A lifting mechanism and an adsorbing bearing mechanism suitable for large-size substrates

Abstract

The application relates to the technical field of organic light-emitting diode display, and discloses a lifting mechanism suitable for a large-size substrate and a suction bearing mechanism, and a lifting mechanism suitable for a large-size substrate, which comprises a base, a driving assembly, a base plate and a porous ceramic plate. The driving assembly is arranged on the base, the base plate is driven by the driving assembly to move linearly, and a first suction hole is arranged on the base plate. The porous ceramic plate is fixed on the side of the base plate away from the driving assembly, covers the first suction hole and is communicated with the first suction hole, and a covering coating is arranged on the circumferential side of the porous ceramic plate. When the first suction hole forms a negative pressure, only the surface of the porous ceramic plate away from the base plate generates the negative pressure. With the cooperation of the base plate and the porous ceramic plate, the suction force and the lifting force can be dispersed, the stress concentration of the contact area between the thin glass in the semiconductor field and the mechanism is reduced, and the heating uniformity of the thin glass substrate is improved.

Description

Technical Field

[0001] This invention relates to the field of organic light-emitting diode display technology, and in particular to a lifting mechanism and adsorption support mechanism suitable for large-size substrates. Background Technology

[0002] In the current semiconductor industry, vacuum adsorption stages are used to transport thin glass (hereinafter referred to as substrates) during the processing of thin glass.

[0003] For example, in the process of injecting ink into the pixel layer of an OLED inkjet printer, a suction-type micro-motion platform is used to support the OLED substrate (thickness ≤ 8mm). When the substrate 90 is transferred to the suction-type micro-motion platform, a lifting mechanism on the platform first lifts the lift pin ( Figure 1 The lifting pin (number 91) is raised to catch the substrate, and then slowly lowered until the substrate contacts the porous ceramic plate of the platform. The vacuum adsorption stage applies negative pressure to hold the substrate in place. During this process, if the lift pin design is unreasonable, it can easily cause breakage. For example, if the lift pin head is designed to be too sharp, it will increase the possibility of the substrate being broken. For example, if the distribution design of the lift pin is unreasonable, it will cause the substrate to deform beyond the threshold under gravity, resulting in damage. Alternatively, microscopic deformation may form on the substrate, causing Mura (display unevenness).

[0004] On the other hand, because lift pins require pre-set lifting holes on the platform, during inkjet printing, the traditional vacuum adsorption stage leaves lifting holes for the lift pins. This can lead to uneven ink distribution, flow, or evaporation, resulting in MURA (mullion-induced irradiation) after the display device is fabricated. Similarly, during the subsequent drying and curing process, these lifting holes can also cause uneven evaporation, forming MURA.

[0005] Currently, Mura caused by the lift pin is mainly improved through the following interconnected methods: ① adjusting the process conditions of VCD and HPB; ② refining the ink droplet landing point planning; ③ continuously optimizing the head shape of the lift pin. This process is time-consuming, and the coupling with other factors causing Mura must be considered during adjustment, making it difficult and limiting the improvement of accuracy and stability. Summary of the Invention

[0006] The present invention aims to improve at least one technical problem in the prior art.

[0007] This invention provides a lifting mechanism suitable for large-size substrates, comprising:

[0008] Base;

[0009] A drive assembly, which is disposed on the base;

[0010] The substrate is driven by the driving component to move in a straight line, and the substrate is provided with a through first adsorption hole;

[0011] A porous ceramic plate is fixed to the side of the substrate away from the driving component. The porous ceramic plate covers the first adsorption hole, and the pores included in the porous ceramic plate are connected to the first adsorption hole. A covering coating is provided on the circumferential side of the porous ceramic plate. The covering coating covers the circumferential side of the porous ceramic plate, so that when a negative pressure is formed at the first adsorption hole, only the surface of the porous ceramic plate away from the substrate generates a negative pressure.

[0012] The beneficial effects of this invention are as follows: This lifting mechanism for large-size substrates utilizes a mating structure between the substrate and a porous ceramic plate to ensure that the negative pressure generated by the first adsorption hole acts only on the surface of the porous ceramic plate away from the substrate. The porous nature of the porous ceramic plate can disperse the adsorption force and lifting force to multiple contact points, reducing the stress concentration in the contact area between the thin glass and the mechanism in the semiconductor field. At the same time, the porous ceramic plate has uniform thermal conductivity, which can make the heat transfer more even when the thin glass substrate is heated, thus improving the heating uniformity of the substrate.

