Display panel and display device

Abstract

The invention provides a display panel and a display device.The display panel comprises a base plate and a light-emitting assembly, the base plate comprises a substrate and a bonding layer, the bonding layer is arranged on one side of the substrate, and the bonding layer comprises a plurality of spaced bonding parts; the light-emitting assembly is arranged on the side, away from the substrate, of the bonding layer, the light-emitting assembly comprises a plurality of light-emitting devices, and one light-emitting device corresponds to at least two bonding parts and is connected with the at least two bonding parts; each bonding part comprises a main bonding sub-part and an auxiliary bonding sub-part, a gap is formed between the main bonding sub-part and the auxiliary bonding sub-part, and at least one of the main bonding sub-part and the auxiliary bonding sub-part is electrically connected with the light-emitting device, so that the bonding success rate of the light-emitting device is improved, the problem of bonding deviation after the light-emitting device is transferred is avoided, and the light-emitting device is improved. And abnormal color development of the display device is caused.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] Micro Light Emitting Diode (Micro LED) as a new generation of display technology, compared with traditional Light Emitting Diode (LED), has higher photoelectric efficiency, higher brightness, higher contrast and lower power consumption; therefore, Micro LED is widely used in display products.

[0003] At present, after the transfer of the Micro LED chip is completed, the Micro LED chip needs to be detected and repaired. The industry mainly uses redundant circuits and in-situ repair technology to repair the bad points, wherein the redundant circuit needs to occupy a large design space, which is not conducive to improving the pixel density (PPI) and narrow frame design of the display screen, and the in-situ repair technology needs to remove the original Micro LED with bright abnormality, then shape the remaining electrode, and then bond the Micro LED, the process is relatively complex. SUMMARY

[0004] The embodiments of the present application provide a display panel and a display device to alleviate the deficiencies in the related art.

[0005] To achieve the above functions, the technical solutions provided by the embodiments of the present application are as follows:

[0006] The embodiments of the present application provide a display panel, comprising:

[0007] The substrate comprises a substrate and a bonding layer, the bonding layer is arranged on one side of the substrate, and the bonding layer comprises a plurality of bonding parts arranged at intervals;

[0008] The light emitting assembly is arranged on the side of the bonding layer away from the substrate, and the light emitting assembly comprises a plurality of light emitting devices, one light emitting device is arranged and connected corresponding to two bonding parts.

[0009] Among them, each bonding part comprises a main bonding subpart and an auxiliary bonding subpart, and there is a gap between the main bonding subpart and the auxiliary bonding subpart, and at least one of the main bonding subpart and the auxiliary bonding subpart is electrically connected with the light emitting device.

[0010] Optionally, in an embodiment, each light emitting device comprises at least two conductive parts arranged at intervals, the conductive part is located on the side of the light emitting device close to the substrate, and one conductive part is arranged corresponding to one bonding part.

[0011] The conductive part is connected with the main bonding sub-part, and / or the conductive part is connected with one end of the auxiliary bonding sub-part, and the other end of the auxiliary bonding sub-part is connected with the main bonding sub-part.

[0012] Optionally, in an embodiment, the display panel further comprises an electrical connection part, the electrical connection part is arranged on the side of the bonding layer away from the substrate, and a projection of the electrical connection part on the substrate does not overlap with a projection of the conductive part on the substrate.

[0013] The one end of the electrical connection part is connected with the main bonding sub-part, and the other end of the electrical connection part is connected with the auxiliary bonding sub-part.

[0014] Optionally, in an embodiment, the auxiliary bonding sub-part comprises at least one bonding electrode, the bonding electrode comprises a main body part and a lead-out part, the main body part is arranged on one side of the main bonding sub-part, and the lead-out part extends from the main body part to the direction close to the main bonding sub-part.

[0015] The projection of the main body part on the substrate at least partially overlaps with the projection of the conductive part on the substrate, the projection of the lead-out part on the substrate does not overlap with the projection of the conductive part on the substrate, the one end of the electrical connection part is connected with the main bonding sub-part, and the other end of the electrical connection part is connected with the lead-out part.

[0016] Optionally, in an embodiment, the auxiliary bonding sub-part comprises at least one first bonding electrode and at least one second bonding electrode, the first bonding electrode and the second bonding electrode are located between two adjacent main bonding sub-parts; the first bonding electrode is arranged and connected corresponding to the conductive part, and the second bonding electrode does not correspond to the conductive part.

[0017] Optionally, in an embodiment, the auxiliary bonding sub-part comprises at least one first bonding electrode and a plurality of second bonding electrodes, the first bonding electrode and the plurality of second bonding electrodes are arranged around a main bonding sub-part, the first bonding electrode is arranged and connected corresponding to the conductive part, and the second bonding electrode does not correspond to the conductive part.

[0018] Optionally, in an embodiment, the lead-out part of the first bonding electrode and the lead-out part of the second bonding electrode are arranged in parallel and at intervals.

