Laser processing device and light emitting angle control method of laser processing device

Abstract

The invention discloses a laser processing device and a light emitting angle control method of the laser processing device, the laser processing device comprises a shell, a light emitting channel, a laser light source located in the shell, a collimating mirror, a driving device, a reflecting mirror and a focusing mirror, the driving device is fixed on the inner wall of the shell, the driving device is used for driving the reflecting mirror to rotate, and the focusing mirror is fixed on the shell. Laser emitted by the laser light source is collimated by the collimating mirror and then enters the reflector, the reflector reflects the laser to the focusing mirror, the focusing mirror focuses the laser reflected by the reflector and then emits the laser from the light outlet channel, and the control device is used for controlling the driving device to drive the reflector to rotate so as to change the direction of the laser emitted by the focusing mirror. The laser processing efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser processor and a light emitting angle control method of the laser processor. BACKGROUND

[0002] The laser cutting technology is widely used in the field of metal processing. In the traditional curved surface handheld cutting process, the laser light emitting angle needs to be adjusted in real time by manual operation. The adaptability of manual adjustment is poor, which leads to low laser processing efficiency. SUMMARY

[0003] The laser processor and the light emitting angle control method of the laser processor provided by the embodiments of the present application can improve the laser processing efficiency.

[0004] In a first aspect, the laser processor provided by the present application comprises a shell, a light emitting channel, a laser light source located in the shell, a collimating mirror, a driving device, a reflecting mirror and a focusing mirror. The driving device is fixed to the inner wall of the shell, and the driving device is used to drive the reflecting mirror to rotate. The laser emitted by the laser light source enters the reflecting mirror after being collimated by the collimating mirror. The reflecting mirror reflects the laser to the focusing mirror. The focusing mirror focuses the laser reflected by the reflecting mirror and emits the laser from the light emitting channel. The control device is used to control the driving device to drive the reflecting mirror to rotate, so as to change the direction of the laser emitted by the focusing mirror.

[0005] Optionally, the shell comprises a first shell and a second shell. The second shell is in the shape of a handle. The first shell is in communication with the second shell and the light emitting channel respectively. The focusing mirror and the reflecting mirror are located in the first shell. The laser light source and the collimating mirror are located in the second shell.

[0006] Optionally, the laser processor comprises a protective mirror. The protective mirror is located in the first shell. The protective mirror is located on the side of the focusing mirror away from the reflecting mirror. The laser emitted by the focusing mirror passes through the protective mirror and enters the light emitting channel.

[0007] Optionally, the light emitting channel is hollow. The area of the cross-sectional opening of the light emitting channel gradually increases in the direction away from the first shell.

[0008] Optionally, the light emitting channel is in the shape of a circular truncated cone.

[0009] In a second aspect, the light emitting angle control method of the laser processor provided by the present application comprises the following steps. Obtaining a preset processing angle; Obtaining a current processing angle between the laser emitted by the focusing mirror and the object to be processed; If the current machining angle is not the preset machining angle, the driving device is controlled to drive the laser head to rotate relative to the mounting base until the current machining angle is adjusted to the preset machining angle.

[0010] Optionally, if the current machining angle is not the preset machining angle, the driving device is controlled to drive the mirror to rotate to change the direction of the laser emitted by the focusing mirror until the current machining angle is adjusted to the preset machining angle, including: If the current machining angle is not the preset machining angle, the maximum adjustable angle of the laser emitted by the focusing mirror in the laser processor is obtained, wherein when the angle between the laser emitted by the focusing mirror in the laser processor and the central axis of the light outlet channel exceeds the maximum adjustable angle, the laser emitted by the focusing mirror in the laser processor is blocked by the light outlet channel; when the angle between the laser emitted by the focusing mirror in the laser processor and the central axis of the light outlet channel is less than the maximum adjustable angle, the laser emitted by the focusing mirror in the laser processor passes through the light outlet channel. The difference between the preset machining angle and the current machining angle is compared with the maximum adjustable angle. If the difference between the preset machining angle and the current machining angle is less than the maximum adjustable angle, the driving device is controlled to drive the mirror to rotate to change the direction of the laser emitted by the focusing mirror until the current machining angle is adjusted to the preset machining angle.

