Power interface device, remote control and telemetry method and satellite integrated electronic system

Abstract

The application provides a power interface device of a Flash type FPGA, comprising: an instruction receiving module configured to receive instructions from a satellite computer; an instruction analyzing module configured to analyze the instructions received by the instruction receiving module, and the analysis result of the instructions comprises remote control instructions and / or telemetry instructions; a signal driving and collecting module configured to receive the analysis result from the instruction analyzing module, and perform corresponding actions according to the remote control instructions and the telemetry instructions respectively; a telemetry information packaging module configured to, in the case that the analysis result is the telemetry instructions, receive the collected values of multiple analog signals from the signal driving and collecting module and the state information of an external load, and package the collected values of the multiple analog signals and the state information of the external load into telemetry information; and a data sending module configured to send the telemetry information to the satellite computer. The application solves the problem of poor radiation resistance of the power interface device in the prior art.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of satellite integrated electronic systems, and particularly relates to a power interface device, a remote control and telemetry method and a satellite integrated electronic system. BACKGROUND

[0002] The power interface device (PIU, Power Interface Unit) is an important component of the satellite integrated electronic system, and its main functions are responsible for the collection and processing of the entire satellite platform and satellite payload data, multi-command caching and execution, and various data communication services such as satellite platform telemetry and remote control.

[0003] The mainstream implementation methods of the power interface device currently include the following three kinds: the first kind is to realize the functions of the power interface device by the CPU (Central Processing Unit) of the on-board computer itself; the second kind is to realize the functions of the power interface device by the MCU (Microcontroller Unit) architecture; and the third kind is to realize the functions of the power interface device by the MCU+FPGA (Field Programmable Gate Array) architecture.

[0004] For the first implementation method, although the anti-radiation characteristics of the CPU of the on-board computer are relatively good, the possibility of single event upset (SEU) of the satellite in orbit is relatively low, however, this method not only increases the CPU load of the on-board computer and reduces the reliability of the satellite software, but also due to the limited memory resources of the CPU of the on-board computer itself, it is difficult to process in the case of more payload data and instructions.

[0005] For the second implementation method, although the MCU has software development advantages and can realize the functions of the power interface device through the library functions integrated by various manufacturers, however, due to the limited resources of its own IO interface and interrupt, it is difficult to meet the demand in the scene of parallel processing of multiple payload data and instructions; in addition, the low-cost MCU on the low-orbit satellite can maintain certain anti-radiation characteristics through long-time power-on operation, while the MCU on the medium-orbit and high-orbit satellite is extremely prone to single event upset phenomenon, greatly reducing the reliability and safety of the satellite integrated electronic system, and if the MCU that meets the radiation index of the medium-orbit and high-orbit satellite is used, the overall cost of the system will be greatly increased.

[0006] For the third implementation, the MCU+FPGA is used as the main control architecture to expand the interface function of the MCU and make up for the problem of limited resources of the MCU itself. However, the architecture first needs to perform data interaction between the MCU and the FPGA, for example, communication through the EMIF (External Memory Interface), and then perform data interaction between the MCU and the on-board computer. In this way, the MCU and the FPGA both need to be configured with software, which not only increases the complexity of the software, but also reduces the reliability of the software design, and further increases the overall design cost of the power interface device. In addition, the architecture still has the problem of the lack of radiation resistance of the MCU in the medium and high orbit operation as in the second implementation.

[0007] Therefore, there is an urgent need for a power interface device of a satellite integrated electronic system, which can realize multi-channel load data processing and multi-instruction parallel processing, and has high hardware integration, high reliability, and good radiation resistance. SUMMARY

[0008] The main purpose of the present application is to provide a power interface device, a remote control and telemetry method and a satellite integrated electronic system, and to solve the problems of low reliability, difficulty in multi-channel load data processing and multi-instruction parallel processing, and poor radiation resistance of the power interface device in the prior art.

[0009] To solve the above technical problems, in a first aspect, the present application provides a power interface device of a satellite integrated electronic system, the power interface device being in communication connection with an on-board computer of the satellite integrated electronic system, and the power interface device being a Flash type FPGA; the power interface device comprises: an instruction receiving module configured to receive instructions from the on-board computer; an instruction analysis module configured to analyze the instructions received by the instruction receiving module, the analysis result of the instructions including remote control instructions and / or telemetry instructions; a signal driving and collecting module connected to an external load and configured to receive the analysis result from the instruction analysis module, if the analysis result is a remote control instruction, the signal driving and collecting module drives the external load according to the remote control instruction, if the analysis result is a telemetry instruction, the signal driving and collecting module collects multi-channel analog signals and obtains state information of the external load; a telemetry information packaging module configured to receive the collected values of the multi-channel analog signals and the state information of the external load from the signal driving and collecting module if the analysis result is a telemetry instruction, and package the collected values of the multi-channel analog signals and the state information of the external load into telemetry information; and a data sending module configured to receive the telemetry information from the telemetry information packaging module and send the telemetry information to the on-board computer.

