Ceramic packaging structure and packaging method thereof

Abstract

The invention provides a ceramic packaging structure and a packaging method thereof. The packaging method comprises the steps of forming a first adhesive layer on a first frame of a plurality of cover plates based on a screen printing process; forming a second adhesive layer on the first adhesive layer based on a steel mesh printing process; the second adhesive layer is provided with a groove sunken towards the first adhesive layer; the sides, connected with the second adhesive layers, of the plurality of cover plates and the second frames of the plurality of packaging bases are arranged in a one-to-one butt joint mode, so that the second adhesive layers abut against the inner ring parts of the second frames, and buffer spaces are formed between the grooves and the inner ring parts; the second frame is provided with an inner ring part and an outer ring part, the outer ring part is arranged outside the inner ring part in a surrounding mode and provided with a notch, and the area, right facing the groove, of the inner ring part corresponds to the area, provided with the notch, of the outer ring part; and performing first heat treatment to enable the second adhesive layer to be hermetically connected with the inner ring part, and fully filling the buffer space to obtain the ceramic packaging structure. According to the invention, the amount of glue near the gap in the sealing process can be reduced, and the possibility of glue remaining in the gap is reduced.

Description

Technical Field

[0001] This invention relates to the field of ceramic packaging technology, and more specifically, to a ceramic packaging structure and packaging method thereof. Background Technology

[0002] Ceramic packaging technology mainly involves encapsulating electronic components within a ceramic packaging base and cover plate. The packaging base is a three-dimensional interconnected structure that provides mechanical support, circuit conduction, and hermetic protection for the chip. The electronic components are fixed inside the packaging base, and the cover plate is placed on top of the packaging base to complete the hermetic packaging of the electronic components.

[0003] Some package bases have notches on their edges for positioning, foolproofing, or wiring channels. When solder (such as glass paste) is applied to the edge of the package base to weld the cover plate, the solder can easily flow into the notch. Once the solder has solidified, it is difficult to remove, affecting the normal use of the notch.

[0004] Furthermore, forcibly removing the solder from the notch in the packaging base adds steps, thereby increasing costs and the risk of damage to the packaging base. Summary of the Invention

[0005] This application addresses the shortcomings of existing methods by proposing a ceramic packaging structure and packaging method to solve the technical problem that solder easily flows into the gap when welding the cover plate in related technologies.

[0006] In a first aspect, embodiments of this application provide a packaging method for a ceramic packaging structure, comprising: Based on the screen printing process, a first adhesive layer is formed on the first edge of multiple cover plates; Based on the stencil printing process, a second adhesive layer is formed on the first adhesive layer; the second adhesive layer has a groove that is recessed toward the first adhesive layer; Multiple cover plates are connected to one side of the second adhesive layer and matched one-to-one with the second frame of multiple encapsulation bases, so that the second adhesive layer abuts against the inner ring of the second frame, and a buffer space is formed between the groove and the inner ring. Along the direction outward from the center of the second frame, the second frame has an inner ring and an outer ring, the outer ring surrounds the inner ring, the outer ring has a notch, and the area of ​​the inner ring that faces the groove corresponds to the area of ​​the notch in the outer ring. A first heat treatment is performed to seal the second adhesive layer to the inner ring, filling the buffer space and obtaining a ceramic encapsulation structure.

[0007] In some embodiments, one side of the multiple cover plates connected to the second adhesive layer is mated with the second frame of the multiple encapsulation bases, including: The inverted encapsulation base is placed on the cover plate, so that the inner ring of the second frame is bonded to the second adhesive layer.

[0008] In some embodiments, the size of the groove is not less than the size of the notch along the extension direction of the edge where the groove is located.

[0009] In some embodiments, a second adhesive layer is formed on the first adhesive layer based on a stencil printing process, including: A steel mesh is provided on the first adhesive layer; the steel mesh includes multiple pattern units corresponding to the cover plate and connected by a transition structure. The pattern unit includes a hollow area corresponding to the first frame, a shielding area corresponding to the inside of the first frame, and a connecting rib connecting the shielding area and the transition structure. Based on the steel mesh coated with glass slurry, the glass slurry leaks through the hollow area onto the first adhesive layer to form the second initial adhesive layer, and a through groove is formed at the location of the connecting rib; A second heat treatment is performed to solidify the second initial adhesive layer, resulting in a second adhesive layer. Based on the fluidity of the glass slurry, a groove is formed in the through-channel, and the sidewalls of the groove are gentler than the sidewalls of the through-channel.

