Chip AOI detection equipment and chip test equipment

Abstract

The invention relates to the technical field of chip detection, in particular to chip AOI detection equipment and chip testing equipment. The equipment comprises a bottom surface inspection camera assembly which is used for acquiring a back image of at least one to-be-detected chip adsorbed by the tail end of an adsorption assembly which moves along a first direction above the bottom surface inspection camera assembly; the first side face inspection camera assembly and the second side face inspection camera assembly are arranged on the two sides of the first direction respectively, image taking optical axes of a first side face inspection camera and a second side face inspection camera are horizontally and parallelly arranged, and image taking view fields of the first side face inspection camera and the second side face inspection camera are oppositely arranged; the detection module is used for detecting a first side surface and a second side surface of a to-be-detected chip; and the control host is in communication connection with the bottom face inspection camera assembly, the first side face inspection camera assembly and the second side face inspection camera assembly. According to the equipment, multiple surfaces of the to-be-detected chip can be rapidly detected, the detection efficiency is remarkably improved, and the problem of defect missing detection caused by incomplete detection range of existing equipment is avoided.

Description

Technical Field

[0001] This application relates to the field of chip inspection technology, specifically to a chip AOI inspection device and a chip testing device. Background Technology

[0002] A chip is a tiny electronic device made of semiconductor materials. It ingeniously integrates multiple electronic components and circuit functional units, such as transistors, resistors, and capacitors, onto a single chip and is widely used in various electronic devices and systems. However, during chip manufacturing and testing, various surface defects can occur, such as scratches, chipping, and breaks, as well as soldering problems and component misalignment. To quickly and accurately detect chip surface defects, soldering problems, and component misalignment, thereby improving chip production efficiency and ensuring product quality, AOI (Automated Optical Inspection) of all six sides of the chip is required. Currently, most AOI inspection equipment on the market has limited functionality and an incomplete inspection range, only able to inspect the front and back of the chip, unable to inspect the four sides. This can lead to defects in certain areas or angles being missed, significantly increasing the risk of undetected defects. Although a few AOI inspection devices can inspect the front, back, and four sides of the chip, these devices still have significant shortcomings. Specifically, their inspection efficiency needs improvement, and the clarity and stability of the images are difficult to guarantee. For example, cameras used for inspecting the four sides lack sufficient positioning accuracy and cannot focus quickly, resulting in blurry images. As electronic products continue to miniaturize and become more intelligent, the requirements for chip size are becoming increasingly stringent. In this context, the accuracy and reliability of existing AOI inspection equipment will be significantly reduced when inspecting chips that are even smaller or more complex in shape. Therefore, a new type of chip AOI inspection equipment is needed. Summary of the Invention

[0003] The purpose of this application is to provide a chip AOI inspection device and a chip testing device that can improve inspection efficiency while ensuring image clarity and stability, thereby meeting the higher requirements of the electronics industry for chip inspection.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a chip AOI inspection device, the chip AOI inspection device comprising: A bottom-side inspection camera assembly includes a bottom-side inspection camera, wherein the imaging optical axis of the bottom-side inspection camera is arranged vertically for acquiring a back image of the chip under test moving above it along a first direction. The first side inspection camera assembly and the second side inspection camera assembly are respectively disposed on both sides of the first direction; The first side-view camera assembly includes a first side-view camera and a first drive assembly for driving the first side-view camera to reciprocate along a second direction; the second side-view camera assembly includes a second side-view camera and a second drive assembly for driving the second side-view camera to reciprocate along a second direction. The imaging optical axes of the first side-view camera and the second side-view camera are arranged horizontally and parallel, and the imaging fields of the first side-view camera and the second side-view camera are arranged opposite to each other. The first side-view camera is used to acquire a first side image of the chip under test moving along the first direction; the second side-view camera is used to acquire a second side image of the chip under test moving along the first direction. The control host is communicatively connected to the bottom surface inspection camera assembly, the first side surface inspection camera assembly, and the second side surface inspection camera assembly; The control host can determine the amount of movement of the first side inspection camera along the second direction based on the information of the acquired back image, thereby achieving focus between the first side inspection camera and the first side of the chip under test; and determine the amount of movement of the second side inspection camera along the second direction, thereby achieving focus between the second side inspection camera and the second side of the chip under test.