[0013] As a sub-solution of the above technical solution, the material of the covering coating is an organic polymer. The covering coating uses an organic polymer material, which has good structural stability and sealing properties, ensuring the long-term stability of the negative pressure guiding effect and reducing the risk of stress concentration resurgence due to coating failure. Simultaneously, the heat resistance of the organic polymer material is suitable for substrate heating scenarios, indirectly maintaining the improved effect of uniform substrate heating.

[0014] As some sub-solutions of the above technical solutions, the material of the overlay coating is polyimide, polyurethane, or polytetrafluoroethylene. The use of polyimide, polyurethane, or polytetrafluoroethylene for the overlay coating provides excellent resistance to the temperature and chemical environment of semiconductor processing, extending the coating's lifespan, ensuring the continued effectiveness of the negative pressure guiding function, and thus maintaining a stable improvement in stress dispersion and heat uniformity, reducing the impact of equipment maintenance on the improvement effect.

[0015] As a sub-solution of the above technical solution, the lifting mechanism suitable for large-size substrates further includes a guide assembly, which guides the movement of the driving assembly. The guide assembly guides the movement of the driving assembly, improving the stability of the linear motion of the substrate, reducing sudden changes in localized stress on the thin glass caused by substrate swaying, and further reducing the possibility of stress concentration. Simultaneously, the stable movement ensures stable contact between the substrate and the porous ceramic plate, avoiding localized heating differences caused by uneven contact gaps and improving heating uniformity.

[0016] As a sub-solution of the above technical solution, the guiding assembly includes a guide cylinder disposed on the base and a guide rod disposed on the substrate, wherein the guide rod is slidably connected to the guide cylinder. The guiding assembly adopts a sliding connection structure between the guide cylinder and the guide rod, which has high guiding accuracy and can precisely control the movement trajectory of the substrate, making the force position more stable during the lifting and adsorption process of the thin glass, reducing stress fluctuations; the stable contact state also makes the heat transfer between the substrate and the porous ceramic plate more regular, optimizing the uniform heating effect.

[0017] As some sub-solutions of the above technical solutions, the porous ceramic plate is in the shape of a block or a cylinder. The block or cylindrical shape of the porous ceramic plate facilitates precise bonding and fixation with the substrate, reducing uneven stress caused by assembly gaps. Simultaneously, the regular shape allows for a more uniform distribution of adsorption and lifting forces on the substrate contact surface, reducing localized stress. Furthermore, the regular shape also facilitates uniform heat conduction within the ceramic plate, indirectly improving the heating uniformity of the substrate.

[0018] As a sub-solution of the above technical solution, the driving component is a cylinder. The driving component uses a cylinder, which can provide a stable and controllable driving force, making it easier to adjust the lifting speed and force of the substrate, and avoiding stress concentration caused by sudden changes in force during the lifting and lowering of the thin glass; the stable driving force also keeps the relative position of the substrate and the heating source stable, reducing uneven heating caused by positional displacement.

[0019] As a sub-solution of the above technical solution, the base is provided with negative pressure holes and positive pressure holes, both of which are connected to the cylinder. The base's connection of negative and positive pressure holes to the cylinder allows for precise control of the cylinder's extension and retraction via air pressure adjustment, enabling accurate control of the substrate's lifting position. This makes the lifting height of the thin glass more reasonable in relation to the adsorption timing, reducing stress at the moment of contact. Precise position control also ensures that the substrate remains within the preset heating area during the heating process, improving heating uniformity.

[0020] The present invention also provides an adsorption support mechanism, including a base, a vacuum adsorption stage, and a lifting mechanism suitable for large-size substrates as described in any one of the present invention. The vacuum adsorption stage is disposed on the base, and the vacuum adsorption stage is provided with a lifting hole and a plurality of second adsorption holes. The shape of the lifting hole matches the shape of the porous ceramic plate. The porous ceramic plate is lifted and lowered at the lifting hole. The second adsorption holes are used to adsorb the substrate together with the porous ceramic plate on the vacuum adsorption stage.

