Wafer identification probe station with visualization

Abstract

The application relates to the technical field of wafer testing, and discloses a visual wafer identification probe station, which comprises a machining table, a probe card, a bearing table assembly and an observation assembly; the probe card is selectively arranged on the machining table; the probe card comprises four groups of probe array assemblies; the bearing table assembly is used for driving the wafer to move in space so as to selectively cooperate with the probe card; the observation assembly comprises a driving assembly and four groups of visual monitoring assemblies; the four groups of visual monitoring assemblies correspond to the four groups of probe array assemblies one by one; the driving assembly is used for driving the four groups of visual monitoring assemblies to selectively monitor the corresponding probe array assemblies; the visual monitoring assembly comprises a camera and an adjusting assembly; the adjusting assembly is used for adjusting the angle of the camera so as to monitor each probe body in the probe array assembly. The application can more accurately observe the condition of the probe body tip, so that the wear amount of the probe body can be compensated or the probe body or the probe card can be replaced.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and more specifically, to a visual wafer identification probe station. Background Technology

[0002] Wafer testing is a critical step in semiconductor manufacturing. It involves applying test signals to the wafer pads using a probe station and collecting the electrical responses to determine chip performance and reliability. A traditional probe station typically includes a processing stage, a platform assembly to support the wafer, and a testing mechanism with probe cards mounted on it. The platform moves the wafer in three-dimensional space, aligning and bringing the wafer pads into contact with the probe array on the probe card, thus completing the test.

[0003] In related technologies, when using probe cards to perform electrical tests on wafers, the tips of the probe bodies may wear or deform after prolonged testing, leading to increased contact resistance, decreased signal transmission stability, and affecting the testing accuracy of the wafer. To address this, we propose a visual wafer identification probe station. Summary of the Invention

[0004] This invention provides a visual wafer identification probe station, which solves the technical problem in related technologies that after long-term testing, the tip of the probe body may wear or deform, resulting in increased contact resistance, decreased signal transmission stability, and affecting the testing accuracy of the wafer.

[0005] This invention provides a visual wafer identification probe station, comprising a processing stage with an internal cavity and a mounting hole at its top; a probe card selectively disposed at one location within the mounting hole, the probe card comprising four sets of probe array assemblies; a support stage assembly disposed within the cavity for moving the wafer within the cavity to selectively engage with the probe card; and an observation assembly disposed on the processing stage, comprising a driving component and four sets of visual monitoring components, each corresponding one-to-one with one of the four sets of probe array assemblies. The driving component drives the four sets of visual monitoring components to move vertically, enabling the visual monitoring components to selectively monitor the corresponding probe array assembly. Each visual monitoring assembly comprises a camera and an adjustment component, the adjustment component being used to adjust the angle of the camera to monitor each probe body within the probe array assembly.

[0006] As a further improvement of the present invention, the carrier stage assembly includes: a three-dimensional module, a carrier disk, and multiple limiting posts. The carrier disk is used to place the wafer, the three-dimensional module is connected to the carrier disk to drive the carrier disk to move in space, and the multiple limiting posts are distributed in a ring array about the center of the carrier disk to limit the wafer.

[0007] As a further improvement of the present invention, the drive assembly includes: a fixed base, a cylinder, and a mounting base. The fixed base is fixedly connected to the processing table, the fixed end of the cylinder is disposed on the fixed base, and its telescopic end is fixedly connected to the mounting base. All four vision monitoring components are connected to the mounting base.

[0008] As a further improvement of the present invention, the adjustment assembly includes: a drive rod, a drive shaft, a transmission assembly, and a rotating disk. One end of the drive rod is rotatably connected to the mounting base, and the other end is connected to the camera. One end of the drive shaft is rotatably connected to the mounting base, and the other end is fixedly connected to the rotating disk. The axes of the drive rod and the drive shaft are vertically arranged and parallel to each other. The transmission assembly cooperates with both the drive rod and the drive shaft to transmit the power of the drive shaft to the drive rod.

