Chip on film, display module and display device

Abstract

The invention relates to a chip on film which comprises a main body area, a first binding area and a second binding area, the first binding area and the second binding area are located on the first side of the main body area in the first direction, and the first binding area and the second binding area are oppositely arranged; a plurality of first binding terminals are arranged on one surface, facing the second binding area, of the first binding area; a plurality of second binding terminals are arranged on the face, facing the first binding area, of the second binding area. The invention further relates to a display module and a display device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display product manufacturing, and in particular to a COF (Chip On Film), a display module and a display device. BACKGROUND

[0002] With the increasing demand for high-quality / high-resolution in medium and large-sized NB / vehicle-mounted products, the number of product PIN (Pin) lines increases, but the PIN line layout area of the product is limited, so the PIN Pitch becomes narrower, from the conventional > 28um to <= 24um, and the minimum design value is currently 19um. After the Pad Cu process of the OLED product, the carbonized debris generated by the laser causes the PIN to overlap between the PINs, and the dark line and other defects increase by >= 10%, and the yield loss is >= 1.5%. SUMMARY

[0003] To solve the above technical problems, the present application provides a COF (Chip On Film), a display module and a display device, which solve the problem of small distance between adjacent pins affecting product yield.

[0004] To achieve the above purpose, the technical scheme adopted by the embodiments of the present application is as follows: a COF (Chip On Film) includes a main body area and a first binding area and a second binding area located on the first side of the main body area along a first direction, the first binding area and the second binding area are oppositely arranged.

[0005] One side of the first binding area facing the second binding area is provided with a plurality of first binding terminals;

[0006] One side of the second binding area facing the first binding area is provided with a plurality of second binding terminals.

[0007] Optionally, the distance between two adjacent first binding terminals is greater than or equal to 30um, and the distance between two adjacent second binding terminals is greater than or equal to 30um.

[0008] Optionally, a plurality of first binding terminals are arranged at intervals in a second direction, and the second direction is perpendicular to the first direction.

[0009] A plurality of second binding terminals are arranged at intervals in a second direction, and the second direction is perpendicular to the first direction.

[0010] The orthographic projection of the first binding terminal on the second binding area is located between two adjacent second binding terminals, or the orthographic projection of the first binding terminal on the second binding area at least partially overlaps the corresponding second binding terminal.

[0011] Optionally, a first connecting line is arranged on the main body area, the first connecting line extends to the first binding area and is connected with the first binding terminal;

[0012] A second connecting line is arranged on the main body area, the second connecting line extends to the second binding area and is connected with the second binding terminal;

[0013] The first connecting line is arranged on a first part of the main body area and the second connecting line is arranged on a second part of the main body area in the same layer or in different layers.

[0014] Optionally, a first transition area is arranged between the main body area and the first binding area, a second transition area is arranged between the main body area and the second binding area, and the first transition area, the second transition area and the main body area form a Y-shaped structure.

[0015] Optionally, a first alignment mark for alignment with the display panel is arranged on the first binding area and / or the second binding area.

[0016] Optionally, a first conductive adhesive is arranged on a side of the first binding area facing the second binding area, a first protective film is arranged on a side of the first conductive adhesive away from the first binding area, and the first conductive adhesive at least partially overlaps each of the first terminals.

[0017] A second conductive adhesive is arranged on a side of the second binding area facing the first binding area, a first protective film is arranged on a side of the second conductive adhesive away from the second binding area, and the second conductive adhesive at least partially overlaps each of the second terminals.

[0018] Embodiments of the present application also provide a display module, comprising a display panel and the above-described COF.

[0019] The display panel comprises a display area and a third binding area arranged on a side of the display area, and the third binding area is provided with a plurality of third binding terminals.

[0020] The display panel further comprises a display surface and a back surface arranged oppositely, the third binding area comprises a first sub-binding area on the display surface and a second sub-binding area on the back surface, and the third binding terminals comprise a plurality of first sub-binding terminals on the first sub-binding area and a plurality of second sub-binding terminals on the second sub-binding area.