[0010] Further, the signal-driven acquisition module comprises an analog voltage acquisition unit, a thermistor voltage acquisition unit, a sun sensor signal acquisition unit, and a magnetic sensor signal acquisition unit; the analog voltage acquisition unit is configured to acquire 60 analog voltage signals, the thermistor voltage acquisition unit is configured to acquire 75 thermistor voltage signals, the sun sensor signal acquisition unit is configured to acquire 24 sun sensor signals, and the magnetic sensor signal acquisition unit is configured to acquire 3 magnetic torque signals.

[0011] Further, the thermistor voltage acquisition unit is further configured to acquire each of the first 64 thermistor voltage signals at a frequency of 8 times per second and then perform a sliding average processing, the sun sensor signal acquisition unit is further configured to acquire each of the 24 sun sensor signals at a frequency of 8 times per second and then perform a sliding average processing, and the magnetic sensor signal acquisition unit is further configured to acquire each of the 3 magnetic torque signals at a frequency of 8 times per second and then perform a sliding average processing.

[0012] Further, the signal-driven acquisition module further comprises a heater driving unit, a sun sensor driving unit, and a magnetic torque driving unit; the heater driving unit is configured to control the heaters through 48 heater driving circuits, the sun sensor driving unit is configured to control the sun sensors through 40 sun sensor driving circuits, and the magnetic torque driving unit is configured to control the magnetic torque through 3 magnetic torque driving circuits.

[0013] Further, the heater driving unit further comprises a first register configured to control the input signals of any heater driving circuit and store the state information of the heaters, the sun sensor driving unit further comprises a second register configured to control the input signals of any sun sensor driving circuit and store the state information of the sun sensors, and the magnetic torque driving unit further comprises a third register configured to control the input signals of any magnetic torque driving circuit and store the state information of the magnetic torque.

[0014] Further, the power interface device further comprises a CAN 2.0 bus and a SJA1000 bus controller integrated internally, the CAN 2.0 bus is in communication connection with the on-board computer; the CAN 2.0 bus comprises a main line and a backup line, both of which are in communication connection with the on-board computer through the SJA1000 bus controller; the instruction receiving module is further configured to receive instructions from the on-board computer via the CAN 2.0 bus, and the data sending module is further configured to send the packaged telemetry information to the on-board computer via the CAN 2.0 bus.

[0015] Further, the power interface device further comprises an important data backup module, the important data backup module is configured to be in communication connection with the on-board computer through the CAN 2.0 bus; the important data backup module is configured to receive and store important data from the on-board computer, the important data including TT&C ephemeris, injection orbit data, injection time, on-orbit task table information, satellite computer A / B machine FIFO data, satellite attitude data, satellite power data, and satellite interface state data.

[0016] Further, the telemetry information packaging module is further configured to package the important data stored in the important data backup module into telemetry information in the case that the analysis result is the telemetry instruction.

[0017] In the second aspect, the application further provides a remote control and telemetry method using the power interface device of the first aspect, comprising: an instruction receiving step of receiving an instruction from an on-board computer; an instruction analyzing step of analyzing the instruction, the analysis result of the instruction including a remote control instruction and / or a telemetry instruction; a load driving step of driving an external load according to the remote control instruction if the analysis result is the remote control instruction; an information acquiring step of acquiring a plurality of analog signals and obtaining state information of the external load if the analysis result is the telemetry instruction; a telemetry information packaging step of receiving the acquisition values of the plurality of analog signals and the state information of the external load and packaging the acquisition values of the plurality of analog signals and the state information of the external load into telemetry information if the analysis result is the telemetry instruction; and a data sending step of receiving the telemetry information and sending the telemetry information to the on-board computer.

[0018] Further, the telemetry information packaging step further comprises packaging the important data into telemetry information if the analysis result is the telemetry instruction.

[0019] In the third aspect, the application provides a satellite integrated electronic system, comprising an on-board computer, and further comprising the power interface device of the first aspect, the power interface device being in communication connection with the on-board computer.

[0020] Compared with the prior art, the application has the following advantages:

[0021] The power interface device takes a Flash-type FPGA architecture as a hardware carrier, has good radiation resistance, and has the functions of multi-channel load data processing and multi-instruction parallel processing, can realize real-time monitoring of multiple loads in the satellite integrated electronic system, can transmit telemetry information to the on-board computer in real time through the CAN 2.0 bus integrated in the power interface device, thereby realizing accurate control and maintenance of each load, further improving the reliability and safety of the operation process, and reducing the design and development cost and complexity of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 Fig. 1 is a schematic diagram of a structure of a power interface device 200 according to an embodiment of the present application;

[0023] Figure 2 Fig. 2 is a schematic diagram of another structure of the power interface device 200 according to an embodiment of the present application;

[0024] Figure 3 Fig. 3 is a schematic diagram of a flow of a remote control and telemetry method according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. However, the embodiments described below are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application. Unless otherwise explicitly indicated by the language environment or otherwise described, the same reference signs in the drawings represent the same structure or operation.

