Optical module and fin heat pipe heat dissipation structure

Abstract

The invention relates to an optical module and a fin heat pipe heat dissipation structure. The window is formed in a cover plate of the upper shell, the fin heat pipe heat dissipation structure is arranged above the upper shell, the lower shell is arranged opposite to the upper shell, and the photoelectric assembly is located in a cavity between the upper shell and the lower shell. The fin heat pipe heat dissipation structure comprises a body plate, heat dissipation fins arranged on one side face of the body plate and a heat pipe arranged on the other side face of the body plate. At least part of the heat pipe penetrates through the window to make contact with the cavity, and the body plate completely covers the window. According to the technical scheme, the shell and the heat dissipation structure are mutually independent, material selection and machining are facilitated, the window is formed in the upper shell, the fin heat pipe heat dissipation structure can directly make contact with the inner cavity, it is guaranteed that the interior is closed, meanwhile, the heat dissipation efficiency is improved as much as possible, the fin heat pipe heat dissipation structure is integrally formed through 3D printing, and the heat dissipation efficiency is improved. And a welding process is not needed, the heat dissipation capability consistency is high, and the stability is good.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of optical modules, and particularly relates to an optical module and a finned heat pipe heat dissipation structure. BACKGROUND

[0002] An optical module is a tool for realizing mutual conversion of optical and electrical signals and is one of key devices in optical communication equipment. With the continuous increase of transmission rate and integration of the optical module, the power density of the optical module is continuously increased, and more heat is generated. If the heat generated on the optical module cannot be dissipated in time, local high temperature of the optical module is caused, and the optical and electrical performance of the optical module is affected.

[0003] At present, heat dissipation of the optical module is mainly completed by means of heat conduction of metal upper and lower covers. Generally, aluminum or aluminum alloy is adopted. Although the specific heat capacity of aluminum is high, the thermal conductivity coefficient of aluminum is only half of that of copper. Therefore, it is more ideal to adopt copper or copper alloy to quickly conduct the heat of the optical and electrical components. If copper or copper alloy is adopted as the upper and lower covers, although the heat conduction is very good, the material cost is too high, and the overall weight of the product is greatly increased. Obviously, it is not practical to use.

[0004] Therefore, in order to balance the cost and heat dissipation, some heat dissipation structures are tried to be added on the basis of the existing shell. For example, in the optical module provided in Chinese patent CN221507196U, a heat dissipation component is arranged on the top of the upper cover plate of the upper shell, the heat dissipation component includes a heat dissipation cover plate and heat dissipation fins, the bottom of the heat dissipation fins is connected to the top surface of the upper shell, and the top of the heat dissipation fins is connected to the heat dissipation cover plate. However, the heat dissipation efficiency still needs to be improved. SUMMARY

[0005] The application provides an optical module and a finned heat pipe heat dissipation structure to solve the technical problem of poor heat dissipation performance in the optical module.

[0006] To solve the above technical problem, the finned heat pipe heat dissipation structure provided by the application includes a body plate, heat dissipation fins arranged on one side surface of the body plate, and a heat pipe arranged on the other side surface of the body plate.

[0007] Optionally, the finned heat pipe heat dissipation structure is integrally formed by 3D printing.

[0008] Compared with the prior art, since the finned heat pipe heat dissipation structure is integrally formed by 3D printing, the heat dissipation fins and the heat pipe are not directly connected by welding, and therefore heat conduction is more smooth and efficient.

[0009] Optionally, the heat pipe is a hollow flat structure with a rectangular cross section.

[0010] Optionally, the 3D printing adopts a metal powder laying printing process.

[0011] The working process of the metal powder laying printing is to lay a thin layer of metal powder on the platform, and use the cross section of the laser scanning assembly to melt (or fuse) the metal particles together to complete the printing of the layer data.

[0012] Optionally, the heat pipe comprises a hollow pipe wall, a head arranged at one end or both ends of the pipe wall, and an interface arranged on the head, the pipe wall and the head have a multi-layer structure in cross section, and the multi-layer structure comprises, from outside to inside, a skin layer, a honeycomb layer, and a grid layer.

[0013] Due to the 3D printing, the capillary structure of the complex honeycomb + grid in the pipe wall can be designed, when a certain temperature is reached, the liquid in the internal chip area (hot end) vaporizes, absorbs heat, and the steam quickly flows to the condensing end (cold end) under the action of the pressure difference in the pipe, and the steam condenses into liquid at the cold end, releases heat, and the liquid returns to the hot end along the capillary structure by capillary force or gravity, completing the cycle.

[0014] Optionally, the honeycomb layer is formed by splicing single-layer spherical bodies.

