Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate; the pixel defining layer is arranged on one side of the substrate, and the pixel defining layer comprises pixel limiting parts and pixel openings defined by the pixel limiting parts; the isolation structure is arranged on one side of the substrate, isolation openings are formed in the isolation structure, and the isolation openings communicate with the pixel openings; at least part of the light-emitting device is located in the pixel opening, and the side, away from the substrate, of the pixel limiting part exposed out of at least part of the isolation opening is provided with a pit structure. The display panel provided by the embodiment of the invention has a relatively good display effect.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a display panel, a preparation method of the display panel and a display device. BACKGROUND

[0002] Organic light emitting diodes (OLED) and flat display devices based on light emitting diode (LED) technology have been widely applied to mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products due to their high image quality, power saving, thin body and wide application range, and have become the mainstream of display devices.

[0003] However, the process performance of the current OLED display product needs to be improved. SUMMARY

[0004] Embodiments of the present application provide a display panel, a preparation method of the display panel and a display device, aiming to improve the display effect of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; a pixel definition layer disposed on one side of the substrate, the pixel definition layer comprising a pixel limiting portion and a pixel opening formed by the pixel limiting portion; an isolation structure disposed on one side of the substrate, the isolation structure being provided with an isolation opening, the isolation opening being in communication with the pixel opening; and a light emitting device at least partially located in the pixel opening, wherein the pixel limiting portion exposed from at least part of the isolation opening has a pit structure on the side away from the substrate.

[0006] According to the embodiment of the first aspect of the present application, the isolation opening comprises a first opening and a second opening, the light emitting device comprises a first type of device arranged corresponding to the first opening and a second type of device arranged corresponding to the second opening, the first type of device and the second type of device have different light emitting colors, and the pixel limiting portion exposed from the second opening has a pit structure on the side away from the substrate.

[0007] According to any one of the preceding embodiments of the first aspect of the present application, the pixel limiting portion exposed from the first opening has a first flat surface on the side away from the substrate.

[0008] According to any one of the preceding embodiments of the first aspect of the present application, the isolation opening further comprises a third opening, the light emitting device comprises a third type of device arranged corresponding to the third opening, the pixel limiting portion exposed from the third opening has a pit structure on the side away from the substrate, or the pixel limiting portion exposed from the third opening has a first flat surface on the side away from the substrate.

[0009] According to any one of the foregoing embodiments of the first aspect of the application, the isolation opening further comprises a fourth opening, the light emitting device comprises a fourth type of device arranged corresponding to the fourth opening, and the pixel defining portion exposed from the fourth opening has a concave structure on the side facing away from the substrate, or the pixel defining portion exposed from the fourth opening has a first flat surface on the side facing away from the substrate.

[0010] According to any one of the foregoing embodiments of the first aspect of the application, the first type of device is a blue light emitting device, the second type of device is a green light emitting device, the third type of device is a red light emitting device, and the fourth type of device is a white light emitting device.

[0011] According to any one of the foregoing embodiments of the first aspect of the application, the film layer of the light emitting device is partially located in the concave structure.

[0012] According to any one of the foregoing embodiments of the first aspect of the application, the light emitting device comprises, in the direction away from the substrate, a first electrode, a light emitting layer, and a second electrode stacked in sequence, the light emitting layer is partially located in the concave structure, and / or the second electrode is partially located in the concave structure.

[0013] According to any one of the foregoing embodiments of the first aspect of the application, the number of concave structures is one or more, the plurality of concave structures are arranged spaced apart, and / or the plurality of concave structures are connected.

[0014] According to any one of the foregoing embodiments of the first aspect of the application, the isolation structure comprises a first isolation portion and a second isolation portion located on the side of the first isolation portion facing away from the substrate, and the second isolation portion has a first protruding portion protruding from the first isolation portion towards the isolation opening.

[0015] According to any one of the foregoing embodiments of the first aspect of the application, the orthographic projection of the concave structure on the substrate is at least partially located in the orthographic projection of the first protruding portion on the substrate.

[0016] According to any one of the foregoing embodiments of the first aspect of the application, the isolation opening comprises a first opening and a second opening, the light emitting device comprises a first type of device arranged corresponding to the first opening and a second type of device arranged corresponding to the second opening, and the protruding length of the second isolation portion relative to the first isolation portion towards the first opening is smaller than the protruding length of the second isolation portion relative to the first isolation portion towards the second opening.

[0017] According to any one of the preceding embodiments of the first aspect of the application, the first isolation portion has a first surface facing away from the substrate, the second isolation portion has a second surface facing towards the substrate, the first surface has a first distance between a footprint on the substrate of an edge of the first opening corresponding to the first surface and a footprint on the substrate of an edge of the first opening corresponding to the second surface, the first surface has a second distance between a footprint on the substrate of an edge of the second opening corresponding to the first surface and a footprint on the substrate of an edge of the second opening corresponding to the second surface, the first distance being smaller than the second distance.

[0018] According to any one of the preceding embodiments of the first aspect of the application, the first isolation portion has a third surface facing towards the substrate, the third surface has a third distance between a footprint on the substrate of an edge of the first opening corresponding to the third surface and a footprint on the substrate of an edge of the first opening corresponding to the second surface, the third surface has a fourth distance between a footprint on the substrate of an edge of the second opening corresponding to the third surface and a footprint on the substrate of an edge of the second opening corresponding to the second surface, the third distance being smaller than the fourth distance.

[0019] According to any one of the preceding embodiments of the first aspect of the application, the isolation opening further comprises a third opening, the light emitting device comprises a third type of device arranged corresponding to the third opening, the second isolation portion has a protruding length towards the third opening relative to the first isolation portion which is not smaller than a protruding length of the second isolation portion towards the first opening relative to the first isolation portion, and / or the second isolation portion has a protruding length towards the third opening relative to the first isolation portion which is not larger than a protruding length of the second isolation portion towards the second opening relative to the first isolation portion.

[0020] According to any one of the preceding embodiments of the first aspect of the application, the first surface has a fifth distance between a footprint on the substrate of an edge of the third opening corresponding to the first surface and a footprint on the substrate of an edge of the third opening corresponding to the second surface, the fifth distance being not smaller than the first distance, and / or the fifth distance being not larger than the second distance.

[0021] According to any one of the preceding embodiments of the first aspect of the application, the third surface has a sixth distance between a footprint on the substrate of an edge of the third opening corresponding to the third surface and a footprint on the substrate of an edge of the third opening corresponding to the second surface, the sixth distance being not smaller than the third distance, and / or the sixth distance being not larger than the fourth distance.

[0022] According to any one of the preceding embodiments of the first aspect of the application, the isolation opening further comprises a fourth opening, the light emitting device comprises a fourth type of device arranged corresponding to the fourth opening, the second isolation portion has a protruding length towards the fourth opening relative to the first isolation portion which is larger than or equal to a protruding length of the second isolation portion towards the third opening relative to the first isolation portion.

[0023] According to any one of the preceding embodiments of the first aspect of the application, the first surface has a seventh distance between the orthographic projection on the substrate of the edge of the fourth opening corresponding to the first surface and the orthographic projection on the substrate of the edge of the fourth opening corresponding to the second surface, the seventh distance being not less than the first distance, and / or the seventh distance being not greater than the second distance.

[0024] According to any one of the preceding embodiments of the first aspect of the application, the first surface has a fifth distance between the orthographic projection on the substrate of the edge of the third opening corresponding to the first surface and the orthographic projection on the substrate of the edge of the third opening corresponding to the second surface, the seventh distance being greater than or equal to the fifth distance.

[0025] According to any one of the preceding embodiments of the first aspect of the application, the third surface has an eighth distance between the orthographic projection on the substrate of the edge of the fourth opening corresponding to the third surface and the orthographic projection on the substrate of the edge of the fourth opening corresponding to the second surface, the eighth distance being not less than the third distance, and / or the eighth distance being not greater than the fourth distance.

[0026] According to any one of the preceding embodiments of the first aspect of the application, the third surface has a sixth distance between the orthographic projection on the substrate of the edge of the third opening corresponding to the third surface and the orthographic projection on the substrate of the edge of the third opening corresponding to the second surface, the eighth distance being greater than or equal to the sixth distance.

[0027] According to any one of the preceding embodiments of the first aspect of the application, the isolation structure further comprises a conductive portion disposed on the first isolation portion towards the substrate side, the conductive portion has a second protruding portion protruding from the first isolation portion towards the isolation opening, at least part of the second protruding portion of the conductive portion away from the substrate side has a pit structure.

[0028] According to any one of the preceding embodiments of the first aspect of the application, the isolation opening comprises a first opening and a second opening, the light emitting device comprises a first type of device corresponding to the first opening and a second type of device corresponding to the second opening, the second protruding portion protruding from the first isolation portion towards the second opening away from the substrate side has a pit structure.

[0029] According to any one of the preceding embodiments of the first aspect of the application, the second protruding portion protruding from the first isolation portion towards the first opening away from the substrate side has a second flat surface.

[0030] According to any one of the preceding embodiments of the first aspect of the application, the isolation opening further comprises a third opening, the light emitting device comprises a third type of device corresponding to the third opening, the second protruding portion protruding from the first isolation portion towards the third opening away from the substrate side has a pit structure, or the second protruding portion protruding from the first isolation portion towards the third opening away from the substrate side has a second flat surface.

[0031] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation opening further comprises a fourth opening, the light emitting device comprises a fourth type of device arranged corresponding to the fourth opening, the second protruding portion protruding from the first isolation portion towards the fourth opening has a concave structure on the side away from the substrate, or the second protruding portion protruding from the first isolation portion towards the fourth opening has a second flat surface on the side away from the substrate.

[0032] According to any one of the foregoing embodiments of the first aspect of the present application, the light emitting device is partially located in the concave structure of the conductive portion.

[0033] According to any one of the foregoing embodiments of the first aspect of the present application, in the direction away from the substrate, the light emitting device comprises a first electrode, a light emitting layer and a second electrode stacked in sequence, the second electrode is connected to the conductive portion, and the second electrode is partially located in the concave structure of the conductive portion.

[0034] According to any one of the foregoing embodiments of the first aspect of the present application, the second electrode is further connected to the first isolation portion.

[0035] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation opening comprises a first opening and a second opening, the light emitting device comprises a first type of device arranged corresponding to the first opening and a second type of device arranged corresponding to the second opening, the isolation structure comprises a first isolation portion and a conductive portion located on the side of the first isolation portion towards the substrate, the protruding length of the conductive portion towards the first opening with respect to the first isolation portion is less than the protruding length of the conductive portion towards the second opening with respect to the first isolation portion.

