Chip transfer equipment

Abstract

The invention discloses chip transfer equipment, and relates to the technical field of carrying equipment. According to the invention, the at least two elastic suction nozzle assemblies can be uniformly distributed about the center of the turntable, and the chip transfer stations are respectively formed, so that the chip transfer efficiency can be improved. Moreover, the plurality of elastic suction nozzle assemblies share one first push rod assembly, and the first push rod assembly abuts against the elastic suction nozzle assemblies when acting, so that the elastic suction nozzle assemblies are close to the chip and adsorb the chip. According to the chip transfer equipment, the elastic suction nozzle assembly is arranged on the rotating disc, and the position of the first push rod assembly above the rotating disc is adjusted, so that the elastic suction nozzle assembly can suck chips in any posture in the forward direction, the position precision required by chip transfer is reduced, the chip transfer efficiency is further improved, and meanwhile, the equipment cost of the chip transfer equipment is reduced.

Description

Technical Field

[0001] This invention relates to the field of material handling equipment technology, and in particular to a chip transfer device. Background Technology

[0002] After the chips are packaged, they usually need to be tested in batches. This process requires transferring the chips to the testing station and then transferring the tested chips from the testing station.

[0003] Current chip transfer equipment typically uses a feed shuttle for feeding and picks up oriented chips at specific positions on the feed shuttle to the testing station. However, this structure requires high positioning and angular accuracy for the chips, resulting in low chip transport efficiency. Summary of the Invention

[0004] This invention addresses the problem that current chip transfer equipment can only pick up chips that are oriented to a specific position in the feed shuttle, resulting in low chip transport efficiency. The invention aims to provide a chip transfer device that overcomes or at least partially solves the aforementioned problems.

[0005] This invention provides a chip transfer device, the chip transfer device comprising: Three-axis adjustment assembly; A first rotating component is connected to the three-axis adjusting component so that the position of the first rotating component can be adjusted when the three-axis adjusting component is working. A first push rod assembly is connected to the first rotary assembly in a transmission manner; The second rotating component is connected to the first push rod component, and when the first push rod component rotates, it drives the second rotating component to rotate synchronously. A turntable, wherein the turntable is connected in a transmission manner to the second rotating assembly; At least two flexible suction nozzle assemblies are located on the side of the turntable and are evenly distributed about the center of the turntable. When the second rotating assembly rotates, it drives the flexible suction nozzle assembly to rotate. When the first push rod assembly moves, it abuts against the flexible suction nozzle assembly so that the flexible suction nozzle assembly is close to the chip and adsorbs the chip.

[0006] In one optional embodiment, the flexible suction nozzle assembly includes: A mounting backplate is connected to the turntable; A spring limiting unit is located on the mounting back plate, and the axial direction of the spring limiting unit is parallel to the lifting direction of the first push rod assembly. A sliding nozzle unit is located on the mounting back plate. When the first push rod assembly extends, it abuts against the sliding nozzle unit downwards to bring the sliding nozzle unit closer to the chip and attract the chip. The sliding nozzle unit presses against the first end of the limiting spring in the spring limiting unit to reset the sliding nozzle unit through the deformation restoring force of the limiting spring.

[0007] An optional embodiment of the invention, wherein the spring limiting unit comprises: A limiting bracket, wherein a limiting groove is formed inside the limiting bracket and is located on the mounting back plate; A limiting rod is installed in the limiting groove, and the axial direction of the limiting rod is parallel to the movement direction of the first push rod assembly. The limiting spring is sleeved on the limiting rod, and the second end of the limiting spring abuts against the limiting bracket. A spring stop is sleeved on the limiting rod and contacts the first end of the limiting spring. The spring stop is kinetically connected to the sliding suction nozzle unit so that when the sliding suction nozzle unit is driven to descend by the first push rod assembly, the spring stop compresses the limiting spring.

[0008] In one optional embodiment, the sliding suction nozzle unit comprises: A slide rail is disposed on the mounting back plate, and the length direction of the slide rail is parallel to the movement direction of the first push rod assembly; A slider that slides in conjunction with a slide rail, wherein the slider is connected to a spring limiting unit so that when the slider moves downward along the slide rail, it compresses the limiting spring; A drive push rod is connected to the slider and is used to abut against the first push rod assembly; The suction nozzle is connected to the slider so that when the slider moves downward along the slide rail, it drives the suction nozzle to approach the chip.

[0009] In one optional embodiment, the first push rod assembly includes: A push rod connecting plate is connected to the first rotating assembly in a transmission manner, wherein the second rotating assembly is connected to the push rod connecting plate; A lifting push rod is fixed to the end of the push rod connecting plate away from the turntable, so that the lifting push rod is located outside the periphery of the turntable. When the lifting push rod moves downward, it is used to abut against the elastic suction nozzle assembly.

[0010] In one optional embodiment, the turntable has a receiving cavity formed in a direction away from the first rotating component, and the chip transfer device further includes a tray clamping component. The tray clamping component is tractively connected to the first push rod component, so that the three-axis adjustment component drives the tray clamping component to approach the chip tray containing the chip, and the first rotating component drives the tray clamping component to align with the chip tray for clamping.

[0011] In one optional embodiment, the tray clamping assembly includes: A tray connector is provided through the turntable and is connected to the first push rod assembly in a transmission manner; A tray base is connected to a tray connector, wherein the tray base has a tray accommodating space; At least two telescopic clamping members are spaced apart on the tray base, and the telescopic clamping members extend towards the tray receiving space, so that when the telescopic clamping members extend, they clamp the chip tray located in the tray receiving space.

[0012] In one optional embodiment of the invention, the number of telescopic clamping members is four, and the four telescopic clamping members are respectively disposed on the four sides of the material tray base. The four telescopic clamping members are used to cooperate with the material tray limiting groove opened on the chip material tray to form a clamping of the chip material tray.

[0013] In one optional embodiment, the tray clamping assembly further includes: A material tray bushing is located within the material tray receiving space and is fixedly connected to the material tray base. The material tray bushing has a limiting groove formed along the axial direction. A cover plate guide rod is embedded in the limiting groove and moves up and down along the limiting groove under the action of driving force. A tray cover plate is connected to a cover plate guide rod. When the tray cover plate is at its lowest height, it closes the chip tray held by the telescopic clamping member. A cover plate telescopic unit is located on the material tray base. The cover plate telescopic unit extends into the material tray bushing and is shaped to match the material tray cover plate located in the material tray bushing, so that when the cover plate telescopic unit performs horizontal telescopic movement, it drives the material tray cover plate to perform vertical movement.

