A decoupling structure for a millimeter-wave circularly polarized antenna array and a wireless communication device

Abstract

This invention provides a decoupling structure for a millimeter-wave circularly polarized antenna array and a wireless communication device. The decoupling structure is used to resonate and decouple the millimeter-wave circularly polarized antenna array. The decoupling structure comprises, from top to bottom, an upper decoupling dielectric substrate and a lower decoupling dielectric substrate. An upper metal decoupling structure is disposed on the upper surface of the upper decoupling dielectric substrate, and a lower metal decoupling structure is disposed on the upper surface of the lower decoupling dielectric substrate. The upper metal decoupling structure includes a transverse main trunk and several longitudinal branches; the lower metal decoupling structure includes several longitudinal metal branches, with the lengths of the transverse main trunk, longitudinal branches, and longitudinal metal branches decreasing sequentially. Millimeter-wave circularly polarized antenna arrays are spaced apart at the bottom of the lower decoupling dielectric substrate to form a wireless communication device. The resonant decoupling structure of this invention suppresses port coupling between antenna elements while expanding impedance bandwidth and bandwidth.

Description

Technical Field

[0001] This invention relates to the field of antenna decoupling technology in wireless communication, and more specifically, to a decoupling structure for a millimeter-wave circularly polarized antenna array and a wireless communication device. Background Technology

[0002] Millimeter-wave technology is one of the key technologies supporting the high speed, low latency, and high reliability of 5G and 6G. Compared with traditional microwave communication frequency bands, millimeter-wave bands have higher frequencies and wider bandwidths, which can significantly improve the data transmission rate, system capacity, and reliability of communication systems. As signal transmitting and receiving devices, high-performance millimeter-wave antenna systems play a crucial role in communication.

[0003] Existing microstrip patch antennas and planar inverted-F antennas suffer from narrow bandwidth and low gain in the millimeter-wave band. In contrast, magnetoelectric dipole antennas utilize the complementary radiation characteristics of electric and magnetic dipoles, enabling stable radiation over a wide frequency range. They also offer advantages such as simple structure and flexible feeding, making them an important candidate for millimeter-wave antennas.

[0004] Multiple-input multiple-output (MIMO) technology is one of the core technologies of 5G / 6G. By deploying multiple antennas at the transmitter and receiver, MIMO can increase system capacity, reduce interference, and combat multipath effects without increasing spectrum resources. However, with the miniaturization of communication equipment, the spacing between MIMO array elements is often limited. The induced currents generated by the excitation antennas in adjacent elements can cause strong port coupling, leading to decreased antenna radiation efficiency, poor matching, signal attenuation, and pattern distortion, thus affecting system performance. Therefore, improving the isolation of the array antennas is a key challenge in the design of miniaturized, high-performance antennas.

[0005] Among antenna polarization types, circularly polarized (CP) antennas, due to their ability to accept incoming waves in any polarization direction, exhibit excellent performance in resisting polarization mismatch, multipath interference, and propagation in harsh environments such as wind and rain, and are widely used in satellite communications, radio navigation, and base station communications. Compared to linearly polarized antennas, CP antennas have significant advantages in overcoming the Faraday effect and improving link stability. When multiple CP antenna elements are arranged in a compact array, inter-element coupling can disrupt the array's active impedance matching and deteriorate the CP characteristics, leading to pattern distortion and channel interference. Therefore, how to effectively suppress inter-element coupling while maintaining the excellent characteristics of CP has become a core issue in millimeter-wave MIMO array design. Summary of the Invention

[0006] In view of this, the present invention proposes a decoupling structure for a millimeter-wave circularly polarized antenna array and a wireless communication device to solve the problems existing in the prior art.

[0007] To achieve the above object, the present invention provides a decoupling structure for a millimeter-wave circularly polarized antenna array and a wireless communication device, which are used for resonance decoupling of the millimeter-wave circularly polarized antenna array. The decoupling structure is sequentially provided from top to bottom with:

[0008] an upper decoupling dielectric substrate and a lower decoupling dielectric substrate. An upper metal decoupling structure is provided on the upper end surface of the upper decoupling dielectric substrate, and a lower metal decoupling structure is provided on the upper end surface of the lower decoupling dielectric substrate.

