A laser modification method and system for epoxy insulation layer of dry-type transformer

Abstract

The application provides a laser modification method and system for an epoxy resin insulation layer of a dry-type transformer, which comprises the following steps: determining the thickness of an epoxy resin insulation layer to be degraded in a workpiece, determining the configuration parameter value of a laser to be used and the specification of a field lens to be used according to the thickness and the thermosetting property of the epoxy resin; and focusing the focal point of laser generated based on the laser and the field lens to be used on the surface of the workpiece according to the set scanning path parameter value to perform scribing, and placing the workpiece after scribing in a pre-configured epoxy resin degradation solution to recover the metal in the winding structure and the degraded epoxy resin respectively. The method and system can customize the laser scribing according to different epoxy resin formulations or application scenarios by adjusting the processing mode of the laser and the laser parameters, generate a porous structure in the heat affected zone of the scribing surface, increase the contact area with the chemical solvent, and make the degradation reaction more sufficient.

Description

Technical Field

[0001] This invention relates to the field of laser application technology, and more specifically, to a method and system for laser modification of epoxy resin insulation layer of dry transformer. Background Technology

[0002] Dry-type transformers are transformers that operate under high-voltage insulating media. Compared to oil-immersed transformers, they do not require oil as an insulating medium, resulting in higher safety and environmental friendliness. Dry-type transformers are widely used in power transmission and distribution, especially in urban power distribution systems and power supply in special environments. Due to their oil-free design, pollution-free operation, fire and explosion protection, and low noise, dry-type transformers are gradually becoming the mainstream product in power systems.

[0003] Dry-type transformers are inevitably affected by the external environment during long-term operation, especially by material aging and performance degradation. This affects the service life of the equipment and may even lead to safety hazards. Some components in dry-type transformers are difficult to handle, such as the epoxy resin insulation material on the main body surface. This material adheres strongly to the windings and internal metal wiring of the transformer body and is difficult to degrade. This makes it difficult to recycle and reuse abandoned dry-type transformers, resulting in resource waste and environmental pollution. Therefore, the decommissioning and disposal of dry-type transformers has become a major challenge in current power equipment management. How to effectively degrade and dispose of abandoned or aging dry-type transformers has become an environmental problem that needs to be solved.

[0004] To address the issue of recovering epoxy resin from dry-type transformer windings, the common practice is mechanical crushing. This method can quickly and physically destroy the epoxy resin, allowing for the recovery of the internal metal wires. However, this method is hazardous, and the crushed epoxy resin is generally discarded without further treatment, causing environmental impact. Another method is direct incineration, which produces large amounts of harmful substances, causing secondary pollution. A third method is chemical dissolution, but this method is costly and inefficient. In summary, current methods for treating epoxy resin from dry-type transformer windings suffer from significant pollution, high cost of degradation solutions, and low efficiency. Summary of the Invention

[0005] To address the technical problems of significant pollution, high cost of degradation solutions, and low efficiency in the existing epoxy resin treatment of dry transformer windings, this invention provides a method and system for laser modification of epoxy resin insulation layers in dry transformers.

[0006] According to one aspect of the present invention, a method for laser modification of the epoxy resin insulation layer of a dry-type transformer is provided, comprising:

[0007] The thickness of the epoxy resin insulation layer to be degraded in the workpiece is determined, wherein the workpiece includes the winding structure inside a decommissioned dry-type transformer and the epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has thermosetting properties.

[0008] Based on a custom first configuration parameter table, the configuration parameter values ​​of the laser to be used are determined according to the thickness and the thermosetting properties. The first configuration parameter table is a data table that reflects the mapping relationship between the thickness and thermosetting properties of the epoxy resin insulation layer and the range of configuration parameter values ​​of the laser. The configuration parameters include laser power, output wavelength, pulse width, repetition frequency and scanning speed.

[0009] Based on the custom second configuration parameter table, the specifications of the field lens to be used are determined according to the thickness. The second configuration parameter table is a data table that reflects the mapping relationship between the thickness of the epoxy resin insulation layer and the specifications of the field lens.

