Component mounting system

Abstract

A component mounting system (10) is provided with: a mounting head (24) for mounting a component on a substrate on which solder is applied; a heat line head (43) that irradiates a heat line to the solder after the component is mounted; a camera (45) that captures an image of the solder in parallel with irradiation of the heat line; a learning unit (53) that generates a learning model using the solder image as an input and the solder quality as an output; a determination unit (52) that inputs an image of the solder captured by the camera (45) to the learning model and determines whether or not the solder is qualified; and a control unit (51) that stops the irradiation of the heat line when it is determined that the welding quality is qualified.

Description

Technical Field

[0001] This invention relates to a component mounting system. Background Technology

[0002] In the technical field of component mounting systems, production systems such as those disclosed in Patent Document 1 are known.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2023-026021 Summary of the Invention

[0004] Sometimes, the substrate on which the component is mounted is a substrate with low heat resistance, such as a resin substrate. When soldering components onto substrates with low heat resistance, localized heating is used. In this case, soldering is performed using a hot wire, typically a laser. A paste-like solder, pre-applied to the substrate, melts and forms solder pads on the electrode portion of the component, thereby soldering the component to the substrate. Maintaining the high temperature for an extended period to ensure reliable soldering can damage the substrate. The temperature rise during hot wire irradiation varies depending on the size of the substrate's pads and the size of the component's leads, making it difficult to control. Therefore, temperature sensors are used for point detection, but overall solder melting state cannot be managed. If the solder melting state cannot be properly managed, the soldering quality may be degraded.

[0005] The purpose of this invention is to suppress the decline in welding quality.

[0006] The component mounting system according to the present invention includes: a mounting head for mounting components onto a substrate coated with solder; a hot wire head for irradiating the solder with a hot wire after mounting the component; a camera for taking pictures of the solder in parallel with the irradiation of the hot wire; a learning unit for generating a learning model that takes the image of the solder as input and the quality of the soldering as output; a determination unit for inputting the image of the solder taken by the camera into the learning model and determining whether the soldering is of acceptable quality; and a control unit for stopping the irradiation of the hot wire when the soldering is determined to be of acceptable quality.

[0007] The effects of the invention

[0008] According to the present invention, the reduction in welding quality is suppressed. Attached Figure Description

[0009] Figure 1 This is a perspective view showing the substrate and components involved in the embodiment.

[0010] Figure 2 This is a perspective view showing the tray that holds the substrate according to the embodiment.

[0011] Figure 3This is an exploded perspective view showing the substrate and tray involved in the embodiment.

[0012] Figure 4 This is a schematic diagram illustrating the component mounting system involved in the implementation method.

[0013] Figure 5 This is a top view schematically illustrating the mounting device involved in the embodiment.

[0014] Figure 6 This is a perspective view showing the tray and workbench involved in the implementation method.

[0015] Figure 7 This is an exploded perspective view showing the tray and workbench involved in the implementation method.

[0016] Figure 8 This is a schematic diagram illustrating the mounting head involved in the implementation method.

[0017] Figure 9 This is a schematic diagram illustrating the laser irradiation device involved in the embodiment.

[0018] Figure 10 This is a schematic diagram showing a portion of a substrate on which components are mounted, according to an embodiment.

[0019] Figure 11 This is a block diagram illustrating the laser irradiation apparatus involved in the implementation method.

[0020] Figure 12 This is a hardware structure diagram of the controller involved in the implementation method.

[0021] Figure 13 These are examples of the use of machine learning and learning results involved in the implementation method.

[0022] Figure 14 These are examples of images used for learning and judgment in the implementation method. Detailed Implementation

[0023] Below, refer to the appendix. Figure 1The implementation method will be described below. In this implementation, an XYZ orthogonal coordinate system is defined, and the positional relationships of each part will be described with reference to this XYZ orthogonal coordinate system. The direction of the X-axis, which is parallel to the defined plane, is defined as the X-axis direction. The direction of the Y-axis, which is parallel to the defined plane and orthogonal to the X-axis, is defined as the Y-axis direction. The direction of the Z-axis, which is parallel to the defined plane, is defined as the Z-axis direction. The direction of rotation or tilting centered on the X-axis direction is defined as the θX direction. The direction of rotation or tilting centered on the Y-axis direction is defined as the θY direction. The direction of rotation or tilting centered on the Z-axis direction is defined as the θZ direction. In this implementation, the defined plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Furthermore, the defined plane may also be tilted relative to the horizontal plane. In addition, in this implementation, the defined plane including the X-axis and Y-axis is appropriately referred to as the XY plane.

