A photonic cooling CPO switch

Abstract

The present application relates to the technical field of CPO switch cooling, in particular to a photonic cooling CPO switch, which comprises a switch mainboard, a switch main control chip, a laser, a first photonic thin film cold plate and a plurality of CPO optical modules; the switch main control chip is arranged at the center of the top surface of the switch mainboard; the plurality of CPO optical modules are arranged on the top surface of the switch mainboard around the switch main control chip; the first photonic thin film cold plate abuts against the top surface of the switch main control chip and the plurality of CPO optical modules; the first photonic thin film cold plate can detect the hot spot position of the switch main control chip or the CPO optical module, and emit laser to the first photonic thin film cold plate through the laser to carry out photonic refrigeration. Through the first photonic thin film cold plate to detect the hot spot position of the switch main control chip or the CPO optical module, and emit laser to the first photonic thin film cold plate through the laser to carry out photonic refrigeration, the precise refrigeration of the hot spot is realized, and the dead angle hot spot is effectively eliminated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of CPO switch cooling, in particular to a photonic cooling CPO switch. BACKGROUND

[0002] The essence of CPO technology is to move the optical engine out of the pluggable optical module and pack it more closely next to the switch chip (ASIC). This brings huge energy efficiency and bandwidth advantages, but also unprecedented cooling challenges.

[0003] First, heat is concentrated and difficult to dissipate: this is the most core challenge. In 3D stacking, multiple high-power chips are stacked together, and the total heat is huge. More importantly, the heat is confined within the narrow stack. Traditional cooling methods mainly rely on the top and bottom of the chip, but the 3D stacked IC structure makes it difficult for the heat of the middle layer to dissipate efficiently, like a "sandwich layer", which is prone to heat accumulation. Studies have shown that the power density of high-performance chips can reach the level of kilowatts per square centimeter. And when the CPO optical module of the 3D stacked IC structure is connected with the LGS socket, the CPO back contact is in contact with the LGA socket bullet pin, so that this surface cannot be laid out with elements, resulting in little space for heat dissipation chips. The existing internal cooling method of CPO can only dissipate heat through the top of the CPO optical module, which seriously affects the heat dissipation of the middle and bottom layers of the chip.

[0004] Second, temperature sensitivity: lasers, modulators and other optical elements are extremely sensitive to temperature. Temperature fluctuations can cause wavelength drift, efficiency decline and even failure. CPO requires optical elements to be stabilized at a certain temperature (for example, within ±3°C), which is much more demanding than cooling electronic chips (which can usually tolerate higher temperatures).

[0005] Third, limited cooling space: traditional heat sinks, fans and thermal interface materials are difficult to work efficiently in such a compact package, and the heat conduction path becomes very complex.

[0006] Based on this, the current CPO cooling scheme mainly relies on air cooling and system-level liquid cooling. For air cooling, it cools the chip by blowing air with a high-speed fan, and the specific heat capacity and thermal conductivity of air are very low. When the heat flux density (heat generated per unit area) of the chip exceeds 50-100 W / cm², air cooling basically reaches its limit and cannot effectively prevent the chip from overheating; and air cooling also has the problems of high noise, high fan energy consumption, large fin space occupation, dust accumulation, uneven cooling (existence of cooling dead angle) and so on.

[0007] For liquid cooling, it is cooled by coiling pipes on the end face of the chip and passing cooling liquid into the pipes. However, water is a good conductor of electricity. Once leakage occurs, it will cause short circuit and burn of the expensive electronic equipment instantly, resulting in huge economic loss and data loss. Secondly, the manufacturing cost and maintenance cost of liquid cooling are much higher than that of air cooling. Even if ionized water is used for cooling liquid, it may still corrode the metal pipeline in the long run, and microorganisms or algae may breed in the cooling liquid, forming biological silt and blocking the fine flow channel, thereby reducing the heat dissipation efficiency. In addition, the water cooling plate, pipeline and cooling liquid itself will significantly increase the weight of the equipment, and higher requirements are put forward for the bearing capacity of the cabinet and floor. SUMMARY

[0008] (I) Technical problems to be solved

[0009] In view of the above-mentioned defects and deficiencies of the prior art, the present application provides a photonic cooling CPO switch, which solves the technical problem that the existing air cooling and liquid cooling cooling methods are difficult to meet the cooling requirements of the CPO optical module of the 3D stacked IC structure.

[0010] (II) Technical solutions

[0011] In order to achieve the above-mentioned purpose, the photonic cooling CPO switch of the present application comprises a switch mainboard, a switch main control chip, a laser, a first photonic thin film cooling plate and a plurality of CPO optical modules;

[0012] The switch main control chip is arranged at the center position of the top surface of the switch mainboard; a plurality of CPO optical modules are arranged on the top surface of the switch mainboard around the switch main control chip; and the first photonic thin film cooling plate abuts against the top surfaces of the switch main control chip and the plurality of CPO optical modules.

