Positioning adjustment equipment for chip packaging

Abstract

The invention relates to the technical field of chip packaging, and discloses a positioning adjustment device for chip packaging, which comprises a mounting mechanism and a locking mechanism, and is characterized in that the mounting mechanism comprises a main mounting plate, two auxiliary mounting plates, two first pushing frames and four guide grooves; the two auxiliary mounting plates are slidably connected to the two sides of the outer surface of the main mounting plate correspondingly, the two first pushing frames are slidably connected to the lower portion of the main mounting plate, every two of the four guide grooves form a group, one group of guide grooves are formed in the surface of one auxiliary mounting plate, and the other group of guide grooves are formed in the surface of the other auxiliary mounting plate. The other group of mounting plates are arranged on the surface of the other secondary mounting plate; the locking mechanism comprises four guide blocks and a driving part, the four guide blocks are divided into two groups, and one group of guide blocks is in sliding connection with one of the first pushing frames. According to the positioning adjustment equipment for chip packaging, the chip can be centered and positioned, meanwhile, interference caused by shielding of pins of the chip is avoided, and the efficiency of mass production is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a positioning adjustment device for chip packaging. BACKGROUND

[0002] With the rapid development of the semiconductor industry, chip packaging technology as a key link to protect the performance and reliability of the chip, its process precision continues to climb, in the process of chip packaging, accurate positioning and flexible posture adjustment is the core element to ensure the quality of bonding, potting and other processes, the traditional chip positioning device adopts single clamping structure or simple mechanical transmission, it is difficult to meet the complex needs of chip centering adjustment, multi-angle turning and multi-station cooperation at the same time.

[0003] In the prior art, chip packaging needs to be centered, in the chip packaging process, the bonding process needs to connect the chip pins and the packaging carrier accurately, if the chip is not centered, the position deviation of the pins and the bonding points will cause poor connection, affect signal transmission, and if the chip is offset during potting, the uneven distribution of packaging material will reduce the chip heat dissipation performance and mechanical stability, in the process of chip packaging, the current positioning device is centered, and the edge of the chip is tightly contacted, which causes the pins of the chip to be shielded, thereby forming interference, and the problem of local stress concentration is easy to occur, which affects the normal progress of packaging, or the chip is locked by an additional fixing structure to avoid the deflection of the chip during packaging, but in the packaging production, frequent replacement of clamps leads to long downtime of the production line, which seriously restricts the efficiency of mass production. SUMMARY

[0004] The present application provides a positioning adjustment device for chip packaging, which can center the chip without causing interference to the pins of the chip, effectively improving the efficiency of mass production.

[0005] To achieve the above purpose, the present application is realized by the following technical scheme: A positioning adjustment device for chip packaging is designed, which comprises a mounting mechanism and a locking mechanism, wherein: The mounting mechanism comprises a main mounting plate, two auxiliary mounting plates, two first push frames and four guide grooves, the two auxiliary mounting plates are respectively slidably connected to the two sides of the outer surface of the main mounting plate, the two first push frames are slidably connected below the main mounting plate, and the four guide grooves are two groups, one group of the guide grooves is opened on the surface of one of the auxiliary mounting plates, and the other group is opened on the surface of the other auxiliary mounting plate; The locking mechanism comprises four guide blocks and a driving member, the four guide blocks are two groups, one group of guide blocks is in sliding connection with one of the first push frames, and the other group of guide blocks is in sliding connection with the other first push frame, the four guide blocks correspond to the four guide grooves, and the guide blocks are in sliding connection in the guide grooves, and the driving member is used for driving the two first push frames to move synchronously towards or away from each other.

[0006] Optionally, a supporting mechanism is arranged below the mounting mechanism, the supporting mechanism comprises a supporting plate, a plurality of air pressure rods, a plurality of mounting grooves and a plurality of push plates, the plurality of air pressure rods are respectively fixedly installed on the top of the supporting plate, the plurality of mounting grooves are respectively arranged on the top of the supporting plate, the inner bottom walls of the plurality of mounting grooves are respectively fixedly installed with the bottom ends of the plurality of air pressure rods, and the plurality of push plates are respectively fixedly installed on the output ends of the plurality of air pressure rods.

[0007] Optionally, a rotating mechanism is arranged on the top of the push plate, the rotating mechanism comprises a supporting seat, a first motor and a driving gear, the bottom of the supporting seat is fixedly installed with the top of the push plate, the first motor is fixedly installed on the bottom of the supporting seat, the driving gear is rotatably connected to the top of the supporting seat, and the middle part of the bottom of the driving gear is in key transmission connection with the output end of the first motor.

[0008] Optionally, the rotating mechanism further comprises a driven gear and an adjusting plate, the outer surface of the driven gear is in mesh with the outer surface of the driving gear, the top of the driven gear is fixedly connected with the bottom of the adjusting plate, and the top of the adjusting plate is fixedly connected with the bottom of the main mounting plate.