[0024] [Substrate]

[0025] Figure 1 This is a perspective view showing the substrate 1 and component 2 according to the embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may also include corners. Protrusions may also be provided on the surface of the substrate 1.

[0026] A circuit is disposed on the surface of substrate 1. In this embodiment, substrate 1 is formed by in-mold forming technology. Substrate 1 includes: a substrate 1A having a curved surface; and a thin film 1B bonded to the surface of substrate 1A. Thin film 1B is flexible. Thin film 1B is a flexible film. Thin film 1B contains the circuit. The surface of substrate 1 includes the surface of thin film 1B.

[0027] Component 2 includes electronic components. Component 2 can be a leaded electronic component with leads protruding from the body. Component 2 can also be a chip-type electronic component without leads. By mounting component 2 on the surface of substrate 1, an electronic device is manufactured.

[0028] [tray]

[0029] Figure 2 This is a perspective view showing the tray 3 that holds the substrate 1 according to the embodiment. Figure 3 This is an exploded perspective view showing the substrate 1 and tray 3 according to the embodiment. The tray 3 holds the substrate 1. In the embodiment, the substrate 1 is processed while being held in the tray 3. The tray 3 has: a support member 4 that supports the substrate 1; and a clamping mechanism 5 that fixes the substrate 1.

[0030] The support member 4 includes: a base portion 4A that supports the substrate 1 from the -Z side; a protective portion 4B that is respectively disposed on the +Y side and the -Y side of the base portion 4A; and a plurality of pin portions 4C that support the substrate 1 from the +Y side and the -Y side.

[0031] The base portion 4A is formed as a plate with multiple openings. Two holes 4D are formed in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

[0032] The protective portion 4B is formed to extend in the X-axis direction. A pair of protective portions 4B are provided. The pair of protective portions 4B are separated from each other in the Y-axis direction. One protective portion 4B is configured to protrude from the +Y side end of the upper surface of the base portion 4A toward the +Z side. The other protective portion 4B is configured to protrude from the -Y side end of the upper surface of the base portion 4A toward the +Z side.

[0033] Each of the multiple pins 4C is configured to protrude from the upper surface of the base portion 4A toward the +Z side. A portion of the pins 4C are disposed on the +Y side relative to the center of the base portion 4A. A portion of the pins 4C are disposed on the -Y side relative to the center of the base portion 4A. The multiple pins 4C disposed on the +Y side relative to the center of the base portion 4A support the +Y side end of the substrate 1. The multiple pins 4C disposed on the -Y side relative to the center of the base portion 4A support the -Y side end of the substrate 1.

[0034] A clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes: a pair of support portions 5A that support the -X side end of the substrate 1; and a movable portion 5B that supports the +X side end of the substrate 1. The movable portion 5B is located on the upper surface of the base portion 4A and is movable in the X-axis direction. With the substrate 1 positioned between the support portions 5A and the movable portion 5B, the movable portion 5B moves in the -X direction, thereby clamping the substrate 1 between the support portions 5A and the movable portion 5B. The substrate 1 is clamped by the support portions 5A and the movable portion 5B, thereby being fixed to the tray 3.

[0035] [Component Mounting System]

[0036] Figure 4 This is a schematic diagram illustrating the component mounting system 10 according to the embodiment. (See diagram below.) Figure 4 As shown, the component mounting system 10 includes a mounting device 12, a preheating device 13, and a laser irradiation device 14. An electronic equipment production line is constructed using the mounting device 12, the preheating device 13, and the laser irradiation device 14.