[0014] In one optional embodiment, the cover plate telescopic unit comprises: A cover plate telescopic component, wherein the cover plate telescopic component is connected to the material tray base; A cover plate guide is provided, which is connected to the cover plate telescopic member and is located inside the material tray bushing. The top of the cover plate guide is provided with an inclined guide surface, and the material tray cover plate located in the material tray bushing is provided with a cover plate guide hole that matches the shape of the cover plate guide. When the cover plate telescopic unit performs horizontal telescopic movement, the inclined guide surface and the cover plate guide hole approach or separate from each other, driving the material tray cover plate to perform lifting and lowering movement.

[0015] In one optional embodiment, the triaxial adjustment assembly includes: Dual-axis linear module; A motor lead screw guide module is provided, which is connected to the dual-axis linear module for transmission, so that when the dual-axis linear module moves, it drives the motor lead screw guide module to move along the X-axis and / or Y-axis; wherein... The first rotating component is connected to the motor lead screw guide module so that when the motor lead screw guide module moves, it drives the first rotating component to move up and down along the Z-axis.

[0016] In one optional embodiment of the invention, the three-axis adjustment assembly further includes a module connecting plate, the module connecting plate having an L-shaped structure, wherein the module connecting plate forms surface contact with the motor lead screw guide rail module and is detachably connected to the motor lead screw guide rail module; The module connecting plate forms a surface contact with the first rotating component and is detachably connected to the first rotating component.

[0017] Compared with existing technologies, this invention includes a three-axis adjustment assembly, a first rotating assembly, a first push rod assembly, a second rotating assembly, a turntable, and at least two flexible suction nozzle assemblies. The first rotating assembly is driven by the three-axis adjustment assembly, allowing the three-axis adjustment assembly to adjust the position of the first rotating assembly during operation. The first push rod assembly is driven by the first rotating assembly, and the second rotating assembly is connected to the first push rod assembly; when the first push rod assembly rotates, it drives the second rotating assembly to rotate synchronously. The turntable is driven by the second rotating assembly. At least two of the flexible suction nozzle assemblies are located on the sides of the turntable and are evenly distributed about the center of the turntable. When the second rotating assembly rotates, it drives the flexible suction nozzle assemblies to rotate. When the first push rod assembly moves, it abuts against the flexible suction nozzle assemblies, bringing the flexible suction nozzle assemblies close to and adsorbing the chip. Thus, at least two of the flexible suction nozzle assemblies respectively form chip transfer stations, thereby improving the chip transfer efficiency. By having multiple elastic suction nozzle assemblies share a single first push rod assembly, and by adjusting the position of the first push rod assembly above the turntable, the elastic suction nozzle assembly can achieve forward adsorption of chips in any orientation. This reduces the positional accuracy required for chip transfer and further improves the transfer efficiency of the chips, while also reducing the equipment cost of the chip transfer device.

[0018] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings.

[0020] In the attached diagram: Figure 1 This is a first three-dimensional structural schematic diagram of a chip transfer device provided in an embodiment of the present invention; Figure 2 This is a second three-dimensional structural schematic diagram of a chip transfer device provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the first structure of a chip transfer device for adsorbing chips according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the second structure of a chip transfer device for adsorbing chips, provided in an embodiment of the present invention. Figure 5 This is a top view schematic diagram of a partial structure of a chip transfer device provided in an embodiment of the present invention; Figure 6 This is a three-dimensional structural diagram of a chip transfer device provided in an embodiment of the present invention; Figure 7 yes Figure 1 Enlarged structural diagram at point A; Figure 8 This is a front view schematic diagram of a material tray clamping assembly provided in an embodiment of the present invention; Figure 9 This is a top view schematic diagram of a material tray clamping assembly provided in an embodiment of the present invention; Figure 10 This is a three-dimensional structural schematic diagram of a cover plate telescopic unit provided in an embodiment of the present invention; Figure 11 yes Figure 2 Enlarged structural diagram at point B; Figure 12 This is a schematic diagram of a telescopic clamping member for holding a chip tray according to an embodiment of the present invention; Figure 13 This is a schematic diagram of a chip tray enclosure structure provided in an embodiment of the present invention; Figure label: 100. Three-axis adjustment assembly; 110. Dual-axis linear module; 120. Motor lead screw guide rail module; 130. Module connecting plate; 200. First rotating assembly; 300. First push rod assembly; 310. Push rod connecting plate; 320. Lifting push rod; 400. Second rotating assembly; 500. Turntable; 501. Receiving cavity; 600. Elastic suction nozzle assembly; 610. Mounting back plate; 620. Spring limiting unit; 621. Limiting spring; 622. Limiting bracket; 623. Limiting rod; 624. Spring stop. 630, Sliding suction nozzle unit; 631, Slide rail; 632, Slider; 633, Drive push rod; 634, Suction nozzle; 700, Tray clamping assembly; 710, Tray connector; 720, Tray base; 730, Telescopic clamping component; 740, Tray bushing; 741, Limiting long groove; 750, Cover plate guide rod; 760, Tray cover plate; 770, Cover plate telescopic unit; 771, Cover plate telescopic component; 772, Cover plate guide component; 7721, Inclined guide surface; 800, Chip; 900, Chip tray. Detailed Implementation

[0021] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0022] After the chips are packaged, they usually need to be tested in batches. This process requires transferring the chips to the testing station and then transferring the tested chips from the testing station.

[0023] Current chip transfer equipment typically uses a feed shuttle for feeding and picks up oriented chips at specific positions on the feed shuttle to the testing station. However, this structure requires high positioning and angular accuracy for the chips, resulting in low chip transport efficiency.

[0024] To address the aforementioned technical problems, this invention provides an embodiment that may include a three-axis adjustment assembly, a first rotating assembly, a first push rod assembly, a second rotating assembly, a turntable, and at least two flexible suction nozzle assemblies. The first rotating assembly is driven by the three-axis adjustment assembly, allowing the three-axis adjustment assembly to adjust the position of the first rotating assembly during operation. The first push rod assembly is driven by the first rotating assembly, and the second rotating assembly is connected to the first push rod assembly; when the first push rod assembly rotates, it drives the second rotating assembly to rotate synchronously. The turntable is driven by the second rotating assembly. At least two flexible suction nozzle assemblies are located on the sides of the turntable and are evenly distributed about the center of the turntable. When the second rotating assembly rotates, it drives the flexible suction nozzle assemblies to rotate. When the first push rod assembly moves, it abuts against the flexible suction nozzle assemblies, bringing the flexible suction nozzle assemblies close to and adsorbing the chip. Thus, at least two flexible suction nozzle assemblies respectively form chip transfer stations, thereby improving the chip transfer efficiency. By having multiple elastic suction nozzle assemblies share a single first push rod assembly, and by adjusting the position of the first push rod assembly above the turntable, the elastic suction nozzle assembly can achieve forward adsorption of chips in any orientation. This reduces the positional accuracy required for chip transfer and further improves the transfer efficiency of the chips, while also reducing the equipment cost of the chip transfer device.

