A debugging device and a debugging method for an optical assembly of a wafer defect detection machine

Abstract

This invention discloses a debugging device and method for optical components of a wafer defect inspection machine. The debugging device includes a platform body, a positioning reference component, a suction cup, a height adjustment component, a mounting bracket, and an auxiliary debugging interface. The platform body is made of natural marble, and its upper surface forms the mounting reference plane for the optical components. The positioning reference component is located on the upper surface of the platform body and has positioning pin holes machined according to the actual mounting coordinates of the optical components of the defect inspection machine. The suction cup is arranged above the platform body to support the wafers used for debugging. The height adjustment component is installed at the bottom of the suction cup. The mounting bracket engages with threaded holes on the platform body via fasteners. The auxiliary debugging interface is located on the side of the platform body. This invention achieves offline debugging of the optical components through a debugging environment independent of the entire machine, allowing optical debugging and motion platform assembly to be performed in parallel, significantly shortening the equipment assembly cycle, and improving debugging accuracy and safety.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor inspection equipment technology, and is mainly applied to the defect detection stage in wafer manufacturing. It relates to optical system debugging and calibration technology, specifically a debugging device and method for optical components of a wafer defect inspection machine. This device and method aim to provide a precise debugging environment for the optical components, independent of the entire machine, enabling offline calibration and performance verification of optical parameters, thereby ensuring the imaging quality and detection accuracy of the defect detection system. Background Technology

[0002] In semiconductor wafer manufacturing, defect detection is a crucial step in ensuring chip yield. Wafer defect inspection equipment uses its optical system to acquire high-resolution images of the wafer surface, providing data support for defect identification algorithms. As the core component of the inspection equipment, the accuracy of the optical components directly determines the reliability of the inspection results. Currently, the optical component adjustment methods commonly used in the industry have significant technical limitations.

[0003] The current mainstream optical component debugging adopts a "dependent" operation mode, meaning that the installation and debugging of optical components can only proceed after the motion platform of the testing equipment has completed assembly and calibration. As the core mechanism for achieving precise wafer positioning, the assembly of the motion platform involves multiple stages, including mechanical installation, electrical connections, and basic calibration, typically accounting for 30%-40% of the overall assembly cycle. This sequential operation mode means that optical component debugging must wait for the motion platform to be ready before it can begin, preventing critical processes from being carried out in parallel and significantly extending the overall equipment assembly cycle. Practical applications show that this mode can increase project cycles by 15%-20%, severely impacting delivery efficiency in situations with urgent semiconductor equipment needs.

[0004] Furthermore, optical calibration on a motion platform presents numerous technical challenges. When issues such as mounting misalignment or optical path interference are discovered in optical components, it is necessary to disassemble the relevant parts on the motion platform for adjustment. This not only increases rework costs but may also have a secondary impact on the accuracy of the already calibrated motion platform. At the same time, vibration interference and space constraints in the overall machine environment also pose challenges to precision optical calibration, making it difficult to guarantee calibration accuracy and resulting in poor parameter reproducibility.

[0005] Therefore, developing a dedicated device that can independently complete the debugging of optical components without the motion platform, thereby realizing the pre-processing and parallelization of the debugging process, is of great significance for improving the production efficiency and debugging quality of wafer defect inspection equipment. Summary of the Invention

[0006] The present invention aims to provide a debugging device and debugging method for optical components of wafer defect inspection equipment, which solves the problems in the prior art, such as long debugging cycle and low efficiency caused by the fact that the optical components can only be debugged after the whole machine is assembled, low debugging accuracy and difficulty in reproduction caused by the complex environment of the whole machine and large vibration interference, and the fact that the debugging parameters cannot be directly transferred to the machine for use, resulting in the need for secondary calibration after on-site installation.

[0007] The first objective of this invention is to provide a debugging device for the optical components of a wafer defect inspection machine, comprising:

[0008] The main body of the platform is made of natural marble. Its external dimensions match the actual dimensions of the optical component installation area inside the defect detection machine. The upper surface is precision ground to form the mounting reference plane for the optical components.

[0009] The positioning reference component is set on the upper surface of the platform body. Positioning pin holes are machined according to the actual installation coordinates of the optical components of the defect detection machine. The positioning pin holes are used to accommodate positioning pins to achieve precise positioning of the optical components.

