Wafer ring lifting and adsorbing mechanism

Abstract

This invention discloses a wafer ring lifting and adsorption mechanism, aiming to provide a simple structure that utilizes the line contact between the inclined surface of the slider and the roller during the etching process, employs a multi-point linkage lifting and lowering rotary adsorption stage, and allows for parallel dynamic adjustment. The invention includes an adjustment component and a lifting and adsorption component. The lifting and adsorption component includes a fixed platform, a rotary positioning module, a rotating platform, an adsorption plate, several sets of side-pushing modules, and several sets of lifting modules. The rotary positioning module is mounted on the fixed platform, and the rotating platform is connected to the movable end of the rotary positioning module. The several sets of side-pushing modules are mounted on the upper end of the fixed platform, and cooperate with the corresponding lifting modules on the rotating platform to lift the adsorption plate and align it with the wafer ring product. This invention is applied in the technical field of product testing.

Description

Technical Field

[0001] This invention relates to the technical field of product testing, and in particular to a wafer ring lifting and adsorption mechanism. Background Technology

[0002] Semiconductor manufacturing is the cornerstone of today's high-tech industry, involving hundreds of precise and complex processes. Wafers need to be frequently transferred and processed between different processing equipment, such as lithography machines, etching machines, and thin-film deposition equipment. In the etching machine manufacturing process, specialized carriers are used to support and fix the wafers to ensure they are protected from contamination, vibration, and physical damage during transport and storage. As semiconductor manufacturing moves towards higher efficiency, lower costs, and higher yields, production lines are becoming increasingly automated. Automated Material Handling Systems (AMHS) and Equipment Robots are responsible for the unmanned movement of wafer carriers between different equipment units. Therefore, achieving rapid, accurate, and reliable automatic locking and releasing of wafer rings at load ports has become a key technological aspect for ensuring the continuous, stable, and efficient operation of the production line. Wafer rings are used to support and fix wafers, requiring frequent loading and unloading during processes such as dicing, de-resisting, and cleaning. Existing wafer ring unloading and locking mechanisms mainly rely on traditional manual or semi-automatic methods, which are prone to introducing particle contamination, positional deviations, and wafer damage risks. This contradicts the ultra-high cleanliness, ultra-high precision, and ultra-high reliability requirements of semiconductor manufacturing, making it difficult to meet the demands of high cycle time and high precision. Therefore, it is necessary to develop a mechanism that can achieve automatic unloading, locking, and positioning to ensure the stability and safety of wafers during transport.

[0003] Current single-motor drives achieve synchronous lifting at four corners and integrate a vacuum adsorption lifting base via cam or linkage mechanisms. A servo motor drives the main drive shaft to rotate via a precision reducer. Four cams on the drive shaft rotate synchronously, pushing the four corner slides upwards smoothly along linear guides, thus lifting the entire lifting platform and its carrier to the target height. This is a smoother lifting process compared to multi-motor drives. However, the design, machining, and assembly precision requirements of mechanical synchronization mechanisms (especially four-cam systems) are extremely high, resulting in high costs and an overly bulky system, making it unsuitable for many scenarios. Once the cam profile is machined, the lifting motion curve (velocity, acceleration) is fixed and difficult to change, leading to poor compatibility. A simpler structure, using a multi-point linkage lifting rotary adsorption platform with parallel dynamic adjustment, achieved through line contact between the slider's inclined surface and the rollers during etching machine material handling, would be ideal. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a wafer ring lifting and adsorption mechanism with a simple structure, which adopts a multi-point linkage lifting and lowering rotary adsorption stage and can realize parallel dynamic adjustment during the material picking process of etching machine production through the line contact cooperation between the inclined surface of the slider and the roller.

[0005] The technical solution adopted in this invention is as follows: This invention includes an adjustment component and a lifting adsorption component. The lifting adsorption component includes a fixed platform, a rotary positioning module, a rotating platform, an adsorption plate, several sets of side-pushing modules, and several sets of lifting modules. The rotary positioning module is disposed on the fixed platform, and the rotating platform is connected to the movable end of the rotary positioning module. Several sets of side-pushing modules are disposed on the upper end of the fixed platform, and the several sets of side-pushing modules cooperate with the corresponding lifting modules on the rotating platform to lift the adsorption plate to cooperate with the wafer ring product.

