Resin composition and application thereof

Abstract

The invention provides a resin composition and application thereof. The resin composition comprises the following components: cyanate ester resin, bismaleimide resin, epoxy resin and nitride filler, based on the total weight of the resin composition being 100%, the content of the cyanate ester resin is 4%-17%, the content of the bismaleimide resin is 2%-12%, and the content of the epoxy resin is 3%-16%; the nitride filler comprises (A) spherical boron nitride, (B) aluminum nitride and / or silicon nitride; the content of the spherical boron nitride is 20-40% by taking the total weight of the nitride filler as 100%. The resin composition provided by the invention has high thermal conductivity, excellent adhesive property and high heat resistance at the same time, and the metal-based copper-clad laminate prepared from the resin composition has excellent comprehensive properties in the aspects of high thermal conductivity, high reliability and high heat resistance.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of copper-clad plates, and particularly relates to a resin composition and application thereof. BACKGROUND

[0002] With the development of electronic products towards high density, multifunction and 'light, thin and small', the power consumption of devices is getting larger and larger, the assembly density and integration of components on the circuit board are getting higher and higher, and the heat emitted by the circuit board per unit area is getting more and more. If the heat dissipation of the substrate is poor, the temperature of the components on the circuit board will be too high, which will reduce the working stability and reliability of the whole machine, and even cause product failure and shorten the service life of the product. In order to ensure the working stability of electronic components, higher requirements are put forward for the heat dissipation of the board material.

[0003] In order to improve the heat dissipation performance of the substrate, high-thermal-conductivity materials are usually introduced in the preparation of the dielectric layer and the copper-clad plate, such as resins with good thermal conductivity, thermal conductive fillers, etc. Since the types of resins with good thermal conductivity are relatively limited and the cost is high, adding thermal conductive fillers is the main method. The thermal conductive fillers currently used in copper-clad plate materials mainly include aluminum oxide, aluminum nitride, boron nitride, boron oxide and silicon carbide. Among them, boron nitride has great potential in thermal conductive materials as a filling material with excellent thermal conductivity. However, boron nitride has a lamellar structure with a large specific surface area, which cannot be filled in resin in large quantities, greatly weakening the ability of boron nitride to improve the thermal conductivity of the composite material. Moreover, the increase in the amount of thermal conductive fillers will also lead to poor adhesion between the glue layer and the copper foil and the metal substrate, thereby weakening the heat resistance, voltage resistance and other properties of the copper-clad plate, and reducing the reliability of the substrate.

[0004] In addition, the current copper-clad plate also has the problem of insufficient heat resistance.

[0005] Therefore, it is an urgent problem in the field to develop a composite material with high thermal conductivity, excellent adhesion and good heat resistance. SUMMARY

[0006] In view of the deficiencies in the prior art, the purpose of the present application is to provide a resin composition and application thereof.

[0007] To achieve the purpose of the application, the following technical solutions are adopted:

[0008] In a first aspect, the present application provides a resin composition, which comprises the following components: cyanate ester resin, bismaleimide resin, epoxy resin and nitride filler.

[0009] The content of the cyanate ester resin is 4% to 17%, for example, can be 4%, 5%, 6%, 7%, 8%, 9%, 10%, 12%, 14%, 15%, 16% or 17%, and the specific point value between the above point values, limited to the length and for the sake of simplicity, the present invention will not be exhaustive listing the specific point values included in the range, the content of the bismaleimide resin is 2% to 12%, for example, can be 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10% or 12%, and the specific point value between the above point values, limited to the length and for the sake of simplicity, the present invention will not be exhaustive listing the specific point values included in the range, the content of the epoxy resin is 3% to 16%, for example, can be 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 12%, 14%, 15% or 16%, and the specific point value between the above point values, limited to the length and for the sake of simplicity, the present invention will not be exhaustive listing the specific point values included in the range;

[0010] The nitride filler comprises: (A) spherical boron nitride, (B) aluminum nitride and / or silicon nitride;

[0011] The content of the spherical boron nitride is 20% to 40%, for example, can be 20%, 22%, 24%, 25%, 26%, 28%, 30%, 32%, 34%, 35%, 36%, 38% or 40%, and the specific point value between the above point values, limited to the length and for the sake of simplicity, the present invention will not be exhaustive listing the specific point values included in the range.