[0019] The lead-out part of the first bonding electrode is connected with the main bonding sub-part through the electrical connection part, and the second bonding electrode is not connected with the main bonding sub-part.

[0020] Optionally, in an embodiment, a distance between the lead-out portion and the main bonding sub-portion is smaller than a distance between the main body portion and the main bonding sub-portion.

[0021] Optionally, in an embodiment, the conductive portion includes a first portion and a second portion, a footprint of the first portion on the substrate overlaps with a footprint of the bonding portion on the substrate, and a footprint of the second portion on the substrate does not overlap with the footprint of the bonding portion on the substrate.

[0022] wherein an area of the first portion is larger than an area of the second portion.

[0023] Embodiments of the present application also provide a display device including any of the display panels described above.

[0024] Advantages of embodiments of the present application: Embodiments of the present application provide a display panel and a display device. The display panel includes a substrate and a light emitting assembly. The substrate includes a base and a bonding layer. The bonding layer is disposed on one side of the base. The bonding layer includes a plurality of spaced bonding portions. The light emitting assembly is disposed on a side of the bonding layer away from the base. The light emitting assembly includes a plurality of light emitting devices. One light emitting device corresponds to and is connected to at least two bonding portions. By providing that one bonding portion includes a main bonding sub-portion and an auxiliary bonding sub-portion that are spaced apart, at least one of the main bonding sub-portion and the auxiliary bonding sub-portion is electrically connected to the light emitting device. This improves the bonding success rate of the light emitting device and avoids the problem of bonding offset after the light emitting device is transferred, which leads to abnormal color display of the display device. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative effort based on these drawings.

[0026] Figure 1 is a top view of a display panel in the related art;

[0027] Figure 2 is a top view of a display panel in the related art Figure 1 is a cross-sectional view at A-A';

[0028] Figure 3 is a first top view of a display panel provided by an embodiment of the present application;

[0029] Figure 4 is a second top view of a display panel provided by an embodiment of the present application Figure 3A cross-sectional schematic view at B-B`;

[0030] Figure 5 A first top view of the bonding layer provided by the embodiments of the present application;

[0031] Figure 6 A first top view of the display panel provided by the embodiments of the present application Figure 3 A cross-sectional schematic view at C-C`;

[0032] Figure 7 A second top view of the display panel provided by the embodiments of the present application;

[0033] Figure 8 A second top view of the display panel provided by the embodiments of the present application Figure 3 A cross-sectional schematic view at D-D`;

[0034] Figure 9 A third top view of the display panel provided by the embodiments of the present application;

[0035] Figure 10 A third top view of the display panel provided by the embodiments of the present application Figure 9 A cross-sectional schematic view at E-E`;

[0036] Figure 11 A fourth top view of the display panel provided by the embodiments of the present application;

[0037] Figure 12 A structure schematic view of the display device provided by the embodiments of the present application. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application. In addition, it should be understood that the specific implementation manners described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, the orientation words such as "upper" and "lower" generally refer to the upper and lower in the actual use or working mode of the device, and specifically refer to the direction of the drawing surface in the drawings; and "inner" and "outer" refer to the contour of the device.

[0039] In addition, the terms "first" and "second" are only used for description purposes, and the features limited by "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more than two, unless otherwise specifically limited.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections or connections that allow communication; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] The following disclosure provides many different embodiments for implementing different structures of this application. To simplify the disclosure of this application, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0042] It should be noted that after the transfer of the miniature LED chip is complete, bonding misalignment often occurs, leading to abnormal color display in the display device; for example, please refer to... Figure 1 and Figure 2 ;in, Figure 1 This is a top view of a display panel in the related technology; Figure 2 For related technologies Figure 1 A cross-sectional view at EE'; In related technologies, the display panel 1 includes a substrate 11 and a light-emitting component 12. The substrate 11 includes a substrate 111 and a bonding layer 112. The bonding layer 112 is disposed on one side of the substrate 111 and includes two bonding portions 1121 spaced apart. The light-emitting component 12 is disposed on the side of the bonding layer 112 away from the substrate 111. The light-emitting component 12 includes two conductive portions 121, one conductive portion 121 corresponding to one bonding portion 1121 and connected thereto. In this case, the light-emitting component 12 experiences bonding offset, and the contact area between the conductive portion 121 and the bonding portion 1121 is small.

[0043] Currently, the industry mainly uses redundant circuits and in-situ repair techniques to repair defective pixels. Among them, adding redundant circuits takes up a lot of space: adding redundant circuits will occupy a lot of design space, which will prevent the pixel density (PPI) from being improved. At the same time, more circuit design and wiring may affect the narrow bezel design of the screen. In addition, in-situ repair technology requires precise removal of abnormal micro LED chips, which is a complex process and requires high equipment precision. The remaining electrodes need to be shaped to adapt to the new micro LED chips, further increasing the process complexity.