[0037] Mounting device 12 mounts component 2 onto substrate 1. At least one mounting device 12 is provided in the production line. Alternatively, multiple mounting devices 12 may be provided.

[0038] Figure 5 This is a schematic top view of the mounting device 12 according to the embodiment. The mounting device 12 includes a base component 18, a conveying device 19, a worktable 20, a worktable moving device 21, a component supply device 22, a mounting head 24 including a suction nozzle 23, a substrate camera 25, a height sensor 26, a mounting head moving device 27, and a chamber 29.

[0039] The base component 18 supports the conveying device 19, the worktable 20, the worktable moving device 21, the component supply device 22, the mounting head 24, and the mounting head moving device 27.

[0040] The conveying device 19 transports the tray 3 holding the substrate 1 in the X-axis direction. The conveying device 19 transports the tray 3 to the processing position of the mounting device 12. The processing position is defined in the transport path of the conveying device 19.

[0041] The conveying device 19 includes: a conveyor belt 19A that conveys the pallet 3 in the X-axis direction; and a guide member 19B that guides the pallet 3.

[0042] Guide members 19B are formed to extend in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are separated from each other in the Y-axis direction. One guide member 19B is disposed on the +Y side relative to the tray 3. The other guide member 19B is disposed on the -Y side relative to the tray 3.

[0043] The conveyor belt 19A is formed in a loop. A pair of conveyor belts 19A are provided. The conveyor belt 19A is supported on the guide member 19B via a drive pulley and a driven pulley. The conveyor belt 19A is suspended on the drive pulley and the driven pulley. One conveyor belt 19A is supported on one guide member 19B. The other conveyor belt 19A is supported on the other guide member 19B.

[0044] In a pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the lower surface of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the lower surface of the pallet 3. The pallet 3 is conveyed in the X-axis direction by rotating the drive pulley via a drive motor (not shown).

[0045] By means of an actuator (not shown), one guide member 19B can move relative to another guide member 19B in the Y-axis direction. By separating one guide member 19B and the other guide member 19B in the Y-axis direction, the support of the pallet 3 by the conveyor belt 19A is thereby released.

[0046] Figure 6 This is a perspective view showing the tray 3 and worktable 20 involved in the embodiment. Figure 7This is an exploded perspective view showing the tray 3 and worktable 20 involved in the embodiment.

[0047] The worktable 20 supports the substrate 1 via the tray 3. The worktable 20 supports the tray 3, which is being transported to the processing position, from the -Z side. Two positioning members 20A are provided on the upper surface of the worktable 20. The positioning members 20A are inserted into holes 4D in the tray 3. The positioning members 20A are inserted into the holes 4D from the -Z side of the tray 3, thereby positioning the worktable 20 and the tray 3. A hook is provided at the upper end of the positioning member 20A. The hook hooks onto the tray 3. The hook contains a ball that moves under air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the tray 3, the ball hooks onto the tray 3, thereby securing the worktable 20 and the tray 3.

[0048] The table moving device 21 moves the table 20. In this embodiment, the table moving device 21 moves the table 20 in the Y-axis direction, Z-axis direction, θX direction, and θY direction, respectively. The table moving device 21 includes: a Y-axis motor that generates power to move the table 20 in the Y-axis direction; a Z-axis motor that generates power to move the table 20 in the Z-axis direction; an θX motor that generates power to rotate the table 20 in the θX direction; and an θY motor that generates power to rotate the table 20 in the θY direction.

[0049] After the pallet 3 is conveyed to the processing position by the conveyor 19, the guide member 19B on the +Y side moves in the +Y direction to separate from the other guide member 19B, and the worktable 20 moves in the +Z direction by the worktable moving device 21. The guide member 19B on the +Y side moves in the Y-axis direction to separate from the other guide member 19B, thereby releasing the support of the pallet 3 by the conveyor belt 19A. With the support of the pallet 3 by the conveyor belt 19A released, the worktable 20 moves in the +Z direction, thereby transferring the pallet 3 from the conveyor 19 to the worktable 20. With the pallet 3 supported on the worktable 20, the worktable moving device 21 can move the worktable 20 in the Z-axis direction, the θX direction, and the θY direction by moving the worktable 20 in the +Y direction to the center of the two guide members 19B.