[0012] The resin composition provided by the present application, by the complex of specific types of resin components and the control of the amount of each resin component, and by controlling the spherical boron nitride to be added and limiting its amount in a specific range, the nitride filler has a high filling ratio in the epoxy resin, and finally the resin composition has high thermal conductivity, excellent bonding performance and high heat resistance, so that the metal-based copper-clad laminate has excellent comprehensive performance in high thermal conductivity, high reliability and high heat resistance.

[0013] Preferably, the cyanate ester resin comprises any one of bisphenol A type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol M type cyanate ester resin, phenolic type cyanate ester resin or a combination of at least two.

[0014] Preferably, the structure of the bismaleimide resin is shown as formula I:

[0015] ;

[0016] In formula I, M is an aliphatic group or an aromatic group with m valence, Xaand Xbare each independently selected from any one of a hydrogen atom, a halogen atom, and an aliphatic group, and m is an integer of ≥2 (e.g., 2, 3, 4, 5, etc.);

[0017] Preferably, in formula I, M is selected from any one of

[0018] and wherein a is a positive integer of 1-20 (e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 14, 16, 18, 20, etc.), R 17 -R 21 is a phenyl group or an alkyl group with a carbon number of 1-4 (e.g., 1, 2, 3, or 4), represents the access position of the group.

[0019] Preferably, the epoxy resin comprises any one of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol epoxy resin, a phosphorus-containing epoxy resin, an isocyanate-modified epoxy resin, a phenolic aldehyde epoxy resin, a biphenyl epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene-containing epoxy resin, an alicyclic epoxy resin, a brominated epoxy resin, or a combination of at least two thereof.

[0020] Preferably, the isocyanate-modified epoxy resin comprises an MDI (diphenylmethane diisocyanate)-modified epoxy resin.

[0021] Preferably, the average particle size of the spherical boron nitride is 10-50 μm, which can be, for example, 10 μm, 12 μm, 13 μm, 15 μm, 16 μm, 18 μm, 20 μm, 22 μm, 23 μm, 25 μm, 26 μm, 28 μm, 30 μm, 32 μm, 33 μm, 35 μm, 36 μm, 38 μm, 40 μm, 42 μm, 43 μm, 45 μm, 46 μm, 48 μm, or 50 μm, and specific point values between the above point values. Due to the limitation of the length and for the sake of simplicity, the present application does not list all the specific point values included in the range.

[0022] In the present application, the average particle size can be understood as the D 50 The particle size and related data of the particle size can be tested by using a MS3000 Malvern laser particle size analyzer.

[0023] Preferably, the shape of the aluminum nitride is a spherical particle.

[0024] Preferably, the average particle size of the aluminum nitride is 1 to 50 μm, for example, it can be 1 μm, 2 μm, 3 μm, 5 μm, 6 μm, 8 μm, 10 μm, 12 μm, 13 μm, 15 μm, 16 μm, 18 μm, 20 μm, 22 μm, 23 μm, 25 μm, 26 μm, 28 μm, 30 μm, 32 μm, 33 μm, 35 μm, 36 μm, 38 μm, 40 μm, 42 μm, 43 μm, 45 μm, 46 μm, 48 μm, or 50 μm, and specific point values between the above point values, limited to the length and for the sake of simplicity, the present application will not be exhaustive to enumerate the specific point values included in the range, preferably 10 to 40 μm.

[0025] Preferably, the shape of the silicon nitride is a spherical particle.

[0026] Preferably, the average particle size of the silicon nitride is 1 to 30 μm, for example, it can be 1 μm, 2 μm, 3 μm, 5 μm, 6 μm, 8 μm, 10 μm, 12 μm, 13 μm, 15 μm, 16 μm, 18 μm, 20 μm, 22 μm, 23 μm, 25 μm, 26 μm, 28 μm, or 30 μm, and specific point values between the above point values, limited to the length and for the sake of simplicity, the present application will not be exhaustive to enumerate the specific point values included in the range.