[0044] This application provides a display panel and a display device. These will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0045] Please combine Figure 3 , Figure 4 and Figure 5 ;in, Figure 3 This is a first top view of the display panel provided in the embodiments of this application; Figure 4 Provided for the embodiments of this application Figure 3 A schematic diagram of the cross-section at BB'; Figure 5 This is a first top view of the bonding layer provided in an embodiment of this application.

[0046] In one embodiment, the display panel 2 includes a substrate 21 and a light-emitting component 22. The substrate 21 includes a substrate 211 and a bonding layer 212. The bonding layer 212 is disposed on one side of the substrate 211 and includes a plurality of bonding portions 2121 spaced apart. The bonding portions 2121 are used to connect the light-emitting component 22. The light-emitting component 22 is disposed on the side of the bonding layer 212 away from the substrate 211 and includes a plurality of light-emitting devices 221. Each light-emitting device 221 is disposed and connected to at least two bonding portions 2121.

[0047] The substrate 211 may be either a rigid substrate or a flexible substrate. When the substrate 211 is a rigid substrate, the material may be metal or glass. When the substrate 211 is a flexible substrate, the material may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane-based resin, cellulose resin, siloxane resin, polyimide-based resin, and polyamide-based resin. The bonding portion 2121 may be made of a conductive material, including but not limited to titanium, aluminum, copper, and nickel. The light-emitting device 221 may be a micro light-emitting diode chip, but this embodiment does not impose any specific limitations on this.

[0048] Specifically, each of the bonding portions 2121 includes a main bonding portion 21211 and an auxiliary bonding portion 21212, with a notch 21213 between the main bonding portion 21211 and the auxiliary bonding portion 21212. At least one of the main bonding portion 21211 and the auxiliary bonding portion 21212 is electrically connected to the light-emitting device 221, thereby ensuring the transmission of electrical signals in the display panel 2 and the operation of the light-emitting device 221.

[0049] It should be noted that, in at least part of the bonding part 2121, the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212 can be spaced apart by the gap 21213; specifically, the gap 21213 can penetrate the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212 in the thickness direction of the bonding part 2121, so that a part of the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212 are spaced apart.

[0050] It can be understood that, by including the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212 in each bonding part 2121, and having a gap 21213 between the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212, and at least one of the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212 being electrically connected to the light emitting device 221, the design makes each light emitting device 221 have at least two bonding sub-parts that can be electrically connected thereto, thereby increasing the bonding area of the substrate 21, avoiding the problem of bonding deviation after the light emitting device 221 is transferred, and improving the bonding success rate of the light emitting device 221; at the same time, rapid repair can be realized without the need for complex removal and shaping steps.

[0051] Please continue to combine Figure 3 , Figure 4 and Figure 5 ; in an embodiment, a plurality of the bonding parts 2121 are spaced apart along a first direction, the main bonding sub-parts 21211 and the auxiliary bonding sub-parts 21212 are arranged along the first direction, and the auxiliary bonding sub-part 21212 is located between two adjacent main bonding sub-parts 21211; wherein the first direction can be the X direction in Figure 3 .

[0052] Each light emitting device 221 includes at least two conductive parts 2211 spaced apart, the conductive part 2211 is located on the side of the light emitting device 221 close to the substrate 21, and one conductive part 2211 corresponds to one bonding part 2121; wherein, in the conductive part 2211 and its corresponding bonding part 2121, the conductive part 2211 is connected to the main bonding sub-part 21211; and / or the conductive part 2211 is connected to one end of the auxiliary bonding sub-part 21212, and the other end of the auxiliary bonding sub-part 21212 is connected to the main bonding sub-part 21211.

[0053] It should be noted that the main bonding sub-part 21211 has a larger orthographic projection on the substrate than the auxiliary bonding sub-part 21212, and the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212 can both serve as the bonding sub-part structure of the display panel 2.

[0054] It can be understood that, in the embodiment, each of the conductive parts 2211 corresponds to one of the bonding parts 2121, each of the bonding parts 2121 includes a main bonding sub-part 21211 and an auxiliary bonding sub-part 21212, and a gap 21213 is arranged between the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212, each of the conductive parts 2211 corresponds to at least two bonding sub-parts instead of a single bonding sub-part, so that the space occupied by a single bonding sub-part is reduced, more light emitting devices 221 can be arranged in a limited space, and the pixel density is improved; compared with the traditional method of increasing a large amount of redundant circuits, the embodiment directly realizes redundancy on the layout of the light emitting device 221 and the bonding part 2121, so that the space occupied by the redundant circuits is reduced, and the narrow frame design is facilitated.

[0055] Please continue to combine Figure 3 , Figure 4 and Figure 5 ; in an embodiment, the conductive part 2211 includes a first part 22111 and a second part 22112, a normal projection of the first part 22111 on the substrate 211 overlaps a normal projection of the bonding part 2121 on the substrate 211, and a normal projection of the second part 22112 on the substrate 211 does not overlap a normal projection of the bonding part 2121 on the substrate 211; wherein the area of the first part 22111 is greater than the area of the second part 22112.

