Chip disassembling and assembling system for wafer

Abstract

The invention discloses a chip disassembling and assembling system for a wafer. The chip disassembling and assembling system comprises a workbench, a wafer adsorption driving device, a chip adsorption driving device and a chip collecting box. The wafer adsorption driving device is arranged on the workbench and used for adsorbing and fixing a wafer and driving the wafer to move in the X-axis direction and the Y-axis direction. And the chip adsorption driving device is connected with the workbench, is located above the wafer adsorption driving device, and is used for driving the chip to move in the X-axis direction and the Z-axis direction so as to remove a defective chip on the wafer and install a normal chip on the wafer. The chip collecting box is arranged on the workbench and used for collecting defective chips. The wafer adsorption driving device is used for adsorbing and fixing the wafer and driving the wafer to move in the X-axis direction and the Y-axis direction, so that alignment of the wafer and the chip adsorption driving device is achieved, then the chip adsorption driving device is used for disassembling and assembling the chip on the wafer, full-automatic chip disassembling and assembling are achieved, and the working efficiency is improved. And the automation degree of defective chip removal and normal chip installation is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer manufacturing, and in particular to a wafer chip dismounting and mounting system. BACKGROUND

[0002] In the field of semiconductor wafer manufacturing, improving wafer yield is always one of the core challenges of the industry. With the continuous miniaturization of chip processes (currently at the 3nm node), the presence of a single defective chip (bad die) on a wafer can cause the entire wafer to be downgraded. In high-end applications such as 3D packaging and image sensors, the precise removal and repair of defective chips has become a key link in the downstream process.

[0003] Traditional defective chip processing techniques mainly rely on manual microscope positioning combined with mechanical tweezers removal. This approach has the disadvantages of low operation efficiency (less than 50 chips per hour), unstable contact force control which can easily damage adjacent functional normal chips, and high human error rate. Therefore, there is an urgent need to develop a fully automatic device for removing defective chips on a wafer and installing functional normal chips to meet the stringent requirements of advanced processes for wafer repair processes. SUMMARY

[0004] Embodiments of the present application provide a wafer chip dismounting and mounting system to improve the manual removal of defective chips on a wafer, solving the problem of low automation.

[0005] In a first aspect, embodiments of the present application provide a wafer chip dismounting and mounting system, comprising: a workbench; a wafer suction driving device arranged on the workbench, configured to suction and fix a wafer and drive the wafer to move in X-axis and Y-axis directions; a chip suction driving device connected to the workbench and located above the wafer suction driving device, configured to drive a chip to move in the X-axis and Z-axis directions, so as to remove defective chips on the wafer and install normal chips on the wafer; a chip collection box arranged on the workbench, configured to collect the defective chips.

[0006] In some embodiments of the present application, the wafer suction driving device comprises a first driving mechanism and a wafer suction disc, and the driving end of the first driving mechanism is connected to the wafer suction disc, configured to drive the wafer suction disc to move in the X-axis and Y-axis directions.

[0007] In some embodiments of the present application, the first driving mechanism comprises a first X-axis driver and a Y-axis driver, the first X-axis driver is arranged on the driving end of the Y-axis driver, and the wafer suction disc is arranged on the driving end of the first X-axis driver.

[0008] In some embodiments of the present application, the wafer adsorption driving device further comprises a needle assembly arranged at the periphery of the wafer adsorption disc for receiving or lifting the wafer.

[0009] In some embodiments of the present application, the wafer adsorption driving device comprises a rotating seat arranged between the driving end of the first driving mechanism and the wafer adsorption disc for driving the wafer adsorption disc to rotate.

[0010] In some embodiments of the present application, the chip adsorption driving device comprises a second driving mechanism and a chip adsorption mechanism, the driving end of the second driving mechanism is connected with the chip adsorption mechanism for driving the chip adsorption mechanism to move in the Z-axis direction and the X-axis direction, and the chip adsorption mechanism is used for adsorbing chips.

[0011] In some embodiments of the present application, the chip adsorption mechanism comprises a plurality of chip adsorption subassemblies, the sizes of the adsorption ends of the plurality of chip adsorption subassemblies are different to adapt to different chip sizes.

