A step-pressure hot-pressing shaping device and method for capacitor cores
By using a step-type pressurized hot-pressing shaping device, which combines a buffer structure and a heating structure, the problems of thin film layer damage and uneven pressure caused by traditional pressurization methods are solved, and uniform pressurization and shaping of capacitor cores are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SICHUAN ZHONGXING ELECTRONICS
- Filing Date
- 2025-11-11
- Publication Date
- 2026-06-30
AI Technical Summary
Traditional linear pressure application methods can easily lead to displacement, wrinkles, or damage to the thin film layer inside the capacitor core during the core shaping process, resulting in uneven pressure distribution and affecting electrical performance and long-term reliability.
A step-type pressurization and hot-pressing shaping device is adopted. The buffer structure provides resistance before the mold contacts, so as to achieve slow approach and initial wrapping. Then, it switches to high-pressure shaping in a step-type manner. Combined with the heating structure, it ensures uniform pressure and shaping.
This effectively avoids initial impact damage, ensures the compact structure and stable shape of the capacitor core, and improves product qualification rate and electrical performance.
Smart Images

Figure CN121331675B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of capacitor core shaping technology, and more specifically, to a step-type pressurized hot-press shaping device and method for capacitor cores. Background Technology
[0002] In the field of capacitor manufacturing, the shaping of the capacitor core (usually made of metallized thin film) is a critical process. The purpose of the shaping process is to make the loose and unstable core structure compact and fixed by heating and pressurizing, and to form a regular cylindrical or other predetermined shape, thereby ensuring that its electrical parameters (such as capacitance and loss) are stable and meet the dimensional requirements of subsequent packaging processes.
[0003] Traditional hot-pressing devices typically employ a simple linear pressurization method, where a cylinder or hydraulic cylinder directly drives the hot-pressing mold to apply continuous and constant pressure to the capacitor core while simultaneously heating it. However, this direct pressurization method has significant technical drawbacks. In the initial stage of pressurization, the moving parts possess considerable kinetic energy. When the mold momentarily contacts and impacts the soft, loose capacitor core, it can easily cause displacement, wrinkling, or damage to the thin film layer inside the core, or even directly crush the core's end face, rendering the product unusable. Traditional "one-step" pressurization cannot achieve precise, phased pressure control. Applying full pressure before the core has been gently pre-positioned and initially compacted can easily lead to uneven pressure distribution, stress concentration within the core, and uneven density in the final product, affecting its electrical performance and long-term reliability. Summary of the Invention
[0004] The purpose of this invention is to provide a step-type pressurized hot-pressing shaping device for capacitor cores, which addresses the shortcomings of existing technologies and solves the problems mentioned in the background.
[0005] The technical solution of this invention is implemented as follows:
[0006] This invention provides a step-type pressurized hot-pressing shaping device for capacitor cores, comprising a housing, a pressing area on the side wall of the housing, a pressing shell installed within the pressing area, and two pressing platforms arranged in pairs inside the pressing shell. A pushing structure is provided inside the pressing shell to drive the two pressing platforms to move synchronously. Loading seats are installed on the opposite side walls of the two pressing platforms, and each loading seat contains a pressing half-mold. The two pressing half-molds are joined together to form a pressing mold. A buffer structure is provided between the two opposite loading seats, and a heating structure is provided inside the loading seats. A pressurizing structure communicating with the pressing shell is provided inside the housing. When the pushing structure causes the two pressing platforms to move towards each other, the two loading seats slowly approach each other under the resistance of the buffer structure. When the two loading seats move to a preset distance, the buffer structure enters the two loading seats, and the two loading seats apply positive pressure to the capacitor core located inside the pressing mold.
[0007] In some technical solutions of the present invention, the buffer structure includes several guide rods, two guide seats are installed on the outer side wall of the guide rods, the two guide seats located on the same guide rod are respectively connected to two oppositely arranged loading seats, a return spring is sleeved on the outer side wall of the guide rod and abuts against the guide seat, and a blocking structure for controlling the return spring to enter and exit the guide seat is provided on the inner wall of one of the guide seats.
[0008] In some technical solutions of the present invention, the blocking structure includes a displacement ring installed in a guide seat, a guide groove is provided on the side wall of the guide seat along the extension direction of the guide rod, a guide block connected to the displacement ring is slidably disposed in the guide groove, an installation chamber communicating with the guide groove is provided in the guide seat, a trigger rod is slidably disposed in the installation chamber, the trigger rod is connected to the guide block, the trigger rod extends outward after passing through the guide seat, a limiting spring is sleeved on the outer side wall of the trigger rod, and the limiting spring is connected to the inner wall of the installation chamber.