[0009] Optionally, the driving member comprises a double-shaft motor, the bottom of the double-shaft motor is fixedly installed on the bottom of the main mounting plate, two screw rods are rotatably connected to the lower part of the main mounting plate and located on the two sides of the outer surface of the double-shaft motor, the two output ends of the double-shaft motor are both in key transmission connection with first bevel gears, the mounting mechanism further comprises two screw rods, second bevel gears are fixedly installed on the lower part of the outer surfaces of the two screw rods, the outer surface of the first bevel gear is in mesh with the outer surface of the second bevel gear, the outer surfaces of the two screw rods are both in threaded connection with the outer surfaces of the two first push frames, and the threads on the outer surfaces of the two first push frames are respectively right-hand threads and left-hand threads.

[0010] Optionally, the driving member further comprises four second pushing frames, a plurality of sliding blocks, a plurality of sliding grooves and four stretching springs, the four second pushing frames are respectively slidably connected to the two sides of the outer surfaces of the two first pushing frames, the plurality of sliding blocks are respectively fixedly installed on the two sides of the outer surfaces of the two first pushing frames, the plurality of sliding grooves are respectively formed in the outer surfaces of the four second pushing frames, the outer surfaces of the plurality of sliding blocks are respectively slidably connected with the inner side walls of the plurality of sliding grooves, one end of each of the four stretching springs is fixedly connected with the two sides of the bottom of the two auxiliary mounting plates, and the other end of each of the four stretching springs is fixedly connected with the two sides of the outer surface of the main mounting plate.

[0011] Optionally, the locking mechanism further comprises four fastening bolts and four pressing blocks, the four fastening bolts are threadedly connected to the one ends of the four guide blocks penetrating through the pressing blocks, the lower portions of the outer surfaces of the four guide blocks are respectively slidably connected with the inner side walls of the two first pushing frames and the inner side walls of the four second pushing frames, the middle portions of the outer surfaces of the four guide blocks are respectively slidably connected with the inner walls of the four guide grooves, the four pressing blocks are respectively detachably connected to the top portions of the outer surfaces of the four guide blocks and are located above the two auxiliary mounting plates.

[0012] Optionally, the turnover mechanism comprises a limiting plate, an adjusting seat and a clamping plate, the limiting plate is fixedly installed at the bottom of the auxiliary mounting plate, the adjusting seat is rotatably connected to the outer side of the limiting plate, and the clamping plate is slidably connected to the upper portion of the adjusting seat.

[0013] Optionally, the turnover mechanism further comprises four second motors, four third motors and four adjusting rods, the four second motors are respectively fixedly installed on the outer walls of the four limiting plates, the output ends of the four second motors are respectively in transmission connection with the outer walls of the four adjusting seats through keys, the four third motors are respectively fixedly installed on the outer walls of the four adjusting seats, the four adjusting rods are respectively rotatably connected to the inner side walls of the four adjusting seats, and the output ends of the four third motors are respectively in transmission connection with the end portions of the four adjusting rods through keys.

[0014] Optionally, the turnover mechanism further comprises two positioning seats, two limiting blocks and two limiting grooves, the outer surfaces of the two adjusting rods are respectively in threaded connection with the inner walls of the two positioning seats, the two limiting blocks are respectively fixedly connected to the top portions of the two positioning seats, the two limiting grooves are respectively formed in one side of the outer surfaces of the two clamping plates, the inner side walls of the two limiting grooves are respectively in clamping connection with the outer surfaces of the two limiting blocks, and the outer surfaces of the other two adjusting rods are respectively in threaded connection with the other sides of the outer surfaces of the two clamping plates.

[0015] The positioning adjustment device for chip packaging provided by the application has the following advantages: The positioning adjusting device for chip packaging, by the first pushing frame synchronously driven four guide blocks diagonal oblique movement along the guide groove, at this time, four guide blocks respectively in the corresponding first pushing frame sliding, and in the corresponding guide groove sliding, four guide blocks in diagonal oblique movement process to the four corners of the chip close, until the four corners of the chip contact, and the four corners of the chip uniform force and dynamic self-centering, while ensuring high-precision centering clamping, effectively improve the efficiency of clamping, and then suitable for the rapid positioning in batch packaging process, improve the efficiency of packaging, with the connection between the main mounting plate and the vice mounting plate, the spacing between the main mounting plate and the vice mounting plate can be adjusted, the guide groove opened on the vice mounting plate adjusts with the spacing between the vice mounting plate and the main mounting plate, the spacing with the midpoint position of the main mounting plate adjusts, can be applied to different width or length size of chip, further improve the scope of application. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is whole installation structure schematic diagram of the present application; Figure 2 It is support mechanism explosion structure schematic diagram of the present application; Figure 3 It is installation mechanism cooperation installation structure schematic diagram of the present application; Figure 4 It is rotating mechanism explosion structure schematic diagram of the present application; Figure 5 It is installation mechanism explosion structure schematic diagram of the present application; Figure 6 It is first pushing frame and second pushing frame installation structure schematic diagram of the present application; Figure 7 It is locking mechanism installation structure schematic diagram of the present application; Figure 8 It is turnover mechanism explosion structure schematic diagram of the present application; Figure 9 It is adjusting seat installation structure schematic diagram of the present application.

