Preparation method of nuclear-free packaging substrate capable of resisting liquid medicine permeation and structure of board to be disassembled

Abstract

The invention provides a preparation method of a nuclear-free packaging substrate resistant to liquid medicine permeation and a to-be-disassembled plate structure, and the method comprises the steps: carrying out the laser drilling after pressing, arranging a first edge sealing hole, enabling the first edge sealing hole to penetrate through the edge of a bearing plate, and enabling a micropore array to surround the edge of a positioning through hole to be distributed in a staggered manner; after the substrate is arranged, second edge sealing holes are formed through laser drilling and penetrate through the edge of the to-be-disassembled plate structure, and micropore arrays are distributed around the edge of a positioning through hole in a staggered mode; and disassembling the plate to obtain two base plates. Edge sealing holes are formed through laser drilling, so that the sealing performance of the inner layer of the substrate is prevented from being affected, and the interlayer binding force of a product is increased; meanwhile, the edges of the positioning through holes of the packaging substrate are provided with double-sided staggered micropore arrays, so that the interlayer binding force of the substrate is improved, liquid medicine is prevented from entering the positioning through holes, and the process stability and the product yield are improved; in addition, the micropore depth of the micropore array is set, so that the substrate is prevented from being damaged during plate disassembly, and the subsequent plate disassembly effect is optimized; and finally, setting the aperture of the micropores, the distance between the micropores and the distance between the micropores and the positioning through holes, so that the substrate product yield is ensured while the liquid medicine is prevented from entering the positioning through holes.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor integrated circuit manufacturing, and particularly relates to a preparation method of a coreless packaging substrate resistant to drug water penetration and a to-be-disassembled board structure. BACKGROUND

[0002] With the continuous development of high-density, multi-layer and multi-functional circuit board technology, coreless packaging substrates have gradually become an important trend in the circuit board industry. Such products are known for their light and thin structure, high dimensional accuracy and flexible manufacturing capability, and are widely used in smart devices, communication equipment and high-end electronic product fields. They not only provide more compact design space for modern technology products, but also bring unprecedented design freedom to manufacturers, making products more portable and more powerful.

[0003] However, in the actual production of coreless packaging substrates, due to their unique interlayer structure, the board needs to be disassembled into two parts. The poor sealing of the new interface generated by disassembly and the overall poor sealing ability of the coreless substrate itself due to the lack of support make the interlayer sealing more difficult. This leads to frequent problems such as interlayer cracking and drug water penetrating into the inner layer through product positioning through holes, which in turn causes product scrap. This problem has become a key factor affecting product quality and yield. Whenever these problems occur, not only does it mean an increase in production costs, but it can also cause delivery delays, resulting in both reputational and economic losses for the enterprise, and seriously hindering the progress of Chinese enterprises in the current international competitive semiconductor field.

[0004] Therefore, there is an urgent need for a more efficient, reliable and operable drug water packaging technology and process method for coreless packaging substrates.

[0005] It should be noted that the above introduction to the technical background is only to facilitate a clear and complete description of the technical solutions of the present application, and to facilitate the understanding of those skilled in the art. The above technical solutions cannot be considered as known to those skilled in the art merely because they are described in the background section of the present application. SUMMARY

[0006] In view of the above shortcomings of the prior art, the present application aims to provide a preparation method of a coreless packaging substrate resistant to drug water penetration and a to-be-disassembled board structure, to solve the problem of interlayer cracking of the coreless packaging substrate and drug water penetrating into the inner layer through the product positioning through hole in the prior art.

[0007] To achieve the above-mentioned purpose, the present application provides a preparation method of a coreless packaging substrate resistant to drug water penetration, which comprises:

[0008] A carrier plate is provided, which includes a core layer and a core conductive layer, two core conductive layers respectively covering the opposite first surface and second surface of the core layer;

[0009] An initial conductive layer is arranged on the surface of the two core conductive layers respectively, and a pressing process is performed on the obtained structure; a first edge sealing hole is arranged by laser drilling process, the projection of the first edge sealing hole on the carrier plate is uniformly distributed along the edge of the carrier plate, and each first edge sealing hole penetrates the carrier plate and the two initial conductive layers;

[0010] A first micropore array is arranged on the surface of the initial conductive layer close to the first surface, the projection of the first micropore array on the carrier plate surrounds the edge of the carrier plate for setting the pre-set position of the positioning through hole; a second micropore array is arranged on the surface of the initial conductive layer close to the second surface, the projection of the second micropore array on the carrier plate surrounds the edge of the carrier plate for setting the pre-set position of the positioning through hole; the micropores of the first micropore array and the second micropore array are distributed in a staggered manner on the carrier plate; copper plating is performed in the micropores of the first micropore array and the second micropore array;

[0011] A substrate layer is arranged on the surface of the two initial conductive layers respectively, the substrate layer includes a semi-solidified layer and a substrate conductive layer, two semi-solidified layers respectively cover the surface of the two initial conductive layers, and two substrate conductive layers respectively cover the surface of the two semi-solidified layers, thereby obtaining a to-be-disassembled plate structure;

[0012] A pressing process is performed on the obtained to-be-disassembled plate structure; a second edge sealing hole is arranged by laser drilling process, the second edge sealing hole is uniformly distributed on the edge of the to-be-disassembled plate structure, each second edge sealing hole penetrates the to-be-disassembled plate structure, and the second edge sealing hole is distributed in a staggered manner with the first edge sealing hole;

[0013] A third micropore array is arranged on one side of the to-be-disassembled plate structure close to the first surface, the projection of the third micropore array on the carrier plate surrounds the edge of the carrier plate for setting the pre-set position of the positioning through hole; a fourth micropore array is arranged on one side of the to-be-disassembled plate structure close to the second surface, the projection of the fourth micropore array on the carrier plate surrounds the edge of the carrier plate for setting the pre-set position of the positioning through hole; the micropores of the first micropore array, the second micropore array, the third micropore array and the fourth micropore array are distributed in a staggered manner on the first surface; copper plating is performed in the micropores of the third micropore array and the fourth micropore array;

[0014] The to-be-disassembled plate structure is disassembled along the interface between the core conductive layer and the initial conductive layer, thereby obtaining two packaging substrates.

