High-precision wafer alignment device

Abstract

The invention relates to the technical field of temporary wafer bonding, in particular to a high-precision wafer alignment device, and mainly solves the technical problem that a wafer alignment device is low in precision. The device comprises a rack, a visual mechanism, an adsorption platen, an XYZ three-axis platform, a rotating platform and an adjusting platform, the rack comprises a base and a portal frame, the visual mechanism is installed above a cross beam of the portal frame, the adsorption platen is fixed below the cross beam of the portal frame, the XYZ three-axis platform is installed on the base and located on the inner side of the portal frame, and the rotating platform is installed on the XYZ three-axis platform. The adjusting platform comprises a bottom plate, a top plate and leveling assemblies, the bottom plate is fixed to the rotating platform, and the leveling assemblies are connected between the bottom plate and the top plate and distributed at intervals in the circumferential direction. According to the device, on one hand, position calibration of the lower wafer and the upper wafer can be achieved, on the other hand, precision reduction caused by taking down, transferring and placing can be avoided, the precision of the upper wafer and the lower wafer when the upper wafer and the lower wafer are finally fixed can be guaranteed through cooperation of the two aspects, and therefore the process requirement is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temporary wafer bonding, in particular to a high-precision wafer alignment device. BACKGROUND

[0002] Temporary wafer bonding refers to the technology of coating a temporary bonding glue layer on the surface of an upper wafer and / or the surface of a lower wafer, and cross-linking the temporary bonding glue layer through UV curing, hot pressing and other processes, so as to realize the close combination of the upper and lower wafers to form a wafer pair. Temporary wafer bonding is generally completed through equipment such as a feeding device, an alignment device, a bonding device, a cooling station separation device, etc. Among them, the alignment device is an important equipment in the process of temporary wafer bonding, which needs to be configured with a chuck when in use. The chuck is adsorbed on an alignment platform, a mechanical hand picks up an upper wafer and a lower wafer, and adsorbs the upper wafer on an upper adsorption table and the lower wafer on the chuck. After visual calibration, the two wafers are brought into contact and separated at the edge by a spacer to ensure that the air between the two wafers is exhausted before bonding. Finally, the upper and lower wafers are pressed and fixed by a pre-pressing rod, and then the chuck is transported to the next process.

[0003] The existing alignment device needs to take out the upper wafer alone after visual alignment and then place it on the lower wafer before being pressed and fixed. However, the process of taking out the upper wafer from the upper adsorption table will cause precision loss. The upper wafer is prone to slight positional deviation due to air flow disturbance and other external factors during the transfer process. When the upper wafer is placed on the lower wafer, it will also cause slight impact and generate slight positional deviation. Multiple factors cause the precision of the upper and lower wafers to be greatly reduced when they are finally fixed, which is difficult to meet the process requirements.

[0004] Therefore, there is an urgent need for a high-precision wafer alignment device. SUMMARY

[0005] In order to overcome the technical defects of low precision of the existing wafer alignment device, the present application provides a high-precision wafer alignment device.

[0006] The high-precision wafer alignment device provided by the present application comprises: a rack comprising a base and a gantry, the gantry being fixed on the base; a vision mechanism installed above the cross beam of the gantry; an adsorption table plate fixed below the cross beam of the gantry, the lower surface of the adsorption table plate being used to vacuum adsorb an upper wafer, and the adsorption table plate being provided with a notch for visual alignment; an XYZ three-axis platform installed on the base and located on the inner side of the gantry; a rotating platform installed on the XYZ three-axis platform and having a rotating axis arranged along the Z direction; The adjusting platform comprises a bottom plate, a top plate and a leveling assembly, the bottom plate is fixed on the rotating platform, the leveling assembly is connected between the bottom plate and the top plate and is circumferentially spaced with multiple sets, the top plate is used to adsorb the chuck, the top plate is further provided with a negative pressure connecting assembly used to connect the negative pressure channel of the chuck, the bottom plate is further provided with a first driving assembly used to drive the chuck spacer and a second driving assembly used to drive the chuck pre-pressing rod, and the second driving assembly is arranged corresponding to the notch.

[0007] Optionally, the base comprises a chassis, a marble plate and a shock pad, the marble plate is fixed on the chassis through the shock pad.

[0008] Optionally, the adsorption platform is provided with two notches distributed at 180°, the visual mechanism comprises two sets of visual assemblies, each set of visual assembly comprises a moving plate and a visual camera, the moving plate is installed above the cross beam of the gantry and can be driven to move along the direction of the connecting line of the two notches, and the visual camera is installed on the moving plate and can be driven to rise and fall.