[0010] In some embodiments, the depth of the groove is not less than 70% of the thickness of the second adhesive layer.

[0011] In some embodiments, the thickness of the steel mesh, the thickness of the second initial adhesive layer, and the thickness of the second adhesive layer decrease sequentially.

[0012] In some embodiments, the thickness of the steel mesh is determined by the design sealing thickness of the sealant required for the cover plate and frame encapsulation, as well as the shrinkage ratio of the glass paste.

[0013] In some embodiments, a first adhesive layer is formed on the first edge of a plurality of cover plates using a screen printing process, including: The number of screen printing cycles is determined based on the designed sealing thickness and the shrinkage ratio of the glass paste. Based on the screen printing process, glass paste is applied to the first border multiple times to form the first initial adhesive layer; The first initial adhesive layer is cured to form the first adhesive layer.

[0014] In some embodiments, the encapsulation method further includes: Based on the designed sealing thickness, the initial thickness of the glass slurry before the sealing adhesive cures is determined; the thickness of the first initial adhesive layer and the thickness of the second initial adhesive layer each account for half of the initial thickness.

[0015] Secondly, embodiments of this application provide a ceramic packaging structure obtained based on any of the packaging methods provided in the first aspect above, comprising: A cover plate, including a top plate and a first frame disposed on one side of the top plate; The first adhesive layer and the second adhesive layer are sequentially connected to the side of the first frame away from the top plate; The encapsulation base includes a base plate and a second frame disposed on one side of the base plate; the second frame has an inner ring portion and an outer ring portion in a direction outward from the center of the second frame, the outer ring portion surrounds the inner ring portion, and the outer ring portion has a notch; The second adhesive layer is sealed to the inner ring, and there is no obstruction above the notch.

[0016] The beneficial technical effects of the technical solutions provided in this application include: This embodiment of the application prints on multiple cover plates simultaneously, forming a first adhesive layer and a second adhesive layer on the first edge of each cover plate in two separate printing operations. The second adhesive layer near the encapsulation base has a groove, and the location of the groove corresponds to the location of the notch on the second edge during sealing. This reduces the amount of adhesive near the notch during the sealing process, thereby reducing the possibility of adhesive residue at the notch. Furthermore, the groove also serves as a buffer space, accommodating flowing adhesive near the groove and preventing it from flowing into the notch. This embodiment of the application can maintain printing efficiency without requiring an additional process to remove residual adhesive from the notch, effectively controlling costs and reducing the risk of damage to the base.

[0017] Specifically, it includes: (1) The screen printing process can print glass paste on the first edge of multiple cover plates at the same time, forming the first adhesive layer on each cover plate, which is highly efficient. Moreover, screen printing can fully coat the first edge, forming a relatively complete and thick first adhesive layer, which is beneficial to provide sufficient adhesive in the subsequent sealing process to achieve a seal between the cover plate and the encapsulation base.

[0018] (2) The stencil printing process can simultaneously print glass paste on the first adhesive layer of multiple cover plates, forming a corresponding second adhesive layer, resulting in high coating efficiency. Moreover, stencil printing can coat the first adhesive layer with a corresponding pattern through the pattern of the stencil, making the operation convenient.

[0019] (3) The second frame of the base has an inner ring and an outer ring. The cover plate is connected to the inner ring of the second frame only through the first adhesive layer and the second adhesive layer, avoiding the outer ring where the notch is located, which can reduce the possibility of adhesive residue in the notch.

[0020] (4) The area of ​​the inner ring that faces the groove corresponds to the area of ​​the notch on the outer ring, so that the amount of glue near the notch is less than that in other areas, thereby reducing the possibility of glue leakage into the notch. Moreover, the groove can also serve as a buffer space to contain the glue flowing near the groove and prevent the flowing glue from flowing into the notch.

[0021] (5) The first adhesive layer and the second adhesive layer together have sufficient adhesive volume, which can fill the buffer space based on the fluidity of the adhesive during the first heat treatment process, ensuring a sealed connection between the cover plate and the base, and ensuring the airtightness of the ceramic encapsulation structure. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A schematic flowchart illustrating a ceramic encapsulation structure packaging method provided in this application embodiment; Figure 2 This is a schematic diagram of the structure of the second adhesive layer in a ceramic encapsulation method provided in an embodiment of this application; Figure 3 This is a schematic diagram of the second frame of a ceramic packaging structure provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure after the cover plate and the second frame of the packaging base are matched one-to-one in the packaging method of a ceramic packaging structure provided in the embodiments of this application; Figure 5 This is a side view of a ceramic packaging structure provided in an embodiment of this application.