[0009] As a further improvement of the present invention, the transmission assembly includes: a rotating shaft 1, a rotating shaft 2, a gear 1, a gear 2, a gear 3, a gear 4, and a gear 5. The axes of the rotating shaft 1 and the rotating shaft 2 are both vertically arranged and parallel to each other. The rotating shaft 1 and the rotating shaft 2 are both rotatably connected to the mounting base. The gears 1 to 4 are fixedly connected to the drive rod, the rotating shaft 1, the rotating shaft 2, and the drive shaft, respectively. The gear 5 is fixedly connected to the rotating shaft 2. The gear 2 is adapted to both the gear 1 and the gear 3. The gear 4 is adapted to the gear 5. The gears 1 to 4 have the same size. The number of teeth of the gear 5 is greater than the number of teeth of the gear 1.

[0010] As a further improvement of the present invention, a cavity two is provided in the mounting base, and the first rotating shaft, the second rotating shaft, and the first to the fifth gears are all disposed in the cavity two.

[0011] As a further improvement of the present invention, the visual monitoring component further includes: four first lighting lamps and multiple second lighting lamps, the four first lighting lamps corresponding to the four drive rods, the first lighting lamps being disposed on the corresponding drive rods and close to the camera, the multiple second lighting lamps being distributed in a circular array about the center of the support platform, and the second lighting lamps being disposed outside the limiting post.

[0012] As a further improvement of the present invention, the probe card further includes: a circuit board and a ring-shaped mounting bracket, wherein the circuit board has a second mounting hole, and four sets of the probe array assemblies are arranged in a ring array about the center of the mounting bracket; the probe array assembly includes: a plurality of probe assemblies distributed at linear intervals; the probe assembly includes: a probe body, a connecting seat, a piezoresistive sensor and a piezoelectric ceramic actuator, the piezoelectric ceramic actuator is connected to the mounting bracket, and its telescopic end is connected to the connecting seat, one end of the probe body is connected to the connecting seat, the piezoelectric ceramic actuator is used to push the probe body to move, and the piezoresistive sensor is disposed on the probe body for monitoring the pressure of the probe body.

[0013] As a further improvement of the present invention, the connector has an internal mounting groove, one end of the probe body is disposed in the mounting groove, and the connector has a guide groove communicating with the mounting groove on the side facing the probe body. The probe body is provided with a guide plate, which is selectively slidably connected to the guide groove. In the axial direction of the probe body, a gap is provided between the guide plate and the bottom of the guide groove, and the gap is filled with adhesive.

[0014] As a further improvement of the present invention, the probe body has a second mounting groove near the tip, and the probe body also has a wire groove. The two ends of the wire groove are respectively connected to the second mounting groove and the first mounting groove. The piezoresistive sensor is disposed in the second mounting groove, and both the second mounting groove and the wire groove are sealed with adhesive.

[0015] The beneficial effects of this invention are as follows:

[0016] 1. This invention sets up an observation component on the processing table. Each observation component includes a drive component and four vision monitoring components. Each vision monitoring component monitors a set of probe arrays. The camera in the vision monitoring component can be used to observe the tip condition of the probe body. In addition, a piezoresistive sensor and a piezoelectric ceramic actuator are set on each probe body. The piezoresistive sensor can monitor the pressure of the probe body, and the piezoelectric ceramic actuator can compensate for the wear of the probe body. Through the cooperation of the piezoresistive sensor and the vision detection component, the condition of the probe body tip can be understood more accurately. Thus, according to the actual working conditions, the piezoelectric ceramic actuator can be used to push the probe body towards the wafer to compensate for the wear, or the probe body or probe card can be replaced, thereby improving the testing accuracy of the wafer.