[0056] It can be understood that, in the embodiment, the area of the first part 22111 is greater than the area of the second part 22112, so that firm electrical connection between the conductive part 2211 and the bonding part 2121 is ensured, and the possibility of electrical connection failure is reduced.

[0057] Specifically, among the conductive part 2211 and the corresponding bonding part 2121, the area of the normal projection of the conductive part 2211 on the substrate 21 is less than the sum of the area of the normal projection of the main bonding sub-part 21211 on the substrate 21 and the area of the normal projection of the auxiliary bonding sub-part 21212 on the substrate 21, so that the bonding success rate of the light emitting device 221 is improved; and by controlling the area of the conductive part 2211, the circuit design is optimized, the electromagnetic interference between different circuits is reduced, and the stability and performance of the overall circuit are improved.

[0058] Please continue to combine Figure 3 , Figure 4 and Figure 5In an embodiment, the display panel 2 further comprises a driving layer 23, which is arranged between the bonding layer 212 and the substrate 211, and is used to control the driving and operation of the light emitting device 221; wherein the driving layer 23 is provided with a driving circuit, and the light emitting device 221 is arranged on the side of the driving layer 23 away from the substrate 211, and the light emitting device 221 can be connected with the driving circuit in the driving layer 23 through the bonding part 2121, and the driving circuit provides an electrical signal for the light emitting device 221, so that the light emitting device 221 can emit light.

[0059] Specifically, the technical solution of the present application is exemplified by taking each light emitting device 221 comprising a first conductive part 2211A and a second conductive part 2211B arranged at intervals as an example; wherein the first conductive part 2211A and the second conductive part 2211B are both located on the side of the light emitting device 221 close to the substrate 21, and the first conductive part 2211A and the second conductive part 2211B are respectively arranged corresponding to the bonding part 2121.

[0060] In the first conductive part 2211A and the corresponding bonding part 2121, the first conductive part 2211A is connected with the main bonding sub-part 21211, the main bonding sub-part 21211 is electrically connected with the driving layer 23, and the first conductive part 2211A is not connected with the auxiliary bonding sub-part 21212; in the second conductive part 2211B and the corresponding bonding part 2121, the second conductive part 2211B is not connected with the main bonding sub-part 21211, the second conductive part 2211B is connected with one end of the auxiliary bonding sub-part 21212, the other end of the auxiliary bonding sub-part 21212 is connected with the main bonding sub-part 21211, and the main bonding sub-part 21211 is electrically connected with the driving layer 23, thereby realizing the closure of the circuit and the signal transmission.

[0061] It can be understood that the embodiment realizes the bonding connection of the light emitting device 221 and the substrate 21, and supplies power for the light emitting device 221 through the driving circuit, so that the light emitting device 221 can emit light, by setting the light emitting device 221 to include the first conductive part 2211A and the second conductive part 2211B, in the bonding part 2121 corresponding to the first conductive part 2211A, the first conductive part 2211A is connected with the main bonding sub-part 21211, in the bonding part 2121 corresponding to the second conductive part 2211B, the second conductive part 2211B is connected with the auxiliary bonding sub-part 21212, and the auxiliary bonding sub-part 21212 is connected with the main bonding sub-part 21211. At the same time, by connecting the auxiliary bonding sub-part 21212 with the main bonding sub-part 21211, the overall layout of the circuit is simplified, the complex wiring requirement is reduced, and the manufacturing difficulty and cost are reduced.

[0062] It should be noted that, in an ideal case, after the light emitting device 221 completes the transfer process, in the bonding part 2121 corresponding to the first conductive part 2211A, the first conductive part 2211A only corresponds to and is connected with the main bonding sub-part 21211, and in the bonding part 2121 corresponding to the second conductive part 2211B, the second conductive part 2211B only corresponds to and is connected with the main bonding sub-part 21211. However, after the light emitting device 221 completes the transfer, the problem of bonding offset is prone to occur. The embodiment sets one conductive part 2211 corresponding to one bonding part 2121, each bonding part 2121 includes a main bonding sub-part 21211 and an auxiliary bonding sub-part 21212, and the main bonding sub-part 21211 and the auxiliary bonding sub-part 21212 have a gap 21213 therebetween. Each conductive part 2211 corresponds to at least two bonding sub-parts, so as to increase the bonding area of the substrate 21 and improve the bonding success rate of the light emitting device 221.

