Multi-physical field coupling core particle micro-channel boiling heat exchange experimental testing device and testing method
By integrating a multi-physics field coupling microchannel boiling heat transfer experimental test device, the precise coupling and coordinated measurement of multiple physical fields such as light, sound, heat, force and flow were realized. This solved the limitations of traditional devices in terms of measurement dimension and spatiotemporal resolution, and provided a scientific basis for the thermal management design of 3D integrated chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HARBIN INST OF TECH
- Filing Date
- 2025-11-24
- Publication Date
- 2026-06-23
Smart Images
Figure CN121347591B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of boiling heat transfer experimental testing devices, and in particular relates to a multi-physics field coupled core microchannel boiling heat transfer experimental testing device and testing method. Background Technology
[0002] With the rapid development of information technology, 3D integration and chiplet technology have become key paths to break through the bottlenecks of traditional Moore's Law and achieve continuous growth in computing power. However, while 3D stacked structures bring high integration, they also lead to unprecedented heat flux density and complex coupling problems involving multiple physical fields such as electro-thermal-mechanical fields. These coupling effects profoundly affect the performance, reliability, and lifespan of chips. Therefore, accurately revealing the coupling mechanism of multiple physical fields inside 3D structure chips is not only a scientific prerequisite for developing next-generation high-power-density electronic devices, but also a core technological foundation supporting their design and manufacturing.
[0003] Microchannel phase change cooling technology is considered one of the most promising solutions due to its extremely high heat transfer efficiency. However, within the extremely limited space of a three-dimensional chip, multiple physical fields such as electricity, heat, force, and fluidity are strongly coupled and interact with each other. The complex coupling mechanism, especially the phase change and stress evolution processes at the transient and micro / nano scales, has not yet been clarified, thus severely restricting the innovation of highly reliable and efficient thermal management solutions and the further development of 3D integrated chips.
[0004] Currently, research on this problem mainly relies on numerical simulation. Although simulation methods can provide information on the field distribution inside the chip, the accuracy of the model and the reliability of the boundary conditions heavily depend on high-precision experimental data for verification and input. However, existing experimental testing devices have significant limitations: most devices can only simulate single thermal-hydraulic conditions, making it difficult to reproduce the complex environment of multiple physical fields such as light, sound, heat, force, and flow in real chip operation. At the same time, traditional measurement methods face challenges such as insufficient spatial resolution and asynchronous measurement of multiple fields at the tiny scale of the chip and microchannel, which makes it impossible to provide sufficient and effective experimental verification for the simulation model, thus limiting the accuracy of simulation predictions.
[0005] Therefore, there is an urgent need for an innovative microchannel boiling heat transfer experimental testing device that can realize the active coupling and collaborative measurement of integrated multi-physics fields. This device would provide an important experimental platform for revealing the multi-physics field coupling mechanism at the chip scale and constructing a high-fidelity simulation model. Ultimately, it would provide a solid scientific basis and core technology support for the thermal design of next-generation 3D integrated chips. Summary of the Invention
[0006] In view of this, to address the technical problems mentioned in the background section, this invention proposes a multi-physics field coupled microchannel boiling heat transfer experimental testing device and method. It innovatively integrates a laser thermal control module, a reflection temperature measurement module, a particle velocimetry module, a three-dimensional microcontroller module, a stress testing module, an acoustic field testing module, and an electric field testing module, achieving flexible combination and active control of each physical field through standardized interfaces. Pulsed lasers are used for localized point heating, thermal reflection is used for non-contact transient surface temperature analysis, a PIV system is used to analyze micro / nano-scale phase change flow fields, and an embedded thin-film strain gauge group is used to measure local thermal stress. A high-precision piezoelectric displacement stage is combined to achieve automatic alignment and coordinated measurement of each module. Through modular design and system integration, precise coupling and coordinated measurement of multiple physical fields (optical, acoustic, thermal, mechanical, and fluid) at the micro-particle scale are achieved.