[0009] In some technical solutions of the present invention, guide holes matching the guide rods are provided on the opposite side walls of the two pressing platforms.
[0010] In some technical solutions of the present invention, the pushing structure includes a push rod structure installed in the housing, the telescopic end of the push rod structure passing through the housing and placed in the pressing housing, the telescopic end of the push rod structure being connected to one of the pressing platforms, and the other pressing platform being fixedly installed in the pressing housing.
[0011] In some technical solutions of the present invention, a plurality of limiting rods are provided between the two pressing platforms, and the limiting rods pass through the two pressing platforms and are fixedly connected to the inner wall of the pressing shell.
[0012] In some technical solutions of the present invention, a locking groove is provided on the side wall opposite to the pressing half mold of the loading seat, a locking strip is slidably provided in the locking groove, and a limiting plate is provided at both ends of the locking strip. One of the limiting plates is fixedly provided on the side wall of the locking strip, and an assembly groove matching the locking strip is provided at both ends of the pressing half mold. The other limiting plate is slidably provided on the side wall of the locking strip.
[0013] In some technical solutions of the present invention, a mounting hole is provided on the side wall of the locking bar, a connecting rod connected to the limiting plate is provided in the mounting hole, and an adjusting spring connected to the connecting rod is provided in the mounting hole.
[0014] In some technical solutions of the present invention, an inlet and outlet are provided on the outer wall of the pressing shell, and a cover is provided inside the inlet and outlet.
[0015] Compared with existing technologies, this invention has at least the following advantages or beneficial effects: By setting a "buffer structure," resistance is provided when the two pressing molds are about to contact the capacitor core, forcing the loading seats to "slowly approach," achieving gentle contact and initial wrapping of the core, effectively eliminating the direct impact of the kinetic energy of moving parts on the core; after the two loading seats move to a preset distance, the buffer structure enters the two loading seats, realizing a step-by-step operation from low pressure to high pressure in the pressurization process. After the initial buffering stage, the two loading seats automatically (or trigger-based) switch to allow the two pressing half-molds to enter the full-pressure stage, integrating the heating structure into the loading seats, connecting the pressurization structure to the pressing shell, and applying low pressure to the capacitor core through a hot press, so that the thin films of each layer of the core are initially bonded under low pressure, expelling interlayer air, dispersing stress concentration during subsequent high-pressure shaping, and providing buffer protection for the metallized film. During the positive pressure setting stage: After pre-pressing, the pressure is increased to positive pressure (rated pressure) by a hot press and maintained at this pressure for high-pressure setting. "Positive pressure switching" can avoid secondary damage to the metallization film caused by dynamic stress fluctuations during the transition from low pressure to high pressure. At the same time, the high pressure ensures the densification and morphological stability of the core structure, so that the device can provide uniform heating and possible environmental pressure (such as air pressure) for the processing of the capacitor core while applying precise mechanical pressure, thus ensuring the setting effect. Attached Figure Description
[0016] Figure 1 This is a three-dimensional structural diagram of the shaping device in this invention.
[0017] Figure 2 This is a front view of the shaping device in this invention.
[0018] Figure 3 This is a schematic diagram of the internal structure of the shaping device in this invention.
[0019] Figure 4 This is a schematic diagram of the installation structure of the pressing platform in this invention.
[0020] Figure 5 This is a schematic diagram of the installation structure of the pressing half mold in this invention.
[0021] Figure 6 This is a cross-sectional view of the buffer structure in this invention.
[0022] Figure 7 This is a schematic diagram of the mounting bracket structure for the resistive structure in this invention.
[0023] Figure 8 This is a schematic diagram of the installation structure of the locking strip in this invention.
[0024] Figure 9 for Figure 8 A magnified schematic diagram of the structure at point A in the middle.
[0025] Reference numerals: 1. Housing; 2. Pressing housing; 3. Pressing platform; 4. Inlet / outlet; 5. Pushing structure; 51. Push rod structure; 6. Loading seat; 7. Cover; 8. Pressing half mold; 9. Adjusting spring; 10. Buffer structure; 101. Guide rod; 102. Guide seat; 103. Guide hole; 104. Return spring; 105. Resistance structure; 106. Displacement ring; 107. Guide block; 108. Guide groove; 109. Mounting chamber; 110. Trigger rod; 111. Limiting spring; 11. Heating structure; 12. Pressurizing structure; 13. Limiting rod; 14. Locking groove; 15. Locking strip; 16. Limiting plate; 17. Assembly groove; 18. Mounting hole; 19. Connecting rod. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.