[0017] 2. An illumination lamp 1 is installed near the probe array assembly on the drive rod, and multiple illumination lamps 2 are installed on the outside of the wafer on the carrier disk. Illumination lamp 1 and illumination lamp 2 are respectively installed on both sides of the corresponding probe array assembly. In this way, the illumination lamp 1 and illumination lamp 2 can be used together to illuminate the tip of the probe body and the wafer surface more comprehensively, so as to facilitate the camera to better observe the tip of the probe body. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural schematic diagram of a visual wafer identification probe station according to an embodiment of the present invention;

[0019] Figure 2 This is a side view of a visual wafer identification probe station according to an embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the main view structure of a visual wafer identification probe station according to an embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the main cross-sectional structure of a visual wafer identification probe station according to an embodiment of the present invention;

[0022] Figure 5 yes Figure 4 Enlarged view of point A in the middle;

[0023] Figure 6 yes Figure 4 Enlarged view of point B in the middle;

[0024] Figure 7 This is a partial structural schematic diagram of the first top cross-section of a visual wafer identification probe station according to an embodiment of the present invention;

[0025] Figure 8 This is a partial structural schematic diagram of a second top-view cross-section of a visual wafer identification probe station according to an embodiment of the present invention;

[0026] Figure 9 This is a partial three-dimensional structural schematic diagram of the main cross-section of the probe card in this invention;

[0027] Figure 10 A schematic diagram of the front cross-sectional structure of the probe card in this invention;

[0028] Figure 11 yes Figure 10 Enlarged view of point C in the middle;

[0029] Figure 12 yes Figure 10 Enlarged view of point D in the middle.

[0030] In the diagram: 1. Machining table; 11. Cavity 1; 2. Probe card; 21. Circuit board; 211. Mounting hole 2; 22. Mounting bracket; 23. Probe array assembly; 24. Probe assembly; 241. Probe body; 2411. Guide plate; 2412. Mounting slot 2; 2413. Cable groove; 242. Connector; 2421. Mounting slot 1; 2422. Guide groove; 243. Piezoresistive sensor; 244. Piezoelectric ceramic actuator; 3. Support platform assembly; 31. 3D module; 32. Support plate; 33. Limiting post; 4. Observation assembly; 41. Drive assembly; 411, fixed base; 412, cylinder; 413, mounting base; 4131, cavity two; 42, vision monitoring assembly; 421, camera; 422, adjustment assembly; 4221, drive rod; 4222, drive shaft; 4223, rotating disk; 4224, transmission assembly; 42241, rotating shaft one; 42242, rotating shaft two; 42243, gear one; 42244, gear two; 42245, gear three; 42246, gear four; 42247, gear five; 423, lighting lamp one; 424, lighting lamp two. Detailed Implementation

[0031] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the subject matter described herein, and changes may be made to the function and arrangement of the elements discussed without departing from the scope of this specification. Various processes or components may be omitted, substituted, or added as needed in the examples. Furthermore, features described in some examples may be combined in other examples.

[0032] like Figures 1-12 As shown, a visual wafer identification probe station includes a processing stage 1, a probe card 2, a carrier stage assembly 3, and an observation assembly 4. The processing stage 1 primarily serves as a support and mounting component. The probe card 2 is mainly used for electrical testing of the wafer. The carrier stage assembly 3 is mainly used to place the wafer and move it within space to selectively engage with the probe card 2. The observation assembly 4 is mainly used to monitor the testing status of the wafer by the probe card 2. It should be noted that the visual wafer identification probe station also includes existing technologies such as testing machines, which are not specifically described in this embodiment.

[0033] In addition, such as Figure 1 As shown, the processing table 1 has a cavity 11 inside, and a mounting hole 1 is provided on the top of the processing table 1. Both the cavity 11 and the mounting hole 1 can be used for installation. The support table assembly 3 can be placed in the cavity 11, and the probe card 2 can be fixedly installed in the mounting hole 1.

[0034] In addition, such as Figure 3As shown, the support platform assembly 3 includes a three-dimensional module 31, a support disk 32, and multiple limiting posts 33. The support disk 32 is used to place the wafer. The three-dimensional module 31 is connected to the support disk 32 to move the support disk 32 in space. The multiple limiting posts 33 are arranged in a ring array about the center of the support disk 32 to limit the wafer. It should be noted that the three-dimensional module 31 is existing technology and can move the support disk 32 in both horizontal and vertical space, thereby enabling better testing of the wafer and the probe card 2. The multiple limiting posts 33 are arranged in a ring array about the center of the support disk 32, which allows the multiple limiting posts 33 to limit the outer edge of the wafer, thereby making the wafer more stable on the support disk 32.

