A filter modular design optimization method and system

Abstract

The application relates to the technical field of electromagnetic compatibility filters, and discloses a filter modular design optimization method and system, which comprises the following steps: obtaining a component connection relationship, a component port position, a busbar connection path and a cabinet installation position divided according to pre-assembled filter components, establishing an interface relationship table and an initial filter topology; identifying a component connection interface, a busbar transition interface and a cabinet installation interface, extracting an interface length, a contact position, a ground corresponding position and an adjacent conductor corresponding relationship, and forming an interface state description result; mapping each interface into a distributed inductance, a distributed capacitance and a contact impedance, generating a parasitic reconstruction topology; identifying a target interface and determining an interface constraint condition, updating to obtain an assembled filter topology, and outputting a component assembly sequence, a connection path and an installation position; and the application improves the consistency between a filter design result and a whole machine assembly result under modular reuse conditions, and reduces the risk of prototype rectification.

Description

Technical Field

[0001] This application relates to the field of electromagnetic compatibility filter technology, and more specifically, to a filter modular design optimization method and system. Background Technology

[0002] As energy storage converters, vehicle-mounted high-voltage converters, and other high-power power electronic devices increasingly demand platform reuse, assembly efficiency, and structural compactness, filter solutions are gradually evolving from integrated designs to modular pre-assembled designs. In existing technologies, common-mode filter units, differential-mode filter units, damping units, or related filter components are typically prefabricated into independently assembleable modules, which are then integrated with busbars and housing mounting structures to complete the overall system integration. For example, CN114883111B discloses a modular bus capacitor integrating a filter and a discharge resistor. By integrating related filter units with the bus capacitor, the interference current path is shortened and electromagnetic compatibility performance is improved, demonstrating that modular integration and its filter structure in conjunction with busbars and housings have attracted attention in this field.

[0003] Meanwhile, in response to the problem of the high-frequency performance of filters being affected by parasitic parameters, existing technologies have been able to establish models and conduct analyses based on objects such as busbar structures. For example, CN105808797A discloses a structure-based high-frequency modeling method for low-inductance busbars, which can establish an equivalent circuit model of parasitic inductance based on the three-dimensional structure of the low-inductance busbar and provide it for system modeling. This demonstrates that existing technologies are already able to model and design for parasitic factors of the busbar itself.

[0004] Furthermore, regarding the installation and connection between the filter and the chassis or grounding structure, existing technologies have also noted the impact of the connection method on high-frequency impedance and electromagnetic compatibility results. For example, CN201341297Y discloses an installation structure for an EMI filter board, pointing out that when the EMI filter board is connected to ground via copper studs or the chassis, factors such as the contact surface, connection distance, and materials will increase the connection impedance, thereby affecting the conduction test results. This indicates that existing technologies have recognized that the installation interface itself affects the high-frequency characteristics of the filter circuit.

[0005] However, the aforementioned existing technologies mainly focus on the integration method of the module body, the high-frequency modeling of the busbar body, or the design and analysis of a single installation connection structure. They usually assume that the overall filter topology remains unchanged after entering the assembly stage, and have not paid enough attention to the fact that when the filter is divided into multiple assembleable components, different assembly interfaces will be formed between components, between components and busbars, and between components and the housing. When the length, contact position, relative position to ground, and relationship of adjacent conductors of different assembly interfaces change, the filter current loop, the ground coupling path, and the interface impedance will change with the assembly state. Therefore, the analysis results obtained based on individual modules or a given overall connection relationship are difficult to directly reflect the actual filtering performance after the whole machine is assembled.

[0006] In this case, even if each filter component meets the expected indicators when analyzed or tested individually, the filter performance may still deviate after the whole machine is assembled due to changes in the loop, coupling or impedance caused by the assembly interface. This will result in the whole machine results under the condition of module reuse being inconsistent with the previous design results, thereby increasing the risk of repeated rectification of the prototype and failure of certification.

[0007] Therefore, how to establish a correspondence between the state changes of different assembly interfaces and the overall filter design results in the context of modular filter assembly, and thereby improve the consistency between the filter design results and the overall assembly results under modular reuse conditions, has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0008] To overcome the shortcomings of existing technologies in modular filter assembly scenarios, such as the difficulty in establishing a correspondence between the state changes of different assembly interfaces and the overall filter design results, which leads to insufficient consistency between the filter design results and the overall assembly results under modular reuse conditions, this application provides the following technical solution to achieve the above objective: In the first aspect, this application discloses a modular design optimization method for filters, including: Step S1: Obtain the component connection relationship, component port position, busbar connection path and housing installation position according to the pre-assembled filter components, establish the interface relationship table, and establish the initial filter topology based on the interface relationship table; Step S2: Identify the component connection interface, busbar transition interface and housing mounting interface based on the interface relationship table, extract the interface length, contact position, ground corresponding position and adjacent conductor correspondence of each interface, and form the interface state description result of each interface. Step S3: Based on the interface state description results, each interface is mapped to the corresponding distributed inductance, distributed capacitance and contact impedance, and the mapped distributed inductance, distributed capacitance and contact impedance are written into the interface connection position corresponding to each interface in the initial filtering topology to generate the parasitic reconstruction topology. Step S4: Compare the parasitic reconstructed topology with the initial filter topology, identify the target interfaces that cause changes in the filter current loop length, ground coupling path, or interface contact impedance, and determine interface constraints for each target interface. The interface constraints shall include at least one of the following: interface connection length constraint, interface contact position constraint, and interface installation relative position constraint. Step S5: Based on the interface constraints, update the interface connection positions corresponding to each target interface in the initial filtering topology to generate the assembled filtering topology. Step S6: Based on the assembly sequence, connection path, and installation position of the output components of the assembled filter topology, the filter design result is formed.

[0009] Secondly, this application discloses a modular design optimization system for filters, comprising: The initial modeling module is used to obtain the component connection relationship, component port position, busbar connection path and housing installation position according to the pre-assembled filter components, establish the interface relationship table, and establish the initial filter topology based on the interface relationship table; The state extraction module is used to identify the component connection interface, busbar transition interface and housing installation interface based on the interface relationship table, and extract the interface length, contact position, ground corresponding position and adjacent conductor correspondence of each interface to form the interface state description result of each interface. The parasitic reconstruction module is used to map each interface to the corresponding distributed inductance, distributed capacitance and contact impedance according to the interface state description results, and write the mapped distributed inductance, distributed capacitance and contact impedance into the interface connection position corresponding to each interface in the initial filtering topology to generate the parasitic reconstruction topology. The target constraint module is used to compare the parasitic reconstructed topology with the initial filter topology, identify the target interfaces that cause changes in the length of the filter current loop, changes in the ground coupling path, or changes in the interface contact impedance, and determine the interface constraint conditions for each target interface. The topology update module is used to update the interface connection positions corresponding to each target interface in the initial filtering topology based on the interface constraints, and generate the assembled filtering topology. The result output module is used to generate filter design results based on the assembly sequence, connection path, and installation position of the output components in the assembled filter topology.

[0010] Compared with related technologies, this application has the following advantages: This application focuses on processing the assembly interface actually formed during the modular assembly of filters. Instead of analyzing the filter module body, busbar body, or single installation connection structure separately, it establishes a correspondence between the state of the assembly interface and the overall filter design result, thereby improving the consistency between the filter design result and the overall assembly result under modular reuse conditions.

[0011] This application establishes an interface relationship table by obtaining the component connection relationship, component port position, busbar connection path and housing installation position, and establishes an initial filtering topology based on the interface relationship table. This unifies the connection position, transition position and installation position in the modular filter, which helps to avoid the separation between the module body design information and the whole machine assembly information.

[0012] This application identifies the component connection interface, busbar transition interface, and housing mounting interface, and extracts the interface length, contact position, ground corresponding position, and adjacent conductor correspondence to form an interface state description result. This enables the interface state changes that affect the filtering performance during the assembly process to be explicitly characterized, which is beneficial to improving the ability to identify changes in the filtering current loop, changes in the ground coupling path, and changes in the interface contact state.

[0013] Based on the interface state description results, this application maps each interface to the corresponding distributed inductance, distributed capacitance and contact impedance, and writes the mapping results into the corresponding interface connection positions in the initial filter topology to generate a parasitic reconstruction topology. This allows the geometric, contact and proximity relationships of the assembled interfaces to be transformed into electrical parameter relationships related to the filtering performance, which is beneficial to improving the ability of modular design to reflect the actual parasitic effects of the whole machine.