[0010] According to the set scanning path parameter values, the laser generated by the laser to be used and the field lens is focused on the surface of the workpiece for scribing. The scanning path parameters include the scanning mode and the spacing between adjacent scanning lines.

[0011] After the workpiece has been scribing, it is placed into a pre-prepared epoxy resin degradation solution to recover the metal and the degraded epoxy resin from the winding structure.

[0012] According to another aspect of the present invention, a laser modification system for the epoxy resin insulation layer of a dry-type transformer is provided, the system comprising:

[0013] A thickness determination module is used to determine the thickness of the epoxy resin insulation layer to be degraded in a workpiece, wherein the workpiece includes a winding structure inside a decommissioned dry-type transformer and an epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has thermosetting properties.

[0014] The first parameter module is used to determine the configuration parameter values ​​of the laser to be used based on the thickness and thermosetting properties according to a custom first configuration parameter table. The first configuration parameter table is a data table that reflects the mapping relationship between the thickness and thermosetting properties of the epoxy resin insulation layer and the range of configuration parameter values ​​of the laser. The configuration parameters include laser power, output wavelength, pulse width, repetition frequency and scanning speed.

[0015] The second parameter module is used to determine the specifications of the field lens to be used based on the thickness according to the custom second configuration parameter table. The second configuration parameter table is a data table that reflects the mapping relationship between the thickness of the epoxy resin insulation layer and the specifications of the field lens.

[0016] The laser scribing module is used to scribing the surface of the workpiece by focusing the laser generated by the laser to be used and the field lens on the surface of the workpiece according to the set scanning path parameter values, wherein the scanning path parameters include the scanning mode and the spacing between adjacent scanning lines;

[0017] The product recycling module is used to place the workpiece after it has been scratched into a pre-prepared epoxy resin degradation solution to recover the metal and the degraded epoxy resin in the winding structure.

[0018] According to another aspect of the present invention, a computer-readable storage medium is provided, the storage medium storing a computer program that, when executed by a processor, implements the methods described in any of the above aspects of the present invention.

[0019] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising: a processor; a memory for storing executable instructions of the processor; the processor being configured to read the executable instructions from the memory and execute the instructions to implement the method described in any of the preceding aspects of the present invention.

[0020] The present invention discloses a method and system for laser modification of epoxy resin insulation layer in dry-type transformers. The method includes determining the thickness of the epoxy resin insulation layer to be degraded in the workpiece; determining the configuration parameter values ​​of the laser to be used based on a custom first configuration parameter table, according to the thickness and the thermosetting properties of the epoxy resin; determining the specifications of the field lens to be used based on the thickness, according to a custom second configuration parameter table; focusing the laser generated by the laser to be used and the field lens onto the surface of the workpiece for scribing according to the set scanning path parameter values; placing the scribed workpiece into a pre-prepared epoxy resin degradation solution to recover the metal and degraded epoxy resin in the winding structure, respectively. The method and system described herein achieve material surface structure reconstruction by adjusting the laser and laser parameters (such as wavelength, power, and scanning path), as well as the processing method of the field lens. It has high process flexibility and adaptability, and can be customized to implement laser scribing schemes according to different epoxy resin formulations or application scenarios. Laser scribing will generate a porous structure and microcrack phenomenon in the heat-affected zone of the scribing surface. The contour of laser scribing and these phenomena can increase the contact area with chemical solvents, thereby further increasing the contact surface and making the degradation reaction more complete. Attached Figure Description

[0021] Exemplary embodiments of the present invention can be more fully understood by referring to the following figures:

[0022] Figure 1 This is a flowchart of a laser modification method for the epoxy resin insulation layer of a dry-type transformer according to a preferred embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of a laser scanning trajectory according to a preferred embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of a laser modification system for the epoxy resin insulation layer of a dry-type transformer according to a preferred embodiment of the present invention.