[0026] As shown in the present application and claims, unless the context clearly indicates otherwise, the words “one”, “an”, “a”, and / or “the” do not specify a singular form, but also include a plural form. Generally, the terms “comprise” and “include” only indicate that the steps and elements explicitly identified are included, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0027] Flowcharts are used in the present application to illustrate the operations performed by the system according to the embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed in sequence. Instead, various steps can be processed in reverse order or simultaneously. Meanwhile, other operations can be added to these processes, or one or more steps of operations can be removed from these processes.

[0028] Referring to Figure 1 The present application proposes a power interface device 200 for a satellite integrated electronic system 100, which is in communication connection with a satellite-borne computer 300 of the satellite integrated electronic system 100. The power interface device 200 according to the present application is a Flash-type FPGA, which includes an instruction receiving module 201, an instruction analysis module 202, a signal driving and collecting module 203, a telemetry information packaging module 204, and a data sending module 205, which are in communication connection in sequence.

[0029] Specifically, the instruction receiving module 201 is configured to receive instructions from the on-board computer 300; the instruction analysis module 202 is configured to analyze the instructions received by the instruction receiving module 201, and the analysis result of the instructions includes remote control instructions and / or telemetry instructions; the signal driving and collecting module 203 is connected to the external load and is configured to receive the analysis result from the instruction analysis module 202, if the analysis result is the remote control instructions, the signal driving and collecting module 203 drives the external load according to the remote control instructions, if the analysis result is the telemetry instructions, the signal driving and collecting module 203 collects multiple analog signals and obtains the state information of the external load; the telemetry information packaging module 204 is configured to receive the collected values of the multiple analog signals and the state information of the external load from the signal driving and collecting module 203 in the case that the analysis result is the telemetry instructions, and package the collected values of the multiple analog signals and the state information of the external load into telemetry information; the data sending module 205 is configured to receive the telemetry information from the telemetry information packaging module 204 and send the telemetry information to the on-board computer 300.

[0030] Compared with the three mainstream implementation modes (taking the CPU of the on-board computer as the architecture, taking the MCU as the architecture, and taking the MCU+FPGA as the architecture), the power interface device of the satellite integrated electronic system is designed with a hardware carrier of a Flash type FPGA architecture, which not only has good radiation resistance and can be used in the integrated electronic system of a medium-high orbit satellite, but also has the functions of multi-load data processing and multi-instruction parallel processing, further improves the reliability and safety of the operation process, and reduces the design and development cost and complexity of the chip.

[0031] Next, the power interface device of the present application will be described in detail in combination with specific embodiments.

[0032] In some embodiments of the present application, the multiple analog signals include 60 analog voltage signals, 75 voltage signals of thermistors, 24 signals of solar sensors, and 3 signals of magnetic torque devices, and the external load includes a heater, a solar sensor, and a magnetic torque device.

[0033] Please refer to Figure 2 The power interface device 200 of the present application further includes a CAN 2.0 bus and a SJA1000 bus controller integrated inside, and the CAN 2.0 bus is in communication connection with the on-board computer 300. Further, the instruction receiving module 201 is configured to receive instructions from the on-board computer 300 via the CAN 2.0 bus, and the data sending module 205 is configured to send the packaged telemetry information to the on-board computer 300 via the CAN 2.0 bus.

[0034] In some specific embodiments, the power interface device 200 communicates with the CPU mainboard of the satellite computer 300 through a CAN 2.0 bus of a VPX interface arranged on the FPGA bottom plate, the transmission rate of the CAN 2.0 bus is 500 kps, and the crystal frequency is 16 MHz. The CAN 2.0 bus includes a main line CAN A and a backup line CAN B, both of which are in communication connection with the satellite computer 300 through a SJA1000 bus controller, the main line CAN A includes a high-level signal line CANH_A and a low-level signal line CANL_A, and the backup line CAN B includes a high-level signal line CANH_B and a low-level signal line CANL_B. Generally, the CAN A interface is used by default for communication.

[0035] In some specific embodiments, the SJA1000 bus controller is a protocol chip of the CAN 2.0 bus, which is integrated into the power interface device 200 of the Flash-type FPGA in the form of an IP core realized by verilog coding, and then the protocol function of the CAN 2.0 bus is realized by using the LUT logic resource inside the Flash-type FPGA. It can be understood that the IP (Intellectual Property) core refers to the general term of integrated circuit core with intellectual property rights, which is a logic unit or functional unit of an integrated circuit with specific functions, reusability, and specific core elements.

