Full-automatic cutting equipment applied to MIP products

Abstract

The invention discloses full-automatic cutting equipment applied to MIP products, and relates to the technical field of precise electronic production, the full-automatic cutting equipment comprises a rack, a material box collecting and discharging device is arranged on one side of the rack, and a product conveying station is arranged on the rack and located on one side of the material box collecting and discharging device; a product conveying station is arranged on the rack, a slide glass position normalizing mechanism is arranged on the rack and located on one side of the product conveying station, a cutting platform material taking and placing mechanism is arranged on the rack and located on one side of the slide glass position normalizing mechanism in a sliding mode, and a transferring mechanical arm is arranged at the position, close to the cutting platform material taking and placing mechanism, the slide glass position normalizing mechanism and the product conveying station, of the rack. A cutting device is arranged on the rack and located at the moving tail end of the cutting platform material taking and placing mechanism, and the number of the transplanting heads is two times or more than two times that of the tidying grooves. By means of the slide glass position normalizing mechanism, the buffering function of products to be cut is achieved, the product reloading period is remarkably shortened, and the overall production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of precision electronics manufacturing technology, specifically a fully automated cutting device for MIP products. Background Technology

[0002] In the field of Mini / Micro LED display manufacturing, MIP (Micro LED in Package) is a key packaging technology. After packaging, the chips typically need to be separated using precision cutting equipment to form independent units. The efficiency and precision of this cutting process directly affect the overall production line capacity and product yield.

[0003] Currently, common cutting methods in the market employ a single device for each process, with these devices operating independently. This hinders automated production. For example, patent CN120308656A discloses a glass substrate cassette loading and unloading device, and patent CN119347982A discloses a glass substrate positioning mechanism. Furthermore, existing cutting methods typically employ a sequential operation mode: a robotic arm loads the product to be cut from the loading station to the cutting platform, the cutting platform moves to the cutting station for cutting, the platform returns, the robotic arm removes the cut product and places it back at the unloading station, and only then can the loading and cutting cycle begin for the next product. This sequential "loading-cutting-unloading" mode has inherent efficiency bottlenecks. Because the robotic arm must wait during the cutting process, the equipment experiences significant idle time, limiting the improvement of the overall production cycle time.

[0004] To improve efficiency, some equipment attempts to optimize processes by adding multiple robotic arms or adopting more complex motion control systems. However, this often leads to complex equipment structures, significantly increased costs, and greater control difficulties. In addition, the traditional single-piece transfer method requires the robotic arm to move back and forth between the loading station and the cutting platform multiple times when changing products, resulting in long material changeover cycles and failing to fully realize the potential of high-speed cutting devices. Summary of the Invention

[0005] The purpose of this invention is to provide a fully automatic cutting device for MIP products, which solves the problems of long waiting time and low work efficiency of traditional robotic arms during the cutting process.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A fully automatic cutting device for MIP products is characterized by: a frame, a material tray receiving and discharging device on one side of the frame, a product conveying station on the frame and located on the side of the material tray receiving and discharging device, a substrate positioning mechanism on the frame and located on the side of the product conveying station, a cutting platform picking and discharging mechanism slidably arranged on the frame and located on the side of the substrate positioning mechanism, a transfer robot on the frame and located near the cutting platform picking and discharging mechanism, the substrate positioning mechanism, and the product conveying station, a cutting device on the frame and located at the moving end of the cutting platform picking and discharging mechanism, a plurality of positioning grooves on the substrate positioning mechanism, and a plurality of transfer heads on the transfer robot, the number of transfer heads being twice or more than twice the number of positioning grooves.

[0007] In a preferred embodiment, the transplanting head is a suction cup mechanism.

[0008] In a preferred embodiment, the cutting device is a dicing machine, and the material handling mechanism of the cutting platform includes an R-axis drive module, an adsorption plate module, and a waterproof groove module.