[0025] Figure 4 This is a schematic diagram of the structure of an electronic device according to a preferred embodiment of the present invention. Detailed Implementation

[0026] Exemplary embodiments of the invention will now be described with reference to the accompanying drawings. However, the invention may be embodied in many different forms and is not limited to the embodiments described herein. These embodiments are provided to fully and completely disclose the invention and to fully convey its scope to those skilled in the art. The terminology used in the exemplary embodiments illustrated in the drawings is not intended to limit the invention. In the drawings, the same units / elements are referred to by the same reference numerals.

[0027] Unless otherwise stated, the terms used herein (including technical terms) have their common meaning as understood by one of ordinary skill in the art. Furthermore, it is understood that terms defined in commonly used dictionaries should be understood to have a meaning consistent with the context of their relevant field, and not to be interpreted as having an idealized or overly formal meaning.

[0028] Exemplary methods

[0029] Figure 1 This is a flowchart of a laser modification method for the epoxy resin insulation layer of a dry-type transformer according to a preferred embodiment of the present invention. Figure 1 As shown, the laser modification method for the epoxy resin insulation layer of the dry transformer described in this preferred embodiment begins from step 101.

[0030] In step 101, the thickness of the epoxy resin insulation layer to be degraded in the workpiece is determined, wherein the workpiece includes the winding structure inside a decommissioned dry-type transformer and the epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has thermosetting properties.

[0031] Preferably, the process further includes determining the thickness of the epoxy resin insulation layer to be degraded in the workpiece before proceeding with:

[0032] The casing of the decommissioned dry-type transformer was disassembled to obtain the workpiece;

[0033] The epoxy resin insulation layer on the surface of the workpiece is cleaned to remove surface contaminants.

[0034] In this preferred embodiment, the cleaning process mainly includes removing contaminants such as dust, oil stains, and other impurities to ensure the laser-treated area is clean and to improve the efficiency of laser energy action on the substrate. For decommissioned cylindrical dry-type transformers, after dismantling and cleaning, the thickness of the epoxy resin insulation layer to be degraded is measured to be 10 mm.

[0035] Preferably, before disassembling the casing of the decommissioned dry-type transformer and obtaining the workpiece, the method further includes establishing a first configuration parameter table according to a first configuration rule and establishing a second configuration parameter table according to a second configuration rule, wherein:

[0036] The first configuration rule includes:

[0037] The ablation efficiency of epoxy resin insulation layer is determined based on its thermosetting properties.

[0038] The output wavelength of the laser is determined based on the relationship between ablation efficiency and laser output wavelength.

[0039] The greater the thickness of the epoxy resin insulating layer, the greater the power of the laser.

[0040] The laser pulse width range is 200-500ns, the repetition frequency is 200-800kHz, and the scanning speed is 100-300mm / s;

[0041] The second configuration rule is that the greater the thickness of the epoxy resin insulation layer, the smaller the focal length of the field lens.

[0042] In step 102, based on the custom first configuration parameter table, the configuration parameter values ​​of the laser to be used are determined according to the thickness and the thermosetting property. The first configuration parameter table is a data table that reflects the mapping relationship between the thickness and thermosetting property of the epoxy resin insulation layer and the range of configuration parameter values ​​of the laser. The configuration parameters include laser power, output wavelength, pulse width, repetition frequency and scanning speed.

[0043] In step 103, based on the custom second configuration parameter table, the specifications of the field lens to be used are determined according to the thickness, wherein the second configuration parameter table is a data table reflecting the mapping relationship between the thickness of the epoxy resin insulation layer and the specifications of the field lens.

[0044] In this preferred embodiment, the average thickness of the epoxy resin is 10.0 mm. Checking its ablation efficiency, it was confirmed that 1064 nm has a high ablation efficiency. Based on the mapping relationship in the custom first configuration parameter table, a YAG nanosecond pulsed laser with an output wavelength of 1064 nm is selected. Further, the pulsed laser power is 500 W, the pulse width is set to 500 ns, the repetition frequency is 330 kHz, and the field lens specification is F254.

