Cleaning device used before opening of front open type wafer box
By creating a sealed space before opening the front-opening wafer cassette and using clean gas to remove impurities, the problem of impurity contamination during wafer cassette opening is solved, improving wafer cleanliness and yield.
Patent Information
- Application Number
- CN202511801912.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-02
- Publication Date
- 2026-01-23
AI Technical Summary
When a front-opening wafer cell is opened, the influx of gas from the external environment can bring impurities into the cell, contaminating the wafer and causing defects such as metal damage.
A cleaning device for a front-opening wafer cassette is designed. A cleaning component forms a sealed space between the cassette cover and the wafer cassette, clean gas is used to remove impurities, and excess gas is discharged when the cassette cover is separated to ensure internal cleanliness.
It effectively reduces impurities entering the wafer cassette, improves wafer cleanliness and yield, avoids subsequent contamination, and ensures wafer processing quality.
Smart Images
Figure CN121372997A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of semiconductor, and particularly relates to a cleaning device for a front opening unified pod before opening. BACKGROUND
[0002] The front opening unified pod is a container used for protecting, transporting and storing wafers in a semiconductor process, can accommodate 25 pieces of 300mm wafers, and is an important transmission container of an automatic transmission system in a 12-inch (300mm) wafer factory.
[0003] In the semiconductor manufacturing process, different manufacturing steps need to transport wafers to different areas for processing. In the process of storing wafers into the front opening unified pod for transportation, the low-cleanliness area will be passed through. When the front opening unified pod passes through the low-cleanliness area, the outer wall will be contaminated with impurities (dust particles). When the front opening unified pod reaches and stays on the loading platform of the processing area, the moment the front opening unified pod cover is opened, a large amount of gas in the external environment will rush into the front opening unified pod, causing the gas in the external environment to carry impurities into the front opening unified pod, affecting the internal environment, thereby polluting the wafers stored in the front opening unified pod, causing the wafers to have defects (mainly metal damage), and disturbing the back-end process. For this problem, how to design a cleaning device for the front opening unified pod before opening becomes a problem we need to solve at present. SUMMARY
[0004] The purpose of the application is to solve the problems in the prior art and provide a cleaning device for a front opening unified pod before opening.
[0005] To achieve the above purpose, the application provides a cleaning device for a front opening unified pod before opening, which comprises a loading device, the top of the loading device is provided with a front opening unified pod, the inside of the front opening unified pod is inserted with a cover, the outer wall of the loading device is fixedly provided with a mounting piece, the mounting piece is arranged on one side of the cover, the inside of the mounting piece is fixedly provided with an electric push rod and a filter element, one end of the filter element is fixedly connected with a gas supply pipe; a cleaning assembly, the cleaning assembly is used for cleaning and splitting the front opening unified pod and the cover, and the cleaning assembly is connected with the mounting piece, the electric push rod and the filter element.
[0006] In the above technical solution, further, the cleaning assembly comprises a sealing element fixedly connected to one end of the electric push rod, the sealing element is fixedly installed on the outer wall of the end of the filter element, the sealing element is slidably connected in the inside of the mounting piece, the inner wall of the sealing element is provided with a shunt groove, and the inside of the sealing element is fixedly provided with a porous metal piece.
[0007] In the above technical scheme, further, the inside of the porous metal piece is fixedly connected with a connecting pipe, the inside of the connecting pipe is fixedly installed with a spring, one end of the spring is fixedly installed with a porous metal block, the side away from the spring of the porous metal block is fixedly installed with a sealing sheet, and the porous metal block and the sealing sheet are slidingly connected in the inside of the connecting pipe.
[0008] In the above technical scheme, further, the end away from the filter core of the connecting pipe is fixedly connected with a plurality of connecting sheets, the outer wall of one of the connecting sheets is provided with a weakening groove, the outer wall of the connecting sheet is fixedly connected with a round clamping block, and the outer wall of the exhaust port of the sealing piece is fixedly installed with a particle detector.
