High-precision PCB pressing plate and warpage compensation device thereof

Abstract

This invention relates to the field of PCB manufacturing technology, and more particularly to a high-precision PCB laminator and its warpage compensation device. The warpage compensation device processes the PCB laminator and includes a support frame with a detection unit for detecting the edge warpage of the PCB laminator. It also includes a compensation unit movably connected to the support frame, comprising a movable component with connecting frames movably connected to both ends. A frame is fixedly mounted on the outer end of the connecting frames, and an adjustment mechanism is movably connected within the frame. The adjustment mechanism applies external force to the two side edges of the PCB laminator to achieve warpage compensation. This invention can accurately detect the warpage of the two side edges of the PCB laminator during compensation and can adaptively adjust the subsequent pressing force on the PCB laminator according to the different warpage degrees, thereby achieving precise warpage compensation and obtaining a high-precision PCB laminator with low warpage.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and in particular to a high-precision PCB lamination board and its warpage compensation device. Background Technology

[0002] PCB warpage refers to the physical deformation that occurs on a printed circuit board during manufacturing, storage, or use. It manifests as a bending or twisting of the board surface away from an ideal plane. Warpage directly affects the precision of SMT placement, leading to poor contact between electronic components and pads, and even misalignment. During wave soldering, a warped substrate may prevent some pads from contacting the solder surface, resulting in cold solder joints or missing solder joints. After through-hole soldering, a bent board can also cause uneven cutting of component leads, increasing the difficulty of subsequent assembly.

[0003] In terms of manufacturing processes, excessively high lamination temperatures or rapid heating rates, insufficient natural cooling after heat treatment, and direct water washing and cooling after hot air leveling can all lead to the inability to release internal stress in the substrate, causing warping. Summary of the Invention

[0004] The purpose of this invention is to address the problems existing in the prior art by proposing a PCB lamination board with low warpage and a warpage compensation device in the PCB manufacturing process to compensate for the warpage caused by the failure to release internal stress in the PCB lamination board during the manufacturing process.

[0005] The technical solution of the present invention: a high-precision PCB laminate warpage compensation device, which processes the PCB laminate using a warpage compensation device. The warpage compensation device includes a support frame, on which a detection unit for detecting the edge warpage of the PCB laminate is provided. The detection unit includes overlapping rollers symmetrically connected to the support frame. The outer wall of the overlapping roller overlaps with the upper outer wall of the PCB laminate. The position of the overlapping roller in the horizontal direction is adjusted by a hydraulic cylinder.

[0006] It also includes a compensation unit movably connected to the support frame. The compensation unit includes a movable part movably connected to the support frame. Both ends of the movable part are movably connected to the connecting frame. A frame is fixedly installed at the outer end of the connecting frame. An adjustment mechanism is movably connected inside the frame. The adjustment mechanism is used to apply external force to the two sides of the PCB laminate to make the PCB laminate deform in the opposite direction of bending, thereby achieving warpage compensation.

[0007] The adjustment mechanism includes a mounting bracket movably connected to the frame, and a pressing roller is movably connected to the lower end of the mounting bracket. The pressing roller is used to apply pressure to the edge of the PCB laminate to control the warpage of the PCB laminate.

[0008] Optionally, overlapping blocks are fixedly installed at both ends of the overlapping roller, and an overlapping frame is movably connected to the outer wall of the support frame. An overlapping groove is opened inside the overlapping frame, and the overlapping blocks are inserted into the overlapping groove and maintain a sliding fit with it. The overlapping frame is fixedly connected to the output end of a hydraulic cylinder provided on the side wall of the support frame through an overlapping rod, and the overlapping blocks are inserted into an avoidance groove opened on the side wall of the support frame.

[0009] Optionally, a sensor transmitter is fixedly installed on the upper outer wall of the overlapping block, and a sensor receiver is provided on the upper outer wall of the overlapping groove. When the overlapping roller rolls on the PCB laminating plate, the warpage value of the corresponding PCB laminating plate edge can be detected by using the sensor transmitter and sensor receiver.

[0010] Optionally, a chute is provided on the lower left side of the support frame, and a conveyor plate is movably connected to the left side of the chute. The conveyor plate is used to convey the PCB lamination board to the area directly below the moving part.

[0011] Optionally, a drive shaft is fixedly installed at the upper end of the moving part, and the drive shaft is fixedly connected to the output end of the external cylinder. A bladder is provided on both sides of the top surface of the moving part, and the bladder is connected to the output end of the external air pump through a connecting pipe provided on the connecting frame. A fixing block is fixedly installed in the middle of the bottom surface of the moving part, and the upper outer wall of the PCB pressing board is in contact with the fixing block during the adjustment of the two side edges of the PCB pressing board.