[0011] Optionally, the light outlet angle control method of the laser processor further includes: If the difference between the preset machining angle and the current machining angle is greater than the maximum adjustable angle, a prompt information is sent, and the prompt information is used to prompt a user to move the laser processor.

[0012] Optionally, the laser processor includes an angle detection device, and the current machining angle between the laser emitted by the focusing mirror and the object to be machined is obtained by the angle detection device. The current machining angle between the laser emitted by the focusing mirror and the object to be machined is obtained by the angle detection device.

[0013] Optionally, the angle detection device is a depth camera, the photographing direction of the depth camera is parallel to the light outlet direction of the focusing mirror, and the current machining angle between the laser emitted by the focusing mirror and the object to be machined is obtained by the angle detection device, including: The laser head is controlled to emit visible light to the object to be machined to generate a visible light spot on the object to be machined. The object to be machined is photographed by the depth camera to obtain a target image and depth values of each pixel point on the target image. Determine the current machining angle between the laser emitted by the focusing mirror and the object to be machined based on the target image and the depth value of each pixel point on the target image.

[0014] In the present application, compared with the related art, the laser processor comprises a shell, a light emitting channel, a laser light source located in the shell, a collimating mirror, a driving device, a reflecting mirror and a focusing mirror. The driving device is fixed to the inner wall of the shell and is used to drive the reflecting mirror to rotate. The laser emitted by the laser light source enters the reflecting mirror after collimation by the collimating mirror. The reflecting mirror reflects the laser to the focusing mirror. The focusing mirror focuses the laser reflected by the reflecting mirror and emits the laser from the light emitting channel. The control device is used to control the driving device to drive the reflecting mirror to rotate so as to change the direction of the laser emitted by the focusing mirror. The present application can improve the laser machining efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0016] Figure 1 is a structural schematic diagram of one embodiment of the laser processor provided by the present application from one perspective; Figure 2 is a light path schematic diagram of one embodiment of the laser processor provided by the present application; Figure 3 is a flow schematic diagram of one embodiment of the light emitting angle control method of the laser processor provided by the present application. DETAILED DESCRIPTION

[0017] It should be noted that the principles of the present application are exemplified in an appropriate operating environment. The following description is based on the exemplified specific embodiments of the present application, which should not be regarded as limiting other specific embodiments of the present application not described in detail.

[0018] In the following description of the present application, "some embodiments" are described, which describe a subset of all possible embodiments, but it can be understood that "some embodiments" can be the same subset or different subset of all possible embodiments, and can be combined with each other without conflict.

[0019] In the following description of the present application, the terms "first", "second", "third", etc. are merely used to distinguish similar objects, and do not represent a specific order or sequence of the objects. It is understood that the "first", "second", "third", etc. can be interchangeable under appropriate circumstances and / or conditions, and the application described herein can be practiced in other sequences than the one described or illustrated herein.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0021] Although the description of the application will be introduced in combination with some embodiments, it does not mean that the features of the application are limited to the embodiments. On the contrary, the purpose of introducing the application in combination with the embodiments is to cover other options or modifications that can be extended based on the claims of the application. In order to provide a deep understanding of the application, many specific details will be included in the following description. The application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the focus of the application, some specific details will be omitted in the description. It should be noted that the embodiments and features in the embodiments in the application can be combined with each other without conflict.

[0022] In the embodiments of the present application, the description of "one embodiment" or "some embodiments" means that the specific features, structures or characteristics described in combination with the embodiment are included in one or more embodiments of the present application. Therefore, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in other some embodiments" and the like appearing in different places in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized.

[0023] In the embodiments of the present application, the terms "include", "contain", "have" and their variants mean "include but not limited to", unless otherwise specifically emphasized.