[0021] The first sub-binding terminals are used for binding connection with the first binding terminals, and the second sub-binding terminals are used for binding connection with the second binding terminals.

[0022] Optionally, a distance between two adjacent first sub-bonding terminals is greater than or equal to 30 um, and a distance between two adjacent second sub-bonding terminals is greater than or equal to 30 um.

[0023] Optionally, a back surface of the display panel is provided with a back film, and a direct projection of the back film on the display panel is located at one side of the third bonding area.

[0024] Optionally, a gap is formed between a direct projection of the back film on the display panel and a direct projection of the COF on the display panel.

[0025] Optionally, the gap between the COF and the display panel is filled with a protective adhesive layer.

[0026] Optionally, a back surface of the display panel is provided with a back film, and the protective adhesive layer extends to form an extension part close to the display area, and a direct projection of the extension part on the display panel and a direct projection of the back film on the display panel are adjacent.

[0027] Optionally, the protective adhesive layer is made of acrylate.

[0028] Embodiments of the present application also provide a display device comprising the display module.

[0029] The present application has the advantages that the COF comprises a main area and first and second bonding areas located at a first side of the main area, and the first and second bonding areas are oppositely arranged. The display panel is provided with bonding terminals on both sides of the bonding area to be connected with the first and second bonding areas of the COF, respectively, so as to increase the space for arranging the bonding terminals on the display panel, and further increase the distance between adjacent bonding terminals, increase the space for arranging the bonding terminals of the COF, and further increase the distance between adjacent bonding terminals, thereby solving the problem of reducing product yield due to the small distance between adjacent bonding terminals. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 A schematic diagram of a COF in the related art is shown;

[0031] Figure 2 A schematic diagram of a COF in an embodiment of the present application is shown;

[0032] Figure 3 A schematic diagram of a display module in the related art is shown;

[0033] Figure 4 A schematic diagram of a display module in an embodiment of the present application is shown;

[0034] Figure 5FIG. 1 is a schematic diagram of a display module according to an embodiment of the present application;

[0035] Figure 6 FIG. 2 is a schematic diagram of a COF according to an embodiment of the present application;

[0036] Figure 7 FIG. 3 is a schematic diagram of a COF according to an embodiment of the present application. DETAILED DESCRIPTION

[0037] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present disclosure.

[0038] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which the present disclosure pertains. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. Similarly, the terms "one", "a", or "the" and similar terms do not denote a quantity restriction, but mean that at least one exists. The terms "include", "comprise", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms do not mean a physical or mechanical connection, but can include an electrical connection, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships can also change accordingly.

[0039] Reference Figure 1 and Figure 3 In the related art, the display panel is bound to the COF, the COF is a single-layer structure, and the binding terminals are arranged on only one side of the display panel. However, with the increasing market demand for high-quality / high-resolution products in the medium and large size NB / vehicle-mounted product market, the number of product PIN lines increases, so the PIN pitch becomes narrower. After the Pad Cu process of the OLED product, the carbonized debris generated by the laser causes the PIN to overlap between the PINs, and the dark line and other defects increase by ≥10%, the yield loss is ≥1.5%, and the product cost increases.

[0040] Reference Figure 2 andFigure 5 To solve the above problems, the embodiment provides a chip on film, comprising a main body area 1 and a first binding area 2 and a second binding area 3 located on the first side of the main body area 1 along a first direction (reference Figure 2 X direction) in the main body area 1, the first binding area 2 and the second binding area 3 are oppositely arranged;

[0041] One side of the first binding area 2 towards the second binding area 3 is provided with a plurality of first binding terminals 21;

[0042] One side of the second binding area 3 towards the first binding area 2 is provided with a plurality of second binding terminals 31.