[0009] In a preferred embodiment, the R-axis drive module includes an R-axis mounting base mounted on the X-axis drive module. An R-axis motor is fixedly mounted on the upper side of the R-axis mounting base. An adsorption plate module mounting seat is mounted on the upper output end of the R-axis motor. A grinding plate is mounted on the upper side of the R-axis mounting base and on one side of the adsorption plate module mounting seat. A waterproof and dustproof cover is fixedly mounted on the upper side of the R-axis mounting base and outside the R-axis motor.

[0010] In a preferred embodiment, the adsorption cup module includes a suction cup positioning plate fixedly installed on the adsorption cup module mounting base. A wafer steel ring is fixedly disposed on the outer side of the suction cup positioning plate, and the suction cup positioning plate is provided with a wafer fixing clamp.

[0011] In a preferred embodiment, the waterproof groove module includes a water receiving groove installed on the X-axis drive module and located on the lower outer side of the R-axis drive module. A crossbeam waterproof groove is fixedly provided on the upper side of the water receiving groove, and the crossbeam waterproof groove corresponds to the position of the grinding plate. A waterproof cover is fixedly installed on the upper side of the water receiving groove and on one side of the crossbeam waterproof groove. The waterproof cover is provided with a drain outlet and a ventilation outlet.

[0012] In a preferred embodiment, a non-contact height measuring device is fixedly installed on the inner side of the water receiving trough and below one end of the crossbeam waterproof trough. The non-contact height measuring device includes a base, a rotary cylinder is fixedly installed on the upper side of the base, a light sensor is provided at the output end of the rotary cylinder, a water spray pipe is provided on the base and on one side of the light sensor, and a height measuring waterproof cover is provided on the base and on the other side of the light sensor.

[0013] In a preferred embodiment, an opening is provided on the upper side of the waterproof groove of the crossbeam, and a louver is slidably disposed on the opening.

[0014] In a preferred embodiment, the cassette receiving and discharging device includes a housing, on which a lifting assembly is provided. A cassette conveying and positioning mechanism is installed at the output end of the lifting assembly. The lifting assembly is used to drive the cassette conveying and positioning mechanism to move vertically. A cassette is provided inside the cassette conveying and positioning mechanism. The cassette includes a frame. Multiple glass slides are vertically and evenly arranged inside the cassette. An loading and unloading conveying mechanism is provided on the housing. The loading and unloading conveying mechanism is used to position and convey the cassette into the cassette conveying and positioning mechanism.

[0015] In a preferred embodiment, the housing is further provided with a locking mechanism, which is used to lock and unlock multiple glass slides inside the cassette.

