On-chip optical interconnects and switch chips and their application systems

Abstract

The application discloses an on-chip optical interconnection and exchange chip and an application system thereof. The on-chip optical interconnection and exchange chip is integrated by a power divider, a bidirectional optical transceiver unit and an optical switch unit. The application system of the on-chip optical interconnection and exchange chip comprises a multi-wavelength light source for generating a multi-wavelength optical carrier signal, a transceiver unit control and clock module for bidirectional transceiver unit feedback / amplifier control and clock synchronization, and an optical exchange control module for optical switch unit exchange link switching. The above chips and modules are used for realizing optical interconnection and optical exchange of an application-specific electrical computing chip ASIC. The on-chip optical interconnection and exchange technology can realize bidirectional optical interconnection and exchange of a CPU, a GPU, a DPU and other special computing electrical chips, has high interconnection rate, short exchange switching time, can support an algorithm cluster networking oriented to artificial intelligence application, and has a good application prospect.

Description

On-chip optical interconnect and switching chips and their application systems Technical Field

[0001] This invention relates to the field of high-speed optical interconnects and switching, and more specifically to an on-chip optical interconnect and switching chip and its application system. Background Technology

[0002] The explosive development of Artificial Intelligence (AI) technology, especially the training and inference of various large-scale models, has placed new demands on the networking of computing facilities in computing centers. Traditional computing centers typically interconnect servers and exchange data through optical modules and electrical switching systems. At the switching system end, the signal needs to undergo a process of photoelectric conversion, electrical switching, and electro-optical conversion, which introduces a series of problems. First, the optical modules that perform photoelectric and electro-optical conversion functions have high power consumption. Second, as computing power increases, the electrical switching system and optical modules need to be updated and replaced accordingly, resulting in high costs. To address this, Google is attempting to introduce an all-optical switching system (see [Poutievski L, Mashayekhi O, Ong J, et al. Jupiter evolving: transforming google's datacenter network via optical circuit switches and software-defined networking[C] / / Proceedings of the ACM SIGCOMM 2022 Conference. 2022: 66-85.]). In this system, the optical signals output from the computing server are directly switched via an optical switching system. Compared to electrical switching, this significantly reduces power consumption and latency because it eliminates the need for photoelectric / electro-optical conversion. Furthermore, optical switching is transparent to protocols and supports upgrades to various communication rates. However, this solution still requires optical modules on the computing server side. As the communication rate of optical modules increases, the power consumption and bandwidth of traditional pluggable optical modules will gradually become bottlenecks. One solution is to introduce optoelectronic co-packaging technology (see [Minkenberg C, Krishnaswamy R, Zilkie A, et al. Co‐packaged datacenter optics: Opportunities and challenges[J]. IET optoelectronics,2021, 15(2): 77-91.]), which integrates the optical interface with the application-specific integrated circuit (ASIC) chip through advanced semiconductor packaging technology. This can reduce signal transmission delay and power consumption, and improve the system signal transmission bandwidth and integration. Against this backdrop, this invention draws on advanced optoelectronic co-packaging technology and the high integration characteristics of silicon photonic chips to propose an on-chip optical interconnect and switching chip and its application system. This chip supports high-speed data transmission and switching between ASICs and can be applied to the networking of computing facilities in the future. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing an on-chip optical interconnect and switching chip and its application system. This chip utilizes a single-chip integrated optical interconnect and switching core device to simultaneously achieve high-speed interconnect and switching functions, supporting the interconnection of high-speed computing chips and the networking of computing power.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] This invention provides an on-chip optical interconnect and switching chip, wherein the on-chip optical interconnect and switching chip integrates a power divider L, a power divider R, a bidirectional optical transceiver unit L, a bidirectional optical transceiver unit R, and an optical switch unit; wherein:

[0006] The power divider L and power divider R have a symmetrical architecture, each including one optical input terminal and M optical output terminals; the optical input terminal receives external multi-wavelength optical carrier signals and serves as the optical input terminal of the on-chip optical interconnect and switching chip; the optical output terminal is used to output multi-wavelength optical carrier signals; the optical output terminal of power divider L is connected to M bidirectional optical transceiver units L respectively, and the optical output terminal of power divider R is connected to M bidirectional optical transceiver units R respectively.