[0036] In some specific embodiments, the CAN 2.0 bus and the SJA1000 bus controller are also in communication connection with a CAN transceiver (not shown in the figure), which is used to provide an interface between the CAN 2.0 bus and the SJA1000 bus controller and provide the function of transmitting and receiving differential signals for the SJA1000 bus controller. In this application, TJA1042 of NXP Semiconductors is selected as the CAN transceiver, which is integrated outside the power interface device 200.

[0037] It should be noted that the transmission and reception processes of the remote control instructions and the telemetry instructions are carried out in parallel, the transmission period of the telemetry instructions is once per second, i.e. 1 Hz, and the transmission of the remote control instructions is carried out according to the demand. The specific content of the remote control instructions and / or the telemetry instructions will be described in detail below.

[0038] In the present application, by integrating the functions of CAN 2.0 bus and SJA1000 chip into the internal of Flash type FPGA, the peripheral level conversion chip of the power interface device 200 is reduced, the design cost of the power interface device 200 is further reduced, and the irradiation area of the FPGA is also reduced, thereby improving the radiation resistance characteristics, on-orbit operation reliability and safety of the power interface device 200.

[0039] In some specific embodiments, the signal-driven acquisition module 203 includes an analog voltage acquisition unit, a thermistor voltage acquisition unit, a sun sensor signal acquisition unit, and a magnetic sensor signal acquisition unit. The analog voltage acquisition unit is configured to acquire 60 analog voltage signals, the thermistor voltage acquisition unit is configured to acquire 75 thermistor voltage signals, the sun sensor signal acquisition unit is configured to acquire 24 sun sensor signals, and the magnetic sensor signal acquisition unit is configured to acquire 3 magnetic torque signals.

[0040] It can be understood that when the signal-driven acquisition module 203 receives the telemetry instruction from the instruction analysis module 202, the analog voltage acquisition unit, the thermistor voltage acquisition unit, the sun sensor signal acquisition unit, and the magnetic sensor signal acquisition unit respectively acquire the above-mentioned multi-channel analog signals, and send the acquisition values of the above-mentioned multi-channel analog signals to the telemetry information packaging module 204.

[0041] In some specific embodiments, the power interface device 200 of the present application further has three data buffer areas in its internal, including an analog voltage buffer area, a thermistor voltage buffer area, and a sun sensor signal buffer area. The analog voltage buffer area is used to buffer the acquisition values of 60 analog voltages, the thermistor voltage buffer area is used to buffer the acquisition values of 75 thermistor voltages, and the sun sensor signal buffer area is used to buffer the acquisition values of 24 sun sensor signals.

[0042] In some specific embodiments, the analog voltage acquisition unit is provided with 4 pieces of HI9P0546 analog channel switch chips for acquiring 60 analog voltage signals. Each piece of H19P0546 chip has one Enable signal and four channel selection signals (Addr3~Addr0). The Enable signals of each piece of H19P0546 chip are used independently, and the channel selection signals of the four pieces of H19P0546 chips are multiplexed.

[0043] The analog voltage acquisition unit is further provided with an AD1674 analog-digital conversion chip, the AD1674 chip is respectively connected with four H19P0546 chips, and the 60 analog voltage signals are first output to the AD1674 chip for AD conversion and then transmitted to the analog voltage buffer area for buffering. The specific acquisition of the 60 analog signals on the four H19P0546 chips is shown in Table 1.

[0044] Table 1 Acquisition of 60 analog voltage signals in the analog voltage acquisition unit

[0045] Corresponding analog channel number 0546 Serial number 0546 Identification number 0546 Channel number (Addr3~Addr0) Vin1~ Vin 15 Enable1 U24 IN1~IN15 Vin 16~ Vin 30 Enable2 U27 IN1~IN15 Vin 31~ Vin 45 Enable3 U30 IN1~IN15 Vin 46~ Vin 60 Enable4 U33 IN1~IN15

[0046] In some specific embodiments, the thermistor voltage acquisition unit is provided with five HI9P0546 analog channel switch chips for acquiring 75 thermistor voltage signals, each HI9P0546 chip has one enable signal and four channel selection signals (Addr3-Addr0), the enable signals of each H19P0546 chip are independently used, and the channel selection signals of the five H19P0546 chips are multiplexed.

[0047] Further, the HI9P0546 analog channel switch chip of the thermistor voltage acquisition unit is configured to acquire each of the first 64 thermistor voltage signals at a frequency of 8 times per second and then perform a sliding average processing, so as to suppress signal noise and improve data signal-to-noise ratio.

