A detection method for a high-precision flexible plate for intelligent networked vehicles

Abstract

A kind of detection method of high-precision flexible plate for intelligent networked vehicle, according to design data, flexible core plate is formed by processing, and the flexible core plate includes pad;Then the first socket is welded to the pad, forming a welded plate;Form a test adapter plate including rigid area and flexible area;The second socket is provided in the flexible area, and the test pad is provided in the rigid area;Second socket and test pad are electrically connected;The test adapter plate and the welded plate are connected, including the second socket is inserted into the first socket, then the test pad is tested by using test machine, and the detection is completed;Through welding the first socket, the test adapter plate containing the second socket is manufactured, a stable current loop and a voltage test loop are established, the identification accuracy of the line gap, micro short circuit, line young and other micro defects of the line is improved, the transmission stability of the line is guaranteed, and the problems such as traditional low resistance test due to high pad degree, easy to appear probe contact, miscontact or poor contact and other problems are effectively avoided.

Description

A testing method for high-precision flexible plates used in intelligent connected vehicles Technical Field

[0001] This invention relates to the field of circuit board processing, and more particularly to a method for testing high-precision flexible boards for intelligent connected vehicles. Background Technology

[0002] For a certain type of precision module used in driver assistance systems, stable operation relies on the performance support of high-precision flexible boards (i.e., flexible circuit boards). As a key carrier for signal transmission and energy conduction, such flexible boards have stringent requirements for circuit precision. Even minor defects in the circuits can lead to signal delay or transmission distortion, thereby affecting the core functions of driver assistance systems such as environmental recognition and distance judgment, and causing safety hazards.

[0003] Currently, conventional electrical testing methods for flexible boards in the industry have limitations. They can only accurately identify obvious faults such as open circuits and short circuits, but they are difficult to detect hidden defects such as wire gaps, micro-short circuits, thin wires, or insufficient copper thickness in vias. Because the conductivity of the circuit is not completely destroyed, these defects are easily missed in conventional electrical testing. Once applied to the long-term operation or complex working environment of assisted driving systems, they may gradually deteriorate and cause module failure. To solve this problem, low-resistance testing technology is widely used in the testing process of such high-precision flexible boards.

[0004] The core principle of low resistance testing is as follows: by applying a preset micro-current to the pads at both ends of the line, the voltage signals at both ends of the line are collected simultaneously, the actual resistance value of the line is calculated by computer, and then compared with the preset standard resistance value, so as to accurately determine whether the line has the above-mentioned hidden defects.

[0005] The implementation of this testing method relies on a four-wire test architecture: that is, two pins need to contact the same pad at the same time. The two pairs of pins correspond to the two pads at both ends of the line. One pair of pins is responsible for providing a stable micro current, while the other pair of pins focuses on voltage signal acquisition. By separating the current loop and the voltage test loop, a low-resistance test is formed.

[0006] However, in practical applications, low-resistance testing faces two major technical challenges:

[0007] (1) Due to the miniaturization and high-density integration requirements of precision modules in the driver assistance system, the pad density of the flexible board is extremely high and the precision is strict. The design of the same pad needs to contact two probes at the same time is very easy to cause problems such as the probes not being able to contact the pads, accidentally contacting adjacent pads, or poor contact caused by uneven contact pressure. This directly leads to consequences such as inability to measure and distortion of measurement data, which seriously affects the reliability of the test.

[0008] (2) After the flexible board completes the low resistance test, the components need to be soldered and assembled. However, the high temperature and mechanical stress during the soldering process may affect the structural integrity or contact performance of the precision pads, causing the circuit resistance to change. If the flexible board is retested for low resistance, it will not only increase the additional testing time and equipment wear, but may also cause secondary damage to the pads due to repeated testing, significantly increasing production costs.

[0009] Based on the above background and problems, there is a need to provide a new method for testing high-precision flexible plates for intelligent connected vehicles. Summary of the Invention

[0010] This invention aims to solve the comprehensive problems of difficulty in judging hidden defects in the lower circuitry of high-precision flexible boards in existing technologies, and provides a detection method for high-precision flexible boards used in intelligent connected vehicles. The flexible board is processed according to design data, which includes forming lines. The area within the forming lines is the effective area, and other areas are invalid areas. The effective area is provided with solder pads. The detection method includes the following steps:

[0011] S10: A flexible core board is formed according to the design data, the flexible core board including the pads; then a first socket is welded to the pads to form a welding board;

[0012] S20: Fabricate a test adapter board comprising a rigid region and a flexible region; the flexible region is provided with a second socket, and the rigid region is provided with test pads; the second socket is electrically connected to the test pads;

[0013] S30: Connect the test adapter board to the soldering board, including plugging the second socket into the first socket, and then using a tester to perform electrical testing on the test pads to complete the test.