[0009] Optionally, the visual mechanism further comprises three sets of edge cameras, two sets of edge cameras are installed on the two moving plates respectively and are collinear with the visual cameras of the two sets of visual assemblies, and the remaining one set of edge camera is installed on the cross beam of the gantry and the adsorption platform is provided with a detection port corresponding to the edge camera, and each set of edge camera can be driven to rise and fall.

[0010] Optionally, the adsorption platform is a microporous ceramic adsorption disc.

[0011] Optionally, the leveling assembly comprises: a fixed seat fixed on the bottom plate; a sliding block installed on the fixed seat and driven to move horizontally; a lifting block installed on the fixed seat and capable of free lifting, the lifting block and the sliding block are connected through a wedge-shaped structure to drive the lifting block to lift when the sliding block moves horizontally; a connecting rod with a bottom end fixedly connected with the lifting block and a top end movably connected with the top plate.

[0012] Optionally, the bottom of the sliding block is connected with the fixed seat through a first cross roller guide rail, and the top of the sliding block is connected with the lifting block through a second cross roller guide rail, and the second cross roller guide rail is inclinedly arranged to form the wedge-shaped structure.

[0013] Optionally, the leveling assembly is provided with two groups distributed at 180°, the first group of leveling assemblies comprises two sets of leveling assemblies, and the top end of the connecting rod of the first group of leveling assemblies is movably connected with the top plate through the cooperation of the ball and the V-shaped groove, the second group of leveling assemblies comprises one set of leveling assembly, and the top end of the connecting rod of the second group of leveling assemblies is movably connected with the top plate through the ball hinge structure.

[0014] Optionally, the top plate is further provided with a jacking assembly, a plurality of sets of the jacking assembly are distributed at intervals in the circumferential direction, the jacking assembly comprises a jacking driving member and a top pin, the jacking driving member is installed below the top plate, the top pin is connected to the output end of the top pin driving member and can penetrate the top plate and the chuck under the driving of the jacking driving member, and the top pins of the plurality of sets of jacking assemblies are used to clamp the edges of the lower wafer to achieve preliminary positioning.

[0015] Compared with the prior art, the technical scheme provided by the present application has the following advantages: The high-precision wafer alignment device provided by the present application can realize the position calibration of the lower wafer and the upper wafer, and ensure the alignment precision, on the one hand, by recognizing the marks of the upper and lower wafers through the vision mechanism and adjusting the position of the chuck through the leveling assembly, the XYZ three-axis platform and the rotary platform, and on the other hand, by driving the lower wafer, the chuck and the adjusting platform as a whole through the XYZ three-axis platform after the vision alignment, so that the lower wafer contacts the upper wafer, and then the second driving assembly arranged in the corresponding gap drives the pre-pressing rod to complete the pressing and fixing of the upper and lower wafers, and the wafer does not need to be separated from the original adsorption surface in the whole process, so that the precision decline caused by taking down, transferring and placing can be avoided. The cooperation of the two aspects can ensure the precision of the upper and lower wafers when they are finally fixed, so as to meet the process requirements. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present application and, together with the specification, serve to explain the principles of the application.

[0017] In order to more clearly illustrate the technical schemes in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or the prior art description will be briefly introduced below, and obviously, other accompanying drawings can also be obtained by those skilled in the art without creative labor.

[0018] Figure 1 The structure schematic diagram of the high-precision wafer alignment device in the embodiment of the present application is shown. Figure 2 The structure schematic diagram of the vision mechanism in the embodiment of the present application is shown. Figure 3 The structure schematic diagram of the adsorption base plate in the embodiment of the present application is shown. Figure 4 Fig. 6 shows a structural schematic diagram of the adjusting platform in the embodiment of the present application; Figure 5 Fig. 7 shows a structural schematic diagram of the first set of leveling assemblies in the embodiment of the present application; Figure 6 Fig. 8 shows a structural schematic diagram of the second set of leveling assemblies in the embodiment of the present application; Figure 7 Fig. 9 shows a structural schematic diagram of the top plate and the accessory components in the embodiment of the present application; Figure 8 Fig. 10 shows a structural schematic diagram of the bottom plate and the accessory components in the embodiment of the present application; Figure 9 Fig. 11 shows a structural schematic diagram of the chuck adapted to the high-precision wafer alignment device in the embodiment of the present application.

