Display module, preparation method of display module and display device

Abstract

The invention relates to the technical field of display preparation, and provides a display module, a preparation method of the display module and a display device.The display module comprises a cover plate and a display panel, the side, facing the cover plate, of the first surface of the cover plate is sunken, and the first surface is the face, close to the display panel, of the cover plate; the display panel comprises a display area, a bending area and a binding area, the bending area is connected with the display area and the binding area, and the orthographic projection of the display area is within the orthographic projection of the cover plate; the supporting layer is located on the side, away from the cover plate, of the display area and is integrally formed; wherein the supporting layer forms a containing space, the bending area is located in the containing space, and after the bending area is bent, the binding area is located on the side, away from the display area, of the supporting layer; the reliability of the display module provided by the invention is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module, a method for manufacturing the display module, and a display device. Background Technology

[0002] The purpose of the background description provided herein is to give an overall background to this application. The statements in this section are merely to provide background information relevant to this application and do not necessarily constitute prior art.

[0003] Currently, wearable products based on organic light-emitting diodes (OLEDs) are developing rapidly, and spherical displays are a popular research area. User demand for spherical display products is also growing stronger.

[0004] However, the reliability of the display modules in this technology is poor. Summary of the Invention

[0005] To address the aforementioned issues, this application proposes a display module, a method for manufacturing the display module, and a display device, thereby resolving the problem of poor reliability in display modules of related technologies.

[0006] This application provides a display module, including

[0007] A cover plate and a display panel, wherein a first surface of the cover plate is recessed toward one side of the cover plate, and the first surface is the side of the cover plate closest to the display panel;

[0008] The display panel includes a display area, a bending area, and a bonding area. The bending area is connected to the display area and the bonding area, respectively. The orthographic projection of the display area is within the orthographic projection of the cover plate.

[0009] A support layer is located on the side of the display area opposite to the cover plate and is integrally formed;

[0010] The support layer forms an accommodating space, the bending area is located within the accommodating space, and after the bending area is bent, the binding area is located on the side of the support layer opposite to the display area.

[0011] Optionally, the display module further includes:

[0012] A flexible circuit board is connected to the bonding area and located on the side surface of the support layer opposite to the display area.

[0013] Optionally, the support layer includes a first adhesive area and a second adhesive area. After the bending area is bent, the first adhesive area is located within the orthographic projection coverage of the flexible circuit board and the bonding area, and the second adhesive area is the area of ​​the support layer other than the first adhesive area.

[0014] The second adhesive area has its side surface away from the display area located between the side surface of the bonding area facing the display area and the side surface of the bonding area away from the display area.

[0015] Optionally, the display module further includes a fixing member for fixing the flexible circuit board and the support layer.

[0016] Optionally, the fastener includes a first part and a second part, the width of the first part being greater than the width of the second part, the first part being located on the side of the flexible circuit board away from the support layer, and the second part penetrating the flexible circuit board and extending into the support layer;

[0017] The width directions of the first part and the second part are parallel, and the width direction is perpendicular to the arrangement direction along the first part to the second part.

[0018] Optionally, the flexible circuit board includes a coding area, and a plurality of the fixing members are distributed at intervals between the coding area and the flexible circuit board.

[0019] Optionally, the width of the second part ranges from 0.2mm to 0.4mm;

[0020] Along the arrangement direction from the first part to the second part, the height of the second part ranges from 0.5mm to 1mm.

[0021] Optionally, the surface roughness of the second part is greater than that of the first part.

[0022] Optionally, the display module further includes: a first protective layer, a second protective layer, and a third protective layer;

[0023] After the bending area is bent, the first protective layer is located between the display area and the support layer, the second protective layer is located between the bonding area and the support layer, and the third protective layer is located between the bending area and the second adhesive area of ​​the support layer.

[0024] Both the first protective layer and the second protective layer are in contact with the support layer.

[0025] This application also provides a method for manufacturing a display module, including:

[0026] A cover plate and a display panel are provided. The first surface of the cover plate is recessed towards the side of the display panel. The display panel includes a display area, a bending area, and a bonding area. The bending area is connected to the display area and the bonding area respectively. The orthographic projection of the display area is within the orthographic projection of the cover plate.

[0027] An adhesive layer is formed by placing the adhesive on the side of the display area away from the cover plate.

[0028] The bending area is bent such that the bonding area is positioned opposite the display area, and at least a portion of the bending area is located in the adhesive layer;

[0029] After bending the bending area, the adhesive layer is cured to form a support layer.

[0030] Optionally, the bonding area is connected to the flexible circuit board before the adhesive is placed on the side of the display area away from the cover plate;

[0031] In the step of bending the bending area, the flexible circuit board is brought into contact with the adhesive on the side of the surface opposite to the display area.

[0032] Optionally, the adhesive layer includes a first adhesive area and a second adhesive area. After the bending area is bent, the first adhesive area is located between the flexible circuit board and the display area, and between the bonding area and the display area; the second adhesive area is located on the side of the flexible circuit board and the bonding area.

[0033] The second adhesive area has its side surface away from the display area located between the side surface of the bonding area facing the display area and the side surface of the bonding area away from the display area.

[0034] Optionally, the viscosity range of the adhesive is 800 mPa·s to 1500 mPa·s.

[0035] Optionally, the method further includes:

[0036] Before placing the adhesive on the side of the display area away from the cover plate, place the cover plate and the display panel in the lower mold;

[0037] After bending the bending area, the upper mold is placed on the side of the flexible circuit board and the bonding area opposite to the display area and is closed with the lower mold.