[0009] In the above technical scheme, further, the side close to the sealing piece of the box cover is fixedly connected with a sleeve, the inside of the sleeve is provided with a first clamping groove matched with the round clamping block, the inside of the box cover is slidingly connected with a connecting piece, the inside of the connecting piece is rotatably connected with a plurality of connecting rods, the end away from the connecting piece of the plurality of connecting rods is rotatably connected with a sliding piece, one end of the sliding piece is fixedly connected with a spring piece, and the spring piece is fixedly installed in the inside of the box cover.
[0010] In the above technical scheme, further, the sliding piece is slidingly connected in the inside of the box cover, the end away from the spring piece of the sliding piece is fixedly connected with a triangular clamping block, the inside of the FOUP is provided with a second clamping groove, the triangular clamping block is inserted in the inside of the second clamping groove, the side away from the sealing piece of the box cover is provided with an exhaust groove, and the sliding piece is arranged on one side of the exhaust groove.
[0011] Compared with the prior art, the present application has the following beneficial effects: By setting the cleaning assembly, when the FOUP is not opened, a sealed space is formed with the box cover and the FOUP, and the impurities in the sealed space are cleaned, thereby reducing the number of impurities on the outer wall of the FOUP and the box cover and nearby, avoiding the impurities entering the inside of the loading equipment when the box cover is taken down subsequently, and ensuring the cleanliness of the wafers and improving the yield rate of the wafers after processing. By setting the cleaning assembly, when the FOUP is opened, clean gas is filled in the inside of the FOUP, the space generated when the FOUP is separated from the box cover is filled, and the excess clean gas is discharged through the gap generated when the FOUP is separated from the box cover, thereby avoiding the gas in the external environment entering the inside of the FOUP, further reducing the pollution suffered by the wafers in the inside of the FOUP, ensuring the cleanliness of the wafers, and improving the yield rate of the wafers after processing. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 The overall structure schematic diagram of the present application is provided. Figure 2The overall structure sectional view of the present application; Figure 3 The sealing member structure sectional view of the present application; Figure 4 The box cover structure sectional view of the present application; Figure 5 The cleaning assembly structure sectional view of the present application; Figure 6 The Figure 5 A part structure enlarged view of the present application.
[0013] In the figure: 1, loading equipment; 2, front opening wafer box; 3, box cover; 4, mounting member; 5, electric push rod; 6, filter element; 7, air supply pipe; 8, sealing member; 9, shunt groove; 10, porous metal member; 11, connecting pipe; 12, spring; 13, porous metal block; 14, sealing sheet; 15, connecting sheet; 16, weakened groove; 17, round clamping block; 18, particle detector; 19, sleeve; 20, first clamping groove; 21, connecting member; 22, connecting rod; 23, sliding member; 24, elastic sheet member; 25, triangular clamping block; 26, second clamping groove; 27, exhaust groove. DETAILED DESCRIPTION
[0014] In order to enable the above-mentioned objects, features and advantages of the present application to be more clearly understood, the present application will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0015] As Figures 1-2 shown in a kind of front opening wafer box clean device before opening, including loading equipment 1, the top of loading equipment 1 is provided with front opening wafer box 2, the inside of front opening wafer box 2 is inserted with box cover 3, loading equipment 1 outer wall is fixed sliding installation with mounting member 4, mounting member 4 is arranged at one side of box cover 3, electric push rod 5 and filter element 6 are fixedly installed in the inside of mounting member 4, one end of filter element 6 is fixedly connected with air supply pipe 7;Cleaning assembly, cleaning assembly is used to clean and split front opening wafer box 2 and box cover 3, cleaning assembly is connected with mounting member 4, electric push rod 5 and filter element 6, all the clean device materials that contact with front opening wafer box 2 are high-cleanliness materials, reduce the production and adhesion of dust particles, satisfy the high-cleanliness requirement of semiconductor manufacturing.
