Chip on film structure, display device and tiled display device

Abstract

Embodiments of the present application disclose a kind of chip on film structure, display device and spliced display device.The chip on film structure includes: substrate, including oppositely arranged first surface and second surface;First circuit, covering the first surface, the first circuit includes driving chip binding area;Display panel binding end, located at the second surface;First conductive part is connected with the first circuit and the display panel binding end respectively.The embodiments of the present application can reduce the binding difficulty of display panel, improve the binding yield and reliability, improve the display uneven problem caused by the heat of driving chip.

Description

Technical Field

[0001] This invention relates to the field of display panel technology, and more particularly to a flip-chip thin film structure, a display device, and a splicing display device. Background Technology

[0002] Currently, in display devices, the driver chip and the display panel are bonded to the same side of a chip-on-flex PCB (COF) structure, with the driver chip located between the display panel and the COF structure. Due to the relatively high height of the driver chip, the metal bonding layer used to bond the display panel and the COF structure is also relatively high, leading to increased bonding difficulty, reliability issues, and reduced bonding yield. Furthermore, the driver chip generates heat during operation, causing the temperature of the display panel area near the driver chip to rise. This, in turn, reduces the luminous efficiency of the light-emitting devices in the display panel, resulting in decreased brightness and ultimately causing uneven display. Summary of the Invention

[0003] This invention provides a flip-chip thin film structure, a display device, and a splicing display device, which can reduce the bonding difficulty of display panels, improve bonding yield and reliability, and improve the display unevenness problem caused by the heat of the driver chip in the display panel.

[0004] This invention provides a flip-chip thin film structure, comprising:

[0005] The substrate includes a first surface and a second surface disposed opposite to each other;

[0006] A first line covers the first surface, and the first line includes a driver chip bonding area;

[0007] The display panel bonding end is located on the second surface;

[0008] The first conductive part is connected to the first line and the bonding end of the display panel, respectively.

[0009] Furthermore, the first conductive portion penetrates the substrate.

[0010] Furthermore, the substrate also includes a third surface that is connected to the first surface and the second surface respectively;

[0011] The first conductive portion covers the third surface.

[0012] Furthermore, the display panel bonding end is disposed overlapping the first conductive part in a target direction, which is a direction parallel to the second surface.

[0013] Furthermore, the flip-chip thin film structure also includes a second circuit;

[0014] The second line covers the second surface, the display panel bonding end is located on the side of the second line away from the substrate, and the first conductive part is connected to the display panel bonding end through the second line.

[0015] Furthermore, the display panel bonding end and the first conductive part are spaced apart in a target direction, which is a direction parallel to the second surface;

[0016] The second line is located between the display panel bonding end and the first conductive part.

[0017] Furthermore, the flip-chip thin film structure also includes a heat insulation layer;

[0018] The heat insulation layer is located on the side of the second line away from the substrate.

[0019] Furthermore, the flip-chip thin film structure also includes a first protective layer, which is located on the side of the first line away from the substrate;

[0020] Furthermore, the flip-chip thin film structure also includes a second protective layer, which is located between the second circuit and the heat insulation layer.

[0021] Furthermore, the first line also includes a circuit board bonding area;

[0022] The circuit board bonding area and the display panel bonding end are respectively located near the opposite ends of the substrate.

[0023] Furthermore, the flip-chip structure also includes a driver chip;

[0024] The driver chip is located in the driver chip bonding area and is connected to the first line.

[0025] This invention also provides a display device, comprising:

[0026] A flip-chip thin film structure, wherein the flip-chip thin film structure is the flip-chip thin film structure described above;

[0027] The display panel is connected to the display panel bonding end in the flip-chip thin film structure.

[0028] Furthermore, the display panel is a bottom-emitting display panel;

[0029] The bottom-emitting display panel has a first bonding end at its top. The flip-chip thin film structure is located at the top of the bottom-emitting display panel. The bonding end of the display panel faces the bottom-emitting display panel and is connected to the first bonding end.

[0030] Furthermore, the display panel is a top-emitting display panel, and the top-emitting display panel includes a second conductive portion;

[0031] The top of the top-emitting display panel has a second bonding end, the flip-chip thin film structure is located at the bottom of the top-emitting display panel, the bonding end of the display panel faces the top-emitting display panel and is connected to the second bonding end through the second conductive part.