[0050] When pallet 3 is transferred from worktable 20 to conveyor 19, worktable 20 moves in the -Y direction until one side of pallet 3 is on conveyor belt 19A, and guide member 19B on the +Y side moves in the -Y direction until the opposite side of pallet 3 is on conveyor belt 19A. After the hook at the upper end of positioning member 20A is released, worktable 20 is moved in the -Z direction by worktable moving device 21. As a result, the support of worktable 20 on pallet 3 is released, and pallet 3 is supported on conveyor belt 19A.

[0051] The component supply device 22 supplies components 2. The component supply device 22 includes multiple belt feeders. The belt feeders hold multiple components 2. The component supply device 22 supplies at least one of the multiple components 2 to the supply position. The component supply device 22 is disposed on the -Y side of the conveying device 19. Alternatively, the component supply device 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0052] Mounting head 24 mounts component 2 onto substrate 1. Mounting head 24 supports multiple suction nozzles 23. Mounting head 24 holds component 2 supplied from component supply device 22 onto substrate 1 via suction nozzles 23. Mounting head 24 is movable between a supply position and a processing position, supplying component 2 from component supply device 22 to the supply position and positioning substrate 1 at the processing position. Mounting head 24 holds component 2 supplied to the supply position via suction nozzles 23, and after moving to the processing position, mounts it onto the surface of substrate 1 positioned at the processing position.

[0053] The mounting head moving device 27 moves the mounting head 24. In this embodiment, the mounting head moving device 27 moves the mounting head 24 in both the X-axis and Y-axis directions. The mounting head moving device 27 includes an X-axis moving device 27X, which moves the mounting head 24 in the X-axis direction; and a Y-axis moving device 27Y, which moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. The mounting head 24 moves in the X-axis direction by the operation of the X-axis moving device 27X. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. The X-axis moving device 27X moves in the Y-axis direction by the operation of the Y-axis moving device 27Y, thereby moving the mounting head 24 in the Y-axis direction.

[0054] Figure 8 This is a schematic diagram illustrating the mounting head 24 according to the embodiment. (See diagram below.) Figure 8 As shown, the mounting head 24 has multiple suction nozzles 23. The suction nozzles 23 hold the component 2 in a manner that allows for the attachment and detachment of the component 2. The suction nozzle 23 is a suction nozzle for adsorbing and holding the component 2. An opening is formed at the lower end of the suction nozzle 23. The opening of the suction nozzle 23 is connected to a vacuum system. When the lower end of the suction nozzle 23 is in contact with the component 2, a suction action is performed from the opening at the lower end of the suction nozzle 23, thereby adsorbing and holding the component 2 at the lower end of the suction nozzle 23. Releasing the suction action from the opening releases the component 2 from the suction nozzle 23. Alternatively, the suction nozzle 23 may also be a clamping suction nozzle that holds the component 2 in place.

[0055] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in the Z-axis direction and the θZ direction, respectively. The nozzle moving device 28 is supported on the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. Multiple shafts 23A are provided. Multiple nozzles 23 are connected to multiple shafts 23A respectively. Multiple nozzle moving devices 28 are provided. Multiple nozzle moving devices 28 are connected to multiple shafts 23A respectively. The nozzle 23 is supported on the mounting head 24 via the shafts 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shafts 23A in the Z-axis direction and the θZ direction, thereby moving the nozzle 23.

[0056] The suction nozzle 23 can move in the X-axis, Y-axis, Z-axis and θZ-axis directions respectively via the mounting head moving device 27 and the suction nozzle moving device 28. By moving the suction nozzle 23, the component 2 held by the suction nozzle 23 can also move in the X-axis, Y-axis, Z-axis and θZ-axis directions respectively.

[0057] The substrate camera 25 captures images of the substrate 1. In this embodiment, the substrate camera 25 captures images of the surface of the substrate 1 from the +Z side. The substrate camera 25 is mounted on the mounting head 24. The substrate camera 25 moves together with the mounting head 24 in the X-axis and Y-axis directions. The substrate camera 25 is capable of capturing images of positioning marks provided on the surface of the substrate 1.