[0016] As Figure 3 , Figure 5 and Figure 6As shown, the cleaning assembly includes a sealing piece 8 fixedly connected at one end of the electric push rod 5, the sealing piece 8 is fixedly installed on the outer wall of the end of the filter core 6, the sealing piece 8 is slidingly connected in the inside of the mounting piece 4, the inner wall of the sealing piece 8 is provided with a shunt groove 9, through the arrangement of the shunt groove 9, the clean gas is guided and separated, and can enter the inside of the porous metal piece 10 from different positions, the distribution range of the clean gas is improved, the porous metal piece 10 is fixedly installed in the inside of the sealing piece 8, the connecting pipe 11 is fixedly connected in the inside of the porous metal piece 10, the spring 12 is fixedly installed in the inside of the connecting pipe 11, the porous metal block 13 is fixedly installed at one end of the spring 12, a large number of directional holes are dispersedly distributed in the inside of the porous metal piece 10 and the porous metal block 13, when the gas passes through, the impurities in the gas can be adsorbed, and the distribution of the passing gas is more uniform, the cleaning effect on the impurities is ensured, the impurities in the dead angle cannot be removed, the subsequent wafer is polluted, the sealing sheet 14 is fixedly installed on the side of the porous metal block 13 away from the spring 12, the porous metal block 13 and the sealing sheet 14 are slidingly connected in the inside of the connecting pipe 11, the connecting piece 15 is fixedly connected at the end of the connecting pipe 11 away from the filter core 6, the outer wall of one of the connecting pieces 15 is provided with a weakening groove 16, and the outer wall of the connecting piece 15 is fixedly connected with a round clamping block 17, and the outer wall of the exhaust port of the sealing piece 8 is fixedly installed with a particle detector 18.
[0017] As shown in the figure, Figures 3-6 As shown, the box cover 3 is fixedly connected with a sleeve 19 on the side close to the sealing piece 8, the sleeve 19 is provided with a first clamping groove 20 matched with the round clamping block 17 in the inside, the inside of the box cover 3 is slidingly connected with a connecting piece 21, a plurality of connecting rods 22 are rotatably connected in the inside of the connecting piece 21, one end of each of the plurality of connecting rods 22 is rotatably connected with a sliding piece 23, one end of the sliding piece 23 is fixedly connected with a spring piece 24, through the arrangement of the spring piece 24, after the connecting piece 21 loses the extrusion, the sliding piece 23 is pushed to reset, the sliding piece 23 reseals the exhaust groove 27 and drives the triangular clamping block 25 to reset, the sliding piece 23 drives the connecting piece 21 to reset through the connecting rod 23, the spring piece 24 is fixedly installed in the inside of the box cover 3, the sliding piece 23 is slidingly connected in the inside of the box cover 3, one end of the sliding piece 23 away from the spring piece 24 is fixedly connected with a triangular clamping block 25, the inside of the front opening wafer box 2 is provided with a second clamping groove 26, the triangular clamping block 25 is inserted in the inside of the second clamping groove 26, the box cover 3 is provided with an exhaust groove 27 on the side away from the sealing piece 8, and the sliding piece 23 is arranged on one side of the exhaust groove 27.
