Chip packaging auxiliary device, chip packaging method and chip assembly

Abstract

The invention relates to the technical field of chip processing, and discloses a chip packaging auxiliary device, a chip packaging method and a chip assembly. The chip packaging auxiliary device comprises a suction head, a swing arm and a driving unit, the suction head is used for adsorbing the side, away from a welding column, of a chip, and the swing arm is arranged at the upper end of the suction head; the driving unit is arranged at the end, away from the suction head, of the swing arm and can drive the swing arm to swing in the vertical plane, the included angle between the swing angle and the vertical direction is a first preset angle, and the driving unit can further drive the swing arm to ascend and descend in the vertical direction. The chip packaging auxiliary device provided by the invention can realize the uniformity of dipping the soldering flux among a plurality of welding columns of the chip.

Description

Technical Field

[0001] This invention relates to the field of chip assembly processing technology, and in particular to a chip packaging auxiliary device and a chip assembly. Background Technology

[0002] In the current FCBGA (Flip Chip Ball Grid Array) chip flipping process, the chip needs to be attracted so that the solder pillars are coated with flux to facilitate subsequent soldering between the chip and the substrate.

[0003] When the chip has no warpage or only minor warpage, vertical pick-up operation is sufficient for the job requirements. However, with the development and widespread application of AI technology, chips manufactured using advanced packaging processes integrate multiple chips internally and are protected by molding compound. The thermal expansion coefficients of different materials are difficult to match, which can lead to varying degrees of warpage in the entire chip, i.e., the chip exhibits smiley face warpage (the definition of smiley face warpage is: when the solder pillars are facing down, the chip presents a smiley face shape, i.e., the middle is low and the two sides are high).

[0004] When a chip exhibits smiley-face warping, due to the limited flux depth, it is impossible to ensure sufficient flux contact at the four corners of the chip's solder pillars through continuous descent. Figure 1 As shown, this results in the soldering posts 11 at the four corners of chip 1 failing to pick up flux. When there is no flux in the four corner areas of chip 1, the adhesion between chip 1 and substrate 2 will exhibit adhesion in the middle but no adhesion at the four corners. Therefore, in the subsequent X-ray confirmation of the mounting position before the reflow oven, there may be corner issues affecting the judgment of the mounting position (it cannot be confirmed whether the corner is caused during mounting or due to lack of adhesion), resulting in multiple adjustments and wasting manpower and machine time. Furthermore, as... Figure 2 As shown, when the solder pillars 11 in the four corner areas of chip 1 are without flux, there will be a problem of poor soldering after chip mounting, which will affect the soldering quality and reliability of the product.

[0005] Therefore, there is an urgent need for a chip packaging auxiliary device, a chip packaging method, and a chip assembly to solve the above problems. Summary of the Invention

[0006] Based on the above, the purpose of this invention is to provide a chip packaging auxiliary device, a chip packaging method, and a chip assembly, which can achieve uniform flux application between multiple solder pillars of the chip.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] Chip packaging auxiliary device, including:

[0009] The suction head and the swing arm are provided, wherein the suction head is used to pick up the chip on the side away from the soldering post, and the swing arm is disposed at the upper end of the suction head;

[0010] A drive unit is disposed at the end of the swing arm away from the suction head. The drive unit can drive the swing arm to swing in the vertical plane, and the angle between the swing angle and the vertical direction is a first preset angle. The drive unit can also drive the swing arm to rise and fall in the vertical direction.

[0011] As a preferred embodiment of the chip packaging auxiliary device, the driving unit includes:

[0012] A swing assembly includes a swing drive, wherein the swing arm is disposed at the swing end of the swing assembly, and the swing drive can drive the swing end to swing in a vertical plane;

[0013] A lifting assembly includes a lifting drive component, and a swing component is disposed at the lifting end of the lifting assembly. The lifting drive component can drive the lifting end to move up and down in the vertical direction.

[0014] As a preferred embodiment of the chip packaging auxiliary device, the driving unit includes:

[0015] A swing assembly includes a swing drive, wherein the swing arm is disposed at the swing end of the swing assembly, and the swing drive can drive the swing end to swing in a vertical plane;

[0016] The swing arm is telescopic to change the distance between the suction head and the swing end.

[0017] As a preferred embodiment of a chip packaging auxiliary device, the driving unit can drive the swing arm to swing along two vertically arranged planes.

[0018] As a preferred embodiment of a chip packaging auxiliary device, the swing plane of the swing arm is arranged parallel to the longest side of the chip.