[0016] In a preferred embodiment, the housing is further provided with a material pulling mechanism, which includes a track and a push-pull assembly. The push-pull assembly can move linearly along the track trajectory. The push-pull assembly includes a push-pull block and a suction cup. The suction cup is used to adsorb and fix the glass substrate. The bottom of the loading and unloading conveying mechanism is provided with a pushing mechanism, which is used to push the glass substrate out of the frame. When the push-pull assembly moves linearly, the suction cup can pull the adsorbed and fixed glass substrate out of the frame, and the push-pull block can push the processed glass substrate back into the frame.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention utilizes a carrier positioning mechanism to achieve a buffer function for the products to be cut, allowing the transfer robot to perform loading and unloading operations simultaneously during the cutting process, reducing equipment downtime. The transfer robot is equipped with multiple transfer heads, supporting the rapid completion of "removing already cut products" and "placing new products to be cut," significantly shortening the product changeover cycle and improving overall production efficiency. A non-contact height measurement device monitors the wear of the cutting blade in real time and adjusts and calibrates it via a rotary cylinder to ensure grinding accuracy, thereby maintaining cutting quality. The waterproof trough module (including a water receiving trough, a crossbeam waterproof trough, and an exhaust vent) effectively collects cooling water, debris, and water mist generated during cutting and grinding, reducing water accumulation on the equipment surface and facilitating cleaning and maintenance. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 For the present invention Figure 1 A top-view structural diagram; Figure 3 This is a partial structural diagram of the present invention; Figure 4 This is a schematic diagram of the cooperation structure between the material handling mechanism and the cutting device of the cutting platform of the present invention; Figure 5 This is a schematic diagram of the R-axis drive module and the adsorption disk module of the present invention; Figure 6 This is a schematic diagram of the waterproof groove module structure of the present invention; Figure 7 This is a schematic diagram of the non-contact height measuring device of the present invention; Figure 8 This is a schematic diagram of the material receiving and discharging device of the present invention; Figure 9 This is a schematic diagram of the material pulling mechanism of the present invention; Figure 10 This is a schematic diagram of the overall structure of the present invention; Figure Labels and Annotations: 1-Frame; 2-Footage receiving and unloading device; 3-Product conveying station; 4-Carrier position straightening mechanism; 5-Cutting platform picking and unloading mechanism; 6-Transfer robot; 7-Cutting device; 41-Straightening groove; 61-Transfer head; 51-R-axis drive module; 52-Adsorption plate module; 53-Waterproof groove module; 8-Non-contact height measuring device; 21-Housing; 211-Lifting assembly; 22-Footage conveying and positioning mechanism; 23-Footage; 231-Frame; 24-Loading and unloading conveying mechanism; 25-Locking mechanism; 26-Pulling mechanism; 261-Railway; 263-Push-pull assembly Components; 2633-Push-pull block; 2634-Suction cup; 27-Pushing mechanism; 511-R-axis mounting base; 512-R-axis motor; 513-Suction cup module mounting base; 514-Grinding plate; 515-Waterproof and dustproof cover; 521-Suction cup positioning plate; 522-Wafer steel ring; 523-Carrier fixing clamp; 531-Water receiving groove; 532-Crossbeam waterproof groove; 533-Waterproof cover; 534-Drain outlet; 535-Exhaust vent; 536-Opening; 537-Louvre; 81-Base; 82-Rotary cylinder; 83-Light sensor; 84-Water spray pipe; 85-Height measuring waterproof cover. Detailed Implementation

[0020] The following embodiments will describe the present invention in detail with reference to the accompanying drawings. In the drawings or description, similar or identical parts are referred to by the same reference numerals, and in practical applications, the shape, thickness, or height of each component may be enlarged or reduced. The embodiments listed in this invention are merely illustrative and not intended to limit the scope of the invention. Any obvious modifications or changes made to this invention do not depart from the spirit and scope of the invention.

[0021] like Figures 1 to 3 and Figure 10 As shown, a fully automatic cutting device for MIP products includes a frame 1, a material tray receiving and discharging device 2 is provided on one side of the frame 1, a product conveying station 3 is provided on the frame 1 and located on one side of the material tray receiving and discharging device 2, a carrier plate position straightening mechanism 4 is provided on the frame 1 and located on one side of the product conveying station 3, a cutting platform picking and discharging mechanism 5 is slidably provided on the frame 1 and located on one side of the carrier plate position straightening mechanism 4, a transfer robot 6 is provided on the frame 1 and located near the cutting platform picking and discharging mechanism 5, the carrier plate position straightening mechanism 4 and the product conveying station 3, a cutting device 7 is provided on the frame 1 and located at the moving end of the cutting platform picking and discharging mechanism 5, a plurality of straightening grooves 41 are provided on the carrier plate position straightening mechanism 4, and a plurality of transfer heads 61 are provided on the transfer robot 6, the number of transfer heads 61 being twice or more than the number of straightening grooves 41. The material receiving and discharging device 2, product conveying station 3, wafer positioning and straightening mechanism 4, transfer robot 6, and cutting device 7 in this invention are all existing technologies. Some existing mechanisms or devices are not specifically described in this invention. The main content of this invention is the integration of various devices to form a device that can automatically and precisely cut MIP products in MINILED displays.

[0022] The workflow of this invention is as follows: Feeding: The cassette receiving and discharging device 2 is responsible for storing and supplying cassettes 23 containing uncut MIP products, and delivering the products one by one to the product conveying station 3.

[0023] Conveying: Product conveying station 3 conveys the received products to a position that is easy for the transfer robot 6 to grasp.