[0038] Optionally, the adhesive layer includes: a first adhesive region and a second adhesive region surrounding the side portion of the first adhesive region;

[0039] After the bending area is bent, the flexible circuit board comes into contact with the first adhesive area and a portion of the second adhesive area, and the bonding area is disposed opposite to a portion of the second adhesive area;

[0040] The step of curing the adhesive layer includes: curing the second adhesive area before closing the upper mold and the lower mold; and curing the first adhesive area after closing the upper mold and the lower mold.

[0041] Optionally, the second bonding area can be cured using a photocuring process; or the first bonding area can be cured using a thermocuring process or a moisture curing process.

[0042] Optionally, after bending the bending area, the flexible circuit board is positioned opposite to the first adhesive area;

[0043] The method for preparing the display module further includes: after curing the second adhesive area and before closing the upper mold and the lower mold, fixing the flexible circuit board and the first adhesive area with a fixing component.

[0044] Optionally, the fastener includes a first part and a second part, wherein the width of the first part is greater than the width of the second part; the width directions of the first part and the second part are parallel, and the width direction is perpendicular to the arrangement direction along the first part to the second part;

[0045] The step of fixing the flexible circuit board and the second adhesive area with a fastener includes: placing the first portion on the side of the flexible circuit board away from the first adhesive area, and extending the second portion through the flexible circuit board and into the first adhesive area.

[0046] This application also provides a display device, including the display module described above.

[0047] In the display module provided in this application, the support layer is located on the side of the display area away from the cover plate and is integrally formed; wherein, at least part of the bending area is located in the support layer, and the bonding area is located on the side of the support layer away from the display area. This provides at least the following beneficial technical effects: the integrally formed support layer can cover the opposing bending surfaces of the bending area of ​​the display panel, avoiding the formation of gaps between the support layer and the bending area. Therefore, when the bending area is subjected to external force, the support layer can provide better protection for the bending area extending into the support layer. The support layer can buffer the external force before acting on the bending area, thus enhancing the bending area's ability to resist deformation under external force. This improves the reliability of the display module.

[0048] In the method for manufacturing the display module provided in this application, an adhesive is placed on the side of the display area away from the cover plate. Because the adhesive has a certain degree of fluidity, it does not exert significant pressure on the display panel, thus avoiding uneven light and shadow effects on the side of the cover plate away from the display panel. After placing the adhesive on the side of the display area away from the cover plate, the bent area is bent so that the bonding area is positioned opposite the display area. At least a portion of the bent area is located within the adhesive, which can cover the bent area, preventing gaps from forming between the adhesive and the bent area. After bending the bent area, the adhesive is cured, forming a support layer. Correspondingly, the support layer can cover the bent area, preventing gaps from forming between the support layer and the bent area. Therefore, when the bent area is subjected to external force, the support layer can provide better protection for the bent area extending into the support layer. The support layer can buffer the external force before acting on the bent area, thus enhancing the bent area's resistance to deformation. Furthermore, the adhesive curing process does not exert significant pressure on the display panel, preventing uneven light and shadow effects on the side of the cover plate away from the display panel, thus avoiding mold marks. This improves the reliability of the display module. Secondly, the processes of placing the adhesive on the side of the display area away from the cover plate and curing the adhesive are relatively easy to implement, thus reducing the complexity of the manufacturing process. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0050] It should also be noted that, for ease of description, only the parts relevant to this disclosure are shown in the accompanying drawings. The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions in this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0051] Figures 1 to 4 This is a schematic diagram of the display module manufacturing process in related technologies;

[0052] Figure 5 This is a schematic diagram of the structure of a display module provided in one embodiment of this application;

[0053] Figure 6 for Figure 5 Enlarged view of areas C and D within the middle wireframe;

[0054] Figure 7This invention provides a schematic diagram of the structure of a fixing member in a display module according to an embodiment of the present application.

[0055] Figure 8 A top view of a display module provided in one embodiment of this application is shown;

[0056] Figure 9 A flowchart illustrating a method for manufacturing a display module according to an embodiment of this application is shown;

[0057] Figures 10 to 17 This is a schematic diagram of the manufacturing process of a display module provided in one embodiment of this application.

[0058] Reference numerals in the figures: cover plate 101, first surface 1011, display panel 102, display area 1021, bending area 1022, bonding area 1023, first surface of bonding area 10233, second surface of bonding area 10232, flexible circuit board 103, optical adhesive 104, polarizer 105; first protective layer 10211, second protective layer 10231, adhesive layer 113a, support layer 113, first adhesive area 1131, second adhesive area 113a, second adhesive area 113a, etc. Zone 1132, first support layer 107, second support layer 108, adhesive layer 109, flexible circuit board back adhesive 110, bending zone gap 111, cover layer 112, fastener 114, first part 1141, second part 1142, lower mold 115, lower mold buffer layer 1151, lower mold body 1152, upper mold 116, upper mold first buffer layer 1161, upper mold body 1162, upper mold second buffer layer 1163. Detailed Implementation