[0005] Furthermore, the imaging optical axes of the first side inspection camera and the second side inspection camera are coaxially arranged. When the chip under test moves along the first direction to the imaging field of view of the first side inspection camera or the second side inspection camera, the first side inspection camera and the second side inspection camera can simultaneously acquire the corresponding first side image and second side image of the chip under test.

[0006] Furthermore, the imaging optical axes of the first side inspection camera and the second side inspection camera are arranged at intervals along the first direction. During the process of the chip under test moving along the first direction, the chip under test can pass through the first side inspection camera and the second side inspection camera in sequence, thereby obtaining the first side image of the chip under test through the first side inspection camera and the second side image of the chip under test through the second side inspection camera in sequence.

[0007] Furthermore, the first driving component includes a first slider that can slide along a second direction, and the first side detection camera is fixedly mounted on the first slider; The second drive assembly includes a second slider that can slide along a second direction, and the second side inspection camera is fixedly mounted on the second slider.

[0008] Furthermore, it also includes an adsorption component, which includes a plurality of suction nozzle shafts arranged sequentially along the first direction. The bottom end of each suction nozzle shaft is used to adsorb one of the chips under test. Each suction nozzle shaft can drive the chip under test to rotate around its axis and can drive the chip under test to move up and down along its axis.

[0009] Furthermore, it also includes a first side camera fine-tuning component and a second side camera fine-tuning component; The first side camera fine-tuning component is fixedly mounted on the first slider. The upper end of the first side camera fine-tuning component is connected to the first side camera and drives the first side camera to rotate on the horizontal plane, thereby adjusting the imaging optical axis of the first side camera to a direction parallel to the second direction. The second side camera fine-tuning component is fixedly mounted on the second slider. The upper end of the second side camera fine-tuning component is connected to the second side inspection camera, driving the second side inspection camera to rotate on the horizontal plane, thereby adjusting the imaging optical axis of the second side inspection camera to a direction parallel to the second direction.

[0010] Furthermore, the first side camera fine-tuning component includes a first fixing member and a first driving member. One end of the first fixing member is connected to the front end of the first side camera and the other end is fixedly connected to the first slider. The first driving member is fixedly disposed on the first slider. The first driving member includes a first moving member connected to the first side camera. The first moving member is used to drive the first side camera to rotate on the horizontal plane. The second side camera fine-tuning assembly includes a second fixing member and a second driving member. One end of the second fixing member is connected to the front end of the second side inspection camera, and the other end is fixedly connected to the second slider. The second driving member is fixedly mounted on the second slider. The second driving member includes a second moving member connected to the second side inspection camera. The second moving member is used to drive the second side inspection camera to rotate on the horizontal plane.

[0011] Furthermore, the chip AOI inspection device also includes a bottom camera fine-tuning component, which is connected to the bottom inspection camera component. The bottom camera fine-tuning component drives the bottom inspection camera component to move along the first direction, so as to make the imaging optical axis of the bottom inspection camera coincide with the axis of the suction nozzle axis.

[0012] Furthermore, the bottom camera fine-tuning assembly includes a connector and a third driving component. The connector is L-shaped, with one end fixedly mounted on the third driving component and the other end fixedly connected to the side of the bottom camera assembly. The third driving component drives the bottom camera assembly to move along the first direction.

[0013] This application also provides a chip testing device, which includes the above-mentioned chip AOI inspection device.

[0014] The beneficial effects of this invention are as follows: The chip AOI inspection equipment provided in this application, by rationally arranging the first side inspection camera assembly, the second side inspection camera assembly, and the bottom inspection camera assembly, can achieve rapid inspection of multiple sides of the chip. While greatly shortening the single inspection cycle, it greatly improves the accuracy and reliability of chip inspection, avoids the defect omission problem caused by the incomplete inspection range of existing equipment, and thus significantly improves the inspection efficiency, which helps to improve the chip production efficiency.