[0027] Preferably, the content of the nitride filler is 50% to 90% based on 100% of the total weight of the resin composition, for example, it can be 50%, 52%, 54%, 55%, 56%, 58%, 60%, 62%, 64%, 65%, 66%, 68%, 70%, 72%, 74%, 75%, 76%, 78%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, or 90%, and specific point values between the above point values, limited to the length and for the sake of simplicity, the present application will not be exhaustive to enumerate the specific point values included in the range.

[0028] Preferably, the resin composition further includes a curing agent.

[0029] Preferably, the curing agent includes any one of a phenol resin, a cyanate ester resin, an active ester, a polyphenyl ether resin, a maleimide resin, an acid anhydride curing agent, an amine curing agent, a benzoxazine resin, or a combination of at least two thereof.

[0030] Preferably, the phenol resin includes any one of a bisphenol A type phenol resin, a phosphorus-containing phenol resin, a phenol type phenol resin, a biphenyl type phenol resin, a dicyclopentadiene type phenol resin, a naphthalene-containing phenol resin, or a combination of at least two thereof.

[0031] Preferably, the amine curing agent comprises 4,4'-diaminodiphenyl sulfone (DDS).

[0032] Preferably, the content of the curing agent is 1% to 5%, for example, 1%, 2%, 3%, 4% or 5%, and specific point values between the above point values, limited by the length and for the sake of simplicity, the present application does not exhaustively list the specific point values included in the range.

[0033] Preferably, the resin composition further comprises a toughening resin.

[0034] Preferably, the toughening resin comprises any one or a combination of at least two of a phenolic oxygen resin, a carboxyl rubber, a carboxyl rubber modified epoxy, a polybutadiene, a polybutadiene modified epoxy, a polyphenyl ether, a polyphenyl ether modified epoxy, an acrylate rubber, an acrylate rubber modified epoxy, a core-shell rubber, a core-shell rubber toughened epoxy resin, a fatty chain toughened epoxy resin, or an acrylic toughened epoxy resin, wherein a typical but non-limiting combination comprises a combination of a phenolic oxygen resin and a carboxyl rubber, a combination of a carboxyl rubber modified epoxy, a polybutadiene, a polybutadiene modified epoxy and a polyphenyl ether, a combination of a polyphenyl ether modified epoxy, an acrylate rubber, an acrylate rubber modified epoxy, a core-shell rubber and a core-shell rubber toughened epoxy resin, a combination of a core-shell rubber, a core-shell rubber toughened epoxy resin, a fatty chain toughened epoxy resin, an acrylic toughened epoxy resin, and the like.

[0035] Preferably, the content of the toughening resin is 1% to 5%, for example, 1%, 2%, 3%, 4% or 5%, and specific point values between the above point values, limited by the length and for the sake of simplicity, the present application does not exhaustively list the specific point values included in the range.

[0036] Preferably, the resin composition further comprises an accelerator.

[0037] Preferably, the accelerator comprises any one or a combination of at least two of an imidazole compound, an organic complex, a tertiary amine, a tertiary phosphine, a quaternary ammonium salt, and further preferably an imidazole compound.

[0038] It should be noted that the imidazole compound as an accelerator can simultaneously play the roles of curing the epoxy resin and accelerating the curing.

[0039] Preferably, the imidazole compound comprises any one or a combination of at least two of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 2-isopropylimidazole, 2-phenyl-4-methylimidazole, 2-dodecylimidazole, 1-cyanoethyl-2-methylimidazole.

[0040] Preferably, the organic complex comprises cobalt acetylacetonate.

[0041] Preferably, the mass percentage of the accelerator in the resin composition is ≤8%, for example, it can be 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%, 0.1%, or 0.01%, and the specific point values between the above-mentioned point values, limited by the length and for the sake of simplicity, the present application will not list the specific point values included in the range, preferably 0.01% to 6%.

[0042] Preferably, the resin composition further comprises any one or a combination of at least two of other fillers, flame retardants, coupling agents.

[0043] Preferably, the other fillers include any one or a combination of at least two of aluminum oxide, beryllium oxide, silicon dioxide, titanium dioxide, barium titanate, strontium titanate, magnesium titanate, calcium titanate, strontium barium titanate, barium calcium titanate, lead titanate, lead zirconium titanate, lead lanthanum zirconium titanate, barium lanthanum titanate, barium zirconium titanate, hafnium dioxide, lead magnesium niobate, barium magnesium niobate, lithium niobate, potassium niobate, strontium aluminum tantalate, potassium tantalum niobate, barium strontium niobate, barium lead niobate, barium titanium niobate, bismuth strontium tantalate, bismuth titanate, barium rubidium titanate, copper titanate, lead titanate-lead magnesium niobate.