[0010] Suction cups, positioned above the main platform, are used to support wafers for debugging.

[0011] A height adjustment component, installed at the bottom of the suction cup, includes a linear motor and is used to adjust the height of the suction cup to adapt to the imaging distance requirements of different optical components;

[0012] The mounting bracket, through fasteners engaging with threaded holes on the platform body, is used to fix the optical components to the platform body and ensure that the installation position and angle of the optical components are consistent with the actual installation state of the defect detection machine.

[0013] The auxiliary debugging interface, located on the side of the platform body, includes a power interface and a data transmission interface. It is used to connect the control module of the optical components to external debugging equipment to realize real-time monitoring and adjustment of optical parameters during the debugging process.

[0014] Optical components, including image sensors, lens modules, and light source modules, are used to simulate imaging detection of wafer defects during the debugging process. By simulating the optical installation environment of the wafer defect detection machine, the debugging of optical components can be carried out simultaneously with the motion platform assembly stage.

[0015] The optical components are connected to the mounting bracket via a connecting plate. The connecting plate has elongated holes, allowing for fine-tuning of the optical components' position. If a compatibility issue is found with the optical components, the mounting bracket can be replaced or the mounting position adjusted directly without disassembling the assembled motion platform.

[0016] The debugging work is carried out in a stable environment independent of the motion platform, avoiding any interference or damage to the precision motion platform.

[0017] Furthermore, the suction cup is a zoned controllable vacuum suction cup, and the device also includes:

[0018] Pressure sensor arrays, integrated into the adsorption surface or internal flow channels of the chuck, are used to monitor the adsorption pressure or contact status in different areas of the wafer.

[0019] The deformation monitoring module is used to acquire surface morphology information of the wafer after it is adsorbed. The deformation monitoring module is a vision measurement unit set on the optical component. It indirectly calculates the deformation of the wafer by analyzing the imaging distortion of the standard planar target placed on the chuck.

[0020] The suction cup controller is connected to the pressure sensor array, the deformation monitoring module, and the partitioned controllable vacuum suction cup. Based on the signals from the pressure sensor array and / or the morphology information obtained by the deformation monitoring module, the suction cup controller dynamically adjusts the vacuum pressure in different areas of the suction cup to correct the adsorption deformation of the wafer and make its surface tend to be flat.

[0021] Furthermore, the device also includes:

[0022] A multi-degree-of-freedom micro-motion detection sensor network is deployed on the main body of the platform to monitor the micron-level displacement and attitude changes of the optical components being debugged in space in real time. The multi-degree-of-freedom micro-motion detection sensor network includes multiple non-contact displacement sensors, with the detection end of the non-contact displacement sensor facing the preset reference surface of the optical component or its mounting structure. The non-contact displacement sensor is one or more of the following: laser displacement sensor, capacitive displacement sensor, or eddy current displacement sensor.

[0023] The system controller communicates with the multi-degree-of-freedom micro-motion detection sensor network and optical components;

[0024] The system controller receives monitoring data from the sensor network and performs correlation analysis with the image quality data acquired by the optical components to evaluate the dynamic stability of the optical components under simulated operating conditions.

[0025] Furthermore, the device also includes a dynamic vibration suppression system, which includes a vibration sensor mounted on the platform body or frame for real-time vibration detection.

[0026] The active actuator is located between the platform body and the supporting foundation; the active actuator is an inertial actuator or an air spring.

[0027] The vibration controller is electrically connected to the vibration sensor and the active actuator.

[0028] The vibration controller drives the active actuator to generate an anti-phase canceling force or displacement based on the vibration signal detected by the vibration sensor, so as to actively suppress the vibration transmitted to the platform body.

[0029] The second objective of this invention is to provide a debugging method for the debugging device of the optical components of the aforementioned wafer defect inspection machine, comprising the following steps:

[0030] S1 device reference calibration: Adjust the height of the chuck to position the wafer at the optimal imaging height of the optical components;

[0031] S2 Optical Component Installation: The optical component to be debugged is positioned using the positioning pin holes and then fixed to the platform body using mounting brackets and fasteners.

