A camera module

Abstract

The application discloses a camera module, comprising: a filter base, the filter base has at least one pair of first base side walls, the first base side walls are inwardly recessed to form first recesses, the first recesses are provided with an avoidance hole, the avoidance hole penetrates the first base side walls along a direction perpendicular to the first base side walls to provide a space for the image sensor surface; a circuit board for carrying the image sensor, the circuit board has a circuit board first side wall, the circuit board first side wall is provided with a second recess corresponding to the first recess; a cover embedded in the accommodation space formed by the first recess and the second recess, and covering the avoidance hole; and an adhesive provided in the accommodation space for fixedly connecting the cover, the filter base and the circuit board. The reliable sealing of the sensor avoidance hole is realized under the condition of narrow gap, the HA glue process window is guaranteed, and the structural stability and assembly efficiency of the periscope module are significantly improved.

Description

Technical Field

[0001] This application relates to the field of camera modules, and more particularly to a camera module. Background Technology

[0002] With the increasing demands for thinner and lighter mobile devices and higher imaging performance, periscope camera modules face a significant challenge in achieving optical zoom while balancing a low-profile design with the need to adapt to large-format sensors. Current technologies, by vertically arranging large-format sensors and optimizing gold wire bonding processes, can compress the distance between the chip and the edge of the image sensor circuit board to a very small extent. However, this spatial compression effect severely encroaches on the HA (Hybrid Adhesive) filling area between the filter base and the image sensor circuit board, leading to a significant decrease in adhesive strength and stress buffering capacity, posing a significant challenge to module reliability.

[0003] Specifically, the current mainstream solution, designed to meet the high imaging requirements of large-format sensors, employs a layout where the sensor is positioned along the long side of the image sensor circuit board. While this layout maximizes space utilization to achieve a low-shoulder-height target, it inevitably leads to a significant reduction in the gap between the long side of the sensor and the long side of the image sensor circuit board. This narrow gap design directly results in insufficient expansion space required for HA adhesive coating, preventing the effective coverage area of ​​the HA adhesive from meeting standard process requirements. This leads to a significant decrease in the bonding strength and stress buffering capacity between the filter base and the circuit board, thereby increasing the risk of base peeling and severely affecting the structural stability and lifespan of the periscope module. Summary of the Invention

[0004] One objective of this application is to provide a camera module that, through the coordinated recessed design of the filter base and the image sensor circuit board and the adaptive layout of the cover, achieves reliable sealing of the sensor clearance hole under narrow gap conditions, while ensuring the HA glue process window, significantly improving the structural stability and assembly efficiency of the periscope module.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: a camera module, comprising: a filter base, the filter base having at least a pair of first base sidewalls, the first base sidewalls being recessed inward to form a first recess, the first recess having a clearance hole penetrating through the first base sidewall in a direction perpendicular to the first base sidewall, for providing clearance space for an image sensor; a circuit board for supporting the image sensor, the circuit board having a circuit board first sidewall, the circuit board first sidewall having a second recess corresponding to the first recess; a cover member embedded in the receiving space formed by the first recess and the second recess, and covering the clearance hole; and an adhesive disposed in the receiving space for fixing the cover member, the filter base, and the circuit board together.

[0006] As a preferred embodiment, the first sidewall of the circuit board is a sidewall corresponding to the long side of the image sensor, and a gap is left between the first sidewall of the circuit board and the long side of the image sensor. The second recess at least partially overlaps with the gap along the short side of the image sensor.

[0007] As another preferred embodiment, the length of the clearance hole is less than the length of the first recess, and the width of the clearance hole is less than the width of the first recess.

[0008] More preferably, the cover completely covers the clearance hole in a projection plane parallel to the side wall of the first base, and the thickness of the cover is less than the smaller of the depths of the first recess and the second recess.

[0009] Further preferably, the first recess is generally U-shaped and includes multiple side surfaces and a bottom surface penetrated by the clearance hole, the bottom surface and at least one of the side surfaces serving as contact surfaces for the adhesive.

[0010] More preferably, the second recess forms a stepped positioning platform relative to the first recess, one end of the cover is fixed to the positioning platform by the adhesive, and the positioning platform is used as the installation reference.

[0011] More preferably, the first recess forms a stepped positioning platform relative to the second recess, one end of the cover is fixed to the positioning platform by the adhesive, and the positioning platform is used as the installation reference.

[0012] More preferably, the bottom surfaces of the first recess and the second recess are flush with each other, and they partially overlap along the length direction, wherein the shorter one constitutes the mounting reference of the cover.

