Semiconductor integrated light source and lighting device

Abstract

This application relates to a semiconductor integrated light source and an illumination device. The semiconductor integrated light source includes a support, a light-emitting chip, and an optical component. The support has a groove, and the light-emitting chip is disposed within the groove. The optical component is sealed to the front of the support. The optical component includes a light-transmitting element and a light-blocking element. The light-transmitting element has an incident light end and an exit light end. The light-blocking element is an opaque hollow structure, with one end embedded in the light-transmitting element and the other end corresponding to the exit light end, defining the light-emitting surface of the exit light end. This optical component blocks part of the light emitted by the light-emitting chip, especially large-angle lateral light emission, improving the cutoff of the light spot projected by the semiconductor integrated light source. The light spot edge is clear, the transition between light and dark areas is weakened or essentially eliminated, and the light spot quality is high.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to a semiconductor integrated light source and lighting device. Background Technology

[0002] Traditional LED light sources typically consist of an LED chip and a transparent adhesive layer that encapsulates the LED chip. Because the light emission of an LED chip follows a Lambertian distribution, its luminous intensity decreases as the emission angle increases. This results in poor cutoff of the light spot projected by traditional LED light sources, unclear edge of the light spot, and a transition between light and dark areas, thus the quality of the light spot needs to be improved. Summary of the Invention

[0003] Therefore, it is necessary to provide a semiconductor integrated light source and lighting device to address the problem of poor cutoff of the light spot projected by traditional LED light sources.

[0004] A semiconductor integrated light source, comprising:

[0005] The bracket has a groove;

[0006] A light-emitting chip, wherein the light-emitting chip is disposed within the groove; and

[0007] An optical component, wherein the optical component is sealed to the front of the bracket;

[0008] The optical component includes: a light-transmitting element having a light-incident end and a light-exiting end; and a light-blocking element having an opaque hollow structure, one end of which is embedded in the light-transmitting element, and the other end of which is disposed corresponding to the light-exiting end and defines the light-exiting surface of the light-exiting end.

[0009] The light-incident end face is sealed to the front of the bracket with adhesive, forming a sealed cavity with the bracket, and the light-emitting chip is located inside the cavity.

[0010] In one embodiment, the light cutoff element is configured to absorb light.

[0011] In one embodiment, the light-transmitting element further has an inclined side surface connected to the end face of the light-incident end; one end of the light-blocking element is disposed corresponding to the inclined side surface and is used to absorb at least a portion of the light totally reflected by the inclined side surface.

[0012] In one embodiment, the area of ​​the light-emitting surface is greater than or equal to the area of ​​the end face of the light-incident end.

[0013] In one embodiment, the outer side of the light cutoff element is connected to the inclined side.

[0014] In one embodiment, the inner surface of the light cutoff member is gradually widened in the direction from the light input end to the light output end.

[0015] In one embodiment, on the plane where the end face of the light-incident end is located, the orthographic projection of one end of the light-blocking member covers the orthographic projection of the inclined side.

[0016] In one embodiment, one end of the light cutoff element is disposed near the light-incident end, or is disposed corresponding to the light-incident end.

[0017] In one embodiment, the orthographic projection of the light-emitting surface of the light-transmitting element covers the front of the bracket on the plane containing the front of the bracket.

[0018] A lighting device, comprising:

[0019] Circuit board; and

[0020] Multiple semiconductor integrated light sources are disposed on the circuit board, and the semiconductor integrated light sources are semiconductor integrated light sources as described in any of the above embodiments.

[0021] In one embodiment, the lighting device further includes:

[0022] A sealing layer, which is opaque, is disposed on the circuit board and covers part of the sides of all the semiconductor integrated light sources. The front of the sealing layer is aligned with or higher than one end of the light cutoff component of the semiconductor integrated light source.