[0045] In step 104, according to the set scanning path parameter values, the laser generated by the laser to be used and the field lens is focused on the surface of the workpiece for scribing. The scanning path parameters include the scanning mode and the spacing between adjacent scanning lines.

[0046] In this preferred embodiment, the scanning mode is set to spiral, the spacing between two adjacent scanning lines is 10mm, and the scanning speed is 200mm / s.

[0047] Preferably, the laser focal point of the laser to be used is focused on the surface of the workpiece for scribing, including:

[0048] During the first scribing, the scribing depth on the workpiece surface was recorded;

[0049] The number of scratches at the same location is calculated based on the scratch depth and the thickness.

[0050] The workpiece is repeatedly scratched along a set scratching direction according to the number of scratches until the metal substrate is reached.

[0051] Adjust the laser position sequentially, and repeatedly scratch each remaining unscratched area according to the stated number of scratches until the metal substrate is reached.

[0052] Preferably, the number of scratches at the same location is calculated based on the scratch depth and the thickness, and the calculation formula is as follows:

[0053]

[0054] In the formula, T, H, and D represent the number of scratches, the thickness of the epoxy resin insulation layer to be degraded, and the number of scratches, respectively. Round up a real number.

[0055] In this preferred embodiment, after the first laser scan, the scratch depth is measured to be 0.8 mm. Therefore, according to the scratch count calculation formula, 13 repeated scans are required to penetrate the entire insulating layer and reach the metal substrate, thereby preventing energy waste.

[0056] Preferably, the scanning mode is spiral, and a laser is used to scribble a mesh pattern on the surface of the workpiece.

[0057] Preferably, while focusing the laser of the laser to be used on the surface of the workpiece for scribing, argon gas is introduced to blow away the products generated during the scribing process.

[0058] In this preferred embodiment, in order to improve heat conduction efficiency and reduce carbonization outside the laser heat-affected zone, argon gas with a flow rate of 2.5 MPa is used for auxiliary purging.

[0059] Figure 2 This is a schematic diagram of a laser scanning trajectory according to a preferred embodiment of the present invention. Figure 2 As shown, when the scanning mode is set to spiral, the laser marks on the workpiece surface are spiral-shaped. After scanning, the workpiece surface exhibits a uniform and regular mesh structure, with obvious local cracks and micropores. This structure facilitates the penetration of the solution and the reaction in the subsequent chemical degradation steps.

[0060] In step 105, the workpiece after scribing is placed into a pre-prepared epoxy resin degradation solution to recover the metal and the degraded epoxy resin from the winding structure.

[0061] In this preferred embodiment, the treated workpiece is placed in a laboratory-prepared epoxy resin degradation solution for degradation. During the process, it was observed that the resin in the treated area was significantly peeled off, and the copper wires within the windings could be completely precipitated and recovered. Compared to the previously untreated dry-type transformer, the degradation efficiency can be increased by 200%.

[0062] The laser modification method for the epoxy resin insulation layer of dry transformers described in this preferred embodiment achieves material surface structure reconstruction by adjusting the laser and laser parameters (such as wavelength, power, and scanning path), as well as the field lens processing method. It has high process flexibility and adaptability, and the laser scribing scheme can be customized according to different epoxy resin formulations or application scenarios. Laser scribing will generate a porous structure and microcrack phenomenon in the heat-affected zone of the scribing surface. The contour of laser scribing and these phenomena can increase the contact area with chemical solvents, thereby further increasing the contact surface and making the degradation reaction more complete.

[0063] Exemplary System

[0064] Figure 3 This is a schematic diagram of a laser modification system for the epoxy resin insulation layer of a dry-type transformer according to a preferred embodiment of the present invention. Figure 3 As shown, the laser modification system 300 for the epoxy resin insulation layer of a dry-type transformer according to this preferred embodiment includes:

[0065] Thickness determination module 301 is used to determine the thickness of the epoxy resin insulation layer to be degraded in the workpiece, wherein the workpiece includes the winding structure inside the decommissioned dry-type transformer and the epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has thermosetting properties.