[0063] In the above, in the process of transferring the light emitting device 221, the second conductive part 2211B of the light emitting device 221 is bonded to the main bonding sub-part 21211 of the bonding layer 212, and the second conductive part 2211B of the light emitting device 221 is overlapped on the auxiliary bonding sub-part 21212 of the bonding layer 212. For example, the second conductive part 2211B of the light emitting device 221 is not overlapped on the main bonding sub-part 21211 of the bonding layer 212. The technical solutions of the present application are illustrated by taking the first conductive part 2211A connected to the main bonding sub-part 21211 and / or the first conductive part 2211A connected to the auxiliary bonding sub-part 21212, and / or the second conductive part 2211B connected to the main bonding sub-part 21211 and / or the second conductive part 2211B connected to the auxiliary bonding sub-part 21212 as examples. It should be noted that the first conductive part 2211A and the second conductive part 2211B are not limited to the above.

[0064] Please refer to Figure 6 and Figure 7 ; wherein, Figure 6 is a second top view of the display panel provided in the embodiments of the present application; Figure 7 is a second top view of the display panel provided in the embodiments of the present application; Figure 6 is a cross-sectional view at C-C'.

[0065] In an embodiment, each of the light emitting devices 221 includes a first conductive part 2211A and a second conductive part 2211B arranged at intervals, and the first conductive part 2211A and the second conductive part 2211B are located on the side of the light emitting device 221 close to the substrate 21. The first conductive part 2211A and the second conductive part 2211B are respectively arranged corresponding to the bonding part 2121.

[0066] In the first conductive part 2211A and the bonding part 2121 corresponding thereto, the first conductive part 2211A is connected to the main bonding sub-part 21211, and the main bonding sub-part 21211 is electrically connected to the driving layer 23. The first conductive part 2211A is not connected to the auxiliary bonding sub-part 21212. In the second conductive part 2211B and the bonding part 2121 corresponding thereto, the second conductive part 2211B is connected to the main bonding sub-part 21211, and one end of the second conductive part 2211B is connected to the auxiliary bonding sub-part 21212. The other end of the auxiliary bonding sub-part 21212 is connected to the main bonding sub-part 21211, and the main bonding sub-part 21211 is electrically connected to the driving layer 23, thereby realizing the closure of the circuit and the signal transmission.

[0067] Specifically, in the second conductive part 2211B and its corresponding bonding part 2121, the orthogonal projection of the second conductive part 2211B on the substrate 211 at least partially overlaps with the orthogonal projection of the main bonding sub-part 21211 on the substrate 211, and the orthogonal projection of the second conductive part 2211B on the substrate 211 at least partially overlaps with the orthogonal projection of the auxiliary bonding sub-part 21212 on the substrate 211.

[0068] It can be understood that, by arranging the second conductive part 2211B to be connected with the main bonding sub-part 21211, the second conductive part 2211B to be connected with one end of the auxiliary bonding sub-part 21212, and the other end of the auxiliary bonding sub-part 21212 to be connected with the main bonding sub-part 21211, and the main bonding sub-part 21211 to be electrically connected with the driving layer 23, the circuit is closed and signal transmission is achieved, and the problem of excessive contact resistance caused by the overlap area between the light-emitting device 221 and the bonding layer 212 being too small due to misalignment, thereby affecting the display backlighting effect, is avoided.

[0069] Please refer to Figure 3 , Figure 4 , Figure 5 and Figure 8 ; wherein, Figure 8 is provided by the embodiments of the present application Figure 3 the cross-sectional schematic view at D-D'.

[0070] In an embodiment, the display panel 2 further comprises an electrical connection part 24, which is arranged on the side of the bonding layer 212 away from the substrate 211, and the orthogonal projection of the electrical connection part 24 on the substrate 211 does not overlap with the orthogonal projection of the conductive part 2211 on the substrate 211; wherein one end of the electrical connection part 24 is connected with the main bonding sub-part 21211, and the other end of the electrical connection part 24 is connected with the auxiliary bonding sub-part 21212; the electrical connection part 24 is located above the gap 21213, and the material of the electrical connection part 24 includes but is not limited to conductive silver paste or other conductive materials.

[0071] It should be noted that after the transfer process of the light emitting device 221 is completed, the micro light emitting diode chip needs to be detected and repaired. When the display panel 2 is detected, the auxiliary bonding sub-department 21212 can be connected with the bonding sub-department by setting the electrical connection part 24, thereby reducing the complexity of the physical repair operation; at the same time, the electrical connection part 24 is arranged on the side of the bonding layer 212 away from the substrate 211, thereby forming a layered layout, which is beneficial to simplify the manufacturing process, reduce the manufacturing steps, and improve the production efficiency; and since the orthographic projection of the electrical connection part 24 on the substrate 211 and the orthographic projection of the conductive part 2211 on the substrate 211 do not overlap, the potential short circuit and electromagnetic interference risk between different electrical connection parts 24 is reduced, thereby improving the reliability and stability of the electrical connection; in addition, the electrical connection part 24 provides an independent electrical connection path, which is not affected by the position of the conductive part 2211, thereby ensuring the normal work of the light emitting device 221.