[0043] By using the above scheme, the chip on film comprises a double-layered part, that is, the first binding area 2 and the second binding area 3 are oppositely arranged, and the display panel 101 to be bound and connected is provided with a double-sided binding area to be bound and connected with the first binding area 2 and the second binding area 3 respectively. In this way, the concentrated binding terminals are layered, the spacing between the corresponding adjacent two binding terminals is increased, and the problem of dark line defects caused by small spacing between adjacent binding terminals is solved.

[0044] In an exemplary embodiment, the distance between the two adjacent first binding terminals 21 is greater than or equal to 30um, and the distance between the two adjacent second binding terminals 31 is greater than or equal to 30um.

[0045] It should be noted that, in the prior art, all binding terminals are concentrated in one binding area. In the embodiment, the first binding area 2 and the second binding area 3 are provided, the setting space of the binding terminals is increased, all terminals are dispersedly arranged on the first binding area 2 and the second binding area 3, the distance between the two adjacent binding terminals (including the first binding terminal 21 and the second binding terminal 31) is increased, the number of the first binding terminals 21 and the number of the second binding terminals 31 can be the same or different. In some embodiments, the number of the first binding terminals and the number of the second binding terminals 31 are the same, so that the spacing between the two adjacent first binding terminals 21 and the spacing between the two adjacent second binding terminals 31 are both in the maximum state, but it is not limited thereto.

[0046] In an exemplary embodiment, a plurality of first binding terminals 21 are spaced apart in a second direction, and the second direction is perpendicular to the first direction;

[0047] A plurality of second binding terminals 31 are spaced apart in a second direction, and the second direction is perpendicular to the first direction;

[0048] The orthogonal projection of the first binding terminal 21 on the second binding area 3 is located between two adjacent second binding terminals 31, or the orthogonal projection of the first binding terminal 21 on the second binding area 3 at least partially overlaps with the corresponding second binding terminal 31.

[0049] In some embodiments, in order to facilitate alignment, the orthogonal projection of the first binding terminal 21 on the second binding area 3 completely coincides with the corresponding second binding terminal 31.

[0050] In an exemplary embodiment, a first connection line is provided on the main body area 1, the first connection line extends to the first binding area 2 and is connected with the first binding terminal 21;

[0051] A second connection line is provided on the main body area 1, the second connection line extends to the second binding area 3 and is connected with the second binding terminal 31;

[0052] The first connection line is provided on a first part of the main body area 1 and the second connection line is provided on a second part of the main body area 1 in the same layer or in different layers.

[0053] In an exemplary embodiment, the first connection line is provided on the first part of the main body area 1 and the second connection line is provided on the second part of the main body area 1 in different layers. Specifically, referring to Figure 7 The main body area 1 includes a first substrate layer, a first trace layer 301 and a second trace layer 302 located on opposite sides of the first substrate layer, an insulating layer is provided on the side of the first trace layer 301 away from the first substrate layer, and an insulating layer is provided on the side of the second trace layer 302 away from the first substrate layer. The first binding area includes a second substrate layer, a third trace layer 303 and an insulating layer which are sequentially stacked, the third trace layer 303 is provided in the same layer as the first trace layer 301, and a copper exposure area is provided on the side of the first binding area close to the second binding area to form the first binding terminal. The second binding area includes a third substrate layer, a fourth trace layer 304 and an insulating layer which are sequentially stacked, the fourth trace layer 304 is provided in the same layer as the second trace layer 302, and a copper exposure area is provided on the side of the second binding area close to the first binding area to form the second binding terminal.