[0032] Furthermore, the second conductive portion extends through the top-emitting display panel, or the second conductive portion covers the side of the top-emitting display panel.

[0033] This invention also provides a splicing display device, comprising multiple display devices spliced ​​together, wherein the display devices are the aforementioned display devices.

[0034] The beneficial effects of the embodiments of the present invention are as follows: a first line is covered on the first surface of the substrate, and the first line includes a driver chip bonding area. A display panel bonding end is provided on the second surface of the substrate. The first surface and the second surface are disposed opposite to each other, and the first line is connected to the display panel bonding end through a first conductive part, so as to ensure that the driver chip and the display panel are bonded on opposite sides of the substrate, avoid the display panel bonding end being too high, reduce the bonding difficulty of the display panel, improve the bonding yield and reliability, and facilitate the heat dissipation of the driver chip, thereby improving the display unevenness problem caused by the heat generation of the driver chip. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments or prior art, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of a flip-chip thin film structure provided in an embodiment of the present invention;

[0037] Figure 2 This is another schematic diagram of the flip-chip thin film structure provided in an embodiment of the present invention;

[0038] Figure 3 This is another schematic diagram of the flip-chip thin film structure provided in an embodiment of the present invention;

[0039] Figure 4 This is another schematic diagram of the flip-chip thin film structure provided in an embodiment of the present invention;

[0040] Figure 5This is another schematic diagram of the flip-chip thin film structure provided in an embodiment of the present invention;

[0041] Figure 6 This is a schematic diagram of a display device provided in an embodiment of the present invention.

[0042] Figure 7 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0043] Figure 8 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0044] Figure 9 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0045] Figure 10 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0046] Figure 11 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0047] Figure 12 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0048] Figure 13 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0049] Figure 14 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0050] Figure 15 This is another structural schematic diagram of the display device provided in an embodiment of the present invention;

[0051] Figure 16 This is a schematic diagram of a splicing display device provided in an embodiment of the present invention. Detailed Implementation

[0052] The specific structural and functional details disclosed herein are merely representative and are intended to describe exemplary embodiments of the invention. However, the invention can be embodied in many alternative forms and should not be construed as being limited solely to the embodiments set forth herein.

[0053] In the description of this invention, it should be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Additionally, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion.

[0054] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0055] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments. Unless the context clearly indicates otherwise, the singular forms “a” and “an” as used herein are also intended to include the plural. It should also be understood that the terms “comprising” and / or “including” as used herein specify the presence of the stated features, integers, steps, operations, units, and / or components, without excluding the presence or addition of one or more other features, integers, steps, operations, units, components, and / or combinations thereof.

[0056] See Figures 1 to 5 This is a schematic diagram of the flip-chip thin film structure provided in an embodiment of the present invention.

[0057] like Figure 1 As shown, an embodiment of the present invention provides a flip-chip thin film structure, including a substrate 1, a first circuit 2, a display panel bonding end 3, and a first conductive part 4.

[0058] The substrate 1 includes a first surface 11 and a second surface 12 disposed opposite to each other. For example... Figure 1As shown, the first surface 11 can be the lower surface of the substrate 1, and the second surface 12 can be the upper surface of the substrate 1. The substrate 1 may also include a third surface 13 connected to the first surface 11 and the second surface 12 respectively, and the third surface 13 can be a side surface of the substrate 1. The substrate 1 can be a PI (polyimide) substrate.

[0059] The first line 2 covers the first surface 11 of the substrate 1, and the first line 2 may cover all or part of the first surface 11 of the substrate 1. The first line 2 includes a driver chip bonding area 21 for bonding a driver chip. Figure 1 As shown, the driver chip bonding area 21 can be located close to the center region of the first surface 11. The material of the first line 2 is a conductive metal, such as tungsten, cobalt, copper, aluminum, etc.

[0060] The display panel bonding end 3 is located on the second surface 12 of the substrate 1 and is used for bonding with the display panel. For example... Figure 1 As shown, the display panel bonding end 3 is disposed near one end of the substrate 1, for example, near the third surface 13 of the substrate 1. The display panel bonding end 3 can be a welding metal, and the material of the welding metal is a conductive metal, such as tungsten, cobalt, copper, aluminum, etc.

