Preparation method of high-thermal-conductivity epoxy resin and high-thermal-conductivity epoxy resin

Abstract

The invention discloses a preparation method of epoxy resin with high thermal conductivity. The preparation method comprises the following steps: dissolving dodecyl dimethyl ammonium chloride and dodecyl dimethyl ammonium bromide in a solution, and uniformly stirring to obtain a first mixed solution; uniformly mixing polyvinylpyrrolidone, ethylene glycol and modified hexagonal boron nitride with active chemical groups to obtain a second mixed solution; dissolving silver nitrate in an ethylene glycol solution, adding the first mixed solution and the second mixed solution, and uniformly stirring to obtain a hexagonal boron nitride-silver nanowire compound; after bisphenol A epoxy resin is heated, solvents such as the hexagonal boron nitride-silver nanowire compound are added and mixed uniformly, and the high-thermal-conductivity epoxy resin is obtained. By growing the silver nanowires on the surface of the hexagonal boron nitride, the compatibility and dispersity of the hybrid material of the hexagonal boron nitride and the silver nanowires are improved, and the thermal conductivity of the epoxy resin can be effectively improved.

Description

Technical Field

[0001] This invention relates to the field of epoxy resin technology, and more particularly to a method for preparing a high thermal conductivity epoxy resin and the high thermal conductivity epoxy resin itself. Background Technology

[0002] Epoxy resin composites are widely used in electronics, rail transportation, and new energy vehicles due to their advantages of high strength, high modulus, and low cost. These fields generally involve the heating of electrical components. Excessive heat accumulation will adversely affect the service life and working efficiency of electrical components. Therefore, epoxy resin composites with high thermal conductivity have broad application prospects.

[0003] In existing technologies for thermally conductive epoxy resin composites, a single thermally conductive filler is typically used, which is limited by the availability of a single thermally conductive nanosheet. For hybrid solutions using multiple thermally conductive fillers, the dispersion and compatibility of the fillers need to be considered. Improving the compatibility of each filler, enhancing its dispersibility in the epoxy resin, and maximizing the effectiveness of multiple thermally conductive fillers are crucial issues in the preparation of high thermally conductive epoxy resin composites. Summary of the Invention

[0004] The main objective of this invention is to solve the technical problems described in the background section.

[0005] In a first aspect, the present invention provides a method for preparing a high thermal conductivity epoxy resin, the method comprising: Dodecyl dimethyl ammonium chloride and dodecyl dimethyl ammonium bromide are dissolved in a solution of ethylene glycol, stirred evenly at a first preset temperature, and cooled to obtain a first mixture. Polyvinylpyrrolidone, ethylene glycol and modified hexagonal boron nitride with active chemical groups are mixed evenly and then mixed evenly at a second preset temperature to obtain a second mixture. Silver nitrate was dissolved in ethylene glycol solution, added to the first mixture and stirred until homogeneous to obtain the third mixture. Then the second mixture was added and stirred until homogeneous. The mixture was reacted at a third preset temperature for a third preset time. The mixture was then cooled, centrifuged and washed in sequence to obtain the hexagonal boron nitride-silver nanowire composite. After heating the bisphenol A epoxy resin, additives and the hexagonal boron nitride-silver nanowire composite were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0006] In one embodiment, the method for preparing the modified hexagonal boron nitride with active chemical groups includes: Hexagonal boron nitride, sulfonyl chloride, and phosphoryl chloride were added to chloroform and stirred at room temperature for a first preset time. Then, the mixture was ultrasonically dispersed and stirred for a second preset time under water bath heating. Finally, the mixture was washed to obtain modified hexagonal boron nitride with active chemical groups.

[0007] In one embodiment, the hexagonal boron nitride component is 1 to 1.5 parts, the sulfonyl chloride component is 5 to 10 parts, the phosphoryl chloride component is 5 to 10 parts, the chloroform component is 10 to 20 parts, the first preset time is 2 to 6 hours, and the second preset time is 12 to 24 hours.

[0008] In one embodiment, the first preset temperature is 80°C, the second preset temperature is room temperature, the third preset temperature is 180°C, and the third preset time is 1 hour.

[0009] In one embodiment, the first mixture contains 0.1-0.2 parts of dodecyl dimethyl ammonium chloride, 0.1-0.2 parts of dodecyl dimethyl ammonium bromide, and 10-20 parts of ethylene glycol; the second mixture contains 4-8 parts of polyvinylpyrrolidone, 100-200 parts of ethylene glycol, and 1-2 parts of modified hexagonal boron nitride; and the third mixture contains 0.25-0.5 parts of silver nitrate and 25-50 parts of ethylene glycol.

[0010] In one embodiment, the bisphenol A epoxy resin component in the high thermal conductivity epoxy resin is 80-110 parts, the additives include a curing agent, a curing accelerator, a solvent, a flame retardant, and an antioxidant, the curing agent component is 3-10 parts, the curing accelerator component is 0.1-0.5 parts, the solvent component is 15-30 parts, the flame retardant component is 15-25 parts, the hexagonal boron nitride-silver nanowire composite component is 10-30 parts, and the antioxidant component is 1-2 parts.