[0024] In the embodiments of the present application, unless otherwise specifically defined and limited, the terms "mount", "connect" should be understood in a broad sense, for example, "connect" can be detachably connected, or can be non-detachably connected; can be directly connected, or indirectly connected through an intermediate medium.

[0025] In the embodiments of the present application, "and / or" is only used to describe the relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that there are three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are an "or" relationship.

[0026] In the embodiments of the present application, the orientation terms mentioned, such as "up", "down", "left", "right", "in", "out" and the like, are only the directions of reference to the drawings, therefore, the orientation terms used are for better and clearer illustration and understanding of the embodiments of the present application, and are not meant to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0027] Please refer to Figure 1 and Figure 2 In the embodiments of the present application, the laser processor 10 includes a shell 11, a light emitting channel 113, a laser light source 121 located in the shell 11, a collimating mirror 122, a driving device 14, a reflecting mirror 123, and a focusing mirror 124. The driving device 14 is fixed to the inner wall of the shell 11, and is used to drive the reflecting mirror 123 to rotate. The laser emitted by the laser light source 121 enters the reflecting mirror 123 after collimation by the collimating mirror 122. The reflecting mirror 123 reflects the laser to the focusing mirror 124. The focusing mirror 124 focuses the laser reflected by the reflecting mirror 123 and emits it from the light emitting channel 113. The control device is used to control the driving device 14 to drive the reflecting mirror 123 to rotate, so as to change the direction of the laser emitted by the focusing mirror 124. The control device is used to receive a control instruction and control the driving device 131 to drive the reflecting mirror 123 to rotate. When the driving device 14 drives the reflecting mirror 123 to rotate, the optical path changes, which can change the direction of the laser emitted by the focusing mirror 124, thereby changing the angle between the laser emitted by the focusing mirror 124 and the object to be processed.

[0028] Specifically, the laser light source 121 can emit infrared light, ultraviolet light and other lasers, which can be set according to specific circumstances. Further, the laser light source 121 simultaneously emits visible light with the same laser light path, for example, the laser light source 121 simultaneously emits red light, thereby forming a visible light spot on the material to be cut. Specifically, when the laser emitted by the laser light source 121 for laser processing and the visible light for positioning are irradiated on the object to be processed, a light spot with the same position and size is generated.

[0029] In one specific embodiment, the driving device 14 is a direct drive rotary motor. The driving device 14 is fixed to the inner wall of the shell 11, and the output end of the driving device 14 is connected to one side edge of the reflecting mirror 123. The output end of the driving device 14 drives the reflecting mirror 123 to rotate, and the rotating surface of the driving device 14 driving the reflecting mirror 123 to rotate is perpendicular to the reflecting surface of the reflecting mirror 123.

[0030] In another specific embodiment, the focusing mirror 124, the reflecting mirror 123 and the driving device 14 are sequentially arranged. The two side edges of the reflecting mirror 123 are provided with rotating shafts, and the two side edges of the reflecting mirror 123 are rotatably connected to the inner wall of the shell 11 through the rotating shafts. The driving device 14 is fixed to the inner wall of the shell 11. The driving device 14 is fixed to the inner wall of the shell 11. The driving device 14 is provided with a driven gear on the rotating shaft of the reflecting mirror 123, and the output end of the driving device 14 is provided with a driving gear. The driven gear and the driving gear are engaged. The output end of the driving device 14 drives the driving gear, the driven gear and the reflecting mirror 123 to rotate. The driving device 14 is located at the back of the reflecting mirror 123, which can avoid the driving device 14 and the reflecting mirror 123 being arranged side by side in the direction perpendicular to the light path, thereby reducing the width of the laser processor 10 in the direction of light path propagation.

[0031] In the embodiment of the present application, the shell 11 includes a first shell 111 and a second shell 112. The second shell 112 is handle-shaped, and the first shell 111 is connected to the second shell 112 and the light outlet channel 113, respectively. The focusing mirror 124 and the reflecting mirror 123 are located in the first shell 111, and the laser light source 121 and the collimating mirror 122 are located in the second shell 112.