[0023] The aforementioned semiconductor integrated light source and lighting device integrates an opaque light cutoff element within a light-transmitting element. The hollow light cutoff element defines the light-emitting surface of the light-emitting end. The light emitted by the light-emitting chip enters the light-transmitting element through the light-incident end. Lateral light rays propagating to the light cutoff element are blocked and cannot escape from the outer side of the light cutoff element. This allows the light rays entering the hollow space of the light cutoff element to only exit through the light-emitting surface, thus cutting off part of the light emitted by the light-emitting chip, especially lateral large-angle light emission. This improves the cutoff of the light spot projected by the semiconductor integrated light source, resulting in clear light spot edges, weakening or essentially eliminating the light-dark transition phenomenon of the light spot, and achieving high light spot quality.

[0024] When applied to lighting, displays, or other applications, light virtually does not escape from the side of the light cutoff element, significantly improving or essentially eliminating lateral light leakage between adjacent semiconductor integrated light sources. Due to the integrated optical components, the structure of the semiconductor integrated light source is simplified. During assembly, the optical components are mounted as a single unit on the support, eliminating the need for separate light cutoff elements and light-transmitting elements. This reduces processes, improves production efficiency, and significantly lowers the cost of the semiconductor integrated light source. Attached Figure Description

[0025] Figure 1 This is a cross-sectional view of the semiconductor integrated light source in the first embodiment of this application.

[0026] Figure 2 for Figure 1 A top view of a semiconductor integrated light source.

[0027] Figure 3 for Figure 1 A partial cross-sectional view of the molding die for the optical components of a semiconductor integrated light source.

[0028] Figure 4 This is a cross-sectional view of the semiconductor integrated light source in the second embodiment of this application.

[0029] Figure 5 This is a cross-sectional view of the semiconductor integrated light source in the third embodiment of this application.

[0030] Figure 6 This is a cross-sectional view of the semiconductor integrated light source in the fourth embodiment of this application.

[0031] Figure 7 for Figure 6 A partial cross-sectional view of the molding die for the optical components of a semiconductor integrated light source.

[0032] Figure 8 This is a cross-sectional view of the semiconductor integrated light source in the fifth embodiment of this application.

[0033] Figure 9 This is a partial cross-sectional view of a lighting device in one embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100 - Semiconductor integrated light source; 110 - Support; 112 - Groove; 114 - Front side; 120 - Light-emitting chip; 130 - Optical component; 132 - Cavity; 140 - Light-transmitting element; 141 - Light-incident end; 142 - Light-emitting end; 143 - Light-incident surface; 144 - Light-emitting surface; 145 - Inclined side; 150 - Light cut-off component; 152 - Inner side; 154 - Outer side; 200 - Molding mold; 210 - First mold; 212 - Lower mold groove; 220 - Second mold; 222 - Upper mold groove; 224 - Diversion channel; 230 - Glue groove; 300 - Transfer fixture; 400 - Lighting device; 410 - Circuit board; 420 - Sealing adhesive layer. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0042] Please see Figures 1 to 3 , Figure 1 A cross-sectional view of the semiconductor integrated light source in the first embodiment of this application is shown. Figure 2 It shows Figure 1 A top view of a semiconductor integrated light source. Figure 3 It shows Figure 1A partial cross-sectional view of the molding die for the optical component of a semiconductor integrated light source. The first embodiment of this application provides a semiconductor integrated light source 100, including a support 110, a light-emitting chip 120, and an optical component 130. The support 110 has a groove 112, and the light-emitting chip 120 is disposed within the groove 112. One end of the optical component 130 is sealed to the front surface 114 of the support 110, forming a sealed cavity 132 with the support 110. The light-emitting chip 120 is located in the cavity 132 and is isolated from the external environment, thus improving its reliability and lifespan. The light emitted from the light-emitting chip 120 enters from one end of the optical component 130, passes through the optical component 130, and exits from the other end of the optical component 130.

[0043] To prevent light emission from the light-emitting chip 120 from escaping from the side of the bracket 110, the plastic portion (not labeled) of the bracket 110 can be made of a light-absorbing material to absorb light incident upon it. This light-absorbing material can be, but is not limited to, black or dark-colored plastic. Obviously, in other embodiments, the plastic portion of the bracket 110 can be white, allowing its surface to reflect light and essentially block light incident upon it; its material can be, but is not limited to, polyphthalamide (PPA).