[0017] In the figure: 1, support mechanism; 101, support plate; 102, mounting groove; 103, air pressure rod; 104, push plate; 2, rotating mechanism; 201, support seat; 202, first motor; 203, driving gear; 204, driven gear; 205, adjusting plate; 3, mounting mechanism; 301, main mounting plate; 302, auxiliary mounting plate; 303, double-shaft motor; 304, threaded rod; 305, first push frame; 306, second push frame; 307, sliding block; 308, sliding groove; 309, guide groove; 3010, tension spring; 4, locking mechanism; 401, guide block; 402, pressing block; 403, fastening bolt; 5, overturning mechanism; 501, limiting plate; 502, adjusting seat; 503, second motor; 504, third motor; 505, adjusting rod; 506, clamping plate; 507, positioning seat; 508, limiting block; 509, limiting groove. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0019] Referring to Figures 1 to 9 The positioning device provided by the embodiments of the present application is applied to a scene requiring forward and reverse overturning in a chip packaging process. In the embodiments, the structure of the positioning device is improved to have the advantages of center positioning and forward and reverse overturning. Specifically, taking the forward and reverse packaging of an automotive electronic chip as an example, as a preferred solution in the embodiments, the positioning device is specifically a positioning and adjusting device for chip packaging, which can quickly center position and forward and reverse overturning during packaging of the automotive electronic chip.

[0020] Referring to Figures 1 to 9 The present application provides a technical solution: a positioning and adjusting device for chip packaging, which is applied to a scene requiring forward and reverse overturning in a chip packaging process.

[0021] The positioning and adjusting device for chip packaging comprises a mounting mechanism 3 and a locking mechanism 4, wherein: The mounting mechanism 3 comprises a main mounting plate 301, two auxiliary mounting plates 302, two first push frames 305, and four guide grooves 309. The two auxiliary mounting plates 302 are respectively slidably connected to the two sides of the outer surface of the main mounting plate 301. The two first push frames 305 are slidably connected below the main mounting plate 301. The four guide grooves 309 are two groups. One group of guide grooves 309 is formed on the surface of one of the auxiliary mounting plates 302, and the other group is formed on the surface of the other auxiliary mounting plate 302. The locking mechanism 4 comprises four guide blocks 401 and a driving member, the four guide blocks 401 are in two groups, one group of guide blocks 401 is in sliding connection with one of the first push frames 305, and the other group of guide blocks 401 is in sliding connection with the other first push frame 305, the four guide blocks 401 correspond to the four guide grooves 309, and the guide blocks 401 are in sliding connection in the guide grooves 309, and the driving member is used to drive the two first push frames 305 to move synchronously towards or away from each other.

[0022] In the embodiment, the cooperation of the main mounting plate 301 and the auxiliary mounting plate 302 can adjust the positions of the two auxiliary mounting plates 302 according to the size of the chip, and then adjust the positions of the two pressing blocks 402, so that the chip of different sizes can be fixed in the center, and the two first push frames 305 are slidably connected below the main mounting plate 301, and slide along the length direction of the main mounting plate 301 under the driving of the threaded rod 304, further transmit the movement to the guide blocks 401, and play the role of auxiliary support and guide, to ensure the stability and accuracy of the movement of the locking mechanism 4, through the cooperation of the sliding block 307 and the sliding groove 308, slide along the length direction of the first push frame 305, so as to cooperate with the four pressing blocks 402, suitable for chips of different widths, the guide groove 309 is arranged at the top of the two auxiliary mounting plates 302, to provide guidance for the sliding of the guide blocks 401, limit the movement direction of the guide blocks 401, so that it can only slide in the direction of the guide groove 309, to ensure that the pressing blocks 402 can accurately clamp and fix the chip from four directions, realize the center positioning of the chip, the outer surfaces of the four guide blocks 401 are slidably connected with the inner sidewalls of the first push frame 305 and the second push frame 306, and the middle parts are slidably connected with the inner walls of the guide groove 309, slide along the direction of the guide groove 309 under the driving of the first push frame 305 and the second push frame 306, convert the movement of the first push frame 305 and the second push frame 306 into linear movement in the direction of the guide groove 309, drive the pressing blocks 402 to clamp and fix the chip, and because of the limitation of the guide groove 309, the guide blocks 401 will not rotate, to ensure the accuracy of the movement of the pressing blocks 402, the four pressing blocks 402 are detachably connected to the top of the outer surfaces of the guide blocks 401 and located above the auxiliary mounting plates 302, to clamp and fix the chip, and in the pushing process, the chip can be pushed to the middle position of the top of the main mounting plate 301, to realize the center adjustment of the chip, and the detachable design facilitates the replacement of the suitable pressing blocks 402 according to different sizes of chips.