[0058] A height sensor 26 detects the height of the surface of the substrate 1 in the Z-axis direction. The height sensor 26 is disposed on the mounting head 24. The height sensor 26 moves together with the mounting head 24 in the X-axis and Y-axis directions. In this embodiment, the height sensor 26 is a laser positioning sensor. The height sensor 26 illuminates the surface of the substrate 1 with laser light from the +Z side of the substrate 1, and receives the laser light reflected from the surface of the substrate 1, thereby enabling the detection of the distance from the mounting head 24 to the substrate 1. By detecting the distance from the mounting head 24 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0059] The chamber 29 has an internal space that accommodates the base component 18, the conveying device 19, the worktable 20, the worktable moving device 21, the component supply device 22, the mounting head 24, the mounting head moving device 27, and the suction nozzle moving device 28.

[0060] In this embodiment, the mounting device 12 includes a dispensing applicator 34 for applying solder paste to a substrate 1. The dispensing applicator 34 moves along the X-axis, Y-axis, and Z-axis directions on the +Z side relative to the conveying device 19. The dispensing applicator 34 and the mounting head 24 can move independently. After the solder paste is applied to the surface of the substrate 1 by the dispensing applicator 34, the mounting head 2 is used to mount the component 2 onto the substrate 1. The mounting head 24 mounts the component 2 onto the substrate 1 with the solder paste applied. The substrate 1, with the component 2 mounted by the mounting device 12, is conveyed to the preheating device 13 while being fixed to the tray 3.

[0061] The preheating device 13 reduces the liquid component of the solder paste applied to the substrate 1. The solder paste includes flux and metal solder balls dispersed in the flux. The preheating device 13 reduces the liquid component of the solder paste by vaporizing at least a portion of the liquid component as the flux is activated.

[0062] The preheating device 13 includes: a base component 35; a conveying device 36 for conveying the tray 3; a heater 37 for heating the substrate 1; and a chamber 38.

[0063] The base component 35 supports the conveying device 36. The conveying device 36 conveys the tray 3 holding the substrate 1 in the X-axis direction. The conveying device 36 includes: a conveyor belt 36A that conveys the tray 3; and a guide component 36B that guides the tray 3.

[0064] Heater 37 heats substrate 1 so that at least a portion of the liquid component of flux in the solder paste vaporizes.

[0065] The chamber 38 has an internal space that accommodates the base component 35, the conveying device 36 and the heater 37 respectively.

[0066] The preheating device 13 heats the substrate 1 held by the tray 3 to reduce the liquid content of the solder paste. The preheating device 13 heats the substrate 1 at a temperature lower than the melting point of the solder paste. For example, the preheating device 13 heats the substrate 1 at a temperature of 80°C or higher and 100°C or lower for 10 minutes. The substrate 1, preheated by the preheating device 13, is then conveyed to the laser irradiation device 14 while being fixed on the tray 3.

[0067] The laser irradiation device 14 irradiates the paste solder with a laser to melt the paste solder. The laser irradiation device 14 includes: a base component 39; a conveying device 40 with a conveying tray 3; a worktable 41 with a supporting tray 3; a worktable moving device 42 for moving the worktable 41; a laser head 43 for emitting a laser; a solder joint camera 45 for photographing the substrate 1; and a chamber 44.

[0068] The base component 39 supports the conveying device 40, the worktable 41, the worktable moving device 42, and the laser head 43 respectively.

[0069] The conveying device 40 conveys the tray 3 holding the substrate 1 in the X-axis direction. The conveying device 40 includes: a conveyor belt 40A that conveys the tray 3; and a guide member 40B that guides the tray 3. The construction and function of the conveying device 40 are substantially the same as those of the conveying device 19.

[0070] The worktable 41 supports the tray 3 from the -Z side. The worktable moving device 42 moves the worktable 41 in the Y-axis direction, Z-axis direction, θX direction, and θY direction, respectively. The structure and function of the worktable 41 are substantially the same as those of the worktable 20.

