A fluid heat sink

Abstract

The application discloses a fluid heat dissipation device, comprising a heat dissipation unit and a heat source unit, the heat dissipation unit is located on one side of the heat source unit; the heat dissipation unit comprises an encapsulation shell and an adjusting part; the encapsulation shell comprises a first encapsulation part, a second encapsulation part and a third encapsulation part; the third encapsulation part comprises a fluid inlet, the first encapsulation part comprises a first fluid outlet, and the second encapsulation part comprises a second fluid outlet; the adjusting part comprises a support column, a first diaphragm, a first connecting part, a second diaphragm, a second connecting part and a third diaphragm; the support column comprises a sub fluid inlet, the first diaphragm comprises a first sub outlet, the third diaphragm comprises a second sub outlet, and the first sub outlet and the second sub outlet are both not overlapped with the support column along a second direction; the second diaphragm comprises a first point; the distance between the first point and the first encapsulation part is different in different working states of the fluid heat dissipation device. The fluid heat dissipation device provided by the embodiment of the application can effectively improve the overall heat dissipation effect.

Description

Technical Field

[0001] This invention relates to the technical field of electronic devices, and more particularly to a fluid heat dissipation device. Background Technology

[0002] With the rapid adoption of artificial intelligence in consumer electronics, products such as mobile phones, augmented reality glasses, and action cameras are integrating high-performance chips for complex tasks like image recognition, voice interaction, and real-time rendering. However, chips generate a significant amount of heat during high-performance operation. If this heat cannot be dissipated in time, it will lead to overheating, causing performance degradation, response delays, and even system crashes. For consumer electronics, heat dissipation is a particularly critical issue. Summary of the Invention

[0003] This invention provides a fluid heat dissipation device that improves the overall heat dissipation effect of the fluid heat dissipation device by adjusting the state of the second diaphragm under different working conditions.

[0004] This invention provides a fluid heat dissipation device, including a heat dissipation unit and a heat source unit, wherein the heat dissipation unit is located on one side of the heat source unit;

[0005] The heat dissipation unit includes an encapsulated housing and an adjustment section;

[0006] The encapsulation housing includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion; the first encapsulation portion and the second encapsulation portion extend along a first direction, and the third encapsulation portion extends along a second direction connecting the second encapsulation portion and the first encapsulation portion; the cavity formed by the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion houses the adjustment portion; the third encapsulation portion includes a fluid inlet, the first encapsulation portion includes a first fluid outlet, and the second encapsulation portion includes a second fluid outlet;

[0007] The adjustment section includes a support column, a first diaphragm, a first connecting portion, a second diaphragm, a second connecting portion, and a third diaphragm; the first diaphragm is located on the side of the support column away from the first encapsulation section; the first connecting portion is located on the side of the first diaphragm away from the support column, the second diaphragm is located on the side of the first connecting portion away from the first diaphragm, the second connecting portion is located on the side of the second diaphragm away from the first connecting portion, and the third diaphragm is located on the side of the second connecting portion away from the second diaphragm; along the second direction, the first connecting portion, the second connecting portion, and the support column overlap; the support column includes a sub-fluid inlet, the first diaphragm includes a first sub-outlet, and the third diaphragm includes a second sub-outlet; along the second direction, neither the first sub-outlet nor the second sub-outlet overlaps with the support column;

[0008] The second diaphragm includes a first point along the second direction, the first point not overlapping the support column; the distance between the first point and the first encapsulation portion is different under different operating states of the fluid heat dissipation device; the first direction and the second direction intersect.

[0009] Optionally, the second diaphragm further includes a second point, which is located on the side of the first point away from the center of the adjustment section along the first direction; and the second point overlaps with the support column along the second direction.

[0010] The distance between the first point and the first packaging segment is L1, and the distance between the second point and the first packaging segment is L2; ​​L1 and L2 are positive numbers;

[0011] The working state includes a first working state and a second working state;

[0012] In the first operating state, L1 < L2, and in the second operating state, L1 > L2.

[0013] Optionally, the first membrane includes a third point and a fourth point, and the third membrane includes a fifth point and a sixth point; along the second direction, the third point and the fifth point overlap with the first point, and the fourth point and the sixth point overlap with the second point;

[0014] Along the second direction, the distance between the third point and the first point is La, the distance between the fifth point and the first point is Lb, the distance between the fourth point and the second point is Lc, and the distance between the sixth point and the second point is Ld; La, Lb, Lc, and Ld are positive numbers;

[0015] In the first operating state, La < Lc, Lb > Ld; in the second operating state, La > Lc, Lb < Ld.

[0016] Optionally, along the first direction, the fluid inlet and the sub-fluid inlet do not overlap.

[0017] Optionally, the distance between the sub-fluid inlet and the first packaging section is less than the distance between the fluid inlet and the first packaging section.

[0018] Optionally, the total area of ​​the first sub-outlet is less than or equal to the total area of ​​the first fluid outlet, and the total area of ​​the second sub-outlet is less than or equal to the total area of ​​the second fluid outlet.

[0019] Optionally, the fluid cooling device may further include a circuit board;

[0020] Both the heat dissipation unit and the heat source unit are electrically connected to the circuit board.

[0021] Optionally, the adjustment section includes multiple piezoelectric layer structures, each piezoelectric layer structure including a first electrode layer, a piezoelectric layer, and a second electrode layer, wherein along the second direction, the first electrode layer and the second electrode layer are located on both sides of the piezoelectric layer;

[0022] The first diaphragm includes a first substrate, and the piezoelectric layer structure is located on at least one side of the first substrate; the second diaphragm includes a second substrate, and the piezoelectric layer structure is located on at least one side of the second substrate; the third diaphragm includes a third substrate, and the piezoelectric layer structure is located on at least one side of the second substrate; along the second direction, the piezoelectric layer structure does not overlap with the first sub-outlet, and the piezoelectric layer structure does not overlap with the second sub-outlet.

[0023] Optionally, the adjustment section includes an electrode sub-diaphragm, which, along the second direction, does not overlap with the first sub-outlet and the second sub-outlet;

[0024] The first diaphragm includes a first piezoelectric layer and multiple layers of the electrode sub-diaphragms, with a layer of the first piezoelectric layer disposed between two adjacent layers of the electrode sub-diaphragms along the second direction;

[0025] The second diaphragm includes a second piezoelectric layer, and along the second direction, a second piezoelectric layer is disposed between two adjacent electrode sub-diaphragms;

[0026] The third diaphragm includes a third piezoelectric layer, and along the second direction, a third piezoelectric layer is disposed between two adjacent electrode sub-diaphragms.

[0027] Optionally, the first diaphragm includes a first capacitor substrate layer and a first insulating layer, wherein the first capacitor substrate layer is located on the side of the first insulating layer close to the first packaging portion;

[0028] The second diaphragm includes a second capacitor substrate layer, a second insulating layer and a third insulating layer. The second insulating layer is located on the side of the second electrode substrate layer close to the first diaphragm, and the third insulating layer is located on the side of the second electrode substrate layer away from the first diaphragm.