[0035] Furthermore, such as Figure 1 As shown, the probe card 2 is selectively fixedly installed at one of the mounting holes, that is, the probe card 2 and the mounting hole are detachably connected. When the probe card 2 is needed to inspect the wafer, it can be fixedly connected to the mounting hole. When the probe card 2 needs to be replaced, it can be removed from the mounting hole.

[0036] Specifically, such as Figure 6 and Figures 8-12 As shown, the probe card 2 includes: a circuit board 21, a ring-shaped mounting bracket 22, and four sets of probe array assemblies 23. The circuit board 21 is existing technology and is typically a disc structure. The circuit board 21 is the basic framework and main electrical connection platform of the probe card 2. The circuit board 21 is usually connected to the probe body 241 and the tester, mainly used for receiving test signals and power. A mounting hole 211 is provided in the center of the circuit board 21, primarily for connection. The mounting bracket 22 is fixedly connected within the mounting hole 211, and the four sets of probe array assemblies 23 are arranged in a ring array around the center of the mounting bracket 22. The mounting bracket 22 mainly serves for connection and installation; the four sets of probe array assemblies 23 are arranged in a ring array around the center of the mounting bracket 22 for better adaptation to the test points on the wafer pads.

[0037] The probe array assembly 23 includes a plurality of probe components 24 spaced apart along a straight line. That is, each probe array assembly 23 is composed of a plurality of probe components 24, and the plurality of probe components 24 are arranged in a straight line.

[0038] The probe assembly 24 includes: a probe body 241, a connector 242, a piezoresistive sensor 243, and a piezoelectric ceramic actuator 244. The probe body 241 is existing technology and is mainly used to make physical and electrical contact with the wafer pads. Specifically, it pierces the oxide layer on the surface of the wafer pads with mechanical pressure to form a reliable electrical connection, then transmits the test signal to the wafer pads and sends the corresponding response back to the testing machine.

[0039] The connector 242 primarily serves as a mounting and support structure, providing a carrier for mounting and supporting corresponding components. The piezoelectric ceramic actuator 244 primarily functions as a drive, moving the probe body 241 toward the wafer and thus compensating for wear on the probe body 241.

[0040] Furthermore, the piezoelectric ceramic actuator 244 is fixedly connected to the mounting bracket 22, and the telescopic end of the piezoelectric ceramic actuator 244 is fixedly connected to the connecting seat 242. One end of the probe body 241 is connected to the connecting seat 242. It should be noted that the telescopic end of the piezoelectric ceramic actuator 244 can extend and retract vertically. The connecting seat 242 can be a cylindrical structure, and its axis is vertically oriented. Similarly, the axis of the probe body 241 can also be vertically oriented. The piezoelectric ceramic actuator 244 is used to push the probe body 241 to move along the axial direction of the probe body 241. The piezoresistive sensor 243 is disposed on the probe body 241 to monitor the pressure of the probe body 241.

[0041] It should be noted that the piezoresistive sensor 243 can be integrated onto the probe body 241 using MEMS (Micro-Electro-Mechanical Systems) technology. When the tip of the probe body 241 contacts the pad and is subjected to pressure, this pressure causes a slight deformation of the probe body 241. The piezoresistive sensor 243 can sense this slight deformation and convert it into a measurable electrical signal, which is then transmitted back to the testing machine. Furthermore, the piezoresistive sensor 243 can also monitor the magnitude of the pressure on the probe body 241, thereby enabling more uniform pressure distribution on each probe body 241 when used in conjunction with the piezoelectric ceramic actuator 244.

[0042] In use, the wear amount at the tip of the probe body 241 can be measured based on the electrical signal returned by the piezoresistive sensor 243. Then, the piezoelectric ceramic actuator 244 moves the tip of the probe body 241 toward the wafer pad by the amount of wear, thereby compensating for the wear of the probe body 241. After compensation, the piezoresistive sensor 243 can be used to detect whether the pressure of the probe body 241 has returned to the normal value. This can extend the service life of the probe body 241 and improve the testing accuracy of the wafer.

