Intermediate treatment equipment for negative photoresist coating process

Abstract

The invention discloses intermediate processing equipment for a negative photoresist coating process, and relates to the technical field of photoresist coating related auxiliary equipment for chip production, and the intermediate processing equipment comprises a first curing tunnel, a second curing tunnel, a pair of detection assemblies, a pair of translation assemblies and an overturning assembly. The first curing tunnel is provided with a plurality of silicon wafer inlet and outlet assemblies. The second curing tunnel is arranged on one side of the first curing tunnel in parallel. And the detection assembly is used for measuring the thickness of the photoresist on the silicon wafer. The translation assembly is used for moving the silicon wafer between the first curing tunnel and the second curing tunnel. The overturning assembly is used for transferring the silicon wafer from the conveying tail end of the second conveying belt conveyor to the conveying starting end of the first conveying belt conveyor and overturning the silicon wafer at the same time. According to the invention, thickness detection can be carried out while a large number of silicon wafers of which the front surfaces are coated with photoresist are cured, the silicon wafers are translated or overturned between the two curing tunnels, and the silicon wafers of which the back surfaces can be coated with the photoresist are sent back to a photoresist coating machine in time.

Description

Technical Field

[0001] This invention relates to the technical field of auxiliary equipment for photoresist coating in chip manufacturing, and particularly to an intermediate processing device for negative photoresist coating process. Background Technology

[0002] Chip manufacturing involves many steps, and different processes are used depending on the type of chip being manufactured. In some common chip manufacturing processes, photoresist needs to be coated on both the front and back sides of the silicon wafer to be photolithographically prepared. The photoresist on the front side is used to form the circuit pattern later, while the photoresist on the back side mainly serves to protect and prevent contamination.

[0003] After coating the front side of the silicon wafer with photoresist, the photoresist needs to be dried. This step is usually called pre-baking in semiconductor processes. When a robust mask needs to be made on the silicon wafer or deep etching is required, negative photoresist is usually coated on both sides. However, negative photoresist requires a long pre-baking time. For example, for 200μm thick SU-8 photoresist, the pre-baking conditions are usually 1 hour at 95°C. Therefore, the intermediate processing of photoresist coating requires a lot of manual operation, including taking the silicon wafer from the photoresist coating machine, transporting it to the oven, opening the oven, placing the silicon wafer in, closing the oven, waiting for the silicon wafer to cure, opening the oven again, closing the oven again, and putting the cured silicon wafer back into the photoresist coating machine. In mass continuous production, the curing start time of the silicon wafer at each position in the oven also needs to be recorded on a record board next to the oven, which consumes a lot of manpower. Summary of the Invention

[0004] To address the aforementioned shortcomings, this invention provides an intermediate processing device for negative photoresist coating processes. This device can perform thickness detection on a large number of silicon wafers that have completed front-side photoresist coating while they are being cured, and can also perform translation or flipping between two curing tunnels to promptly send silicon wafers ready for back-side photoresist coating back to the photoresist coating machine.

[0005] In order to achieve the objectives of this invention, the following technologies are proposed: An intermediate processing device for a negative photoresist coating process, located on one side of multiple photoresist coating machines arranged in an array, includes: The first curing tunnel has multiple hot air blowers at its upper end that blow hot air into it. Inside the first curing tunnel is a first conveyor belt that extends outwards from the entrance and exit of the first curing tunnel, respectively. The first curing tunnel has multiple side openings on its side facing the photoresist coating machine for silicon wafers to enter and exit the first curing tunnel. The first curing tunnel also has multiple silicon wafer entry and exit components for transferring silicon wafers between the first curing tunnel and the photoresist coating machine. The second curing tunnel is parallel to the first curing tunnel on the side away from the photoresist coating machine. Multiple hot air blowers are also provided at the upper end of the second curing tunnel. Inside the second curing tunnel, there is a second conveyor belt that is opposite to the first conveyor belt during operation. Its two ends extend a predetermined distance to the outside of the entrance and exit of the second curing tunnel, respectively. A pair of detection components are respectively located at the exit ends of the first curing tunnel and the second curing tunnel. The detection components include an interferometric thickness sensor for measuring the thickness of the photoresist on the silicon wafer. A pair of translation components are respectively located at both ends of the first curing tunnel, and are used to move the silicon wafer between the first curing tunnel and the second curing tunnel; A flipping assembly, located between the first curing tunnel and the second curing tunnel, is used to transfer the silicon wafer from the end of the second conveyor belt to the beginning of the first conveyor belt and simultaneously flip the silicon wafer.