[0024] Figure label: 100 - First border; 200 - First adhesive layer; 300 - Second adhesive layer; 310 - Groove; 320 - Second initial adhesive layer; 321 - Through groove; 400 - Second border; 410 - Outer ring; 420 - Inner ring; 411 - Notch. Detailed Implementation

[0025] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions of the embodiments of this application.

[0026] Those skilled in the art will understand that, unless specifically stated otherwise, the terms "described" and "the" as used herein may also include plural forms. It should be further understood that the term "comprising" as used in this application's specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by this art. It should be understood that when we say an element is "connected" to another element, the element may be directly connected to the other element, or it may mean that the element and the other element are connected through an intermediate element.

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0028] The research and development approach of this application includes: to avoid adhesive residue in the notch, a glass paste can be coated on the second edge of the encapsulation base and then sealed with the cover plate.

[0029] However, the small notch requires precise control when applying adhesive to the encapsulation base, which is quite difficult. Furthermore, it's crucial to avoid the glass paste falling into the base (the area enclosed by the second frame) during adhesive application. Therefore, a precise dispensing method is necessary, significantly increasing the time cost and resulting in low efficiency.

[0030] Furthermore, there is a certain damage rate to the adhesive coating. Precision electronic components are already fixed inside the packaging base. If the adhesive coating on the packaging base is damaged, it may lead to damage to the electronic components, which greatly increases the testing cost.

[0031] Therefore, this application provides a packaging method for a ceramic packaging structure, the flowchart of which is shown below. Figure 1 As shown, the method includes steps S101 to S104: S101: Based on screen printing process, a first adhesive layer 200 is formed on the first frame 100 of multiple cover plates.

[0032] S102: Based on the stencil printing process, a second adhesive layer 300 is formed on the first adhesive layer 200; such as... Figure 2 As shown, the second adhesive layer 300 has a groove 310 recessed toward the first adhesive layer 200.

[0033] S103: Connect the side of the multiple cover plates with the second adhesive layer 300 and match them one by one with the second frame 400 of the multiple encapsulation bases, so that the second adhesive layer 300 abuts against the inner ring 420 of the second frame 400, and a buffer space is formed between the groove 310 and the inner ring 420.

[0034] like Figure 3-4As shown, along the direction outward from the center of the second frame 400, the second frame 400 has an inner ring portion 420 and an outer ring portion 410. The outer ring portion 410 surrounds the inner ring portion 420 and has a notch 411. The area of ​​the inner ring portion 420 that is directly opposite the groove 310 corresponds to the area of ​​the outer ring portion 410 where the notch 411 is opened.

[0035] S104: Perform the first heat treatment to seal the second adhesive layer 300 with the inner ring 420, fill the buffer space, and obtain a ceramic encapsulation structure.

[0036] In this embodiment, by simultaneously printing on multiple cover plates, a first adhesive layer 200 and a second adhesive layer 300 are formed in two separate printing processes on the first frame 100 of each cover plate. The second adhesive layer 300 near the encapsulation base has a groove 310. During sealing, the position of the groove 310 corresponds to the position of the notch 411 in the second frame 400, which can reduce the amount of adhesive near the notch 411 during the sealing process, thereby reducing the possibility of adhesive residue at the notch 411. Moreover, the groove 310 can also serve as a reserved buffer space to accommodate the adhesive flowing near the groove 310 and prevent the flowing adhesive from flowing into the notch 411. This embodiment of the application can ensure printing efficiency without adding a process to remove residual adhesive in the notch 411, effectively controlling costs and reducing the risk of damage to the base.

[0037] Specifically, in this embodiment, screen printing is used, which allows glass paste to be printed simultaneously on the first frame 100 of multiple cover plates, forming the first adhesive layer 200 on each cover plate, resulting in high coating efficiency. Moreover, screen printing can achieve full coating on the first frame 100, forming a relatively complete and thick first adhesive layer 200, which is beneficial for providing sufficient adhesive in the subsequent sealing process to achieve a seal between the cover plate and the encapsulation base.

