Electronic skin and manufacturing method thereof
By designing the structure of the encapsulation layer, conductive network, and adhesive gel layer in the electronic skin, especially by utilizing the deformation characteristics of the hollow structure and flexible contact electrodes, the problem of high contact impedance was solved, resulting in more efficient electrical signal transmission and better performance.
Patent Information
- Application Number
- CN202411017509.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2026-01-27
AI Technical Summary
The existing electronic skin has a large contact impedance with the object being tested, which leads to distortion of electrical signals and affects its practicality.
The structure employs an encapsulation layer, a conductive network, and an adhesive gel layer. The conductive network includes flexible contact electrodes and terminals, while the adhesive gel layer has a hollow structure that exposes the flexible contact electrodes and terminals. The flexible contact electrodes contact and deform with the object to be contacted to reduce contact resistance.
This reduces the contact impedance between the flexible contact electrode and the object to be contacted, thereby improving the quality and performance of electrical signal transmission in the electronic skin.
Smart Images
Figure CN121400784A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic skin technology, and more particularly to an electronic skin and its manufacturing method. Background Technology
[0002] Electronic skin is a flexible electronic device that can be attached to biological skin like a band-aid to monitor data such as blood oxygen and heart rate in real time. It can also be used to detect internal conditions in non-biological materials, such as cracks and pores. When electronic skin is installed on the object being tested, the contact impedance between the electronic skin and the object is a crucial factor affecting the quality of the electronic skin's output electrical signal. Higher contact impedance will result in distorted electrical signals, thus reducing the practicality of the electronic skin.
[0003] Therefore, how to reduce the contact impedance between the electronic skin and the object to be tested has become a technical problem that urgently needs to be solved in this field. Summary of the Invention
[0004] This invention provides an electronic skin and a method for manufacturing the same, which reduces the contact impedance between the electronic skin and the object to be tested.
[0005] In a first aspect, embodiments of the present invention provide an electronic skin, comprising: an encapsulation layer, a conductive network disposed on the encapsulation layer, and an adhesive gel layer;
[0006] The conductive network includes flexible contact electrodes and terminals. The flexible contact electrodes are used to contact the object to be contacted, and the terminals are used to transmit electrical signals.
[0007] The adhesive gel layer has a first perforated structure, which exposes the flexible contact electrode and the terminal.
[0008] Secondly, embodiments of the present invention provide a method for manufacturing electronic skin as described in the first aspect above, comprising:
[0009] Form an encapsulation layer;
[0010] A conductive network is formed on the encapsulation layer;
[0011] An adhesive gel layer is formed on top of the encapsulation layer.
[0012] The beneficial effects of this invention are as follows:
[0013] This invention provides an electronic skin and its manufacturing method, comprising: an encapsulation layer, a conductive network disposed on the encapsulation layer, and an adhesive gel layer; the conductive network includes flexible contact electrodes and terminals, the flexible contact electrodes being used to contact an object to be contacted, and the terminals being used to transmit electrical signals; the adhesive gel layer has a first perforated structure, exposing the flexible contact electrodes and terminals. Thus, the adhesive gel layer can bond the electronic skin to the object to be contacted, allowing the flexible contact electrodes to contact the object. Furthermore, because the flexible contact electrodes can deform upon contact with the object, they can better conform to the surface of the object, reducing the contact impedance between the flexible contact electrodes and the object, thereby resulting in lower contact impedance during use and improved performance of the electronic skin. Attached Figure Description
[0014] Figure 1 This is a cross-sectional view of an electronic skin provided in an embodiment of the present invention;
[0015] Figure 2 This is a cross-sectional view of another electronic skin provided in an embodiment of the present invention;
[0016] Figure 3 This is a view of the electronic skin provided in this embodiment of the invention, viewed from the side of the adhesive gel layer.
[0017] Figure 4 This is a flowchart illustrating a method for manufacturing electronic skin according to an embodiment of the present invention;
[0018] Figure 5 This is a graph showing the relationship between the phase transition time and temperature of the adhesive gel layer provided in an embodiment of the present invention.