[0019] As a preferred embodiment of the chip packaging auxiliary device, the chip packaging auxiliary device further includes a translation unit, the translation unit includes a translation drive, the drive unit is disposed at the translation end of the translation unit, and the translation drive can drive the translation end to move in the horizontal plane.

[0020] The chip packaging method employs a chip packaging auxiliary device as described in any of the above schemes to apply flux; the chip packaging method includes:

[0021] The suction head of the chip packaging auxiliary device adsorbs the chip on the side away from the welding post, swings in a first direction in the vertical plane at a second preset angle, and then descends until the welding post is immersed in the flux at a preset depth, wherein the second preset angle is less than or equal to the first preset angle.

[0022] It swings in the opposite direction of the first direction for twice the second preset angle and then rises.

[0023] As a preferred embodiment of the chip packaging method, the chip packaging auxiliary device further includes, before swinging, obtaining the maximum warpage angle of the chip in order to calculate the second preset angle.

[0024] As a preferred embodiment of the chip packaging method, the method further includes the following step before the suction head picks up the chip:

[0025] The adsorption device adsorbs the upper side of the chip with the welding post facing upwards and flips the chip so that the welding post faces downwards;

[0026] The chip packaging auxiliary device adsorbs the chip from above on the side away from the welding post, and the adsorption device detaches from the adsorption of the chip;

[0027] The chip packaging auxiliary device moves the chip over the flux;

[0028] And / or, after the chip packaging auxiliary device swings and rises, it further includes:

[0029] The chip packaging auxiliary device moves the chip above the substrate and mounts the chip onto the substrate.

[0030] The chip assembly includes the chip packaging auxiliary device described in any of the above solutions.

[0031] The beneficial effects of this invention are as follows:

[0032] This invention utilizes a suction head to adsorb chips. Since the solder pillars on the chip need to be dipped in flux later, these pillars are located below the chip, and the suction head adsorbs the chip on the upper side away from the solder pillars; at this point, the chip's edge is curved upwards. A swing arm connects the suction head and a drive unit, located at the end of the swing arm away from the suction head. This avoids interfering with the suction head's chip adsorption and provides space for swinging. Specifically, the drive unit can drive the swing arm, along with the suction head, to move vertically up and down to pick up flux. Furthermore, the drive unit can also drive the swing arm and the suction head to swing vertically, and the angle between the swing angle and the vertical direction is a first preset angle, so as to ensure that the highest point of the chip edge warping can be dipped in flux; and during the swing dipping process, each solder pillar on the chip can be dipped in flux, improving the uniformity of flux dipping between multiple solder pillars. This not only reduces the problem of poor bonding of chips in the subsequent chip mounting process, thus effectively avoiding chip misalignment and transfer, but also avoids interference factors in judging mounting accuracy, ensuring the accuracy and efficiency of mounting inspection. In addition, it effectively avoids failures caused by cold solder joints, ensuring welding quality and welding reliability, and improving packaging yield. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the chip and substrate after mounting, provided in the background technology.

[0035] Figure 2 This is a schematic diagram of chip and substrate welding provided in the background technology;

[0036] Figure 3 This is a schematic diagram of a chip packaging auxiliary device provided in a specific embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of another chip packaging auxiliary device provided in a specific embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of a rectangular chip provided in a specific embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of a square chip provided in a specific embodiment of the present invention;

[0040] Figure 7This is a flowchart illustrating the chip packaging method provided in a specific embodiment of the present invention. Figure 1 ;

[0041] Figure 8 This is a flowchart illustrating the chip packaging method provided in a specific embodiment of the present invention. Figure 2 ;

[0042] Figure 9 This is a flowchart illustrating the chip packaging method provided in a specific embodiment of the present invention. Figure 3 ;

[0043] Figure 10 This is a flowchart illustrating the chip packaging method provided in a specific embodiment of the present invention. Figure 4 ;

[0044] Figure 11 This is a flowchart illustrating the chip packaging method provided in a specific embodiment of the present invention. Figure 5 ;

[0045] Figure 12 This is a flowchart illustrating the chip packaging method provided in a specific embodiment of the present invention. Figure 6 ;

[0046] Figure 13 This is a schematic diagram of the chip and substrate after mounting according to a specific embodiment of the present invention.