[0015] This chip AOI inspection equipment achieves precise focusing between the first and second side inspection cameras and the chip under test (DUT) through its drive components. This ensures that when capturing images from all four sides of the DUT, the first and second side inspection cameras focus on the key inspection areas, obtaining clear image data and significantly improving the accuracy and reliability of the inspection. The side camera fine-tuning components and the bottom camera fine-tuning components allow for precise adjustment of the imaging optical axes of the first and second side inspection cameras and the bottom inspection camera, respectively. This eliminates image blurring and distortion caused by camera installation errors, mechanical vibrations, and other factors, further ensuring clear and stable images and providing high-quality image data for subsequent defect analysis. The precise focusing of the first and second side inspection cameras with the DUT through the first and second drive components also gives this chip AOI inspection equipment high flexibility and convenience, making it promising for a wide range of applications. When inspecting chips of different sizes and shapes, especially those that are smaller or more complex in shape, the system can automatically adjust the focus position to ensure the accuracy and reliability of the inspection results without requiring hardware replacement or complex parameter resetting. This not only saves equipment debugging time and costs but also improves the adaptability and production efficiency of the production line, making it particularly suitable for multi-variety, small-batch chip production.

[0016] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a chip AOI inspection device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the second side inspection camera assembly according to an embodiment of the present invention; Figure 3This is a top view of a chip AOI inspection device according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the first side camera fine-tuning component according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the bottom surface inspection camera assembly according to one embodiment of the present invention; Figure label: 1. Bottom surface inspection camera assembly; 11. Bottom surface inspection camera; 12. Protective component; 2. First side surface inspection camera assembly; 21. First side surface inspection camera; 22. First drive assembly; 221. First slider; 3. Second side surface inspection camera assembly; 31. Second side surface inspection camera; 32. Second drive assembly; 321. Second slider; 4. Bottom surface camera fine-tuning assembly; 41. Third drive component; 42. Connector; 5. Second side surface camera fine-tuning assembly; 51. Second fixing component; 52. Second drive component; 521. Second moving component; 522. Second guide component; 53. Second support plate; 6. First side surface camera fine-tuning assembly; 61. First fixing component; 62. First drive component; 621. First moving component; 622. First guide component; 63. First support plate; 7. Nozzle shaft; 10. Chip under test. Detailed Implementation

[0018] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0022] Please see Figure 1 This application discloses a preferred embodiment of a chip AOI inspection device, comprising a bottom-side camera assembly 1, a first side-side camera assembly 2, a second side-side camera assembly 3, and a control host. The bottom-side camera assembly 1 includes a bottom-side camera 11, whose imaging optical axis is vertically arranged to acquire a rear image of the chip 10 under test moving above it along a first direction, which is parallel to the X-axis. The first side-side camera assembly 2 and the second side-side camera assembly 3 are respectively disposed on opposite sides of the first direction. The first side-side camera assembly 2 includes a first side-side camera 21 and a first driving component 22 that drives the first side-side camera 21 to reciprocate along a second direction. Figure 2 As shown, the second side inspection camera assembly 3 includes a second side inspection camera 31 and a second driving assembly 32 that drives the second side inspection camera 31 to reciprocate along a second direction; the second direction is parallel to the Y-axis. The imaging optical axes of the first side inspection camera 21 and the second side inspection camera 31 are arranged horizontally and parallel, and the imaging fields of the first side inspection camera 21 and the second side inspection camera 31 are arranged opposite to each other. The first side inspection camera 21 is used to acquire a first side image of the chip under test 10 moving along the first direction; the second side inspection camera 31 is used to acquire a second side image of the chip under test 10 moving along the first direction. The control host is communicatively connected to the bottom surface inspection camera assembly 1, the first side surface inspection camera assembly 2, and the second side surface inspection camera assembly 3. Based on the information from the acquired back image, the control host can determine the amount of movement of the first side surface inspection camera 21 along the second direction, thereby enabling the first side surface inspection camera 21 to focus on the first side surface of the chip under test 10, ensuring that the focal plane of the side surface camera 21 precisely coincides with the first side surface of the chip under test 10, thus guaranteeing the accuracy of the first side surface inspection; and determine the amount of movement of the second side surface inspection camera 31 along the second direction, thereby enabling the second side surface inspection camera 31 to focus on the second side surface of the chip under test 10; thus significantly improving the automation level and inspection accuracy of the chip AOI inspection equipment.