[0032] S3 debugging equipment connection: Connect the control module of the optical components to the debugging equipment through the auxiliary debugging interface;

[0033] S4 Parameter Adjustment and Calibration: Perform parameter adjustment of optical components in a simulated installation environment, including focal length calibration, optical path coaxiality adjustment, and light source parameter adaptation;

[0034] S5 Debugging Data Recording and Migration: Record the optical component parameters after debugging is completed, and directly migrate the debugged components and their parameters to the defect detection machine for use.

[0035] Furthermore, in step S1 device reference calibration, before or after adjusting the chuck height, a step S1a wafer flatness calibration is also included; step S1a includes:

[0036] The wafer or test target is adsorbed onto the suction cup, and its surface morphology information is obtained through the deformation monitoring module to determine whether its flatness meets the requirements. If the flatness does not meet the requirements, the vacuum pressure in different areas of the suction cup is dynamically adjusted by the suction cup controller to correct the deformation of the wafer or test target until its surface flatness reaches the preset standard.

[0037] Furthermore, after completing the parameter debugging and calibration in step S4, a dynamic stability evaluation step S4a is also included: under the condition that the optical component parameters remain unchanged, the first data of the optical component pose change is collected through a multi-degree-of-freedom micro-motion detection sensor network, and the second data of its imaging quality is collected at the same time; the first data and the second data are correlated and analyzed, and if the micro-motion of the optical component causes the image quality to deteriorate beyond the allowable threshold, it is determined that its dynamic stability is insufficient.

[0038] Compared with the prior art, the debugging device and debugging method for optical components of wafer defect inspection equipment provided by the present invention have the following significant technical effects:

[0039] (1) Parallelization of processes significantly improves production efficiency. By simulating the optical installation environment of the wafer defect inspection machine, the debugging of optical components can be carried out synchronously during the motion platform assembly stage. The two key processes that are executed serially in the traditional operation mode are transformed into parallel processes, which shortens the waiting time for the whole machine assembly, improves the production delivery efficiency, and optimizes the allocation and utilization of production resources.

[0040] (2) Improve the safety and operational flexibility of the debugging process. The debugging work is carried out in a stable environment independent of the motion platform, avoiding possible interference or damage to the precision motion platform. When compatibility issues are found with optical components, the bracket can be replaced or the installation position adjusted directly without disassembling the already assembled motion platform. This not only reduces the difficulty of operation, but also reduces the time cost and quality risks caused by rework.

[0041] (3) Ensure consistency of debugging accuracy and equipment versatility. The thermal stability and flatness of natural marble provide a reliable reference plane for optical debugging. The machining accuracy of the positioning reference components is completely consistent with the actual installation requirements of the machine tool, ensuring that the debugging parameters can be directly transferred and used, avoiding errors caused by secondary calibration. Through modular design, this device can be flexibly adapted to different models of wafer defect inspection machines, improving the versatility and usability of the equipment and reducing equipment investment costs. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a structural diagram of the debugging device according to an embodiment of the present invention;

[0044] Figure 2 This is a front view of the debugging device according to an embodiment of the present invention;

[0045] Figure 3 This is a side view of the debugging device according to an embodiment of the present invention;

[0046] Figure 4 This is a top view of the debugging device according to an embodiment of the present invention;

[0047] Figure 5 This is a flowchart of the debugging method according to an embodiment of the present invention;

[0048] Figure 6 This is a flowchart detailing the parameter debugging and calibration steps in the debugging method of this invention.

[0049] Explanation of reference numerals in the attached drawings: 1-Frame; 2-Shock damping pad; 3-Linear motor; 4-Wafer; 5-Optical-mechanical assembly; 6-Auxiliary debugging interface; 7-Suction cup; 8-Platform body; 9-Mounting bracket; 10-Connecting plate. Detailed Implementation

[0050] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid obscuring the invention.

[0051] To fully understand this invention, detailed steps and structures will be presented in the following description to illustrate the technical solution of this invention. Preferred embodiments of the invention are described in detail below; however, in addition to these detailed descriptions, the invention may have other embodiments.