[0071] After the component 2 is mounted onto the substrate 1 via the mounting head 24 using a solder paste, the laser head 43 irradiates the solder paste with a laser. The laser head 43 melts the solder paste by irradiating it with the laser. The laser head 43 moves along the X-axis, Y-axis, and Z-axis directions on the +Z side relative to the conveying device 40. The laser head 43 is an example of a hot wire head. The laser emitted from the laser head 43 is an example of a hot wire.

[0072] The solder joint camera 45 photographs the substrate 1. The solder joint camera 45 photographs at least the solder paste. In this embodiment, the solder joint camera 45 photographs the surface of the substrate 1 from the +Z side. The solder joint camera 45 is mounted on the laser head 43. The solder joint camera 45 moves together with the laser head 43 in the X-axis, Y-axis, and Z-axis directions.

[0073] The chamber 44 has an internal space that accommodates the base component 39, the conveying device 40, the worktable 41, the worktable moving device 42, and the laser head 43.

[0074] [Laser irradiation device]

[0075] Figure 9 This is a schematic diagram illustrating the laser irradiation device 14 according to the embodiment. Figure 10 This is a schematic diagram showing a portion of a substrate 1 on which the component 2 is mounted, according to the embodiment.

[0076] The worktable 41 of the laser irradiation device 14 supports the tray 3 holding the substrate 1. The substrate 1 is supported on the worktable 41 via the tray 3. The worktable 41 is capable of rotating about the rotation axis Rm.

[0077] Component 2 is mounted on substrate 1 via solder paste 90. For example... Figure 10As shown, component 2 has a main body 2A and an electrode 2B. The substrate 1 has a pad 1C. The electrode 2B and the pad 1C are soldered together using solder paste 90.

[0078] In the laser irradiation apparatus 14, a laser beam emitted from the laser head 43 irradiates the solder paste 90. The laser heats the solder paste 90, causing it to melt. The molten solder paste 90 is cooled, forming solder feet between the electrode portion 2B and the pad 1C, thereby soldering the component 2 to the substrate 1. The solder feet are portions formed by solder protrusions on the surface of the substrate 1.

[0079] In this embodiment, after the liquid component of the solder paste 90 is reduced in the preheating device 13, the solder paste 90 is irradiated with a laser. Since the solder paste 90 is irradiated with a laser while the liquid component of the solder paste 90 is reduced, solder balls generated by sudden boiling of the solder paste 90 are suppressed.

[0080] A solder joint camera 45 is fixed to the laser head 43. The solder joint camera 45 photographs the solder paste 90 disposed on the surface of the substrate 1. The solder joint camera 45 photographs the solder paste 90 in parallel with the laser irradiation of the solder paste 90. That is, the solder joint camera 45 photographs the solder paste 90 at least during the period when the laser is emitted from the laser head 43. The solder joint camera 45 photographs the solder paste 90 while the laser is irradiating the solder paste 90.

[0081] If the solder paste 90 is continuously irradiated with a laser for an extended period to ensure reliable soldering, it may damage the substrate 1. Insufficient laser irradiation of the solder paste 90 may result in reduced soldering quality. That is, if the laser irradiation of the solder paste 90 is insufficient, the substrate 1 and component 2 may not be adequately soldered. Conventionally, the melting state of the solder paste 90 has been managed using a temperature sensor for point detection; however, methods using temperature sensors can only manage the melting state of a localized portion of the solder paste 90.

[0082] In this embodiment, the melting state of the solder paste 90 is managed based on an image of the solder paste 90. Specifically, the laser irradiation time is managed based on the image of the solder paste 90. According to this embodiment, by managing the overall melting state of the solder, damage to the substrate 1 can be suppressed and the degradation of soldering quality can be prevented.

[0083] Figure 11 This is a block diagram illustrating the laser irradiation apparatus 14 according to the embodiment. The laser irradiation apparatus 14 includes a laser head 43, a welding foot camera 45, and a controller 16. The controller 16 controls the laser irradiation apparatus 14.