[0043] In addition, such as Figures 1-7 As shown, the observation component 4 is mounted on the processing table 1. The observation component 4 includes a drive component 41 and four sets of visual monitoring components 42. The four sets of visual monitoring components 42 correspond one-to-one with the four sets of probe array components 23. The drive component 41 is used to drive the four sets of visual monitoring components 42 to move in the vertical direction, so that the visual monitoring components 42 selectively monitor the corresponding probe array components 23.

[0044] Specifically, the drive assembly 41 includes a fixed base 411, a cylinder 412, and a mounting base 413. The fixed base 411 is fixedly connected to the processing table 1. The fixed end of the cylinder 412 is disposed on the fixed base 411, and the telescopic end of the cylinder 412 is fixedly connected to the mounting base 413. All four vision monitoring components 42 are connected to the mounting base 413. It should be noted that the telescopic direction of the cylinder 412 is vertical.

[0045] Initially, the four vision monitoring components 42 are positioned above the processing stage 1. After the probe card 2 is fixedly installed in the mounting hole 1, the cylinder 412 is activated, pushing the four vision monitoring components 42 downwards until they reach positions that engage with their corresponding probe array components 23. Specifically, the engagement position of each vision monitoring component 42 with its corresponding probe array can be the middle position of the probe array component 23 and located above the tip of the probe body 241. This facilitates observation of the probe array component 23 while reducing interference with the wafer.

[0046] Additionally, the visual monitoring component 42 includes a camera 421 and an adjustment component 422. The camera 421 can be positioned facing the tip of the probe body 241, and is primarily used to observe the deformation and wear of the probe tip. The adjustment component 422 is used to adjust the angle of the camera 421, allowing for better monitoring of each probe body 241 in the probe array component 23. The camera 421 can be a telecentric lens camera, or other suitable cameras.

[0047] In use, when the piezoresistive sensor 243 detects an abnormal change in the tip pressure of a probe body 241, the visual monitoring component 42 can be used to observe the tip of the probe body 241 and check its specific condition. If wear is observed at the tip of the probe body 241, the piezoelectric ceramic actuator 244 can be used to move the probe body 241 toward the wafer by the amount of wear, thereby compensating for the wear of the probe body 241. When bending or deformation of the tip of the probe body 241 is detected, the probe card 2 or the probe body 241 can be replaced.

[0048] Specifically, such as Figure 5 and Figure 7As shown, the adjustment assembly 422 includes: a drive rod 4221, a drive shaft 4222, a transmission assembly 4224, and a rotating disk 4223. One end of the drive rod 4221, i.e., the top of the drive rod 4221, is rotatably connected to the mounting base 413. The other end of the drive rod 4221, i.e., the bottom of the drive rod 4221, is fixedly connected to the camera 421. One end of the drive shaft 4222, i.e., the bottom of the drive shaft 4222, is rotatably connected to the mounting base 413, and the other end of the drive shaft 4222, i.e., the top of the drive shaft 4222, is fixedly connected to the rotating disk 4223. The axes of the drive rod 4221 and the drive shaft 4222 are vertically aligned and parallel to each other. The transmission assembly 4224 cooperates with both the drive rod 4221 and the drive shaft 4222 to transmit power from the drive shaft 4222 to the drive rod 4221.

[0049] The transmission assembly 4224 includes: a first rotating shaft 42241, a second rotating shaft 42242, a first gear 42243, a second gear 42244, a third gear 42245, a fourth gear 42246, and a fifth gear 42247. Both the first rotating shaft 42241 and the second rotating shaft 42242 are rotatably connected to the mounting base 413, and the axes of both the first rotating shaft 42241 and the second rotating shaft 42242 are vertically aligned and parallel to each other. Gear 1 (42243), Gear 2 (42244), Gear 3 (42245), and Gear 4 (42246) are fixedly connected to drive rod 4221, rotating shaft 1 (42241), rotating shaft 2 (42242), and drive shaft 4222, respectively. Gear 5 (42247) is fixedly connected to rotating shaft 2 (42242). Gear 2 (42244) meshes with both gear 1 (42243) and gear 3 (42245), and gear 4 (42246) meshes with gear 5 (42247). Gear 1 (42243), Gear 2 (42244), Gear 3 (42245), and Gear 4 (42246) are all the same size, and gear 5 (42247) has more teeth than gear 1 (42243).