[0011] In one embodiment, the step of heating the bisphenol A epoxy resin, adding the additives and the hexagonal boron nitride-silver nanowire composite, and mixing them evenly to obtain a high thermal conductivity epoxy resin can be replaced by: After heating the bisphenol A epoxy resin to 60-70°C, the additives and the hexagonal boron nitride-silver nanowire composite were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0012] In one embodiment, the curing agent is any one or more of diethylenetriamine, maleic anhydride, tetraethylenepentamine, dicyandiamide, phthalic anhydride, and m-phenylenediamine; the curing accelerator is any one or more of 4-dimethylaminopyridine, 2-methylimidazole, and 2-phenylimidazole; the solvent is any one or more of acetone, dimethyl carbonate, and N,N-dimethylformamide; the antioxidant is any one of antioxidant 1010, antioxidant 1076, antioxidant 168, antioxidant 1098, and antioxidant 264; and the flame retardant is any one or more of tris(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide, zinc borate, aluminum hydroxide, magnesium hydroxide, and ammonium polyphosphate.

[0013] In a second aspect, the present invention also provides a high thermal conductivity epoxy resin, said high thermal conductivity epoxy resin being made by the method described in the first aspect.

[0014] The aforementioned method for preparing high thermal conductivity epoxy resin improves the compatibility and dispersibility of the hybrid material by growing silver nanowires on the surface of hexagonal boron nitride. The hexagonal boron nitride-silver nanowire composite, through the hybridization of thermally conductive materials in different dimensions, possesses excellent thermal conductivity, effectively improving the thermal conductivity of the epoxy resin. Furthermore, the modified amino and hydroxyl functional groups on the surface of hexagonal boron nitride provide reaction sites for the epoxy resin, effectively improving its compatibility with the epoxy resin. The composite material obtained by reacting the hexagonal boron nitride-silver nanowire composite with epoxy resin exhibits good thermal conductivity and can be used as a sheet material in electronic and electrical fields with high thermal conductivity requirements. Attached Figure Description

[0015] Figure 1 This is a flowchart illustrating a method for preparing a high thermal conductivity epoxy resin according to an embodiment of the present invention. Figure 2 This is a scanning electron microscope image of a hexagonal boron nitride-silver nanowire composite. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0017] Firstly, referring to Figure 1-2 This invention provides a method for preparing a high thermal conductivity epoxy resin, the method comprising: S110, dodecyl dimethyl ammonium chloride and dodecyl dimethyl ammonium bromide are dissolved in a solution of ethylene glycol, stirred evenly at a first preset temperature, and cooled to obtain a first mixture; Wherein, the first preset temperature is 80℃; the dodecyl dimethyl ammonium chloride component in the first mixture is 0.1~0.2 parts, the dodecyl dimethyl ammonium bromide component is 0.1~0.2 parts, and the ethylene glycol component is 10~20 parts, and the parts in this application are counted by weight.

[0018] S120, polyvinylpyrrolidone, ethylene glycol and modified hexagonal boron nitride with active chemical groups are mixed evenly and then mixed evenly at a second preset temperature to obtain a second mixture; Wherein, the second preset temperature is room temperature, the polyvinylpyrrolidone component in the second mixture is 4-8 parts, the ethylene glycol component is 100-200 parts, and the modified hexagonal boron nitride component is 1-2 parts.

[0019] S130, silver nitrate is dissolved in ethylene glycol solution, added to the first mixture and stirred evenly to obtain the third mixture, then the second mixture is added and stirred evenly, reacted at the third preset temperature for the third preset time, and then cooled, centrifuged and washed in sequence to obtain the hexagonal boron nitride-silver nanowire composite. The third preset temperature is 180℃, the third preset time is 1 hour, the silver nitrate component in the third mixture is 0.25~0.5, and the ethylene glycol component is 25~50 parts. The scanning electron microscope image of the hexagonal boron nitride-silver nanowire composite is shown below. Figure 2 As shown.

[0020] S140: After heating the bisphenol A epoxy resin, add the additives and the hexagonal boron nitride-silver nanowire composite and mix evenly to obtain a high thermal conductivity epoxy resin.

[0021] The high thermal conductivity epoxy resin comprises 80-110 parts of bisphenol A epoxy resin, and the additives include a curing agent, a curing accelerator, a solvent, a flame retardant, and an antioxidant. The curing agent comprises 3-10 parts, the curing accelerator comprises 0.1-0.5 parts, the solvent comprises 15-30 parts, the flame retardant comprises 15-25 parts, the hexagonal boron nitride-silver nanowire composite comprises 10-30 parts, and the antioxidant comprises 1-2 parts. The curing agent is any one of diethylenetriamine, maleic anhydride, tetraethylenepentamine, dicyandiamide, phthalic anhydride, and m-phenylenediamine. The curing accelerator is one or more of 4-dimethylaminopyridine, 2-methylimidazole, and 2-phenylimidazole; the solvent is one or more of acetone, dimethyl carbonate, and N,N-dimethylformamide; the antioxidant is one or more of antioxidant 1010, antioxidant 1076, antioxidant 168, antioxidant 1098, and antioxidant 264; and the flame retardant is one or more of tris(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide, zinc borate, aluminum hydroxide, magnesium hydroxide, and ammonium polyphosphate.

[0022] Step S140 can be replaced by: heating the bisphenol A epoxy resin to 60~70℃, adding the additives and the hexagonal boron nitride-silver nanowire composite, and mixing them evenly to obtain a high thermal conductivity epoxy resin.

