Grinding device

Abstract

The invention discloses a grinding device. The grinding device comprises a vibration unit, a grinding unit, a control unit, a water cooling unit and a vibration isolation unit. The vibration unit is used for receiving the vibration starting signal output by the control unit, generating a high-frequency electric signal according to the vibration starting signal and converting the high-frequency electric signal into a high-frequency vibration signal; a main shaft of the grinding unit receives the rotating signal output by the control unit and drives a grinding assembly to rotate at a preset rotating speed; the grinding assembly receives the high-frequency vibration signal and performs axial high-frequency vibration at a preset amplitude; the water cooling unit is arranged in the axial middle area of the vibration unit in a sleeving manner, and the water cooling unit is used for receiving a cooling starting signal output by the control unit and cooling the vibration unit; the vibration isolation unit is arranged at the axial tail end area of the vibration unit in a sleeving mode and used for isolating the high-frequency vibration signals from being transmitted to an external machine body. Intermittent grinding is achieved through high-frequency vibration, stable operation of the grinding device is guaranteed through water cooling and vibration isolation design, and the using effect is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of precision machining, in particular to a grinding device. BACKGROUND

[0002] Wafer chamfering is one of the key processes in semiconductor manufacturing, which aims to eliminate sharp corners and micro-cracks on the wafer edge to prevent breakage or contamination during subsequent processing or transmission. Currently, diamond grinding stones are commonly used to grind the rotating wafer edge in the prior art. However, there are several problems in the prior art: the mechanical stress is large during grinding, which can easily cause damage, micro-cracks or even edge collapse in the material subsurface layer, affecting the reliability and service life of the device; the grinding stone wears out quickly and needs to be frequently repaired and replaced, which not only increases production costs, but also reduces equipment utilization and production efficiency; the processing method is rigid and difficult to adapt to the processing requirements of complex curved surfaces or irregular edges, with poor processing flexibility; the debris generated during grinding can easily scratch the wafer surface again; the processing efficiency and effect of hard and brittle materials such as silicon carbide and sapphire are poor, limiting their application in advanced semiconductor manufacturing. Therefore, there is an urgent need to design a grinding device with reasonable structure, portable operation and strong practicality. SUMMARY

[0003] The present application provides a grinding device, which realizes intermittent grinding through high-frequency vibration, and ensures stable operation and use effect of the grinding device through cooling sealing and vibration isolation design.

[0004] The present application provides a grinding device, which comprises a vibration unit, a grinding unit, a control unit, a water cooling unit and a vibration isolation unit; the control unit is electrically connected with the vibration unit, the grinding unit and the water cooling unit respectively;

[0005] The vibration unit is used for receiving the vibration start signal output by the control unit, generating a high-frequency electric signal according to the vibration start signal, and converting the high-frequency electric signal into a high-frequency vibration signal;

[0006] The grinding unit comprises a spindle and a grinding assembly, the spindle is rigidly connected with the grinding assembly, the spindle receives the rotation signal output by the control unit and drives the grinding assembly to rotate at a preset speed, and at the same time the grinding assembly receives the high-frequency vibration signal to perform axial high-frequency vibration at a preset amplitude to grind the workpiece to be processed;

[0007] The water cooling unit is sleeved on the axial middle region of the vibration unit, and the water cooling unit is used for receiving the cooling start signal output by the control unit to cool the vibration unit according to the cooling start signal;

[0008] The vibration isolation unit is located between the water cooling unit and the outer body of the grinding device, is sleeved on the axial end region of the vibration unit, and is used for isolating the transmission of the high-frequency vibration signal to the outer body.

[0009] Optionally, the vibration unit comprises an ultrasonic generator, a transducer, a horn, and at least two connecting interfaces, the ultrasonic generator is electrically connected with the transducer, the transducer is connected with the horn through the connecting interfaces, and the horn is connected with the grinding assembly through the connecting interfaces.

[0010] The ultrasonic generator is used for generating a high-frequency electric signal according to the vibration starting signal.

[0011] The transducer is used for converting the high-frequency electric signal into a high-frequency vibration signal.

[0012] The horn is used for amplifying the high-frequency vibration signal to generate a high-frequency vibration amplified signal and transmitting the high-frequency vibration amplified signal to the grinding assembly.

[0013] Optionally, the connecting interfaces are threaded connecting interfaces, conical surface connecting interfaces, or flange connecting interfaces.

[0014] Optionally, the water cooling unit comprises a water cooling sleeve, a sealing structure, and a cooling liquid circulation structure.

