Display panel, preparation method thereof and display device

Abstract

The invention relates to a display panel, a preparation method thereof and a display device. The display panel includes: a substrate; the isolation structure is arranged on one side of the substrate; the isolation structure comprises a first isolation structure located in the first region and a second isolation structure located at the junction of the first region and the second region; a plurality of first isolation openings are formed in the first isolation structure; the plurality of light-emitting elements are arranged on one side of the substrate and are arranged corresponding to the plurality of first isolation openings; at least part of the light-emitting element is arranged in the corresponding first isolation opening; and the protection layer covers at least part of the side wall, facing the second region, of the second isolation structure. The display performance of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising next-generation flat panel display technology. Compared to LCD technology, OLED technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed. However, current OLED display panels suffer from display defects. Summary of the Invention

[0003] Therefore, it is necessary to provide a display panel that can improve the display effect, as well as a method for manufacturing the same and a display device.

[0004] In a first aspect, embodiments of this application provide a display panel having a first region and a second region adjacent to the first region; the display panel includes:

[0005] substrate;

[0006] An isolation structure is disposed on one side of the substrate; the isolation structure includes a first isolation structure located in the first region and a second isolation structure located at the junction of the first region and the second region; the first isolation structure is provided with a plurality of first isolation openings;

[0007] Multiple light-emitting elements are disposed on one side of the substrate and are correspondingly disposed with the multiple first isolation openings; at least a portion of the light-emitting elements are disposed within the corresponding first isolation openings;

[0008] A protective layer covers at least a portion of the sidewalls of the second isolation structure facing the second region.

[0009] The display panel provided in this application embodiment, by providing a protective layer that covers at least a portion of the sidewalls of the second isolation structure facing the second region, can protect the second isolation structure. Thus, during the manufacturing process of the display panel, the erosion of the sidewalls of the second isolation structure by the process solution is reduced. On the one hand, this helps prevent ion deposition in the second isolation structure from affecting the light-emitting element and its luminous performance; on the other hand, it helps reduce the risk of encapsulation failure caused by the erosion of the second isolation structure, thereby improving the reliability of the display panel.

[0010] In one embodiment, the first area is a display area, and the second area is a border area;

[0011] Optionally, the border area surrounds the periphery of the display area;

[0012] Optionally, the isolation structure further includes a third isolation structure located in the border area, the third isolation structure being electrically connected to the first isolation structure;

[0013] The display panel further includes an array film layer disposed between the substrate and the isolation structure; the third isolation structure is electrically connected to the wiring in the array film layer;

[0014] Optionally, the protective layer also covers at least a portion of the sidewalls of the third isolation structure;

[0015] Optionally, the display panel further includes a dam, which is disposed in the frame area and surrounds the outer periphery of the isolation structure;

[0016] Optionally, the display panel further includes an organic encapsulation layer, which is disposed on the side of the light-emitting element away from the substrate and on the side of the isolation structure away from the substrate;

[0017] Optionally, the organic encapsulation layer also covers at least a portion of the dam;

[0018] Optionally, the display panel further includes an inorganic encapsulation layer, which at least covers the side of the organic encapsulation layer opposite to the substrate.

[0019] In one embodiment, the first area is a display area, and the second area is a punch-hole area; the light transmittance of the punch-hole area is greater than that of the display area;

[0020] The isolation structure is provided with a first light-transmitting opening, which is located in the perforated area;

[0021] Optionally, the display area is located around the perimeter of the cut-out area.

[0022] In one embodiment, the display panel has a first sub-display area and a second sub-display area, the first sub-display area and the second sub-display area are arranged adjacent to each other, and the light transmittance of the first sub-display area is less than that of the second sub-display area; the second sub-display area has a plurality of second regions arranged at intervals, and the remaining regions of the second sub-display area and the entire regions of the first sub-display area constitute the first region;

[0023] The isolation structure includes multiple second light-transmitting openings that are disposed in a corresponding manner in a plurality of second regions. The protective layer includes multiple protective sub-layers that correspond one-to-one with the plurality of second light-transmitting openings. Each protective sub-layer covers the sidewall of the corresponding second light-transmitting opening.

[0024] Optionally, the first sub-display area is located around the second sub-display area.

[0025] In one embodiment, the isolation structure includes a conductive portion and a blocking portion stacked along a direction away from the substrate; the outer contour of the orthographic projection of the blocking portion on the substrate is located outside the outer contour of the orthographic projection of the conductive portion on the substrate.

[0026] The light-emitting element includes a first electrode, a light-emitting portion, and a second electrode stacked along a direction away from the substrate, wherein the second electrode is electrically connected to the conductive portion.

[0027] The protective layer at least covers at least a portion of the wall surface of the conductive part of the second isolation structure facing the second region;

[0028] Optionally, the protective layer also covers the wall surface of the blocking portion of the second isolation structure facing the second region;

[0029] Optionally, the protective layer includes a main body that covers at least a portion of the sidewall of the second isolation structure facing the second region;

[0030] Optionally, the protective layer is made of organic or inorganic materials.

[0031] In one embodiment, the protective layer further includes a first extension connected to the main body portion, the first extension being disposed on the side of the blocking portion away from the substrate; the surface of the first extension near the substrate is spaced apart from the surface of the blocking portion away from the substrate.

[0032] Optionally, the second isolation structure is provided with a first groove, the first groove being located on the side of the isolation structure away from the substrate; the protective layer further includes a second extension, the second extension being connected to the end of the first extension away from the main body, and covering at least a portion of the groove wall of the first groove;

[0033] Optionally, the first trench includes a first sub-trench and a first opening, the first opening being located on the side of the first sub-trench away from the substrate; the orthographic projection of the first opening on the substrate falls within the orthographic projection range of the first sub-trench on the substrate.

[0034] Optionally, the first opening extends through the blocking portion along the thickness direction of the substrate, and the first sub-groove is provided on the side surface of the conductive portion opposite to the substrate.

[0035] Optionally, the dimension of the first opening along the first direction is smaller than the dimension of the first sub-groove along the first direction; the first direction is perpendicular to the thickness direction of the substrate and the extension direction of the first groove.

[0036] Optionally, a light-emitting material film and an electrode material layer are stacked between the first extension and the blocking portion, wherein the light-emitting material film is located between the blocking portion and the electrode material layer.

[0037] In one embodiment, the protective layer further includes a cover portion connected to the main body portion, one end of the cover portion being connected to the end of the main body portion away from the blocking portion, and the other end of the cover portion extending in a direction away from the second isolation structure;

[0038] Optionally, the display panel further includes an insulating structure disposed between the isolation structure and the substrate.

[0039] In one embodiment, at least a portion of the surface of the cover near the substrate is spaced apart from the surface of the insulating structure away from the substrate;

[0040] Optionally, a first gap is formed between the end of the main body portion away from the blocking portion and the sidewall of the second isolation structure near the second region; the entire surface of the covering portion near the substrate is spaced apart from the surface of the insulating structure away from the substrate.

[0041] Optionally, the display panel further includes a filling layer, at least partially filling the first gap and the space between the cover and the insulating structure;

[0042] Optionally, the filler layer comprises an organic material;

[0043] Optionally, the display panel further includes an organic encapsulation layer, which is disposed on the side of the light-emitting element away from the substrate and on the side of the isolation structure away from the substrate; the filler layer is disposed in the same layer and made of the same material as the organic encapsulation layer.

[0044] In one embodiment, one end of the cover portion near the main body portion contacts the surface of the insulating structure away from the substrate; the other end of the cover portion away from the main body portion is spaced apart from the insulating structure.

[0045] Optionally, the main body covers all the sidewalls of the second isolation structure facing the second region;

[0046] Optionally, one end of the blocking portion near the first isolation opening extends toward the center of the first isolation opening and protrudes from the side wall of the conductive portion near the first isolation opening; one end of the blocking portion near the second region extends toward the second region and protrudes from the side wall of the conductive portion near the second region.

[0047] Wherein, the portion of the blocking part protruding from the side wall of the conductive part near the first isolation opening is a first sub-blocking part, and the first sub-blocking part protrudes from the wall of the conductive part by a first length; the portion of the blocking part protruding from the side wall of the conductive part near the second region is a second sub-blocking part, and the second sub-blocking part protrudes from the wall of the conductive part by a second length; the second length is greater than the first length;

[0048] Optionally, the ratio of the second length to the first length is between 1 and 3;

[0049] Optionally, the isolation structure is a metal structure, and the metal structure density of the first region is greater than that of the second region.

[0050] In one embodiment, the insulating structure located in the second region is provided with a second trench, and the protective layer further includes a third extension, which is connected to one end of the cover portion away from the main body portion and covers at least a portion of the trench wall of the second trench;

[0051] Optionally, the second trench includes a second sub-trench and a second opening; the second opening is located on the side of the second sub-trench away from the substrate; the orthographic projection of the second opening on the substrate falls within the orthographic projection range of the second sub-trench on the substrate.

[0052] Optionally, the insulating structure includes a planarization layer and a pixel definition layer stacked together, the planarization layer being disposed between the substrate and the pixel definition layer; the second opening penetrates the pixel definition layer along the thickness direction of the substrate, and the second sub-trench is disposed on the side surface of the planarization layer facing away from the substrate;

[0053] Optionally, the dimension of the second opening along the second direction is smaller than the dimension of the second sub-groove along the second direction; the second direction is perpendicular to the thickness direction of the substrate and the extension direction of the second groove;

[0054] Optionally, a light-emitting material film layer and an electrode material layer are stacked between the covering portion and the insulating structure, wherein the light-emitting material film layer is located between the insulating structure and the electrode material layer;

[0055] Optionally, the pixel definition layer is provided with a plurality of pixel openings, the plurality of first isolation openings are correspondingly and interconnected with the plurality of pixel openings, and the plurality of light-emitting elements are all correspondingly and interconnected with the plurality of pixel openings.

[0056] In one embodiment, the plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements; the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors;

[0057] The display panel further includes a plurality of first encapsulation portions, a plurality of second encapsulation portions, and a plurality of third encapsulation portions. The plurality of first encapsulation portions correspond one-to-one with the plurality of first light-emitting elements, and the first encapsulation portion is disposed on the side of the corresponding first light-emitting element away from the substrate. The plurality of second encapsulation portions correspond one-to-one with the plurality of second light-emitting elements, and the second encapsulation portion is disposed on the side of the corresponding second light-emitting element away from the substrate. The plurality of third encapsulation portions correspond one-to-one with the plurality of third light-emitting elements, and the third encapsulation portion is disposed on the side of the corresponding third light-emitting element away from the substrate.

[0058] Optionally, any one of the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion is disposed in the same layer and made of the same material as the protective layer;

[0059] Optionally, the first encapsulation part, the second encapsulation part, and the third encapsulation part are all inorganic film layers;

[0060] Optionally, the first encapsulation portion includes a first main portion and a first sub-portion connected to the first main portion. The first main portion covers the sidewall of the first light-emitting element and the first isolation opening, and the first sub-portion is located on the side of the isolation structure away from the substrate.

[0061] Optionally, the first sub-part is spaced apart from the side surface of the isolation structure away from the substrate;

[0062] Optionally, the second encapsulation portion includes a second main portion and a second sub-portion connected to the second main portion. The second main portion covers the sidewall of the second light-emitting element and the first isolation opening, and the second sub-portion is located on the side of the isolation structure away from the substrate.

[0063] Optionally, the second sub-part is spaced apart from the side surface of the isolation structure away from the substrate;

[0064] Optionally, the third encapsulation portion includes a third main portion and a third sub-portion connected to the third main portion. The third main portion covers the sidewall of the third light-emitting element and the first isolation opening, and the third sub-portion is located on the side of the isolation structure away from the substrate.

[0065] Optionally, the third sub-part is spaced apart from the side surface of the isolation structure away from the substrate;

[0066] Optionally, in adjacent first and second packaging portions, the orthographic projection of the first sub-part on the substrate overlaps with the orthographic projection of the second sub-part on the substrate;

[0067] Optionally, in adjacent first and second packaging portions, the first sub-portion and the second sub-portion are spaced apart;

[0068] Optionally, in adjacent first and second packaging portions, a portion of the second sub-portion is located on the side of the first sub-portion facing away from the substrate;

[0069] Optionally, in adjacent second and third packaging portions, the orthographic projection of the second sub-part on the substrate overlaps with the orthographic projection of the third sub-part on the substrate;

[0070] Optionally, in adjacent second and third packaging portions, the second sub-portion and the third sub-portion are spaced apart;

[0071] Optionally, in the adjacent second and third packaging portions, a portion of the third sub-portion is located on the side of the second sub-portion facing away from the substrate.

[0072] Secondly, embodiments of this application provide another display panel, the display panel having adjacent display areas and border areas; the display panel includes:

[0073] Array substrate;

[0074] Multiple light-emitting elements are spaced apart on one side of the array substrate;

[0075] A metal structure is disposed on one side of the array substrate; the metal structure includes a first part and a second part that are electrically connected, the first part being located in the display area and used to space adjacent light-emitting elements, the second part being located in the frame area and electrically connected to the traces in the array substrate;

[0076] A protective layer, covering at least a portion of the sidewalls of the second part.

[0077] The display panel provided in this application embodiment, by providing a protective layer that covers at least a portion of the sidewalls of the second part of the metal structure, can protect the sidewalls of the second part. Thus, during the manufacturing process of the display panel, the erosion of the sidewalls of the second part by the process solution is reduced, which helps prevent ion deposition in the second part from affecting the light-emitting element and its light-emitting performance.

[0078] In one embodiment, the second portion includes a first metal layer and a second metal layer stacked along a direction away from the array substrate; the opposite ends of the second metal layer along a first direction protrude from the opposite sides of the first metal layer along the first direction.

[0079] The protective layer is covered on at least one sidewall of the first metal layer along the first direction; the first direction is perpendicular to the thickness direction of the array substrate and the extension direction of the second portion;

[0080] Optionally, the protective layer is respectively covered on both sidewalls of the first metal layer along the first direction;

[0081] Optionally, the protective layer further covers the sidewalls of the second metal layer along the first direction;

[0082] Optionally, the protective layer includes a main body that covers the sidewall of the first metal layer along the first direction and the sidewall of the second metal layer along the first direction.

[0083] In one embodiment, the protective layer further includes a first extension connected to the main body portion, the first extension being disposed on the side of the second metal layer away from the array substrate; the surface of the first extension near the array substrate is spaced apart from the surface of the second metal layer away from the array substrate.

[0084] Optionally, the first extensions of the two protective layers located on both sides of the first metal layer along the first direction are connected;

[0085] Optionally, the second portion is provided with a third groove, the third groove being located on the side of the second portion away from the array substrate; the protective layer further includes a second extension, the second extension being connected to the end of the first extension away from the main body portion, and covering at least a portion of the groove wall of the third groove;

[0086] Optionally, the third trench includes a third sub-trench and a third opening, the third opening being located on the side of the third sub-trench away from the array substrate; the orthographic projection of the third opening on the array substrate falls within the orthographic projection range of the third sub-trench on the array substrate.

[0087] Optionally, the third opening penetrates the second metal layer along the thickness direction of the array substrate, and the third sub-trench is disposed on the surface of the first metal layer facing away from the array substrate.

[0088] Optionally, the dimension of the third opening along the first direction is smaller than the dimension of the third sub-groove along the first direction; the first direction is perpendicular to the thickness direction of the array substrate and the extension direction of the third trench;

[0089] Optionally, a light-emitting material film and an electrode material layer are stacked between the first extension and the second metal layer, wherein the light-emitting material film is located between the second metal layer and the electrode material layer.

[0090] In one embodiment, the protective layer further includes a cover portion connected to the main body portion, one end of the cover portion being connected to the end of the main body portion away from the second metal layer, and the other end of the cover portion extending in a direction away from the second portion;

[0091] Optionally, the display panel further includes an insulating structure disposed between the metal structure and the array substrate.

[0092] In one embodiment, at least a portion of the surface of the cover near the array substrate is spaced apart from the surface of the insulating structure away from the array substrate;

[0093] Optionally, a second gap exists between the end of the main body portion away from the second metal layer and the sidewall of the first metal layer; the entire surface of the cover portion near the array substrate is spaced apart from the surface of the insulating structure away from the array substrate.