[0023] In this embodiment, the compatibility and dispersibility of the hybrid material are improved by growing silver nanowires on the surface of hexagonal boron nitride. The hexagonal boron nitride-silver nanowire composite exhibits excellent thermal conductivity through the hybridization of thermally conductive materials with different dimensions, effectively improving the thermal conductivity of epoxy resin. Furthermore, the modified amino and hydroxyl functional groups on the surface of hexagonal boron nitride provide reaction sites for epoxy resin, effectively improving its compatibility with epoxy resin. The composite material obtained by reacting the hexagonal boron nitride-silver nanowire composite with epoxy resin possesses good thermal conductivity and can be used as a sheet material in electronic and electrical fields with high thermal conductivity requirements.

[0024] In one embodiment, the method for preparing modified hexagonal boron nitride with active chemical groups includes: Hexagonal boron nitride, sulfonyl chloride and phosphoryl chloride were added to chloroform, stirred at room temperature for a first preset time, and then ultrasonically dispersed. After stirring for a second preset time under water bath heating, the mixture was washed to obtain modified hexagonal boron nitride with active chemical groups. The components of the hexagonal boron nitride are 1 to 1.5 parts, the components of the sulfonyl chloride are 5 to 10 parts, the components of the phosphoryl chloride are 5 to 10 parts, the components of the chloroform are 10 to 20 parts, the first preset time is 2 to 6 hours, and the second preset time is 12 to 24 hours.

[0025] Specifically, the steps of adding hexagonal boron nitride, sulfonyl chloride, and phosphoryl chloride to chloroform, stirring at room temperature for a first preset time, ultrasonically dispersing, stirring for a second preset time under water bath heating, and then washing to obtain modified hexagonal boron nitride with active chemical groups include: Hexagonal boron nitride, sulfonyl chloride and phosphoryl chloride were added to chloroform and stirred at room temperature for a first preset time to obtain the first solution; The first mixture is subjected to ultrasonic dispersion for a fourth preset time, and then placed in a container for water bath heating and stirring for a second preset time. The water bath heating temperature is 60~80℃, to obtain the second solution. The second solution was subjected to vacuum filtration and washed a predetermined number of times with a predetermined washing solution to obtain modified hexagonal boron nitride with active chemical groups.

[0026] The fourth preset time is 1-2 hours, the preset washing liquid is dichloromethane, and the preset number of times is 3.

[0027] In this embodiment, the modified hexagonal boron nitride obtained by the treatment has chemical groups, which can improve compatibility and is suitable for epoxy systems.

[0028] In Example 1, the method for preparing the high thermal conductivity epoxy resin includes: 1g of hexagonal boron nitride (1 part), 8g of sulfonyl chloride (8 parts), and 8g of phosphoryl chloride (8 parts) were added to 20g of chloroform (20 parts) and stirred at room temperature for 5 hours in a stirring device; then the solution was ultrasonically dispersed, heated in a water bath and stirred for 12 hours; finally, it was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. Dissolve 0.15g dodecyl dimethyl ammonium chloride (0.15 parts) and 0.2g dodecyl dimethyl ammonium bromide (0.2 parts) in 20g ethylene glycol solution (20 parts), stir evenly at 80°C with a speed of 300rpm, and cool to room temperature to obtain the first mixture for later use; Mix 1.5g of modified hexagonal boron nitride (1.5 parts), 6g of polyvinylpyrrolidone (6 parts) and 150g of ethylene glycol (150 parts) evenly, and stir at 800 rpm at room temperature to obtain a second mixture for later use. Dissolve 0.4g of AgNO3 (0.4 parts) in 50g of ethylene glycol solution (50 parts), add the first mixture, and stir evenly at 800rpm to obtain the third mixture; After the second and third mixtures were stirred evenly, they were reacted at 180°C for 1 hour, and then cooled, centrifuged, and washed to obtain a hexagonal boron nitride-silver nanowire composite. 90g of bisphenol A epoxy resin (90 parts) was heated, and 5g of maleic anhydride (5 parts), 0.3g of 4-dimethylaminopyridine (0.3 parts), 25g of acetone (25 parts), 20g of zinc borate (20 parts), 25g of hexagonal boron nitride-silver nanowire composite (25 parts), and 15g of antioxidant 1010 (15 parts) were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0029] The thermal conductivity of the high thermal conductivity epoxy resin was tested: the thermal diffusivity (α) was measured using a laser flash spectrometer. The sample diameter was 100 mm and the sample thickness was 2 mm. The thermal conductivity of the sample was calculated using the formula λ = α × C. p ×ρ; The high thermal conductivity epoxy resin was subjected to tensile strength test: according to GB / T1040-92, the sample was cut into a size of 4mm×75mm×2mm and placed in an electronic universal testing machine for tensile test at a tensile speed of 100mm / min. The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 3.2 W / m·K and a tensile strength of 91.2 MPa. In Example 2, the formulation of the modified hexagonal boron nitride was modified: 8g of sulfonyl chloride and 8g of phosphoryl chloride were replaced with 10g of sulfonyl chloride and 10g of phosphoryl chloride. Simultaneously, the first stirring time was changed to 6 hours, and the second stirring time was changed to 24 hours. The specific preparation method of the high thermal conductivity epoxy resin includes: 1g of hexagonal boron nitride, 10g of sulfonyl chloride, and 10g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 6 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 24 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. Dissolve 0.15g dodecyl dimethyl ammonium chloride and 0.2g dodecyl dimethyl ammonium bromide in 20g ethylene glycol solution, stir at 300rpm at 80℃ until homogeneous, and cool to room temperature to obtain the first mixture for later use. Mix 1.5g of modified hexagonal boron nitride, 6g of polyvinylpyrrolidone and 150g of ethylene glycol evenly, and stir at 800rpm at room temperature to obtain a second mixture for later use. Dissolve 0.4g of AgNO3 in 50g of ethylene glycol solution, add the first mixture, and stir evenly at 800rpm to obtain the third mixture. After the second and third mixtures were stirred evenly, they were reacted at 180°C for 1 hour, and then cooled, centrifuged, and washed to obtain a hexagonal boron nitride-silver nanowire composite. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0030] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 2.6 W / m·K and a tensile strength of 92.5 MPa. (Sulfonyl chloride and phosphoryl chloride, as halogenation modifiers, introduce chlorinated functional groups on the surface of hexagonal boron nitride (h-BN) through a substitution reaction with the hydroxyl groups on the h-BN surface.) Excessive modifier and prolonged stirring time led to an excessively high density of functional groups on the h-BN surface, causing intermolecular electrostatic attraction and aggregation. This disrupted the uniform dispersion of the thermally conductive filler, resulting in the breakage or obstruction of the internal thermal conductivity pathways of the epoxy resin, a decrease in heat transfer efficiency, and a drop in thermal conductivity from 3.2 W / m·K. K decreased to 2.6 W / m K (decreased by 18.75%), while moderate over-modification improved the interfacial bonding force between h-BN and the matrix, but agglomeration offset the thermal conductivity gain, resulting in only a slight improvement in mechanical properties, with tensile strength increasing from 91.2 MPa to 92.5 MPa (a slight increase of 1.4%).