[0072] Please continue to combine Figure 3 , Figure 4 , Figure 5 and Figure 8 ; in an embodiment, the auxiliary bonding sub-department 21212 includes at least one bonding electrode 212121, and the bonding electrode 212121 includes a main body part 2121211 and a lead-out part 2121212, the main body part 2121211 is arranged on one side of the main bonding sub-department 21211, and the lead-out part 2121212 extends from the main body part 2121211 to the direction close to the main bonding sub-department 21211.

[0073] Wherein, the orthographic projection of the main body part 2121211 on the substrate 211 and the orthographic projection of the conductive part 2211 on the substrate 211 at least partially overlap, the orthographic projection of the lead-out part 2121212 on the substrate 211 and the orthographic projection of the conductive part 2211 on the substrate 211 do not overlap, at least part of the extension direction of the lead-out part 2121212 is parallel to the main bonding sub-department 21211, one end of the electrical connection part 24 is connected with the main bonding sub-department 21211, and the other end of the electrical connection part 24 is connected with the lead-out part 2121212, thereby realizing the connection between the bonding electrode 212121 and the main bonding sub-department 21211.

[0074] It can be understood that, in the embodiment, the auxiliary bonding sub-department 21212 includes at least one bonding electrode 212121, the bonding electrode 212121 includes a main body part 2121211 and a leading-out part 2121212, the main body part 2121211 is at least partially overlapped with the conductive part 2211 on the substrate 211, the leading-out part 2121212 is not overlapped with the conductive part 2211 on the substrate 211, the leading-out part 2121212 is connected with the main bonding sub-department 21211, thereby forming an independent electrical connection path, improving the reliability of electrical connection, and ensuring the normal operation of the light emitting device 221; meanwhile, at least part of the extension direction of the leading-out part 2121212 is parallel to the main bonding sub-department 21211, effectively utilizing the space of the display panel 2, making the whole layout more compact, and being beneficial to realize higher pixel density and narrow frame design.

[0075] Please combine Figure 9 and Figure 10 ; wherein, Figure 9 is a third top view of the display panel provided by the embodiment of the application; Figure 10 is a third top view of the display panel provided by the embodiment of the application Figure 9 is a cross-sectional schematic view at E-E'.

[0076] In an embodiment, the auxiliary bonding sub-department 21212 includes at least one first bonding electrode 212121A and at least one second bonding electrode 212121B, the first bonding electrode 212121A and the second bonding electrode 212121B are located between two adjacent main bonding sub-departments 21211; wherein, the first bonding electrode 212121A is arranged and connected corresponding to the conductive part 2211, and the second bonding electrode 212121B does not correspond to the conductive part 2211.

[0077] It should be noted that, in the embodiment, the auxiliary bonding sub-department 21212 includes one first bonding electrode 212121A and two second bonding electrodes 212121B to exemplarily illustrate the technical solution of the application.

[0078] The first bonding electrode 212121A is arranged on the substrate 211, and the normal projection of the first bonding electrode 212121A on the substrate 211 at least partially overlaps with the normal projection of the conductive part 2211 on the substrate 211. The second bonding electrode 212121B is arranged on the substrate 211, and the normal projection of the second bonding electrode 212121B on the substrate 211 does not overlap with the normal projection of the conductive part 2211 on the substrate 211. The lead-out part 2121212 of the first bonding electrode 212121A and the lead-out part 2121212 of the second bonding electrode 212121B are arranged in parallel and spaced apart. The lead-out part 2121212 of the first bonding electrode 212121A is connected to the main bonding sub-part 21211 through the electric connection part 24, and the second bonding electrode 212121B is not connected to the main bonding sub-part 21211. Specifically, the lead-out part 2121212 of the first bonding electrode 212121A and the lead-out part 2121212 of the second bonding electrode 212121B are arranged in parallel and spaced apart. The lead-out part 2121212 of the first bonding electrode 212121A is connected to the main bonding sub-part 21211 through the electric connection part 24, and the second bonding electrode 212121B is not connected to the main bonding sub-part 21211, thereby saving the manufacturing cost.

[0079] Specifically, in the conductive part 2211 and the corresponding bonding part 2121, one end of the electric connection part 24 is connected to the lead-out part 2121212 of the first bonding electrode 212121A, and the other end of the electric connection part 24 is connected to the main bonding sub-part 21211. It should be noted that, since the second bonding electrode 212121B is not connected to the conductive part 2211, the lead-out end of the second bonding electrode 212121B can be connected to the electric connection part 24 or not connected to the electric connection part 24, which does not affect the light emitting effect of the light emitting device 221. That is, when arranging the electric connection part 24, it is not necessary to consider whether the electric connection part 24 is connected to the second bonding electrode 212121B or not, and the position of the electric connection part 24 can be flexibly arranged.