[0015] Optionally, the micropores of the first micropore array and the third micropore array extend to the first surface of the core layer, and the micropores of the second micropore array and the fourth micropore array extend to the second surface of the core layer.

[0016] Optionally, a circle with the center of the position of the positioning through hole as the center and passing through the center of each micropore of the first micropore array is a first circle, a circle with the center of the position of the positioning through hole as the center and passing through the center of each micropore of the second micropore array is a second circle, a circle with the center of the position of the positioning through hole as the center and passing through the center of each micropore of the third micropore array is a third circle, and a circle with the center of the position of the positioning through hole as the center and passing through the center of each micropore of the fourth micropore array is a fourth circle; the radius of the first circle is the same as the radius of the second circle, the radius of the third circle is the same as the radius of the fourth circle, and the radius of the first circle is smaller than the radius of the third circle; the projection of each two adjacent micropores of the first micropore array on the first surface is distributed with the projection of one micropore of the second micropore array on the first surface, and the projection of each two adjacent micropores of the third micropore array on the first surface is distributed with the projection of one micropore of the fourth micropore array on the first surface.

[0017] Optionally, the first micropore array, the second micropore array, the third micropore array and the fourth micropore array are micropore arrays, and the first circle, the second circle, the third circle and the fourth circle are circles; the arc length formed by the two points at which each micropore of each micropore array intersects the corresponding circle of the micropore array on the circle is the micropore diameter of the micropore array, and the arc length formed by the two points at which the two adjacent micropores of the micropore array intersect the circle at the closest distance is the micropore spacing of the micropore array; the micropore spacing of each micropore array is 1-6 times the micropore diameter of the corresponding micropore array.

[0018] Optionally, the micropore diameter of each micropore array is 50 microns-600 microns.

[0019] Optionally, the minimum distance between each micropore of each micropore array and the center of the position of the positioning through hole is 100 microns-2000 microns.

[0020] Optionally, the preparation method further comprises:

[0021] After copper plating is performed in the micropores of the third micropore array and the fourth micropore array, 2n additional substrate layers are again arranged, n is an integer greater than or equal to 1; each additional substrate layer comprises a semi-cured layer and a substrate conductive layer, and the semi-cured layers of every two additional substrate layers are respectively located on the two surfaces of the to-be-removed substrate structure obtained before the additional substrate layer is arranged, and the substrate conductive layer is located on the surface of the semi-cured layer of the additional substrate layer.

[0022] After setting 2 layers of the additional substrate layer, a pressing process is performed on the obtained structure; then an additional micropore array is arranged on the side of the obtained to-be-disassembled structure close to the first surface and the side close to the second surface, a projection of the additional micropore array on the carrier plate surrounds the edge of the carrier plate for setting the preset position of the positioning through hole; the projections of the additional micropore array, the first micropore array, the second micropore array, the third micropore array and the fourth micropore array on the first surface are distributed in a staggered manner; copper plating is performed in the micropores of the additional micropore array.

[0023] After 2n layers of the additional substrate layer are arranged, the to-be-disassembled structure is disassembled along the interface between the core conductive layer and the initial conductive layer, and two packaging substrates are obtained.

[0024] The application further provides a to-be-disassembled structure obtained by using any one of the packaging substrate preparation methods.

[0025] The carrier plate comprises a core layer and a core conductive layer, and the two core conductive layers are arranged on the opposite first surface and second surface of the core layer, respectively.

[0026] Two initial conductive layers, one layer of the initial conductive layer is arranged on the surface of each core conductive layer.

[0027] Two substrate layers, each substrate layer comprises a prepreg layer and a substrate conductive layer, the two prepreg layers are arranged on the surfaces of the two initial conductive layers, respectively, and the two substrate conductive layers are arranged on the surfaces of the two prepreg layers, respectively.

[0028] A first edge hole, the first edge hole penetrates the carrier plate, and the projection of the first edge hole on the carrier plate is uniformly distributed on the edge of the carrier plate.

[0029] A second edge hole, the second edge hole penetrates the to-be-disassembled structure, and the projection of the second edge hole on the carrier plate is uniformly distributed on the edge of the carrier plate, and the second edge hole is distributed in a staggered manner with the first edge hole.

[0030] The micro-hole array includes a first micro-hole array, a second micro-hole array, a third micro-hole array and a fourth micro-hole array, the first micro-hole array and the third micro-hole array are located on one side of the to-be-disassembled panel structure close to the first surface, the second micro-hole array and the fourth micro-hole array are located on one side of the to-be-disassembled panel structure close to the second surface, the first micro-hole array and the second micro-hole array extend to the carrier plate from the surface of the initial conductive layer away from the carrier plate, the third micro-hole array and the fourth micro-hole array extend to the carrier plate from the surface of the substrate layer away from the carrier plate, and the projection of each micro-hole array on the carrier plate surrounds the preset position of the edge of the positioning through hole of the carrier plate; the projection of the micro-hole of the micro-hole array on the first surface is distributed in a staggered manner, and the micro-hole is filled with a copper plating layer.

[0031] Optionally, the to-be-disassembled panel structure further includes 2n additional substrate layers, n is an integer greater than or equal to 1; each additional substrate layer includes a semi-cured layer and a substrate conductive layer, and each additional substrate layer is uniformly distributed on the surface of two substrate layers close to the first surface and close to the second surface in sequence, and the substrate conductive layer in each additional substrate layer is located on the side of the semi-cured layer of the additional substrate layer away from the carrier plate.

[0032] The micro-hole array further includes an additional micro-hole array, each additional substrate layer has an additional micro-hole array extending to the carrier plate from the surface of the additional substrate layer away from the carrier plate, and the projection of the additional micro-hole array on the carrier plate surrounds the preset position of the edge of the positioning through hole of the carrier plate; the projection of the micro-hole of each additional micro-hole array and the first micro-hole array, the second micro-hole array, the third micro-hole array and the fourth micro-hole array on the first surface is distributed in a staggered manner; and the micro-hole of the additional micro-hole array is filled with a copper plating layer.