[0066] The first parameter module 302 is used to determine the configuration parameter values ​​of the laser to be used based on the thickness and the thermosetting property according to a custom first configuration parameter table. The first configuration parameter table is a data table that reflects the mapping relationship between the thickness and thermosetting property of the epoxy resin insulation layer and the range of configuration parameter values ​​of the laser. The configuration parameters include laser power, output wavelength, pulse width, repetition frequency and scanning speed.

[0067] The second parameter module 303 is used to determine the specifications of the field lens to be used based on the thickness according to the custom second configuration parameter table, wherein the second configuration parameter table is a data table reflecting the mapping relationship between the thickness of the epoxy resin insulation layer and the specifications of the field lens.

[0068] The laser scribing module 304 is used to scribing the surface of the workpiece by focusing the laser generated by the laser to be used and the field lens on the workpiece according to the set scanning path parameter values, wherein the scanning path parameters include the scanning mode and the spacing between adjacent scanning lines.

[0069] Product recycling module 305 is used to place the workpiece after it has been scratched into a pre-prepared epoxy resin degradation solution to recover the metal and the degraded epoxy resin in the winding structure.

[0070] Preferably, the system further includes a cleaning module for:

[0071] The casing of the decommissioned dry-type transformer was disassembled to obtain the workpiece;

[0072] The epoxy resin insulation layer on the surface of the workpiece is cleaned to remove surface contaminants.

[0073] Preferably, the system further includes a parameter table establishment module, used to establish the first configuration parameter table according to a first configuration rule, and to establish the second configuration parameter table according to a second configuration rule, wherein:

[0074] The first configuration rule includes:

[0075] The ablation efficiency of epoxy resin insulation layer is determined based on its thermosetting properties.

[0076] The output wavelength of the laser is determined based on the relationship between ablation efficiency and laser output wavelength.

[0077] The greater the thickness of the epoxy resin insulating layer, the greater the power of the laser.

[0078] The laser pulse width range is 200-500ns, the repetition frequency is 200-800kHz, and the scanning speed is 100-300mm / s;

[0079] The second configuration rule is that the greater the thickness of the epoxy resin insulation layer, the smaller the focal length of the field lens.

[0080] Preferably, the laser scribing module 304 focuses the laser focal point of the laser to be used onto the workpiece surface for scribing, including:

[0081] During the first scribing, the scribing depth on the workpiece surface was recorded;

[0082] The number of scratches at the same location is calculated based on the scratch depth and the thickness.

[0083] The workpiece is repeatedly scratched along a set scratching direction according to the number of scratches until the metal substrate is reached.

[0084] Adjust the laser position sequentially, and repeatedly scratch each remaining unscratched area according to the stated number of scratches until the metal substrate is reached.

[0085] Preferably, the laser scribing module 304 calculates the number of scribing operations at the same location based on the scribing depth and the thickness, using the following formula:

[0086]

[0087] In the formula, T, H, and D represent the number of scratches, the thickness of the epoxy resin insulation layer to be degraded, and the number of scratches, respectively. Round up a real number.

[0088] Preferably, the laser scribing module uses a spiral scanning mode to scribble a mesh pattern on the surface of the workpiece using a laser.

[0089] Preferably, the laser scribing module 304 focuses the laser of the laser to be used on the surface of the workpiece for scribing, while introducing argon gas as an auxiliary gas to blow away the products generated during the scribing process.

[0090] The laser modification system for epoxy resin insulation layer of dry transformers described in this preferred embodiment and the laser modification method for epoxy resin insulation layer of dry transformers determine the thickness of the epoxy resin insulation layer to be degraded in the workpiece, determine the configuration parameters of the laser to be used and the field lens specifications based on the thickness and the thermosetting properties of the epoxy resin, focus the laser generated by the laser to be used and the field lens on the surface of the workpiece for scribing, and finally place the scribed workpiece into a pre-prepared epoxy resin degradation solution to recover the metal in the winding structure and the degraded epoxy resin, respectively. The steps are the same, and the technical effects achieved are also the same, so they will not be described again here.