[0032] In the embodiment of the present application, the laser processor 10 includes a protective mirror 125. The protective mirror 125 is located in the first shell 111, and the protective mirror 125 is located on the side of the focusing mirror 124 away from the reflecting mirror 123. The laser light emitted by the focusing mirror 124 passes through the protective mirror 125 and enters the light outlet channel 113.

[0033] In the embodiment of the present application, the light outlet channel 113 is hollow, and the cross-sectional opening area of the light outlet channel 113 gradually increases in the direction away from the first shell 111.

[0034] In the embodiment of the present application, the light outlet channel 113 is circular truncated cone-shaped. The light outlet channel 113 is circular truncated cone-shaped, which can avoid foreign matter entering the light path, and can facilitate adjustment of the direction of the laser light and avoid blocking the laser light.

[0035] As Figure 3As shown, the application also provides a light emitting angle control method of a laser processor, which is applied to the laser processor 10 in any one of the above, and a control device in the laser processor 10 is used to execute the light emitting angle control method of the laser processor 10. The light emitting angle control method of the laser processor 10 comprises the following steps: 201, obtaining a preset machining angle.

[0036] When the laser processor 10 is started, the optical axis included angle between the laser emitted by the focusing mirror and the central axis of the light emitting channel 113 is initialized so as to be zero. When the optical axis included angle is zero, the laser emitted by the focusing mirror 124 is emitted along the central axis of the light emitting channel 113, thereby facilitating adjustment.

[0037] The preset machining angle is a machining angle between the laser emitted by the focusing mirror and the object to be machined, which can be set manually. For example, the preset machining angle is 90 degrees, which can be set according to specific conditions.

[0038] 202, obtaining a current machining angle between the laser emitted by the focusing mirror and the object to be machined.

[0039] In the embodiment of the application, the laser processor 10 comprises an angle detection device, which obtains the current machining angle between the laser emitted by the focusing mirror and the object to be machined, comprising: obtaining the current machining angle between the laser emitted by the focusing mirror and the object to be machined through the angle detection device.

[0040] In a specific embodiment, the angle detection device is a depth camera, which is arranged on the first shell 111. Of course, the depth camera can also be arranged at other positions, which can be set according to specific conditions. The photographing direction of the depth camera is parallel to the light emitting direction of the focusing mirror. The current machining angle between the laser emitted by the focusing mirror and the object to be machined is obtained through the angle detection device, comprising: (1) controlling the laser light source to emit visible light to the object to be machined, so as to generate a visible light spot on the object to be machined.

[0041] (2) photographing the object to be machined through the depth camera, so as to obtain a target image and depth values of each pixel point on the target image.

[0042] (3) determining the current machining angle between the laser emitted by the focusing mirror and the object to be machined based on the target image and the depth values of each pixel point on the target image.

[0043] In a specific embodiment, the current machining angle between the laser emitted by the focusing mirror and the object to be machined is determined based on the target image and the depth values of each pixel point on the target image, comprising: (1) performing light spot identification on the target image, so as to obtain a light spot region.

[0044] Specifically, the target image is subjected to light spot recognition by using a pre-trained YOLOV5 model to obtain a light spot region.

[0045] (2) The current machining angle between the laser emitted by the focusing mirror and the object to be machined is determined according to the light spot region and the depth values of each pixel point in the light spot region.

[0046] In a specific embodiment, the light spot edge of the light spot region is determined, the least square method is used to perform ellipse fitting on the light spot edge to obtain an ellipse boundary, and the machining angle between the laser emitted by the laser processor 10 and the surface of the object to be machined is determined according to the ellipse boundary. Specifically, the major axis length L1 and the minor axis length L2 of the ellipse boundary are obtained, and the machining angle θ is determined according to the major axis length and the minor axis length, where cos θ = L2 / L1.