[0012] Optionally, a sliding groove is provided on the inner side of the connecting frame, the moving part is slidably connected in the sliding groove, a limiting groove is provided through the upper outer wall of the sliding groove, and a limiting post fixed on the top surface of the moving part is inserted into the limiting groove and maintains a sliding fit with it.

[0013] Optionally, the frame has a movable groove in the middle, the mounting bracket is slidably connected in the movable groove, a piston tube is fixedly installed at the upper end of the frame, a piston rod is movably connected in the piston tube, and the piston rod is fixedly connected to the mounting bracket. When gas is injected into the piston tube, the corresponding mounting bracket will move downward in the movable groove, and the extrusion roller will apply external force to the edge of the PCB laminate to achieve warpage compensation; it also includes a control module, which is used to adjust the amount of gas injected into the piston tube according to the warpage of the PCB laminate obtained by the detection unit, thereby adjusting the downward distance of the extrusion roller in the vertical direction.

[0014] Optionally, an L-shaped frame is fixedly installed on the side wall of the support frame, and an L-shaped groove is provided inside the L-shaped frame. A slider provided on the outer wall of the frame slides in cooperation with the L-shaped groove.

[0015] Optionally, a pressing plate is movably connected to the support frame on the lower side of the middle part of the moving part. The top surface of the pressing plate is arc-shaped. Support plates are provided on both sides of the pressing plate. A cavity is opened inside the support plate. The cavity is connected to the output end of an external hot air pump through an air inlet pipe. A heating plate is fixedly installed on the outside of the support plate. The heating plate has an arc-shaped structure and multiple air outlet holes are opened through the heating plate.

[0016] A high-precision PCB lamination board, which is produced using a high-precision PCB lamination board warpage compensation device.

[0017] In summary, this application includes at least one of the following beneficial technical effects:

[0018] This invention utilizes a detection unit to accurately detect the warpage of the two edges of a PCB laminator during compensation. Combined with a control module, it can adaptively adjust the subsequent pressing force on the PCB laminator according to the warpage of different PCB laminators, thereby achieving precise warpage compensation for the PCB laminator and obtaining a high-precision PCB laminator with low warpage. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the support frame of the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of the overlapping roller and the support frame when they are separated.

[0021] Figure 3 This is a schematic diagram of the exploded structure at the overlap roller of the present invention;

[0022] Figure 4 This is a schematic diagram of the structure when the support frame and the moving part of the present invention are separated;

[0023] Figure 5 This is a schematic diagram of the exploded structure at the moving part of the present invention;

[0024] Figure 6 This is a schematic diagram of the exploded structure of the frame of the present invention;

[0025] Figure 7 This is a schematic cross-sectional view of the moving part of the present invention;

[0026] Figure 8 This diagram illustrates the changes in the extrusion tube position and the deformation structure of the PCB lamination board during the compensation process.

[0027] Reference numerals: 100, support frame; 101, chute; 102, clearance groove; 110, L-shaped frame; 111, L-shaped groove; 120, support plate; 121, chamber; 122, air inlet pipe; 130, heating plate; 131, air outlet; 140, extrusion plate; 200, conveyor plate; 300, overlap frame; 301, overlap groove; 310, overlap rod; 320, overlap roller; 321, overlap. 322, sensor transmitter; 400, moving part; 401, drive shaft; 410, fixed block; 420, capsule; 430, limiting post; 500, connecting frame; 501, sliding groove; 502, limiting groove; 510, connecting pipe; 600, frame; 601, movable groove; 610, slider; 620, piston tube; 700, mounting bracket; 710, piston rod; 720, extrusion roller. Detailed Implementation

[0028] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application.