[0036] According to any one of the foregoing embodiments of the first aspect of the present application, the protruding length of the conductive portion towards the first opening with respect to the first isolation portion is in the range of 0.05 microns to 0.4 microns.

[0037] According to any one of the foregoing embodiments of the first aspect of the present application, the protruding length of the conductive portion towards the second opening with respect to the first isolation portion is greater than the protruding length of the conductive portion 330 towards the first opening with respect to the first isolation portion, and is not greater than 3 times the protruding length of the conductive portion 330 towards the first opening with respect to the first isolation portion.

[0038] According to any one of the foregoing embodiments of the first aspect of the present application, the protruding length of the conductive portion towards the second opening with respect to the first isolation portion is not less than 3 / 2 times the protruding length of the conductive portion 330 towards the first opening with respect to the first isolation portion, and is not greater than 2 times the protruding length of the conductive portion 330 towards the first opening with respect to the first isolation portion.

[0039] According to any one of the preceding embodiments of the first aspect of the application, the isolation structure further comprises a second isolation portion located on the side of the first isolation portion facing away from the substrate, a projection of an edge of the second isolation portion on the substrate towards the side of the first opening has a ninth distance from a projection of an edge of the conductive portion on the substrate towards the side of the first opening, a projection of an edge of the second isolation portion on the substrate towards the side of the second opening has a tenth distance from a projection of an edge of the conductive portion on the substrate towards the side of the second opening, and the ninth distance is equal to the tenth distance.

[0040] According to any one of the preceding embodiments of the first aspect of the application, the ninth distance and the tenth distance are in a range of 0.1 micrometers to 0.6 micrometers.

[0041] According to any one of the preceding embodiments of the first aspect of the application, the isolation structure further comprises a third opening, the light emitting device comprises a third type of device arranged corresponding to the third opening, and a protruding length of the conductive portion relative to the first isolation portion towards the third opening is not less than a protruding length of the conductive portion relative to the first isolation portion towards the first opening, and / or a protruding length of the conductive portion relative to the first isolation portion towards the third opening is not greater than a protruding length of the conductive portion relative to the first isolation portion towards the second opening.

[0042] According to any one of the preceding embodiments of the first aspect of the application, the protruding length of the conductive portion relative to the first isolation portion towards the third opening is in a range of 0.05 micrometers to 0.4 micrometers.

[0043] According to any one of the preceding embodiments of the first aspect of the application, the isolation structure further comprises a second isolation portion located on the side of the first isolation portion facing away from the substrate, a projection of an edge of the second isolation portion on the substrate towards the side of the first opening has a ninth distance from a projection of an edge of the conductive portion on the substrate towards the side of the first opening, a projection of an edge of the second isolation portion on the substrate towards the side of the second opening has a tenth distance from a projection of an edge of the conductive portion on the substrate towards the side of the second opening, and a projection of an edge of the second isolation portion on the substrate towards the side of the third opening has an eleventh distance from a projection of an edge of the conductive portion on the substrate towards the side of the third opening, and the ninth distance, the tenth distance and the eleventh distance are all equal.

[0044] According to any one of the preceding embodiments of the first aspect of the application, the ninth distance, the tenth distance and the eleventh distance are in a range of 0.1 micrometers to 0.6 micrometers.

[0045] According to any one of the preceding embodiments of the first aspect of the application, the isolation structure further comprises a fourth opening, the light emitting device comprises a fourth type of device arranged corresponding to the fourth opening, and a protruding length of the conductive portion relative to the first isolation portion towards the fourth opening is greater than or equal to a protruding length of the conductive portion relative to the first isolation portion towards the third opening.

[0046] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation structure further comprises a second isolation portion located on the side of the first isolation portion away from the substrate, a normal projection on the substrate of an edge of the second isolation portion toward the side of the first opening has a ninth distance with a normal projection on the substrate of an edge of the conductive portion toward the side of the first opening, a normal projection on the substrate of an edge of the second isolation portion toward the side of the second opening has a tenth distance with a normal projection on the substrate of an edge of the conductive portion toward the side of the second opening, a normal projection on the substrate of an edge of the second isolation portion toward the side of the third opening has an eleventh distance with a normal projection on the substrate of an edge of the conductive portion toward the side of the third opening, and a normal projection on the substrate of an edge of the second isolation portion toward the side of the fourth opening has a twelfth distance with a normal projection on the substrate of an edge of the conductive portion toward the side of the fourth opening, wherein the ninth distance, the tenth distance, the eleventh distance and the twelfth distance are equal.

[0047] According to any one of the foregoing embodiments of the first aspect of the present application, the ninth distance, the tenth distance, the eleventh distance and the twelfth distance are in the range of 0.1 microns to 0.6 microns.

[0048] According to any one of the foregoing embodiments of the first aspect of the present application, the depth of the recess structure is in the range of 0.3 microns to 0.7 microns, and / or the width of the recess structure is less than 1.5 microns.

[0049] The embodiments of the first aspect of the present application also provide a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure being provided with an isolation opening, the isolation structure comprising a first isolation portion and a conductive portion disposed on the side of the first isolation portion away from the substrate, the conductive portion having a second protruding portion protruding from the first isolation portion toward the isolation opening; and a light emitting device at least partially located in the isolation opening, wherein the side of the second protruding portion of at least part of the conductive portion away from the substrate has a recess structure.

[0050] According to the embodiments of the first aspect of the present application, the isolation opening comprises a first opening and a second opening, the light emitting device comprises a first type of device disposed corresponding to the first opening and a second type of device disposed corresponding to the second opening, and the side of the second protruding portion protruding from the first isolation portion toward the first opening away from the substrate has a recess structure.

[0051] According to any one of the foregoing embodiments of the first aspect of the present application, the side of the second protruding portion protruding from the first isolation portion toward the first opening away from the substrate has a second flat surface.

[0052] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation opening further comprises a third opening, the light emitting device comprises a third type of device arranged corresponding to the third opening, the second protruding portion protruding from the first isolation portion towards the third opening has a concave structure on the side away from the substrate, or the second protruding portion protruding from the first isolation portion towards the third opening has a second flat surface on the side away from the substrate.

[0053] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation opening further comprises a fourth opening, the light emitting device comprises a fourth type of device arranged corresponding to the fourth opening, the second protruding portion protruding from the first isolation portion towards the fourth opening has a concave structure on the side away from the substrate, or the second protruding portion protruding from the first isolation portion towards the fourth opening has a second flat surface on the side away from the substrate.

[0054] According to any one of the foregoing embodiments of the first aspect of the present application, the light emitting device is partially located in the concave structure.

[0055] According to any one of the foregoing embodiments of the first aspect of the present application, in the direction away from the substrate, the light emitting device comprises a first electrode, a light emitting layer and a second electrode stacked in sequence, the second electrode is connected with the conductive portion, and the second electrode is partially located in the concave structure.

[0056] According to any one of the foregoing embodiments of the first aspect of the present application, the number of the concave structures is one or more, the plurality of concave structures are arranged at intervals, and / or the plurality of concave structures are connected.

[0057] Embodiments of the first aspect of the present application also provide a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure being provided with an isolation opening, the isolation opening comprising a first opening, a second opening and a third opening, the isolation structure comprising a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, the second isolation portion being disposed protruding from the first isolation portion towards the isolation opening; light emitting devices comprising a first type of device disposed corresponding to the first opening, a second type of device disposed corresponding to the second opening and a third type of device disposed corresponding to the third opening, wherein the side of the first isolation portion away from the substrate has a first surface, the side of the second isolation portion towards the substrate has a second surface, the first surface has a first distance between the orthographic projection of the edge corresponding to the first opening on the substrate and the orthographic projection of the edge corresponding to the first opening on the second surface, the first surface has a second distance between the orthographic projection of the edge corresponding to the second opening on the substrate and the orthographic projection of the edge corresponding to the second opening on the second surface, the first surface has a fifth distance between the orthographic projection of the edge corresponding to the third opening on the substrate and the orthographic projection of the edge corresponding to the third opening on the second surface, the first distance is smaller than the second distance, and the fifth distance is equal to the first distance; and / or, the side of the first isolation portion close to the substrate has a third surface, the third surface has a third distance between the orthographic projection of the edge corresponding to the first opening on the substrate and the orthographic projection of the edge corresponding to the first opening on the second surface, the third surface has a fourth distance between the orthographic projection of the edge corresponding to the second opening on the substrate and the orthographic projection of the edge corresponding to the second opening on the second surface, the third surface has a sixth distance between the orthographic projection of the edge corresponding to the third opening on the substrate and the orthographic projection of the edge corresponding to the third opening on the second surface, the third distance is smaller than the fourth distance, and the sixth distance is equal to the third distance.

[0058] According to the embodiments of the first aspect of the present application, the isolation opening further comprises a fourth opening, the light emitting devices comprise a fourth type of device disposed corresponding to the fourth opening, the first surface has a seventh distance between the orthographic projection of the edge corresponding to the fourth opening on the substrate and the orthographic projection of the edge corresponding to the fourth opening on the second surface, and the seventh distance is greater than or equal to the fifth distance; and / or, the third surface has an eighth distance between the orthographic projection of the edge corresponding to the fourth opening on the substrate and the orthographic projection of the edge corresponding to the fourth opening on the second surface, and the eighth distance is greater than or equal to the sixth distance.

[0059] Embodiments of the second aspect of the present application provide a method for manufacturing a display panel, comprising:

[0060] forming an isolation material layer on the substrate;

[0061] opening a first opening and a second opening through the isolation material layer;

[0062] disposing a first type of device in the first opening;

[0063] a second type of device is prepared in the second opening, the first type of device and the second type of device having different light emitting colors;

[0064] a third opening is formed through the isolation material layer;

[0065] a third type of device is disposed in the third opening.

[0066] According to the embodiments of the second aspect of the present application, the first type of device is disposed in the first opening, comprising:

[0067] a first device material layer is prepared on the substrate;

[0068] the first device material layer in the second opening is removed to form the first type of device corresponding to the first opening;

[0069] a second type of device is disposed in the second opening, comprising:

[0070] a second device material layer is prepared on the substrate;

[0071] the second device material layer outside the second opening is removed to form the second type of device corresponding to the second opening;

[0072] a third type of device is disposed in the third opening, comprising:

[0073] a third device material layer is prepared on the substrate;

[0074] the third device material layer outside the third opening is removed to form the third type of device corresponding to the third opening.