[0038] In this embodiment, a stencil printing process is used, which allows glass paste to be printed simultaneously on the first adhesive layer 200 of multiple cover plates, forming the second adhesive layer 300 in a one-to-one correspondence, resulting in high coating efficiency. Moreover, stencil printing can coat the first adhesive layer 200 with a corresponding pattern by means of the stencil pattern, making the operation convenient.

[0039] In this embodiment, the second frame 400 of the base has an inner ring portion 420 and an outer ring portion 410. The cover plate is connected to the inner ring portion 420 of the second frame 400 only through the first adhesive layer 200 and the second adhesive layer 300, avoiding the outer ring portion 410 where the notch 411 is located, which can reduce the possibility of adhesive residue in the notch 411.

[0040] In this embodiment, the area of ​​the inner ring portion 420 opposite the groove 310 corresponds to the area of ​​the outer ring portion 410 where the notch 411 is formed, so that the amount of adhesive near the notch 411 is less than that in other areas, thereby reducing the possibility of adhesive residue at the notch 411. Moreover, the groove 310 can also serve as a reserved buffer space to accommodate the adhesive flowing near the groove 310 and prevent the flowing adhesive from overflowing into the notch 411.

[0041] In this embodiment, the first adhesive layer 200 and the second adhesive layer 300 together have sufficient adhesive content, which can fill the buffer space based on the fluidity of the adhesive during the first heat treatment process, ensuring a sealed connection between the cover plate and the base, and ensuring the airtightness of the ceramic encapsulation structure.

[0042] Optionally, step S101 further includes: after screen printing the glass paste, curing the glass paste to obtain a stable, non-flowing first adhesive layer 200.

[0043] Optionally, in step S101, multiple cover plates are arranged in an array and placed upside down on the printing platform, and screen printing is performed on the first frame 100 of the cover plates. Compared with the traditional dispensing method, screen printing is more efficient.

[0044] Optionally, step S102 further includes: after printing the glass paste on the stencil, curing the glass paste to obtain a stable, non-flowing second adhesive layer 300.

[0045] Optionally, in step S102, multiple cover plates are arranged in an array and placed upside down on the printing platform, and a stencil printing operation is performed on the first adhesive layer 200 on the cover plates. Compared with the traditional dispensing method, screen printing is more efficient.

[0046] Optionally, the first heat treatment process can be understood as a sealing process, in which the first adhesive layer 200 and the second adhesive layer 300 are briefly melted and then solidified, thereby sealing the cover plate and the encapsulation base together.

[0047] In some embodiments, step S103 above, which involves connecting one side of the multiple cover plates to the second adhesive layer 300 and fitting them one-to-one with the second frame 400 of the multiple encapsulation bases, includes the following steps: The encapsulation base is inverted on the cover plate, so that the inner ring 420 of the second frame 400 is bonded to the second adhesive layer 300.

[0048] In this embodiment, after the first adhesive layer 200 and the second adhesive layer 300 are printed on the cover plate, the first edge 100 of the cover plate is kept facing upwards. The encapsulation base is inverted so that the second edge 400 faces downwards and placed on the second adhesive layer 300 on the cover plate. The inner ring 420 of the second edge 400 is aligned with the second adhesive layer 300 to facilitate subsequent first heat treatment operations. In this embodiment, by inverting the encapsulation base, the first adhesive layer 200 or the second adhesive layer 300 overflows to both sides under the action of gravity when flowing, and does not overflow into the upper notch 411. This further avoids the first adhesive layer 200 or the second adhesive layer 300 overflowing into the notch 411 of the second edge 400, reducing the possibility of adhesive residue in the notch 411.

[0049] Alternatively, the electronic components are already fixed inside the package base before packaging, so inverting the package base has virtually no impact on the electronic components.

[0050] Optionally, the temperature of the first heat treatment is between 400 and 450 degrees Celsius, including the endpoint values, and the electronic components inside the package substrate are able to withstand high temperatures above 450 degrees Celsius.

[0051] In some embodiments, such as Figure 4 As shown, Figure 4 This can be understood as a side view during the sealing process, along the extension direction of the side containing the groove 310, that is, along... Figure 4 In the horizontal direction, the size of the groove 310 is not less than the size of the notch 411.