[0044] Preferably, the average particle size (D 50 The particle size is 0.01 to 50 μm, for example, it can be 0.05 μm, 0.1 μm, 0.5 μm, 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, and the specific point values between the above-mentioned point values, limited by the length and for the sake of simplicity, the present application will not list the specific point values included in the range, further preferably 0.01 to 30 μm, more preferably 0.01 to 10 μm.

[0045] Preferably, the content of the other fillers is ≤20% based on the total weight of the resin composition, for example, it can be 0, 0.1%, 0.5%, 1%, 2%, 3%, 4%, 5%, 6%, 8%, 10%, 12%, 14%, 15%, 16%, or 18%, and the specific point values between the above-mentioned point values, limited by the length and for the sake of simplicity, the present application will not list the specific point values included in the range.

[0046] The resin composition can further comprise a solvent, and the amount of the solvent added is selected by a person skilled in the art according to experience and process requirements, so that the resin composition reaches a suitable viscosity for use, so as to facilitate the impregnation, coating, etc. of the resin composition. Subsequently, in the drying, semi-curing or complete curing stage, the solvent in the resin composition will partially or completely volatilize.

[0047] The "parts" and "weight parts" in the present application are calculated based on the solid content, excluding solvents, dispersants and the like.

[0048] In another aspect, the present application provides a resin glue solution, which comprises the resin composition according to the first aspect and a solvent.

[0049] Exemplarily, the solvent comprises any one or a combination of at least two of ketone solvents, alcohol solvents, aromatic hydrocarbon solvents, ester solvents, nitrogen-containing solvents.

[0050] As the solvent of the present application, there is no particular limitation, and generally, ketones such as acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, aromatic hydrocarbons such as toluene, xylene, mesitylene, esters such as ethyl acetate, butyl acetate, ethoxyethyl acetate, alcohols such as methanol, ethanol, butanol, glycol ethers such as ethyl cellosolve, butyl cellosolve, ethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, carbitol, butyl carbitol, nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone can be used. The solvent can be used alone or in combination of two or more.

[0051] The resin composition provided by the present application can be prepared by a method comprising mixing and uniformly dispersing the components of the resin composition to obtain the resin composition.

[0052] In a second aspect, the present application provides a prepreg, which comprises a reinforcing material and the resin composition according to the first aspect attached to the reinforcing material.

[0053] Preferably, the resin composition is attached to the reinforcing material after impregnation and drying.

[0054] Exemplarily, the prepreg is prepared by impregnating the reinforcing material with a resin glue solution of the resin composition, and then drying to obtain the prepreg.

[0055] Preferably, the temperature of the drying is 100-180°C, for example, it can be 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, 150°C, 155°C, 160°C, 165°C, 170°C or 175°C, and specific point values between the above point values, limited by the length and for the sake of simplicity, the present application does not exhaustively list the specific point values included in the range, and further preferably 115-175°C.

[0056] Preferably, the drying time is 1 to 30 minutes, for example, 2 minutes, 5 minutes, 8 minutes, 10 minutes, 15 minutes, 20 minutes, or 25 minutes, and specific point values between the above-mentioned point values, the present application does not exhaustively list the specific point values included in the range for the sake of brevity and simplicity, and further preferably 2 to 15 minutes.

[0057] In a third aspect, the present application provides a thermally conductive resin film, a material of the thermally conductive resin film comprising the resin composition according to the first aspect.

[0058] Preferably, the thermally conductive resin film is prepared by drying and / or semi-curing the resin composition coated on a release material.

[0059] Further, the present application also provides a thermally conductive paste, the thermally conductive paste comprising the resin composition according to the first aspect.

[0060] In another aspect, the present application provides a resin-coated copper foil, the resin-coated copper foil comprising a copper foil layer and a resin layer, a material of the resin layer comprising the resin composition according to the first aspect.

[0061] Preferably, the resin-coated copper foil is prepared by drying and / or semi-curing the resin composition coated on a copper foil.