[0013] More preferably, the bottom surface of the first recess and the second recess is closer to the long side of the image sensor, and the minimum distance between the bottom surface of the recess and the long side of the image sensor is ≥50μm.

[0014] Further preferably, the width of the gap between the first sidewall of the circuit board and the long side of the image sensor is less than 0.2 mm.

[0015] Further preferably, it also includes: a cover; a housing having an accommodating space covered by the cover; a light deflecting element for changing the propagation direction of incident light; a lens assembly disposed within the accommodating space and located on the light-sensing path of the image sensor; and a driving assembly disposed within the accommodating space for driving the lens assembly to achieve optical zoom.

[0016] One object of this application is to provide a camera module, wherein the lens assembly is fixed to the base by a detachable connection, the detachable connection including a snap-fit ​​connection or a mechanical fastening. Attached Figure Description

[0017] Figure 1 This is a structural schematic diagram of the camera module housing provided in this application.

[0018] Figure 2 This is a schematic diagram of the internal structure of the camera module with the cover removed, as provided in this application.

[0019] Figure 3 This is a schematic diagram of the filter base from a first-view perspective.

[0020] Figure 4 This is a schematic diagram of the structure of the housing according to the first preferred embodiment of this application.

[0021] Figure 5 This is a schematic diagram of the filter base from a second-view perspective.

[0022] Figure 6 This is a schematic diagram of the filter base from a second-view perspective.

[0023] Figure 7 This is a schematic diagram showing the relationship between the filter base and a portion of the image sensor circuit board according to the first preferred embodiment of this application.

[0024] Figure 8 This is a schematic diagram showing the positional relationship between the filter base and the image sensor according to the first preferred embodiment of this application.

[0025] Figure 9 This is a schematic diagram showing the positional relationship between the filter base and the circuit board according to the first preferred embodiment of this application.

[0026] Figure 10 This is a schematic diagram of the filter base and circuit board according to the first preferred embodiment of this application from a first-view perspective.

[0027] Figure 11 This is a structural schematic diagram of the filter base and circuit board according to the first preferred embodiment of this application from a second perspective.

[0028] Figure 12 This is a schematic diagram of the circuit board according to the first preferred embodiment of this application.

[0029] Figure 13 This is a schematic diagram showing the positional relationship between the image sensor and the filter according to the first preferred embodiment of this application.

[0030] Figure 14This is a schematic diagram showing the positional relationship between the filter base and the photosensitive component according to the first preferred embodiment of this application.

[0031] Figure 15 This is a schematic diagram showing the relationship between the filter base, adhesive, and cover according to a first preferred embodiment of this application.

[0032] Figure 16 This is an overall view of the camera module according to a first preferred embodiment of the present invention.

[0033] In the figure: 10, outer shell; 11, shell base; 12, shell body; 111, shell base sidewall; 1111, first sidewall edge; 1112, second sidewall edge; 20, photosensitive component; 21, image sensor; 22, circuit board; 221, circuit board first sidewall; 2211, second recess; 222, circuit board second sidewall; 23, cover; 24, adhesive; 25, circuit element; 30, filter assembly; 31, filter base; 311, first base sidewall; 3111, first recess; 31111, bottom surface; 31112, side surface; 3112, clearance hole; 312, second base sidewall; 313, filter receiving part; 40, cover; 50, light steering element; 60, lens assembly; 70, drive assembly. Detailed Implementation

[0034] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0035] In the description of this application, it should be noted that the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., which indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of this application.

[0036] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0037] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0038] refer to Figure 1-16 As shown, this application provides a camera module, which includes a photosensitive component 20 and a filter component 30. The photosensitive component 20 includes a circuit board 22, a cover 23, and an adhesive 24. The filter assembly 30 includes a filter base 31, which has at least one pair of first base sidewalls 311. The first base sidewalls 311 are recessed inward to form a first recess 3111. The first recess 3111 is provided with a clearance hole 3112, which penetrates the first base sidewalls 311 in a direction perpendicular to the first base sidewalls 311 to provide clearance space for the image sensor 21. The circuit board 22 is used to support the image sensor 21. The circuit board 22 has a circuit board first sidewall 221, which is provided with a second recess 2211 corresponding to the first recess 3111. A cover 23 is embedded in the receiving space formed by the first recess 3111 and the second recess 2211 and covers the clearance hole 3112. An adhesive 24 is disposed in the receiving space to fix the cover 23, the filter base 31 and the circuit board 22.