[0018] Working principle: After the front opening wafer box 2 is fixed on the loading platform of the loading device 1, the loading device 1 controls the electric push rod 5 to push the sealing element 8 to slide along the inside of the mounting element 4 until the sealing element 8 stops after the porous metal element 10 is sleeved on the outer wall of the front opening wafer box 2 in the opening direction. At this time, the porous metal element 10, the box cover 3 and the front opening wafer box 2 form a sealed space. The loading device 1 can control the gas supply pipe 7 to provide clean gas to the inside of the filter element 6, so that the clean gas flows into the inside of the sealing element 8 after being filtered by the filter element 6, and flows along the shunt groove 9 opened on the sealing element 8 until the shunt groove 9 is filled with clean gas. The clean gas will be discharged into the sealed space through the porous metal element 10, blow away the impurities accumulated in the sealed space, on the outer wall of the box cover 3 and the outer wall of the front opening wafer box 2 in the opening direction, and discharged into the particle detector 18 through the exhaust port of the sealing element 8. The particle detector 18 detects the gas, until the cleanliness of the gas detected by the particle detector 18 meets the requirements, so as to achieve the effect of removing impurities by gas, reduce the number of impurities on the outer wall of the front opening wafer box 2 and the box cover 3 and nearby, avoid the situation that the impurities enter the inside of the loading device 1 when the box cover 3 is taken out later, pollute the wafers, ensure the cleanliness of the wafers, and improve the yield of the wafers after processing; When the gas cleanliness detected by the particle detector 18 reaches the requirement, the particle detector 18 sends a signal to the loading device 1, so that the loading device 1 controls the electric push rod 5 to continue to extend to the end of the stroke and retract, so that the sealing piece 8 drives the porous metal piece 10 to continue to approach the loading device 1, so that the formed sealing space is continuously reduced, so that the connecting pipe 11 is inserted into the sleeve 19, the connecting piece 15 abuts against the connecting piece 21, at this time, the sealing piece 8 continues to approach the loading device 1, so that the connecting piece 21 is extruded, the connecting piece 21 slides along the inside of the box cover 3 to the end, the round clamping block 17 on the connecting piece 15 is clamped into the first clamping groove 20 in the sleeve 19, at this time, the electric push rod 5 extends to the end of the stroke and stops continuing to extend, the porous metal piece 10 abuts against the box cover 3, and the formed sealing space disappears, so that the clean gas can only flow along the inside of the porous metal piece 10 for a long distance and be discharged through the exhaust port of the sealing piece 8, which reduces the discharge speed of the clean gas, increases the pressure of the clean gas between the sealing piece 8 and the porous metal piece 10, so that the clean gas begins to push the porous metal block 13 and the sealing piece 14 to slide along the inside of the connecting pipe 11 and stretch the spring 12, until the porous metal block 13 and the sealing piece 14 move to the connecting piece 21 between the multiple connecting pieces 15 and abut against the connecting piece 15, and then stop, at this time, the clean gas can be discharged through the interval space between the porous metal block 13 and the multiple connecting pieces 15, so that the clean gas enters the inside of the box cover 3, and the connecting piece 21 is extruded and drives the sliding piece 23 to slide along the inside of the box cover 3 through the connecting rod 22, so that the sliding piece 23 extrudes the spring piece 24 to deform, so that the sliding piece 23 drives the triangular clamping block 25 to be separated from the inside of the second clamping groove 26, stops the clamping and fixing between the box cover 3 and the front opening wafer box 2, and stops the sliding piece 23 from blocking the exhaust groove 27, when the blocking and sealing of the exhaust groove 27 is cancelled, the clean gas discharged into the inside of the box cover 3 will be discharged into the inside of the front opening wafer box 2 through the exhaust groove 27; It should be noted that after the porous metal block 13 and the sealing sheet 14 slide between the plurality of connecting sheets 15, the porous metal block 13 and the sealing sheet 14 support and fix the connecting sheet 15 provided with the weakening groove 16, so that the connecting sheet 15 is fixed and limited by the clamping of the round clamping block 17 and the first clamping groove 20 on the sleeve 19. At this time, the retraction of the electric push rod 5 will drive the porous metal piece 10 to reset through the sealing element 8, so that the porous metal piece 10 drives the connecting sheet 15 to reset through the connecting pipe 11, so that the round clamping block 17 on the connecting sheet 15 pulls the box cover 3 and the front opening wafer box 2 apart through the first clamping groove 20 on the sleeve 19, so as to achieve the effect of disassembling the box cover 3 and opening the seal of the front opening wafer box 2. In this process, the clean gas discharged through the exhaust groove 27 will continuously enter the inside of the front opening wafer box 2, so that the clean gas in the inside of the front opening wafer box 2 increases, fills the space generated when the front opening wafer box 2 and the box cover 3 are separated, and discharges the excess clean gas through the gap generated when the front opening wafer box 2 and the box cover 3 are separated, so as to avoid the gas in the external environment from entering the inside of the front opening wafer box 2, further reduce the pollution of the wafer in the inside of the front opening wafer box 2, ensure the cleanliness of the wafer, improve the yield of the wafer after processing, and finally, after the front opening wafer box 2 and the box cover 3 are separated, the loading device 1 controls the air supply pipe 7 to stop providing clean gas to the inside of the filter element 6, so that the porous metal block 13 and the sealing sheet 14 lose the driving force, and then the spring 12 drives the porous metal block 13 and the sealing sheet 14 to reset and stop limiting between the plurality of connecting sheets 15, so that the connecting sheet 15 provided with the weakening groove 16 can be easily deformed and cannot drive the box cover 3 to continue moving through the round clamping block 17 and the first clamping groove 20, so that the sleeve 19 on the box cover 3 is separated from the connecting pipe 11.