[0007] This invention ultimately provides a high-precision, multi-physics field, full-field measurement experimental platform for microchannel boiling heat transfer in core particles, breaking through the technical bottlenecks of traditional devices in terms of measurement dimension, spatiotemporal resolution, and multi-field coupling capability, and providing advanced experimental means for the research and simulation verification of multi-physics field coupling mechanism in 3D integrated chips.
[0008] To achieve the above objectives, the present invention adopts the following technical solution: a multi-physics field coupled microchannel boiling heat transfer experimental testing device, comprising a laser thermal control module, a reflection temperature measurement module, a particle velocity measurement module, a three-dimensional microcontroller module, a stress testing module, an acoustic field testing module, and an electric field testing module. The laser thermal control module, acoustic field testing module, and electric field testing module respectively simulate laser, acoustic field, and electric field environments. The reflection temperature measurement module, particle velocity measurement module, and stress testing module constitute a multi-parameter, high spatiotemporal resolution data acquisition system at the core-scale. The three-dimensional microcontroller module is used to fix and control the position of the workpiece under test.
[0009] Furthermore, the laser thermal control module includes two sets of pulsed laser sources, an annular guide rail bracket, a laser synchronization controller, and high-temperature resistant acrylic glass. The two sets of pulsed laser sources are fixed on the annular guide rail bracket. The pulsed laser sources generate lasers to irradiate the surface of the core particles, and the laser synchronization controller synchronizes and controls the two sets of pulsed laser sources. The annular guide rail bracket is installed inside the high-temperature resistant acrylic glass.
[0010] Furthermore, the reflection temperature measurement module includes a micro-temperature measurement unit, an LED variable wavelength light source, a high-speed pulse source, a PID controller, and a computer. The micro-temperature measurement unit is fixed at the center of the top of the high-temperature resistant acrylic glass. The micro-temperature measurement unit includes a CCD high-speed camera, a lens, and an objective lens. The housing is fixed at the center of the top of the high-temperature resistant acrylic glass. The CCD high-speed camera and the lens are coaxially assembled and installed inside the housing. The objective lens is installed at the bottom of the housing. The LED variable wavelength light source, the high-speed pulse source, the PID controller, and the computer are located outside the high-temperature resistant acrylic glass.
[0011] Furthermore, the microscopic temperature distribution on the surface of the tested core particle is acquired through a CCD high-speed camera, the light is deflected through a lens, and the objective lens further magnifies the image. The LED variable wavelength light source shines directly onto the lens, enabling diversified control of the test light source. The high-speed pulse source generates different excitation pulses according to the test conditions, which are then combined with the PID controller and computer settings.
[0012] Furthermore, the three-dimensional micro-control module includes a triaxial piezoelectric displacement stage, a displacement controller, a test microchannel, and a core particle test surface. The workpiece under test is fixed on the triaxial piezoelectric displacement stage. Through the displacement controller and computer control, automatic alignment and collaborative measurement can be achieved. The test microchannel is fixed above the triaxial piezoelectric displacement stage, and the core particle test surface is installed directly above it and reinforced at multiple points to prevent leakage of the liquid working fluid during the test.
[0013] Furthermore, the particle velocimetry module includes a high-speed particle camera, a synchronization controller, a sheet laser light source, and a data acquisition device. The high-speed particle camera is connected to the sheet laser light source through the synchronization controller, and the acquired images are transmitted to a computer for analysis and processing through the data acquisition device. The high-speed particle camera and the sheet laser light source are fixed inside a high-temperature resistant plexiglass. The sheet laser light source illuminates a specific plane within the microchannel. The high-speed particle camera records and traces particle motion at a frame rate of 10,000 frames per second, and obtains the flow field velocity distribution through a cross-correlation algorithm.
[0014] Furthermore, the stress testing module includes a thin-film strain gauge and a stress meter. The thin-film strain gauge, as a sensing element, is directly attached to the heat sink or thermal interface material between the microchannel and the core particle test surface. The stress meter collects strain signals and converts them into local thermal stress data for analyzing the thermo-mechanical coupling effect during the phase transition process.