[0039] It is understandable that: Figure 3 as well as Figure 7 As shown, the first recess 3111 and the second recess 2211 are arranged in parallel. The cover 23 is embedded in the receiving space formed by the first recess 3111 and the second recess 2211 and is fixed by adhesive 24. This achieves a reliable seal for the clearance hole 3112 under narrow gap conditions, and solves the technical defects of warping and deformation of the cover 23 and insufficient fitting accuracy in the traditional insert injection molding process. Compared with the existing solution, this cooperative groove design significantly reduces the risk of peeling off the filter base 31 and improves the structural stability by more than 50%.

[0040] To establish a spatial coordinate system to describe the relative positional relationships of the components, refer to Figure 1 As shown, in this embodiment, the propagation direction of the light path in the camera module is defined as the Z-axis direction, the length direction of the camera module is defined as the Y-axis, and the width direction is defined as the X-axis.

[0041] refer to Figures 1 to 4As shown, the camera module may also include a housing 10 and a cover 40. The cover 40 covers the top of the housing 10, and the interior of the housing 10 forms an accommodating space for accommodating and protecting internal components. The housing 10 includes a housing body 12 and a pair of housing bases 11. Specifically, the housing body 12 is a lidless cuboid frame, and the housing bases 11 are L-shaped. The interior of the housing body 12 forms an accommodating cavity for accommodating and protecting the lens assembly 60; its top is closed by the cover 40. Both L-shaped housing bases 11 are fixed to the same side wall of the housing body 12 and extend outward from this side wall to form mounting feet that can be directly fixed to the circuit board 22 of the camera module. In this way, the circuit board 22 no longer needs to be indirectly connected to the housing 10 via the filter base 31, which ensures connection strength and reduces the bottom area occupied by the circuit board 22, realizing the overall miniaturization of the camera module. The two L-shaped shell bases 11 are integrally formed with the corresponding side walls of the shell body 12, or are fixed together by suitable processes such as welding, riveting, gluing or threading. The side wall of the shell body 12 connected to the two L-shaped shell bases 11 includes a light-transmitting window so that light can pass through the light-transmitting window to reach the photosensitive component 20.

[0042] like Figure 5 As shown, the filter base 31 is a one-piece injection-molded convex-shaped light-transmitting frame that is completely continuous along the optical axis Z, forming a three-level cavity with a gradually increasing diameter from top to bottom, specifically including:

[0043] The filter receiving portion 313, located at the upper end of the convex shape, is a rectangular thin-walled frame with its inner circumference fitting the outer shape of the filter. An annular support step is integrally formed by protruding inward from the middle inner wall of this receiving portion. The step surface is perpendicular to the optical axis and serves to support the back of the filter and restrict its Z-axis position. The step depth is less than or equal to the thickness of the filter, ensuring that the top surface of the filter is flush with or slightly lower than the top surface of the filter base 31 after installation. The filter receiving portion 313 also has rounded corner grooves at its four corners to suppress corner reflections and prevent scattering or reflection losses at corners, thereby ensuring the transmission efficiency of the optical system.

[0044] The sensor housing is located at the lower end of the convex shape. Its shape is a rectangular thick-walled frame larger than the filter housing 313. Its inner circumference is matched with the packaging shape of the image sensor 21, and its depth forms the sensor housing cavity. The top surface of the sensor housing can serve as a support reference for the two L-shaped shell bases, thereby avoiding the shell bases from occupying too much of the X-direction dimension of the module, which is beneficial to the miniaturization of the camera module.

[0045] Since the outer contour of the filter housing 313 is smaller than that of the sensor housing, the cross section of the filter base 31 parallel to the xoz plane is generally convex. The supporting step exists inside the filter housing 313 and is a certain distance away from the top surface of the sensor housing in the Z-axis direction, thereby ensuring that the light-emitting surface of the filter and the light-receiving surface of the image sensor 21 maintain a precise air gap.

[0046] Furthermore, the sensor housing has two pairs of opposing sidewalls: a first base sidewall 311 extending along the long side of the image sensor 21; and a second base sidewall 312 extending along the short side of the image sensor 21. The first base sidewall 311 and the second base sidewall 312 together form a rectangular housing cavity that matches the package shape of the image sensor 21.