[0061] The first conductive part 4 is connected to both the first line 2 and the display panel bonding end 3. Specifically, one end of the first conductive part 4 is connected to the first line 2, and the other end is connected to the display panel bonding end 3. After bonding the driver chip and the display panel, the driver chip can be electrically connected to the display panel through the first line 2, the first conductive part 4, and the display panel bonding end 3. The material of the first conductive part 4 is a conductive metal, such as tungsten, cobalt, copper, or aluminum.

[0062] In this embodiment, the driver chip bonding area 21 is located on the first surface 11 of the substrate 1, and the display panel bonding end 3 is located on the second surface 12 of the substrate 1. That is, the driver chip bonding area 21 and the display panel bonding end 3 are located on opposite sides of the substrate 1. After bonding the driver chip and the display panel, the driver chip and the display panel are located on opposite sides of the substrate 1, so that the height of the display panel bonding end 3 does not need to be too high, such as being less than the height of the driver chip, thereby reducing the bonding difficulty of the display panel and improving the bonding yield and reliability. In addition, the driver chip and the display panel being located on opposite sides of the substrate 1 is beneficial for the heat dissipation of the driver chip, and the heat generated by the driver chip will not affect the display panel, thereby improving the display unevenness problem caused by the heat generated by the driver chip.

[0063] The first conductive portion 4 may penetrate the substrate 1 or cover the third surface 13 of the substrate 1. The second surface 12 of the substrate 1 may cover the second circuit, allowing the first conductive portion 4 to be electrically connected to the display panel bonding terminal 3 via the second circuit. Alternatively, the second surface of the substrate 1 may not cover the second circuit, allowing the first conductive portion 4 to be directly connected to the display panel bonding terminal 3.

[0064] Specifically, in the first embodiment, such as Figure 1 As shown, the first line 2 covers the first surface 11 of the substrate 1, and the first conductive part 4 covers the third surface 13 of the substrate 1, such that one end of the first conductive part 4 is connected to the first line 2. The display panel bonding end 3 is located on the second surface 12 of the substrate 1, and the display panel bonding end 3 and the first conductive part 4 are overlapped in the target direction A (i.e., the direction parallel to the second surface 12), that is, the display panel bonding end 3 is set close to the third surface 13 of the substrate 1, so that the other end of the first conductive part 4 is directly connected to the display panel bonding end 3. In this embodiment, the display panel bonding end 3 is directly set on the second surface 12 of the substrate 1. While reducing the thickness of the flip-chip film structure, the height of the display panel bonding end 3 can be reduced as much as possible, reducing the bonding difficulty of the display panel and improving the bonding yield and reliability.

[0065] like Figure 1 As shown, the flip-chip thin film structure may further include a first protective layer 71, which is located on the side of the first line 2 facing away from the substrate 1. The first protective layer 71 can cover all areas of the first line 2 except for the driver chip bonding area 21 and the circuit board bonding area 22, thus protecting the first line 2.

[0066] In the second embodiment, such as Figure 2 As shown, the first line 2 covers the first surface 11 of the substrate 1, and the first conductive part 4 penetrates the substrate 1, such that one end of the first conductive part 4 is connected to the first line 2. The display panel bonding end 3 is located on the second surface 12 of the substrate 1, and the display panel bonding end 3 and the first conductive part 4 are overlapped in the target direction A, such that the other end of the first conductive part 4 is directly connected to the display panel bonding end 3. In this embodiment, while reducing the thickness of the flip-chip film structure and minimizing the height of the display panel bonding end 3, the first conductive part 4 is prevented from being exposed, thereby preventing short circuits between the first conductive part 4 and other conductive structures.

[0067] like Figure 2 As shown, the flip-chip thin film structure may further include a first protective layer 71, which is located on the side of the first line 2 facing away from the substrate 1. The first protective layer 71 can cover all areas of the first line 2 except for the driver chip bonding area 21 and the circuit board bonding area 22, thus protecting the first line 2.