[0029] The third diaphragm includes a third capacitor substrate layer and a fourth insulating layer, wherein the third capacitor substrate layer is located on the side of the fourth insulating layer closer to the second packaging portion.

[0030] This invention provides a fluid heat dissipation device, in which a heat dissipation unit dissipates heat from a heat source unit. The heat dissipation unit includes a housing and an adjustment portion, which is disposed within the space surrounded by the housing. Specifically, the adjustment portion includes a support column, a first diaphragm, a first connecting portion, a second diaphragm, a second connecting portion, and a third diaphragm. The support column, the first diaphragm, the first connecting portion, the second diaphragm, the second connecting portion, and the third diaphragm enclose the space surrounded by the housing into multiple cavity structures. The second diaphragm includes a first point that does not overlap with the support column in a second direction. The distance between the first point and the first housing portion varies depending on the operating state of the fluid heat dissipation device, thus adjusting the shape of the second diaphragm to achieve different heat dissipation effects. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of the first fluid heat dissipation device provided in the embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the structure of the second type of fluid heat dissipation device provided in the embodiments of the present invention;

[0034] Figure 3 This is a schematic diagram of the first working state of a fluid heat dissipation device provided in an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the second working state of a fluid heat dissipation device provided in an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram illustrating the working principle of a fluid heat dissipation device provided in an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of the structure of the third type of fluid heat dissipation device provided in the embodiments of the present invention;

[0038] Figure 7 This is an enlarged schematic diagram of the first adjustment section provided in the embodiment of the present invention;

[0039] Figure 8 This is an enlarged schematic diagram of the second adjustment section provided in the embodiment of the present invention;

[0040] Figure 9This is an enlarged schematic diagram of the third adjustment section provided in the embodiment of the present invention. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be fully described below with reference to the accompanying drawings in the embodiments of this invention, through specific implementation methods. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort fall within the protection scope of this invention.

[0042] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a system, product, or device comprising a series of units is not necessarily limited to those steps or units explicitly listed, but may include other units not explicitly listed or inherent to such products or devices.

[0043] Figure 1 This is a schematic diagram of the structure of the first fluid heat dissipation device provided in the embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of the second type of fluid heat dissipation device provided in the embodiment of the present invention. Figure 3 This is a schematic diagram of the first working state of a fluid heat dissipation device provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of the second working state of a fluid heat dissipation device provided in an embodiment of the present invention, with reference to... Figures 1 to 4As shown, this embodiment of the invention provides a fluid heat dissipation device 10, which includes a heat dissipation unit 100 and a heat source unit 200. The heat dissipation unit 100 is located on one side of the heat source unit 200. The heat dissipation unit 100 includes a housing 110 and an adjustment portion 120. The housing 110 includes a first housing portion 111, a second housing portion 112, and a third housing portion 113. The first housing portion 111 and the second housing portion 112 extend along a first direction X1, and the third housing portion 113 extends along a second direction X2 and connects to the second housing portion 112. The first packaging section 111 and the second packaging section 112 and the third packaging section 113 form a cavity for placing the adjustment section 120; the third packaging section 113 includes a fluid inlet 113a, the first packaging section 111 includes a first fluid outlet 111a, and the second packaging section 112 includes a second fluid outlet 112a; the adjustment section 120 includes a support post 121, a first diaphragm 122, a first connecting portion 123, a second diaphragm 124, a second connecting portion 125, and a third diaphragm 126; the first diaphragm The first diaphragm 122 is located on the side of the support post 121 away from the first encapsulation portion 111; the first connecting portion 123 is located on the side of the first diaphragm 122 away from the support post 121, the second diaphragm 124 is located on the side of the first connecting portion 123 away from the first diaphragm 122, the second connecting portion 125 is located on the side of the second diaphragm 124 away from the first connecting portion 123, and the third diaphragm 126 is located on the side of the second connecting portion 125 away from the second diaphragm 124; along the second direction X2, the first connecting portion 123, the second connecting portion 125, and the support post 121 overlap; the support post 121 includes a sub-fluid inlet 121a, a first diaphragm 122 includes a first sub-outlet 122a, and a third diaphragm 126 includes a second sub-outlet 126a. Along the second direction X2, both the first sub-outlet 122a and the second sub-outlet 126a do not overlap with the support column 121. The second diaphragm 124 includes a first point a1. Along the second direction X2, the first point a1 does not overlap with the support column 121. The distance between the first point a1 and the first encapsulation portion 111 is different under different operating states of the fluid heat dissipation device 10. The first direction X1 and the second direction X2 intersect.

[0044] Among them, reference Figure 1 As shown, this embodiment of the invention provides a fluid heat dissipation device 10, which includes a heat dissipation unit 100 and a heat source unit 200. The heat source unit 200 can be understood as a device that generates heat during operation, such as a chip that needs to be cooled. The heat dissipation unit 100 is located on one side of the heat source unit 200. The fluid discharged by the heat dissipation unit 100 can dissipate heat from the heat source unit 200, preventing the heat generated by the heat source unit 200 from accumulating and affecting the normal operation of the heat source unit 200. The relative positional relationship between the heat source unit 200 and the heat dissipation unit 100 is diverse. For example, Figure 1 The heat source unit 200 can be located on both sides of the heat dissipation unit 100, meaning that fluid for heat dissipation can be discharged from both sides of the heat dissipation unit 100 to cool different heat source units 200. Optionally, the heat dissipation unit 100 can also be located on one side of the heat source unit 200. The specific positions of the heat source unit 100 and the heat dissipation unit 200 can be adjusted adaptively according to actual needs. Figure 1 This is just one example of a relative setting method.

[0045] Among them, reference Figure 1 As shown, the heat dissipation unit 100 includes a housing 110 and an adjustment portion 120. The housing 110 includes a first housing portion 111, a second housing portion 112, and a third housing portion 113. The first housing portion 111 and the second housing portion 112 are disposed opposite to each other. The third housing portion 113 is used to connect the oppositely disposed second housing portion 112 and at least a portion of the first housing portion 111. The adjustment portion 120 is placed in the cavity formed by the first housing portion 111, the second housing portion 112, and the third housing portion 113. In other words, the housing 110 is equivalent to a housing structure that forms a cavity structure for placing the adjustment portion 120.