[0075] According to any one of the preceding embodiments of the second aspect of the present application, before the step of forming the isolation material layer on the substrate, the method further comprises:

[0076] a pixel definition material layer is formed on the substrate;

[0077] in the step of forming the isolation material layer on the substrate, comprising:

[0078] the isolation material layer is formed on the pixel definition material layer;

[0079] in the step of forming the first opening and the second opening through the isolation material layer, comprising:

[0080] the pixel definition material layer exposed from the first opening and the second opening is subjected to a patterning process to form pixel openings corresponding to the first opening and the second opening;

[0081] in the step of forming the third opening through the isolation material layer, comprising:

[0082] The pixel definition material layer exposed from the third opening is patterned to form a pixel opening corresponding to the third opening.

[0083] According to any one of the preceding embodiments of the second aspect of the present application, in the step of disposing the first type of device in the first opening, a recess structure is formed on the pixel definition material layer exposed from the second opening.

[0084] According to any one of the preceding embodiments of the second aspect of the present application, the isolation material layer comprises a first isolation material layer, a second isolation material layer located on a side of the first isolation material layer away from the substrate, and a conductive material layer located on a side of the first isolation material layer toward the substrate, and the step of disposing the first type of device in the first opening comprises:

[0085] The first opening and the second opening are cleaned using an etching material, and at least part of the first isolation material layer is etched so that the conductive material layer protrudes from the first isolation material layer toward the first opening and the second opening;

[0086] The first type of device is disposed in the first opening.

[0087] According to any one of the preceding embodiments of the second aspect of the present application, the isolation material layer comprises a first isolation material layer, a second isolation material layer located on a side of the first isolation material layer away from the substrate, and a conductive material layer located on a side of the first isolation material layer toward the substrate, and the step of disposing the second type of device in the second opening comprises:

[0088] The second opening is cleaned using an etching material, and at least part of the first isolation material layer is etched so that the conductive material layer protrudes from the first isolation material layer toward the second opening;

[0089] The second type of device is disposed in the second opening.

[0090] According to any one of the preceding embodiments of the second aspect of the present application, the step of cleaning the second opening using an etching material further comprises:

[0091] The etching material etches at least part of the first isolation material layer so that the protruding length of the second isolation material layer relative to the first isolation material layer toward the first opening is less than the protruding length of the second isolation material layer relative to the first isolation material layer toward the second opening.

[0092] According to any one of the preceding embodiments of the second aspect of the present application, the isolation material layer comprises a first isolation material layer, a second isolation material layer located on a side of the first isolation material layer away from the substrate, and a conductive material layer located on a side of the first isolation material layer toward the substrate, and the step of disposing the third type of device in the third opening comprises:

[0093] cleaning the third opening by using an etching material and etching at least part of the first isolation material layer so that the conductive material layer is arranged protruding from the first isolation material layer towards the third opening;

[0094] arranging a third type of device in the third opening.

[0095] According to any one of the preceding embodiments of the second aspect of the present application, the isolation material layer comprises a first isolation material layer and a conductive material layer arranged on a side of the first isolation material layer facing the substrate, and the step of arranging the first type of device in the first opening comprises forming a recess structure on the conductive material layer exposed in the second opening.

[0096] According to any one of the preceding embodiments of the second aspect of the present application, the step of opening the first opening and the second opening through the isolation material layer is performed before the step of opening the third opening through the isolation material layer.

[0097] Alternatively, the step of opening the first opening and the second opening through the isolation material layer is performed after the step of opening the third opening through the isolation material layer.

[0098] According to any one of the preceding embodiments of the second aspect of the present application, the step of opening the third opening through the isolation material layer comprises:

[0099] opening a fourth opening through the isolation material layer;

[0100] after the step of arranging the third type of device in the third opening, the method further comprises:

[0101] arranging a fourth type of device in the fourth opening.

[0102] According to any one of the preceding embodiments of the second aspect of the present application, the method further comprises:

[0103] opening a fourth opening through the isolation material layer;

[0104] arranging a fourth type of device in the fourth opening;

[0105] Alternatively, the step of opening the fourth opening through the isolation material layer is performed after the step of opening the third opening through the isolation material layer, or the step of opening the fourth opening through the isolation material layer is performed between the step of opening the first opening and the second opening through the isolation material layer and the step of opening the third opening through the isolation material layer, or the step of opening the fourth opening through the isolation material layer is performed before the step of opening the first opening and the second opening through the isolation material layer.

[0106] According to any one of the preceding embodiments of the second aspect of the present application, the step of opening the first opening and the second opening through the isolation material layer further comprises:

[0107] a fourth opening is formed through the isolation material layer;

[0108] The step of disposing the second type of device in the second opening further includes:

[0109] A fourth type of device is disposed in the fourth opening.

[0110] Embodiments of the second aspect of the application further provide a method for manufacturing a display panel, comprising:

[0111] forming a pixel definition material layer on the substrate;

[0112] forming an isolation material layer on the pixel definition material layer;

[0113] forming a first opening, a second opening and a third opening through the isolation material layer;

[0114] forming a pixel opening corresponding to the first opening and the second opening on the pixel definition material layer;

[0115] disposing a first type of device in the pixel opening corresponding to the first opening and a second type of device in the pixel opening corresponding to the second opening, respectively;

[0116] forming a pixel opening corresponding to the third opening on the pixel definition material layer;

[0117] disposing a third type of device in the pixel opening corresponding to the third opening.

[0118] According to the embodiments of the second aspect of the application, forming the pixel opening corresponding to the first opening and the second opening on the pixel definition material layer is performed before forming the pixel opening corresponding to the third opening on the pixel definition material layer, or is performed after forming the pixel opening corresponding to the third opening on the pixel definition material layer.

[0119] Embodiments of the third aspect of the application provide a display device, comprising the display panel of any of the above embodiments, or the display panel manufactured by the manufacturing method of any of the above embodiments.

[0120] In the display panel provided by the embodiments of the application, the display panel comprises a substrate, a pixel definition layer, an isolation structure and a light emitting device. The pixel definition layer comprises a pixel limiting portion and a pixel opening enclosed by the pixel limiting portion, the light emitting device is at least partially located in the pixel opening, and the isolation structure is arranged on one side of the substrate and encloses an isolation opening in communication with the pixel opening. The pixel definition layer and the isolation structure can be used to divide a sub-pixel of the display panel. The pixel limiting portion exposed from at least part of the isolation opening has a pit structure on the side away from the substrate, which can improve the display effect of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0121] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0122] Figure 1 is a partial schematic view of an isolation structure provided by an embodiment of the present application;

[0123] Figure 1 a is a partial schematic view of a pixel definition layer provided by an embodiment of the present application;

[0124] Figure 2 is a partial cross-sectional view of a display panel provided by an embodiment of the present application;

[0125] Figure 2a is a partial enlarged cross-sectional view of a display panel provided by an embodiment of the present application;

[0126] Figure 3 is a partial cross-sectional view of a display panel provided by another embodiment of the present application;

[0127] Figure 3a is a partial enlarged cross-sectional view of a display panel provided by another embodiment of the present application;

[0128] Figure 4 is a partial cross-sectional view of a display panel provided by still another embodiment of the present application;

[0129] Figure 5 is a partial cross-sectional view of a display panel provided by yet another embodiment of the present application;

[0130] Figure 6 is a partial cross-sectional view of a display panel provided by still another embodiment of the present application;

[0131] Figure 7 is a partial cross-sectional view of a display panel provided by still another embodiment of the present application;

[0132] Figure 8 is a partial cross-sectional view of a display panel provided by still another embodiment of the present application;

[0133] Figure 9 is a flowchart of a preparation method of a display panel provided by an embodiment of the present application;

[0134] Figures 10 to 36 is a preparation process diagram of a preparation method of a display panel provided by an embodiment of the present application

[0135] Figure 37 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application;

[0136] Figures 38 to 44 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application.

[0137] Legend:

[0138] 10, display panel; 10a, pit structure; 10b, first flat surface; 10c, second flat surface; 11, pixel definition material layer; 12, conductive material layer; 13, first isolation material layer; 14, second isolation material layer; 15, first device material layer; 15a, first light emitting material layer; 15b, first electrode material layer; 16, second device material layer; 16a, second light emitting material layer; 16b, second electrode material layer; 17, third device material layer; 17a, third light emitting material layer; 17b, third electrode material layer; 18, encapsulation material layer;

[0139] 100, substrate; 110, substrate; 120, first insulating layer; 130, second insulating layer; 140, third insulating layer; 150, driving circuit; 151, transistor; 151a, gate; 151b, source / drain; 152, storage capacitor; 152a, first plate; 152b, second plate;

[0140] 200, pixel definition layer; 210, pixel definition part; 220, pixel opening

[0141] 300, isolation structure; 301, isolation opening; 301a, first opening; 301b, second opening; 301c, third opening; 301d, fourth opening; 310, first isolation part; 310a, first surface; 310b, third surface; 320, second isolation part; 320a, second surface; 321, first protruding part; 330, conductive part; 331, second protruding part;

[0142] 400, light emitting device; 401, first type device; 402, second type device; 403, third type device; 404, fourth type device; 410, first electrode; 420, light emitting layer; 430, second electrode;

[0143] 500, encapsulation layer; 510, first encapsulation layer; 511, encapsulation unit; 520, second encapsulation layer; 530, third encapsulation layer;

[0144] D1, first distance; D2, second distance; D3, third distance; D4, fourth distance; D5, fifth distance; D6, sixth distance; D7, seventh distance; D8, eighth distance; D9, ninth distance; D10, tenth distance; D11, eleventh distance; D12, twelfth distance. DETAILED DESCRIPTION

[0145] The features and exemplary embodiments of various aspects of the present application will be described below in detail, in order to make the purposes, technical solutions and advantages of the present application more clear and apparent, the present application will be further described in detail below in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application, and are not configured to limit the present application. The present application can be implemented without some of these specific details for those skilled in the art. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0146] It should be noted that, in this paper, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitation, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0147] It should be understood that when describing the structure of a component, when one layer, one region is referred to as being "on" or "above" another layer, another region, it can mean being directly on or above another layer, another region, or containing other layers or regions between it and another layer, another region. And if the component is turned over, the layer, the region will be "under" or "below" the other layer, the other region.

[0148] Embodiments of the present application provide a display panel, a preparation method of the display panel and a display device, which will be described below in combination with the drawings.

[0149] Figure 1 is a partial schematic view of an isolation structure 300 provided by embodiments of the present application, Figure 1 a is a partial schematic view of a pixel definition layer 200 provided by embodiments of the present application, Figure 2is a partial cross-sectional view of a display panel 10 provided by an embodiment of the present application, Figure 2a is a partial enlarged cross-sectional view of a display panel 10 provided by an embodiment of the present application. In the partial cross-sectional view of the display panel 10 provided by the present application, the display panel 10 has a first opening 301a, a second opening 301b, and a third opening 301c. Figure 2a may be Figure 2 a second opening 301b in the display panel 10 of the present application. In the partial cross-sectional view of the display panel 10 provided by the present application, the display panel 10 has a first opening 301a, a second opening 301b, and a third opening 301c. Figure 1 is a cross-sectional view at A-A.