[0091] Exemplary electronic devices

[0092] Figure 4This is a schematic diagram of the structure of an electronic device according to a preferred embodiment of the present invention. Figure 4 As shown, the electronic device includes one or more processors 401 and memory 402.

[0093] The processor 401 may be a central processing unit (CPU) or other form of processing unit with data processing and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0094] The memory 402 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium, and the processor 401 may execute the program instructions to implement the laser modification method for the epoxy resin insulation layer of dry transformers of the various embodiments disclosed above, and / or other desired functions. In one example, the electronic device may also include an input device 403 and an output device 404, these components being interconnected via a bus system and / or other forms of connection mechanisms (not shown).

[0095] In addition, the input device 403 may also include, for example, a keyboard, a mouse, etc.

[0096] The output device 404 can output various information to the outside. The output device 404 may include, for example, a display, a speaker, a printer, and a communication network and its connected remote output devices, etc.

[0097] Of course, for the sake of simplicity, Figure 4 Only some of the components of the electronic device relevant to this disclosure are shown, omitting components such as buses, input / output interfaces, etc. In addition, the electronic device may include any other suitable components depending on the specific application.

[0098] Exemplary computer program products and computer-readable storage media

[0099] In addition to the methods and apparatus described above, embodiments of this disclosure may also be computer program products comprising computer program instructions that, when executed by a processor, cause the processor to perform the steps in the laser modification method for the epoxy resin insulation layer of a dry transformer according to various embodiments of this disclosure as described in the "Exemplary Methods" section above.

[0100] The computer program product can be written in any combination of one or more programming languages ​​to perform the operations of the embodiments of this disclosure. The programming languages ​​include object-oriented programming languages ​​such as Java and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on a user's computing device, partially on a user's computing device, as a standalone software package, partially on a user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0101] Furthermore, embodiments of this disclosure may also be computer-readable storage media storing computer program instructions that, when executed by a processor, cause the processor to perform the steps in the laser modification method for the epoxy resin insulation layer of a dry transformer according to various embodiments of this disclosure as described in the "Exemplary Methods" section above.

[0102] The computer-readable storage medium may be any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may, for example, include, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatuses, or devices, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: electrical connections having one or more wires, portable disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0103] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0104] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For system embodiments, since they largely correspond to method embodiments, the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0105] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0106] The apparatus and methods of this disclosure may be implemented in many ways. For example, they may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above-described order of steps for the methods is for illustrative purposes only, and the steps of the methods of this disclosure are not limited to the order specifically described above unless otherwise specifically stated. Furthermore, in some embodiments, this disclosure may also be implemented as a program recorded on a recording medium, the program including machine-readable instructions for implementing the methods according to this disclosure. Thus, this disclosure also covers recording media storing programs for performing the methods according to this disclosure.