[0006] Furthermore, the rotary positioning module includes a fixed ring, a rotary motor, a synchronous ring, and a support ring. The fixed ring is connected to the middle of the fixed platform, the synchronous ring is rotatably engaged with the fixed ring, the rotary motor is located on one side of the fixed platform and is rotatably engaged with the synchronous ring via a synchronous belt, and the rotary platform is connected to the upper end of the synchronous ring via the support ring.

[0007] Furthermore, the lifting module includes a side-push slide rail, a side-push slider, a lifting fixing block, a lifting slide rail, and a lifting slider. Several sets of the side-push slide rail arrays are arranged in the mounting groove at the upper end of the rotating platform. The side-push slider is connected to the movable end of the side-push slide rail. Several sets of the lifting fixing blocks arrays are arranged inside the clearance opening in the middle of the rotating platform. Several lifting sliders slide in cooperation with the lifting fixing blocks through the lifting slide rails. A spherical block is provided on the upper end surface of the side-push slider. A lifting roller is provided at one end of the lifting slider corresponding to the side-push slider. The lifting roller cooperates with the spherical block and drives the lifting slider to cooperate with the adsorption plate.

[0008] Furthermore, the side-push module includes a side-push cylinder and a side-push head. Several sets of the side-push cylinder array are arranged on the upper surface of the fixed platform. The side-push head is connected to the movable end of the side-push cylinder. An avoidance roller is provided at the upper end of the side-push head. An avoidance groove is provided at the bottom of the side-push slider near the side-push head. The side-push cylinder drives the avoidance roller to cooperate with the avoidance groove.

[0009] Furthermore, a top rod is provided at the upper end of the lifting slider, and a plurality of adsorption buckles are provided on the lower end face of the adsorption plate, with the plurality of top rods engaging with the corresponding adsorption buckles for limiting.

[0010] Furthermore, a grating ruler is provided on the outer edge of the support ring, and a reading head module is provided on the upper surface of the fixed platform. The reading head module is in sensing cooperation with the grating ruler.

[0011] Furthermore, the adjustment assembly includes an X-axis adjustment module, a balance plate, and a Y-axis adjustment module. The balance plate is connected to the movable end of the X-axis adjustment module, the Y-axis adjustment module is disposed on the upper surface of the balance plate, and the fixed platform is connected to the movable end of the Y-axis adjustment module.

[0012] Furthermore, a visual inspection module is provided above the adsorption plate. The visual inspection module includes a camera bracket and an industrial camera. The industrial camera is connected to the fixed end of an external inspection machine through the camera bracket.

[0013] Furthermore, the upper surface of the fixed platform is provided with a plurality of stop blocks, and the lower surface of the rotating platform is provided with a limit block, the limit block cooperating with the plurality of stop blocks.

[0014] Furthermore, an isolation plate is provided at the upper end of the rotating platform.

[0015] The beneficial effects of this invention are as follows: The rotary positioning module in this patent uses crossed roller bearings to support the rotary table, reducing radial and axial runout during rotation. Combined with closed-loop control of the grating ruler and reading head, it ensures minimal rotation angle positioning error, meeting the angular accuracy requirements for transferring the wafer ring between different workstations. The horizontal drive module centrally controls four cylinders through a manifold, ensuring uniform distribution of compressed air and enabling synchronous cylinder extension and retraction. Simultaneously, a reed switch monitors the cylinder's action status in real time, preventing uneven force on the lifting mechanism due to delays in the action of a single cylinder. The lifting mechanism smoothly converts horizontal movement into vertical movement through the line contact between the slider's inclined surface and the roller. A linear guide rail constrains the movement direction of the lifting plate, preventing tilting during lifting and ensuring the verticality of the adsorption platform's ascent and descent. The adsorption platform only initiates rotational transfer when adsorption is reliable, preventing the wafer ring from falling during transfer. The actions of each module are uniformly scheduled through the control system, following a "signal feedback - command execution - status confirmation" mechanism. The system operates in a closed-loop mode. For example, the lifting is only started after the rotation and positioning are in place, and the rotation and transfer are only carried out after the adsorption is reliable. This ensures that each action link is smoothly connected and avoids damage to the wafer ring or failure of loading and unloading due to misoperation. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present invention;

[0017] Figure 2 This is a perspective view of the invention with the isolation plate hidden.