[0052] In this embodiment, the size of the groove 310 is not less than the size of the notch 411, which can ensure that the amount of adhesive at the notch 411 is less than the amount of adhesive in other areas during sealing, further reducing the possibility of adhesive residue at the notch 411.

[0053] In some embodiments, the formation of the second adhesive layer 300 on the first adhesive layer 200 based on the stencil printing process in step S102 above includes the following steps: A steel mesh is provided on the first adhesive layer 200; the steel mesh includes multiple pattern units corresponding to the cover plate and connected by a transition structure. The pattern unit includes a hollow area corresponding to the first frame 100, a shielding area corresponding to the interior of the first frame 100, and a connecting rib connecting the shielding area and the transition structure.

[0054] Based on the steel mesh coated with glass slurry, the glass slurry leaks through the hollow area onto the first adhesive layer 200 to form the second initial adhesive layer 320, and a through groove 321 is formed at the location of the connecting rib.

[0055] A second heat treatment is performed to solidify the second initial adhesive layer 320, resulting in a second adhesive layer 300. Based on the fluidity of the glass slurry, the through groove 321 forms a groove 310, and the sidewalls of the groove 310 are gentler than the sidewalls of the through groove 321.

[0056] Understandably, when using stencil printing, the stencil is placed above the cured first adhesive layer 200, and the glass paste leaks from the perforated area of ​​the stencil onto the first adhesive layer 200. The pattern units of the stencil correspond to each cover plate area, and the perforated area of ​​each pattern unit corresponds to an area of ​​the first adhesive layer 200. Since the first adhesive layer 200 has a ring-shaped structure, the perforated area is also ring-shaped. However, the occlusion area of ​​the pattern unit corresponds to the inner area of ​​the first frame 100. The inner area of ​​the first frame 100 cannot be printed with glass paste; that is, the occlusion area is located inside the perforated area. Therefore, without connecting ribs, the occlusion area and the large stencil will be disconnected through the perforated area.

[0057] Therefore, in this embodiment, the shielding area is connected to the transition structure through the area where the connecting rib passes through the hollow area, so that the shielding area is part of the large steel mesh, and there is no need to provide separate support for the disconnected shielding area. Furthermore, the second adhesive layer 300 shielded at the connecting rib will not be printed with glass paste. After the steel mesh is removed, the glass paste has thixotropic properties and can become viscous and set without external force, forming the second initial adhesive layer 320. A through groove 321 can be formed at the original location of the connecting rib.

[0058] Next, the second initial adhesive layer 320 is subjected to a second heat treatment. During the heating process, the second initial adhesive layer 320 will flow for a short time and then finally solidify into the second adhesive layer 300. After the flow, the sidewall of the channel 321 becomes smoother, forming the groove 310.

[0059] It is understandable that the through groove 321 can expose the first adhesive layer 200, while the groove 310 may expose the first adhesive layer 200 or block it.

[0060] In some embodiments, the depth of the groove 310 is not less than 70% of the thickness of the second adhesive layer 300.

[0061] In this embodiment, the depth of the groove 310 is not less than 70% of the thickness of the second adhesive layer 300 and not greater than the thickness of the second adhesive layer 300, which enables the buffer space formed between the groove 310 and the second frame 400 to have sufficient buffering capacity, and to accommodate the first adhesive layer 200 or the second adhesive layer 300 that may melt during the first heat treatment, so that the first adhesive layer 200 and the second adhesive layer 300 are sealed and connected to the encapsulation base, and the notch 411 is basically left with adhesive.

[0062] Optionally, the depth of the through groove 321 is between 100 and 130 micrometers, including the end value, and the depth of the groove 310 is between 90 and 120 micrometers, including the end value.

[0063] Optionally, such as Figure 2 and 4As shown, the through channel 321 is rectangular, and after the flow on the side wall of the through channel 321, the resulting groove 310 is V-shaped. Figure 2 The dotted line at the groove 310 is the top edge of the groove 310.

[0064] In some embodiments, the thickness of the steel mesh, the thickness of the second initial adhesive layer 320, and the thickness of the second adhesive layer 300 decrease sequentially.

[0065] In this embodiment, the steel mesh is thicker and has a larger aspect ratio, making it easier for the glass slurry to be "demolded," easier to remove the steel mesh, and ensuring that the remaining adhesive layer has a specific shape.

[0066] In some embodiments, the thickness of the steel mesh is determined by the design sealing thickness of the sealant required for the cover plate and frame encapsulation, as well as the shrinkage ratio of the glass paste.