[0028] Example
[0029] This invention provides a step-type pressurized hot-pressing shaping device for capacitor cores, such as... Figures 1-9 As shown, the device includes a housing 1, which is a steel box structure. A pressing area is provided on the side wall of the housing 1, and a pressing shell 2 is installed within the pressing area. Two pressing platforms 3 are arranged in pairs within the pressing shell 2.
[0030] The pressing housing 2 is equipped with a pushing structure 5 that drives one pressing platform 3 to reciprocate towards the other pressing platform 3. The pushing structure 5 provides power to bring the two pressing platforms 3 closer together, ensuring uniform pressure on the capacitor core and preventing coating breakage or cracking during the pressing process. Loading seats 6 are bolted to the opposite sidewalls of the two pressing platforms 3. Each loading seat 6 contains a long, narrow pressing half-mold 8, most of which protrudes outward from the loading seat 6. The two pressing half-molds (8) are joined together to form a pressing cavity for pressing the cylindrical capacitor core. The mold corresponding to this cavity can be removed from the loading seat (6) and replaced with pressing half-molds 8 of other shapes. A buffer structure 10 is provided between the two opposing loading seats 6. The buffer structure 10 generates resistance at the contact point of the two pressing half-molds 8, causing them to slowly approach and press the capacitor core. This prevents the two pressing half-molds 8 from directly impacting the capacitor core at high speed, which could cause displacement or cracking of the internal thin film layer. When the pressing half-mold 8 reaches the preset distance, the buffer structure 10 is released and enters one of the loading seats 6, and the two pressing half-molds 8 come into contact, thereby switching from low pressure to high pressure, thus realizing step pressurization. The loading seat 6 is equipped with a heating structure 11, and the housing 1 is equipped with a pressurization structure 12 that communicates with the pressing housing 2; the heating structure 11 heat-sets the capacitor core during the pressurization process, promoting the softening or solidification of the material, and the pressurization structure 12 can apply additional pressure after evacuating the pressing area by negative pressure, thereby enhancing the setting effect.
[0031] The working process of this structure is as follows: After the device is started, the pushing structure 5 drives the two pressing platforms 3 to move towards each other. The two loading seats 6 move with the pressing platforms 3, but due to the obstruction of the buffer structure 10, the loading seats 6 slowly approach each other, and the two pressing half-molds 8 approach each other to apply pressure to the capacitor core. When the two loading seats 6 move to a preset distance, the buffer structure 10 enters one of the loading seats 6, and the buffering effect is weakened or disappears. Subsequently, the two loading seats 6 quickly approach each other, so that the pressing mold formed by splicing the two pressing half-molds 8 applies positive pressure to the capacitor core. At the same time, the heating structure 11 heats the pressing half-mold 8 in the loading seat 6, and the pressurizing structure 12 is connected to the pressing shell 2 to perform pressurization operation on the pressing area. This structure achieves a slow-then-fast pressurization method through the buffer structure 10, avoiding damage to the capacitor core from the initial impact and improving the product qualification rate.
[0032] In some technical solutions of the present invention, the buffer structure 10 includes several guide rods 101, and two guide seats 102 are installed on the outer side wall of the guide rods 101. The guide rods 101 provide linear guidance to ensure the accurate movement trajectory of the loading seat 6. The two guide seats 102 located on the same guide rod 101 are respectively connected to two oppositely arranged loading seats 6. A return spring 104 is sleeved on the outer side wall of the guide rod 101 and abuts against the guide seat 102. The return spring 104 stores or releases energy during movement to generate a buffering force and slow down the approach speed of the loading seat 6. A stop structure 105 is provided on the inner wall of one of the guide seats 102 to control the return spring 104 to enter and exit the guide seat 102. The stop structure 105 intervenes when the loading seat 6 reaches a preset distance to realize the switching from the two buffering stages to the pressurization stage, so that the two pressing half molds 8 perform a step-by-step pressurization operation on the capacitor core.