[0031] In Example 3, the formulation of the modified hexagonal boron nitride was modified: 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride were replaced with 1.5g of hexagonal boron nitride, 5g of sulfonyl chloride, and 5g of phosphoryl chloride. Simultaneously, the initial stirring time was changed to 2 hours. The specific preparation method of the high thermal conductivity epoxy resin includes: 1.5g of hexagonal boron nitride, 5g of sulfonyl chloride, and 5g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 2 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 12 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. Dissolve 0.15g dodecyl dimethyl ammonium chloride and 0.2g dodecyl dimethyl ammonium bromide in 20g ethylene glycol solution, stir at 300rpm at 80℃ until homogeneous, and cool to room temperature to obtain the first mixture for later use. Mix 1.5g of modified hexagonal boron nitride, 6g of polyvinylpyrrolidone and 150g of ethylene glycol evenly, and stir at 800rpm at room temperature to obtain a second mixture for later use. Dissolve 0.4g of AgNO3 in 50g of ethylene glycol solution, add the first mixture, and stir evenly at 800rpm to obtain the third mixture. After the second and third mixtures were stirred evenly, they were reacted at 180°C for 1 hour, and then cooled, centrifuged, and washed to obtain a hexagonal boron nitride-silver nanowire composite. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0032] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 2.1 W / m·K and a tensile strength of 82.3 MPa. The reduced amount of modifier and shorter stirring time resulted in insufficient grafting of functional groups on the h-BN surface. The increased h-BN, due to insufficient modification, agglomerated, further hindering heat transfer, reducing the thermal conductivity from 3.2 W / m·K. K decreased to 2.1 W / m K (decreased by 34.38%), the insufficiently modified h-BN has poor compatibility with the epoxy resin matrix, there are voids at the interface, and stress concentration is prone to occur when under stress, resulting in a significant decrease in tensile strength, that is, the tensile strength decreased from 91.2MPa to 82.3MPa (decreased by 9.76%).

[0033] In Example 4, the amount of polyvinylpyrrolidone in the second mixture was adjusted from 6g to 8g (1.5g of modified hexagonal boron nitride and 150g of ethylene glycol remained unchanged), and the amount of AgNO3 in the third mixture was adjusted from 0.4g to 0.25g (50g of ethylene glycol and the conditions for adding the first mixture remained unchanged). The specific method for preparing the high thermal conductivity epoxy resin includes: 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 5 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 12 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. Dissolve 0.15g dodecyl dimethyl ammonium chloride and 0.2g dodecyl dimethyl ammonium bromide in 20g ethylene glycol solution, stir at 300rpm at 80℃ until homogeneous, and cool to room temperature to obtain the first mixture for later use. Mix 1.5g of modified hexagonal boron nitride, 8g of polyvinylpyrrolidone and 150g of ethylene glycol evenly, and stir at 800rpm at room temperature to obtain a second mixture for later use. Dissolve 0.25g of AgNO3 in 50g of ethylene glycol solution, add the first mixture, and stir evenly at 800rpm to obtain the third mixture. After the second and third mixtures were stirred evenly, they were reacted at 180°C for 1 hour, and then cooled, centrifuged, and washed to obtain a hexagonal boron nitride-silver nanowire composite. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0034] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 2.4 W / m·K and a tensile strength of 87.6 MPa. Increasing the amount of polyvinylpyrrolidone (PVP) improved the dispersion effect, but reducing the amount of AgNO3 led to a decrease in the yield of silver nanowires. The insufficient number of "thermal bridges" prevented complete connection of the h-BN sheets, and the two effects canceled each other out. The thermal conductivity was better than in Examples 2 and 3, but lower than in Example 1. Specifically, the thermal conductivity of Example 1 was 3.2 W / m·K. K decreased to 2.4 W / m K (decreased by 25%), while the improved PVP dispersion improved interfacial compatibility, but the reduced amount of silver nanowires led to a decrease in the number of bonding points between the matrix and the composite, resulting in a slight decrease in mechanical properties, namely, the tensile strength decreased from 91.2 MPa to 87.6 MPa (decreased by 3.95%).