[0013] The first photonic thin film cooling plate can detect the hot spot position of the switch main control chip or the CPO optical module, and emit laser to the first photonic thin film cooling plate through the laser to perform photonic refrigeration.

[0014] Optionally, the photonic cooling CPO switch further comprises a CPO fixing support for fixing the first photonic thin film cooling plate.

[0015] The bottom end of the CPO fixing support is correspondingly clamped with the switch main control chip and the CPO optical module.

[0016] The first photonic thin film cooling plate comprises a plurality of photonic cooling plates; and the plurality of photonic cooling plates are correspondingly clamped with the top end of the CPO fixing support.

[0017] Optionally, the photonic cooling plate comprises a receiving reflection layer, a refrigeration layer and a thermal induction layer which are sequentially attached from top to bottom in the vertical direction.

[0018] The top end of the receiving reflective layer is configured as an array of multiple prisms; the prisms can focus the incident laser to the refrigeration layer;

[0019] The refrigeration layer can absorb the laser focused by the prisms, perform photonic refrigeration, and reflect high-energy light, and the high-energy light is emitted through the prisms;

[0020] The heat sensing layer can detect the hotspot position of the CPO optical module or the main control chip of the switch.

[0021] Optionally, the first photonic thin film cold plate further comprises a reflective layer;

[0022] One side of the reflective layer is attached to the refrigeration layer, and the other side is attached to the heat sensing layer; the reflective layer can reflect the laser and high-energy light emitted through the refrigeration layer.

[0023] Optionally, the photonic cooling CPO switch further comprises a thermal imaging display instrument electrically connected to the laser and the heat sensing layer;

[0024] The thermal imaging display instrument can obtain the hotspot area detected by the first photonic thin film cold plate, and drive the laser to emit laser to one or more prisms above the hotspot area.

[0025] Optionally, a plurality of first clamping grooves are vertically formed on the CPO fixing support; a plurality of second clamping grooves are formed on the top surface of the CPO fixing support; the second clamping grooves are in communication with the plurality of first clamping grooves;

[0026] A plurality of CPO optical modules are correspondingly clamped with a plurality of first clamping grooves, and a plurality of first photonic thin film cold plates are correspondingly clamped with a plurality of second clamping grooves, so that the top surface of the CPO optical module abuts against the bottom surface of the first photonic thin film cold plate.

[0027] Optionally, the laser is arranged above a plurality of first photonic thin film cold plates; the laser can adjust the wavelength of the emitted laser.

[0028] Optionally, the CPO optical module comprises an optical fiber and a plurality of built-in heat generating devices and a plurality of second photonic thin film cold plates; the photonic cooling CPO switch further comprises an external laser light source;

[0029] A plurality of second photonic thin film cold plates are correspondingly arranged on a plurality of heat generating devices; one end of the optical fiber is connected to a plurality of waveguides in parallel with the second photonic thin film cold plates, and the other end extends out of the CPO optical module and is connected to the external laser light source;

[0030] The second photonic thin film cold plate can detect the hot spot position of the heat generating device, and emit laser to the optical fiber through the external laser light source, so that the second photonic thin film cold plate performs photonic refrigeration.

[0031] Optionally, the second photonic thin film cold plate is arranged on one side of the heat generating device away from the top plate of the shell of the CPO optical module.

[0032] Optionally, the photonic cooling CPO switch further comprises a switch shell;

[0033] The switch mainboard, the switch main control chip, the laser, the first photonic thin film cold plate, the CPO optical module, the external laser light source and the optical fiber are all built-in in the switch shell;

[0034] The inner wall of the switch shell is coated with a radiation-absorbing heat dissipation coating.

[0035] (Three) beneficial effects

[0036] The beneficial effects of the present application are:

[0037] Strong cooling capacity: below ambient temperature. Photonic cooling can perform "refrigeration", so that the temperature of the heat generating device inside the photonic cooling CPO switch can be reduced to below the ambient temperature, and the adaptability to devices extremely sensitive to temperature is strong.

[0038] Strong precision: point-to-point cooling. Photonic cooling can use a laser beam to cool a specific hot spot like a "scalpel", without affecting the temperature of the surrounding area, achieving precise cooling of the hot spot and effectively eliminating cooling dead angles.

[0039] Strong reliability and silence: no moving parts. Photonic cooling has only an optical path and no mechanical moving parts, with a very long theoretical service life and complete silence, making it very suitable for scenarios with strict requirements for reliability and quietness. In addition, the response speed of the optical path is much better than that of gas and liquid, which enables the photonic cooling CPO switch to more accurately control the temperature of the heat generating device, meeting the use requirements of optical elements extremely sensitive to temperature.