[0015] The water cooling sleeve is sleeved on the axial middle region of the vibration unit, and a cooling channel is formed between the inner circumferential surface of the water cooling sleeve and the outer circumferential surface of the vibration unit.

[0016] The sealing structure is arranged at both ends of the water cooling sleeve and is used for sealing and isolating the cooling channel.

[0017] The cooling liquid circulation structure is in communication with the inlet end and the outlet end of the cooling channel, respectively, and is used for supplying and recovering the cooling liquid.

[0018] Optionally, the vibration isolation unit comprises an elastic structure, the elastic structure is sleeved on the axial end region of the vibration unit, and is connected with the outer body.

[0019] Optionally, the grinding device further comprises a protection unit, the protection unit is arranged around the vibration unit.

[0020] Optionally, the grinding device further comprises a temperature acquisition unit, the temperature acquisition unit is electrically connected with the control unit, and the temperature acquisition unit is used for acquiring a temperature value of the vibration unit in real time.

[0021] The control unit is used for outputting a cooling starting signal according to the temperature value.

[0022] Optionally, the preset rotating speed is 1500-4000 rpm.

[0023] Optionally, the frequency of the high-frequency vibration signal is 20-50 kHz, and the preset amplitude is 2-6 μm.

[0024] Optionally, the workpiece to be processed includes a silicon wafer or a silicon carbide wafer.

[0025] The technical scheme of the embodiment of the application provides a grinding device, which comprises a vibration unit, a grinding unit, a control unit, a water cooling unit and a vibration isolation unit. The control unit is electrically connected with the vibration unit, the grinding unit and the water cooling unit. The vibration unit is used for receiving a vibration starting signal output by the control unit, generating a high-frequency electric signal according to the vibration starting signal and converting the high-frequency electric signal into a high-frequency vibration signal. The grinding unit comprises a spindle and a grinding assembly. The spindle is rigidly connected with the grinding assembly. The spindle receives a rotating signal output by the control unit and drives the grinding assembly to rotate at a preset rotating speed. Meanwhile, the grinding assembly receives the high-frequency vibration signal and performs axial high-frequency vibration at a preset amplitude, so as to grind the workpiece to be processed. The water cooling unit is arranged in the axial middle region of the vibration unit. The water cooling unit is used for receiving a cooling starting signal output by the control unit and cooling the vibration unit according to the cooling starting signal. The vibration isolation unit is located between the water cooling unit and the external machine body of the grinding device. The vibration isolation unit is arranged in the axial end region of the vibration unit. The vibration isolation unit is used for isolating the high-frequency vibration signal from being transmitted to the external machine body. The high-frequency vibration is used to realize intermittent grinding of the workpiece to be processed. The design of the water cooling unit and the vibration isolation unit ensures the stable operation of the grinding device, prolongs the operation time and ensures the use effect.

[0026] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the application, nor is it used to limit the scope of the application. Other features of the application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0028] Figure 1 A structural diagram of the grinding device provided by the embodiment of the application is provided.

[0029] Figure 2 A sectional structure diagram of the grinding device provided by the embodiment of the application is provided.

[0030] Figure 3 A structural diagram of a vibration unit provided by an embodiment of the present application is shown. DETAILED DESCRIPTION

[0031] In order to enable persons skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present application.

[0032] It should be noted that the terms "first", "second", and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0033] Figure 1 A structural diagram of a grinding device provided by an embodiment of the present application is shown, Figure 2 A cross-sectional structural diagram of a grinding device provided by an embodiment of the present application is shown, Figure 1 and Figure 2As shown, the grinding device comprises a vibration unit 101, a grinding unit 102, a control unit (not shown in the figure), a water cooling unit 103 and a vibration isolation unit 104; the control unit is electrically connected with the vibration unit 101, the grinding unit 102 and the water cooling unit 103 respectively; the vibration unit 101 is used for receiving a vibration starting signal output by the control unit, generating a high-frequency electric signal according to the vibration starting signal and converting the high-frequency electric signal into a high-frequency vibration signal; the grinding unit 102 comprises a main shaft 1021 and a grinding assembly 1022, the main shaft 1021 is rigidly connected with the grinding assembly 1022, the main shaft 1021 receives a rotation signal output by the control unit and drives the grinding assembly 1022 to rotate at a preset rotation speed, while the grinding assembly 1022 receives the high-frequency vibration signal to perform axial high-frequency vibration at a preset amplitude, so as to grind the workpiece 10 to be processed; the water cooling unit 103 is sleeved on the axial middle region 1011 of the vibration unit 101, the water cooling unit 103 is used for receiving a cooling starting signal output by the control unit and cooling the vibration unit 101 according to the cooling starting signal; the vibration isolation unit 104 is located between the water cooling unit 103 and the external machine body 105 of the grinding device, the vibration isolation unit 104 is sleeved on the axial end region 1012 of the vibration unit 101, and the vibration isolation unit 104 is used for isolating the transmission of the high-frequency vibration signal to the external machine body 105.