[0107] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps are decomposable and / or recombinable. Such decomposition and / or recombination should be considered equivalent to the present disclosure. The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0108] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A method for laser modification of the epoxy resin insulation layer of a dry-type transformer, characterized in that, The method includes: A first configuration parameter table is established according to the first configuration rule, and a second configuration parameter table is established according to the second configuration rule, wherein: The first configuration rule includes: The ablation efficiency of the epoxy resin insulation layer to be degraded was determined based on its thermosetting properties. The output wavelength of the laser to be used is determined based on the relationship between ablation efficiency and the output wavelength of the laser to be used. The greater the thickness of the epoxy resin insulation layer to be degraded, the higher the power of the laser to be used. The proposed laser pulse width range is 200-500ns, the repetition frequency is 200-800kHz, and the scanning speed is 100-300mm / s; The first configuration parameter table is a data table that reflects the mapping relationship between the thickness and thermosetting properties of the epoxy resin insulation layer to be degraded and the value range of the laser configuration parameters. The configuration parameters include laser power, output wavelength, pulse width, repetition frequency and scanning speed. The second configuration rule is that the greater the thickness of the degradable epoxy resin insulation layer, the smaller the focal length of the field lens; The second configuration parameter table is a data table reflecting the mapping relationship between the thickness of the epoxy resin insulation layer to be degraded and the field lens specifications; The outer casing of a decommissioned dry-type transformer is disassembled to obtain a workpiece, wherein the workpiece includes the winding structure inside the decommissioned dry-type transformer and a pseudo-degradable epoxy resin insulation layer covering the winding structure; The epoxy resin insulation layer on the surface of the workpiece is cleaned to remove surface contaminants; Determine the thickness of the epoxy resin insulation layer to be degraded in the workpiece; Based on the first configuration parameter table, the configuration parameter values ​​of the laser to be used are determined according to the thickness and the thermosetting property. Based on the second configuration parameter table, the specifications of the field lens to be used are determined according to the thickness; Based on the set scanning path parameter values, the laser generated by the laser to be used and the field lens is focused onto the surface of the workpiece for scribing, including: The scan path parameters include the scan mode and the spacing between adjacent scan lines; During the first scribing, the scribing depth on the workpiece surface was recorded; The number of scratches at the same location is calculated based on the scratch depth and the thickness. The workpiece is repeatedly scratched along a set scratching direction according to the number of scratches until the metal substrate is reached. Adjust the laser position sequentially, and repeatedly scratch each remaining unscratched area according to the stated number of scratches until the metal substrate is reached; After the workpiece has been scribing, it is placed into a pre-prepared epoxy resin degradation solution to recover the metal and the degraded epoxy resin from the winding structure.

2. The method according to claim 1, characterized in that, The number of scratches at the same location is calculated based on the scratch depth and the thickness, using the following formula: In the formula, T, H, and D represent the number of scratches, the thickness of the epoxy resin insulation layer to be degraded, and the scratch depth, respectively. Round up a real number.

3. The method according to claim 1, characterized in that, The scanning mode is spiral, and a laser is used to scribble a mesh pattern on the surface of the workpiece.

4. The method according to claim 1, characterized in that, While focusing the laser of the laser to be used on the surface of the workpiece for scribing, argon gas is introduced to blow away the products generated during the scribing process.

5. A laser modification system for the epoxy resin insulation layer of a dry-type transformer using any one of claims 1 to 4, characterized in that, The system includes: A thickness determination module is used to determine the thickness of the epoxy resin insulation layer to be degraded in a workpiece, wherein the workpiece includes a winding structure inside a decommissioned dry-type transformer and an epoxy resin insulation layer to be degraded covering the winding structure, and the epoxy resin of the epoxy resin insulation layer to be degraded has thermosetting properties. The first parameter module is used to determine the configuration parameter values ​​of the laser to be used based on the thickness and thermosetting properties according to a custom first configuration parameter table. The first configuration parameter table is a data table that reflects the mapping relationship between the thickness and thermosetting properties of the epoxy resin insulation layer to be degraded and the range of configuration parameter values ​​of the laser. The configuration parameters include laser power, output wavelength, pulse width, repetition frequency and scanning speed. The second parameter module is used to determine the specifications of the field lens to be used based on the thickness according to the custom second configuration parameter table, wherein the second configuration parameter table is a data table reflecting the mapping relationship between the thickness of the epoxy resin insulation layer to be degraded and the specifications of the field lens; A laser scribing module is used to scribing the surface of the workpiece by focusing the laser generated by the laser to be used and the field lens on the workpiece according to the set scanning path parameter values, wherein the scanning path parameters include the scanning mode and the spacing between adjacent scanning lines; The product recycling module is used to place the workpiece after it has been scratched into a pre-prepared epoxy resin degradation solution to recover the metal and the degraded epoxy resin in the winding structure.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the steps of the method as described in any one of claims 1-4.

7. An electronic device, characterized in that, include: processor; Memory used to store the processor's executable instructions; The processor is configured to read the executable instructions from the memory and execute the instructions to implement the method described in any one of claims 1-4.

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