[0084] Figure 12This is a hardware structure diagram of the controller 16 according to the implementation method. The controller 16 includes a computer system. The controller 16 has a processor 47 such as a CPU (Central Processing Unit), a main memory 48 including non-volatile memory such as ROM (Read Only Memory) and volatile memory such as RAM (Random Access Memory), a storage device 49, and an interface 50 including input / output circuitry. The functions of the controller 16 are stored as a computer program in the storage device 49. The processor 47 reads the computer program from the storage device 49 and expands it to the main memory 48, and executes the prescribed processing according to the computer program. In addition, the computer program can also be transmitted to the controller 16 via a network.

[0085] like Figure 11 As shown, the inspection device 15 is connected to the laser irradiation device 14. The controller 16 is capable of communicating with the inspection device 15. The inspection device 15 includes a substrate appearance inspection device (AOI: Automated Optical Inspection) for inspecting the state of the substrate 1 after welding the component 2. The inspection device 15 is capable of inspecting the quality of the welding.

[0086] In this embodiment, the quality of the solder joint includes the shape of the solder pads 90. The inspection device 15 inspects the shape of the solder pads. As described above, a laser is irradiated onto the solder pad 90 from the laser head 43, thereby melting the solder pad 90. The molten solder pad 90 is cooled, thereby forming the solder pads of the solder pad 90. The quality of the solder joint can be evaluated by the shape of the solder pads. If the shape of the solder pads is of acceptable quality (the target shape), the solder joint is evaluated as acceptable. If the shape of the solder pads is unacceptable (different from the target shape), the solder joint is evaluated as unacceptable. The inspection result of the inspection device 15 is sent to the controller 16.

[0087] The controller 16 has a control unit 51, a solder joint formation determination unit 52, and a machine learning unit 53.

[0088] The control unit 51 controls the laser head 43. The control unit 51 controls the laser oscillation. The control unit 51 can control the laser irradiation time.

[0089] The solder joint formation determination unit 52 determines whether the solder joint is of acceptable quality based on the image of the paste solder 90 captured by the solder joint camera 45. That is, the solder joint formation determination unit 52 determines whether the shape of the solder joint of the paste solder 90 is of acceptable quality based on the image of the paste solder 90 captured by the solder joint camera 45.

[0090] The machine learning unit 53 generates a learning model that takes an image of the solder paste 90 as input and the quality of the soldering as output. For example, the machine learning unit 53 uses an image of the molten solder paste 90 and the inspection results of the inspection device 15 as teacher data to generate a learning model that takes an image of the molten solder paste 90 as input and the shape of the solder feet of the solder paste 90 as output.

[0091] The solder joint formation determination unit 52 inputs an image of the molten solder 90 (in the state of being irradiated by laser) captured by the solder joint camera 45 into the learning model to determine whether the solder joint is of acceptable quality. That is, based on the image of the molten solder 90 (in the state of being irradiated by laser) and the learning model, the solder joint formation determination unit 52 predicts the shape of the solder joint after the solder 90 cools, and determines whether the predicted shape of the solder joint is of acceptable quality.

[0092] When the solder joint formation determination unit 52 determines that the solder joint is of acceptable quality, the control unit 51 stops the laser irradiation. This suppresses excessive laser irradiation, that is, it suppresses damage to the substrate 1 and prevents a decrease in solder joint quality.

[0093] [Operation of the laser irradiation device]

[0094] The following is an example of the operation of the laser irradiation device 14. Figure 13 This is a flowchart illustrating the operation of the laser irradiation device 14 according to the embodiment. Figure 14 This is a diagram schematically showing the state of the solder pads involved in the implementation method. Figure 14 This is an example of an image used for learning and an image used for determining, as described in the implementation method.

[0095] The welding foot camera 45 is capable of capturing video. The machine learning department 53, from... Figure 14 The video image of the solder paste 90 forming a solder joint, as shown, is extracted, and a label is attached to the extracted image indicating the state of the solder joint (step S1). The labels attached to the image include a label for "before solder joint formation" and a label for "after solder joint formation". For example, the machine learning unit 53 may also attach a "after solder joint formation" label to images that are nearing the end of soldering during normal time management, and a "before solder joint formation" label to images that are earlier than the end time.