[0014] This application compares the parasitic reconstructed topology with the initial filtering topology, identifies the target interface, determines the interface constraints for each target interface, and then updates the interface connection positions based on the interface constraints. This generates an assembled filtering topology and outputs the component assembly sequence, connection path, and installation position. This can reduce the overall filtering offset risk to an adjustable assembly interface, which helps to reduce the filtering performance offset risk after the whole machine is assembled under module reuse conditions and reduces the number of prototype rectification and debugging times. Attached Figure Description

[0015] Figure 1 A flowchart illustrating a modular design optimization method for filters provided in this application; Figure 2 A flowchart illustrating the method for creating the output target interface set provided in this application; Figure 3 A flowchart illustrating the method for determining interface constraints for each target interface provided in this application; Figure 4This application provides a schematic diagram of data processing for a filter modular design optimization system. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Example 1

[0017] Please see Figure 1 As shown, this embodiment provides a filter modular design optimization method, including the following steps: Step S1: Obtain the component connection relationship, component port position, busbar connection path and housing installation position according to the pre-assembled filter components, establish the interface relationship table, and establish the initial filter topology based on the interface relationship table; In some implementations, the steps of obtaining the component connection relationships, component port positions, busbar connection paths, and housing mounting positions according to the pre-assembled filter components, and establishing an interface relationship table include: To determine the list of pre-assembled filter components, first read the filter's assembly drawing, electrical connection drawing, and component list. Number each filter component that has formed an independent assembly before entering the final assembly, forming a list of pre-assembled filter components. Each pre-assembled filter component corresponds to a unique component identifier, and the component category, component dimensions, number of conductive ports, and port names are recorded. For example, the common-mode choke component is recorded as the first component, the differential-mode capacitor component as the second component, the bypass capacitor component as the third component, and the damping component as the fourth component. Subsequent steps will use the component identifier.

[0018] To obtain the component connection relationships, based on the electrical connection diagram and assembly diagram, read the connection correspondence between each pre-assembled filter component and other conductors one by one, and divide them into three categories of records according to the source of the connection object: one category records the connection relationship between two pre-assembled filter components, one category records the connection relationship between a pre-assembled filter component and a busbar, and one category records the connection relationship between a pre-assembled filter component or busbar and the housing; for each connection relationship, record the component identifier on the side that sends the connection, the component identifier or housing identifier on the side that receives the connection, the connection port identifier, and the connection type; the connection type is recorded as at least one of the following: crimp connection, screw connection, plug connection, and welded connection, and the connection type will continue to be used in the subsequent contact impedance mapping step.

[0019] To obtain the port positions of the components, under a unified coordinate reference, determine the center position of each conductive port of each pre-assembled filter component. The unified coordinate reference is taken as the origin of a corner of the bottom surface inside the housing, and the length, width, and height directions are used as the three coordinate directions respectively. For each port, record the port identifier, port center coordinates, and port orientation. The port orientation is used to indicate the port's output direction, and the recording method can be one of the following: along the length direction, along the width direction, or along the height direction, or in the form of a three-dimensional vector.

[0020] Obtain the busbar connection path. For locations where busbars are connected, extract the path start point, turning point, and path end point sequentially along the busbar entity, and decompose the busbar path into multiple continuous path segments. Each busbar connection path records at least the path identifier, start port identifier, end port identifier, path segment order, length of each path segment, direction of each path segment, and busbar width. When a busbar connection path passes through multiple turning points, record each segment in the order of the turning points. Subsequent interface length extraction directly reads the path segment records.

[0021] Obtain the housing installation position. For pre-assembled filter components or busbars that are installed with the housing, extract the location data of the installation point or installation area. Each housing installation position record shall include at least the installation position identifier, the installation surface position, the installation hole position, or the installation pressing area position. When the same pre-assembled filter component or the same busbar corresponds to multiple installation points, record the multiple installation points one by one and associate them with the same component identifier or the same path identifier.

[0022] Establish an interface relationship table, using a "one interface corresponds to one interface record" approach. Each interface record should include at least the following fields: interface identifier, interface category, first component identifier, first port identifier, second component identifier or housing identifier, second port identifier, busbar connection path identifier, housing installation position identifier, and connection type. The interface category should be written synchronously when establishing the interface relationship table, and should include at least the component connection interface, busbar transition interface, and housing installation interface. The component connection interface indicates the direct connection position between two pre-assembled filter components. The busbar transition interface indicates the transition connection position between the pre-assembled filter component and the busbar, or between two busbars. The housing installation interface indicates the installation contact position between the pre-assembled filter component or the busbar and the housing.

[0023] Through the above steps, the connection objects, connection positions, and installation positions after being divided according to the pre-assembled filter components are uniformly organized into an interface relationship table. This ensures that when establishing the initial filter topology, identifying interface categories, extracting interface lengths, contact positions, ground correspondence positions, and adjacent conductor correspondences, the same data record source is used.

[0024] For example, to illustrate the process of establishing the interface relationship table, a three-phase input-side filter is used as an example. The pre-assembled filter components include a common-mode choke, a differential-mode capacitor, and a damping component. The center coordinates of the input port of the common-mode choke are recorded as (20, 35, 18), and the center coordinates of the output port are recorded as (20, 78, 18). The center coordinates of the input port of the differential-mode capacitor are recorded as (58, 82, 20). The center coordinates of the connection port of the damping component are recorded as (92, 84, 20). The output port of the common-mode choke and the input port of the differential-mode capacitor are connected by a busbar connection path. The busbar connection path includes two continuous path segments. The first path segment is 26 mm long, the second path segment is 14 mm long, and the busbar width is 12 mm. The differential-mode capacitor component and the damping component are connected by a press-fit connection. The center coordinates of the mounting surface corresponding to the housing mounting position are recorded as (60, 110, 0). Based on the above component connection relationships, component port positions, busbar connection paths, and housing mounting positions, when establishing the interface relationship table, three interface records can be generated. The first interface record corresponds to the busbar transition interface between the common-mode choke component and the busbar; the second interface record corresponds to the busbar transition interface between the busbar and the differential-mode capacitor component; and the third interface record corresponds to the component connection interface between the differential-mode capacitor component and the damping component. This example illustrates how the connection objects, connection positions, and installation positions scattered in assembly drawings and electrical connection diagrams can be organized into an interface relationship table record that can be uniformly called in subsequent steps.

[0025] In some implementations, the steps for establishing the initial filtering topology based on the interface relationship table include: Read the interface records in the interface relationship table. First, read all the first component identifiers, second component identifiers or housing identifiers, first port identifiers, second port identifiers, busbar connection path identifiers and housing installation position identifiers from the interface relationship table, and match them with the pre-assembled filter component list to obtain the component set, port set, busbar path set and housing installation position set that participate in the connection representation.

[0026] Establish component records in the initial filtering topology. According to the component categories in the pre-assembled filtering component list, write each pre-assembled filtering component as a component record. Each component record should include at least the component identifier, component category, and port list. When the component category is a common-mode choke component, write the input port and output port in the component record. When the component category is a differential-mode capacitor component, bypass capacitor component, or damping component, write the corresponding conductive port in the component record.

[0027] Establish interface connection position records in the initial filtering topology. For each interface record in the interface relationship table, based on the first port identifier, second port identifier, busbar connection path identifier, and chassis mounting position identifier, establish an interface connection position record in the initial filtering topology. Each interface connection position record includes at least an interface identifier, a first connection position, a second connection position, and a connection category. The connection category is consistent with the interface category in the interface relationship table, and is still divided into component connection interface, busbar transition interface, and chassis mounting interface. When writing distributed inductance, distributed capacitance, and contact impedance later, the interface connection position record is directly located by the interface identifier.

[0028] Establish the connection relationships in the initial filtering topology. According to the connection correspondence in the interface relationship table, connect the component records and interface connection position records sequentially to form a complete connection representation result. For direct connections between pre-assembled filtering components, connect the port corresponding to the first component identifier and the port corresponding to the second component identifier through an interface connection position record. For connections formed via busbars, first connect the port corresponding to the first component identifier to the starting position corresponding to the busbar connection path, and then connect the ending position corresponding to the busbar connection path to the port corresponding to the second component identifier. For installation connections with the housing, connect the component port or busbar connection position to the housing installation position.

[0029] An initial filtering topology is formed after completing the component recording, interface connection position recording, and connection relationship writing. The initial filtering topology retains the connection relationship of the pre-assembled filter component body, the busbar connection path relationship, and the housing installation position relationship, but does not write the distributed inductance, distributed capacitance, and contact impedance. Subsequently, interface parasitic parameters are written on the basis of the initial filtering topology to generate a parasitic reconstruction topology.