[0150] As shown in Figure 1 , Figure 1 a , Figure 2 and Figure 2a , the embodiment of the first aspect of the present application provides a display panel 10, comprising: a substrate 100; a pixel definition layer 200 disposed on one side of the substrate 100, the pixel definition layer 200 comprising a pixel limiting portion 210 and a pixel opening 220 formed by the pixel limiting portion 210; an isolation structure 300 disposed on one side of the substrate 100, the isolation structure 300 having an isolation opening 301 disposed thereon, the isolation opening 301 being in communication with the pixel opening 220; and a light emitting device 400 at least partially located in the pixel opening 220, wherein the pixel limiting portion 210 exposed from at least part of the isolation opening 301 has a pit structure 10a away from the one side of the substrate 100.

[0151] In the display panel provided by the embodiment of the present application, the display panel 10 comprises a substrate 100, a pixel definition layer 200, an isolation structure 300, and a light emitting device 400. The pixel definition layer 200 comprises a pixel limiting portion 210 and a pixel opening 220 formed by the pixel limiting portion 210, the light emitting device 400 is at least partially located in the pixel opening 220, the isolation structure 300 is disposed on one side of the substrate 100, the isolation structure 300 has an isolation opening 301 disposed thereon, the isolation opening 301 is in communication with the pixel opening 220, and the pixel definition layer 200 and the isolation structure 300 can be used to divide the sub-pixels of the display panel 10.

[0152] Optionally, the composition, preparation, etc. of the isolation structure 300 are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN116685174A, for reference.

[0153] The number of the isolation openings 301 is multiple, and one isolation opening 301 is in communication with at least one pixel opening 220.

[0154] Optionally, the isolation structure 300 is arranged on the side of the pixel defining portion 210 away from the substrate 100.

[0155] The side of the pixel defining portion 210 away from the substrate 100, which is exposed from at least part of the isolation opening 301, has a pit structure 10a.

[0156] In some embodiments of the present application, the substrate 100 can be arranged in various ways. For example, the substrate 100 can include a substrate 110 and a driving circuit 150 arranged on the substrate 110. Optionally, the substrate 100 includes a first insulating layer 120, a second insulating layer 130 and a third insulating layer 140 arranged in layers. For example, the driving circuit 150 can include a transistor 151, a storage capacitor 152 and a driving signal line for connecting various devices. The transistor 151 includes a semiconductor, a gate 151a and a source / drain 151b. The storage capacitor 152 includes a first plate 152a and a second plate 152b. As an example, the gate 151a and the first plate 152a can be arranged on the side of the first insulating layer 120 facing the substrate 110, the second plate 152b can be arranged between the first insulating layer 120 and the second insulating layer 130, and the source / drain 151b can be arranged between the second insulating layer 130 and the third insulating layer 140.

[0157] In some optional embodiments, the light emitting device 400 includes a first electrode 410, a light emitting layer 420 and a second electrode 430 arranged in layers in the direction away from the substrate 100.

[0158] Optionally, the light emitting layer 420 can include a hole injection layer (HIL), a hole transport layer (HTL), a light emitting structure, an electron injection layer (EIL) and an electron transport layer (ETL).

[0159] Optionally, the first electrode 410 and the second electrode 430 can serve as pixel electrodes of the display panel 10, one of the first electrode 410 and the second electrode 430 can serve as an anode, and the other can serve as a cathode to drive the light emitting unit to emit light. The embodiments of the present application take the first electrode 410 as the anode of the display panel 10 and the second electrode 430 as the cathode of the display panel 10 as an example.

[0160] In some embodiments of the present application, the isolation structure 300 and the pixel definition layer 200 can both be in a mesh shape. The hollowed-out areas in the mesh-shaped isolation structure 300 can form the isolation openings 301, and the hollowed-out areas in the mesh-shaped pixel definition layer 200 can form the pixel openings 220.

[0161] In some optional embodiments, the isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate. The second isolation portion 320 can be arranged to protrude from the first isolation portion 310 toward the isolation openings 301. For example, the second isolation portion 320 has a first protruding portion 321 arranged to protrude from the first isolation portion 310 toward the isolation openings 301.

[0162] By arranging the second isolation portion 320 to protrude from the first isolation portion 310 toward the isolation openings 301, the material (e.g., the material of the light-emitting layer 420 and the material of the second electrode 430) of the light-emitting device 400 can be directly vapor-deposited in a whole plane when the light-emitting device 400 of the display panel 10 is prepared. The second isolation portion 320 can block at least part of the material used to prepare the light-emitting device 400, so as to isolate the material of the light-emitting device 400 between adjacent sub-pixels. This facilitates the formation of a plurality of light-emitting devices 400 arranged at intervals and located in different isolation openings 301. Therefore, a mask plate with high precision is not required when the light-emitting device 400 of the display panel 10 is prepared. For example, a fine metal mask (FMM) is not required when the material of the light-emitting device 400 is vapor-deposited. Thus, the production and preparation cost of the display panel 10 can be reduced.

[0163] In some optional embodiments, the material of the isolation structure 300 can include a conductive material. The second electrode 430 can be connected to the isolation structure 300, so that the second electrodes 430 of adjacent sub-pixels can be electrically connected through the isolation structure 300, facilitating the control of the second electrode 430.

[0164] In some optional embodiments, the isolation structure 300 further includes a conductive portion 330 arranged on the side of the first isolation portion 310 toward the substrate 100. The conductive portion 330 is arranged to protrude from the first isolation portion 310 toward the isolation openings 301. For example, the conductive portion 330 has a second protruding portion 331 arranged to protrude from the first isolation portion 310 toward the isolation openings 301.

[0165] Optionally, the second electrode 430 is connected to the second protruding portion 331.

[0166] In these optional embodiments, the conductive portion 330 is arranged protruding from the first isolation portion 310 towards the isolation opening 301, so that the conductive portion 330 has a larger area for facilitating the connection with the second electrode 430, thereby facilitating the electrical connection between the second electrode 430 and the isolation structure 300.

[0167] Optionally, the second electrode 430 can also be connected with the first isolation portion 310, so that the second electrodes 430 of adjacent sub-pixels can also be electrically connected through the first isolation portion 310.

[0168] Optionally, the orthographic projection of the conductive portion 330 on the substrate 100 can also be located within the orthographic projection of the second isolation portion 320 on the substrate 100, so that the second isolation portion 320 has a sufficient size to further improve the shielding and blocking capability of the second isolation portion 320 to the material of the light emitting device 400.

[0169] In some optional embodiments, the isolation opening 301 includes a first opening 301a and a second opening 301b, and the light emitting device 400 includes a first type of device 401 arranged corresponding to the first opening 301a and a second type of device 402 arranged corresponding to the second opening 301b.

[0170] The first type of device 401 arranged corresponding to the first opening 301a can mean that the first type of device 401 can be at least partially located within the first opening 301a. Optionally, the second type of device 402 arranged corresponding to the second opening 301b can mean that the second type of device 402 can be at least partially located within the second opening 301b.

[0171] The first type of device 401 and the second type of device 402 have different light emitting colors, so as to facilitate the color display of the display panel 10.

[0172] Optionally, the isolation opening 301 can also include a third opening 301c, and the light emitting device 400 includes a third type of device 403 arranged corresponding to the third opening 301c.

[0173] The third type of device 403 arranged corresponding to the third opening 301c can mean that the third type of device 403 can be at least partially located within the third opening 301c.

[0174] The first type of device 401, the second type of device 402 and the third type of device 403 have different light emitting colors, so as to facilitate the color display of the display panel 10.

[0175] For example, the first type of device 401 is a blue light emitting light emitting device 400, the second type of device 402 is a green light emitting light emitting device 400, and the third type of device 403 is a red light emitting light emitting device 400.

[0176] In some embodiments of the present application, the shielding and partitioning effect of the isolation structure 300 on the light emitting device 400 can be utilized to achieve separate fabrication of different color light emitting devices 400.

[0177] In some alternative embodiments, the isolation structure 300 can be utilized to separately fabricate the first type of device 401 and the second type of device 402.

[0178] Specifically, the fabrication of the first opening 301a and the second opening 301b can be completed simultaneously. Then, the full-area evaporation of the material of the first type of device 401 can be performed, and the isolation structure 300 can partition part of the material of the first type of device 401. Then, the material of the first type of device 401 outside the first opening 301a is removed to form the first type of device 401 arranged corresponding to the first opening 301a. Then, the full-area evaporation of the material of the second type of device 402 is performed, and the isolation structure 300 can partition part of the material of the second type of device 402. Then, the material of the second type of device 402 outside the second opening 301b is removed to form the second type of device 402 arranged corresponding to the second opening 301b.

[0179] Optionally, in the step of removing the material of the first type of device 401 outside the first opening 301a, the etching material can etch the pixel defining portion 210 exposed from the remaining openings 301 outside the first opening 301a to a certain extent to form a pit structure 10a.

[0180] In some alternative embodiments, the side of the pixel defining portion 210 exposed from the second opening 301b away from the substrate 100 can have a pit structure 10a.

[0181] In this alternative embodiment, in the step of removing the material of the first type of device 401 outside the first opening 301a, the etching material can etch the pixel defining portion 210 exposed from the second opening 301b to a certain extent to form a pit structure 10a.

[0182] Optionally, the side of the pixel defining portion 210 exposed from the first opening 301a away from the substrate 100 has a first flat surface 10b. The side of the pixel defining portion 210 exposed from the first opening 301a away from the substrate 100 does not have a pit structure.

[0183] Optionally, the side of the pixel defining portion 210 exposed from the third opening 301c away from the substrate 100 has a pit structure 10a, or the side of the pixel defining portion 210 exposed from the third opening away from the substrate 100 has a first flat surface 10b.

[0184] When the third opening 301c is prepared simultaneously with the first opening 301a and the second opening 301b, in the step of removing the material of the first type of device 401 outside the first opening 301a and the step of removing the material of the second type of device 402 outside the second opening 301b, the etching material can etch the pixel defining portion 210 exposed from the third opening 301c to a certain extent to form the pit structure 10a, so that the side of the pixel defining portion 210 exposed from the third opening 301c away from the substrate 100 can have the pit structure 10a.