[0021] Since the adsorption bearing mechanism of the present invention includes the lifting mechanism for large-size substrates described in any of the above technical solutions, it also has the beneficial effects of the lifting mechanism for large-size substrates described in any of the above technical solutions, which will not be elaborated here.

[0022] As some sub-schemes of the aforementioned adsorption and support mechanism, there are five lifting holes and five lifting mechanisms in total. Four of the lifting holes and lifting mechanisms are arranged in a rectangular pattern, and the remaining lifting hole and lifting mechanism are located at the center of the rectangle. The five lifting holes and lifting mechanisms, arranged in a four-rectangular distribution plus a central arrangement, can provide balanced support and adsorption forces to both the edge and center areas of the large-size substrate simultaneously, effectively dispersing the overall stress of the substrate and reducing the stress difference between the edge and center. The uniform distribution of multiple contact points also makes heat transfer more consistent across different areas of the substrate, significantly improving the heating uniformity of the large-size substrate. Attached Figure Description

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 In existing technology, the lift pin is in the raised state;

[0025] Figure 2 In the existing technology, the lift pin is in the state of supporting the substrate;

[0026] Figure 3 This is a schematic diagram of a lifting mechanism suitable for large-size substrates in a non-lifted state.

[0027] Figure 4 This is a schematic diagram of a lifting mechanism suitable for large-size substrates in the lifted state.

[0028] Figure 5 This is a top view of the adsorption support mechanism;

[0029] Figure 6 This is a schematic diagram showing the state of the adsorption support mechanism supporting the substrate.

[0030] Figure 7 This is a schematic diagram of the adsorption support mechanism in the state of not supporting the substrate.

[0031] Figure 8 This is a schematic diagram of the process of the adsorption support mechanism receiving the substrate;

[0032] Figure 9 This is a schematic diagram of the process of removing the substrate from the adsorption support mechanism.

[0033] In the attached image:

[0034] 34 - Porous ceramic plate;

[0035] 35 - Overlay coating;

[0036] 36-Base;

[0037] 37-Guide assembly;

[0038] 38 - Mounting holes;

[0039] 39 - Negative pressure hole;

[0040] 40 - Positive pressure hole;

[0041] 41-Cylinder;

[0042] 42 - First adsorption pore;

[0043] 51-Substrate;

[0044] 52-Base;

[0045] 53 - Suitable for lifting mechanisms of large-size substrates;

[0046] 54 - Vacuum adsorption stage. Detailed Implementation

[0047] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0048] The following is combined with Figures 1 to 9 Embodiments of the present invention will be described.

[0049] Reference Figure 1 and Figure 2 When an OLED inkjet printer injects ink into the pixel layer of a glass substrate 51, the adsorption-type micro-motion platform carries the OLED substrate 51 with a thickness of ≤8mm. After the substrate 51 is transferred to the platform, the lifting mechanism on the platform raises the lift pin to receive the substrate 51, and then slowly lowers it to make the substrate 51 contact the porous ceramic plate of the platform. The vacuum adsorption stage 54 holds the substrate 51 by negative pressure. During this process, if the lift pin is not designed properly (such as the head being too sharp or improperly distributed), it is easy to cause the substrate 51 to break or undergo microscopic deformation, which in turn causes Mura (display unevenness). The lifting holes of the vacuum adsorption stage 54 for the lift pin will cause uneven ink droplet placement, flow or evaporation during inkjet printing, as well as uneven evaporation during subsequent drying and curing, which will also cause Mura. At present, the main means to improve this type of Mura are to adjust the process conditions of VCD and HPB, refine the ink droplet placement planning and optimize the shape of the lift pin head. These methods need to be used in combination, which not only consumes a lot of time, but also requires consideration of the coupling with other Mura causes during debugging, which is difficult and limits the improvement of accuracy and stability.