[0054] In an exemplary embodiment, the first connection line is provided on the first part of the main body area 1 and the second connection line is provided on the second part of the main body area 1 in the same layer. Specifically, referring to Figure 6The main body area 1 includes an insulating layer, a fifth trace layer 201 and an insulating layer which are sequentially stacked. The first binding area includes a second substrate layer, a third trace layer 202 and an insulating layer which are sequentially stacked, the third trace layer 202 is provided in the same layer as the fifth trace layer 201, and a copper-exposed area is provided on the side of the first binding area close to the second binding area to form the first binding terminal. The second binding area includes a third substrate layer, a fourth trace layer 203 and an insulating layer which are sequentially stacked, the fourth trace layer 203 is provided in the same layer as the fifth trace layer 201, and a copper-exposed area is provided on the side of the second binding area close to the first binding area to form the second binding terminal. In this embodiment, the main body area 1 is provided with a plurality of first connection lines and a plurality of second connection lines, and the parts of the plurality of first connection lines on the main body area 1 and the parts of the plurality of second connection lines on the main body area 1 can be staggered, for example, if the connection lines on the main body area are numbered in order from 1 to n (n>2), then the plurality of first connection lines are numbered as odd numbers 1, 3, 5, etc., and the plurality of second connection lines are numbered as even numbers 2, 4, 6, etc., but this is not limited thereto.

[0055] For example, the first binding area 2 and the second binding area 3 are used for binding connection with the corresponding binding areas on the display panel 101, the first binding area 2 and the second binding area 3 are located on the same side of the main body area 1, therefore the first connection lines connected with the first binding terminal 21 are provided to extend from the first binding terminal 21 to the main body area 1, the second connection lines connected with the second binding terminal 31 are provided to extend from the second binding terminal 31 to the main body area 1, and the extension directions of the first connection lines and the second connection lines are substantially parallel.

[0056] In an exemplary embodiment, the main body area 1 and the first binding area 2 are provided with a first transition area 4, the main body area 1 and the second binding area 3 are provided with a second transition area 5, and the first transition area 4, the second transition area 5 and the main body area 1 form a Y-shaped structure.

[0057] The first transition area 4, the second transition area 5 and the main body area 1 form a Y-shaped structure, so that there is a certain gap between the first binding area 2 and the second binding area 3, which facilitates the binding connection of the first binding area 2 and the second binding area 3 on the opposite sides of the display panel 101.

[0058] For example, the first transition area 4 and the first binding area 2 are smoothly transitioned, and the first transition area 4 and the main body area 1 are smoothly transitioned, which reduces stress and facilitates the arrangement of the corresponding signal lines.

[0059] For example, the smooth transition between the second transition region 5 and the second binding region 3, and the smooth transition between the second transition region 5 and the main body region 1, reduces stress and facilitates the arrangement of the corresponding signal lines.

[0060] It should be noted that the specific structure and size of the main body region 1, the first transition region 4, the second transition region 5, the first binding region 2, and the second binding region 3 can be set according to actual needs. In some embodiments, the first binding region 2 and the second binding region 3 are symmetrically arranged, and the first transition region 4 and the second transition region 5 are symmetrically arranged. In the first direction, the length of the first binding region 2 is 1310 um, and the length of the first transition region 4 is 250 um, but this is not limited.

[0061] In an exemplary embodiment, the first binding region 2 and / or the second binding region 3 is provided with a first alignment mark for alignment with the display panel 101.

[0062] The specific arrangement position of the first alignment mark can be set according to actual needs. In some embodiments, the first binding region 2 includes a first edge region on the side of the first binding terminal 21 away from the main body region 1, and the first edge region is provided with the first alignment mark 23. In some embodiments, the second binding region 3 includes a second edge region on the side of the second binding terminal 31 away from the main body region 1, and the second edge region is provided with the first alignment mark 23.

[0063] In an exemplary embodiment, in order to reduce the length of the first binding region 2 or the length of the second binding region 3 in the first direction, the first alignment mark 23 can be arranged between two adjacent first binding terminals 21.

[0064] In an exemplary embodiment, the first binding region 2 is provided with a first conductive adhesive 22 on the side facing the second binding region 3, the first conductive adhesive 22 is provided with a first protective film 6 on the side away from the first binding region 2, and the first conductive adhesive 22 at least partially overlaps each first terminal.

[0065] The second binding region 3 is provided with a second conductive adhesive 32 on the side facing the first binding region 2, the second conductive adhesive 32 is provided with a first protective film 6 on the side away from the second binding region 3, and the second conductive adhesive 32 at least partially overlaps each second terminal.