[0068] In the third embodiment, such as Figure 3 As shown, the first line 2 covers the first surface 11 of the substrate 1, and the first conductive part 4 covers the third surface 13 of the substrate 1, such that one end of the first conductive part 4 is connected to the first line 2. The display panel bonding end 3 and the first conductive part 4 are spaced apart in the target direction A. The second surface 12 of the substrate 1 partially covers the second line 5, that is, the second line 5 is located between the display panel bonding end 3 and the first conductive part 4. The display panel bonding end 3 is located on the side of the second line 5 away from the substrate 1, such that the other end of the first conductive part 4 is connected to the display panel bonding end 3 through the second line 5. This embodiment reduces the height of the display panel bonding end 3 while increasing the area on the second surface 12 where the display panel bonding end 3 can be set, thereby reducing the manufacturing difficulty of the display panel bonding end 3.

[0069] like Figure 3 As shown, the flip-chip thin film structure may also include a heat insulation layer 6, which is located on the side of the second circuit 5 facing away from the substrate 1. The heat insulation layer 6 can be provided in all areas of the second circuit 5 except for the connection area with the display panel bonding end 3, to isolate the heat generated by the second circuit 5 and prevent the heat generated by the second circuit 5 from affecting the display panel after bonding, thereby avoiding the problem of uneven display caused by heat dissipation from the second circuit 5.

[0070] The flip-chip thin film structure may further include a first protective layer 71, which is located on the side of the first line 2 facing away from the substrate 1. The first protective layer 71 can cover all areas of the first line 2 except for the driver chip bonding area 21 and the circuit board bonding area 22, thus protecting the first line 2.

[0071] The flip-chip thin-film structure may further include a second protective layer 72, which is located between the second circuit 5 and the heat insulation layer 6. The second protective layer 72 can cover all areas of the second circuit 5 except for the connection area with the display panel bonding terminal 3, thus protecting the second circuit 5. The heat insulation layer 6 can completely cover the second protective layer 72 to effectively isolate the heat generated by the second circuit 5.

[0072] In the fourth embodiment, such as Figure 4As shown, the first line 2 covers the first surface 11 of the substrate 1, and the first conductive part 4 penetrates the substrate 1, so that one end of the first conductive part 4 is connected to the first line 2. The display panel bonding end 3 and the first conductive part 4 are spaced apart in the target direction A. The second surface 12 of the substrate 1 partially covers the second line 5, that is, the second line 5 is located between the display panel bonding end 3 and the first conductive part 4. The display panel bonding end 3 is located on the side of the second line 5 away from the substrate 1, so that the other end of the first conductive part 4 is connected to the display panel bonding end 3 through the second line 5. This embodiment reduces the height of the display panel bonding end 3 and the manufacturing difficulty of the display panel bonding end 3, while avoiding the first conductive part 4 being exposed, thereby preventing the first conductive part 4 from short-circuiting with other conductive structures.

[0073] like Figure 4 As shown, the flip-chip thin film structure may also include a heat insulation layer 6, which is located on the side of the second circuit 5 facing away from the substrate 1. The heat insulation layer 6 can be provided in all areas of the second circuit 5 except for the connection area with the display panel bonding end 3, to isolate the heat generated by the second circuit 5 and prevent the heat generated by the second circuit 5 from affecting the display panel after bonding, thereby avoiding the problem of uneven display caused by heat dissipation from the second circuit 5.

[0074] The flip-chip thin film structure may further include a first protective layer 71, which is located on the side of the first line 2 facing away from the substrate 1. The first protective layer 71 can cover all areas of the first line 2 except for the driver chip bonding area 21 and the circuit board bonding area 22, thus protecting the first line 2.

[0075] The flip-chip thin-film structure may further include a second protective layer 72, which is located between the second circuit 5 and the heat insulation layer 6. The second protective layer 72 can cover all areas of the second circuit 5 except for the connection area with the display panel bonding terminal 3, thus protecting the second circuit 5. The heat insulation layer 6 can completely cover the second protective layer 72 to effectively isolate the heat generated by the second circuit 5.