[0030] By performing the above steps, the physical connection relationships in the interface relationship table are organized into an initial filtering topology that can locate the interface connection positions, so that the subsequent interface state description results, distributed inductance, distributed capacitance, and contact impedance can all correspond one-to-one with the interface connection positions in the initial filtering topology.

[0031] Step S2: Identify the component connection interface, busbar transition interface and housing mounting interface based on the interface relationship table, extract the interface length, contact position, ground corresponding position and adjacent conductor correspondence of each interface, and form the interface state description result of each interface.

[0032] In some implementations, the steps of identifying component connection interfaces, busbar transition interfaces, and housing mounting interfaces based on an interface relationship table, and extracting the interface length, contact position, ground-corresponding position, and adjacent conductor correspondence of each interface to form an interface state description result include: The interface category is identified based on the interface relationship table. The interface records in the interface relationship table are read one by one, and the interface category is confirmed based on the first component identifier, the second component identifier or the housing identifier, the busbar connection path identifier and the housing installation position identifier. When both the first component identifier and the second component identifier correspond to the pre-assembled filter component, and the interface record does not contain the busbar connection path identifier or the housing installation position identifier, the interface is identified as a component connection interface. When the interface record contains the busbar connection path identifier, the interface is identified as a busbar transition interface. When the interface record contains the housing installation position identifier, the interface is identified as a housing installation interface.

[0033] Determine the start and end reference positions for each interface. For component connection interfaces, take the center positions of the ports on both sides of the interface as the start and end reference positions. For busbar transition interfaces, take the center position of the port and the start or end position of the busbar connection path as the start and end reference positions. For housing installation interfaces, take the contact center position between the component conductive connection position or the busbar conductive connection position and the housing installation position as the start and end reference positions.

[0034] Extract the interface length and calculate it along the actual conductive extension direction based on the start and end reference positions. For component connection interfaces, the interface length is the connection distance between the center positions of the two ports. For busbar transition interfaces, the interface length is the length of the path segment corresponding to the interface in the busbar connection path. When an interface spans multiple path segments, the lengths of the multiple path segments are accumulated in the order of the paths. For housing mounting interfaces, the interface length is the conductive extension distance between the component conductive connection position or the busbar conductive connection position and the contact center position of the housing mounting position. Thus, each interface forms an interface length record.

[0035] Extract the contact positions and determine the actual contact positions where current enters or leaves the interface based on the connection form and assembly drawing in the interface relationship table.

[0036] For screwed connections, the contact position is the center of the screw clamping area and the boundary of the clamping area; for crimped connections, the contact position is the center of the crimping area and the length of the crimping area; for plug-in connections, the contact position is the center of the plugging area and the plugging depth; for welded connections, the contact position is the center of the welding area and the length of the welding area. When there are multiple contact points on an interface, each contact point is recorded and associated with the same interface identifier.

[0037] To extract the corresponding position to ground, first read the interface contact position, then read the position of the conductive mounting surface of the casing; subsequently, project from the interface contact position along a direction perpendicular to the conductive mounting surface of the casing to obtain the position of the projection point, and record the position of the projection point as the corresponding position to ground.

[0038] When the interface type is a housing mounting interface, the ground corresponding position is directly taken as the contact center position in the housing mounting position; when the interface type is a component connection interface or busbar transition interface, the ground corresponding position is taken as the projection point position of the interface contact position on the conductive mounting surface of the housing; the ground corresponding position is directly used for mapping distributed capacitance and distributed inductance in step S3.

[0039] Extract the correspondence between adjacent conductors and establish a search area based on the contact position and interface length of each interface. The search area is established by taking the line connecting the interface contact positions as the center line, maintaining the original length along the interface length direction, and extending a search distance to both sides along the direction perpendicular to the interface length to form a cuboid search area. The idea behind setting the search distance is to use the sum of the busbar width, the insulation gap between components, and the assembly tolerance as the base distance.

[0040] Subsequently, other conductors are searched within the search area, and conductors with length overlap with the interface are selected. The method for determining the length overlap is as follows: the projected length of the conductor in the length direction of the interface is compared with the projected length in the length direction of the interface. If there is an overlap, it is recorded as having a length overlap relationship. For each selected conductor, the conductor identifier, conductor position, minimum distance between the conductor and the interface, length overlap value, and relative orientation relationship are recorded, and a record of adjacent conductor correspondence is formed. The relative orientation relationship is determined based on the actual conductive extension direction of the current interface and the actual conductive extension direction of the conductor, and is used to characterize the same, opposite, or intersecting relationship between the two in the length direction of the interface. When no other conductors are identified in the search area, the interface identifier is still retained, and the adjacent conductor correspondence is written as an empty record.

[0041] To form an interface state description result, the interface category, interface length, contact position, ground corresponding position, and adjacent conductor correspondence obtained in the above steps are written into the state record one by one according to the interface identifier, forming an interface state description result; each state record includes at least the interface identifier, interface category, interface length, contact position, ground corresponding position, and adjacent conductor correspondence; in the subsequent step S3, the interface state description result is directly read to perform distributed inductance, distributed capacitance, and contact impedance mapping.

[0042] Through the above steps, the connection correspondence in the interface relationship table is further refined into interface state description results, so that step S3 can map distributed inductance, distributed capacitance and contact impedance to different interfaces according to the interface length, contact position, ground correspondence position and adjacent conductor correspondence.

[0043] To illustrate the formation process of the interface state description results, taking the second interface record above as an example, this interface is a busbar transition interface. The start and end reference positions are the end position of the busbar (58, 68, 20) and the center position of the input port of the differential mode capacitor component (58, 82, 20), respectively. The interface length is 14 mm along the actual conductive extension direction. The interface uses a crimp connection with a crimp area length of 10 mm and a crimp area width of 12 mm. The center position of the crimp area is recorded as (58, 75, 20). The conductive mounting surface of the housing is located in the z=0 plane. The center position of the crimp area is projected vertically onto the conductive mounting surface of the housing to obtain the corresponding position to ground as (58, 75, 0). After establishing the search area based on the interface length of 14 mm and the contact position, an adjacent conductor is identified on one side of the interface. The minimum distance between the center line of the corresponding conductor and the current interface is 8 mm, and the length overlap value along the interface length direction is 9 mm. Based on the above results, the interface category, interface length, contact position, corresponding position to ground, and the correspondence of adjacent conductors including conductor identification, minimum distance, length overlap value, and relative orientation relationship can be written according to the interface identifier. This forms the interface state description result of the interface and serves as the direct input for executing parasitic parameter mapping in step S3.

[0044] Step S3: Based on the interface state description results, each interface is mapped to the corresponding distributed inductance, distributed capacitance and contact impedance, and the mapped distributed inductance, distributed capacitance and contact impedance are written into the interface connection position corresponding to each interface in the initial filtering topology to generate the parasitic reconstruction topology.

[0045] In some implementations, the step of mapping each interface to its corresponding distributed inductance, distributed capacitance, and contact impedance based on the interface state description results includes: A parameter mapping rule table is established by first preparing multiple sets of standard interface samples, each covering different interface categories, connection types, interface lengths, ground distances, conductor spacings, length overlap values, contact areas, and relative orientation relationships. Then, for each set of standard interface samples, the corresponding values ​​of inductance per unit length, capacitance per unit area, contact impedance coefficient per unit area, and inductance correction results under the influence of adjacent conductors are obtained. These results are then categorized according to interface category, connection type, interface length range, ground distance range, conductor spacing range, length overlap range, contact area range, and relative orientation relationship to form the parameter mapping rule table. The parameter mapping rule table includes at least input and output fields. The input fields include at least interface category, connection type, interface length range, ground distance range, conductor spacing range, length overlap range, contact area range, and relative orientation relationship. The output fields include at least the distributed inductance per unit length, distributed capacitance per unit area, contact impedance coefficient per unit area, inductance correction coefficient, and correction direction marker.