[0062] In a fourth aspect, the present application provides a metal-clad laminate, the metal-clad laminate comprising a metal foil, and at least one of the prepreg according to the second aspect, or the thermally conductive resin film according to the third aspect.

[0063] In a fifth aspect, the present application provides a metal-based copper-clad laminate, the metal-based copper-clad laminate comprising a metal-based layer, an insulating resin layer, and a copper foil layer, the insulating resin layer being disposed between the metal-based layer and the copper foil layer, the insulating resin layer being prepared from the resin composition according to the first aspect.

[0064] Preferably, the metal-based of the metal-based layer is an aluminum plate, a copper plate, an iron plate, or a stainless steel plate.

[0065] Preferably, the metal foil in the metal-clad laminate comprises any one of a copper foil, an aluminum foil, a nickel foil, an alloy foil, or a combination of at least two of them.

[0066] Preferably, the metal foil is a copper foil, and the metal-clad laminate is a copper-clad laminate.

[0067] Preferably, the number of prepregs in the metal-clad laminate is 1-20, for example, 2, 3, 5, 7, 9, 10, 11, 13, 15, 17, or 19, and specific point values between the above-mentioned point values, the specific point values included in the range are not listed exhaustively due to the limited space and for the sake of simplicity.

[0068] Preferably, the method for preparing the metal-clad laminate comprises: pressing a metal foil on one side or both sides of a prepreg, curing to obtain the metal-clad laminate; or, laminating at least two prepregs into a laminate, then pressing a metal foil on one side or both sides of the laminate, curing to obtain the metal-clad laminate.

[0069] Preferably, the curing is performed in a press.

[0070] Preferably, the curing temperature is 170-280℃, for example, 180℃, 190℃, 200℃, 210℃, 220℃, 230℃, 240℃, 250℃, 260℃, or 270℃, and specific point values between the above-mentioned point values, the specific point values included in the range are not listed exhaustively due to the limited space and for the sake of simplicity.

[0071] Preferably, the curing pressure is 1-10MPa, for example, 1.5MPa, 2MPa, 3MPa, 4MPa, 5MPa, 6MPa, 7MPa, 8MPa, or 9MPa, and specific point values between the above-mentioned point values, the specific point values included in the range are not listed exhaustively due to the limited space and for the sake of simplicity.

[0072] Preferably, the curing time is 30-300min, for example, 40min, 50min, 60min, 80min, 100min, 120min, 150min, 180min, 200min, 220min, 240min, 260min, or 280min, and specific point values between the above-mentioned point values, the specific point values included in the range are not listed exhaustively due to the limited space and for the sake of simplicity.

[0073] In a sixth aspect, the present application provides a printed circuit board, which comprises at least one of the prepreg according to the second aspect, the thermally conductive resin film according to the third aspect, the metal-clad laminate according to the fourth aspect, or the metal-based copper-clad laminate according to the fifth aspect.

[0074] Compared with the prior art, the present application has the following beneficial effects:

[0075] The resin composition provided by the application has high filling ratio of nitride filler in the epoxy resin by compounding specific types of resin components, controlling the amount of each resin component, controlling the spherical shape of the added boron nitride, and limiting the amount of the boron nitride within a specific range, so that the resin composition has high thermal conductivity, excellent adhesive property, and high heat resistance, thereby achieving excellent comprehensive performance of the metal-based copper-clad laminate in terms of high thermal conductivity, high reliability, and high heat resistance. DETAILED DESCRIPTION

[0076] The technical solutions of the application are further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only used to help understand the application and should not be regarded as specific limitations on the application.

[0077] The raw materials used in the following examples and comparative examples are as follows:

[0078]

[0079] Example 1

[0080] A resin composition, specific components and amounts (parts by weight) of the resin composition are shown in Table 1.

[0081] An aluminum-based copper-clad plate containing the resin composition is prepared by the following method:

[0082] (1) The components of the resin composition are mixed with a solvent (glycol methyl ether) according to the formulation amount, uniformly dispersed at room temperature, and prepared into a glue solution with a solid content of 75%; the glue solution is uniformly coated using a coating device and copper foil as a coating medium, and placed in an oven at 155°C for 5 min to obtain a copper foil coated with glue;

[0083] (2) The copper foil coated with glue is laminated on an aluminum plate in a hot press at 210°C and 5 MPa for 2 h to obtain the aluminum-based copper-clad plate.