[0012] In some embodiments of the present application, the second driving mechanism comprises a Z-axis driver and a second X-axis driver, the Z-axis driver is arranged at the driving end of the second X-axis driver, and the chip adsorption mechanism is arranged at the driving end of the Z-axis driver.

[0013] In some embodiments of the present application, the chip adsorption driving device further comprises a range finder and a visual detection device, the range finder and the visual detection device are arranged at the driving end of the Z-axis driver.

[0014] In some embodiments of the present application, the chip adsorption driving device further comprises a force sensor connected with the chip adsorption mechanism for detecting the force received by the chip adsorption mechanism.

[0015] Therefore, the embodiments of the present application can realize the alignment of the wafer and the chip adsorption driving device by using the wafer adsorption driving device to adsorb and fix the wafer and drive the wafer to move in the X-axis direction and the Y-axis direction, and then use the chip adsorption driving device to disassemble and assemble the chips on the wafer, so as to realize the full-automatic chip disassembly and assembly, improve the efficiency, precision and automation degree of the defective chip removal and normal chip installation, and accordingly, it is also beneficial to reduce the labor intensity and labor cost. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced. Obviously, the drawings in the following description only constitute some of the embodiments of the present application. All other embodiments obtained by those skilled in the art without creative effort based on the drawings belong to the scope of the present application.

[0017] Figure 1 A structural schematic diagram of a wafer chip dismounting system provided by an embodiment of the present application; Figure 2 A structural schematic diagram of a wafer suction driving device in a wafer chip dismounting system provided by an embodiment of the present application; Figure 3 A structural schematic diagram of a wafer suction driving device in a wafer chip dismounting system provided by an embodiment of the present application; Figure 2 An exploded schematic diagram of the wafer suction driving device; Figure 4 A structural schematic diagram of a wafer suction driving device in a wafer chip dismounting system provided by an embodiment of the present application; Figure 5 An exploded schematic diagram of the wafer suction driving device; Figure 4 An exploded schematic diagram of the wafer suction driving device.

[0018] Signs of the drawings: 1, workbench; 2, wafer suction driving device; 21, first driving mechanism; 211, first X-axis driver; 212, Y-axis driver; 22, wafer suction disc; 23, pin assembly; 231, pin; 232, electric cylinder driver; 24, rotating seat; 3, chip suction driving device; 31, second driving mechanism; 311, Z-axis driver; 312, second X-axis driver; 32, chip suction mechanism; 321, chip suction part; 33, range finder; 34, visual detection device; 35, force sensor; 4, chip collection box. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort belong to the scope of the present application.

[0020] In the description of the present application, it should be understood that the words "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or indicating the number of the indicated technical features. Therefore, the features with "first", "second" can be explicitly or implicitly included one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0021] Please refer to Figures 1 to 5 Embodiments of the present application provide a wafer chip disassembly system, comprising a workbench 1, a wafer suction driving device 2, a chip suction driving device 3 and a chip collection box 4. The wafer suction driving device 2 is arranged on the workbench 1 and is used to suction and fix the wafer and drive the wafer to move in the X-axis direction and the Y-axis direction. The chip suction driving device 3 is connected with the workbench 1 and is located above the wafer suction driving device 2, and is used to drive the chip to move in the X-axis direction and the Z-axis direction, so as to remove the defective chip on the wafer and install the normal chip on the wafer. The chip collection box 4 is arranged on the workbench 1 and is used to collect the defective chip.

[0022] The technical scheme provided by the present application uses the wafer suction driving device 2 to suction and fix the wafer and drive the wafer to move in the X-axis direction and the Y-axis direction, so as to realize the alignment of the wafer and the chip suction driving device 3, and then uses the chip suction driving device 3 to disassemble and assemble the chip on the wafer, realizes the full-automatic chip disassembly and assembly, improves the efficiency, precision and automation degree of removing the defective chip and installing the normal chip, and correspondingly, is also beneficial to reduce the labor intensity and labor cost.

[0023] It should be noted that the chip collection box 4 can be used only for collecting the defective chip, or a sub-warehouse structure can be arranged in the chip collection box 4, so that the chip collection box 4 has a defective chip collection warehouse and a normal chip storage warehouse, so that the chip collection box 4 can collect the defective chip and store the normal chip, and can avoid the mixing of the defective chip and the normal chip. For the chip suction driving device 3, whether the defective chip is put into the chip collection box 4 or the normal chip is taken from the chip collection box 4 and installed on the wafer, the movement route of the chip suction driving device 3 is basically fixed, which is beneficial to set the movement route of the chip suction driving device 3 and reduce the number of chip collection boxes 4 and reduce the cost.

