Compact interconnection transmission structure of multi-channel transceiving multifunctional chip

Abstract

The invention discloses a compact interconnection transmission structure of a multi-channel transceiving multifunctional chip, which comprises a plurality of transmission structures corresponding to multiple channels, and the plurality of transmission structures at least comprise a first transmission structure and a second transmission structure; each of the first transmission structure and the second transmission structure comprises a surface-layer matching section, an inner-layer quasi-coaxial section and an inner-layer strip-shaped line section, the surface-layer matching section comprises a bonding matching disc, and the bonding matching disc is connected with a chip bonding pad through a bonding alloy wire; the inner-layer quasi-coaxial section comprises radio frequency inner cores and grounding holes arranged around the radio frequency inner cores, and the radio frequency inner cores of the first transmission structure and the second transmission structure deviate from respective centers and deviate towards the central positions of the first transmission structure and the second transmission structure; the inner-layer strip line segment comprises a strip line and a strip line tail end matching disc, and the radio frequency inner core is connected with the bonding matching disc and the strip line tail end matching disc. According to the multi-channel multi-functional chip, the problem that the multi-channel multi-functional chip can be bonded and led out only after the distance between the transmitting and receiving bonding pads is short and the routing is pulled far can be solved, and radio frequency interconnection transmission of the multi-channel multi-functional chip in a limited space is realized.

Description

Technical Field

[0001] This invention belongs to the field of radio frequency microwave technology, and specifically relates to a compact interconnect transmission structure for a multi-channel transceiver multi-functional chip. Background Technology

[0002] Currently, RF modules in the microwave and radio frequency (RF) field are trending towards miniaturization and lightness. Reduced size allows for greater integration of electronic devices, enabling more complex electronic functions. RF SiP modules are extremely small in size; a typical TR module integrates five to nine RF chips, plus several power management chips. This presents challenges due to limited space and a large number of chips. Furthermore, the need for interconnectivity between these chips and the overall module's input / output interconnectivity further restricts board space. In particular, the small spacing between transceiver pads on multi-channel, multi-functional chips typically requires extended surface traces for bonding, failing to meet the requirement of close-proximity port interconnection and transmission.

[0003] Furthermore, in high-power or high-frequency applications, channel isolation becomes increasingly important. RF SiP modules have limited size, and signals are prone to crosstalk and self-oscillation. Building Kovar alloy walls around the chips inside the SiP module can effectively improve channel isolation, but this also reduces the surface wiring space. Therefore, a compact interconnect transmission structure has become a key technology for the miniaturization of current RF SiP modules. Summary of the Invention

[0004] The purpose of this invention is to provide a compact interconnect transmission structure for a multi-channel transceiver multi-function chip, which can solve the problem that the transceiver pads of a multi-channel multi-function chip are close together and require the traces to be extended before they can be bonded and brought out, thus realizing radio frequency interconnect transmission of a multi-channel multi-function chip in a limited space.

[0005] To achieve the above objectives, one aspect of the present invention provides a compact interconnect transmission structure for a multi-channel transceiver multifunction chip, including multiple transmission structures corresponding to multiple channels, wherein the multiple transmission structures include at least a first transmission structure and a second transmission structure, and the first transmission structure and the second transmission structure are symmetrically arranged. Both the first transmission structure and the second transmission structure include a surface matching segment, an inner coaxial segment, and an inner strip segment. The surface matching segment includes a bonding matching pad and a copper-avoiding area of ​​the bonding matching pad disposed around the bonding matching pad. The bonding matching pad is connected to the chip pad through a bonding wire. The inner coaxial segment includes a radio frequency core, a first grounding hole and a second grounding hole arranged around the radio frequency core, and a coaxial copper avoidance area. The radio frequency cores of the first transmission structure and the second transmission structure are respectively offset from their respective centers and shifted toward the center position of the two. The coaxial copper avoidance area together with the first grounding hole and the second grounding hole constitute the outer metal wall of the coaxial segment, forming electromagnetic shielding for the transmitted signal. The inner strip segment includes a strip line and a strip line end matching disk. The RF core connects the bonding matching disk and the strip line end matching disk. The transmitted signal is transmitted to the strip line through the RF core and the strip line end matching disk. The first ground hole connects the surface matching segment, the inner coaxial segment and the inner strip line segment. The second ground hole connects the upper and lower ground metals of the strip line.