[0019] Figure 6 This is a diagram showing the relationship between sweat secretion and the adhesive gel layer provided in an embodiment of the present invention;
[0020] Figure 7 This is a graph showing the relationship between relative humidity and temperature and conductivity, as provided in an embodiment of the present invention. Detailed Implementation
[0021] The specific embodiments of an electronic skin and its manufacturing method provided by the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
[0022] This invention provides an electronic skin, such as... Figure 1As shown, it includes: an encapsulation layer 100, a conductive network 200 disposed on the encapsulation layer, and an adhesive gel layer 300; the conductive network 200 includes a flexible contact electrode 201 and a terminal 202, the flexible contact electrode 201 is used to contact the object 400 to be contacted, and the terminal 202 is used to transmit electrical signals; the adhesive gel layer 300 has a first hollow structure K1, the first hollow structure K1 exposing the flexible contact electrode 201 and the terminal 202.
[0023] In this way, the adhesive gel layer can bond the electronic skin to the object to be contacted, allowing the flexible contact electrode to make contact with the object. Furthermore, since the flexible contact electrode can deform when it comes into contact with the object, it can fit the surface of the object more closely, reducing the contact resistance between the flexible contact electrode and the object. This results in the electronic skin having lower contact resistance during use and improving the performance of the electronic skin.
[0024] It should be understood that electronic skin can be used, but is not limited to: measuring human physiological signals, such as electrical impedance tomography; or, dynamic monitoring of mechanical operation, such as crack detection inside moving machinery; or, characterization of animal and plant physiology, etc.
[0025] Optionally, such as Figure 1 As shown, the conductive network 200 also includes a transmission line 203, which is used to connect the flexible contact electrode 201 and the terminal 202. The transmission line 203 is located between the encapsulation layer 100 and the adhesive gel layer 300.
[0026] The conductive network, including flexible contact electrodes, terminals, and transmission lines, can be made of the same material, such as a flexible conductive material. This simplifies the fabrication process, reduces the cost of the electronic skin, and lowers the contact impedance between the flexible contact electrodes and the object being contacted. Alternatively, the flexible contact electrodes, terminals, and transmission lines can be made of different materials. The flexible contact electrodes can be made of a flexible conductive material to reduce the contact impedance between them and the object. The terminals and transmission lines, however, do not need to consider contact impedance and can therefore be made of any material with high conductivity to reduce signal transmission loss.
[0027] Thus, by placing the transmission line between the encapsulation layer and the adhesive gel layer, the transmission line is covered by the encapsulation layer and the adhesive gel layer, reducing the influence of external noise signals on signal transmission, thereby reducing the distortion of electrical signals when they are transmitted in the transmission line and improving the performance of the electronic skin.
[0028] Furthermore, when the flexible contact electrodes, terminals, and transmission lines are all made of the same material, the conductive network is made of an organic conductive composition and conductive nanowires; the organic conductive composition includes poly(3,4-ethylenedioxythiophene) and sulfonates. The conductive nanowires include, but are not limited to, silver nanowires, gold nanowires, titanium nanowires, etc., and the diameter of the conductive nanowires can be set according to actual needs; the sulfonates include, but are not limited to, poly(styrene sulfonate), amino acid sulfonates, alkyl sulfonates, etc.
[0029] Thus, the organic conductive composition made of poly(3,4-ethylenedioxythiophene) and sulfonate gives the conductive network good flexibility, and the conductive nanowires improve the conductivity of the conductive network, thereby obtaining a conductive network that has both flexibility and high conductivity, thus improving the performance of electronic skin.
[0030] Of course, when flexible contact electrodes, terminals and transmission lines are made of different materials, flexible contact electrodes can still be made of flexible conductive materials made of organic conductive compositions and conductive nanowires, thereby reducing the contact resistance between the flexible contact electrode and the object to be contacted. Of course, other flexible conductive materials can also be used, and this is not limited here.
[0031] Optionally, the organic conductive composition further includes an aqueous polyurethane solution. The aqueous polyurethane solution increases the viscosity of the organic conductive composition, thereby maintaining the shape of the conductive network for a longer period during fabrication. This makes the conductive network less prone to deformation during preparation, facilitating its fabrication and simplifying the manufacturing process of the electronic skin.
[0032] In addition, the conductive network described above has good conductivity and flexibility, so in addition to being used in electronic skin, it can also be used in other application scenarios, such as, but not limited to, using it as a conductive layer in photovoltaic materials, or as a stretchable electrode, etc., which are not limited here.
[0033] Optionally, such as Figure 2 As shown, the electronic skin also includes a solid support layer 500 located between the adhesive gel layer 300 and the encapsulation layer 100; the solid support layer 500 has a second perforated structure K2, which exposes the flexible contact electrode 201 and the terminal 202. Thus, by providing the solid support layer 500, the conductive network 200 can be better fixed, reducing the probability of misalignment of the conductive network 200 during transportation or use, and improving the reliability of the electronic skin. Furthermore, with the solid support layer 500 provided, the adhesive gel layer 500 can be made thinner and has no requirement for viscosity, reducing the manufacturing difficulty of the adhesive gel layer 500.