[0015] Furthermore, the sound field testing module includes an acoustic oscillator, an amplitude transformer, a transducer, and an oscilloscope. The acoustic oscillator, amplitude transformer, and transducer are arranged sequentially from top to bottom. The acoustic oscillator is located below the triaxial piezoelectric displacement stage. The acoustic oscillator and amplitude transformer are used to generate a sound field, while the transducer converts electrical signals into acoustic signals. The oscilloscope is used to edit sound field electrical signals with different waveforms and frequencies.
[0016] Furthermore, the electric field testing module includes electrodes and a voltage divider. The electrodes are evenly distributed near the microchannel, and the voltage generated by the power supply is regulated by the voltage divider, thereby generating a controllable electric field near the test element.
[0017] A testing method for a multi-physics field coupled microchannel boiling heat transfer experimental test device specifically includes the following steps:
[0018] Step 1: Fix the core sample on the triaxial piezoelectric displacement stage of the three-dimensional microcontroller module, install the microchannel and ensure it is sealed, and use the pulsed laser source of the laser thermal control module to precisely heat the surface of the core sample under test, and use the reflection temperature measurement module to monitor the initial temperature field distribution in real time.
[0019] Step 2: Start the sound field test module to generate a sound field with specific frequency and waveform in the working medium through the transducer and amplitude converter; simultaneously start the electric field test module to apply a controllable electric field in the test area through the electrodes and voltage divider, thereby constructing a thermo-electric-acoustic multi-physics coupling environment.
[0020] Step 3: The particle velocimetry module uses a sheet light source and a CCD high-speed camera to simultaneously capture the flow field structure and bubble behavior within the microchannel. At the same time, the reflection temperature measurement module continues to collect transient temperature field data, and the stress testing module records the local stress changes at the thermal interface in real time, thus realizing the synchronous acquisition and fusion analysis of multi-physics field data of light, sound, heat, force, and flow.
[0021] Compared with existing technologies, the beneficial effects of the multi-physics field coupled core particle microchannel boiling heat transfer experimental testing device and testing method described in this invention are:
[0022] 1. The multi-physics field coupled microchannel boiling heat transfer experimental testing device described in this invention integrates modules such as laser thermal control, electric field testing, reflection temperature measurement, particle velocimetry, stress testing, and acoustic field testing. This enables active coupling and coordinated measurement of multiple physical fields (thermal, electrical, mechanical, fluid, acoustic, and optical) at the microparticle scale, overcoming the comprehensive limitations of traditional testing methods in terms of measurement dimensionality, inter-field interference, and spatiotemporal resolution. Each module uses a standardized interface, allowing for independent operation and flexible combination. A high-precision three-dimensional microcontroller system enables rapid alignment and coordinated measurement, significantly improving the device's adaptability and experimental efficiency.
[0023] 2. This invention can accurately simulate the multi-field coupling environment of 3D integrated chips under real-world operating conditions, and achieve transient and full-field observation of key physical processes such as boiling phase transition, flow heat transfer, interfacial stress, and electric field effects within microchannels. This device provides an advanced experimental platform for revealing the multi-physics coupling mechanism at the chip scale, and can provide accurate verification data for high-fidelity simulation models, thus strongly supporting the thermal management design and reliability research of next-generation high-power-density chips. Attached Figure Description
[0024] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:
[0025] Figure 1 This is a schematic diagram of a multi-physics field coupled core microchannel boiling heat transfer experimental test device according to the present invention.
[0026] In the diagram: 1-Pulsed laser source, 2-Ring guide rail bracket, 3-Laser synchronization controller, 4-High-temperature resistant plexiglass, 5-CCD high-speed camera, 6-Lens, 7-Objective lens, 8-LED variable wavelength light source, 9-High-speed pulse source, 10-PID controller, 11-Computer, 12-Particle high-speed camera, 13-Synchronization controller, 14-Sheet laser source, 15-Data acquisition instrument, 16-Triaxial piezoelectric displacement stage, 17-Displacement controller, 18-Microchannel for testing, 19-Core particle testing surface, 20-Thin film strain gauge, 21-Stress gauge, 22-Acoustic oscillator, 23-Amplitude converter, 24-Transducer, 25-Oscilloscope, 26-Programmable power supply, 27-Electrode, 28-Voltage divider. Detailed Implementation
[0027] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the drawings, and not all of them. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing specific embodiments only and is not intended to limit the invention.