[0014] Furthermore, the rigid area in the test adapter plate forms an enclosing structure with respect to the flexible area.

[0015] Furthermore, a through groove is provided at the junction of the flexible area and the rigid area of ​​the test adapter plate where they are not electrically connected.

[0016] Furthermore, an auxiliary welding pattern is made around the solder pad in the welding plate, and a welding pattern is made on the side of the first socket used for welding corresponding to the auxiliary welding pattern. Welding the first socket includes welding the welding pattern corresponding to the auxiliary welding pattern.

[0017] Furthermore, both the auxiliary welding pattern and the welding pattern are discontinuous pad patterns.

[0018] Furthermore, the fabrication of the flexible core board includes forming an auxiliary area in the region extending outward from the side where the pad is located in the ineffective region; a window area is provided between the auxiliary area and the effective region, and a connecting bridge is provided in the window area, the connecting bridge connecting the auxiliary area and the effective region.

[0019] Furthermore, the test adapter plate is provided with pins, and the auxiliary area is provided with positioning holes. The electrical testing process includes inserting the pins into the corresponding positioning holes.

[0020] Furthermore, a pin is welded to the surface of the rigid area, and the welding plate has insertion holes; the rigid area is provided with a plurality of second test pads, and the plurality of second test pads are electrically connected to the insertion holes; the conductive connection between the test adapter board and the welding plate includes connecting the pins to the corresponding insertion holes; the electrical testing process includes using the testing machine to perform electrical testing on the second test pads.

[0021] Furthermore, a reinforcing sheet is attached to the back of the flexible area corresponding to the area of ​​the second socket.

[0022] Furthermore, the fabrication of the flexible core board includes: processing the core board with circuit patterns according to the design data to form a patterned core board; fabricating a copper shielding layer on the surface of the patterned core board; and fabricating the auxiliary welding pattern on the copper shielding layer.

[0023] The beneficial effects of this technical solution are as follows:

[0024] (1) By first soldering the first socket and then making a test adapter board with the second socket, a matching connection is formed. The socket pins stably establish a current loop and a voltage test loop, avoiding contact failures of the contact pins, improving the identification accuracy of hidden defects such as line gaps, micro short circuits, thin wires, and thin copper holes, ensuring the transmission stability of the core circuit of the assisted driving system, and effectively avoiding the problems of the traditional low resistance test being prone to problems such as the contact pins not being able to contact, accidentally contacting adjacent pads, or poor contact due to the high density and precision of the solder pads;

[0025] (2) By setting an auxiliary area that extends the support area around the pads outward, the area of ​​the fine pads is extended, forming a larger support area, providing a more stable board surface foundation for subsequent welding, inspection and other processing, and preventing the processing process from being affected by factors such as expansion and contraction deformation; at the same time, the auxiliary area and the ineffective area are connected by a connecting bridge, which not only ensures the structural integrity of the board in the early stage of processing, but also can be easily removed by milling or laser cutting without damaging the effective area lines and pads;

[0026] (3) The test adapter board with rigid-flexible design achieves precise functional zoning: First, the flexible area of ​​the test adapter board can flexibly adjust the docking angle of the second socket during insertion and removal, adapting to the slight positional deviation of the flexible board caused by assembly and transportation, and avoiding the bending of socket pins and the detachment of solder pads caused by hard insertion and removal; Second, the rigid substrate of the rigid area provides a stable support plane for the test solder pads. When the test probe contacts, the rigid area has no risk of shaking or deformation, which can ensure that the contact pressure between the probe and the test solder pad is uniform, ensuring the convenience of test operation and data stability.