[0034] Of course, such as Figure 1As shown, electronic skin may also omit the solid support layer, instead setting the adhesive gel layer 300 to be thicker and with higher viscosity, so that the adhesive gel layer 300 can act as a solid support layer. This simplifies the structure of electronic skin and reduces its manufacturing cost.
[0035] Optionally, such as Figure 2 As shown, the electronic skin also includes a hydrophobic layer 600 located on the surface of the encapsulation layer 100 facing away from the conductive network 200. Thus, by providing the hydrophobic layer 600, water droplets can be prevented from accumulating on the electronic skin, thereby reducing the damage to the electronic skin caused by long-term contact with water and improving the reliability of the electronic skin.
[0036] Optionally, such as Figure 2 As shown, the thickness d of the electronic skin is no greater than 10 μm. This results in a thinner electronic skin, leading to a smaller size, improving its portability, and eliminating the need for a large installation space, thus enhancing its practicality.
[0037] In addition, to clearly illustrate the structure of the electronic skin, such as Figure 3 As shown, Figure 3 This is a view of the electronic skin from the side of the adhesive gel layer. The flexible contact electrode 201, the adhesive gel layer 300, and the terminal 202 can be seen in the figure.
[0038] Of course, the number and distribution of flexible contact electrodes, as well as the overall morphology of the electronic skin, are not limited to... Figure 3 The structure shown can also be configured according to the actual application requirements of the electronic skin. For example, when the electronic skin is used in electrical impedance tomography, multiple flexible contact electrodes can be set and evenly distributed. The overall shape of the electronic skin can be strip-shaped. The specific configuration of the number and distribution of flexible contact electrodes and the overall shape of the electronic skin is not limited here.
[0039] Based on the same inventive concept, this invention provides a method for manufacturing electronic skin as described above, such as... Figure 4 As shown, it includes:
[0040] S401, Form the encapsulation layer;
[0041] S402. A conductive network is formed on the encapsulation layer;
[0042] S403. An adhesive gel layer is formed on top of the encapsulation layer.
[0043] In this way, the adhesive gel layer can bond the electronic skin to the object to be contacted, allowing the flexible contact electrode to make contact with the object. Furthermore, since the flexible contact electrode can deform when it comes into contact with the object, it can fit the surface of the object more closely, reducing the contact resistance between the flexible contact electrode and the object. This results in the electronic skin having lower contact resistance during use and improving the performance of the electronic skin.
[0044] Optionally, the manufacturing method further includes: forming a solid support layer on the encapsulation layer before forming the adhesive gel layer and after forming the conductive network; the solid support layer has a second perforated structure, the second perforated structure exposing the flexible contact electrodes and terminals; forming the adhesive gel layer includes: forming the adhesive gel layer on the solid support layer. Thus, by setting the solid support layer, the conductive network can be better fixed, reducing the probability of misalignment of the conductive network during transportation or use, and improving the reliability of the electronic skin.
[0045] Optionally, at least some of the encapsulation layer, solid support layer, and adhesive gel layer may be made of the same material. In this way, the encapsulation layer, solid support layer, and adhesive gel layer can be formed using only two or one material, reducing the manufacturing cost of the electronic skin and facilitating its mass production.
[0046] Furthermore, at least a portion of the encapsulation layer, solid support layer, and adhesive gel layer are made from a polyvinyl alcohol-chitosan mixed solution. This structure, made from the polyvinyl alcohol-chitosan mixed solution, exhibits good biocompatibility and a certain degree of bactericidal ability, as well as good air permeability. When the electronic skin is attached to biological skin, it is less likely to cause adverse effects (such as allergies or irritation) to the organism, thus improving the safety of the electronic skin. In addition, when the encapsulation layer, solid support layer, and adhesive gel layer are all made from the polyvinyl alcohol-chitosan mixed solution, except for the conductive network, the other structures of the electronic skin can be recycled through high-temperature hydrolysis, further reducing costs and meeting environmental protection requirements.
[0047] Optionally, forming the conductive network in step S402 specifically includes: sequentially forming multiple stacked conductive layers, such that the multiple conductive layers constitute a conductive network; wherein each conductive layer is made of an organic conductive composition and conductive nanowires. Thus, by forming the conductive network through multiple stacking of conductive layers, a thicker conductive network can be formed, improving its conductivity. Furthermore, it avoids the cracking problem that can occur when forming a thick conductive network in a single step, thereby improving the reliability of the electronic skin.