[0046] Further reference Figure 1 and Figure 2 As shown, the third packaging section 113 includes at least one fluid inlet 113a, which is used to allow fluid media such as gas or liquid to flow into the interior of the heat dissipation unit 100. Figure 1 Taking the third encapsulation portion 113 on both sides, each including a fluid inlet 113a, as an example, the distance is explained. Figure 2 The distance is illustrated using the third encapsulation portion 113 on one side, which includes a fluid inlet 113a, as an example. It should be noted that... Figure 1 and Figure 2 This is a cross-sectional view of the fluid heat dissipation device 10. The overall structure of the fluid heat dissipation device 10 is not limited to... Figure 1 The two fluid inlets 113a shown in the figure are either Figure 2 The diagram shows one or two fluid inlets 113a. The specific number of fluid inlets 113a can be adjusted according to the actual heat dissipation requirements.

[0047] Further reference Figure 1 and Figure 2As shown, the first encapsulation section 111 includes multiple first fluid outlets 111a. The first fluid outlets 111a are used to allow a fluid medium such as gas or liquid to flow out of the heat dissipation unit 100 and then be transmitted to the heat source unit 200. The heat is absorbed by the fluid medium such as gas or liquid, thereby dissipating heat from the heat source unit 200. Optionally, the fluid medium can be a low-temperature gas or liquid from the outside environment. Figure 1 and Figure 2 The first packaging section 111 includes six first fluid outlets 111a as an example. The specific number of first fluid outlets 111a can be adjusted according to actual heat dissipation requirements. This embodiment of the invention does not impose a specific limitation on this.

[0048] Further reference Figure 1 and Figure 2 As shown, the second encapsulation section 112 includes multiple second fluid outlets 112a. These second fluid outlets 112a are also used to allow a fluid medium, such as gas or liquid, to flow out of the heat dissipation unit 100 and then to the heat source unit 200. The fluid medium absorbs heat, thereby dissipating heat from the heat source unit 200. Optionally, the fluid medium can be a low-temperature gas or liquid from the outside environment. Figure 1 and Figure 2 The second packaging section 111 is illustrated by an example, which includes six second fluid outlets 112a. The specific number of second fluid outlets 112a can be adjusted according to actual heat dissipation requirements, and this embodiment of the invention does not impose a specific limitation on this. That is to say, the heat dissipation unit 100 can discharge the fluid medium through the first fluid outlet 112a or through the second fluid outlet 112a, demonstrating the diversity of heat dissipation directions of the heat dissipation unit 100, and thus demonstrating the flexibility of the relative position arrangement between the heat dissipation unit 100 and the heat source unit 200.

[0049] Optional, see reference Figure 2 As shown, the encapsulation housing 110 may further include a fourth encapsulation portion 114, located on the side of the first encapsulation portion 111 away from the second encapsulation portion 112. The fourth encapsulation portion 114 can adjust the fluid medium discharged from the first fluid outlet 111a, thereby adjusting the discharge direction of the fluid medium. Similarly, the encapsulation housing 110 may further include a fifth encapsulation portion 115, located on the side of the second encapsulation portion 112 away from the first encapsulation portion 111. The fifth encapsulation portion 115 can adjust the fluid medium discharged from the second fluid outlet 112a, thereby adjusting the discharge direction of the fluid medium. This further improves the arrangement of the heat dissipation unit 100 and the heat source unit 200.

[0050] It should be noted that, due to the flexibility in the placement of the heat source unit 200, Figure 2 The specific location of the heat source unit 200 is not shown in the text, but can be adjusted according to actual needs.

[0051] Among them, reference Figure 1 As shown, the adjustment section 120 is disposed inside the encapsulation housing 110. The adjustment section 120 can adjust the flow rate or volume of the fluid medium, such as gas or liquid, injected into the heat dissipation unit 100 through the fluid inlet 113a, thereby achieving different degrees of heat dissipation effect. For details, refer to... Figure 1 and Figure 2 As shown, the adjustment section 120 includes a support post 121, a first diaphragm 122, a first connecting portion 123, a second diaphragm 124, a second connecting portion 125, and a third diaphragm 126. The positional relationships of the first diaphragm 122, the first connecting portion 123, the second diaphragm 124, the second connecting portion 125, and the third diaphragm 126 are as follows: the first diaphragm 122 is located on the side of the support post 121 away from the first encapsulation section 111; the first connecting portion 123 is located on the side of the first diaphragm 122 away from the support post 121; the second diaphragm 124 is located on the side of the first connecting portion 123 away from the first diaphragm 122; the second connecting portion 125 is located on the side of the second diaphragm 124 away from the first connecting portion 123; and the third diaphragm 126 is located on the side of the second connecting portion 125 away from the second diaphragm 124. For details, refer to... Figure 1 and Figure 2 As shown, the support column 121, the first diaphragm 122, and part of the first encapsulation portion 111 can form a cavity structure; the first diaphragm 122, the first connecting portion 123, and the second diaphragm 124 can form a cavity structure; the second diaphragm 124, the second connecting portion 125, and the third diaphragm 126 can form a cavity structure; and the third diaphragm 126, the second encapsulation portion 112, the third encapsulation portion 113, and part of the first encapsulation portion 111 can form a cavity structure. The adjustment portion 120, located within the encapsulation housing 110, divides the encapsulation housing 110 into multiple cavity structures. Optionally, the materials of the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126 can be the same, and the materials of the first connecting portion 123 and the second connecting portion 125 can also be the same as the material of the first diaphragm 122, thus reducing the manufacturing cost of the fluid heat dissipation device 10.

[0052] Further reference Figure 1 and Figure 2As shown, the support post 121 includes a sub-fluid inlet 121a. Fluid media entering the encapsulation housing 110 through the fluid inlet 113a can enter the cavity structure enclosed by the support post 121, the first diaphragm 122, and part of the first encapsulation portion 111 through the sub-fluid inlet 121a. The number of sub-fluid inlets 121a can vary, such as... Figure 1 As shown, in the current cross-sectional schematic diagram, the adjusted section 120 includes two sub-fluid inlets 121a, or it can be as follows: Figure 2 In the current cross-sectional schematic diagram, the adjustment section 120 includes a sub-fluid inlet 121a. The specific number of sub-fluid inlets 121a can be adjusted adaptively according to actual needs. This embodiment of the invention does not impose a specific limitation on this.

[0053] Further reference Figure 1 and Figure 2 As shown, the first diaphragm 122 includes a first sub-outlet 122a. Along the second direction X2, the first sub-outlet 122a does not overlap with the support column 121, meaning the first sub-outlet 122a is located near the central region of the first diaphragm 122. Fluid media can flow into the cavity structure formed by the first diaphragm 122, the first connecting portion 123, and the second diaphragm 124 through the first sub-outlet 122a. The third diaphragm 126 includes a second sub-outlet 126a. Along the second direction X2, the second sub-outlets 124a do not overlap with the support column 121, meaning the second sub-outlets 126a are located near the central region of the third diaphragm 126. The number of first sub-outlets 122a and second sub-outlets 126a can vary, and can be as follows: Figure 1 and Figure 2 As shown in the current cross-sectional schematic diagram, the first diaphragm 122 includes six first sub-outlets 122a, and the third diaphragm 126 includes six second sub-outlets 126a. The specific number of first sub-outlets 122a and second sub-outlets 126a can be adaptively adjusted according to actual needs, and this embodiment of the invention does not impose a specific limitation on this. The fluid medium can move into different cavity structures, and the deformation of the first diaphragm 122, second diaphragm 124, and second diaphragm 126 can adjust the air pressure inside different cavity structures, thereby adjusting the flow rate and velocity of the fluid medium, which is beneficial for achieving different degrees of heat dissipation effect on the heat source unit 200.