[0067] In this embodiment, the thickness of the second adhesive layer 300 can be calculated by designing the sealing thickness. Based on the thickness of the second adhesive layer 300 and the shrinkage ratio of the glass paste, the thickness of the second initial adhesive layer 320 can be obtained. Then, a thicker thickness is determined by the thickness of the second initial adhesive layer 320. The thickness of the stencil is designed in this way to ensure that the actual thickness of the glass paste printed by the stencil is close to the thickness of the second initial adhesive layer 320.

[0068] In some embodiments, the formation of the first adhesive layer 200 on the first frame 100 of the plurality of cover plates in step S101 above, based on the screen printing process, includes the following steps: The number of screen printing cycles is determined based on the design of the solder paste required for the cover and frame encapsulation, the solder thickness, and the shrinkage ratio of the glass paste.

[0069] Based on the screen printing process, glass paste is applied to the first border 100 multiple times in sequence to form the first initial adhesive layer.

[0070] The first initial adhesive layer is cured to form the first adhesive layer 200.

[0071] In this embodiment, screen printing is performed multiple times to obtain multiple adhesive layers, the sum of which is called the first initial adhesive layer. The first initial adhesive layer undergoes a third heat treatment to cure it, resulting in the first adhesive layer 200. The thickness of each screen-printed layer is approximately the same. Based on the total amount of adhesive required for sealing the cover plate and base, the overall design sealing thickness of the first adhesive layer 200 and the second adhesive layer 300 can be determined. Then, based on the design sealing thickness and the shrinkage ratio of the glass paste, the overall thickness of the first initial adhesive layer and the second initial adhesive layer 320 can be determined. The thickness of the first initial adhesive layer is then determined according to a certain ratio. Finally, based on the thickness of the first initial adhesive layer and the number of screen printing operations per cycle, the number of screen printing operations is determined.

[0072] It is understood that the sealing adhesive described in this embodiment is the integral adhesive layer composed of the first adhesive layer 200 and the second adhesive layer 300 used for sealing after curing.

[0073] For example, through experimentation or calculation, the total amount of adhesive required for sealing the cover plate and base, resulting in the sum of the thicknesses of the first adhesive layer 200 and the second adhesive layer 300, is generally 230 micrometers. Therefore, the designed sealing thickness is 230 micrometers. Based on this 230 micrometers and the shrinkage ratio of the glass paste, the overall thickness of the first initial adhesive layer and the second initial adhesive layer 320 is determined to be 300 micrometers (approximately 300 micrometers before curing, and approximately 230 micrometers after curing due to paste shrinkage). If the first adhesive layer 200 and the second adhesive layer 300 each account for half of the designed sealing thickness, then the thicknesses of the first initial adhesive layer and the second initial adhesive layer 320 are also roughly the same. Therefore, the thickness of the first initial adhesive layer is determined to be 150 micrometers. Based on this 150 micrometers and the thickness of each screen printing cycle of 50 micrometers, the number of screen printing cycles is determined to be 3.

[0074] Optionally, the shrinkage ratio of the glass slurry is between 15% and 25%.

[0075] Optionally, the glass slurry comprises 10wt%-25wt% of a carrier and 75wt%-90wt% of glass powder (wt% is weight percentage). The carrier comprises: silicone epoxy resin (40wt%-50wt%), terpineol (40wt%-60wt%), dioctyl phthalate (4wt%-8wt%), polyethylene glycol (1wt%-3wt%), and BYK-333 (0.5wt%-2wt%). The glass powder comprises: silicon dioxide (10mol%-15mol%, mol% is molar percentage), alumina (0.1mol%-1mol%), titanium dioxide (3mol%-5mol%), lead oxide (60mol%-90mol%), and zinc oxide (1mol%-5mol%). Therefore, the glass slurry's coefficient of thermal expansion matches that of the ceramic material, facilitating welding, and its high hardness after curing ensures sufficient strength for the encapsulated ceramic structure.

[0076] In some embodiments, the encapsulation method further includes the following steps: Based on the designed sealing thickness, the initial thickness of the glass slurry before the sealing adhesive cures is determined; the thickness of the first initial adhesive layer and the thickness of the second initial adhesive layer 320 each account for half of the initial thickness.