[0185] When the preparation of the third opening 301c is performed independently from the other openings 301, for example, when the preparation of the third opening 301c is performed after the preparation of the first type of device 401 and the second type of device 402, the pixel defining portion 210 exposed from the third opening 301c is less affected by the etching material, so that the side of the pixel defining portion 210 exposed from the third opening 301c away from the substrate 100 has the first flat surface 10b.

[0186] In these alternative embodiments, the first flat surface 10b refers to the flat surface of the side of the pixel defining portion 210 away from the substrate 100, which can be relatively flat and can not have the pit structure 10a.

[0187] In some embodiments of the present application, the pit structure 10a on the side of the pixel defining portion 210 away from the substrate 100, and the film layer in the pit structure 10a has a concave shape, which can be beneficial to improve the adhesion of the film layer and the film layer above it, and improve the display effect of the display panel. For example, part of the light emitting layer 420 is in the pit structure 10a, which can improve the adhesion between the light emitting layer 420 in the pit structure 10a and the second electrode 430 above it. Further, the light emitting layer 420 in the pit structure 10a has a concave shape, and the second electrode 430 above the light emitting layer 420 also has a concave shape, and the concave-shaped second electrode 430 has better adhesion with the encapsulation layer.

[0188] Figure 3 is a partial cross-sectional view of a display panel 10 provided by another embodiment of the present application, Figure 3a is a partial enlarged cross-sectional view of a display panel 10 provided by another embodiment of the present application. Wherein, Figure 3a may be Figure 3 is a partial enlarged view of the second opening 301b in the middle.

[0189] As Figure 3As shown, in some optional embodiments, at least a portion of the second protrusion 331 of the conductive portion 330 has a recess structure 10a on the side facing away from the substrate 100. The recess structure 10a provided on the side of the second protrusion 331 of the conductive portion 330 facing away from the substrate 100 can facilitate increasing the connection area between the second electrode 430 and the conductive portion 330, thereby improving the electrical connection effect between the second electrode 430 and the conductive portion 330.

[0190] In some optional embodiments, the depth of the recess structure 10a ranges from 0.3 micrometers to 0.7 micrometers, and / or the width of the recess structure 10a is less than 1.5 micrometers. For example, the depth of the recess structure 10a in both the pixel defining portion 210 and the conductive portion 330 ranges from 0.3 micrometers to 0.7 micrometers, and / or the width of the recess structure 10a in both the pixel defining portion 210 and the conductive portion 330 is less than 1.5 micrometers.

[0191] Optionally, the depth of the recessed structure 10a may refer to the dimension of the recessed structure 10a in the thickness direction of the display panel 10, for example, Figure 2a and Figure 3a G1 in the diagram can indicate the depth of the recess structure 10a. Optionally, the width of the recess structure 10a can refer to the dimension of the recess structure 10a in the direction from the isolation structure 300 to the pixel opening 220, for example, Figure 2a and Figure 3a G2 in the diagram can indicate the width of the recess structure 10a.

[0192] Optionally, the depth of the recess structure 10a can be 0.3 micrometers, 0.4 micrometers, 0.5 micrometers, 0.6 micrometers, or 0.7 micrometers. Optionally, the width of the recess structure 10a can be 1.4 micrometers, 1.3 micrometers, 1.2 micrometers, 1.1 micrometers, 1.0 micrometers, 0.9 micrometers, or 0.8 micrometers.

[0193] In these alternative embodiments, by reasonably setting the size of the recess structure 10a, the moisture intrusion path can be better adjusted, and the connection area between the second electrode 430 and the conductive part 330 can be better adjusted, thereby improving the display effect of the display panel 10.

[0194] In some embodiments of this application, when the first type of device 401 and the second type of device 402 are fabricated using the isolation structure 300, the recess structure 10a may be located only on the conductive portion 330 within a portion of the isolation opening 301 due to the influence of the fabrication process of the display panel 10.

[0195] Optionally, in the step of removing the material of the first type of device 401 outside the first opening 301a, the etching material can etch the second protruding portion 331 protruding from the first isolation portion 310 towards the second opening 301b to a certain extent to form the pit structure 10a.

[0196] In some optional embodiments, the second protruding portion 331 protruding from the first isolation portion 310 towards the second opening 301b has the pit structure 10a on the side facing away from the substrate 100.

[0197] In this optional embodiment, in the step of removing the material of the first type of device 401 outside the first opening 301a, the etching material can etch the second protruding portion 331 protruding from the first isolation portion 310 towards the second opening 301b to a certain extent to form the pit structure 10a.

[0198] Optionally, the second protruding portion 331 protruding from the first isolation portion 310 towards the first opening 301a has the second flat surface 10c on the side facing away from the substrate 100.

[0199] Optionally, the second protruding portion 331 protruding from the first isolation portion 310 towards the third opening 301c has the pit structure 10a on the side facing away from the substrate 100, or the second protruding portion 331 protruding from the first isolation portion 310 towards the third opening 301c has the second flat surface 10c on the side facing away from the substrate 100. The second flat surface 10c refers to the flat surface on the side of the second protruding portion 331 facing away from the substrate 100.

[0200] When the third opening 301c is prepared simultaneously with the first opening 301a and the second opening 301b, in the step of removing the material of the first type of device 401 outside the first opening 301a and the step of removing the material of the second type of device 402 outside the second opening 301b, the etching material can etch the second protruding portion 331 protruding from the first isolation portion 310 towards the third opening 301c to a certain extent to form the pit structure 10a, so that the side of the second protruding portion 331 exposed from the third opening 301c facing away from the substrate 100 has the pit structure 10a.

[0201] When the preparation of the third opening 301c is performed independently from the other openings 301, for example, when the preparation of the third opening 301c is performed after the preparation of the first type of device 401 and the second type of device 402, the second protruding portion 331 protruding from the first isolation portion 310 towards the third opening 301c exposed from the third opening 301c is not easily affected by the etching material, so that the side of the second protruding portion 331 exposed from the third opening 301c facing away from the substrate 100 has the second flat surface 10c.

[0202] In some alternative embodiments, the second flat surface 10c can be relatively flat, and the second flat surface 10c can not have the recess structure 10a.

[0203] In some alternative embodiments, the film layer of the light emitting device 400 can be partially located in the recess structure 10a.

[0204] For example, the film layer of the light emitting device 400 can be partially located in the recess structure 10a of the pixel defining portion 210, and / or the film layer of the light emitting device 400 can be partially located in the recess structure 10a of the conductive portion 330.

[0205] Optionally, the light emitting layer 420 is partially located in the recess structure 10a. For example, the light emitting layer 420 can extend from the pixel opening 220 to the side of the pixel defining portion 210 away from the substrate 100, and the light emitting layer 420 can be partially located in the recess structure 10a of the pixel defining portion 210 (not shown in the figure).

[0206] Optionally, the second electrode 430 is partially located in the recess structure 10a. For example, the second electrode 430 can extend from the pixel opening 220 to the side of the pixel defining portion 210 away from the substrate 100, and the second electrode 430 can be partially located in the recess structure 10a of the pixel defining portion 210. For example, the second electrode 430 can extend to the side of the conductive portion 330 away from the substrate 100, and the second electrode 430 can be partially located in the recess structure 10a of the conductive portion 330.

[0207] Optionally, the number of the recess structures 10a can be one or more, wherein the plurality of recess structures 10a can be spaced apart, and / or the plurality of recess structures 10a can be connected. The arrangement of the recess structures 10a can be disordered, and the recess structures 10a can have various shapes, which are not limited in the present application.

[0208] In some alternative embodiments, the orthographic projection of the recess structure 10a on the substrate 100 is at least partially located in the orthographic projection of the first convex portion 321 on the substrate 100. For example, the orthographic projection of the recess structure 10a of the pixel defining portion 210 on the substrate 100 is at least partially located in the orthographic projection of the first convex portion 321 on the substrate 100, and / or the orthographic projection of the recess structure 10a of the conductive portion 330 on the substrate 100 is at least partially located in the orthographic projection of the first convex portion 321 on the substrate 100. For example, the orthographic projection of the recess structure 10a of the pixel defining portion 210 on the substrate 100 is partially located in the orthographic projection of the first convex portion 321 on the substrate 100, and partially located outside the orthographic projection of the first convex portion 321 on the substrate 100. Alternatively, the orthographic projection of the recess structure 10a of the pixel defining portion 210 on the substrate 100 is entirely located in the orthographic projection of the first convex portion 321 on the substrate 100.

[0209] In the optional embodiment, the material of the light emitting device 400 is deposited, and the amount of the material of the light emitting device 400 falling below the first protruding part 321 is small due to the shielding effect of the first protruding part 321, so that the thickness of the film layer below the first protruding part 321 is thin. Therefore, in the step of removing the material of the first type of device 401 outside the first opening 301a and the step of removing the material of the second type of device 402 outside the second opening 301b, the etching material is easy to etch and remove the material of the light emitting device 400 below the first protruding part 321, and further etch the material of the pixel defining part 210 and / or the conductive part 330 below the first protruding part 321, so that the pit structure 10a is easy to form below the first protruding part 321.

[0210] In the embodiments of the present application, there are various ways to achieve the "second isolation part 320 is arranged protruding from the first isolation part 310 towards the isolation opening 301" and the "conductive part 330 is arranged protruding from the first isolation part 310 towards the isolation opening 301".

[0211] For example, in the preparation process of the display panel 10, the "second isolation part 320 is arranged protruding from the first isolation part 310 towards the isolation opening 301" and the "conductive part 330 is arranged protruding from the first isolation part 310 towards the isolation opening 301" can be achieved by controlling the etching degree of the material of the first isolation part 310. For another example, in the preparation process of the display panel 10, the "second isolation part 320 is arranged protruding from the first isolation part 310 towards the isolation opening 301" and the "conductive part 330 is arranged protruding from the first isolation part 310 towards the isolation opening 301" can be achieved by controlling the etching degree of the material of the second isolation part 320 and the conductive part 330. For another example, in the preparation process of the display panel 10, the "second isolation part 320 is arranged protruding from the first isolation part 310 towards the isolation opening 301" and the "conductive part 330 is arranged protruding from the first isolation part 310 towards the isolation opening 301" can be achieved by controlling the etching degree of the material of the first isolation part 310 and the second isolation part 320, and controlling the etching degree of the material of the first isolation part 310 and the conductive part 330.

[0212] For the convenience of description, the following embodiments are described by taking the example that in the preparation process of the display panel 10, the "second isolation part 320 is arranged protruding from the first isolation part 310 towards the isolation opening 301" and the "conductive part 330 is arranged protruding from the first isolation part 310 towards the isolation opening 301" can be achieved by controlling the etching degree of the material of the first isolation part 310.