[0007] The bidirectional optical transceiver unit L and the bidirectional optical transceiver unit R have a symmetrical architecture, each containing N / 2 pairs of optical transceiver links. Each pair of optical transceiver links includes one micro-ring modulator, one micro-ring detector, one driver amplifier, and one transimpedance amplifier. The driver amplifier and the micro-ring modulator form a transmit link for transmitting modulated signals, and the micro-ring detector and the transimpedance amplifier form a receive link for receiving modulated signals. All micro-ring modulators and micro-ring detectors are connected in series through a main waveguide in a coupled manner. One end of the main waveguide receives multi-wavelength optical carrier signals, and the other end is connected to an optical switch unit.

[0008] The optical switch unit is an M×M port mutually exclusive optical device used to realize the optical signal routing and switching between the M bidirectional optical transceiver units L and the M bidirectional optical transceiver units R.

[0009] Furthermore, the bidirectional optical transceiver unit L corresponds one-to-one with the N / 2 pairs of optical transceiver links in the bidirectional optical transceiver unit R, wherein the resonant wavelengths of the micro-ring modulator of the transmitting link and the micro-ring detector of the receiving link are the same.

[0010] Furthermore, the micro-ring modulator and micro-ring detector in the bidirectional optical transceiver unit L and the bidirectional optical transceiver unit R support wavelength division multiplexing.

[0011] Furthermore, the resonant wavelengths of the micro-ring modulator and the micro-ring detector are controlled by thermal or electrical adjustment to align with multi-wavelength optical carrier signals.

[0012] Furthermore, the optical switch unit achieves path switching through thermo-optical and electro-optical methods.

[0013] Furthermore, the driver amplifier and transimpedance amplifier in the optical transceiver link are monolithically integrated in the on-chip optical interconnect and switching chip, or externally mounted using 2.5D or 3D packaging technology.

[0014] The present invention also provides an application system comprising the above-described on-chip optical interconnect and switching chip, the system further comprising:

[0015] Multi-wavelength light source L and multi-wavelength light source R respectively generate multi-wavelength optical carrier signals containing N / 2 wavelengths, which are input to the power divider L and power divider R of the on-chip optical interconnect and switching chip;

[0016] A dedicated computing chip is connected to the optical transceiver link in the bidirectional optical transceiver unit to generate and receive electrical signals for communication with other dedicated computing chips. The signal generation end is connected to the input end of the driver amplifier of the optical transceiver link, and the signal receiving end is connected to the output end of the transimpedance amplifier of the optical transceiver link.

[0017] The transceiver unit control and clock module is used to control the resonant wavelength of the micro-ring modulator and micro-ring detector in the bidirectional optical transceiver unit, as well as the amplification parameters of the drive amplifier and transimpedance amplifier.

[0018] The optical switching control module is connected to the optical switch unit in the on-chip optical interconnect and switching chip, and is used to generate control signals to control the optical switch unit to realize the routing switching of signals from different bidirectional optical transceiver units.

[0019] Furthermore, the wavelengths of the multi-wavelength optical carrier signals of the multi-wavelength light source L correspond one-to-one with the resonant wavelengths of the micro-ring modulators in the bidirectional optical transceiver unit L; the wavelengths of the multi-wavelength optical carrier signals of the multi-wavelength light source R correspond one-to-one with the resonant wavelengths of the micro-ring modulators in the bidirectional optical transceiver unit R.

[0020] Furthermore, the multi-wavelength light source adopts a modular design and provides multi-wavelength light source signals to the system in an external form.

[0021] Furthermore, the on-chip optical interconnect and switching chip, dedicated computing chip, transceiver unit control and clock module, and optical switching control module are packaged using 2D, 2.5D, or 3D semiconductor packaging processes.

[0022] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0023] (1) The bidirectional optical transceiver unit of the present invention supports bidirectional transmission of transmitted and received optical signals in a single waveguide and is compatible with optical switch unit, thereby supporting point-to-point bidirectional data transmission of the bidirectional optical transceiver unit.

[0024] (2) The present invention integrates the bidirectional optical transceiver unit and the optical switch unit on a single chip using photonic integration technology, which can avoid the polarization sensitivity problem of the received optical signal when the system is separated. Therefore, there is no need for polarization control related optical devices, which simplifies the design of the receiving link of the bidirectional optical transceiver unit and improves the link performance.