[0050] When in use, if it is necessary to adjust the angle of the camera 421 to observe the tip of a specific probe body 241, the rotating disk 4223 is manually rotated. The rotating disk 4223 can drive the gear four 42246 to rotate through the drive shaft 4222. The rotation of the gear four 42246 is transmitted in sequence through the gear five 42247, the rotating shaft two 42242, the gear three 42245, the gear two 42244, and the gear one 42243, which can drive the drive rod 4221 to rotate, thereby driving the camera 421 to rotate. It is flexible and convenient to use.

[0051] It should be noted that the number of teeth in gear five 42247 is greater than that in gear one 42243. This can reduce the speed. Compared with the rotation speed of the rotating disk 4223, it can reduce the rotation speed of the camera 421. This makes it easier to fine-tune the angle of the camera 421, thereby allowing for better adjustment of the camera 421's angle and reducing the need for excessive adjustments and repeated adjustments.

[0052] In addition, such as Figure 3 and Figure 6 As shown, the visual monitoring component 42 also includes four illumination lamps 423 and multiple illumination lamps 424. The four illumination lamps 423 correspond one-to-one with the four drive rods 4221. The illumination lamps 423 are fixedly connected to their respective drive rods 4221 and positioned close to the camera 421. The multiple illumination lamps 424 are arranged in a circular array around the center of the support platform, and are positioned outside the limiting post 33. Both illumination lamps 423 and 424 provide illumination, and are positioned on opposite sides of the corresponding probe array component 23. This allows for more comprehensive illumination of the tip of the probe body 241 and the wafer surface, facilitating better observation of the tip of the probe body 241 by the camera 421. The illumination lamps 423 and 424 can be LED light sources, or other suitable light sources can be used.

[0053] As an optional embodiment, such as Figure 4 As shown, a cavity 4131 is formed inside the mounting base 413, and the first rotating shaft 42241, the second rotating shaft 42242, the first gear 42243, the second gear 42244, the third gear 42245, the fourth gear 42246, and the fifth gear 42247 are all disposed within the cavity 4131. This avoids interference between the first rotating shaft 42241, the second rotating shaft 42242, the first gear 42243, the second gear 42244, the third gear 42245, the fourth gear 42246, and the fifth gear 42247 and the external environment, thereby allowing the above components to work better.

[0054] In addition, such as Figure 11 and Figure 12As shown, the connector 242 has a mounting groove 2421 inside, and the bottom of the mounting groove 2421 communicates with the outside. One end of the probe body 241 is disposed in the mounting groove 2421, and the connector 242 has a guide groove 2422 communicating with the mounting groove 2421 on the side facing the probe body 241. A guide plate 2411 is fixedly connected to the probe body 241, and the guide plate 2411 is selectively slidably connected to the guide groove 2422. In the axial direction of the probe body 241, a gap is provided between the guide plate 2411 and the bottom of the guide groove 2422, and the gap is filled with adhesive.

[0055] Setting one end, i.e. the tail end, of the probe body 241 in the mounting slot 2421 can reduce the interference between the tail end of the probe body 241 and the external environment, thereby enabling the probe body 241 to work better.

[0056] In addition, the cooperation between the guide groove 2422 and the guide plate 2411 can play a role in positioning and limiting. Through the cooperation between the guide groove 2422 and the guide plate 2411, the tail end of the probe body 241 can be installed into the mounting groove 2421 more accurately, and the rotation of the probe body 241 can be restricted. This makes the setting of the probe body 241 more stable and reliable, and facilitates the probe body 241 to perform testing work better.

[0057] Furthermore, along the axial direction of the probe body 241, after the tail of the probe body 241 reaches the installation position, there is a gap between the bottom of the guide plate 2411 and the bottom of the guide groove 2422. Adhesive can be filled into this gap to fix the guide plate 2411, thereby securing the probe body 241 to the connector 242. By using adhesive filling, when the probe body 241 is damaged, it can be replaced simply by removing the outer layer of adhesive, making it more flexible and convenient. The adhesive can be epoxy resin, but other suitable materials can also be selected.