[0025] Reference Figure 1-13 This invention provides a chip transfer device, which may include a three-axis adjustment assembly 100, a first rotating assembly 200, a first push rod assembly 300, a second rotating assembly 400, a turntable 500, and at least two elastic suction nozzle assemblies 600.

[0026] The first rotating component 200 is drive-connected to the three-axis adjustment component 100 so that the three-axis adjustment component 100 adjusts the position of the first rotating component 200 during operation. In addition to providing structural mounting support for the first rotating component 200, the first push rod assembly 300, the second rotating component 400, the turntable 500, and the elastic suction nozzle assembly 600, the three-axis adjustment component 100 is also used to adjust the position of the first rotating component 200. For example, the three adjustable axes in the three-axis adjustment component 100 are the X-axis, Y-axis, and Z-axis in three-dimensional spatial coordinates, thereby allowing the three-axis adjustment component 100 to adapt and adjust the position of the first rotating component 200 according to the position of the chip tray 900, so that the elastic suction nozzle assembly 600 can adsorb the chips 800 in the chip tray 900.

[0027] The first push rod assembly 300 is drively connected to the first rotating assembly 200, and the second rotating assembly 400 is connected to the first push rod assembly 300. When the first push rod assembly 300 rotates, it drives the second rotating assembly 400 to rotate synchronously. In other words, when the first rotating assembly 200 is working, it drives the first push rod assembly 300 to rotate, and when the first push rod assembly 300 rotates, it can simultaneously drive the second rotating assembly 400 connected to it to rotate.

[0028] The turntable 500 is driveably connected to the second rotating assembly 400. At least two of the elastic suction nozzle assemblies 600 are located on the side of the turntable 500 and are evenly distributed about the center of the turntable 500. "Evenly distributed" can be understood as at least two elastic suction nozzle assemblies 600 being distributed at equal angles about the center of the turntable 500. When the second rotating assembly 400 rotates with the first push rod assembly 300, the elastic suction nozzle assemblies 600 distributed on the side of the turntable 500 can rotate synchronously with the first push rod assembly 300. Furthermore, when the second rotating assembly 400 is working, it can drive the turntable 500, which is driveably connected to it, to rotate. That is, when the first rotating assembly 200 is not working (not outputting rotational motion), and the second rotating assembly 400 is working (outputting rotational motion), it can drive the turntable 500 to rotate relative to the first push rod assembly 300. (Refer to...) Figure 3 and Figure 4 As shown, different flexible suction nozzle assemblies 600 on the turntable 500 are switched to reach the area below the first push rod assembly 300. Thus, when the first push rod assembly 300 is activated, it abuts against the flexible suction nozzle assembly 600, causing the flexible suction nozzle assembly 600 to descend and approach the chip 800 to adsorb it.

[0029] Based on the above structural design, at least two of the elastic suction nozzle assemblies 600 respectively form chip 800 transfer stations, thereby improving the transfer efficiency of the chip 800. By having multiple elastic suction nozzle assemblies 600 share a single first push rod assembly 300, and by adjusting the position of the first push rod assembly 300 above the turntable 500, the elastic suction nozzle assemblies 600 can achieve forward adsorption of the chip 800 in any orientation. This reduces the positional accuracy required for chip 800 transfer and further improves the transfer efficiency of the chip 800, while also reducing the equipment cost of the chip transfer device.

[0030] In one or more embodiments, refer to Figure 7 As shown, the elastic suction nozzle assembly 600 may include a mounting back plate 610, a spring limiting unit 620, and a sliding suction nozzle unit 630.

[0031] The mounting back plate 610 is connected to the turntable 500. For example, the mounting back plate 610 is detachably connected to the side of the turntable 500, thereby providing mounting area for bolts, screws, and other connecting parts through the surface contact between the mounting back plate 610 and the side of the turntable 500. The spring limiting unit 620 and the sliding suction nozzle unit 630 are respectively located on the mounting back plate 610.

[0032] The axial direction of the spring limiting unit 620 is parallel to the lifting direction of the first push rod assembly 300. This parallel arrangement ensures that the axial direction of the limiting spring 621 in the spring limiting unit 620 is consistent with the extension / retraction direction. Therefore, when the first push rod assembly 300 extends, it abuts downwards against the sliding suction nozzle unit 630, causing the sliding suction nozzle unit 630 to approach and attract the chip 800. The sliding suction nozzle unit 630 presses against the first end of the limiting spring 621 in the spring limiting unit 620, thereby restoring the sliding suction nozzle unit 630 through the deformation restoring force of the limiting spring 621. The first end of the limiting spring 621 can be the end of the limiting spring 621 closer to the first push rod assembly 300, and the second end of the limiting spring 621 can be the end of the limiting spring 621 away from the first push rod assembly 300.

[0033] In one example, when the first push rod assembly 300 abuts downward against the sliding nozzle unit 630, the limiting spring 621 can be pressed downward simultaneously from its first end, compressing it. Furthermore, when the first push rod assembly 300 retracts, the pressure on the sliding nozzle unit 630 and the limiting spring 621 is released, allowing the limiting spring 621 to return to its original position due to its deformation restoring force.

[0034] Based on the above structure, the initial position of the sliding nozzle unit 630 can be limited by the spring limiting unit 620. When the sliding nozzle unit 630 moves downwards, the spring limiting unit 620 can improve the movement stability of the sliding nozzle unit 630 and enhance the buffering performance when the sliding nozzle unit 630 contacts the chip 800, thereby reducing damage to the chip 800. Furthermore, when the pressure applied by the first push rod assembly 300 is removed, the deformation restoring force of the spring limiting unit 620 drives the sliding nozzle unit 630 to return to its initial position.

[0035] In one or more embodiments, refer to Figure 7 As shown, the spring limiting unit 620 may include a limiting bracket 622, a limiting rod 623, and a spring stop 624. The limiting bracket 622 has a limiting groove inside and is located on the mounting back plate 610. In one example, the limiting bracket 622 may be a U-shaped structure, which can be fixed to the mounting back plate 610 by welding, screw connection, or other methods.