[0048] Optionally, after step S401, the fabrication method further includes forming a hydrophobic layer on the surface of the encapsulation layer facing away from the conductive network. The hydrophobic layer can be formed between steps S401 and S402, between steps S402 and S403, or after step S403. The specific formation time of the hydrophobic layer can be set according to actual needs and is not limited here. Thus, by setting a hydrophobic layer, water droplets can be prevented from accumulating on the electronic skin, thereby reducing the damage to the electronic skin caused by long-term contact with water and improving the reliability of the electronic skin.
[0049] The method for fabricating electronic skin provided by the present invention will be explained below with reference to specific embodiments. Taking PPPA (poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate)-polyurethane-silver nanowires) as the material for fabricating the conductive network, and polyvinyl alcohol-chitosan solution as the material for fabricating the encapsulation layer, solid support layer and adhesive gel layer.
[0050] S1. Prepare a polyvinyl alcohol-chitosan solution.
[0051] The specific production methods include:
[0052] First, a certain amount of polyvinyl alcohol is weighed and swollen in water at a certain temperature, and then stirred until the polyvinyl alcohol is completely dissolved to obtain a polyvinyl alcohol solution with a preset mass fraction; chitosan is dissolved in an acetic acid solution with a certain volume fraction to obtain a chitosan solution with a preset mass fraction.
[0053] Then, the polyvinyl alcohol solution and the chitosan solution are mixed and stirred to obtain a mixed solution of polyvinyl alcohol and chitosan.
[0054] Finally, glycerol was added to the mixed solution of polyvinyl alcohol and chitosan, stirred evenly, and allowed to stand to allow the polyvinyl alcohol and chitosan to crosslink. Then, it was allowed to stand to defoam and obtain a polyvinyl alcohol-chitosan solution with a certain viscosity.
[0055] S2, Create PPPA.
[0056] The specific production methods include:
[0057] First, glycerol is added to the conductive ink (i.e., a poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate) solution) and the glycerol is dispersed evenly to obtain a first mixed solution, in order to improve the agglomeration of the conductive ink and enhance its conductivity.
[0058] Then, an aqueous polyurethane solution is added to the first mixed solution, and the mixture is stirred until homogeneous to form a second mixed solution.
[0059] Finally, silver nanowires were dispersed in ethanol and diluted with water to obtain a water-based silver nanowire solution. At a certain temperature, the water-based silver nanowire solution was added to the second mixed solution one by one while stirring to ensure that the silver nanowires were evenly dispersed, thereby obtaining PPPA.
[0060] S3, forming an electronic skin.
[0061] The specific production methods include:
[0062] First, a polyvinyl alcohol-chitosan solution is coated and dried to obtain an encapsulation layer. The polyvinyl alcohol-chitosan solution can be coated onto a hydrophilic non-stick paper surface to facilitate subsequent removal of the encapsulation layer; the thickness of the resulting encapsulation layer can be, but is not limited to, 5 μm.
[0063] Then, a fluorinated silicon solution is sprayed onto one side of the encapsulation layer and dried to obtain a hydrophobic layer.
[0064] Secondly, a circuit template is placed on the side surface without the hydrophobic layer, and the circuit is printed using PPPA material. The circuit is then dried at a certain temperature to obtain a conductive layer. This process of printing and drying is repeated multiple times to form multiple conductive layers, which together form a conductive network.
[0065] Next, a polyvinyl alcohol-chitosan solution is coated onto a portion of the conductive network to cover the transmission lines and expose the flexible contact electrodes and terminals. After drying, a solid support layer formed by the polyvinyl alcohol-chitosan solution is obtained. The flexible contact electrodes should protrude from the solid support layer to ensure contact between the flexible contact electrodes and the object to be contacted after the adhesion gel layer is formed. Methods for coating with the polyvinyl alcohol-chitosan solution include, but are not limited to, coating using a 3D printer or manual coating.
[0066] Finally, a mask is placed over the flexible contact electrode, and a polyvinyl alcohol-chitosan solution is applied again to the surface of the structure after the solid support layer has been formed. After coating, the mask is removed, revealing an adhesive gel layer formed by the polyvinyl alcohol-chitosan solution, thus obtaining the electronic skin. The fabricated electronic skin then needs to be cryogenically stored to maintain the gel state of the adhesive gel layer and preserve the adhesion ability of the electronic skin.