[0044] The light-emitting chip 120 can be, but is not limited to, an LED chip, and is a vertical chip. An LED chip is disposed within a recess 112, its back electrode is die-bonded to a pad on a support 110, and its front electrode is electrically connected to another pad on the support 110 via a bonding wire (not labeled). In alternative embodiments, the number of light-emitting chips 120 is at least two. For example, two LED chips are disposed within the recess 112, and the two LED chips emit the same or different colors; or, three LED chips are disposed within the recess 112, and the three LED chips emit the same or different colors. When the three LED chips emit different colors, any one of the three LED chips can be controlled to emit light to achieve monochromatic light emission. Moreover, the type of light-emitting chip 120 is not limited to a vertical chip; it can also be a horizontal chip or a flip chip.

[0045] The optical assembly 130 includes a light-transmitting element 140 and a light-blocking element 150. The light-transmitting element 140 has a light-incident end 141 and a light-exiting end 142. The light-incident end 141 is disposed on the front side 114 of the support 110, and the front side 114 of the support 110 defines the light-incident surface 143 of the light-incident end 141. The light-blocking element 150 is an opaque hollow structure. One end of the light-blocking element 150 is embedded in the light-transmitting element 140, and the other end of the light-blocking element 150 is disposed corresponding to the light-exiting end 142 and defines the light-exiting surface 144 of the light-exiting end 142.

[0046] By embedding an opaque light cutoff element 150 in the light-transmitting element 140, and integrating the light cutoff element 150 within the light-transmitting element 140, the hollow light cutoff element 150 defines the light-emitting surface 144 of the light-emitting end 142. The light emitted by the light-emitting chip 120 enters the light-transmitting element 140 through the light-incident end 141. The lateral light rays propagating to the light cutoff element 150 are blocked and cannot be emitted from the outer surface 154 of the light cutoff element 150. This allows the light rays entering the hollow space of the light cutoff element 150 to only be emitted through the light-emitting surface 144, thus cutting off part of the light emitted by the light-emitting chip 120, especially the lateral large-angle light emission. This improves the cutoff of the light spot projected by the semiconductor integrated light source 100, resulting in clear light spot edges, weakening or essentially eliminating the light-dark transition phenomenon of the light spot, and achieving high light spot quality. When applied to lighting, displays, or other applications, light is virtually prevented from escaping from the side of the light cutoff element 150, significantly improving or essentially eliminating lateral light leakage between adjacent semiconductor integrated light sources 100. Due to the integrated arrangement of the optical component 130, the structure of the semiconductor integrated light source 100 is simplified. During assembly, the optical component 130 is mounted as a single unit on the bracket 110, eliminating the need for separate light cutoff elements 150 and light-transmitting elements 140. This reduces processing steps, improves production efficiency, and significantly lowers the cost of the semiconductor integrated light source 100.

[0047] It should be noted that in some application scenarios, to prevent light leakage between adjacent light sources, the traditional method usually involves setting up a grid-like light-blocking structure and inserting a light guide in each grid of the light-blocking structure, through which the light emitted by the light source is guided. Obviously, the semiconductor integrated light source 100 of this application integrates optical components 130. When applied to the above-mentioned scenarios, the semiconductor integrated light source 100 can replace the light source, light-blocking structure, and light guide in the traditional method, thus greatly simplifying the structure. It eliminates the need to install the light source, light-blocking structure, and light guide separately, significantly reducing assembly steps, significantly improving assembly efficiency, and greatly reducing costs.

[0048] The light cutoff element 150 is designed to absorb light, thus virtually eliminating light reflection. Light entering the hollow space of the light cutoff element 150 can only exit from the light-emitting surface 144. There is virtually no reflected or stray light emanating from the light-emitting surface 144. The light spot is formed by the direct projection of light that has passed sequentially through the light-incident surface 143 and the light-emitting surface 144. The edge of the light spot is clearer, with no transition between light and dark areas, significantly improving the cutoff performance of the light spot. There are virtually no stray light spots, resulting in a pure light spot and a substantial improvement in light spot quality. In an alternative embodiment, the light cutoff element 150 can be made of a reflective material, such as PPA.