[0009] The upper metal decoupling structure includes a horizontal main trunk and a plurality of vertical branches. The horizontal main trunk is disposed at the horizontal central position of the upper end surface of the upper decoupling dielectric substrate. The vertical branches are parallelly and equidistantly distributed and vertically disposed on the horizontal main trunk. The number of the vertical branches is odd, and the central vertical branch is disposed at the vertical central position of the upper end surface of the upper decoupling dielectric substrate, and the vertical branches are symmetric with respect to the horizontal main trunk.

[0010] The lower metal decoupling structure includes a plurality of vertical metal branches, wherein the number of the vertical metal branches is one less than the number of the vertical branches, and each vertical metal branch is disposed at the center position of the interval between adjacent vertical branches and is parallel to the vertical branches.

[0011] The lengths of the horizontal main trunk, the vertical branches and the vertical metal branches are sequentially decreased.

[0012] Optionally, the upper decoupling dielectric substrate and the lower decoupling dielectric substrate are directly stacked, and the upper decoupling dielectric substrate and the lower decoupling dielectric substrate have the same length, width and thickness and the same material.

[0013] Optionally, the upper decoupling dielectric substrate and the lower decoupling dielectric substrate are made of a low-loss dielectric substrate material.

[0014] Optionally, the number of the vertical branches is three, and the vertical branches and the horizontal main trunk form a "丰" character shape.

[0015] Optionally, the vertical branches and the horizontal main trunk have the same width.

[0016] On the other hand, the present invention provides a wireless communication device, including: the above decoupling structure, and a millimeter-wave circularly polarized antenna array is disposed at intervals at the bottom of the lower decoupling dielectric substrate of the decoupling structure to form a wireless communication device.

[0017] Optionally, the millimeter-wave circularly polarized antenna array includes a plurality of magnetoelectric dipole antenna units, and the magnetoelectric dipole antenna units are sequentially provided from top to bottom with: an antenna radiation patch, an intermediate layer dielectric substrate, a metal floor, a bottom layer dielectric substrate and a T-shaped feed microstrip line.

[0018] Optionally, the antenna radiating patch includes a large electric dipole patch arranged diagonally and a small electric dipole patch placed diagonally. The large electric dipole patch and the small electric dipole patch are connected to the metal ground plate through metal through holes. The metal ground plate is provided with an H-shaped gap for electromagnetic coupling.

[0019] Optionally, the T-shaped feed microstrip line is printed on the lower end face of the underlying dielectric substrate as a feed radiator.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0021] (1) This invention employs a resonant decoupling structure consisting of a transverse main trunk and longitudinal branches. The longitudinal branches are arranged alternately in the upper and lower layers and are orthogonal to the transverse main trunk. By adjusting the lengths of the main trunk and branches, the amplitude and phase of the induced current can be effectively controlled, thereby suppressing the mutual coupling current.

[0022] (2) The resonant decoupling structure of this invention is suitable for millimeter-wave circularly polarized antenna arrays, which can significantly reduce the mutual coupling between antenna elements and improve port isolation. It effectively cancels the coupling current between elements by introducing an additional current path with equal amplitude and opposite phase, thereby reducing the coupling level between ports.

[0023] (3) The resonant decoupling structure of the present invention is composed of multiple orthogonally distributed metal branches, which can provide multiple induced current paths within the target frequency band, thereby generating mutually orthogonal induced currents within the structure itself. This current interacts with the antenna radiated current, maintaining circular polarization characteristics and improving amplitude-phase balance, effectively extending the 3 dB axial ratio bandwidth. Attached Figure Description

[0024] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. In the drawings:

[0025] Figure 1 A schematic cross-sectional view of a millimeter-wave circularly polarized antenna array with the resonant decoupling structure of this invention.

[0026] Figure 2 A 3D layered diagram of a millimeter-wave circularly polarized antenna array with the resonant decoupling structure of this invention;

[0027] Figure 3 This is a top view of the resonant decoupling structure of the present invention;

[0028] Figure 4 The simulation results of the S-parameters of the millimeter-wave circularly polarized antenna array before loading the resonant decoupling structure of this invention are shown in the figure.

[0029] Figure 5 The figure shows the simulation results of the S-parameters of the millimeter-wave circularly polarized antenna array after loading the resonant decoupling structure of this invention;

[0030] Figure 6 The simulation results of the axial ratio of the millimeter-wave circularly polarized antenna array before loading the resonant decoupling structure of this invention are shown in the figure.