[0024] In some embodiments, please refer to Figure 2 and Figure 3 The wafer suction driving device 2 comprises a first driving mechanism 21 and a wafer suction disc 22. The driving end of the first driving mechanism 21 is connected with the wafer suction disc 22 and is used to drive the wafer suction disc 22 to move in the X-axis direction and the Y-axis direction. By using the first driving mechanism 21 to drive the wafer suction disc 22 to move in the X-axis direction and the Y-axis direction, the wafer suction disc 22 can adjust its position in the XY plane, so that it can be located at any position within the driving stroke of the first driving mechanism 21, which is convenient for the wafer suction disc 22 to be positioned with the chip suction driving device 3, so that the chip suction driving device 3 can accurately disassemble and assemble the chip subsequently.

[0025] Further, the first driving mechanism 21 comprises a first X-axis driver 211 and a Y-axis driver 212. The Y-axis driver 212 is arranged on the table top of the workbench 1, the first X-axis driver 211 is arranged at the driving end of the Y-axis driver 212, and the wafer suction disc 22 is arranged at the driving end of the first X-axis driver 211. Exemplarily, the first driving mechanism 21 forms a composite motion structure by directly integrating the first X-axis driver 211 on the mover platform of the Y-axis driver 212. The first X-axis driver 211 can adopt a ball screw module, the lead screw is 5 mm, and a servo motor with a 17-bit absolute value encoder is provided. The Y-axis driver 212 can adopt a high-rigidity linear motor module, the peak thrust is 200 N, and the repeat positioning accuracy is 0.5 μm. Of course, in other embodiments, the first X-axis driver 211 and the Y-axis driver 212 can also adopt other driving devices, such as driving cylinders, etc., without limitation. When the Y-axis driver 212 drives the first X-axis driver 211 to move along the precise linear guide rail of the Y-axis driver 212 in the Y-axis direction, the first X-axis driver 211 drives the wafer suction disc 22 to accurately translate in the X-axis direction through its own ball screw. This structure decouples the motion of the X-axis and the motion of the Y-axis, and the driving path of the wafer suction disc 22 is completely determined by the superimposed displacement of the first X-axis driver 211 and the Y-axis driver 212. For example, when moving to the coordinates X=150 mm, Y=200 mm, the Y-axis driver 212 drives the first X-axis driver 211 and the wafer suction disc 22 to move 200 mm as a whole, and then the first X-axis driver 211 moves 150 mm alone. For the wafer suction disc 22, the surface is a microporous ceramic material, and the suction aperture and the suction area can be determined according to actual needs, which are not limited here.

[0026] By using the technical scheme of jointly driving the wafer suction disc by the first X-axis driver 211 and the Y-axis driver 212, the reverse gap and inertia coupling problem of the intermediate transmission structure can be eliminated compared with the traditional series driving platform, especially at high speed. The motion stability of the wafer suction disc 22 can be maintained, and by directly fixing the wafer suction disc 22 to the end of the first X-axis driver 211, the rigidity attenuation caused by multi-stage transmission is avoided, so that the wafer suction disc 22 will not deviate due to inertia force when high-speed reversing. This structure is particularly suitable for 12-inch wafer full-width high-speed scanning, such as the maximum moving speed of 800 mm / s in the X-axis direction and the maximum moving speed of 600 mm / s in the Y-axis direction. Combined with the vacuum negative pressure control of the wafer suction disc 22, the wafer can be accurately positioned from the loading position to any target position within 3 seconds.

[0027] In some embodiments, the wafer suction driving device 2 further comprises a set of top pins 231, which are arranged at the periphery of the wafer suction plate 22 and used to support or lift the wafer. When the mechanical arm is ready to place the wafer on the wafer suction plate 22, the set of top pins 231 will be raised to support the wafer, and then the top pins 231 will be lowered to make the wafer fall on the wafer suction plate 22, which will then suck and fix the wafer. When the mechanical arm needs to take away the wafer, the set of top pins 231 will lift the wafer again to make it separate from the wafer suction plate 22, so that it is no longer subjected to the suction force of the wafer suction plate 22, and then the mechanical arm takes away the wafer.