[0035] In Example 5, the amount of polyvinylpyrrolidone in the second mixture was adjusted from 6g to 4g, and the amount of AgNO3 in the third mixture was adjusted from 0.4g to 0.5g. The specific method for preparing the high thermal conductivity epoxy resin includes: 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 5 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 12 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. Dissolve 0.15g dodecyl dimethyl ammonium chloride and 0.2g dodecyl dimethyl ammonium bromide in 20g ethylene glycol solution, stir at 300rpm at 80℃ until homogeneous, and cool to room temperature to obtain the first mixture for later use. Mix 1.5g of modified hexagonal boron nitride, 4g of polyvinylpyrrolidone and 150g of ethylene glycol evenly, and stir at 800rpm at room temperature to obtain a second mixture for later use. Dissolve 0.5g of AgNO3 in 50g of ethylene glycol solution, add the first mixture, and stir evenly at 800rpm to obtain the third mixture; After the second and third mixtures were stirred evenly, they were reacted at 180°C for 1 hour, and then cooled, centrifuged, and washed to obtain a hexagonal boron nitride-silver nanowire composite. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0036] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 2.1 W / m·K and a tensile strength of 84.2 MPa. However, insufficient PVP content prevented complete encapsulation of the silver nanowires generated from excessive AgNO3, leading to nanowire agglomeration. This agglomeration disrupted the continuity of the thermally conductive network and hindered the dispersion of the h-BN sheets, significantly reducing the thermal conductivity from 3.2 W / m·K. K decreased to 2.1 W / m K (decreased by 34.38%), silver nanowire aggregation and insufficient PVP dispersion led to a decrease in the interfacial compatibility between the composite and the epoxy resin matrix. Under stress, interfacial delamination was prone to occur, resulting in a decrease in tensile strength, specifically from 91.2 MPa to 84.2 MPa (decreased by 7.67%).

[0037] In Example 6, the amount of hexagonal boron nitride-silver nanowire composite was reduced from 25g to 10g, and the specific method for preparing the high thermal conductivity epoxy resin included: 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 5 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 12 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. Dissolve 0.15g dodecyl dimethyl ammonium chloride and 0.2g dodecyl dimethyl ammonium bromide in 20g ethylene glycol solution, stir at 300rpm at 80℃ until homogeneous, and cool to room temperature to obtain the final product. Mix 1.5g of modified hexagonal boron nitride, 6g of polyvinylpyrrolidone and 150g of ethylene glycol evenly, and stir at 800rpm at room temperature to obtain a second mixture for later use. Dissolve 0.4g of AgNO3 in 50g of ethylene glycol solution, add the first mixture, and stir evenly at 800rpm to obtain the third mixture. After the second and third mixtures were stirred evenly, they were reacted at 180°C for 1 hour, and then cooled, centrifuged, and washed to obtain a hexagonal boron nitride-silver nanowire composite. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 10g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0038] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 1.5 W / m·K and a tensile strength of 82.7 MPa. The amount of composite material used is only 40% of that in Example 1. The insufficient concentration of thermally conductive filler prevents the formation of a continuous thermally conductive network. Heat transfer primarily relies on the epoxy resin matrix, resulting in a sharp drop in thermal conductivity from 3.2 W / m·K. K decreased to 1.5 W / m K (decreased by 53.12%), as the composite is used as a reinforcing phase. The reduced amount of composite leads to a lack of sufficient support points when the matrix is ​​under stress. At the same time, the interfacial bonding area is reduced, resulting in a decrease in tensile strength. The tensile strength decreased from 91.2 MPa to 82.7 MPa (decreased by 9.32%).

[0039] In Example 7, the amount of acetone used was reduced from 25g to 10g, and the specific method for preparing the high thermal conductivity epoxy resin included: 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 5 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 12 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. Dissolve 0.15g dodecyl dimethyl ammonium chloride and 0.2g dodecyl dimethyl ammonium bromide in 20g ethylene glycol solution, stir at 300rpm at 80℃ until homogeneous, and cool to room temperature to obtain the first mixture for later use. Mix 1.5g of modified hexagonal boron nitride, 6g of polyvinylpyrrolidone and 150g of ethylene glycol evenly, and stir at 800rpm at room temperature to obtain a second mixture for later use. Dissolve 0.4g of AgNO3 in 50g of ethylene glycol solution, add the first mixture, and stir evenly at 800rpm to obtain the third mixture. After the second and third mixtures were stirred evenly, they were reacted at 180°C for 1 hour, and then cooled, centrifuged, and washed to obtain a hexagonal boron nitride-silver nanowire composite. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 10g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0040] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 2.3 W / m·K and a tensile strength of 83.1 MPa. Insufficient acetone content led to increased system viscosity, uneven dispersion of the composite and other fillers, and localized agglomeration, obstructing the thermal conductivity pathway. Simultaneously, decreased interfacial wettability increased thermal resistance and reduced thermal conductivity efficiency, with the thermal conductivity decreasing from 3.2 W / m·K. K decreased to 2.3 W / m K (decreased by 28.12%), uneven mixing leads to microscopic voids and stress concentration points inside the matrix, which are prone to fracture at these weak points when under stress, resulting in a decrease in tensile strength, from 91.2 MPa to 83.1 MPa (decreased by 8.88%).