[0033] As described above, the anti-drug water infiltration coreless packaging substrate preparation method and the to-be-disassembled panel structure have the following beneficial effects:

[0034] The present application sets the edge sealing hole by laser drilling, avoids the influence of low-speed drilling of a drill bit on the sealing performance of the inner layer of the substrate, and makes the micro-hole position concave by laser, thereby increasing the interlayer bonding force of the product;

[0035] The present application sets the double-sided staggered closed micro-hole array on the edge of the positioning through hole of the packaging substrate, further improves the interlayer bonding force of the substrate, thereby reducing the risk of drug water entering the positioning through hole in other process technologies, improving the process stability and product yield;

[0036] The present application sets the depth of the micro-hole of the micro-hole array, avoids the positioning through hole from entering the drug water, avoids the excessive bonding force between the carrier plate and the substrate layer from causing damage to the substrate when the panel is disassembled, and optimizes the subsequent disassembly effect.

[0037] This invention, by setting the micro-hole diameter, micro-hole spacing, and the distance between the micro-hole and the positioning through-hole, ensures that the micro-holes are identifiable, prevents the positioning through-hole from entering the chemical solution, and at the same time guarantees the product yield of the substrate and reduces the impact on the quality of the substrate itself. Attached Figure Description

[0038] Figure 1 The diagram shown is a side view of the structure of the carrier plate provided in step 1 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention.

[0039] Figure 2 The diagram shown is a side view of the structure presented in step 2 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention, which involves setting the first sealing hole.

[0040] Figure 3 The diagram shown is a side view of the structure presented in step 3 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention, which involves setting the first micropore array.

[0041] Figure 4 The diagram shown is a side view of the structure after copper plating in step 3 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention.

[0042] Figure 5 The diagram shown is a side view of the structure of the substrate layer in step 4 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention.

[0043] Figure 6 The diagram shown is a side view of the structure presented in step 5 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention, which involves setting a second sealing hole.

[0044] Figure 7 The diagram shown is a side view of the structure presented in step 6 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention, which involves setting a micropore array.

[0045] Figure 8 The diagram shown is a side view of the structure after copper plating in step 6 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention.

[0046] Figure 9 The diagram shown is a top view of the distribution of the micropore array in step 6 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention.

[0047] Figure 10 The diagram shown is a bottom view of the distribution of the micropore array in step 6 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention.

[0048] Figure 11The image shown is a top-view perspective view of the micropore array presented in step 6 of the method for preparing a coreless encapsulation substrate resistant to drug penetration according to the present invention.

[0049] Explanation of icon numbers

[0050] 10. Support plate; 11. Core layer; 12. Core conductive layer; 13. Initial conductive layer;

[0051] 20. Substrate layer; 21. Prepreg layer; 22. Substrate conductive layer;

[0052] 31. First sealing hole; 32. Second sealing hole;

[0053] 40. Positioning via; 41. First microvia array; 42. Second microvia array; 43. Third microvia array; 44. Fourth microvia array; 45. Residual copper; 46. Copper plating layer;

[0054] 51. First circle; 52. Second circle; 53. Third circle; 54. Fourth circle. Detailed Implementation

[0055] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0056] In the detailed description of embodiments of the present invention, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0057] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0058] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0059] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex. The quantity range given in the present invention includes the two boundary values ​​of the quantity range by default unless otherwise specified.

[0060] With the continuous advancement of high-density, multilayer, and multifunctional circuit board technologies, coreless packaging substrates have gradually become an important trend in the circuit board industry. These products are highly regarded for their thin and light structure, high dimensional accuracy, and flexible manufacturing capabilities, providing modern technological products with more compact design space and greater design freedom, resulting in lighter and more powerful products. However, in the actual production of coreless packaging substrates, due to their unique interlayer structure, the board needs to be split in two. The resulting new interface has poor sealing, and the lack of support in the coreless substrate itself also leads to poor overall sealing ability, significantly increasing the difficulty of interlayer sealing. This results in frequent interlayer cracking and chemical seepage into the inner layers through product positioning vias, leading to product scrap and seriously affecting key factors of product quality and yield.

[0061] To address the above problems, this invention provides a method for preparing a coreless encapsulation substrate resistant to chemical penetration, the method comprising:

[0062] Step 1: Provide a carrier plate, the carrier plate including a core layer and a core conductive layer, the two core conductive layers respectively covering the first and second surfaces opposite to the core layer;

[0063] Step 2: Deposit an initial conductive layer on the surface of each of the two core conductive layers, and perform a pressing process on the resulting structure; use a laser drilling process to set the first sealing holes, the projection of the first sealing holes on the carrier plate is evenly distributed along the edge of the carrier plate, and each first sealing hole penetrates the carrier plate and the two initial conductive layers;

[0064] Step 3: A first microvia array is formed on the surface of the initial conductive layer near the first surface, and the projection of the first microvia array on the carrier plate surrounds the preset position of the edge of the carrier plate used to set the positioning through hole; a second microvia array is formed on the surface of the initial conductive layer near the second surface, and the projection of the second microvia array on the carrier plate surrounds the preset position of the edge of the carrier plate used to set the positioning through hole; the projections of the microvias of the first microvia array and the second microvia array on the carrier plate are staggered; copper plating is performed in the microvias of the first microvia array and the second microvia array;

[0065] Step 4: Deposit a substrate layer on the surface of each of the two initial conductive layers. The substrate layer includes a semi-cured layer and a substrate conductive layer. The two semi-cured layers cover the surface of the two initial conductive layers respectively, and the two substrate conductive layers cover the surface of the two semi-cured layers respectively, to obtain the board structure to be disassembled.

[0066] Step 5: Perform a pressing process on the obtained plate structure to be disassembled; use laser drilling to set second edge sealing holes, the second edge sealing holes are evenly distributed on the edge of the plate structure to be disassembled, each second edge sealing hole penetrates the plate structure to be disassembled, and the second edge sealing holes are staggered with the first edge sealing holes;

[0067] Step 6: A third microvia array is disposed on the side of the structure to be disassembled near the first surface. The projection of the third microvia array onto the support plate surrounds the edge of the support plate used to set the positioning through holes at a preset position. A fourth microvia array is disposed on the side of the structure to be disassembled near the second surface. The projection of the fourth microvia array onto the support plate surrounds the edge of the support plate used to set the positioning through holes at a preset position. The projections of the microvias of the first, second, third, and fourth microvia arrays onto the first surface are all staggered. Copper plating is performed inside the microvias of the third and fourth microvia arrays.