[0036] The limiting rod 623 is installed in the limiting groove. For example, the limiting rod 623 can be radially assembled into the limiting groove, and both ends of the limiting rod 623 form surface contact with the limiting bracket 622. Thus, the limiting rod 623 and the limiting bracket 622 can be fixed by assembling the two ends of the limiting rod 623 through the outer surface of the limiting bracket 622. For example, threaded holes can be provided at both ends of the limiting rod 623, allowing for a detachable connection between the limiting rod 623 and the limiting bracket 622 using screws or other fasteners.

[0037] The axial direction of the limiting rod 623 is parallel to the movement direction of the first push rod assembly 300, and the limiting spring 621 is sleeved on the limiting rod 623. The limiting rod 623 is used to limit the axial direction of the limiting spring 621, and the limiting spring 621 is sleeved on the limiting rod 623. The setting of the limiting rod 623 can provide structural support for the limiting spring 621 in the axial direction, can limit the deformation trajectory of the limiting spring 621, and can protect the limiting spring 621, thereby extending the service life of the spring limiting unit 620. In one example, the diameter of the limiting rod 623 can be the same as or slightly smaller than the inner diameter of the limiting spring 621. The axial direction of the limiting rod 623 is parallel to the movement direction of the first push rod assembly 300, which can ensure that the limiting spring 621 is axially compressed under the pressure of the first push rod assembly 300.

[0038] The second end of the limiting spring 621 abuts against the limiting bracket 622, and the spring stop 624 is sleeved on the limiting rod 623 and contacts the first end of the limiting spring 621. The spring stop 624 is kinetically connected to the sliding suction nozzle unit 630, so that when the sliding suction nozzle unit 630 is driven to descend by the first push rod assembly 300, the spring stop 624 compresses the limiting spring 621. That is, the spring stop 624 is located above the limiting spring 621, and both ends of the limiting spring 621 contact the spring stop 624 and the limiting bracket 622, respectively. When the sliding nozzle unit 630 moves downward under the abutting force of the first push rod assembly 300, the spring baffle 624, which is connected to the sliding nozzle unit 630, presses against the limiting spring 621. The spring baffle 624 moves downward along the limiting rod 623, causing the limiting spring 621 to be compressed.

[0039] When the first push rod assembly 300 releases its abutting force, the pressure force of the spring stop 624 on the limiting spring 621 is simultaneously released. The limiting spring 621 recovers its deformation, and under the action of the deformation recovery force, it drives the spring stop 624 to move upward along the limiting rod 623, simultaneously driving the sliding suction nozzle unit 630, which is connected to the spring stop 624, to move upward and return the sliding suction nozzle unit 630 to its initial position.

[0040] Based on the above structural design, the positioning and reset functions of the sliding suction nozzle unit 630 can be achieved through the simple spring limiting unit 620, which greatly reduces the structural cost of the spring limiting unit 620.

[0041] In one or more embodiments, refer to Figure 7 As shown, the sliding suction nozzle unit 630 may include a slide rail 631, a slider 632, a drive rod 633, and a suction nozzle 634. The slide rail 631 is disposed on the mounting back plate 610, and the length direction of the slide rail 631 is parallel to the movement direction of the first push rod assembly 300. The slider 632 is slidably engaged with the slide rail 631. The slide rail 631 can be fixed to the mounting back plate 610 by means of screws or welding. The slider 632 is kinetically connected to the spring limiting unit 620, so that when the slider 632 moves downward along the slide rail 631, it compresses the limiting spring 621. The drive rod 633 is connected to the slider 632 and abuts against the first push rod assembly 300. For example, the slider 632 is fixedly connected to the spring stop 624 in the spring limiting unit 620. When the first push rod assembly 300 moves downward, it abuts against the drive push rod 633, and the abutting force applied to the drive push rod 633 drives the slider 632 to move downward. During the downward movement of the slider 632, the spring stop 624, which is connected to the slider 632, will move downward synchronously, causing the spring stop 624 to move downward along the limiting rod 623 and compress the limiting spring 621.

[0042] The suction nozzle 634 is driven by the slider 632, so that when the slider 632 moves downward along the slide rail 631, it drives the suction nozzle 634 closer to the chip 800. For example, during the descent of the slider 632, the suction nozzle 634, which is driven by the slider 632, can be driven downward simultaneously. During the descent, the suction nozzle 634 can approach the chip 800 in the chip tray 900, and when the suction nozzle 634 reaches its lowest position, it can adhere to and adsorb the chip 800. Then, when the first push rod assembly 300 moves upward, the deformation recovery of the limiting spring 621 drives the spring baffle 624 to move upward along the limiting rod 623, thereby simultaneously driving the suction nozzle 634 upward away from the chip tray 900. Finally, the second rotating component 400 rotates the sliding suction nozzle unit 630 that holds the chip 800, or the three-axis adjusting component 100 adjusts the position to transfer the held chip 800 to other workstations (such as testing workstations) to quickly achieve the transfer of the chip 800.

[0043] In one example, the chip transfer device may further include a vacuum generator connected to the air passage of the suction nozzle 634. When the suction nozzle 634 forms surface contact with the chip 800, the vacuum generator operates to extract air from the suction nozzle 634, thereby generating an adsorption force under air pressure to adsorb the chip 800.

[0044] Based on the above structural design, multiple sliding nozzle units 630 can achieve damage-free adsorption of the chip 800 by sharing a single first push rod assembly 300, without each having its own power source for controlling lifting and lowering. This significantly reduces the structural cost of densely arranging the elastic nozzle assemblies 600 on the side of the turntable 500, thereby improving the transfer efficiency of the chip 800 and extending the service life of the elastic nozzle assemblies 600.

[0045] In one or more embodiments, refer to Figure 1 , Figure 5 as well as Figure 6 As shown, the first push rod assembly 300 may include a push rod connecting plate 310 and a lifting push rod 320. The push rod connecting plate 310 is drive-connected to the first rotating assembly 200, wherein the second rotating assembly 400 is connected to the push rod connecting plate 310. The push rod connecting plate 310 is used to provide structural support for the second rotating assembly 400 and the lifting push rod 320. For example, the push rod connecting plate 310 may be located above the turntable 500. The push rod connecting plate 310 is drive-connected to the first rotating assembly 200. When the first rotating assembly 200 outputs rotational motion, the push rod connecting plate 310 is driven to rotate by the first rotating assembly 200. At the same time, the second rotating assembly 400 and the lifting push rod 320 are respectively located on the push rod connecting plate 310. During the rotation of the push rod connecting plate 310, the second rotating assembly 400 and the lifting push rod 320 rotate with the push rod connecting plate 310. In other words, when the push rod connecting plate 310 rotates, it can drive the lifting push rod 320 to rotate synchronously with the turntable 500.