[0047] Further, the depth value, the abscissa and the ordinate of each pixel point in the light spot region are obtained, the plane fitting is performed based on the abscissa, the ordinate and the depth value of each pixel point in the light spot region to obtain a fitted light spot plane, the perpendicular distance between each pixel point in the light spot region and the fitted light spot plane is determined, the pixel points in the light spot region with a perpendicular distance less than a preset distance are determined as light spot pixel points, and a plurality of light spot pixel points are obtained. The region enclosed by the plurality of light spot pixel points is determined as a target region, and the edge obtained by performing edge detection on the target region is determined as the light spot edge of the light spot region.

[0048] 203、If the current machining angle is not the preset machining angle, the driving device is controlled to drive the reflecting mirror to rotate to change the direction of the laser emitted by the focusing mirror until the current machining angle is adjusted to the preset machining angle.

[0049] In the embodiment of the application, if the current machining angle is not the preset machining angle, the driving device 14 is controlled to drive the reflecting mirror 123 to rotate to change the direction of the laser emitted by the focusing mirror 124 until the current machining angle is adjusted to the preset machining angle.

[0050] In a specific embodiment, if the current machining angle is not the preset machining angle, the driving device 14 is controlled to drive the reflecting mirror 123 to rotate to change the direction of the laser emitted by the focusing mirror 124 until the current machining angle is adjusted to the preset machining angle, including: (1) If the current machining angle is not the preset machining angle, the maximum adjustable angle of the laser emitted by the focusing mirror 124 in the laser processor 10 is obtained. When the angle between the laser emitted by the focusing mirror 124 in the laser processor 10 and the central axis of the light outlet channel 113 exceeds the maximum adjustable angle, the laser emitted by the focusing mirror 124 in the laser processor 10 is blocked by the light outlet channel 113. When the angle between the laser emitted by the focusing mirror 124 in the laser processor 10 and the central axis of the light outlet channel 113 is less than the maximum adjustable angle, the laser emitted by the focusing mirror 124 in the laser processor 10 passes through the light outlet channel 113.

[0051] (2) The difference between the preset machining angle and the current machining angle is compared with the maximum adjustable angle.

[0052] (3) If the difference between the preset machining angle and the current machining angle is less than the maximum adjustable angle, the driving device 14 is controlled to drive the reflecting mirror 123 to rotate, so as to change the direction of the laser emitted by the focusing mirror 124, until the current machining angle is adjusted to the preset machining angle.

[0053] If the difference between the preset machining angle and the current machining angle is less than the maximum adjustable angle, it indicates that the current machining angle can be adjusted to the preset machining angle by adjusting the reflecting mirror 123. The driving device 14 is controlled to drive the reflecting mirror 123 to rotate, so as to change the direction of the laser emitted by the focusing mirror 124, until the current machining angle is adjusted to the preset machining angle.

[0054] Further, if the difference between the preset machining angle and the current machining angle is greater than the maximum adjustable angle, it indicates that the current machining angle cannot be adjusted to the preset machining angle by adjusting the reflecting mirror 123. A prompt information is sent, and the prompt information is used to prompt the user to move the laser processor 10. For example, the user can swing the laser processor 10 to reacquire the current machining angle between the laser emitted by the focusing mirror and the object to be machined.

[0055] Specifically, the prompt information includes the difference between the preset machining angle and the current machining angle.

[0056] Further, the power adjustment button 129 and the pressure sensor are arranged on the second shell 112. The power adjustment button 129 passes through an opening on the second shell 112 and is connected with the pressure sensor. The control device is connected with the pressure sensor and the laser light source 121 respectively. The pressure sensor is used to detect the pressure applied by the power adjustment button 129 and returns a pressure detection value to the control device.

[0057] The power adjustment button 129 is connected with the pressure sensor through the opening. When the user holds the handle 12 and presses the power adjustment button 129, the pressure sensor detects the pressure applied by the power adjustment button 129 and returns the pressure detection value to the control device. For example, the pressure detection value is 5 Newtons.

[0058] The control device is configured to adjust the laser emission power of the laser light source 121 according to the pressure detection value.