[0059] In related technologies, methods for manufacturing display modules include: (Refer to...) Figure 1 A cover plate 101 and a display panel 102 are provided. The first surface 1011 of the cover plate 101 is recessed towards the display panel 102. The display panel 102 includes a display area 1021, a bending area 1022, and a bonding area 1023. The bending area 1022 is connected to both the display area 1021 and the bonding area 1023. The display area 1021 extends along a portion of the first surface 1011. The bonding area 1023 is connected to a flexible circuit board 103. A protective layer 112 is provided on the bending surface of the bending area 1022 facing away from the support structure. An irregularly shaped support structure is prepared, including a first support layer 107 and a second support layer 108. For example, the material of the first support layer 107 is textured adhesive, and the material of the second support layer 108 is silicone. Figure 2 The prepared support structure is placed on the side of the display area 1021 opposite to the cover plate 101; then, in conjunction with the reference... Figure 3 and Figure 4 , Figure 3 In order to be in Figure 2 A basic diagram. Figure 4 for Figure 3 Enlarged views of dashed boxes A and B. Figure 4 The diagram of the left-hand area is as follows Figure 3 Enlarged view of dashed box A. Figure 4 The diagram of the right-hand side is as follows Figure 3 An enlarged view of the dashed box A shows that the bending area 1022 is bent so that the bonding area 1023 is positioned opposite to the display area 1021, and the flexible circuit board 103 and the support structure are bonded together, as well as the bonding area 1023 and the display area 1021 are bonded together.

[0060] However, the reliability of display modules produced by the above-mentioned manufacturing method is poor. Research has found that the reason is as follows:

[0061] The first support layer 107 and the second support layer 108 of the support structure have dimensional errors during processing. When the support structure is placed on the side of the display area 1021 away from the cover plate 101, localized areas of the support structure exert significant pressure on the display area 1021, causing mold marks to form on the surface of the display panel 102. Secondly, after bending the bending area 1022, a large gap 111 exists between the support structure and the bending area 1022, and the support structure is not covered by the protective layer 112 on the side away from the bending area 1022. This weakens the bending area 1022's ability to resist deformation under external forces, thus reducing the reliability of the display module. Furthermore, the process of fabricating irregularly shaped support structures and achieving precise positioning is quite challenging.

[0062] Based on this, the embodiments of this application propose a display module, a method for preparing the display module, and a display device, thereby improving the reliability of the display module.

[0063] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0064] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0065] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0066] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0067] Figure 5 This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 6 for Figure 5 Enlarged view of dashed boxes C and D. Figure 6 The diagram of the left-hand area is as follows Figure 5 Enlarged view of the dashed box C. Figure 6 The diagram of the right-hand side is as follows Figure 5 Enlarged view of the dashed box D.

[0068] One embodiment of this application provides a display module, see reference... Figure 5 and Figure 6 The display module may include:

[0069] The cover plate 101 and the display panel 102, wherein the first surface 1011 of the cover plate 101 is recessed on one side facing the cover plate 101, and the first surface 1011 is the surface of the cover plate 101 close to the display panel 102;

[0070] The display panel 102 includes a display area 1021, a bending area 1022, and a bonding area 1023. The bending area 1022 is connected to the display area 1021 and the bonding area 1023 respectively. The orthographic projection of the display area 1021 is within the orthographic projection of the cover plate 101.

[0071] The support layer 113 is located on the side of the display area 1021 opposite to the cover plate 101 and is integrally formed;

[0072] The support layer 113 forms an accommodating space, the bending area 1022 is located within the accommodating space, and after the bending area is bent, the binding area 1023 is located on the side of the support layer 113 away from the display area 1021.

[0073] In the display module provided in this embodiment, the support layer 113 is integrally formed and located on the side of the display area 1021 opposite to the cover plate 111. At least a portion of the bending area 1022 is located in the support layer 113, and the bonding area 1023 is located on the surface of the support layer 113 opposite to the display area 1021. The integrally formed support layer 113 can cover the bending area 1022 of the display panel 102, avoiding the formation of gaps between the support layer 113 and the bending area 1022. Therefore, when the bending area 1022 is subjected to external force, the support layer 113 provides better protection for the bending area 1022 extending into the support layer 113. After buffering the external force, the support layer 113 acts on the bending area 1022, thus enhancing the bending area 1022's ability to resist deformation. This improves the reliability of the display module.

[0074] In one embodiment, the display module is an organic light-emitting diode (OLED) display module, such as a wearable display module.

[0075] In one embodiment, reference Figure 5 The display module further includes a flexible circuit board 103, which is connected to the bonding area 1023 and located on the side surface of the support layer 113 opposite to the display area 1021. The flexible circuit board 103 is in contact with the side surface of the support layer 113 opposite to the display area 1021.

[0076] In a specific example, the display surface of display area 1021 is curved. The back surface of display area 1021, opposite to the display surface, is also curved. The display module meets the practical needs of wearable devices, such as smartwatches or smart bracelets.

[0077] In one embodiment, the area of ​​the first surface 1011 of the cover plate 101 is larger than the area of ​​the display surface of the display area 1021, and the edge of the cover plate 101 extends beyond the edge of the display area 1021.

[0078] The cover plate 101 is a light-transmitting cover plate, so that the image displayed in the display area 1021 can be observed from the side of the cover plate 101 away from the display area 1021. For example, the light-transmitting cover plate is a glass cover plate.

[0079] In one embodiment, the support layer 113 includes a first adhesive area 1131 and a second adhesive area 1132. After the bending area is bent, the first adhesive area 1131 is located within the orthographic projection coverage of the flexible circuit board 103 and the bonding area 1023, and the second adhesive area 1132 is the area of ​​the support layer 113 other than the first adhesive area 1131.