[0006] Furthermore, the first curing tunnel is also provided with multiple vertical first linear mechanisms on the side facing the photoresist coating machine. The output end of the first linear mechanism is provided with an L-shaped side cover. The L-shaped side cover opens and closes its vertical part to the side opening by sliding.

[0007] Furthermore, the silicon wafer inlet / outlet assembly includes a second linear mechanism located on the upper surface of the first curing tunnel and pointing in the direction of the photoresist coating machine. A third linear mechanism is vertically provided at the output end of the second linear mechanism. An inverted L-shaped block is provided at the output end of the third linear mechanism. A horizontal bar parallel to the output axis of the second linear mechanism is provided at the lower end of the vertical part of the inverted L-shaped block. A pair of limiting rods are provided on one side of the horizontal bar, and the limiting rods extend from the side of the horizontal bar in a direction opposite to the conveying direction of the first conveyor belt.

[0008] Furthermore, the length of the limiting rod is greater than the radius of the silicon wafer, but less than the diameter of the silicon wafer.

[0009] Furthermore, the detection assembly includes a control box mounted on one side of the first curing tunnel or the second curing tunnel, and a ring frame mounted on the exit end face of the first curing tunnel or the second curing tunnel, with an interferometric thickness sensor vertically inserted through the ring frame.

[0010] Furthermore, one translation component is used to move the silicon wafer from the end of the first conveyor belt to the beginning of the second conveyor belt, and another translation component is used to move the silicon wafer from the end of the second conveyor belt to the beginning of the first conveyor belt. The translation components include a pair of L-shaped frames, with a fourth linear mechanism parallel to the second linear mechanism at the upper end of the L-shaped frames. The sliding end of the fourth linear mechanism is provided with a fifth linear mechanism parallel to the conveying direction of the silicon wafer in the first or second curing tunnel. The output end of the fifth linear mechanism is provided with a pair of symmetrically arranged L-shaped trays, and the vertical opposing surfaces of the two L-shaped trays are used to limit the silicon wafer.

[0011] Furthermore, the upper horizontal surface of the L-shaped pallet, the conveying plane of the first conveyor belt, and the second conveyor belt are all located on the same horizontal plane.

[0012] Furthermore, the flipping assembly includes a first rotary motor located between the starting end of the first conveyor belt and the ending end of the second conveyor belt, and a second rotary motor at its output end. A pair of sixth linear mechanisms with opposite output directions are provided on one side of the output end of the second rotary motor. A hanging plate is provided at the output end of the sixth linear mechanism. A clamping block is provided at the lower end of the hanging plate facing the sixth linear mechanism. One side of the clamping block is formed with an arc surface, and the arc surface has an arc groove that matches the outer periphery of the silicon wafer.

[0013] Furthermore, the output end of the second rotary motor is provided with a rotating plate, one side of which is provided with an L-shaped support rod, and one end of its short side is provided with a mounting base. Two sixth linear mechanisms are respectively located at both ends of the mounting base.

[0014] The beneficial effects of this technical solution are as follows: After the photoresist coating machine coats the front side of the silicon wafer, it can transport the wafer to the first curing tunnel via the wafer in-and-out assembly. In mass production, multiple silicon wafers can continuously circulate between the first and second curing tunnels, being heated by hot air to cure them. Because the wafers are constantly moving, it's unnecessary to equip each wafer with an interferometric thickness sensor. Two detection components are used, located at the ends of the first and second conveyor belts respectively. These components can detect changes in the photoresist thickness on the wafer. Although automated photoresist coating is difficult to control, detecting changes in thickness, rather than simply measuring the thickness itself, provides a better way to determine if curing is complete. If the thickness no longer changes or the change is less than a preset value, the wafer can be flipped using a flipping component and then returned to the photoresist coating machine from the first curing tunnel. This intermediate processing equipment significantly reduces manual steps in the negative photoresist coating process, saving manpower. Attached Figure Description

[0015] Figure 1 This is a perspective view of the embodiment of the present application when it is located on one side of the photoresist coating machine during operation.

[0016] Figure 2 An embodiment of this application is shown. Figure 1 Enlarged view of part A.

[0017] Figure 3 The overall three-dimensional representation of the embodiment of this application is shown. Figure 1 .