[0094] Optionally, the display panel further includes a filling layer, at least partially filling the second gap and the space between the cover and the insulating structure;

[0095] Optionally, the filler layer comprises an organic material;

[0096] Optionally, the display panel further includes an organic encapsulation layer, which is disposed on the side of the light-emitting element away from the array substrate and on the side of the metal structure away from the array substrate; the filler layer is disposed in the same layer and of the same material as the organic encapsulation layer.

[0097] Optionally, the display panel further includes a dam, which is disposed in the frame area and surrounds the outer periphery of the metal structure;

[0098] Optionally, the organic encapsulation layer also covers at least a portion of the dam;

[0099] Optionally, the display panel further includes an inorganic encapsulation layer, which at least covers the side of the organic encapsulation layer opposite to the array substrate.

[0100] In one embodiment, one end of the cover portion near the main body portion contacts the surface of the insulating structure away from the array substrate; the other end of the cover portion away from the main body portion is spaced apart from the insulating structure.

[0101] Optionally, the first portion includes a third metal layer and a fourth metal layer stacked along a direction away from the array substrate; the first portion is provided with a plurality of second isolation openings, and the plurality of light-emitting elements are correspondingly disposed with respect to the plurality of second isolation openings; at least a portion of the light-emitting elements is disposed within the corresponding second isolation opening;

[0102] Optionally, one end of the fourth metal layer near the second isolation opening extends toward the center of the second isolation opening and protrudes from the side wall of the third metal layer near the second isolation opening;

[0103] Wherein, the length of the fourth metal layer protruding from the wall surface of the third metal layer near the second isolation opening is the first length; the length of the first metal layer protruding from the wall surface of the second metal layer along the first direction is the second length; the second length is greater than the first length;

[0104] Optionally, the ratio of the second length to the first length is between 1 and 3;

[0105] Optionally, the first metal layer and the third metal layer are disposed in the same layer and made of the same material;

[0106] Optionally, the second metal layer and the fourth metal layer are disposed in the same layer and made of the same material;

[0107] Optionally, the metal structure density of the display area is greater than the metal structure density of the border area.

[0108] In one embodiment, the insulating structure located in the border area is provided with a second groove, and the protective layer further includes a third extension, which is connected to one end of the cover portion away from the main body portion and covers at least a portion of the groove wall of the second groove;

[0109] Optionally, the second trench includes a second sub-trench and a second opening; the second opening is located on the side of the second sub-trench away from the array substrate; the orthographic projection of the second opening on the array substrate falls within the orthographic projection range of the second sub-trench on the array substrate.

[0110] Optionally, the insulating structure includes a planarization layer and a pixel definition layer stacked together, the planarization layer being disposed between the array substrate and the pixel definition layer; the second opening penetrates the pixel definition layer along the thickness direction of the array substrate, and the second sub-trench is disposed on the side surface of the planarization layer opposite to the array substrate;

[0111] Optionally, the dimension of the second opening along the second direction is smaller than the dimension of the second sub-trench along the second direction; the second direction is perpendicular to the thickness direction of the array substrate and the extension direction of the second trench;

[0112] Optionally, a light-emitting material film layer and an electrode material layer are stacked between the covering portion and the insulating structure, wherein the light-emitting material film layer is located between the insulating structure and the electrode material layer;

[0113] Optionally, the pixel definition layer is provided with a plurality of pixel openings, the first part is provided with a plurality of second isolation openings, the plurality of second isolation openings are correspondingly and interconnected with the plurality of pixel openings, and the plurality of light-emitting elements are all correspondingly and interconnected with the plurality of pixel openings.

[0114] In one embodiment, the first portion is provided with a plurality of second isolation openings, and the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements; the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; the plurality of first light-emitting elements, the plurality of second light-emitting elements, and the plurality of third light-emitting elements are respectively disposed in the plurality of second isolation openings;

[0115] The display panel further includes a plurality of first encapsulation portions, a plurality of second encapsulation portions, and a plurality of third encapsulation portions. The plurality of first encapsulation portions correspond one-to-one with the plurality of first light-emitting elements, and the first encapsulation portion is disposed on the side of the corresponding first light-emitting element away from the array substrate. The plurality of second encapsulation portions correspond one-to-one with the plurality of second light-emitting elements, and the second encapsulation portion is disposed on the side of the corresponding second light-emitting element away from the array substrate. The plurality of third encapsulation portions correspond one-to-one with the plurality of third light-emitting elements, and the third encapsulation portion is disposed on the side of the corresponding third light-emitting element away from the array substrate.

[0116] Optionally, any one of the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion is disposed in the same layer and made of the same material as the protective layer;

[0117] Optionally, the first encapsulation part, the second encapsulation part, and the third encapsulation part are all inorganic film layers;

[0118] Optionally, the first encapsulation portion includes a first main portion and a first sub-portion connected to the first main portion. The first main portion covers the sidewalls of the first light-emitting element and the second isolation opening, and the first sub-portion is located on the side of the metal structure away from the array substrate.

[0119] Optionally, the first sub-part is spaced apart from the side surface of the metal structure away from the array substrate;

[0120] Optionally, the second encapsulation portion includes a second main portion and a second sub-portion connected to the second main portion. The second main portion covers the sidewall of the second light-emitting element and the second isolation opening, and the second sub-portion is located on the side of the metal structure away from the array substrate.

[0121] Optionally, the second sub-part is spaced apart from the side surface of the metal structure away from the array substrate;

[0122] Optionally, the third encapsulation portion includes a third main portion and a third sub-portion connected to the third main portion. The third main portion covers the sidewall of the third light-emitting element and the second isolation opening, and the third sub-portion is located on the side of the metal structure away from the array substrate.

[0123] Optionally, the third sub-part is spaced apart from the side surface of the metal structure away from the array substrate;

[0124] Optionally, in adjacent first and second packaging portions, the orthographic projection of the first sub-part on the array substrate overlaps with the orthographic projection of the second sub-part on the array substrate;

[0125] Optionally, in adjacent first and second packaging portions, the first sub-portion and the second sub-portion are spaced apart;

[0126] Optionally, in adjacent first and second package portions, a portion of the second sub-portion is located on the side of the first sub-portion facing away from the array substrate;

[0127] Optionally, in adjacent second and third packaging portions, the orthographic projection of the second sub-part on the array substrate overlaps with the orthographic projection of the third sub-part on the array substrate;

[0128] Optionally, in adjacent second and third packaging portions, the second sub-portion and the third sub-portion are spaced apart;

[0129] Optionally, in the adjacent second and third packaging portions, a portion of the third sub-portion is located on the side of the second sub-portion facing away from the array substrate.

[0130] Thirdly, embodiments of this application provide a method for manufacturing a display panel, the display panel having a first region and a second region adjacent to the first region;

[0131] The preparation method includes:

[0132] Provide substrate;

[0133] An isolation structure, a plurality of light-emitting elements, and a protective layer are formed on one side of the substrate; the isolation structure includes a first isolation structure located in the first region and a second isolation structure located at the junction of the first region and the second region; the first isolation structure is provided with a plurality of first isolation openings; the plurality of light-emitting elements are correspondingly arranged with the plurality of first isolation openings; at least a portion of the light-emitting elements are disposed in the corresponding first isolation openings; at least a portion of the sidewalls of the second isolation structure facing the second region are covered with the protective layer.

[0134] The display panel manufacturing method provided in this application provides a protective layer that covers at least a portion of the sidewalls of the second isolation structure facing the second region, thereby protecting the second isolation structure. This reduces the erosion of the sidewalls of the second isolation structure by the process solution during display panel manufacturing. On the one hand, this helps prevent ion deposition from the second isolation structure from affecting the light-emitting elements and their luminous performance; on the other hand, it reduces the risk of encapsulation failure caused by erosion of the second isolation structure, thus improving the reliability of the display panel.

[0135] In one embodiment, the formation of an isolation structure, multiple light-emitting elements, and a protective layer on one side of the substrate includes:

[0136] An isolation structure is formed on one side of the substrate;

[0137] A protective layer is formed on at least a portion of the sidewalls of the second isolation structure facing the second region;

[0138] Multiple light-emitting elements are formed on one side of the substrate.

[0139] In one embodiment, the formation of an isolation structure, multiple light-emitting elements, and a protective layer on one side of the substrate includes:

[0140] An isolation structure is formed on one side of the substrate;

[0141] A protective layer and multiple light-emitting elements are formed on one side of the substrate.

[0142] In one embodiment, the plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; the plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings;

[0143] The provision of forming a protective layer and multiple light-emitting elements on one side of the substrate includes:

[0144] The first light-emitting element is formed within the first opening;

[0145] A first encapsulation portion is formed on the first light-emitting element, and a protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region;

[0146] A second light-emitting element is formed within the second opening;

[0147] A second encapsulation portion is formed on the second light-emitting element;

[0148] A third light-emitting element is formed within the third opening;

[0149] A third encapsulation portion is formed on the third light-emitting element.

[0150] In one embodiment, the plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; the plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings;

[0151] The provision of forming a protective layer and multiple light-emitting elements on one side of the substrate includes:

[0152] The first light-emitting element is formed within the first opening;

[0153] A first encapsulation portion is formed on the first light-emitting element;

[0154] A second light-emitting element is formed within the second opening;

[0155] A second encapsulation portion is formed on the second light-emitting element, and a protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region;

[0156] A third light-emitting element is formed within the third opening;

[0157] A third encapsulation portion is formed on the third light-emitting element.

[0158] In one embodiment, the plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; the plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings;

[0159] The provision of forming a protective layer and multiple light-emitting elements on one side of the substrate includes:

[0160] The first light-emitting element is formed within the first opening;

[0161] A first encapsulation portion is formed on the first light-emitting element;

[0162] A second light-emitting element is formed within the second opening;

[0163] A second encapsulation portion is formed on the second light-emitting element;

[0164] A third light-emitting element is formed within the third opening;

[0165] A third encapsulation portion is formed on the third light-emitting element, and a protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region.

[0166] In one embodiment, the plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; the plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings;

[0167] The method of forming an isolation structure, multiple light-emitting elements, and a protective layer on one side of the substrate includes:

[0168] An isolation structure material layer is formed on one side of the substrate;

[0169] The isolation structure material layer is first etched to form a first opening and a sidewall of the second isolation structure facing the second region;

[0170] A first light-emitting element is formed within the first opening;

[0171] A first encapsulation portion is formed on the first light-emitting element;

[0172] The sidewall of the second isolation structure facing the second region is side-cut;

[0173] The isolation structure material layer is etched a second time to form a second opening;

[0174] A second light-emitting element is formed within the second opening;

[0175] A second encapsulation portion is formed on the second light-emitting element, and the protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region;

[0176] The isolation structure material layer is etched a third time to form a third opening;

[0177] A third light-emitting element is formed within the third opening;

[0178] A third encapsulation portion is formed on the third light-emitting element.

[0179] In one embodiment, the plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; the plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings;

[0180] The method of forming an isolation structure, multiple light-emitting elements, and a protective layer on one side of the substrate includes:

[0181] An isolation structure material layer is formed on one side of the substrate;

[0182] The isolation structure material layer is first etched to form a first opening and a sidewall of the second isolation structure facing the second region;

[0183] A first light-emitting element is formed within the first opening;

[0184] A first encapsulation portion is formed on the first light-emitting element;

[0185] The isolation structure material layer is etched a second time to form a second opening;

[0186] A second light-emitting element is formed within the second opening;

[0187] A second encapsulation portion is formed on the second light-emitting element;

[0188] The sidewall of the second isolation structure facing the second region is side-cut;

[0189] The isolation structure material layer is etched a third time to form a third opening;

[0190] A third light-emitting element is formed within the third opening;

[0191] A third encapsulation portion is formed on the third light-emitting element, and the protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region.

[0192] Fourthly, embodiments of this application also provide a display device, including the display panel described in any of the embodiments of the first and second aspects. Attached Figure Description

[0193] To more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of this application, the drawings used in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0194] Figure 1 This is a partial cross-sectional structural diagram of a display panel provided in an embodiment of this application.

[0195] Figure 2 for Figure 1 A plan view of the display panel shown.

[0196] Figure 3 for Figure 1 Another planar schematic diagram of the display panel shown.

[0197] Figure 4 for Figure 3 A plan view of a partial structure of the display panel shown.

[0198] Figure 5 for Figure 1 Another plan view of the display panel shown.

[0199] Figure 6 for Figure 5 A plan view of a partial structure of the display panel shown.

[0200] Figure 7 for Figure 5 The diagram shows a partial cross-sectional view of the display panel.

[0201] Figure 8 for Figure 1 The diagram shows a partial cross-sectional view of the display panel.

[0202] Figure 9 This is a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0203] Figure 10 This is a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0204] Figure 11This is a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0205] Figure 12 for Figure 11 The diagram shows a partial cross-sectional view of the display panel.

[0206] Figure 13 and Figure 14 for Figure 1 The diagram shows a cross-sectional structure of the display panel during its fabrication process.

[0207] Figure 15 This is a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0208] Figure 16 This is a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0209] Figure 17 This is a plan view of a partial structure of a display panel provided in an embodiment of this application.

[0210] Figure 18 for Figure 17 The diagram shows a cross-sectional view of the second part of the isolation structure and the protective layer in the display panel.

[0211] Figure 19 for Figure 17 The diagram shows another cross-sectional view of the second part of the isolation structure and the protective layer in the display panel.

[0212] Figure 20 for Figure 17 The diagram shows another cross-sectional view of the second part of the isolation structure and the protective layer in the display panel.

[0213] Figure 21 This is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application.

[0214] Explanation of reference numerals in the attached figures:

[0215] 10. Display panel; 10a. First area; 10b. Second area; 10c. First sub-display area; 10d. Second sub-display area; 10e. Bezel area; 10f. Display area; 11. Array substrate; 111. Substrate; 112. Array film layer; 1121. Line; 12. Isolation structure; 12a. First isolation opening; 12a1. First opening; 12a2. Second opening; 12a3. Third opening; 12b. Second light-transmitting opening; 12c. First light-transmitting opening; 12d. First trench; 12d1. First opening portion; 1 2d2, First sub-groove; 12e1, First isolation structure; 12e2, Second isolation structure; 12e3, Third isolation structure; 121, Conductive part; 122, Blocking part; 1221, First sub-blocking part; 1222, Second sub-blocking part; 13, Light-emitting element; 13a, First light-emitting element; 13b, Second light-emitting element; 13c, Third light-emitting element; 131, First electrode; 132, Light-emitting part; 133, Second electrode; 14, Protective layer; 141, Main body part; 142, First extension part; 143, Second extension part ; 144. Cover portion; 145. Third extension portion; 15. Insulating structure; 15a. Second trench; 15a1. Second opening portion; 15a2. Second sub-trench; 151. Planarization layer; 152. Pixel definition layer; 161. First encapsulation portion; 1611. First main portion; 1612. First sub-portion; 162. Second encapsulation portion; 1621. Second main portion; 1622. Second sub-portion; 163. Third encapsulation portion; 1631. Third main portion; 1632. Third sub-portion; 171. Light-emitting material film layer; 172. Electrode material layer ; 173, First luminescent material layer; 174, Second luminescent material layer; 175, First encapsulation material layer; 176, Second encapsulation material layer; 18, Metal structure; 181, First part; 181a, Second isolation opening; 182, Second part; 182a, Third trench; 182a1, Third opening; 182a2, Third sub-trench; 1821, First metal layer; 1822, Second metal layer; 191, Filling layer; 192, Organic encapsulation layer; 193, Inorganic encapsulation layer; 194, Dam; 195, First gap. Detailed Implementation

[0216] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0217] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, this does not indicate any order, quantity, or importance, but is merely used to distinguish different components. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Words such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, without excluding other elements or objects.

[0218] Organic Light Emitting Diode (OLED) display technology is considered the most promising next-generation flat panel display technology. Compared to liquid crystal displays (LCDs), OLEDs offer advantages such as low power consumption, low cost, self-emissiveness, wide viewing angles, and fast response times. In OLED display panels, an isolation structure is formed on the substrate, defining a first isolation port, a second isolation port, and a third isolation port. Red, green, and blue sub-pixels are respectively located within the first, second, and third isolation ports, and the cathodes of each sub-pixel are electrically connected to the isolation structure. The red, green, and blue sub-pixels are sequentially fabricated using a patterning process, with each sub-pixel protected by a corresponding encapsulation during patterning. However, this type of OLED display panel suffers from display defects.