[0018] Figure 3This is an exploded view of the lifting and adsorption assembly;

[0019] Figure 4 This is a cross-sectional view of the lifting and adsorption assembly;

[0020] Figure 5 This is a three-dimensional view of the rotary positioning module;

[0021] Figure 6 This is a three-dimensional view of the side-pushing module and the lifting module in combination;

[0022] Figure 7 This is a three-dimensional view of another state in which the side-pushing module and the lifting module are engaged.

[0023] Figure 8 This is a three-dimensional view of the adsorption plate. Detailed Implementation

[0024] like Figures 1 to 8 As shown, in this embodiment, the present invention includes an adjustment component 1 and a lifting adsorption component 2. The lifting adsorption component 2 includes a fixed platform 3, a rotary positioning module 4, a rotating platform 5, an adsorption plate 6, several sets of side-pushing modules 8, and several sets of lifting modules 9. The rotary positioning module 4 is disposed on the fixed platform 3. The rotating platform 5 is connected to the movable end of the rotary positioning module 4. Several sets of side-pushing modules 8 are disposed on the upper end of the fixed platform 3. The several sets of side-pushing modules 8 cooperate with the corresponding lifting modules 9 on the rotating platform 5 to lift the adsorption plate 6 to cooperate with the wafer ring product 10. Therefore, the rotary positioning module 4 and the rotary platform 5 rotate together to achieve rotary transfer, and together with the adjustment component 1, the adsorption plate 6 achieves precise alignment with the wafer ring product 10. The side push module 8 and the lifting module 9 cooperate to convert the side push into vertical formation, thereby pushing the adsorption plate 6 to lift and adsorb the wafer ring product 10. The four sets of the side push module 8 and the four sets of the lifting module 9 make the lifting and adsorption of the adsorption plate 6 more stable and less prone to displacement that could damage the wafer ring product.

[0025] like Figure 3 and Figure 5As shown, in this embodiment, the rotary positioning module 4 includes a fixed ring 41, a rotary motor 42, a synchronization ring 43, and a support ring 44. The fixed ring 41 is connected to the middle of the fixed platform 3, and the synchronization ring 43 is rotatably engaged with the fixed ring 41. The rotary motor 42 is located on one side of the fixed platform 3 and is rotatably engaged with the synchronization ring 43 via a synchronization belt 45. The rotating platform 5 is connected to the upper end of the synchronization ring 43 via the support ring 44. Therefore, the fixed ring 41 is stably connected to the middle of the fixed platform 3, and the synchronization ring 43 is connected to the movable end of the rotary motor 42 via the synchronization belt 45, thereby enabling the support ring 44 to rotate synchronously, achieving the rotational alignment of the adsorption plate 6.

[0026] like Figure 3 , Figure 4 , Figure 6 as well as Figure 7 As shown, in this embodiment, the lifting module 9 includes a side-push slide rail 91, a side-push slider 92, a lifting fixing block 93, a lifting slide rail 94, and a lifting slider 95. A plurality of the side-push slide rails 91 are arrayed and arranged in the mounting groove 11 at the upper end of the rotating platform 5. The side-push slider 92 is connected to the movable end of the side-push slide rail 91. A plurality of the lifting fixing blocks 93 are arrayed and arranged inside the clearance opening 12 in the middle of the rotating platform 5. A plurality of the lifting sliders 95 slide in cooperation with the lifting fixing blocks 93 through the lifting slide rails 94. A spherical block 96 is provided on the upper surface of the side-push slider 92. A lifting roller 97 is provided at one end of the lifting slider 95 corresponding to the side-push slider 92. The lifting roller 97 cooperates with the spherical block 96 and drives the lifting slider 95 to cooperate with the adsorption plate 6. Therefore, the lifting fixing block 93 is fixedly connected to the rotating platform 5, and the side push slider 92 slides to make the slab block 96 cooperate with the lifting roller 97, thereby adjusting the height of the lifting slider 95 and realizing the lifting and adsorption effect of the adsorption plate 6.

[0027] like Figure 3 , Figure 4 , Figure 6 as well as Figure 7As shown, in this embodiment, the side-push module 8 includes a side-push cylinder 81 and a side-push head 82. A plurality of side-push cylinders 81 are arrayed on the upper surface of the fixed platform 3. The side-push head 82 is connected to the movable end of the side-push cylinder 81. A clearance roller 83 is provided at the upper end of the side-push head 82. A clearance groove 98 is provided at the bottom of the side-push slider 92 near the side-push head 82. The side-push cylinder 81 drives the clearance roller 83 to cooperate with the clearance groove 98. Therefore, the side-push cylinder 81 provides lateral pushing force, and the rotating platform 5 needs to rotate to a specific alignment angle so that the clearance roller 83 can correspond with the clearance groove 98 and perform a side-push lifting operation.