[0080] The second adhesive area 1132 has its side surface facing away from the display area 1021 located between the side surface of the bonding area 1023 facing the display area 1021 and the side surface of the bonding area 1023 facing away from the display area 1021.

[0081] This exposes the side surface of the flexible circuit board 103 facing away from the display area 1021 and the side surface of the bonding area 1023 facing away from the display area 1021, without affecting the bonding between the side surface of the flexible circuit board 103 facing away from the display area 1021 and the integrated circuit chip.

[0082] This application effectively simplifies the structure of the display module through the integrally molded support layer 103.

[0083] In one embodiment, reference Figure 5 The display module further includes a fixing member 114 for fixing the flexible circuit board 103 and the support layer 113. The fixing member 114 can fix the flexible circuit board 103 and the support layer 113, preventing the flexible circuit board 103 and the support layer 113 from separating.

[0084] In one embodiment, the material of the fastener 114 includes, but is not limited to, resin material and metal material.

[0085] Figure 7 A structural schematic diagram of the fastener provided in an embodiment of the present invention is shown.

[0086] Reference Figure 7 In one embodiment, the fastener 114 includes a first portion 1141 and a second portion 1142. The width of the first portion 1141 is greater than the width of the second portion 1142. The first portion 1141 is located on the side of the flexible circuit board 103 opposite to the support layer 113. The second portion 1142 penetrates the flexible circuit board 103 and extends into the support layer 113. The width directions of the first portion 1141 and the second portion 1142 are parallel and perpendicular to the arrangement direction of the first portion 1141 to the second portion 1142.

[0087] In one embodiment, the width 'a' of the second portion 1142 can range from 0.2 mm to 0.4 mm.

[0088] In one embodiment, along the arrangement direction from the first portion 1141 to the second portion 1142, the height h of the second portion 1142 can range from 0.5 mm to 1 mm.

[0089] In a specific example, the width 'a' of the second part 1142 may take values ​​including, but not limited to, 0.2mm, 0.25mm, 0.3mm, 0.35mm, and 0.4mm; and the height 'h' of the second part 1142 may take values ​​including, but not limited to, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1mm.

[0090] In a specific example, h is between 0.5mm and 1mm. This serves two purposes: firstly, it prevents the second portion 1142 from contacting the display panel 102, thus avoiding damage to the display area 1021; secondly, the height of the second portion 1142 is not too small, ensuring sufficient contact area between the second portion 1142 and the support layer 113. The height of the second portion 1142, within the aforementioned range, effectively prevents damage to the display surface 102 while providing good fixation for the flexible circuit board 103 and the support layer 113.

[0091] In one embodiment, the surface roughness of the second portion 1142 is greater than that of the first portion 1141. By setting a larger roughness for the second portion 1142, the firmness of the connection between the second portion 1142 and the support layer 113 can be improved, further enhancing the stability and reliability of the fixation between the flexible circuit board 103 and the support layer 113.

[0092] The number of fasteners may be one or more. Figure 5 In this example, two fasteners are used. In other embodiments, one fastener may be provided, or more than three fasteners may be provided.

[0093] Figure 9 A top view of the display module provided in an embodiment of the present invention is shown.

[0094] Reference Figure 9 In one embodiment, the flexible circuit board 103 has a coding area 1031 on the side surface opposite to the support layer 113. In a specific example, the fastener 114 avoids the coding area 1031, that is, the fastener 114 and the coding area 1031 are spaced apart.

[0095] In one embodiment, reference Figure 6The display module further includes a first protective layer 10211 and a second protective layer 10231. The first protective layer 10211 is located between the display area 1021 and the support layer 113, and the second protective layer 10231 is located between the bonding area 1023 and the support layer 113. Both the first protective layer 10211 and the second protective layer 10231 are in contact with the support layer 113.

[0096] In one embodiment, the materials of the first protective layer 10211 and the second protective layer 10231 include, but are not limited to, alumina, silicon oxide, etc.

[0097] In one embodiment, reference Figure 6 The display module also includes a third protective layer 10221, which is located between the bending area 1022 and the second adhesive area 1132.

[0098] In one embodiment, the material of the third protective layer 10221 is acrylic adhesive.

[0099] The bending area 1022 has opposing first and second bending surfaces, the second bending surface being connected to the back side of the display area 1021 opposite to the cover plate 101. The second bending surface is in contact with the support layer 113.

[0100] In one embodiment, reference Figure 6 The display module also includes: a polarizing film layer 105, located between the display area 1021 and the cover plate 101; and an optical adhesive layer 104, located between the polarizing film layer 105 and the cover plate 101, with the optical adhesive layer 104 having a certain overlap with the third protective layer 10221.

[0101] Another embodiment of the present invention provides a method for manufacturing a display module, referring to... Figure 9 The preparation method may include:

[0102] Step 910: Provide a cover plate and a display panel, wherein a first surface of the cover plate is recessed inward, and the display panel includes a display area, a bending area, and a binding area, wherein the bending area is connected to the display area and the binding area respectively, and the display area extends along a portion of the first surface;

[0103] Step 920: Apply adhesive to the side of the display area away from the cover plate to form an adhesive layer;

[0104] Step 930: Bend the bending area so that the bonding area is positioned opposite the display area, and at least a portion of the bending area is located in the adhesive layer;

[0105] Step 940: After bending the bending area, cure the adhesive layer to form a support layer.