[0030] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] like Figures 1 to 3 As shown, this invention proposes a high-precision PCB laminate warpage compensation device. The device processes the PCB laminate using a warpage compensation method. The warpage compensation device includes a support frame 100, on which a detection unit for detecting the edge warpage of the PCB laminate is mounted. The detection unit includes overlapping rollers 320 symmetrically connected to the support frame 100. The outer wall of the overlapping rollers 320 overlaps with the upper outer wall of the PCB laminate. The horizontal position of the overlapping rollers 320 is adjusted by a hydraulic cylinder. In the actual PCB laminate production process, the degree of lamination of each PCB laminate will vary, resulting in differences in the edge warpage of the corresponding PCB laminate. Therefore, in this application… Given the differences in warpage among different PCB laminates, the degree of adjustment should also vary during subsequent adjustments. Therefore, in this application, to ensure the accuracy of warpage adjustment for each PCB laminate, the warpage of each PCB laminate to be adjusted is detected during each adjustment. Using a detection unit and an overlapping roller 320 movably connected to the support frame 100, the horizontal position of the overlapping roller 320 is adjusted under the action of a hydraulic cylinder. By rolling the overlapping roller 320 on the surface of the PCB laminate and detecting its height difference in the vertical direction, the degree of warpage at the edge of each PCB laminate can be clearly identified, facilitating precise subsequent adjustments.

[0034] Furthermore, regarding the scheme for detecting the edge warpage of the PCB laminate, specifically, overlapping blocks 321 are fixedly installed at both ends of the overlapping roller 320, and an overlapping frame 300 is movably connected to the outer wall of the support frame 100. An overlapping groove 301 is provided inside the overlapping frame 300, and the overlapping blocks 321 are inserted into the overlapping groove 301 and maintain a sliding fit therewith. The overlapping frame 300 is fixedly connected to the output end of a hydraulic cylinder provided on the side wall of the support frame 100 via an overlapping rod 310. The overlapping blocks 321 are inserted into a clearance groove 102 provided on the side wall of the support frame 100. A sensor transmitter 322 is fixedly installed on the upper outer wall of the overlapping block 321, and a sensor receiver is provided on the upper outer wall of the overlapping groove 301. When the overlapping roller 320 rolls on the PCB laminate, the warpage value of the corresponding PCB laminate edge can be detected using the sensor transmitter 322 and the sensor receiver.

[0035] In the actual testing process, the PCB laminator is positioned above the support frame 100. At this point, the two overlapping frames 300, movably connected to the support frame 100, are in the closest possible position. The two overlapping rollers 320 are positioned on the upper surface of the PCB laminator, maintaining overlap with it. It should be noted that the overlapping rollers 320 are in a free state in the vertical direction. During testing, the output end of the hydraulic cylinder is fixedly connected to the overlapping frame 300 via the overlapping rod 310, allowing the overlapping rollers 320 to roll along the surface of the PCB laminator. When the overlapping rollers 320 roll to the raised edge of the PCB laminator, the overlapping blocks 321 fixedly connected to both ends of the overlapping rollers 320 slide within the overlapping groove 301. This means that the overlapping rollers 320 will generate a height difference in the vertical direction. The height difference data obtained will vary depending on the PCB laminator.

[0036] Furthermore, a sensor transmitter 322 is provided on the top surface of the overlap block 321, and a sensor receiver is provided on the upper inner wall of the overlap groove 301. When the overlap roller 320 rolls along the surface of the PCB laminate, a height difference will appear in the vertical direction. The height difference data can be obtained by the distance sensor, thereby clarifying the difference in warpage of different PCB laminates.

[0037] Specifically, after the warpage data at both edges of the PCB lamination board is detected, the position of the detected PCB lamination board needs to be adjusted so that the PCB lamination board is transported from the detection station to the adjustment station, which corresponds to the lower position of the moving part 400 set in this application. As one embodiment, in this application, a slide groove 101 is provided on the lower left side of the support frame 100, and a conveyor plate 200 is movably connected to the left side of the slide groove 101. The conveyor plate 200 is used to transport the PCB lamination board to the area directly below the moving part 400.

[0038] Specifically, regarding the edge compensation scheme for the PCB laminate, this application further includes a compensation unit movably connected to the support frame 100. The compensation unit includes a movable part 400 movably connected to the support frame 100. Connecting frames 500 are movably connected to both ends of the movable part 400. A frame 600 is fixedly installed at the outer end of the connecting frame 500. An adjustment mechanism is movably connected inside the frame 600. The adjustment mechanism is used to apply external force to the two sides of the PCB laminate, causing the PCB laminate to deform in the opposite direction of bending, thereby achieving warpage compensation. The adjustment mechanism includes a mounting frame 700 movably connected inside the frame 600. A pressing roller 720 is movably connected to the lower end of the mounting frame 700. The pressing roller 720 is used to apply pressure to the edge of the PCB laminate to reduce the warpage of the PCB laminate.