[0052] Example 1

[0053] Please refer to the following: Figure 1 and Figure 4 The present invention relates to a debugging device for optical components of a wafer defect inspection machine, comprising a platform body 8, a positioning reference component, a suction cup 7, a height adjustment component, a mounting bracket 9, an auxiliary debugging interface 6, and an optical component 5 to be debugged. Through the high-precision marble platform body 8, the precise positioning reference component, the precisely adjustable suction cup 7 system, and the comprehensive auxiliary debugging interface 6, an offline debugging platform that highly simulates the internal environment of a real wafer defect inspection machine has been successfully constructed.

[0054] The platform body 8 is the cornerstone of the entire device. This invention is made of high-density, low-porosity natural marble with an extremely low coefficient of thermal expansion. This material possesses excellent long-term dimensional stability, corrosion resistance, and vibration damping characteristics, effectively resisting the effects of environmental temperature fluctuations and providing an extremely stable reference plane for optical debugging. The external dimensions of the platform body 8, including length, width, and height, have been precisely measured and designed to perfectly match the actual spatial dimensions of the area inside the target defect detection machine used to install optical components, ensuring that the spatial constraints during debugging are consistent with real-world working conditions. The upper surface of the platform body 8 is ground using a high-precision gantry mill to create an ultra-high-precision installation reference plane, providing a geometric reference for the subsequent positioning and installation of components.

[0055] The positioning reference component is set on the upper surface of the platform body 8. According to the optical component installation drawings of the target defect detection machine, a number of positioning pin holes are machined on the platform body 8 using a high-precision CNC machining center. The coordinate position, diameter, and depth tolerance of these positioning pin holes are strictly controlled to ensure that they are completely consistent with the mounting holes on the actual machine. During debugging, by inserting precision positioning pins into these positioning pin holes, the optical component 5 or mounting bracket 9 to be installed can be quickly and accurately positioned, eliminating the cumulative errors during the installation process.

[0056] In one specific embodiment, the positioning reference component also includes a reference grid of lines created on the upper surface of the platform body 8 using laser scribing technology. The axis of this grid precisely corresponds to the optical coordinate system established inside the defect inspection machine, and the grid spacing can be set as needed. These lines provide an intuitive visual reference for real-time verification and fine-tuning of the installation position and angle of the optical component 5 using a vision alignment system during the debugging process, improving alignment accuracy and efficiency.

[0057] The suction cup 7 is positioned above the platform body 8 to stably support the wafer 4 used for debugging during the debugging process. The suction cup 7 in this invention preferably employs a vacuum adsorption principle, with a micropore array distributed on its surface. A negative pressure is generated by an external vacuum generator, thereby flattening and firmly adsorbing the wafer 4 or test target onto the surface of the suction cup 7, avoiding debugging errors caused by sample warping or displacement. The suction cup 7 can be made of stainless steel or nickel-plated aluminum alloy to ensure sufficient rigidity and flatness.

[0058] In one specific embodiment, to ensure that wafers with different warpages can be adsorbed into an ideal focal plane, this invention introduces an adaptive control of vacuum adsorption pressure and a deformation compensation function. The suction cup 7 is a zoned controllable vacuum suction cup. Its adsorption surface is divided into multiple independent annular or grid-like regions, each connected to an independent vacuum pipeline and proportional valve, allowing for precise pressure control by the suction cup controller. An array of pressure sensors is integrated into the adsorption surface or internal flow channels of the suction cup 7 to monitor the actual adsorption force of each region on the wafer 4 in real time. A preferred implementation of the deformation monitoring module is as follows: using the image sensor of the calibration object—i.e., the optical component 5 itself—to image a high-precision planar grid target placed on the suction cup 7. By analyzing the distortion of the acquired grid image, the suction cup controller can indirectly and non-contactly calculate the current surface morphology of the wafer 4, such as edge warpage and center concavity. This function effectively solves the calibration error introduced by the sample's own deformation, ensuring that the calibration results have highly consistent process applicability for different batches of wafers with different warpage characteristics.

[0059] A height adjustment component is installed at the bottom of the suction cup 7 to adjust the height position of the suction cup 7 and the object on it relative to the fixed optical component 5. This is because different models or optical components with different detection requirements may have different optimal imaging working distances. The height adjustment component of this invention includes a linear motor 3. As a preferred embodiment, the linear motor 3 is a voice coil motor. Voice coil motors have advantages such as compact structure, fast response speed, high resolution, no cogging effect, and smooth movement, making them very suitable for precise vertical position adjustment.