[0106] In the method for manufacturing the display module provided in this embodiment, an adhesive is placed on the side of the display area away from the cover plate. Because the adhesive has a certain degree of fluidity, it does not exert significant pressure on the display panel, thus avoiding uneven light and shadow effects on the side of the cover plate away from the display panel. After placing the adhesive on the side of the display area away from the cover plate, the bent area is bent so that the bonding area is positioned opposite the display area. At least a portion of the bent area is located within the adhesive layer, and the adhesive layer can cover the bent area to prevent gaps from forming between the adhesive and the bent area. After bending the bent area, the adhesive layer is cured to form a support layer. Correspondingly, the support layer can cover the bent surface of the bent area, preventing gaps from forming between the support layer and the bent area. Therefore, when the bent area is subjected to external force, the support layer can provide good protection for the bent area extending into the support layer. The support layer plays a certain buffering role against external forces, enhancing the ability of the bent area to resist deformation. Furthermore, the curing process of the adhesive layer does not exert significant pressure on the display panel, preventing uneven light and shadow effects on the side of the cover plate away from the display panel, thus avoiding mold marks. This improves the reliability of the display module. Secondly, the processes of placing the adhesive on the side of the display area away from the cover plate and curing the adhesive (also referred to as the adhesive layer in this embodiment) are relatively easy to implement, thereby reducing the complexity of the process.

[0107] The following is for reference. Figures 10 to 17 A detailed explanation will follow.

[0108] Reference Figure 10 Step 910 provides a cover plate 101 and a display panel 102. The first surface 1011 of the cover plate 101 is recessed on one side facing the cover plate 101. The first surface 1011 is the surface of the cover plate 101 close to the display panel 102. The display panel 102 includes a display area 1021, a bending area 1022 and a binding area 1023. The bending area 1022 is connected to the display area 1021 and the binding area 1023 respectively. The orthographic projection of the display area is within the orthographic projection of the cover plate.

[0109] Furthermore, in order to improve the stability of the cover plate 101 and the display panel 102 in subsequent processing, the method for preparing the display module may further include: placing the cover plate 101 and the display panel 102 in the lower mold 115.

[0110] In a specific example, the lower mold 115 includes a lower mold frame 1152 and a lower mold body 1151. The hardness of the lower mold frame 1152 is greater than that of the lower mold body 1151. The material of the lower mold body 1151 is, for example, silicone, and the material of the lower mold frame 1152 is, for example, metal. The lower mold frame 1152 provides support, while the lower mold body 1151 provides support, stability, and protection for the display module to ensure the stability of its position and angle during the manufacturing process and to guarantee the quality of the display module. The lower mold frame 1152 surrounds the bottom surface and side walls of the lower mold body 1151.

[0111] In one embodiment, the method further includes placing the adhesive 113a on the side of the display area 1021 facing away from the cover plate 101 before the bonding area 1023 is connected to the flexible circuit board 103;

[0112] In the step of bending the bending area 1023, the flexible circuit board 103 is brought into contact with the surface of the adhesive layer 113a on the side opposite to the display area.

[0113] It can be done by placing the cover plate 101 and the display panel 102 before the lower mold 115, and connecting the bonding area 1023 to the flexible circuit board 103 to facilitate the bonding process.

[0114] Reference Figure 11 In step 920, adhesive 113a is placed on the side of the display area 1021 away from the cover plate 101 to form an adhesive layer.

[0115] In one embodiment, adhesive 113a is placed on the side of the display area 1021 opposite to the cover plate 101 according to a pre-stored injection amount. Optionally, the injection amount can be calculated based on the design structure of the display module and obtained through experimental correction.

[0116] Specifically, the adhesive must meet flowability requirements to achieve automatic leveling after injection.

[0117] Because adhesive 113a has a certain degree of fluidity, it will not put too much pressure on the display panel 102, thus avoiding uneven light and shadow effects on the side of the cover plate 101 away from the display surface of the display panel 102.

[0118] In one embodiment, the adhesive 113a has thermosetting and photocurable properties; or, the adhesive 113a has photocurable and moisture-curable properties; or, the adhesive 113a has thermosetting properties; or, the adhesive 113a has moisture-curable properties.

[0119] For adhesives that can be cured in two ways, step-by-step curing of the adhesive can be achieved to further improve the stability of the display module manufacturing process.

[0120] Step 930: Bend the bending area 1022 so that the bonding area 1023 is positioned opposite to the display area 1021, and at least a portion of the bending area 1022 is located in the adhesive layer.

[0121] Reference Figure 12 and Figure 13 , Figure 12 In order to be in Figure 11 A basic diagram. Figure 13 It shows Figure 12 A partially enlarged schematic diagram, in which Figure 13 The diagram on the left is Figure 12 Enlarged view of the dashed box C. Figure 13 The diagram on the right is Figure 12 Enlarged view of the dashed box D.

[0122] The bending area 1022 is bent so that the bonding area 1023 is positioned opposite to the display area 1021, and at least a portion of the bending area 1022 is located in the adhesive 113a.

[0123] The adhesive layer 113a includes a first adhesive area 1131 and a second adhesive area 1132. After the bending area is bent, the first adhesive area 1131 is located between the flexible circuit board 103 and the display area 1021, and between the bonding area 1023 and the display area 1021; the second adhesive area 1132 is located on the side of the flexible circuit board 103 and the bonding area 1132.