[0047] In the picture:

[0048] 1. Chip; 11. Welding post; 2. Substrate;

[0049] 100. Chip packaging auxiliary device; 110. Suction head; 120. Swing arm; 130. Drive unit; 131. Swing assembly; 132. Lifting assembly; 140. Translation unit;

[0050] 210. Adsorption device; 220. Fixture; 230. Flux. Detailed Implementation

[0051] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0052] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0053] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0054] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0055] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0056] like Figures 3-6 As shown, this embodiment provides a chip packaging auxiliary device. The chip packaging auxiliary device 100 includes a suction head 110, a swing arm 120, and a driving unit 130. The suction head 110 is used to adsorb the side of the chip 1 away from the soldering post 11. The swing arm 120 is disposed at the upper end of the suction head 110. The driving unit 130 is disposed at the end of the swing arm 120 away from the suction head 110. The driving unit 130 can drive the swing arm 120 to swing in the vertical plane, and the angle between the swing angle and the vertical direction is a first preset angle. The driving unit 130 can also drive the swing arm 120 to rise and fall in the vertical direction.

[0057] The suction head 110 is used to adsorb the chip 1. Since the solder pillars 11 of the chip 1 need to be dipped in flux 230 later, the solder pillars 11 are located below the chip 1, and the suction head 110 adsorbs the chip 1 on the upper side away from the solder pillars 11; at this time, the edge of the chip 1 is curved upwards. A swing arm 120 is used to connect the suction head 110 and the drive unit 130. The drive unit 130 is located at the end of the swing arm 120 away from the suction head 110 to avoid affecting the suction head 110's adsorption of the chip 1, while providing swing space. Specifically, the drive unit 130 can drive the swing arm 120 and the suction head 110 to move up and down in the vertical direction to dip in flux 230. Furthermore, the drive unit 130 can also drive the swing arm 120 and the suction head 110 to swing in the vertical plane, and the angle between the swing angle and the vertical direction is a first preset angle, so as to ensure that the highest point of the edge warping of the chip 1 can be dipped in flux 230; and during the swing dipping process, each solder pillar 11 on the chip 1 can be dipped in flux 230, which improves the uniformity of flux 230 dipping among multiple solder pillars 11. This not only reduces the problem of poor adhesion of the chip 1 during subsequent placement, thus effectively avoiding chip 1 offset and transfer, but also avoids interference factors in judging placement accuracy, ensuring the accuracy and efficiency of placement detection. In addition, it effectively avoids failure caused by cold solder joints, ensures the welding quality and welding reliability, and improves the packaging yield.

[0058] In this embodiment, the suction head 110 is provided with multiple vacuum holes to achieve adsorption of the chip 1. All the vacuum holes are connected to a negative pressure device, which can provide a negative pressure environment for the vacuum holes. By adsorbing the chip 1 through multiple vacuum holes, the adsorption is more reliable.

[0059] Specifically, such as Figure 3 As shown, the drive unit 130 includes a swing assembly 131 and a lifting assembly 132 to respectively realize the swing and lifting of the swing arm 120 and the suction head 110, as well as the chip 1 adsorbed by the suction head 110. The swing assembly 131 includes a swing drive member, and the swing arm 120 is disposed at the swing end of the swing assembly 131. When the swing drive member is activated, it can drive the swing end and the swing arm 120 disposed at the swing end to swing in the vertical plane. The lifting assembly 132 includes a lifting drive member, and the swing assembly 131 is disposed at the lifting end of the lifting assembly 132. When the lifting drive member is activated, it can drive the lifting end and the swing assembly 131 disposed at the lifting end to rise and fall in the vertical direction.

[0060] When the aforementioned drive unit 130 is working, the swing drive first swings the swing arm 120 to a first preset angle; then the lifting drive lowers the lifting end to a preset position. This setting, compared to lowering first and then swinging, can avoid some of the solder pillars 11 on the chip 1 from being dipped in flux 230 a second time, ensuring the uniformity of flux 230 dipping between the solder pillars 11, and at the same time avoiding the waste of flux 230.

[0061] In other embodiments, such as Figure 4 As shown, the drive unit 130 includes a swing assembly 131, which includes a swing drive component. A swing arm 120 is disposed at the swing end of the swing assembly 131, and the swing drive component can drive the swing end to swing in a vertical plane. The difference is that the swing arm 120 is designed to be telescopic, meaning that the telescopic swing arm 120 replaces the aforementioned lifting assembly 132, resulting in a simpler structure while still allowing for changes in the distance between the suction head 110 and the swing end. The telescopic swing arm 120 includes at least two segments, and the distance between the suction head 110 and the swing end can be adjusted by changing the overlap length between adjacent segments.

