System for testing temperature coefficient of graphene copper wire

Abstract

The invention relates to the technical field of wire temperature testing, in particular to a graphene copper wire temperature coefficient testing system which comprises a micro environment box and a sample loading module arranged in a temperature control cavity, and the sample loading module is used for loading a graphene copper wire sample and applying current; the voltage measuring module is electrically connected with the sample loading module and is used for measuring the sample voltage and the standard resistance voltage of the graphene copper wire sample; and the data acquisition and processing module is used for receiving the sample current, the sample voltage and the standard resistance voltage of the graphene copper wire sample, calculating the resistance of the graphene copper wire sample, obtaining a sample resistance temperature coefficient and outputting a test report. The complete, precise and automatic temperature coefficient testing technology from graphene copper wire sample treatment, environment control to final data analysis powerfully supports the fundamental research and industrial application of the new graphene copper material.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wire temperature test, in particular to a graphene copper wire temperature coefficient test system. BACKGROUND

[0002] The interface of graphene-copper composite material is not ideal ohmic contact. The work function of graphene is different from that of copper. Impurities, oxides or chemical bonding states at the interface are not uniform, forming a Schottky barrier. In addition, the surface distribution of nanoscale graphene is uneven, resulting in uncertainty of current injection point.

[0003] The interface of graphene-copper composite material is complex. In the traditional four-terminal method test, the contact resistance of current and voltage probes will change due to the surface state and pressure of the material, introducing significant errors. Traditional tube furnace or oil bath temperature control has temperature gradient, resulting in inconsistent temperature of different sections of the sample, affecting the accuracy of resistance measurement. The traditional method can only measure the overall TCR, and cannot distinguish the specific contribution of copper matrix, graphene interface and their synergistic effect to TCR. SUMMARY

[0004] The purpose of the present application is to provide a graphene copper wire temperature coefficient test system. The complete, precise and automated temperature coefficient test technology from graphene copper wire sample processing, environmental control to final data analysis effectively supports the basic research and industrial application of graphene copper new materials.

[0005] To achieve this purpose, the present application adopts the following technical scheme: A graphene copper wire temperature coefficient test system, comprising: A miniature environmental box with a temperature control cavity, the temperature control range in the temperature control cavity is-50℃ to 300℃; A sample loading module arranged in the temperature control cavity, the sample loading module is used for loading a graphene copper wire sample; the sample loading module is used for applying current to the graphene copper wire sample; A voltage measurement module electrically connected with the sample loading module, the voltage measurement module is used for measuring sample voltage and standard resistance voltage of the graphene copper wire sample; A data acquisition and processing module, used for receiving sample current, sample voltage and standard resistance voltage of the graphene copper wire sample, and performing graphene copper wire sample resistance calculation to obtain sample resistance temperature coefficient and output test report.

[0006] Further, the temperature control cavity is formed by a heat equalizing block coated with multiple layers of heat insulation and reflection materials, and the temperature regulation element of the heat equalizing block is a semiconductor refrigerating sheet and a heating wire.

[0007] Further, the multiple positions of the heat block and the graphene copper wire sample are respectively provided with platinum resistance thermometers or thermocouples for monitoring and feeding back the real environment temperature. The platinum resistance thermometer (PT100) or thermocouple is electrically connected with the data acquisition and processing module.

[0008] Further, the sample loading module comprises at least two clamps, and the clamps are made of gold-plated copper or beryllium copper. The clamps are provided with temperature sensors and electrode contacts, and the clamps are electrically connected with the power supply.

[0009] Further, the sample loading module passes a large current to perform in-situ transient annealing on the graphene copper wire sample before testing.

[0010] Further, the data received by the data acquisition and processing module includes sample current I, sample voltage Vs, standard resistance voltage Vref and temperature T, TCR fitting technology is adopted, and least square linear regression fitting is performed according to the formula R(T) = R0 [1 + α(T - T0)] to directly calculate the resistance temperature coefficient α at the reference temperature T0.

[0011] Further, the data acquisition and processing module has a display screen, and the display screen displays the R-T curve, the fitting curve, the α value and the goodness of fit R² in real time.

[0012] The technical scheme provided by the present application can include the following beneficial effects: The present application adopts a heat block to realize high uniformity and real temperature monitoring technology, and through the design of the heat block and the direct temperature measurement on the sample, the accuracy of the temperature parameter is ensured, which is the premise of high-precision TCR measurement. The system of the present application realizes full-automatic synchronous measurement, eliminates human operation errors, and improves the test efficiency and repeatability. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 is a schematic diagram of a graphene copper wire temperature coefficient test system of an embodiment of the present application; Fig. 2 is a schematic diagram of a chuck of a clamp; Among them, the miniature environmental box 1, the sample loading module 2, the chuck 21 of the clamp, the power line 22, the temperature sensor 23, and the data acquisition and processing module 3. DETAILED DESCRIPTION

[0014] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0015] The following is combined with Figs. 1-2 This invention describes a testing system for the temperature coefficient of graphene copper wire, comprising: A miniature environmental chamber 1 with a temperature control cavity, wherein the temperature control range within the temperature control cavity is -50℃ to 300℃; The sample loading module 2 is disposed within the temperature control cavity. The sample loading module is used to load the graphene copper wire sample and to apply current to the graphene copper wire sample. A voltage measurement module electrically connected to the sample loading module is used to measure the sample voltage and standard resistance voltage of the graphene copper wire sample. The data acquisition and processing module 3 is used to receive the sample current, sample voltage and standard resistance voltage of the graphene copper wire sample, calculate the resistance of the graphene copper wire sample, obtain the temperature coefficient of resistance of the sample and output a test report.