[0023] In the above embodiment, as a preferred solution, a support mechanism 1 is arranged below the mounting mechanism 3, the support mechanism 1 comprises a support plate 101, a plurality of air pressure rods 103, a plurality of mounting grooves 102 and a plurality of push plates 104, the plurality of air pressure rods 103 are respectively fixedly installed on the top of the support plate 101, the plurality of mounting grooves 102 are respectively arranged on the top of the support plate 101, the inner bottom walls of the plurality of mounting grooves 102 are respectively fixedly installed with the bottom ends of the plurality of air pressure rods 103, and the plurality of push plates 104 are respectively fixedly installed on the output ends of the plurality of air pressure rods 103. The support plate 101 serves as the basic load-bearing component of the entire device, provides a stable mounting plane for other components such as the air pressure rods 103, ensures the stability of the overall structure of the device, bears the weight load of the mechanisms and chips above, and can be flexibly adjusted in height to adapt to the height requirements of different processes of chip packaging, such as the height position of the bonding and potting equipment, thereby improving the versatility and operation convenience of the device. When the turnover mechanism 5 is running, the mounting mechanism 3 carrying the turned-over chip can be appropriately lowered, so that the chip can be placed more conveniently on the mounting mechanism 3, the plurality of mounting grooves 102 are used to fixedly install the air pressure rods 103, so that the installation position of the air pressure rods 103 is accurate and stable, ensuring the stability of the vertical lifting of the air pressure rods 103, avoiding the air pressure rods 103 from deviating during work and affecting the operation accuracy of the device, the plurality of push plates 104 are connected to the output ends of the air pressure rods 103, and the lifting movement of the air pressure rods 103 is transmitted to the rotating mechanism 2 and the mounting mechanism 3 above, thereby playing a force conduction role, and the push plate 104 provides a larger force receiving area, so that the force received by the mechanism above is more uniform.

[0024] In the above embodiment, as a preferred scheme, the top of the push plate 104 is provided with a rotating mechanism 2, which comprises a support seat 201, a first motor 202 and a driving gear 203. The bottom of the support seat 201 is fixedly installed on the top of the push plate 104, the first motor 202 is fixedly installed on the bottom of the support seat 201, and the driving gear 203 is rotatably connected to the top of the support seat 201. The middle part of the bottom of the driving gear 203 is connected to the output end of the first motor 202 through a key transmission. The support seat 201 is fixedly installed on the top of the push plate 104 to provide installation support for the first motor 202 and the driving gear 203, ensure the relative position of each component of the rotating mechanism 2 is fixed, maintain the stability and accuracy of the rotating motion, and the first motor 202 serves as the power source of the rotating mechanism 2, which drives the driving gear 203 to rotate through the rotation of the output shaft, provides power for the rotation of the adjusting plate 205 and the installation mechanism 3, and can realize multi-angle rotation of the installation mechanism 3 to meet the needs of multi-station cooperation in the chip packaging process, such as enabling the chip to rotate to different working positions of the packaging equipment. The driving gear 203 is connected to the output shaft of the first motor 202 through a key transmission, which transmits the rotating power of the first motor 202 to the driven gear 204, and through gear meshing transmission, it can realize stable speed and torque transmission to ensure the smoothness of the rotating motion of the installation mechanism 3.

[0025] In the above embodiment, as a preferred scheme, the rotating mechanism 2 further comprises a driven gear 204 and an adjusting plate 205. The outer surface of the driven gear 204 is engaged with the outer surface of the driving gear 203, the top of the driven gear 204 is fixedly connected with the bottom of the adjusting plate 205, and the top of the adjusting plate 205 is fixedly connected with the bottom of the main mounting plate 301. Through the engagement of the driven gear 204 and the driving gear 203, the rotating motion of the driving gear 203 is converted into the rotation of the driven gear 204, which in turn drives the adjusting plate 205 and the installation mechanism 3 to rotate, changes the transmission direction and output position of the motion, and makes the rotation of the installation mechanism 3 more flexible and controllable. The adjusting plate 205 connects the driven gear 204 and the main mounting plate 301, transmits the rotating motion of the driven gear 204 to the installation mechanism 3, realizes the rotation of the installation mechanism 3 on the horizontal plane, facilitates the packaging operation of the chip in different directions, and improves the working efficiency and applicability of the equipment.

[0026] In the above embodiment, as a preferred solution, the driving member comprises a double-shaft motor 303, the bottom of the double-shaft motor 303 is fixedly installed on the bottom of the main mounting plate 301, two threaded rods 304 are respectively rotatably connected to the lower side of the main mounting plate 301 and located on both sides of the outer surface of the double-shaft motor 303, the two output ends of the double-shaft motor 303 are both connected with first bevel gears through key transmission, the mounting mechanism 3 further comprises two threaded rods 304, second bevel gears are fixedly installed on the lower side of the outer surface of the two threaded rods 304, the outer surface of the first bevel gear is engaged with the outer surface of the second bevel gear, the outer surface of the two threaded rods 304 is both threadedly connected with the outer surface of the two first push frames 305, and the threads on the outer surfaces of the two first push frames 305 are respectively right and left threads, the outer surface of the two threaded rods 304 is both threadedly connected with the outer surface of the two first push frames 305, and the threads on the outer surfaces of the two first push frames 305 are respectively right and left threads, the double-shaft motor 303 is installed on the bottom of the main mounting plate 301, the two output shafts thereof are respectively connected with the first bevel gears through key transmission, providing a power source for the rotation of the two threaded rods 304, through double-shaft synchronous output, synchronous reverse driving of the two first push frames 305 can be realized, the symmetry and accuracy of the chip centering positioning operation are ensured, the two threaded rods 304 are rotatably connected below the main mounting plate 301, the right and left threads on the outer surfaces thereof are respectively threadedly connected with the two first push frames 305, and under the driving of the double-shaft motor 303, rotation is realized, the rotary motion of the motor is converted into the linear sliding motion of the first push frame 305, the moving distance and speed of the first push frame 305 are accurately controlled, and thus the accurate centering positioning of the chip is realized.