[0213] Optionally, the conductive portion 330 may be made of a conductive material, allowing electrical connection between the second electrodes 430 of adjacent light-emitting devices 400. Optionally, the first isolation portion 310 may also be made of a conductive material, and at least a portion of the second electrodes 430 may be connected to the first isolation portion 310, allowing electrical connection between the second electrodes 430 of adjacent light-emitting devices 400 through the first isolation portion 310, thereby better reducing the resistance of the display panel 10.

[0214] For example, the material of the conductive portion 330 may include molybdenum, the material of the first isolation portion 310 may include aluminum, and the material of the second isolation portion 320 may include titanium, so that there can be a large etching selectivity between the first isolation portion 310 and the second isolation portion 320, and a large etching selectivity between the first isolation portion 310 and the conductive portion 330, so that during the etching process, the etching rate of the etching material on the first isolation portion 310 can be greater than the etching rate of the etching material on the second isolation portion 320, and the etching rate of the etching material on the first isolation portion 310 can be greater than the etching rate of the etching material on the conductive portion 330, so as to realize that "the second isolation portion 320 protrudes from the first isolation portion 310 toward the isolation opening 301" and "the conductive portion 330 protrudes from the first isolation portion 310 toward the isolation opening 301".

[0215] Figure 4 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0216] like Figure 4 As shown, in some optional embodiments, the protrusion length of the second isolation portion 320 relative to the first isolation portion 310 toward the first opening 301a is less than the protrusion length of the second isolation portion 320 relative to the first isolation portion 310 toward the second opening 301b.

[0217] Optionally, the first isolation portion 310 has a first surface 310a on the side facing away from the substrate 100, and the second isolation portion 320 has a second surface 320a on the side facing the substrate 100. There is a first distance D1 between the orthographic projection of the edge of the first opening 301a on the substrate 100 corresponding to the first surface 310a and the orthographic projection of the edge of the first opening 301a on the substrate 100 corresponding to the second surface 320a and the orthographic projection of the edge of the second opening 301b on the substrate 100 corresponding to the second surface 320a and the second opening 301b on the substrate 100 corresponding to the second surface 320a and the second opening 301b. The first distance D1 is smaller than the second distance D2, so that the protrusion length of the second isolation portion 320 relative to the first isolation portion 310 towards the first opening 301a is smaller than the protrusion length of the second isolation portion 320 relative to the first isolation portion 310 towards the second opening 301b.

[0218] Optionally, the first isolation portion 310 has a third surface 310b close to the side of the substrate 100, the third surface 310b has a third distance D3 between the orthographic projection of the edge of the first opening 301a on the substrate 100 and the orthographic projection of the second surface 320a on the substrate 100, and the third surface 310b has a fourth distance D4 between the orthographic projection of the edge of the second opening 301b on the substrate 100 and the orthographic projection of the second surface 320a on the substrate 100, the third distance D3 is less than the fourth distance D4, so that the convex length of the second isolation portion 320 relative to the whole of the first isolation portion 310 towards the first opening 301a is less than the convex length of the second isolation portion 320 relative to the whole of the first isolation portion 310 towards the second opening 301b.

[0219] In these optional embodiments, by setting the convex length of the second isolation portion 320 relative to the first isolation portion 310 towards the first opening 301a to be less than the convex length of the second isolation portion 320 relative to the first isolation portion 310 towards the second opening 301b, the isolation structure 300 around the second opening 301b can have a better shielding and blocking effect on the material of the light emitting device 400, so as to facilitate the preparation of the second type of device 402.

[0220] In some optional embodiments, the convex length of the conductive portion 330 relative to the first isolation portion 310 towards the first opening 301a is less than the convex length of the conductive portion 330 relative to the first isolation portion 310 towards the second opening 301b.

[0221] Optionally, S1 in the figure can indicate the convex length of the conductive portion 330 relative to the first isolation portion 310 towards the first opening 301a, and S2 in the figure can indicate the convex length of the conductive portion 330 relative to the first isolation portion 310 towards the second opening 301b.

[0222] Optionally, the convex length of the conductive portion 330 relative to the first isolation portion 310 towards the second opening 301b is greater than the convex length of the conductive portion 330 relative to the first isolation portion 310 towards the first opening 301a, and is not greater than 3 times the convex length of the conductive portion 330 relative to the first isolation portion 310 towards the first opening 301a.

[0223] Optionally, the convex length of the conductive portion relative to the first isolation portion 310 towards the first opening 301a is in the range of 0.05 microns to 0.4 microns, for example, the convex length of the conductive portion relative to the first isolation portion 310 towards the first opening 301a can be 0.05 microns, 0.1 microns, 0.15 microns, 0.2 microns, 0.25 microns, 0.3 microns, 0.35 microns or 0.4 microns.

[0224] In the optional embodiments, by setting the protruding length of the conductive part 330 relative to the first isolation part 310 towards the first opening 301a to be less than the protruding length of the conductive part 330 relative to the first isolation part 310 towards the second opening 301b, the second type of device 402 can have a larger overlap area with the conductive part 330 around the second opening 301b, and the material of the conductive part 330 in the second opening 301b is less likely to be damaged by etching during the preparation of the display panel 10, which can better improve the electrical connection stability of the second type of device 402 and the conductive part 330 around the second opening 301b, thereby better improving the working reliability of the display panel 10.

[0225] In some embodiments of the present application, the etching degree of the etching material to the first isolation part 310 around the first opening 301a can be less than the etching degree of the etching material to the first isolation part 310 around the second opening 301b, so that the protruding length of the second isolation part 320 relative to the first isolation part 310 towards the first opening 301a is less than the protruding length of the second isolation part 320 relative to the first isolation part 310 towards the second opening 301b, and the protruding length of the conductive part 330 relative to the first isolation part 310 towards the first opening 301a is less than the protruding length of the conductive part 330 relative to the first isolation part 310 towards the second opening 301b.

[0226] Therefore, the second electrode 430 can have a larger connection area with the conductive part 330 around the second opening 301b. Due to the shielding effect of the longer second isolation part 320 around the second opening 301b, the second electrode 430 can have a smaller connection area with the first isolation part 310 around the second opening 301b. Since the material of the conductive part 330 includes molybdenum and the material of the first isolation part 310 includes aluminum, the conductive part 330 is less likely to be oxidized than the first isolation part 310, so that the second electrode 430 can be more connected to the conductive part 330 which is less likely to be oxidized, thereby better improving the electrical connection reliability of the second electrode 430 and the overall isolation structure 300.

[0227] In some embodiments of the present application, when the first type of device 401 and the second type of device 402 are respectively prepared by using the isolation structure 300, after the material of the first type of device 401 outside the first opening 301a is removed, the second opening 301b can be cleaned by using an etching liquid to remove impurities in the second opening 301b. For example, the second opening 301b can be cleaned by using an etching material to remove impurities in the second opening 301b. During the cleaning of the second opening 301b, the etching material is easy to etch the first isolation portion 310, so that the etching material etches the first isolation portion 310 on the side of the second opening 301b, and the etching material does not etch the conductive portion 330 on the side of the second opening 301b, thereby increasing the protruding length of the conductive portion 330 on the side of the second opening 301b relative to the first isolation portion 310. In the present embodiment, due to the etching of the first isolation portion 310 on the side of the second opening 301b by the etching material, the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the first opening 301a is less than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the second opening 301b, and the protruding length of the conductive portion 330 relative to the first isolation portion 310 towards the first opening 301a is less than the protruding length of the conductive portion 330 relative to the first isolation portion 310 towards the second opening 301b.

[0228] In some optional embodiments, the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c is not less than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the first opening 301a, and / or the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c is not greater than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the second opening 301b.

[0229] For example, the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c can be greater than or equal to the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the first opening 301a. For example, the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c is less than or equal to the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the second opening 301b.

[0230] Optionally, the fifth distance D5 is between the normal projection of the edge of the third opening 301c on the substrate 100 corresponding to the first surface 310a and the normal projection of the edge of the third opening 301c on the substrate 100 corresponding to the second surface 320a.

[0231] The fifth distance D5 can be not less than the first distance D1, so as to make the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c not less than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the first opening 301a. The fifth distance D5 can be not greater than the second distance D2, so as to make the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c not greater than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the second opening 301b.

[0232] Optionally, the third surface 310b corresponds to the edge of the third opening 301c on the normal projection of the substrate 100 between the second surface 320a corresponds to the edge of the third opening 301c on the normal projection of the substrate 100 has a sixth distance D6.

[0233] The sixth distance D6 can be not less than the third distance D3, so as to make the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c not less than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the first opening 301a. The sixth distance D6 can be not greater than the fourth distance D4, so as to make the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c not greater than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the second opening 301b.

[0234] In these optional embodiments, by setting the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c not less than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the first opening 301a, and setting the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c not greater than the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the second opening 301b, the shielding and blocking ability of the isolation structure 300 around the third opening 301c to the material of the light emitting device 400 can be between the shielding and blocking ability of the isolation structure 300 around the first opening 301a and the shielding and blocking ability of the isolation structure 300 around the second opening 301b, so as to facilitate the preparation of the third type of device 403.

[0235] In some optional embodiments, the protruding length of the conductive part 330 relative to the first isolation part 310 towards the third opening 301c is not less than the protruding length of the conductive part 330 relative to the first isolation part 310 towards the first opening 301a, and / or the protruding length of the conductive part 330 relative to the first isolation part 310 towards the third opening 301c is not greater than the protruding length of the conductive part 330 relative to the first isolation part 310 towards the second opening 301b.

[0236] For example, the protruding length of the conductive part 330 relative to the first isolation part 310 towards the third opening 301c is greater than or equal to the protruding length of the conductive part 330 relative to the first isolation part 310 towards the first opening 301a. For example, the protruding length of the conductive part 330 relative to the first isolation part 310 towards the third opening 301c is less than or equal to the protruding length of the conductive part 330 relative to the first isolation part 310 towards the second opening 301b.

[0237] Optionally, S3 in the figure can illustrate the protruding length of the conductive part 330 relative to the first isolation part 310 towards the third opening 301c.

[0238] Optionally, the protruding length of the conductive part 330 relative to the first isolation part 310 towards the third opening 301c is in the range of 0.05 microns to 0.4 microns. For example, the protruding length of the conductive part relative to the first isolation part 310 towards the third opening 301c can be 0.05 microns, 0.1 microns, 0.15 microns, 0.2 microns, 0.25 microns, 0.3 microns, 0.35 microns or 0.4 microns.