[0031] Figure 7 The simulation results of the axial ratio of the millimeter-wave circularly polarized antenna array after loading the resonant decoupling structure of this invention are shown in the figure.

[0032] Figure 8 The radiation pattern of the present invention at 37.5 GHz is shown; wherein Figure (a) corresponds to the radiation pattern of the XOZ plane and Figure (b) corresponds to the radiation pattern of the YOZ plane.

[0033] Figure 9 The radiation pattern of the present invention is shown at 40 GHz; wherein Figure (a) corresponds to the radiation pattern of the XOZ plane and Figure (b) corresponds to the radiation pattern of the YOZ plane.

[0034] Figure 10 The radiation pattern of the present invention at 42.5 GHz is shown; wherein Figure (a) corresponds to the radiation pattern of the XOZ plane and Figure (b) corresponds to the radiation pattern of the YOZ plane.

[0035] In the attached diagram: 1. Upper metal decoupling structure; 2. Upper decoupling dielectric substrate; 3. Lower metal decoupling structure; 4. Lower decoupling dielectric substrate; 5. Antenna radiating patch; 6. Middle dielectric substrate; 7. Metal ground plane; 8. Bottom dielectric substrate; 9. T-shaped feed microstrip line;

[0036] 101. Longitudinal support; 102. Transverse main branch; 501. Large electric dipole patch; 502. Small electric dipole patch; 601. Metal through hole; 701. First gap; 702. Second gap; Detailed Implementation

[0037] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0038] The present invention proposes a resonant decoupling structure applicable to a millimeter-wave circularly polarized antenna array. While suppressing the port mutual coupling between antenna elements, it realizes the expansion of the impedance bandwidth and the 3 dB axial ratio bandwidth. The technical solution adopted by the present invention is as follows:

[0039] The resonant decoupling structure of the present invention includes upper and lower decoupling dielectric substrates, and metal resonant decoupling structure modules etched on the upper end faces of the two decoupling dielectric substrates respectively;

[0040] The upper and lower decoupling dielectric substrates are the upper decoupling dielectric substrate 2 and the lower decoupling dielectric substrate 4 respectively, which are directly stacked. Their length, width and thickness are the same, and the materials used are also the same. A low-loss dielectric substrate material is adopted, for example, both are FR4_epoxy. The relative dielectric constant of the decoupling dielectric substrate is 4.4, and the loss tangent of the decoupling dielectric substrate is 0.02. The gap between the lower decoupling dielectric substrate 4 and the circularly polarized antenna is H0.

[0041] An upper-layer metal decoupling structure 1 in the shape of a "丰" character is etched on the upper end face of the upper decoupling dielectric substrate 2. The upper metal decoupling structure 1 is composed of a horizontal main trunk 102 and three vertical branches 101. The horizontal main trunk 102 is horizontally arranged at the center of the upper end face of the upper decoupling dielectric substrate 2, with a width of W1 and a length of L0; the three vertical branches 101 are perpendicular to the horizontal main trunk 102, with a width of W1 and a length of L1, and are equally spaced along the length direction of the horizontal main trunk 102. The distance between adjacent vertical branches 101 is D1.

[0042] A lower-layer metal decoupling structure 3 in the shape of a "二" character is etched on the upper end face of the lower decoupling dielectric substrate 4. The lower-layer metal decoupling structure 3 is composed of two vertical metal branches, and is completely coaxially aligned with the upper-layer metal decoupling structure 1 in the shape of a "丰" character in the plane and is located below it. The two vertical metal branches are arranged with a width of W2 and a length of L2; the distance is D2. The lower-layer metal decoupling structure 3 in the shape of a "二" character is centered as a whole, and its two vertical metal branches are respectively located at the gap positions between the three vertical branches 101 in the upper-layer metal decoupling structure 1 in the shape of a "丰" character, and are arranged in a staggered manner without overlapping, and at the same time satisfy the dimensional relationship of L0 > L1 > L2. The materials of the vertical branches 101, the horizontal main trunk 102 and the vertical metal branches are the same.