[0049] Furthermore, the light cutoff element 150 is black and has a light absorption rate of over 99%. In an alternative embodiment, the light cutoff element 150 may be dark-colored.

[0050] The inner surface 152 of the light cutoff element 150 is cylindrical, but is not limited to this shape. In other embodiments, the inner surface 152 of the light cutoff element 150 may be open, closed, hourglass-shaped, or other shapes.

[0051] Combination Figure 2 Specifically, the light cutoff element 150 is a square ring structure, which defines the shape of the projected light spot. In alternative embodiments, the light cutoff element 150 may also be a circular ring structure, an elliptical ring structure, a prismatic ring structure, other parallelogram ring structures, or other polygonal ring structures.

[0052] In terms of materials, the light cutoff element 150 is made of silicone filled with light-absorbing particles. Silicone has good light transmittance; when light shines on the light cutoff element 150, the light can penetrate the silicone and be absorbed by the light-absorbing particles. Its light absorption effect is excellent, and it essentially does not reflect light. Light shining onto the wall of the light-emitting aperture is virtually unreflected, thus blocking disordered reflected light. Consequently, the light spot is formed by the beam directly passing through the light-emitting surface 144, resulting in a clearer edge, a prominent cutoff line, and no transition zone. In other embodiments, the light cutoff element 150 can also be made of epoxy resin or silicone resin filled with light-absorbing particles.

[0053] Furthermore, the light-absorbing particles can be, but are not limited to, carbon black, which has good light absorption properties. In other embodiments, the light-absorbing particles can also be metal microparticles, black dye particles, or black silicon carbide particles, wherein the metal microparticles can be, but are not limited to, aluminum powder or copper powder.

[0054] The light-incident end 141 of the light-transmitting element 140 is sealed and bonded to the front surface 114 of the bracket 110 with adhesive (not shown), forming a sealed cavity 132. The groove 112 of the bracket 110 constitutes the entire cavity 132. The other end of the light-cutoff element 150 is disposed around the light-emitting end 142, defining the light-emitting surface 144. Obviously, the other end face of the light-cutoff element 150 is aligned with or higher than the end face of the light-emitting end 142.

[0055] Furthermore, the end face of the light-incident end 141 completely covers the front surface 114 of the bracket 110, and the edge of the end face of the light-incident end 141 coincides with the outer edge of the front surface 114 of the bracket 110. In other embodiments, the end face of the light-incident end 141 may only cover a portion of the front surface 114 of the bracket 110, such that the edge of the end face of the light-incident end 141 is located within the outer edge of the front surface 114 of the bracket 110.

[0056] The light-transmitting element 140 also has an inclined side surface 145, which is connected to the end face of the light-incident end 141. One end of the light cutoff element 150 is disposed corresponding to the inclined side surface 145, and is used to absorb at least a portion of the light that is totally internally reflected by the inclined side surface 145, preventing this portion of the light from being reflected back to the inclined side surface 145 by the light cutoff element 150 and exiting from the inclined side surface 145 to cause side light emission. Obviously, the greater the lateral thickness of the light cutoff element 150, the larger its end face is, and the more total internally reflected light it can absorb from the inclined side surface 145; however, the area of ​​the light-emitting surface 144 defined by its other end is smaller.

[0057] On the plane P where the front surface 114 of the bracket 110 is located, the orthographic projection of the light-emitting surface 144 of the light-transmitting element 140 covers the front surface 114 of the bracket 110. Compared with traditional light sources, the area of ​​the light-emitting surface 144 of the semiconductor integrated light source 100 of this application is larger, which is beneficial to increase the area of ​​the light spot projected at the same spacing. When applied to display scenarios, the display surface controlled by a single semiconductor integrated light source 100 is larger. Under the condition that the total display area is constant, the number of semiconductor integrated light sources 100 is less, and the cost is lower.