[0039] Furthermore, a drive shaft 401 is fixedly installed on the upper end of the movable part 400, and the drive shaft 401 is fixedly connected to the output end of the external cylinder. A bladder 420 is provided on both sides of the top surface of the movable part 400. The bladder 420 is connected to the output end of the external air pump through a connecting pipe 510 provided on the connecting frame 500. A fixing block 410 is fixedly installed in the middle of the bottom surface of the movable part 400. During the adjustment of the two sides of the PCB lamination board, the upper outer wall of the PCB lamination board is in contact with the fixing block 410. In the actual process of adjusting the warping of the PCB lamination board, the height of the moving part 400 can be adjusted vertically by the drive shaft 401 located at the center of the top surface of the moving part 400. Specifically, when the moving part 400 moves downward a certain distance, the lower outer wall of the fixing block 410 fixedly installed at the center of the ground of the moving part 400 contacts the upper surface of the PCB lamination board. At this time, the moving part 400 stops moving downward. Then, gas is injected into the bladder 420 by the connecting pipe 510 set on the connecting frame 500. Combined with the connection relationship between the outer wall of the bladder 420 and the connecting frame 500, when a certain amount of gas is injected into the bladder 420, the two connecting frames 500 that are slidably connected to the moving part 400 will move away from each other, thereby driving the frame 600 that is fixedly connected to the connecting frame 500 to move synchronously.

[0040] It should be noted that, in order to ensure the accuracy of position adjustment during the aforementioned adjustment of the moving part 400, connecting frame 500, and frame 600, an L-shaped frame 110 is fixedly installed on the side wall of the support frame 100. An L-shaped groove 111 is provided inside the L-shaped frame 110. A slider 610, located on the outer wall of the frame 600, slides in cooperation with the L-shaped groove 111. Specifically, during the downward movement of the moving part 400, the slider 610, which remains fixedly connected to the outer wall of the frame 600, slides downward within the vertical portion of the L-shaped groove 111. When the slider 610 moves to the lowest position of the L-shaped groove 111... At this time, gas is injected into the bladder 420 through the connecting tube 510. In the horizontal direction, the frame 600, which is fixedly connected to the connecting bracket 500, will move synchronously. At this time, the slider 610 will slide in the horizontal direction of the L-shaped groove 111. Since the frame 600 and the mounting bracket 700 slidably connected inside it maintain a relatively fixed position in the horizontal direction, the extrusion roller 720, which is movably connected to the mounting bracket 700, will also adjust its position synchronously in the horizontal direction. Specifically, the two extrusion rollers 720 will slide on the surface of the PCB laminating board.

[0041] Furthermore, to ensure stable horizontal rolling of the extrusion roller 720, in this application, a sliding groove 501 is provided on the inner side of the connecting frame 500, and the moving part 400 is slidably connected within the sliding groove 501. A limiting groove 502 is provided through the upper outer wall of the sliding groove 501, and a limiting post 430 fixed to the top surface of the moving part 400 is inserted into the limiting groove 502 and maintains a sliding fit with it. Through the sliding fit between the limiting post 430 and the limiting groove 502, when gas is injected into the bladder 420 using the connecting pipe 510, the two connecting frames 500 can move stably in the horizontal direction relative to the moving part 400, ensuring stable horizontal movement.

[0042] As mentioned above, during the actual adjustment process, the corresponding extrusion roller 720 rolls from the center to both sides of the PCB lamination board surface. Regarding the application of external force to adjust the warpage of the PCB lamination board, in this application, a movable groove 601 is provided in the middle of the frame 600, and the mounting bracket 700 is slidably connected in the movable groove 601. A piston tube 620 is fixedly installed at the upper end of the frame 600, and a piston rod 710 is movably connected in the piston tube 620. The piston rod 710 is fixedly connected to the mounting bracket 700. When gas is injected into the piston tube 620, the corresponding mounting bracket 700 moves downward in the movable groove 601, and the extrusion roller 720 moves towards the edge of the PCB lamination board. To compensate for warping, one implementation method involves applying external force to the PCB laminator during adjustment. This is achieved by injecting a certain amount of gas into the piston tube 620. The piston rod 710, which is fixedly connected to the mounting bracket 700, is movably connected to the inside of the piston tube 620. After injecting the gas, the piston rod 710 moves downwards, causing the pressure roller 720, which is rotated and connected to the lower side of the mounting bracket 700, to apply a certain external force to the PCB laminator, compensating for warping at the edges of the PCB laminator during production.