[0028] See Figure 1This embodiment describes a multi-physics field coupled microchannel boiling heat transfer experimental testing device, comprising a laser thermal control module, a reflection temperature measurement module, a particle velocity measurement module, a three-dimensional microcontroller module, a stress testing module, an acoustic field testing module, and an electric field testing module. The laser thermal control module, acoustic field testing module, and electric field testing module respectively simulate laser, acoustic, and electric field environments, and together constitute an active multi-physics field coupled environment. The reflection temperature measurement module, particle velocity measurement module, and stress testing module constitute a multi-parameter, high spatiotemporal resolution data acquisition system at the core-scale. The three-dimensional microcontroller module is used to fix and control the position of the workpiece under test, providing precise positioning and collaborative support for each measurement unit.
[0029] The laser thermal control module includes two sets of pulsed laser sources 1, a ring guide rail bracket 2, a laser synchronization controller 3, and high-temperature resistant organic glass 4. The two sets of pulsed laser sources 1 are fixed on the ring guide rail bracket 2. The pulsed laser source 1 generates laser light to irradiate the surface of the core particle. Its light output direction is generally perpendicular to the core particle test surface 19, and the temperature rise rate is 8000℃ / s. It can accurately simulate the hot spot effect of the chip for different test workpieces, and the direction and power can be flexibly adjusted according to experimental requirements.
[0030] The two sets of pulsed laser sources 1 are synchronously controlled by the laser synchronization controller 3 to ensure strict synchronization of the timing of the two sets of pulsed lasers, and to achieve precise synchronization with the reflection temperature measurement, particle velocity measurement and other measurement systems, thereby realizing the time-series coupling of efficient heating and accurate measurement. The annular guide rail bracket 2 is installed and fixed inside the high-temperature resistant plexiglass 4, which effectively avoids the loss of heating power and increases the experimental accuracy.
[0031] The reflection temperature measurement module includes a micro-temperature measurement unit, an LED variable wavelength light source 8, a high-speed pulse source 9, a PID controller 10, and a computer 11. The micro-temperature measurement unit is fixed at the top center of the high-temperature resistant organic glass 4. The micro-temperature measurement unit includes a CCD high-speed camera 5, a lens 6, and an objective lens 7. The housing is fixed at the top center of the high-temperature resistant organic glass 4. The CCD high-speed camera 5 and the lens 6 are coaxially assembled and installed inside the housing. The objective lens 7 is installed at the bottom of the housing.
[0032] The microscopic temperature distribution on the surface of the core particle is acquired by a CCD high-speed camera 5, and the light is deflected by a lens 6. The objective lens 7 further magnifies the image. The LED variable wavelength light source 8, high-speed pulse source 9, PID controller 10, and computer 11 are located outside the high-temperature resistant organic glass 4. The LED variable wavelength light source 8 shines directly on the lens 6, enabling diversified control of the test light source. The high-speed pulse source 9 generates different excitation pulses according to the test conditions. With the PID controller 10 and computer 11, the devices can work in a certain time sequence, thereby obtaining the accurate temperature distribution on the surface of the tested core particle at different time points.
[0033] The reflection temperature measurement module uses a CCD high-speed camera 5 to receive thermal radiation signals from the surface being measured, and an LED variable wavelength light source 8 to provide excitation. A high-speed pulse source 9 controls the measurement timing. By measuring the changes in the thermal reflection signal, the transient temperature field distribution on the surface of the core particle is obtained, with a spatial resolution of up to the micrometer level.
[0034] The particle velocity measurement module includes a high-speed particle camera 12, a synchronization controller 13, a sheet laser source 14, and a data acquisition device 15. The high-speed particle camera 12 is connected to the sheet laser source 14 through the synchronization controller 13. The acquired images are transmitted to the computer 11 for analysis and processing through the data acquisition device 15. During the high-speed optical imaging process of particles, the FPS parameter is set to 10,000 frames / second, and the imaging pixel is 1 million pixels.