[0027] In the above embodiment, as a preferred scheme, the driving member further comprises four second pushing frames 306, a plurality of sliding blocks 307, a plurality of sliding grooves 308 and four extension springs 3010, the four second pushing frames 306 are respectively slidably connected to the two sides of the outer surfaces of the two first pushing frames 305, the plurality of sliding blocks 307 are respectively fixedly installed on the two sides of the outer surfaces of the two first pushing frames 305, the plurality of sliding grooves 308 are respectively formed on the outer surfaces of the four second pushing frames 306, the outer surfaces of the plurality of sliding blocks 307 are respectively slidably connected with the inner side walls of the plurality of sliding grooves 308, one end of each of the four extension springs 3010 is fixedly connected with the two sides of the bottom of the auxiliary mounting plate 302, and the other end of each of the four extension springs 3010 is fixedly connected with the two sides of the outer surface of the main mounting plate 301, so as to drive the second pushing frame 306 and the locking mechanism 4 to move, drive the guide block 401 and the pressing block 402 to clamp and fix the chip and center adjust the chip, which are key transmission components for realizing the positioning of the chip, the four second pushing frames 306 are respectively slidably connected to the two sides of the outer surfaces of the two first pushing frames 305, the plurality of sliding grooves 308 are formed on the outer surfaces of the second pushing frames 306 and cooperate with the sliding blocks 307 to provide guidance for the sliding of the sliding blocks 307, so that the second pushing frame 306 can slide and adjust along the length direction of the first pushing frame 305, so as to improve the applicability of the device, and the one end of each of the four extension springs 3010 is connected with the two sides of the bottom of the auxiliary mounting plate 302, and the other end is connected with the two sides of the outer surface of the main mounting plate 301, which plays a resetting role in the sliding process of the auxiliary mounting plate 302 and can also assist in clamping the chip.

[0028] In the above embodiment, as a preferred scheme, the locking mechanism 4 further comprises four fastening bolts 403 and the pressing block 402, the four fastening bolts 403 are threadedly connected with the one ends of the four guide blocks 401 penetrating through the pressing block 402, the lower portions of the outer surfaces of the four guide blocks 401 are respectively slidably connected with the inner side walls of the two first pushing frames 305 and the inner side walls of the four second pushing frames 306, the middle portions of the outer surfaces of the four guide blocks 401 are respectively slidably connected with the inner walls of the four guide grooves 309, the four pressing blocks 402 are respectively detachably connected with the top portions of the outer surfaces of the four guide blocks 401 and are located above the two auxiliary mounting plates 302, and the four fastening bolts 403 are threadedly connected with the one ends of the guide blocks 401 penetrating through the pressing block 402, which is used to fix the relative positions of the pressing block 402 and the guide block 401, ensures that the pressing block 402 will not be loose during clamping the chip, guarantees the stability and reliability of clamping the chip, and the fastening bolts 403 can be removed to adjust or replace the pressing block 402.