[0048] The thermistor voltage acquisition unit is further provided with an AD1674 analog-digital conversion chip, the AD1674 chip is respectively connected with five H19P0546 chips, the 75 thermistor voltage signals are first output to the AD1674 chip for AD conversion and then transmitted to the thermistor voltage buffer area for buffering. The specific acquisition of the 75 analog signals on the four H19P0546 chips is shown in Table 2.

[0049] Table 2 Acquisition of 75 thermistor voltage signals in the thermistor voltage acquisition unit

[0050] Corresponding thermistor channel number 0546 Serial number 0546 Identification number 0546 Channel number (Addr3~Addr0) TMP01~ TMP 15 Enable1 U37 IN1~IN15 TMP 16~ TMP 30 Enable2 U40 IN1~IN15 TMP 31~ TMP 45 Enable3 U43 IN1~IN15 TMP 46~ TMP 60 Enable4 U46 IN1~IN15 TMP 61~ TMP 75 Enable5 U38 IN1~IN15

[0051] In some specific embodiments, the solar sensor signal acquisition unit is provided with two pieces of HI9P0546 analog channel switch chips for acquiring the current or voltage signals of 24 solar sensors, each piece of HI9P0546 chip has one Enable signal and four channel selection signals (Addr3~Addr0), the Enable signals of each piece of H19P0546 chip are independently used, and the channel selection signals of the two pieces of H19P0546 chips are multiplexed.

[0052] Further, the HI9P0546 analog channel switch chip of the solar sensor signal acquisition unit is configured to acquire each of the current or voltage signals of the first 24 solar sensors at a frequency of 8 times per second and then perform sliding average processing, so as to suppress signal noise and improve data signal-to-noise ratio.

[0053] The solar sensor signal acquisition unit is also provided with one piece of AD1674 analog-to-digital conversion chip, which is in communication connection with the two pieces of H19P0546 chips, and the current or voltage signals of the above-mentioned 24 solar sensors are first output to the AD1674 chip for AD conversion and then transmitted to the solar sensor signal buffer area for buffering. The specific acquisition of 75 analog signals on the four pieces of H19P0546 chips is shown in Table 3.

[0054] Table 3 Acquisition of 24 solar sensor signals of the solar sensor signal acquisition unit

[0055] Corresponding solar sensor signal channel number 0546 Serial number 0546 Identification number 0546 Channel number (Addr3~Addr0) TMP01~ TMP 12 Enable1 U57 IN1~IN12 TMP 13~ TMP 24 Enable2 U61 IN1~IN12

[0056] In some specific embodiments, the magnetic sensor signal acquisition unit includes an MMC5983 sensor chip, and the MMC5983 chip acquires the signals of three magnetic torque devices through an SPI interface (Serial Peripheral Interface). Specifically, the MMC5983 sensor chip includes four SPI interfaces of MAG_SCK, MAG_CS, MAG_SDO, and MAG_SDI, and acquires the signal data of three magnetic torque devices through the above interfaces, and the signal of each magnetic torque device is acquired at a frequency of 8 times per second and then subjected to sliding average processing, so as to improve the signal-to-noise ratio of data.

[0057] In some specific embodiments, the signal driving and acquisition module 203 further includes a heater driving unit, a solar sensor driving unit, and a magnetic torque device driving unit, the heater driving unit is configured to control the heater through 48 heater driving circuits, the solar sensor driving unit is configured to control the solar sensor through 40 solar sensor driving circuits, and the magnetic torque device driving unit is configured to control the magnetic torque device through three magnetic torque device driving circuits.

[0058] It can be understood that when the signal-driven acquisition module 203 receives the remote control instruction from the instruction analysis module 202, the heater driving unit, the high-sensitivity driving unit, and the magnetic torque driving unit drive the corresponding loads respectively.

[0059] In some specific embodiments, each heater driving circuit includes an F_WK1 port and a VCC_WK1 port, wherein the F_WK1 port is connected with the IO pin of the heater driving unit, when the heater driving unit outputs high level "1", the corresponding heater is turned on through this heater driving circuit, and when the heater driving unit outputs low level "0", the corresponding heater of this heater driving circuit is turned off.

[0060] In some specific embodiments, the heater driving unit further includes a first register configured to control the input signal of any heater driving circuit and send the state information of the corresponding heater to the telemetry information packaging module. The bit width of the first register is set to 48 bits, i.e. [47:0], and 48 heater driving circuits are arranged in the first register, and each bit of the first register is used to control the input signal of the heater driving circuit of one of the 48 heater driving circuits.

[0061] It can be understood that the state information of the heater is expressed by high and low level signals of "0" or "1": when the heater is in the on state, the first register stores the corresponding high level signal "1", and when the heater is in the off state, the first register stores the corresponding low level signal "0".