[0050] This embodiment provides a lifting mechanism 53 suitable for large-size substrates, such as... Figure 3 and Figure 4 As shown, the device includes a base, on which a driving assembly is mounted. A base 36 is connected to the driving assembly. The base 36 is driven by the driving assembly to reciprocate in a linear direction. A through first adsorption hole 42 is provided on the base 36. A porous ceramic plate 34 is fixed on the side of the base 36 away from the driving assembly. The porous ceramic plate 34 completely covers the first adsorption hole 42, and the holes contained in the porous ceramic plate 34 are connected to the first adsorption hole 42. A covering coating 35 is provided on the circumferential side of the porous ceramic plate 34. The covering coating 35 completely covers the circumferential side of the porous ceramic plate 34, so that when a negative pressure is formed at the first adsorption hole 42, only the surface of the porous ceramic plate 34 away from the base 36 generates a negative pressure. The drive assembly starts, causing the substrate 36 and the porous ceramic plate 34 to rise until the porous ceramic plate 34 contacts the semiconductor thin glass substrate 51. Then, a vacuum is created through the first adsorption hole 42, forming a negative pressure. Due to the covering coating 35's coverage of the circumferential sides of the porous ceramic plate 34, the negative pressure can only act on the substrate 51 through the surface of the porous ceramic plate 34 away from the substrate 36, achieving adsorption and fixation of the substrate 51. During lifting, the drive assembly causes the substrate 36 to rise, and the porous ceramic plate 34 contacts the substrate 51 and provides support (lifted state as shown). Figure 4 The porous structure of the porous ceramic plate 34 allows negative pressure to be evenly distributed on its surface, thereby dispersing the adsorption and lifting forces on the substrate 51 and effectively improving stress concentration. Simultaneously, the structure of the porous ceramic plate 34 is similar to that of the support platform with second adsorption holes (both contain porous structures), which improves the heating uniformity of the substrate 51 during heating. Furthermore, the substrate 36 is also provided with mounting holes 38 for fixing to an external base.

[0051] In traditional lifting mechanisms, the sealing structure on the side of the porous ceramic plate 34 often suffers from poor material compatibility, leading to negative pressure leakage or sealing failure, affecting adsorption stability, and exacerbating stress concentration problems. Furthermore, the poor thermal performance of the sealing material also adversely affects the heating uniformity of the substrate 51. In one embodiment of the present invention, the material of the aforementioned covering coating 35 is an organic polymer. Organic polymer materials have good elasticity and sealing properties. When covering the circumferential side of the porous ceramic plate 34, they can tightly adhere to the tiny pores on the ceramic plate surface, effectively blocking the path of negative pressure leakage from the side, ensuring that the negative pressure is concentrated on the contact surface of the substrate 51, making the substrate 51 more evenly stressed and optimizing stress concentration. Moreover, organic polymer materials have a certain degree of thermal stability, maintaining stable physical properties within the heating temperature range of the substrate 51, and will not experience sealing failure due to temperature changes, ensuring the stability of heat conduction in the porous ceramic plate 34 and helping to improve the heating uniformity of the substrate 51. In another embodiment of the present invention, the material of the covering coating 35 is polyimide, polyurethane, or polytetrafluoroethylene. Polyimide, polyurethane, and polytetrafluoroethylene all have excellent high-temperature resistance, which can withstand the heating temperature during the processing of semiconductor substrate 51. They also have good chemical stability and wear resistance, which can resist the corrosion of chemical reagents in the processing environment and wear during long-term use, maintain reliable sealing performance for a long time, and ensure the stability of negative pressure.

[0052] Traditional lifting mechanisms, when driving the base 36, lack effective guiding constraints, easily leading to trajectory deviations and causing the base 36 to sway during lifting. This results in unstable contact positions between the porous ceramic plate 34 and the substrate 51, exacerbating stress concentration. Furthermore, the swaying also alters the contact state of the substrate 51 during heating, affecting uniform heating. To ensure stable operation of the driving component and the base 36, this invention also includes a guiding component 37. The guiding component 37 guides the movement of the driving component. Working in conjunction with the driving component and the base 36, the guiding component 37 restricts the direction of movement of the base 36 as it is driven, ensuring that the base 36 always moves along a preset straight trajectory, preventing deviations and swaying. This maintains a stable contact position between the porous ceramic plate 34 and the substrate 51, ensuring uniform contact force distribution and improving stress concentration. The stable movement also ensures that the substrate 51 maintains good contact with the porous ceramic plate 34 during heating, guaranteeing continuous and uniform heat transfer.