[0035] The particle velocimetry module uses a sheet laser light source 14 to illuminate a specific plane within the microchannel 18. The high-speed particle camera 12 records and tracks the particle motion at a frame rate of 10,000 frames per second. The flow field velocity distribution is obtained through a cross-correlation algorithm, and the flow and bubble dynamics behavior during the micro-nano scale phase transition process is accurately analyzed.
[0036] The three-dimensional microcontroller module includes a triaxial piezoelectric displacement stage 16, a displacement controller 17, a testing microchannel 18, and a core particle testing surface 19. The testing microchannel 18 is fixed above the triaxial piezoelectric displacement stage 16, and the core particle testing surface 19 is mounted directly above it and precisely reinforced at multiple points to prevent leakage of the liquid working fluid during testing. The core particle test piece is installed and fixed above the core particle testing surface 19 and moves in three dimensions via the triaxial piezoelectric displacement stage 16, thus coordinating with the multi-field testing process of the test piece. Through the coordination of the displacement controller 17 and the computer 11, automatic alignment and collaborative measurement effects can be achieved.
[0037] The three-dimensional microcontroller module uses a triaxial piezoelectric displacement stage 16 with a displacement resolution better than 1 micrometer. It carries and precisely positions the core particle test surface 19 and the microchannel 18 assembly. Through the displacement controller 17 and the computer 11, it realizes automatic alignment of the measurement optical path and rapid scanning measurement of specific areas.
[0038] The stress testing module includes a thin-film strain gauge 20 and a stress meter 21. The stress testing module uses the thin-film strain gauge 20 as a sensing element, which is directly attached to the heat sink or thermal interface material between the microchannel 18 and the core particle test surface 19. The stress meter 21 collects the strain signal and converts it into local thermal stress data for analyzing the thermo-mechanical coupling effect during the phase transition process.
[0039] The thin-film strain gauge 20 serves as a stress measurement element with a sensitivity coefficient of 3.0 and an operating temperature range of -196℃ to 600℃. Depending on the specific experimental requirements, it can be installed between the microchannel 18 and the core particle test surface 19. Data is acquired and displayed through the stress gauge 21, enabling precise measurement of local stress changes in the thermal interface material.
[0040] The sound field testing module includes an acoustic oscillator 22, an amplitude transformer 23, a transducer 24, an oscilloscope 25, and a programmable power supply 26. The acoustic oscillator 22, amplitude transformer 23, and transducer 24 are arranged sequentially from top to bottom. The acoustic oscillator 22 is located below the triaxial piezoelectric displacement stage 16. The acoustic oscillator 22 and amplitude transformer 23 are used to generate a sound field, while the transducer 24 converts electrical signals into acoustic signals. Different waveforms and frequencies of the sound field electrical signals can be edited using the oscilloscope 25. The oscilloscope and other related instruments obtain power from the programmable power supply 26. The sound field module can be flexibly activated according to specific experimental requirements.
[0041] The sound field test module is driven by a programmable power supply 26 to generate an electrical signal of a specific frequency through a transducer 24. After being amplified and focused by an amplitude converter 23, the signal is transmitted to the working fluid to form a controllable sound field. The sound pressure and frequency can be adjusted by programming through a computer 11 to study the acoustic flow effect and the influence of the sound field on bubble behavior and heat transfer.
[0042] The electric field testing module includes electrodes 27 and a voltage divider 28. The electrodes 27 are evenly distributed near the microchannel 18. The voltage divider 28 appropriately regulates the voltage generated by the power supply, thereby generating a controllable electric field near the test element. The electric field module can be flexibly activated according to specific experimental requirements.
[0043] The electric field testing module applies the input voltage to the side electrode 27 after the high-precision voltage divider 28 is precisely divided, forming a uniform and controllable DC or AC electric field in the microchannel 18 region. The electric field strength can be flexibly adjusted according to experimental requirements, and is used to study the mechanism of electric field on boiling nucleation and bubble dynamics.