[0124] The second adhesive area 1132 has its side surface facing away from the display area 1021 located between the side surface of the bonding area 1023 facing the display area 1021 and the side surface of the bonding area 1023 facing away from the display area 1021.

[0125] Reference Figure 13 The surface of the binding area 1023 facing the display area 1021 is the first surface 10233 of the binding area, and the surface of the binding area 1023 away from the display area 1021 is the second surface 10232 of the binding area.

[0126] In one embodiment, reference Figure 6 The display module also includes: a first protective layer 10211 and a second protective layer 10231.

[0127] After bending the bending area 1022, the first protective layer 10211 is located between the display area 1021 and the support layer 113, and the second protective layer 10231 is located between the binding area 1023 and the support layer 113. Both the first protective layer 10211 and the second protective layer 10231 are in contact with the support layer 113.

[0128] In one embodiment, the materials of the first protective layer 10211 and the second protective layer 10231 include, but are not limited to, alumina, silicon oxide, etc.

[0129] In one embodiment, reference Figure 6 The display module also includes a third protective layer 10221, which is located between the bending area 1022 and the second adhesive area 1132 of the support layer after the bending area is bent.

[0130] Adhesive 113a can cover the bending area 1022 to prevent gaps from forming between adhesive 113a and bending area 1022.

[0131] In one embodiment, before the adhesive 113a is placed on the side of the display area 1021 away from the cover plate 101, the bonding area 1023 is connected to the flexible circuit board 103; in the step of bending the bending area 1022, the flexible circuit board 103 is brought into contact with the surface of the adhesive 113a on the side away from the display area 1021.

[0132] In one embodiment, after bending the bending region 1022, for the adhesive 113a located on the side of the flexible circuit board 103 and the bonding region 1023, the side surface of the adhesive 113a facing away from the display area 1021 lies between the side surface of the bonding region 1023 facing the display area 1021 and the side surface of the bonding region 1023 facing away from the display area 1021. After bending the bending region 1022, the adhesive 113a exposes the side surface of the flexible circuit board 103 facing away from the display area 1021 and the side surface of the bonding region 1023 facing away from the display area 1021, without affecting the subsequent bonding of the side surface of the flexible circuit board 103 facing away from the display area 1021 to the integrated circuit chip. In one embodiment, the viscosity range of the adhesive 113a is 800 mPa·s to 1500 mPa·s. The adhesive 113a has good flowability. In a specific example, the viscosity of the adhesive may include, but is not limited to, 800 mPa·s, 900 mPa·s, 1000 mPa·s, 1200 mPa·s, and 1500 mPa·s.

[0133] In one embodiment, the adhesive layer 113a includes a first adhesive region 1131 and a second adhesive region 1132 surrounding a side portion of the first adhesive region. After bending the bending region 1022, the flexible circuit board 103 contacts the first adhesive region 1131 and a portion of the second adhesive region 1132. In one embodiment, after bending the bending region 1022, the flexible circuit board 103 is disposed opposite to the first adhesive region 1131.

[0134] refer to Figures 14 to 17 , Figure 14 In order to be in Figure 12 A basic diagram. Figure 15 It shows Figure 14 A partially enlarged schematic diagram, in which Figure 15 The diagram on the left is Figure 14 Enlarged view of the dashed box C. Figure 15 The diagram on the right is Figure 14 An enlarged view of the dashed box D in the middle. Figure 16 In order to be in Figure 14 A basic diagram. Figure 17 In order to be in Figure 16 Based on the schematic diagram, after bending the bending area 1022, the adhesive 113a is cured to form the support layer 113.

[0135] The curing process of the adhesive will not put too much pressure on the display panel, thus avoiding uneven light and shadow effects on the side of the cover plate away from the display panel, which also avoids mold marks.

[0136] In one embodiment, reference Figure 17 The method further includes:

[0137] Before placing the adhesive 113a on the side of the display area 1021 away from the cover plate 101, place the cover plate 101 and the display panel 102 in the lower mold 115;

[0138] After bending the bending area, the upper mold 116 is placed on the side of the flexible circuit board 103 and the binding area 1023 away from the display area 1021 and is closed with the lower mold 115.

[0139] The adhesive layer 113a includes: a first adhesive region 1131 and a second adhesive region 1132 surrounding the side portion of the first adhesive region;

[0140] After bending the bending area 1022, the flexible circuit board 103 comes into contact with the first adhesive area 1031 and a portion of the second adhesive area 1032, and the bonding area 1023 is disposed opposite to a portion of the second adhesive area 1032.

[0141] The step of curing the adhesive layer 113a includes: curing the second adhesive area 1132 before closing the upper mold 116 and the lower mold 115; and curing the first adhesive area 1131 after closing the upper mold 116 and the lower mold 115.

[0142] In one embodiment, the first adhesive area 1131 is cured using a thermosetting process or a moisture curing process.

[0143] refer to Figure 14 and Figure 15 The second adhesive area 1132 is then cured.

[0144] In one embodiment, the second adhesive region 1132 is cured using a photocuring process.

[0145] In one embodiment, after bending the bending area 1022, the flexible circuit board 103 is disposed opposite to the first adhesive area 1131; the method further includes:

[0146] After the second bonding area 1132 is cured, and before the upper mold 116 and the lower mold 115 are closed, the flexible circuit board 103 and the first bonding area 1131 are fixed by the fastener 114.