[0046] The lifting push rod 320 is fixed to the end of the push rod connecting plate 310 away from the turntable 500. This ensures the lifting push rod 320 is located outside the periphery of the turntable 500. When the lifting push rod 320 descends, it abuts against the elastic suction nozzle assembly 600. In other words, the push rod connecting plate 310 extends beyond the side of the turntable 500, and the axial direction of the lifting push rod 320 is parallel to the vertical direction. When the lifting push rod 320 descends, its top end abuts against the drive rod 633 of the sliding suction nozzle unit 630, thereby causing the sliding suction nozzle unit 630 to descend synchronously and compress the limiting spring 621.

[0047] When the lifting push rod 320 moves upward, the top end of the lifting push rod 320 separates from the drive rod 633 of the sliding suction unit 630, thereby removing the resisting force on the sliding suction unit 630. The limiting spring 621 drives the sliding suction unit 630 to rise to the initial position through deformation restoring force.

[0048] In one or more examples, the lifting push rod 320 can be a device such as an electric telescopic rod. The top of the lifting push rod 320 may have an abutment groove to mate with the shape of the drive rod 633, improving abutment stability and preventing relative displacement between the lifting push rod 320 and the drive rod 633 during abutment. In another example, the abutment groove may be formed near the top of the drive rod 633, close to the top of the lifting push rod 320; this is not further limited.

[0049] In one or more embodiments, the chip transfer device may further include a camera device mounted on the lifting push rod 320. The camera device can detect the distribution of chips 800 in the chip tray 900. If the camera device detects a chip 800 in the area corresponding to the sliding suction nozzle unit 630 based on an image captured vertically downwards, the lifting push rod 320 can be activated to drive the sliding suction nozzle unit 630 to descend and adsorb the chip 800 at the corresponding position in the chip tray 900. If the image shows no chip 800 in the area corresponding to the sliding suction nozzle unit 630, the position of the sliding suction nozzle unit 630 can be moved using the three-axis adjustment assembly 100 to adsorb the chip 800 at the next position in the chip tray 900.

[0050] Based on the above structural design, the rotation of the push rod connecting plate 310 can drive the synchronous rotation of the lifting push rod 320 and the turntable 500, thereby improving the positioning accuracy of the contact position between the lifting push rod 320 and the drive push rods 633 distributed on the turntable 500. Furthermore, the rotation angle of the turntable 500 relative to the drive push rods 633 is driven by the second rotating assembly 400, further improving the positioning accuracy of the contact positions between different drive push rods 633 and the lifting push rod 320.

[0051] In one or more embodiments, refer to Figure 2 As shown, the turntable 500 has a receiving cavity 501 formed in a direction away from the first rotating assembly 200. The receiving cavity 501 can be formed by the top end face and side face of the turntable 500, thus the opening direction of the receiving cavity 501 is radially downward along the turntable 500. The chip transfer device may further include a tray clamping assembly 700 for clamping the chip tray 900. The tray clamping assembly 700 is drive-connected to the first push rod assembly 300. For example, the tray clamping assembly 700 can pass through the turntable 500 and be fixed to the push rod connecting plate 310 of the push rod assembly, so that when the first rotating assembly 200 drives the push rod connecting plate 310 to rotate, the push rod connecting plate 310, the second rotating assembly 400, and the lifting push rod 320 synchronously follow the rotation of the push rod connecting plate 310.

[0052] As the tray clamping assembly 700 rotates following the first pusher assembly 300, its clamping angle on the chip tray 900 can be adjusted. For example, it can be adjusted to an angle aligned with the chip tray 900 before clamping the chip tray 900. The three-axis adjustment assembly 100 can drive the tray clamping assembly 700 closer to the chip tray 900 containing the chip 800.

[0053] In actual operation, the three-axis adjustment component 100 first moves the tray clamping component 700 above the chip tray 900 containing the chips 800. Then, the first rotating component 200 rotates the tray clamping component 700 to an angle aligned with the chip tray 900. Alternatively, the three-axis adjustment component 100 directly controls the tray clamping component 700 to descend closer to the chip tray 900, causing it to clamp the chip tray 900. Next, the three-axis adjustment component 100 rotates the tray clamping component 700 to transfer the chip tray 900. For example, the chip tray 900 is transferred to a chip 800 transfer table. Then, the elastic suction nozzle component 600 individually picks up and transfers the chips 800 from the chip tray 900.

[0054] Based on the above structural design, the tray clamping assembly 700 and the elastic suction nozzle assembly 600 can be integrated into the same chip transfer device, thereby saving the equipment movement space required for chip 800 loading and chip 800 transfer, avoiding the conflict of movement trajectories between chip 800 loading and chip 800 transfer, and achieving position adjustment by sharing the three-axis adjustment assembly 100, thus saving the number of parts in the chip transfer device.

[0055] In one or more embodiments, refer to Figure 8-13 As shown, the tray clamping assembly 700 may include a tray connector 710, a tray base 720, and at least two telescopic clamping members 730. The tray connector 710 passes through the turntable 500 and is kinetically connected to the first push rod assembly 300. For example, the tray connector 710 may be connected to the push rod connecting plate 310 of the first push rod assembly 300, or the tray connector 710 may be connected to the rotation output end of the first rotating assembly 200. Thus, when the first rotating assembly 200 outputs rotational motion, the tray connector 710 can rotate accordingly.

[0056] The tray base 720 is connected to the tray connector 710, and the tray base 720 has a tray accommodating space. The opening of the tray accommodating space is vertically downward. When the tray connector 710 rotates, it can drive the tray base 720 connected to it to rotate. At least two telescopic clamping members 730 are distributed at intervals on the tray base 720. When clamping the chip tray 900, the at least two telescopic clamping members 730 can be located on at least two sides of the chip tray 900, thereby improving the clamping stability of the chip tray 900. The telescopic direction of the telescopic clamping members 730 is towards the tray accommodating space, so that when the telescopic clamping members 730 extend, they clamp the chip tray 900 located in the tray accommodating space. In other words, each of the telescopic clamping devices moves closer to or further away from the tray receiving space, thereby clamping the chip tray 900 that has entered the tray receiving space. In one example, during the extension of each telescopic clamping member 730, it can extend to the bottom of the chip tray 900, thereby limiting the chip tray 900 by the common support of the bottom of the chip tray 900 by multiple telescopic clamping members 730, thus enabling the transfer of the chip tray 900.