[0015] Optionally, the grid layer is a square grid structure.

[0016] Due to the existence of pores of different sizes, the contradiction between steam overflow and liquid return can be well solved, because large pores are beneficial to the escape of steam, and small pores are beneficial to the return of liquid, so that the heat pipe exhibits the best performance.

[0017] Optionally, the head is a square head, and the interface is a vertical oblong shape.

[0018] This interface is not only used for later vacuum extraction and introduction of phase change liquid, but also used for the removal of unformed metal powder after 3D printing, so it extends vertically, which is more beneficial to 3D printing forming, and also utilizes the rapid removal of later powder.

[0019] Optionally, the metal powder of the metal powder laying printing process is selected from copper-based alloy materials.

[0020] Optionally, a green laser is used in the metal powder laying printing process.

[0021] The green laser can meet the requirements of short wavelength, high power, and high beam quality at the same time, has higher absorption rate for copper or copper alloy, and realizes more excellent printing performance.

[0022] Optionally, it also comprises a heat dissipation cover plate, the bottom of the heat dissipation fin is connected to the body plate, and the top is connected to the heat dissipation cover plate, and the heat dissipation fin, the heat dissipation cover plate, and the body plate form a heat dissipation channel.

[0023] Optionally, the thickness of the contact area between the body plate and the heat pipe is less than the thickness of other areas of the body plate.

[0024] Optionally, the finned heat pipe heat dissipation module is processed as follows:

[0025] S1 imports the drawn 3D model into the 3D printer, places the base substrate, performs vacuum extraction and passes in argon as a protective gas;

[0026] S2 performs layering and powder filling on the base substrate by painting, and the laser scans layer by layer according to the 3D model to complete the 3D printing of the finned heat pipe heat dissipation structure, and the unformed metal powder is recycled, and the metal powder in the heat pipe is recycled through the interface;

[0027] S3 injects a phase change liquid into the sealed cavity through the interface, and seals the interface after vacuum extraction of the sealed cavity.

[0028] The application further provides an optical module, which comprises an upper shell, a window formed in a cover plate of the upper shell, a finned heat pipe heat dissipation structure arranged above the upper shell, a lower shell arranged opposite to the upper shell, and an optoelectronic assembly arranged in a cavity between the upper shell and the lower shell; the heat pipe at least partially penetrates the window to contact the cavity, and the body plate completely covers the window.

[0029] Optionally, the upper surface of the heat pipe is completely located in the window area.

[0030] Optionally, the body plate is fixed to the upper shell by a fastener.

[0031] Optionally, the window comprises a limiting portion matched with at least a part of the outer contour of the heat pipe.

[0032] In addition to the limiting portion, the window can be as wide as possible to enable the inner cavity of the optical module shell to directly contact the body plate.

[0033] Optionally, the limiting portion is located at one end or both ends of the heat pipe.

[0034] The technical solution provided by the application is that the shell and the heat dissipation structure are independent of each other, which facilitates material selection and processing, a window is formed in the upper shell, the finned heat pipe heat dissipation structure can directly contact the inner cavity, the heat dissipation efficiency is as high as possible while ensuring the internal sealing, the finned heat pipe heat dissipation structure is integrally formed by 3D printing, the process is simple and does not require a welding process, the structural design has high flexibility, the potential failure risk is extremely low, the heat dissipation capacity has high consistency, and the stability is good. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a structural schematic diagram of a specific embodiment of the finned heat pipe heat dissipation structure described in the application;

[0036] Figure 2 is a structural schematic diagram of a specific embodiment of the heat dissipation fin described in the application;

[0037] Figure 3 is a sectional view of a specific embodiment of the finned heat pipe heat dissipation structure of the present application;

[0038] Figure 4 is a partial enlarged view of a specific embodiment of the honeycomb layer of the present application;

[0039] Figure 5 is a partial enlarged view of a specific embodiment of the grid layer of the present application;

[0040] Figure 6 is a structural schematic view of a specific embodiment of the end cap of the present application;

[0041] Figure 7 is a sectional view of a specific embodiment of the optical module of the present application;

[0042] Figure 8 is a structural schematic view of a specific embodiment of the finned heat pipe heat dissipation structure cooperating with the upper shell of the present application. DETAILED DESCRIPTION

[0043] For the convenience of understanding, the finned heat pipe heat dissipation structure and the optical module are described below in conjunction with the embodiments, which should be understood that these embodiments are only used for illustrating the present application and not for limiting the scope of the present application.