[0025] (3) The main functional components of the present invention are integrated on a single chip, the system is compact, and the system complexity can be effectively reduced. Combined with advanced packaging technology, the interconnection and exchange power consumption between dedicated computing chips can be effectively reduced. Attached Figure Description

[0026] Figure 1 is a schematic diagram of the structure of an on-chip optical interconnect and switching chip according to the present invention;

[0027] Figure 2 is a schematic diagram of a specific embodiment of the application system of the present invention that includes an on-chip optical interconnect and switching chip;

[0028] Figure 3 is a schematic diagram of the spectral distribution of multi-wavelength light source L and multi-wavelength light source R in the application system of the present invention, which includes an on-chip optical interconnect and switching chip.

[0029] Figure 4 is a schematic diagram of the bidirectional optical transceiver unit L structure inside an on-chip optical interconnect and switching chip according to the present invention.

[0030] Figure 5 is a schematic diagram of the bidirectional optical transceiver unit R structure inside an on-chip optical interconnect and switching chip according to the present invention. Detailed Implementation

[0031] To address the shortcomings of existing technologies, this invention integrates a bidirectional optical transceiver unit and an optical switch unit onto a single chip, combined with advanced packaging technology, enabling dedicated computing chips to directly achieve high-speed bidirectional data transmission and exchange. The solution features a large signal transmission bandwidth, low power consumption, and fast signal exchange speed, and can be flexibly scaled up according to actual needs.

[0032] The schematic diagram of the on-chip optical interconnect and switching chip structure of the present invention is shown in Figure 1. It is integrated by one power divider L, one power divider R, M bidirectional optical transceiver units L, M bidirectional optical transceiver units R and one optical switch unit. M is a natural number greater than 1. In the schematic diagram, M is selected as 4.

[0033] Wherein: the power divider L and the power divider R have the same and symmetrical design structure. Each power divider includes 1 optical input terminal and M optical output terminals. The optical input terminal is the optical input terminal of the entire on-chip optical interconnect and switching chip, used to receive external multi-wavelength optical carrier signals. The optical output terminals of the power divider L are respectively connected to the optical input terminals of the M bidirectional optical transceiver units L, and the optical output terminals of the power divider R are respectively connected to the optical input terminals of the M bidirectional optical transceiver units R.

[0034] The M bidirectional optical transceiver units L have the same and symmetrical design structure, and the M bidirectional optical transceiver units R also have the same design structure. Each bidirectional optical transceiver unit contains N / 2 pairs of optical transceiver links, where N is an even number greater than or equal to 2. Each pair of optical transceiver links contains one micro-ring modulator, one micro-ring detector, one driver amplifier, and one transimpedance amplifier. The driver amplifier and the micro-ring modulator form a transmit link for transmitting modulated signals, and the micro-ring detector and the transimpedance amplifier form a receive link for receiving modulated signals. All micro-ring modulators and micro-ring detectors are connected in series through a main waveguide in a coupled manner. The main waveguide contains one optical input end and one optical output end, which serve as the optical input end and optical output end of the bidirectional optical transceiver unit, respectively. The optical output ends of the M bidirectional optical transceiver units L are connected to M optical ports on one side of the M×M optical switch unit, and the optical output ends of the M bidirectional optical transceiver units R are connected to M optical ports on the other side of the M×M optical switch unit.

[0035] Preferably, the bidirectional optical transceiver unit L corresponds one-to-one with the N / 2 pairs of optical transceiver links in the bidirectional optical transceiver unit R, wherein the resonant wavelengths of the micro-ring modulator in the transmit link and the micro-ring detector in the receive link are the same. The resonant wavelengths of the micro-ring modulator and the micro-ring detector can be thermally or electrically controlled to align with multi-wavelength optical carrier signals.

[0036] Preferably, the optical switch unit can achieve path switching through thermo-optical, electro-optical, or other methods.

[0037] Preferably, the driver amplifier and transimpedance amplifier and other electrical components in the optical transceiver link can be integrated on a single chip in the on-chip optical interconnect and switching chip, or they can be externally mounted using 2.5D or 3D advanced packaging technology.

[0038] Figure 2 shows a schematic diagram of a specific embodiment of the application system of the present invention, which includes an on-chip optical interconnect and switching chip. The system includes: a multi-wavelength light source L, a multi-wavelength light source R, a dedicated computing chip ASIC, a transceiver unit control and clock module, an optical switching control module, and an on-chip optical interconnect and switching chip.