[0024] Transfer and straightening: The transfer robot 6 uses its transfer head 61 to pick up the product from the product conveying station 3 and place it into the straightening groove 41 of the carrier position straightening mechanism 4.

[0025] Precision cutting: After alignment and positioning, the transfer robot 6 transfers the product from the carrier position alignment mechanism 4 to the cutting platform pick-and-place mechanism 5. The cutting platform pick-and-place mechanism 5 then carries the product to the cutting device 7 for precision cutting.

[0026] Material unloading: After cutting is completed, the cutting platform pick-up and unloading mechanism 5 returns, the transfer robot 6 removes the cut product and sends it back to the product conveying station 3, and finally the material box receiving and unloading device 2 collects it back into the material box 23.

[0027] In this invention, the wafer position alignment mechanism 4 is one of the main components for achieving high-efficiency continuous production, and its function is not limited to simple positioning and correction.

[0028] Function 1: To regulate and correct the position of the product The design of the aligning groove 41 ensures that the glass slides (products) placed within it can be precisely constrained and positioned. During the gripping and placement process by the transfer robot 6, slight positional deviations are inevitable. By entering the aligning groove 41, the product's position is mechanically corrected, ensuring that it is in an accurate and known position when transferred to the cutting platform's loading and unloading mechanism 5, thus eliminating cutting quality problems caused by inaccurate positioning.

[0029] Function 2: Buffering glass slides to be cut The sizing mechanism 4, by setting multiple sizing slots 41, allows the cutting device 7 to cut multiple products at once, increasing production efficiency. This invention enables parallel operation; the transfer robot 6 can pre-place multiple products in these slots for sizing. This means that while the cutting device 7 is cutting a group of products, the transfer robot 6 does not need to wait idle but continues to perform the following tasks: The cut products are transferred from the transfer robot 6 to the product conveying station 3 and then returned to the material collection and dispensing device 2.

[0030] The next piece of product to be cut is picked up from the product conveying station 3 and placed into the empty sizing slot 41.

[0031] This design allows the time-consuming "cutting process" to overlap with the "loading, unloading, and sizing process." Once cutting is complete, the cutting platform's loading / unloading mechanism 5 returns, and the transfer robot 6 can remove the cut product while simultaneously sending the new product already prepared in the sizing mechanism to the cutting station. This eliminates the waiting time during loading and unloading, significantly shortening the average product processing cycle.

[0032] The number of transfer heads 61 in this invention is twice or more than the number of sizing slots 41. A sufficient number of transfer heads 61 allows the transfer robot 6 to simultaneously perform two actions in one stroke: "removing the cut product" and "placing the new product to be cut." The transfer robot 6 can use one set of suction heads to pick up the cut product while using another set of suction heads to carry the sizing new product, completing the product change on the cutting platform in one transfer. The combination of multiple suction heads and multiple sizing slots ensures that products can flow quickly and smoothly between the buffer station and each workstation, fully utilizing the efficiency of the buffer mechanism.

[0033] The transplanting head 61 is a suction cup mechanism.

[0034] like Figures 4 to 7 As shown, the cutting device 7 is a dicing machine, and the material handling mechanism 5 of the cutting platform includes an R-axis drive module 51, an adsorption plate module 52, and a waterproof groove module 53.

[0035] The R-axis drive module 51 includes an R-axis mounting base 511 slidably mounted on the frame 1. An R-axis motor 512 is fixedly mounted on the upper side of the R-axis mounting base 511. An adsorption cup module mounting seat 513 is mounted on the upper output end of the R-axis motor 512. A grinding plate 514 is mounted on the upper side of the R-axis mounting base 511 and on one side of the adsorption cup module mounting seat 513. A waterproof and dustproof cover 515 is fixedly mounted on the upper side of the R-axis mounting base 511 and outside the R-axis motor 512. The adsorption cup module 52 includes a suction cup positioning plate 521 fixedly mounted on the adsorption cup module mounting seat 513. A wafer steel ring 522 is fixedly mounted on the outer side of the suction cup positioning plate 521. The suction cup positioning plate 521 is provided with a wafer fixing clamp 523. The R-axis drive module 51 and the adsorption disk module 52 constitute a carrier platform. Multiple sets of pads are provided inside the R-axis drive module 51 and the adsorption disk module 52 and at the connection between them, which has the advantage of anti-vibration, eliminates micron-level vibration interference, and ensures no offset during the wafer cutting process.