[0006] According to the compact interconnect transmission structure of the multi-channel transceiver multifunction chip of the present invention, the problem that the transceiver pads of the multi-channel multifunction chip are close together and need to be extended before they can be bonded can be solved, thus realizing the radio frequency interconnect transmission of the multi-channel multifunction chip in a limited space. Attached Figure Description

[0007] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort: Figure 1 This is a schematic diagram of the overall structure of a compact interconnect transmission structure according to an embodiment of the present invention; Figure 2 This is a partial structural schematic diagram of the surface matching segment and the inner strip line segment according to an embodiment of the present invention; Figure 3 This is a partial structural schematic diagram of the inner coaxial segment according to an embodiment of the present invention; Figure 4 This is a partial schematic diagram of the surface matching segment and the radio frequency core according to an embodiment of the present invention. Detailed Implementation

[0008] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0009] One embodiment of the present invention provides a compact interconnect transmission structure for a multi-channel transceiver multifunction chip, comprising multiple transmission structures corresponding to multiple channels, wherein the multiple transmission structures include at least the following: Figure 1 The diagram shows two transmission structures corresponding to two channels (one transmit channel and one receive channel / two receive channels / two transmit channels): a first transmission structure 1 and a second transmission structure 2, which are symmetrically arranged.

[0010] Both the first transmission structure 1 and the second transmission structure 2 include a surface matching segment, an inner coaxial segment, and an inner strip segment. For example... Figure 2 and Figure 3 As shown, the surface matching segment includes a bonding matching pad 3 and a bonding matching pad copper avoidance area 4. The surface matching segment can effectively offset the inductive component brought by the gold wire bonding of the chip. The inner coaxial segment includes an RF core 5, a first grounding hole 8 and a second grounding hole 9 arranged around the RF core 5, and a coaxial copper avoidance area 10. The inner strip segment includes a strip line 6 and a matching pad 7 at the end of the strip line.

[0011] The copper avoidance area 4 of the bonding matching pad is larger than that of the bonding matching pad 3. Each side of the copper avoidance area 4 has a certain gap from the sides of the bonding matching pad 3. Adjusting the size of this gap, i.e., adjusting the size of the copper avoidance area 4, can change the capacitive component of the transmission structure. Simultaneously, the copper avoidance area ensures the transmission path of the RF signal. The bonding matching pad 3 has a square structure with locally rounded protrusions, and the copper avoidance area 4 also has a square structure with locally rounded protrusions. For example... Figure 4 As shown, the copper-avoiding area 4 of the bonding matching pad is composed of a first square area 21 and a first circular area 22, and the bonding matching pad 3 is composed of a second square area 23 and a second circular area 24. The coaxial copper-avoiding area 10, together with the first grounding hole 8 and the second grounding hole 9, constitutes a coaxial outer metal wall, forming electromagnetic shielding for the transmitted signal and ensuring signal transmission.

[0012] The RF cores 5 of the first transmission structure 1 and the second transmission structure 2 are offset towards each other. This offset means that the RF cores are deviated from their respective centers and shifted towards the center of both structures. In other words, the RF core 5 is eccentrically arranged relative to the first grounding hole 8 and the second grounding hole 9 arranged around it. Figure 4 As shown, the maximum distance between the RF core and the grounding hole is denoted as Tmax, and the minimum distance between the RF core and the grounding hole is denoted as Tmin. The eccentricity is then... The eccentricity is controlled within 40%.

[0013] The RF core 5 connects the surface matching segment and the inner stripline segment, specifically connecting the bonding matching pad 3 and the stripline end matching pad 7. A first grounding hole 8, arranged around the RF core 5, connects the surface matching segment, the inner coaxial segment, and the inner stripline segment. A second grounding hole 9 connects the upper and lower ground metals of the stripline 6. The first grounding hole 8 and the second grounding hole 9 are arranged in a rotatable configuration around the RF core 5, with a radii, for example, 0.85 mm.

[0014] In one embodiment, the compact interconnect transmission structure of the present invention is applicable to Al2O3 ceramic tube shells, and the dielectric material of the first transmission structure and the second transmission structure is Al2O3 material, such as... Figure 1 As shown, the structure comprises five metal layers 11, 12, 13, 14, and 15 from top to bottom. Due to the high dielectric constant of Al₂O₃, the radius of the coaxial grounding via is relatively large, which prevents the placement of two vertical transmission structures on closely spaced chip bonding pads. Therefore, this invention employs an RF core biasing method, limiting the eccentricity to no more than 40%, thus ensuring a compact spatial layout and good RF transmission performance.

[0015] The bonding matching disk 3 and the copper-avoiding area 4 of the bonding matching disk are located in the first metal layer 11 and are used for chip bonding and lead-out; the top of the RF core 5 is connected to the bonding matching disk 3, and the bottom is connected to the matching disk 7 at the end of the stripline, thereby realizing signal connection with the stripline 6.

[0016] The coaxial copper avoidance region 10 is located on the second, third, and fourth metal layers 12, 13, and 14. The second grounding hole 9 connects to five metal layers 11, 12, 13, 14, and 15 from top to bottom, and the first grounding hole 8 connects to four metal layers 11, 12, 13, and 14 from top to bottom. The second grounding hole 9 is configured to connect to five metal layers 11, 12, 13, 14, and 15 from top to bottom, and the first grounding hole 8 is a grounding hole adjacent to both sides of the stripline 6. Due to the RF cores being offset towards each other, to prevent the grounding hole 8 from affecting the signal transmission of the stripline 6, the first grounding hole 8 is configured to connect to metal layers 11, 12, 13, and 14 from top to bottom.