[0044] This invention integrates and controls the entire system and fuses data through a computer 11. A pulsed laser source 1 is triggered by a laser synchronization controller 3 to generate a high-energy pulsed laser to locally heat the surface of the core particle being measured, which is fixed on a triaxial piezoelectric displacement stage 16. A CCD high-speed camera 5, an LED variable wavelength light source 8, and a high-speed pulse source 9 work together to achieve non-contact transient temperature field measurement. A particle high-speed camera 12 and a sheet laser source 14 are controlled by a synchronization controller 13 to capture phase change flow information within a microchannel 18. A thin-film strain gauge 20 is attached to the heat sink interface, and its signal is collected by a stress gauge 21. The sound field is generated by a programmable power supply 26 driving an acoustic oscillator 22 and an amplitude transformer 23. The electric field is established by a voltage divider 28 adjusting the voltage applied to the electrode 27.
[0045] The pulsed laser source 1, the ring guide rail bracket 2, the CCD high-speed camera 5, the lens 6, and the objective lens 7 are installed inside the upper part of the high-temperature resistant acrylic glass 4. The particle high-speed camera 12, the sheet laser source 14, the triaxial piezoelectric displacement stage 16, the test microchannel 18, the core particle test surface 19, the thin film strain gauge 20, the acoustic oscillator 22, the amplitude transformer 23, the transducer 24, and the electrode 27 are installed inside the lower part of the high-temperature resistant acrylic glass 4. The laser synchronization controller 3, the LED variable wavelength source 8, the high-speed pulse source 9, the PID controller 10, the computer 11, the synchronization controller 13, the data acquisition instrument 15, the displacement controller 17, the stress meter 21, the oscilloscope 25, the programmable power supply 26, and the voltage divider 28 are installed outside the high-temperature resistant acrylic glass 4.
[0046] A testing method for a core-particle microchannel boiling heat transfer experimental testing device utilizing multi-physics field coupling specifically includes the following steps:
[0047] Step 1: Fix the core sample on the triaxial piezoelectric displacement stage 16 of the three-dimensional microcontroller module, install the microchannel 18 and ensure it is sealed, and use the pulsed laser source 1 of the laser thermal control module to precisely heat the surface of the core sample under test, and use the reflection temperature measurement module to monitor the initial temperature field distribution in real time.
[0048] Step 2: Start the sound field test module to generate a sound field with a specific frequency and waveform in the working medium through transducer 24 and amplitude transformer 23; simultaneously start the electric field test module to apply a controllable electric field in the test area through electrode 27 and voltage divider 28, thereby constructing a thermo-electric-acoustic multi-physics coupling environment.
[0049] Step 3: The sheet laser source 14 of the particle velocimetry module and the CCD high-speed camera 5 synchronously capture the flow field structure and bubble behavior in the microchannel. At the same time, the reflection temperature measurement module continues to collect transient temperature field data, and the stress test module records the local stress changes at the thermal interface in real time, so as to realize the synchronous acquisition and fusion analysis of multi-physics field data of light, sound, heat, force and flow.
[0050] This invention discloses a multi-physics coupled microchannel boiling heat transfer experimental testing device for studying the boiling heat transfer characteristics of multi-physics coupled microchannels at the micro-scale in 3D integrated chips. It mainly consists of a laser thermal control module, a reflection temperature measurement module, a particle velocimetry module, a three-dimensional microcontroller module, a stress testing module, an acoustic field testing module, and an electric field testing module. Before the experiment, each module is assembled and debugged to ensure the system is in optimal working condition. The test microparticle is fixed on a triaxial piezoelectric displacement stage 16, and a test microchannel 18 is installed and sealed. Deionized water is injected as the working fluid. The surface of the microparticle is locally heated using a pulsed laser source 1, with an initial power of 20 mW, gradually increased in 10 mW increments until a sudden temperature rise is detected, indicating proximity to the critical heat flux state. During the experiment, the reflection temperature measurement module, particle velocimetry module, and stress testing module simultaneously acquire temperature, flow field, and stress data, achieving real-time acquisition of multi-physics information (particle velocimetry 10000 fps).