[0047] refer to Figure 4 As shown, the housing base 11 includes a pair of opposing housing base sidewalls 111. The cross-section of the housing base sidewalls 111 parallel to the xoz plane is L-shaped. Each housing base sidewall 111 includes a first sidewall edge 1111 and a second sidewall edge 1112. The first sidewall edge 1111 extends along a direction parallel to the X-axis, and the second sidewall edge 1112 extends along the Z-axis towards the image sensor 21. The two are connected by an arc transition to form a smooth corner. The thickness of the second sidewall edge 1112 in the Z-axis direction is greater than the thickness of the first sidewall edge 1111 in the Z-axis direction. At the same time, the extension length of the second sidewall edge 1112 in the X-axis direction is less than the extension length of the first sidewall edge 1111 in the X-axis direction. The L-shaped design of the housing base 11 allows it to rest on the convex shoulder of the filter base 31. The L-shaped structure of the housing base sidewall 111 extends in the X and Z axes in a complementary manner with the structure of the filter base 31, achieving full coverage of the filter base 31 and significantly improving the vibration resistance of the camera module.

[0048] refer to Figure 3 As shown, the first base sidewall 311 has a first recess 3111. The first recess 3111 is a near-U-shaped planar groove machined on the outer surface of the first base sidewall 311 and closer to the side of the photosensitive component 20. It is formed by a bottom surface 31111 (lateral) and three side surfaces 31112 (longitudinal): two relatively parallel side surfaces 31112 are connected by another side surface 31112 to form a U-shaped sidewall; the three side surfaces 31112 are all perpendicular to the bottom surface 31111, the bottom surface 31111 constitutes the bottom surface supporting the groove, and the three side surfaces 31112 respectively form the two side walls and one end wall of the groove. This U-shaped groove provides a precise positioning reference for the cover 23, and the positional accuracy of the cover 23 is greatly improved compared with the traditional planar attachment method.

[0049] refer to Figure 3 and Figure 5As shown, at least one pair of first base sidewalls 311 have a pair of clearance holes 3112. The clearance holes 3112 are rectangular cavities corresponding to at least one pair of first recesses 3111. The clearance holes 3112 are used to avoid the image sensor 21, preventing pressure damage. The clearance hole 3112 is a rectangular cavity formed by extending downwards from the first recess 3111 along the direction close to the image sensor 21, based on a hollowing-out first base sidewall 311. The depth of the hollowing-out first recess 3111 and clearance hole 3112 along the Y-axis is equal to the thickness of the first base sidewall 311. The length of the first recess 3111 along the X-axis is less than the length of the first base sidewall 311. The first recess 3111 is centrally located on the side of the first base sidewall 311. The length of the clearance hole 3112 along the X-axis is less than the length of the first recess 3111 in the X-axis direction and is completely embedded within the first recess 3111. The width of the first recess 3111 along the Z-axis is greater than the width of the clearance hole 3112, and the clearance hole 3112 is completely accommodated within the first recess 3111 along the Z-axis. The two form a symmetrical stepped transition structure on both sides of the Z-axis. The three-dimensional nested structure ensures structural strength and achieves efficient use of space, thereby providing sufficient clearance space for the image sensor 21 and preventing damage to the sensor during assembly.

[0050] refer to Figure 7 As shown, the photosensitive component 20 includes an image sensor 21 and a circuit board 22. The image sensor 21 is electrically connected to the circuit board 22. In this embodiment, the image sensor 21 is disposed on the upper surface of the circuit board 22. Figure 7 As shown, the image sensor 21 is positioned within a rectangular frame structure formed by two opposing first base sidewalls 311 and two opposing second base sidewalls 312. The image sensor 21 is projected along the Z-direction at the center of the rectangular frame enclosed by the two opposing first base sidewalls 311 and two opposing second base sidewalls 312. The surface of the image sensor 21 is parallel to the window plane of the filter receiving portion 313. The image sensor 21 has a rectangular structure, with its two opposing long sides embedded in corresponding clearance holes 3112. In other words, the thickness of the first base sidewall 311 extends along the short side of the image sensor 21, and its outer edge overlaps with the outline of the short side of the image sensor 21 in the short side direction. Therefore, the clearance holes 3112 are provided to prevent the inner surface of the first base sidewall 311 from extending into the middle of the image sensor 21, thus avoiding interference between the first base sidewall 311 and the image sensor 21. The length of the clearance hole 3112 along the X-axis is greater than the length of the long side of the image sensor 21. This avoids interference between the first base sidewall 311 and the image sensor 21, thereby enabling reliable installation of the large image sensor under narrow gap conditions.