[0019] In the drawings: 1, frame; 11, base; 111, bottom frame; 112, marble plate; 113, shock pad; 12, gantry; 2, vision mechanism; 21, moving plate; 22, vision camera; 23, edge camera; 3, adsorption platform; 31, notch; 32, detection port; 4, XYZ three-axis platform; 5, rotating platform; 6, adjusting platform; 61, bottom plate; 62, top plate; 63, leveling assembly; 631, fixing seat; 632, sliding block; 633, lifting block; 634, connecting rod; 635, first cross roller guide rail; 636, second cross roller guide rail; 64, negative pressure connecting assembly; 65, first driving assembly; 651, telescopic cylinder; 652, lever; 66, second driving assembly; 661, lifting and rotating combined driving pair; 662, claw; 67, jacking assembly; 671, jacking driving piece; 672, jacking pin; 68, support plate; 100, inner disc body; 200, outer ring frame; 300, spacer assembly; 400, pre-pressing assembly. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the solutions of the present application will be further described below. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] In the description, it needs to be explained that the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. It needs to be explained that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0022] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein; obviously, the examples in the specification are only some of the embodiments of the present application, not all the embodiments.

[0023] The following will be described in detail Figures 1 to 9 The specific embodiments of the present application are described in detail.

[0024] The embodiment provides a high-precision wafer alignment device, which comprises a rack 1, a visual mechanism 2, a suction table plate 3, an XYZ three-axis platform 4, a rotating platform 5 and an adjusting platform 6.

[0025] The rack 1 comprises a base 11 and a gantry 12, and the gantry 12 is fixed on the base 11.

[0026] Specifically, the base 11 of the embodiment comprises a base frame 111, a marble plate 112 and a shock pad 113, and the marble plate 112 is fixed on the base frame 111 through the shock pad 113. The marble plate 112 has good flatness, and the shock pad 113 can improve the buffering capacity of the device. In other embodiments, the base 11 can also adopt a box-shaped structure and the like.

[0027] The visual mechanism 2 is installed above the cross beam of the gantry 12, the suction table plate 3 is fixed below the cross beam of the gantry 12, the lower surface of the suction table plate 3 is used for vacuum suction of the upper wafer, and the suction table plate 3 is provided with a notch 31 for visual alignment.

[0028] Specifically, the adsorption platform 3 of the embodiment is provided with two notches 31 distributed at 180°, and the vision mechanism 2 includes two sets of vision assemblies, each of which includes a moving plate 21 and a vision camera 22. The moving plate 21 is installed above the crossbeam of the gantry 12 and can be driven to move along the line connecting the two notches 31. The vision camera 22 is installed on the moving plate 21 and can be driven to rise and fall. The moving plate 21 and the vision camera 22 can be driven by a linear power element such as a linear slide. The vision camera 22 can be moved to different positions by the sliding of the moving plate 21 to adapt to wafers at different identification positions. The cooperation of the two sets of vision assemblies can improve the accuracy of vision alignment. In other embodiments, one or three sets of vision assemblies can be provided.

[0029] Further, the vision mechanism 2 further includes three sets of edge cameras 23, two of which are installed on the two moving plates 21 and are collinear with the vision cameras 22 of the two sets of vision assemblies, and the remaining one is installed on the crossbeam of the gantry 12 and the adsorption platform 3 is provided with a detection port 32 corresponding to the edge camera 23. Each set of edge camera 23 can be driven to rise and fall. The edge camera 23 can be driven by a linear power element such as a linear slide. The position of the remaining set of edge cameras 23 is not limited, and is preferably installed at the middle position of the two sets of vision cameras 22. The three sets of edge cameras 23 can detect the edge of the wafer, and the cooperation with the vision camera 22 can improve the detection accuracy.

[0030] It should be noted that, Figure 3 The adsorption platform 3 is provided with two notches 31 and two detection ports 32, one set of vision assembly is installed at each notch 31, and only one detection port 32 is provided with an edge camera 23.

[0031] Specifically, the adsorption platform 3 of the embodiment is a microporous ceramic adsorption disc, which has the advantages of high flatness and high cleanliness. In other embodiments, the adsorption platform 3 can also be a metal suction disc.

[0032] The XYZ three-axis platform 4 is installed on the base 11 and located on the inner side of the gantry 12.

[0033] It is easy to understand that the XYZ three-axis platform 4 is a mature structure in the art, which will not be described here.

