Heat sink unsealing tool for flip packaging device

Abstract

The invention discloses an unsealing tool for a heat sink of a flip packaging device. The unsealing tool comprises a base, a top cover, a lateral fastening screw A, a lateral fastening screw B, a lateral fastening clamping piece A, a lateral fastening clamping piece B, a bottom fastening screw, a bottom fastening clamping piece, a top fastening screw and a top fastening clamping piece. The top cover is positioned above the base; the lateral fastening screw rod A and the bottom fastening screw rod respectively penetrate through the base; the lateral fastening screw rod B and the top fastening screw rod respectively penetrate through the top cover; and the lateral fastening clamping piece A, the lateral fastening clamping piece B, the bottom fastening clamping piece and the top fastening clamping piece are respectively arranged between the lateral fastening screw rod A, the lateral fastening screw rod B, the bottom fastening screw rod and the top fastening screw rod and the sample. By means of the flip packaging device heat sink unsealing tool, unsealing of the flip packaging device heat sink can be achieved, and while the heat sink at the top of the flip packaging device is removed, warping of a device substrate is not caused, and a semiconductor chip in the device is not damaged.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device technology, and particularly relates to a heat sink opening tool for flip-chip packaged devices. Background Technology

[0002] Flip-chip packaging is one of the main packaging forms for large-scale semiconductor devices and an important means of achieving high-density integrated packaging of semiconductors. Due to the high power density of these devices, a metal heat sink is often mounted on top, which is in contact with the back of the chip through thermally conductive adhesive for heat dissipation. Typical flip-chip devices use a ceramic substrate or organic substrate as the carrier, and the chip is mounted using a flip-chip bonding method. The metal heat sink is bonded to the top with thermally conductive adhesive, and the heat sink material is generally copper or aluminum-based silicon carbide. In the process of conducting destructive physical analysis, structural analysis, and failure analysis of components, it is necessary to remove the metal heat sink on the top of the device to expose the chip for inspection. The traditional method of removing the heat sink is to mechanically pry it off the substrate, but this process can easily cause deformation of the organic substrate, resulting in cracks in the chip and affecting subsequent inspection work. Summary of the Invention

[0003] The technical problem solved by the present invention is to overcome the shortcomings of the prior art and provide a heat sink unpacking tool for flip-chip packaged devices. This tool can unpack the heat sink of flip-chip packaged devices, remove the heat sink on the top of the flip-chip packaged device without causing warping of the device substrate or damaging the semiconductor chip inside the device, thereby providing conditions for subsequent flip-chip SAM, internal visual inspection and other tests.

[0004] To solve the above-mentioned technical problems, the present invention discloses a heat sink opening tool for flip-chip packaged devices, comprising: a base, a top cover, a side fastening screw A, a side fastening screw B, a side fastening clip A, a side fastening clip B, a bottom fastening screw, a bottom fastening clip, a top fastening screw, and a top fastening clip.

[0005] The top cover is located above the base;

[0006] The lateral fastening screw A and the bottom fastening screw are respectively installed through the base;

[0007] The lateral fastening screw B and the top fastening screw are respectively installed through the top cover;

[0008] Lateral fastening clip A, lateral fastening clip B, bottom fastening clip, and top fastening clip are respectively placed between the lateral fastening screw A, lateral fastening screw B, bottom fastening screw, and top fastening screw and the sample.

[0009] In the above-mentioned heat sink opening tool for flip-chip packaged devices, the base is a disc-shaped structure A, the center of the disc-shaped structure A is a circular groove, and the center of the circular groove is a square groove A.

[0010] In the aforementioned heat sink opening tools for flip-chip packaged devices

[0011] The base has four circumferentially distributed holes A on its side for installing lateral fastening screws A;

[0012] The base has a hole C in the center, and the bottom fastening screw passes through hole C and contacts the bottom fastening clip.

[0013] The upper surface of the base is provided with four circumferentially distributed positioning bolts for installing and fixing the base and the top cover.

[0014] In the above-mentioned heat sink opening tool for flip-chip packaged devices, there are four lateral fastening screws A and four lateral fastening clips A; the four lateral fastening screws A pass through four holes A and contact the corresponding lateral fastening clips A.

[0015] In the above-mentioned heat sink opening tool for flip-chip packaged devices, two rotating handles A are symmetrically arranged on the side of the base.