[0043] Among them, combined with the appendix Figure 8 As shown, during the actual warpage adjustment process, the movement trajectory of the corresponding extrusion roller 720 on the PCB laminator is arc-shaped. This is because, during the adjustment phase, in the horizontal direction, the corresponding connecting frame 500 drives the frame 600 to move to both sides, and the corresponding extrusion roller 720 will have a displacement in the horizontal direction per unit time. In the vertical direction, due to the injection of gas into the piston tube 620, the corresponding extrusion roller 720 will have a downward displacement and a downward displacement per unit time. In this way, by adjusting the position of the force points of different PCB laminators and the corresponding pressure applied to the PCB laminators, flexible adjustment compensation of the PCB laminators can be achieved, avoiding the problem of brittle cracking of the PCB laminators due to sudden external force during the warpage adjustment process.

[0044] Specifically, the warpage compensation device also includes a control module for adjusting the amount of gas injected into the piston tube 620 based on the warpage of the PCB laminate obtained by the detection unit, thereby adjusting the downward movement distance of the extrusion roller 720 in the vertical direction. Regarding the detection unit, for each PCB laminate to be warped, the warpage at its corresponding two edges is different. Therefore, the downward movement distance of the extrusion roller 720 in the vertical direction during warpage compensation will also differ, resulting in different pressures applied to the PCB laminate. In this application, the control module can adjust the vertical displacement of the extrusion roller 720 during warpage compensation based on the detected warpage of each PCB laminate. As one implementation, the sensor transmitter 322 and corresponding sensor receiver can acquire the degree of warpage at the edge of each PCB laminate and obtain the corresponding data. According to the invention, by controlling the warpage and the displacement of the extrusion roller 720 in a proportional manner, it is possible to adjust the force applied by the extrusion roller 720 to the PCB laminate for different warpages, thereby achieving precise adjustment. Of course, since the diameter of the piston tube 620 is not limited in this application, the amount of gas entering the piston tube 620 and the downward movement distance of the extrusion roller 720 cannot be determined and are not limited here. However, it is clear that the amount of gas entering the piston tube 620 and the displacement of the extrusion roller 720 are also proportional. In this way, precise compensation for the warpage of the edge of each PCB laminate can be achieved.

[0045] Furthermore, in order to eliminate the influence of internal stress in the PCB laminating board on the edge of the adjusted PCB laminating board, in this application, a pressing plate 140 is movably connected to the support frame 100 at the lower side of the middle part of the moving part 400. The top surface of the pressing plate 140 is set as arc shape, and support plates 120 are set on both sides of the pressing plate 140. A cavity 121 is opened inside the support plate 120. The cavity 121 is connected to the output end of the external hot air pump through the air inlet pipe 122. A heating plate 130 is fixedly installed on the outside of the support plate 120, and the heating plate 130 has an arc structure. Multiple air outlet holes 131 are opened through the heating plate 130. During the adjustment and compensation phase, hot air can be injected into the chamber 121 through the air inlet pipe 122 located on the lower side of the support plate 120. Combined with the air outlet 131 on the heating plate 130, the mating surfaces of the PCB laminating plate and the heating plate 130 can be cleaned to prevent particulate impurities from being located between the PCB laminating plate and the heating plate 130 during the adjustment process. This would prevent scratches from appearing on the surface of the PCB laminating plate when the extrusion roller 720 applies external force to the PCB laminating plate.

[0046] Furthermore, during the adjustment process, the heating plate 130 is used to heat the PCB lamination plate position to further eliminate internal stress and ensure accurate compensation of the PCB lamination plate.

[0047] A high-precision PCB lamination board is disclosed. The high-precision PCB lamination board produced using a high-precision PCB lamination board warpage compensation device is described in this application. In this application, the warpage of the edge of the PCB lamination board produced using the aforementioned warpage compensation device can be effectively reduced. In particular, the warpage compensation device in this application is applicable to single-sided boards, where the copper-clad laminate is only on one side of the PCB lamination board, and its warpage direction is unique, making it more suitable for adjustment using the warpage compensation device in this application.