[0060] In one specific embodiment, the height adjustment component also integrates a high-precision grating ruler or magnetic encoder and other position feedback elements, forming a closed-loop control system with the motion controller, thereby realizing the precise setting and real-time monitoring of the height position of the suction cup 7.

[0061] Mounting bracket 9 secures the optical component 5 to the platform body 8 using high-strength fasteners that engage with pre-drilled threaded holes. Mounting bracket 9 features a modular and compatible design; its connection interface with the platform body 8 is standardized, while the interface connecting to the optical component 5 can be adapted to suit the shape and installation requirements of different components.

[0062] In one specific embodiment, to achieve fine adjustment of the mounting posture of the optical component 5, the optical component 5 is connected to the mounting bracket 9 via a connecting plate 10. The connecting plate 10 has one or more elongated holes. When the fastening screws are not fully tightened, the optical component 5 can be slightly translated and finely adjusted along the direction of the elongated holes. Combined with the angle adjustment function that the mounting bracket 9 itself may have, the spatial posture of the optical component 5 can be precisely adjusted to ensure that its mounting position and angle are strictly consistent with the actual mounting state of the defect detection machine.

[0063] The auxiliary debugging interface 6 is centrally located on the side of the platform body 8, providing electrical connections for debugging work. It includes various types of interfaces: a power interface for supplying power to the image sensor, light source module, and linear motor 3 of the height adjustment component within the optical assembly 5; data transmission interfaces, such as Gigabit Ethernet, Camera Link, and USB, for connecting the image sensor of the optical assembly 5 to the control computer and transmitting image data; and a control signal interface for receiving commands from the control computer to adjust light source brightness, trigger acquisition, etc. Through this auxiliary debugging interface 6, external debugging equipment connects to the optical assembly 5 and actuators on the device, forming a complete debugging system that enables real-time monitoring, recording, and adjustment of optical parameters and image quality during the debugging process.

[0064] Optical component 5 is the object to be debugged in this device. It includes an image sensor, a lens module, and a light source module. The image sensor can be a CCD or CMOS camera, and the light source module can be an LED ring light source, a coaxial light source, or a laser light source of a specific wavelength. After these components are installed and adjusted to their optimal state on the debugging device, they will be transferred as a whole to the testing machine.

[0065] In one specific embodiment, to further enhance the stability and anti-interference capability of the debugging device, the present invention also includes a vibration damping and support system. Specifically, multiple vibration damping pads 2 are installed at the bottom of the platform body 8. The vibration damping pads 2 can be made of a metal and rubber composite or use advanced air-bearing vibration isolation materials, which can effectively attenuate low-frequency and high-frequency vibrations from the ground or environment. The entire debugging device is mounted on a frame 1. The frame 1 is welded from square steel or shaped steel. The frame 1 ensures the stability of the center of gravity of the entire device and can integrate auxiliary equipment such as control cabinets and displays.

[0066] In one specific embodiment, the damping pads 2 at the bottom of the platform body 8 provide basic passive vibration isolation. To further address specific low-frequency vibrations or continuous disturbances that may exist in the environment, and to ensure that the platform maintains extremely high stability even in more demanding environments, this invention also integrates a dynamic vibration suppression system. This dynamic vibration suppression system mainly includes a vibration sensor, an active actuator, and a vibration controller. The vibration sensor is mounted on the frame 1 to monitor its actual vibration in real time. The active actuator is preferably an inertial actuator or an actively controlled air spring. If an inertial actuator is used, it can be directly mounted at the bottom of the platform body 8; if an actively controlled air spring is used, it can be integrated between the frame 1 and the platform body 8, replacing or working in conjunction with the existing damping pads 2. The vibration controller receives signals from the vibration sensor and, through a built-in adaptive control algorithm, calculates and outputs a control signal that is out of phase with the detected vibration signal to the active actuator in real time. The active actuator generates a counteracting force of equal magnitude and opposite direction based on this signal. When the sensor detects an upward vibration displacement on the platform, the controller immediately instructs the actuator to generate a downward force. The two forces cancel each other out on the platform body, thereby significantly attenuating or even eliminating the vibration energy transmitted to the platform body. This achieves high-performance hybrid vibration control that combines "passive vibration isolation" and "active vibration suppression," which is beneficial for suppressing low-frequency vibrations and isolated line spectrum interference. Its performance far exceeds that of a purely passive vibration reduction scheme, providing an extremely stable reference environment for nanometer-level precision optical debugging.