[0068] Step 7: Disassemble the obtained board structure along the interface between the core conductive layer and the initial conductive layer to obtain two encapsulation substrates.

[0069] The following will describe in detail, with reference to the accompanying drawings, the method for preparing the coreless encapsulation substrate resistant to drug penetration according to the present invention. It should be noted that the above order does not strictly represent the order of the preparation method protected by the present invention, and those skilled in the art can make changes according to the actual process steps.

[0070] First, proceed with step 1, as follows: Figure 1As shown, material is fed in, and a support plate 10 is provided. The support plate 10 includes a core layer 11 and a core conductive layer 12. The two core conductive layers 12 cover the first and second surfaces opposite to the core layer 11, respectively.

[0071] Preferably, the core layer 11 is made of one or more of epoxy resin, polyphenylene ether, or epoxy blends, which has the advantages of heat resistance, chemical corrosion resistance, easy processing, and low cost; the core conductive layer 12 is a copper foil layer.

[0072] In one embodiment, an adhesive layer is provided between the core conductive layer 12 and the core layer 11.

[0073] Then, proceed to step 2, as follows: Figure 1 As shown, an initial conductive layer 13 is respectively deposited on the surface of the two core conductive layers 12, and the resulting structure is subjected to a lamination process; as Figure 2 As shown, the first sealing hole 31 is set by laser drilling process. The projection of the first sealing hole 31 on the carrier plate 10 is evenly distributed along the edge of the carrier plate 10. Each first sealing hole 31 penetrates the carrier plate 10 and the two layers of the initial conductive layer 13.

[0074] This invention enhances the sealing effect of the plate edge by first setting through sealing holes in the bearing plate 10, effectively preventing the risk of plate edge cracking and chemical ingress.

[0075] In one embodiment, the initial conductive layer 13 is a copper foil layer.

[0076] Next, proceed to step 3, as follows: Figure 3 As shown, a first micropore array 41 is formed on the surface of the initial conductive layer 13 near the first surface. The projection of the first micropore array 41 onto the support plate 10 surrounds the support plate 10 at a preset position for setting the edge of the positioning through hole 40. A second micropore array 42 is formed on the surface of the initial conductive layer 13 near the second surface. The projection of the second micropore array 42 onto the support plate 10 surrounds the support plate 10 at a preset position for setting the edge of the positioning through hole 40. The projections of the micropores of the first micropore array 41 and the second micropore array 42 onto the support plate 10 are staggered. Figure 4 As shown, copper plating is performed within the micropores of the first micropore array 41 and the second micropore array 42 to obtain a copper plating layer 46. Specifically, Figures 3-4 To highlight the position of the micropore array, only the micropore array is shown; the first sealing hole 31 is not shown.

[0077] By setting the first micropore array 41 and the second micropore array 42 on the top and bottom surfaces of the support plate 10 respectively, the present invention can effectively prevent the medicine from seeping into the positioning through hole 40.

[0078] Then, proceed to step 4, as follows: Figure 5 As shown, a substrate layer 20 is respectively disposed on the surface of the two initial conductive layers 13. The substrate layer 20 includes a semi-cured layer 21 and a substrate conductive layer 22. The two semi-cured layers 21 respectively cover the surface of the two initial conductive layers 13, and the two substrate conductive layers 22 respectively cover the surface of the two semi-cured layers 21, thus obtaining the board structure to be disassembled.

[0079] Specifically, the substrate layer 20 serves as the packaging substrate after disassembly.

[0080] Preferably, the material of the semi-cured layer 21 is one or more of epoxy resin, polyphenylene ether, or epoxy blend, which has the advantages of heat resistance, chemical corrosion resistance, easy processing, and low cost; the substrate conductive layer 22 of the substrate layer 20 is a copper foil layer.

[0081] Next, proceed to step 5, as follows: Figure 6 As shown, the obtained panel structure to be disassembled undergoes a pressing process; a second edge-sealing hole 32 is set using a laser drilling process. The second edge-sealing holes 32 are evenly distributed along the edge of the panel structure to be disassembled, and each second edge-sealing hole 32 penetrates the panel structure to be disassembled. The second edge-sealing holes 32 are staggered from the first edge-sealing holes 31. Specifically, Figure 6 To highlight the location of the sealing holes, only the first sealing hole 31 and the second sealing hole 32 are shown; the micropore array is not shown.

[0082] This invention enhances the overall edge sealing effect and reduces the risk of edge cracking and chemical injection by setting a first through-hole 31 in the carrier plate 10, followed by setting a semi-cured layer 21 and a substrate conductive layer 22 to form a substrate layer 20, and then performing a pressing process to form a second through-hole 32 in the structure to be disassembled. The pressing process before each setting of the edge sealing hole and copper plating of the micro-hole array makes the pressed structure a whole, which can improve the alignment of the holes in the subsequent setting. Moreover, the pressing process can fully fill and cure the resin under high temperature and high pressure, minimize the warpage of the board surface, and squeeze out interlayer bubbles and gaps to prevent voids in the subsequent conductive layers, forming a chemical and mechanical combination of the overall structure, which greatly improves the interlayer bonding force and structural reliability. At the same time, laser drilling is used instead of mechanical drilling. The copper foil and PP of the carrier plate 10 are melted by a high-energy laser beam. Compared with the cutting force and vibration of the drill bit, the problem of interlayer bonding force is solved, and material deformation and interlayer cracks are effectively avoided.

[0083] In one embodiment, a green laser is used to perform laser drilling to obtain the first sealing hole 31 and the second sealing hole 32.

[0084] Specifically, the first and second surfaces of the general bearing plate 10 are rectangular, and the surface of the resulting plate structure to be disassembled is also rectangular. The sealing holes are distributed along the two long sides and two short sides of the rectangle, such as... Figure 11 The image shown is an overall top view of the distribution of the first sealing hole 31 and the second sealing hole 32 along the edge of the structure to be disassembled. The sealing holes are distributed in a rectangular shape along the edge.