[0027] (4) The technical process of forming correlation between various technical features: The auxiliary area provides a stable board surface foundation for the welding of the first socket. The copper shielding layer isolates electromagnetic interference and ensures the accuracy of the test signal. The intermittent auxiliary welding pattern is precisely aligned with the welding pattern to avoid the influence of welding heat on the low resistance characteristics of the line. The rigid area of ​​the test adapter board surrounds the flexible area structure. Combined with the through slot design, the insertion and removal buffer and stress dispersion effect are further optimized. The pin and the positioning hole of the auxiliary area are used to achieve precise pre-positioning to ensure the accuracy of socket docking and pin connection. The flexible area reinforcement plate and the rigid plate non-functional area reinforcement plate respectively strengthen the rigidity of key parts to avoid damage caused by insertion and removal and tooling operation. The detection method of high precision flexible board for intelligent connected vehicles is realized to meet the high precision processing and detection requirements. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 is a process flow diagram of an embodiment of the present invention;

[0030] Figure 2 is a plan view of the flexible core board according to an embodiment of the present invention;

[0031] Figure 3 is a plan view of the welding plate according to an embodiment of the present invention;

[0032] Figure 4 is a plan view of the test adapter board according to an embodiment of the present invention;

[0033] Figure 5 is a plan view of the test adapter plate according to another embodiment of the present invention;

[0034] Figure 6 is a schematic diagram of the working plane for testing using the test adapter plate in Figure 4;

[0035] Figure 7 is a schematic diagram of the working plane for testing using the test adapter plate in Figure 5;

[0036] Figure 8 is a schematic diagram of the AA section structure in Figure 7;

[0037] Figure 9 is a schematic diagram of the BB section structure in Figure 7;

[0038] Figure 10 is a plan view of the high-precision flexible plate according to an embodiment of the present invention;

[0039] Figure 11 is a physical image of the high-precision flexible plate according to an embodiment of the present invention.

[0040] Explanation of reference numerals in the attached diagram: 100, forming line; 200, invalid area; 300, valid area; 400, auxiliary area; 500, window area; 10, flexible core board; 1010, solder pad; 1020, positioning hole; 1030, insertion hole; 1040, connecting bridge; 1050, auxiliary welding pattern; 20, welding plate; 2010, first socket; 30, test adapter board; 3010, rigid area; 3020, flexible area; 3030, second socket; 3040, test solder pad; 30A, another test adapter board; 3050, through slot; 3060, reinforcing piece; 3070, rigid reinforcing plate; 3080, ejector pin; 3080A, second test solder pad; 3090, pin.

[0041] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0043] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0044] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0046] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0047] The method for testing high-precision flexible boards for intelligent connected vehicles provided in this embodiment involves processing the flexible board according to design data, which includes a forming line 100, an effective area 300 within the forming line 100, and other areas as ineffective areas 200. The effective area 300 is provided with pads 1010.

[0048] Please refer to Figure 1, which is a process flow diagram of an embodiment of the present invention.

[0049] The detection method of this embodiment includes the process flow shown in Figure 1, and is described in detail below.

[0050] Please refer to Figures 2 and 3. Figure 2 is a plan view of the flexible core board according to an embodiment of the present invention, and Figure 3 is a plan view of the welding plate according to an embodiment of the present invention.

[0051] Step S10:

[0052] The flexible core board 10 is formed by processing according to the design data. The flexible core board 10 includes pads 1010. Then, the first socket 2010 is welded to the pads 1010 to form a welding board 20.

[0053] In this embodiment, the first socket 2010 is soldered first, and then the circuit pattern of the first socket 2010 and the flexible core board 10 is used to detect the low resistance of the circuit. This avoids the problem that if the low resistance is detected first and then the first socket 2010 is soldered, the high temperature and mechanical stress during the soldering process will affect the structural integrity or contact performance of the precision solder pad 1010, causing the circuit resistance to change.

[0054] Furthermore, the fabrication of the flexible core board 10 includes forming an auxiliary area 400 in the region extending outward from the side where the pad 1010 is located in the ineffective region 200; a window area 500 is provided between the auxiliary area 400 and the effective region 300, and a connecting bridge 1040 is provided in the window area 500, the connecting bridge 1040 connecting the auxiliary area 400 and the effective region 300.

[0055] By extending the support area around the solder pad 1010 outward to form the auxiliary area 400, the area of ​​the area where the solder pad 1010 is located is extended, forming a larger area of ​​support effect. This provides a more stable board surface foundation for subsequent welding, inspection and other processing, and prevents the processing from being affected by factors such as expansion and contraction deformation.