[0077] In this embodiment, the initial thickness of the glass slurry before the sealing adhesive cures can be determined based on the design sealing thickness in the early design stage. The thickness of the first initial adhesive layer and the second initial adhesive layer 320 are each half of the initial thickness. This facilitates the design and ensures that the first initial adhesive layer and the second initial adhesive layer 320 have sufficient adhesive to seal the groove 310, thus ensuring a sealed connection between the cover plate and the base.

[0078] Based on the same inventive concept, embodiments of this application also provide a ceramic packaging structure obtained based on any of the packaging methods provided in the foregoing embodiments, such as... Figure 5 As shown, Figure 5 This is a side view of a ceramic encapsulation structure, which includes a cover plate, a first adhesive layer 200, a second adhesive layer 300, and an encapsulation base.

[0079] The cover plate includes a top plate and a first frame 100 disposed on one side of the top plate.

[0080] The first adhesive layer 200 and the second adhesive layer 300 are sequentially connected to the side of the first frame 100 away from the top plate.

[0081] The encapsulation base includes a base plate and a second frame 400 disposed on one side of the base plate; the second frame 400 has an inner ring portion 420 and an outer ring portion 410 in the direction outward from the center of the second frame 400, the outer ring portion 410 surrounds the inner ring portion 420, and the outer ring portion 410 has a notch 411.

[0082] The second adhesive layer 300 is sealed to the inner ring 420, and there is no obstruction above the notch 411.

[0083] Understandably, the outer edge of the packaging base is larger than the outer edge of the cover plate. When the cover plate is packaged with the packaging base, it is actually only packaged with the inner ring 420 of the packaging base; the outer ring 410 has a notch 411 and does not require packaging. For example, the outer edge of the cover plate is 4.7*3.0 mm, the outer edge of the packaging base is 5.0*3.2 mm, and the width of the first border 100 and the second border 400 is 0.5 mm.

[0084] Optionally, the cover plate is a ceramic cover plate with a first frame 100. The first frame 100 has a certain adsorption capacity for glass slurry, which can reduce the possibility of glass slurry flowing into the interior of the first frame 100, thereby reducing the possibility of residual adhesive flowing into the base and damaging electronic components.

[0085] Moreover, the coefficient of thermal expansion of ceramic cover plates is more compatible with that of the glass slurry used. Cover plates made of other materials need to be matched with suitable glass slurry, which increases costs.

[0086] In this embodiment, the ceramic encapsulation structure is obtained by any of the encapsulation methods provided in the aforementioned embodiments, and their implementation principles are similar, so they will not be described again here. The notch 411 of the encapsulated ceramic encapsulation structure has virtually no residual glass slurry, eliminating the need for additional adhesive removal and ensuring that the notch 411 can be used normally in subsequent processes.

[0087] By applying the embodiments of this application, at least the following beneficial effects can be achieved: (1) By simultaneously printing on multiple cover plates, a first adhesive layer 200 and a second adhesive layer 300 are formed by printing twice on the first frame 100 of each cover plate. The second adhesive layer 300 near the encapsulation base has a groove 310. During sealing, the position of the groove 310 corresponds to the position of the notch 411 of the second frame 400, which can reduce the amount of adhesive near the notch 411 during the sealing process, thereby reducing the possibility of adhesive residue in the notch 411. Moreover, the groove 310 can also serve as a reserved buffer space to accommodate the adhesive flowing near the groove 310 and prevent the flowing adhesive from flowing into the notch 411. The embodiments of this application can ensure printing efficiency without adding a process to remove the adhesive residue in the notch 411, which can effectively control costs and reduce the risk of damage to the base.

[0088] (2) After printing the first adhesive layer 200 and the second adhesive layer 300 on the cover plate, keep the first edge 100 of the cover plate facing upwards, and invert the encapsulation base so that the second edge 400 faces downwards, placing it on the second adhesive layer 300 on the cover plate. The inner ring 420 of the second edge 400 is aligned with the second adhesive layer 300 to facilitate the subsequent first heat treatment operation. By inverting the encapsulation base, the first adhesive layer 200 or the second adhesive layer 300 overflows to both sides under the action of gravity when flowing, and does not overflow into the upper notch 411. This further avoids the first adhesive layer 200 or the second adhesive layer 300 overflowing into the notch 411 of the second edge 400, reducing the possibility of adhesive residue in the notch 411.