[0066] For example, the first conductive adhesive 22 completely covers a plurality of first binding terminals 21, facilitating the binding connection of the chip on film and the display panel 101.

[0067] The second conductive adhesive 32 completely covers the second conductive terminal, facilitating the bonding connection of the COF and the display panel 101.

[0068] For example, the first protective film 6 completely covers the first conductive adhesive 22, effectively protecting the first conductive adhesive 22, and the second protective film 7 completely covers the second conductive adhesive 32, effectively protecting the second conductive adhesive 32.

[0069] With reference to Figure 4 and Figure 5 The present embodiment further provides a display module, comprising a display panel 101 and the above-mentioned COF.

[0070] The display panel 101 comprises a display area 1011 and a third bonding area located on one side of the periphery of the display area 1011, and a plurality of third bonding terminals are arranged on the third bonding area.

[0071] The display panel 101 further comprises a display surface and a back surface arranged oppositely, the third bonding area comprises a first sub-bonding area 1012 located on the display surface and a second sub-bonding area 1013 located on the back surface, and the third bonding terminals comprise a plurality of first sub-bonding terminals 1001 located on the first sub-bonding area 1012 and a plurality of second sub-bonding terminals 1002 located on the second sub-bonding area 1013.

[0072] The first sub-bonding terminals 1001 are used for bonding connection with the first bonding terminals 21, and the second sub-bonding terminals 1002 are used for bonding connection with the second bonding terminals 31.

[0073] The third binding area on the display panel 101 includes a first sub-binding area 1012 on the display surface and a second sub-binding area 1013 on the back surface, which increases the setting space of the binding terminals (including the first sub-binding terminal 1001 and the second sub-binding terminal 1002) and the distance between adjacent two binding terminals (including the first sub-binding terminal 1001 and the second sub-binding terminal 1002) compared with the setting of a single surface binding area. The COF includes a first binding area 2 and a second binding area 3 arranged oppositely, which increases the setting space of the binding terminals (including the first binding terminal 21 and the second binding terminal 31) and the distance between adjacent two binding terminals (including the first binding terminal 21 and the second binding terminal 31) compared with the setting of a single binding area. The first sub-binding area 1012 is bindingly connected with the first binding area 2, the first sub-binding terminal 1001 is connected with the first binding terminal 21, the second sub-binding area 1013 is bindingly connected with the second binding area 3, and the second sub-binding terminal 1002 is connected with the second binding terminal 31. The problem of dark line defects caused by small distance between binding terminals is solved.

[0074] In an exemplary embodiment, the distance between adjacent two first sub-binding terminals 1001 is greater than or equal to 30 um, and the distance between adjacent two second sub-binding terminals 1002 is greater than or equal to 30 um.

[0075] In related technologies, the PIN Pitch (the distance between adjacent binding terminals) is becoming narrower and narrower, from the conventional > 28 um to ≤ 24 um, and the current minimum design value is 19 um. The distance between adjacent binding terminals and the dark line defect rate are shown in the following table:

[0076] Pitch design and factory dark line defect data:

[0077] Pitch ≥ 28um 27.2um 25.9um 25.4um 24.9um 24um Dark line loss 0.01％ 1.52％ 1.56％ 1.73％ 2.55％ 7％

[0078] In this embodiment, the distance between adjacent binding terminals (including the binding terminals on the display panel 101 and the binding terminals on the COF) is increased. Exemplarily, the distance between adjacent binding terminals can be greater than or equal to 30 um. According to the above table, the display module provided in this embodiment solves the problem of dark line defects caused by small distance between adjacent binding terminals.

[0079] Exemplarily, the first binding area 2 and the second binding area 3 are symmetrically arranged, the first binding terminal 21 and the first sub-binding terminal 1001 are connected by crimping, and the second binding terminal and the second sub-binding terminal 1002 are connected by crimping.