[0057] During the retraction of each telescopic clamp 730, the portion of the telescopic clamp 730 extending to the bottom of the chip tray 900 retracts, and the chip tray 900 moves downward from the tray accommodating space without bottom structural support, thereby realizing the transfer of the chip tray 900.

[0058] Based on the above structural design, the rotation of the first rotating component 200 can drive the tray base 720 to rotate to an angle that facilitates clamping the chip tray 900. Then, multiple telescopic clamping members 730 work together to limit and clamp the chip tray 900, thereby enabling the chip transfer device to clamp and load the chip tray 900 at different positions and angles, improving the transfer convenience and efficiency of the chip tray 900.

[0059] In one or more embodiments, refer to Figure 9 , Figure 12 and Figure 13As shown, four telescopic clamping members 730 are provided, respectively disposed on the four sides of the tray base 720. These four telescopic clamping members 730 engage with the tray limiting grooves on the chip tray 900 to clamp the chip tray 900. The placement of the four telescopic clamping members 730 on the four sides of the tray base 720 ensures stable support for all four sides of the chip tray 900 with a minimum number of telescopic clamping members 730, thereby improving the transport stability of the chip tray 900.

[0060] The telescopic clamping member 730 engages with the tray limiting groove on the chip tray 900 to improve the relative positional accuracy between the chip tray 900 and the telescopic clamping member 730, and to prevent relative displacement between the chip tray 900 and the telescopic clamping member 730 during the transfer process.

[0061] In one or more embodiments, refer to Figure 8 As shown, the tray clamping assembly 700 may further include a tray bushing 740, a cover guide rod 750, a tray cover plate 760, and a cover telescopic unit 770. The tray bushing 740 is located within the tray receiving space and is fixedly connected to the tray base 720. When the tray base 720 rotates with the first rotating assembly 200, the tray bushing 740 rotates with the tray base 720. The tray bushing 740 has a limiting groove 741 formed along its axial direction. The length direction of the limiting groove 741 is parallel to the axial direction of the tray bushing 740. The cover guide rod 750 is embedded in the limiting groove 741 and moves up and down along the limiting groove 741 under the action of a driving force. For example, there may be two limiting grooves 741, and both ends of the cover guide rod 750 may be embedded in the two limiting grooves 741 respectively. The limiting groove 741, along the radial direction of the material tray bushing 740, limits the cover plate guide rod 750. Therefore, when the cover plate guide rod 750 is subjected to a vertical driving force, it can move up and down along the limiting groove 741.

[0062] The tray cover 760 is drive-connected to the cover guide rod 750, allowing the tray cover 760 to move up and down following the cover guide rod 750. For example, a portion of the tray cover 760 is embedded in the tray bushing 740 and fixedly connected to the cover guide rod 750. Thus, when the cover guide rod 750 moves up and down along the limiting groove 741, the tray cover 760 moves up and down synchronously with the cover guide rod 750. When the tray cover 760 is at its lowest height, it seals the chip tray 900 held by the telescopic clamping member 730. In other words, the tray cover 760 is used to seal the chip tray 900, thereby preventing impurities from the external environment from entering the chip tray 900 and affecting the electrical performance of the chip 800 during the transfer of the chip tray 900.

[0063] The cover plate telescopic unit 770 is located on the tray base 720. The cover plate telescopic unit 770 extends into the tray bushing 740 and is shaped-fitted with the tray cover plate 760 located within the tray bushing 740. This shape fit can be understood as a portion of the cover plate telescopic unit 770 being radially embedded in the tray cover plate 760 along the tray bushing 740. This allows the cover plate telescopic unit 770 to move horizontally, thereby causing the tray cover plate 760 to move vertically. For example, the vertical movement of the tray cover plate 760 along the tray bushing 740 can be achieved by moving the cover plate telescopic unit 770 and the tray cover plate 760 closer or further apart.

[0064] Based on the above structural design, the first rotating component 200 can drive the synchronous rotation of the tray cover 760 and the telescopic clamping member 730, allowing the tray clamping component 700 to rotate to an angle suitable for clamping the chip tray 900. Furthermore, the tray cover 760 directly encloses the chip tray 900, preventing impurities from the external environment from entering the chip tray 900 and affecting the electrical performance of the chip 800.

[0065] In one or more embodiments, refer to Figure 8 and Figure 10As shown, the cover plate telescopic unit 770 may include a cover plate telescopic component 771 and a cover plate guide component 772. The cover plate telescopic component 771 is connected to the tray base 720. For example, the cover plate telescopic component 771 is located within the tray receiving space and is detachably connected to the tray base 720. The cover plate guide component 772 is drively connected to the cover plate telescopic component 771. Alternatively, the cover plate guide component 772 can be understood as being connected to the output end of the cover plate telescopic component 771, thereby causing the cover plate guide component 772 to telescopically extend and retract along the horizontal direction when the cover plate telescopic component 771 is in operation.

[0066] The cover plate guide 772 is located inside the tray bushing 740. An inclined guide surface 7721 is provided on the top of the cover plate guide 772. A cover plate guide hole, adapted to the shape of the cover plate guide 772, is provided on the tray cover plate 760 located in the tray bushing 740. When the cover plate telescopic unit 770 performs horizontal telescopic movement, the inclined guide surface 7721 and the cover plate guide hole approach or separate from each other, causing the tray cover plate 760 to move up and down. For example, during the extension movement of the cover plate telescopic unit 771, the inclined guide surface 7721 approaches the cover plate guide hole, and the height of the tray cover plate 760 gradually increases under the guidance of the inclined guide surface 7721, thereby pushing the cover plate guide rod 750 to move upward along the limiting groove 741, and causing the tray cover plate 760 to rise. For example, during the retraction movement of the cover plate telescopic member 771, the inclined guide surface 7721 and the cover plate guide hole move away from each other. Under the guidance of the inclined guide surface 7721, the height of the tray cover plate 760 gradually decreases, thereby pushing the cover plate guide rod 750 to move downward along the limiting groove 741 and driving the tray cover plate 760 to descend.

[0067] Based on the above structural design, the lifting and lowering control of the tray cover 760 can be achieved through the cover plate telescopic component 771 and the cover plate guide component 772, thereby facilitating the opening and closing control of the chip tray 900 by the tray cover 760.