[0041] In Comparative Example 1, hexagonal boron nitride was not treated; 1.5g of unmodified hexagonal boron nitride was used directly, and the remaining portion was the same as in Example 4. The specific preparation method of the high thermal conductivity epoxy resin includes: 0.15 g of dodecyl dimethyl ammonium chloride and 0.2 g of dodecyl dimethyl ammonium bromide were dissolved in 20 g of ethylene glycol solution and stirred at 300 rpm at 80 °C until homogeneous. After cooling to room temperature, a first mixture was obtained for later use. 1.5 g of hexagonal boron nitride, 8 g of polyvinylpyrrolidone, and 150 g of ethylene glycol were mixed uniformly and stirred at 800 rpm at room temperature until homogeneous, resulting in a second mixture for later use. 0.25 g of AgNO3 was dissolved in 50 g of ethylene glycol solution and added to the first mixture. The mixture was stirred at 800 rpm until homogeneous, resulting in a third mixture for later use. The second and third mixtures were stirred until homogeneous and reacted at 180 °C for 1 h. After cooling, centrifugation, and washing, a hexagonal boron nitride-silver nanowire composite was obtained. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0042] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 1.3 W / m·K and a tensile strength of 62.5 MPa. However, the unmodified h-BN and silver nanowires are not firmly bonded, and the silver nanowires easily detach, failing to form a stable "h-BN-silver nanowire" thermally conductive network. Furthermore, severe h-BN aggregation disrupts the thermal conductivity pathways, resulting in thermal conductivity properties close to that of pure epoxy resin, with a thermal conductivity of 3.2 W / m·K. K decreased to 1.3 W / m K (decreased by 59.37%), there are obvious voids at the interface between unmodified h-BN and epoxy resin matrix, the interfacial bonding is extremely weak, the interface peels off under stress, and the tensile strength decreases significantly (the largest decrease), from 91.2MPa to 62.5MPa (decreased by 31.47%).

[0043] In Comparative Example 2, the synthesis of the hexagonal boron nitride-silver nanowire composite was omitted. Instead of 25g of the hexagonal boron nitride-silver nanowire composite, 25g of modified hexagonal boron nitride was used. The preparation steps of the first / second / third mixture and the synthesis steps of the hexagonal boron nitride-silver nanowire composite were omitted. The specific method for preparing the high thermal conductivity epoxy resin includes: 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 5 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 12 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of modified hexagonal boron nitride, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0044] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 0.9 W / m·K and a tensile strength of 71.3 MPa. Without silver nanowires to build a "thermal bridge," the modified h-BN sheets have numerous voids, significantly increasing interfacial thermal resistance and hindering effective heat transfer, resulting in the worst thermal conductivity, with a thermal conductivity starting at 3.2 W / m·K. K decreased to 0.9 W / m K (decreased by 71.87%). Although modified h-BN has better compatibility than unmodified h-BN, it lacks the interfacial reinforcement effect of silver nanowires, resulting in insufficient bonding between the matrix and the filler. The tensile strength decreased significantly, from 91.2 MPa to 71.3 MPa (decreased by 21.82%).

[0045] In Comparative Example 3, 0.15g of dodecyl dimethyl ammonium chloride (DDAC) was omitted from the first mixture, and only 0.2g of dodecyl dimethyl ammonium bromide (DDAB) was retained. The amount of polyvinylpyrrolidone in the second mixture was adjusted from 6g to 8g, and the amount of AgNO3 in the third mixture was adjusted from 0.4g to 0.25g. The specific preparation method of the high thermal conductivity epoxy resin includes: 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 5 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 12 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. 0.2 g of dodecyl dimethyl ammonium bromide was dissolved in a mixed solution of 20 g of ethylene glycol and stirred at 300 rpm at 80 °C until homogeneous. After cooling to room temperature, a first mixture was obtained for later use. 1.5 g of modified hexagonal boron nitride, 8 g of polyvinylpyrrolidone, and 150 g of ethylene glycol were mixed uniformly and stirred at 800 rpm at room temperature to obtain a second mixture for later use. 0.25 g of AgNO3 was dissolved in 50 g of ethylene glycol solution and added to the first mixture. The mixture was stirred at 800 rpm until homogeneous to obtain a third mixture for later use. The second and third mixtures were stirred uniformly and reacted at 180 °C for 1 h. After cooling, centrifugation, and washing, a hexagonal boron nitride-silver nanowire composite was obtained. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0046] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 2.2 W / m·K and a tensile strength of 84.5 MPa. DDAB alone cannot effectively control the growth of silver nanowires; some silver nanowires are granular or short rod-shaped, weakening the "thermal bridging" effect. Simultaneously, the bonding force between silver nanowires and h-BN decreases, dispersibility deteriorates, and the thermally conductive network becomes discontinuous, reducing the thermal conductivity from 3.2 W / m·K. K decreased to 2.2 W / m K (decreased by 31.25%), the synergistic effect of surfactant complex disappeared, the interfacial compatibility between the complex and the matrix decreased, the tensile strength decreased slightly, from 91.2 MPa to 84.5 MPa (decreased by 7.35%).