[0033] In some technical solutions of the present invention, the stop structure 105 includes a displacement ring 106 installed in the guide seat 102. A guide groove 108 is formed on the side wall of the guide seat 102 along the extension direction of the guide rod 101. A guide block 107 connected to the displacement ring 106 is slidably disposed in the guide groove 108. The guide groove 108 restricts the movement direction of the guide block 107 to ensure accurate movement of the displacement ring 106. The guide seat 102 is provided with a mounting chamber 109 communicating with the guide groove 108. A trigger rod 110 is slidably disposed in the mounting chamber 109. The displacement ring 106 directly controls the effective range of the reset spring 104. The trigger rod 110, which achieves the buffering effect, is connected to the guide block 107. The trigger rod 110 extends outward after passing through the guide seat 102. A limit spring 111 is sleeved on the outer wall of the trigger rod 110. The limit spring 111 is connected to the inner wall of the mounting chamber 109. The limit spring 111 resets the trigger rod 110 when there is no external force, keeping the stop structure 105 stable.
[0034] Furthermore, a lever arm connected to the trigger rod is slidably provided in the chamber 109. After passing through the guide groove 108, the lever arm is connected to the displacement ring 106 to provide support for the displacement ring 106.
[0035] When the trigger rod 110 is externally triggered, it pushes the guide block 107 to slide within the guide groove 108, causing the displacement ring 106 to move towards the bottom of the guide seat 102. This causes the return spring 104, which is in contact with the displacement ring 106, to enter the guide seat 102. Subsequently, the two loading seats 6 quickly approach each other, causing the pressing mold formed by the splicing of the two pressing half molds 8 to apply positive pressure to the capacitor core.
[0036] In some technical solutions of this invention, guide holes 103 matching the guide rods 101 are provided on the opposite sidewalls of the two pressing platforms 3. When the pressing platform 3 moves, the guide rods 101 slide within the guide holes 103, providing additional guidance and preventing the two pressing half molds 8 from shifting during the pressing process, thus affecting the molding quality of the capacitor core. Furthermore, the guide holes 103 cooperate with the guide rods 101 to form a sliding bearing effect, restricting the degrees of freedom of the loading seat 6 and ensuring that the pressing platform 3 moves only along the direction of the guide rods 101, avoiding rotation or lateral movement.
[0037] In some technical solutions of the present invention, the pushing structure 5 includes a push rod structure 51 installed inside the housing 1. The telescopic end of the push rod structure 51 passes through the housing 1 and is placed inside the pressing housing 2. The telescopic end of the push rod structure 51 is connected to one of the pressing platforms 3, and the other pressing platform 3 is fixedly installed inside the pressing housing 2. The pushing structure 5 includes a push rod structure 51 (such as a hydraulic cylinder or pneumatic cylinder) installed inside the housing 1. The telescopic end of the push rod structure 51 passes through the housing 1 and is connected to one of the pressing platforms 3, and the other pressing platform 3 is fixed inside the pressing housing 2. When the push rod structure 51 extends or retracts, it drives the pressing platform 3 to move towards the fixed platform.
[0038] In some technical solutions of the present invention, a plurality of limiting rods 13 are provided between the two pressing platforms, and the limiting rods 13 pass through the two pressing platforms 3 and are fixedly connected to the inner wall of the pressing shell 2.
[0039] The limiting rod 13 is fixedly connected to the inner wall of the pressing housing 2. When the pressing platform 3 moves, the limiting rod 13 provides a limit. As a rigid constraint, the limiting rod 13 restricts the maximum stroke of the pressing platform 3. This prevents excessive movement of the pressing platform 3 and avoids damage to the device or over-pressure on the capacitor core. Furthermore, the limiting rod 13 and the guide rod 101 work together to guide the pressing half mold 8, enhancing the stability of the overall structure during the operation of the pressing half mold 8 of the capacitor core.
[0040] In some technical solutions of the present invention, a locking groove 14 is provided on the side wall opposite to the pressing half mold 8 of the loading seat 6, and a locking strip 15, which is wedge-shaped, is slidably disposed in the locking groove 14. Both ends of the locking strip 15 are provided with L-shaped limiting plates 16, one of which is fixedly disposed on the side wall of the locking strip 15. Both ends of the pressing half mold 8 are provided with assembly grooves 17 that match the locking strip 15, and the other limiting plate 16 is slidably disposed on the side wall of the locking strip 15. When the locking strip 15 is inserted into the assembly groove 17, the pressing half mold 8 is fixed. The pressing half mold 8 can be released or locked by sliding the limiting plate 16.