[0046] In some implementations, the output fields of the parameter mapping rule table include at least the distributed inductance coefficient per unit length, the distributed capacitance coefficient per unit area, the contact impedance coefficient per unit area, the inductance correction coefficient, and the correction direction marker. The distributed inductance coefficient per unit length is obtained by: for standard interface samples of the same interface type and connection type, while keeping the distance to ground, conductor spacing, length overlap, and contact area within the corresponding ranges, changing the interface length, measuring or simulating the equivalent inductance value corresponding to each interface length, and then dividing the equivalent inductance value by the corresponding interface length to obtain the distributed inductance coefficient per unit length. The distributed capacitance coefficient per unit area is obtained by: for standard interface samples of the same interface type and connection type, while keeping the distance to ground, conductor spacing, and length overlap within the corresponding ranges, changing the effective coupling area, measuring or simulating the equivalent capacitance value corresponding to each effective coupling area, and then dividing the equivalent capacitance value by the corresponding effective coupling area to obtain the distributed capacitance coefficient per unit area. The method for obtaining the contact impedance coefficient per unit area includes: for standard interface samples of the same interface type and connection form, while keeping the interface length within the corresponding range, determining the contact impedance value corresponding to different contact areas, and then multiplying the contact impedance value by the contact area to obtain the contact impedance coefficient per unit area. Subsequently, the distributed inductance coefficient per unit length, distributed capacitance coefficient per unit area, contact impedance coefficient per unit area, inductance correction coefficient, and correction direction mark corresponding to different interface categories, connection forms, interface length ranges, ground distance ranges, conductor spacing ranges, length overlap ranges, contact area ranges, and relative orientation relationships are written into the parameter mapping rule table. This allows for subsequent lookup of the table based on the interface state description results to obtain the distributed inductance, distributed capacitance, contact impedance, and distributed inductance correction results under the influence of adjacent conductors.

[0047] Based on the interface state description results, the distributed inductance is mapped. For each state record in the interface state description results, the interface type, interface length, corresponding position to ground, and correspondence with adjacent conductors are read first. Next, the distance from the interface to the conductive mounting surface of the casing is determined based on the corresponding position to the ground, and the conductor spacing and length overlap value are determined based on the correspondence between adjacent conductors. Then, the unit length distributed inductance coefficient corresponding to the interface type, interface length range, ground distance range, conductor spacing range and length overlap range is found in the parameter mapping rule table. Finally, the unit length distributed inductance coefficient is multiplied by the interface length to obtain the basic distributed inductance value.

[0048] When the same interface corresponds to multiple adjacent conductor records, first determine the basic distributed inductance value of the current interface; then, for each adjacent conductor record, read the minimum spacing, length overlap value, and relative orientation relationship, and look up the corresponding inductance correction coefficient and correction direction mark according to the parameter mapping rule table; subsequently, multiply the inductance correction coefficient by the length overlap value to obtain the corrected distributed inductance value corresponding to the current adjacent conductor record; finally, sum the basic distributed inductance value and all corrected distributed inductance values ​​algebraically to obtain the distributed inductance of the interface.

[0049] Based on the interface state description results, the distributed capacitance is mapped. For each state record in the interface state description results, the contact position, the corresponding position to ground, and the correspondence between adjacent conductors are read. First, the effective coupling area is determined based on the contact position. The effective coupling area is determined as follows: in screw connections and crimp connections, the area of ​​the crimped region is taken; in plug connections, the product of the length and width of the plug region is taken; in welded connections, the product of the length and width of the weld region is taken. Then, the distance to ground from the interface to the conductive mounting surface of the housing is determined based on the corresponding position to ground, and the conductor spacing and length overlap value from the interface to the adjacent conductor are determined based on the correspondence between adjacent conductors. Subsequently, the distributed capacitance coefficient per unit area corresponding to the effective coupling area, the distance to ground, the conductor spacing, and the length overlap value are looked up in the parameter mapping rule table. Finally, the distributed capacitance coefficient per unit area is multiplied by the effective coupling area to obtain the distributed capacitance value to ground. For each adjacent conductor, the minimum spacing, length overlap, and effective coupling area between the current interface and the adjacent conductor are read, and the corresponding distributed capacitance coefficient per unit area is found according to the parameter mapping rule table. Then, the distributed capacitance coefficient per unit area is multiplied by the effective coupling area to obtain the distributed capacitance value of the adjacent conductor corresponding to the current adjacent conductor. After obtaining the distributed capacitance values ​​of all adjacent conductors, the distributed capacitance values ​​of all adjacent conductors corresponding to the same interface are added one by one using the interface identifier as the aggregation key value, and written together with the distributed capacitance value to ground formed by the current interface to the conductive mounting surface of the casing, and written into the distributed capacitance record of the interface to form the distributed capacitance of the interface.

[0050] Based on the interface state description results, the contact impedance is mapped. For each state record in the interface state description results, the connection type, contact position, and interface length are read. First, the contact area and number of contact points are determined based on the contact position. Then, the contact method type is determined based on the connection type. Subsequently, the unit area contact impedance coefficient corresponding to the contact method type, contact area range, and interface length range is found in the parameter mapping rule table. Finally, the unit area contact impedance coefficient is divided by the contact area to obtain the single contact point contact impedance value. When there are multiple contact points on an interface, the single contact point contact impedance value corresponding to each contact point is obtained separately. When multiple contact points are located on the same conductive surface and are conducting together, the multiple single contact point contact impedance values ​​are combined in parallel. When multiple contact points are arranged sequentially along the current flow direction, the multiple single contact point contact impedance values ​​are combined in series. The combined result is recorded as the contact impedance of the interface.

[0051] To form an interface parasitic parameter mapping result, distributed inductance, distributed capacitance, and contact impedance are written into the same parasitic parameter record according to the interface identifier, thus forming the interface parasitic parameter mapping result. Each parasitic parameter record includes at least the interface identifier, distributed inductance, distributed capacitance, and contact impedance. Subsequent steps directly read the interface parasitic parameter mapping result and match it one by one with the interface connection position record in the initial filtering topology.

[0052] Through the above steps, the interface state description results are converted into distributed inductance, distributed capacitance, and contact impedance that can be written into the initial filter topology, so that the subsequently generated parasitic reconstruction topology not only retains the connection positions, but also introduces electrical parameter results corresponding to the interface state.

[0053] As an example, to illustrate the mapping process of distributed inductance, distributed capacitance, and contact impedance, let's continue with the busbar transition interface as an example. The interface type is busbar transition interface, the interface length is 14 mm, the crimping area is 120 square millimeters, the distance from the interface to the conductive mounting surface of the housing to ground is 20 mm, the minimum spacing with adjacent conductors is 8 mm, and the length overlap is 9 mm. According to the parameter mapping rule table, the corresponding distributed inductance per unit length is 0.42 nanohenries per millimeter, the distributed capacitance per unit area is 0.018 picofarads per square millimeter, and the contact impedance per unit area is 0.36 milliohms per square millimeter. Multiplying the distributed inductance per unit length by the interface length yields a basic distributed inductance value of 5.88 nanohenries; multiplying the distributed capacitance per unit area by the crimping area yields a distributed capacitance to ground value of 2.16 picofarads; and dividing the contact impedance per unit area by the crimping area yields a single contact point contact impedance value of 0.003 milliohms. If the interface has two parallel crimping points, the contact impedance of the two single contact points is combined in parallel to obtain the contact impedance of the interface. Subsequently, the distributed inductance, distributed capacitance, and contact impedance of the interface are written into the parasitic parameter record according to the interface identifier, and written into the interface connection position corresponding to the interface in the initial filtering topology to form the corresponding connection representation result in the parasitic reconstruction topology.

[0054] In some implementations, the steps for generating a parasitic reconstructed topology include: based on the mapping results of the initial filter topology and interface parasitic parameters, the mapped distributed inductance, distributed capacitance, and contact impedance are written into the interface connection positions corresponding to each interface in the initial filter topology. Establish the correspondence between interface identifiers and interface connection positions. First, read all interface connection position records in the initial filtering topology, and then read the interface parasitic parameter mapping results. Using the interface identifier as the corresponding key value, establish the correspondence between interface identifiers and interface connection position records. When a certain interface identifier in the interface parasitic parameter mapping results does not have a corresponding interface connection position record in the initial filtering topology, generate an unassociated interface record and recheck the interface connection position records.

[0055] The distributed inductance is written to the interface connection position. For each parasitic parameter record in the interface parasitic parameter mapping result, the corresponding interface connection position record is found according to the interface identifier. Then, a series inductance record is inserted between the original connections on both sides of the interface connection position, and the distributed inductance is written to the series inductance record. When an interface corresponds to multiple length segments, series inductance records are inserted for each of the multiple length segments and arranged in the original physical order.

[0056] Write the contact impedance to the interface connection position. Continue to insert a contact impedance record in the connection position corresponding to the contact position for the same interface connection position, and write the contact impedance to the contact impedance record. When there are multiple contact points on the same interface, insert multiple contact impedance records in the initial filter topology respectively, and connect them in parallel or series relationship.

[0057] Write the distributed capacitance to the interface connection position, read the distributed capacitance, if the distributed capacitance corresponds to the conductive mounting surface of the chassis, insert a capacitance record between the interface connection position and the chassis mounting position; if the distributed capacitance corresponds to an adjacent conductor, insert a capacitance record between the interface connection position and the connection position corresponding to the adjacent conductor; when an interface corresponds to multiple adjacent conductors at the same time, insert a capacitance record for each adjacent conductor and write the corresponding capacitance value.