[0054] For details, please refer to Figure 3 and Figure 4As shown, the second diaphragm 124 includes a first point a1 along the second direction X2. The first point a1 does not overlap with the support column 121. This can be understood as the orthographic projection of the first point a1 on the first encapsulation portion 111 being located on the side of the orthographic projection of the support portion 121 on the first encapsulation portion 111 closer to the center of the adjustment portion 120. The distance between the first point a1 and the first encapsulation portion 111 varies under different operating conditions of the fluid heat dissipation device 10, indicating that the second diaphragm 124 undergoes different degrees of morphological adjustment under different operating conditions of the fluid heat dissipation device 10. This allows for dynamic changes in the volume of the two adjacent cavity structures formed by 124, thereby adjusting the flow rate of the fluid medium at the first fluid outlet 111a and the second fluid outlet 112a, achieving different degrees of heat dissipation effects.

[0055] For example, refer to Figure 3 and Figure 4 These represent two different operating states of the fluid cooling device 10. (Reference) Figure 3 As shown, the distance between the first point a1 and the first encapsulation portion 111 is b1. In this case, the central region of the second diaphragm 124 bends towards the first encapsulation portion 111. (Reference) Figure 4 As shown, the distance between the first point a1 and the first encapsulation portion 111 is b2. In this case, the central region of the second diaphragm 124 bends away from the first encapsulation portion 111. Therefore, b1 is less than b2, meaning that the distance between the first point a1 and the first encapsulation portion 111 is different under different operating conditions of the fluid cooling device 10.

[0056] It should be noted that, Figure 3 and Figure 4 It is a display Figure 1 A schematic diagram of the state of the adjustment section 120 under different operating conditions of the fluid cooling device 10. Figure 2 The state diagrams of the adjustment section 120 under different operating states of the fluid heat dissipation device 10 are similar, and will not be shown individually here. Furthermore, due to the flexibility and diversity of the placement of the heat source unit 200, Figure 3 and Figure 4 The heat source unit 200 is not shown in the diagram.

[0057] In summary, this invention provides a fluid heat dissipation device, in which a heat dissipation unit dissipates heat from a heat source unit. The heat dissipation unit includes a housing and an adjustment portion, which is disposed within the space surrounded by the housing. Specifically, the adjustment portion includes a support column, a first diaphragm, a first connecting portion, a second diaphragm, a second connecting portion, and a third diaphragm. The support column, the first diaphragm, the first connecting portion, the second diaphragm, the second connecting portion, and the third diaphragm enclose the space surrounded by the housing into multiple cavity structures. The second diaphragm includes a first point that does not overlap with the support column in a second direction. The distance between the first point and the first housing portion varies depending on the operating state of the fluid heat dissipation device; that is, by adjusting the shape of the second diaphragm, different heat dissipation effects can be achieved by the fluid heat dissipation device.

[0058] Continue to refer to Figure 1 , Figure 3 and Figure 4 As shown, the second diaphragm 124 also includes a second point a2. Along the first direction X1, the first point a1 is located on the side of the second point a2 away from the center of the adjustment section 120; along the second direction X2, the second point a2 overlaps with the support post 121; the distance between the first point a1 and the first encapsulation section 111 is L1, and the distance between the second point a2 and the first encapsulation section 111 is L2; ​​L1 and L2 are positive numbers; the working state includes a first working state and a second working state; in the first working state, L1 < L2, and in the second working state, L1 > L2.

[0059] Further reference Figure 3 and Figure 4 As shown, the second diaphragm 124 also includes a second point a2, wherein along the second direction X2, the second point a2 overlaps with the support post 121. The region where the second point a2 is located can be understood as the connection region between the second diaphragm 124 and the first connecting portion 123 and the second connecting portion 125. Along the first direction X1, the second point a2 is located on the side of the first point a1 away from the center of the adjustment portion 120. That is, the orthographic projection of the second point a2 on the first packaging portion 111 is located on the side of the orthographic projection of the first point a1 on the first packaging portion 111 away from the orthographic projection of the center of the adjustment portion 120 on the first packaging portion 111.

[0060] Specifically, the working states of the fluid heat dissipation device 10 include a first working state and a second working state. For the first working state, please refer to... Figure 3 As shown, the second working state can be referenced. Figure 4 As shown. Further, see reference. Figure 3As shown, the distance between the first point a1 and the first packaging section 111 is L1, and the distance between the second point a2 and the first packaging section 111 is L2, where L1 < L2. The edge portion of the second diaphragm 124 is used for fixed connection with the first connecting portion 123 and the second connecting portion 125, meaning that the value of L2 is fixed in different working states. Therefore, it can be understood that in the first working state, the middle portion of the second diaphragm 124 bends towards the first packaging section 111, thereby adjusting the volume of different cavity structures.

[0061] Further reference Figure 4 As shown, the distance between the first point a1 and the first packaging section 111 is L1, and the distance between the second point a2 and the first packaging section 111 is L2, where L1 > L2. The edge portion of the second diaphragm 124 is used for fixed connection with the first connecting portion 123 and the second connecting portion 125, that is, the value of L2 is fixed in different working states. Therefore, it can be understood that in the second working state, the middle portion of the second diaphragm 124 bends away from the first packaging section 111, thus achieving adjustment of the volume of different cavity structures.

[0062] Figure 5 This is a schematic diagram illustrating the working principle of a fluid heat dissipation device provided in an embodiment of the present invention. (Refer to...) Figure 1 , Figures 3 to 5 As shown, the first diaphragm 122 includes a third point a3 and a fourth point a4, and the third diaphragm 126 includes a fifth point a5 and a sixth point a6; along the second direction X2, the third point a3 and the fifth point a5 both overlap with the first point, and the fourth point and the sixth point overlap with the second point;

[0063] Along the second direction X2, the distance between the third point a3 and the first point a1 is La, the distance between the fifth point a5 and the first point a1 is Lb, the distance between the fourth point a4 and the second point a2 is Lc, and the distance between the sixth point a6 and the second point a2 is Ld; La, Lb, Lc, and Ld are positive numbers.

[0064] In the first operating state, La < Lc, Lb > Ld; in the second operating state, La > Lc, Lb < Ld.