[0051] refer to Figure 2 and Figure 9As shown, circuit board 22 is an L-shaped circuit board, corresponding to the housing base 11. Circuit board 22 is positioned on one side of the housing base sidewall 111 included in the housing base 11. The short sidewall of circuit board 22 is parallel to the housing base sidewall 111, and the long sidewall of circuit board 22 is perpendicularly connected to the short sidewall and parallel to the housing base sidewall 111 on the side of the base wall perpendicular to the housing base sidewall 111. (Reference) Figure 2 As shown, the short sidewall of the circuit board 22 is positioned on the side parallel to the filter base 31. The circuit board 22 is located behind the image sensor 21 along the optical path transmission direction. The arrangement order of the components in the optical path transmission direction is as follows: the filter is located at the frontmost optical path incident side, the image sensor 21 is located in the middle as a photosensitive element, and the circuit board 22 is located at the rearmost end as a signal processing unit. The short and long sidewalls of the circuit board 22 are manufactured using an integral molding process. Through a bending process, it is formed into an L-shaped circuit board. The bending process forms a 90-degree corner at the corner corresponding to the housing base 11 and maintains a smooth transition without damaging the internal circuit wiring. The L-shaped circuit board 22 can adapt to the geometry of the housing base 11, thereby ensuring the integrity of the circuit connection and improving the convenience of assembly. Compared with the traditional planar circuit board layout, the thickness of the camera module is reduced, which is beneficial to the miniaturization of the module.

[0052] refer to Figure 11 As shown, the circuit board 22 has at least one pair of first sidewalls 221 and at least one pair of second sidewalls 222. The at least one pair of first sidewalls 221 are arranged parallel to each other along the length direction, and their extension dimension is greater than that of the second sidewalls 222 in the width direction. The at least one pair of second sidewalls 222 are arranged parallel to each other along the width direction. Together, they define the basic outline of the circuit board 22. The at least one pair of first sidewalls 221 are perpendicularly connected to the at least one pair of second sidewalls 222, forming a rectangular planar structure of the circuit board 22. (Refer to...) Figure 7As shown, at least one pair of first sidewalls 221 of the circuit board includes at least one pair of second recesses 2211. These second recesses 2211 are arranged parallel to and corresponding to at least one pair of first recesses 3111. The second recesses 2211 are located on the first sidewalls 221 of the circuit board and can be implemented as rectangular cutouts in the first sidewalls 221. The width of the second recess 2211 along the Z-axis does not exceed the thickness of the circuit board 22. The length of the second recess 2211 is equal to or close to the length of the first recess 3111. The two recesses are designed to cooperate to form a receiving space for the cover 23. The dimensions of the two recesses ensure that the cover 23, after attachment, can completely cover the clearance hole 3112, while ensuring that the cover 23 is not exposed on the bottom plane of the circuit board 22, thus not increasing the length of the periscope module. A gap is left between the first sidewalls 221 of the circuit board and the long side of the image sensor 21. The width of the gap is less than 0.2 mm, achieving a compact layout with a narrow gap. In other words, while ensuring the miniaturization of the camera module, the circuit board 22 has a limited size. The image sensor 21 mounted on the circuit board 22 in this application is a large-area sensor, resulting in a relatively large size. Therefore, the gap between the long side of the image sensor 21 and the first sidewall 221 of the circuit board is narrow. In this case, if a conventional method of bonding the bottom surface of the filter base 31 to the surface of the circuit board 22 is used, the insufficient contact area makes it difficult to guarantee the bonding strength and module reliability. By using the structure of the two recesses and the cover 23 in this application, it is no longer necessary to apply adhesive to the conventional limited contact surface. Instead, adhesive is applied within the two recesses, and the adhesive can contact the bottom surface of the recess and at least one side surface. The size of the recesses can be reasonably set, increasing the adhesive contact area. Multiple surfaces contacting the adhesive ensure the bonding strength after curing. This achieves both connection and sealing between the filter base 31 and the circuit board 22, while also ensuring bonding strength and reliability, reducing the risk of the filter base 31 detaching from the circuit board 22, and thus improving the reliability of the camera module. At least one pair of second recesses 2211 and at least one pair of first recesses 3111 maintain a parallel correspondence, forming a corresponding mating structure in spatial arrangement. The depth of the second recesses 2211 and the first recesses 3111 along the Y-axis direction is smaller than the gap size between the first sidewall 221 of the circuit board and the parallel long side of the image sensor 21. This dimensional relationship ensures that the groove processing will not affect the image sensor 21. Thus, by setting the groove and attaching the cover 23 in the limited gap space, it is possible to achieve complete coverage of the avoidance hole 3112 and form a sealed space to protect the image sensor 21, thereby ensuring the reliability of the camera module and the imaging quality.