[0062] In some specific embodiments, the high-sensitivity driving unit further includes a second register, the bit width of the second register is set to 40 bits, i.e. [39:0], and each bit of the second register is used to control the input signal of the high-sensitivity driving circuit of one of the 40 high-sensitivity driving circuits and store the state information (i.e. high and low level signals of "0" or "1") of the corresponding solar sensor. Each high-sensitivity driving circuit generates the same pulse signal, the pulse width is 160 ms, and the period is 1 s, and the high and low levels output by the pulse signal drive the solar sensor.

[0063] In the present application, DRV8871 driving chip is used as the hardware carrier of the magnetic torque driving unit, and 3 magnetic torque driving circuits are arranged on the DRV8871 driving chip; the magnetic torque includes CLJX, CLJY, and CLJZ, and each magnetic torque driving circuit controls one of the magnetic torques, taking the magnetic torque CLJX as an example, the corresponding magnetic torque driving circuit thereof includes two signal input ports CLJX_IN1 and CLJX_IN2 and two signal output ports YC_CLJX and YC_CLJX.

[0064] In some specific embodiments, the magnetic torque driver driving unit further comprises three third registers, each of which is set to have a bit width of 2 bits, i.e., [1:0], and each of which is configured to control the input signal of a corresponding magnetic torque driver circuit and store the state information of the corresponding magnetic torque driver, i.e., the high or low level signal of "0" or "1".

[0065] In some specific embodiments, the state information of the external load is characterized by the following physical quantities: for the thermistor, the state information includes the real-time acquisition voltage value of the thermistor, which represents the actual temperature of the current temperature measurement point; for the sun sensor, the state information includes the real-time acquisition current value of the sun sensor, which represents the sun center point orientation; for the magnetic torque driver, the state information includes the magnetic field strength acquired by the magnetic sensor in real time, which represents the satellite attitude angle.

[0066] The thermistor used is a negative temperature coefficient thermistor (NTC, Negative Temperature Coefficient), which has the characteristic that as the temperature T rises, the resistance value R becomes smaller and smaller, at which time the measured voltage value U of the thermistor also becomes smaller and smaller. Therefore, by converting the voltage value U into the resistance value R through the relationship R=10U / (Vref-U), and combining the R-T table provided by the thermistor manufacturer, the temperature T of the thermistor can be indirectly obtained by directly measuring the voltage value U.

[0067] The sun sensor is a sensor installed on the satellite at a fixed position. When the current of a certain sun sensor is much larger than that of other sun sensors, it indicates that the sun position is in the field of view of the sun sensor at this time, and combined with the position label of the sun sensor, the current attitude information of the sun relative to the satellite can be obtained.

[0068] The magnetic sensor acquires the magnetic field strength of the magnetic torque driver of the X, Y, and Z axes in real time. Assuming that the digital quantities output by the magnetic torque drivers of the X, Y, and Z axes are x_raw, y_raw, and z_raw, respectively, the three-axis magnetic field strengths are B_x=x_raw*S, B_y=y_raw*S, and B_z=z_raw*S, respectively, where S is the sensitivity of the corresponding magnetic sensor.

[0069] In some specific embodiments, the signal driving and acquisition module 203 is further configured to acquire the working current and working voltage of other loads to determine whether their working states are normal and whether in-orbit latching occurs.

[0070] It can be understood that when the signal-driven acquisition module 203 receives the telemetry instruction from the instruction analysis module 202, the heater driving unit, the g-sensor driving unit and the magnetic torque driving unit read the corresponding load state information stored in the first register, the second register and the third register respectively, and send the above state information to the telemetry information packaging module 204.

[0071] Please refer to Figure 1 The power interface device 200 of the application further comprises an important data backup module 206, which is in communication connection with the on-board computer 300 through the CAN 2.0 bus, and is configured to receive and store important data from the on-board computer 300.

[0072] In some specific embodiments, the storage space of the important data backup module 206 is divided into 8 regions, and each region is allocated a space size of 512 bytes. The on-board computer 300 has 8 types of important data to be backed up, which are: TT&C ephemeris table, injection orbit data, injection time, on-orbit task table information, satellite attitude data, satellite power data, and satellite interface state data. The 8 types of data occupy about 4KB of space, and the corresponding telemetry is identified by "state data 1 update count", "state data 2 update count",..., "state data 8 update count". Each telemetry is represented by a single-byte unsigned integer, and there are 8 bytes in total. During the running of the satellite software, when the above important data changes, the on-board computer 300 sends the corresponding data block to the power interface device 200 through the CAN 2.0 bus in a broadcast manner, and the power interface device 200 receives and stores the corresponding data block of the important data through the important data backup module 206.