[0028] Exemplarily, the set of top pins 231 is composed of three top pins 231 distributed at equal angles and an electric cylinder driver 232, and each top pin 231 is independently connected to the electric cylinder driver 232. The top pin 231 is made of silicon nitride ceramic material, and the tip of the top pin 231 is provided with a micro vacuum suction hole with a diameter of 50 μm and a vacuum degree of -10 kPa. Of course, in other examples, the diameter and vacuum degree of the suction hole of the top pin 231 can also be set to other parameters, which can be set according to actual needs. The tip of the top pin 231 is also provided with a piezoelectric contact sensor. When the wafer needs to be loaded, the three sets of top pins 231 are synchronously raised to a preset height to form a triangular support plane. After the mechanical arm places the wafer on the tip of the top pin 231, the vacuum suction hole is started to fix the position of the wafer, and then the wafer suction plate 22 starts the main vacuum suction while the top pin 231 electric cylinder is lowered at a speed of 0.1 mm / s. The contact sensor monitors in real time, and if a sudden pressure change exceeding 0.5 N is detected, it will stop immediately and alarm, ensuring that the wafer and the wafer suction plate 22 achieve non-impact contact. In the unloading stage, the top pin 231 electric cylinder is raised by 0.5 mm to lift the wafer away from the suction surface of the wafer suction plate 22, which destroys the vacuum suction and triggers the edge air blowing device to assist in separation. The contact force of the top pin 231 is always lower than the wafer fracture threshold. Compared with the traditional straight suction scheme without top pin 231, the slip rate of the wafer caused by electrostatic suction or micro-vibration is reduced from 5% to 0.01%. Especially when processing ultra-thin wafers, i.e. wafers with a thickness of 50 μm or less, the wafer can still be kept intact and undamaged, and the lifting height of the top pin 231 can be adjusted to adapt to the loading and unloading needs of wafers of different thicknesses. In the actual measurement, no scratches were found on the wafer surface in 1000 continuous loading and unloading cycles, and a white light interferometer was used for detection.

[0029] In some embodiments, the wafer suction driving device 2 comprises a rotating seat 24 arranged between the driving end of the first driving mechanism 21 and the wafer suction disc 22, for driving the wafer suction disc 22 to rotate. For example, the rotating seat 24 adopts a frameless torque motor direct driving structure, the rotor flange of which is rigidly connected to the wafer suction disc 22 through a high-rigidity carbon fiber composite support, while the stator assembly is fixed to the driving end of the first driving mechanism 21, specifically the driving end of the first X-axis driver 211, through an invar base with matched thermal expansion coefficient. When the system detects that the wafer cutting path has an angle deviation from the X-axis, the rotating seat 24 drives the wafer suction disc 22 to rotate for compensation with an angle resolution of 0.0001°, and the built-in 24-bit absolute photoelectric encoder feeds back the position in real time, so as to realize accurate positioning with an axis center offset of less than 0.3 μm through the cross-roller bearing. For example, after the wafer is loaded, the vision detection device 34 identifies that the cutting path has a 0.38° deviation from the X-axis, and the rotating seat 24 completes a 0.38° counterclockwise rotation within 0.8 seconds, so that the wafer cutting path is strictly parallel to the X-axis. This rotating compensation mechanism enables the XY platform to move directly according to the wafer coordinate system without coordinate transformation calculation, and eliminates the cumulative positioning error caused by the wafer angle deviation. In particular, when processing the local stress deformation of the wafer caused by the cutting process, the rotating seat 24 can cooperate with the pitch adjustment module to perform dynamic angle compensation, so as to ensure that the wafer surface is always parallel to the XY movement plane.

[0030] In some embodiments, referring to Figure 4 and Figure 5 , the chip suction driving device 3 comprises a second driving mechanism 31 and a chip suction mechanism 32, the driving end of the second driving mechanism 31 is connected to the chip suction mechanism 32, for driving the chip suction mechanism 32 to move in the Z-axis direction and the X-axis direction, and the chip suction mechanism 32 is used for suctioning the chip. When it is necessary to take the defective chip from the wafer or install the normal chip on the wafer, the wafer suction device is first driven by the first X-axis driver 211 and the Y-axis driver 212 to move to a target position, which is a position in alignment with the suction end of the chip suction mechanism 32, so as to ensure that the chip suction mechanism 32 can be aligned with the target chip to complete the suction or accurate placement of the normal chip under the driving of the second driving mechanism 31. As to how to determine the target position, it will be further described in subsequent embodiments, which will not be described here.