[0016] In the above-mentioned heat sink opening tool for flip-chip packaged devices, the top cover is a disc-shaped structure B, and the center of the disc-shaped structure B is a square groove B.

[0017] In the aforementioned heat sink opening tools for flip-chip packaged devices

[0018] The top cover has four circumferentially distributed holes B on its side for installing lateral fastening screws B.

[0019] The top cover has a hole D in the center, and the top fastening screw passes through hole D and contacts the top fastening clip.

[0020] The top cover has four circumferentially distributed semi-circular grooves on its side. These four semi-circular grooves cooperate with four positioning bolts to achieve the installation and fixation of the base and the top cover.

[0021] In the aforementioned heat sink opening tools for flip-chip packaged devices

[0022] There are four lateral fastening screws B and four lateral fastening clips B; the four lateral fastening screws B pass through four holes B and contact the corresponding lateral fastening clips B.

[0023] In the above-mentioned heat sink opening tool for flip-chip packaged devices, two rotating handles B are symmetrically arranged on the side of the top cover.

[0024] In the aforementioned heat sink opening tools for flip-chip packaged devices

[0025] The lateral fastening screw A is used to adjust the position of the lateral fastening clamp A so that the lateral fastening clamp A presses against the side of the sample.

[0026] The side fastening screw B is used to adjust the position of the side fastening clamp B so that the side fastening clamp B presses against the side of the sample.

[0027] The bottom fastening screw is used to adjust the position of the bottom fastening clip so that the bottom fastening clip presses firmly against the bottom surface of the sample;

[0028] The top fastening screw is used to adjust the position of the top fastening clip so that the top fastening clip presses against the top surface of the sample.

[0029] The present invention has the following advantages:

[0030] This invention discloses a heat sink unpacking tool for flip-chip packaged devices, which can unpack the heat sink of flip-chip packaged devices. While removing the heat sink on the top of the flip-chip packaged device, it does not cause warping of the device substrate or damage to the semiconductor chip inside the device, thereby providing conditions for subsequent flip-chip SAM, internal visual inspection and other tests. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the first cross-section (cross-section along the position of the positioning pin) of a heat sink opening tool for a flip-chip packaged device in an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the second cross-section (cross-section along the position of the lateral fastening screw) of a heat sink opening tool for a flip-chip packaged device according to an embodiment of the present invention;

[0033] Figure 3 This is a schematic diagram of the structure of a base according to an embodiment of the present invention;

[0034] Figure 4 This is a schematic diagram of the structure of a top cover in an embodiment of the present invention. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments disclosed in the present invention will be described in further detail below with reference to the accompanying drawings.

[0036] Reference Figures 1-2In this embodiment, the heat sink unpacking tool for the flip-chip packaged device includes: a base 1, a top cover 2, lateral fastening screws A41 and B42, lateral fastening clips A51 and B52, a bottom fastening screw 6, a bottom fastening clip 7, a top fastening screw 8, and a top fastening clip 9. The top cover 2 is located above the base 1; the lateral fastening screws A41 and B42 pass through the base 1; the lateral fastening screws B42 and B42 pass through the top cover 2; and the lateral fastening clips A51, B52, 7, and 9 are positioned between the lateral fastening screws A41, B42, 6, and 8 and the sample.

[0037] In this embodiment, the base 1 can be made of a metal material with high hardness, including but not limited to: stainless steel, aluminum alloy, copper alloy, etc. Figure 3 As shown, the base 1 is a disc-shaped structure A, with a circular groove in the center and a square groove A in the center of the circular groove. Four circumferentially distributed holes A are opened on the side of the base 1 for installing lateral fastening screws A41. Specifically, there are four lateral fastening screws A41 and four lateral fastening clips A51. The four lateral fastening screws A41 pass through the four holes A and contact the corresponding lateral fastening clips A51. A hole C is opened in the center of the base 1, and the bottom fastening screw 6 passes through the hole C and contacts the bottom fastening clip 7.