[0058] Maintain the connection relationships of the pre-assembled filter components and update the interface connection positions. When writing distributed inductance, distributed capacitance, and contact impedance, retain the original connection relationships of the pre-assembled filter components in the initial filter topology, and do not delete the original component records and port records. The updated content is limited to the interface connection positions corresponding to each interface. After writing, the initial filter topology is updated from a connection representation result that only includes the connection relationships of the pre-assembled filter components, the busbar connection path relationships, and the chassis mounting position relationships to a connection representation result that also includes the interface parasitic parameter relationships.

[0059] Generate a parasitic reconstructed topology and verify the connection representation results after writing. The verification includes at least: whether each interface parasitic parameter record corresponds to an interface connection position record, whether each inserted record retains the interface identifier, and whether each distributed capacitance record clearly corresponds to the chassis mounting position or the position of the adjacent conductor. After verification, the updated connection representation results are output as the parasitic reconstructed topology. Subsequent steps continue to compare the parasitic reconstructed topology with the initial filtering topology and further identify the target interface and determine the interface constraints.

[0060] By performing the above steps, the distributed inductance, distributed capacitance, and contact impedance are accurately written into the interface connection positions corresponding to each interface in the initial filter topology according to the interface markings. This allows the parasitic reconstructed topology to retain the original connection relationship of the pre-assembled filter components while also incorporating the additional effects of each interface on the connection relationship.

[0061] Step S4: Compare the parasitic reconstructed topology with the initial filter topology, identify the target interfaces that cause changes in the length of the filter current loop, changes in the ground coupling path, or changes in the interface contact impedance, and determine the interface constraints for each target interface. The interface constraints include at least one of the following: interface connection length constraint, interface contact position constraint, and interface installation relative position constraint.

[0062] In some implementations, see Figure 2 As shown, based on the initial filtering topology and the parasitic reconstruction topology, the detailed implementation steps for comparing the parasitic reconstruction topology with the initial filtering topology to identify the target interface that causes changes in the filter current loop length, ground coupling path, or interface contact impedance include: To establish an interface comparison record, first read all interface connection position records in the initial filtering topology, then read all interface connection position records in the parasitic reconstruction topology, and establish an interface comparison record using the interface identifier as the corresponding key value. Each interface comparison record should at least include the interface identifier, the corresponding interface connection position record in the initial filtering topology, and the corresponding interface connection position record in the parasitic reconstruction topology. When an interface identifier in the parasitic reconstruction topology does not have a corresponding interface connection position record in the initial filtering topology, the interface comparison record is marked as a new interface comparison record. When an interface identifier in the initial filtering topology does not have a corresponding interface connection position record in the parasitic reconstruction topology, the interface comparison record is marked as a missing interface comparison record. When the same interface identifier exists in both topologies, the interface comparison record is marked as the corresponding interface comparison record. Subsequent steps are all performed based on the interface comparison record.

[0063] Compare the changes in the length of the filter current loop. For each interface comparison record, first read the corresponding connection path in the initial filter topology, then read the interface state description result and the corresponding record of the current interface in the parasitic reconstruction topology. The initial total path length is obtained by: starting from the center position of one side of the interface connection position, sequentially accumulating the length of each path segment along the path segment record of the corresponding interface connection position in the initial filter topology, and accumulating the conductive extension length between the port center position and the original connection position to obtain the initial total path length. The reconstructed total path length is obtained by: starting from the center position of one side of the port at the same interface connection position, along the actual conductive extension path of the current interface. The lengths of each path segment are sequentially accumulated, and the conductive extension length between the port center and the contact center is also accumulated to obtain the total reconstructed path length. The series inductance record, contact impedance record, and capacitance record inserted for recording distributed inductance, distributed capacitance, and contact impedance are only used to characterize interface parasitic parameters and are not included in the path length accumulation. Subsequently, the total reconstructed path length is subtracted from the initial total path length to obtain the path length difference. When the path length difference is not equal to zero, it is recorded as a change in the length of the filter current loop, and the path length difference is written into the interface comparison record. When the path length difference is equal to zero, it is recorded as no change in the length of the filter current loop.

[0064] The changes in ground coupling paths are compared. For each interface, the comparison records are first read from the initial filtering topology, and then the capacitive connection records between the current interface and the conductive mounting surface of the chassis are read from the parasitic reconstruction topology. The comparison content includes at least three items: the first item is whether the location of the ground capacitive connection has changed; the second item is whether the number of ground capacitive connections has changed; and the third item is whether the chassis mounting position identifier corresponding to the interface identifier has changed.

[0065] The method for comparing the locations of capacitor connections to ground is as follows: read the starting and ending locations of capacitor connections in the initial filtering topology, then read the starting and ending locations of capacitor connections in the parasitic reconstruction topology, and compare them item by item according to the location coordinates. The method for comparing the number of ground capacitance connections is as follows: count the number of ground capacitance connections corresponding to the current interface in the initial filtering topology, then count the corresponding number in the parasitic reconstruction topology, and compare the two values. The comparison method for the chassis mounting position identifier is as follows: read the chassis mounting position identifier corresponding to the current interface in the initial filtering topology, then read the corresponding chassis mounting position identifier in the parasitic reconstruction topology, and determine whether the two identifiers are consistent.

[0066] When any one of the three items changes, it is recorded as a change in the ground coupling path, and the changed item is written into the interface comparison record; when none of the three items change, it is recorded as no change in the ground coupling path.

[0067] To compare changes in interface contact impedance, for each interface comparison record, first read the original connection form and original contact area of ​​the current interface from the interface relationship table or assembly drawing, then read the interface state description result and the contact position record and contact impedance record of the current interface in the parasitic reconstruction topology. The original contact impedance reference value is obtained by determining the original contact method category based on the original connection form, original contact area, and original number of contact points, and then obtaining the original contact impedance reference value based on the parameter mapping rule table. The updated contact impedance reference value is obtained by determining the updated contact method category based on the contact position, contact area, number of contact points, and connection form of the current interface, and then obtaining the updated contact impedance reference value based on the parameter mapping rule table or the contact impedance record in the parasitic reconstruction topology. Subsequently, the original contact impedance reference value and the updated contact impedance reference value are compared, and the original contact method category and the updated contact method category are compared for consistency. When the contact impedance reference value changes or the contact method category changes, it is recorded as an interface contact impedance change, and the change item is written into the interface comparison record. When neither the contact impedance reference value nor the contact method category changes, it is recorded as no interface contact impedance change.

[0068] Identify the target interface and filter the interface comparison records after the comparison is completed. When any of the following changes are present in an interface comparison record: change in filter current loop length, change in ground coupling path, or change in interface contact impedance, the corresponding interface is identified as the target interface and a target interface record is formed. Each target interface record includes at least the interface identifier, interface category, path length difference, ground coupling path change item, and interface contact impedance change item. If none of the three types of changes are present in an interface comparison record, a target interface record is not formed.

[0069] Output the target interface set by summarizing all target interface records according to the interface identifier. When the same pre-assembled filter component corresponds to multiple target interfaces, each target interface is retained, and the correspondence with the component identifier is retained for subsequent determination of interface constraints.

[0070] Through the above steps, the parasitic reconstructed topology is compared with the initial filtered topology interface by interface. The connection differences before and after writing the parasitic parameters of the interface are transformed into a set of target interfaces that can be located, recorded, and further processed, so that subsequent operations can determine the interface constraints for the interfaces that have been identified as changed.

[0071] In some implementations, see Figure 3 As shown, the implementation steps for determining interface constraints for each target interface, based on the target interface set, include: Read the target interface records by category according to the change items, and read the path length difference, ground coupling path change items and interface contact impedance change items in the target interface records one by one, and record them according to the source of change.

[0072] When the path length difference is not equal to zero, the current target interface is written into the length change record; When the ground coupling path change item is not empty, the current target interface is written into the coupling change record; When the interface contact impedance change item is not empty, the current target interface is written into the impedance change record.

[0073] The same target interface can correspond to multiple change records at the same time, and the constraints of subsequent interfaces can contain multiple constraint contents at the same time.

[0074] To determine the interface connection length constraint, for each target interface in the length change record, first read the path length difference, then read the interface length record in the interface state description result and the interface connection position record in the initial filtering topology.

[0075] Subsequently, the interface connection length constraint is determined based on the principle of adjusting the total path length in the parasitic reconstruction topology back to the corresponding total path length in the initial filtering topology, or adjusting it to the preset target path length.