[0036] The waterproof groove module 53 includes a water receiving groove 531 that is slidably mounted on the frame 1 together with the R-axis drive module 51 and located on the lower outer side of the R-axis drive module 51. A crossbeam waterproof groove 532 is fixedly installed on the upper side of the water receiving groove 531, corresponding to the position of the grinding plate 534. A waterproof cover 533 is fixedly installed on the upper side of the water receiving groove 531 and on one side of the crossbeam waterproof groove 532. The waterproof cover 533 is provided with a drain outlet 534 and an exhaust vent 535. This reduces surface water accumulation on various components at the working cutting position, facilitating component maintenance and care. The exhaust vent 535 extracts water mist outside the equipment, reducing water mist and cutting / grinding debris.

[0037] A non-contact height measuring device 8 is fixedly installed inside the water receiving tank 531 and below one end of the crossbeam waterproof groove 532. The non-contact height measuring device 8 includes a base 81, a rotary cylinder 82 is fixedly installed on the upper side of the base 81, a light sensor 83 is provided at the output end of the rotary cylinder 82, a water spray pipe 84 is provided on the base 81 and on one side of the light sensor 83, and a height measuring waterproof cover 85 is provided on the base 81 and on the other side of the light sensor 83. The wear of the cutting blade of the dicing machine needs to be checked regularly. The non-contact height measuring device 8 transmits the measured height value to the controller. To ensure the sharpening accuracy of the sharpening plate 534, the rotary cylinder 82 can adjust the angle of the light sensor 83 for calibration during use, thereby ensuring the detection accuracy.

[0038] An opening 536 is provided on the upper side of the crossbeam waterproof groove 532, and a louver 537 is slidably disposed on the opening 536. During sharpening, the cooling water, due to its high temperature, produces water mist and sharpening debris. If the water mist is not treated, it will adhere to the vision device of the dicing machine, affecting its cutting accuracy, while the sharpening debris will splash onto the product cutting position, adversely affecting the cut product. Therefore, this invention isolates the sharpening position from the product cutting position through the crossbeam waterproof groove 532. When the cutting device 7 needs sharpening, the cutting blade of the cutting device 7 (which generally has a multi-axis movement mechanism) extends into the crossbeam waterproof groove 532 through the opening 536, and then the cutting blade strikes the sharpening plate 5... 14. The back-and-forth motion is used to achieve grinding. At this time, the exhaust vent 535 can draw out the water mist and grinding debris formed in the waterproof groove 532 of the crossbeam. When cutting products without grinding, the opening 536 can be closed by sliding the louvers. The air coming from the exhaust vent 535 comes from the side gap between the water receiving groove 531 and the waterproof and dustproof cover 515. This is conducive to the exhaust vent 535 adsorbing the debris and water generated on the upper side of the waterproof and dustproof cover 515 when cutting products. It is also conducive to the water quickly entering the water receiving groove 531, thereby preventing excessive water and dust accumulation on the waterproof and dustproof cover 515.

[0039] like Figure 8 and Figure 9As shown, the cassette loading and unloading device 2 includes a housing 21, on which a lifting assembly 211 is provided. A cassette conveying and positioning mechanism 22 is installed at the output end of the lifting assembly 211. The lifting assembly 211 drives the cassette conveying and positioning mechanism 22 to move vertically. A cassette 23 is provided inside the cassette conveying and positioning mechanism 22. The cassette 23 includes a frame 231, and multiple glass slides are vertically and evenly arranged inside the cassette 23. A loading and unloading conveying mechanism 24 is provided on the housing 21, which positions and conveys the cassette 23 into the cassette conveying and positioning mechanism 22. A locking mechanism 25 is also provided on the housing 21, which locks the multiple glass slides inside the cassette 23. Locking and unlocking; the housing 21 is also provided with a material pulling mechanism 26, which includes a track 261 and a push-pull assembly 263. The push-pull assembly 263 can move linearly along the track 261. The push-pull assembly 263 includes a push-pull block 2633 and a suction cup 2634. The suction cup 2634 is used to adsorb and fix the glass substrate. The bottom of the loading and unloading conveying mechanism 24 is provided with a pushing mechanism 27. The pushing mechanism 27 is used to push the glass substrate in the frame 231 out of the frame 231. When the push-pull assembly 263 moves linearly, the suction cup 2634 can pull the adsorbed and fixed glass substrate out of the frame 231, and the push-pull block 2633 can push the processed glass substrate back into the frame 231.