[0056] Secondly, a window area 500 is reserved at the boundary between the auxiliary area 400 and the invalid area 200. The window area 500 does not have a circuit or substrate reinforcement layer, but only serves as an isolation between the two and a reserved area for subsequent cutting. By making a number of connecting bridges 1040 evenly distributed along the edge of the window area 500, one end connects to the auxiliary area 400 and the other end connects to the invalid area 200, a complete flexible core board 10 integral structure is formed.

[0057] Furthermore, after the flexible core board 10 completes welding, testing, and other processes that require support from the auxiliary area 300, the connecting bridge 1040 can be cut off using milling or laser cutting processes, thereby removing the auxiliary area 400. This does not affect the subsequent punching and forming of the flexible core board 10, nor does it affect the circuit performance of the pads 1010 in the effective area 300.

[0058] Therefore, the auxiliary area 400 extends the support range of the pad 1010, the connecting bridge 1040 ensures the structural integrity of the entire board in the early stage of processing, and the window area 500 reserves space for the precise removal of the auxiliary area 400 in the later stage. The three work together to achieve a closed loop of auxiliary area 400 function, which provides stable support in the early stage and convenient removal in the later stage.

[0059] Optionally, an auxiliary welding pattern 1050 is made around the solder pad 1010 in the welding plate 20, and a welding pattern (not shown in the figure) is made on the side of the first socket 2010 used for welding corresponding to the auxiliary welding pattern 1050. Welding the first socket 2010 includes welding the welding pattern corresponding to the auxiliary welding pattern 1050.

[0060] Both the auxiliary welding pattern 1050 and the welding pattern enhance the welding process. The auxiliary welding pattern 1050 makes the welding of the first socket 2010 more secure, and the welding pattern makes the welding of the second socket 3030 more secure, thus preventing the insertion and removal of the first socket 2010 and the second socket 3030 during testing from affecting the stability of the sockets themselves.

[0061] Optionally, the fabrication of the flexible core board 10 includes processing according to design data to form a patterned core board with circuit patterns; fabricating a copper shielding layer on the surface of the patterned core board; and fabricating an auxiliary welding pattern 1050 on the copper shielding layer.

[0062] In this embodiment, the copper shielding layer is made by taking a copper layer and an insulating adhesive layer, and fabricating the copper layer onto the surface of the graphic core board through the insulating adhesive layer according to the design data.

[0063] If the board has a copper shielding layer that uses a copper layer as a shielding layer, then the auxiliary soldering pattern 1050 can be made on the copper shielding layer.

[0064] Furthermore, both the auxiliary welding pattern 1050 and the welding pattern are discontinuous pad patterns.

[0065] That is, the segmented and discontinuous ring structure along the edge of pad 1010 blocks the continuous conduction of heat through the blank area. This can effectively avoid the problems caused by the large contact area between the solder and the pattern during soldering, which would lead to a sudden increase in local temperature due to the heat generated by the melting of the solder if a continuous ring pad pattern is used. In addition, it can avoid the problem of occupying the effective circuit pattern distribution space.

[0066] Please refer to Figure 4, which is a planar schematic diagram of the test adapter board according to an embodiment of the present invention.

[0067] Step S20:

[0068] A test adapter board 30 is fabricated, comprising a rigid region 3010 and a flexible region 3020; the flexible region 3020 is provided with a second socket 3030, and the rigid region 3010 is provided with a test pad 3040; the second socket 3030 is electrically connected to the test pad 3040.

[0069] By designing the test adapter board 30 as a rigid-flexible partitioned structure, two requirements can be met simultaneously: First, the flexible area 3020 of the test adapter board 30, with its bendable characteristics, can flexibly adjust the mating angle of the second socket 3030 during insertion and removal, avoiding bending of the pins of the second socket 3030 and detachment of the test pad 3040 caused by hard insertion and removal; Second, the rigid substrate of the rigid area 3010 provides a stable support plane for the test pad 3040. When the test probe contacts, the rigid area 3010 has no risk of shaking or deformation, which can ensure uniform contact pressure between the probe and the test pad 3040, ensuring the convenience of test operation and data stability.