[0239] In these optional embodiments, by setting the protruding length of the conductive part 330 relative to the first isolation part 310 towards the third opening 301c not less than the protruding length of the conductive part 330 relative to the first isolation part 310 towards the first opening 301a, and setting the protruding length of the conductive part 330 relative to the first isolation part 310 towards the third opening 301c not greater than the protruding length of the conductive part 330 relative to the first isolation part 310 towards the second opening 301b, the third type device 403 can have a moderate overlap area with the conductive part 330 around the third opening 301c, and the material of the conductive part 330 in the third opening 301c is not easy to be damaged by etching in the preparation process of the display panel 10, which can better improve the electrical connection stability between the third type device 403 and the conductive part 330 around the third opening 301c, thereby better improving the working reliability of the display panel 10.

[0240] Figure 5 is a partial cross-sectional view of a display panel 10 provided by another embodiment of the present application.

[0241] As Figure 5As shown, in some optional embodiments, the isolation opening 301 further comprises a fourth opening 301d, and the light emitting device comprises a fourth type of device 404 arranged corresponding to the fourth opening 301d.

[0242] Optionally, the fourth type of device 404 arranged corresponding to the fourth opening 301d can mean that the fourth type of device 404 can be at least partially located within the fourth opening 301d.

[0243] Optionally, the light emitting colors of the first type of device 401, the second type of device 402, the third type of device 403 and the fourth type of device 404 are all different, so as to realize color display of the display panel 10.

[0244] Optionally, the fourth type of device 404 is a white light emitting light emitting device 400.

[0245] In some optional embodiments, the side of the pixel defining part 210 exposed from the fourth opening 301d away from the substrate 100 has a pit structure 10a, or the side of the pixel defining part 210 exposed from the fourth opening 301d away from the substrate 100 has a first flat surface 10b.

[0246] When the fourth opening 301d is prepared at the same time as the first opening 301a and the second opening 301b, in the steps of removing the material of the first type of device 401 outside the first opening 301a and removing the material of the second type of device 402 outside the second opening 301b, the etching material can etch the pixel defining part 210 exposed from the fourth opening 301d to a certain extent to form the pit structure 10a, so that the side of the pixel defining part 210 exposed from the fourth opening 301d away from the substrate 100 can have the pit structure 10a.

[0247] Or when the fourth opening 301d is prepared at the same time as the third opening 301c, the preparation of the fourth type of device 404 can be performed after the preparation of the third type of device 403 is performed by the same or similar method as the preparation of the first type of device 401 and the second type of device 402. In the step of removing the material of the third type of device 403 outside the third opening 301c, the etching material can etch the pixel defining part 210 exposed from the fourth opening 301d to a certain extent to form the pit structure 10a, so that the side of the pixel defining part 210 exposed from the fourth opening 301d away from the substrate 100 can have the pit structure 10a.

[0248] When the fourth opening 301d is prepared independently from the other isolation openings 301, for example, when the fourth opening 301d is prepared after the preparation of the first device 401, the second device 402, and the third device 403, the pixel defining portion 210 exposed from the fourth opening 301d is less likely to be affected by the etching material, so that the side of the pixel defining portion 210 exposed from the fourth opening 301d away from the substrate 100 has the first flat surface 10b.

[0249] In some optional embodiments, the second protruding portion 331 protruding from the first isolation portion 310 towards the fourth opening 301d has a pit structure 10a on the side thereof away from the substrate 100, or the second protruding portion 331 protruding from the first isolation portion 310 towards the fourth opening 301d has a second flat surface 10c on the side thereof away from the substrate 100.

[0250] When the fourth opening 301d is prepared simultaneously with the first opening 301a and the second opening 301b, in the steps of removing the material of the first device 401 outside the first opening 301a and removing the material of the second device 402 outside the second opening 301b, the etching material can etch the second protruding portion 331 exposed from the fourth opening 301d to a certain extent to form the pit structure 10a, so that the side of the second protruding portion 331 exposed from the fourth opening 301d away from the substrate 100 can have the pit structure 10a.

[0251] When the fourth opening 301d is prepared simultaneously with the third opening 301c, the fourth device 404 can be prepared after the preparation of the third device 403 by the same or similar method as the preparation of the first device 401 and the second device 402. In the step of removing the material of the third device 403 outside the third opening 301c, the etching material can etch the second protruding portion 331 exposed from the fourth opening 301d to a certain extent to form the pit structure 10a, so that the side of the second protruding portion 331 exposed from the fourth opening 301d away from the substrate 100 can have the pit structure 10a.

[0252] When the fourth opening 301d is prepared independently from the other isolation openings 301, for example, when the fourth opening 301d is prepared after the preparation of the first device 401, the second device 402, and the third device 403, the pixel defining portion 210 exposed from the fourth opening 301d is less likely to be affected by the etching material, so that the side of the pixel defining portion 210 exposed from the fourth opening 301d away from the substrate 100 has the first flat surface 10b.

[0253] In some optional embodiments, the protruding length of the second isolation portion 320 towards the fourth opening 301d relative to the first isolation portion 310 is greater than or equal to the protruding length of the second isolation portion 320 towards the third opening 301c relative to the first isolation portion 310.

[0254] Optionally, the fourth edge 310d of the first surface 310a corresponding to the fourth opening 301d has a seventh distance D7 with the fourth edge 320d of the second surface 320a corresponding to the fourth opening 301d on the substrate 100, and the seventh distance D7 is greater than or equal to the fifth distance D5, so as to realize that the protruding length of the second isolation portion 320 towards the fourth opening 301d relative to the first isolation portion 310 is greater than or equal to the protruding length of the second isolation portion 320 towards the third opening 301c relative to the first isolation portion 310.

[0255] Optionally, the seventh distance D7 is not less than the first distance D1, and / or the seventh distance D7 is not greater than the second distance D2, so that the protruding length of the second isolation portion 320 towards the fourth opening 301d relative to the first isolation portion 310 can be between the protruding length of the second isolation portion 320 towards the first opening 301a relative to the first isolation portion 310 and the protruding length of the second isolation portion 320 towards the second opening 301b relative to the first isolation portion 310.

[0256] Optionally, the fourth edge 310d of the first surface 310a corresponding to the fourth opening 301d has an eighth distance D8 with the fourth edge 320d of the second surface 320a corresponding to the fourth opening 301d on the substrate 100, and the eighth distance D8 is greater than or equal to the sixth distance, so as to realize that the overall protruding length of the second isolation portion 320 towards the fourth opening 301d relative to the first isolation portion 310 is greater than or equal to the overall protruding length of the second isolation portion 320 towards the third opening 301c relative to the first isolation portion 310.

[0257] Optionally, the eighth distance D8 is not less than the third distance D3, and / or the eighth distance D8 is not greater than the fourth distance D4, so that the overall protruding length of the second isolation portion 320 towards the fourth opening 301d relative to the first isolation portion 310 can be between the overall protruding length of the second isolation portion 320 towards the first opening 301a relative to the first isolation portion 310 and the overall protruding length of the second isolation portion 320 towards the second opening 301b relative to the first isolation portion 310.

[0258] In these optional embodiments, by setting the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the fourth opening 301d to be greater than or equal to the protruding length of the second isolation portion 320 relative to the first isolation portion 310 towards the third opening 301c, the isolation structure 300 around the fourth opening 301d can have a better shielding and blocking effect on the material of the light emitting device 400, so as to facilitate the preparation of the fourth type device 404.

[0259] In some optional embodiments, the protruding length of the conductive portion 330 relative to the first isolation portion 310 towards the fourth opening 301d is greater than or equal to the protruding length of the conductive portion 330 relative to the first isolation portion 310 towards the third opening 301c.

[0260] Optionally, S4 in the figure can illustrate the protruding length of the conductive portion 330 relative to the first isolation portion 310 towards the fourth opening 301d.

[0261] In these optional embodiments, by setting the protruding length of the conductive portion 330 relative to the first isolation portion 310 towards the fourth opening 301d to be greater than or equal to the protruding length of the conductive portion 330 relative to the first isolation portion 310 towards the third opening 301c, the fourth type device 404 can have a greater overlap area with the conductive portion 330 around the fourth opening 301d, and the material of the conductive portion 330 in the fourth opening 301d is not easy to be damaged by etching during the preparation process of the display panel 10, which can better improve the electrical connection stability of the fourth type device 404 and the conductive portion 330 around the fourth opening 301d, thereby better improving the working reliability of the display panel 10.

[0262] As shown in FIG. 4A, in some optional embodiments, the fourth opening 301d can be located between the first opening 301a and the second opening 301b. Figure 5 As shown in FIG. 4A, in some optional embodiments, the fourth opening 301d can be located between the first opening 301a and the second opening 301b.

[0263] Optionally, the ninth distance D9 and the tenth distance D10 can be in the range of 0.1 microns to 0.6 microns. For example, the ninth distance D9 and the tenth distance D10 can be 0.1 microns, 0.2 microns, 0.3 microns, 0.4 microns, 0.5 microns, or 0.6 microns.

[0264] Optionally, the second isolation portion 320 has a eleventh distance D11 between the normal projection of the edge of the second isolation portion 320 on the substrate 100 toward the third opening 301c and the normal projection of the edge of the conductive portion 330 on the substrate 100 toward the third opening 301c, and the ninth distance D9, the tenth distance D10 and the eleventh distance D11 are all equal.

[0265] Optionally, the eleventh distance D11 is in a range from 0.1 micrometer to 0.6 micrometer. For example, the eleventh distance D11 can be 0.1 micrometer, 0.2 micrometer, 0.3 micrometer, 0.4 micrometer, 0.5 micrometer or 0.6 micrometer.

[0266] Optionally, the second isolation portion 320 has a twelfth distance D12 between the normal projection of the edge of the second isolation portion 320 on the substrate 100 toward the fourth opening 301d and the normal projection of the edge of the conductive portion 330 on the substrate 100 toward the fourth opening 301d, and the ninth distance D9, the tenth distance D10, the eleventh distance D11 and the twelfth distance D12 are all equal.

[0267] Optionally, the twelfth distance D12 is in a range from 0.1 micrometer to 0.6 micrometer. For example, the twelfth distance D12 can be 0.1 micrometer, 0.2 micrometer, 0.3 micrometer, 0.4 micrometer, 0.5 micrometer or 0.6 micrometer.

[0268] In these optional embodiments, when the “the second isolation portion 320 is disposed protruding from the first isolation portion 310 toward the isolation opening 301” and the “the conductive portion 330 is disposed protruding from the first isolation portion 310 toward the isolation opening 301” are realized by controlling the etching degree of the material of the first isolation portion 310, since the etching degree of the first isolation portion 310 is adjusted, the relative position relationship between the first isolation portion 310 and the second isolation portion 320 in each isolation opening 301 will not change greatly, so that the twelfth distance D12, the ninth distance D9, the tenth distance D10, the eleventh distance D11 and the twelfth distance D12 can all be equal.