[0029] In the above embodiment, as a preferred solution, the turnover mechanism 5 comprises a limiting plate 501, an adjusting seat 502 and a clamping plate 506, the limiting plate 501 is fixedly installed at the bottom of the auxiliary mounting plate 302, the adjusting seat 502 is rotatably connected to the outer side of the limiting plate 501, the clamping plate 506 is slidably connected to the upper side of the adjusting seat 502, four limiting plates 501 are fixedly installed at the bottom of the two auxiliary mounting plates 302, providing mounting support for the adjusting seat 502, limiting the installation position of the adjusting seat 502, ensuring the stability of the adjusting seat 502 during the turnover of the chip, and providing a reference for the rotating movement of the adjusting seat 502, four adjusting seats 502 are rotatably connected to the outer side of the limiting plate 501, and can rotate around the limiting plate 501 under the drive of the second motor 503, driving the clamping plate 506 to turn over the chip, realizing the forward and reverse conversion of the chip, the rotatable design makes the chip turnover operation more flexible, and the synchronous operation of the four adjusting seats 502 can ensure the stability during the turnover of the chip, the bottom of the two clamping plates 506 is slidably connected to the upper side of the four adjusting seats 502 respectively, and can move along the length direction of the adjusting seat 502 under the drive of the adjusting rod 505, clamping and fixing the chip from both sides, and can be turned over under the driving of the adjusting seat 502, realizing the forward and reverse conversion of the chip, the sliding connection design makes the movement of the clamping plate 506 more smooth, facilitating the clamping and turnover operation of the chip, in the chip packaging, part of the chips need to be packaged in forward and reverse directions, for some complex function chips, such as automobile electronic chips and high-performance processor chips, because different functional modules need to be integrated on the front and back surfaces of the chip, such as arranging precision circuit and pin on the front surface, and processing heat dissipation structure or reinforcement layer on the back surface, or subsequent processes such as front gold wire bonding and back pouring, special requirements will involve forward and reverse packaging process, which is also an important reason for the low efficiency and quality problems of traditional equipment due to inconvenient turnover, through the cooperation of the two clamping plates 506, the chip can be clamped and fixed from both sides, and after clamping and fixing, the two clamping plates 506 can be turned over by rotating the adjusting seat 502 outside the limiting plate 501, and the four turnover mechanisms 5 are synchronously operated, which can place the clamped and fixed chip on the adjacent mounting mechanism 3, thereby realizing the forward and reverse turnover of the chip, and then the operation of the locking mechanism 4 can reposition the turned over chip to the middle part, thereby making the device applicable to different needs of chip packaging.

[0030] In the above embodiment, as a preferred scheme, the turnover mechanism 5 further comprises four second motors 503, four third motors 504 and four adjusting rods 505, the four second motors 503 are fixedly installed on the outer walls of the four limiting plates 501 respectively, the output ends of the four second motors 503 are drivingly connected with the outer walls of the four adjusting seats 502 through keys respectively, the four third motors 504 are fixedly installed on the outer walls of the four adjusting seats 502 respectively, the four adjusting rods 505 are rotatably connected with the inner side walls of the four adjusting seats 502 respectively, the output ends of the four third motors 504 are drivingly connected with the end portions of the four adjusting rods 505 through keys respectively, the four second motors 503 fixedly installed on the outer walls of the limiting plates 501 serve as the power sources for the rotation of the adjusting seats 502, the rotation of the output shafts drives the adjusting seats 502 to rotate, the rotation angle and speed of the adjusting seats 502 are accurately controlled, the accuracy and reliability of the turnover operation of the chips are ensured, the process requirements of the front and back packaging of the chips are met, the four third motors 504 fixedly installed on the outer walls of the adjusting seats 502 provide power for the rotation of the adjusting rods 505, the clamping plates 506 are driven to move along the axial directions of the adjusting rods 505 through the rotation of the adjusting rods 505, the clamping and loosening operations of the clamping plates 506 on the chips are realized, the clamping force of the clamping plates 506 can be accurately adjusted according to chips of different sizes, the four adjusting rods 505 are rotatably connected with the inner side walls of the adjusting seats 502 and rotate under the driving of the third motors 504, the rotation movements are converted into the linear movements of the clamping plates 506 through the threaded connection with the clamping plates 506, the clamping and loosening operations on the chips are realized, the threaded transmission mode can provide stable clamping force and ensure that the chips will not be loosened in the turnover process.

[0031] In the above embodiment, as a preferred scheme, the turnover mechanism 5 further comprises two positioning seats 507, two limiting blocks 508 and two limiting grooves 509, wherein the outer surfaces of the two adjusting rods 505 are respectively threadedly connected with the inner walls of the two positioning seats 507, the two limiting blocks 508 are respectively fixedly connected to the top portions of the two positioning seats 507, the two limiting grooves 509 are respectively formed in one side of the outer surfaces of the two clamping plates 506, the inner side walls of the two limiting grooves 509 are respectively clamped with the outer surfaces of the two limiting blocks 508, and the outer surfaces of the other two adjusting rods 505 are respectively threadedly connected with the other sides of the outer surfaces of the two clamping plates 506. Through the thread connection between the two positioning seats 507 and the adjusting rods 505, when the adjusting rods 505 rotate, the limiting blocks 508 and the limiting grooves 509 on the clamping plates 506 can be driven to move along the axis direction of the adjusting rods 505, so that the positioning and fixing of the clamping plates 506 are realized, the accuracy of the position of the clamping plates 506 when clamping the chip is ensured, the two limiting blocks 508 are fixedly connected to the top portions of the positioning seats 507 and clamped with the limiting grooves 509 on the clamping plates 506, so that the movement range of the clamping plates 506 is limited, the clamping operation of the clamping plates 506 on the chip in the correct position is ensured, the reliability of chip positioning and turnover is improved, the two limiting grooves 509 are formed in one side of the outer surfaces of the clamping plates 506 and clamped with the limiting blocks 508, so that through the cooperation with the limiting blocks 508, the positioning and fixing of the clamping plates 506 are realized, the stability of the clamping plates 506 in the working process is ensured, and the loosening of the clamping plates 506 affecting the quality of chip packaging is prevented.