[0059] Further, the light emission angle control method of the laser processor 10 comprises: (1) obtaining a pressure detection value and a preset pressure-power mapping curve.

[0060] In a specific embodiment, the preset pressure-power mapping curve can be pre-set. For example, the preset pressure-power mapping curve is a straight line, and the relationship between the pressure detection value F and the power mapping value P in the preset pressure-power mapping curve is P=kF, where k is the slope of the preset pressure-power mapping curve, for example, k=80.

[0061] (2) determining the power mapping value corresponding to the pressure detection value based on the pressure detection value and the preset pressure-power mapping curve.

[0062] For example, the relationship between the pressure detection value F and the power mapping value P in the preset pressure-power mapping curve is P=80F. If F=5 Newtons, the power mapping value is 400W.

[0063] (3) adjusting the laser emission power of the laser light source 121 to the power mapping value.

[0064] Specifically, the control device sends a control instruction to the laser light source 121 to control the laser light source 121 to adjust the laser emission power to the power mapping value, i.e., to 400W.

[0065] Further, it is judged whether the power mapping value is greater than the upper limit power; if the power mapping value is not greater than the upper limit power, the laser emission power of the laser light source 121 is adjusted to the power mapping value; if the power mapping value is greater than the upper limit power, the laser emission power of the laser light source 121 is adjusted to the upper limit power.

[0066] In the embodiment of the present application, the light emission angle control method of the laser processor 10 comprises: (1) obtaining material parameters of the object to be processed, and relative position relationship information between the laser processor 10 and the object to be processed.

[0067] The material parameters include material type and material thickness, and the relative position relationship information includes the interval distance between the light emission channel 113 of the laser processor 10 and the object to be processed, and the processing angle between the laser emitted by the laser processor 10 and the surface of the object to be processed.

[0068] (2) Determine the upper limit power based on material parameters and relative position relationship information.

[0069] Specifically, determining the upper limit power based on material parameters and relative position relationship information includes: inputting the material parameters and the relative position relationship information into a pre-trained target neural network model to obtain the upper limit power.

[0070] The target neural network model can be a CNN, RNN, or other model, which can be set according to specific circumstances. The target neural network model is trained according to early test data. The early test data can be obtained by testing, for example, 2mm stainless steel material cutting, 1000W power, 90 degree vertical cutting; 2mm aluminum alloy material cutting, 1200W power, 90 degree vertical cutting; by replacing different materials, the upper limit power is re-determined.

[0071] Compared with related technologies, the laser processor includes a shell, a light exit channel, a laser light source located in the shell, a collimating mirror, a driving device, a reflecting mirror, and a focusing mirror. The driving device is fixed to the inner wall of the shell, and is used to drive the reflecting mirror to rotate. The laser emitted by the laser light source enters the reflecting mirror after collimation by the collimating mirror. The reflecting mirror reflects the laser to the focusing mirror. The focusing mirror focuses the laser reflected by the reflecting mirror and emits it from the light exit channel. The control device is used to control the driving device to drive the reflecting mirror to rotate, so as to change the direction of the laser emitted by the focusing mirror. The present application can improve the laser processing efficiency.

[0072] The above describes in detail the light exit angle control method of the laser processor and the laser processor provided by the present application. The principles and implementation modes of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed; in conclusion, the content of the specification should not be understood as a limitation of the present application.

[0073] It should be noted that when the above embodiments of the present application are applied to specific products or technologies, related data of users are involved, which needs to obtain user permission or consent, and the collection, use and processing of related data need to comply with relevant laws, regulations and standards of relevant countries and regions.

Claims

1. A laser processing device, characterized in that, The laser processor includes a housing, a light emission channel, a laser source located inside the housing, a collimating mirror, a driving device, a reflecting mirror, and a focusing mirror. The driving device is fixed to the inner wall of the housing and is used to drive the reflecting mirror to rotate. The laser emitted by the laser source is collimated by the collimating mirror and then enters the reflecting mirror. The reflecting mirror reflects the laser to the focusing mirror, and the focusing mirror focuses the laser reflected by the reflecting mirror and then emits it from the light emission channel. The control device is used to control the driving device to drive the reflecting mirror to rotate, thereby changing the direction of the laser emitted from the focusing mirror.