[0076] The concept behind setting the preset target path length is as follows: the total path length in the initial filtering topology is used first; when multiple continuous path segments correspond to the same interface and the installation space inside the casing is insufficient to retain the original path direction, the path length obtained along the shortest conductive extension direction within the existing arrangeable area inside the casing is used; the interface connection length constraint includes at least the allowable connection length, the allowable number of path segments, and the connection start and end positions.

[0077] The allowed connection length is obtained by reading the total length of the corresponding path in the initial filtered topology; The number of allowed path segments is obtained by reading the number of path segments corresponding to the current interface in the initial filtering topology, and the number is written as the maximum number of retained path segments; The start and end positions of the connection are obtained by reading the first and second connection positions of the current target interface in the initial filtering topology; thus, the interface connection length constraint of the current target interface is formed.

[0078] To determine the interface contact position constraints, for each target interface in the impedance change record, first read the interface contact impedance change item, then read the contact position record and contact impedance mapping result; then, based on the principle of making the contact position correspond back to the original contact area in the initial filter topology, or correspond to the contact area with the largest area value in the same connection surface, determine the interface contact position constraints.

[0079] The method for obtaining the contact area with the largest area value within the same connection surface is as follows: within the same component connection surface, the same busbar connection surface, or the same housing mounting surface, find all connectable contact areas, read the length and width of each contact area, calculate the area value, and select the contact area with the largest area value as the candidate contact area.

[0080] Interface contact position constraints include at least the allowed contact area, the allowed number of contact points, and the contact form; the allowed contact area is obtained in the following way: firstly, read the original contact area of ​​the interface corresponding to the initial filtering topology in the assembly drawing; when the original contact area overlaps with the current component installation position, select the contact area with the largest area value from other contact areas in the same connection surface; The number of allowed contact points is obtained by reading the number of contact points of the corresponding interface in the initial filtering topology, and this number is written as the priority contact point number; the contact form is obtained by reading the connection form in the interface relationship table, and this connection form is written into the interface contact position constraint; thus, the interface contact position constraint of the current target interface is formed.

[0081] To determine the relative position constraints of the interface installation, for each target interface in the coupling change record, first read the ground coupling path change item, then read the corresponding ground position and the corresponding relationship record of adjacent conductors; then, based on the principle of making the position relationship of the interface contact position relative to the conductive mounting surface of the housing and the position relationship relative to the adjacent conductor return to the corresponding relationship in the initial filtering topology, or return to the preset assembly direction relationship, the relative position constraints of the interface installation are determined.

[0082] The concept behind setting the preset assembly direction relationship is: to keep the component port orientation consistent with the busbar extension direction, to keep the vertical distance from the interface contact position to the conductive mounting surface of the housing not increased, and to keep the length overlap between the interface and the adjacent conductor not increased.

[0083] The relative position constraints for interface mounting include at least the relative distance between the interface and the conductive mounting surface of the housing, the relative spacing between the interface and adjacent conductors, and the orientation of the interface.

[0084] The relative distance from the interface to the conductive mounting surface of the chassis is obtained by reading the ground-corresponding position of the corresponding interface in the initial filtering topology and calculating the vertical distance to the conductive mounting surface of the chassis. The relative distance between the interface and the adjacent conductor is obtained by reading the minimum distance value in the correspondence record of the adjacent conductors; The interface orientation is obtained by reading the component port orientation and the busbar path direction, and the consistent arrangement relationship between the port orientation and the busbar path direction is written into the interface installation relative position constraint; thus, the interface installation relative position constraint of the current target interface is formed.

[0085] The interface constraints are combined to form interface constraints. For each target interface, the interface connection length constraints, interface contact position constraints, and interface installation relative position constraints are summarized.

[0086] When the target interface corresponds to only one type of change record, only one type of constraint is written in the interface constraint conditions; when the target interface corresponds to two or three types of change records, both types of constraints are written in the interface constraint conditions; each interface constraint condition includes at least the interface identifier, interface category, and corresponding constraint content.

[0087] Output the set of interface constraints. Summarize the interface constraints of all target interfaces according to the interface identifier to form a set of interface constraints. When multiple target interfaces belong to the same pre-assembled filter component, retain the correspondence between multiple interface constraints and the same component identifier, so that subsequent steps can synchronously update the connection positions of multiple interfaces on the same pre-assembled filter component.

[0088] By following the steps above, the identified target interface and its changes are transformed into interface constraints that can directly guide the updating of interface connection positions, thus providing a clear basis for the update action.

[0089] To illustrate the process of target interface identification and interface constraint determination, the initial filtering topology and parasitic reconstruction topology corresponding to the aforementioned busbar transition interface are compared. In the initial filtering topology, the total path length corresponding to this interface is 14 mm. In the parasitic reconstruction topology, considering the conductive extension at the contact position, the total reconstruction path length is 19 mm, resulting in a path length difference of 5 mm. In the initial filtering topology, this interface corresponds to a ground capacitance connection position. In the parasitic reconstruction topology, the current interface corresponds to a capacitance connection position to the conductive mounting surface of the chassis. In the parasitic reconstruction topology, if the capacitance connection position or the number of capacitance connections to the conductive mounting surface of the chassis changes, it is considered a change in the ground coupling path. The original contact impedance reference is determined based on the original crimping area, the original number of contact points, and the original connection form. The updated contact impedance reference value is determined based on the current contact position, updated contact area, number of contact points, and connection type. When the updated contact impedance reference value is inconsistent with the original contact impedance reference value, it is recorded as a change in interface contact impedance. Based on the above comparison results, the interface is identified as the target interface. Subsequently, based on the original total path length of 14 mm in the initial filtering topology, the allowable connection length is determined to be 14 mm. The allowable contact area is determined based on the original crimping area position. Based on the original ground corresponding position and the minimum spacing between adjacent conductors, it is determined that the relative distance from the interface to the conductive mounting surface of the housing does not increase and the relative spacing from the interface to the adjacent conductor does not decrease, thereby forming the interface connection length constraint, interface contact position constraint, and interface mounting relative position constraint of the target interface, which serve as the basis for updating the interface connection position in step S5.

[0090] Step S5: Based on the interface constraints, update the interface connection positions corresponding to each target interface in the initial filtering topology to generate the assembled filtering topology.

[0091] In some implementations, the detailed steps for generating the assembled filter topology include: The process reads the interface constraints and the initial filtering topology. First, it reads the set of interface constraints, then the initial filtering topology. Subsequently, using the interface identifier as the corresponding key, it finds the interface connection position record corresponding to each interface constraint in the initial filtering topology and establishes an update correspondence between interface constraints and interface connection position records. If a certain interface constraint does not have a corresponding interface connection position record in the initial filtering topology, it returns to the interface connection position establishment step for re-verification. After verification, it continues to execute the subsequent update steps.

[0092] The interface connection positions are updated based on the interface connection length constraints. For a target interface with interface connection length constraints, the allowed connection length, the allowed number of path segments, and the connection start and end positions are read first. Then, the path segment records corresponding to the current interface are adjusted in the initial filtering topology. The path segment adjustment methods include: deleting path segment records that exceed the allowed number of path segments; shortening the length of path segments whose cumulative length exceeds the allowed connection length; rewriting the connection start and end positions to the connection start and end positions in the interface connection length constraints; when a target interface corresponds to multiple consecutive path segments, they are adjusted segment by segment in the order from the end closest to the component port to the end closest to the housing installation position; when the cumulative path length reaches the allowed connection length, the extension of subsequent path segments is stopped; after the update is completed, the adjusted path segment records are written back to the corresponding interface connection position records in the initial filtering topology.

[0093] The interface connection positions are updated based on the interface contact position constraints. For a target interface with interface contact position constraints, the allowed contact area, the number of allowed contact points, and the contact form are first read. Then, in the initial filtering topology, the contact position of the current interface is updated to the contact center position in the allowed contact area, and the contact point records are rewritten according to the number of allowed contact points. When the original number of contact points is greater than the number of allowed contact points, the first few contact point records are retained in descending order of contact area value. When the original number of contact points is less than the number of allowed contact points, contact point records are added in the allowed contact area at uniform intervals. The contact form remains consistent with the contact form in the interface constraint conditions. After the update is completed, the new contact position record is written back to the corresponding interface connection position record in the initial filtering topology.

[0094] The interface connection position is updated based on the relative position constraints of the interface installation. For a target interface with relative position constraints of the interface installation, the relative distance from the interface to the conductive mounting surface of the housing, the relative spacing from the interface to the adjacent conductor, and the interface orientation are read first. Then, the spatial coordinate record of the current interface connection position is adjusted in the initial filtering topology.