[0076] In the fifth embodiment, such as Figure 5As shown, the first line 2 covers the first surface 11 of the substrate 1, and the first conductive part 4 can penetrate the substrate 1, so that one end of the first conductive part 4 is connected to the first line 2. In some other embodiments, the first conductive part 4 can also cover the third surface 13 of the substrate 1, so that one end of the first conductive part 4 is connected to the first line 2. The second surface 12 of the substrate 1 completely covers the second line 5, and the display panel bonding end 3 is located on the side of the second line 5 away from the substrate 1, so that the other end of the first conductive part 4 is connected to the display panel bonding end 3 through the second line 5. The first conductive part 4 and the display panel bonding end 3 can be arranged overlappingly in the target direction A, or they can be arranged at intervals in the target direction A. In this embodiment, when manufacturing the second line 5, the second line 5 completely covers the second surface 12 of the substrate 1, and there is no need to etch the second line 5, so as to reduce the height of the display panel bonding end 3, reduce the process difficulty of the display panel bonding end 3, and simplify the manufacturing process of the second line 5.

[0077] like Figure 5 As shown, the flip-chip thin film structure may also include a heat insulation layer 6, which is located on the side of the second circuit 5 facing away from the substrate 1. The heat insulation layer 6 can be provided in all areas of the second circuit 5 except for the connection area with the display panel bonding end 3, to isolate the heat generated by the second circuit 5 and prevent the heat generated by the second circuit 5 from affecting the display panel after bonding, thereby avoiding the problem of uneven display caused by heat dissipation from the second circuit 5.

[0078] like Figure 5 As shown, the flip-chip thin film structure may further include a first protective layer 71, which is located on the side of the first line 2 facing away from the substrate 1. The first protective layer 71 can cover all areas of the first line 2 except for the driver chip bonding area 21 and the circuit board bonding area 22, thus protecting the first line 2.

[0079] like Figure 5 As shown, the flip-chip thin film structure may further include a second protective layer 72, which is located between the second circuit 5 and the heat insulation layer 6. The second protective layer 72 can cover all areas of the second circuit 5 except for the connection area with the display panel bonding terminal 3, thus protecting the second circuit 5. The heat insulation layer 6 can completely cover the second protective layer 72 to effectively isolate the heat generated by the second circuit 5.

[0080] like Figures 1 to 5As shown, the first line 2 also includes a circuit board bonding area 22 for bonding the circuit board. The circuit board bonding area 22 and the display panel bonding end 3 are respectively disposed near opposite ends of the substrate 1. For example, the display panel bonding end 3 is disposed near the third surface 13 of the substrate 1, and the circuit board bonding area 22 is disposed near the fourth surface 14 of the substrate 1. The fourth surface 14 is disposed opposite to the third surface 13, and both the third surface 13 and the fourth surface 14 can be side surfaces of the substrate 1. The circuit board bonding area 22 and the display panel bonding end 3 are respectively disposed near opposite ends of the substrate 1 to prevent damage to the circuit board caused by the heating of the display panel bonding end 3 after bonding the circuit board.

[0081] like Figures 1 to 5 As shown, the flip-chip thin film structure may further include a driver chip 8, which is located in the driver chip bonding area 21 and is connected to the first line 2, thereby bonding the driver chip 8 to the first line 2. The flip-chip thin film structure may further include a circuit board 9, which is located in the circuit board bonding area 22 and is connected to the first line 2, thereby bonding the circuit board 9 to the first line 2.

[0082] The flip-chip thin film structure provided in this embodiment of the invention covers a first circuit on a first surface of a substrate, and the first circuit includes a driver chip bonding area. A display panel bonding end is provided on a second surface of the substrate. The first surface and the second surface are disposed opposite to each other, and the first circuit is connected to the display panel bonding end through a first conductive part. This ensures that the driver chip and the display panel are bonded to opposite sides of the substrate, avoids the display panel bonding end being too high, reduces the bonding difficulty of the display panel, improves the bonding yield and reliability, and is also beneficial for the heat dissipation of the driver chip, thus improving the display unevenness problem caused by the heat generated by the driver chip.

[0083] See Figures 6 to 15 This is a schematic diagram of the structure of the display device provided in an embodiment of the present invention.

[0084] like Figures 6 to 15 As shown, the display device provided in this embodiment of the invention includes a flip-chip thin film structure 10 and a display panel 20. The display panel 20 can be a bottom-emitting display panel or a top-emitting display panel. The flip-chip thin film structure 10 can be the flip-chip thin film structure described in the above embodiments, which will not be elaborated further here. The display panel bonding end 3 in the flip-chip thin film structure 10 is disposed facing the display panel 20, and the flip-chip thin film structure 10 is connected to the display panel 20 through the display panel bonding end 3 to achieve bonding between the flip-chip thin film structure 10 and the display panel 20.