[0041] In some technical solutions of the present invention, a mounting hole 18 is provided on the side wall of the locking strip 15, and a connecting rod 19 connected to the limiting plate 16 is provided in the mounting hole 18. An adjusting spring 9 connected to the connecting rod 19 is also provided in the mounting hole 18. After the connecting rod 19 is connected to the sliding limiting plate 16, the adjusting spring 9 provides elastic force. When an external force is applied, the sliding limiting plate 16 compresses the adjusting spring 9 and moves; after the external force disappears, the spring returns to its original position, causing the limiting plate 16 to enter the assembly groove 17. The adjusting spring 9 applies a continuous pulling force to the sliding limiting plate 16 through the connecting rod 19, so that the limiting plate 16 is partially embedded between the locking strip 15 and the locking groove 14, locking the locking strip 15.
[0042] In some technical solutions of this invention, an inlet / outlet 4 is provided on the outer wall of the pressing housing 2, and a cover 7 is provided inside the inlet / outlet 4. The inlet / outlet 4 is used to insert or remove the capacitor core and mold, and the cover 7 covers the inlet / outlet 4, sealing the pressing area during pressurization. The inlet / outlet 4 serves as an operating channel, facilitating material loading and unloading. The cover 7 provides a seal, helping to maintain stable internal temperature and pressure during the hot pressing process, preventing pressure leakage or external contamination.
[0043] The step-pressure hot-pressing shaping method for capacitor cores includes the following steps:
[0044] The capacitor core to be shaped is placed in a pressing mold formed by splicing two pressing half molds 8;
[0045] The activation push structure 5 drives the two pressing platforms 3, carrying the loading seats 6 and pressing half molds 8 on them, to move towards each other; under the resistance of the buffer structure 10, the two loading seats 6 slowly approach each other, so that the pressing molds gently contact and initially wrap the capacitor core.
[0046] When the two loading seats 6 move to the preset distance, the buffer structure 10 is triggered, causing it to enter the guide seat 102 and thus releasing the buffering effect.
[0047] After the buffering effect of the buffer structure 10 is released, the two loading seats 6 quickly approach each other under the continuous drive of the pushing structure 5, apply a preset positive pressure to the capacitor core, and at the same time heat the capacitor core through the heating structure 11, and pre-pressurize the inside of the pressing shell 2 with low pressure through the pressurizing structure 12, and then pressurize it to positive pressure. Under the combined action of heat and pressure, the capacitor core is shaped.
[0048] Start the heating system of the heating structure (11) to heat the hot press to the rated temperature (e.g., 105°C).
[0049] Initial pressure and pre-compression stage: Apply low pressure to the capacitor core using a hot press, pre-compressing to 50% of the core's positive pressure (rated pressure) for 60-120 seconds. The purpose of pre-compression is to allow the thin films of each layer of the core to initially adhere under lower pressure, expel interlayer air, disperse stress concentration during subsequent high-pressure shaping, and provide buffer protection for the metallized film.
[0050] Positive pressure shaping stage: After pre-pressing, the pressure is increased to positive pressure (rated pressure) by hot press. Within 1-5 seconds, the pressure is switched from initial pressure to positive pressure and maintained at this pressure for high-pressure shaping. "Positive pressure switching" can avoid secondary damage to the metallization film caused by dynamic stress fluctuations during the transition from low pressure to high pressure. At the same time, high pressure ensures the densification of the core structure and the stability of its shape.