[0062] In this embodiment, the chip 1 packaging auxiliary device further includes a translation unit 140. The translation unit 140 is used to drive the suction head 110, the swing arm 120, and the drive unit 130 to move in the horizontal direction, thereby realizing the conversion of the chip 1 position between different workstations. Specifically, the translation unit 140 includes a translation drive, and the drive unit 130 is disposed at the translation end of the translation unit 140. When the translation drive works, it enables the translation end, as well as the suction head 110, the swing arm 120, and the drive unit 130 disposed at the translation end, to move in the horizontal plane.

[0063] For example, the swing drive can be configured as a rotary drive element, such as a servo motor or rotary cylinder; or as a linear drive element in conjunction with a reversing structure, such as a starter push rod and structure. The lifting drive can be configured as a cylinder or electric push rod, or the lifting assembly 132 can be configured as a KK module, achieving a higher degree of integration. The translation drive is similar to the lifting drive and will not be described further here.

[0064] It is worth noting that the aforementioned chip 1 packaging auxiliary device can not only adsorb warped chip 1 and dip it in flux 230, but also adsorb warped chip 1 and dip it in solder. Furthermore, if chip 1 is not warped, or the degree of warping does not affect the application of flux 230, the chip 1 packaging auxiliary device is still applicable; that is, the drive unit 130 only needs to drive the suction head 110 to rise and fall vertically to dip the chip, without any oscillation. Those skilled in the art can operate it according to actual needs, thus broadening its applicability.

[0065] For example, such as Figure 5 and Figure 6As shown, chip 1 can be rectangular or square. It is worth noting that chip 1 has uniform circumferential warping, therefore the corners of rectangles and squares have greater warping. Optionally, the swing plane of the swing arm 120 is parallel to the longest side of chip 1. Since the ends of the longest side of chip 1 have greater warping, setting the swing plane of the swing arm 120 parallel to the longest side of chip 1 ensures that the solder pillars 11 at the more warped positions can be dipped in flux 230. When chip 1 is rectangular, the swing plane of the swing arm 120 is parallel to the long side (AB and CD) of the rectangle. When chip 1 is square, the swing plane of the swing arm 120 can be along any side of the square (AB, BC, CD, DA). It is understandable that if the swing plane is set parallel to AB, and when the swing arm 120 swings at the first preset angle, the corners of the chip 1 located on the same side (relative to the same side of the swing plane, i.e., A and D are on the same side of the chip 1, and C and B are on the same side of the chip 1) are on the same horizontal plane, the effect of dipping the flux 230 is the same.

[0066] Preferably, the drive unit 130 can drive the swing arm 120 to swing along two vertically arranged vertical planes. For example, the two vertical planes can be parallel to the diagonals (AC and BD) of the chip 1, respectively. This arrangement provides a better pick-up effect for the chip 1 with a greater degree of warping.

[0067] like Figures 7-13 As shown, this embodiment discloses a chip packaging method, which uses a chip packaging auxiliary device 100 as described in any of the above schemes to apply flux 230; the chip packaging method includes: as... Figure 8 As shown, the suction head 110 of the chip packaging auxiliary device 100 adsorbs the chip 1 on the side away from the soldering post 11; as Figure 9 As shown, it swings towards the first direction in the vertical plane at a second preset angle, and then descends until it reaches the desired position. Figure 10 The welding column 11 shown is immersed in flux 230 to a preset depth, and the second preset angle is less than or equal to the first preset angle; along as shown Figures 11 to 12 It swings twice the second preset angle in the opposite direction of the first direction shown, and then rises.

[0068] The chip packaging method uses the aforementioned chip packaging auxiliary device 100 to apply flux 230, ensuring that each solder post 11 on the chip 1, which has experienced smile-face warping, is coated with flux 230. Figure 13As shown, this not only increases the accuracy of chip 1 and substrate 2 mounting and avoids interference factors in mounting inspection, but also ensures the reliability of the soldering between chip 1 and substrate 2. Furthermore, the chip packaging auxiliary device 100 swings a second preset angle in a first direction within the vertical plane before descending to pick up flux, ensuring that each soldering post 11 is only dipped in flux 230 once, resulting in more uniform application and reduced flux 230 waste. The second preset angle, which doubles the initial angle, ensures that the edges of chip 1 along both ends of the swing plane are coated with flux 230.