[0031] Further, the chip suction mechanism 32 comprises a plurality of chip suction members 321, and the suction ends of the plurality of chip suction members 321 have different sizes to adapt to different chip sizes.

[0032] Exemplarily, the chip suction accessory 321 comprises independently driven vacuum suction nozzle units, the chip suction accessory 321 is provided with three independently driven vacuum suction nozzle units, and the independently driven vacuum suction nozzle units also have three, such as three vacuum suction nozzle units with a pore diameter of 0.5 mm, 1.5 mm and 3.0 mm. Each group of vacuum suction nozzle units is driven by a piezoelectric ceramic micro-motion platform to realize Z-direction fine adjustment, thereby realizing automatic selection of the three vacuum suction nozzle units. The technical solution provided in the embodiment can seamlessly switch between processing three different sizes of chips in a single wafer processing process, improve the adaptability of chip sizes, and improve the efficiency of processing different chips.

[0033] Further, the second driving mechanism 31 comprises a Z-axis driver 311 and a second X-axis driver 312, the Z-axis driver 311 is arranged at the driving end of the second X-axis driver 312, and the chip suction mechanism 32 is arranged at the driving end of the Z-axis driver 311.

[0034] Exemplarily, the second driving mechanism 31 forms an orthogonal motion architecture by directly integrating the Z-axis driver 311 on the mover of the second X-axis driver 312. The second X-axis driver 312 drives the Z-axis driver 311 and other mechanisms connected to the Z-axis driver 311, such as the chip suction mechanism 32, to move at a high speed in the X-axis direction, while the Z-axis driver 311 drives the chip suction mechanism 32 to vertically lift through a precision cross-roller guide. This separated driving technical solution makes the motion in the X-axis direction and the Z-axis direction not interfere with each other. The chip suction mechanism 32 is rigidly connected to the Z-axis slide through a six-dimensional force sensor 35, and the suction nozzle of the chip suction accessory 321 adopts a composite structure of a silicon carbide ceramic substrate and a flexible silica gel sealing ring. When suctioning a 5*5 mm chip, the suction nozzle contacts the chip surface at a vacuum degree of -80 kPa, the Z-axis applies a pre-pressure of 0.8 N and maintains it for 0.5 seconds to make the silica gel ring deform and seal, and then vertically lifts to remove the chip at a speed of 10 mm / s. During this process, the second X-axis driver 312 synchronously moves laterally at a speed of 0.1 m / s above the chip collection box 4, realizing seamless connection of the pick-and-place action. The chip suction mechanism 32 adopts a low-inertia design, and the total moving mass is less than 300 g, which can control the dynamic vibration amplitude within 0.5 μm. At the same time, through the X-axis and Z-axis decoupling control algorithm, the interference of the second X-axis driver 312 on the Z-axis positioning when it is suddenly stopped is eliminated. When removing an ultra-thin chip with a thickness of 50 μm, the contact force fluctuation range is within the range of -0.02 N to 0.02 N, the breakage rate is reduced from 5% to 0.01%, and the suction nozzle quick-change interface supports replacing different size suction nozzle groups within 10 seconds, adapting to the chip processing requirements of 8-inch to 12-inch wafers.

[0035] In some embodiments, the chip suction driving device 3 further comprises a range finder 33 and a visual detection device 34, both of which are arranged at the driving end of the Z-axis driver 311.