[0051] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A step-type pressurized hot-pressing shaping device for capacitor cores, characterized in that, The system includes a housing (1), on which a pressing area is provided on the side wall. A pressing shell (2) is installed in the pressing area. Two pressing platforms (3) are arranged in pairs inside the pressing shell (2). A pushing structure (5) is provided inside the pressing shell (2) to drive one pressing platform (3) toward the other pressing platform (3). Loading seats (6) are installed on the opposite side walls of the two pressing platforms (3). Each loading seat (6) is provided with a pressing half-mold (8). The two pressing half-molds (8) are spliced together to form a pressing mold. The two oppositely arranged loading seats... A buffer structure (10) is provided between the seats (6), a heating structure (11) is provided inside the loading seat (6), and a pressurizing structure (12) connected to the pressing shell (2) is provided inside the housing (1); when the pushing structure (5) causes the two pressing platforms (3) to move towards each other, the two loading seats (6) slowly approach each other under the obstruction of the buffer structure (10). When the two loading seats (6) move to a preset distance, the buffer structure (10) enters the two loading seats (6), and the pressing half mold (8) inside the two loading seats (6) applies positive pressure to the capacitor core located in the pressing mold; The buffer structure (10) includes several guide rods (101). Two guide seats (102) are installed on the outer side wall of the guide rod (101). The two guide seats (102) located on the same guide rod (101) are respectively connected to two oppositely arranged loading seats (6). A return spring (104) that abuts against the guide seat (102) is sleeved on the outer side wall of the guide rod (101). A blocking structure (105) for controlling the return spring (104) to enter and exit the guide seat (102) is provided on the inner wall of one of the guide seats (102). The stop structure (105) includes a displacement ring (106) installed in the guide seat (102). A guide groove (108) is provided on the side wall of the guide seat (102) along the extension direction of the guide rod (101). A guide block (107) connected to the displacement ring (106) is slidably provided in the guide groove (108). An installation chamber (109) communicating with the guide groove (108) is provided in the guide seat (102). A trigger rod (110) is slidably provided in the installation chamber (109). The trigger rod (110) is connected to the guide block (107). The trigger rod (110) extends outward after passing through the guide seat (102). A limiting spring (111) is sleeved on the outer side wall of the trigger rod (110). The limiting spring (111) is connected to the inner wall of the installation chamber (109).
2. The step-type pressurized hot-pressing shaping device for capacitor cores according to claim 1, characterized in that, The two pressing platforms (3) are provided with guide holes (103) on their opposite side walls that match the guide rod (101).
3. The step-type pressurized hot-pressing shaping device for capacitor cores according to claim 2, characterized in that, The pushing structure (5) includes a push rod structure (51) installed in the housing (1). The telescopic end of the push rod structure (51) passes through the housing (1) and is placed in the pressing housing (2). The telescopic end of the push rod structure (51) is connected to one of the pressing platforms (3), and the other pressing platform (3) is fixedly installed in the pressing housing (2).
4. The step-type pressurized hot-pressing shaping device for capacitor cores according to claim 3, characterized in that, Several limiting rods (13) are provided between the two pressing platforms. The limiting rods (13) pass through the two pressing platforms (3) and are fixedly connected to the inner wall of the pressing shell (2).
5. The step-type pressurized hot-pressing shaping device for capacitor cores according to claim 1, characterized in that, The loading seat (6) has a locking groove (14) on the side wall opposite to the pressing half mold (8). A locking strip (15) is slidably provided in the locking groove (14). Both ends of the locking strip (15) are provided with limiting plates (16). One of the limiting plates (16) is fixedly set on the side wall of the locking strip (15). Both ends of the pressing half mold (8) are provided with assembly grooves (17) that match the locking strip (15). The other limiting plate (16) is slidably set on the side wall of the locking strip (15).
6. The step-type pressurized hot-pressing shaping device for capacitor cores according to claim 5, characterized in that, The locking bar (15) has an installation hole (18) on its side wall. The installation hole (18) is provided with a connecting rod (19) connected to the limiting plate (16). The installation hole (18) is provided with an adjusting spring (9) connected to the connecting rod (19).
7. The step-type pressurized hot-pressing shaping device for capacitor cores according to claim 1, characterized in that, The outer wall of the pressing shell (2) is provided with an inlet and outlet (4), and a cover (7) is provided inside the inlet and outlet (4).
8. A method for step-pressure hot-pressing and shaping of a capacitor core based on any one of claims 1-7, characterized in that, Includes the following steps: The capacitor core to be shaped is placed in a pressing mold formed by splicing two pressing half molds (8); The start-up push structure (5) drives the two pressing platforms (3) to move towards each other, carrying the loading seats (6) and pressing half molds (8) on them; under the resistance of the buffer structure (10), the two loading seats (6) slowly approach each other, so that the pressing molds gently contact and initially wrap the capacitor core; When the two loading seats (6) move to the preset distance, the buffer structure (10) is triggered, causing it to enter the guide seat (102) and the buffering effect is released; After the buffering effect of the buffer structure (10) is released, the two loading seats (6) quickly approach each other under the continuous drive of the pushing structure (5), apply a preset positive pressure to the capacitor core, and at the same time heat the capacitor core through the heating structure (11), and pre-pressurize the inside of the pressing shell (2) with low pressure through the pressurizing structure (12), and then pressurize it to positive pressure. Under the combined action of heat and pressure, the capacitor core is shaped.