[0034] The control unit is electrically connected with the vibration unit 101, the grinding unit 102 and the water cooling unit 103 respectively, and is used to start the vibration unit 101, the grinding unit 102 and the water cooling unit 103, so as to ensure the normal work of the grinding device. The control unit can control the vibration unit 101, the grinding unit 102 and the water cooling unit 103 to start at the same time, so as to ensure the processing stability. After the vibration unit 101, the grinding unit 102 and the water cooling unit 103 are started, the control unit can further finely adjust the working state of the vibration unit 101, the grinding unit 102 and the water cooling unit 103, so as to ensure the processing effect. The vibration unit 101 can be an ultrasonic vibration unit, which is used to receive a vibration starting signal output by the control unit. The vibration unit 101 can generate a high-frequency electric signal according to the vibration starting signal and convert the high-frequency electric signal into a high-frequency vibration signal, so that the vibration unit 101 can generate axial high-frequency vibration and transmit the axial high-frequency vibration to the grinding unit 102, so as to realize the grinding of the workpiece 10 to be processed by the grinding unit 102 with the aid of ultrasonic assistance. The grinding unit 102 comprises a spindle 1021 and a grinding assembly 1022. The spindle 1021 is rigidly connected with the grinding assembly 1022. The grinding assembly 1022 comprises a grinding stone body and a clamping structure. The clamping structure is used to detachably fix the grinding stone body. The material of the grinding stone body can be diamond or cubic boron nitride, which is used to grind the edge of the workpiece 10 to be processed. The grinding stone body can be replaced in time according to the actual use condition, so as to ensure the grinding effect. The clamping structure is connected with the spindle 1021, so that the spindle 1021 can drive the grinding assembly 1022 to rotate. The spindle 1021 receives a rotating signal output by the control unit and drives the grinding assembly 1022 to rotate at a preset rotating speed. The preset rotating speed can be set according to the type of the workpiece 10 to be processed, which is not limited in the embodiment of the application. The control unit also controls the size of the feeding speed. While the spindle 1021 rotates, the control unit controls the moving speed of the grinding assembly 1022 relative to the workpiece 10 to be processed. The feeding speed can be 1-10 mm / min. The specific size can be adjusted according to the actual processing effect, so as to ensure the processing effect. The grinding assembly 1022 receives the high-frequency vibration signal to perform axial high-frequency vibration at a preset amplitude, so that the grinding assembly 1022 can rotate and vibrate at the same time. Meanwhile, the control unit can also control the grinding assembly 1022 to contact the edge of the workpiece 10 to be processed at a preset angle and a preset pressure, so as to realize the ultrasonic-assisted grinding of the workpiece 10 to be processed. In order to avoid the overheating of the vibration unit 101 in the grinding process and affect the stable grinding effect, the grinding device further comprises a water cooling unit 103, which is sleeved on the axial middle region 1011 of the vibration unit 101.The water cooling unit 103 is used for receiving the cooling start signal output by the control unit, so that the water cooling unit 103 starts to work according to the cooling start signal, and then the water cooling unit 103 cools the vibration unit 101, the water cooling unit 103 can take away the heat generated by the vibration unit 101 and the main shaft 1021, avoid the temperature of the grinding device overheating and transmitting to the grinding assembly 1022, cause thermal damage to the workpiece 10 to be processed. The grinding device is also provided with a vibration isolation unit 104, the vibration isolation unit 104 is sleeved on the axial end region 1012 of the vibration unit 101, and is located between the water cooling unit 103 and the external machine body 105 of the grinding device, the vibration isolation unit 104 is used for isolating the high-frequency vibration signal from being transmitted to the external machine body 105, the external machine body 105 can include a machine tool and its related components, avoid the high-frequency vibration of the grinding device transmitting to the external machine body 105, cause damage to the external machine body 105.