[0043] The above upper and lower layer metal decoupling structures are integrally composed of a horizontal main trunk 102 and its交错分布的纵向分支 (vertically distributed branches in a staggered manner). Among them, three longer vertical branches 101 are arranged on the upper layer, and two shorter vertical metal branches are arranged on the lower layer, thus forming the resonant decoupling structure. The decoupling structure module as a whole has central symmetry characteristics, and its symmetric center position corresponds to directly above the geometric center of the antenna array.

[0044] Based on the above resonant decoupling structure, circularly polarized antennas are placed at intervals below the lower decoupling dielectric substrate 4 to form a wireless communication device.

[0045] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0046] like Figures 1-3 The diagram illustrates a millimeter-wave circularly polarized antenna array with a resonant decoupling structure according to the present invention, including the resonant decoupling structure and the millimeter-wave broadband circularly polarized antenna array. The resonant decoupling structure includes an upper metal decoupling structure 1, an upper decoupling dielectric substrate 2, a lower metal decoupling structure 3, and a lower decoupling dielectric substrate 4. The millimeter-wave broadband circularly polarized antenna array includes an antenna radiating patch 5, an intermediate dielectric substrate 6, a metal ground plane 7, a bottom dielectric substrate 8, and a T-shaped feed microstrip line 9.

[0047] Figure 1 A cross-sectional schematic diagram of a circularly polarized antenna array with the resonant decoupling structure of this invention is shown. The cross-sectional structure, from top to bottom, comprises: an upper metal decoupling structure 1, an upper decoupling dielectric substrate 2, a lower metal decoupling structure 3, a lower decoupling dielectric substrate 4, an antenna radiating patch 5, an intermediate dielectric substrate 6, a metal ground plane 7, a bottom dielectric substrate 8, and a T-shaped feed microstrip line 9. The gap between the lower decoupling dielectric substrate 4 and the circularly polarized antenna array is H0 = 0.248 mm.

[0048] Figure 2 A 3D layered diagram of a circularly polarized antenna array loaded with the resonant decoupling structure of this invention is shown. Figure 3 A top view of the resonant decoupling structure of the present invention is shown; combined with Figure 2 and Figure 3The resonant decoupling structure is described in detail below: The upper metal decoupling structure 1 includes three longitudinal supports 101 and a transverse main trunk 102, which are disposed on the upper end face of the upper decoupling dielectric substrate 2. The transverse main trunk 102 has a width of W1 = 0.35 mm and a length of L0 = 8.9 mm. The three longitudinal supports 101 are perpendicular to the main trunk, with a width of W1 = 0.35 mm and a length of L1 = 4.7 mm, and are evenly distributed along the transverse main trunk 102. The spacing between adjacent longitudinal supports 101 is D1 = 1.225 mm. The upper end face of the lower decoupling dielectric substrate 4 is provided with a lower metal decoupling structure 3, which consists of two longitudinal metal supports. The two longitudinal metal supports have a width of W2 = 0.4 mm and a length of L2 = 2.375 mm, and a spacing of D2 = 1.2 mm. Both the upper decoupling dielectric substrate 2 and the lower decoupling dielectric substrate 4 are made of FR4_epoxy, with a relative permittivity of 4.4 and a loss tangent of 0.02. The thickness of both substrates is 0.1 mm, and their length and width are the same as those of the antenna array's dielectric substrate: 9.35 mm and 4.8 mm respectively. The upper metal decoupling structure 1 and the lower metal decoupling structure 3 together form a transverse main trunk 102 combined with staggered longitudinal metal branches. The upper metal decoupling structure 1 includes three longer longitudinal branches 101, and the lower metal decoupling structure 3 includes two shorter longitudinal branches, thus constituting the resonant decoupling structure. The resonant decoupling structure module has a central symmetry characteristic, with its center of symmetry located directly above the geometric center of the antenna array. The upper metal decoupling structure 1, the lower decoupling structure 3, the upper decoupling dielectric substrate 2, and the lower decoupling dielectric substrate 4 together constitute the resonant decoupling structure of this invention.

[0049] The millimeter-wave circularly polarized antenna array used in this invention consists of two magnetoelectric dipole antenna elements, and the center-to-center spacing of the millimeter-wave circularly polarized antenna array is 0.55λ. L . λ L The free-space wavelength corresponding to the lowest frequency at which the antenna operates.