[0040] Strong integration potential: on-chip and in-chip thermal management. Photonic cooling can be designed in micro-nano scale and integrated on the surface or even inside the chip, which provides the possibility of "on-chip cooling" or "in-chip cooling", directly eliminating heat from the source and achieving efficient cooling of the CPO optical module 4 of the 3D stacked IC structure. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 The structure diagram of the photonic cooling CPO switch of the present application;

[0042] Figure 2 A decomposition view of the photon cooling CPO switch of the present application;

[0043] Figure 3 A schematic view of the compound eye laser emitting laser to the first photon thin film cold plate of the present application;

[0044] Figure 4 A structural schematic view of the photon cold plate of the present application;

[0045] Figure 5 A structural schematic view of the CPO optical module of the present application;

[0046] Figure 6 A schematic view of the CPO optical module receiving an external laser light source of the present application.

[0047] BRIEF DESCRIPTION OF DRAWINGS

[0048] 1: switch mainboard;

[0049] 2: switch main control chip;

[0050] 3: first photon thin film cold plate; 31: photon cold plate; 311: receiving reflection layer; 3111: prism; 312: refrigeration layer; 313: thermal induction layer; 314: reflection layer;

[0051] 4: CPO optical module; 41: optical fiber; 42: second photon thin film cold plate; 43: chip; 44: DFB laser; 45: photon integrated chip; 46: intermediate plate; 47: PCB plate; 48: FAU;

[0052] 5: CPO fixing support; 51: first clamping groove; 52: second clamping groove;

[0053] 6: thermal imaging display instrument;

[0054] 7: compound eye laser;

[0055] 8: external laser light source;

[0056] 9: switch shell. DETAILED DESCRIPTION

[0057] In order to better explain the present application, so as to be understood, the present application is described in detail in the specific implementation mode, combined with the drawings.

[0058] It should be noted that all directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), if the specific posture changes, the directionality indication also changes accordingly.

[0059] In addition, in the present application, the description such as "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0060] In the present application, unless otherwise specifically defined and limited, the terms "connection", "fixing" and the like should be understood in a broad sense, for example, "fixing" can be fixed connection, or detachable connection, or integral; "connection" can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0061] Referring to Figures 1 to 3 The present application provides a kind of photon cooling CPO switch, and the photon cooling CPO switch includes switch mainboard 1, switch main control chip 2, laser, first photon film cold plate 3 and multiple CPO optical modules 4;Switch main control chip 2 is arranged at the center position of the top surface of switch mainboard 1;Multiple CPO optical modules 4 are arranged on the top surface of switch mainboard 1 around switch main control chip 2;First photon film cold plate 3 is arranged on the top surface of switch main control chip 2 and multiple CPO optical modules 4;First photon film cold plate 3 can detect the hotspot position of switch main control chip 2 or CPO optical module 4, and emit laser to first photon film cold plate 3 by laser, to carry out photon refrigeration.In the embodiment, CPO optical module 4 is the CPO optical module of 3D stacked IC structure, carries out photon refrigeration by the effective cooperation of laser and first photon film cold plate 3, and then the inside of CPO optical module 4 is cooled.

[0062] Photon cooling belongs to laser cooling. The photon cooling technology is to directly convert thermal energy into light energy by using the principle of laser-induced anti-Stokes cooling. Specifically, the anti-Stokes effect refers to the scattering of part of the photons when the incident photons interact with the molecular vibration energy level of the material. If the scattered photon energy is higher than the incident photon (shorter wavelength), it is called anti-Stokes scattering; otherwise, it is Stokes scattering. In the anti-Stokes process, the molecule absorbs energy from the outside (manifested as an increase in scattered photon energy), thereby reducing its own temperature. That is, the principle of cooling by absorbing low-energy light from the material and emitting high-energy light to reduce the temperature. Specifically, when laser irradiates on a special material, the ions of the special material will absorb the incident light, combine with the material lattice vibration, and trigger the emission of higher energy light. Unlike traditional heat dissipation methods, photon cooling does not need to cool the entire chip, but precisely targets the hotspot area of the chip that needs to be cooled for precise cooling. Photon cooling is different from traditional air cooling and water cooling plate heat dissipation in principle. This technology can keep the temperature of the heat generating device below 50°C, while the temperature after traditional cooling is generally 90-120°C. This is because photon cooling converts waste heat into electrical energy, and the high-energy light carrying heat escapes from the chip. Since the escape speed of photons is extremely fast (nanosecond level), heat is difficult to be reabsorbed by the chip material, thereby achieving rapid local temperature drop.