[0036] Exemplarily, the distance meter 33 adopts the laser triangulation principle, with a wavelength of 650 nm, a spot diameter of 10 pm, a measurement range of 0-10 mm, and a resolution of 0.1 pm. The visual detection device 34 adopts a 5 million pixel CMOS sensor with a pixel size of 2.2 pm, and is matched with a telecentric lens with a depth of field range of -0.05 mm to 0.05 mm. The distance meter 33 and the visual detection device 34 are integrated on the driving end flange of the Z-axis driver 311 through a high-rigidity titanium alloy support to form a follow-up measurement system. When the Z-axis driver 311 is raised and lowered at a speed of 0.01 pm / s to 50 mm / s, the distance meter 33 detects the distance between the nozzle tip and the wafer surface in real time, and the sampling rate can be set to 10 kHz. The multi-spectral ring light source of the visual detection device 34 is synchronously triggered to perform stroboscopic illumination, including infrared light 850 nm, visible light 520 nm, and ultraviolet light 365 nm bands, and the exposure time is 10 ps. For example, before adsorbing a 5*5 mm chip, the Z-axis is lowered to 100 pm from the wafer surface at a speed of 5 mm / s, the distance meter 33 is switched to a high-precision mode, i.e., a resolution of 0.01 pm, and the driving nozzle is driven to contact the chip with a step of 0.1 pm. At the same time, the visual device captures the relative position of the chip edge and the scribe lane in real time through a feature matching algorithm. When it is detected that the chip offset exceeds 3 pm, the Z-axis driver 311 pauses the lowering and triggers the first X-axis driver 211 and the Y-axis driver 212 to perform fine adjustment compensation. The integrated measurement system enables the distance measurement, surface coplanarity detection, and visual positioning three-in-one operation to be completed in a single Z-axis stroke. For example, when processing a warped wafer, the distance meter 33 scans the wafer three-dimensional topography along the Z-axis movement trajectory, and the visual device is automatically adjusted to the best focus. It is measured that in the range of a 12-inch wafer, the chip positioning time is shortened from 2.5 seconds of the traditional split-type measurement to 0.8 seconds. Because the measurement system is rigidly connected with the nozzle, the system error of 1 pm to 5 pm caused by the gap between the mechanical structures of the traditional split-type measurement head is eliminated. Especially when processing transparent film chips, the multi-spectral light source can be switched to the ultraviolet band for penetration detection, and the optical focus is corrected in real time combined with the laser distance data, so that the visual positioning accuracy is stabilized in the range of -0.8 pm to 0.8 pm.

[0037] In some embodiments, the chip adsorption driving device 3 further comprises a force sensor 35 connected with the chip adsorption mechanism 32 for detecting the force received by the chip adsorption mechanism 32.

[0038] For example, the force sensor 35 is directly connected in series between the chip adsorption mechanism 32 and the drive end of the Z-axis driver 311 via a titanium alloy adapter flange, forming a closed-loop force control system. The force sensor 35 can be a MEMS six-dimensional force sensor 35 with a range of -20N to 20N and a bandwidth of 1kHz. When the Z-axis driver 311 presses down on the chip adsorption component 321 to contact the chip at a micro-feed speed of 0.1μm / s, the force sensor 35 detects the normal contact force and the lateral shear force in real time, and transmits the signals to the motion controller through a high-speed data acquisition card, triggering an adaptive PID control algorithm to dynamically adjust the Z-axis pressure. For example, when removing a 3×3mm chip with a thickness of 80μm, the system presets a contact force threshold of 0.6N±0.05N. When the force sensor 35 detects an actual contact force of 0.55N, the Z-axis immediately switches to position holding mode. Simultaneously, the vacuum nozzle adsorbs the chip with a negative pressure of -90kPa and maintains a stable time of 300ms. During this process, if a lateral force fluctuation exceeding 0.1N is detected, the system automatically triggers micro-motion compensation on the X and Y axes. For example, when adsorbing a 10×10mm chip and encountering a 0.3N lateral force, the motion controller calculates the compensation vector within 5ms and drives the second X-axis driver 312 and the wafer adsorption drive device 2 of the wafer adsorption disk 22 to move in coordination, eliminating the misalignment shear force between the chip adsorption component 321 and the chip. This force control mechanism keeps the dynamic force fluctuation during chip removal within ±0.005N, and the measured complete removal rate of ultrathin chips increases from 78% to 99.9%. Especially when processing flexible organic semiconductor wafers, the force-displacement hybrid control mode is effective. This design ensures that the chip surface depression deformation is less than 5nm, which is detected by atomic force microscopy. At the same time, the six-dimensional force sensor 35 can detect the anisotropy of chip adhesion force. When a sudden increase of 30% in adhesion force in a certain direction is detected, the peeling angle is automatically adjusted. Compared with the sensorless solution, this structure improves the chip removal adaptability under different process conditions by 400%. Furthermore, during the chip installation stage, the coplanarity of the chip and the substrate is intelligently determined by contact force curve analysis. If the pressure does not reach the preset value within 0.5 seconds, an alarm is triggered, effectively preventing cold solder joints or misaligned mounting.