[0053] When using a simple guide assembly 37, the guiding accuracy is low, making it difficult to meet the high-precision requirements for lifting and lowering large-size substrate 51. The substrate 36 may still experience slight displacement, affecting stress distribution and heating uniformity. Further, in one embodiment of the invention, the guide assembly 37 includes a guide cylinder mounted on a base and a guide rod mounted on the substrate 36, with the guide rod slidably connected to the guide cylinder. One end of the guide rod is fixed to the substrate 36, and the other end is inserted into the guide cylinder. The inner wall of the guide cylinder and the outer wall of the guide rod are tightly fitted to form a high-precision sliding pair. When the substrate 36 is lifted or lowered, the guide rod slides along the axial direction within the guide cylinder. Through the constraint of the guide cylinder on the guide rod, the movement error of the substrate 36 can be controlled within a small range, ensuring more precise and uniform contact between the porous ceramic plate 34 and the substrate 51, further optimizing stress concentration. Simultaneously, the high-precision guidance prevents the substrate 51 from shifting position during heating, ensuring uniform heat diffusion on the surface of the substrate 51.

[0054] Furthermore, in one embodiment of the present invention, the porous ceramic plate 34 is in the shape of a cube or a cylinder. A cube-shaped porous ceramic plate 34 can form a larger contact area with the large rectangular substrate 51, allowing for more dispersed stress and heat transfer; a cylindrical porous ceramic plate 34 has a more uniform stress distribution characteristic, enabling more balanced stress at the contact points of the substrate 51. Selecting the appropriate shape based on the shape of the substrate 51 and the installation space of the processing equipment ensures the compatibility between the porous ceramic plate 34 and the substrate 51.

[0055] Furthermore, in one embodiment of the present invention, the driving component is a cylinder 41. The cylinder 41 drives the piston to move by air pressure, thereby driving the substrate 36 to rise and fall. The smooth adjustment of air pressure can realize the uniform movement of the substrate 36, reduce the impact during the start-up and stop process, and make the contact between the substrate 51 and the porous ceramic plate 34 smoother, effectively improving stress concentration. At the same time, the response speed of the cylinder 41 is controllable, and the lifting position of the substrate 36 can be precisely adjusted according to the processing requirements to ensure that the substrate 51 is in the optimal bearing state during the heating process and improve the uniformity of heating.

[0056] Furthermore, the base is equipped with a negative pressure hole 39 and a positive pressure hole 40, both of which are connected to the cylinder 41. The negative pressure hole 39 and the positive pressure hole 40 are connected to an external negative pressure source and a positive pressure source, respectively. By switching the air circuit valves, the air pressure difference between the two sides of the moving end inside the cylinder 41 can be adjusted, thereby precisely controlling the extension and retraction direction and speed of the piston. When the base 36 needs to rise, positive pressure is introduced into the positive pressure hole 40, and a vacuum is created in the negative pressure hole 39 to form a negative pressure, pushing the piston upward. When the base 36 needs to descend, the air circuit is switched so that positive pressure is introduced into the negative pressure hole 39, and a vacuum is created in the positive pressure hole 40, causing the piston to descend.

[0057] In traditional adsorption-support mechanisms, the lift pin of the lifting mechanism is prone to causing mura.

[0058] Reference Figures 5 to 8 This embodiment also provides an adsorption support mechanism, including a base 52, a vacuum adsorption stage 54, and a lifting mechanism 53 suitable for large-size substrates as described in any of the above embodiments. The vacuum adsorption stage 54 is disposed on the base 52, and has lifting holes and a plurality of second adsorption holes. The shape of the lifting holes matches the shape of the porous ceramic plate 34. The porous ceramic plate 34 rises and falls at the lifting holes. The second adsorption holes are used for adsorbing the substrate 51 together by the vacuum adsorption stage 54 and the porous ceramic plate 34. The base 52 provides fixed support for the entire mechanism. The vacuum adsorption stage 54 is used to support the substrate 51. The shape of the lifting holes perfectly matches the shape of the porous ceramic plate 34. When the porous ceramic plate 34 rises and falls, it can accurately retract from the lifting holes, reducing the gap between the porous ceramic plate 34 and the lifting holes of the vacuum adsorption stage 54.