[0047] In Comparative Example 4, 0.2g of dodecyl dimethyl ammonium bromide was omitted from the first mixture, and the amount of dodecyl dimethyl ammonium chloride was adjusted to 0.2g. The amount of polyvinylpyrrolidone in the second mixture was adjusted from 6g to 8g, and the amount of AgNO3 in the third mixture was adjusted from 0.4g to 0.25g. The specific preparation method of the high thermal conductivity epoxy resin includes: 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride were added to 20g of chloroform and stirred at room temperature for 5 hours in a stirring device. The solution was then ultrasonically dispersed, heated in a water bath, and stirred for another 12 hours. Finally, the mixture was vacuum filtered and washed three times with dichloromethane to obtain modified hexagonal boron nitride. 0.2 g of dodecyl dimethyl ammonium chloride was dissolved in 20 g of ethylene glycol solution and stirred at 300 rpm at 80 °C until homogeneous. After cooling to room temperature, a first mixture was obtained for later use. 1.5 g of modified hexagonal boron nitride, 8 g of polyvinylpyrrolidone, and 150 g of ethylene glycol were mixed uniformly and stirred at 800 rpm at room temperature until homogeneous, resulting in a second mixture for later use. 0.25 g of AgNO3 was dissolved in 50 g of ethylene glycol solution and added to the first mixture. The mixture was stirred at 800 rpm until homogeneous, resulting in a third mixture for later use. The second and third mixtures were stirred until homogeneous and reacted at 180 °C for 1 h. After cooling, centrifugation, and washing, a hexagonal boron nitride-silver nanowire composite was obtained. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0048] The high thermal conductivity epoxy resin produced in this embodiment has a thermal conductivity of 2.1 W / m·K and a tensile strength of 85.2 MPa. The single DDAC resulted in a reduced aspect ratio (shorter and thicker) of the silver nanowires, leading to decreased thermal conductivity. Simultaneously, insufficient bonding with h-BN resulted in poor dispersibility and impaired thermal network continuity, reducing the thermal conductivity from 3.2 W / m·K. K decreased to 2.1 W / m K (decreased by 34.38%), poor silver nanowire morphology and decreased interfacial compatibility, tensile strength decreased slightly, but due to the increased DDAC content, the negative impact of the lack of compound was partially offset, and the strength was slightly higher than that of Comparative Example 3, with tensile strength decreasing from 91.2 MPa to 85.2 MPa (decreased by 6.58%).

[0049] In Comparative Example 5, 6g of polyvinylpyrrolidone (PVP) was omitted from the second mixture, and only 1.5g of modified hexagonal boron nitride and 150g of ethylene glycol were retained. The amount of AgNO3 in the third mixture was adjusted from 0.4g to 0.25g. The preparation method of the high thermal conductivity epoxy resin specifically included: adding 1g of hexagonal boron nitride, 8g of sulfonyl chloride, and 8g of phosphoryl chloride to 20g of chloroform and stirring at room temperature for 5 hours in a stirring device; then ultrasonically dispersing the solution, heating in a water bath and continuing to stir for 12 hours; finally vacuum filtering and washing three times with dichloromethane to obtain modified hexagonal boron nitride. A first mixture was prepared by stirring a solution of 0.15 g dodecyl dimethyl ammonium chloride, 0.2 g dodecyl dimethyl ammonium bromide, and 20 g ethylene glycol at 300 rpm at 80 °C until homogeneous. After cooling to room temperature, the mixture was prepared for use. A second mixture was prepared by mixing 1.5 g modified hexagonal boron nitride and 150 g ethylene glycol at 800 rpm at room temperature until homogeneous. A third mixture was prepared by dissolving 0.25 g AgNO3 in 50 g ethylene glycol solution and adding it to the first mixture. The mixture was stirred at 800 rpm until homogeneous. The second and third mixtures were stirred until homogeneous and reacted at 180 °C for 1 h. After cooling, centrifugation, and washing, the hexagonal boron nitride-silver nanowire composite was obtained. 90g of bisphenol A epoxy resin was heated, and 5g of maleic anhydride, 0.3g of 4-dimethylaminopyridine, 25g of acetone, 20g of zinc borate, 25g of hexagonal boron nitride-silver nanowire composite, and 15g of antioxidant 1010 were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

[0050] The high thermal conductivity epoxy resin prepared in this embodiment has a thermal conductivity of 1.2 W / m·K and a tensile strength of 73.4 MPa. The absence of PVP leads to severe agglomeration of the silver nanowires, preventing them from forming an effective bond with h-BN. The h-BN also agglomerates due to the lack of a dispersant, resulting in a complete breakage of the thermally conductive network. The thermal conductivity is close to that of Comparative Example 2, where the thermal conductivity is 3.2 W / m·K. K decreased to 1.2 W / m K (decreased by 62.5%), the aggregated complex has extremely poor interfacial compatibility with the epoxy resin matrix, there are a large number of micro-defects inside, and the tensile strength is significantly reduced, from 91.2 MPa to 73.4 MPa (decreased by 19.52%).

[0051] In summary, data from Examples 1-7 and Comparative Examples 1-5 show that the epoxy resin prepared by this invention possesses excellent thermal conductivity and tensile strength, making it suitable for the production of products such as boards. It is important to note that the amount of modifier and stirring time must be controlled during h-BN modification; excessive or insufficient modification will lead to a decrease in thermal conductivity. The PVP and DDAC / DDAB compound system is crucial for ensuring the dispersion and growth of silver nanowires; neither can be omitted, otherwise aggregation will occur. Simultaneously, the amount of AgNO3 must be matched with the dispersant. The synergistic effect of the "modified h-BN + silver nanowire" composite (h-BN framework + silver nanowire bridge) is essential for achieving high thermal conductivity (≥3W / m). The key to K is that neither h-BN alone nor unmodified h-BN can achieve the target performance; acetone (25g) is used as a solvent, and its amount must meet the viscosity requirements of the system to ensure that all components are mixed evenly, otherwise it will affect both thermal conductivity and mechanical properties.