[0058] In addition, such as Figure 12 As shown, the probe body 241 has a second mounting groove 2412 near the tip, and a wire groove 2413 is also provided on the probe body 241. The two ends of the wire groove 2413 are connected to the second mounting groove 2412 and the first mounting groove 2421, respectively. The piezoresistive sensor 243 is disposed in the second mounting groove 2412, and both the second mounting groove 2412 and the wire groove 2413 are sealed with adhesive.

[0059] The piezoresistive sensor 243 is installed in the second mounting slot 2412, and the second mounting slot 2412 is set close to the tip of the probe body 241. This allows the piezoresistive sensor 243 to be closer to the tip of the probe body 241, so that the piezoresistive sensor 243 can more accurately monitor the pressure on the tip of the probe body 241, thereby improving the accuracy of compensation for wear of the probe body 241.

[0060] The wire groove 2413 can serve as a conduit for the wires. The wire groove 2413 can be used to hide the signal wires of the piezoresistive sensor 243, preventing them from getting tangled together and interfering with external parts, thereby allowing the piezoresistive sensor 243 to work better.

[0061] The embodiments of this example have been described above. However, this example is not limited to the specific implementation methods described above. The specific implementation methods described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms based on the guidance of this example, and all of them are within the protection scope of this example.

Claims

1. A visual wafer identification probe station, comprising: The utility model relates to a processing table (1) is provided with the cavity (11) and the installation hole (1) in the top, and the probe card (2) is selectively arranged in the installation hole (1), the probe card (2) includes four groups of probe array assembly (23), the bearing table assembly (3) is arranged in the cavity (11) and is used for driving wafer to move in the cavity (11) and selectively cooperates with the probe card (2), and the bearing table assembly (3) includes bearing disc (32) and a plurality of limit post (33), the observation assembly (4) is arranged on the processing table (1) and includes drive assembly (41) and four groups of visual monitoring assembly (42), four groups of visual monitoring assembly (42) correspond with four groups of probe array assembly (23) one to one, and the drive assembly (41) is used for driving four groups of visual monitoring assembly (42) to move in the vertical direction to make visual monitoring assembly (42) selectively monitor corresponding probe array assembly (23), visual monitoring assembly (42) includes camera (421) and adjusting assembly (422), and the adjusting assembly (422) includes drive rod (4221), and the adjusting assembly (422) is used for adjusting the angle of camera (421) to monitor every probe body (241) in probe array assembly (23), the visual monitoring assembly (42) still includes four lighting lamp one (423) and a plurality of lighting lamp two (424), four lighting lamp one (423) correspond with four drive rod (4221) one to one, and the lighting lamp one (423) is arranged on corresponding drive rod (4221) and is close to camera (421) and is arranged, a plurality of lighting lamp two (424) are about the center annular array distribution of bearing disc, and the lighting lamp two (424) is arranged on the outside of limit post (33), and lighting lamp one (423) and lighting lamp two (424) are arranged at the two sides of corresponding probe array assembly (23) respectively, cooperate with lighting lamp one (423) and lighting lamp two (424), more comprehensively the tip of probe body (241) and wafer surface are illuminated, to facilitate camera (421) better observation the tip of probe body (241), the probe card (2) still includes circuit board (21) and annular structure's mounting bracket (22), and the installation hole (2) is opened in circuit board (21), and four groups of probe array assembly (23) about the center annular array of mounting bracket (22) are arranged on mounting bracket (22), the probe array assembly (23) includes a plurality of linearly spaced probe assembly (24), ​ ​ ​ ​ ​ ​ ​ ​ The probe assembly (24) comprises a probe body (241), a connecting seat (242), a piezoresistive sensor (243) and a piezoelectric ceramic actuator (244), the piezoelectric ceramic actuator (244) is connected to the mounting bracket (22), and the telescopic end is connected to the connecting seat (242); one end of the probe body (241) is connected to the connecting seat (242); the piezoelectric ceramic actuator (244) is used to push the probe body (241) to move; the piezoresistive sensor (243) is arranged on the probe body (241) and used to monitor the pressure of the probe body (241). The connecting seat (242) is internally provided with a mounting groove (2421), one end of the probe body (241) is arranged in the mounting groove (2421), and the side of the connecting seat (242) facing the probe body (241) is provided with a guide groove (2422) in communication with the mounting groove (2421); the probe body (241) is provided with a guide plate (2411) which is selectively connected to the guide groove (2422) in sliding mode; in the axial direction of the probe body (241), a gap is arranged between the guide plate (2411) and the bottom of the guide groove (2422), and the gap is filled with an adhesive. The probe body (241) is provided with a mounting groove (2412) near the needle tip, and a wire groove (2413) is further provided on the probe body (241), the two ends of the wire groove (2413) are in communication with the mounting groove (2412) and the mounting groove (2421) respectively, the piezoresistive sensor (243) is arranged in the mounting groove (2412), and the mounting groove (2412) and the wire groove (2413) are sealed by the adhesive. When the piezoresistive sensor (243) detects that the tip pressure of a certain probe body (241) changes abnormally, the tip of the probe body (241) is observed by the visual monitoring assembly (42) to check the specific situation of the tip of the probe body (241).