[0051] To investigate the synergistic effects of multiphysics fields on boiling heat transfer, acoustic and electric field testing modules were activated separately. The acoustic field was generated by an acoustic oscillator driven by a programmable power supply, with a frequency set to 40 kHz and a sound pressure level of 0.5 W / cm². 2 The electric field is adjusted by a voltage divider to form a DC electric field with a strength of 200 V / cm. During the experiment, the laser heating power is precisely controlled by a computer, and the surface temperature fluctuation of the core particle is controlled within ±0.5 K.
[0052] Based on the data collected by the reflection temperature measurement module, the transient temperature field on the core particle surface is calculated using the following formula:
[0053] (1)
[0054] (2)
[0055] In the formula, C TR I is the thermal reflectance coefficient, ΔR / R is the relative change in the sample reflectance, and I is the thermal reflectance coefficient. L and I H T represents the reflected light intensity at low and high temperatures, respectively. L and T H The corresponding temperature is given. By analyzing the heat flux density and temperature field distribution, the enhancement effects of the acoustic and electric fields on the bubble detachment frequency and heat transfer coefficient can be quantified, providing experimental basis for the thermal management design of 3D integrated chips. After the experiment, the power supply to each module was turned off, and the microchannel system was cleaned and maintained to ensure long-term stable operation of the equipment.
[0056] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating orientation and positional relationships are based on the orientation and positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0057] The embodiments of the present invention disclosed above are merely illustrative of the invention. These embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention.
Claims
1. A multi-physical field coupled core particle micro-channel boiling heat transfer experimental test device, characterized in that: It includes a laser thermal control module, a reflection temperature measurement module, a particle velocity measurement module, a three-dimensional micro-control module, a stress testing module, an acoustic field testing module, and an electric field testing module. The laser thermal control module, acoustic field testing module, and electric field testing module respectively simulate laser, acoustic field, and electric field environments. The reflection temperature measurement module, particle velocity measurement module, and stress testing module constitute a core-scale multi-parameter, high spatiotemporal resolution data acquisition system. The three-dimensional micro-control module is used to fix and control the position of the workpiece under test. The three-dimensional micro-control module includes a triaxial piezoelectric displacement stage (16), a displacement controller (17), a test microchannel (18), and a core particle test surface (19). The test microchannel (18) is fixed above the triaxial piezoelectric displacement stage (16), and the core particle test surface (19) is installed directly above it. The workpiece to be tested is fixed on the core particle test surface (19). Through the displacement controller (17) and the computer (11) in coordination, automatic alignment and collaborative measurement can be achieved.
2. The multi-physics coupled kernel-pellet microchannel boiling heat transfer experimental test device according to claim 1, characterized in that: The laser thermal control module includes two sets of pulsed laser sources (1), an annular guide rail bracket (2), a laser synchronization controller (3), and high-temperature resistant organic glass (4). The two sets of pulsed laser sources (1) are fixed on the annular guide rail bracket (2). The pulsed laser sources (1) generate lasers to irradiate the surface of the core particles, and the two sets of pulsed laser sources (1) are synchronously controlled by the laser synchronization controller (3). The annular guide rail bracket (2) is installed inside the high-temperature resistant organic glass (4).
3. The multi-physics coupled kernel-pellet microchannel boiling heat transfer experimental test device according to claim 2, characterized in that: The reflection temperature measurement module includes a micro temperature measurement unit, an LED variable wavelength light source (8), a high-speed pulse source (9), a PID controller (10), and a computer (11). The micro temperature measurement unit is fixed at the top center of the high-temperature resistant plexiglass (4). The micro temperature measurement unit includes a CCD high-speed camera (5), a lens (6), and an objective lens (7). The housing is fixed at the top center of the high-temperature resistant plexiglass (4). The CCD high-speed camera (5) and the lens (6) are coaxially assembled and installed inside the housing. The objective lens (7) is installed at the bottom of the housing. The LED variable wavelength light source (8), the high-speed pulse source (9), the PID controller (10), and the computer (11) are located outside the high-temperature resistant plexiglass (4).