[0085] When the display panel 20 is a bottom-emitting display panel, such as Figures 6 to 10As shown, the top of the display panel 20 has a first bonding end 24, the flip-chip thin film structure 10 is located on the top of the display panel 20, and the display panel bonding end 3 in the flip-chip thin film structure 10 is disposed facing the display panel 20 to be connected to the first bonding end 24.

[0086] Specifically, the display panel 20 includes an array substrate 21, a light-emitting device 22 located on the array substrate 21, and a reflective layer 23 covering the light-emitting device 22 and the array substrate 21. The light-emitting device 22 can be a micro LED. The reflective layer 23 is used to reflect the light emitted by the light-emitting device 22 to the bottom of the display panel 20 (i.e., the side of the array substrate 21 opposite to the reflective layer 23) for emission. The reflective layer 23 can also be used to encapsulate the light-emitting device 22.

[0087] The first bonding terminal 24 can be located on the array substrate 21, and the reflective layer 23 does not cover the first bonding terminal 24. The flip-chip thin film structure 10 can be located on top of the display panel 20 (i.e., on the side of the reflective layer 23 facing away from the array substrate 21). The display panel bonding terminal 3 in the flip-chip thin film structure 10 is disposed facing the display panel 20 to connect with the first bonding terminal 24. The display panel 20 is connected to the flip-chip thin film structure 10 through the first bonding terminal 24 and the display panel bonding terminal 3, thereby achieving bonding between the display panel 20 and the flip-chip thin film structure 10.

[0088] When the display panel 20 is a top-emitting display panel, such as Figures 11 to 15 As shown, the display panel 20 has a second bonding end 25 at its top and also includes a second conductive portion 26. The flip-chip thin film structure 10 is located at the bottom of the display panel 20. The display panel bonding end 3 in the display panel 20 faces the display panel 20 and is connected to the second bonding end 25 via the second conductive portion 26. The second conductive portion 26 can penetrate the display panel 20 or cover the side of the display panel 20.

[0089] Specifically, the display panel 20 includes an array substrate 27, a light-emitting device 28 located on the array substrate 27, and an encapsulation layer 29 covering the light-emitting device 28 and the array substrate 27. The light-emitting device 28 can be a micro LED. The encapsulation layer 29 is used to encapsulate the light-emitting device 28.

[0090] The second bonding terminal 25 may be located on the array substrate 27, and the encapsulation layer 29 may not cover the second bonding terminal 25. In some other embodiments, the encapsulation layer 29 may also cover the second bonding terminal 25. The second conductive portion 26 may penetrate through the array substrate 27 or may be located on the side of the array substrate 27, such that one end of the second conductive portion 26 is connected to the second bonding terminal 25. The flip-chip structure 10 may be located at the bottom of the display panel 20 (i.e., the side of the array substrate 27 facing away from the encapsulation layer 29), and the display panel bonding end 3 in the flip-chip structure 10 is disposed facing the display panel 20 to connect with the other end of the second conductive portion 26. The display panel 20 is connected to the flip-chip structure 10 through the second bonding terminal 25, the second conductive portion 26, and the display panel bonding end 3, thereby achieving bonding between the display panel 20 and the flip-chip structure 10.

[0091] The display device provided in this embodiment of the invention can bond the driver chip and the display panel to opposite sides of the substrate, avoiding excessive height of the bonding end of the display panel, reducing the bonding difficulty of the display panel, improving the bonding yield and reliability, and also facilitating heat dissipation of the driver chip, thus improving the uneven display problem caused by the heat generated by the driver chip.

[0092] See Figure 16 This is a structural schematic diagram of the splicing display device provided in an embodiment of the present invention.

[0093] like Figure 16 As shown, the splicing display device provided in this embodiment of the invention includes multiple display devices 100 spliced ​​together. Each display device 100 can be a display device as described in the above embodiment, and will not be described in detail here.

[0094] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A flip-chip thin film structure, characterized in that, include: The substrate includes a first surface and a second surface disposed opposite to each other; A first line covers the first surface, and the first line includes a driver chip bonding area; The display panel bonding end is located on the second surface; The first conductive part is connected to the first line and the bonding end of the display panel, respectively; The first conductive portion penetrates the substrate, and the flip-chip thin film structure further includes a second circuit; the second circuit covers the second surface, and the display panel bonding end is located on the side of the second circuit away from the substrate, and the first conductive portion is connected to the display panel bonding end through the second circuit.