[0096] The machine learning unit 53 uses labeled images to perform teacher-led machine learning to generate a learning model (step S2).

[0097] Solder leg formation determination unit 52 will be as follows Figure 14The image of the solder paste 90 captured by the solder foot camera 45, as shown, is input into the learning model, and the state of the solder foot is determined at any time based on the image during soldering. That is, the solder foot formation determination unit 52 uses the learning model to determine at any time whether the solder foot is "before formation" or "after formation" based on the image during soldering (step S3).

[0098] The control unit 51 stops laser oscillation at the moment when the determination result of the solder joint formation determination unit 52 changes from "before formation" to "after formation" (step S4).

[0099] The laser oscillation time during welding is controlled by the actions in steps S3 and S4, thereby welding with minimal heating. The image used for judgment is saved in advance. If the welding is determined to be of unacceptable quality in the inspection device 15 of the subsequent process, the image is relearned by attaching a "before weld formation" label to the image, thereby improving the judgment accuracy.

[0100] Furthermore, when a temperature sensor capable of detecting the temperature of the solder paste 90 (solder foot temperature) and the temperature of the substrate 1 (substrate temperature) is provided in the laser irradiation device 14, in step S4 above, after the determination result of the solder foot formation determination unit 52 changes from "before solder foot formation" to "after solder foot formation", the laser oscillation is stopped after the solder foot temperature exceeds the specified temperature and before the substrate temperature exceeds the specified temperature, thereby improving the reliability of the soldering.

[0101] This application appropriately incorporates the contents disclosed in Japanese Patent Application No. 2023-107900, filed on June 30, 2023.

[0102] Explanation of the label

[0103] 1…Substrate, 1A…Base material, 1B…Film, 1C…Pad, 2…Component, 2A…Main body, 2B…Electrode part, 3…Pad, 4…Support component, 4A…Base part, 4B…Protective part, 4C…Pin part, 4D…Hole, 5…Clamping mechanism, 5A…Support part, 5B…Modible part, 10…Component mounting system, 12…Mounting device, 13…Preheating device, 14…Laser irradiation device, 15…Inspection device, 16…Controller, 18…Base component, 19…Conveying device, 19A…Conveyor belt, 19B…Guiding component, 20…Workbench, 20A…Positioning component, 21…Workbench moving device, 22…Component supply device, 23…Nose, 23A…Shaft, 24…Mounting head, 25…Substrate camera, 26…Height sensor Sensor, 27… Mounting head moving device, 27X… X-axis moving device, 27Y… Y-axis moving device, 28… Nozzle moving device, 29… Chamber, 34… Dispenser, 35… Base component, 36… Conveying device, 36A… Conveyor belt, 36B… Guide component, 37… Heater, 38… Chamber, 39… Base component, 40… Conveying device, 40A… Conveyor belt, 40B… Guide component, 41… Worktable, 42… Worktable moving device, 43… Laser head, 44… Chamber, 45… Solder foot camera, 47… Processor, 48… Main memory, 49… Memory, 50… Interface, 51… Control unit, 52… Solder foot formation determination unit (determination unit), 53… Machine learning unit (learning unit), 90… Solder paste (solder).

Claims

1. A component mounting system, comprising: a mounting head that mounts a component to a solder-applied substrate; a heat ray head that irradiates a heat ray to the solder after the component is mounted; a camera that photographs the solder in parallel with the irradiation of the heat ray; a learning unit that generates a learning model that takes an image of the solder as input and takes a quality of a soldering as output; a determination unit that determines whether the soldering is a good quality or not by inputting the image of the solder photographed by the camera to the learning model; and a control unit that stops the irradiation of the heat ray when the soldering is determined to be a good quality.

2. The component mounting system according to claim 1, wherein the quality of the soldering includes a shape of a solder fillet of the solder, the determination unit determines whether the shape of the solder fillet is a good quality or not.

3. The component mounting system according to claim 2, wherein there is an inspection device that inspects the quality of the soldering, the learning unit generates the learning model using an image of the solder and an inspection result of the inspection device as teacher data. ​

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