[0219] Through research, the inventors discovered that during the patterning process of creating sub-pixels, the etching solution easily erodes the sidewalls of the edge area of ​​the isolation structure, causing ions to be released from the isolation structure. During the cleaning process, the released ions easily flow into the isolation port of the isolation structure. In the subsequent process of creating the light-emitting element, these ions are doped into the light-emitting element, affecting the light-emitting performance and lifespan of the light-emitting element, resulting in poor display.

[0220] To address the aforementioned issues, this application provides a display panel, a method for manufacturing the same, and a display device. The embodiments will be described below with reference to the accompanying drawings.

[0221] The composition and preparation of the isolation structure mentioned below are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A for reference.

[0222] Firstly, referring to Figure 1 As shown, this application embodiment provides a display panel 10, which may be an organic light-emitting diode display panel 10 (OLED) or a quantum dot light-emitting diode display panel 10 (QLED).

[0223] Specifically, the display panel 10 has a first region 10a and a second region 10b adjacent to the first region 10a. The display panel 10 includes a substrate 111, an isolation structure 12, a plurality of light-emitting elements 13, and a protective layer 14. The isolation structure 12 is disposed on one side of the substrate 111; the isolation structure 12 includes a first isolation structure 12e1 located in the first region 10a and a second isolation structure 12e2 located at the junction of the first region 10a and the second region 10b. The first isolation structure 12e1 has a plurality of first isolation openings 12a. The plurality of light-emitting elements 13 are disposed on one side of the substrate 111 and are correspondingly disposed with respect to the plurality of first isolation openings 12a. At least a portion of the light-emitting elements 13 is disposed within the corresponding first isolation opening 12a. The protective layer 14 covers at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0224] Here, the isolation structure 12 can be divided into regions. For example, refer to... Figure 1 As shown, the isolation structure 12 located to the right of the dashed line (i.e., the first region 10a) is the first isolation structure 12e1, and the isolation structure 12 located to the left of the dashed line (i.e., the second region 10b) is the second isolation structure 12e2.

[0225] It is understood that the correspondence between the multiple light-emitting elements 13 and the multiple first isolation openings 12a can be "many to one" or "one to one". This application embodiment uses a one-to-one correspondence between the light-emitting elements 13 and the first isolation openings 12a as an example for illustration.

[0226] The display panel 10 provided in this application embodiment protects the second isolation structure 12e2 by providing a protective layer 14 that covers at least a portion of the sidewalls of the second isolation structure 12e2 facing the second region 10b. This reduces the erosion of the sidewalls of the second isolation structure 12e2 by process solutions (such as etching solutions) during the fabrication of the display panel 10. On the one hand, this helps prevent ion deposition in the second isolation structure 12e2 from affecting the light-emitting element 13 and its light-emitting performance; on the other hand, it reduces the risk of encapsulation failure caused by erosion of the second isolation structure 12e2, thus improving the reliability of the display panel 10.

[0227] In one embodiment, reference Figure 2 As shown, the first region 10a is the display area, and the second region 10b is the border area. This is equivalent to setting a protective layer 14 on the sidewall of the isolation structure 12 located at the junction of the display area and the border area, which helps to prevent the sidewall of the isolation structure 12 located at the junction of the display area and the border area from being eroded by the etching solution, causing ion precipitation and affecting the light-emitting performance of the light-emitting element 13.

[0228] In one embodiment, the border area surrounds the periphery of the display area.

[0229] In one embodiment, reference Figure 3 and Figure 4 As shown, the first region 10a is the display area, and the second region 10b is the cutout area. The light transmittance of the cutout area is greater than that of the display area. The isolation structure 12 is provided with a first light-transmitting opening 12c, which is located in the cutout area.

[0230] In one embodiment, the display area is surrounded by the perimeter of the cut-out area.

[0231] Understandably, an under-display module can be installed in the punch-hole area of ​​the display panel 10. This under-display module could be an under-display camera module, an under-display fingerprint module, or something similar. Figure 3 The display panel 10 shown may also include a border area 10e, which surrounds the periphery of the first area 10a.

[0232] In one embodiment, reference Figure 5 , Figure 6 and Figure 7 As shown, the display panel 10 has a first sub-display area 10c and a second sub-display area 10d. The first sub-display area 10c and the second sub-display area 10d are arranged adjacent to each other, and the light transmittance of the first sub-display area 10c is less than that of the second sub-display area 10d. The second sub-display area 10d is provided with a plurality of second regions 10b arranged at intervals. The remaining regions of the second sub-display area 10d and all regions of the first sub-display area 10c constitute a first region 10a.

[0233] The isolation structure 12 includes a plurality of second light-transmitting openings 12b, each corresponding to one of the plurality of second regions 10b. The protective layer 14 includes a plurality of protective sub-layers, each corresponding to one of the plurality of second light-transmitting openings 12b, with each protective sub-layer covering the sidewall of the corresponding second light-transmitting opening 12b. It can be understood that the sidewall of the isolation structure 12 that encloses the second light-transmitting opening 12b is itself the sidewall of the second light-transmitting opening 12b.

[0234] exist Figure 5 and Figure 6 In the illustrated embodiment, the area used to provide the second light-transmitting opening 12b is designated as the first region 10a. Each protective sublayer functions as a separate protective structure, protecting the sidewall of the corresponding second light-transmitting opening 12b. It is understood that the structure of this protective sublayer can be identical to the structure of the protective layer 14 described in detail below.

[0235] In one embodiment, the first sub-display area 10c surrounds the second sub-display area 10d. It is understood that the first sub-display area 10c and the second sub-display area 10d together constitute the display area of ​​the display panel 10.

[0236] In one embodiment, reference Figure 7 and Figure 8 As shown, the isolation structure 12 includes a conductive portion 121 and a blocking portion 122 stacked along a direction away from the substrate 111; the outer contour of the orthographic projection of the blocking portion 122 on the substrate 111 is located outside the outer contour of the orthographic projection of the conductive portion 121 on the substrate 111. The light-emitting element 13 includes a first electrode 131, a light-emitting portion 132, and a second electrode 133 stacked along a direction away from the substrate 111, and the second electrode 133 is electrically connected to the conductive portion 121.

[0237] It is understood that the isolation structure 12 can be electrically connected to the pixel circuit of the display panel 10. In this embodiment, the second electrode 133 of the light-emitting element is connected to the pixel circuit through the isolation structure 12. This allows for a more optimized arrangement of the traces 1121 within the display area 10f of the display panel 10.

[0238] It should be noted that the first electrode 131 can be an anode, the second electrode 133 can be a cathode, and the light-emitting part 132 includes at least an emission layer (EML). In addition, it may include one or more of the following: a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL). Alternatively, the light-emitting part 132 may be a stacked light-emitting structure, that is, it includes at least two emission layers and a charge generation layer (CGL) located between adjacent emission layers. It is understood that the emission layers in the light-emitting part 132 of light-emitting elements 13 of different colors are different.

[0239] In one embodiment, the conductive portion 121 includes at least one metal layer. In one example, the conductive portion 121 includes one metal layer. Further, the material of the conductive portion 121 includes at least one of a metal and a metal oxide. Exemplarily, the metal may be silver, copper, titanium, aluminum, etc. The metal oxide may be tin oxide, zinc oxide, cadmium oxide, indium oxide, indium tin oxide, zinc indium oxide, zinc gallium oxide, zinc aluminum oxide, titanium tantalum oxide, etc.

[0240] In one embodiment, the protective layer 14 covers at least a portion of the wall surface of the conductive portion 121 of the second isolation structure 12e2 facing the second region 10b. This provides protection for the conductive portion 121, preventing it from being corroded.

[0241] In one specific embodiment, the conductive portion 121 comprises aluminum. In related technologies, when the isolation structure 12 is side-etched, silver ions from the cathode displace aluminum, and the precipitated silver particles adhere to the conductive portion 121. During subsequent cleaning, the precipitated silver particles are washed into the anode region exposed by the isolation structure 12, forming dark spots. Furthermore, during the subsequent fabrication of the light-emitting element 13, these ions dope into the light-emitting element 13, affecting its luminous performance and lifespan, leading to display defects. In this embodiment, by using a protective layer 14 to protect the sidewalls of the conductive portion 121, corrosion of the conductive portion 121 by the etching solution is prevented, thus preventing the precipitation of silver ions.

[0242] In one embodiment, the material of the blocking portion 122 includes titanium or molybdenum.

[0243] In one embodiment, reference Figure 8 and Figure 9 As shown, the protective layer 14 also covers the wall surface of the blocking portion 122 of the second isolation structure 12e2 facing the second region 10b. In this way, the contact area between the protective layer 14 and the second isolation structure 12e2 can be increased, thereby improving the connection stability of the protective layer 14.

[0244] In one embodiment, the protective layer 14 includes a main body 141 that covers at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, the main body 141 covers the wall surface of the blocking portion 122 of the second isolation structure 12e2 facing the second region 10b and the wall surface of the conductive portion 121 of the second isolation structure 12e2 facing the second region 10b.

[0245] In one embodiment, the protective layer 14 is made of organic or inorganic materials. This allows the protective layer 14 to possess better protective performance.

[0246] In one embodiment, reference Figure 8 As shown, the protective layer 14 also includes a first extension 142 connected to the main body 141. The first extension 142 is located on the side of the blocking portion 122 away from the substrate 111. The surface of the first extension 142 near the substrate 111 is spaced apart from the surface of the blocking portion 122 away from the substrate 111. This helps to reduce the risk of peeling of the protective layer 14 and improves the connection stability of the protective layer 14.

[0247] It is understandable that organic material can be filled between the first extension 142 and the blocking portion 122. This helps to increase the contact area between the protective layer 14 and other films in the display panel 10, further improving the connection stability of the protective layer 14.

[0248] In one embodiment, reference Figure 9 As shown, the second isolation structure 12e2 has a first trench 12d, which is located on the side of the isolation structure 12 away from the substrate 111. The protective layer 14 also includes a second extension 143, which is connected to the end of the first extension 142 away from the main body 141 and covers at least a portion of the trench wall of the first trench 12d. This increases the contact area between the protective layer 14 and the isolation structure 12, improving the connection stability of the protective layer 14.

[0249] In one embodiment, the first trench 12d includes a first sub-trench 12d2 and a first opening 12d1. The first opening 12d1 is located on the side of the first sub-trench 12d2 away from the substrate 111. The orthographic projection of the first opening 12d1 onto the substrate 111 falls within the orthographic projection range of the first sub-trench 12d2 onto the substrate 111. That is, the first trench 12d is a trench structure with a small opening and a large cavity. The second extension 143 covers at least a portion of the trench wall of the first sub-trench 12d2. Thus, the first trench 12d is equivalent to a "sealing structure," which on the one hand increases the contact area between the protective layer 14 and the isolation structure 12, and on the other hand, even if the protective layer 14 peels, the first opening 12d1 can act as a barrier, slowing down the outward "lifting" of the protective layer 14 located in the first sub-trench 12d2, thereby "locking" the protective layer 14 and reducing the risk of peeling between the protective layer 14 and the isolation structure 12.

[0250] In one embodiment, the first opening 12d1 extends through the blocking portion 122 along the thickness direction of the substrate 111, and the first sub-groove 12d2 is provided on the side surface of the conductive portion 121 facing away from the substrate 111. This allows the first groove 12d to be formed by utilizing the material difference between the blocking portion 122 and the conductive portion 121.

[0251] In one embodiment, the dimension of the first opening 12d1 along the first direction is smaller than the dimension of the first sub-trench 12d2 along the first direction; the first direction is perpendicular to the thickness direction of the substrate 111 and the extension direction of the first trench 12d. (Refer to...) Figure 9 As shown, the first direction is horizontal, and the first groove 12d extends in a direction perpendicular to the paper surface.

[0252] In one embodiment, a light-emitting material film layer 171 and an electrode material layer 172 are stacked between the first extension 142 and the blocking portion 122, with the light-emitting material film layer 171 located between the blocking portion 122 and the electrode material layer 172. It should be noted that the light-emitting material film layer 171 may be disposed in the same layer and with the same material as one of the first light-emitting material layer 173 of the first light-emitting element 13a, the second light-emitting material layer 174 of the second light-emitting element 13b, and the third light-emitting material layer of the third light-emitting element 13c. Correspondingly, the electrode material layer 172 is disposed in the same layer and with the same material as the electrode material layer 172 of the first light-emitting element 13a, the second light-emitting element 13b, or the third light-emitting element 13c.

[0253] In one embodiment, reference Figure 8 and Figure 9As shown, the protective layer 14 also includes a cover portion 144 connected to the main body portion 141. One end of the cover portion 144 is connected to the end of the main body portion 141 away from the blocking portion 122, and the other end of the cover portion 144 extends in a direction away from the second isolation structure 12e2. By providing the cover portion 144, it is beneficial to increase the contact area between the protective layer 14 and other film layers in the display panel 10, and further improve the connection stability of the protective layer 14.

[0254] In one embodiment, the display panel 10 further includes an insulating structure 15 disposed between the isolation structure 12 and the substrate 111.

[0255] In one embodiment, at least a portion of the surface of the cover portion 144 near the substrate 111 is spaced apart from the surface of the insulating structure 15 away from the substrate 111. Specifically, the end of the cover portion 144 away from the main body portion 141 is raised in a direction away from the substrate 111.

[0256] It should be noted that the shape of the cover 144 is related to the manufacturing process of the protective layer 14. The cover 144 will lift up because the light-emitting material film layer 171 and the electrode material layer 172 will be covered under the cover 144, and the light-emitting material film layer 171 and the electrode material layer 172 will be removed in the subsequent manufacturing process.

[0257] In one embodiment, reference Figure 10 As shown, the end of the main body 141 away from the blocking portion 122 has a first gap 195 between it and the sidewall of the second isolation structure 12e2 near the second region 10b. The entire surface of the cover portion 144 near the substrate 111 is spaced apart from the surface of the insulating structure 15 away from the substrate 111.

[0258] It should be noted that the reason why there is a first gap 195 between the main body 141 and the side wall of the second isolation structure 12e2 is because the edge of the electrode material layer 172 will climb onto the side wall of the second isolation structure 12e2, and the electrode material layer 172 is removed in subsequent manufacturing processes.

[0259] In one embodiment, the display panel 10 further includes a filling layer 191, at least a portion of which fills the first gap 195 and the space between the cover portion 144 and the insulating structure 15. By providing the filling layer 191, the contact area between the protective layer 14 and the film layer in the display panel 10 can be increased, further improving the connection stability of the protective layer 14 and also strengthening the sealing effect of the sidewall of the second isolation structure 12e2.

[0260] In one embodiment, the filler layer 191 comprises an organic material. This ensures that the filler layer 191 fills the first gap 195 well.

[0261] In one embodiment, the display panel 10 further includes an organic encapsulation layer 192, which is disposed on the side of the light-emitting element 13 away from the substrate 111 and on the side of the isolation structure 12 away from the substrate 111; the filler layer 191 and the organic encapsulation layer 192 are disposed in the same layer and made of the same material. Thus, the filler layer 191 and the organic encapsulation layer 192 can be fabricated simultaneously in the same manufacturing process, which helps to reduce the number of manufacturing processes for the display panel 10 and lower manufacturing costs.

[0262] In one embodiment, reference Figure 8 As shown, one end of the cover portion 144 near the main body portion 141 is in contact with the surface of the insulating structure 15 away from the substrate 111; the other end of the cover portion 144 away from the main body portion 141 is spaced apart from the insulating structure 15.

[0263] By bringing the cover 144 into contact with the insulating structure 15, the bonding strength of the protective layer 14 can be improved, which helps to prevent peeling of the protective layer 14.

[0264] In one embodiment, the main body 141 covers all the sidewalls of the second isolation structure 12e2 facing the second region 10b. This increases the contact area between the protective layer 14 and the isolation structure 12, improving the connection stability of the protective layer 14.