[0070] On the one hand, it can effectively avoid the problem that if the board is fully flexible, the force application point will be offset, which will easily cause the adapter board to tilt and increase the difficulty of docking. On the other hand, it can effectively avoid the problem that if the adapter board is a fully rigid structure, the position needs to be repeatedly fine-tuned to align the socket, which is time-consuming and laborious. In addition, the high overall strength of the fully rigid board means that the board's deformation ability is extremely weak. It cannot adapt to the variables in the plugging and unplugging scenario through its own slight bending or up and down movement. During the plugging and unplugging process, it is difficult for the operator to apply force evenly, which can easily generate oblique force or unilateral force. Since the fully rigid board has no buffer structure, it will directly transmit the external force to the pins of the second socket 3030 and the first socket 2010, resulting in concentrated force on the pins and a greatly increased risk of deformation.

[0071] It is worth noting that the test adapter board 30 achieves the connection between the second socket 3030 and the test pad 3040 through its internal circuit pattern.

[0072] The rigid-flexible joint structure of the test adapter board 30 in this embodiment has good durability, meets the plugging and unplugging requirements of batch testing, reduces poor contact caused by wear, and can be reused thousands to tens of thousands of times, significantly reducing the interface cost of a single test.

[0073] Please refer to Figure 5, which is a plan view of a test adapter plate according to another embodiment of the present invention.

[0074] Furthermore, in another test adapter plate 30A, the rigid region 3010 forms an enclosing structure with the flexible region 3020.

[0075] The rigid area 3010 surrounds the flexible area 3020 in a frame-like manner. The rigid frame provides a stable force fulcrum for operation. When the second socket 3030 is connected to or separated from the first socket 2010 of the welding plate 20, the surrounding frame can withstand the insertion and removal force of the operator, preventing the flexible area 3020 from shifting due to deformation under force. The central flexible area 3020, constrained only by the edges of the surrounding rigid frame, can make slight adjustments with the connection angle during insertion and removal. If there is a slight positional deviation during connection, the flexible area 3020 can adjust and align itself through its own deformation. During separation, the deformation of the flexible area 3020 can also buffer the jamming force at the moment of socket separation, avoiding pin jamming caused by hard pulling, and achieving smooth insertion and removal. This not only extends the service life of the second socket 3030 and the first socket 2010, but also reduces test interruptions caused by damage to the second socket 3030 and the first socket 2010, further ensuring the continuity of insertion and removal operations.

[0076] Furthermore, a through groove 3050 is provided at the junction of the non-electrical connection between the flexible area 3020 and the rigid area 3010 in another test adapter plate 30A.

[0077] The through-slot 3050 is located at the boundary between the rigid zone 3010 and the flexible zone 3020. In areas without internal conductive lines, it neither damages the overall support frame of the rigid zone 3010 nor touches the installation area of ​​the second socket 3030 in the flexible zone 3020, thus avoiding the conductive path of internal lines and ensuring that electrical performance is not affected.

[0078] The through groove 3050 forms a structural break to prevent repeated friction between the flexible area 3020 and the rigid area 3010 during the insertion and removal of the first socket 2010 and the second socket 3030, which could cause problems such as tearing, wear, and deformation of the board and affect the test results. It can also release the deformation space and cut off the stress transmission path. When an oblique force is applied to the rigid area 3010, some of the stress will be released at the through groove 3050, and the remaining stress will be further absorbed by the small deformation of the flexible area 3020 itself, which can effectively avoid micro-deformation caused by stress concentration.

[0079] Please refer to Figures 6, 7, 8, 9 and 10. Figure 6 is a schematic diagram of the working plane for testing using the test adapter plate in Figure 4; Figure 7 is a schematic diagram of the working plane for testing using the test adapter plate in Figure 5; Figure 8 is a schematic diagram of the AA section structure in Figure 7; and Figure 9 is a schematic diagram of the BB section structure in Figure 7.

[0080] Step S30:

[0081] Connect the test adapter board 30 to the soldering board 20 by inserting the second socket 3030 into the first socket 2010, and then use a tester to perform electrical testing on the test pad 3040 to complete the test.