[0053] In some alternative embodiments, the depth and length relationship between the first recess 3111 and the second recess 2211 includes various implementations, which will be described separately below.

[0054] In one embodiment, the length of the second recess 2211 along the X-axis is less than the length of the first recess 3111, and the depth of the second recess 2211 along the Y-axis is less than the depth of the first recess 3111. A stepped surface is formed at the junction of the two recesses. The stepped surface is used for positioning the cover 23. The length of the cover 23 is designed based on the length of the second recess 2211. Furthermore, the length of the second recess 2211 can be less than the length of the first recess 3111, and the length of the cover 23 can be less than the length of the second recess 2211. Of course, the length of the second recess 2211 can also be greater than or equal to the length of the first recess 3111, in which case the length of the cover 23 is less than the length of the first recess 3111. The depth relationship and the length relationship are configured independently. This method can avoid interference between the cover 23 and the image sensor 21.

[0055] In another embodiment, the length of the second recess 2211 along the X-axis is greater than the length of the first recess 3111, and the depth of the second recess 2211 along the Y-axis is greater than the depth of the first recess 3111. A stepped surface is formed at the junction of the two recesses, and the stepped surface is used for positioning the cover 23. The length of the cover 23 is designed based on the length of the first recess 3111. Furthermore, the depth of the second recess 2211 along the Y-axis can be greater than, less than, or equal to the depth of the first recess 3111, and the depth relationship is configured independently of the length relationship. Furthermore, the length of the second recess 2211 can be less than the length of the first recess 3111, in which case the length of the cover 23 is less than the length of the second recess 2211; of course, the length of the second recess 2211 can also be equal to the length of the first recess 3111, in which case the length of the cover 23 is less than the length of either the first recess 3111 or the second recess 2211.

[0056] In this way, with a slightly smaller length and depth of one recess, the shorter and shallower recess is used as a reference when attaching the cover 23. This makes the position of the cover 23 within the two recesses more definite, allowing for more precise control of the attachment position and angle of the cover 23, reducing error accumulation, and ensuring the fitting accuracy of the cover 23 with the upper and lower recesses. It also makes it easier to position and fix the cover 23, improving the efficiency of attaching the cover 23. Attaching the cover 23 to the shallower recess makes it easier to achieve a tight fit, which is beneficial for improving the sealing of the cutout after filling with adhesive. It can provide a certain tolerance range for the assembly of the circuit board and the base. The length of the cover 23 is based on the shorter recess design, so even if there are assembly errors, it is less likely that the cover 23 will be too long to be accommodated by the two recesses.

[0057] In another embodiment, the length of the second recess 2211 along the X-axis is equal to the length of the first recess 3111, and the depth of the second recess 2211 along the Y-axis is equal to the depth of the first recess 3111. In this case, the length of the cover 23 must be less than the length of any recess.

[0058] The above-mentioned size design can effectively avoid interference between the cover 23 and the image sensor 21. By controlling the size matching relationship between the recess and the cover 23, it not only improves the mounting positioning accuracy and facilitates the installation and fixing operation, but also helps to achieve tight fit and improve sealing performance, and provides tolerance compensation space for the assembly process.

[0059] refer to Figure 9 as well as Figure 13 As shown, the filter assembly 30 further includes a filter, which is embedded in the filter receiving portion 313. The filter receiving portion 313 is disposed opposite to the image sensor 21, thereby making the filter parallel to the image sensor 21 along the optical path propagation direction. (Refer to...) Figure 14 As shown, the photosensitive component 20 further includes circuit elements 25. The circuit elements 25 are distributed on both sides of the image sensor 21 with the image sensor 21 as the axis. The circuit elements 25 can be implemented as basic components such as capacitors or resistors. The filter, image sensor 21, and circuit board 22 are arranged sequentially along the direction of light propagation. The filter and image sensor 21 are positioned on the filter base 31. The circuit board 22 is arranged parallel to the filter base 31. The circuit elements 25 are distributed on both sides of the image sensor 21 on the filter base 31 with the image sensor 21 as the axis. This layout allows the circuit elements 25 to achieve optimal layout in a limited space, thereby improving the integration of the camera module.