[0080] For example, in order to ensure the effective connection between the display panel 101 and the COF, the length of the first sub-bonding terminal 1001 is 850 um, the length of the first conductive adhesive 22 is 1000 um, and the length of the first bonding terminal 21 is 1300 um in the first direction, but the present application is not limited thereto. In the first direction, the length of the second sub-bonding terminal 1002 is 850 um, the length of the second conductive adhesive 32 is 1000 um, and the length of the second bonding terminal 31 is 1300 um, but the present application is not limited thereto.

[0081] For example, a second alignment mark 1003 is arranged on the display surface of the display panel to align the COF and the display panel with the first alignment mark. Figure 4 The second alignment mark 1003 is arranged in the first sub-bonding area 1012.

[0082] In an exemplary embodiment, a back film 102 is arranged on the back of the display panel 101, and the orthographic projection of the back film 102 on the display panel 101 is located on one side of the third bonding area.

[0083] In the prior art, the bonding terminals on the display panel 101 are arranged on the display surface (i.e., the front surface), and the back film 102 is arranged on the back of the display panel 101 and generally completely covers the display panel 101. In the present embodiment, the second sub-bonding area 1013 is additionally arranged on the back of the display panel 101, and the second sub-bonding terminal 1002 is arranged on the second sub-bonding area 1013, and the back film 102 is retracted to provide space for the arrangement of the second sub-bonding area.

[0084] For example, the distance between the back film 102 and the second sub-bonding terminal 1002 in the direction from the display area 1011 to the third bonding area can be set according to actual needs, for example, the distance between the back film 102 and the second sub-bonding terminal 1002 is in the range of 250±50 um, but the present application is not limited thereto.

[0085] In an exemplary embodiment, the back film 102 has a gap between the orthographic projection of the back film 102 on the display panel 101 and the orthographic projection of the COF on the display panel 101.

[0086] In order to avoid interference between the COF and the back film 102, the back film 102 has a gap between the orthographic projection of the back film 102 on the display panel 101 and the orthographic projection of the COF on the display panel 101. The gap value is 10±10 um, but the present application is not limited thereto.

[0087] In an exemplary embodiment, the gap between the COF and the display panel 101 is filled with a protective adhesive layer 8.

[0088] The protective adhesive layer 8 ensures the tensile strength, impact strength and waterproofness of the COF.

[0089] It should be noted that the protective adhesive layer 8 is filled after the COF is bonded to the display panel 101, and the thickness of the protective adhesive layer 8 can be set according to actual needs, for example, it can be 156 um, but is not limited thereto.

[0090] In an exemplary embodiment, the back of the display panel 101 is provided with a back film 102, the protective adhesive layer 8 extends to the direction close to the display area 1011 to form an extension, and the orthographic projection of the extension on the display panel 101 and the orthographic projection of the back film 102 on the display panel 101 are adjacent, thereby ensuring the flatness of the display panel 101.

[0091] In an exemplary embodiment, the protective adhesive layer 8 is made of acrylate. The viscosity of acrylate is ≤200 cps, that is, the hardness of the protective adhesive layer 8 formed after UV curing is ≤40A, but is not limited thereto, for example, the protective adhesive layer 8 can also be made of epoxy resin.

[0092] For example, acrylate is cured by using an LED light source, and the wavelength of the curing light used is 405-470 nm.

[0093] The present application also provides a display device comprising the display module.

[0094] The display device can be a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer or any product or component having a display function, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.

[0095] The following points need to be explained:

[0096] (1) The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can be referred to the general design.

[0097] (2) For the sake of clarity, the thickness of a layer or region is exaggerated or reduced in the drawings used to describe the embodiments of the present disclosure, that is, these drawings are not drawn according to the actual proportion. It can be understood that when an element such as a layer, a film, a region or a substrate is referred to as being located “on” or “under” another element, the element can be “directly” located on or under another element or there can be an intermediate element.

[0098] (3) In the case of no conflict, the embodiments of the present disclosure and the features in the embodiments can be combined to obtain new embodiments.