[0032] In the present application, the working steps of the device are as follows: 1. Chip center positioning: start the double-shaft motor 303, the double-shaft motor 303 drives the two threaded rods 304 to rotate through the first bevel gear and the second bevel gear, the two first push frames 305 slide along the length direction of the main mounting plate 301 under the drive of the threaded rods 304 due to the opposite threads on the outer surfaces of the two first push frames 305, the second push frame 306 moves, the second push frame 306 slides in the sliding groove 308 through the sliding block 307, at the same time, the first push frame 305 and the second push frame 306 transmit the movement to the guide block 401, the guide block 401 slides along the guide groove 309 under the limitation of the guide groove 309, the pressing block 402 moves from four directions to the middle part of the main mounting plate 301, pushes the chip to the middle part of the top of the main mounting plate 301 and clamps and fixes it, and the center adjustment of the chip is realized; 2. Chip rotation: if it is necessary to adjust the direction of the chip, start the first motor 202, the first motor 202 drives the driving gear 203 to rotate, the driving gear 203 drives the driven gear 204 and the adjusting plate 205 to rotate through the meshing with the driven gear 204, and then the main mounting plate 301 and the chip mounted thereon rotate to meet the demand of multi-station cooperation in the chip packaging process; 3. Single-sided packaging: after the chip is centrally positioned or rotated to the appropriate position, single-sided packaging operation is performed on the chip, such as bonding, potting, etc. 4. Chip flipping: after the single-sided packaging is completed, the four third motors 504 are started, the third motors 504 drive the adjusting rods 505 to rotate, the adjusting rods 505 are connected with the clamping plates 506 through threads, the clamping plates 506 are moved along the axis of the adjusting rods 505, the chip is clamped and fixed from both sides, then the two second motors 503 are started, the second motors 503 drive the adjusting seats 502 to rotate around the limiting plates 501, the two adjusting seats 502 are synchronously operated, drive the clamping plates 506 and the chip to flip, after the flipping, the clamping plates 506 are placed above the adjacent mounting mechanisms 3; 5. Chip repositioning after flipping: the double-shaft motor 303 is started, the double-shaft motor 303 drives the two threaded rods 304 to rotate through the first and second bevel gears, since the outer surfaces of the two first push frames 305 are threads with opposite threads, the two first push frames 305 slide along the length direction of the main mounting plate 301 under the driving of the threaded rods 304, drive the second push frame 306 to move, the second push frame 306 slides in the sliding groove 308 through the sliding block 307, at the same time, the first and second push frames 305 transmit the movement to the guide block 401, the guide block 401 slides along the guide groove 309 under the limitation of the guide groove 309, drive the pressing block 402 to move from four directions to the middle part of the main mounting plate 301, push the chip to the middle part of the top of the main mounting plate 301 and clamp and fix it, realize the central adjustment of the chip; 6. Device resetting: after the packaging is completed, the height of the mounting mechanism 3 can be adjusted through the air pressure rod 103, the clamping plate 506 is loosened, the packaged chip is taken out, and the next chip packaging operation is prepared.

[0033] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning and adjustment device for chip packaging, characterized in that: Including installation mechanism (3) and locking mechanism (4), wherein: The installation mechanism (3) includes a main mounting plate (301), two auxiliary mounting plates (302), two first push frames (305) and four guide grooves (309), the two auxiliary mounting plates (302) are respectively slidably connected with the two sides of the outer surface of the main mounting plate (301), the two first push frames (305) are slidably connected below the main mounting plate (301), the four guide grooves (309) are two groups, one group of the guide grooves (309) is formed on the surface of one of the auxiliary mounting plates (302), and the other group is formed on the surface of the other auxiliary mounting plate (302); The locking mechanism (4) includes four guide blocks (401) and a driving member, the four guide blocks (401) are two groups, one group of the guide blocks (401) is slidably connected with one of the first push frames (305), the other group of the guide blocks (401) is slidably connected with the other first push frame (305), the four guide blocks (401) correspond to the four guide grooves (309), and the guide blocks (401) are slidably connected in the guide grooves (309), and the driving member is used for driving the two first push frames (305) to move synchronously towards or away from each other.

2. The positioning adjustment apparatus for chip packaging according to claim 1, wherein: The lower portion of the installation mechanism (3) is provided with a supporting mechanism (1), the supporting mechanism (1) includes a supporting plate (101), a plurality of air pressure rods (103), a plurality of mounting grooves (102) and a plurality of push plates (104), the plurality of air pressure rods (103) are fixedly installed at the top of the supporting plate (101), the plurality of mounting grooves (102) are formed at the top of the supporting plate (101), the inner bottom walls of the plurality of mounting grooves (102) are fixedly installed with the bottom ends of the plurality of air pressure rods (103), and the plurality of push plates (104) are fixedly installed at the output ends of the plurality of air pressure rods (103).

3. The positioning adjustment apparatus for chip packaging according to claim 2, wherein: The top of the push plate (104) is provided with a rotating mechanism (2), the rotating mechanism (2) includes a supporting seat (201), a first motor (202) and a driving gear (203), the bottom of the supporting seat (201) is fixedly installed with the top of the push plate (104), the first motor (202) is fixedly installed at the bottom of the supporting seat (201), the driving gear (203) is rotatably connected to the top of the supporting seat (201), and the middle portion of the bottom of the driving gear (203) is connected with the output end of the first motor (202) through key transmission.