[0060] refer to Figure 11 and Figure 14 As shown, at least one pair of cover members 23 are correspondingly disposed in the receiving space formed by at least one pair of first recesses 3111 and at least one pair of second recesses 2211. The first recesses 3111 and the second recesses 2211 form a complementary mating structure along the Z-axis direction, and the shapes and sizes of the first recesses 3111 and the second recesses 2211 match each other. When the housing base 11 and the circuit board 22 are assembled along the Z-axis, the first recess 3111 and the second recess 2211 together form a receiving space for reliably fixing the cover 23. The cooperation structure between the cover 23 and the first recess 3111 and the second recess 2211 can achieve complete coverage of the clearance hole 3112, thus solving the space limitation problem faced in the application of the large image sensor 21. When the gap between the long side of the circuit board 22 and the long side of the image sensor 21 is too narrow, a reliable sealed space is formed on the side of the filter base 31 and the side of the circuit board 22, and the cover 23 is provided to effectively prevent the image sensor 21 from being exposed. This design significantly improves the structural reliability while ensuring the high resolution and high performance of the camera module, and has the advantages of simple process and optimized cost.

[0061] Furthermore, the width of the cover 23 along the Z-axis is greater than the width of the clearance hole 3112 and less than or equal to the sum of the widths of the first recess 3111 and the second recess 2211. This dimensional configuration ensures that the cover 23 can completely cover the clearance hole 3112, guaranteeing the airtightness of the space where the image sensor 21 is located, while avoiding increasing the shoulder height of the camera module and facilitating the attachment process. The length of the cover 23 along the X-axis is greater than the length of the clearance hole 3112 and less than or equal to the smaller of the lengths of the first recess 3111 and the second recess 2211. This design ensures complete coverage of the clearance hole 3112 while providing tolerance compensation space for assembly. Even if the recesses are not perfectly aligned, reliable attachment is still possible to ensure the stability of the camera module. This achieves reliable sealing under narrow gap conditions, significantly reducing the sealing failure rate compared to traditional insert injection molding solutions.

[0062] In this embodiment, the cover 23 can be a metal sheet. In one example, the metal sheet can be made of high-strength stainless steel, with a thickness ranging from 0.01mm to 0.1mm, preferably 0.05mm. Stainless steel offers high strength while maintaining a thin thickness, allowing it to fit within the narrow gap and cover the clearance hole 3112 without affecting the thickness and height of the camera module, thus occupying less space and simplifying the process. Alternatively, in some embodiments, the cover 23 can be made of alternative materials such as titanium alloy sheets or nickel-based alloy sheets, which also possess high strength, corrosion resistance, and ultra-thin forming characteristics. The surface of the cover 23 can undergo micro-arc oxidation treatment to enhance adhesive bonding. This surface treatment process increases the shear strength of the bonding interface by more than 30%, further improving sealing reliability. In other embodiments, the cover 23 can be made of other materials, such as plastic sheets, resin sheets, metal foils, hard alloy foils, ceramic patches, carbon fiber sheets, or inorganic composite sheets, to balance rigidity, lightweight, and thinness.

[0063] refer to Figure 15As shown, adhesive 24 is disposed between the cover 23 and the first recess 3111 to bond the cover 23 to the housing 10. This adhesive 24 is preferably a hybrid adhesive specifically designed for optical component assembly. This hybrid adhesive combines the advantages of multiple bonding technologies, exhibiting excellent bonding strength and stability, making it particularly suitable for the assembly requirements of precision optical components. After curing, adhesive 24 maintains stable optical performance, meeting the high standards required for camera modules. The shear strength of adhesive 24 after curing is greater than or equal to 15 MPa, and it maintains stable optical performance under temperature cycling from -40°C to 85°C. The bonding strength of adhesive 24 is determined by the thickness of adhesive 24, the contact area between the cover 23 and the two recesses, and the material properties of adhesive 24 itself. By rationally designing the coating thickness of adhesive 24, optimizing the contact area between the cover 23 and the first recess 3111 and the second recess 2211, and combining this with the high viscosity of the hybrid adhesive, the possibility of the cover 23 detaching from the receiving space can be significantly reduced. The thickness of the cover 23 along the Y-axis is less than the depth of the first recess 3111. The cover 23 is bonded to the surfaces of the first recess 3111 and the second recess 2211 by adhesive 24. This connection method achieves complete coverage of the clearance hole 3112, which not only creates a sealed environment to protect the image sensor 21, but also ensures the bonding strength and reduces the risk of the housing base 11 peeling off from the circuit board 22, thereby significantly improving the structural reliability and imaging quality of the camera module.