[0018] Figure 4 An embodiment of this application is shown. Figure 3 Enlarged view of part B.

[0019] Figure 5 The overall three-dimensional representation of the embodiment of this application is shown. Figure 2 .

[0020] Figure 6 An embodiment of this application is shown. Figure 5 Enlarged view of part C.

[0021] Figure 7 An embodiment of this application is shown. Figure 5 Enlarged view of part D.

[0022] Figure 8 The overall three-dimensional representation of the embodiment of this application is shown. Figure 3 .

[0023] Figure 9 An embodiment of this application is shown. Figure 8 Enlarged view of part E.

[0024] Figure 10 The diagram shows a partial exploded view of the first solidification tunnel, the first conveyor belt, the first linear mechanism, and the L-shaped side cover according to an embodiment of this application.

[0025] The diagram shows the following components: First curing tunnel 1, First conveyor belt 11, Side opening 12, First linear mechanism 13, L-shaped side cover 14, Second linear mechanism 15, Third linear mechanism 16, Inverted L-shaped block 17, Crossbar 18, Limiting rod 19, Second curing tunnel 2, Second conveyor belt 21, Hot air blower 3, Detection assembly 4, Control box 41, Ring frame 42, Interference thickness sensor 43, Connecting line 44, Translation assembly 5, L-shaped frame 51, Fourth linear mechanism 52, Fifth linear mechanism 53, End plate 54, L-shaped support plate 55, Tilting assembly 6, Side plate 61, First rotary motor 62, Second rotary motor 63, Turning plate 64, L-shaped support rod 65, Mounting base 66, Sixth linear mechanism 67, Hanging plate 68, Clamping block 69, Photoresist coating machine 7, Feed port 71, Semiconductor robot 72, Tray 73. Detailed Implementation

[0026] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0027] like Figures 1-10 The intermediate processing equipment shown is located on one side of multiple photoresist coating machines 7 arranged in an array, and includes a first curing tunnel 1, a second curing tunnel 2, a detection component 4, a translation component 5, and a flipping component 6.

[0028] like Figures 1-10As shown, the first curing tunnel 1 has multiple hot air blowers 3 at its upper end that blow hot air into it. A first conveyor belt 11 is installed inside the first curing tunnel 1, with both ends extending a predetermined distance outwards from the entrance and exit of the first curing tunnel 1, respectively. Multiple side openings 12 for silicon wafers to enter and exit the first curing tunnel 1 are provided on the side facing the photoresist coating machine 7. Multiple vertical first linear mechanisms 13 are also provided on the side. The output end of each first linear mechanism 13 has an L-shaped side cover 14, which slides to open and close the side openings 12. The first curing tunnel 1 also has multiple silicon wafer entry / exit components for transferring silicon wafers between the first curing tunnel 1 and the photoresist coating machine 7. Each silicon wafer entry / exit component includes components located on the upper surface of the first curing tunnel 1 with an output direction pointing towards light. The second linear mechanism 15 of the resist coating machine 7 has a third linear mechanism 16 vertically arranged at its output end. The output end of the third linear mechanism 16 has an inverted L-shaped block 17. The lower vertical part of the inverted L-shaped block 17 has a horizontal bar 18 parallel to the output axis of the second linear mechanism 15. A pair of limiting rods 19 are provided on one side of the horizontal bar 18. The two limiting rods 19 are used to limit the silicon wafer between their opposite faces. The limiting rods 19 extend from the side of the horizontal bar 18 in the opposite direction to the conveying direction of the first conveyor belt 11. This allows the silicon wafer to be blocked by the horizontal bar 18 and limited by the limiting rods 19 without additional silicon wafer tracking components such as cameras. The length of the limiting rods 19 is greater than the radius of the silicon wafer and less than the diameter of the silicon wafer. When the side opening 12 is opened, the limiting rods 19 can pass through the side opening 12 when moving.

[0029] like Figure 1 , Figure 3 , Figures 5-9 As shown, the second curing tunnel 2 is arranged parallel to one side of the first curing tunnel 1 and is relatively farther away from the photoresist coating machine 7 than the first curing tunnel 1. Multiple hot air blowers 3 are also provided at the upper end of the second curing tunnel 2. Specifically, multiple air ducts are opened at the upper ends of both the first curing tunnel 1 and the second curing tunnel 2, which are connected to the air outlet of the hot air blowers 3. The second curing tunnel 2 is equipped with a second conveyor belt 21 that is opposite to the first conveyor belt 11 in terms of conveying direction during operation. The two ends of the second conveyor belt 21 extend a predetermined distance to the outside of the entrance and exit of the second curing tunnel 2, respectively.