[0265] In one embodiment, the end of the blocking portion 122 near the first isolation opening 12a extends toward the center of the first isolation opening 12a and protrudes from the side wall of the conductive portion 121 near the first isolation opening 12a; the end of the blocking portion 122 near the second region 10b extends toward the second region 10b and protrudes from the side wall of the conductive portion 121 near the second region 10b.

[0266] The portion of the blocking portion 122 that protrudes from the side wall of the conductive portion 121 near the first isolation opening 12a is the first sub-blocking portion 1221, which protrudes from the wall of the conductive portion 121 by a first length L1; the portion of the blocking portion 122 that protrudes from the side wall of the conductive portion 121 near the second region 10b is the second sub-blocking portion 1222, which protrudes from the wall of the conductive portion 121 by a second length L2; the second length L2 is greater than the first length L1.

[0267] Thus, during the evaporation of the light-emitting material film layer 171 and the electrode material layer 172, the second sub-blocking portion 1222 can have a large blocking area, so that the insulating structure 15 below the second sub-blocking portion 1222 is not covered by the light-emitting material film layer 171 and the electrode material layer 172, thereby allowing the covering portion 144 to contact the insulating structure 15.

[0268] In one embodiment, the ratio of the second length L2 to the first length L1 is between 1 and 3. For example, the ratio of the second length L2 to the first length L1 can be 1, 1.5, 2, 3, or any two of the above values. This allows the second sub-blocking portion 1222 to have a relatively suitable blocking area while keeping the manufacturing cost relatively low.

[0269] In one embodiment, the isolation structure 12 is a metal structure, and the metal structure density of the first region 10a is greater than that of the second region 10b. Thus, when the isolation structure 12 is side-cut, the side-cut depth of the second isolation structure 12e2 near the second region 10b can be deeper than the side-cut depth at the first isolation opening 12a, that is, the protruding length of the second sub-block 1222 is longer than the protruding length of the first sub-block 1221.

[0270] In one embodiment, reference Figure 11 and Figure 12 As shown, the insulating structure 15 located in the second region 10b has a second groove 15a. The protective layer 14 also includes a third extension 145, which is connected to the end of the covering portion 144 away from the main body portion 141 and covers at least a portion of the groove wall of the second groove 15a. This helps to increase the contact area between the protective layer 14 and the insulating structure 15 and improve the connection stability of the protective layer 14.

[0271] In one embodiment, the second trench 15a includes a second sub-trench 15a2 and a second opening 15a1; the second opening 15a1 is located on the side of the second sub-trench 15a2 away from the substrate 111; the orthographic projection of the second opening 15a1 on the substrate 111 falls within the orthographic projection range of the second sub-trench 15a2 on the substrate 111. That is, the second trench 15a is a trench structure with a "small opening and large cavity".

[0272] Specifically, the third extension 145 covers at least a portion of the groove wall of the second sub-groove 15a2.

[0273] Thus, the second trench 15a is equivalent to a "sealing structure". On the one hand, it can increase the contact area between the protective layer 14 and the insulating structure 15. On the other hand, even if the protective layer 14 peels, the second opening 15a1 can act as a barrier to slow down the protective layer 14 located in the second sub-trench 15a2 from "lifting" outward, thereby "locking" the protective layer 14 and reducing the risk of the protective layer 14 peeling.

[0274] In one embodiment, the insulating structure 15 includes a planarization layer 151 and a pixel definition layer 152 stacked together, with the planarization layer 151 disposed between the substrate 111 and the pixel definition layer 152; a second opening 15a1 penetrates the pixel definition layer 152 along the thickness direction of the substrate 111, and a second sub-trench 15a2 is disposed on the side surface of the planarization layer 151 facing away from the substrate 111. This allows the second trench 15a to be formed by utilizing the material difference between the planarization layer 151 and the pixel definition layer 152.

[0275] In one embodiment, the dimension of the second opening 15a1 along the second direction is smaller than the dimension of the second sub-groove 15a2 along the second direction; the second direction is perpendicular to the thickness direction of the substrate 111 and the extension direction of the second trench 15a. (Refer to...) Figure 12 As shown, the second direction is horizontal, and the second groove 15a extends in a direction perpendicular to the paper surface.

[0276] In one embodiment, a light-emitting material film layer 171 and an electrode material layer 172 are stacked between the cover portion 144 and the insulating structure 15, with the light-emitting material film layer 171 located between the insulating structure 15 and the electrode material layer 172.

[0277] In one embodiment, the pixel definition layer 152 is provided with a plurality of pixel openings (not shown in the figure), a plurality of first isolation openings 12a are correspondingly and through the plurality of pixel openings, and a plurality of light-emitting elements 13 are correspondingly and through the plurality of pixel openings. For example, the first isolation openings 12a are correspondingly and through the pixel openings one by one, and the light-emitting elements 13 are correspondingly and through the pixel openings one by one.

[0278] In one embodiment, the plurality of light-emitting elements 13 include a plurality of first light-emitting elements 13a, a plurality of second light-emitting elements 13b, and a plurality of third light-emitting elements 13c; the first light-emitting elements 13a, second light-emitting elements 13b, and third light-emitting elements 13c are respectively used to emit light of different colors. The display panel 10 also includes a plurality of first encapsulation portions 161, a plurality of second encapsulation portions 162, and a plurality of third encapsulation portions 163. The plurality of first encapsulation portions 161 correspond one-to-one with the plurality of first light-emitting elements 13a, and the first encapsulation portion 161 is disposed on the side of the corresponding first light-emitting element 13a away from the substrate 111; the plurality of second encapsulation portions 162 correspond one-to-one with the plurality of second light-emitting elements 13b, and the second encapsulation portion 162 is disposed on the side of the corresponding second light-emitting element 13b away from the substrate 111; the plurality of third encapsulation portions 163 correspond one-to-one with the plurality of third light-emitting elements 13c, and the third encapsulation portion 163 is disposed on the side of the corresponding third light-emitting element 13c away from the substrate 111.

[0279] Specifically, the first isolation opening 12a includes a first opening 12a1, a second opening 12a2 and a third opening 12a3. At least a portion of the first light-emitting element 13a is disposed in the first opening 12a1, at least a portion of the second light-emitting element 13b is disposed in the second opening 12a2, and at least a portion of the third light-emitting element 13c is disposed in the third opening 12a3.

[0280] In one embodiment, the first encapsulation portion 161, the second encapsulation portion 162, and the third encapsulation portion 163 are all inorganic film layers. This allows the first encapsulation portion 161, the second encapsulation portion 162, and the third encapsulation portion 163 to all possess good encapsulation performance.

[0281] In one embodiment, any one of the first encapsulation portion 161, the second encapsulation portion 162, and the third encapsulation portion 163 is disposed in the same layer and made of the same material as the protective layer 14. In this way, it is equivalent to manufacturing the protective layer 14 and the encapsulation portion (one of the three encapsulation portions) in the same manufacturing process, reducing the number of manufacturing steps for the display panel 10 and lowering the manufacturing cost.

[0282] In a specific example, refer to Figure 13 and Figure 14 As shown, the first light-emitting element 13a and the first encapsulation portion 161 are fabricated first, then the second light-emitting element 13b and the second encapsulation portion 162 are fabricated, and finally the third light-emitting element 13c and the third encapsulation portion 163 are fabricated. During the fabrication of the second encapsulation portion 162, the second light-emitting material layer 174, the electrode material layer 172, and the second encapsulation material layer 176 not only cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, but also cover the isolation structure 12. Furthermore, the second encapsulation material layer 176 also covers the sidewall of the second isolation structure 12e2 near the second region 10b. Then, the second light-emitting material layer 174, the electrode material layer 172, and the second encapsulation material layer 176 within the third opening 12a3 are etched, resulting in the structure shown below. Figure 13 As shown. Next, the second light-emitting material layer 174, electrode material layer 172 and second encapsulation material layer 176 in the first opening 12a1, and the first light-emitting material layer 173, electrode material layer 172 and first encapsulation material layer 175 in the third opening 12a3, retain the second encapsulation material layer 176 on the sidewall of the second isolation structure 12e2, thereby forming a protective layer 14.

[0283] In one embodiment, reference Figure 15As shown, the first encapsulation portion 161 includes a first main portion 1611 and a first sub-portion 1612 connected to the first main portion 1611. The first main portion 1611 covers the sidewalls of the first light-emitting element 13a and the first isolation opening 12a, and the first sub-portion 1612 is disposed on the side of the isolation structure 12 away from the substrate 111. In this way, the contact area between the first encapsulation portion 161 and the film layer in the display panel 10 can be increased, and the connection stability of the first encapsulation portion 161 can be improved.

[0284] In one embodiment, the first sub-part 1612 is spaced apart from the side surface of the isolation structure 12 away from the substrate 111. This is because, during the fabrication of the first light-emitting element 13a, a first light-emitting material layer 173 and an electrode material layer 172 are formed between the first sub-part 1612 and the isolation structure 12, and in subsequent processes, the first light-emitting material layer 173 and the electrode material layer 172 in this region are removed.

[0285] In one embodiment, the second encapsulation portion 162 includes a second main portion 1621 and a second sub-portion 1622 connected to the second main portion 1621. The second main portion 1621 covers the sidewalls of the second light-emitting element 13b and the first isolation opening 12a, and the second sub-portion 1622 is disposed on the side of the isolation structure 12 away from the substrate 111. This increases the contact area between the second encapsulation portion 162 and the film layer in the display panel 10, improving the connection stability of the second encapsulation portion 162.

[0286] In one embodiment, the second sub-part 1622 is spaced apart from the side surface of the isolation structure 12 away from the substrate 111. This is because, during the fabrication of the second light-emitting element 13b, a second light-emitting material layer 174 and an electrode material layer 172 are formed between the second sub-part 1622 and the isolation structure 12, and in subsequent processes, the second light-emitting material layer 174 and the electrode material layer 172 in this region are removed.

[0287] In one embodiment, the third encapsulation portion 163 includes a third main portion 1631 and a third sub-portion 1632 connected to the third main portion 1631. The third main portion 1631 covers the sidewalls of the third light-emitting element 13c and the first isolation opening 12a, and the third sub-portion 1632 is located on the side of the isolation structure 12 away from the substrate 111. This increases the contact area between the third encapsulation portion 163 and the film layer in the display panel 10, improving the connection stability of the third encapsulation portion 163.

[0288] In one embodiment, the third sub-part 1632 is spaced apart from the side surface of the isolation structure 12 away from the substrate 111. This is because, during the fabrication of the third light-emitting element 13c, a third light-emitting material layer and an electrode material layer 172 are formed between the third sub-part 1632 and the isolation structure 12, and in subsequent processes, the third light-emitting material layer and the electrode material layer 172 in this region are removed.

[0289] In one embodiment, in adjacent first encapsulation portions 161 and second encapsulation portions 162, the orthographic projection of the first sub-portion 1612 on the substrate 111 overlaps with the orthographic projection of the second sub-portion 1622 on the substrate 111. This effectively causes the first encapsulation portion 161 and the second encapsulation portion 162 to overlap in the thickness direction of the display panel 10, which helps reduce the probability of peeling between the first encapsulation portion 161 and the second encapsulation portion 162, thereby improving the encapsulation reliability of the first encapsulation portion 161 or the second encapsulation portion 162.

[0290] In one embodiment, in adjacent first packaging portion 161 and second packaging portion 162, the first sub-portion 1612 and the second sub-portion 1622 are spaced apart.

[0291] In one embodiment, in adjacent first package portion 161 and second package portion 162, a portion of the second sub-portion 1622 is located on the side of the first sub-portion 1612 facing away from the substrate 111. This allows the second sub-portion 1622 to block the first sub-portion 1612 from above, preventing the first sub-portion 1612 from peeling up and improving the packaging reliability of the first package portion 161.

[0292] In one embodiment, in adjacent second encapsulation portions 162 and third encapsulation portions 163, the orthographic projection of the second sub-portion 1622 on the substrate 111 overlaps with the orthographic projection of the third sub-portion 1632 on the substrate 111. This effectively causes the second encapsulation portions 162 and third encapsulation portions 163 to overlap in the thickness direction of the display panel 10, which helps reduce the probability of peeling between the second encapsulation portions 162 and third encapsulation portions 163, thereby improving the encapsulation reliability of the second encapsulation portions 162 and third encapsulation portions 163.

[0293] In one embodiment, in adjacent second packaging portions 162 and third packaging portions 163, second sub-portions 1622 and third sub-portions 1632 are spaced apart.

[0294] In one embodiment, in adjacent second package portions 162 and third package portions 163, a portion of the third sub-portion 1632 is located on the side of the second sub-portion 1622 facing away from the substrate 111. This allows the third sub-portion 1632 to block the second sub-portion 1622 from above, preventing the second sub-portion 1622 from peeling up and improving the packaging reliability of the second package portion 162.

[0295] In one embodiment, reference Figure 16 As shown, the isolation structure 12 also includes a third isolation structure 12e3 located in the border area 10e, which is electrically connected to the first isolation structure 12e1. The display panel 10 also includes an array film layer 112 disposed between the substrate 111 and the isolation structure 12; the third isolation structure 12e3 is electrically connected to the traces 1121 in the array film layer 112. In this way, the third isolation structure 12e3 is reused as the traces 1121, which helps to reduce the manufacturing steps of the display panel 10 and reduce the manufacturing cost.

[0296] It is understandable that the third isolation structure 12e3 and the first isolation structure 12e1 can be directly electrically connected, or they can be electrically connected using other components, such as the first isolation structure 12e1 and the third isolation structure 12e3 being electrically connected using the second isolation structure 12e2. Furthermore, the first isolation structure 12e1, the second isolation structure 12e2, and the third isolation structure 12e3 can be located on the same layer, which can reduce manufacturing costs. Even further, the third isolation structure 12e3 and the first isolation structure 12e1 can be directly connected or spaced apart.

[0297] In one embodiment, the protective layer 14 also covers at least a portion of the sidewalls of the third isolation structure 12e3. Thus, during the fabrication of the display panel 10, the erosion of the sidewalls of the third isolation structure 12e3 by the process solution (such as an etching solution) is reduced, which helps prevent ion deposition in the third isolation structure 12e3 from affecting the light-emitting element 13 and its light-emitting performance.

[0298] In one embodiment, the display panel 10 further includes a dam 194 disposed in the bezel area 10e and surrounding the outer periphery of the isolation structure 12. By providing the dam 194, it is possible to prevent the overflow of organic materials in the display area.

[0299] In one embodiment, the display panel 10 further includes an organic encapsulation layer 192, which is disposed on the side of the light-emitting element 13 away from the substrate 111 and on the side of the isolation structure 12 away from the substrate 111.

[0300] In one embodiment, the organic encapsulation layer 192 also covers at least a portion of the dam 194.

[0301] In one embodiment, the display panel 10 further includes an inorganic encapsulation layer 193, which at least covers the side of the organic encapsulation layer 192 facing away from the substrate 111.

[0302] Figure 17 , Figure 18 , Figure 19 and Figure 20 The display panel 10 shown in this embodiment of the application.

[0303] Specifically, the display panel 10 has adjacent display areas 10f and bezel areas 10e. The display panel 10 includes an array substrate 11, a plurality of light-emitting elements 13, a metal structure 18, and a protective layer 14. The plurality of light-emitting elements 13 are spaced apart on one side of the array substrate 11. The metal structure 18 is disposed on one side of the array substrate 11; the metal structure 18 includes a first portion 181 and a second portion 182 electrically connected. The first portion 181 is located in the display area 10f and is used to space adjacent light-emitting elements 13. The second portion 182 is located in the bezel area 10e and is electrically connected to a trace 1121 in the array substrate 11. The protective layer 14 covers at least a portion of the sidewalls of the second portion 182. It is understood that the array substrate 11 may include a substrate 111 and an array film layer 112 disposed on the substrate 111, and the trace 1121 is disposed in the array film layer 112.

[0304] The display panel 10 provided in this application embodiment protects the sidewalls of the second part 182 of the metal structure 18 by providing a protective layer 14 covering at least a portion of the sidewalls. Thus, during the fabrication of the display panel 10, the erosion of the sidewalls of the second part 182 by the process solution (such as an etching solution) is reduced, which helps prevent ion deposition in the second part 182 from affecting the light-emitting element 13 and its light-emitting performance.