4. The positioning adjustment apparatus for chip packaging according to claim 3, wherein: The rotating mechanism (2) further includes a driven gear (204) and an adjusting plate (205), the outer surface of the driven gear (204) is engaged with the outer surface of the driving gear (203), the top of the driven gear (204) is fixedly connected with the bottom of the adjusting plate (205), and the top of the adjusting plate (205) is fixedly connected with the bottom of the main mounting plate (301).

5. The positioning adjustment apparatus for chip packaging of claim 1, wherein: The driving member comprises a double-shaft motor (303), the bottom of the double-shaft motor (303) is fixedly installed on the bottom of the main mounting plate (301), two threaded rods (304) are rotatably connected to the lower side of the main mounting plate (301) and located on the two sides of the outer surface of the double-shaft motor (303), the two output ends of the double-shaft motor (303) are both connected with a first bevel gear through key transmission, the mounting mechanism (3) further comprises two threaded rods (304), a second bevel gear is fixedly installed on the outer surface of each threaded rod (304), the outer surface of the first bevel gear is engaged with the outer surface of the second bevel gear, the outer surface of each threaded rod (304) is threadedly connected with the outer surface of each first push frame (305), and the threads on the outer surfaces of the two first push frames (305) are respectively normal threads and reverse threads.

6. The positioning adjustment apparatus for chip packaging according to claim 5, wherein: The driving member further comprises four second push frames (306), a plurality of sliding blocks (307), a plurality of sliding grooves (308) and four stretch springs (3010), the four second push frames (306) are slidably connected to the two sides of the outer surfaces of the two first push frames (305), the plurality of sliding blocks (307) are fixedly installed on the two sides of the outer surfaces of the two first push frames (305), the plurality of sliding grooves (308) are formed on the outer surfaces of the four second push frames (306), the outer surfaces of the plurality of sliding blocks (307) are slidably connected with the inner side walls of the plurality of sliding grooves (308), and one end of each of the four stretch springs (3010) is fixedly connected with the two sides of the bottom of each of the two auxiliary mounting plates (302), and the other end of each of the four stretch springs (3010) is fixedly connected with the two sides of the outer surface of the main mounting plate (301).

7. The positioning adjustment apparatus for chip packaging according to claim 6, wherein: The locking mechanism (4) further comprises four fastening bolts (403) and pressing blocks (402), the four fastening bolts (403) are threadedly connected to the one end of the four guide blocks (401) penetrating through the pressing blocks (402), the outer surfaces of the four guide blocks (401) are slidably connected to the inner side walls of the two first push frames (305) and the inner side walls of the four second push frames (306) respectively, the middle portions of the outer surfaces of the four guide blocks (401) are slidably connected to the inner walls of the four guide grooves (309) respectively, and the four pressing blocks (402) are detachably connected to the top of the outer surface of each of the four guide blocks (401) and located above the two auxiliary mounting plates (302).

8. The positioning adjustment apparatus for chip packaging of claim 1, wherein: The turnover mechanism (5) comprises a limiting plate (501), an adjusting seat (502) and a clamping plate (506), the limiting plate (501) is fixedly installed on the bottom of the auxiliary mounting plate (302), the adjusting seat (502) is rotatably connected to the outer side of the limiting plate (501), and the clamping plate (506) is slidably connected to the upper side of the adjusting seat (502).

9. The positioning adjustment apparatus for chip packaging according to claim 8, wherein: The turnover mechanism (5) further comprises four second motors (503), four third motors (504) and four adjusting rods (505), the four second motors (503) are fixedly installed on the outer walls of the four limiting plates (501) respectively, the output ends of the four second motors (503) are drivingly connected with the outer walls of the four adjusting bases (502) through keys respectively, the four third motors (504) are fixedly installed on the outer walls of the four adjusting bases (502) respectively, the four adjusting rods (505) are rotatably connected with the inner side walls of the four adjusting bases (502) respectively, and the output ends of the four third motors (504) are drivingly connected with the end portions of the four adjusting rods (505) through keys respectively.

10. The positioning adjustment apparatus for chip packaging according to claim 9, wherein: The turnover mechanism (5) further comprises two positioning seats (507), two limiting blocks (508) and two limiting grooves (509), the outer surfaces of the two adjusting rods (505) are threadedly connected with the inner walls of the two positioning seats (507) respectively, the two limiting blocks (508) are fixedly connected with the top portions of the two positioning seats (507) respectively, the two limiting grooves (509) are formed in one side of the outer surfaces of the two clamping plates (506) respectively, the inner side walls of the two limiting grooves (509) are clamped with the outer surfaces of the two limiting blocks (508) respectively, and the outer surfaces of the other two adjusting rods (505) are threadedly connected with the other sides of the outer surfaces of the two clamping plates (506) respectively.

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