[0065] For details, please refer to Figure 1 , Figure 3 and Figure 5 As shown, the first diaphragm 122 includes a third point a3 and a fourth point a4, wherein the third point a3 overlaps with the first point a1 along the second direction X2, and the fourth point a4 overlaps with the second point a2 along the second direction X2. Figure 3 and Figure 4It can be seen that the relative positions of the third point a3 and the fourth point d4 are adjusted accordingly under different working conditions, demonstrating that both the first diaphragm 122 and the second diaphragm 124 in the adjustment section 120 can be bent to adjust the volume of the cavity structure. Similarly, refer to Figure 1 , Figure 3 and Figure 5 As shown, the third diaphragm 126 includes a fifth point a5 and a sixth point a6, wherein the fifth point a5 overlaps with the first point a1 along the second direction X2, and the sixth point a6 overlaps with the second point a2 along the second direction X2. Figure 3 and Figure 4 It can be seen that the relative positions of the fifth point a5 and the sixth point a6 are adjusted accordingly under different working conditions, which shows that the third diaphragm 126 and the second diaphragm 124 in the adjustment section 120 can be bent to realize the adjustment of the cavity structure volume.

[0066] Further reference Figure 1 , Figure 3 and Figure 5 As shown, along the second direction X2, the distance between the third point a3 and the first point a1 is La, the distance between the fifth point a5 and the first point a1 is Lb, the distance between the fourth point a4 and the second point a2 is Lc, and the distance between the sixth point a6 and the second point a2 is Ld. The relationship between La and Lc, and the relationship between Lb and Ld, will change under different operating conditions in the fluid heat dissipation section 10.

[0067] For details, please refer to Figure 3As shown, in the first operating state, La < Lc, Lb > Ld. That is, in the first operating state, the center of the first diaphragm 122 bends away from the first packaging section 111, the center of the second diaphragm 124 bends towards the first packaging section 111, and the center of the third diaphragm 126 bends away from the first packaging section 111. Thus, the volume of the cavity structure composed of the support post 121, the first diaphragm 122, and part of the first packaging section 111 increases; the volume of the cavity structure composed of the first diaphragm 122, the first connecting part 123, and the second diaphragm 124 decreases; the volume of the cavity structure composed of the second diaphragm 124, the second connecting part 125, and the third diaphragm 126 increases; and the volume of the cavity structure composed of the third diaphragm 126, the second packaging section 112, the third packaging section 113, and part of the first packaging section 111 decreases. In other words, in the first operating state, the fluid medium input through the fluid inlet 113a flows into the cavity structure composed of the third diaphragm 126, the second encapsulation section 112, the third encapsulation section 113, and part of the first encapsulation section 111. It then enters the cavity structure composed of the second diaphragm 124, the second connecting section 125, and the third diaphragm 126. Because the third diaphragm 125 bends away from the first encapsulation section 111, it to some extent prevents high-temperature gas from flowing into the heat dissipation unit 100 through the second fluid outlet 112a. Simultaneously, the volume of the cavity structure composed of the first diaphragm 122, the first connecting section 123, and the second diaphragm 124 is compressed. The bending action of the second diaphragm 124 allows the fluid medium to pass through the cavity structure composed of the support column 121, the first diaphragm 122, and part of the first encapsulation section 111 at a high speed before flowing out through the first fluid outlet 111a. That is, in this operating state, the fluid medium is mainly discharged through the first fluid outlet 111a. Optionally, the fluid medium transmission path can be referenced... Figure 3 The red arrow in the middle.

[0068] For details, please refer to Figure 4As shown, in the first operating state, La > Lc, Lb < Ld. That is, in the first operating state, the center of the first diaphragm 122 bends towards the side closer to the first encapsulation portion 111, the center of the second diaphragm 124 bends away from the first encapsulation portion 111, and the center of the third diaphragm 126 bends towards the side closer to the first encapsulation portion 111. Thus, the volume of the cavity structure composed of the support post 121, the first diaphragm 122, and part of the first encapsulation portion 111 decreases, while the volume of the cavity structure composed of the first diaphragm 122, the first connecting portion 123, and the second diaphragm 124 increases; the volume of the cavity structure composed of the second diaphragm 124, the second connecting portion 125, and the third diaphragm 126 decreases; and the volume of the cavity structure composed of the third diaphragm 126, the second encapsulation portion 112, the third encapsulation portion 113, and part of the first encapsulation portion 111 increases. This operating process is the reverse of the first operating state, thus, in this operating state, the fluid medium is discharged mainly from the second fluid outlet 112a. Optionally, the transport path for the fluid medium can be referenced. Figure 4 The red arrow in the middle.

[0069] Optionally, the morphology of the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126 can be adjusted by controlling the applied voltage. In other words, structures that deform according to voltage are provided at the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126, thereby causing them to deform. (Reference) Figure 5 As shown, since the motion states of the first diaphragm 122 and the third diaphragm 126 remain constant in all operating states, the voltage applied to the first diaphragm 122 is consistent with the voltage applied to the third diaphragm 126. Since the motion states of the first diaphragm 122 and the second diaphragm 124 remain opposite in all operating states, the voltage applied to the first diaphragm 122 is consistent with the voltage applied to the second diaphragm 124.

[0070] refer to Figure 1 and Figure 2 As shown, along the first direction X1, the fluid inlet 113a and the sub-fluid inlet 121a do not overlap.

[0071] This can also be understood as follows: along the first direction X1, the fluid inlet 113a and the sub-fluid inlet 121a are staggered. This ensures that the fluid medium flowing in through the fluid inlet 113a can partially enter the cavity structure formed by the support column 121, the first diaphragm 122, and part of the first encapsulation section 111. The fluid medium flowing in through the fluid inlet 113a can also partially flow into the cavity structure formed by the third diaphragm 126, the second encapsulation section 112, the third encapsulation section 113, and part of the first encapsulation section 111. This ensures that the fluid heat dissipation device 10 can achieve different operating states, and that the fluid medium used for heat dissipation in the fluid heat dissipation device 10 can flow out through either the first fluid outlet 111a or the second fluid outlet 112a.

[0072] Further reference Figure 1 and Figure 2 As shown, the distance between the sub-fluid inlet 121a and the first packaging section 111 is less than the distance between the fluid inlet 113a and the first packaging section 111.

[0073] For details, please refer to Figure 1 and Figure 2 As shown, the sub-fluid inlet 121a is located on the side of the fluid inlet 113a that is closer to the first encapsulation section 111. This ensures better diversion of the fluid medium entering through the fluid inlet 113a and better prevents all the fluid medium from flowing into the interior through the sub-fluid inlet 121a, thus ensuring that the fluid heat dissipation device 10 can achieve different working states.

[0074] Optional, see reference Figure 1 and Figure 2 As shown, the sub-fluid inlet 121a can be configured to fit snugly against the first packaging section 111. Alternatively, the sub-fluid inlet 121a can be positioned at a certain distance from the first packaging section 111. The specific location of the sub-fluid inlet 121a can be adaptively adjusted according to the actual product dimensions; however, this embodiment of the invention does not impose specific limitations on this.