[0067] In one specific implementation, to further enhance the depth and predictability of the debugging process, the debugging device also integrates a multi-degree-of-freedom micro-motion detection sensor network and a more powerful system controller. The sensor network consists of multiple high-precision non-contact displacement sensors, which can be micrometer-level laser displacement sensors. These laser displacement sensors are fixed to the platform body in a specific layout, with their detection ends pointing towards a pre-defined reference plane on the lens barrel or mounting bracket of the optical component being debugged. By measuring from at least three sensors in different directions, the system controller can calculate the micrometer-level attitude changes of the optical component in multiple degrees of freedom, including vertical displacement, pitch, and yaw. The system controller communicates with the sensor network and the image sensor of the optical component.

[0068] Example 2

[0069] Based on Embodiment 1 above, Embodiment 2 further provides a debugging method using a debugging device for the optical components of a wafer defect inspection machine, including the following steps:

[0070] S1 Device Reference Calibration: First, power on the device and initialize the motion control system. Place a standard thickness wafer or a dedicated test target on the suction cup 7 and initiate vacuum adsorption. The control computer sends commands to drive the linear motor 3 in the height adjustment assembly, adjusting the suction cup 7 and the wafer 4 or target to the theoretically optimal imaging height of the optical component 5 to be debugged. This height value can be preset according to the model of the optical component and is precisely fed back and locked by the encoder built into the height adjustment assembly. The purpose of this step is to establish an accurate object plane reference for subsequent optical debugging.

[0071] S2 Optical Component Installation: Carefully move the optical component 5 to be tested close to the platform body 8. Using the precision-machined positioning pin holes on the platform body 8, insert the positioning pins to initially guide the optical component 5, or its mounting bracket 9 and connecting plate 10, into place. Then, using appropriate installation tools and fasteners, initially fix the optical component 5 to the platform body 8 via the mounting bracket 9 and connecting plate 10. At this time, the elongated hole design on the connecting plate 10 allows for fine adjustments; therefore, the tightening force should not be too large to ensure that the component still has the ability to make minor adjustments.

[0072] S3 Debugging Equipment Connection: Connect the control module of the optical component 5 to the external debugging equipment via the auxiliary debugging interface 6 on the side of the platform body 8 using a cable. External debugging equipment typically includes: an industrial computer with image acquisition and analysis software installed, a light source controller, a motion control card, etc. After ensuring all electrical connections are correct and reliable, power on the device and check if the communication between each component is normal.

[0073] S4 parameter debugging and calibration: This is the core part of the entire debugging method. In an installation environment that highly simulates the real machine, the key parameters of the optical component 5 are finely adjusted.

[0074] S41 Focal Length Calibration: Run the image analysis software to display the test target image acquired by optical component 5 in real time. Slowly adjust the focal length adjustment mechanism of the lens module in optical component 5, while observing the image sharpness in the software. Quantitatively evaluate the image contrast using the image evaluation function provided by the software until the image sharpness reaches its peak, meeting the stringent resolution requirements of the defect detection machine. For autofocus systems, this process can be automatically controlled by software.

[0075] S42 Optical Path Coaxiality Adjustment: Observe the projection of the reference grating onto the photosensitive surface of the image sensor using an additional, calibrated telecentric lens or autocollimator. Fine-tune the lens optical axis to the central axis of the image sensor using the fine-tuning mechanisms on the mounting bracket 9 and connecting plate 10. This results in the reference grating being centered in the sensor's field of view without rotation. This step eliminates image distortion and vignetting caused by installation misalignment.