[0048] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A high-precision PCB laminate warpage compensation device, characterized in that, include: A support frame (100) is provided with a detection unit for detecting the edge warping of a PCB laminate. The detection unit includes an overlapping roller (320) symmetrically connected to the support frame (100). The outer wall of the overlapping roller (320) overlaps with the upper outer wall of the PCB laminate. The position of the overlapping roller (320) in the horizontal direction is adjusted by a hydraulic cylinder. It also includes a compensation unit movably connected to the support frame (100). The compensation unit includes a movable part (400) movably connected to the support frame (100). The two ends of the movable part (400) are movably connected to the connecting frame (500). A frame (600) is fixedly installed at the outer end of the connecting frame (500). An adjustment mechanism is movably connected inside the frame (600). The adjustment mechanism is used to apply external force to the two sides of the PCB laminate to make the PCB laminate deform in the opposite direction of bending, thereby achieving warpage compensation. The adjustment mechanism includes a mounting bracket (700) movably connected within the frame (600), and a pressing roller (720) movably connected to the lower end of the mounting bracket (700). The pressing roller (720) is used to apply pressure to the edge of the PCB laminate to control the warpage of the PCB laminate. The overlapping roller (320) has overlapping blocks (321) fixedly installed at both ends. The outer wall of the support frame (100) is movably connected to an overlapping frame (300). An overlapping groove (301) is opened inside the overlapping frame (300). The overlapping block (321) is inserted into the overlapping groove (301) and maintains a sliding fit with it. The overlapping frame (300) is fixedly connected to the output end of a hydraulic cylinder provided on the side wall of the support frame (100) through an overlapping rod (310). The overlapping block (321) is inserted into a clearance groove (102) opened on the side wall of the support frame (100). A sensor transmitter (322) is fixedly installed on the upper outer wall of the overlapping block (321), and a sensor receiver is provided on the upper outer wall of the overlapping groove (301). When the overlapping roller (320) rolls on the PCB pressing plate, the warping value of the corresponding PCB pressing plate edge can be detected by using the sensor transmitter (322) and the sensor receiver. The support frame (100) has a slide groove (101) on the lower left side, and a conveyor plate (200) is movably connected to the left side of the slide groove (101). The conveyor plate (200) is used to convey the PCB lamination board to the underside of the moving part (400). A drive shaft (401) is fixedly installed on the upper end of the movable part (400). The drive shaft (401) is fixedly connected to the output end of the external cylinder. A bladder (420) is provided on both sides of the top surface of the movable part (400). The bladder (420) is connected to the output end of the external air pump through a connecting pipe (510) provided on the connecting frame (500). A fixing block (410) is fixedly installed in the middle of the bottom surface of the movable part (400). During the adjustment of the two sides of the PCB lamination board, the upper outer wall of the PCB lamination board is in contact with the fixing block (410).

2. The high-precision PCB lamination board warpage compensation device according to claim 1, characterized in that, The inner side of the connecting frame (500) is provided with a sliding groove (501), the moving part (400) is slidably connected in the sliding groove (501), and a limiting groove (502) is provided through the upper outer wall of the sliding groove (501). A limiting post (430) fixed on the top surface of the moving part (400) is inserted into the limiting groove (502) and maintains a sliding fit with it.

3. The high-precision PCB lamination board warpage compensation device according to claim 2, characterized in that, The frame (600) has a movable groove (601) in the middle. The mounting bracket (700) is slidably connected in the movable groove (601). A piston tube (620) is fixedly installed at the upper end of the frame (600). A piston rod (710) is movably connected in the piston tube (620). The piston rod (710) is fixedly connected to the mounting bracket (700). When gas is injected into the piston tube (620), the corresponding mounting bracket (700) will move downward in the movable groove (601). The extrusion roller (720) will apply external force to the edge of the PCB lamination board to achieve warpage compensation. It also includes a control module for adjusting the amount of gas injected into the piston tube (620) based on the warpage of the PCB press board obtained by the detection unit, thereby adjusting the downward movement distance of the extrusion roller (720) in the vertical direction.

4. The high-precision PCB lamination board warpage compensation device according to claim 3, characterized in that, An L-shaped frame (110) is fixedly installed on the side wall of the support frame (100). An L-shaped groove (111) is provided inside the L-shaped frame (110). A slider (610) provided on the outer wall of the frame (600) slides in cooperation with the L-shaped groove (111).

5. A high-precision PCB lamination board warpage compensation device according to claim 4, characterized in that, An extrusion plate (140) is movably connected to the support frame (100) at the lower middle part of the movable part (400). The top surface of the extrusion plate (140) is arc-shaped. Support plates (120) are provided on both sides of the extrusion plate (140). A chamber (121) is opened inside the support plate (120). The chamber (121) is connected to the output end of an external hot air pump through an air inlet pipe (122). A heating plate (130) is fixedly installed on the outside of the support plate (120). The heating plate (130) has an arc-shaped structure. Multiple air outlets (131) are opened through the heating plate (130).

6. A high-precision PCB lamination board, characterized in that, Warp compensation is performed using the high-precision PCB laminate warp compensation device as described in any one of claims 1-5.

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