4. The multi-physics coupled kernel-pellet microchannel boiling heat transfer experimental test device according to claim 3, characterized in that: The microscopic temperature distribution on the surface of the core particle under test is obtained by a CCD high-speed camera (5), the light is deflected by a lens (6), and the objective lens (7) further magnifies the effect. The LED variable wavelength light source (8) shines directly on the lens (6) to realize diversified control of the test light source. The high-speed pulse source (9) generates different excitation pulses according to the test conditions and is set in conjunction with the PID controller (10) and the computer (11).
5. The multi-physics coupled kernel-pellet microchannel boiling heat transfer experimental test device according to claim 4, characterized in that: The particle velocity measurement module includes a high-speed particle camera (12), a synchronization controller (13), a sheet laser source (14), and a data acquisition instrument (15). The high-speed particle camera (12) is connected to the sheet laser source (14) through the synchronization controller (13). The obtained images are transmitted to the computer (11) for analysis and processing through the data acquisition instrument (15). The high-speed particle camera (12) and the sheet laser source (14) are fixed inside the high-temperature resistant organic glass (4). The sheet laser source (14) illuminates a specific plane in the test microchannel (18). The high-speed particle camera (12) records the movement of the tracer particles at a frame rate of 10,000 frames / second and obtains the flow field velocity distribution through a cross-correlation algorithm.
6. The multi-physics coupled kernel-pellet microchannel boiling heat transfer experimental test device according to claim 5, characterized in that: The stress testing module includes a thin-film strain gauge (20) and a stress meter (21). The thin-film strain gauge (20) is used as a sensing element and is directly attached to the heat sink or thermal interface material between the test microchannel (18) and the core particle test surface (19). The stress meter (21) collects strain signals and converts them into local thermal stress data for analyzing the thermo-mechanical coupling effect during the phase transition process.
7. The experimental testing device for multiphysics field coupling in a microchannel boiling heat transfer system according to claim 6, characterized in that: The sound field testing module includes an acoustic oscillator (22), an amplitude transformer (23), a transducer (24), and an oscilloscope (25). The acoustic oscillator (22), amplitude transformer (23), and transducer (24) are arranged sequentially from top to bottom. The acoustic oscillator (22) is located below the triaxial piezoelectric displacement stage (16). The acoustic oscillator (22) and amplitude transformer (23) are used to generate a sound field, while the transducer (24) converts electrical signals into sound signals. The oscilloscope (25) is used to edit sound field electrical signals with different waveforms and frequencies.
8. The experimental testing device for multi-physics field coupling in a microchannel boiling heat transfer system according to claim 7, characterized in that: The electric field testing module includes electrodes (27) and voltage dividers (28). The electrodes (27) are evenly distributed near the test microchannel (18). The voltage generated by the power supply is regulated by the voltage divider (28), thereby generating a controllable electric field near the test element.
9. A testing method for a core-particle microchannel boiling heat transfer experimental testing device using multi-physics field coupling as described in claim 8, characterized in that: Specifically, the following steps are included: Step 1: Fix the core sample on the triaxial piezoelectric displacement stage (16) of the three-dimensional microcontroller module, install the test microchannel (18) and ensure it is sealed, and use the pulsed laser source (1) of the laser thermal control module to precisely heat the surface of the core sample under test, and use the reflection temperature measurement module to monitor the initial temperature field distribution in real time. Step 2: Start the sound field test module to generate a sound field with a specific frequency and waveform in the working medium through the transducer (24) and the amplitude transformer (23); The electric field test module is started synchronously, and a controllable electric field is applied to the test area through the electrode (27) and the voltage divider (28), thereby constructing a thermo-electric-acoustic multi-physics coupling environment; Step 3: The flow field structure and bubble behavior in the microchannel are captured synchronously by the sheet laser light source (14) of the particle velocimetry module and the CCD high-speed camera (5). At the same time, the reflection temperature measurement module continues to collect transient temperature field data, and the stress test module records the local stress change at the thermal interface in real time, so as to realize the synchronous acquisition and fusion analysis of optical-acoustic-thermal-mechanical-fluid multi-physics field data.