2. The laser processor according to claim 1, characterized in that, The outer casing includes a first casing and a second casing. The second casing is handle-shaped. The first casing is connected to the second casing and the light emission channel. The focusing lens and the reflecting mirror are located inside the first casing. The laser source and the collimating lens are located inside the second casing.

3. The laser processor according to claim 2, characterized in that, The laser processor includes a protective mirror located inside the first housing. The protective mirror is located on the side of the focusing mirror away from the reflecting mirror. The laser emitted from the focusing mirror passes through the protective mirror and enters the light output channel.

4. The laser processor according to claim 2, characterized in that, The light-emitting channel is hollow, and the area of ​​the cross-sectional opening of the light-emitting channel gradually increases in the direction away from the first housing.

5. The laser processor according to claim 4, characterized in that, The light-emitting channel is frustum-shaped.

6. A method for controlling the beam output angle of a laser processor, characterized in that, The laser processing apparatus described in any one of claims 1-5, wherein the control device in the laser processing apparatus is used to execute the laser processing apparatus's beam emission angle control method, the laser processing apparatus's beam emission angle control method comprising: Obtain the preset machining angle; Obtain the current processing angle between the laser emitted from the focusing lens and the object to be processed; If the current processing angle is not the preset processing angle, the driving device is controlled to drive the reflector to rotate, thereby changing the direction of the laser emitted from the focusing lens, until the current processing angle is adjusted to the preset processing angle.

7. The method for controlling the beam output angle of a laser processor according to claim 6, characterized in that, If the current processing angle is not a preset processing angle, then controlling the driving device to drive the reflector to rotate, thereby changing the direction of the laser emitted from the focusing lens, until the current processing angle is adjusted to the preset processing angle, includes: If the current processing angle is not a preset processing angle, the maximum adjustable angle of the laser emitted from the focusing lens in the laser processor is obtained. Specifically, when the angle between the laser emitted from the focusing lens and the central axis of the output channel exceeds the maximum adjustable angle, the laser emitted from the focusing lens is blocked by the output channel; when the angle between the laser emitted from the focusing lens and the central axis of the output channel is less than the maximum adjustable angle, the laser emitted from the focusing lens passes through the output channel. Compare the difference between the preset processing angle and the current processing angle with the maximum adjustable angle; If the difference between the preset processing angle and the current processing angle is less than the maximum adjustable angle, the driving device is controlled to drive the reflector to rotate, thereby changing the direction of the laser emitted from the focusing lens, until the current processing angle is adjusted to the preset processing angle.

8. The method for controlling the beam emission angle of a laser processor according to claim 7, characterized in that, The laser processing machine's beam emission angle control method further includes: If the difference between the preset processing angle and the current processing angle is greater than the maximum adjustable angle, a prompt message is issued to prompt the user to move the laser processor.

9. The method for controlling the beam output angle of a laser processor according to claim 6, characterized in that, The laser processor includes an angle detection device, wherein acquiring the current processing angle between the laser emitted from the focusing lens and the object to be processed includes: The current processing angle between the laser emitted from the focusing lens and the object to be processed is obtained by the angle detection device.

10. The method for controlling the beam output angle of a laser processor according to claim 9, characterized in that, The angle detection device is a depth camera, and the imaging direction of the depth camera is parallel to the light output direction of the focusing lens. The step of obtaining the current processing angle between the laser emitted from the focusing lens and the object to be processed through the angle detection device includes: The laser head is controlled to emit visible light toward the object to be processed, thereby generating a visible light spot on the object to be processed. The object to be processed is photographed using the depth camera to obtain a target image and the depth value of each pixel in the target image; The current processing angle between the laser emitted from the focusing lens and the object to be processed is determined based on the target image and the depth value of each pixel in the target image.

Images