[0095] The spatial coordinate adjustment methods include: moving the interface connection position along the direction perpendicular to the conductive mounting surface of the casing so that the adjusted vertical distance corresponds to the relative distance in the interface mounting relative position constraint; moving the interface connection position along the normal direction between the interface and the adjacent conductor so that the adjusted minimum spacing corresponds to the relative spacing in the interface mounting relative position constraint; and rotating the port orientation corresponding to the interface connection position so that the adjusted orientation is consistent with the interface orientation in the interface mounting relative position constraint.

[0096] When the same pre-assembled filter component corresponds to multiple target interfaces and all target interfaces have relative position constraints for interface installation, first summarize the relative position constraints of multiple interface installations according to the component identifier, and then synchronously adjust the connection positions of multiple interfaces under the same component coordinates to avoid changing the update result of another interface after one interface is updated; after the update is completed, write the new spatial coordinate record back to the corresponding interface connection position record in the initial filter topology.

[0097] An updated set of interface connection positions is formed. All updated interface connection position records are re-aggregated to form an updated set of interface connection positions. Each updated interface connection position record includes at least one or more of the following: interface identifier, updated path segment record, updated contact position record, and updated spatial coordinate record. Subsequent operations replace the corresponding records in the initial filtering topology with the updated set of interface connection positions.

[0098] Generate an assembled filtering topology, write the updated set of interface connection positions back to the initial filtering topology one by one, replace the original interface connection position records corresponding to the target interface, and keep the interface connection position records of non-target interfaces unchanged, thus forming an assembled filtering topology; the assembled filtering topology retains the connection relationship of the pre-assembled filtering components in the initial filtering topology, and writes the updated interface connection position relationship based on the interface constraints.

[0099] By performing the above steps, the interface constraints are translated into specific update actions for the interface connection positions, transforming the initial filtering topology into an assembled filtering topology that can directly reflect the adjustment results of the target interface.

[0100] To illustrate the interface connection position update process, for the aforementioned target interface, the original two path segment records are read from the initial filter topology: the first path segment is 26 mm and the second path segment is 14 mm. Based on the interface connection length constraint, the second path segment corresponding to the current target interface is shortened from 14 mm to 9 mm, bringing the total conductive extension length of the current interface back within the allowable connection length range. Based on the interface contact position constraint, the original center position of the crimping area is updated from (58, 75, 20) to the center position of the larger crimping area within the same connection surface (56, 73, 20), and the two dispersed crimping points are adjusted to two evenly distributed crimping points. Based on the interface installation relative position constraint, the spatial coordinates of the current interface are shifted down by 2 mm along the direction perpendicular to the conductive mounting surface of the housing, reducing the relative distance between the updated interface and the conductive mounting surface of the housing, and the interface orientation is adjusted to be consistent with the direction of the end segment of the busbar path. After completing the above updates, the path segment record, contact position record, and spatial coordinate record of the current target interface are all written back to the initial filter topology, generating the corresponding assembled filter topology record.

[0101] Step S6: Based on the assembly sequence, connection path, and installation position of the output components of the assembled filter topology, the filter design result is formed.

[0102] In some implementations, the steps to generate the filter design result include: Read the component records and updated interface connection position records in the assembly filtering topology; first read all pre-assembled filtering component records in the assembly filtering topology, then read all updated interface connection position records; subsequently, using the component identifier as an index, re-associate each pre-assembled filtering component with the corresponding interface connection position record to form a component assembly relationship record; each component assembly relationship record includes at least one or more of the following: component identifier, associated interface identifier, updated path segment record, updated contact position record, and updated spatial coordinate record.

[0103] The component assembly sequence is determined, and the preceding connection objects corresponding to each pre-assembled filter component are recorded and counted according to the component assembly relationship. In this embodiment, the preceding connection object is defined as: an object located before the current pre-assembled filter component that needs to be fixed or connected first during assembly, including at least the housing installation position, the object corresponding to the busbar starting point, and another pre-assembled filter component; then, the component assembly sequence is generated in the following manner: First, filter pre-assembled filter components with zero preceding connection objects are selected and written into the first priority record. Then, delete the pre-assembled filter components that have been written into the first priority record and their related connection relationships from the remaining pre-assembled filter components, and recount the number of preceding connection objects for the remaining pre-assembled filter components. Continue to filter pre-assembled filter components with zero preceding connection objects and write them into the next priority record. Repeat the deletion, counting and filtering process until all pre-assembled filter components are written into the component assembly order record.

[0104] When multiple pre-assembled filter components exist in the same sequence record, the pre-assembled filter component that directly corresponds to the housing installation position is written first, then the pre-assembled filter component that directly corresponds to the busbar starting point object is written, and finally the pre-assembled filter component that directly corresponds to another pre-assembled filter component is written. Through this step, the component assembly order is directly derived from the connection dependency relationship in the assembly filter topology.

[0105] The output connection path is determined by updating the path segment records in the assembled filter topology, and then outputting the connection path records for each interface. For each target interface, the updated number of path segments, the direction of each path segment, and the length of each path segment are read first, and then the connection path records are output in the order of the path segments. Each connection path record includes at least the interface identifier, the starting position, the ending position, the path segment order, the direction of each path segment, and the length of each path segment. When the same pre-assembled filter component corresponds to multiple interfaces, the connection path records are output for each interface separately, and the correspondence with the component identifier is retained.

[0106] The installation position is output based on the updated spatial coordinate records and updated contact position records in the assembled filter topology, and the installation position records are output for each component. Each installation position record includes at least the component identifier, installation surface position, contact center position, interface orientation, and housing installation position identifier. When the same pre-assembled filter component corresponds to multiple installation points, installation position records are output for each installation point, and the point order is retained in the installation position records. When a pre-assembled filter component is only connected to other pre-assembled filter components through the busbar path and does not directly correspond to the housing installation position, the spatial coordinates corresponding to the end point of the busbar path are still written into the installation position record as the basis for installation positioning.

[0107] The filter design results are generated by summarizing the component assembly sequence records, connection path records, and installation position records according to the component identifiers. The filter design results include at least a component assembly sequence table, a connection path table, and an installation position table. The component assembly sequence table indicates the order in which each pre-assembled filter component enters the whole machine assembly. The connection path table indicates the connection direction and length after the update of each target interface. The installation position table indicates the specific installation position of each pre-assembled filter component or busbar within the casing.

[0108] Output the filter design results and write them into the design output file. The design output file should include at least component identification, component assembly sequence, interface identification, connection path record, and installation location record. When it is necessary to continue to check the assembly results, directly read the design output file and check it against the interface relationship table in step S1.

[0109] Through the above steps, the assembled filter topology is further transformed into filter design results for actual assembly and design write-back. This allows the interface identification, parasitic mapping, topology comparison, interface constraint determination, and interface connection position update obtained in the previous steps to ultimately be reflected in the three output contents: component assembly sequence, connection path, and installation position.

[0110] This example illustrates that, based on the updated assembled filter topology, the following filter design results can be achieved: the common-mode choke component, due to its direct correspondence to the chassis mounting position and the zero number of preceding connected objects, is identified as the first-priority assembled component; the differential-mode capacitor component, installed after the common-mode choke component and its corresponding busbar are fixed, is identified as the second-priority assembled component; the damping component, installed after the differential-mode capacitor component is connected, is identified as the third-priority assembled component; for the aforementioned target interface, the corresponding output connection path record includes the starting position (58, 68, 20). The endpoint position is (56, 73, 20), the number of path segments is 1, the path segment direction is along the width direction, and the path segment length is 9 mm. The corresponding output installation position record includes the component identification as differential mode capacitor component, the mounting surface position as the inner mounting surface of the housing, the contact center position as (56, 73, 20), the interface orientation as consistent with the direction of the last section of the busbar, and the housing installation position identification as M3. After summarizing the above component assembly sequence record, connection path record, and installation position record according to the component identification, a filter design result that can be directly called for assembly and design write-back is formed. Example 2

[0111] See Figure 4 As shown, this embodiment provides a filter modular design optimization system. Since this system is used to implement a filter modular design optimization method in Embodiment 1, it also has corresponding technical effects, which will not be elaborated here. The system includes: The initial modeling module is used to obtain the component connection relationship, component port position, busbar connection path and housing installation position according to the pre-assembled filter components, establish the interface relationship table, and establish the initial filter topology based on the interface relationship table; The state extraction module is used to identify the component connection interface, busbar transition interface and housing installation interface based on the interface relationship table, and extract the interface length, contact position, ground corresponding position and adjacent conductor correspondence of each interface to form the interface state description result of each interface. The parasitic reconstruction module is used to map each interface to the corresponding distributed inductance, distributed capacitance and contact impedance according to the interface state description results, and write the mapped distributed inductance, distributed capacitance and contact impedance into the interface connection position corresponding to each interface in the initial filtering topology to generate the parasitic reconstruction topology. The target constraint module is used to compare the parasitic reconstructed topology with the initial filter topology, identify the target interfaces that cause changes in the length of the filter current loop, changes in the ground coupling path, or changes in the interface contact impedance, and determine the interface constraint conditions for each target interface. The topology update module is used to update the interface connection positions corresponding to each target interface in the initial filtering topology based on the interface constraints, and generate the assembled filtering topology. The result output module is used to generate filter design results based on the assembly sequence, connection path, and installation position of the output components in the assembled filter topology.