[0023] Specifically, in this embodiment, the imaging optical axes of the first side inspection camera 21 and the second side inspection camera 31 are arranged at intervals along a first direction. During the movement of the chip under test 10 along the first direction, the chip under test 10 can sequentially pass through the first side inspection camera 21 and the second side inspection camera 31, thereby sequentially acquiring a first side image of the chip under test 10 through the first side inspection camera 21 and a second side image of the chip under test 10 through the second side inspection camera 31. From a spatial layout perspective, as... Figure 3 As shown, in the first direction, the first side inspection camera 21 and the bottom inspection camera assembly 1 are arranged side by side, closely adjacent to each other. In the second direction, the second side inspection camera 31 overlaps with both the side-by-side first side inspection camera 21 and the bottom inspection camera assembly 1. This compact arrangement allows the bottom inspection camera assembly 1 to nest with the first side inspection camera 21 and the second side inspection camera 31 without interfering with each other, significantly saving internal space and making the overall structure of the chip AOI inspection equipment more compact. This not only facilitates transportation and storage but also helps in its installation within larger equipment, achieving a tight connection with the overall system. In the second direction, the staggered arrangement of the first side inspection camera 21 and the second side inspection camera 31 also provides ample space for installation, debugging, and maintenance, avoiding errors or difficulties in installation and debugging due to limited space between components. This greatly improves the control efficiency of the first side inspection camera 21 and the second side inspection camera 31, thereby effectively ensuring the accuracy of the inspection and providing assurance for the quality inspection of the chip 10 under test. In other embodiments, the imaging optical axes of the first side inspection camera 21 and the second side inspection camera 31 are coaxially arranged. When the chip under test 10 moves along the first direction to the imaging field of view of the first side inspection camera 21 or the second side inspection camera 31, the first side inspection camera 21 and the second side inspection camera 31 can simultaneously acquire the corresponding first side image and second side image of the chip under test 10. This allows for the detection of both sides of the chip under test 10 in a shorter time, improving detection efficiency and making the chip AOI detection equipment suitable for scenarios with high detection speed requirements. During the detection of the two opposite sides of the chip under test 10, when the distance between the two side cameras 21 and the chip under test 10 is equal, the two side cameras 21 can be adjusted in opposite directions based on the position information obtained by the bottom inspection camera 11.

[0024] In this embodiment, the first driving component 22 includes a first slider 221 that can slide along a second direction, and a first side inspection camera 21 is fixedly mounted on the first slider 221; the second driving component 32 includes a second slider 321 that can slide along a second direction, and a second side inspection camera 31 is fixedly mounted on the second slider 321. Both the first driving component 22 and the second driving component 32 include a matching servo motor and a lead screw. The first slider 221 and the second slider 321 are respectively sleeved on the lead screw and slide back and forth along the lead screw during the rotation driven by the servo motor, thereby driving the first side inspection camera 21 and the second side inspection camera 31 to move back and forth along the second direction, so that the focal planes of the first side inspection camera 21 and the second side inspection camera 31 coincide with the first side and the second side of the chip under test 10, respectively. In other embodiments, the first driving component 22 and the second driving component 32 can be selected from any other motion module capable of driving the first side inspection camera 21 and the second side inspection camera 31 to move back and forth along the second direction, depending on actual needs and application scenarios. In this embodiment and other embodiments, the bottom surface inspection camera assembly 1 may also include a protective member 12. The protective member 12 is fixedly disposed on the periphery of the bottom surface inspection camera 11, and its main function is to fix and protect the bottom surface inspection camera 11, effectively preventing the bottom surface inspection camera 11 from shaking during use.

[0025] In this embodiment, the chip AOI inspection equipment further includes an adsorption assembly, which comprises multiple suction nozzle shafts 7 arranged sequentially along a first direction. The bottom end of each suction nozzle shaft 7 is used to adsorb a chip 10 to be tested. Each suction nozzle shaft 7 can drive the chip 10 to be tested to rotate around its axis and can drive the chip 10 to be tested to move up and down along its axis. This allows for flexible adjustment of the position and angle of the chip 10 to be tested during the inspection process, so that the focal planes of the first side inspection camera assembly 2 and the second side inspection camera assembly 3 coincide with the planes containing the first side and the second side of the chip 10 to be tested, respectively. Furthermore, by controlling the distance the suction nozzle shaft 5 moves along the first direction, the center of the first side and the second side of the chip 10 to be tested is made as close as possible to the focal point of the first side inspection camera assembly 2 and the second side inspection camera assembly 3, respectively. This precise control can greatly improve the accuracy and efficiency of the inspection, making the entire inspection process more intelligent and efficient. When the chip under test 10 adsorbed at the end of the adsorption component needs to be inspected by AOI, the adsorption component will first move above the bottom surface inspection camera component 1, and then move along the first direction, so that the bottom surface inspection camera component 1, the first side inspection camera component 2, and the second side inspection camera component 3 will sequentially take pictures of the back, the first side, and the second side of the chip. After the first side inspection camera component 2 and the second side inspection camera component 3 have inspected the first side and the second side of the chip under test 10 respectively, the suction nozzle shaft 5 will first rotate 90°, and then move from the top of the bottom surface inspection camera component 1 along the first direction, so that the first side inspection camera component 2 and the second side inspection camera component 3 will inspect the other two opposite sides of each chip under test 10, namely the third side and the fourth side, thus completing the inspection of all four sides of the chip under test 10.