[0030] like Figure 1 , Figure 3 , Figures 5-9As shown, there is a pair of detection components 4, which are respectively located at the exit ends of the first curing tunnel 1 and the second curing tunnel 2. The detection component 4 includes a control box 41 mounted on one side of the first curing tunnel 1 or the second curing tunnel 2, and a ring frame 42 mounted on the exit end face of the first curing tunnel 1 or the second curing tunnel 2. An interferometric thickness sensor 43 is vertically mounted on the ring frame 42 for measuring the thickness of the photoresist on the silicon wafer. The connecting line 44 of the interferometric thickness sensor 43 is connected to the control box 41.

[0031] like Figure 1 , Figure 3 , Figures 5-9 As shown, there is a pair of translation components 5, which are respectively located at both ends of the first curing tunnel 1, and can also be said to be located at both ends of the second curing tunnel 2. The translation components 5 include a pair of L-shaped frames 51 fixed to one end of the first curing tunnel 1 and one end of the second curing tunnel 2. The upper end of the L-shaped frame 51 is provided with a fourth linear mechanism 52 parallel to the second linear mechanism 15. The sliding end of the fourth linear mechanism 52 is provided with a fifth linear mechanism 53 parallel to the conveying direction of the silicon wafer in the first curing tunnel 1 or the second curing tunnel 2. The output end of the fifth linear mechanism 53 is provided with an end plate 54. One side of the end plate 54 is provided with a pair of symmetrically arranged L-shaped support plates 55. The upper horizontal surface of the L-shaped support plate 55, the conveying plane of the first conveyor belt 11, and the second conveyor belt 21 are all located on the same horizontal plane. The vertical opposite surfaces of the two L-shaped support plates 55 are used to limit the silicon wafer.

[0032] like Figure 1 , Figure 3 , Figure 5 , Figure 6 , Figure 8 , Figure 9 As shown, the flipping assembly 6 is located between the first curing tunnel 1 and the second curing tunnel 2, and includes a side plate 61 fixed to one side of the first curing tunnel 1. A first rotary motor 62 is located above one end of the side plate 61 between the starting end of the first conveyor belt 11 and the ending end of the second conveyor belt 21. A second rotary motor 63 is located at the output end of the side plate 62. A rotating plate 64 is located at the output end of the second rotary motor 63. An L-shaped support rod 65 is located on one side of the rotating plate 64. A mounting base 66 is located at one end of the short side of the rotating plate 64. A sixth linear mechanism 67 with opposite output directions is located at both ends of the mounting base 66. A hanging plate 68 is located at the output end of the sixth linear mechanism 67. A clamping block 69 is located at the lower end of the side of the hanging plate 68 facing the sixth linear mechanism 67. A circular arc surface is formed on one side of the clamping block 69. The circular arc surface has a circular arc groove that matches the outer periphery of the silicon wafer.

[0033] Preferably, a central control device can also be provided that is electrically connected to the detection component 4, the translation component 5, and the flipping component 6. Obviously, the translation component 5 should always move the silicon wafer at the end of the first conveyor belt 11 to the beginning of the second conveyor belt 21. As for the other end, that is, the end of the second conveyor belt 21, after receiving the information from the detection component 4, the central control device determines whether the flipping component 6 flips the silicon wafer and then places the silicon wafer at the beginning of the first conveyor belt 11, or whether the other translation component 5 moves the silicon wafer. The information and judgment method of the detection component 4 will be explained later.

[0034] In this embodiment, the first linear mechanism 13, the second linear mechanism 15, the third linear mechanism 16, the fifth linear mechanism 53, and the sixth linear mechanism 67 all use single-axis linear cylinders, while the fourth linear mechanism 52 uses a rodless linear cylinder.

[0035] Work style: First, such as Figure 1 The intermediate processing equipment for the negative photoresist coating process is arranged as shown. It should be noted that, due to the different sizes of various photoresist coating machines 7, the intermediate processing equipment for the negative photoresist coating process may block the feeding position of the photoresist coating machine 7. If it is not possible to manually feed the photoresist coating machine 7 at the beginning of photoresist coating, the silicon wafer can be placed at the starting end of the first conveyor belt 11, and then fed through the silicon wafer entering and exiting the assembly.