[0085] In one embodiment, other sealing holes may be added as needed, or other sealing hole distributions may be used, but the sealing effect is inferior compared to the two sealing holes and their distribution in this application.

[0086] Then, proceed to step 6, as follows: Figure 7 As shown, a third micropore array 43 is provided on the side of the structure to be disassembled near the first surface. The projection of the third micropore array 43 on the support plate 10 surrounds the support plate 10 at a preset position around the edge of the positioning through hole 40. A fourth micropore array 44 is provided on the side of the structure to be disassembled near the second surface. The projection of the fourth micropore array 44 on the support plate 10 surrounds the support plate 10 at a preset position around the edge of the positioning through hole 40. The projections of the micropores of the first micropore array 41, the second micropore array 42, the third micropore array 43, and the fourth micropore array 44 on the first surface are all staggered. Figure 8 As shown, copper plating is performed within the micropores of the third micropore array 43 and the fourth micropore array 44 to form a copper plating layer 46. Specifically, Figures 7-8 To highlight the position of the micropore array, only the micropore array is shown; the first sealing hole 31 and the second sealing hole 32 are not shown.

[0087] This invention utilizes a third micro-hole array 43 and a fourth micro-hole array 44 surrounding the positioning through-hole 40, located on the top and bottom surfaces of the structure to be disassembled, respectively. This, combined with a first micro-hole array 41 and a second micro-hole array 42 surrounding the positioning through-hole 40 on both surfaces of the support plate 10, and a first sealing hole 31 and a second sealing hole 32 at the edge, provides double-layer shielding and sealing, achieving a better sealing effect to prevent chemicals from seeping into the positioning through-hole 40. Furthermore, copper plating is performed after each micro-hole array setup. Due to the characteristics of laser blind holes, residual copper 45 remains inside the micro-holes obtained after laser drilling. After electroplating to achieve copper plating inside the holes, the copper plating further enhances the sealing effect, reducing the risk of chemicals seeping in during the process.

[0088] In one embodiment, after setting the positioning through hole 40, the sealing hole and the micro-hole array are set.

[0089] In another embodiment, a positioning through hole 40 is provided after the sealing hole and micro-hole array are provided.

[0090] Specifically, the drilling steps for the positioning through hole 40 are set according to the actual original process steps.

[0091] In one embodiment, such as Figure 3 and Figure 7 As shown, the micropores of the first micropore array 41 and the third micropore array 43 extend to the first surface of the core layer 11, and the micropores of the second micropore array 42 and the fourth micropore array 44 extend to the second surface of the core layer 11.

[0092] This invention sets the depth of the micropores in the micropore array so that the micropore array can seal the substrate layer 20 to prevent the liquid medicine from entering the positioning through hole 40. At the same time, it avoids the micropore array from increasing the bonding force between the carrier plate 10 and the substrate layer 20 too much, which would affect the disassembly effect. This reduces the risk of damage to the substrate layer 20 during the disassembly process, thereby further improving the quality of the substrate obtained after disassembly.

[0093] In one embodiment, the micropores in the micropore array are controlled by measuring the pore depth using a 3D microscope to ensure that the laser depth reaches the carrier plate 10, thus preventing the medicine from seeping into the product layers through the positioning through-holes 40 and causing the product to be scrapped.

[0094] In one embodiment, a circle centered at the location center of the positioning through-hole 40 and passing through the centers of each micropore in the first micropore array 41 is designated as a first circle 51; a circle centered at the location center of the positioning through-hole 40 and passing through the centers of each micropore in the second micropore array 42 is designated as a second circle 52; a circle centered at the location center of the positioning through-hole 40 and passing through the centers of each micropore in the third micropore array 43 is designated as a third circle 53; and a circle centered at the location center of the positioning through-hole 40 and passing through the centers of each micropore in the fourth micropore array 44 is designated as a fourth circle 54. Figures 9-11 As shown, where Figure 9 This is a top-down view of the micropore array distribution. Figure 10 The image shows the distribution of the micropore array viewed from below. Figure 11 The distribution diagram of the micropore array is viewed from above. The radius of the first circle 51 is the same as the radius of the second circle 52, and the radius of the third circle 53 is the same as the radius of the fourth circle 54. The radius of the first circle 51 is smaller than the radius of the third circle 53. Between the projections of each two adjacent micropores of the first micropore array 41 on the first surface, there is a projection of a micropore of the second micropore array 42 on the first surface. Between the projections of each two adjacent micropores of the third micropore array 43 on the first surface, there is a projection of a micropore of the fourth micropore array 44 on the first surface.

[0095] This invention, by setting micropore arrays on the two surfaces of the carrier plate 10 and the plate structure to be disassembled, respectively, allows the micropore arrays to seal around the positioning through-hole 40 of the carrier plate 10 and the positioning through-hole 40 of the plate structure to be disassembled after the substrate layer 20 is set. The micropore arrays also surround the product positioning through-hole 40 twice, which not only does not affect the identification of the product positioning through-hole 40, but also increases the sealing effect of the product. This effectively prevents the chemicals used in other processes from seeping into the product through the positioning through-hole 40, thereby facilitating manufacturing and adaptation to subsequent processes, improving process stability and product yield.

[0096] In one embodiment, the first micropore array 41, the second micropore array 42, the third micropore array 43, and the fourth micropore array 44 are all micropore arrays, and the first circle 51, the second circle 52, the third circle 53, and the fourth circle 54 are all circles; for example Figure 11 As shown, the arc length AA' formed by the two points where each micropore of the micropore array intersects with the corresponding circle on the circle is the micropore diameter of the micropore array. The arc length BB' formed by the two points where the two adjacent micropores of the micropore array intersect with the circle at the closest distance is the micropore spacing of the micropore array. The micropore spacing of each micropore array is 1-6 times the micropore diameter of the corresponding micropore array.

[0097] This invention sets the relationship between the micropore diameter and the micropore spacing of the micropore array by setting the arc length relationship, and obtains the micropore array distribution with the best sealing effect after testing. This minimizes the risk of the liquid medicine entering the positioning through hole 40. At the same time, by using the angle system to calculate the length in arc length, the process complexity of setting the micropore array is reduced.