[0035] The embodiment of the present application provides a vibration unit, a grinding unit, a control unit, a water cooling unit and a vibration isolation unit in the grinding device, the vibration unit generates high-frequency vibration and the rotation speed of the main shaft drives the grinding unit to intermittently grind the workpiece to be processed, and through the design of the water cooling unit and the vibration isolation unit, the stable operation of the grinding device is ensured, the operation time is prolonged, and the use effect is ensured.

[0036] Optionally, Figure 3 A structure diagram of a vibration unit provided by the embodiment of the present application is shown in Figure 1 、 Figure 2 and Figure 3 The vibration unit 101 includes an ultrasonic generator 11, a transducer 12, an amplitude transformer 13 and at least two connection interfaces 14, the ultrasonic generator 11 is electrically connected with the transducer 12, the transducer 12 is connected with the amplitude transformer 13 through the connection interface 14, and the amplitude transformer 13 is connected with the grinding assembly 1022 through the connection interface 14; the ultrasonic generator 11 is used for generating a high-frequency electric signal according to a vibration start signal; the transducer 12 is used for converting the high-frequency electric signal into a high-frequency vibration signal; the amplitude transformer 13 is used for amplifying the high-frequency vibration signal to generate a high-frequency vibration amplified signal and transmitting the high-frequency vibration amplified signal to the grinding assembly 1022.

[0037] The ultrasonic generator 11 is used for converting the commercial power into a high-frequency electric signal according to the vibration starting signal output by the control unit, and outputting to the transducer 12. The ultrasonic generator 11 is electrically connected with the transducer 12, and the transducer 12 is used for receiving the high-frequency electric signal and converting the high-frequency electric signal into a mechanical vibration of the same frequency, i.e. converting into a high-frequency vibration signal. The transducer 12 is connected with the first end of the amplitude transformer 13 through the connecting interface 14, and the amplitude transformer is used for receiving the high-frequency vibration signal and amplifying the high-frequency vibration signal through the area mutation to change the vibration amplitude and generate a high-frequency vibration amplification signal. The second end of the amplitude transformer 13 is connected with the grinding assembly 1022 through the connecting interface 14, so that the amplitude transformer 13 can transmit the high-speed vibration amplification signal to the grinding assembly 1022 for ultrasonic-assisted grinding. The types of the two connecting interfaces 14 can be the same or different, and the specific selection can be made according to the actual design requirements, and the embodiment of the present application is not limited.

[0038] Optionally, with reference to Figure 3 , the connecting interface 14 is a threaded connecting interface, a conical connecting interface or a flange connecting interface. The connecting interface 14 can be a threaded connecting interface, one end of which is provided with external threads and the other end of which is provided with internal threads, and the two ends can be connected by direct screwing. The connecting interface 14 can be a conical connecting interface, one end of which is made into an external cone and the other end of which is made into an internal cone, and the two cones have the same taper angle and are pressed tightly by axial tension. The flange connecting interface can be that two components are respectively fixed on a pair of flanges, a gasket is arranged between the flanges to realize sealing, a plurality of through holes are arranged on the flanges, and a plurality of screws are used for fixing.

[0039] Optionally, with reference to Figure 1 and Figure 2 , the water cooling unit 103 includes a water cooling jacket 21, a sealing structure 22 and a cooling liquid circulation structure 23. The water cooling jacket 21 is arranged at the axial middle region 1011 of the vibration unit 101, and a cooling channel is formed between the inner circumferential surface of the water cooling jacket 21 and the outer circumferential surface of the vibration unit 101. The sealing structure 22 is arranged at both ends of the water cooling jacket 21 and is used for sealing and isolating the cooling channel. The cooling liquid circulation structure 23 is in communication with the inlet end 24 and the outlet end 25 of the cooling channel respectively, and is used for supplying and recovering the cooling liquid.