[0063] First, strong cooling capacity: below ambient temperature. Air cooling and water cooling plate are only "heat dissipation", while photon cooling is "cooling", which can reduce the temperature of the heat generating device inside the photon cooling CPO switch to below ambient temperature. This ability is irreplaceable in devices that are extremely sensitive to temperature (such as lasers, quantum bits, and high-precision sensors).

[0064] Second, strong precision: point-to-point cooling. In modern chips, heat distribution is extremely uneven, with fatal "hot spots", i.e. heat dissipation dead angles. Air cooling and water cooling plate are "surface" cooling, which is difficult to solve local overheating; while photon cooling can use a laser beam to cool a specific hotspot like a "scalpel", without affecting the temperature of the surrounding area. This is a dream come true for the optical engine next to the switching chip in CPO.

[0065] Third, strong reliability and silence: no moving parts. Fans will wear out, pumps will fail, and pipes will age and leak, all of which are single points of failure in traditional cooling systems. Photonic cooling has no moving parts and can last indefinitely, and is completely silent, making it ideal for situations where reliability and silence are critical. In addition, the response speed of the optical path is much better than that of gas and liquid, which can remove heat immediately when the hot spot is formed, which enables the photonic cooling CPO switch to more accurately control the temperature of the heat generating device and meet the use requirements of the optical element which is extremely sensitive to temperature.

[0066] Fourth, strong integration potential: on-chip, in-chip thermal management. Photonic cooling can be designed as a micro-nano structure and integrated on the surface or even inside the chip, which makes it possible to achieve "on-chip cooling" or "in-chip cooling", directly eliminating heat from the source and achieving efficient cooling of the CPO optical module 4 of the 3D stacked IC structure.

[0067] The present application sets the switch main control chip 2 at the center of the top surface of the switch main board 1, and sets a plurality of CPO optical modules 4 around the switch main control chip 2 on the top surface of the switch main board 1. This annular layout effectively concentrates the hot spots, so that all hot spots are concentrated on the same horizontal plane, facilitating laser irradiation of the first photonic thin film cold plate 3 by the laser, so that the laser can cover all the heat generating points inside the photonic cooling CPO switch, that is, cover the top surface (laser receiving surface) of the first photonic thin film cold plate 3, achieving the purpose of eliminating laser irradiation dead angles.

[0068] The first photonic thin film cold plate 3 is arranged on the top surface of the switch main control chip 2 and the plurality of CPO optical modules 4. The first photonic thin film cold plate 3 can be fixed above the CPO optical module 4 (or the switch main control chip 2), and the first photonic thin film cold plate 3 is irradiated by the laser to reduce the air temperature at the top surface of the CPO optical module 4, achieving the purpose of reducing the high temperature inside the CPO optical module 4. Preferably, the first photonic thin film cold plate 3 is arranged in close contact with the top plate of the CPO optical module 4 to eliminate the spacing between the two in a face-to-face contact manner, achieving the purpose of direct heat exchange, effectively improving the cooling efficiency of the CPO optical module 4.

[0069] The first photonic thin film cold plate 3 detects the hot spot position of the switch main control chip 2 or the CPO optical module 4, and guides the laser to emit laser to the first photonic thin film cold plate 3 to perform photonic refrigeration, achieving accurate refrigeration of the hot spot and effectively reducing the refrigeration energy consumption and improving the cooling efficiency.

[0070] The switch main control chip 2 and the CPO optical module 4 will generate a large amount of heat in the working process. The first photonic thin film cold plate 3 is attached and arranged on the top surface of the switch main control chip 2 and the plurality of CPO optical modules 4, realizing "on-chip cooling". The first photonic thin film cold plate 3 is a thin film sheet structure, thin in thickness, light in weight, and easy to integrate on the heat generating device. The first photonic thin film cold plate 3 is cooled by laser irradiation, and the low temperature is conducted through the shell of the CPO optical module 4, realizing efficient and accurate cooling of the 3D stacked IC structure CPO optical module 4, and reducing the local hot spot temperature to the target temperature. The switch main control chip 2 is the same, and details are not repeated.

[0071] Further, the photonic cooling CPO switch further comprises a CPO fixing support 5 for fixing the first photonic thin film cold plate 3; the bottom end of the CPO fixing support 5 is correspondingly clamped with the switch main control chip 2 and the CPO optical module 4; the first photonic thin film cold plate 3 comprises a plurality of photonic cold plates 31; the plurality of photonic cold plates 31 are correspondingly clamped with the top end of the CPO fixing support 5. In this embodiment, the switch main control chip 2 and the CPO optical module 4 are correspondingly welded with the switch main board 1; the CPO fixing support 5 is detachably connected with the switch main control chip 2, which can be selectively connected by screws or buckles. The CPO fixing support 5 supports the thin film cold plate, so that the thin film cold plate can be erected on the top surface of the switch main control chip 2 and the CPO optical module 4 to conduct temperature in a direct contact manner. By arranging the plurality of photonic cold plates 31 corresponding to the area of the heat generating device on the top end of the CPO fixing support 5, compared with the way of arranging the first photonic thin film cold plate 3 as a whole plate, the plurality of photonic cold plates 31 are arranged for the area provided with the heat generating device, which effectively reduces the occupied space and weight of the first photonic thin film cold plate 3, and the energy consumption generated by cooling.