[0080] It can be understood that the embodiment further increases the bonding area of the substrate 21 by arranging the auxiliary bonding sub-department 21212 to include at least one first bonding electrode 212121A and at least one second bonding electrode 212121B, the first bonding electrode 212121A is arranged and connected corresponding to the conductive part 2211, thereby avoiding the problem of bonding offset after the light emitting device 221 is completed to be transferred, and improving the bonding success rate of the light emitting device 221; at the same time, the design of multiple first bonding electrodes 212121A reduces the risk of single point failure, that is, even if one first bonding electrode 212121A fails, other first bonding electrodes 212121A can still maintain normal work of electrical connection, thereby enhancing the reliability of the backlight module; in addition, since the orthogonal projection of the second bonding electrode 212121B on the substrate 211 does not overlap with the orthogonal projection of the conductive part 2211 on the substrate 211, thereby reducing the path of electromagnetic interference, and improving the electromagnetic compatibility of the backlight module.

[0081] Please continue to combine Figure 9 and Figure 10 ; in an embodiment, the auxiliary bonding sub-department 21212 includes a plurality of bonding electrodes 212121, the bonding electrode 212121 includes a main body part 2121211 and a lead-out part 2121212, the main body part 2121211 is arranged between two adjacent main bonding sub-departments 21211; wherein, in the first direction, the width of the bonding electrode 212121 is greater than or equal to 1 micrometer and less than or equal to 5 micrometers, the spacing between the bonding electrode 212121 and the main bonding sub-department 21211 is greater than or equal to 1 micrometer and less than or equal to 5 micrometers, and the spacing between two adjacent bonding electrodes 212121 is greater than or equal to 1 micrometer and less than or equal to 5 micrometers.

[0082] Specifically, the spacing between the lead-out part 2121212 and the main bonding sub-department 21211 is less than the spacing between the main body part 2121211 and the main bonding sub-department 21211; it can be understood that the embodiment shortens the electrical connection path by arranging the lead-out part 2121212 close to the main bonding sub-department 21211, thereby reducing the resistance, and the shorter connection path reduces the resistance loss, which is helpful to realize more stable current transmission and improve the overall electrical performance of the light emitting device 221; at the same time, the connection between the lead-out part 2121212 and the main bonding sub-department 21211 is more compact, thereby reducing the complexity of wiring.

[0083] Please refer to Figure 11 , the fourth top view of the display panel 2 provided by the embodiment of the present application.

[0084] In an embodiment, the auxiliary bonding sub-portion 21212 includes at least one first bonding electrode 212121A and a plurality of second bonding electrodes 212121B, the first bonding electrode 212121A and the plurality of second bonding electrodes 212121B are disposed around the main bonding sub-portion 21211, the first bonding electrode 212121A is disposed and connected corresponding to the conductive portion 2211, and the second bonding electrode 212121B is not corresponding to the conductive portion 2211.

[0085] It should be noted that the present embodiment takes the auxiliary bonding sub-portion 21212 including one first bonding electrode 212121A and three second bonding electrodes 212121B as an example to illustrate the technical solutions of the present application.

[0086] Specifically, the first bonding electrode 212121A has a projection on the substrate 211 which at least partially overlaps with the projection of the conductive portion 2211 on the substrate 211, and the second bonding electrode 212121B has a projection on the substrate 211 which does not overlap with the projection of the conductive portion 2211 on the substrate 211; wherein the lead-out portion 2121212 of the first bonding electrode 212121A and the lead-out portion 2121212 of the second bonding electrode 212121B are parallel and spaced apart, the lead-out portion 2121212 of the first bonding electrode 212121A is connected to the main bonding sub-portion 21211 through the electrical connection portion 24, and the second bonding electrode 212121B is not connected to the main bonding sub-portion 21211, thereby saving manufacturing costs.

[0087] It can be understood that the embodiment further increases the bonding area of the substrate 21 by arranging the auxiliary bonding sub-department 21212 to include a plurality of first bonding electrodes 212121A and a plurality of second bonding electrodes 212121B, and arranging the plurality of first bonding electrodes 212121A and the plurality of second bonding electrodes 212121B around the main bonding sub-department 21211, i.e., the surrounding layout of the first bonding electrodes 212121A and the second bonding electrodes 212121B, thereby avoiding the problem of bonding deviation after the light emitting device 221 is transferred, and improving the bonding success rate of the light emitting device 221. At the same time, the design of the plurality of first bonding electrodes 212121A reduces the risk of single-point failure, so that even if one of the first bonding electrodes 212121A fails, the other first bonding electrodes 212121A can still maintain normal work of electrical connection, thereby enhancing the reliability of the backlight module. In addition, since the orthogonal projection of the second bonding electrode 212121B on the substrate 211 does not overlap with the orthogonal projection of the conductive part 2211 on the substrate 211, the path of electromagnetic interference is reduced, and the electromagnetic compatibility of the backlight module is improved.

[0088] Please refer to Figure 12 The structure of the display device provided by the embodiment of the present application is shown in the figure.

[0089] The embodiment also provides a display device, which comprises a terminal main body and a display module, and the terminal main body and the display module are combined into one body; wherein the display module comprises a display panel and the display panel in any of the above embodiments, the display panel can be a liquid crystal display panel (LCD), and the display panel is arranged on one side of the backlight of the display panel, and the brightness display of the display panel is realized by the light source provided by the display panel.