[0073] In some specific embodiments, the telemetry information packaging module 204 is further configured to, in the case that the analysis result of the instruction is a telemetry instruction, package the important data stored in the important data backup module 206 into telemetry information, and send the above telemetry information to the data sending module 205, and the data sending module 205 further sends the telemetry information containing the above important data to the on-board computer 300 through the CAN 2.0 bus.

[0074] The power interface device 200 of the application takes a Flash type FPGA architecture as a hardware carrier, has good radiation resistance, and has the functions of multi-channel load data processing and multi-instruction parallel processing, can realize real-time monitoring of multiple loads in the satellite integrated electronic system 100, and transmit the telemetry information to the on-board computer 300 in real time through the CAN 2.0 bus integrated in the power interface device 200, so as to realize accurate control and maintenance of each load and provide safety guarantee for long-term on-orbit operation of the satellite.

[0075] Referring to Figure 1 The application also provides a satellite integrated electronic system 100 comprising an on-board computer 300 and the power interface device 200 as described above, wherein the power interface device 200 is in communication connection with the on-board computer 300.

[0076] The details of the power interface device 200 in the embodiment can be referred to the foregoing embodiment, which will not be described here.

[0077] Referring to Figure 3 The application also provides a remote control and telemetry method using the power interface device, which specifically comprises the following steps.

[0078] An instruction receiving step is arranged to receive instructions from the on-board computer;

[0079] An instruction analyzing step is arranged to analyze the instructions, and the analysis result of the instructions comprises remote control instructions and / or telemetry instructions;

[0080] A load driving step is arranged to drive the external load according to the remote control instructions if the analysis result is the remote control instructions;

[0081] An information obtaining step is arranged to collect multi-channel analog signals and obtain the state information of the external load if the analysis result is the telemetry instructions;

[0082] A telemetry information packaging step is arranged to receive the collection values of the multi-channel analog signals and the state information of the external load, and package the collection values of the multi-channel analog signals and the state information of the external load into telemetry information if the analysis result is the telemetry instructions;

[0083] A data sending step is arranged to receive the telemetry information and send the telemetry information to the on-board computer.

[0084] In some specific embodiments, the telemetry information packaging step further comprises packaging important data into telemetry information if the analysis result is the telemetry instructions.

[0085] In some specific embodiments, in the instruction resolving step, the instruction resolving module 202 first judges whether the current instruction meets the protocol requirement, if the instruction does not meet the protocol requirement, returns an error identification code and ends the process; if the instruction meets the protocol requirement, resolves the current instruction.

[0086] The above disclosure of the application is merely exemplary and does not limit the application. Although the application has been described in detail with reference to specific embodiments, those skilled in the art will recognize that various changes and modifications can be made to the application without departing from the spirit and scope of the application. Such changes and modifications are intended to be included within the scope of the application.

[0087] Some embodiments use numerical values to describe components, quantities of attributes, it should be understood that such numerical values used in the description of the embodiments are in some examples modified by the words "about", "approximately", or "generally". Unless otherwise stated, "about", "approximately" or "generally" indicates that the stated numerical value allows for a ±20% variation. Accordingly, numerical values used in the specification and claims of some embodiments are approximations. The approximation is provided considering reasonable variation in individual measurements, as desired in the individual embodiment. In some embodiments, numerical values are presented in a form that is understood as having a specified significant digits and employing standard rounding. Although the numerical ranges and parameters setting forth the broadest scope of the application in some embodiments are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. The numerical values set forth in the specific examples are provided to be as precise as reasonably possible. However, some variations may occur depending on the standard variation and applicable rule of each relevant art.

[0088] Although the application has been described with reference to specific embodiments, it is understood that those skilled in the art can make various equivalent changes and modifications to the above embodiments without departing from the spirit and scope of the application. Therefore, any changes, modifications and variations of the above embodiments within the spirit and scope of the application will fall within the scope of the application.

Claims

1. A power interface device (200) for a satellite integrated electronic system (100), the power interface device (200) being communicatively connected to the onboard computer (300) of the satellite integrated electronic system (100), characterized in that, The power interface device (200) is a Flash-type FPGA; The power interface device (200) includes: The instruction receiving module (201) is configured to receive instructions from the onboard computer (300); The instruction parsing module (202) is configured to parse the instructions received by the instruction receiving module (201), and the parsing result of the instructions includes remote control instructions and / or telemetry instructions; The signal-driven acquisition module (203) is connected to the external load and is configured to receive the parsing result from the instruction parsing module (202). If the parsing result is a remote control instruction, the signal-driven acquisition module (203) drives the external load according to the remote control instruction. If the parsing result is a telemetry instruction, the signal-driven acquisition module (203) acquires multiple analog signals and obtains the status information of the external load. The telemetry information packaging module (204) is configured to receive the acquisition values ​​of the multi-channel analog signals and the status information of the external load from the signal-driven acquisition module (203) when the parsing result is a telemetry instruction, and to package the acquisition values ​​of the multi-channel analog signals and the status information of the external load into telemetry information. The data transmission module (205) is configured to receive the telemetry information from the telemetry information packaging module (204) and send the telemetry information to the onboard computer (300).