[0034] The rotating platform 5 is installed on the XYZ three-axis platform 4 and the rotating axis is arranged along the Z direction.

[0035] Specifically, the structure of the rotating platform 5 is not limited, for example, the rotating platform 5 of the embodiment is a gas floating rotating structure, which has small friction and high precision.

[0036] The adjusting platform 6 comprises a bottom plate 61, a top plate 62 and a leveling assembly 63, the bottom plate 61 is fixed on the rotating platform 5, the leveling assembly 63 is connected between the bottom plate 61 and the top plate 62 and is circumferentially spaced and distributed with multiple sets, the top plate 62 is used to adsorb the chuck, the top plate 62 is further provided with a negative pressure connecting assembly 64 used to butt joint the negative pressure channel of the chuck, the bottom plate 61 is further provided with a first driving assembly 65 used to drive the chuck spacer and a second driving assembly 66 used to drive the chuck pre-pressing rod, and the second driving assembly 66 is arranged corresponding to the gap 31.

[0037] Specifically, the leveling assembly 63 of the embodiment comprises a fixing seat 631, a sliding block 632, a lifting block 633 and a connecting rod 634; the fixing seat 631 is fixed on the bottom plate 61; the sliding block 632 is installed on the fixing seat 631 and can be driven to move horizontally; the lifting block 633 is installed on the fixing seat 631 and can freely lift and lower, the lifting block 633 is slidably connected with the sliding block 632 through a wedge-shaped structure to drive the lifting block 633 to lift and lower when the sliding block 632 moves horizontally; the bottom end of the connecting rod 634 is fixedly connected with the lifting block 633 and the top end is movably connected with the top plate 62. The sliding block 632 can be driven by a linear power element such as a linear sliding table. The lifting block 633 can freely lift and lower through a guide rail pair or a column sleeve pair or other commonly used guide pairs. When in action, the horizontal movement of the sliding block 632 is converted into the lifting and lowering of the lifting block 633 through the wedge-shaped structure, so as to adjust the height of the top plate 62.

[0038] More specifically, the bottom of the sliding block 632 is connected with the fixing seat 631 through a first cross roller guide rail 635, and the top of the sliding block 632 is connected with the lifting block 633 through a second cross roller guide rail 636, and the second cross roller guide rail 636 is arranged obliquely to form a wedge-shaped structure. The cross roller guide rail has the advantages of low friction and high precision. In other embodiments, a guide rail pair can also be used to connect the sliding block 632 on the fixing seat 631, and a wedge-shaped structure can also be formed by the cooperation of an obliquely arranged guide groove and a sliding rod.

[0039] Specifically, the leveling assembly 63 of the embodiment is provided in two groups distributed at 180°. The first group of leveling assembly 63 includes two sets of leveling assembly 63, and the top end of the connecting rod 634 of the first group of leveling assembly 63 is movably connected with the top plate 62 through the cooperation of the ball and the V-shaped groove. The second group of leveling assembly 63 includes one set of leveling assembly 63, and the top end of the connecting rod 634 of the second group of leveling assembly 63 is movably connected with the top plate 62 through the ball hinge structure. During the leveling process, the top plate 62 will not only be offset in the vertical direction, but also be offset in the horizontal direction. Therefore, the leveling assembly 63 of the embodiment is provided in two groups arranged oppositely: one group adopts the cooperation of the ball and the V-shaped groove, which can compensate for the vertical offset and the horizontal offset at the same time; the other group adopts the ball hinge structure, which ensures that the position of the top plate 62 does not be greatly offset, and also compensates for the angle change of the top plate 62 during the leveling process.

[0040] Specifically, the structure of the negative pressure connecting assembly 64 is not limited, for example, the negative pressure connecting assembly 64 in the embodiment adopts an elastic structure, which can abut on the negative pressure channel of the chuck with a certain elastic force, thereby ensuring the sealing butt joint.

[0041] For the first driving assembly 65 and the second driving assembly 66, the configuration of the chuck should be designed, which should be easily designed by those skilled in the art.

[0042] For example, the chuck structure configured by the high-precision wafer alignment device of the embodiment is as shown in Figure 9 The chuck includes an inner disc body 100 and an outer ring frame 200, and is provided with a spacer assembly 300 and a pre-pressing assembly 400. The spacer of the spacer assembly 300 is pulled to have a working state above the inner disc body 100 and an avoidance state away from the inner disc body 100. The pre-pressing rod of the pre-pressing assembly 400 is lifted and rotated to have a pre-pressing state above the inner disc body 100 and a storage state in the outer ring frame 200.