[0044] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation and positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0045] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0046] Example 1 Finned heat pipe heat dissipation structure

[0047] As Figure 1As shown, the finned heat pipe heat dissipation structure includes a body plate 11, heat dissipation fins 10 disposed on one side of the body plate 11, heat pipes 20 disposed on the other side of the body plate 11, and a heat dissipation cover plate 12. The bottom of the heat dissipation fins 10 is connected to the body plate 11, and the top is connected to the heat dissipation cover plate 12. The heat dissipation fins 10, the heat dissipation cover plate 12, and the body plate 11 form a heat dissipation channel.

[0048] like Figure 2 As shown, the body plate 11 is provided with a groove 14 that cooperates with the heat pipe 20, that is, the thickness of the contact area between the body plate 11 and the heat pipe 20 is less than the thickness of other areas of the body plate 11.

[0049] like Figure 1 and 3 As shown, the heat pipe 20 is a hollow, flat structure with a rectangular cross-section. It includes a hollow pipe wall 21, a cap 22 disposed at one end of the pipe wall 21, and an interface 23 disposed on the cap 22. The pipe wall 21 and the cap 22 have a multi-layered cross-section. The multi-layered structure includes, from the outside to the inside, a skin layer 24, a honeycomb layer 25, and a mesh layer 26.

[0050] like Figure 4 As shown, the honeycomb layer 25 is formed by splicing together single-layer spherical bodies, with a layer thickness of 0.05-1.0 mm.

[0051] like Figure 5 As shown, the grid layer 26 has a square structure and a thickness of 0.05-1.0 mm.

[0052] like Figure 6 As shown, the end cap 22 is a square end cap, and the grid layer 26 and honeycomb layer 25 of the end cap 22 have pores 221 at the corresponding positions of the interface 23, and the pores 221 extend vertically.

[0053] The manufacturing process of the above-mentioned finned heat pipe heat dissipation module is as follows:

[0054] S1 imports the drawn 3D model into the 3D printer, places the base plate substrate, and then performs a vacuuming process with a vacuum degree of 1 Pa. Argon gas is then introduced as a protective gas, and the vacuum degree reaches 0.9 MPa after the argon gas is introduced.

[0055] S2 uses a brush to fill powder in layers on the substrate, and a laser scans layer by layer according to the 3D model. The laser wavelength is 532nm green laser, the laser processing scanning speed is 1000mm / s, and the laser spot diameter is 0.04mm, thus completing the 3D printing of the finned heat pipe heat dissipation structure.

[0056] S3 injects phase change liquid into the sealed cavity through the interface, and then seals the interface after evacuating the sealed cavity.

[0057] In this embodiment, the metal powder used is a copper-based alloy material, and the specific preparation method is as follows:

[0058] Crude copper is used as the anode and refined copper as the cathode, both placed in an acidic solution. The acidic solution is prepared by mixing 1.5 mol / L sulfuric acid solution and 1.6 mol / L copper sulfate solution in a volume ratio of 1:2. The current density during electrolysis is 1000 A / m². A rotating brush is installed on one side of the cathode plate, driven by a servo motor, brushing once every 30 seconds, rotating twice each time. The cathode plate is rotated by a servo motor, rotating half a revolution every 30 seconds. The rotation of the cathode plate precedes the rotation of the rotating brush by 10 seconds. The rotational angular velocity of the cathode plate and the rotating brush is 0.5 r / m. The distance between the cathode plate and the anode plate is 20 cm. The electrolyte temperature is maintained at 60℃. The copper powder brushed off is filtered through a 100-mesh standard sieve and then placed in a dryer for drying. Argon gas is introduced as a protective gas during drying. The drying temperature is 150℃, and the drying time is 5 hours. The product is then removed from the furnace at 35℃. The dried electrolytic copper powder was mixed with atomized chromium powder. The mixed powder was then added to an electromagnetic stirring device for stirring. The stirring speed was 800 r / min, the stirring volume was 10 L, the stirring temperature was 40 ℃, and the stirring time was 45 min. Argon gas was added as a protective gas during stirring, and the stirring device was evacuated to a vacuum degree of 6 Pa. The desired copper-based alloy material was obtained after mixing.

[0059] Heat transfer performance test

[0060] The chip was assembled into one end of the heat pipe 20 in the finned heat pipe heat dissipation structure. The specific test parameters are as follows: horizontal open test, test time: 180 seconds, power: 17W (10x10mm2). Compressed air cooling was provided near the end of the chip. The test results are shown in Table 1, where TH1 is the temperature at the chip, T1 is the temperature at the heat dissipation cover 12 opposite the chip, and T2 is the temperature at the other end of the heat pipe opposite the heat dissipation cover 12. That is, T1 and T2 are the temperatures at both ends of the heat dissipation cover 12.