[0076] S43 Light Source Parameter Adaptation: Different defect types require different lighting conditions to produce optimal contrast. Adjust the parameters of the light source controller, including brightness, color temperature or wavelength, and illumination angle. Observe the grayscale value changes of a specific defect simulation area in the image, with the goal of maximizing the signal-to-noise ratio between the defect features and the background to meet the input requirements of subsequent defect recognition algorithms.

[0077] S44 Debugging Result Verification: After completing the above parameter debugging, the debugging results must be objectively verified. Remove the test target and replace it with a standard defect template certified by an authoritative metrology institution. This template has standardized defects of known size and type pre-fabricated on its surface. Use the currently debugged optical system to scan and image the template, running the same defect identification algorithm as the actual testing machine. Compare the number, location, and size of defects detected by the algorithm with the template's standard certificate. When the detection accuracy reaches the preset pass threshold, the optical component 5 is deemed to have passed debugging. If it does not meet the standard, the cause must be analyzed, and the parameter debugging process from S41 to S43 must be repeated until verification is successful.

[0078] In one specific embodiment, before or after adjusting the suction cup height in step S1 device reference calibration, a step S1a wafer flatness calibration is also included: after placing wafer 4 and initiating vacuum adsorption, the suction cup controller first acquires a grid image through optical component 5. If image analysis shows that the grid is stretched and distorted at the edges, indicating that the wafer warps in that area and is not completely flattened, the controller instructs to increase the vacuum negative pressure in the edge area; if the grid is compressed and distorted in the center area, indicating that the center adsorption is too tight and causes a depression, the controller appropriately reduces the vacuum negative pressure in the center area, and even, in specific cases, injects a small amount of positive pressure airflow into the area for "lifting" correction. Through this closed-loop feedback control, wafer 4 can be dynamically corrected to an extremely high flatness, providing a truly flat reference surface for subsequent focus calibration.

[0079] In one specific implementation, after optical parameter tuning is completed, an S4a dynamic stability assessment is performed: the system controls the optical component to continuously image the test target, and simultaneously records the optical component pose data measured by the sensor network (first data) and the image quality data calculated by the image analysis software (second data). By performing correlation analysis on these two sets of time-series data, the impact of environmental micro-vibrations or internal thermal disturbances on imaging stability can be quantified. If the data shows that the optical component has only undergone a displacement of 0.5 micrometers, but causes a fluctuation in image sharpness of more than 3%, it indicates that the component has poor dynamic stability in the current tuning state, and it may not be able to maintain stable detection performance in the vibration environment of a real machine. This function provides a key quantitative basis for predicting the long-term reliability of the optical component in online operation, realizing a technological leap from static tuning to dynamic stability prediction.

[0080] S5 Debugging Data Recording and Migration: After successful debugging, the system records key optical and mechanical position parameters in detail and generates a debugging report. Recorded parameters include, but are not limited to: focal length setting, light source brightness / color temperature parameters, final angle value of optical path adjustment, and image sensor gain / exposure time. Then, the successfully debugged optical component 5 is removed from the debugging device as a whole. Since the debugging device accurately replicates the installation environment of the inspection machine, simply install the optical component 5 as a whole into the corresponding position on the target defect inspection machine and import the recorded optimal parameter file into the machine's control system for rapid deployment. Typically, no or minimal online fine-tuning is required, achieving a "plug-and-play" effect and significantly reducing downtime for machine maintenance or component replacement.

[0081] The preferred embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, nor is it limited to the debugging device and method for optical components of wafer defect inspection machines. Devices and structures not described in detail herein should be understood as being implemented in a manner common to the art. Any person skilled in the art can make many possible variations and modifications to the technical solutions of the present invention, or modify them into equivalent embodiments, without departing from the scope of the present invention. This does not affect the essential content of the present invention. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the present invention are still within the scope of protection of the present invention.