[0017] The stripline 6 is placed within the dielectric between the fourth metal layer 14 and the fifth metal layer 15. The aperture of the RF core 5 is 0.127 mm, and the radius of the coaxial copper avoidance region 10 is set to 0.75 mm; the radius of the grounding hole surrounding the RF core is 0.85 mm. The eccentricity of the RF core 5 is set to 35%.

[0018] In use, the compact interconnect transmission structure of this invention connects the chip pads to the bonding matching pads 3 via bonding wires. After the chip is bonded to the bonding matching pads 3, the signal is transmitted to the inner stripline 6 via the RF core 5 and the stripline end matching pads 7.

[0019] The compact interconnect transmission structure of this invention directly bonds the chip to the bonding matching pad 3, enabling signal transmission from the surface layer to the inner layer. This reduces space waste caused by excessive traces on the surface layer and improves the integration of electronic devices. For multi-channel transceiver chips, the spacing between the chip's transceiver pads is usually small. The opposing biased RF cores can ensure a small spacing between the bonding matching pads, while the eccentricity is no more than 40%, ensuring good signal transmission. This solves the problem that the transceiver pads of multi-channel multi-functional chips are close together and usually require long traces to be bonded out. It enables signal interconnect transmission in close proximity, achieving RF interconnect transmission within a limited space. The compact structure facilitates layout, effectively increases the surface layer density of the ceramic housing, further reduces the size of the RF module, and is beneficial to improving the integration of electronic devices.

[0020] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A compact interconnect transmission structure for a multi-channel transceiver multi-functional chip, characterized in that, It includes multiple transmission structures corresponding to multiple channels, and the multiple transmission structures include at least a first transmission structure and a second transmission structure, wherein the first transmission structure and the second transmission structure are symmetrically arranged. Both the first transmission structure and the second transmission structure include a surface matching segment, an inner coaxial segment, and an inner strip segment. The surface matching segment includes a bonding matching pad and a copper-avoiding area of ​​the bonding matching pad disposed around the bonding matching pad. The bonding matching pad is connected to the chip pad through a bonding wire. The inner coaxial segment includes a radio frequency core, a first grounding hole and a second grounding hole arranged around the radio frequency core, and a coaxial copper avoidance area. The radio frequency cores of the first transmission structure and the second transmission structure are respectively offset from their respective centers and shifted toward the center position of the two. The coaxial copper avoidance area together with the first grounding hole and the second grounding hole constitute the outer metal wall of the coaxial segment, forming electromagnetic shielding for the transmitted signal. The inner strip segment includes a strip line and a strip line end matching disk. The RF core connects the bonding matching disk and the strip line end matching disk. The transmitted signal is transmitted to the strip line through the RF core and the strip line end matching disk. The first ground hole connects the surface matching segment, the inner coaxial segment and the inner strip line segment. The second ground hole connects the upper and lower ground metals of the strip line.

2. The compact interconnect transmission structure according to claim 1, characterized in that, The bonding mating disk and the copper avoidance area of ​​the bonding mating disk are square structures with local rounded protrusions. Each side of the copper avoidance area of ​​the bonding mating disk is separated from each side of the bonding mating disk by a certain gap. The capacitive component of the transmission structure can be changed by adjusting the size of the gap.

3. The compact interconnect transmission structure according to claim 1 or 2, characterized in that, The RF core is eccentrically arranged relative to the first and second grounding holes arranged around it. The maximum distance between the RF core and the first and second grounding holes is denoted as Tmax, and the minimum distance is denoted as Tmin. The eccentricity is then... .

4. The compact interconnect transmission structure according to claim 3, characterized in that, The eccentricity is no higher than 40%.

5. The packaging structure of the compact interconnect transmission structure according to claim 1 or 2, characterized in that, The dielectric material of the first and second transport structures is Al2O3.

6. The compact interconnect transmission structure according to claim 5, characterized in that, The first and second transmission structures include five metal layers from top to bottom. The bonding mating disk and the copper avoidance area of ​​the bonding mating disk are located in the first metal layer. The copper avoidance area of ​​the coaxial circuit is located in the second, third and fourth metal layers. The second grounding hole connects the five metal layers from top to bottom. The second grounding hole 8 connects the first, second, third and fourth metal layers from top to bottom. The stripline 6 is placed in the medium between the fourth metal layer and the fifth metal layer.

7. The compact interconnect transmission structure according to claim 6, characterized in that, The RF core aperture is 0.127mm, the wrap radius of the first and second ground holes is 0.85mm, the radius of the coaxial copper avoidance area is 0.75mm, and the eccentricity of the RF core is 35%.

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