[0028] like Figure 3 , Figure 6 , Figure 7 as well as Figure 8 As shown, in this embodiment, the upper end of the lifting slider 95 is provided with a top rod 99, and the lower end face of the adsorption plate 6 is provided with a plurality of adsorption buckles 13. The plurality of top rods 99 are engaged with the corresponding adsorption buckles 13 for limiting cooperation. It can be seen that the adsorption plate 6 adopts an annular adsorption groove and a multi-suction hole structure to increase the contact area with the blue film and make the adsorption force evenly distributed. The top rods 99 are limited and connected with the adsorption buckles 13, so that the adsorption plate 6 can rotate synchronously with the rotary positioning module 4.

[0029] like Figure 3 and Figure 5 As shown, in this embodiment, a grating ruler 46 is provided on the outer edge of the support ring 44, and a reading head module 14 is provided on the upper surface of the fixed platform 3. The reading head module 14 and the grating ruler 46 are inductively coupled. Therefore, the cooperation between the reading head module 14 and the grating ruler 46 ensures accurate rotation trajectory.

[0030] like Figure 2 As shown, in this embodiment, the adjustment component 1 includes an X-axis adjustment module 101, a balance plate 102, and a Y-axis adjustment module 103. The balance plate 102 is connected to the movable end of the X-axis adjustment module 101, and the Y-axis adjustment module 103 is disposed on the upper surface of the balance plate 102. The fixed platform 3 is connected to the movable end of the Y-axis adjustment module 103. Therefore, the X-axis adjustment module 101 and the Y-axis adjustment module 103 achieve planar position adjustment, enabling alignment, receiving, and transferring of materials.

[0031] like Figure 1 and Figure 2As shown, in this embodiment, a visual inspection module 15 is disposed above the adsorption plate 6. The visual inspection module 15 includes a camera bracket 151 and an industrial camera 152. The industrial camera 152 is connected to the fixed end of an external inspection machine through the camera bracket 151. Thus, the industrial camera 152 realizes image acquisition of the wafer ring product 10 on the adsorption plate 6.

[0032] like Figure 3 As shown, in this embodiment, the upper surface of the fixed platform 3 is provided with a plurality of stop blocks 16, and the lower surface of the rotating platform 5 is provided with a limit block 17, which cooperates with the plurality of stop blocks 16. Therefore, the plurality of stop blocks 16 limit the rotation angle of the rotating platform 5 within a certain range.

[0033] like Figure 1 As shown in the figure, in this embodiment, an isolation plate 18 is provided at the upper end of the rotating platform 5. Therefore, the isolation plate 18 provides a protective effect.

[0034] The working principle of this invention is as follows: In the initial standby phase, the fixed platform 3 remains horizontal, the rotating platform 5 is at its origin, and the grating ruler 46 and the reading head module 14 ensure no initial angle deviation. The external conveying mechanism delivers the wafer ring to the top of the adsorption plate 6. The rotary motor 42 drives the rotating platform 5 to rotate via the synchronous belt 45. The grating ruler 46 collects angle data in real time and provides feedback, forming a closed-loop control. When the adsorption plate 6 rotates to the loading position directly opposite the wafer ring product 10, the adjustment component 1 ensures center alignment. The avoidance roller 83 enters the avoidance push groove 98, the four sets of side push cylinders 81 extend synchronously, the side push slider 92 moves horizontally, and the slab block 96 cooperates with the lifting roller 97 to make the lifting slider 95 rise along the lifting slide rail 94. The adsorption plate 6 rises and contacts the blue film of the wafer ring product 10. After the reed switch detects that the wafer ring product 10 has "extended into position", the adsorption plate 6 adsorbs the blue film of the wafer ring product 10. The rotary motor 42 starts again and, together with the adjustment component 1, drives the wafer ring product 10 to rotate to the loading and unloading station for the next material handling operation. All components are reset and the above steps are repeated to realize the side push lifting adsorption and transfer of the wafer ring.

[0035] Although the embodiments of the present invention are described with reference to actual solutions, they do not constitute a limitation on the meaning of the present invention. Modifications to the embodiments and combinations with other solutions based on this specification will be obvious to those skilled in the art.