Claims

1. A debugging device for optical components of a wafer defect inspection machine, characterized in that, include: The main body of the platform is made of natural marble. Its external dimensions match the actual dimensions of the optical component installation area inside the defect detection machine. The upper surface is precision ground to form the mounting reference plane for the optical components. The positioning reference component is set on the upper surface of the platform body. Positioning pin holes are machined according to the actual installation coordinates of the optical components of the defect detection machine. The positioning pin holes are used to accommodate positioning pins to achieve precise positioning of the optical components. Suction cups, positioned above the main platform, are used to support wafers for debugging. A height adjustment component, installed at the bottom of the suction cup, includes a linear motor and is used to adjust the height of the suction cup to adapt to the imaging distance requirements of different optical components; The mounting bracket, through fasteners engaging with threaded holes on the platform body, is used to fix the optical components to the platform body and ensure that the installation position and angle of the optical components are consistent with the actual installation state of the defect detection machine. The auxiliary debugging interface, located on the side of the platform body, includes a power interface and a data transmission interface. It is used to connect the control module of the optical components to external debugging equipment to realize real-time monitoring and adjustment of optical parameters during the debugging process. Optical components, including image sensors, lens modules, and light source modules, are used to simulate imaging detection of wafer defects during the debugging process. By simulating the optical installation environment of the wafer defect detection machine, the debugging of optical components can be carried out simultaneously with the motion platform assembly stage. The optical components are connected to the mounting bracket via a connecting plate. The connecting plate has elongated holes, allowing for fine-tuning of the optical components' position. If a compatibility issue is found with the optical components, the mounting bracket can be replaced or the mounting position adjusted directly without disassembling the assembled motion platform. The debugging work is carried out in a stable environment independent of the motion platform, avoiding any interference or damage to the precision motion platform.

2. The debugging device for the optical components of a wafer defect inspection machine according to claim 1, characterized in that: The linear motor in the height adjustment assembly is a voice coil motor.

3. The debugging device for the optical components of a wafer defect inspection machine according to claim 1, characterized in that: The platform body is equipped with shock-absorbing pads at the bottom to reduce the interference of external vibrations on the debugging process.

4. The debugging device for the optical components of a wafer defect inspection machine according to claim 3, characterized in that: It also includes a frame for supporting the platform body and its associated components.

5. The debugging device for the optical components of a wafer defect inspection machine according to claim 1, characterized in that: The positioning reference component also includes a reference grid formed on the upper surface of the platform body. The reference grid corresponds precisely to the optical coordinate system of the defect inspection machine and is used to verify the installation position accuracy of the optical component in real time through the vision alignment system during the debugging process.

6. A debugging method using the apparatus according to any one of claims 1 to 5, characterized in that, Includes the following steps: S1 device reference calibration: Adjust the height of the chuck to position the wafer at the optimal imaging height of the optical components; S2 Optical Component Installation: The optical component to be debugged is positioned using the positioning pin holes and then fixed to the platform body using mounting brackets and fasteners. S3 debugging equipment connection: Connect the control module of the optical components to the debugging equipment through the auxiliary debugging interface; S4 Parameter Adjustment and Calibration: Perform parameter adjustment of optical components in a simulated installation environment, including focal length calibration, optical path coaxiality adjustment, and light source parameter adaptation; S5 Debugging Data Recording and Migration: Record the optical component parameters after debugging is completed, and directly migrate the debugged components and their parameters to the defect detection machine for use.

7. The debugging method according to claim 6, characterized in that, Step S4 includes: S41 Focal Length Calibration: Adjust the focal length adjustment mechanism of the lens in the optical assembly, and observe the image clarity of the test target in conjunction with image analysis software until the detection resolution requirements of the defect detection machine are met. S42 Optical Path Coaxiality Adjustment: Using the reference lines on the platform body as a reference, the mounting bracket and connecting plate of the optical components are finely adjusted to keep the lens optical axis coaxial with the central axis of the image sensor; S43 Light Source Parameter Adaptation: Adjust the brightness, color temperature, and illumination angle of the light source controller to ensure that the defective area on the test target exhibits a contrast in the image that meets the input requirements of the defect recognition algorithm.

8. The debugging method according to claim 6, characterized in that, The debugging data recorded in step S5 includes the focal length setting, light source brightness parameters, and optical path adjustment angle.

9. The debugging method according to claim 7, characterized in that, Step S4 also includes the following sub-steps: S44: Verification of debugging results. After completing the parameter debugging, a standard defect template is used for verification testing. The detection results of the standard defect template are compared with the standard values ​​using image analysis software. When the detection accuracy reaches the predetermined threshold, the debugging is deemed qualified; otherwise, the parameter debugging process is repeated.

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