[0072] As Figure 4As shown, the photon cold plate 31 includes, from top to bottom in the vertical direction, a receiving reflection layer 311, a refrigeration layer 312, and a heat induction layer 313. The top end of the receiving reflection layer 311 is configured as an array of multiple prisms 3111. The prisms 3111 can focus the incident laser light to the refrigeration layer 312. The refrigeration layer 312 can absorb the laser light focused by the prisms 3111, perform photon refrigeration, and reflect high-energy light, which is emitted through the prisms 3111. The heat induction layer 313 can detect the hotspot position of the CPO light module 4 or the switch main control chip 2. The heat induction layer 313 is attached with a plurality of heat induction pixel materials (vanadium oxide, amorphous silicon) and is electrically connected to the thermal imaging display instrument 6. The basic principle of the heat induction layer 313 is that the heat induction material can sense the temperature radiated from the CPO light module 4. The change in temperature causes the resistance of the heat induction material to change. By reading the circuit to detect the resistance change of each pixel, the infrared radiation intensity received by each pixel is calculated, and finally converted into a temperature value and an image signal output to the thermal imaging display instrument 6, so as to monitor the temperature of the potential hotspot area of each heat generating device and accurately lock a hotspot position. Specifically, the hotspot is first detected by the heat induction layer 313 abutting the heat generating device, and the laser is guided to emit laser light to the prisms 3111 (not necessarily the prisms 3111 directly above) above the hotspot, so as to accurately lock the hotspot. The laser is low-energy light, which is absorbed by the refrigeration layer 312 to emit high-energy light and achieve refrigeration. The cooling capacity is conducted to the inside of the heat generating device through the shell top plate of the heat generating device, so as to achieve the cooling of the inside and bottom of the heat generating device. The high-energy light carrying heat is reflected to the switch shell 9 by the prisms 3111, and the heat is dissipated by the switch shell 9.

[0073] It should be noted that the prisms 3111 concentrate the laser light to a specific direction through refraction and total reflection, so as to focus the laser light to the refrigeration layer 312. Each prism 3111 has a corresponding laser incidence angle, and the laser works with each prism 3111 based on the corresponding laser incidence angle. The prisms 3111 can be selected as three prisms or right-angle prisms, as long as the laser can conduct the laser light to the corresponding photon cold plate 31. Compared with the traditional coupler (lens for focusing incident laser light to a micro refrigeration area), the prism 3111 has a smaller structure and a regular shape, and is easy to be arrayed and integrated on the same horizontal plane.

[0074] Secondly, the first photonic thin film cold plate 3 further comprises a reflective layer 314; one side of the reflective layer 314 is attached to the refrigeration layer 312, and the other side is attached to the thermal induction layer 313; the reflective layer 314 can reflect the laser and high-energy light emitted by the refrigeration layer 312. Specifically, the reflective layer 314 can be a back reflector, which prevents the incident laser from directly irradiating the CPO optical module 4 by reflecting the laser signal, thereby eliminating the "dark silicon" problem (i.e., the chip cannot run at full speed due to heat dissipation limitations). Due to the different angles at which the laser enters the prism 3111, some laser and high-energy light may be directed towards the thermal induction layer 313, affecting the detection accuracy of the thermal induction layer 313 on the hot spot of the CPO optical module 4. Based on this, a reflective layer 314 is added between the refrigeration layer 312 and the thermal induction layer 313 to avoid the influence of laser and heat-carrying high-energy light on the thermal induction layer 313, improving the detection accuracy of the thermal induction layer 313 on the hot spot of the heat-generating device. Compared with the traditional back reflector and hot spot detection sensor, the receiving reflective layer 311, the refrigeration layer 312, the thermal induction layer 313, and the reflective layer 314 are integrated in the form of a thin film stack, occupying a small space, and having a high integration level with the 3D stacked IC structure of the CPO optical module.