[0058] Furthermore, the orthographic projection of the light-emitting surface 144 onto the plane P containing the front surface 114 of the bracket 110 extends beyond the front surface 114 of the bracket 110, thus increasing the area of ​​the light-emitting surface 144. Since the end face of the light-incident end 141 completely coincides with the front surface 114 of the bracket 110, the area of ​​the light-emitting surface 144 is larger than the area of ​​the end face of the light-incident end 141. In an alternative embodiment, the orthographic projection just covers the front surface 114 of the bracket 110, that is, the edge of the orthographic projection coincides with the outer edge of the front surface 114 of the bracket 110. In this case, the area of ​​the light-emitting surface 144 is equal to the area of ​​the end face of the light-incident end 141.

[0059] The outer surface 154 of the light cut-off element 150 is connected to the inclined surface 145, so that one end of the light cut-off element 150 is directly connected to the inclined surface 145, thereby better absorbing the total internal reflection light generated by the inclined surface 145.

[0060] Furthermore, the outer surface 154 of the light cut-off element 150 constitutes part of the side surface of the semiconductor integrated light source 100. At this time, the outer surface 154 of the light cut-off element 150 is connected to the maximum end of the inclined side surface 145, so that the light cut-off element 150 is located on the outermost side, which is beneficial to increase the area of ​​the light emitting surface 144.

[0061] The material of the light-transmitting element 140 can be, but is not limited to, silicone. Since the material of the light-blocking element 150 also includes silicone, the interfacial tension can be reduced during insert injection molding, making the bond between the two more stable. In alternative embodiments, the light-transmitting element 140 can also be made of other similar materials, such as epoxy resin.

[0062] Combination Figure 3 The optical component 130 can be formed by insert injection molding process. Its molding mold 200 includes a first mold 210 and a second mold 220. The first mold 210 is provided with a plurality of lower mold grooves 212, and the second mold 220 is provided with a plurality of upper mold grooves 222. The plurality of upper mold grooves 222 are set in a one-to-one correspondence with the plurality of lower mold grooves 212. During molding, multiple light-blocking elements 150 are first inserted one by one into multiple lower mold slots 212 using a jig, so that the outer surface 154 of each light-blocking element 150 fits tightly with the groove wall of the corresponding lower mold slot 212. Then, a second mold 220 is placed on top of the first mold 210, so that each upper mold slot 222 communicates with the corresponding lower mold slot 212, forming multiple mold cavities (unlabeled). The second mold 220 has multiple runners 224, each runner 224 communicating with a mold cavity. Finally, the injection molding machine injects glue into the main runner (not shown), the glue enters the runners 224 through the main runner, and then enters the mold cavity, filling the mold cavity until the glue cools and solidifies, thus molding the light-transmitting element 140, and then mass-producing the optical components 130. When the material of the light-transmitting element 140 is the same as the substrate of the light-blocking element 150 (such as silicone) and there is no interface between the two, the two are an integral structure.

[0063] It should be noted that in other embodiments, the outer surface 154 of each light cut-off element 150 may be spaced apart from the groove wall of the corresponding lower mold groove 212, so that the formed light-transmitting element 140 covers the outer surface 154 of the light cut-off element 150; or, the bottom of the lower mold groove 212 may be provided with a slot, and one end of the light cut-off element 150 may be inserted into the slot, so that the light-emitting surface 144 of the formed light-transmitting element 140 does not exceed the end face on the same side of the light cut-off element 150.

[0064] It is understandable that the optical components 130 can also be formed through other processes. First, multiple interconnected light-transmitting elements 140 are batch-formed, forming grooves between the multiple light-transmitting elements 140. Then, black glue is used to fill the grooves until the black glue cures. Then, the black glue is cut to form a light cutoff element 150, and the connection between adjacent light-transmitting elements 140 is severed, thereby obtaining multiple optical components 130. Obviously, the above process can be carried out on the basis of a sheet of brackets 110. After cutting and separating the optical components 130, the individual brackets 110 can be separated to obtain the semiconductor integrated light source 100. The sheet of brackets 110 can be a blanking type bracket, which facilitates the separation of individual brackets 110.