[0068] In one or more embodiments, refer to Figure 1As shown, the three-axis adjustment assembly 100 may include a dual-axis linear module 110 and a motor screw guide module 120. The motor screw guide module 120 is drive-connected to the dual-axis linear module 110. In one example, the dual-axis linear module 110 can be constructed by a linear motor module distributed along the X-axis and a linear motor module distributed along the Y-axis. It can not only adjust the position of the first rotating assembly 200 and other components, but also provide structural support. When the dual-axis linear module 110 moves, it drives the motor screw guide module 120 to move along the X-axis and / or the Y-axis. The first rotating assembly 200 is drive-connected to the motor screw guide module 120 so that when the motor screw guide module 120 moves, it drives the first rotating assembly 200 to move up and down along the Z-axis. For example, during the transfer of the chip 800, the horizontal position of the elastic suction nozzle assembly 600 relative to the chip 800 to be transferred can be adjusted by the dual-axis linear module 110. The height of the elastic suction nozzle assembly 600 relative to the chip 800 to be transferred is initially adjusted by the motor lead screw guide module 120. Finally, the height of the elastic suction nozzle assembly 600 relative to the chip 800 to be transferred is precisely adjusted by the first push rod assembly 300 to achieve the adsorption and transfer of the chip 800 to be transferred.

[0069] In another example, during the transfer of the chip tray 900, the horizontal position of the tray clamping assembly 700 relative to the chip tray 900 can be adjusted by the dual-axis linear module 110. Then, the height of the tray clamping assembly 700 relative to the chip tray 900 can be adjusted by the motor lead screw guide module 120. Finally, the tray clamping assembly 700 actuates to clamp the chip tray 900, and then the chip tray 900 is transferred.

[0070] Based on the above structural design, the transfer of the chip tray 900 and the transfer of a single chip 800 can share the same set of components, namely the three-axis adjustment component 100, for position adjustment. This can greatly reduce the number of parts in the chip transfer equipment and avoid conflicts in the movement trajectories between chip 800 loading and chip 800 transfer.

[0071] In one or more embodiments, refer to Figure 1As shown, the three-axis adjustment assembly 100 may further include a module connecting plate 130, which has an L-shaped structure. The module connecting plate 130 forms a surface contact with the motor lead screw guide module 120 and is detachably connected to it. This surface contact between the module connecting plate 130 and the motor lead screw guide module 120 increases the contact area, providing sufficient connection area for the detachable connection and improving the connection strength with the motor lead screw guide module 120. The module connecting plate 130 also forms a surface contact with the first rotating assembly 200 and is detachably connected to it. The module connecting plate 130 forms a surface contact with the first rotating component 200, which can increase the contact area between the module connecting plate 130 and the first rotating component 200, thereby providing sufficient connection area for detachable connection and improving the connection firmness with the first rotating component 200.

[0072] Based on the above structural design, the connection between the motor lead screw guide module 120 and the first rotating component 200 can be greatly improved, and the structural support strength of other components that are connected to the first rotating component 200 can be improved, thereby improving the overall structural strength and operational stability of the chip transfer device.

[0073] In one or more embodiments of the invention, both the first rotating component 200 and the second rotating component 400 may include a drive motor and a divider. The divider is driven by the drive motor, wherein the drive motor rotates the divider when it operates. The turntable 500 is coaxially connected to the divider of the second rotating component 400. The angle formed by two adjacent elastic suction nozzle assemblies 600 and the central axis of the turntable 500 is an integer multiple of the division angle of the divider. That is, the drive motor of the first rotating component 200 is fixed to the module connecting plate 130, and the divider of the first rotating component 200 is coaxially fixed to the push rod connecting plate 310. The drive motor of the second rotating component 400 is mounted on the divider of the first rotating component 200, and the divider of the second rotating component 400 is coaxially arranged with the divider of the first rotating component 200. The tray bushing 740 is coaxially arranged with the divider of the first rotating component 200.

[0074] For example, the divider of the second rotating component 400 can be located below the divider of the first rotating component 200, so that the rotation of the divider of the first rotating component 200 can drive the push rod connecting plate 310 and the drive motor of the second rotating component 400 to rotate synchronously. During the process of the divider of the first driving component driving the push rod connecting plate 310 and the drive motor of the second rotating component 400 to rotate, the push rod connecting plate 310 and the turntable 500 can perform a periodic action of rotating, stopping, rotating, and stopping.

[0075] When the divider of the second rotating component 400 drives the turntable 500 to rotate, the turntable 500 can perform a periodic action of rotating, stopping, rotating, and stopping.

[0076] In summary, this invention discloses a chip transfer device, which may include a three-axis adjustment assembly 100, a first rotating assembly 200, a first push rod assembly 300, a second rotating assembly 400, a turntable 500, and at least two elastic suction nozzle assemblies 600. The first rotating assembly 200 is drivenly connected to the three-axis adjustment assembly 100, so that the three-axis adjustment assembly 100 adjusts the position of the first rotating assembly 200 during operation. The first push rod assembly 300 is drivenly connected to the first rotating assembly 200, and the second rotating assembly 400 is connected to the first push rod assembly 300, and when the first push rod assembly 300 rotates, it drives the second rotating assembly 400 to rotate synchronously. The turntable 500 is drive-connected to the second rotating component 400. At least two of the elastic suction nozzle components 600 are located on the side of the turntable 500 and are evenly distributed about the center of the turntable 500. When the second rotating component 400 rotates, it drives the elastic suction nozzle components 600 to rotate. When the first push rod component 300 moves, it abuts against the elastic suction nozzle components 600, so that the elastic suction nozzle components 600 approach the chip 800 and adsorb the chip 800. Thus, at least two of the elastic suction nozzle components 600 respectively form chip 800 transfer stations, thereby improving the transfer efficiency of the chip 800. By having multiple elastic suction nozzle components 600 share a single first push rod component 300, and by adjusting the position of the first push rod component 300 above the turntable 500, the elastic suction nozzle components 600 can adsorb the chip 800 in any orientation, reducing the positional accuracy required for chip 800 transfer and further improving the transfer efficiency of the chip 800, while also reducing the equipment cost of the chip transfer device.

[0077] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0078] It will be readily apparent to those skilled in the art that any combination of the above embodiments is feasible, and therefore any combination of the above embodiments is an implementation scheme of the present invention. However, due to space limitations, this specification will not describe them in detail here.

[0079] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0080] Similarly, it should be understood that, in order to simplify the invention and aid in understanding one or more of the various aspects of the invention, in the description of exemplary embodiments of the invention above, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof.