[0061] Table 1

[0062] TH1 / °C T1 / ℃ T2 / ℃ Ta (ambient temperature) / °C Temperature difference Δ1 TH1-T1 / °C Temperature difference Δ2 T1-T2 / °C Example 1 59.3 49.4 47.9 27.7 9.9 1.5 Comparative Example 66.1 54.7 49.6 27.7 11.4 5.1

[0063] The comparison is a solid plate made of the same copper-based alloy material.

[0064] TH1 heat source test:

[0065] • The results showed that, under air-cooled conditions, the temperature of the heat source in the comparative example was approximately 66.1°C, while the temperature of the heat source in Example 1 dropped to 59.3°C, indicating a significant cooling effect.

[0066] Overall longitudinal temperature difference test: △1=TH1-T1

[0067] • The results showed that under air-cooled conditions, the longitudinal temperature difference in the comparative example was 11.4°C, while the longitudinal temperature difference in Example 1 dropped to 9.9°C, indicating that longitudinal heat conduction was faster.

[0068] Overall transverse temperature difference test: △2 = T1 - T2

[0069] • The results showed that under air-cooled conditions, the lateral temperature difference in the comparative example was 5.1°C, while the temperature difference in Example 1 dropped to 1.5°C, indicating that lateral heat conduction was also faster.

[0070] Example 2: Optical Module

[0071] like Figure 7 and 8 As shown, the optical module includes an upper housing 30, a window 40 opened on the cover plate of the upper housing 30, a finned heat pipe heat dissipation structure of Embodiment 1 disposed above the upper housing 30, a lower housing 50 disposed opposite to the upper housing 30, and an optoelectronic component (not shown in the figure) located in the cavity between the upper housing 30 and the lower housing 50.

[0072] In this embodiment, the heat pipe 20 enters the cavity through the window 40, allowing it to directly contact the air inside the cavity and improve heat dissipation efficiency. To ensure the relative sealing of the cavity and prevent dust from entering, the body plate 11 completely covers the window 40. The body plate 11 is fixed to the upper housing 30 by fasteners 60.

[0073] See also Figure 8 The window 40 includes a limiting part 41 that matches the outer contour of the heat pipe 20. In this embodiment, the limiting part is located at both ends of the heat pipe 20. The window in the middle area of ​​the heat pipe is larger, which allows the body plate 11 to directly contact the cavity air even after removing the area of ​​the heat pipe 20, thus helping to dissipate heat.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein, and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module characterized by comprising: The application relates to a heat dissipation structure of a finned heat pipe, which comprises an upper shell, a window arranged on a cover plate of the upper shell, a finned heat pipe heat dissipation structure arranged above the upper shell, a lower shell arranged opposite to the upper shell and a photoelectric assembly arranged in a cavity between the upper shell and the lower shell. The finned heat pipe heat dissipation structure comprises a body plate, heat dissipation fins arranged on one side of the body plate and a heat pipe arranged on the other side of the body plate. The heat pipe at least partially penetrates the window and contacts the cavity, and the body plate completely covers the window.

2. The optical module according to claim 1, wherein The upper surface of the heat pipe is completely located in the window area.

3. The optical module of claim 1, wherein, The window comprises a limiting part matched with at least a part of the outer contour of the heat pipe.

4. The optical module of claim 1, wherein, The limiting part is located at one end or both ends of the heat pipe.

5. A finned heat pipe heat dissipating structure, characterized by comprising: The application further relates to a heat dissipation structure of a finned heat pipe, which comprises a body plate integrally formed by 3D printing, heat dissipation fins arranged on one side of the body plate and a heat pipe arranged on the other side of the body plate.

6. The fin heat pipe heat dissipating structure according to claim 5, wherein The 3D printing adopts a metal powder laying printing process.

7. The fin heat pipe heat dissipating structure according to claim 6, wherein The metal powder of the metal powder laying printing process is selected from copper-based alloy materials.

8. The fin heat pipe heat dissipating structure according to claim 6, wherein The heat pipe comprises a hollow pipe wall, a head arranged at one end or both ends of the pipe wall and an interface arranged on the head, the head is a square head, and the interface is a vertical long circle.

9. The fin heat pipe heat dissipating structure according to claim 6, wherein The heat pipe comprises a hollow pipe wall, a head arranged at one end or both ends of the pipe wall and an interface arranged on the head, the pipe wall and the head are in a multi-layer structure, and the multi-layer structure comprises, from outside to inside, a skin layer, a honeycomb layer and a grid layer.

10. The fin heat pipe heat dissipating structure according to claim 9, wherein The honeycomb layer is formed by splicing single-layer spherical bodies.

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