[0067] Thus, the electronic skin can be fabricated by going through steps S1 to S3. The performance of the electronic skin obtained by this method will be introduced below.
[0068] like Figure 5 As shown, Figure 5 This graph shows the relationship between the phase transition time and temperature of the adhesive gel layer in electronic skin. The phase transition time is the time it takes for the adhesive gel layer to change from a gel state to a solid state. Figure 5As can be seen, the phase transition time of the adhesive gel layer gradually decreases with increasing temperature, and temperature changes have a greater impact on the phase transition time at low temperatures. Furthermore, at 36℃, the phase transition time is approximately 1 minute. Therefore, when this electronic skin is used on the human body, it can transform into a solid state in a short time, thus adhering to the human body, making the use process convenient and quick.
[0069] When the electronic skin adheres to animal skin, the sweat secreted by the animal skin will have a certain impact on the adhesion of the electronic skin and the phase transition time of the adhesion gel layer. Specifically, it can be as follows: Figure 6 As shown, Figure 6 (a) shows the relationship between adhesion force and phase transition time and sweat secretion rate, where the bar chart represents adhesion force and the curve chart represents phase transition time. Figure 6 (b) shows the relationship between sweat evaporation time and adhesion. Figure 6 As can be seen in (a), with the increase of sweat secretion rate, the adhesion of the electronic skin gradually decreases, and the phase transition time of the adhesive gel layer gradually increases. Furthermore, when the sweat secretion rate is 0 g·h⁻¹, the adhesion of the electronic skin gradually decreases, and the phase transition time of the adhesive gel layer gradually increases. -1 ·m -2 Up to 200g·h -1 ·m -2 At that time, the increase in sweat secretion rate only led to a 4.62% decrease in electronic skin adhesion, but when the sweat secretion rate exceeded 300 g·h -1 ·m -2 At this time, the decrease in electronic skin adhesion is exacerbated, when the sweat secretion rate is 600 g·h -1 ·m -2 At that time, the adhesion was only 56.14% of that when no sweat was secreted; as the sweat secretion rate increased, the phase transition time of the adhesive gel layer was prolonged, especially when the secretion rate was 600 g·h. -1 ·m -2 At that time, the phase transition time was 2.05 times that when no sweat was secreted. From Figure 6 As shown in (b), the adhesion of the electronic skin gradually recovers as the sweat evaporates. Therefore, when attaching electronic skin, it is important to avoid sweat secretion from the animal's skin surface to prevent affecting the phase transition time of the adhesive gel layer and reducing the adhesion efficiency of the electronic skin. When the electronic skin adheres to the animal's skin surface, a small amount of sweat secretion does not significantly affect the adhesion, and the adhesion gradually recovers after the sweat evaporates, indicating that the electronic skin has high reliability.
[0070] Furthermore, tests showed that the tensile stress, shear stress, and interfacial toughness between the electronic skin and piglet skin reached 53.16 kPa, 72.76 kPa, and 2.49 J·m, respectively. -2 Furthermore, it can remain in place for 500 minutes without falling off, which indicates that the electronic skin has high reliability.
[0071] like Figure 7 As shown, Figure 7 Figure (a) shows the relationship between relative humidity and the conductivity of the conductive network. Figure 7 (b) shows the relationship between temperature and the conductivity of the conductive network. Figure 7 As can be seen in (a), the conductivity of the conductive network gradually decreases with increasing relative humidity. This is because poly(styrene sulfonate) is insulating and hydrophilic, while poly(3,4-ethylenedioxythiophene) is conductive and hydrophobic. Therefore, as relative humidity increases, poly(styrene sulfonate) absorbs water and swells, leading to an increase in the distance between adjacent poly(3,4-ethylenedioxythiophene), hindering the transfer of charge carriers, and thus reducing the conductivity of the conductive network. However, the decrease in conductivity is not significant. Figure 7 As shown in (b), the conductivity of the conductive network gradually increases with increasing temperature. This is because rising temperature inhibits the water content and volume of poly(styrene sulfonate), reducing the distance between adjacent poly(3,4-ethylenedioxythiophene), thus promoting carrier transfer. Therefore, the conductivity of the conductive network increases, and can rise from 12000 S·cm at room temperature. -1 The conductivity increased to 14018 S·cm at 80℃ -1 The conductivity is high. Thus, the conductive network of the electronic skin can maintain high conductivity when temperature and humidity change, improving the reliability of the electronic skin.