[0016] This invention employs a heat spreader to achieve high uniformity and accurate temperature monitoring. Through the design of the heat spreader and direct temperature measurement on the sample, the accuracy of temperature parameters is ensured, which is a prerequisite for high-precision TCR measurement. The system using this invention achieves fully automated synchronous measurement, eliminating human error and improving testing efficiency and repeatability.

[0017] Preferably, the temperature control cavity is formed by a heat spreader block coated with multiple layers of insulating and reflective materials, and the temperature control elements of the heat spreader block are a semiconductor cooling chip and a heating wire. This solution uses the Peltier effect (semiconductor cooling chip) combined with a miniature heating wire to achieve rapid and precise temperature control from -50°C to +300°C. Combined with a PID (proportional-integral-derivative) algorithm, the temperature stability is better than ±0.1°C, forming a precision temperature control unit. The heat spreader block is made of a high thermal conductivity material, such as pure copper.

[0018] More preferably, platinum resistance thermometers or thermocouples are respectively installed at multiple locations of the heat spreader and the graphene copper wire sample to monitor and provide feedback on the real ambient temperature. The platinum resistance thermometer (PT100) or thermocouple is electrically connected to the data acquisition and processing module.

[0019] Calibrated platinum resistance thermometers (PT100) or thermocouples are placed at key locations (at least 3 points) on the heat exchange block and on the sample body to monitor and report the actual temperature in real time, ensuring the accuracy of the sample temperature value and enabling multi-point temperature monitoring.

[0020] In one embodiment of the present invention, the sample loading module 2 includes at least two clamps, and the clamp head 21 of the clamps is made of gold-plated copper or beryllium copper. The clamp is equipped with a temperature sensor and electrode contacts, and is electrically connected to a power source. For example, the clamp's gripper 21 is connected to a power cord 22 and a temperature sensor 23.

[0021] Specifically, the fixture employs a split V-groove design and is made of an inert and highly thermally conductive material (such as gold-plated copper or beryllium copper). Each electrode contact is provided with constant and minute pressure (e.g., 10-50 cN) by an independent micro-spring, ensuring good contact while avoiding damage or excessive deformation of the sample. The fixture can be connected to a micro-current source to perform in-situ instantaneous annealing of the sample with a large current before testing, eliminating stress introduced by the fixture pressure and obtaining a more stable intrinsic resistance value.

[0022] Preferably, the sample loading module applies a large current to perform in-situ instantaneous annealing of the graphene copper wire sample before testing.

[0023] In embodiments of the present invention, the data received by the data acquisition and processing module includes sample current I, sample voltage Vs, standard resistance voltage Vref, and temperature T. Using the TCR fitting technique, the least squares linear regression fitting is performed according to the formula R(T) = R0 [1 + α(T - T0)] to directly calculate the resistance temperature coefficient α at the reference temperature T0.

[0024] Preferably, the data acquisition and processing module has a display screen that displays the RT curve, the fitted curve, the α value, and the goodness of fit R² in real time.

[0025] Other components and operations of the graphene copper wire temperature coefficient testing system according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0026] In the description of this specification, references to terms such as "embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A system for testing the temperature coefficient of graphene copper wire, characterized in that, include: A miniature environmental chamber with a temperature control cavity, wherein the temperature control range within the temperature control cavity is -50℃ to 300℃; The sample loading module is disposed within the temperature control cavity. The sample loading module is used to load the graphene copper wire sample. The sample loading module is used to apply current to the graphene copper wire sample. A voltage measurement module electrically connected to the sample loading module is used to measure the sample voltage and standard resistance voltage of the graphene copper wire sample. The data acquisition and processing module is used to receive the sample current, sample voltage, and standard resistance voltage of the graphene copper wire sample, calculate the resistance of the graphene copper wire sample, obtain the temperature coefficient of resistance of the sample, and output a test report.

2. The testing system according to claim 1, characterized in that, The temperature control cavity is formed by a heat-spreading block covered with multiple layers of heat-insulating and reflective materials, and the temperature control elements of the heat-spreading block are a semiconductor cooling chip and a heating wire.

3. The testing system according to claim 4, characterized in that, Platinum resistance thermometers or thermocouples are respectively installed at multiple locations on the heat exchange block and on the graphene copper wire sample to monitor and provide feedback on the real ambient temperature. The platinum resistance thermometer (PT100) or thermocouple is electrically connected to the data acquisition and processing module.

4. The testing system according to claim 1, characterized in that, The sample loading module includes at least two clamps, which are made of gold-plated copper or beryllium copper. The clamp is equipped with a temperature sensor and electrode contacts, and the clamp is electrically connected to a power source.

5. The testing system according to claim 4, characterized in that, The sample loading module applies a high current to perform in-situ instantaneous annealing of the graphene copper wire sample before testing.

6. The testing system according to claim 1, characterized in that, The data acquisition and processing module receives data including sample current I, sample voltage Vs, standard resistor voltage Vref, and temperature T. Using the TCR fitting technique, the least squares linear regression fitting is performed according to the formula R(T) = R0 [1 + α(T - T0)] to directly calculate the resistance temperature coefficient α at the reference temperature T0.

7. The testing system according to claim 6, characterized in that, The data acquisition and processing module has a display screen that displays the RT curve, the fitted curve, the α value, and the goodness of fit R² in real time.

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