[0305] In one embodiment, reference Figure 18 As shown, the second portion 182 includes a first metal layer 1821 and a second metal layer 1822 stacked along a direction away from the array substrate 11; the two opposite ends of the second metal layer 1822 protrude from opposite sides of the first metal layer 1821 along the first direction. At least one sidewall of the first metal layer 1821 along the first direction is covered with a protective layer 14; the first direction is perpendicular to the thickness direction of the array substrate 11 and the extension direction of the second portion 182. Figure 18 In the middle, the first direction is horizontal, and the extension direction of the second part 182 is perpendicular to the paper.

[0306] In one embodiment, the first metal layer 1821 is covered with protective layers 14 on both sidewalls along the first direction. This further reduces the erosion of the sidewalls of the second portion 182 by the process solution (such as an etching solution).

[0307] In one embodiment, the protective layer 14 further covers the sidewalls of the second metal layer 1822 along the first direction. This increases the contact area between the protective layer 14 and the second portion 182, improving the connection stability of the protective layer 14.

[0308] In one embodiment, the protective layer 14 includes a main body 141 that covers the sidewalls of the first metal layer 1821 along the first direction and the sidewalls of the second metal layer 1822 along the first direction.

[0309] In one embodiment, the protective layer 14 is made of organic or inorganic materials. This allows the protective layer 14 to possess better protective performance.

[0310] In one embodiment, the protective layer 14 further includes a first extension 142 connected to the main body 141, the first extension 142 being disposed on the side of the second metal layer 1822 away from the array substrate 11. The surface of the first extension 142 near the array substrate 11 is spaced apart from the surface of the second metal layer 1822 away from the array substrate 11. This helps reduce the risk of peeling of the protective layer 14 and improves the connection stability of the protective layer 14.

[0311] It is understandable that organic material can be filled between the first extension 142 and the second metal layer 1822. This helps to increase the contact area between the protective layer 14 and other films in the display panel 10, further improving the connection stability of the protective layer 14.

[0312] In one embodiment, reference Figure 19 As shown, the first extensions 142 of the two protective layers 14 located on both sides of the first metal layer 1821 along the first direction are connected. In this way, connecting the two protective layers 14 helps to improve the connection stability of the protective layers 14.

[0313] In one embodiment, reference Figure 20 As shown, the second portion 182 is provided with a third trench 182a, which is located on the side of the second portion 182 away from the array substrate 11. The protective layer 14 also includes a second extension 143, which is connected to the end of the first extension 142 away from the main body 141 and covers at least a portion of the trench wall of the third trench 182a. This increases the contact area between the protective layer 14 and the second portion 182, improving the connection stability of the protective layer 14.

[0314] In one embodiment, the third trench 182a includes a third sub-trench 182a2 and a third opening 182a1, with the third opening 182a1 located on the side of the third sub-trench 182a2 away from the array substrate 11; the orthographic projection of the third opening 182a1 onto the array substrate 11 falls within the orthographic projection range of the third sub-trench 182a2 onto the array substrate 11. That is, the third trench 182a has a "small opening, large cavity" trench structure. Specifically, the second extension 143 covers at least a portion of the trench wall of the third sub-trench 182a2. Thus, the third groove 182a is equivalent to a "sealing structure". On the one hand, it can increase the contact area between the protective layer 14 and the second part 182. On the other hand, even if the protective layer 14 peels, the third opening 182a1 can act as a barrier to slow down the protective layer 14 located in the third sub-groove 182a2 from "lifting" outward, thereby "locking" the protective layer 14 and reducing the risk of peeling between the protective layer 14 and the second part 182.

[0315] In one embodiment, the third opening 182a1 extends through the second metal layer 1822 along the thickness direction of the array substrate 11, and the third sub-trench 182a2 is provided on the side surface of the first metal layer 1821 facing away from the array substrate 11. This allows the third trench 182a to be formed by utilizing the material difference between the first metal layer 1821 and the second metal layer 1822.

[0316] In one embodiment, reference Figure 20 As shown, the dimension of the third opening 182a1 along the first direction is smaller than the dimension of the third sub-groove 182a2 along the first direction; the first direction is perpendicular to the thickness direction of the array substrate 11 and the extension direction of the third trench 182a. Figure 20 In the middle, the first direction is horizontal, and the third groove 182a extends in a direction perpendicular to the paper surface.

[0317] In one embodiment, a light-emitting material film layer 171 and an electrode material layer 172 are stacked between the first extension 142 and the second metal layer 1822, with the light-emitting material film layer 171 located between the second metal layer 1822 and the electrode material layer 172. It should be noted that the light-emitting material film layer 171 may be disposed in the same layer and with the same material as one of the first light-emitting material layer 173 of the first light-emitting element 13a, the second light-emitting material layer 174 of the second light-emitting element 13b, and the third light-emitting material layer of the third light-emitting element 13c. Correspondingly, the electrode material layer 172 is disposed in the same layer and with the same material as the electrode material layer 172 of the first light-emitting element 13a, the second light-emitting element 13b, or the third light-emitting element 13c.

[0318] In one embodiment, the protective layer 14 further includes a cover portion 144 connected to the main body portion 141. One end of the cover portion 144 is connected to the end of the main body portion 141 away from the second metal layer 1822, and the other end of the cover portion 144 extends in a direction away from the second portion 182. By providing the cover portion 144, it is beneficial to increase the contact area between the protective layer 14 and other film layers in the display panel 10, thereby further improving the connection stability of the protective layer 14.

[0319] In one embodiment, the display panel 10 further includes an insulating structure 15 disposed between the metal structure 18 and the array substrate 11.

[0320] In one embodiment, reference Figure 18 and Figure 19 As shown, at least a portion of the surface of the cover portion 144 near the array substrate 11 is spaced apart from the surface of the insulating structure 15 away from the array substrate 11. Specifically, the end of the cover portion 144 away from the main body portion 141 is raised in a direction away from the array substrate 11.

[0321] It should be noted that the shape of the cover 144 is related to the manufacturing process of the protective layer 14. The cover 144 will lift up because the light-emitting material film layer 171 and the electrode material layer 172 will be covered under the cover 144, and the light-emitting material film layer 171 and the electrode material layer 172 will be removed in the subsequent manufacturing process.

[0322] In one embodiment, a second gap exists between the end of the main body 141 away from the second metal layer 1822 and the sidewall of the first metal layer 1821; the entire surface of the cover 144 near the array substrate 11 is spaced apart from the surface of the insulating structure 15 away from the array substrate 11. The second gap is not shown in the accompanying drawings of this application, but can be compared here. Figure 10 As shown, Figure 10 The first gap 195 in the middle is equivalent to the second gap here. The reason why there is a second gap between the main body 141 and the sidewall of the second metal layer 1822 is that the edge of the electrode material layer 172 will climb onto the sidewall of the second metal layer 1822, and the electrode material layer 172 is removed in subsequent manufacturing processes.

[0323] In one embodiment, the display panel 10 further includes a filler layer 191, at least a portion of which fills the second gap and the space between the cover portion 144 and the insulating structure 15. By providing the filler layer 191, the contact area between the protective layer 14 and the film layer in the display panel 10 can be increased, further improving the connection stability of the protective layer 14.

[0324] In one embodiment, the filler layer 191 comprises an organic material. This ensures that the filler layer 191 effectively fills the second gap.

[0325] In one embodiment, the display panel 10 further includes an organic encapsulation layer 192, which is disposed on the side of the light-emitting element 13 away from the array substrate 11 and on the side of the metal structure 18 away from the array substrate 11; the filler layer 191 and the organic encapsulation layer 192 are disposed in the same layer and made of the same material. Thus, the filler layer 191 and the organic encapsulation layer 192 can be fabricated simultaneously in the same manufacturing process, which helps to reduce the manufacturing process of the display panel 10 and lower manufacturing costs.

[0326] In one embodiment, the display panel 10 further includes a dam 194 disposed in the bezel area 10e and surrounding the outer periphery of the metal structure 18. By providing the dam 194, it is possible to prevent the overflow of organic materials in the display area 10f.

[0327] In one embodiment, the display panel 10 further includes an inorganic encapsulation layer 193, which at least covers the side of the organic encapsulation layer 192 facing away from the array substrate 11.

[0328] In one embodiment, one end of the cover portion 144 near the main body portion 141 contacts the surface of the insulating structure 15 away from the array substrate 11; the other end of the cover portion 144 away from the main body portion 141 is spaced apart from the insulating structure 15.

[0329] By bringing the cover 144 into contact with the insulating structure 15, the bonding strength of the protective layer 14 can be improved, which helps to prevent peeling of the protective layer 14.

[0330] In one embodiment, the first part 181 includes a third metal layer (not shown) and a fourth metal layer (not shown) stacked along a direction away from the array substrate 11; the first part 181 is provided with a plurality of second isolation openings 181a, and a plurality of light-emitting elements 13 are correspondingly disposed with the plurality of second isolation openings 181a; at least a portion of the light-emitting elements 13 is disposed within the corresponding second isolation opening 181a.

[0331] In one embodiment, the end of the fourth metal layer near the second isolation opening 181a extends toward the center of the second isolation opening 181a and protrudes from the side wall of the third metal layer near the second isolation opening 181a. The length of the fourth metal layer protruding from the side wall of the third metal layer near the second isolation opening 181a is a first length; the length of the first metal layer 1821 protruding from the side wall of the second metal layer 1822 along the first direction is a second length; the second length is greater than the first length. It should be noted that the metal structure 18 in the second aspect embodiment can be considered as a metal structure 18.

[0332] The above configuration allows the second metal layer 1822 to have a larger blocking area during the evaporation of the luminescent material film layer 171 and the electrode material layer 172, so that the insulating structure 15 below the second metal layer 1822 is not covered by the luminescent material film layer 171 and the electrode material layer 172, thereby allowing the covering part 144 to contact the insulating structure 15.

[0333] In one embodiment, the ratio of the second length to the first length is between 1 and 3. Exemplarily, the ratio of the second length to the first length can be 1, 1.5, 2, 3, or any two of the aforementioned values. This allows the second metal layer 1822 to have a reasonably suitable blocking area while keeping the manufacturing cost relatively low.

[0334] In one embodiment, the first metal layer 1821 and the third metal layer are disposed in the same layer and made of the same material. For example, the first metal layer 1821 and the third metal layer may be made of aluminum.

[0335] In one embodiment, the second metal layer 1822 and the fourth metal layer are disposed in the same layer and made of the same material. For example, the second metal layer 1822 and the fourth metal layer may be made of titanium or molybdenum.

[0336] In one embodiment, the density of the metal structure 18 in the display area 10f is greater than the density of the metal structure 18 in the border area 10e. Thus, when the metal structure 18 is etched, the etch depth of the second portion 182 can be greater than the etch depth of the first portion 181, that is, the protruding length of the second metal layer 1822 is greater than the protruding length of the fourth metal layer.

[0337] In one embodiment, the insulating structure 15 located in the border region 10e has a second groove 15a, and the protective layer 14 further includes a third extension 145, which is connected to the end of the covering portion 144 away from the main body portion 141 and covers at least a portion of the groove wall of the second groove 15a. This increases the contact area between the protective layer 14 and the insulating structure 15, improving the connection stability of the protective layer 14.

[0338] In one embodiment, the second trench 15a includes a second sub-trench 15a2 and a second opening 15a1; the second opening 15a1 is located on the side of the second sub-trench 15a2 away from the array substrate 11; the orthographic projection of the second opening 15a1 onto the array substrate 11 falls within the orthographic projection range of the second sub-trench 15a2 onto the array substrate 11. That is, the second trench 15a is a trench structure with a "small opening and large cavity". Specifically, the third extension 145 covers at least a portion of the trench wall of the second sub-trench 15a2.

[0339] In one embodiment, the insulating structure 15 includes a planarization layer 151 and a pixel definition layer 152 stacked together, with the planarization layer 151 disposed between the array substrate 11 and the pixel definition layer 152; a second opening 15a1 penetrates the pixel definition layer 152 along the thickness direction of the array substrate 11, and a second sub-trench 15a2 is disposed on the side surface of the planarization layer 151 facing away from the array substrate 11. This allows the second trench 15a to be formed by utilizing the material difference between the planarization layer 151 and the pixel definition layer 152.

[0340] In one embodiment, the dimension of the second opening 15a1 along the second direction is smaller than the dimension of the second sub-trench 15a2 along the second direction; the second direction is perpendicular to the thickness direction of the array substrate 11 and the extension direction of the second trench 15a. (Refer to...) Figure 20 As shown, the second direction is horizontal, and the second groove 15a extends in a direction perpendicular to the paper surface.

[0341] In one embodiment, a light-emitting material film layer 171 and an electrode material layer 172 are stacked between the cover portion 144 and the insulating structure 15, with the light-emitting material film layer 171 located between the insulating structure 15 and the electrode material layer 172.

[0342] In one embodiment, a plurality of second isolation openings 181a are disposed through a plurality of pixel openings. For example, the second isolation openings 181a are disposed through a pixel opening in a one-to-one correspondence, and the light-emitting element 13 is disposed through a pixel opening in a one-to-one correspondence.

[0343] In one embodiment, the plurality of light-emitting elements 13 include a plurality of first light-emitting elements 13a, a plurality of second light-emitting elements 13b, and a plurality of third light-emitting elements 13c; the first light-emitting elements 13a, the second light-emitting elements 13b, and the third light-emitting elements 13c are respectively used to emit light of different colors; the plurality of first light-emitting elements 13a, the plurality of second light-emitting elements 13b, and the plurality of third light-emitting elements 13c are disposed in a one-to-one correspondence with the plurality of second isolation openings 181a. The display panel 10 also includes a plurality of first encapsulation portions 161, a plurality of second encapsulation portions 162, and a plurality of third encapsulation portions 163. The plurality of first encapsulation portions 161 correspond one-to-one with a plurality of first light-emitting elements 13a, and the first encapsulation portion 161 is disposed on the side of the corresponding first light-emitting element 13a away from the array substrate 11. The plurality of second encapsulation portions 162 correspond one-to-one with a plurality of second light-emitting elements 13b, and the second encapsulation portion 162 is disposed on the side of the corresponding second light-emitting element 13b away from the array substrate 11. The plurality of third encapsulation portions 163 correspond one-to-one with a plurality of third light-emitting elements 13c, and the third encapsulation portion 163 is disposed on the side of the corresponding third light-emitting element 13c away from the array substrate 11.

[0344] In one embodiment, reference Figure 15As shown, the first encapsulation portion 161 includes a first main portion 1611 and a first sub-portion 1612 connected to the first main portion 1611. The first main portion 1611 covers the sidewalls of the first light-emitting element 13a and the second isolation opening 181a, and the first sub-portion 1612 is located on the side of the metal structure 18 away from the array substrate 11. In this way, the contact area between the first encapsulation portion 161 and the film layer in the display panel 10 can be increased, thereby improving the connection stability of the first encapsulation portion 161.

[0345] In one embodiment, the first sub-part 1612 is spaced apart from the side surface of the metal structure 18 away from the array substrate 11. This is because, during the fabrication of the first light-emitting element 13a, a first light-emitting material layer 173 and an electrode material layer 172 are formed between the first sub-part 1612 and the metal structure 18, and in subsequent processes, the first light-emitting material layer 173 and the electrode material layer 172 in this region are removed.

[0346] In one embodiment, the second encapsulation portion 162 includes a second main portion 1621 and a second sub-portion 1622 connected to the second main portion 1621. The second main portion 1621 covers the sidewalls of the second light-emitting element 13b and the second isolation opening 181a, and the second sub-portion 1622 is located on the side of the metal structure 18 away from the array substrate 11. This increases the contact area between the second encapsulation portion 162 and the film layer in the display panel 10, improving the connection stability of the second encapsulation portion 162.

[0347] In one embodiment, the second sub-part 1622 is spaced apart from the side surface of the metal structure 18 away from the array substrate 11. This is because, during the fabrication of the second light-emitting element 13b, a second light-emitting material layer 174 and an electrode material layer 172 are formed between the second sub-part 1622 and the metal structure 18, and in subsequent processes, the second light-emitting material layer 174 and the electrode material layer 172 in this region are removed.