[0026] The chip AOI inspection device also includes a first side camera fine-tuning component 6. For example... Figure 4 As shown, the first side camera fine-tuning component 6 is fixedly mounted on the first slider 221. The upper end of the first side camera fine-tuning component 6 is connected to the first side inspection camera 21, driving the first side inspection camera 21 to rotate on the horizontal plane. This precisely adjusts the image-capturing optical axis of the first side inspection camera 21 to a direction parallel to the second direction, thereby aligning the focal plane of the first side inspection camera component 2 with the first side of the chip under test 10. This ensures that the first side of the chip under test 10 can be clearly and accurately captured, improving the quality of the inspection. Similarly, this chip AOI inspection device also includes a second side camera fine-tuning component 5. The second side camera fine-tuning component 5 is fixedly mounted on the second slider 321. The upper end of the second side camera fine-tuning component 5 is connected to the second side inspection camera 31, driving the second side inspection camera 31 to rotate on the horizontal plane. This adjusts the image-capturing optical axis of the second side inspection camera 31 to a direction parallel to the second direction.

[0027] In this embodiment, the first side camera fine-tuning assembly 6 includes a first fixing member 61 and a first driving member 62. One end of the first fixing member 61 is fixedly connected to the slider 221, and the other end is connected to the front end of the first side inspection camera 21, providing a supporting foundation for the first side inspection camera 21. The first driving member 62 is fixedly mounted on the first slider 221 and includes a first moving member 621 connected to the first side inspection camera 21. The first moving member 621 drives the first side inspection camera 21 to rotate on a horizontal plane with its front end as the rotation point, achieving precise adjustment of the camera angle. To ensure the stability of the movement direction of the first moving member 621, the first driving member 62 also includes a first guide member 622, which is fixedly mounted on the first slider 221. The first guide member 622 is provided with a guide protrusion, and the first moving member 621 is provided with a groove for accommodating the guide protrusion. The first moving member 621 is fastened to the first guide member 622 and moves along the guide protrusion to ensure the stability and accuracy of the rotation of the first side inspection camera 21. In other embodiments, to further enhance the stability of the first side inspection camera 21, the first side camera fine-tuning assembly 6 also includes a U-shaped first support plate 63. The vertical section of the first support plate 63 is provided with a through hole for the first side inspection camera 21 to pass through, and the through hole can fit tightly against the first side inspection camera 21, providing it with additional support. The horizontal section of the first support plate 63 is fixedly connected to the first moving member 621. The first support plate 63 can effectively reduce the shaking of the camera during rotation and improve the reliability of the inspection. The first driving member 62 can also be any other component that can drive the rotation of the first side inspection camera 21, depending on actual needs and performance requirements. Similarly, the second side camera fine-tuning assembly 5 includes a second fixing member 51, a second driving member 52, and a second support plate 53. One end of the second fixing member 51 is connected to the front end of the second side inspection camera 31, and the other end is fixedly connected to the second slider 321. The second driving member 52 is fixedly mounted on the second slider 321. The second driving member 52 includes a second moving member 521 connected to the second side inspection camera 31 and a second guide member 522 that plays a guiding role. The second moving member 521 is used to drive the second side inspection camera 31 to rotate on the horizontal plane.