[0084] The aluminum-based copper-clad plate is tested for performance according to the following method:

[0085] (1) Thermal conductivity: the thermal conductivity of the plate is tested according to the test method in standard ASTM-D5470;

[0086] (2) Peel strength: the peel strength of the plate is tested according to the test conditions in IPC-TM-650 2.4.8 method;

[0087] (3) Glass transition temperature (Tg): the Tg value of the DSC of the plate is tested according to the test conditions in IPC-TM-650-2.4.25D method.

[0088] The performance test data are shown in Table 1.

[0089] Example 2-3, Comparative Example 1-9

[0090] A resin composition and an aluminum-based copper-clad plate comprising the same, which are different from Example 1 in that the formula of the resin composition is different, and specifically as shown in Table 1 and Table 2; wherein the amount of each component is in units of "parts by weight"; the preparation method of the aluminum-based copper-clad plate and the performance test method are the same as those of Example 1.

[0091] Table 1

[0092]

[0093] Table 2

[0094]

[0095] As can be seen from Table 1, the aluminum-based copper-clad plates prepared by using the resin composition provided by the application all have high thermal conductivity, high peel strength (0.93-1.02 N / mm) and high Tg (224-270℃), and have excellent comprehensive performance.

[0096] Compared with Example 1, the filler in Comparative Example 1 is too little, and the thermal conductivity and Tg of the aluminum-based copper-clad plate are both significantly decreased.

[0097] Compared with Example 2, the filler in Comparative Example 2 is too much, and it cannot be prepared into a qualified product, and cannot be tested.

[0098] Compared with Example 2, no cyanate ester resin is added in Comparative Example 3, and the Tg of the aluminum-based copper-clad plate is greatly reduced.

[0099] Compared with Example 1, the cyanate ester resin in Comparative Example 4 is too much, and the peel strength of the aluminum-based copper-clad plate is significantly reduced.

[0100] Compared with Example 2, no bismaleimide resin is added in Comparative Example 5, and the thermal conductivity of the aluminum-based copper-clad plate is reduced, and the Tg is greatly reduced.

[0101] Compared with Example 1, the bismaleimide resin in Comparative Example 6 is too much, and the peel strength of the aluminum-based copper-clad plate is significantly reduced.

[0102] Compared with Example 1, the spherical boron nitride in Comparative Example 7 is replaced with an equal amount of aluminum oxide particles, and the thermal conductivity of the aluminum-based copper-clad plate is significantly reduced.

[0103] Compared with Example 2, the spherical boron nitride in Comparative Example 8 is too much, and it cannot be prepared into a qualified product, and cannot be tested.

[0104] Compared with Example 1, in Comparative Example 9, spherical boron nitride is replaced with an equivalent amount of flaky boron nitride, and the thermal conductivity and peel strength of the aluminum-based copper-clad plate are both reduced.

[0105] The applicant states that the resin composition of the present application and the application thereof are illustrated by the above examples, but the present application is not limited to the above examples, i.e. it does not mean that the present application must rely on the above examples to be implemented. It should be understood by those skilled in the art that any improvement of the present application, equivalent replacement of the raw materials selected by the present application, addition of auxiliary ingredients, selection of specific modes, etc. fall within the protection scope and disclosure scope of the present application.

Claims

1. A resin composition, characterized in that, The resin composition comprises the following components: cyanate ester resin, bismaleimide resin, epoxy resin, and nitride filler; Based on the total weight of the resin composition (100%), the content of the cyanate ester resin is 4% to 17%, the content of the bismaleimide resin is 2% to 12%, and the content of the epoxy resin is 3% to 16%. The nitride filler includes: (A) spherical boron nitride, (B) aluminum nitride and / or silicon nitride; Based on the total weight of the nitride filler as 100%, the content of the spherical boron nitride is 20% to 40%.