[0348] In one embodiment, the third encapsulation portion 163 includes a third main portion 1631 and a third sub-portion 1632 connected to the third main portion 1631. The third main portion 1631 covers the sidewalls of the third light-emitting element 13c and the second isolation opening 181a, and the third sub-portion 1632 is located on the side of the metal structure 18 away from the array substrate 11. This increases the contact area between the third encapsulation portion 163 and the film layer in the display panel 10, improving the connection stability of the third encapsulation portion 163.

[0349] In one embodiment, the third sub-part 1632 is spaced apart from the side surface of the metal structure 18 away from the array substrate 11. This is because, during the fabrication of the third light-emitting element 13c, a third light-emitting material layer and an electrode material layer 172 are formed between the third sub-part 1632 and the metal structure 18, and in subsequent processes, the third light-emitting material layer and the electrode material layer 172 in this region are removed.

[0350] In one embodiment, in adjacent first packaging portions 161 and second packaging portions 162, the orthographic projection of the first sub-portion 1612 on the array substrate 11 overlaps with the orthographic projection of the second sub-portion 1622 on the array substrate 11. This effectively causes the first packaging portions 161 and second packaging portions 162 to overlap in the thickness direction of the display panel 10, which helps reduce the probability of peeling between the first packaging portions 161 and the second packaging portions 162, thereby improving the packaging reliability of the first packaging portions 161 and the second packaging portions 162.

[0351] In one embodiment, in adjacent first package portion 161 and second package portion 162, a portion of the second sub-portion 1622 is located on the side of the first sub-portion 1612 facing away from the array substrate 11. In this way, the second sub-portion 1622 can block the first sub-portion 1612 from above, preventing the first sub-portion 1612 from peeling up and improving the packaging reliability of the first package portion 161.

[0352] In one embodiment, in adjacent second packaging portions 162 and third packaging portions 163, the orthographic projection of the second sub-portion 1622 on the array substrate 11 overlaps with the orthographic projection of the third sub-portion 1632 on the array substrate 11. This effectively causes the second packaging portions 162 and third packaging portions 163 to overlap in the thickness direction of the display panel 10, which helps reduce the probability of peeling between the second packaging portions 162 and the third packaging portions 163, thereby improving the packaging reliability of the second packaging portions 162 and the third packaging portions 163.

[0353] In one embodiment, in adjacent second package portions 162 and third package portions 163, a portion of the third sub-portion 1632 is located on the side of the second sub-portion 1622 facing away from the array substrate 11. This allows the third sub-portion 1632 to block the second sub-portion 1622 from above, preventing the second sub-portion 1622 from peeling up and improving the packaging reliability of the second package portion 162.

[0354] Reference Figure 21 As shown, one embodiment of the manufacturing method of the display panel 10 of this application specifically includes the following steps:

[0355] S100: Provide substrate 111. Substrate 111 can be a rigid substrate 111 or a flexible substrate 111.

[0356] S200: An isolation structure 12, a plurality of light-emitting elements 13, and a protective layer 14 are formed on one side of the substrate 111. The isolation structure 12 includes a first isolation structure 12e1 located in the first region 10a and a second isolation structure 12e2 located at the junction of the first region 10a and the second region 10b. The first isolation structure 12e1 is provided with a plurality of first isolation openings 12a; the plurality of light-emitting elements 13 are correspondingly disposed with the plurality of first isolation openings 12a; at least a portion of the light-emitting elements 13 is disposed within the corresponding first isolation opening 12a; at least a portion of the sidewalls of the second isolation structure 12e2 facing the second region 10b are covered with the protective layer 14.

[0357] The method for manufacturing the display panel 10 provided in this application provides a protective layer 14 that covers at least a portion of the sidewalls of the second isolation structure 12e2 facing the second region 10b, thus protecting the second isolation structure 12e2. In this way, during the manufacturing of the display panel 10, the erosion of the sidewalls of the second isolation structure 12e2 by the process solution (such as an etching solution) is reduced. On the one hand, this helps prevent ion deposition in the second isolation structure 12e2 from affecting the light-emitting element 13 and its light-emitting performance; on the other hand, it helps reduce the risk of encapsulation failure caused by the erosion of the second isolation structure 12e2, thereby improving the reliability of the display panel 10.

[0358] In one embodiment, S200: An isolation structure 12, a plurality of light-emitting elements 13, and a protective layer 14 are formed on one side of the substrate 111, specifically including the following steps:

[0359] S210A: An isolation structure 12 is formed on one side of the substrate 111.

[0360] S220A: A protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0361] S230A: A plurality of light-emitting elements 13 are formed on one side of the substrate 111.

[0362] In this way, the protective layer 14 is essentially fabricated before all the light-emitting elements 13 are fabricated. This avoids the etching solution during the fabrication of each type of light-emitting element 13 from eroding the sidewall of the second isolation structure 12e2 facing the second region 10b, thus improving the protective performance of the protective layer 14.

[0363] In one embodiment, S200: An isolation structure 12, a plurality of light-emitting elements 13, and a protective layer 14 are formed on one side of the substrate 111, specifically including the following steps:

[0364] S210B: An isolation structure 12 is formed on one side of the substrate 111.

[0365] S220B: A protective layer 14 and a plurality of light-emitting elements 13 are formed on one side of the substrate 111. In this way, the protective layer 14 is formed simultaneously during the fabrication of the light-emitting elements 13, which helps to reduce the number of fabrication steps of the display panel 10 and reduce the manufacturing cost.

[0366] It should be noted that, prior to S210B, a plurality of first electrodes 131 arranged at intervals can be formed on the substrate 111.

[0367] In one embodiment, S220B: A protective layer 14 and a plurality of light-emitting elements 13 are formed on one side of the substrate 111, specifically including the following steps:

[0368] S221B: A first light-emitting element 13a is formed within the first opening 12a1. Specifically, a first light-emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 within the first opening 12a1 constitute the light-emitting portion 132 and the second electrode 133 of the first light-emitting element 13a.

[0369] S222B: A first encapsulation portion 161 is formed on the first light-emitting element 13a, and a protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b.

[0370] Specifically, S222B may include the following steps:

[0371] S2221B: A first encapsulation material layer 175 is formed on the electrode material layer 172. The first encapsulation material layer 175 also covers at least a portion of the sidewalls of the second isolation structure 12e2 facing the second region 10b.

[0372] S2222B: The first encapsulation material layer 175 is patterned to form the first encapsulation portion 161 and the protective layer 14.

[0373] It should be noted that S220B in this embodiment can employ either a "three-stage etching process" or a "four-stage etching process." If a "three-stage etching process" is used, then in S2222B, the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the second opening 12a2 and the third opening 12a3 are removed. If a "four-stage etching process" is used, then in S2222B, only the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the second opening 12a2 are removed, while the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the third opening 12a3 are retained. It should be noted that a wet etching process can be used to remove the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175.

[0374] It is understandable that the protective layer 14 formed in this step can not only prevent the etching solution used in step S222B from eroding the second isolation structure 12e2, but also prevent the etching solution used in the subsequent fabrication of the second light-emitting element 13b and the third light-emitting element 13c from eroding the second isolation structure 12e2.

[0375] After the protective layer 14 is formed, the following steps are performed;

[0376] S223B: A second light-emitting element 13b is formed within the second opening 12a2. Specifically, a second light-emitting material layer 174 and an electrode material layer 172 are stacked on one side of the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 within the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b.

[0377] S224B: A second encapsulation portion 162 is formed on the second light-emitting element 13b. Specifically, S224B may include the following steps:

[0378] S2241B: A second encapsulation material layer 176 is formed on the electrode material layer 172.

[0379] S2242B: The second encapsulation material layer 176 is patterned to form the second encapsulation portion 162.

[0380] If a "three-etching process" is used, then in S2242B, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the first opening 12a1 and the third opening 12a3 are removed. If a "four-etching process" is used, refer to... Figure 13 and Figure 14 As shown, in S2242B, firstly, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the third opening 12a3 are removed. Then, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the first opening 12a1, and the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the third opening 12a3 are removed. It should be noted that a wet etching process can be used to remove the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176.

[0381] After the second encapsulation part 162 is formed, the following steps are performed:

[0382] S225B: A third light-emitting element 13c is formed within the third opening 12a3. Specifically, a third light-emitting material layer and an electrode material layer 172 are stacked on one side of the substrate 111. The third light-emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The third light-emitting material layer and the electrode material layer 172 within the third opening 12a3 constitute the light-emitting portion 132 and the second electrode 133 of the third light-emitting element 13c.

[0383] S226B: A third package portion 163 is formed on the third light-emitting element 13c. Specifically, S226B may include the following steps:

[0384] S2261B: A third encapsulation material layer is formed on the electrode material layer 172.

[0385] S2262B: Remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer within the first opening 12a1 and the second opening 12a2 to form the third encapsulation portion 163. It should be noted that a wet etching process can be used to remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer.

[0386] In one embodiment, S220B: A protective layer 14 and a plurality of light-emitting elements 13 are formed on one side of the substrate 111, specifically including the following steps:

[0387] S221B: A first light-emitting element 13a is formed within the first opening 12a1. Specifically, a first light-emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 within the first opening 12a1 constitute the light-emitting portion 132 and the second electrode 133 of the first light-emitting element 13a.

[0388] S222B: A first encapsulation portion 161 is formed on the first light-emitting element 13a. Specifically, S222B may include the following steps:

[0389] S2221B: A first encapsulation material layer 175 is formed on the electrode material layer 172.

[0390] S2222B: The first encapsulation material layer 175 is patterned to form the first encapsulation portion 161.

[0391] If a "three-etching process" is used, then in S2222B, the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the second opening 12a2 and the third opening 12a3 are removed. If a "four-etching process" is used, then in S2222B, only the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the second opening 12a2 are removed, while the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the third opening 12a3 are retained. It should be noted that a wet etching process can be used to remove the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175.

[0392] After the first encapsulation part 161 is formed, the following steps are performed;

[0393] S223B: A second light-emitting element 13b is formed within the second opening 12a2. Specifically, a second light-emitting material layer 174 and an electrode material layer 172 are stacked on one side of the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 within the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b.

[0394] S224B: A second encapsulation portion 162 is formed on the second light-emitting element 13b, and a protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, S224B may include the following steps:

[0395] S2241B: A second encapsulation material layer 176 is formed on the electrode material layer 172. The second encapsulation material layer 176 also covers at least a portion of the sidewalls of the second isolation structure 12e2 facing the second region 10b.

[0396] S2242B: The second encapsulation material layer 176 is patterned to form the second encapsulation portion 162 and the protective layer 14.

[0397] If a "three-etching process" is used, then in S2242B, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the first opening 12a1 and the third opening 12a3 are removed. If a "four-etching process" is used, refer to... Figure 13 and Figure 14 As shown, in S2242B, firstly, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the third opening 12a3 are removed. Then, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the first opening 12a1, and the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the third opening 12a3 are removed. It should be noted that a wet etching process can be used to remove the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176.

[0398] It is understandable that the protective layer 14 formed in this step can not only prevent the etching solution used in step S224B from eroding the second isolation structure 12e2, but also prevent the etching solution used in the subsequent fabrication of the third light-emitting element 13c from eroding the second isolation structure 12e2.

[0399] After the protective layer 14 is formed, the following steps are performed:

[0400] S225B: A third light-emitting element 13c is formed within the third opening 12a3. Specifically, a third light-emitting material layer and an electrode material layer 172 are stacked on one side of the substrate 111. The third light-emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The third light-emitting material layer and the electrode material layer 172 within the third opening 12a3 constitute the light-emitting portion 132 and the second electrode 133 of the third light-emitting element 13c.

[0401] S226B: A third package portion 163 is formed on the third light-emitting element 13c. Specifically, S226B may include the following steps:

[0402] S2261B: A third encapsulation material layer is formed on the electrode material layer 172.

[0403] S2262B: Remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer within the first opening 12a1 and the second opening 12a2 to form the second encapsulation portion 162. It should be noted that a wet etching process can be used to remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer.

[0404] In one embodiment, S220B: A protective layer 14 and a plurality of light-emitting elements 13 are formed on one side of the substrate 111, specifically including the following steps:

[0405] S221B: A first light-emitting element 13a is formed within the first opening 12a1. Specifically, a first light-emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 within the first opening 12a1 constitute the light-emitting portion 132 and the second electrode 133 of the first light-emitting element 13a.

[0406] S222B: A first encapsulation portion 161 is formed on the first light-emitting element 13a. Specifically, S222B may include the following steps:

[0407] S2221B: A first encapsulation material layer 175 is formed on the electrode material layer 172.

[0408] S2222B: The first encapsulation material layer 175 is patterned to form the first encapsulation portion 161.

[0409] If a "three-etching process" is used, then in S2222B, the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the second opening 12a2 and the third opening 12a3 are removed. If a "four-etching process" is used, then in S2222B, only the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the second opening 12a2 are removed, while the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the third opening 12a3 are retained. It should be noted that a wet etching process can be used to remove the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175.

[0410] After the first encapsulation part 161 is formed, the following steps are performed;

[0411] S223B: A second light-emitting element 13b is formed within the second opening 12a2. Specifically, a second light-emitting material layer 174 and an electrode material layer 172 are stacked on one side of the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 within the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b.

[0412] S224B: A second encapsulation portion 162 is formed on the second light-emitting element 13b. Specifically, S224B may include the following steps:

[0413] S2241B: A second encapsulation material layer 176 is formed on the electrode material layer 172.

[0414] S2242B: The second encapsulation material layer 176 is patterned to form the second encapsulation portion 162 and the protective layer 14.

[0415] If a "three-etching process" is used, then in S2242B, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the first opening 12a1 and the third opening 12a3 are removed. If a "four-etching process" is used, refer to... Figure 13 and Figure 14 As shown, in S2242B, firstly, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the third opening 12a3 are removed. Then, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the first opening 12a1, and the first light-emitting material layer 173, electrode material layer 172, and first encapsulation material layer 175 within the third opening 12a3 are removed. It should be noted that a wet etching process can be used to remove the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176.

[0416] After the second encapsulation part 162 is formed, the following steps are performed:

[0417] S225B: A third light-emitting element 13c is formed within the third opening 12a3. Specifically, a third light-emitting material layer and an electrode material layer 172 are stacked on one side of the substrate 111. The third light-emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The third light-emitting material layer and the electrode material layer 172 within the third opening 12a3 constitute the light-emitting portion 132 and the second electrode 133 of the third light-emitting element 13c.

[0418] S226B: A third encapsulation portion 163 is formed on the third light-emitting element 13c, and a protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, S226B may include the following steps:

[0419] S2261B: A third encapsulation material layer is formed on the electrode material layer 172. The third encapsulation material layer also covers at least a portion of the sidewalls of the second isolation structure 12e2 facing the second region 10b.

[0420] S2262B: Remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer within the first opening 12a1 and the second opening 12a2 to form the second encapsulation portion 162. It should be noted that a wet etching process can be used to remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer. It is understood that the protective layer 14 formed in this step can prevent the etching solution used in step S226B from eroding the second isolation structure 12e2.

[0421] In one embodiment, S200: An isolation structure 12, a plurality of light-emitting elements 13, and a protective layer 14 are formed on one side of the substrate 111, specifically including the following steps:

[0422] S210C: An isolation structure material layer is formed on one side of the substrate 111. The isolation structure material layer may include multiple metal layers.

[0423] S220C: A first etching is performed on the isolation structure material layer to form the first opening 12a1 and the sidewalls of the second isolation structure 12e2 facing the second region 10b. Specifically, this is equivalent to performing a first side etching on the isolation structure material layer to form the initial morphology of the first opening 12a1 and the second isolation structure 12e2 facing the second region 10b. It should be noted that an etching barrier layer can be used to protect areas that do not need to be etched.

[0424] S230C: A first light-emitting element 13a is formed within the first opening 12a1. Specifically, a first light-emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 cover the first opening 12a1 and also cover the surface of the insulating structure material layer away from the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 within the first opening 12a1 constitute the light-emitting portion 132 and the second electrode 133 of the first light-emitting element 13a.

[0425] S240C: A first encapsulation portion 161 is formed on the first light-emitting element 13a. Specifically, S240C may include the following steps:

[0426] S241C: A first encapsulation material layer 175 is formed on the electrode material layer 172.

[0427] S242C: The first encapsulation material layer 175 is patterned to form the first encapsulation portion 161.