[0039] First, a multi-wavelength light source L generates a multi-wavelength optical carrier signal containing N / 2 wavelengths and sends it to the optical input terminal of the optical power divider L in the on-chip optical interconnect and switching chip. The power divider L splits the signal into M sub-multi-wavelength optical carrier signals, where M is selected as 4 in the schematic diagram. These M sub-multi-wavelength optical carrier signals are then sent to M bidirectional optical transceiver units L. Simultaneously, a multi-wavelength light source R generates a multi-wavelength optical carrier signal containing N / 2 wavelengths and sends it to the optical input terminal of the optical power divider R in the on-chip optical interconnect and switching chip. The power divider R splits the signal into M sub-multi-wavelength optical carrier signals, which are then sent to M bidirectional optical transceiver units R. A dedicated computing chip and bidirectional optical transceiver... The optical transceiver link in the unit generates and receives electrical signals for communication with other dedicated computing chips. The signal generation end is connected to the input of the driver amplifier of the optical transceiver link, and the signal receiving end is connected to the output of the transimpedance amplifier of the optical transceiver link. The transceiver unit control and clock module controls the resonant wavelength of the micro-ring modulator and micro-ring detector in the bidirectional optical transceiver unit, as well as the amplification parameters of the driver amplifier and transimpedance amplifier. The optical switching control module is connected to the optical switch unit in the on-chip optical interconnect and switching chip, generates control signals, and controls the optical switch unit to realize the routing switching of signals from different bidirectional optical transceiver units, thereby realizing high-speed interconnection and exchange of data from different dedicated computing chips.

[0040] It should be noted that the wavelengths of the multi-wavelength optical carrier signals of the multi-wavelength light source L correspond one-to-one with the resonant wavelengths of the micro-ring modulators in the bidirectional optical transceiver unit L, and the wavelengths of the multi-wavelength optical carrier signals of the multi-wavelength light source R correspond one-to-one with the resonant wavelengths of the micro-ring modulators in the bidirectional optical transceiver unit R; the multi-wavelength light sources provide multi-wavelength light source signals to the system in a modular form through external means; the on-chip optical interconnect and switching chip, dedicated computing chip, transceiver unit control and clock module, and optical switching control module can be packaged using advanced semiconductor packaging processes such as 2D, 2.5D, and 3D.

[0041] To facilitate public understanding, the technical solution of the present invention will be further described in detail below through a specific embodiment (M=4 in the specific embodiment):