[0075] refer to Figure 1 and Figure 2 As shown, the total area of ​​the first sub-outlet 122a is less than or equal to the total area of ​​the first fluid outlet 111a, and the total area of ​​the second sub-outlet 126a is less than or equal to the total area of ​​the second fluid outlet 112a.

[0076] For details, please refer to Figure 1 and Figure 2As shown, the fluid cooling device 10 may include a plurality of first sub-outlets 122a, a plurality of second sub-outlets 126a, a plurality of first fluid outlets 111a, and a plurality of second fluid outlets 112a. The first sub-outlets 122a and the first fluid outlets 111a are located on one side of the second diaphragm 124, while the second sub-outlets 126a and the second fluid outlets 112a are located on the other side of the second diaphragm 124.

[0077] Furthermore, the total area of ​​the first sub-outlet 122a is less than or equal to the total area of ​​the first fluid outlet 111a, and the total area of ​​the second sub-outlet 126a is less than or equal to the total area of ​​the second fluid outlet 112a. This ensures that the fluid medium entering the heat dissipation unit 100 can be effectively discharged, preventing the fluid medium from accumulating inside the encapsulation shell 110, thereby ensuring the structural stability and reliability of the fluid heat dissipation device 10.

[0078] Figure 6 This is a schematic diagram of the structure of the third type of fluid heat dissipation device provided in the embodiments of the present invention, for reference. Figure 6 As shown, the fluid heat dissipation device 10 also includes a circuit board 300; the heat dissipation unit 100 and the heat source unit 200 are both electrically connected to the circuit board 300.

[0079] For details, please refer to Figure 6 As shown, the fluid cooling device 10 also includes a circuit board 300, and the heat source unit 200 is electrically connected to the circuit board 300. The circuit board 300 can provide relevant electrical signals to the heat source unit 200 to drive it to work. Furthermore, the circuit board 300 is also electrically connected to the heat dissipation unit 100. The circuit board 300 provides relevant electrical signals to the heat dissipation unit 100, which can drive the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126 in the heat dissipation unit 100 to be in different states, thereby realizing different working states of the fluid cooling device 10 and providing different degrees of heat dissipation effect to the heat source unit 200.

[0080] Optionally, the arrangement of the heat dissipation unit 100 can be varied, and the relative positions of the heat dissipation unit 100 and the heat source unit 200 can also be varied. Therefore, the electrical connection methods between the heat dissipation unit 100 and the heat source unit 200 and the circuit board 300 can also be varied. Figure 6 This invention illustrates only one connection method for illustrative purposes. Specific connection methods can be adapted to meet actual needs, and this embodiment of the invention does not impose any specific limitations on them.

[0081] For example, refer to Figure 6As shown, the heat dissipation unit 100 can be electrically connected to the circuit board 300 via the first connection terminal 410. The first connection terminal 411 includes a first connection portion 411a and a second connection portion 411b, where the first connection portion 411a can be understood as the transmission of a voltage-related signal, and the second connection portion 411b can be understood as a ground signal. The heat source unit 200 can be electrically connected to the circuit board 300 via the second connection terminal 420.

[0082] Figure 7 This is an enlarged schematic diagram of the first adjustment section provided in the embodiment of the present invention, for reference. Figure 7 As shown, the adjustment section 120 includes multiple piezoelectric layer structures 130. Each piezoelectric layer structure 130 includes a first electrode layer 131, a piezoelectric layer 132, and a second electrode layer 133. Along the second direction X2, the first electrode layer 131 and the second electrode layer 133 are located on opposite sides of the piezoelectric layer 132. The first diaphragm 122 includes a first substrate 141, and the piezoelectric layer structure 130 is located on at least one side of the first substrate 141. The second diaphragm 124 includes a second substrate 142, and the piezoelectric layer structure 130 is located on at least one side of the second substrate 142. The third diaphragm 126 includes a third substrate 143, and the piezoelectric layer structure 130 is located on at least one side of the second substrate 142. Along the second direction X2, the piezoelectric layer structure 130 does not overlap with the first sub-outlet 122a, and the piezoelectric layer structure 130 does not overlap with the second sub-outlet 126a.

[0083] Further reference Figure 7 As shown, the adjustment section 120 includes multiple piezoelectric layer structures 130. Each piezoelectric layer structure 130 includes a first electrode layer 131, a piezoelectric layer 132, and a second electrode layer 133. Along the second direction X2, the first electrode layer 131 and the second electrode layer 133 are located on both sides of the piezoelectric layer 132. The first electrode layer 131 can be understood as the top electrode, and the second electrode layer 133 as the bottom electrode. The first electrode layer 131, piezoelectric layer 132, and second electrode layer 133 form a "sandwich" structure. The material of the piezoelectric layer 132 can include at least one or more of lead zirconate titanate (PZT), aluminum nitride (AlN), aluminum nitride-doped (ScAlN), and lithium niobate (LiNbO3). The materials of the first electrode layer 131 and the second electrode layer 133 are selected based on the material of the piezoelectric layer 132 to better fit the structure, such as molybdenum, gold, titanium, or platinum. The specific materials of the piezoelectric layer structure 132 can be adaptively adjusted according to actual needs.

[0084] The piezoelectric layer structure 130 can deform to different degrees depending on the different electrical signals it receives. Furthermore, the piezoelectric layer structure 130 is disposed on the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126. Under different operating conditions, the piezoelectric layer structure 130 can drive the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126 to produce different deformation effects according to the different electrical signals received, thereby enabling the fluid medium to be discharged from the first fluid outlet 111a or the second fluid outlet 112a, achieving different operating states.

[0085] For details, please refer to Figure 7 As shown, the first diaphragm 122 includes a first substrate 141, and the piezoelectric layer structure 130 is located on at least one side of the first substrate 141. Figure 7 The example is illustrated by showing a piezoelectric layer structure 130 disposed on one side of the first substrate 141. Along the second direction X2, the piezoelectric layer structure 130 does not overlap with either the first sub-outlet 122a or the second sub-outlet 126a; that is, the piezoelectric structure 130 disposed in the first diaphragm 122 is only disposed in the edge region of the first diaphragm 122. Similarly, refer to... Figure 7 As shown, the second diaphragm 124 includes a second substrate 142, and the piezoelectric layer structure 130 is located on at least one side of the second substrate 142. Figure 7 The example shown is an example of a piezoelectric layer structure 130 disposed on one side of the second substrate 142. Along the second direction X2, the piezoelectric layer structure 130 does not overlap with either the first sub-outlet 122a or the second sub-outlet 126a. In other words, the piezoelectric structure 130 disposed in the second diaphragm 124 is only located at the edge region of the first diaphragm 122 and will not interfere with the first sub-outlet 122a or the second sub-outlet 126a. Similarly, refer to... Figure 7 As shown, the third diaphragm 126 includes a third substrate 143, and the piezoelectric layer structure 130 is located on at least one side of the third substrate 143. Figure 7 The example is illustrated by having a piezoelectric layer structure 130 disposed on one side of the third substrate 143. Along the second direction X2, the piezoelectric layer structure 130 does not overlap with either the first sub-outlet 122a or the second sub-outlet 126a. In other words, the piezoelectric structure 130 disposed in the third diaphragm 126 is only located at the edge region of the first diaphragm 122 and will not interfere with the first sub-outlet 122a or the second sub-outlet 126a.