2. The visual wafer identification probe station of claim 1, wherein, The bearing table assembly (3) further comprises a three-dimensional module (31), the bearing disc (32) is used for placing a wafer, the three-dimensional module (31) is connected with the bearing disc (32) to drive the bearing disc (32) to move in space, and a plurality of limiting columns (33) are arranged in a circular array about the center of the bearing disc (32) to limit the wafer.

3. The visual wafer identification probe station of claim 2, wherein, The driving assembly (41) comprises a fixed seat (411), a gas cylinder (412) and a mounting seat (413), the fixed seat (411) is fixedly connected to the machining table (1), the fixed end of the gas cylinder (412) is arranged on the fixed seat (411), and the telescopic end is fixedly connected to the mounting seat (413), and four visual monitoring assemblies (42) are connected to the mounting seat (413).

4. The visual wafer identification probe station of claim 3, wherein, The adjusting assembly (422) further includes a driving shaft (4222), a transmission assembly (4224) and a rotating disc (4223), one end of the driving rod (4221) is rotationally connected with the mounting seat (413), and the other end is connected with the camera (421), one end of the driving shaft (4222) is rotationally connected with the mounting seat (413), and the other end is fixedly connected with the rotating disc (4223), the axis of the driving rod (4221) and the driving shaft (4222) are vertically arranged and parallel to each other, and the transmission assembly (4224) is matched with the driving rod (4221) and the driving shaft (4222) at the same time, for transmitting power of the driving shaft (4222) to the driving rod (4221).

5. The visual wafer identification probe station of claim 4, wherein, The transmission assembly (4224) includes a rotating shaft one (42241), a rotating shaft two (42242), a gear one (42243), a gear two (42244), a gear three (42245), a gear four (42246) and a gear five (42247), the axes of the rotating shaft one (42241) and the rotating shaft two (42242) are vertically arranged and parallel to each other, and the rotating shaft one (42241) and the rotating shaft two (42242) are rotationally connected on the mounting seat (413), the gear one (42243) to the gear four (42246) are fixedly connected with the driving rod (4221), the rotating shaft one (42241), the rotating shaft two (42242) and the driving shaft (4222) respectively, the gear five (42247) is fixedly connected with the rotating shaft two (42242), the gear two (42244) is matched with the gear one (42243) and the gear three (42245) at the same time, the gear four (42246) and the gear five (42247) are matched, the sizes of the gear one (42243) to the gear four (42246) are the same, and the gear five (42247) has more teeth than the gear one (42243).

6. The visual wafer identification probe station of claim 5, wherein, The mounting seat (413) is provided with a cavity two (4131) therein, and the rotating shaft one (42241), the rotating shaft two (42242) and the gear one (42243) to the gear five (42247) are arranged in the cavity two (4131).

Images