[0075] Again referring to Figure 3 , the photonic cooling CPO switch further comprises a thermal imaging display instrument 6 electrically connected to the laser and the thermal induction layer 313; the thermal imaging display instrument 6 can acquire the hot spot area detected by the first photonic thin film cold plate 3 and drive the laser to emit laser to one or more prisms 3111 above the hot spot area. In this embodiment, the laser is a compound eye laser 7 that can rotate at 360° high speed, which is arranged directly above the first photonic thin film cold plate 3, and the laser can be emitted to any corner inside the switch, fully covering the first photonic thin film cold plate 3, i.e., fully covering the heat-generating device; and the compound eye laser 7 can emit one or multiple lasers at the same time, and the corresponding laser emission angle is adjustable. After the thermal imaging display instrument 6 receives the hot spot information of each thermal induction layer 313, it drives the laser responsible for the corresponding hot spot area on the compound eye laser 7 to move to the corresponding angle, so that the emitted laser can accurately shoot towards the prism 3111 above the hot spot. Through the thermal imaging display instrument 6, the high heat flux concentration area inside the CPO switch is detected, and the chip hot spot is sensed. When the hot spot appears, the laser irradiates the prism 3111 above the hot spot, stimulates the photonic process, and absorbs heat, ultimately achieving precise cooling.

[0076] Further, a plurality of first clamping grooves 51 are vertically formed on the CPO fixing support 5; a plurality of second clamping grooves 52 are formed on the top surface of the CPO fixing support 5; the second clamping grooves 52 are in communication with the plurality of first clamping grooves 51; the plurality of CPO optical modules 4 are correspondingly clamped with the plurality of first clamping grooves 51, and the plurality of first photonic thin film cold plates 3 are correspondingly clamped with the plurality of second clamping grooves 52, so that the top surface of the CPO optical module 4 and the bottom surface of the first photonic thin film cold plate 3 form a face-to-face contact. Specifically, the first clamping groove 51 is clamped with the shell of the CPO optical module 4, so that the shell top plate of the CPO optical module 4 is flush or protrudes from the horizontal plane of the first clamping groove 51. The first clamping groove 51 improves the relative position accuracy of the shell of the CPO optical module 4 and the first photonic thin film cold plate 3, thereby ensuring the accuracy of the prism 3111 receiving laser light, and finally achieving precise cooling of the hot spot area. The second clamping groove 52 is used to support the first photonic thin film cold plate 3, so that the bottom surface of the first photonic thin film cold plate 3 abuts against the shell top plate of the CPO optical module 4, and heat conduction is achieved. In addition, a third clamping groove and a fourth clamping groove are also formed at the center position of the CPO fixing support 5, the third clamping groove is arranged similarly to the first clamping groove 51, and the fourth clamping groove is arranged similarly to the second clamping groove 52, so that the shell top plate of the switch main control chip 2 abuts against the photonic cold plate 31 above it.

[0077] In the embodiment, the switch main control chip 2 is arranged at the center position of the top surface of the switch main board 1, and four groups of CPO optical module combinations are arranged at the front, rear, left and right edge positions on the top surface of the switch main board 1. Each group of CPO optical module combination is arranged with a plurality of CPO optical modules 4 along the edge line of the top surface of the switch main board 1, and a photonic cold plate 31 is arranged above each group of CPO optical module combination. A photonic cold plate 31 is also arranged above the switch main control chip 2, so that the four photonic cold plates 31 above the four groups of CPO optical module combinations are arranged around the photonic cold plate 31 above the switch main control chip 2, as shown in Figure 3 The compound eye laser 7 emits laser light to each photonic cold plate 31, which reduces the amplitude of the laser head that needs to be adjusted by the compound eye laser 7, and improves the response speed of the compound eye laser 7.

[0078] In an embodiment, the laser is arranged above the plurality of first photonic thin film cold plates 3 and is installed in the interior of the switch shell 9. The laser can adjust the wavelength of the emitted laser light. Specifically, the laser can emit a wavelength of light according to the refrigeration material, flexibly adjust the controllable temperature range of the first photonic thin film cold plate 3, and improve the adaptability of temperature regulation for different temperature-sensitive optical elements and heat-generating devices.

[0079] In another embodiment, as shown in Figure 5 and Figure 6As shown, the CPO optical module 4 includes optical fibers 41 and a plurality of heat generating devices and a plurality of second photonic thin film cold plates 42; the plurality of heat generating devices are provided with the plurality of second photonic thin film cold plates 42 one by one in a one-to-one correspondence; one end of the optical fiber 41 is connected to the second photonic thin film cold plate 42 in parallel with the plurality of waveguides, and the other end extends out of the CPO optical module 4 and is connected to the external laser light source 8; the second photonic thin film cold plate 42 can detect the hot spot position of the heat generating device, and emit laser light to the optical fiber 41 through the external laser light source 8, so that the second photonic thin film cold plate 42 performs photonic refrigeration. Compared with the "on-chip cooling" of the previous embodiment, in this embodiment, the photonic thin film cold plate is built-in in the CPO optical module 4, and "on-chip cooling" is performed, which directly cools the heat source, optimizes the process of conducting cold energy through the shell, and greatly improves the cooling efficiency of the heat generating device. Specifically, the second photonic thin film cold plate 42 is provided in analogy to the first photonic thin film cold plate 3, and the structure and cooling principle are consistent, and the only difference is the different installation position. The external laser light source 8 is provided inside the switch shell 9, and the external laser light source 8 is connected to the optical fiber 41. The optical fiber 41 transmits laser light to the corresponding second photonic thin film cold plate 42 through the waveguide, and provides laser light for the second photonic thin film cold plate 42 built-in in the CPO optical module 4. As shown in the figure, Figure 5 As shown, the optical fiber 41 directly irradiates the center of the second photonic thin film cold plate 42 at the bottom of the heat generating device through the waveguide, and the laser light covers the entire second photonic thin film cold plate 42, achieving the purpose of directly cooling the chip and refrigerating from the heat source.