[0081] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

Claims

1. A chip transfer apparatus characterized by comprising: The chip transfer device comprises: A three-axis adjusting assembly; A first rotating assembly, which is in transmission connection with the three-axis adjusting assembly to adjust the position of the first rotating assembly when the three-axis adjusting assembly works; A first push rod assembly, which is in transmission connection with the first rotating assembly; A second rotating assembly, which is connected with the first push rod assembly and rotates synchronously with the first push rod assembly; A rotating disc, which is in transmission connection with the second rotating assembly; At least two elastic suction nozzle assemblies, which are located on the side of the rotating disc and are uniformly distributed about the center of the rotating disc, wherein the second rotating assembly rotates to drive the elastic suction nozzle assemblies to rotate, and the first push rod assembly abuts against the elastic suction nozzle assemblies to make the elastic suction nozzle assemblies close to the chips and adsorb the chips.

2. The chip transfer apparatus according to claim 1, wherein The elastic suction nozzle assembly comprises: A mounting back plate, which is connected with the rotating disc; A spring limiting unit, which is located on the mounting back plate and has an axial direction parallel to the lifting direction of the first push rod assembly; A sliding suction nozzle unit, which is located on the mounting back plate and is abutted downward by the first push rod assembly to make the sliding suction nozzle unit close to the chips and adsorb the chips; wherein The sliding suction nozzle unit presses the first end of the limiting spring in the spring limiting unit to reset the sliding suction nozzle unit through the restoring force of the deformation of the limiting spring.

3. The chip transfer apparatus according to claim 2, wherein The spring limiting unit comprises: A limiting support, which has a limiting groove in the inside and is located on the mounting back plate; A limiting rod, which is installed in the limiting groove and has an axial direction parallel to the movement direction of the first push rod assembly, wherein the limiting spring is sleeved on the limiting rod, and the second end of the limiting spring abuts against the limiting support; A spring stop sheet, which is sleeved on the limiting rod and contacts the first end of the limiting spring, wherein the spring stop sheet is in transmission connection with the sliding suction nozzle unit, so that when the sliding suction nozzle unit is driven to move downward by the first push rod assembly, the spring stop sheet compresses the limiting spring.

4. The chip transfer apparatus according to claim 2, wherein The sliding suction nozzle unit comprises: A slide rail, which is provided on the mounting back plate and has a length direction parallel to the movement direction of the first push rod assembly; A sliding block, which is in sliding cooperation with the slide rail, wherein the sliding block is in transmission connection with the spring limiting unit, so that when the sliding block moves downward along the slide rail, the limiting spring is compressed; A driving top rod, which is connected with the sliding block to abut against the first push rod assembly; A suction nozzle, which is in transmission connection with the sliding block, so that when the sliding block moves downward along the slide rail, the suction nozzle is driven to close to the chips.

5. The chip transport apparatus according to claim 1, wherein The first push rod assembly comprises: A push rod connecting plate is in transmission connection with the first rotating assembly, wherein the second rotating assembly is connected with the push rod connecting plate; A lifting push rod is fixed to one end of the push rod connecting plate away from the rotating disc, so that the lifting push rod is located outside the rotating disc, and the lifting push rod is used to abut against the elastic suction nozzle assembly when the lifting push rod moves downward.

6. The chip transport apparatus according to claim 1, wherein The rotating disc is formed with a containing cavity in a direction away from the first rotating assembly, and the wafer transfer device further comprises a tray clamping assembly, the tray clamping assembly is in transmission connection with the first push rod assembly, so that the three-axis adjusting assembly drives the tray clamping assembly to approach a wafer tray containing the wafer, and the first rotating assembly drives the tray clamping assembly to clamp the wafer tray.

7. The chip transfer apparatus according to claim 6, wherein The tray clamping assembly comprises: A tray connecting piece is arranged through the rotating disc and is in transmission connection with the first push rod assembly; A tray base is connected with the tray connecting piece, wherein the tray base has a tray containing space; At least two telescopic clamping pieces are spaced apart on the tray base, and the telescopic clamping pieces are telescopically arranged towards the tray containing space, so that the telescopic clamping pieces are extended to clamp the wafer tray in the tray containing space.

8. The chip transfer apparatus according to claim 7, wherein The number of the telescopic clamping pieces is four, the four telescopic clamping pieces are arranged on four sides of the tray base respectively, and the four telescopic clamping pieces are used to limit the wafer tray in cooperation with a tray limiting groove arranged on the wafer tray, so as to clamp the wafer tray.

9. The chip transfer apparatus according to claim 7, wherein The tray clamping assembly further comprises: A tray shaft sleeve is arranged in the tray containing space and is fixedly connected with the tray base, wherein the tray shaft sleeve is arranged with a limiting long groove in the axial direction; A cover plate guide rod is embedded in the limiting long groove and moves up and down along the limiting long groove under the action of a driving force; A tray cover plate is connected with the cover plate guide rod, wherein the tray cover plate is closed when the tray cover plate is at the lowest height. A cover plate telescopic unit is arranged on the tray base, the cover plate telescopic unit extends into the tray shaft sleeve and cooperates with the tray cover plate in the tray shaft sleeve, so that the cover plate telescopic unit moves horizontally to drive the tray cover plate to move up and down.

10. The chip transfer apparatus according to claim 9, wherein The cover plate telescopic unit comprises: A cover plate telescopic piece is connected with the tray base; A cover plate guide piece is in transmission connection with the cover plate telescopic piece and is arranged in the tray shaft sleeve, wherein the top of the cover plate guide piece is provided with an inclined guide surface, and the tray cover plate arranged in the tray shaft sleeve is arranged with a cover plate guide hole matched with the shape of the cover plate guide piece; When the cover plate telescopic unit moves horizontally, the inclined guide surface and the cover plate guide hole are close to or separated from each other, so as to drive the tray cover plate to move up and down.

11. The chip transport apparatus of claim 1, wherein The three-axis adjusting assembly comprises: A double-shaft linear module; A motor-screw guide rail module, which is in transmission connection with the double-shaft linear module, so as to drive the motor-screw guide rail module to move along the X-axis and / or the Y-axis when the double-shaft linear module moves; wherein, The first rotating assembly is in transmission connection with the motor-screw guide rail module, so as to drive the first rotating assembly to move up and down along the Z-axis when the motor-screw guide rail module moves.

12. The chip transfer apparatus according to claim 11, wherein The three-axis adjusting assembly further comprises a module connecting plate, which is in L-shaped structure, wherein the module connecting plate is in surface contact with and detachably connected with the motor-screw guide rail module; The module connecting plate is in surface contact with and detachably connected with the first rotating assembly.

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