[0112] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope defined in the claims.

Claims

1. A filter modular design optimization method, characterized by, include: Step S1: Obtain the component connection relationship, component port position, busbar connection path and housing installation position according to the pre-assembled filter components, establish the interface relationship table, and establish the initial filter topology based on the interface relationship table; Step S2: Identify the component connection interface, busbar transition interface and housing mounting interface based on the interface relationship table, and extract the interface length, contact position, ground corresponding position and adjacent conductor correspondence of each interface to form the interface state description result of each interface. Step S3: Based on the interface state description results, each interface is mapped to the corresponding distributed inductance, distributed capacitance and contact impedance, and the mapped distributed inductance, distributed capacitance and contact impedance are written into the interface connection position corresponding to each interface in the initial filtering topology to generate the parasitic reconstruction topology. Step S4: Compare the parasitic reconstructed topology with the initial filter topology, identify the target interfaces that cause changes in the length of the filter current loop, changes in the ground coupling path, or changes in the interface contact impedance, and determine the interface constraints for each target interface. Step S5: Based on the interface constraints, update the interface connection positions corresponding to each target interface in the initial filtering topology to generate the assembled filtering topology. Step S6: Based on the assembly sequence, connection path, and installation position of the output components of the assembled filter topology, the filter design result is formed.

2. The filter modular design optimization method according to claim 1, characterized in that, Methods for creating interface relationship tables include: Read the filter's assembly drawings, electrical connection diagrams, and component list to form a pre-assembled filter component list; Based on the electrical connection diagram and assembly diagram, obtain the component connection relationship between the pre-assembled filter component and other conductors; under a unified coordinate reference, obtain the component port position, busbar connection path and housing installation position of each pre-assembled filter component; Based on the component connection relationship, component port position, busbar connection path and chassis installation position, an interface relationship table is established in such a way that one interface corresponds to one interface record.

3. The filter modular design optimization method according to claim 1, characterized in that, Methods for establishing an initial filter topology include: Read the first component identifier, second component identifier or housing identifier, first port identifier, second port identifier, busbar connection path identifier and housing installation position identifier from the interface relationship table; Establish component records based on the first component identifier, the second component identifier, or the housing identifier; establish interface connection position records based on the first port identifier, the second port identifier, the busbar connection path identifier, and the housing installation position identifier. Then, according to the connection correspondence in the interface relationship table, connect the component records and the interface connection position records to form the initial filtering topology.

4. The filter modular design optimization method according to claim 2, characterized in that, Methods for generating interface state descriptions for each interface include: The component connection interface, busbar transition interface, and housing mounting interface are determined based on the interface relationship table. The start and end reference positions of each interface are determined according to the interface type, and the interface length is extracted along the actual conductive extension direction. The contact position is extracted based on the connection method, and the corresponding ground position is determined by combining the position of the conductive mounting surface of the casing. Then, a search area is established based on the contact location and interface length to identify the correspondence between adjacent conductors; Write the interface category, interface length, contact position, ground correspondence position, and adjacent conductor correspondence according to the interface identifier to form the interface state description result of each interface.

5. The filter modular design optimization method of claim 4, wherein, Methods for mapping each interface to its corresponding distributed inductance, distributed capacitance, and contact impedance include: Based on the interface category, interface length, contact position, ground corresponding position and adjacent conductor correspondence in the interface state description results, find and construct the unit length distributed inductance coefficient, unit area distributed capacitance coefficient, unit area contact impedance coefficient, inductance correction coefficient and correction direction mark in the parameter mapping rule table respectively; Based on the search results, calculate the distributed inductance, distributed capacitance, and contact impedance of each interface, and write them into the parasitic parameter record according to the interface identifier to form the interface parasitic parameter mapping result.

6. The filter modular design optimization method according to claim 5, characterized in that, Methods for generating parasitic reconstructed topologies include: Read the interface connection position records and interface parasitic parameter mapping results in the initial filtering topology, and establish the corresponding relationship based on the interface identifier; In the interface connection positions corresponding to each interface, the distributed inductance, contact impedance and distributed capacitance are written respectively; wherein, the distributed inductance is recorded as a series inductance, the contact impedance is recorded as a contact impedance, and the distributed capacitance is recorded as a capacitance. Based on preserving the connection relationships of the pre-assembled filter components, the updated connection representation results are checked and output to generate the parasitic reconstruction topology.

7. The filter modular design optimization method according to claim 6, characterized in that, Methods for identifying target interfaces that cause changes in filter current loop length, ground coupling path, or interface contact impedance include: Based on the initial filtering topology and the parasitic reconstruction topology, an interface comparison record is established according to the interface identifier, and the corresponding interface connection position record is written into the interface comparison record. Based on the interface comparison records and combined with the interface status description results, the path length difference, changes in ground capacitor connection position, changes in the number of ground capacitor connections, changes in the chassis installation position markings, and changes in the interface contact impedance reference value or contact method category are compared for each interface. Based on the comparison results, the interface exhibiting any change is identified as the target interface.

8. The filter modular design optimization method according to claim 7, characterized in that, Methods for determining interface constraints for each target interface include: Based on the path length difference, ground coupling path change items, and interface contact impedance change items recorded in the target interface records, the target interfaces are classified according to the source of change. For target interfaces with path length differences, interface connection length constraints are determined based on the total path length, number of path segments, and connection start and end positions in the initial filtering topology. For target interfaces with varying interface contact impedance, interface contact position constraints are determined based on the original contact area, the number of contact points, and the connection type. For target interfaces with varying ground coupling paths, the relative position constraints of the interface installation are determined based on the ground corresponding position, the correspondence between adjacent conductors, the orientation of component ports, and the direction of busbar paths; these are then combined to form interface constraint conditions.

9. The filter modular design optimization method of claim 1, wherein, Methods for generating filter design results include: Update the interface connection positions in the initial filtering topology based on the interface constraints to generate the assembled filtering topology; Read the pre-assembled filter component records and the updated interface connection position records in the assembled filter topology to form a component assembly relationship record; Based on the component assembly relationship record, the preceding connection objects corresponding to each pre-assembled filter component are counted; the component assembly sequence is determined based on the preceding connection objects. Output connection path records based on the updated path segment records, and output installation location records based on the updated spatial coordinate records and contact position records; Then, the assembly sequence of the components, the connection path, and the installation location are summarized according to the component identification to form the filter design results.

10. A filter modular design optimization system, used to implement a filter modular design optimization method according to any one of claims 1-9, characterized in that, The system includes: The initial modeling module is used to obtain the component connection relationship, component port position, busbar connection path and housing installation position according to the pre-assembled filter components, establish the interface relationship table, and establish the initial filter topology based on the interface relationship table; The state extraction module is used to identify the component connection interface, busbar transition interface and housing installation interface based on the interface relationship table, and extract the interface length, contact position, ground corresponding position and adjacent conductor correspondence of each interface to form the interface state description result of each interface. The parasitic reconstruction module is used to map each interface to the corresponding distributed inductance, distributed capacitance and contact impedance according to the interface state description results, and write the mapped distributed inductance, distributed capacitance and contact impedance into the interface connection position corresponding to each interface in the initial filtering topology to generate the parasitic reconstruction topology. The target constraint module is used to compare the parasitic reconstructed topology with the initial filter topology, identify the target interfaces that cause changes in the length of the filter current loop, changes in the ground coupling path, or changes in the interface contact impedance, and determine the interface constraint conditions for each target interface. The topology update module is used to update the interface connection positions corresponding to each target interface in the initial filtering topology based on the interface constraints, and generate the assembled filtering topology. The result output module is used to generate filter design results based on the assembly sequence, connection path, and installation position of the output components in the assembled filter topology.

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