[0080] In this embodiment, the CPO optical module 4 is a 3D stacked IC structure, including a chip 43, a DFB laser 44 (distributed feedback laser), a photonic integrated chip 45, an intermediate plate 46, a PCB plate 47 and an FAU 48 (fiber array unit); wherein the photonic integrated chip 45, the intermediate plate 46 and the PCB plate 47 are stacked in sequence along the vertical direction and are electrically connected through contacts; the heat generating devices include the chip 43 and the DFB laser 44; the chip 43 and the DFB laser 44 are provided inside the photonic integrated chip 45 and the intermediate plate 46 in a corresponding manner, and the heat generating devices are connected through waveguides, which occupies a small space and is easy to integrate inside the CPO optical module 4 of the 3D stacked IC structure. The waveguide structure and the optical fiber 41 are connected through the FAU 48, and the external laser light source 8 transmits laser light to the hot spot area needing to be cooled, i.e. the corresponding second photonic thin film cold plate 42, through the optical fiber 41 and the waveguide structure, and performs photonic refrigeration; of course, laser light can also be emitted directly to all second photonic thin film cold plates 42 to cool all heat generating devices.

[0081] Further, the second photonic thin film cold plate 42 is arranged on the side of the heat generating device away from the top plate of the shell of the CPO light module 4. Since the shell of the CPO light module 4 has heat dissipation capability, the heat of the CPO light module 4 is mainly concentrated in the inside and the bottom thereof, and based on this, the second photonic thin film cold plate 42 is abutted to the bottom surface of the heat generating device, so that the area where the heat is concentrated in the inside of the CPO light module 4 can be efficiently cooled. Alternatively, the second photonic thin film cold plate 42 is arranged on the bottom plate of the heat generating device in the inside of the CPO light module 4, so that "on-chip cooling" is realized, and the entire heat generating device above the second photonic thin film cold plate 42 is cooled, and the heat is removed from the heat source. At the same time, the first photonic thin film cold plate 3 is arranged on the top plate of the shell of the CPO light module 4, so that "on-chip cooling" is realized, and the heat spots reaching or exceeding the threshold value are detected by the thermal sensing layer 313 of the first photonic thin film cold plate 3, and the compound eye laser 7 is controlled to emit laser to the corresponding prism 3111, so as to reduce the local heat spots. The "on-chip cooling" cooperates with the "on-chip cooling" to cool the heat generating device, and the "on-chip cooling" is mainly used, and the "on-chip cooling" is auxiliary, so that the response speed of temperature regulation is effectively improved, and finally the efficient and accurate cooling of the heat spots is realized.

[0082] In addition, whether it is "on-chip cooling" or "on-chip cooling", the thin film structure occupies very small space and does not affect the integration of photonic cooling corresponding to air cooling and / or liquid cooling. When multiple cooling modes are integrated, the cooling efficiency of the heat generating device can be further improved.

[0083] Secondly, the photonic cooling CPO switch further comprises a switch shell 9; the switch mainboard 1, the switch main control chip 2, the laser, the first photonic thin film cold plate 3, the CPO light module 4, the external laser light source 8 and the optical fiber 41 are all built-in in the switch shell 9; and a radiation-absorbing heat dissipation coating is coated on the inner wall of the switch shell 9. Specifically, the switch shell 9 is a cuboid, and the radiation-absorbing heat dissipation coating is coated on the six inner walls of the switch shell 9, so that when the high-energy light carrying heat emitted by the prism 3111 is directed to the switch shell 9, the radiation-absorbing heat dissipation coating can achieve the effect of radiation heat dissipation.

[0084] It should be understood that the description of the specific embodiments of the present application is only for the purpose of illustrating the technical route and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and to implement it, but the present application is not limited to the above specific embodiments. Any changes or modifications made within the scope of the technical solution of the present application shall be covered within the protection scope of the present application.