[0050] Each magnetoelectric dipole antenna element is printed on an intermediate dielectric substrate 6 by an antenna radiating patch 5. The antenna radiating patch 5 includes a large electric dipole patch 501 and a small electric dipole patch 502 placed diagonally. The large electric dipole patch 501 has the same width as the small electric dipole patch 502 but is longer. It also has two grooves of the same depth but different widths on the long side near the small electric dipole patch 502. One groove on the small electric dipole patch 502 corresponds to one of the grooves on the large electric dipole patch 501 and has the same width. Four metal through-holes 601 are provided in the intermediate dielectric substrate 6, connecting the antenna radiating patch 5 to a metal ground plane 7. The metal through-holes 601 are equivalent to magnetic dipoles, and the magnetic dipoles and electric dipoles work together to achieve circular polarization. To achieve electromagnetic coupling, H-shaped slots are etched on the metal ground plane 7, including a first slot 701 and a second slot 702. The aforementioned metal through-hole 601 connects both sides of the H-shaped slot without disrupting the H-shaped slot structure. The H-shaped slot corresponds to the gap between the large electric dipole patch 501 and the small electric dipole patch 502, and the groove on top. The gap between these gaps can be overlapped with the second slot 702 on the projection plane. The second slot 702 overlaps with a groove in the large electric dipole patch 501 on the projection plane. The length and width of the H-shaped slot, and the depth, width, and position of the groove on the electric dipole patch are optimized through simulation to achieve the best possible electromagnetic coupling effect. The T-shaped feed microstrip line 9 is printed on the lower end face of the bottom dielectric substrate 8 and serves as a feed radiator.

[0051] To achieve circularly polarized radiation, the current in the magnetoelectric dipole antenna must be parallel to the equivalent magnetic current. The direction of the current generated by the electric dipole is parallel to the direction of the magnetic current generated by the magnetic dipole equivalently formed by the metal through-hole 601, and the two alternate within a quarter-cycle. Thus, stable circularly polarized radiation can be achieved.

[0052] The resonant decoupling structure of this invention is disposed on the top of the antenna radiating patch to achieve spatial decoupling. When the first antenna element is excited by current I0, and the other antenna element, namely the second antenna element, is a passive element connected to a 50 Ω matched load, the current I2 on the second antenna element consists of two parts: one part is the induced current a directly coupled from the first antenna element to the second antenna element. + I0, the other part is the first antenna element, which will also generate an induced current b in the resonant decoupling structure. + I0, this current is then transmitted to the second antenna unit through coupling, generating an additional induced current c. + b + I0, i.e., I2 = a + I0 + c + b +I0, by adjusting the length and width of the metal supports on the resonant decoupling structure and H0, controls the amplitude and phase of the coupling current, making the two currents on the second antenna element equal in amplitude and opposite in phase. Thus, the coupling current I2 on the second antenna element can cancel each other out, effectively reducing coupling between the millimeter-wave antenna ports. Where a + b + and c + These represent the corresponding coupling coefficients. Based on the above analysis of the decoupling principle, it can be seen that the function of the resonant decoupling structure is to introduce an additional current path with the same amplitude and opposite phase as the current directly coupled to the first antenna element.

[0053] The S-parameters and axial ratio of millimeter-wave circularly polarized antenna arrays with and without loading and resonant decoupling structures were simulated and analyzed using the high-frequency electromagnetic simulation software HFSS. The analysis results are as follows:

[0054] Figure 4 The result shown is when the resonant decoupling structure is not loaded, S 11 The operating frequency band with a < -10 dB limit is 36.3-41.1 GHz, with a relative bandwidth of 12.4%, and the average port mutual coupling between antenna elements is approximately -19 dB. For example... Figure 5 As shown, after loading the resonant decoupling structure, S 11 The operating frequency band of < -10 dB is extended to 36.8-43.11 GHz, the relative bandwidth is increased to 15.8%, the average port mutual coupling between antenna elements is reduced to -27 dB, and the average port isolation is improved by more than 8 dB, with a maximum improvement of 21.6 dB. This is because the resonant decoupling structure introduces an additional resonant path in the target frequency band, improves the input impedance distribution, and suppresses the impedance distortion caused by mutual coupling current, so that the matching bandwidth is not only not damaged, but is effectively extended.