[0040] The loading and unloading conveying mechanism 24 of this invention is responsible for receiving the cassette 23 from the manual loading position and accurately positioning and conveying it into the cassette conveying and positioning mechanism 22, which is a platform for carrying and fixing the cassette. The lifting assembly 211 drives the cassette conveying and positioning mechanism 22 at its output end and the cassette 23 inside it to move vertically. When the cassette conveying and positioning mechanism 22 is located below the lifting assembly 211, it is responsible for receiving the cassette 23 from the AGV and then rising to the upper part of the lifting assembly 211. Before picking up or placing the glass sheets, the multiple glass sheets stacked in the upper cassette 23 are unlocked so that a single sheet can be smoothly removed or pushed back. During transportation or idle time: multiple glass sheets are locked to prevent the glass sheets from shaking, misaligning, or slipping in the cassette 23 during transportation or movement, ensuring product safety.

[0041] When a glass slide needs to be removed for processing, the pushing mechanism 27 activates, pushing the top glass slide out of the cassette 23. The suction cup 2634 on the push-pull assembly 263 is activated, adsorbing and fixing the glass slide that has extended out of the frame. Subsequently, the push-pull assembly 263 moves linearly along the track, using the suction cup 2634 to completely pull the adsorbed and fixed glass slide out of the frame 231, and then transfers it to the product conveying station 3.

[0042] The cut glass slide is returned to the product conveying station 3 by the transfer robot 6. The push-pull assembly 263 moves along the track again, using its push-pull block 2633 to push the processed glass slide back into the frame 231.

[0043] During the loading and unloading process, the lifting assembly 211 precisely controls the height of the cassette 23 to ensure smooth pushing and pulling of the glass slides. After all slides have been processed and transferred to the cassette 23, the locking mechanism 25 activates again to lock all the glass slides in the cassette 23, ensuring safe transportation. This invention uses two sets of cassettes 23. Once one cassette 23 has finished loading and unloading, the other cassette 23 can be switched to supply materials, thus achieving uninterrupted material supply and processing.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A fully automatic cutting device for MIP products, characterized in that: The system includes a frame (1), a hopper receiving and discharging device (2) is provided on one side of the frame (1), a product conveying station (3) is provided on the frame (1) and on one side of the hopper receiving and discharging device (2), a sheet positioning mechanism (4) is provided on the frame (1) and on one side of the product conveying station (3), and a cutting platform picking and discharging mechanism (5) is slidably provided on the frame (1) and on one side of the sheet positioning mechanism (4). The mechanism (5), the substrate positioning mechanism (4) and the product conveying station (3) are equipped with a transfer robot (6). A cutting device (7) is provided on the frame (1) and at the moving end of the material handling mechanism (5) of the cutting platform. The substrate positioning mechanism (4) is equipped with multiple positioning grooves (41). The transfer robot (6) is equipped with multiple sets of transfer heads (61). The number of transfer heads (61) is twice or more than the number of positioning grooves (41).

2. The fully automatic cutting equipment for MIP products according to claim 1, characterized in that, The cutting device is a dicing machine (7), and the material handling mechanism (5) of the cutting platform includes an R-axis drive module (51), an adsorption plate module (52), and a waterproof groove module (53).