Claims

1. A photonic-cooled CPO switch, characterized in that, The photonic cooled CPO switch includes a switch motherboard (1), a switch main control chip (2), a laser, a first photonic thin film cold plate (3), and multiple CPO optical modules (4); the CPO optical module (4) is a CPO optical module with a 3D stacked IC structure; The main control chip (2) of the switch is located at the center of the top surface of the main board of the switch (1); a plurality of CPO optical modules (4) are arranged around the main control chip (2) on the top surface of the main board of the switch (1); the first photonic thin film cold plate (3) is arranged on the top surface of the main control chip (2) and the plurality of CPO optical modules (4); The first photonic thin-film cold plate (3) includes multiple photonic cold plates (31); the photonic cold plate (31) includes a receiving and reflecting layer (311), a cooling layer (312) and a thermal sensing layer (313) that are sequentially attached vertically from top to bottom; the top of the receiving and reflecting layer (311) is constructed as an array of multiple prisms (3111); the prisms (3111) can focus the incident laser onto the cooling layer (312); the cooling layer (312) can absorb the laser focused by the prisms (3111) to perform photonic cooling and reflect high-energy light, which is emitted through the prisms (3111); the thermal sensing layer (313) can detect the hot spot position of the CPO optical module (4) or the main control chip (2) of the switch, guide the laser to emit laser light from the prisms (3111) above the hot spot, and focus the laser onto the cooling layer (312) to perform photonic cooling.

2. The photonic-cooled CPO switch according to claim 1, characterized in that, The photonic cooling CPO switch also includes a CPO fixing bracket (5) for fixing the first photonic thin film cold plate (3); The bottom end of the CPO mounting bracket (5) is connected to the main control chip (2) of the switch and the CPO optical module (4); Multiple photonic cold plates (31) are snapped into the top of the CPO fixing bracket (5) in a one-to-one correspondence.

3. The photonic-cooled CPO switch according to claim 2, characterized in that, The first photonic thin film cold plate (3) also includes a reflective layer (314); One side of the reflective layer (314) is attached to the cooling layer (312), and the other side is attached to the thermal sensing layer (313); the reflective layer (314) can reflect laser and high-energy light emitted through the cooling layer (312).

4. The photonic-cooled CPO switch according to claim 2, characterized in that, The photonic cooling CPO switch also includes a thermal imaging display (6) that is electrically connected to the laser and the thermal sensing layer (313). The thermal imaging display (6) can acquire the hot spot area detected by the first photonic thin film cold plate (3) and drive the laser to emit laser light to one or more of the prisms (3111) above the hot spot area.

5. The photonic-cooled CPO switch according to claim 2, characterized in that, The CPO fixing bracket (5) has multiple through first slots (51) vertically opened along its upper edge; the top surface of the CPO fixing bracket (5) has multiple second slots (52); the second slots (52) are connected to the multiple first slots (51); Multiple CPO optical modules (4) are connected to multiple first card slots (51) in a one-to-one correspondence, and multiple first photonic thin film cold plates (3) are connected to multiple second card slots (52) in a one-to-one correspondence, so that the top surface of the CPO optical module (4) abuts against the bottom surface of the first photonic thin film cold plate (3).

6. The photonic-cooled CPO switch according to any one of claims 1-5, characterized in that, The laser is positioned above a plurality of the first photonic thin film cold plates (3); the laser is capable of adjusting the wavelength of the emitted laser.

7. The photonic-cooled CPO switch according to any one of claims 1-5, characterized in that, The CPO optical module (4) includes an optical fiber (41) and multiple built-in heat-generating devices and multiple second photonic thin-film cold plates (42); the photonic cooled CPO switch also includes an external laser source (8). Multiple second photonic thin film cold plates (42) are provided on each of the multiple heating devices in a corresponding manner; one end of the optical fiber (41) is connected to the second photonic thin film cold plates (42) connected in parallel with multiple waveguides, and the other end extends out of the CPO optical module (4) and is connected to the external laser source (8); The second photonic thin-film cold plate (42) can detect the hot spot location of the heating device and emit laser light to the optical fiber (41) through the external laser light source (8) so that the second photonic thin-film cold plate (42) performs photonic cooling.

8. The photonic-cooled CPO switch according to claim 7, characterized in that, The second photonic thin film cold plate (42) is disposed on the top surface of the housing of the heating device away from the CPO optical module (4).

9. The photonic-cooled CPO switch according to claim 7, characterized in that, The photonic-cooled CPO switch also includes a switch housing (9); The switch motherboard (1), the switch main control chip (2), the laser, the first photonic thin film cold plate (3), the CPO optical module (4), the external laser source (8) and the optical fiber (41) are all built into the switch housing (9). The inner wall of the switch housing (9) is coated with a radiation-absorbing and heat-dissipating coating.

Images