[0086] Furthermore, in combination Figure 3 and Figure 4 As shown, the deformation of the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126 in the fluid heat dissipation device 10 is due to the piezoelectric layer structure 130 receiving different potential signals, as illustrated in the example. Figure 3This shows the fluid cooling device 10 in its first operating state. Figure 4 This shows the fluid cooling device 10 in its second operating state.

[0087] Figure 8 This is an enlarged schematic diagram of the second adjustment section provided in the embodiment of the present invention, for reference. Figure 8 As shown, the adjustment section 120 includes an electrode sub-film 150. Along the second direction X2, the electrode sub-film 150 does not overlap with the first sub-outlet 122a, and the electrode sub-film 150 does not overlap with the second sub-outlet 126a. The first film 122 includes a first piezoelectric layer 161 and multiple electrode sub-films 150. Along the second direction X2, a first piezoelectric layer 161 is disposed between two adjacent electrode sub-films 150. The second film 124 includes a second piezoelectric layer 162. Along the second direction X2, a second piezoelectric layer 162 is disposed between two adjacent electrode sub-films 150. The third film 126 includes a third piezoelectric layer 163. Along the second direction X2, a third piezoelectric layer 163 is disposed between two adjacent electrode sub-films 150.

[0088] Further reference Figure 8 As shown, the first diaphragm 122 includes a first piezoelectric layer 161, and the adjustment portion further includes a plurality of electrode sub-diaphragms 150, wherein the electrode sub-diaphragms 150 are disposed at the first piezoelectric layer 161. Further, along the second direction X2, the electrode sub-diaphragms 150 do not overlap with the first sub-outlet 122a and the second sub-outlet 126a; that is, the electrode sub-diaphragms 150 are only disposed in the edge region of the first diaphragm 122. Further, referring to… Figure 8 As shown, the number of electrode sub-films 150 on the first film 122 can be multiple. Along the second direction X2, a first piezoelectric layer 161 is disposed between two adjacent electrode sub-films 150. The structure formed by the first piezoelectric layer 161 and the two adjacent electrode sub-films 150 is equivalent to a "sandwich" structure. For example, refer to... Figure 8 As shown, the first diaphragm 122 includes three electrode sub-diaphragms 150, and a first piezoelectric layer 161 exists between two adjacent electrode sub-diaphragms 150. Therefore, the three electrode sub-diaphragms 150 form two sets of "sandwich" structures. Compared with a single "sandwich" structure, the deformation adjustment effect of the first diaphragm 122 is better when receiving electrical signals.

[0089] Similarly, refer to Figure 8As shown, the second diaphragm 124 includes a second piezoelectric layer 162, wherein an electrode sub-diaphragm 150 is disposed on the second piezoelectric layer 162. Furthermore, the electrode sub-diaphragm 150 disposed on the second diaphragm 124 does not overlap with either the first sub-outlet 122a or the second sub-outlet 126a along the second direction X2; that is, the electrode sub-diaphragm 150 is only disposed in the edge region of the second diaphragm 124. Further, refer to... Figure 8 As shown, the number of electrode sub-films 150 on the second film 124 can be multiple. Along the second direction X2, a second piezoelectric layer 162 is disposed between two adjacent electrode sub-films 150. The structure formed by the second piezoelectric layer 162 and the two adjacent electrode sub-films 150 is equivalent to a "sandwich" structure. For example, refer to... Figure 8 As shown, the second diaphragm 124 includes three electrode sub-diaphragms 150, and a second piezoelectric layer 162 exists between two adjacent electrode sub-diaphragms 150. Therefore, the three electrode sub-diaphragms 150 form two sets of "sandwich" structures. Compared with a single "sandwich" structure, the deformation adjustment effect of the second diaphragm 124 is better when receiving electrical signals.

[0090] Similarly, refer to Figure 8 As shown, the third diaphragm 126 includes a third piezoelectric layer 163. The electrode sub-diaphragm 150 disposed on the third diaphragm 126 does not overlap with either the first sub-outlet 122a or the second sub-outlet 126a along the second direction X2; that is, the electrode sub-diaphragm 150 is only disposed in the edge region of the third diaphragm 126. Further, refer to… Figure 8 As shown, the number of electrode sub-films 150 on the third film 126 can be multiple. Along the second direction X2, a third piezoelectric layer 163 is disposed between two adjacent electrode sub-films 150. The structure formed by the third piezoelectric layer 163 and the two adjacent electrode sub-films 150 is equivalent to a "sandwich" structure. For example, refer to... Figure 8 As shown, the third diaphragm 126 includes three electrode sub-diaphragms 150, and a third piezoelectric layer 163 exists between two adjacent electrode sub-diaphragms 150. Therefore, the three electrode sub-diaphragms 150 form two sets of "sandwich" structures. Compared with a single "sandwich" structure, the deformation adjustment effect of the third diaphragm 126 is better when receiving electrical signals.

[0091] Figure 9 This is an enlarged schematic diagram of the third adjustment section provided in the embodiment of the present invention, for reference. Figure 9As shown, the first diaphragm 122 includes a first capacitor substrate layer 171 and a first insulating layer 172, with the first capacitor substrate layer 171 located on the side of the first insulating layer 172 close to the first packaging portion 111; the second diaphragm 124 includes a second capacitor substrate layer 173, a second insulating layer 174 and a third insulating layer 175, with the second insulating layer 174 located on the side of the second electrode substrate layer 173 close to the first diaphragm 122, and the third insulating layer 175 located on the side of the second electrode substrate layer 173 away from the first diaphragm 122; the third diaphragm 126 includes a third capacitor substrate layer 176 and a fourth insulating layer 177, with the third capacitor substrate layer 176 located on the side of the fourth insulating layer 177 close to the second packaging portion 112.