[0065] Please see Figure 4 , Figure 4A cross-sectional view of the semiconductor integrated light source in the second embodiment of this application is shown. Compared with the light cut-off member 150 of the semiconductor integrated light source 100 in the above embodiment, the inner side 152 of the light cut-off member 150 of the semiconductor integrated light source 100 in this embodiment is open, and it is gradually widened in the direction away from the light-emitting chip 120, which increases the area of ​​the light-emitting surface 144. At the same time, the light cut-off member 150 and the light-transmitting element 140 are interlocked and cannot be separated, making the connection more stable.

[0066] On the plane P where the front side 114 of the bracket 110 is located, the orthographic projection of one end (embedded end) of the light cut-off member 150 covers the orthographic projection of the inclined side 145, so that the light reflected by the inclined side 145 is basically absorbed by one end of the light cut-off member 150, and the light will basically not be emitted from the inclined side 145. At the same time, it does not affect the size of the light-emitting surface 144, and can even increase the area of ​​the light-emitting surface 144.

[0067] Furthermore, on the plane P where the front surface 114 of the bracket 110 is located, the orthographic projection of one end (embedded end) of the light cutoff member 150 coincides with the orthographic projection of the inclined side surface 145. In an alternative embodiment, a portion of the orthographic projection of one end (embedded end) of the light cutoff member 150 falls on the front surface 114 of the bracket 110, resulting in better absorption of total internal reflection light.

[0068] As for the other aspects of the semiconductor integrated light source 100 in this embodiment, they are basically the same as the other aspects of the semiconductor integrated light source 100 in the above embodiments. The specific content can be referred to the description of the above embodiments, and will not be repeated here.

[0069] Please see Figure 5 , Figure 5 A cross-sectional view of the semiconductor integrated light source in the third embodiment of this application is shown. Compared with the light cutoff member 150 of the semiconductor integrated light source 100 in the first embodiment, the other end face of the light cutoff member 150 of the semiconductor integrated light source 100 in this embodiment is set higher than the light emitting surface 144, which can cut off part of the lateral light emitted from the light emitting surface 144, reduce the light emission angle of the light emitting surface 144, and make the edge of the light spot projected by the light emitting surface 144 more cut off, and the brightness of the light spot higher.

[0070] Furthermore, the light-emitting surface 144 is convex, which can converge light and improve the brightness of the light spot. Moreover, the light-incident surface 143 of the light-incident end 141 is defined by the front surface 114 of the support 110, and the light-incident surface 143 can be a free-form surface, the shape of which depends on the actual requirements. In an alternative embodiment, the light-emitting surface 144 can be concave.

[0071] As for the other aspects of the semiconductor integrated light source 100 in this embodiment, they are basically the same as the other aspects of the semiconductor integrated light source 100 in the first embodiment above. The specific content can be referred to the description of the first embodiment above, and will not be repeated here.

[0072] Please see Figure 6 and Figure 7 , Figure 6 A cross-sectional view of the semiconductor integrated light source according to the fourth embodiment of this application is shown. Figure 7 It shows Figure 6 A partial cross-sectional view of the molding die for the optical components of the semiconductor integrated light source. Compared with the light cut-off member 150 of the semiconductor integrated light source 100 in the first embodiment, in this embodiment, one end of the light cut-off member 150 of the semiconductor integrated light source 100 is located close to the light-incident end 141, thereby blocking lateral light from shining onto the inclined side 145 and eliminating the phenomenon that light will be emitted from the inclined side 145.

[0073] The light-incident end 141 of the light-transmitting element 140 extends out of the side of the bracket 110, making the end face of the light-incident end 141 larger. Since the end face of the light-emitting end 142 is larger than the end face of the light-incident end 141, the end face of the light-emitting end 142 is also larger, further increasing the area of ​​the light-emitting surface 144.