[0069] Specifically, before the chip packaging auxiliary device 100 swings, it further includes: obtaining the maximum warpage angle of the chip 1 to calculate a second preset angle. That is, the swing angle of the chip packaging auxiliary device 100 is compared with the maximum warpage angle of the chip 1, avoiding excessive swing angles that would waste program time. It can be understood that the first preset angle is the maximum swing angle set for the chip packaging auxiliary device 100. Setting the first preset angle to be greater than the second preset angle allows the chip packaging auxiliary device 100 to adapt to any possible warpage angle of the chip 1, thus increasing its versatility. For example, the first preset angle is set to 30°-60°.

[0070] Furthermore, such as Figure 7 As shown, before the suction head 110 adsorbs the chip 1, it also includes: a suction device 210 adsorbing the upper side of the chip 1 with the soldering post 11 facing upwards, and flipping the chip 1 so that the soldering post 11 faces downwards; for picking up the chip 1 onto the self-governing fixture 220. Exemplarily, the fixture 220 can be a pin or a tray. Then, the chip packaging auxiliary device 100 adsorbs the side of the chip 1 away from the soldering post 11 from above, facilitating subsequent oscillation to apply flux 230. After the chip packaging auxiliary device 100 adsorbs the chip 1, the suction device 210 detaches from the adsorption of the chip 1. Next, the translation unit 140 of the chip packaging auxiliary device 100 moves the chip 1 above the flux 230 for subsequent flux application.

[0071] In this embodiment, after the chip packaging auxiliary device 100 swings and rises, it further includes: the chip packaging auxiliary device 100 moves the chip 1 above the substrate 2 and mounts the chip 1 onto the substrate 2. After the chip 1 is dipped in flux 230 by swinging, each solder post 11 of the chip 1 is dipped in flux 230, so the mounting and soldering of the chip 1 to the substrate 2 is more reliable.

[0072] The chip packaging method using the aforementioned chip packaging auxiliary device 100 to apply flux 230 is further completed as follows:

[0073] S1. Pre-bake the incoming material substrate 2.

[0074] S2. Prepare substrate 2, chip 1, flux 230 and corresponding fixtures 220 such as ejector pins, adsorption devices 210, chip packaging auxiliary devices 100, etc.

[0075] S3. Using the Datacon2200 device, the substrate 2 is transported to the designated position via a track.

[0076] S4. The entire chip 1 is placed into the equipment. Chip 1 has a ejector pin at its bottom and the soldering post 11 facing upwards. Chip 1 has an adsorption device 210 at its top. Based on the electronic document indicating good and bad products, the equipment uses the ejector pin and adsorption device 210 to remove the good chip 1 from the blue film. At this point, chip 1 is adsorbed by the vacuum holes of the adsorption device 210 through vacuum. Some products can also be loaded via a carrier tray; in this case, the ejector pin is not needed, and the chip can be directly adsorbed using the vacuum holes of the adsorption device 210.

[0077] S5. The vacuum hole of the adsorption device 210 is rotated 180° up and down by its own mechanism, so that the vacuum hole of the adsorption device 210 faces upward.

[0078] S6. The vacuum hole of the chip packaging auxiliary device 100 picks up the chip 1 from the vacuum hole of the adsorption device 210. At this time, the chip 1 is transferred to the chip packaging auxiliary device 100 with the welding post 11 facing down.

[0079] S7. The vacuum hole of the chip packaging auxiliary device 100 adsorbs the chip 1, moves it horizontally above the area of ​​flux 230, and rotates counterclockwise by a second preset angle (determined by the product warpage; when the chip 1 warps significantly, the counterclockwise rotation angle increases accordingly) and remains stationary. At this time, the angle between the swing arm 120 and the left side of the vertical line is the second preset angle. Then, the chip packaging auxiliary device 100, along with the chip 1, descends vertically, causing the leftmost solder post 11 of the chip 1 to be first immersed in and dipped in flux 230. Subsequently, the chip packaging auxiliary device 100 rotates clockwise, passing through an angle of 0° with the vertical line. At this point, the solder pillar 11 in the center area of ​​chip 1 is dipped in flux 230; then continue to rotate clockwise until the angle between the swing arm 120 and the right side of the vertical line is the second preset angle (the rotation angle is determined by the warping of chip 1, and it can be the same as the angle on the left side). At this point, the rightmost end of chip 1 is also dipped in flux 230; then the vacuum hole of the chip packaging auxiliary device 100 lifts chip 1 along with it, so that chip 1 is removed from the area of ​​flux 230. At the same time, the chip packaging auxiliary device 100 rotates counterclockwise, so that the position of chip 1 returns to the correct position (i.e., the angle with the vertical line is 0°).