[0082] The working process is as follows: Based on the male-female compatibility characteristics between the sockets of the welding board 20 made in step S10 and the test adapter board 30 made in step S20, the second socket 3030 is precisely plugged into the first socket 2010 to complete the connection; after connection, the circuit of the welding board 20 forms a complete conductive loop through "first socket 2010 → second socket 3030 → internal circuit of test adapter board 30 → test pad 3040". Then, the testing machine is started, and its probe is aligned with the test pad 3040 of the test adapter board 30. The actual resistance value of the circuit of the welding board 20 is calculated by the computer. The actual resistance value is compared with the design standard resistance value. If the difference is within the allowable error range, the circuit is judged to have no problems such as wire gaps, micro-short circuits, thin wires, or thin copper holes, and is a qualified product; if the difference exceeds the range, it is judged to be a defective product.

[0083] After the test is completed, unplug the second socket 3030; if the test is qualified: the welding plate 20 is shaped and processed to finally obtain a high-precision flexible plate 40 that meets the processing requirements; if the test is unqualified: the welding plate 20 is directly transferred to the rework process or scrapped.

[0084] Furthermore, a pin 3080 is welded to the surface of the rigid region 3010, and a plug-in hole 1030 is formed on the welding plate 20; the rigid region 3010 is provided with a plurality of second test pads 3080A, and the plurality of second test pads 3080A are electrically connected to the plug-in hole 1030; the conductive connection between the test adapter plate 30 and the welding plate 20 includes correspondingly abutting the pin 3080 to the plug-in hole 1030; the electrical testing process includes using a testing machine to perform electrical testing on the second test pads 3080A.

[0085] Another test process for the adapter board 30A and the soldering board 20 involves the first socket 2010 of the soldering board 20 forming an electrical connection through its internal circuitry as follows: "First socket 2010 → Second socket 3030 → Internal circuitry of the adapter board 30 → Test pad 3040", and "Plug-in hole 1030 → Ejector pin 3080 → Internal circuitry of the adapter board 30A → Second test pad 3080A". Through multi-threaded synchronous testing, the low-resistance circuitry and plug-in hole 1030 are tested in one go. The subsequent testing process is similar to the above process.

[0086] Optionally, the diameter of the second test pad 3080A can be set between 0.1mm and 5mm to ensure sufficient contact space so that the two test probes can reliably contact the second test pad 3080A, avoiding test interruption or misjudgment due to contact problems.

[0087] Preferably, the second test pad 3080A and the second socket 3030 are distributed on different sides of the test adapter board 30. In order to facilitate the operator to observe the docking status, the soldering plate 20 is usually placed below the test adapter board 30 during testing, and the second socket 3030 is placed on the back. It can directly form a vertical docking with the first socket 2010 of the soldering plate 20 below. When plugging and unplugging, only the force needs to be applied in the vertical direction, without the need to move the test adapter board 30 laterally, which is more in line with the operation logic.

[0088] Optionally, the test pad 3040 and the second test pad 3080A are both relatively large, ranging from 0.5mm to 3.0mm, which can effectively improve the problem of insufficient area of ​​the same pad 1010 when the same pad 1010 needs to contact two probes at the same time during low resistance testing.

[0089] Furthermore, the test adapter board 30 is provided with pins 3090, and the auxiliary area 400 is provided with positioning holes 1020. The electrical test process includes inserting the pins 3090 into the positioning holes 1020.

[0090] On the one hand, the pin 3090 and the positioning hole 1020 can play a positioning role. Before the second socket 3030 and the first socket 2010 are connected, the pin 3090 of the test adapter plate 30 is inserted into the positioning hole 1020 of the welding plate 20. This can quickly calibrate the relative position of the two, avoid socket misalignment caused by manual alignment, and reduce pin collision during insertion and removal. On the other hand, the pin 3090 and the positioning hole 1020 can form a rigid constraint on each other, locking the welding plate 20 and the test adapter plate 30 into a whole. This can prevent the welding plate 20 from shifting or warping due to the flexible substrate characteristics when the test probe contacts the test pad 3040, and can also avoid board shaking caused by slight external vibrations during the test.

[0091] Optionally, a reinforcing sheet 3060 is attached to the back of the area of ​​the flexible zone 3020 corresponding to the area of ​​the second socket 3030.

[0092] On the one hand, the reinforcing plate 3060 can extend the insertion and removal life of the second socket 3030 through rigid support, solve the problem of socket loosening caused by repeated insertion and removal, and ensure the stable conduction of the test circuit. If the reinforcing plate 3060 is not attached, the solder joints are prone to poor soldering due to stress concentration after repeated insertion and removal, which can lead to problems such as interruption of the test circuit. On the other hand, the rigid support provided by the reinforcing plate 3060 can ensure that the pins always maintain accurate alignment, which can effectively avoid the lateral bias force during insertion and removal, which can easily cause the socket to tilt, resulting in a series of problems such as poor contact or test errors.