3. The fully automatic cutting equipment for MIP products according to claim 2, characterized in that, The R-axis drive module (51) includes an R-axis mounting base (511) that is slidably mounted on the frame (1). An R-axis motor (512) is fixedly mounted on the upper side of the R-axis mounting base (511). An adsorption plate module mounting seat (513) is mounted on the upper output end of the R-axis motor (512). A grinding plate (514) is mounted on the upper side of the R-axis mounting base (511) and on one side of the adsorption plate module mounting seat (513). A waterproof and dustproof cover (515) is fixedly mounted on the upper side of the R-axis mounting base (511) and outside the R-axis motor (512).

4. The fully automatic cutting equipment for MIP products according to claim 3, characterized in that, The suction cup module (52) includes a suction cup positioning plate (521) fixedly installed on the suction cup module mounting base (513). A wafer steel ring (522) is fixedly provided on the outer side of the suction cup positioning plate (521), and a wafer fixing clamp (523) is provided on the suction cup positioning plate (521).

5. The fully automatic cutting equipment for MIP products according to claim 4, characterized in that, The waterproof groove module (53) includes a water receiving groove (531) that is slidably mounted on the frame (1) together with the R-axis drive module (51) and located on the lower outer side of the R-axis drive module (51). A crossbeam waterproof groove (532) is fixedly provided on the upper side of the water receiving groove (531). The crossbeam waterproof groove (532) corresponds to the position of the grinding plate (534). A waterproof cover (533) is fixedly installed on the upper side of the water receiving groove (531) and on one side of the crossbeam waterproof groove (532). A drain outlet (534) and an exhaust outlet (535) are provided on the waterproof cover (533).

6. The fully automatic cutting equipment for MIP products according to claim 5, characterized in that, A non-contact height measuring device (8) is fixedly installed on the inner side of the water receiving tank (531) and below one end of the crossbeam waterproof tank (532). The non-contact height measuring device (8) includes a base (81). A rotary cylinder (82) is fixedly installed on the upper side of the base (81). A light sensor (83) is provided at the output end of the rotary cylinder (82). A water spray pipe (84) is provided on the base (81) and on one side of the light sensor (83). A height measuring waterproof cover (85) is provided on the base (81) and on the other side of the light sensor (83).

7. The fully automatic cutting equipment for MIP products according to claim 6, characterized in that, An opening (536) is provided on the upper side of the crossbeam waterproof groove (532), and a louver (537) is slidably provided on the opening (536).

8. The fully automatic cutting equipment for MIP products according to claim 1, characterized in that, The material box receiving and discharging device (2) includes a housing (21), on which a lifting assembly (211) is provided. A material box conveying and positioning mechanism (22) is installed at the output end of the lifting assembly (211). The lifting assembly (211) is used to drive the material box conveying and positioning mechanism (22) to move vertically. A material box (23) is provided inside the material box conveying and positioning mechanism (22). The material box (23) includes a frame (231). Multiple glass slides are vertically and evenly arranged inside the material box (23). A loading and unloading conveying mechanism (24) is provided on the housing (21). The loading and unloading conveying mechanism (24) is used to position and convey the material box (23) into the material box conveying and positioning mechanism (22).

9. A fully automatic cutting device for MIP products according to claim 8, characterized in that, The housing (1) is also provided with a locking mechanism (25), which is used to lock and unlock multiple glass slides in the cassette (23).

10. A fully automatic cutting device for MIP products according to claim 9, characterized in that, The housing (21) is also provided with a material pulling mechanism (26). The material pulling mechanism (26) includes a track (261) and a push-pull assembly (263). The push-pull assembly (263) can move linearly along the track (261). The push-pull assembly (263) includes a push-pull block (2633) and a suction cup (2634). The suction cup (2634) is used to adsorb and fix the glass substrate. The bottom of the loading and unloading conveying mechanism (24) is provided with a pushing mechanism (27). The pushing mechanism (27) is used to push the glass substrate inside the frame (231) out of the frame (231). When the push-pull assembly (263) moves linearly, the suction cup (2634) can pull the adsorbed and fixed glass substrate out of the frame (231), and the push-pull block (2633) can push the processed glass substrate back into the frame (231).

Images