2. The power interface device (200) according to claim 1, characterized in that, The signal-driven acquisition module (203) includes an analog voltage acquisition unit, a thermistor voltage acquisition unit, a solar sensor signal acquisition unit, and a magnetic sensor signal acquisition unit; The analog voltage acquisition unit is configured to acquire 60 channels of analog voltage signals. The thermistor voltage acquisition unit is configured to acquire voltage signals from 75 thermistors. The solar sensor signal acquisition unit is configured to acquire signals from 24 solar sensors. The magnetic sensor signal acquisition unit is configured to acquire signals from three magnetic torquers.

3. The power interface device (200) according to claim 2, characterized in that, The thermistor voltage acquisition unit is further configured to acquire the voltage signal of each of the first 64 thermistors out of the 75 thermistors at a frequency of 8 times per second, and then perform a moving average processing. The solar sensor signal acquisition unit is further configured to acquire each of the 24 solar sensors' signals at a frequency of 8 times per second and then perform a moving average processing. The magnetic sensor signal acquisition unit is further configured to acquire each signal of the three magnetic torquers at a frequency of 8 times per second and then perform a moving average processing.

4. The power interface device (200) according to claim 1, characterized in that, The signal drive acquisition module (203) also includes a heater drive unit, a tert-sensor drive unit, and a magnetic torque drive unit; The heater drive unit is configured to control the heater via 48-channel heater drive circuitry. The solar sensor drive unit is configured to control the solar sensor via 40-channel solar sensor drive circuitry. The magnetic torque drive unit is configured to control the magnetic torque via a 3-way magnetic torque drive circuit.

5. The power interface device (200) according to claim 4, characterized in that, The heater driving unit further includes a first register, which is configured to control the input signals of any of the heater driving circuits and store the status information of the heater. The solar sensor driving unit further includes a second register, which is configured to control the input signals of any of the solar sensor driving circuits and store the state information of the solar sensor. The magnetic torque drive unit further includes a third register, which is configured to control the input signal of any of the magnetic torque drive circuits and store the state information of the magnetic torque.

6. The power interface device (200) according to any one of claims 1-5, characterized in that, The power interface device (200) further includes an integrated CAN 2.0 bus and an SJA1000 bus controller, the CAN 2.0 bus being communicatively connected to the onboard computer (300); The CAN 2.0 bus includes a main line and a backup line, both of which are connected to the onboard computer (300) via the SJA1000 bus controller. The instruction receiving module (201) is further configured to receive instructions from the onboard computer (300) via the CAN 2.0 bus, and the data sending module (205) is further configured to send the packaged telemetry information to the onboard computer (300) via the CAN 2.0 bus.

7. The power interface device (200) according to claim 6, characterized in that, The power interface device (200) further includes an important data backup module (206), which is configured to communicate with the onboard computer (300) via the CAN 2.0 bus; The important data backup module (206) is configured to receive and store important data from the onboard computer (300), including telemetry and control ephemeris, injected orbit data, injection time, on-orbit mission table information, FIFO data of the satellite service computer A / B machine, satellite attitude data, satellite power data, and status data of each satellite interface.

8. The power interface device (200) according to claim 7, characterized in that, The telemetry information packaging module (204) is further configured to package the important data stored in the important data backup module (206) into the telemetry information when the parsing result is the telemetry instruction.

9. A remote control and telemetry method using a power interface device as described in any one of claims 1-8, characterized in that, include: The instruction receiving step involves receiving instructions from the onboard computer. The instruction parsing step parses the instruction, and the parsing result of the instruction includes remote control instructions and / or telemetry instructions; In the load driving step, if the parsing result is a remote control command, the external load is driven according to the remote control command. The information acquisition step involves, if the parsing result is a telemetry command, acquiring the multi-channel analog signals and obtaining the status information of the external load; The telemetry information packaging step involves, if the parsing result is a telemetry instruction, receiving the acquired values ​​of the multi-channel analog signals and the status information of the external load, and packaging the acquired values ​​of the multi-channel analog signals and the status information of the external load into telemetry information. The data transmission step involves receiving the telemetry information and sending it to the onboard computer.

10. The remote control and telemetry method according to claim 9, characterized in that, Also includes: The critical data backup step involves receiving and storing important data from the onboard computer. The telemetry information packaging step further includes, if the parsing result is a telemetry instruction, packaging the important data into the telemetry information.

11. A satellite integrated electronic system (100), comprising an onboard computer (300), characterized in that, It also includes a power interface device (200) as claimed in any one of claims 1-8.

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