[0040] The vibration unit 101 has a certain extension length along the main shaft 1021, the water cooling unit 103 is sleeved on the vibration unit 101, that is, the water cooling unit 103 is located between the grinding unit 102 and the vibration isolation unit 104. The water cooling unit 103 comprises a water cooling sleeve 21, a sealing structure 22 and a cooling liquid circulating structure 23, the water cooling sleeve 21 is sleeved on the axial middle region 1011 of the vibration unit 101, so that a cooling channel is formed between the inner circumferential surface of the water cooling sleeve 21 and the outer circumferential surface of the vibration unit 101, the cooling channel can be a double helical flow channel, the inlet end 24 and the outlet end 25 are distributed at an angle, and counterflow heat exchange is formed. The sealing structure 22 is arranged at both ends of the water cooling sleeve 21 and is used for sealing and isolating the cooling channel, the sealing structure 22 can be a multi-lip rotary sealing ring combined structure, and can effectively prevent the cooling liquid and the grinding from invading the inside of the vibration unit 101 in a high-speed rotating state. The inner circumferential surface of the cooling channel can also be provided with a heat absorption structure, which can absorb latent heat in a heat instantaneous explosive manner and delay temperature rise. The cooling liquid circulating structure 23 is in communication with the inlet end 24 and the outlet end 25 of the cooling channel respectively, and is used for supplying and recovering the cooling liquid, so as to ensure the cooling effect of the water cooling unit 103 on the vibration unit 101. A flow meter can also be arranged on the cooling liquid circulating structure 23, the flow meter can be connected with a control unit, the control unit can adjust the working state of the flow meter, thereby affecting the flow rate of the cooling liquid, and ensuring the cooling effect of the water cooling unit 103.

[0041] Optionally, with reference to Figure 1 and Figure 2 , the vibration isolation unit 104 comprises an elastic structure 1041, the elastic structure 1041 is sleeved on the axial end region 1012 of the vibration unit 101 and is connected with the external machine body 105.

[0042] The elastic structure 1041 is arranged in the vibration isolation unit 104, the elastic structure 1041 is sleeved on the axial end region 1012 of the vibration unit 101, and the elastic vibration is located between the water cooling unit 103 and the external machine body 105, so that the vibration isolation unit 104 can avoid mechanical vibration from being transmitted to the external machine body 105, and damage to the external machine body 105 is avoided. The elastic structure 1041 can also prevent the detection of grinding dust and liquid, and improve the safety of operation. Illustratively, the composition material of the elastic structure 1041 can be rubber or polyurethane elastic support. The composition material of the elastic structure 1041 can be selected according to actual design requirements, and the embodiments of the present application are not limited in this regard.

[0043] Optionally, with reference to Figure 1 and Figure 2 , the grinding device further comprises a protection unit (not shown in the figure), and the protection unit is arranged around the vibration unit 101.

[0044] The grinding device is further provided with a protection unit, which can be composed of a metal material or a composite material. The protection unit surrounds the vibration unit 101 and can prevent the vibration generated by the vibration unit 101 from being transmitted to the outside, attenuate the vibration, and ensure the stability of the processing. At this time, the protection unit can also block noise and prevent the splashing of cooling liquid.

[0045] Optionally, with reference to the above Figure 1 and Figure 2 , the grinding device further comprises a temperature acquisition unit (not shown in the figure), which is electrically connected with the control unit. The temperature acquisition unit is used to acquire the temperature value of the vibration unit 101 in real time; and the control unit is used to output a cooling start signal according to the temperature value.

[0046] Optionally, the grinding device can be provided with a temperature acquisition unit, which can acquire the temperature value of the vibration unit 101 in real time and transmit it to the control unit. The control unit can output a cooling start signal according to the temperature value, thereby ensuring the cooling effect of the water cooling unit 103 and avoiding the temperature value of the vibration unit 101 exceeding the temperature threshold, which affects the processing effect. The control unit can also directly output a power-off signal to stop the grinding device from continuing to run when the temperature value exceeds the temperature threshold, thereby avoiding overheating and affecting the performance of the grinding device.

[0047] Optionally, the workpiece to be processed 10 includes a silicon wafer or a silicon carbide wafer. The processing efficiency of hard and brittle materials such as silicon wafers or silicon carbide wafers is low and the processing effect is poor in the prior art. The grinding device of the embodiment of the present application can process hard and brittle materials such as silicon wafers or silicon carbide wafers efficiently, is simple to operate, has strong adaptability, and ensures the processing stability.

[0048] Optionally, the preset rotating speed is 1500-4000 rpm. When the workpiece to be processed 10 is a silicon wafer, the preset rotating speed of the main shaft 1021 can be 2000-4000 rpm; and when the workpiece to be processed 10 is a silicon carbide wafer, the preset rotating speed of the main shaft 1021 can be 1500-4000 rpm. According to the type of the workpiece to be processed 10, the main shaft 1021 can drive the grinding assembly 1022 at the preset rotating speed to meet the processing requirements.