[0093] It is worth noting that the reinforcing plate 3060 can also improve the convenience of testing. Without the reinforcing plate 3060, the socket is prone to collapse due to the indentation of the flexible area 3020 when plugging or unplugging. Operators need to deliberately control the force and direction of application to avoid the socket from tilting. After attaching the reinforcing plate 3060, the socket will form a stable rigid feedback when plugging or unplugging, and the direction of application of force is easier to control, avoiding operational errors caused by the collapse of the base material.

[0094] Optionally, a rigid reinforcing plate 3070 is provided in the area of ​​the non-corresponding welded plate of the rigid zone 3010.

[0095] By directionally thickening the non-functional area, the rigid reinforcing plate 3070 forms a raised protective layer of the rigid area 3010, which isolates the welding plate 20 from direct collision when the testing fixture approaches during operation.

[0096] Please refer to Figures 10 and 11. Figure 10 is a plan view of the high-precision flexible plate according to an embodiment of the present invention; Figure 11 is a physical image of the high-precision flexible plate according to an embodiment of the present invention.

[0097] After the inspection is completed, the welding plate 20 is shaped and processed to obtain the flexible plate 40.

[0098] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the inventive concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for testing high-precision flexible boards for intelligent connected vehicles, wherein the flexible board is processed according to design data, the design data including forming lines, the area within the forming lines being the effective area, and other areas being the ineffective area, the effective area being provided with solder pads, characterized in that, The detection method includes the following steps: S10: A flexible core board is formed according to the design data, the flexible core board including the pads; a first socket is then soldered to the pads to form a soldering board; the formation of the flexible core board includes forming an auxiliary area extending outward from the side where the pads are located in the invalid area; a window area is provided between the auxiliary area and the effective area, the window area is provided with a connecting bridge, and the connecting bridge connects the auxiliary area and the effective area; S20: A test adapter board including a rigid area and a flexible area is formed; a second socket is provided in the flexible area, and a test pad is provided in the rigid area; the second socket is electrically connected to the test pad; the test adapter board is provided with pins, the... The auxiliary area has positioning holes; the surface of the rigid area is welded with ejector pins, and the welding plate has insertion holes; the rigid area is provided with a plurality of second test pads, and the plurality of second test pads are electrically connected to the insertion holes; connecting the test adapter board and the welding plate includes connecting the ejector pins to the insertion holes; S30: Connecting the test adapter board and the welding plate includes connecting the second socket to the first socket, and then using a testing machine to perform electrical testing on the test pads to complete the test; the electrical testing process includes connecting the pins to the positioning holes; the electrical testing process includes using the testing machine to perform electrical testing on the second test pads.

2. The method for detecting high-precision flexible plates for intelligent connected vehicles as described in claim 1, characterized in that, The rigid area in the test adapter plate forms an enclosing structure with the flexible area.

3. The method for detecting high-precision flexible plates for intelligent connected vehicles as described in claim 2, characterized in that, A through groove is provided at the junction of the flexible area and the rigid area of ​​the test adapter board where they are not electrically connected.

4. The method for detecting high-precision flexible plates for intelligent connected vehicles as described in claim 1, characterized in that, An auxiliary welding pattern is made around the pad in the welding plate, and a welding pattern is made on the side of the first socket to be welded corresponding to the auxiliary welding pattern; welding the first socket includes welding the welding pattern corresponding to the auxiliary welding pattern.

5. The method for detecting high-precision flexible plates for intelligent connected vehicles as described in claim 4, characterized in that, Both the auxiliary welding pattern and the welding pattern are discontinuous pad patterns.

6. The method for detecting high-precision flexible plates for intelligent connected vehicles as described in claim 1, characterized in that, A reinforcing sheet is attached to the back of the flexible area corresponding to the area of ​​the second socket.

7. The method for detecting high-precision flexible plates for intelligent connected vehicles as described in claim 4, characterized in that, The fabrication of the flexible core board includes processing the core board with circuit patterns according to the design data. A copper shielding layer is formed on the surface of the patterned core board, and the auxiliary welding pattern is formed on the copper shielding layer.

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