[0089] (3) The size of the groove 310 is not less than the size of the notch 411, which can ensure that the amount of adhesive at the notch 411 is less than the amount of adhesive in other areas during sealing, further reducing the possibility of adhesive residue at the notch 411.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A packaging method for a ceramic packaging structure, characterized in that, include: Based on the screen printing process, a first adhesive layer is formed on the first edge of multiple cover plates; A second adhesive layer is formed on the first adhesive layer using a stencil printing process. The second adhesive layer has a groove recessed toward the first adhesive layer; One side of the multiple cover plates connected to the second adhesive layer is matched with the second frame of the multiple encapsulation bases one by one, so that the second adhesive layer abuts against the inner ring of the second frame, and a buffer space is formed between the groove and the inner ring. Along the direction outward from the center of the second frame, the second frame has an inner ring portion and an outer ring portion, the outer ring portion surrounds the inner ring portion, the outer ring portion has a notch, and the area of ​​the inner ring portion that faces the groove corresponds to the area of ​​the outer ring portion where the notch is formed; A first heat treatment is performed to seal the second adhesive layer to the inner ring, filling the buffer space and obtaining the ceramic encapsulation structure.

2. The packaging method for the ceramic packaging structure according to claim 1, characterized in that, One side of each of the multiple cover plates connected to the second adhesive layer is fitted with a second frame of a multiple encapsulation base, including: The encapsulation base is inverted onto the cover plate, so that the inner ring of the second frame is bonded to the second adhesive layer.

3. The packaging method for the ceramic packaging structure according to claim 1, characterized in that, Along the extending direction of the side containing the groove, the size of the groove is not less than the size of the notch.

4. The packaging method for the ceramic packaging structure according to claim 1, characterized in that, Based on the stencil printing process, a second adhesive layer is formed on the first adhesive layer, including: A steel mesh is provided on the first adhesive layer; the steel mesh includes a plurality of pattern units corresponding to the cover plate and connected by a transition structure, the pattern unit includes a hollow area corresponding to the first frame, a shielding area corresponding to the inside of the first frame, and a connecting rib connecting the shielding area and the transition structure; Based on the steel mesh coated with glass slurry, the glass slurry leaks through the hollow area onto the first adhesive layer to form a second initial adhesive layer, and a through groove is formed at the location of the connecting rib; A second heat treatment is performed to solidify the second initial adhesive layer, resulting in the second adhesive layer. Based on the fluidity of the glass slurry, the through-channel forms the groove, and the sidewall of the groove is gentler than the sidewall of the through-channel.

5. The packaging method for the ceramic packaging structure according to claim 4, characterized in that, The depth of the groove is not less than 70% of the thickness of the second adhesive layer.

6. The packaging method for the ceramic packaging structure according to claim 4, characterized in that, The thickness of the steel mesh, the thickness of the second initial adhesive layer, and the thickness of the second adhesive layer decrease sequentially.

7. The packaging method for the ceramic packaging structure according to claim 4, characterized in that, The thickness of the steel mesh is determined by the designed sealing thickness of the sealing adhesive required for the cover plate and the frame, as well as the shrinkage ratio of the glass paste.

8. The packaging method for the ceramic packaging structure according to claim 4, characterized in that, Based on screen printing technology, a first adhesive layer is formed on the first edge of multiple cover plates, including: The number of screen printing cycles is determined based on the designed sealing thickness and the shrinkage ratio of the glass paste. Based on the screen printing process, glass paste is applied to the first frame multiple times in sequence to form the first initial adhesive layer; The first initial adhesive layer is cured to form the first adhesive layer.

9. The packaging method for the ceramic packaging structure according to claim 8, characterized in that, Also includes: Based on the designed sealing thickness, the initial thickness of the glass slurry before the sealing adhesive cures is determined; The thickness of the first initial adhesive layer and the thickness of the second initial adhesive layer are each half of the initial thickness.

10. A ceramic encapsulation structure obtained based on the encapsulation method according to any one of claims 1-9, characterized in that, include: A cover plate, including a top plate and a first frame disposed on one side of the top plate; The first adhesive layer and the second adhesive layer are sequentially connected to the side of the first frame away from the top plate; The encapsulation base includes a base plate and a second frame disposed on one side of the base plate; the second frame has an inner ring portion and an outer ring portion in a direction outward from the center of the second frame, the outer ring portion surrounding the inner ring portion and having a notch; The second adhesive layer is sealed to the inner ring portion, and there is no obstruction above the notch.

Images