[0052] In a second aspect, the present invention also provides a high thermal conductivity epoxy resin, said high thermal conductivity epoxy resin being made by the method described in the first aspect.

[0053] The high thermal conductivity epoxy resin is as described in any of the first aspects, and will not be repeated here.

[0054] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0055] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0056] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0057] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A method for preparing a high thermal conductivity epoxy resin, characterized in that, The preparation method of the high thermal conductivity epoxy resin includes: Dodecyl dimethyl ammonium chloride and dodecyl dimethyl ammonium bromide are dissolved in a solution of ethylene glycol, stirred evenly at a first preset temperature, and cooled to obtain a first mixture. Polyvinylpyrrolidone, ethylene glycol and modified hexagonal boron nitride with active chemical groups are mixed evenly and then mixed evenly at a second preset temperature to obtain a second mixture. Silver nitrate was dissolved in ethylene glycol solution, added to the first mixture and stirred until homogeneous to obtain the third mixture. Then the second mixture was added and stirred until homogeneous. The mixture was reacted at a third preset temperature for a third preset time. The mixture was then cooled, centrifuged and washed in sequence to obtain the hexagonal boron nitride-silver nanowire composite. After heating the bisphenol A epoxy resin, the additives and the hexagonal boron nitride-silver nanowire composite were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

2. The method for preparing a high thermal conductivity epoxy resin as described in claim 1, characterized in that, The method for preparing the modified hexagonal boron nitride with active chemical groups includes: Hexagonal boron nitride, sulfonyl chloride, and phosphoryl chloride were added to chloroform and stirred at room temperature for a first preset time. Then, the mixture was ultrasonically dispersed and stirred for a second preset time under water bath heating. Finally, the mixture was washed to obtain modified hexagonal boron nitride with active chemical groups.

3. The method for preparing a high thermal conductivity epoxy resin as described in claim 2, characterized in that, The hexagonal boron nitride component is 1-1.5 parts, the sulfonyl chloride component is 5-10 parts, the phosphoryl chloride component is 5-10 parts, the chloroform component is 10-20 parts, the first preset time is 2-6 hours, and the second preset time is 12-24 hours.

4. The method for preparing a high thermal conductivity epoxy resin as described in claim 1, characterized in that, The first preset temperature is 80℃, the second preset temperature is room temperature, the third preset temperature is 180℃, and the third preset time is 1 hour.

5. The method for preparing a high thermal conductivity epoxy resin as described in claim 1, characterized in that, In the first mixture, the dodecyl dimethyl ammonium chloride component is 0.1-0.2 parts, the dodecyl dimethyl ammonium bromide component is 0.1-0.2 parts, and the ethylene glycol component is 10-20 parts. In the second mixture, the polyvinylpyrrolidone component is 4-8 parts, the ethylene glycol component is 100-200 parts, and the modified hexagonal boron nitride component is 1-2 parts. In the third mixture, the silver nitrate component is 0.25-0.5 parts, and the ethylene glycol component is 25-50 parts.

6. The method for preparing a high thermal conductivity epoxy resin as described in claim 1, characterized in that, The high thermal conductivity epoxy resin comprises 80-110 parts of bisphenol A epoxy resin, and the additives include a curing agent, a curing accelerator, a solvent, a flame retardant, and an antioxidant. The curing agent comprises 3-10 parts, the curing accelerator comprises 0.1-0.5 parts, the solvent comprises 15-30 parts, the flame retardant comprises 15-25 parts, the hexagonal boron nitride-silver nanowire composite comprises 10-30 parts, and the antioxidant comprises 1-2 parts.

7. The method for preparing a high thermal conductivity epoxy resin as described in claim 6, characterized in that, The curing agent is any one or more of diethylenetriamine, maleic anhydride, tetraethylenepentamine, dicyandiamide, phthalic anhydride, and m-phenylenediamine; the curing accelerator is any one or more of 4-dimethylaminopyridine, 2-methylimidazole, and 2-phenylimidazole; the solvent is any one or more of acetone, dimethyl carbonate, and N,N-dimethylformamide; the antioxidant is any one of antioxidant 1010, antioxidant 1076, antioxidant 168, antioxidant 1098, and antioxidant 264; and the flame retardant is any one or more of tris(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide, zinc borate, aluminum hydroxide, magnesium hydroxide, and ammonium polyphosphate.

8. The method for preparing a high thermal conductivity epoxy resin as described in claim 1, characterized in that, The step of heating the bisphenol A epoxy resin, adding the additives and the hexagonal boron nitride-silver nanowire composite, and mixing them evenly to obtain a high thermal conductivity epoxy resin can be replaced by: After heating the bisphenol A epoxy resin to 60-70°C, the additives and the hexagonal boron nitride-silver nanowire composite were added and mixed evenly to obtain a high thermal conductivity epoxy resin.

9. A high thermal conductivity epoxy resin, characterized in that, The high thermal conductivity epoxy resin is made by the method described in claims 1-8.

Images