[0042] First, the multi-wavelength lasers L and R, acting as multi-wavelength light sources, each output N / 2 multi-wavelength optical carrier signals with equal wavelength intensities. The optical carrier wavelengths output by the multi-wavelength light source L are λ2, λ4, ..., λ... N The optical carrier wavelengths output by the multi-wavelength light source R (and the multi-wavelength light source L are λ1, λ3, ..., λ) are respectively λ1, λ3, ..., λ4. N-1The spectral distribution of the output multi-wavelength optical carrier signal is shown in Figure 3. The multi-wavelength optical carrier signal is fed into the optical input terminals of the on-chip optical interconnect and switching chip, namely the optical input terminals of power dividers L and R. Power divider L divides the multi-wavelength optical carrier signal output from the multi-wavelength light source L into four sub-multi-wavelength optical carrier signals of equal power, and sends them to four bidirectional optical transceiver units L respectively. Simultaneously, power divider R divides the multi-wavelength optical carrier signal output from the multi-wavelength light source R into four sub-multi-wavelength optical carrier signals of equal power, and sends them to four bidirectional optical transceiver units R respectively. Each dedicated computing power chip (ASIC1, ASIC2, ASIC3, ASIC4) contains N / 2 pairs of electrical transceiver links, which are connected to the electrical interfaces of the four bidirectional optical transceiver units L respectively. The structural diagram of the bidirectional optical transceiver unit L is shown in Figure 4. Each bidirectional optical transceiver unit L contains N / 2 pairs of optical transceiver links, which are connected one-to-one with the electrical transceiver links of the corresponding dedicated computing power chip. The transmit electrical signal output from the dedicated computing chip is sent to the corresponding optical transceiver link to drive the amplifier and micro-ring modulator to form the transmit link, thus obtaining the transmit modulated optical signal. N / 2 transmit links correspond to N / 2 transmit modulated optical signals. All micro-ring modulators are connected in series through the main waveguide in a coupled manner to obtain multi-wavelength modulated optical signals (corresponding wavelengths λ2, λ4, ..., λ). N A total of four multi-wavelength modulated optical signals are obtained. The output of the main waveguide of the bidirectional optical transceiver unit L is connected to the port on one side of the optical switching unit. At the same time, the N / 2 pairs of electrical transceiver links of the dedicated computing power chips (ASIC5, ASIC6, ASIC7, ASIC8) are connected to the electrical interfaces of the four bidirectional optical transceiver units R. The structural schematic diagram of the bidirectional optical transceiver unit R is shown in Figure 5. Similarly, each bidirectional optical transceiver unit R contains N / 2 pairs of optical transceiver links, which are connected to the electrical transceiver links of the corresponding dedicated computing power chips. The transmit electrical signal output by the dedicated computing power chip is sent to the corresponding optical transceiver link to drive the amplifier and the micro-ring modulator to form the transmit link, thereby obtaining the transmit modulated optical signal. N / 2 electrical transmit links correspond to N / 2 transmit modulated optical signals. All micro-ring modulators are connected in series through the main waveguide in a coupled manner to obtain multi-wavelength modulated optical signals (corresponding wavelengths are λ1, λ3, ..., λ). N-1A total of four multi-wavelength modulated optical signals are obtained. The output terminals of the main waveguide of the bidirectional optical transceiver unit R are connected one by one to the ports on the other side of the optical switching unit. During this process, the transceiver unit control and clock module controls the resonant wavelength of the micro-ring modulator to correspond one-to-one with the multi-wavelength optical carrier, thereby stabilizing the output of the transmitted modulated optical signals. The optical switching control module is connected to the optical switch unit in the on-chip optical interconnect and switching chip, and generates control signals to control the 4×4 optical switch unit to establish a path between the four bidirectional optical transceiver units L and the four bidirectional optical transceiver units R, and the path can be switched. When the bidirectional optical transceiver unit L and the bidirectional optical transceiver unit R establish a path, the bidirectional optical transceiver unit L receives N / 2 transmitted modulated optical signals emitted by the bidirectional optical transceiver unit R, and the N / 2 transmitted modulated optical signals emitted by the bidirectional optical transceiver unit R become received modulated optical signals after entering the bidirectional optical transceiver unit L. The received modulated optical signal enters the main waveguide. In the N / 2 optical transceiver links of the bidirectional optical transceiver unit L, the micro-ring detector and transimpedance amplifier in the optical receiving link receive the received modulated optical signal of the corresponding wavelength, obtaining a received electrical signal. This receiving link is simultaneously connected to the receiving end of the dedicated computing chip. Simultaneously, the bidirectional optical transceiver unit R receives N / 2 transmitted modulated optical signals emitted by the bidirectional optical transceiver unit L. In the N / 2 optical transceiver links of the bidirectional optical transceiver unit R, the micro-ring detector and transimpedance amplifier in the optical receiving link receive the received modulated optical signal of the corresponding wavelength, obtaining a received electrical signal. This receiving link is also simultaneously connected to the receiving end of the dedicated computing chip. The dedicated computing chip optical interconnects and switching established by other optical switching units are performed using the same signal transmission logic.

[0043] Finally, it should be noted that the above examples are merely specific embodiments of the present invention. The present invention is not limited to the above embodiments and can have many variations. All variations that can be directly derived or conceived by those skilled in the art from the disclosure of the present invention should be considered within the scope of protection of the present invention.

Claims

1. An on-chip optical interconnect and switching chip, characterized in that, The on-chip optical interconnect and switching chip integrates a power divider L, a power divider R, a bidirectional optical transceiver unit L, a bidirectional optical transceiver unit R, and an optical switch unit. Specifically: the power divider L and power divider R have a symmetrical architecture, each including one optical input terminal and M optical output terminals; the optical input terminal receives external multi-wavelength optical carrier signals and serves as the optical input terminal of the on-chip optical interconnect and switching chip; the optical output terminal outputs multi-wavelength optical carrier signals; the optical output terminals of the power divider L are respectively connected to M bidirectional optical transceiver units L, and the optical output terminals of the power divider R are respectively connected to M bidirectional optical transceiver units R; the bidirectional optical transceiver units L and R have a symmetrical architecture, each including N / 2 pairs of... An optical transceiver link is defined as follows: N is an even number greater than or equal to 2. Each pair of optical transceiver links includes one micro-ring modulator, one micro-ring detector, one driver amplifier, and one transimpedance amplifier. The driver amplifier and the micro-ring modulator form a transmit link for transmitting modulated signals, and the micro-ring detector and the transimpedance amplifier form a receive link for receiving modulated signals. All micro-ring modulators and micro-ring detectors are connected in series through a main waveguide in a coupled manner. One end of the main waveguide receives multi-wavelength optical carrier signals, and the other end is connected to an optical switching unit. The optical switching unit is an M×M port mutually exclusive optical device used to realize the optical signal routing and switching between the M bidirectional optical transceiver units L and the M bidirectional optical transceiver units R.