[0080] S8. For example Figure 13 As shown, the chip packaging auxiliary device 100 mounts the chip 1, which is coated with flux 230, onto a designated area of ​​the substrate 2.

[0081] S9. Remove the mounted substrate 2 and chip 1 from the equipment track, and have an engineer take the product to the X-ray room to confirm the soldering position (whether chip 1 corresponds one-to-one with the pads on substrate 2).

[0082] S10. The substrate 2 and chip 1, after being mounted, are reflow soldered by a reflow equipment to solder chip 1 to substrate 2.

[0083] S11. The reflowed substrate 2 is cleaned by a cleaning device to remove excess flux 230.

[0084] S12. Products that have completed mounting will continue with subsequent packaging processes.

[0085] This embodiment also discloses a chip assembly packaged using the chip packaging method described in any of the above embodiments. The above-described chip assembly exhibits more reliable soldering, resulting in more stable performance.

[0086] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.

Claims

1. A chip packaging auxiliary device, characterized in that, include: The suction head (110) and the swing arm (120) are provided. The suction head (110) is used to adsorb the chip (1) on the side away from the welding post (11), and the swing arm (120) is disposed at the upper end of the suction head (110). A drive unit (130) is disposed at one end of the swing arm (120) away from the suction head (110). The drive unit (130) can drive the swing arm (120) to swing in the vertical plane, and the angle between the swing angle and the vertical direction is a first preset angle. The drive unit (130) can also drive the swing arm (120) to rise and fall in the vertical direction.

2. The chip packaging auxiliary device according to claim 1, characterized in that, The drive unit (130) includes: The swing assembly (131) includes a swing drive, the swing arm (120) is disposed at the swing end of the swing assembly (131), and the swing drive can drive the swing end to swing in a vertical plane. The lifting assembly (132) includes a lifting drive component, and the swing assembly (131) is disposed at the lifting end of the lifting assembly (132). The lifting drive component can drive the lifting end to move up and down in the vertical direction.

3. The chip packaging auxiliary device according to claim 1, characterized in that, The drive unit (130) includes: The swing assembly (131) includes a swing drive, the swing arm (120) is disposed at the swing end of the swing assembly (131), and the swing drive can drive the swing end to swing in a vertical plane. The swing arm (120) is telescopically oriented to change the distance between the suction head (110) and the swing end.

4. The chip packaging auxiliary device according to claim 1, characterized in that, The drive unit (130) can drive the swing arm (120) to swing along two vertically arranged planes.

5. The chip packaging auxiliary device according to claim 1, characterized in that, The swing plane of the swing arm (120) is set parallel to the longest side of the chip (1).

6. The chip packaging auxiliary device according to any one of claims 1-5, characterized in that, The chip packaging auxiliary device further includes a translation unit (140), the translation unit (140) includes a translation drive, the drive unit (130) is disposed at the translation end of the translation unit (140), and the translation drive can drive the translation end to move in the horizontal plane.

7. A chip packaging method, characterized in that, The chip packaging auxiliary device (100) as described in any one of claims 1-6 is used to apply flux (230); the chip packaging method includes: The suction head (110) of the chip packaging auxiliary device (100) adsorbs the chip (1) on the side away from the welding post (11), swings in the first direction in the vertical plane at a second preset angle and then descends until the welding post (11) is immersed in the flux (230) at a preset depth, the second preset angle being less than or equal to the first preset angle; It swings in the opposite direction of the first direction for twice the second preset angle and then rises.

8. The chip packaging method according to claim 7, characterized in that, Before the chip packaging auxiliary device (100) swings, it further includes: obtaining the maximum warpage angle of the chip (1) in order to calculate the second preset angle.

9. The chip packaging method according to claim 7, characterized in that, Before the suction head (110) adsorbs the chip (1), the following is also included: The adsorption device (210) adsorbs the upper side of the chip (1) with the welding post (11) facing upward, and flips the chip (1) so that the welding post (11) faces downward; The chip packaging auxiliary device (100) adsorbs the chip (1) from above to the side away from the welding post (11), and the adsorption device (210) detaches from the adsorption of the chip (1); The chip packaging auxiliary device (100) moves the chip (1) above the flux (230); And / or, after the chip packaging auxiliary device (100) swings and rises, it further includes: The chip packaging auxiliary device (100) moves the chip (1) above the substrate (2) and mounts the chip (1) onto the substrate (2).

10. A chip assembly, characterized in that, The chip is packaged using the chip packaging method described in any one of claims 7-9.

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