[0043] Therefore, the first driving assembly 65 of the embodiment is designed as a combination of a telescopic cylinder 651 and a push rod 652. The telescopic cylinder 651 is horizontally arranged, drives the push rod 652 to move horizontally, and the push rod 652 pulls the spacer. The second driving assembly 66 is designed as a combination of a lifting and rotating combined driving pair 661 and a claw 662. The lifting and rotating combined driving pair 661 drives the claw 662 to lift and rotate, and the claw 662 drives the pre-pressing assembly 400 to lift and rotate.

[0044] It should be noted that a plurality of support plates 68 are also provided between the bottom plate 61 and the top plate 62. An active gap is reserved between the support plate 68 and the top plate 62 to compensate for the position offset of the top plate 62 during the leveling process. The support plate 68 is mainly used to support the top plate 62 and its attached structures in the non-working state.

[0045] Further, the top plate 62 is further provided with a plurality of sets of jacking assemblies 67 which are distributed in a circumferential direction, the jacking assemblies 67 comprising a jacking driving member 671 and a jacking pin 672, the jacking driving member 671 being installed below the top plate 62, the jacking pin 672 being connected to an output end of the jacking pin 672 driving member and being capable of penetrating the top plate 62 and chuck under the driving of the jacking driving member 671, the jacking pins 672 of the plurality of sets of jacking assemblies 67 being used to clamp the edges of the lower wafer to achieve preliminary positioning. The jacking assembly 67 can be a linear power member such as a pneumatic cylinder. After the mechanical hand picks up the lower wafer, the lower wafer is first placed between the plurality of jacking pins 672, so that the edges of the wafer are clamped in the plurality of jacking pins 672 at the same time, thereby achieving preliminary positioning, and then the jacking driving member 671 drives the jacking pins 672 and the lower wafer to descend as a whole until the lower wafer falls onto the chuck, thereby improving the position accuracy of the lower wafer and avoiding large errors.

[0046] The working principle of the high-precision wafer alignment device of the embodiment is as follows: 1) The mechanical hand transfers the chuck to the top plate 62, and the chuck is fixed to the top plate 62 by negative pressure adsorption; 2) The mechanical hand transfers the upper wafer to the adsorption table plate 3, and the upper wafer is fixed to the lower surface of the adsorption table plate 3 by negative pressure adsorption; 3) The jacking driving member 671 drives the jacking pins 672 to extend, and the mechanical hand transfers the lower wafer to the jacking pins 672, and the edges of the lower wafer are clamped inside the plurality of jacking pins 672; 4) The jacking driving member 671 drives the jacking pins 672 to retract, and the lower wafer falls onto the chuck and is fixed by negative pressure adsorption; 5) The visual mechanism 2 detects the marks of the upper wafer and the lower wafer to obtain a position difference signal; 6) The leveling assembly 63, the XYZ three-axis platform 4 and the rotary platform 5 cooperatively act according to the position difference signal to make a slight adjustment to the lower wafer until the lower wafer is positionally aligned with the upper wafer; 7) The first driving assembly 65 drives the spacer to act, so that the spacer switches to a working state; 8) The XYZ three-axis platform 4 drives the rotary platform 5, the adjusting platform 6, the chuck and the lower wafer to move upward as a whole until the lower wafer contacts the upper wafer; 9) The second driving assembly 66 drives the pre-pressing rod to act, so that the pre-pressing rod switches to a pre-pressing state; 10) The adsorption table plate 3 loses negative pressure, the XYZ three-axis platform 4 descends, the top plate 62 loses negative pressure, and the mechanical hand transfers the chuck, the upper wafer and the lower wafer as a whole to the next process.

[0047] The above merely describes specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Although the foregoing embodiments are described in detail, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some or all of the technical features can be replaced equivalently, and these modifications or replacements do not cause the nature of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments, and should be covered in the protection scope of the claims.