[0090] It can be understood that the display panel has been described in detail in the above embodiments, and will not be repeated here; the terminal main body can comprise a middle frame, and the middle frame and the display module are combined into one body to provide support and fixation and protection for the display module.

[0091] In specific applications, the display device can be at least one of a smart phone, a tablet computer, a mobile phone, a video phone, an electronic book reader, a desktop computer, a laptop computer, a netbook, a workstation, a server, a personal digital assistant, a portable media player, an MP3 player, a mobile medical machine, a camera, a game machine, a digital camera, a car navigation device, an electronic billboard, an automatic teller machine, or a wearable device, etc.

[0092] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0093] The display panel and the display device provided by the embodiments of the present application are described in detail above, and the principles and implementation manners of the present application are described by applying specific examples in this paper. The above description of the embodiments is only used to help understand the technical solutions of the present application and the core idea thereof. It should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features thereof can be replaced equivalently. The modification or replacement does not change the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate comprising a substrate and a bonding layer arranged on one side of the substrate, the bonding layer comprising a plurality of bonding portions arranged at intervals; a light-emitting assembly arranged on the side of the bonding layer away from the substrate, the light-emitting assembly comprising a plurality of light-emitting devices, one light-emitting device corresponding to two bonding portions and being connected; wherein each bonding portion comprises a main bonding sub-portion and an auxiliary bonding sub-portion, and a gap is formed between the main bonding sub-portion and the auxiliary bonding sub-portion, and at least one of the main bonding sub-portion and the auxiliary bonding sub-portion is electrically connected to the light-emitting device.

2. The display panel of claim 1, wherein, Each light-emitting device comprises at least two conductive portions arranged at intervals, the conductive portions being located on the side of the light-emitting device close to the substrate, and one conductive portion corresponding to one bonding portion; wherein, in the conductive portion and its corresponding bonding portion, the conductive portion is connected to the main bonding sub-portion; and / or the conductive portion is connected to one end of the auxiliary bonding sub-portion, and the other end of the auxiliary bonding sub-portion is connected to the main bonding sub-portion.

3. The display panel of claim 2, wherein, The display panel further comprises an electrical connection portion arranged on the side of the bonding layer away from the substrate, and the orthogonal projection of the electrical connection portion on the substrate does not overlap with the orthogonal projection of the conductive portion on the substrate; wherein one end of the electrical connection portion is connected to the main bonding sub-portion, and the other end of the electrical connection portion is connected to the auxiliary bonding sub-portion.

4. The display panel of claim 3, wherein, The auxiliary bonding sub-portion comprises at least one bonding electrode, the bonding electrode comprising a main body portion and a lead-out portion, the main body portion being arranged on one side of the main bonding sub-portion, and the lead-out portion extending from the main body portion towards the main bonding sub-portion; wherein the orthogonal projection of the main body portion on the substrate at least partially overlaps with the orthogonal projection of the conductive portion on the substrate, the orthogonal projection of the lead-out portion on the substrate does not overlap with the orthogonal projection of the conductive portion on the substrate, one end of the electrical connection portion is connected to the main bonding sub-portion, and the other end of the electrical connection portion is connected to the lead-out portion.

5. The display panel of claim 4, wherein, The auxiliary bonding sub-portion comprises at least one first bonding electrode and at least one second bonding electrode, the first bonding electrode and the second bonding electrode being located between two adjacent main bonding sub-portions; wherein the first bonding electrode corresponds to the conductive portion and is connected thereto, and the second bonding electrode does not correspond to the conductive portion.

6. The display panel of claim 4, wherein, The auxiliary bonding sub-portion comprises at least one first bonding electrode and a plurality of second bonding electrodes, the first bonding electrode and the plurality of second bonding electrodes being arranged around one main bonding sub-portion, the first bonding electrode corresponding to the conductive portion and being connected thereto, and the second bonding electrode not corresponding to the conductive portion.

7. The display panel of any of claims 5-6, wherein, The lead-out portions of the first bonding electrode and the second bonding electrode are arranged in parallel and at intervals; wherein the lead-out portion of the first bonding electrode is connected to the main bonding sub-portion through the electrical connection portion, and the second bonding electrode is not connected to the main bonding sub-portion.

8. The display panel of any of claims 5-6, wherein, The distance between the lead-out portion and the main bonding sub-portion is smaller than the distance between the main body portion and the main bonding sub-portion.

9. The display panel of claim 2, wherein, The conductive part includes a first portion and a second portion, a projection of the first portion on the substrate overlaps with a projection of the bonding part on the substrate, and a projection of the second portion on the substrate does not overlap with the projection of the bonding part on the substrate. The area of the first portion is greater than the area of the second portion.

10. A display device, characterized by comprising: A display panel comprising the display panel as claimed in any one of claims 1 to 9.

Images