[0072] Furthermore, the conductivity changes little when the conductive network is subjected to mechanical deformation, such as stretching or bending. For example, after bending in the experiment, the conductivity of the conductive network decreased by a maximum of 4.8%. After 20,000 bending-recovery experiments, the resistance of the conductive network increased by only 15.51%. Moreover, the mechanical deformation has little effect on the conductivity and resistance of the conductive network, which further demonstrates the high reliability of the electronic skin.
[0073] In summary, the electronic skin obtained using the above-described manufacturing method has the following advantages:
[0074] (1) The conductive network has high conductivity and the contact impedance between the flexible contact electrode and the object to be contacted is low, with the contact impedance being only 35% of that of commercial gel electrodes. This makes the electrical signal passing through the electronic skin have high fidelity.
[0075] (2) It can use a single material to make the encapsulation layer, solid support layer and adhesive gel layer, which reduces the production cost of electronic skin and helps the large-scale application of electronic skin; at the same time, polyvinyl alcohol-chitosan can be hydrolyzed and recycled, which further reduces the cost of electronic skin.
[0076] (3) The adhesive gel layer is initially gel-like, which can better adhere to the surface of the object to be contacted and reduce the contact resistance. The adhesive gel layer can change from gel-like to solid at higher temperatures to improve the adhesion strength, making the electronic skin adhere more firmly to the object to be contacted.
[0077] (4) The transmission line is covered, which can reduce the distortion of the signal in the transmission line, and the lower contact impedance noise can weaken the parasitic capacitance effect, thus the electronic skin outputs a higher quality electrical signal.
[0078] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.
Claims
1. An electronic skin, characterized in that, include: An encapsulation layer, and a conductive network and an adhesive gel layer disposed on the encapsulation layer; The conductive network includes flexible contact electrodes and terminals. The flexible contact electrodes are used to contact the object to be contacted, and the terminals are used to transmit electrical signals. The adhesive gel layer has a first perforated structure, which exposes the flexible contact electrode and the terminal.
2. The electronic skin as described in claim 1, characterized in that, The electronic skin also includes a solid support layer located between the adhesive gel layer and the encapsulation layer; The solid support layer has a second hollow structure, which exposes the flexible contact electrode and the terminal.
3. The electronic skin as described in claim 1 or 2, characterized in that, The conductive network is made of an organic conductive composition and conductive nanowires; The organic conductive composition comprises: poly(3,4-ethylenedioxythiophene) and sulfonate.
4. The electronic skin as described in claim 3, characterized in that, The organic conductive composition further includes: an aqueous polyurethane solution.
5. The electronic skin according to any one of claims 1-4, characterized in that, The electronic skin further includes a hydrophobic layer located on the surface of the encapsulation layer opposite to the conductive network.
6. The electronic skin according to any one of claims 1-5, characterized in that, The thickness of the electronic skin is no more than 10 μm.
7. The electronic skin according to any one of claims 1-6, characterized in that, The conductive network also includes a transmission line for connecting the flexible contact electrode and the terminal, and the transmission line is located between the encapsulation layer and the adhesive gel layer.
8. A method for manufacturing electronic skin as described in any one of claims 1-7, characterized in that, include: Form an encapsulation layer; A conductive network is formed on the encapsulation layer; An adhesive gel layer is formed on top of the encapsulation layer.
9. The manufacturing method as described in claim 8, characterized in that, The manufacturing method further includes: Before the formation of the adhesive gel layer and after the formation of the conductive network, a solid support layer is formed on the encapsulation layer; the solid support layer has a second cutout structure that exposes flexible contact electrodes and terminals. Forming the adhesive gel layer includes: forming the adhesive gel layer on the solid support layer.
10. The manufacturing method as described in claim 9, characterized in that, At least a portion of the encapsulation layer, the solid support layer, and the adhesive gel layer are made of the same material.
11. The manufacturing method as described in claim 9 or 10, characterized in that, At least a portion of the encapsulation layer, the solid support layer, and the adhesive gel layer is made of a polyvinyl alcohol-chitosan mixture.
12. The manufacturing method according to any one of claims 8-11, characterized in that, Forming the conductive network specifically includes: Multiple conductive layers are sequentially stacked to form the conductive network; wherein each conductive layer is made of an organic conductive composition and conductive nanowires.
13. The manufacturing method according to any one of claims 8-12, characterized in that, The manufacturing method further includes forming a hydrophobic layer on the surface of the encapsulation layer opposite to the conductive network.