[0028] The chip AOI inspection equipment also includes a bottom-side camera fine-tuning component 4. The bottom-side camera fine-tuning component 4 is connected to the bottom-side inspection camera component 1. The bottom-side camera fine-tuning component 4 drives the bottom-side inspection camera component 1 to move along the first direction, thereby aligning the imaging optical axis of the bottom-side inspection camera 11 with the axis of the suction nozzle axis 7. This ensures that during the inspection process, the bottom-side inspection camera 11 can accurately capture every detail of the back surface of the chip 10 under test, providing a reliable basis for accurate quality assessment of the chip 10. In this embodiment, as... Figure 5As shown, the bottom-side camera fine-tuning assembly 4 includes a connector 42 and a third drive member 41. The connector 42 is L-shaped, with one end fixedly mounted on the third drive member 41 and the other end fixedly connected to the side of the bottom-side inspection camera assembly 1. The structure of the third drive member 41 is the same as that of the first drive member 62, and it is used to precisely drive the bottom-side inspection camera assembly 1 to move along a first direction. In other embodiments, the structure of the third drive member 41 may differ from that of the first drive member 62.

[0029] This application also provides a chip testing device, which includes the above-mentioned chip AOI inspection device.

[0030] The inspection process of chip AOI inspection equipment: The chip under test is adsorbed and fixed by the suction nozzle axis of the adsorption assembly and moved above the bottom inspection camera. The position of the bottom inspection camera is finely adjusted by the bottom camera fine-tuning assembly to ensure that the imaging optical axis of the bottom inspection camera coincides with the axis of the suction nozzle axis above it to obtain a clear image. The bottom inspection camera assembly starts working, and the bottom inspection camera takes an image of the back of the chip under test.

[0031] Based on the image information captured by the bottom inspection camera, the control host obtains the position information of the chip under test, and determines the distance that the adsorption component drives the chip to move along the first direction, as well as the distance that the first side inspection camera and the second side inspection camera move along the second direction.

[0032] After the adsorption component moves the chip a certain distance along the first direction, the first side inspection camera moves a certain distance along the second direction and takes a picture of the first side of the chip under test.

[0033] The adsorption component moves the chip a certain distance along the first direction, while the second side inspection camera moves a certain distance along the second direction and captures an image of the second side of the chip under test. During the inspection process, the angle of the first or second side inspection camera can be adjusted manually as needed to ensure that the imaging optical axes of the first and second side inspection cameras are parallel to the second direction, thereby obtaining a clear side image.

[0034] After the first and second sides of the chip under test are inspected, the nozzle shaft rotates 90° around its axis and then moves along the first direction from the top of the bottom inspection camera, so that the first side inspection camera and the second side inspection camera can inspect the third side of the chip under test in sequence.

[0035] After the inspection is completed, the captured images are analyzed and processed to determine whether the chip has surface defects, welding problems, component position misalignment, etc.

[0036] The technical features of the above-described embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A chip AOI inspection device, characterized in that, The chip AOI inspection equipment includes: Bottom surface inspection camera assembly (1) includes bottom surface inspection camera (11), the imaging optical axis of the bottom surface inspection camera (11) is arranged vertically, and is used to acquire the back image of the chip under test (10) moving above it along the first direction; The first side inspection camera assembly (2) and the second side inspection camera assembly (3) are respectively disposed on both sides of the first direction; The first side inspection camera assembly (2) includes a first side inspection camera (21) and a first drive assembly (22) that drives the first side inspection camera (21) to reciprocate along a second direction; the second side inspection camera assembly (3) includes a second side inspection camera (31) and a second drive assembly (32) that drives the second side inspection camera (31) to reciprocate along a second direction. The imaging optical axes of the first side-view camera (21) and the second side-view camera (31) are arranged horizontally and parallel, and the imaging fields of the first side-view camera (21) and the second side-view camera (31) are arranged opposite to each other. The first side inspection camera (21) is used to acquire a first side image of the chip under test (10) moving along the first direction; the second side inspection camera (31) is used to acquire a second side image of the chip under test (10) moving along the first direction. The control host is communicatively connected to the bottom surface inspection camera assembly (1), the first side surface inspection camera assembly (2), and the second side surface inspection camera assembly (3); The control host can determine the amount of movement of the first side inspection camera (21) along the second direction based on the information of the acquired back image, thereby achieving first side focus of the first side inspection camera (21) and the chip under test (10); and determine the amount of movement of the second side inspection camera (31) along the second direction, thereby achieving second side focus of the second side inspection camera (31) and the chip under test (10).