2. The on-chip optical interconnect and switching chip according to claim 1, characterized in that, The bidirectional optical transceiver unit L corresponds one-to-one with the N / 2 pairs of optical transceiver links in the bidirectional optical transceiver unit R. The micro-ring modulator of the transmit link of the bidirectional optical transceiver unit L has the same resonant wavelength as the micro-ring detector of the receive link of the bidirectional optical transceiver unit R, and the micro-ring modulator of the transmit link of the bidirectional optical transceiver unit R has the same resonant wavelength as the micro-ring detector of the receive link of the bidirectional optical transceiver unit L.

3. The on-chip optical interconnect and switching chip according to claim 1, characterized in that, The micro-ring modulator and micro-ring detector in the bidirectional optical transceiver unit L and the bidirectional optical transceiver unit R support wavelength division multiplexing.

4. The on-chip optical interconnect and switching chip according to claim 1, characterized in that, The resonant wavelengths of the micro-ring modulator and the micro-ring detector are controlled by feedback through thermal or electrical modulation to align with multi-wavelength optical carrier signals.

5. The on-chip optical interconnect and switching chip according to claim 1, characterized in that, The optical switch unit achieves path switching through thermo-optical and electro-optical methods.

6. The on-chip optical interconnect and switching chip according to claim 1, characterized in that, The driver amplifier and transimpedance amplifier in the optical transceiver link are either monolithically integrated in the on-chip optical interconnect and switching chip, or externally mounted using 2.5D or 3D packaging technology.

7. An application system comprising the on-chip optical interconnect and switching chip according to any one of claims 1-6, characterized in that, The system further includes: a multi-wavelength light source L and a multi-wavelength light source R, which respectively generate multi-wavelength optical carrier signals containing N / 2 wavelengths, and input them to the power divider L and power divider R of the on-chip optical interconnect and switching chip; a dedicated computing chip, connected to the optical transceiver link in the bidirectional optical transceiver unit, which generates and receives electrical signals for communication with other dedicated computing chips, wherein the signal generation end is connected to the input end of the driver amplifier of the optical transceiver link, and the signal receiving end is connected to the output end of the transimpedance amplifier of the optical transceiver link; a transceiver unit control and clock module, used to control the resonant wavelength of the micro-ring modulator and micro-ring detector in the bidirectional optical transceiver unit, as well as the amplification parameters of the driver amplifier and the transimpedance amplifier; and an optical switching control module, connected to the optical switch unit in the on-chip optical interconnect and switching chip, used to generate control signals to control the optical switch unit to realize the routing switching of signals from different bidirectional optical transceiver units.

8. The application system of the on-chip optical interconnect and switching chip according to claim 7, characterized in that, The wavelengths of the multi-wavelength optical carrier signals of the multi-wavelength light source L correspond one-to-one with the resonant wavelengths of the micro-ring modulators in the bidirectional optical transceiver unit L; the wavelengths of the multi-wavelength optical carrier signals of the multi-wavelength light source R correspond one-to-one with the resonant wavelengths of the micro-ring modulators in the bidirectional optical transceiver unit R.

9. The application system of the on-chip optical interconnect and switching chip according to claim 7, characterized in that, The multi-wavelength light source adopts a modular design and provides multi-wavelength light source signals to the system in an external form.

10. The application system of the on-chip optical interconnect and switching chip according to claim 7, characterized in that, The on-chip optical interconnect and switching chip, dedicated computing chip, transceiver unit control and clock module, and optical switching control module are packaged using 2D, 2.5D, or 3D semiconductor packaging processes.

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