[0019] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.
Claims
1. A cleaning device for front opening wafer pods before opening, comprising a loading device (1), characterized in that, The top of the loading device (1) is provided with a front opening wafer box (2), the inside of the front opening wafer box (2) is inserted with a box cover (3), the outer wall of the loading device (1) is fixedly connected with a mounting piece (4), the mounting piece (4) is arranged on one side of the box cover (3), the inside of the mounting piece (4) is fixedly connected with an electric push rod (5) and a filter core (6), one end of the filter core (6) is fixedly connected with a gas supply pipe (7); A cleaning assembly is arranged for cleaning and separating the front opening wafer box (2) and the box cover (3), and the cleaning assembly is connected with the mounting piece (4), the electric push rod (5) and the filter core (6).
2. The cleaning apparatus for a front opening wafer cassette before opening according to claim 1, wherein The cleaning assembly comprises a sealing piece (8) fixedly connected to one end of the electric push rod (5), the sealing piece (8) is fixedly connected to the outer wall of the end of the filter core (6), the sealing piece (8) is slidably connected to the inside of the mounting piece (4), the inner wall of the sealing piece (8) is provided with a shunt groove (9), and the inside of the sealing piece (8) is fixedly connected with a porous metal piece (10).
3. The cleaning apparatus before opening a front opening wafer cassette according to claim 2, wherein The inside of the porous metal piece (10) is fixedly connected with a connecting pipe (11), the inside of the connecting pipe (11) is fixedly connected with a spring (12), one end of the spring (12) is fixedly connected with a porous metal block (13), the side, away from the spring (12), of the porous metal block (13) is fixedly connected with a sealing sheet (14), and the porous metal block (13) and the sealing sheet (14) are slidably connected to the inside of the connecting pipe (11).
4. The cleaning apparatus before opening of a front opening wafer cassette according to claim 3, wherein The end, away from the filter core (6), of the connecting pipe (11) is fixedly connected with a plurality of connecting sheets (15), the outer wall of one of the connecting sheets (15) is provided with a weakening groove (16), and the outer wall of the connecting sheet (15) is fixedly connected with a round clamping block (17), and the outer wall of the air outlet of the sealing piece (8) is fixedly connected with a particle detector (18).
5. The cleaning apparatus for a front opening wafer cassette before opening according to claim 1, wherein The side, close to the sealing piece (8), of the box cover (3) is fixedly connected with a sleeve (19), the inside of the sleeve (19) is provided with a first clamping groove (20) matched with the round clamping block (17), the inside of the box cover (3) is slidably connected with a connecting piece (21), the inside of the connecting piece (21) is rotatably connected with a plurality of connecting rods (22), the end, away from the connecting piece (21), of the plurality of connecting rods (22) is rotatably connected with a sliding piece (23), one end of the sliding piece (23) is fixedly connected with a spring sheet (24), and the spring sheet (24) is fixedly connected to the inside of the box cover (3).
6. The cleaning apparatus before opening a front opening wafer cassette according to claim 5, wherein The sliding piece (23) is slidably connected to the inside of the box cover (3), the end, away from the spring sheet (24), of the sliding piece (23) is fixedly connected with a triangular clamping block (25), the inside of the front opening wafer box (2) is provided with a second clamping groove (26), the triangular clamping block (25) is inserted into the second clamping groove (26), the side, away from the sealing piece (8), of the box cover (3) is provided with an air exhaust groove (27), and the sliding piece (23) is arranged on one side of the air exhaust groove (27).