2. The chip AOI inspection equipment as described in claim 1, characterized in that, The first side inspection camera (21) and the second side inspection camera (31) are coaxially arranged. When the chip under test (10) moves along the first direction to the field of view of the first side inspection camera (21) or the second side inspection camera (31), the first side inspection camera (21) and the second side inspection camera (31) can synchronously acquire the corresponding first side image and second side image of the chip under test (10).

3. The chip AOI inspection equipment as described in claim 1, characterized in that, The imaging optical axes of the first side inspection camera (21) and the second side inspection camera (31) are arranged at intervals along the first direction. During the movement of the chip under test (10) along the first direction, the chip under test (10) can pass through the first side inspection camera (21) and the second side inspection camera (31) in sequence, and then obtain the first side image of the chip under test (10) through the first side inspection camera (21) and the second side image of the chip under test (10) through the second side inspection camera (31).

4. The chip AOI inspection equipment as described in claim 1, characterized in that, The first drive assembly (22) includes a first slider (221) that can slide along a second direction, and the first side inspection camera (21) is fixedly mounted on the first slider (221); The second drive assembly (32) includes a second slider (321) that can slide along a second direction, and the second side inspection camera (31) is fixedly mounted on the second slider (321).

5. The chip AOI inspection equipment as described in claim 1, characterized in that, It also includes an adsorption component, which includes a plurality of suction shafts (7) arranged sequentially along the first direction. The bottom end of each suction shaft (7) is used to adsorb one of the chips under test (10). Each suction shaft (7) can drive the chip under test (10) to rotate around its axis and can drive the chip under test (10) to move up and down along its axis.

6. The chip AOI inspection equipment as described in claim 4, characterized in that, It also includes a first side camera fine-tuning component (6) and a second side camera fine-tuning component (5); The first side camera fine adjustment component (6) is fixedly mounted on the first slider (221). The upper end of the first side camera fine adjustment component (6) is connected to the first side camera (21) to drive the first side camera (21) to rotate on the horizontal plane, thereby adjusting the imaging optical axis of the first side camera (21) to a direction parallel to the second direction. The second side camera fine adjustment component (5) is fixedly mounted on the second slider (321). The upper end of the second side camera fine adjustment component (5) is connected to the second side inspection camera (31) to drive the second side inspection camera (31) to rotate on the horizontal plane, thereby adjusting the imaging optical axis of the second side inspection camera (31) to a direction parallel to the second direction.

7. The chip AOI inspection equipment as described in claim 6, characterized in that, The first side camera fine-tuning component (6) includes a first fixing member (61) and a first driving member (62). One end of the first fixing member (61) is connected to the front end of the first side camera (21), and the other end is fixedly connected to the first slider (221). The first driving member (62) is fixedly mounted on the first slider (221). The first driving member (62) includes a first moving member (621) connected to the first side camera (21). The first moving member (621) is used to drive the first side camera (21) to rotate on the horizontal plane. The second side camera fine-tuning component (5) includes a second fixing member (51) and a second driving member (52). One end of the second fixing member (51) is connected to the front end of the second side inspection camera (31), and the other end is fixedly connected to the second slider (321). The second driving member (52) is fixedly mounted on the second slider (321). The second driving member (52) includes a second moving member (521) connected to the second side inspection camera (31). The second moving member (521) is used to drive the second side inspection camera (31) to rotate on the horizontal plane.

8. The chip AOI inspection equipment as described in claim 5, characterized in that, The chip AOI inspection device also includes a bottom camera fine-tuning component (4), which is connected to the bottom inspection camera component (1). The bottom camera fine-tuning component (4) drives the bottom inspection camera component (1) to move along the first direction, so that the imaging optical axis of the bottom inspection camera (11) coincides with the axis of the suction nozzle axis (7).

9. The chip AOI inspection equipment as described in claim 8, characterized in that, The bottom camera fine-tuning component (4) includes a connector (42) and a third drive component (41). The connector (42) is L-shaped, with one end fixedly mounted on the third drive component (41) and the other end fixedly connected to the side of the bottom camera component (1). The third drive component (41) drives the bottom camera component (1) to move along the first direction.

10. A chip testing device, characterized in that, The chip AOI inspection device includes any one of claims 1-9.

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