Claims

1. A high precision wafer alignment device, characterized by, The utility model relates to a wafer visual alignment and vacuum adsorption device, which comprises the following components: a rack (1) comprising a base (11) and a portal frame (12) fixed to the base (11); a visual mechanism (2) installed above the crossbeam of the portal frame (12); an adsorption platform (3) fixed below the crossbeam of the portal frame (12), the lower surface of the adsorption platform (3) being used to vacuum adsorb a wafer, and the adsorption platform (3) being provided with a notch (31) used for visual alignment; an XYZ three-axis platform (4) installed on the base (11) and located inside the portal frame (12); a rotating platform (5) installed on the XYZ three-axis platform (4) and having a rotating axis arranged along the Z direction; an adjusting platform (6) comprising a bottom plate (61), a top plate (62) and a leveling assembly (63), the bottom plate (61) being fixed to the rotating platform (5), the leveling assembly (63) being connected between the bottom plate (61) and the top plate (62) and being spaced apart and distributed in a circumferential direction, the top plate (62) being used to adsorb a chuck, the top plate (62) being further provided with a negative pressure connecting assembly (64) used to connect with a negative pressure channel of the chuck, the bottom plate (61) being further provided with a first driving assembly (65) used to move a chuck partition and a second driving assembly (66) used to move a chuck pre-pressing rod, and the second driving assembly (66) being arranged corresponding to the notch (31).

2. The high precision wafer alignment device of claim 1, wherein, The base (11) comprises a chassis (111), a marble plate (112) and a shock pad (113), the marble plate (112) being fixed to the chassis (111) through the shock pad (113).

3. The high precision wafer alignment device of claim 1, wherein, The adsorption platform (3) is provided with two notches (31) distributed at 180°, the visual mechanism (2) comprises two sets of visual assemblies, each set of visual assembly comprising a moving plate (21) and a visual camera (22), the moving plate (21) being installed above the crossbeam of the portal frame (12) and being driven to move along the line connecting the two notches (31), the visual camera (22) being installed on the moving plate (21) and being driven to be raised and lowered.

4. The high precision wafer alignment device of claim 3, wherein, The visual mechanism (2) further comprises edge extension cameras (23), the edge extension cameras (23) being provided with three sets, two sets of edge extension cameras (23) being respectively installed on the two moving plates (21) and being collinear with the visual cameras (22) of the two sets of visual assemblies, and the remaining one set of edge extension cameras (23) being installed on the crossbeam of the portal frame (12), and the adsorption platform (3) being provided with a detection port (32) corresponding to the edge extension camera (23), each set of edge extension cameras (23) being driven to be raised and lowered.

5. The high precision wafer alignment device of claim 1, wherein, The adsorption platform (3) is a microporous ceramic adsorption disc.

6. The high precision wafer alignment device of claim 1, wherein, The leveling assembly (63) comprises: a fixed seat (631) fixed to the bottom plate (61); a sliding block (632) installed on the fixed seat (631) and driven to move in a horizontal direction; A lifting block (633) is installed on the fixed seat (631) and can freely lift and lower, and the lifting block (633) is connected with the sliding block (632) through a wedge-shaped structure to drive the lifting block (633) to lift and lower when the sliding block (632) moves horizontally; A connecting rod (634) is fixedly connected with the bottom end of the lifting block (633) and movably connected with the top end of the top plate (62).

7. The high precision wafer alignment device of claim 6, wherein, The bottom of the sliding block (632) is connected with the fixed seat (631) through a first cross roller guide (635), and the top of the sliding block (632) is connected with the lifting block (633) through a second cross roller guide (636), and the second cross roller guide (636) is arranged obliquely to form the wedge-shaped structure.

8. The high precision wafer alignment device of claim 6 or 7, wherein, The leveling assembly (63) is provided with two groups distributed at 180°, the first group of leveling assemblies (63) includes two sets of leveling assemblies (63), and the top end of the connecting rod (634) of the first group of leveling assemblies (63) is movably connected with the top plate (62) through the cooperation structure of the ball and the V-shaped groove, and the second group of leveling assemblies (63) includes one set of leveling assemblies (63), and the top end of the connecting rod (634) of the second group of leveling assemblies (63) is movably connected with the top plate (62) through the ball hinge structure.

9. The high precision wafer alignment device of claim 1, wherein, The top plate (62) is also provided with a jacking assembly (67), and a plurality of sets of jacking assemblies (67) are distributed at intervals in the circumferential direction, the jacking assembly (67) includes a jacking driving member (671) and a jack (672), the jacking driving member (671) is installed below the top plate (62), the jack (672) is connected to the output end of the jack driving member (671) and can penetrate the top plate (62) and the chuck under the driving of the jacking driving member (671), and the jacks (672) of the plurality of sets of jacking assemblies (67) are used to clamp the edges of the wafer to achieve preliminary positioning.

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