[0147] The second adhesive area 1132 is cured to initially fix the bonding area 1023 and the flexible circuit board 103, thereby improving the positional stability of the bonding area 1023 and the flexible circuit board 103 in subsequent processes. (Reference) Figure 16 After the second adhesive area 1132 is cured, the flexible circuit board 103 and the first adhesive area 1131 are fixed by the fastener 114.

[0148] Reference Figure 7 In one embodiment, the fastener 114 includes a first portion 1141 and a second portion 1142, wherein the width of the first portion 1141 is greater than the width of the second portion 1142.

[0149] The step of fixing the flexible circuit board 103 and the first adhesive area 1132 with the fastener 114 includes: placing the first part 1141 on the side of the flexible circuit board 103 away from the first adhesive area 1131, and extending the second part 1142 through the flexible circuit board 103 and into the first adhesive area 1131.

[0150] The width direction of one part 1141 and the width direction of the second part 1142 are parallel, and the width direction is perpendicular to the arrangement direction along the first part 1141 to the second part 1142.

[0151] In a specific example, the width 'a' of the second part 1142 ranges from 0.2 mm to 0.4 mm.

[0152] In one embodiment, along the arrangement direction from the first portion 1141 to the second portion 1142, the height h of the second portion 1142 ranges from 0.5 mm to 1 mm.

[0153] In a specific example, the width 'a' of the second part 1142 may take values ​​including, but not limited to, 0.2mm, 0.25mm, 0.3mm, 0.35mm, and 0.4mm; and the height 'h' of the second part 1142 may take values ​​including, but not limited to, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1mm.

[0154] In one embodiment, the surface roughness of the second portion 1142 is greater than that of the first portion 1141. By setting a larger roughness for the second portion 1142, the strength of the connection between the second portion 1142 and the subsequently formed support layer 113 can be improved.

[0155] In a specific example, the position of the fastener 114 should avoid various components on the flexible circuit board 103.

[0156] In one embodiment, the flexible circuit board 103 has a coding area 1031 on the side surface facing away from the adhesive 113a, and the fastener 114 avoids the coding area, that is, the fastener 114 and the coding area are spaced apart.

[0157] It should be noted that in other embodiments, the fastener 114 may not be provided.

[0158] refer to Figure 17 After curing the second bonding area, the upper mold 116 is placed on the side of the flexible circuit board and the bonding area away from the display area and is closed with the lower mold 115; after closing the upper mold 116 and the lower mold 115, the first bonding area 1131 is cured.

[0159] In one embodiment, the first adhesive region 1131 is cured using a thermosetting process or a moisture curing process.

[0160] In one embodiment, after fixing the flexible circuit board 103 and the first adhesive area 1131 with the fastener 114, the upper mold 116 is placed on the side of the flexible circuit board and the adhesive area away from the display area and is closed with the lower mold 115.

[0161] In one embodiment, the upper mold 116 includes an upper mold body 1161, an upper mold frame 1162, and an upper mold buffer layer 1163. The upper mold frame 1162 has a higher hardness than the upper mold body 1161. The upper mold body 1161 is located between the upper mold buffer layer 1163 and the upper mold frame 1162.

[0162] In a specific example, the upper mold body 1161 is made of silicone, and the upper mold buffer layer 1163 is made of contoured foam. The shape of the upper mold buffer layer 1163 conforms to the display module and is used to protect the display module. The upper mold frame 1162 is made of metal.

[0163] After the upper mold 116 and the lower mold 115 are closed, the display module is fully fixed, and the positional changes of the various structures of the display module are reduced during the adhesive curing process.

[0164] In some embodiments, after the upper mold 116 and the lower mold 115 are closed, the adhesive 113a is cured by a thermosetting process or a moisture curing process.

[0165] The support layer can cover the bent surface of the bending area, preventing gaps from forming between the support layer and the bending area. Therefore, when the bending area is subjected to external force, the support layer can provide better protection for the bending area extending into the support layer. The support layer can buffer the external force before it acts on the bending area, thus enhancing the bending area's ability to resist deformation. The process of placing the adhesive on the side of the display area away from the cover plate and the process of curing the adhesive are both relatively easy to implement, thus reducing the process difficulty.

[0166] Another embodiment of this application provides a method for preparing a display module. The difference between this embodiment and the previous embodiment is that after the upper mold and the lower mold are closed, a thermosetting process or a moisture curing process is used to cure the adhesive. After the upper mold and the lower mold are closed, each area of ​​the adhesive is cured together, simplifying the process.

[0167] In one embodiment, the adhesive is thermosetting; or, the adhesive is moisture-curing.

[0168] Another embodiment of this application provides a display device, including the display module described above.

[0169] In a specific example, the display device may include, but is not limited to, display devices such as smartwatches and smart bracelets.

[0170] Those skilled in the art will understand that the structure shown in this embodiment does not constitute a limitation on the system of the present application embodiment, and may include more or fewer modules / units than shown, or combine certain modules / units, or have different module / unit arrangements.

[0171] Finally, it should be noted that in the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "a single example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0172] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A display module, characterized by The display module comprises: a cover plate and a display panel, a first surface of the cover plate is recessed towards one side of the cover plate, and the first surface is a surface of the cover plate close to the display panel; the display panel comprises a display area, a bending area and a binding area, the bending area is connected with the display area and the binding area respectively, and a projection of the display area is within a projection of the cover plate; a support layer is located on a side of the display area away from the cover plate and is integrally formed; wherein the support layer forms a containing space, the bending area is located in the containing space, and the binding area is located on a side of the support layer away from the display area after the bending area is bent.