[0428] S250C: Side-etching is performed on the sidewall of the second isolation structure 12e2 facing the second region 10b. This is equivalent to performing a second side-etching on the second isolation structure 12e2, thereby forming the final morphology of the second isolation structure 12e2 facing the second region 10b. This allows for a larger bottom cut on the side of the second isolation structure 12e2 facing the second region 10b. It should be noted that an etching barrier layer can be used to protect areas that do not need to be etched.

[0429] S260C: A second etching is performed on the isolation structure material layer to form the second opening 12a2. Specifically, this is equivalent to a third side etching of the isolation structure material layer to form the second opening 12a2. It should be noted that an etching barrier layer can be used to protect areas that do not need to be etched.

[0430] S270C: A second light-emitting element 13b is formed within the second opening 12a2. Specifically, a stacked second light-emitting material layer 174 and an electrode material layer 172 are formed on one side of the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1 and the second opening 12a2, and also cover the surface of the isolation structure material layer away from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 within the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b. S280C: A second encapsulation portion 162 is formed on the second light-emitting element 13b, and a protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, S280C may include the following steps:

[0431] S281C: A second encapsulation material layer 176 is formed on the electrode material layer 172. The second encapsulation material layer 176 also covers at least a portion of the sidewalls of the second isolation structure 12e2 facing the second region 10b.

[0432] S282C: The second encapsulation material layer 176 is patterned to form the second encapsulation portion 162 and the protective layer 14.

[0433] Specifically, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the first opening 12a1 are removed. Additionally, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 on the side of the isolation structure material layer away from the substrate 111 are removed. It should be noted that a wet etching process can be used to remove the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176.

[0434] It is understandable that the protective layer 14 formed in this step can not only prevent the etching solution used in step S282C from eroding the second isolation structure 12e2, but also prevent the etching solution used in the subsequent fabrication of the third light-emitting element 13c from eroding the second isolation structure 12e2.

[0435] S290C: A third etching is performed on the isolation structure material layer to form the third opening 12a3. Specifically, this is equivalent to a fourth side etching of the isolation structure material layer to form the third opening 12a3. It should be noted that an etching barrier layer can be used to protect areas that do not need to be etched.

[0436] S2100C: A third light-emitting element 13c is formed within the third opening 12a3. Specifically, a third light-emitting material layer and an electrode material layer 172 are stacked on one side of the substrate 111. The third light-emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The third light-emitting material layer and the electrode material layer 172 within the third opening 12a3 constitute the light-emitting portion 132 and the second electrode 133 of the third light-emitting element 13c.

[0437] S2110C: A third package portion 163 is formed on the third light-emitting element 13c. Specifically, S2110C may include the following steps:

[0438] S2111C: A third encapsulation material layer is formed on the electrode material layer 172.

[0439] S2112C: Remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer within the first opening 12a1 and the second opening 12a2 to form the third encapsulation portion 163. It should be noted that a wet etching process can be used to remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer.

[0440] In one embodiment, S200: An isolation structure 12, a plurality of light-emitting elements 13, and a protective layer 14 are formed on one side of the substrate 111, specifically including the following steps:

[0441] S210C: An isolation structure material layer is formed on one side of the substrate 111. The isolation structure material layer may include multiple metal layers.

[0442] S220C: A first etching is performed on the isolation structure material layer to form the first opening 12a1 and the sidewalls of the second isolation structure 12e2 facing the second region 10b. Specifically, this is equivalent to performing a first side etching on the isolation structure material layer to form the initial morphology of the first opening 12a1 and the second isolation structure 12e2 facing the second region 10b. It should be noted that an etching barrier layer can be used to protect areas that do not need to be etched.

[0443] S230C: A first light-emitting element 13a is formed within the first opening 12a1. Specifically, a first light-emitting material layer 173 and an electrode material layer 172 are stacked on one side of the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 cover the first opening 12a1 and also cover the surface of the insulating structure material layer away from the substrate 111. The first light-emitting material layer 173 and the electrode material layer 172 within the first opening 12a1 constitute the light-emitting portion 132 and the second electrode 133 of the first light-emitting element 13a.

[0444] S240C: A first encapsulation portion 161 is formed on the first light-emitting element 13a. Specifically, S240C may include the following steps:

[0445] S241C: A first encapsulation material layer 175 is formed on the electrode material layer 172.

[0446] S242C: The first encapsulation material layer 175 is patterned to form the first encapsulation portion 161.

[0447] S250C: A second etching is performed on the isolation structure material layer to form the second opening 12a2. Specifically, this is equivalent to a second side etching of the isolation structure material layer to form the second opening 12a2. It should be noted that an etching barrier layer can be used to protect areas that do not need to be etched.

[0448] S260C: A second light-emitting element 13b is formed within the second opening 12a2. Specifically, a second light-emitting material layer 174 and an electrode material layer 172 are stacked on one side of the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 cover the first opening 12a1 and the second opening 12a2, and also cover the surface of the insulating structure material layer away from the substrate 111. The second light-emitting material layer 174 and the electrode material layer 172 within the second opening 12a2 constitute the light-emitting portion 132 and the second electrode 133 of the second light-emitting element 13b.

[0449] S270C: A second encapsulation portion 162 is formed on the second light-emitting element 13b.

[0450] Specifically, S270C may include the following steps:

[0451] S271C: A second encapsulation material layer 176 is formed on the electrode material layer 172.

[0452] S272C: The second encapsulation material layer 176 is patterned to form the second encapsulation portion 162.

[0453] Specifically, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 within the first opening 12a1 are removed. Additionally, the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176 on the side of the isolation structure material layer away from the substrate 111 are removed. It should be noted that a wet etching process can be used to remove the second light-emitting material layer 174, electrode material layer 172, and second encapsulation material layer 176.

[0454] S280C: Side-etching is performed on the sidewall of the second isolation structure 12e2 facing the second region 10b. This is equivalent to performing a second side-etching on the second isolation structure 12e2, thereby forming the final morphology of the second isolation structure 12e2 facing the second region 10b. This allows for a larger bottom cut on the side of the second isolation structure 12e2 facing the second region 10b. It should be noted that an etching barrier layer can be used to protect areas that do not need to be etched.

[0455] S290C: A third etching is performed on the isolation structure material layer to form a third opening 12a3. It should be noted that an etching barrier layer can be used to protect areas that do not need to be etched.

[0456] S2100C: A third light-emitting element 13c is formed within the third opening 12a3. Specifically, a third light-emitting material layer and an electrode material layer 172 are stacked on one side of the substrate 111. The third light-emitting material layer and the electrode material layer 172 cover the first opening 12a1, the second opening 12a2, and the third opening 12a3, and also cover the surface of the isolation structure 12 away from the substrate 111. The third light-emitting material layer and the electrode material layer 172 within the third opening 12a3 constitute the light-emitting portion 132 and the second electrode 133 of the third light-emitting element 13c.

[0457] S2110C: A third encapsulation portion 163 is formed on the third light-emitting element 13c, and a protective layer 14 is formed on at least a portion of the sidewall of the second isolation structure 12e2 facing the second region 10b. Specifically, S2110C may include the following steps:

[0458] S2111C: A third encapsulation material layer is formed on the electrode material layer 172. The third encapsulation material layer also covers at least a portion of the sidewalls of the second isolation structure 12e2 facing the second region 10b.

[0459] S2112C: Remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer within the first opening 12a1 and the second opening 12a2 to form the third encapsulation portion 163 and the protective layer 14. It should be noted that a wet etching process can be used to remove the third light-emitting material layer, electrode material layer 172, and third encapsulation material layer. It is understood that the protective layer 14 formed in this step can prevent the etching solution used in step S2112C from eroding the second isolation structure 12e2.

[0460] One display device of this application includes the display panel in any of the above embodiments.

[0461] The display device can be a laptop computer, mobile phone, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, TV monitor, flat panel display, computer monitor, car display (e.g., odometer display), navigator, cockpit controller and / or display, camera view display (e.g., display of a rearview camera in a vehicle), electronic photograph, electronic billboard or sign, projector, etc.

[0462] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel has a first region and a second region adjacent to the first region; the display panel includes: substrate; An isolation structure is disposed on one side of the substrate; the isolation structure includes a first isolation structure located in the first region and a second isolation structure located at the junction of the first region and the second region; the first isolation structure is provided with a plurality of first isolation openings; Multiple light-emitting elements are disposed on one side of the substrate and are correspondingly disposed with the multiple first isolation openings; at least a portion of the light-emitting elements are disposed within the corresponding first isolation openings; A protective layer covers at least a portion of the sidewalls of the second isolation structure facing the second region.

2. The display panel according to claim 1, characterized in that, The first area is the display area, and the second area is the border area; Optionally, the border area surrounds the periphery of the display area; Optionally, the isolation structure further includes a third isolation structure located in the border area, the third isolation structure being electrically connected to the first isolation structure; The display panel further includes an array film layer disposed between the substrate and the isolation structure; The third isolation structure is electrically connected to the wiring in the array film layer; Optionally, the protective layer also covers at least a portion of the sidewalls of the third isolation structure; Optionally, the display panel further includes a dam, which is disposed in the frame area and surrounds the outer periphery of the isolation structure; Optionally, the display panel further includes an organic encapsulation layer, which is disposed on the side of the light-emitting element away from the substrate and on the side of the isolation structure away from the substrate; Optionally, the organic encapsulation layer also covers at least a portion of the dam; Optionally, the display panel further includes an inorganic encapsulation layer, which at least covers the side of the organic encapsulation layer opposite to the substrate.

3. The display panel according to claim 1, characterized in that, The first area is the display area, and the second area is the punch-hole area; the light transmittance of the punch-hole area is greater than that of the display area; The isolation structure is provided with a first light-transmitting opening, which is located in the perforated area; Optionally, the display area is located around the perimeter of the cut-out area.

4. The display panel according to claim 1, characterized in that, The display panel has a first sub-display area and a second sub-display area, which are arranged adjacent to each other, and the light transmittance of the first sub-display area is less than that of the second sub-display area; the second sub-display area has a plurality of second regions arranged at intervals, and the remaining regions of the second sub-display area and the entire regions of the first sub-display area constitute the first region; The isolation structure includes multiple second light-transmitting openings that are disposed in a corresponding manner in a plurality of second regions. The protective layer includes multiple protective sub-layers that correspond one-to-one with the plurality of second light-transmitting openings. Each protective sub-layer covers the sidewall of the corresponding second light-transmitting opening. Optionally, the first sub-display area is located around the second sub-display area.

5. The display panel according to claim 1, characterized in that, The isolation structure includes a conductive portion and a blocking portion stacked along a direction away from the substrate; the outer contour of the orthographic projection of the blocking portion on the substrate is located outside the outer contour of the orthographic projection of the conductive portion on the substrate. The light-emitting element includes a first electrode, a light-emitting portion, and a second electrode stacked along a direction away from the substrate, wherein the second electrode is electrically connected to the conductive portion. The protective layer at least covers at least a portion of the wall surface of the conductive part of the second isolation structure facing the second region; Optionally, the protective layer also covers the wall surface of the blocking portion of the second isolation structure facing the second region; Optionally, the protective layer includes a main body that covers at least a portion of the sidewall of the second isolation structure facing the second region; Optionally, the protective layer is made of organic or inorganic materials.

6. The display panel according to claim 5, characterized in that, The protective layer further includes a first extension connected to the main body portion, the first extension portion being disposed on the side of the blocking portion away from the substrate; the surface of the first extension portion near the substrate is spaced apart from the surface of the blocking portion away from the substrate. Optionally, the second isolation structure is provided with a first groove, the first groove being located on the side of the isolation structure away from the substrate; the protective layer further includes a second extension, the second extension being connected to the end of the first extension away from the main body, and covering at least a portion of the groove wall of the first groove; Optionally, the first trench includes a first sub-trench and a first opening, the first opening being located on the side of the first sub-trench away from the substrate; the orthographic projection of the first opening on the substrate falls within the orthographic projection range of the first sub-trench on the substrate. Optionally, the first opening extends through the blocking portion along the thickness direction of the substrate, and the first sub-groove is provided on the side surface of the conductive portion opposite to the substrate. Optionally, the dimension of the first opening along the first direction is smaller than the dimension of the first sub-groove along the first direction; the first direction is perpendicular to the thickness direction of the substrate and the extension direction of the first groove. Optionally, a light-emitting material film and an electrode material layer are stacked between the first extension and the blocking portion, wherein the light-emitting material film is located between the blocking portion and the electrode material layer.

7. The display panel according to claim 6, characterized in that, The protective layer further includes a covering portion connected to the main body portion, one end of the covering portion being connected to the end of the main body portion away from the blocking portion, and the other end of the covering portion extending in a direction away from the second isolation structure; Optionally, the display panel further includes an insulating structure disposed between the isolation structure and the substrate.

8. The display panel according to claim 7, characterized in that, At least a portion of the surface of the cover near the substrate is spaced apart from the surface of the insulating structure away from the substrate; Optionally, a first gap is formed between the end of the main body portion away from the blocking portion and the sidewall of the second isolation structure near the second region; the entire surface of the covering portion near the substrate is spaced apart from the surface of the insulating structure away from the substrate. Optionally, the display panel further includes a filling layer, at least partially filling the first gap and the space between the cover and the insulating structure; Optionally, the filler layer comprises an organic material; Optionally, the display panel further includes an organic encapsulation layer, which is disposed on the side of the light-emitting element away from the substrate and on the side of the isolation structure away from the substrate; the filler layer is disposed in the same layer and made of the same material as the organic encapsulation layer.

9. The display panel according to claim 7, characterized in that, The end of the cover near the main body contacts the surface of the insulating structure away from the substrate; The end of the cover portion away from the main body portion is spaced apart from the insulating structure; Optionally, the main body covers all the sidewalls of the second isolation structure facing the second region; Optionally, the end of the blocking portion near the first isolation opening extends toward the center of the first isolation opening and protrudes from the side wall of the conductive portion near the first isolation opening. The blocking portion extends toward the second region at one end and protrudes from the side wall of the conductive portion near the second region. Wherein, the portion of the blocking part protruding from the side wall of the conductive part near the first isolation opening is a first sub-blocking part, and the first sub-blocking part protrudes from the wall of the conductive part by a first length; the portion of the blocking part protruding from the side wall of the conductive part near the second region is a second sub-blocking part, and the second sub-blocking part protrudes from the wall of the conductive part by a second length; the second length is greater than the first length; Optionally, the ratio of the second length to the first length is between 1 and 3; Optionally, the isolation structure is a metal structure, and the metal structure density of the first region is greater than that of the second region.

10. The display panel according to claim 7, characterized in that, The insulating structure located in the second region has a second trench, and the protective layer further includes a third extension, which is connected to the end of the cover portion away from the main body portion and covers at least a portion of the trench wall of the second trench; Optionally, the second trench includes a second sub-trench and a second opening; the second opening is located on the side of the second sub-trench away from the substrate; the orthographic projection of the second opening on the substrate falls within the orthographic projection range of the second sub-trench on the substrate. Optionally, the insulating structure includes a planarization layer and a pixel definition layer stacked together, the planarization layer being disposed between the substrate and the pixel definition layer; the second opening penetrates the pixel definition layer along the thickness direction of the substrate, and the second sub-trench is disposed on the side surface of the planarization layer facing away from the substrate; Optionally, the dimension of the second opening along the second direction is smaller than the dimension of the second sub-groove along the second direction; the second direction is perpendicular to the thickness direction of the substrate and the extension direction of the second groove; Optionally, a light-emitting material film layer and an electrode material layer are stacked between the covering portion and the insulating structure, wherein the light-emitting material film layer is located between the insulating structure and the electrode material layer; Optionally, the pixel definition layer is provided with a plurality of pixel openings, the plurality of first isolation openings are correspondingly and interconnected with the plurality of pixel openings, and the plurality of light-emitting elements are all correspondingly and interconnected with the plurality of pixel openings.