2. The flip-chip thin film structure according to claim 1, characterized in that, The display panel bonding end is overlapped with the first conductive part in a target direction, which is a direction parallel to the second surface.

3. The flip-chip thin film structure according to claim 1, characterized in that, The display panel bonding end and the first conductive part are spaced apart in the target direction, which is a direction parallel to the second surface; The second line is located between the display panel bonding end and the first conductive part.

4. The flip-chip thin film structure according to claim 1, characterized in that, The flip-chip thin film structure also includes a heat insulation layer; The heat insulation layer is located on the side of the second line away from the substrate.

5. The flip-chip thin film structure according to claim 1, characterized in that, The flip-chip thin film structure also includes a first protective layer; The first protective layer is located on the side of the first line that is away from the substrate.

6. The flip-chip thin film structure according to claim 4, characterized in that, The flip-chip thin film structure also includes a second protective layer; The second protective layer is located between the second line and the heat insulation layer.

7. The flip-chip thin film structure according to claim 1, characterized in that, The first line also includes a circuit board bonding area; The circuit board bonding area and the display panel bonding end are respectively located near the opposite ends of the substrate.

8. The flip-chip thin film structure according to claim 1, characterized in that, The flip-chip thin film structure also includes a driver chip; The driver chip is located in the driver chip bonding area and is connected to the first line.

9. A flip-chip thin film structure, characterized in that, include: The substrate includes a first surface and a second surface disposed opposite to each other; A first line covers the first surface, and the first line includes a driver chip bonding area; The display panel bonding end is located on the second surface; The first conductive part is connected to the first line and the bonding end of the display panel, respectively; The substrate further includes a third surface that is connected to the first surface and the second surface respectively; the first conductive portion covers the third surface; the flip-chip thin film structure further includes a second circuit; the second circuit covers the second surface, the display panel bonding end is located on the side of the second circuit away from the substrate, and the first conductive portion is connected to the display panel bonding end through the second circuit.

10. The flip-chip thin film structure according to claim 9, characterized in that, The flip-chip thin film structure also includes a heat insulation layer; The heat insulation layer is located on the side of the second line away from the substrate.

11. The flip-chip thin film structure according to claim 9, characterized in that, The flip-chip thin film structure also includes a first protective layer; The first protective layer is located on the side of the first line that is away from the substrate.

12. A display device, characterized in that, include: A flip-chip thin film structure includes a substrate, a first circuit, a display panel bonding end, and a first conductive part. The substrate includes a first surface and a second surface disposed opposite to each other. The first circuit covers the first surface and includes a driver chip bonding area. The display panel bonding end is located on the second surface; the first conductive part is connected to the first line and the display panel bonding end respectively; wherein, the first line further includes a circuit board bonding area, the flip-chip thin film structure further includes a circuit board, the circuit board is located in the circuit board bonding area, and the circuit board is connected to the first line; The display panel is connected to the display panel bonding end in the flip-chip thin film structure; The flip-chip thin film structure is disposed opposite to the display panel, and the boundary of the flip-chip thin film structure is located within the boundary of the display panel.

13. The display device according to claim 12, characterized in that, The display panel is a bottom-emitting display panel; The bottom-emitting display panel has a first bonding end at its top. The flip-chip thin film structure is located at the top of the bottom-emitting display panel. The bonding end of the display panel faces the bottom-emitting display panel and is connected to the first bonding end.

14. The display device according to claim 12, characterized in that, The display panel is a top-emitting display panel, and the top-emitting display panel includes a second conductive portion; The top of the top-emitting display panel has a second bonding end, the flip-chip thin film structure is located at the bottom of the top-emitting display panel, the bonding end of the display panel faces the top-emitting display panel and is connected to the second bonding end through the second conductive part.

15. The display device according to claim 14, characterized in that, The second conductive portion extends through the top-emitting display panel, or the second conductive portion covers the side of the top-emitting display panel.

16. A splicing display device, characterized in that, It includes multiple display devices connected together, wherein the display devices are the display devices as described in any one of claims 12 to 15.

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