[0098] In one embodiment, other micropore arrays may be added as needed, or other micropore array distributions may be used, but the effect of blocking the liquid from entering the positioning through-hole 40 is inferior compared to the micropore array and its distribution method set in this application.

[0099] In one embodiment, the pore size of each micropore array is 50 micrometers to 600 micrometers.

[0100] This invention, by setting the pore size range of the micropore array, ensures that the identification of the product positioning through-hole 40 is not affected, while also increasing the sealing effect of the product and effectively preventing the chemicals used in other processes from seeping into the product through the positioning through-hole 40.

[0101] In one embodiment, such as Figure 11 As shown, the minimum distance L between the micropores of each micropore array and the location center used to set the positioning through-hole 40 is 100 micrometers to 2000 micrometers.

[0102] This invention achieves optimal liquid blocking effect and avoids impacting the yield of substrate layer 20 by setting the distance between the micro-hole array and the positioning via 40, taking into account equipment accuracy, double-sided printing characteristics, and "sealing effect". Specifically, the distance between the micro-holes and the positioning via 40 can be set by comprehensively considering the available space on the substrate surface and the sealing requirements around the positioning via 40.

[0103] In one embodiment, the positioning through-hole 40 of the product is usually designed with different sizes such as 1mm, 2mm, and 3mm according to the different process and equipment requirements in the industry. Theoretically, the larger the aperture of the positioning through-hole 40, the higher the risk of the medicine flowing into the interlayer through the hole. In order to effectively avoid this risk, and in combination with considerations of equipment, process and aesthetics, it is necessary to set the spacing between the positioning through-hole 40 and the micro-hole array according to the specific application scenario.

[0104] In one embodiment, a typical substrate to be disassembled typically has only two substrate layers 20, one upper and one lower. Alternatively, a new substrate layer 20 can be added to the surface of the two existing substrate layers 20 as needed, both of which are within the scope of this invention. Specifically, after each new substrate layer 20 is added, steps 5-6 are repeated to add sealing holes and a micro-hole array, such that the projections of the sealing holes and the micro-hole array on the first surface are staggered.

[0105] In one embodiment, the preparation method further includes:

[0106] After copper plating is performed in the micropores of the third micropore array 43 and the fourth micropore array 44, 2n additional substrate layers are set again, where n is an integer greater than or equal to 1. Each additional substrate layer includes a semi-cured layer 21 and a substrate conductive layer 22. The semi-cured layer 21 of every two additional substrate layers is located on the two surfaces of the board structure to be disassembled obtained before setting the additional substrate layer. The substrate conductive layer 22 of every two additional substrate layers is located on the surface of the semi-cured layer 21 of the additional substrate layer.

[0107] After each two additional substrate layers are set, the resulting structure is subjected to a lamination process. Then, additional micro-hole arrays are respectively set on the side of the resulting structure to be disassembled near the first surface and the side near the second surface. The projection of the additional micro-hole arrays on the carrier plate 10 surrounds the carrier plate 10 at a preset position on the edge for setting the positioning through holes 40. The projections of the micro-holes of each additional micro-hole array and the first micro-hole array 41, the second micro-hole array 42, the third micro-hole array 43, and the fourth micro-hole array 44 on the first surface are staggered with each other. Copper plating is performed in the micro-holes of the additional micro-hole arrays.

[0108] After setting the 2n additional substrate layers, the obtained board structure to be disassembled is disassembled along the interface between the core conductive layer 12 and the initial conductive layer 13 to obtain two encapsulation substrates.

[0109] Specifically, since the first sealing hole 31 and the second sealing hole 32 set in the previous steps can already ensure the sealing effect, when setting more additional substrate layers in the future, only the micro-hole array needs to be set, and there is no need to set the sealing holes again. This is to avoid the sealing holes from being too tight between the substrate layer 20 and the carrier plate 10, which would make it difficult to disassemble the board or damage the substrate layer, and improve the quality of the finished product after disassembly.

[0110] Finally, step 7 is performed to disassemble the obtained board structure to be disassembled along the interface between the core conductive layer 12 and the initial conductive layer 13, resulting in two encapsulation substrates.

[0111] Specifically, after disassembly, other required circuits, semiconductor structures, or substrate layers 20 can be applied to the surface of the packaging substrate, all of which are within the scope of protection of this invention.

[0112] This invention provides a simple, low-complexity, and high-yield process method. By setting up sealing holes and a micro-hole array, this method utilizes a smaller hole wall area to distribute the impact of drilling on the interlayer bonding force of the structural layer containing the positioning through-hole 40, reducing the possibility of decreased interlayer bonding force under drilling stress. This effectively solves the high-risk problem of chemical injection between layers during the production of coreless products. This not only significantly improves product yield and production process stability, but also, when combined with existing processes, greatly reduces the costs required to develop new processes and introduce new equipment. It helps companies reduce scrap rates and material waste, improve resource utilization efficiency, and thus reduce environmental impact. Furthermore, it contributes to the establishment and promotion of unified quality and safety standards within the industry, promotes the standardization process of the industry, and fosters the healthy and orderly development of the entire industry.

[0113] The present invention also provides a removable board structure, wherein the removable board structure is obtained by any of the above-described methods for preparing a coreless encapsulation substrate resistant to chemical penetration, and the removable board structure includes:

[0114] The carrier plate 10 includes a core layer 11 and a core conductive layer 12, with the two core conductive layers 12 respectively covering the first and second surfaces opposite to the core layer 11.

[0115] Two initial conductive layers 13 are provided on the surface of each core conductive layer 12;

[0116] Two substrate layers 20, each of the substrate layers 20 includes a semi-cured layer 21 and a substrate conductive layer 22, the two semi-cured layers 21 respectively cover the surfaces of the two initial conductive layers 13, and the two substrate conductive layers 22 respectively cover the surfaces of the two semi-cured layers 21.

[0117] The first sealing hole 31 penetrates the support plate 10, and its projection on the support plate 10 is evenly distributed on the edge of the support plate 10.