[0074] Furthermore, the side of the light cutoff element 150 is completely covered by the light-transmitting element 140, and the light cutoff element 150 is basically embedded in the light-transmitting element 140. At this time, the optical component 130 is regarded as an integral structure, and the two are firmly connected without any problems of falling off or separating.

[0075] The shape of the light cutoff element 150 can be, but is not limited to, square or circular, and the shape of the light-transmitting element 140 can be adapted accordingly. In other embodiments, the shape of the light cutoff element 150 can also be elliptical, prismatic, other parallelograms or other polygons, while the shape of the light-transmitting element 140 can be adapted accordingly or the light-transmitting element 140 can adopt different shapes.

[0076] Combination Figure 7The molding die 200 of the optical component 130 is provided with multiple spaced glue tanks 230. First, an appropriate amount of glue is injected into each of the multiple glue tanks 230. Then, using a transfer fixture 300, multiple light cut-off elements 150 are simultaneously inserted into the multiple glue tanks 230 until the glue cures to form a light-transmitting element 140. Finally, the transfer fixture 300 is moved to remove the light-transmitting element 140 from the glue tank 230, thus batch-producing the optical component 130. It should be noted that the insertion depth of the light cut-off element 150 can be adjusted according to requirements. The transfer fixture 300 can cover the molding die 200 and close the glue tanks 230. The transfer fixture 300 can fix a batch of light cut-off elements 150 by vacuum adsorption and batch transfer the light cut-off elements 150. Furthermore, the bottom of the glue tank 230 can be set as a convex or concave surface to form light-incident surfaces 143 of different shapes. In subsequent processes, the end face of the light end 142 can be smoothed using a frosting process.

[0077] It should be noted that in other embodiments, the light-transmitting element 140 can be molded first, and the light-transmitting element 140 has a built-in insertion hole. Then, the light cut-off element 150 is inserted into the insertion hole. The light cut-off element 150 can be tightly fitted with the insertion hole or glued to the insertion hole to assemble the optical component 130. Obviously, the above process can be carried out in batches and is not limited to the assembly of a single optical component 130.

[0078] As for the other aspects of the semiconductor integrated light source 100 in this embodiment, they are basically the same as the other aspects of the semiconductor integrated light source 100 in the first embodiment above. The specific content can be referred to the description of the first embodiment above, and will not be repeated here.

[0079] Please see Figure 8 , Figure 8 A cross-sectional view of the semiconductor integrated light source in the fifth embodiment of this application is shown. Compared with the light cutoff member 150 of the semiconductor integrated light source 100 in the fourth embodiment, in this embodiment, one end of the light cutoff member 150 of the semiconductor integrated light source 100 is set corresponding to the light-incident end 141, and the other end is set corresponding to the light-outceasing end 142. The light emitted by the light-emitting chip 120 enters the light-transmitting element 140 from the light-incident surface 143, which also means that it enters the hollow space of the light cutoff member 150. The light cannot escape from the side of the light cutoff member 150, and therefore cannot escape from the side of the light-transmitting element 140, so that the entire semiconductor integrated light source 100 will not leak light from the side. Moreover, the light cutoff member 150 is essentially completely embedded in the light-transmitting element 140, and the two are essentially a single structure.

[0080] Furthermore, the light-transmitting element 140 is cylindrical in shape and has no inclined side 145. In other words, the side of the light-transmitting element 140 can be a flat side, a cylindrical side, or an elliptical cylindrical side.

[0081] It should be noted that, in this application, one end of the light cut-off element 150 is embedded in the light-transmitting element 140, which should be understood as at least two of the end face, outer side and inner side of one end of the light cut-off element 150 being covered by the light-transmitting element 140.

[0082] As for the other aspects of the semiconductor integrated light source 100 in this embodiment, they are basically the same as the other aspects of the semiconductor integrated light source 100 in the fourth embodiment above. The specific content can be referred to the description of the fourth embodiment above, and will not be repeated here.