[0092] For details, please refer to Figure 9 As shown, the first diaphragm 122 includes a first capacitor substrate layer 171, the second diaphragm 124 includes a second capacitor substrate layer 173, and the third diaphragm 126 includes a third capacitor electrode layer 176. The first capacitor substrate layer 171, the second capacitor substrate layer 173, and the third capacitor substrate layer 176 are all disposed opposite each other along the second direction X2, forming a capacitive film structure. This allows for electrostatic driving to control the relative movement of the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126. Furthermore, to prevent short circuits between adjacent capacitor substrate layers along the second direction X2, a first insulating layer 172 is provided at the first diaphragm 122, a second insulating layer 174 and a third insulating layer 175 are provided at the second diaphragm 124, and a fourth insulating layer 177 is provided at the third diaphragm 126. (Refer to...) Figure 9 As shown, the first capacitor substrate layer 171 is located on the side of the first insulating layer 172 close to the first package portion 111, the second insulating layer 174 is located on the side of the second electrode substrate layer 173 close to the first diaphragm 122, the third insulating layer 175 is located on the side of the second electrode substrate layer 173 away from the first diaphragm 122, and the third capacitor substrate layer 176 is located on the side of the fourth insulating layer 177 away from the second diaphragm 124.

[0093] In general, combining Figures 7 to 9 The arrangement of the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126 is diverse, and it should be noted that... Figures 7 to 9 To illustrate the specific structures of the first diaphragm 122, the second diaphragm 124, and the third diaphragm 126, the first connecting portion 123 and the second connecting portion 125 are not shown.

[0094] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A fluid heat dissipation device, characterized in that, It includes a heat dissipation unit and a heat source unit, wherein the heat dissipation unit is located on one side of the heat source unit; The heat dissipation unit includes an encapsulated housing and an adjustment section; The encapsulation housing includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion; the first encapsulation portion and the second encapsulation portion extend along a first direction, and the third encapsulation portion extends along a second direction to connect the second encapsulation portion and the first encapsulation portion; The adjustment section is placed in the cavity formed by the first packaging section, the second packaging section, and the third packaging section; the third packaging section includes a fluid inlet, the first packaging section includes a first fluid outlet, and the second packaging section includes a second fluid outlet. The adjustment section includes a support column, a first diaphragm, a first connecting portion, a second diaphragm, a second connecting portion, and a third diaphragm; the first diaphragm is located on the side of the support column away from the first encapsulation section; the first connecting portion is located on the side of the first diaphragm away from the support column, the second diaphragm is located on the side of the first connecting portion away from the first diaphragm, the second connecting portion is located on the side of the second diaphragm away from the first connecting portion, and the third diaphragm is located on the side of the second connecting portion away from the second diaphragm; along the second direction, the first connecting portion, the second connecting portion, and the support column overlap; the support column includes a sub-fluid inlet, the first diaphragm includes a first sub-outlet, and the third diaphragm includes a second sub-outlet; along the second direction, neither the first sub-outlet nor the second sub-outlet overlaps with the support column; The second diaphragm includes a first point along the second direction, the first point not overlapping the support post; the distance between the first point and the first encapsulation portion is different under different operating states of the fluid heat dissipation device; The first direction and the second direction intersect; A portion of the fluid medium flowing in through the fluid inlet enters the cavity structure volume composed of the support column, the first diaphragm, and part of the first packaging section, while another portion of the fluid medium flowing in through the fluid inlet flows into the cavity structure composed of the third diaphragm, the second packaging section, the third packaging section, and part of the first packaging section. The second diaphragm further includes a second point, which is located on the side of the first point away from the center of the adjustment section along the first direction; and the second point overlaps with the support column along the second direction. The distance between the first point and the first packaging segment is L1, and the distance between the second point and the first packaging segment is L2; ​​L1 and L2 are positive numbers; The working state includes a first working state and a second working state; In the first operating state, L1 < L2, and in the second operating state, L1 > L2.

2. The fluid heat dissipation device according to claim 1, characterized in that, The first membrane includes a third point and a fourth point, and the third membrane includes a fifth point and a sixth point; along the second direction, the third point and the fifth point overlap with the first point, and the fourth point and the sixth point overlap with the second point; Along the second direction, the distance between the third point and the first point is La, the distance between the fifth point and the first point is Lb, the distance between the fourth point and the second point is Lc, and the distance between the sixth point and the second point is Ld; La, Lb, Lc, and Ld are positive numbers; In the first operating state, La < Lc, Lb > Ld; in the second operating state, La > Lc, Lb < Ld.

3. The fluid heat dissipation device according to claim 1, characterized in that, Along the first direction, the fluid inlet and the sub-fluid inlet do not overlap.

4. The fluid heat dissipation device according to claim 3, characterized in that, The distance between the sub-fluid inlet and the first packaging section is less than the distance between the fluid inlet and the first packaging section.

5. The fluid heat dissipation device according to claim 1, characterized in that, The total area of ​​the first sub-outlet is less than or equal to the total area of ​​the first fluid outlet, and the total area of ​​the second sub-outlet is less than or equal to the total area of ​​the second fluid outlet.

6. The fluid heat dissipation device according to claim 1, characterized in that, The fluid cooling device also includes a circuit board; Both the heat dissipation unit and the heat source unit are electrically connected to the circuit board.

7. The fluid heat dissipation device according to claim 1, characterized in that, The adjustment section includes multiple piezoelectric layer structures, each piezoelectric layer structure including a first electrode layer, a piezoelectric layer, and a second electrode layer. Along the second direction, the first electrode layer and the second electrode layer are located on both sides of the piezoelectric layer. The first diaphragm includes a first substrate, and the piezoelectric layer structure is located on at least one side of the first substrate; the second diaphragm includes a second substrate, and the piezoelectric layer structure is located on at least one side of the second substrate; the third diaphragm includes a third substrate, and the piezoelectric layer structure is located on at least one side of the second substrate; along the second direction, the piezoelectric layer structure does not overlap with the first sub-outlet, and the piezoelectric layer structure does not overlap with the second sub-outlet.

8. The fluid heat dissipation device according to claim 1, characterized in that, The adjustment section includes an electrode sub-diaphragm, which, along the second direction, does not overlap with the first sub-outlet and does not overlap with the second sub-outlet; The first diaphragm includes a first piezoelectric layer and multiple layers of the electrode sub-diaphragms, with a layer of the first piezoelectric layer disposed between two adjacent layers of the electrode sub-diaphragms along the second direction; The second diaphragm includes a second piezoelectric layer, and along the second direction, a second piezoelectric layer is disposed between two adjacent electrode sub-diaphragms; The third diaphragm includes a third piezoelectric layer, and along the second direction, a third piezoelectric layer is disposed between two adjacent electrode sub-diaphragms.

9. The fluid heat dissipation device according to claim 1, characterized in that, The first diaphragm includes a first capacitor substrate layer and a first insulating layer, wherein the first capacitor substrate layer is located on the side of the first insulating layer close to the first package portion; The second diaphragm includes a second capacitor substrate layer, a second insulating layer and a third insulating layer. The second insulating layer is located on the side of the second capacitor substrate layer closer to the first diaphragm, and the third insulating layer is located on the side of the second capacitor substrate layer away from the first diaphragm. The third diaphragm includes a third capacitor substrate layer and a fourth insulating layer, wherein the third capacitor substrate layer is located on the side of the fourth insulating layer closer to the second packaging portion.

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