2. The display module of claim 1, wherein, Further comprising: a flexible circuit board connected with the binding area and located on a side surface of the support layer away from the display area.

3. The display module of claim 2, wherein, The support layer comprises a first adhesive area and a second adhesive area, the first adhesive area is located within a projection coverage range of the flexible circuit board and the binding area after the bending area is bent, and the second adhesive area is a region of the support layer other than the first adhesive area; a side surface of the second adhesive area away from the display area is located between a side surface of the binding area towards the display area and a side surface of the binding area away from the display area.

4. The display module of claim 2, wherein, The display module further comprises a fixing member for fixing the flexible circuit board and the support layer.

5. The display module of claim 4, wherein, The fixing member comprises a first part and a second part, a width of the first part is greater than a width of the second part, the first part is located on a side of the flexible circuit board away from the support layer, and the second part penetrates through the flexible circuit board and extends into the support layer; the width direction of the first part and the second part is parallel, and the width direction is perpendicular to an arrangement direction from the first part to the second part.

6. The display module of claim 4, wherein, The flexible circuit board comprises a code spraying area, and a plurality of fixing members are distributed in the flexible circuit board and spaced apart from the code spraying area.

7. The display module of claim 5, wherein, The width of the second part ranges from 0.2 mm to 0.4 mm; in the arrangement direction from the first part to the second part, the height of the second part ranges from 0.5 mm to 1 mm.

8. The display module of claim 5, wherein, The surface roughness of the second part is greater than the surface roughness of the first part.

9. The display module of any one of claims 1 to 8, wherein, The display module further comprises a first protective layer, a second protective layer and a third protective layer; after the bending area is bent, the first protective layer is located between the display area and the support layer, the second protective layer is located between the binding area and the support layer, and the third protective layer is located between the bending area and the second adhesive area of the support layer; wherein the first protective layer and the second protective layer are in contact with the support layer.

10. A method for manufacturing a display module, characterized by, The display module comprises: a cover plate and a display panel, a first surface of the cover plate is recessed towards one side of the cover plate, and the first surface is a surface of the cover plate close to the display panel; the display panel comprises a display area, a bending area and a binding area, the bending area is connected with the display area and the binding area respectively, and a projection of the display area is within a projection of the cover plate; an adhesive is placed on a side of the display area away from the cover plate to form an adhesive layer; bending the bending area to arrange the binding area opposite to the display area, at least part of the bending area is located in the adhesive layer; solidifying the adhesive layer to form a support layer after bending the bending area.

11. The method for manufacturing a display module according to claim 10, characterized in that, Before the adhesive is placed on the side of the display area away from the cover plate, the binding area is connected with a flexible circuit board; In the step of bending the bending area, the flexible circuit board is in surface contact with the side of the adhesive away from the display area.

12. The method of claim 11, wherein the display module is prepared by the steps of: The adhesive layer comprises a first adhesive area and a second adhesive area, after bending the bending area, the first adhesive area is located in the projection coverage range of the flexible circuit board and the binding area, and the second adhesive area is the area of the support layer except the first adhesive area; ​ The side surface of the second adhesive area away from the display area is located between the side surface of the binding area facing the display area and the side surface of the binding area away from the display area.

13. The method for preparing the display module according to claim 10, characterized in that, The viscosity of the adhesive ranges from 800 mPa·s to 1500 mPa·s.

14. The method of claim 11, wherein the display module is prepared by the steps of: Further comprising: ​ Before the adhesive is placed on the side of the display area away from the cover plate, the cover plate and the display panel are placed in a lower mold; After bending the bending area, an upper mold is placed on the side of the flexible circuit board and the binding area away from the display area and is combined with the lower mold.

15. The method for preparing a display module according to claim 14, characterized in that, The adhesive layer comprises a first adhesive area and a second adhesive area surrounding the side of the first adhesive area; After bending the bending area, the flexible circuit board is in contact with the first adhesive area and part of the second adhesive area, and the binding area is arranged opposite to part of the second adhesive area; The step of solidifying the adhesive layer comprises: solidifying the second adhesive area before the upper mold and the lower mold are combined; and solidifying the first adhesive area after the upper mold and the lower mold are combined.

16. The method of claim 15, wherein the display module is prepared by the steps of: The second adhesive area is solidified by using a light curing process, and the first adhesive area is solidified by using a thermal curing process or a moisture curing process.

17. The method for preparing a display module according to claim 15, characterized in that, After bending the bending area, the flexible circuit board is arranged opposite to the first adhesive area; The method for manufacturing the display module further comprises: after solidifying the second adhesive area and before combining the upper mold and the lower mold, fixing the flexible circuit board and the first adhesive area by using a fixing member.

18. The method for preparing a display module according to claim 17, characterized in that, The fixing member comprises a first part and a second part, the width of the first part is greater than the width of the second part; the width direction of the first part and the second part is parallel, and the width direction is perpendicular to the arrangement direction from the first part to the second part; The step of fixing the flexible circuit board and the second adhesive area by using the fixing member comprises: placing the first part on the side of the flexible circuit board away from the first adhesive area, and penetrating the second part through the flexible circuit board and extending into the first adhesive area.

19. A display device comprising the display module according to any one of claims 1 to 9.

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