[0083] Please see Figure 9 , Figure 9 A schematic diagram of a lighting device according to an embodiment of this application is shown. The lighting device 400 provided in this embodiment includes a circuit board 410 and multiple semiconductor integrated light sources 100, which are disposed on the circuit board 410. The specific structure of the semiconductor integrated light sources 100 is as described in the above embodiments. Since the lighting device 400 in this embodiment adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0084] The lighting device 400 also includes a sealant layer 420. The sealant layer 420 is opaque and is disposed on the circuit board 410, covering a portion of the sides of all semiconductor integrated light sources 100. The front side 114 of the sealant layer 420 is aligned with or higher than one end of the light cutoff element 150 of the semiconductor integrated light source 100, further blocking light emitted from the side of the light-transmitting element 140. Simultaneously, the sealant layer 420 improves the dustproof and waterproof performance of the lighting device 400, enabling its application in outdoor environments. It should be noted that, corresponding to the semiconductor integrated light source 100 in the fourth and fifth embodiments described above, the lighting device 400 may not have the sealant layer 420.

[0085] The sealant layer 420 is set in black, which absorbs light and at the same time improves the display contrast of the lighting device 400.

[0086] The lighting device 400 may be, but is not limited to, vehicle lights. Specifically, vehicle lights may be interactive lights (ISD, Intelligent Sign Display), but are not limited to this.

[0087] It should be noted that the application scenarios of the semiconductor integrated light source 100 in this application are not limited to the above-mentioned lighting device 400, but can also be applied to display devices, projection devices, security devices or other self-emissive devices.

[0088] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A semiconductor integrated light source, characterized by, include: A bracket (110) having a groove (112); A light-emitting chip (120) is disposed within the groove (112); and An optical component (130) is sealed to the front side (114) of the bracket (110); The optical component (130) includes: a light-transmitting element (140) having a light-incident end (141) and a light-exiting end (142); and a light-blocking component (150) having an opaque hollow structure, one end of which is embedded in the light-transmitting element (140), and the other end of which is disposed corresponding to the light-exiting end (142) and defines the light-exiting surface (144) of the light-exiting end (142). The end face of the light-incident end (141) is sealed and bonded to the front face (114) of the bracket (110) by adhesive, and forms a sealed cavity (132) with the bracket (110), and the light-emitting chip (120) is located in the cavity (132). The light cutoff element (150) is configured to absorb light; The light-transmitting element (140) also has an inclined side surface (145), which is connected to the end face of the light-incident end (141); One end of the light cut-off member (150) is disposed corresponding to the inclined side surface (145) and is used to absorb at least a portion of the light rays totally reflected by the inclined side surface (145); The inner surface (152) of the light cut-off member (150) is gradually widened in the direction from the light input end (141) toward the light output end (142).

2. The semiconductor integrated light source according to claim 1, characterized in that, The area of ​​the light-emitting surface (144) is greater than or equal to the area of ​​the end face of the light-incident end (141).

3. The semiconductor integrated light source according to claim 1 or 2, characterized in that, The outer side (154) of the light cut-off element (150) is connected to the inclined side (145).

4. The semiconductor integrated light source according to claim 1, wherein On the plane where the end face of the light-incident end (141) is located, the orthographic projection of one end of the light-blocking member (150) covers the orthographic projection of the inclined side surface (145).

5. The semiconductor integrated light source of claim 1, wherein, On the plane where the front side (114) of the bracket (110) is located, the orthographic projection of the light-emitting surface (144) of the light-transmitting element (140) covers the front side (114) of the bracket (110).

6. An illumination device, characterized by include: Circuit board (410); and A plurality of semiconductor integrated light sources (100) are disposed on the circuit board (410), wherein the semiconductor integrated light sources (100) are semiconductor integrated light sources (100) as described in any one of claims 1 to 5.

7. The illumination device of claim 6, wherein Also includes: A sealing layer (420) is provided on the circuit board (410) and covers part of the sides of all the semiconductor integrated light source (100). The front side (114) of the sealing layer (420) is aligned with or higher than one end of the light cut-off element (150) of the semiconductor integrated light source (100).

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