[0039] In summary, the working process of the system provided in this application is as follows: After the robotic arm places the 12-inch wafer onto the ejector pin 231 assembly 23, the wafer adsorption tray 22 initiates vacuum adsorption to fix the wafer. The wafer adsorption drive device 2 moves the wafer to the inspection station. The rangefinder 33 scans the wafer thickness and coordinates with the Z-axis driver 311 to focus. The vision inspection device 34 and the rotary disk work together to rotate the wafer to ensure that the dicing track is strictly aligned with the X-axis. Subsequently, the wafer adsorption drive device 2 moves the target position to below the corresponding chip adsorption component 321 according to the pre-stored coordinates of the defective chip. The Z-axis driver 311 presses down the nozzle to contact the chip in 0.1μm steps. The force sensor 35 detects the contact force in real time and triggers vacuum adsorption. The second X-axis driver 312 laterally moves the defective chip to the chip collection box 4. The three chip adsorption components 321 automatically match different chip sizes. After removal, the wafer adsorption drive device 2 returns to the loading position, the ejector pin 231 electric cylinder lifts the wafer to release the adsorption, the robotic arm removes the wafer, and the process is repeated to install a new normal chip.

[0040] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0041] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0042] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0043] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent application are incorporated herein by reference, except for historical application documents that are inconsistent with or conflict with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0044] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A pick-and-place system for wafers, characterized by comprising: The utility model relates to a wafer chip mounting device, including: A workbench; Wafer suction driving device, be located in the workbench, be used for suction fixed wafer and drive the wafer moves in X axle direction and Y axle direction; Chip suction driving device, be connected with the workbench and be located above the wafer suction driving device, be used for driving chip moves in the X axle direction and Z axle direction, to remove the defective chip on the wafer and install normal chip to the wafer; Chip collection box, be located in the workbench, be used for collecting the defective chip.

2. The system for de-mounting a chip from a wafer according to claim 1, wherein The wafer suction driving device includes a first driving mechanism and a wafer suction disc, the driving end of the first driving mechanism is connected with the wafer suction disc, for driving the wafer suction disc to move in X axle direction and Y axle direction.

3. The system of claim 2, wherein the system is configured to: The first driving mechanism includes a first X-axis driver and a Y-axis driver, the first X-axis driver is arranged at the driving end of the Y-axis driver, and the wafer suction disc is arranged at the driving end of the first X-axis driver.

4. The system for de-mounting a die from a wafer of claim 2, wherein, The wafer suction driving device further includes a thimble assembly, the thimble assembly is arranged at the periphery of the wafer suction disc, for receiving or lifting the wafer.

5. The system for de-mounting a die from a wafer of claim 2, wherein, The wafer suction driving device includes a rotating seat, the rotating seat is arranged between the driving end of the first driving mechanism and the wafer suction disc, for driving the wafer suction disc to rotate.

6. The de-mountable die system for wafers of claim 1, wherein, The chip suction driving device includes a second driving mechanism and a chip suction mechanism, the driving end of the second driving mechanism is connected with the chip suction mechanism, for driving the chip suction mechanism to move in Z axle direction and X axle direction, and the chip suction mechanism is used for suction chip.

7. The system for de-mounting a die from a wafer of claim 6, wherein, The chip suction mechanism includes a plurality of chip suction members, the suction ends of the plurality of chip suction members are different in size, to adapt to different chip sizes.

8. The system of claim 6, wherein the wafer is a semiconductor wafer. The second driving mechanism includes a Z-axis driver and a second X-axis driver, the Z-axis driver is arranged at the driving end of the second X-axis driver, and the chip suction mechanism is arranged at the driving end of the Z-axis driver.

9. The system of claim 8, wherein the wafer is a semiconductor wafer. The chip suction driving device further includes a range finder and a visual detection device, the range finder and the visual detection device are both arranged at the driving end of the Z-axis driver.

10. The system of claim 6, wherein the wafer is a semiconductor wafer. The chip suction driving device further includes a force sensor, the force sensor is connected with the chip suction mechanism, for detecting the force received by the chip suction mechanism.

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