2. The resin composition according to claim 1, characterized in that, The cyanate resin includes any one or a combination of at least two of bisphenol A cyanate resin, bisphenol F cyanate resin, bisphenol M cyanate resin, and phenolic cyanate resin. Preferably, the bismaleimide resin has the structural formula shown in Formula I: ； In Formula I, M is an aliphatic or aromatic group with an m valence, Xa and Xb are each independently selected from any one of hydrogen atoms, halogen atoms and aliphatic groups, and m is an integer ≥2. Preferably, in formula I, M is selected from... and Any one of the following; where a is a positive integer from 1 to 20, R 17 -R 21 It is a phenyl group or an alkyl group having 1-4 carbon atoms. The location where the representative group is attached; Preferably, the epoxy resin includes any one or a combination of at least two of the following: bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic resin, phosphorus-containing epoxy resin, isocyanate-modified epoxy resin, phenolic epoxy resin, biphenyl epoxy resin, dicyclopentadiene type epoxy resin, naphthalene-containing epoxy resin, alicyclic epoxy resin, and brominated epoxy resin.

3. The resin composition according to claim 1 or 2, characterized in that, The average particle size of the spherical boron nitride is 10~50μm; Preferably, the aluminum nitride is in the shape of spherical particles; Preferably, the aluminum nitride has an average particle size of 1~50 μm, more preferably 10~40 μm; Preferably, the silicon nitride is in the shape of spherical particles; Preferably, the average particle size of the silicon nitride is 1~30 μm; Preferably, the nitride filler content is 50% to 90% based on the total weight of the resin composition (100%).

4. The resin composition according to any one of claims 1-3, characterized in that, The resin composition also includes a curing agent; Preferably, the curing agent comprises any one or a combination of at least two of phenolic resin, cyanate ester resin, reactive ester, polyphenylene ether resin, maleimide resin, acid anhydride curing agent, amine curing agent, and benzoxazine resin; Preferably, the phenolic resin includes any one or a combination of at least two of the following: bisphenol A type phenolic resin, phosphorus-containing phenolic resin, phenolic resin, biphenyl type phenolic resin, dicyclopentadiene type phenolic resin, and naphthol-containing phenolic resin. Preferably, the content of the curing agent is 1% to 5% based on the total weight of the resin composition (100%).

5. The resin composition according to any one of claims 1-4, characterized in that, The resin composition also includes a toughening resin; Preferably, the toughening resin content is 1% to 5% based on the total weight of the resin composition (100%). Preferably, the resin composition further includes an accelerator; Preferably, the accelerator comprises any one or a combination of at least two of imidazole compounds, organic complexes, tertiary amines, tertiary phosphine, and quaternary ammonium salts, with imidazole compounds being more preferred; Preferably, the imidazole compound includes any one or a combination of at least two of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 2-isopropylimidazole, 2-phenyl-4-methylimidazole, 2-dodecylimidazole, and 1-cyanoethyl-2-methylimidazole; Preferably, the accelerator in the resin composition has a mass percentage content of ≤8%; Preferably, the resin composition further includes any one or a combination of at least two of other fillers, flame retardants, and coupling agents.

6. A prepreg, characterized in that, The prepreg comprises a reinforcing material and a resin composition as described in any one of claims 1-5 attached to the reinforcing material; Preferably, the resin composition is attached to the reinforcing material after impregnation and drying.

7. A thermally conductive resin film, characterized in that, The material of the thermally conductive resin film includes the resin composition as described in any one of claims 1-5; Preferably, the thermally conductive resin film is prepared by coating the resin composition onto a release material and then drying and / or semi-curing it.

8. A metal foil-coated laminate, characterized in that, The metal foil laminate includes a metal foil and at least one of the prepreg as described in claim 6 and the thermally conductive resin film as described in claim 7.

9. A metal-based copper-clad laminate, characterized in that, The metal-based copper-clad laminate includes a metal base layer, an insulating resin layer, and a copper foil layer, wherein the insulating resin layer is disposed between the metal base layer and the copper foil layer, and the insulating resin layer is prepared from the resin composition as described in any one of claims 1-5; Preferably, the metal base of the metal substrate is an aluminum plate, copper plate, iron plate or stainless steel plate.

10. A printed circuit board, characterized in that, The printed circuit board includes at least one of the prepreg as described in claim 6, the thermally conductive resin film as described in claim 7, the metal foil laminate as described in claim 8, and the metal-based copper foil laminate as described in claim 9.

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