[0038] In this embodiment, the top cover 2 can be made of a metal material with high hardness, including but not limited to: stainless steel, aluminum alloy, copper alloy, etc. Figure 4 As shown, the top cover 2 is a disc-shaped structure B, with a square groove B in the center. Four circumferentially distributed holes B are opened on the side of the top cover 2 for installing lateral fastening screws B42. Specifically, there are four lateral fastening screws B42 and four lateral fastening clips B52. The four lateral fastening screws B42 pass through the four holes B and contact the corresponding lateral fastening clips B52. A hole D is opened in the center of the top cover 2, through which the top fastening screw 8 passes and contacts the top fastening clip 9.

[0039] In this embodiment, four circumferentially distributed positioning bolts 3 are provided on the upper surface of the base 1, and four circumferentially distributed semi-circular grooves 14 are provided on the side of the top cover 2. The four semi-circular grooves 14 cooperate with the four positioning bolts 3 to realize the installation and fixation of the base 1 and the top cover 2. Among them, the positioning bolts 3 are integrally formed with the base 1, and are used to restrict the relative position of the base 1 and the top cover 2 when rotating the base 1 and the top cover 2, so that the base 1 and the top cover 2 can only rotate relative to each other and will not produce displacement in other directions.

[0040] In this embodiment, the lateral fastening screw A41 is mainly used to adjust the position of the lateral fastening clamp A51, so that the lateral fastening clamp A51 presses against the side of the sample; the lateral fastening screw B42 is mainly used to adjust the position of the lateral fastening clamp B52, so that the lateral fastening clamp B52 presses against the side of the sample; the bottom fastening screw 6 is mainly used to adjust the position of the bottom fastening clamp 7, so that the bottom fastening clamp 7 presses against the bottom surface of the sample; the top fastening screw 8 is mainly used to adjust the position of the top fastening clamp 9, so that the top fastening clamp 9 presses against the top surface of the sample. That is, by adjusting the lateral fastening screws A41, B42, 6, and 8, the lateral fastening clamps A51, B52, 7, and 9 can clamp and fix the sample from six directions: up, down, left, right, front, and back.

[0041] In this embodiment, the sample specifically refers to a flip-chip packaged device, including a substrate 10 and a heat sink 11. When clamping and fixing the sample, the lateral clamping clip A51 contacts the side of the substrate 10, the lateral clamping clip B52 contacts the side of the heat sink 11, the bottom clamping clip 7 contacts the bottom surface of the substrate 10, and the bottom clamping clip 9 contacts the top surface of the heat sink 11.

[0042] In this embodiment, two rotating handles A12 are symmetrically arranged on the side of the base 1, and two rotating handles B13 are symmetrically arranged on the side of the top cover 2. The rotating handles A12 and the base 1 are integrally formed, and the rotating handles B13 and the top cover 2 are integrally formed. When the heat sink is opened, the rotating handles A12 and B13 are used to apply a rotational force in opposite directions to the substrate and the heat sink to remove the heat sink from the sample.

[0043] In this embodiment, the usage process of the heat sink opening tool for the flip-chip packaged device is as follows:

[0044] Place the sample in the middle of base 1.

[0045] Adjust the height of the sample by adjusting the bottom fastening screw 6 so that the top surface of the substrate 10 is flush with the top surface of the side fastening clip A51; then, adjust the four side fastening screws A41 to fix the four sides of the substrate 10 through the four side fastening clips A51.

[0046] Place the top cover 2 into the circular groove on the top of the base 1. When placing it, align the semi-circular groove 14 of the top cover 2 with the four positioning bolts 3 of the base 1. Then, adjust the top fastening screw 8. While the top fastening clip 9 presses the top of the heat sink 11, the bottom surface of the heat sink 11 is flush with the bottom surface of the four side fastening clips B52. Adjust the side fastening screw B42 to fix the four sides of the heat sink 11 through the four side fastening clips B52.

[0047] Rotating handles A12 and B13 applies rotational forces in opposite directions to the substrate 10 and the heat sink 11, thereby removing the heat sink from the sample.

[0048] Based on the above embodiments, the following is an explanation with reference to a specific example.

[0049] 1) Select a flip-chip package device. The substrate of the flip-chip package device is an organic substrate, and the heat sink is aluminum-based silicon carbide.

[0050] 2) Place the flip-chip packaged device in the square groove A of the base.

[0051] 3) Adjust the bottom fastening screw to align the top surface of the substrate of the flip-chip packaged device with the top surface of the side fastening clip A to the same plane.

[0052] 4) Adjust the lateral fastening screws to fix the four sides of the substrate of the flip-chip packaged device through the lateral fastening clips A.