[0055] Figure 6 The axial ratio characteristics without decoupling are shown, with a 3 dB axial ratio bandwidth of 39.1–42.7 GHz and a relative bandwidth of only 8.8%; while Figure 7 After the decoupling structure was applied, the 3 dB axial ratio bandwidth was significantly extended to 36.8–43.2 GHz, with a relative bandwidth increase of 16%. This is because the structure is composed of orthogonal metal dendrites, which can induce mutually orthogonal current components. When these components are superimposed on the antenna radiated current, they improve the amplitude and phase balance, thereby maintaining circular polarization characteristics over a wider frequency band and extending the 3 dB axial ratio bandwidth.

[0056] Figure 8 , Figure 9 and Figure 10The radiation patterns of the millimeter-wave circularly polarized antenna array with the loaded resonant decoupling structure designed in this invention are shown at 37.5 GHz, 40 GHz, and 42.5 GHz. These are compared with the actual radiation patterns. Figure 8 (a) and (b) Figure 9 (a) and (b) in the middle and Figure 10 As shown in (a) and (b), the millimeter-wave circularly polarized antenna array improves the directional radiation capability. Its antenna is a right-hand circularly polarized antenna with good directional radiation characteristics.

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A decoupling structure for a millimeter-wave circularly polarized antenna array, characterized in that, For resonant decoupling of a millimeter-wave circularly polarized antenna array, the decoupling structure is sequentially provided from top to bottom with: an upper decoupling dielectric substrate and a lower decoupling dielectric substrate. An upper metal decoupling structure is provided on the upper end surface of the upper decoupling dielectric substrate, and a lower metal decoupling structure is provided on the upper end surface of the lower decoupling dielectric substrate; The upper metal decoupling structure includes a horizontal main trunk and a plurality of vertical branches. The horizontal main trunk is disposed at the horizontal central position of the upper end surface of the upper decoupling dielectric substrate. The vertical branches are parallelly and equidistantly distributed and perpendicularly disposed on the horizontal main trunk. The number of vertical branches is odd, and the central vertical branch is disposed at the vertical central position of the upper end surface of the upper decoupling dielectric substrate, and the vertical branches are symmetric with respect to the horizontal main trunk; The lower metal decoupling structure includes a plurality of vertical metal branches, wherein the number of vertical metal branches is one less than the number of vertical branches. Each vertical metal branch is disposed at the center position of the interval between adjacent vertical branches and is parallel to the vertical branches; The lengths of the horizontal main trunk, the vertical branches, and the vertical metal branches decrease in sequence.

2. The decoupling structure according to claim 1, wherein the upper decoupling dielectric substrate and the lower decoupling dielectric substrate are directly stacked. The upper decoupling dielectric substrate and the lower decoupling dielectric substrate have the same length, width, and thickness and are made of the same material.

3. The decoupling structure according to claim 2, wherein the upper decoupling dielectric substrate and the lower decoupling dielectric substrate are made of a low-loss dielectric substrate material.

4. The decoupling structure according to claim 1, wherein the number of vertical branches is three, and the vertical branches and the horizontal main trunk form a "Feng" character shape.

5. The decoupling structure according to claim 1, wherein the vertical branches and the horizontal main trunk have the same width.

6. A wireless communication device, characterized in that, Comprising: the decoupling structure according to any one of claims 1-5 above. The millimeter-wave circularly polarized antenna array is spaced at the bottom of the lower decoupling dielectric substrate of the decoupling structure to form a wireless communication device.

7. The wireless communication device according to claim 6, wherein the millimeter-wave circularly polarized antenna array includes a plurality of magnetoelectric dipole antenna units. The magnetoelectric dipole antenna units are sequentially provided from top to bottom with: an antenna radiation patch, an intermediate layer dielectric substrate, a metal floor, a bottom layer dielectric substrate, and a T-shaped feeding microstrip line.

8. The wireless communication device according to claim 7, wherein the antenna radiation patch includes a large electric dipole patch disposed diagonally and a small electric dipole patch disposed diagonally. The large electric dipole patch and the small electric dipole patch are connected to the metal floor through metal vias. An H-shaped slot is provided on the metal floor to achieve electromagnetic coupling.

9. The wireless communication device according to claim 7, wherein the T-shaped feeding microstrip line is printed on the lower end surface of the bottom layer dielectric substrate and serves as a feeding radiator.

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