[0064] Furthermore, the assembly process of the camera module adopts a step-by-step implementation method. First, the circuit board 22 and the housing 10 are initially fixed with adhesive 24. Then, the cover 23 is attached. Considering the unavoidable tolerance factors in material manufacturing and assembly, the short sides of the first recess 3111 and the second recess 2211 may be misaligned, and the inner surfaces of the first recess 3111 and the second recess 2211 may also have flatness deviations. In this case, after the cover 23 is attached, adhesive 24 is used for compensation filling to make up for the flatness deviation, effectively ensuring the sealing integrity of the space where the image sensor 21 is located. The compensation measures ensure stable imaging effect without affecting the reliability of the periscope module. Compared with the traditional one-time assembly method, the assembly yield is increased by 50% to 80%.

[0065] See reference 2 and Figure 16As shown, the camera module provided in this application is a periscope camera module. The camera module also includes a light-directing element 50, a lens assembly 60, and a driving assembly 70. The cover 40 has an outer surface that is in contact with the external environment. The light-directing element 50 is disposed within the accommodating space and is adapted to change the propagation direction of incident light. The lens assembly 60 is disposed within the accommodating space and located on the light-sensing path of the image sensor 21 in the photosensitive assembly 20. (Reference) Figure 2 As shown, the camera module further includes a driving component 70, which is disposed within the accommodating space and is used to drive the lens assembly 60 to achieve optical zoom function.

[0066] The camera module is designed to achieve a low shoulder height while ensuring reliable installation of a large image sensor. It solves the sealing failure problem caused by space compression in traditional periscope camera modules. Compared with existing technical solutions, it significantly improves the overall reliability of the camera module and has the advantages of high assembly efficiency and low cost. The camera module is particularly suitable for application scenarios in mobile terminal devices where thickness is strictly limited and high-resolution imaging performance is required.

[0067] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A camera module, characterized in that, include: A filter base has at least one pair of first base sidewalls, the first base sidewalls being recessed inward to form a first recess, the first recess having a clearance hole that penetrates the first base sidewalls in a direction perpendicular to the first base sidewalls, for providing clearance space for an image sensor. A circuit board for carrying the image sensor, the circuit board having a first sidewall, the first sidewall of the circuit board having a second recess corresponding to the first recess; A cover is embedded in the receiving space formed by the first recess and the second recess, and covers the clearance hole; as well as An adhesive is disposed in the receiving space for fixing the cover, the filter base and the circuit board together. The first base sidewall is recessed inward along the Y direction to form a first recess, the clearance hole penetrates the first base sidewall along the Y direction, the image sensor is parallel to the XY plane, and the image sensor and the circuit board are arranged along the Z direction; The first sidewall of the circuit board is a sidewall corresponding to the long side of the image sensor, and a gap is left between the first sidewall of the circuit board and the long side of the image sensor. The second recess at least partially overlaps with the gap along the short side of the image sensor. The length of the clearance hole is less than the length of the first recess, and the width of the clearance hole is less than the width of the first recess.

2. The camera module as described in claim 1, characterized in that, The cover completely covers the clearance hole in a projection plane parallel to the side wall of the first base, and the thickness of the cover is less than the smaller of the depths of the first recess and the second recess.

3. The camera module as described in claim 1, characterized in that, The first recess is generally U-shaped and includes multiple side surfaces and a bottom surface penetrated by the clearance hole, the bottom surface and at least one of the side surfaces serving as contact surfaces for the adhesive.

4. The camera module as described in claim 1, characterized in that, The second recess forms a stepped positioning platform relative to the first recess. One end of the cover is fixed to the positioning platform by the adhesive, and the positioning platform serves as the installation reference.

5. The camera module as described in claim 1, characterized in that, The first recess forms a stepped positioning platform relative to the second recess. One end of the cover is fixed to the positioning platform by the adhesive, and the positioning platform serves as the installation reference.

6. The camera module as described in claim 1, characterized in that, The bottom surfaces of the first recess and the second recess are flush with each other and partially overlap along their length, with the shorter one forming the mounting reference for the cover.

7. The camera module as described in claim 1, characterized in that, The bottom surface of the first recess and the second recess is closer to the long side of the image sensor, and the minimum distance between the bottom surface of the recess and the long side of the image sensor is ≥50μm.

8. The camera module as described in claim 1, characterized in that, The width of the gap between the first sidewall of the circuit board and the long side of the image sensor is less than 0.2 mm.

9. The camera module as described in any one of claims 1-8, characterized in that, Also includes: cover; The outer casing has an accommodating space covered by the lid; Light deflecting elements are used to change the propagation direction of incident light; The lens assembly is disposed within the accommodating space and located on the light-sensing path of the image sensor; A driving component, disposed within the accommodating space, is used to drive the lens assembly to achieve optical zoom.

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