[0099] It can be understood that the above implementation is only an exemplary implementation adopted for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and principle of the present application, and these modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A flip-chip thin film, characterized in that, It includes a main body area and a first binding area and a second binding area located on a first side of the main body area along a first direction, wherein the first binding area and the second binding area are disposed opposite to each other; The side of the first binding area facing the second binding area is provided with a plurality of first binding terminals; The side of the second bonding area facing the first bonding area is provided with a plurality of second bonding terminals.

2. The flip-chip thin film of claim 1, wherein, The distance between two adjacent first bonding terminals is greater than or equal to 30 μm, and the distance between two adjacent second bonding terminals is greater than or equal to 30 μm.

3. The flip-chip thin film of claim 1, wherein, A plurality of the first bonding terminals are spaced apart in a second direction, the second direction being perpendicular to the first direction; A plurality of second bonding terminals are spaced apart in a second direction, which is perpendicular to the first direction; The orthographic projection of the first bonding terminal onto the second bonding area is located between two adjacent second bonding terminals, or the orthographic projection of the first bonding terminal onto the second bonding area at least partially overlaps with the corresponding second bonding terminal.

4. The flip-chip thin film of claim 1, wherein, A first connecting line is provided on the main body area, the first connecting line extends to the first binding area and is connected to the first binding terminal; A second connecting line is provided on the main body area, the second connecting line extends to the second binding area and is connected to the second binding terminal; The first connecting line located in the first part of the main body area and the second connecting line located in the second part of the main body area are either arranged on the same layer or on different layers.

5. The flip-chip thin film of claim 1, wherein, A first transition area is provided between the main body area and the first binding area, and a second transition area is provided between the main body area and the second binding area. The first transition area, the second transition area and the main body area form a Y-shaped structure.

6. The flip-chip thin film of claim 1, wherein, The first binding area and / or the second binding area are provided with a first alignment mark for alignment with the display panel.

7. The flip-chip thin film of claim 1, wherein, A first conductive adhesive is provided on the side of the first bonding area facing the second bonding area, and a first protective film is provided on the side of the first conductive adhesive away from the first bonding area. The first conductive adhesive at least partially overlaps with each of the first bonding terminals. A second conductive adhesive is provided on the side of the second bonding area facing the first bonding area, and a first protective film is provided on the side of the second conductive adhesive away from the second bonding area. The second conductive adhesive at least partially overlaps with each of the second bonding terminals.

8. A display module, characterized by Includes a display panel and a flip-chip film as described in any one of claims 1-7; The display panel includes a display area and a third bonding area located on one side of the periphery of the display area, and the third bonding area is provided with a plurality of third bonding terminals; The display panel further includes a display surface and a back surface disposed opposite to each other, the third bonding area includes a first sub-bonding area located on the display surface and a second sub-bonding area located on the back surface, and the third bonding terminal includes a plurality of first sub-bonding terminals located in the first sub-bonding area and a plurality of second sub-bonding terminals located in the second sub-bonding area; The first sub-binding terminal is used for binding connection with the first binding terminal, and the second sub-binding terminal is used for binding connection with the second binding terminal.

9. The display module of claim 8, wherein, The distance between two adjacent first sub-bonding terminals is greater than or equal to 30 um, and the distance between two adjacent second sub-bonding terminals is greater than or equal to 30 um.

10. The display module of claim 8, wherein, The back of the display panel is provided with a back film, and the orthographic projection of the back film on the display panel is located on one side of the third bonding area.

11. The display module of claim 10, wherein, The orthographic projection of the back film on the display panel has a gap with the orthographic projection of the chip on film on the display panel.

12. The display module of claim 8, wherein, The gap between the chip on film and the display panel is filled with a protective adhesive layer.

13. The display module of claim 12, wherein, The back of the display panel is provided with a back film, and the protective adhesive layer extends in the direction close to the display area to form an extension, and the orthographic projection of the extension on the display panel and the orthographic projection of the back film on the display panel are adjacent.

14. The display module of claim 12, wherein, The protective adhesive layer is made of acrylate.

15. A display device comprising: The display module comprises the display module of any one of claims 8-14.

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