[0059] Reference Figure 8 When the substrate 51 needs to be supported, the lifting mechanism rises from the lifting hole, and the porous ceramic plate 34 of each lifting mechanism contacts the substrate 51 to support the substrate 51. Then, the driving component of each lifting mechanism drives the porous ceramic plate 34 to descend until the substrate 51 contacts the vacuum adsorption stage 54. The second adsorption hole of the vacuum adsorption stage 54 and the first adsorption hole 42 of each porous ceramic plate 34 are connected to negative pressure. At this time, both the porous ceramic plate and the vacuum adsorption stage 54 can form negative pressure, and the substrate 51 is adsorbed on the vacuum adsorption stage 54 and the porous ceramic plate 34. The landing point of the ink droplets during subsequent ink printing is almost unaffected by the lifting mechanism.

[0060] After the substrate 51 has completed processing, such as printing ink, on the vacuum adsorption stage 54, then, refer to Figure 9 First, the negative pressure on the vacuum adsorption stage 54 and each porous ceramic plate is released. Then, when the drive components of each lifting mechanism are activated, the porous ceramic plate 34 rises, the substrate 51 is separated from the vacuum adsorption stage, and then the substrate is transferred.

[0061] The preferred embodiments of the present invention have been described in detail above, but the present disclosure is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope defined by the claims of the present disclosure.

[0062] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

Claims

1. An adsorption-supporting mechanism, characterized in that: This includes a lifting mechanism suitable for large-size substrates, wherein the lifting mechanism suitable for large-size substrates includes: Base; A drive assembly, which is disposed on the base; The substrate (36) is driven by the driving component to move in a straight line, and the substrate (36) is provided with a through first adsorption hole (42). A porous ceramic plate (34) is fixed to the side of the substrate (36) away from the driving component. The porous ceramic plate (34) covers the first adsorption hole (42), and the holes included in the porous ceramic plate (34) are connected to the first adsorption hole (42). A covering coating (35) is provided on the circumferential side of the porous ceramic plate (34). The covering coating (35) covers the circumferential side of the porous ceramic plate (34), so that when a negative pressure is formed at the first adsorption hole (42), only the surface of the porous ceramic plate (34) away from the substrate (36) generates a negative pressure. The adsorption support mechanism further includes a base (52) and a vacuum adsorption stage (54). The vacuum adsorption stage (54) is disposed on the base (52). The vacuum adsorption stage (54) is provided with a lifting hole and a number of second adsorption holes. The shape of the lifting hole matches the shape of the porous ceramic plate (34). The porous ceramic plate (34) is lifted and lowered at the lifting hole. The second adsorption holes are used to adsorb the substrate (51) together with the vacuum adsorption stage (54) and the porous ceramic plate (34).

2. The adsorption support mechanism according to claim 1, characterized in that: The material of the coating (35) is an organic polymer.

3. The adsorption support mechanism according to claim 2, characterized in that: The material of the coating (35) is polyimide or polyurethane, or polytetrafluoroethylene.

4. The adsorption support mechanism according to claim 1, characterized in that: The lifting mechanism for large-size substrates also includes a guide assembly (37) for guiding the movement of the drive assembly.

5. The adsorption support mechanism according to claim 4, characterized in that: The guide assembly (37) includes a guide cylinder disposed on the base and a guide rod disposed on the base (36), the guide rod being slidably connected to the guide cylinder.

6. The adsorption support mechanism according to claim 1, characterized in that: The porous ceramic plate (34) is square or cylindrical.

7. The adsorption support mechanism according to claim 1, characterized in that: The drive component is a cylinder (41).

8. The adsorption support mechanism according to claim 7, characterized in that: The base is provided with a negative pressure hole (39) and a positive pressure hole (40), both of which are connected to the cylinder (41).

9. The adsorption support mechanism according to claim 1, characterized in that: The number of lifting holes and lifting mechanisms is five, of which four of the lifting holes and lifting mechanisms are arranged in a rectangle, and the remaining one lifting hole and lifting mechanism is located at the center of the rectangle.

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