[0036] After the photoresist coating on the front side of the silicon wafer is completed by the photoresist coating machine 7, the feed port 71 is opened, the semiconductor robot 72 extends out of the feed port 71, the upper surface of the tray 73 is on the same horizontal plane as the conveying plane of the first conveyor belt 11, and then the limiting rod 19 is moved by the second linear mechanism 15 and the third linear mechanism 16 of the silicon wafer entry and exit assembly, the L-shaped side cover 14 is lowered by the first linear mechanism 13 to open the side opening 12, and then the silicon wafer is moved onto the first conveyor belt 11 by the second linear mechanism 15, and then the limiting rod 19 is raised by the third linear mechanism 16 to release the limitation on the silicon wafer, so that the silicon wafer can start to be conveyed, and then the silicon wafer entry and exit assembly is moved out of the first curing tunnel 1 and the side opening 12 is closed.

[0037] This process is repeated, allowing multiple silicon wafers to be circulated and transported within the first curing tunnel 1 and the second curing tunnel 2. When the silicon wafers are transported below the interferometric thickness sensor 43, the photoresist thickness on them is detected. Optionally, depending on the actual situation, the detection can be performed at the center point of the upper surface of each silicon wafer, or at the midpoint between the center point and the edge. When the photoresist thickness on the silicon wafer no longer changes or the change is less than the preset value set in the overall control device, it is processed by the flipping assembly 6.

[0038] Specifically, in the above embodiment, the translation component 5 is used for translation in the following manner: the fifth linear mechanism 53 is moved by the fourth linear mechanism 52 to the end of the first conveyor belt 11 or the second conveyor belt 21; then the L-shaped pallet 55 is pushed by the fifth linear mechanism 53 to receive the silicon wafer; then the silicon wafer is retracted by the fifth linear mechanism 53; the silicon wafer is moved by the fourth linear mechanism 52; and then pushed to the beginning of the first conveyor belt 11 or the second conveyor belt 21. The specific working method of the flipping component 6 is as follows: the first rotary motor 62 rotates each component so that the clamping block 69 is horizontally positioned on both sides of the second conveyor belt 21. After the silicon wafer is in place, the clamping block 69 clamps the silicon wafer through the sixth linear mechanism 67. Then, the first rotary motor 62 rotates, and during the rotation, the second rotary motor 63 flips the silicon wafer. Before the silicon wafer reaches the first conveyor belt 11, the silicon wafer is flipped 180° along the output shaft of the second rotary motor 63. Then, the clamping is released, and the silicon wafer is transported by the first conveyor belt 11.

[0039] The silicon wafer that has been flipped is transported by the first conveyor belt 11. When the silicon wafer is about to arrive, the crossbar 18 of the silicon wafer entry and exit assembly is in place in advance and blocks the silicon wafer. Then the silicon wafer is sent back to the photoresist coating machine 7 through the silicon wafer entry and exit assembly.

[0040] The above are only some of the embodiments listed in this application and are not intended to limit this application.

Claims

1. An intermediate processing device for a negative photoresist coating process, characterized in that, Located on one side of multiple photoresist coating machines (7) arranged in an array, including: The first curing tunnel (1) is equipped with multiple hot air blowers (3) at its upper end that blow hot air into it. The first curing tunnel (1) is equipped with a first conveyor belt (11) at its two ends, which extend outwards to the entrance and exit of the first curing tunnel (1) respectively. The first curing tunnel (1) is provided with multiple side openings (12) for silicon wafers to enter and exit the first curing tunnel (1) on the side facing the photoresist coating machine (7). The first curing tunnel (1) is also provided with multiple silicon wafer entry and exit components for transferring silicon wafers between the first curing tunnel (1) and the photoresist coating machine (7). The second curing tunnel (2) is parallel to the side of the first curing tunnel (1) facing away from the photoresist coating machine (7). Multiple hot air blowers (3) are also provided at the upper end of the second curing tunnel (2). Inside the second curing tunnel (2) is a second conveyor belt (21) whose conveying direction is opposite to that of the first conveyor belt (11) during operation. Its two ends extend a predetermined distance to the outside of the entrance and exit of the second curing tunnel (2). A pair of detection components (4) are respectively located at the exit ends of the first curing tunnel (1) and the second curing tunnel (2). The detection components (4) include an interferometric thickness sensor (43) for measuring the thickness of the photoresist on the silicon wafer. A pair of translation components (5) are respectively disposed at both ends of the first curing tunnel (1) for moving the silicon wafer between the first curing tunnel (1) and the second curing tunnel (2); The flipping assembly (6) is located between the first curing tunnel (1) and the second curing tunnel (2) for transferring the silicon wafer from the end of the second conveyor belt (21) to the beginning of the first conveyor belt (11) and flipping the silicon wafer at the same time.