[0053] 5) Place the top cover into the circular groove of the base, aligning the four semi-circular grooves of the top cover with the four positioning bolts of the base.

[0054] 6) Slightly adjust the rotating handle B to align the side fastening screw A with the side fastening screw B.

[0055] 7) Tighten the top fastening bolts to ensure that the top fastening base plate is in close contact with the heat sink top surface.

[0056] 8) Tighten the side fastening screw B to ensure that the side fastening clip B fits tightly against the four sides of the heat sink.

[0057] 9) Fix the base and rotate the rotating handle B on the top cover clockwise. When the heat sink separates from the substrate and the torque of the rotating handle B decreases significantly, the heat sink cap is successfully opened.

[0058] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

[0059] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A flip-chip device heat sink unsealing tool, comprising: Comprise: Base (1), top cover (2), lateral fastening screw A (41), lateral fastening screw B (42), lateral fastening clamp A (51), lateral fastening clamp B (52), bottom fastening screw (6), bottom fastening clamp (7), top fastening screw (8) and top fastening clamp (9); The top cover (2) is located above the base (1); The lateral fastening screw A (41) and the bottom fastening screw (6) are respectively arranged through the base (1); The lateral fastening screw B (42) and the top fastening screw (8) are respectively arranged through the top cover (2); The lateral fastening clamp A (51), the lateral fastening clamp B (52), the bottom fastening clamp (7) and the top fastening clamp (9) are respectively arranged between the lateral fastening screw A (41), the lateral fastening screw B (42), the bottom fastening screw (6) and the top fastening screw (8) and the sample.

2. The flip-chip device heat sink opening tool of claim 1, wherein, The base (1) is a disc structure A, the middle of the disc structure A is a circular groove, and the middle of the circular groove is a square groove A.

3. The flip-chip package device heat sink opening tool according to claim 1, wherein, Four holes A are symmetrically arranged on the side surface of the base (1) for installing the lateral fastening screw A (41); A hole C is arranged at the center of the base (1), and the bottom fastening screw (6) passes through the hole C and contacts the bottom fastening clamp (7); Four positioning pins (3) are arranged on the upper end surface of the base (1) for installing and fixing the base (1) and the top cover (2).

4. The flip-chip device heat sink opening tool of claim 3, wherein, The number of the lateral fastening screw A (41) and the lateral fastening clamp A (51) is four; wherein, the four lateral fastening screw A (41) respectively passes through the four holes A and contacts the corresponding lateral fastening clamp A (51).

5. The flip-chip device heat sink opening tool of claim 1, wherein, Two rotary handles A (12) are symmetrically arranged on the side surface of the base (1).

6. The flip-chip device heat sink opening tool of claim 1, wherein, The top cover (2) is a disc structure B, and the middle of the disc structure B is a square groove B.

7. The flip-chip package device heat sink opening tool according to claim 3, wherein, Four holes B are symmetrically arranged on the side surface of the top cover (2) for installing the lateral fastening screw B (42); A hole D is arranged at the center of the top cover (2), and the top fastening screw (8) passes through the hole D and contacts the top fastening clamp (9); Four semicircular grooves (14) are symmetrically arranged on the side surface of the top cover (2) for installing and fixing the base (1) and the top cover (2).

8. The flip-chip package device heat sink opening tool according to claim 7, wherein, The number of the lateral fastening screw B (42) and the lateral fastening clamp B (52) is four; wherein, the four lateral fastening screw B (42) respectively passes through the four holes B and contacts the corresponding lateral fastening clamp B (52).

9. The flip-chip device heat sink opening tool of claim 1, wherein, Two rotary handles B (13) are symmetrically arranged on the side surface of the top cover (2).

10. The flip-chip package device heat sink opening tool according to claim 1, wherein, The lateral fastening screw A (41) is used for adjusting the position of the lateral fastening clamp A (51) to press the lateral fastening clamp A (51) against the side surface of the sample. a lateral fastening screw B (42) for adjusting the position of a lateral fastening clamp B (52) to press the lateral surface of the sample; a bottom fastening screw (6) for adjusting the position of a bottom fastening clamp (7) to press the bottom surface of the sample; a top fastening screw (8) for adjusting the position of a top fastening clamp (9) to press the top surface of the sample.

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