11. The display panel according to any one of claims 1-10, characterized in that, The plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements; the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; The display panel further includes a plurality of first encapsulation portions, a plurality of second encapsulation portions, and a plurality of third encapsulation portions. The plurality of first encapsulation portions correspond one-to-one with the plurality of first light-emitting elements, and the first encapsulation portion is disposed on the side of the corresponding first light-emitting element away from the substrate. The plurality of second encapsulation portions correspond one-to-one with the plurality of second light-emitting elements, and the second encapsulation portion is disposed on the side of the corresponding second light-emitting element away from the substrate. The plurality of third encapsulation portions correspond one-to-one with the plurality of third light-emitting elements, and the third encapsulation portion is disposed on the side of the corresponding third light-emitting element away from the substrate. Optionally, any one of the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion is disposed in the same layer and made of the same material as the protective layer; Optionally, the first encapsulation part, the second encapsulation part, and the third encapsulation part are all inorganic film layers; Optionally, the first encapsulation portion includes a first main portion and a first sub-portion connected to the first main portion. The first main portion covers the sidewall of the first light-emitting element and the first isolation opening, and the first sub-portion is located on the side of the isolation structure away from the substrate. Optionally, the first sub-part is spaced apart from the side surface of the isolation structure away from the substrate; Optionally, the second encapsulation portion includes a second main portion and a second sub-portion connected to the second main portion. The second main portion covers the sidewall of the second light-emitting element and the first isolation opening, and the second sub-portion is located on the side of the isolation structure away from the substrate. Optionally, the second sub-part is spaced apart from the side surface of the isolation structure away from the substrate; Optionally, the third encapsulation portion includes a third main portion and a third sub-portion connected to the third main portion. The third main portion covers the sidewall of the third light-emitting element and the first isolation opening, and the third sub-portion is located on the side of the isolation structure away from the substrate. Optionally, the third sub-part is spaced apart from the side surface of the isolation structure away from the substrate; Optionally, in adjacent first and second packaging portions, the orthographic projection of the first sub-part on the substrate overlaps with the orthographic projection of the second sub-part on the substrate; Optionally, in adjacent first and second packaging portions, the first sub-portion and the second sub-portion are spaced apart; Optionally, in adjacent first and second packaging portions, a portion of the second sub-portion is located on the side of the first sub-portion facing away from the substrate; Optionally, in adjacent second and third packaging portions, the orthographic projection of the second sub-part on the substrate overlaps with the orthographic projection of the third sub-part on the substrate; Optionally, in adjacent second and third packaging portions, the second sub-portion and the third sub-portion are spaced apart; Optionally, in the adjacent second and third packaging portions, a portion of the third sub-portion is located on the side of the second sub-portion facing away from the substrate.

12. A display panel, characterized in that, The display panel has adjacent display areas and border areas; the display panel includes: Array substrate; Multiple light-emitting elements are spaced apart on one side of the array substrate; A metal structure is disposed on one side of the array substrate; the metal structure includes a first part and a second part that are electrically connected, the first part being located in the display area and used to space adjacent light-emitting elements, the second part being located in the frame area and electrically connected to the traces in the array substrate; A protective layer, covering at least a portion of the sidewalls of the second part.

13. The display panel according to claim 12, characterized in that, The second part includes a first metal layer and a second metal layer stacked along a direction away from the array substrate; the two opposite ends of the second metal layer along a first direction protrude from the opposite sides of the first metal layer along the first direction; The protective layer is covered on at least one sidewall of the first metal layer along the first direction; The first direction is perpendicular to the thickness direction of the array substrate and the extension direction of the second portion; Optionally, the protective layer is respectively covered on both sidewalls of the first metal layer along the first direction; Optionally, the protective layer further covers the sidewalls of the second metal layer along the first direction; Optionally, the protective layer includes a main body that covers the sidewall of the first metal layer along the first direction and the sidewall of the second metal layer along the first direction.

14. The display panel according to claim 13, characterized in that, The protective layer further includes a first extension connected to the main body portion, the first extension being disposed on the side of the second metal layer away from the array substrate; the surface of the first extension near the array substrate is spaced apart from the surface of the second metal layer away from the array substrate. Optionally, the first extensions of the two protective layers located on both sides of the first metal layer along the first direction are connected; Optionally, the second portion is provided with a third groove, the third groove being located on the side of the second portion away from the array substrate; the protective layer further includes a second extension, the second extension being connected to the end of the first extension away from the main body portion, and covering at least a portion of the groove wall of the third groove; Optionally, the third trench includes a third sub-trench and a third opening, the third opening being located on the side of the third sub-trench away from the array substrate; the orthographic projection of the third opening on the array substrate falls within the orthographic projection range of the third sub-trench on the array substrate. Optionally, the third opening penetrates the second metal layer along the thickness direction of the array substrate, and the third sub-trench is disposed on the surface of the first metal layer facing away from the array substrate. Optionally, the dimension of the third opening along the first direction is smaller than the dimension of the third sub-groove along the first direction; the first direction is perpendicular to the thickness direction of the array substrate and the extension direction of the third trench; Optionally, a light-emitting material film and an electrode material layer are stacked between the first extension and the second metal layer, wherein the light-emitting material film is located between the second metal layer and the electrode material layer.

15. The display panel according to claim 13, characterized in that, The protective layer further includes a cover portion connected to the main body portion, one end of the cover portion being connected to the end of the main body portion away from the second metal layer, and the other end of the cover portion extending in a direction away from the second portion; Optionally, the display panel further includes an insulating structure disposed between the metal structure and the array substrate.

16. The display panel according to claim 15, characterized in that, At least a portion of the surface of the cover near the array substrate is spaced apart from the surface of the insulating structure away from the array substrate; Optionally, a second gap exists between the end of the main body portion away from the second metal layer and the sidewall of the first metal layer; the entire surface of the cover portion near the array substrate is spaced apart from the surface of the insulating structure away from the array substrate. Optionally, the display panel further includes a filling layer, at least partially filling the second gap and the space between the cover and the insulating structure; Optionally, the filler layer comprises an organic material; Optionally, the display panel further includes an organic encapsulation layer, which is disposed on the side of the light-emitting element away from the array substrate and on the side of the metal structure away from the array substrate; the filler layer is disposed in the same layer and of the same material as the organic encapsulation layer. Optionally, the display panel further includes a dam, which is disposed in the frame area and surrounds the outer periphery of the metal structure; Optionally, the organic encapsulation layer also covers at least a portion of the dam; Optionally, the display panel further includes an inorganic encapsulation layer, which at least covers the side of the organic encapsulation layer opposite to the array substrate.

17. The display panel according to claim 15, characterized in that, The end of the cover portion near the main body portion is in contact with the surface of the insulating structure away from the array substrate; the end of the cover portion away from the main body portion is spaced apart from the insulating structure. Optionally, the first portion includes a third metal layer and a fourth metal layer stacked along a direction away from the array substrate; the first portion is provided with a plurality of second isolation openings, and the plurality of light-emitting elements are disposed corresponding to the plurality of second isolation openings; At least a portion of the light-emitting element is disposed within the corresponding second isolation opening; Optionally, one end of the fourth metal layer near the second isolation opening extends toward the center of the second isolation opening and protrudes from the side wall of the third metal layer near the second isolation opening; Wherein, the length of the fourth metal layer protruding from the wall surface of the third metal layer near the second isolation opening is the first length; the length of the first metal layer protruding from the wall surface of the second metal layer along the first direction is the second length; the second length is greater than the first length; Optionally, the ratio of the second length to the first length is between 1 and 3; Optionally, the first metal layer and the third metal layer are disposed in the same layer and made of the same material; Optionally, the second metal layer and the fourth metal layer are disposed in the same layer and made of the same material; Optionally, the metal structure density of the display area is greater than the metal structure density of the border area.

18. The display panel according to claim 15, characterized in that, The insulating structure located in the frame area is provided with a second groove, and the protective layer further includes a third extension, which is connected to the end of the cover portion away from the main body portion and covers at least a portion of the groove wall of the second groove; Optionally, the second trench includes a second sub-trench and a second opening; the second opening is located on the side of the second sub-trench away from the array substrate; the orthographic projection of the second opening on the array substrate falls within the orthographic projection range of the second sub-trench on the array substrate. Optionally, the insulating structure includes a planarization layer and a pixel definition layer stacked together, the planarization layer being disposed between the array substrate and the pixel definition layer; the second opening penetrates the pixel definition layer along the thickness direction of the array substrate, and the second sub-trench is disposed on the side surface of the planarization layer opposite to the array substrate; Optionally, the dimension of the second opening along the second direction is smaller than the dimension of the second sub-trench along the second direction; the second direction is perpendicular to the thickness direction of the array substrate and the extension direction of the second trench; Optionally, a light-emitting material film layer and an electrode material layer are stacked between the covering portion and the insulating structure, wherein the light-emitting material film layer is located between the insulating structure and the electrode material layer; Optionally, the pixel definition layer is provided with a plurality of pixel openings, the first part is provided with a plurality of second isolation openings, the plurality of second isolation openings are correspondingly and interconnected with the plurality of pixel openings, and the plurality of light-emitting elements are all correspondingly and interconnected with the plurality of pixel openings.

19. The display panel according to any one of claims 12-18, characterized in that, The first part is provided with a plurality of second isolation openings, and the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements; the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; the plurality of first light-emitting elements, the plurality of second light-emitting elements, and the plurality of third light-emitting elements are respectively arranged in the plurality of second isolation openings; The display panel further includes a plurality of first encapsulation portions, a plurality of second encapsulation portions, and a plurality of third encapsulation portions. The plurality of first encapsulation portions correspond one-to-one with the plurality of first light-emitting elements, and the first encapsulation portion is disposed on the side of the corresponding first light-emitting element away from the array substrate. The plurality of second encapsulation portions correspond one-to-one with the plurality of second light-emitting elements, and the second encapsulation portion is disposed on the side of the corresponding second light-emitting element away from the array substrate. The plurality of third encapsulation portions correspond one-to-one with the plurality of third light-emitting elements, and the third encapsulation portion is disposed on the side of the corresponding third light-emitting element away from the array substrate. Optionally, any one of the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion is disposed in the same layer and made of the same material as the protective layer; Optionally, the first encapsulation part, the second encapsulation part, and the third encapsulation part are all inorganic film layers; Optionally, the first encapsulation portion includes a first main portion and a first sub-portion connected to the first main portion. The first main portion covers the sidewalls of the first light-emitting element and the second isolation opening, and the first sub-portion is located on the side of the metal structure away from the array substrate. Optionally, the first sub-part is spaced apart from the side surface of the metal structure away from the array substrate; Optionally, the second encapsulation portion includes a second main portion and a second sub-portion connected to the second main portion. The second main portion covers the sidewall of the second light-emitting element and the second isolation opening, and the second sub-portion is located on the side of the metal structure away from the array substrate. Optionally, the second sub-part is spaced apart from the side surface of the metal structure away from the array substrate; Optionally, the third encapsulation portion includes a third main portion and a third sub-portion connected to the third main portion. The third main portion covers the sidewall of the third light-emitting element and the second isolation opening, and the third sub-portion is located on the side of the metal structure away from the array substrate. Optionally, the third sub-part is spaced apart from the side surface of the metal structure away from the array substrate; Optionally, in adjacent first and second packaging portions, the orthographic projection of the first sub-part on the array substrate overlaps with the orthographic projection of the second sub-part on the array substrate; Optionally, in adjacent first and second packaging portions, the first sub-portion and the second sub-portion are spaced apart; Optionally, in adjacent first and second package portions, a portion of the second sub-portion is located on the side of the first sub-portion facing away from the array substrate; Optionally, in adjacent second and third packaging portions, the orthographic projection of the second sub-part on the array substrate overlaps with the orthographic projection of the third sub-part on the array substrate; Optionally, in adjacent second and third packaging portions, the second sub-portion and the third sub-portion are spaced apart; Optionally, in the adjacent second and third packaging portions, a portion of the third sub-portion is located on the side of the second sub-portion facing away from the array substrate.

20. A method for manufacturing a display panel, characterized in that, The display panel has a first area and a second area adjacent to the first area; The preparation method includes: Provide substrate; An isolation structure, a plurality of light-emitting elements, and a protective layer are formed on one side of the substrate; the isolation structure includes a first isolation structure located in the first region and a second isolation structure located at the junction of the first region and the second region; the first isolation structure is provided with a plurality of first isolation openings; the plurality of light-emitting elements are correspondingly arranged with the plurality of first isolation openings; at least a portion of the light-emitting elements are disposed in the corresponding first isolation openings; at least a portion of the sidewalls of the second isolation structure facing the second region are covered with the protective layer.

21. The preparation method according to claim 20, characterized in that, The method of forming an isolation structure, multiple light-emitting elements, and a protective layer on one side of the substrate includes: An isolation structure is formed on one side of the substrate; A protective layer is formed on at least a portion of the sidewalls of the second isolation structure facing the second region; Multiple light-emitting elements are formed on one side of the substrate.

22. The preparation method according to claim 20, characterized in that, The method of forming an isolation structure, multiple light-emitting elements, and a protective layer on one side of the substrate includes: An isolation structure is formed on one side of the substrate; A protective layer and multiple light-emitting elements are formed on one side of the substrate.

23. The preparation method according to claim 22, characterized in that, The plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; The plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings; The provision of forming a protective layer and multiple light-emitting elements on one side of the substrate includes: The first light-emitting element is formed within the first opening; A first encapsulation portion is formed on the first light-emitting element, and a protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region; A second light-emitting element is formed within the second opening; A second encapsulation portion is formed on the second light-emitting element; A third light-emitting element is formed within the third opening; A third encapsulation portion is formed on the third light-emitting element.

24. The preparation method according to claim 22, characterized in that, The plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; The plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings; The provision of forming a protective layer and multiple light-emitting elements on one side of the substrate includes: The first light-emitting element is formed within the first opening; A first encapsulation portion is formed on the first light-emitting element; A second light-emitting element is formed within the second opening; A second encapsulation portion is formed on the second light-emitting element, and a protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region; A third light-emitting element is formed within the third opening; A third encapsulation portion is formed on the third light-emitting element.

25. The preparation method according to claim 22, characterized in that, The plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; The plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings; The provision of forming a protective layer and multiple light-emitting elements on one side of the substrate includes: The first light-emitting element is formed within the first opening; A first encapsulation portion is formed on the first light-emitting element; A second light-emitting element is formed within the second opening; A second encapsulation portion is formed on the second light-emitting element; A third light-emitting element is formed within the third opening; A third encapsulation portion is formed on the third light-emitting element, and a protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region.

26. The preparation method according to claim 20, characterized in that, The plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; The plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings; The method of forming an isolation structure, multiple light-emitting elements, and a protective layer on one side of the substrate includes: An isolation structure material layer is formed on one side of the substrate; The isolation structure material layer is first etched to form a first opening and a sidewall of the second isolation structure facing the second region; A first light-emitting element is formed within the first opening; A first encapsulation portion is formed on the first light-emitting element; The sidewall of the second isolation structure facing the second region is side-cut; The isolation structure material layer is etched a second time to form a second opening; A second light-emitting element is formed within the second opening; A second encapsulation portion is formed on the second light-emitting element, and the protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region; The isolation structure material layer is etched a third time to form a third opening; A third light-emitting element is formed within the third opening; A third encapsulation portion is formed on the third light-emitting element.

27. The preparation method according to claim 20, characterized in that, The plurality of light-emitting elements includes a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, wherein the first light-emitting elements, the second light-emitting elements, and the third light-emitting elements are respectively used to emit light of different colors; The plurality of first isolation openings includes a plurality of first openings, a plurality of second openings, and a plurality of third openings; The method of forming an isolation structure, multiple light-emitting elements, and a protective layer on one side of the substrate includes: An isolation structure material layer is formed on one side of the substrate; The isolation structure material layer is first etched to form a first opening and a sidewall of the second isolation structure facing the second region; A first light-emitting element is formed within the first opening; A first encapsulation portion is formed on the first light-emitting element; The isolation structure material layer is etched a second time to form a second opening; A second light-emitting element is formed within the second opening; A second encapsulation portion is formed on the second light-emitting element; The sidewall of the second isolation structure facing the second region is side-cut; The isolation structure material layer is etched a third time to form a third opening; A third light-emitting element is formed within the third opening; A third encapsulation portion is formed on the third light-emitting element, and the protective layer is formed on at least a portion of the sidewall of the second isolation structure facing the second region.

28. A display device, characterized in that, Includes the display panel as described in any one of claims 1-19.

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