[0118] The second sealing hole 32 penetrates the structure of the plate to be disassembled, and its projection on the support plate 10 is evenly distributed on the edge of the support plate 10. The second sealing hole 32 is staggered from the first sealing hole 31.

[0119] The micro-hole array includes a first micro-hole array 41, a second micro-hole array 42, a third micro-hole array 43, and a fourth micro-hole array 44. The first micro-hole array 41 and the third micro-hole array 43 are located on the side of the structure to be disassembled that is close to the first surface, and the second micro-hole array 42 and the fourth micro-hole array 44 are located on the side of the structure to be disassembled that is close to the second surface. The first micro-hole array 41 and the second micro-hole array 42 extend from the surface of the initial conductive layer 13 away from the carrier plate 10 toward the carrier plate 10, and the third micro-hole array 43 and the fourth micro-hole array 44 extend from the surface of the substrate layer 20 away from the carrier plate 10 toward the carrier plate 10. The projection of each micro-hole array on the carrier plate 10 surrounds the edge of the positioning through hole 40 of the carrier plate 10 at a predetermined position. The projections of the micro-holes of the micro-hole array on the first surface are all staggered, and each micro-hole is filled with a copper plating layer 46.

[0120] The sealing performance of the board structure to be disassembled obtained by the aforementioned semiconductor process can prevent the liquid from entering the positioning through hole 40, while ensuring the quality of the substrate after subsequent disassembly. This makes the obtained board structure adaptable to the disassembly process and greatly improves the yield of the substrate obtained after disassembly.

[0121] In one embodiment, the structure to be disassembled further includes 2n additional substrate layers, where n is an integer greater than or equal to 1; each additional substrate layer includes a semi-cured layer 21 and a substrate conductive layer 22, and each additional substrate layer is uniformly distributed on the surfaces of the two substrate layers 20 near the first surface and near the second surface, and the substrate conductive layer 22 in each additional substrate layer is located on the side of the semi-cured layer 21 of the additional substrate layer away from the carrier plate 10.

[0122] The microvia array also includes an additional microvia array. Each additional substrate layer has an additional microvia array extending from the surface of the additional substrate layer away from the carrier plate 10 toward the carrier plate 10. The projection of the additional microvia array on the carrier plate 10 surrounds the carrier plate 10 to set the edge preset position of the positioning through hole 40. The projections of the microvias of each additional microvia array and the first microvia array 41, the second microvia array 42, the third microvia array 43, and the fourth microvia array 44 on the first surface are all staggered. The microvias of the additional microvia array are all filled with a copper plating layer 46.

[0123] In summary, the method for preparing a coreless encapsulation substrate resistant to chemical penetration and the structure of the substrate to be disassembled according to the present invention can set sealing holes by laser drilling, avoiding the impact of low-speed drilling on the sealing performance of the inner layer of the substrate. Moreover, the laser makes the micro-hole positions concave, increasing the interlayer bonding force of the product. At the same time, by setting a double-sided staggered closed micro-hole array at the edge of the positioning through hole of the encapsulation substrate, the interlayer bonding force of the substrate is further improved, thereby reducing the risk of chemicals used in other processes entering the positioning through hole, improving process stability and product yield. In addition, by setting the micro-hole depth of the micro-hole array, chemicals are prevented from entering the positioning through hole, and the bonding force between the carrier plate and the substrate layer is prevented from being too large, which would cause damage to the substrate during disassembly, thus optimizing the subsequent disassembly effect. Finally, by setting the micro-hole diameter, micro-hole spacing, and the spacing between the micro-hole and the positioning through hole, the product yield of the substrate is guaranteed while the chemical penetration of the positioning through hole is prevented and the substrate yield is guaranteed, and the impact on the quality of the substrate itself is reduced.

[0124] Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0125] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for producing a non-nuclear packaging substrate resistant to water penetration, characterized by, The preparation method comprises: providing a carrier plate comprising a core layer and a core conductive layer, two layers of core conductive layer covering the opposite first surface and second surface of the core layer respectively; setting an initial conductive layer on the surface of the two layers of core conductive layer respectively, and performing a pressing process on the obtained structure; setting a first edge sealing hole by laser drilling process, the projection of the first edge sealing hole on the carrier plate is uniformly distributed along the edge of the carrier plate, and each first edge sealing hole penetrates the carrier plate and the two layers of initial conductive layer; setting a first micropore array on the surface of the initial conductive layer close to the first surface, the projection of the first micropore array on the carrier plate surrounds the edge of the carrier plate for setting the pre-set position of the positioning through hole; setting a second micropore array on the surface of the initial conductive layer close to the second surface, the projection of the second micropore array on the carrier plate surrounds the edge of the carrier plate for setting the pre-set position of the positioning through hole; the micropores of the first micropore array and the second micropore array are distributed in a staggered manner on the carrier plate; copper plating is performed in the micropores of the first micropore array and the second micropore array; setting a substrate layer on the surface of the two layers of initial conductive layer respectively, the substrate layer comprising a semi-solid layer and a substrate conductive layer, two layers of semi-solid layer covering the surface of the two layers of initial conductive layer respectively, and two layers of substrate conductive layer covering the surface of the two layers of semi-solid layer respectively, to obtain a to-be-disassembled plate structure; performing a pressing process on the obtained to-be-disassembled plate structure; setting a second edge sealing hole by laser drilling process, the second edge sealing hole is uniformly distributed on the edge of the to-be-disassembled plate structure, each second edge sealing hole penetrates the to-be-disassembled plate structure, and the second edge sealing hole is distributed in a staggered manner with the first edge sealing hole; setting a third micropore array on one side of the to-be-disassembled plate structure close to the first surface, the projection of the third micropore array on the carrier plate surrounds the edge of the carrier plate for setting the pre-set position of the positioning through hole; setting a fourth micropore array on one side of the to-be-disassembled plate structure close to the second surface, the projection of the fourth micropore array on the carrier plate surrounds the edge of the carrier plate for setting the pre-set position of the positioning through hole; the micropores of the first micropore array, the second micropore array, the third micropore array and the fourth micropore array are distributed in a staggered manner on the first surface; copper plating is performed in the micropores of the third micropore array and the fourth micropore array; disassembling the to-be-disassembled plate structure along the interface between the core conductive layer and the initial conductive layer to obtain two packaging substrates.