2. The intermediate processing equipment for negative photoresist coating process according to claim 1, characterized in that, The first curing tunnel (1) is also provided with multiple vertical first linear mechanisms (13) on the side facing the photoresist coating machine (7). The output end of the first linear mechanism (13) is provided with an L-shaped side cover (14). The L-shaped side cover (14) opens and closes its vertical part to the side opening (12) by sliding.

3. The intermediate processing equipment for negative photoresist coating process according to claim 1, characterized in that, The silicon wafer inlet and outlet assembly includes a second linear mechanism (15) located on the upper surface of the first curing tunnel (1) and pointing in the output direction toward the photoresist coating machine (7). The output end of the second linear mechanism (15) is vertically provided with a third linear mechanism (16). The output end of the third linear mechanism (16) is provided with an inverted L-shaped block (17). The lower end of the vertical part of the inverted L-shaped block (17) is provided with a crossbar (18) parallel to the output axis of the second linear mechanism (15). A pair of limiting rods (19) are provided on one side of the crossbar (18), and the limiting rods (19) extend from the side of the crossbar (18) in the opposite direction to the conveying direction of the first conveyor belt (11).

4. The intermediate processing equipment for negative photoresist coating process according to claim 3, characterized in that, The length of the limiting rod (19) is greater than the radius of the silicon wafer and less than the diameter of the silicon wafer.

5. The intermediate processing equipment for negative photoresist coating process according to claim 1, characterized in that, The detection component (4) includes a control box (41) mounted on one side of the first curing tunnel (1) or the second curing tunnel (2), and a ring frame (42) mounted on the exit end face of the first curing tunnel (1) or the second curing tunnel (2). An interferometric thickness sensor (43) is vertically inserted through the ring frame (42).

6. The intermediate processing equipment for negative photoresist coating process according to claim 3, characterized in that, One translation component (5) is used to move the silicon wafer from the end of the first conveyor belt (11) to the beginning of the second conveyor belt (21). Another translation component (5) is used to move the silicon wafer from the end of the second conveyor belt (21) to the beginning of the first conveyor belt (11). The translation component (5) includes a pair of L-shaped frames (51). The upper end of the L-shaped frame (51) is provided with a fourth linear mechanism (52) parallel to the second linear mechanism (15). The sliding end of the fourth linear mechanism (52) is provided with a fifth linear mechanism (53) parallel to the conveying direction of the silicon wafer in the first curing tunnel (1) or the second curing tunnel (2). The output end of the fifth linear mechanism (53) is provided with a pair of L-shaped trays (55) symmetrically arranged. The vertical opposite surfaces of the two L-shaped trays (55) are used to limit the silicon wafer.

7. The intermediate processing equipment for negative photoresist coating process according to claim 6, characterized in that, The upper horizontal surface of the L-shaped pallet (55), the conveying plane of the first conveyor belt (11), and the second conveyor belt (21) are all located on the same horizontal plane.

8. The intermediate processing equipment for negative photoresist coating process according to claim 1, characterized in that, The flipping assembly (6) includes a first rotary motor (62) located between the starting end of the first conveyor belt (11) and the ending end of the second conveyor belt (21). The output end of the first rotary motor (62) is provided with a second rotary motor (63). A pair of sixth linear mechanisms (67) with opposite output directions are provided on one side of the output end of the second rotary motor (63). The output end of the sixth linear mechanism (67) is provided with a hanging plate (68). The hanging plate (68) has a clamping block (69) at the lower end of the side facing the sixth linear mechanism (67). One side of the clamping block (69) is formed with an arc surface. The arc surface is provided with an arc groove that matches the outer periphery of the silicon wafer.

9. The intermediate processing equipment for negative photoresist coating process according to claim 8, characterized in that, The output end of the second rotary motor (63) is provided with a rotating plate (64), and one side of the rotating plate (64) is provided with an L-shaped support rod (65), and one end of its short side is provided with a mounting base (66). Two sixth linear mechanisms (67) are respectively located at both ends of the mounting base (66).

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