[0049] Optionally, the frequency of the high-frequency vibration signal is 20-50 kHz, and the preset amplitude is 2-6 pm. When the workpiece to be processed 10 is a silicon wafer, the frequency of the high-frequency vibration signal is 20-30 kHz, and the preset amplitude is 2-5 pm; when the workpiece to be processed 10 is a silicon carbide wafer, the frequency of the high-frequency vibration signal is 30-40 kHz, and the preset amplitude is 3-6 pm; according to the type of the workpiece to be processed 10, the vibration frequency and amplitude of the vibration unit 101 are selected correspondingly, thereby ensuring the processing effect of the workpiece to be processed 10.

[0050] The foregoing detailed description has set forth various embodiments of the application via specific examples. However, it is noted that various modifications, combinations, sub-combinations, and equivalents can be employed, and will be apparent to one skilled in the art in view of this disclosure. Accordingly, the particular description set forth is not intended to be limiting to the scope of the application, as described in the claims below.

Claims

1. A grinding device, characterized by, The grinding device comprises a vibration unit, a grinding unit, a control unit, a water cooling unit and a vibration isolation unit; the control unit is electrically connected with the vibration unit, the grinding unit and the water cooling unit respectively; The vibration unit is used for receiving a vibration starting signal output by the control unit, generating a high-frequency electric signal according to the vibration starting signal and converting the high-frequency electric signal into a high-frequency vibration signal; The grinding unit comprises a main shaft and a grinding assembly; the main shaft is rigidly connected with the grinding assembly; the main shaft receives a rotating signal output by the control unit and drives the grinding assembly to rotate at a preset rotating speed; meanwhile, the grinding assembly receives the high-frequency vibration signal to perform axial high-frequency vibration at a preset amplitude, so as to grind a workpiece to be processed; The water cooling unit is arranged in an axial middle region of the vibration unit; the water cooling unit is used for receiving a cooling starting signal output by the control unit and cooling the vibration unit according to the cooling starting signal; The vibration isolation unit is arranged between the water cooling unit and an external machine body of the grinding device; the vibration isolation unit is arranged in an axial end region of the vibration unit; the vibration isolation unit is used for isolating the high-frequency vibration signal from being transmitted to the external machine body. The vibration unit comprises an ultrasonic generator, a transducer, an amplitude transformer and at least two connecting interfaces; the ultrasonic generator is electrically connected with the transducer; the transducer is connected with the amplitude transformer through the connecting interfaces; the amplitude transformer is connected with the grinding assembly through the connecting interfaces; 2. The grinding device of claim 1, wherein The ultrasonic generator is used for generating a high-frequency electric signal according to the vibration starting signal; The transducer is used for converting the high-frequency electric signal into a high-frequency vibration signal; The amplitude transformer is used for amplifying the high-frequency vibration signal to generate a high-frequency vibration amplified signal and transmitting the high-frequency vibration amplified signal to the grinding assembly. The connecting interfaces are threaded connecting interfaces, tapered connecting interfaces or flange connecting interfaces.

3. The grinding device of claim 2, wherein The water cooling unit comprises a water cooling sleeve, a sealing structure and a cooling liquid circulation structure; 4. The grinding device of claim 1, wherein The water cooling sleeve is arranged in the axial middle region of the vibration unit; a cooling channel is formed between an inner circumferential surface of the water cooling sleeve and an outer circumferential surface of the vibration unit; The sealing structure is arranged at both ends of the water cooling sleeve and is used for sealing and isolating the cooling channel; The cooling liquid circulation structure is in communication with an inlet end and an outlet end of the cooling channel respectively and is used for supplying and recycling cooling liquid. The vibration isolation unit comprises an elastic structure; the elastic structure is arranged in the axial end region of the vibration unit and is connected with the external machine body.

5. The grinding device of claim 1, wherein The grinding device further comprises a protection unit; the protection unit surrounds the vibration unit.

6. The grinding device of claim 1, wherein The grinding device further comprises a temperature acquisition unit; the temperature acquisition unit is electrically connected with the control unit; the temperature acquisition unit is used for acquiring a temperature value of the vibration unit in real time; 7. The grinding device of claim 1, wherein The control unit is used for outputting a cooling starting signal according to the temperature value. The preset rotating speed is 1500-4000 rpm.

8. The grinding device of claim 1, wherein, The frequency of the high-frequency vibration signal is 20-50 kHz; the preset amplitude is 2-6 μm.

9. The grinding device of claim 1, wherein, The workpiece to be processed comprises a silicon wafer or a silicon carbide wafer.

10. The grinding device of claim 1, wherein, ​

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