Claims

1. A wafer ring lifting and adsorbing mechanism, comprising an adjusting assembly (1) and a lifting and adsorbing assembly (2), characterized in that: The lifting adsorption assembly (2) includes a fixed platform (3), a rotary positioning module (4), a rotating platform (5), an adsorption plate (6), several sets of side-push modules (8) and several sets of lifting modules (9). The rotary positioning module (4) is set on the fixed platform (3). The rotating platform (5) is connected to the movable end of the rotary positioning module (4). Several sets of side-push modules (8) are set on the upper end of the fixed platform (3). Several sets of side-push modules (8) cooperate with the corresponding lifting modules (9) on the rotating platform (5) and lift the adsorption plate (6) to cooperate with the wafer ring product (10). The lifting module (9) includes a side push slide rail (91), a side push slider (92), a lifting fixing block (93), a lifting slide rail (94), and a lifting slider (95). Several sets of the side push slide rails (91) are arranged in an array in the mounting groove (11) at the upper end of the rotating platform (5). The side push slider (92) is connected to the movable end of the side push slide rail (91). Several sets of the lifting fixing blocks (93) are arranged in an array in the clearance opening in the middle of the rotating platform (5). (12) On the inner side, several of the lifting sliders (95) are slidably engaged with the lifting fixing block (93) through the lifting slide rail (94). A spherical block (96) is provided on the upper surface of the side push slider (92). A lifting roller (97) is provided at one end of the lifting slider (95) corresponding to the side push slider (92). The lifting roller (97) engages with the spherical block (96) and drives the lifting slider (95) to engage with the adsorption plate (6). The side-push module (8) includes a side-push cylinder (81) and a side-push head (82). Several sets of the side-push cylinders (81) are arrayed on the upper surface of the fixed platform (3). The side-push head (82) is connected to the movable end of the side-push cylinder (81). The upper end of the side-push head (82) is provided with a clearance roller (83). The bottom of the side-push slider (92) near the side-push head (82) is provided with a clearance groove (98). The side-push cylinder (81) drives the clearance roller (83) to cooperate with the clearance groove (98).

2. The wafer ring lifting and adsorbing mechanism according to claim 1, wherein: The rotary positioning module (4) includes a fixed ring (41), a rotary motor (42), a synchronous ring (43), and a support ring (44). The fixed ring (41) is connected to the middle of the fixed platform (3). The synchronous ring (43) is rotatably engaged with the fixed ring (41). The rotary motor (42) is located on one side of the fixed platform (3) and is rotatably engaged with the synchronous ring (43) via a synchronous belt (45). The rotary platform (5) is connected to the upper end of the synchronous ring (43) via the support ring (44).

3. The wafer ring lifting and adsorbing mechanism according to claim 1, wherein: The upper end of the lifting slider (95) is provided with a top rod (99), and the lower end face of the adsorption plate (6) is provided with a plurality of adsorption buckles (13). The plurality of top rods (99) are limited and engaged with the corresponding adsorption buckles (13).

4. The wafer ring lifting and adsorption mechanism according to claim 2, characterized in that: The outer edge of the support ring (44) is provided with a grating ruler (46), and the upper surface of the fixed platform (3) is provided with a reading head module (14), which is inductively coupled with the grating ruler (46).

5. The wafer ring lifting and adsorption mechanism according to claim 1, characterized in that: The adjustment component (1) includes an X-axis adjustment module (101), a balance plate (102), and a Y-axis adjustment module (103). The balance plate (102) is connected to the movable end of the X-axis adjustment module (101), and the Y-axis adjustment module (103) is disposed on the upper surface of the balance plate (102). The fixed platform (3) is connected to the movable end of the Y-axis adjustment module (103).

6. The wafer ring lifting and adsorption mechanism according to claim 1, characterized in that: A visual inspection module (15) is provided above the adsorption plate (6). The visual inspection module (15) includes a camera bracket (151) and an industrial camera (152). The industrial camera (152) is connected to the fixed end of an external inspection machine through the camera bracket (151).

7. The wafer ring lifting and adsorption mechanism according to claim 1, characterized in that: The fixed platform (3) has a plurality of stop blocks (16) on its upper end face, and the rotating platform (5) has a limit block (17) on its lower end face. The limit block (17) cooperates with the plurality of stop blocks (16).

8. The wafer ring lifting and adsorption mechanism according to claim 1, characterized in that: An isolation plate (18) is provided on the upper end of the rotating platform (5).

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