2. The method of claim 1, wherein the method further comprises: The micropores of the first micropore array and the third micropore array all extend to the first surface of the core layer, and the micropores of the second micropore array and the fourth micropore array all extend to the second surface of the core layer.

3. The method of claim 1, wherein the method further comprises: A circle passing through the center of each microwell of the first microwell array with the center of the position of the positioning through hole as the center is a first circle, a circle passing through the center of each microwell of the second microwell array with the center of the position of the positioning through hole as the center is a second circle, a circle passing through the center of each microwell of the third microwell array with the center of the position of the positioning through hole as the center is a third circle, and a circle passing through the center of each microwell of the fourth microwell array with the center of the position of the positioning through hole as the center is a fourth circle; the radius of the first circle is the same as the radius of the second circle, the radius of the third circle is the same as the radius of the fourth circle, and the radius of the first circle is smaller than the radius of the third circle; the projection of every two adjacent microwells of the first microwell array on the first surface is distributed with the projection of a microwell of the second microwell array on the first surface, and the projection of every two adjacent microwells of the third microwell array on the first surface is distributed with the projection of a microwell of the fourth microwell array on the first surface.

4. The method of claim 3, wherein the method further comprises: The first microwell array, the second microwell array, the third microwell array and the fourth microwell array are all microwell arrays, and the first circle, the second circle, the third circle and the fourth circle are all circles; the arc length formed by the two points of each microwell of each microwell array intersecting with the corresponding circle of the microwell array on the circle is the microwell aperture of the microwell array, and the arc length formed by the two points of every two adjacent microwells of the microwell array intersecting with the circle at the closest distance is the microwell spacing of the microwell array; the microwell spacing of each microwell array is 1-6 times of the microwell aperture of the corresponding microwell array.

5. The method of claim 4, wherein the method further comprises: The microwell aperture of each microwell array is 50-600 microns.

6. The method of claim 4, wherein the method further comprises: The minimum distance between the microwell of each microwell array and the center of the position of the positioning through hole is 100-2000 microns.

7. The method of claim 1-6, wherein The preparation method further comprises: After copper plating is performed in the microwells of the third microwell array and the fourth microwell array, 2n additional substrate layers are arranged again, n is an integer greater than or equal to 1; each additional substrate layer comprises a semi-cured layer and a substrate conductive layer, and the semi-cured layers of every two additional substrate layers are respectively located on the two surfaces of the to-be-removed substrate structure obtained before the additional substrate layer is arranged, and each substrate conductive layer is located on the surface of the semi-cured layer of the additional substrate layer; After each 2 additional substrate layers are arranged, a pressing process is performed on the obtained structure; then additional microwell arrays are arranged on one side of the obtained to-be-removed substrate structure close to the first surface and one side close to the second surface, the projection of the additional microwell array on the carrier plate surrounds the edge of the carrier plate for arranging the positioning through hole; the projection of each additional microwell array and the microwells of the first microwell array, the second microwell array, the third microwell array and the fourth microwell array on the first surface are distributed in a staggered manner; copper plating is performed in the microwells of the additional microwell array; After 2n additional substrate layers are arranged, the to-be-removed substrate structure obtained is removed along the interface between the core conductive layer and the initial conductive layer to obtain two packaging substrates.

8. A structure to be disassembled, characterized by, The to-be-disassembled board structure is prepared by the method for preparing a coreless packaging substrate resistant to drug water infiltration according to any one of claims 1-7, and the to-be-disassembled board structure comprises: a carrier plate comprising a core layer and core conductive layers covering the opposite first surface and second surface of the core layer; two initial conductive layers, each of the surfaces of the core conductive layers being provided with one of the initial conductive layers; two substrate layers, each of the substrate layers comprising a prepreg layer and a substrate conductive layer, the two prepreg layers covering the surfaces of the two initial conductive layers, and the two substrate conductive layers covering the surfaces of the two prepreg layers; first edge sealing holes penetrating the carrier plate and uniformly distributed around the edges of the carrier plate; second edge sealing holes penetrating the to-be-disassembled board structure and uniformly distributed around the edges of the carrier plate, the second edge sealing holes being distributed in a staggered manner with the first edge sealing holes; a micro-hole array comprising a first micro-hole array, a second micro-hole array, a third micro-hole array and a fourth micro-hole array, the first micro-hole array and the third micro-hole array being located on the side of the to-be-disassembled board structure close to the first surface, the second micro-hole array and the fourth micro-hole array being located on the side of the to-be-disassembled board structure close to the second surface, the first micro-hole array and the second micro-hole array extending from the initial conductive layer away from the surface of the carrier plate towards the carrier plate, the third micro-hole array and the fourth micro-hole array extending from the substrate layer away from the surface of the carrier plate towards the carrier plate, the projection of each of the micro-hole arrays on the carrier plate being located around the preset position of the edge of the positioning through hole of the carrier plate; the projections of the micro-holes of the micro-hole array on the first surface being distributed in a staggered manner, and the micro-holes being filled with a copper plating layer.

9. The structure to be disassembled according to claim 8, wherein The to-be-disassembled board structure further comprises 2n additional substrate layers, n being an integer greater than or equal to 1; each of the additional substrate layers comprises a prepreg layer and a substrate conductive layer, and each of the additional substrate layers is uniformly distributed on the surface of the two substrate layers close to the first surface and the second surface, and the substrate conductive layer in each of the additional substrate layers is located on the side of the prepreg layer of the additional substrate layer away from the carrier plate; the micro-hole array further comprises an additional micro-hole array, each of the additional substrate layers has an additional micro-hole array extending from the surface of the additional substrate layer away from the carrier plate towards the carrier plate, and the projection of the additional micro-hole array on the carrier plate is located around the preset position of the edge of the positioning through hole of the carrier plate; the projections of the micro-holes of each of the additional micro-hole arrays and the first micro-hole array, the second micro-hole array, the third micro-hole array and the fourth micro-hole array on the first surface are distributed in a staggered manner; and the micro-holes of the additional micro-hole array are filled with a copper plating layer.

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