[0269] Figure 6 is a partial cross-sectional view of a display panel 10 provided by another embodiment of the present application.

[0270] As shown in FIG. 1, in some optional embodiments, the display panel 10 further includes a packaging layer 500 disposed on the side of the light emitting device 400 and the isolation structure 300 away from the substrate 100, and the packaging layer 500 can be used to package the light emitting device 400. Figure 6

[0271] ​Optionally, the encapsulation layer 500 can include a first encapsulation layer 510 disposed on the side of the light emitting device 400 away from the substrate 100, and the first encapsulation layer 510 can include an encapsulation unit 511 corresponding to each light emitting device 400, and the encapsulation unit 511 can be used to encapsulate each light emitting device 400 independently to improve the encapsulation effect of the display panel 10.

[0272] Optionally, the material of the first encapsulation layer 510 can include an inorganic material, so that the first encapsulation layer 510 can better limit the influence of water vapor on the light emitting device 400.

[0273] Optionally, the first encapsulation layer 510 can be prepared by a chemical vapor deposition (CVD) process.

[0274] Optionally, the encapsulation layer 500 can further include a second encapsulation layer 520 disposed on the side of the first encapsulation layer 510 away from the substrate 100, and the second encapsulation layer 520 can also encapsulate the display panel 10 to further improve the encapsulation effect of the display panel 10.

[0275] Optionally, the material of the second encapsulation layer 520 includes an organic material, so that the material of the second encapsulation layer 520 has better flowability when the second encapsulation layer 520 is prepared, so that the surface on the side of the second encapsulation layer 520 away from the substrate 100 has better flatness to facilitate the subsequent arrangement of devices.

[0276] Optionally, the second encapsulation layer 520 can be prepared by an inkjet printing (IJP) process.

[0277] Optionally, the encapsulation layer 500 can further include a third encapsulation layer 530 disposed on the side of the second encapsulation layer 520 away from the substrate 100, and the third encapsulation layer 530 can also encapsulate the display panel 10 to further improve the encapsulation effect of the display panel 10.

[0278] Optionally, the material of the third encapsulation layer 530 includes an inorganic material.

[0279] Optionally, the third encapsulation layer 530 can be prepared by a chemical vapor deposition process.

[0280] Figure 7 is a partial cross-sectional view of a display panel 10 provided by another embodiment of the present application.

[0281] Please refer to Figures 1 to 6 and refer to Figure 7Embodiments of the first aspect of the present application also provide a display panel 10, comprising: a substrate 100; an isolation structure 300 disposed on one side of the substrate 100, the isolation structure 300 being provided with an isolation opening 301, the isolation structure 300 comprising a first isolation portion 310 and a conductive portion 330 disposed on the side of the first isolation portion 310 facing the substrate 100, the conductive portion 330 having a second protruding portion 331 protruding from the first isolation portion 310 towards the isolation opening 301; and a light emitting device 400 at least partially located in the isolation opening 301, wherein the second protruding portion 331 of at least part of the conductive portion 330 has a pit structure 10a on the side away from the substrate 100.

[0282] In a display panel provided by embodiments of the present application, the display panel 10 comprises a substrate 100, an isolation structure 300 and a light emitting device 400. The isolation structure 300 is disposed on one side of the substrate 100, the isolation structure 300 being provided with an isolation opening 301, and the light emitting device 400 is at least partially located in the isolation opening 301, the isolation structure 300 being used to divide sub-pixels of the display panel 10.

[0283] The isolation structure 300 comprises a first isolation portion 310 and a conductive portion 330 disposed on the side of the first isolation portion 310 facing the substrate 100, and the second protruding portion 331 of at least part of the conductive portion 330 has a pit structure 10a on the side away from the substrate 100, which can improve the display effect of the display panel.

[0284] Optionally, the display panel 10 provided by embodiments of the first aspect of the present application can be the display panel 10 of any of the foregoing embodiments, and thus the display panel 10 provided by embodiments of the present application can have the structures and advantages of the display panel 10 of any of the foregoing embodiments, which will not be described in detail herein.

[0285] For example, the light emitting device 400 can be the light emitting device 400 of any of the foregoing embodiments, and the light emitting device 400 can comprise the first type of device 401, the second type of device 402, the third type of device 403 and the fourth type of device 404 of any of the embodiments, and the light emitting device 400 comprises, in the direction away from the substrate 100, a first electrode 410, a light emitting layer 420 and a second electrode 430 stacked in sequence, the second electrode 430 can be connected with the conductive portion 330, so that the second electrodes 430 of adjacent sub-pixels can be electrically connected through the isolation structure 300, facilitating the control of the second electrode 430. By providing the pit structure 10a on the side of the second protruding portion 331 of at least part of the conductive portion 330 away from the substrate 100, the connection area of the second electrode 430 and the conductive portion 330 can be facilitated to be increased, thereby better improving the electrical connection effect between the second electrode 430 and the conductive portion 330.

[0286] For example, the isolation structure 300 can be the isolation structure 300 in any of the foregoing embodiments, the isolation structure 300 can enclose the isolation opening 301 in any of the foregoing embodiments, and specifically, the isolation opening 301 can include the first opening 301a, the second opening 301b, the third opening 301c, and the fourth opening 301d in any of the foregoing embodiments. The isolation structure 300 can include the conductive portion 330, the first isolation portion 310, and the second isolation portion 320 in any of the foregoing embodiments, and the relative positional relationship and the dimensional relationship between the conductive portion 330, the first isolation portion 310, and the second isolation portion 320 can be set with reference to any of the foregoing embodiments.

[0287] Optionally, the embodiment of the first aspect of the present application further provides a display panel 10, which can further include the pixel definition layer 200 in any of the foregoing embodiments, and the pixel definition layer 200 can include the pixel limiting portion 210 and the pixel opening 220 in any of the foregoing embodiments. At least part of the pixel limiting portion 210 away from the substrate 100 can have a pit structure 10a.

[0288] Figure 8 is a partial cross-sectional view of a display panel 10 according to an embodiment of the present application.

[0289] Please refer to Figures 1 to 7 and refer to Figure 8The embodiment of the first aspect of the present application also provides a display panel 10, comprising: a substrate 100; an isolation structure 300 arranged on one side of the substrate 100, the isolation structure 300 is provided with an isolation opening 301, the isolation opening comprises a first opening 301a, a second opening 301b and a third opening 301c, the isolation structure 300 comprises a first isolation part 310 and a second isolation part 320 located on the side of the first isolation part 310 away from the substrate 100, the second isolation part 320 is arranged protruding from the first isolation part 310 towards the isolation opening 301; a light emitting device 400, comprising a first type of device 401 arranged corresponding to the first opening 301a, a second type of device 402 arranged corresponding to the second opening 301b and a third type of device 403 arranged corresponding to the third opening 301c, wherein the side of the first isolation part 310 away from the substrate 100 has a first surface 310a, the side of the second isolation part 320 towards the substrate 100 has a second surface 320a, the first surface 310a has a first distance D1 between the normal projection of the edge corresponding to the first opening 301a on the substrate 100 and the normal projection of the edge corresponding to the first opening 301a on the second surface 320a, the first surface 310a has a second distance D2 between the normal projection of the edge corresponding to the second opening 301b on the substrate 100 and the normal projection of the edge corresponding to the second opening 301b on the second surface 320a, the first surface 310a has a fifth distance D5 between the normal projection of the edge corresponding to the third opening 301c on the substrate 100 and the normal projection of the edge corresponding to the third opening 301c on the second surface 320a, the first distance D1 is less than the second distance D2, and the fifth distance D5 is equal to the first distance D1; and / or, the side of the first isolation part 310 close to the substrate 100 has a third surface 310b, the third surface 310b has a third distance D3 between the normal projection of the edge corresponding to the first opening 301a on the substrate 100 and the normal projection of the edge corresponding to the first opening 301a on the second surface 320a, the third surface 310b has a fourth distance D4 between the normal projection of the edge corresponding to the second opening 301b on the substrate 100 and the normal projection of the edge corresponding to the second opening 301b on the second surface 320a, the third surface 310b has a sixth distance D6 between the normal projection of the edge corresponding to the third opening 301c on the substrate 100 and the normal projection of the edge corresponding to the third opening 301c on the second surface 320a, the third distance D3 is less than the fourth distance D4, and the sixth distance D6 is equal to the third distance D3.

[0290] In the optional embodiments, the display panel 10 provided by the embodiments of the present application further includes a substrate 100, an isolation structure 300, and a light emitting device 400. The isolation structure 300 is arranged on one side of the substrate 100, and the isolation structure 300 is provided with an isolation opening 301 including a first opening 301a, a second opening 301b, and a third opening 301c. The light emitting device 400 includes a first type of device 401 arranged corresponding to the first opening 301a, a second type of device 402 arranged corresponding to the second opening 301b, and a third type of device 403 arranged corresponding to the third opening 301c. The isolation structure 300 can be used to divide the sub-pixels of the display panel 10.

[0291] The isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100. The second isolation portion 320 is arranged protruding from the first isolation portion 310 towards the isolation opening 301, so that when the light emitting device 400 of the display panel 10 is prepared, the material of the light emitting device 400 (for example, the material of the light emitting layer 420 and the material of the second electrode 430) can be directly vapor deposited in a whole plane. The second isolation portion 320 can block at least part of the material used to prepare the light emitting device 400, so as to cut off the material of the light emitting device 400 between adjacent sub-pixels, so as to form a plurality of light emitting devices 400 arranged at intervals and located in different isolation openings 301, thereby avoiding the need to set a mask plate with high precision when preparing the light emitting device 400 of the display panel 10, for example, avoiding the need to set a high-precision metal mask plate when vapor depositing the material of the light emitting device 400, thereby being able to better reduce the production cost of the display panel 10.

[0292] By reasonably setting the protruding length of the second isolation portion 320 around each isolation opening 301, the blocking and cutting effect of the isolation structure 300 around each isolation opening 301 on the material of the light emitting device 400 can be reasonably adjusted, thereby improving the display effect of the display panel 10.

[0293] Optionally, the display panel 10 provided by the embodiments of the first aspect of the present application can be the display panel 10 in any of the preceding embodiments, and thus the display panel 10 provided by the embodiments of the present application can have the structures and advantages of the display panel 10 in any of the preceding embodiments, which will not be described in detail herein.

[0294] For example, the light emitting device 400 can be the light emitting device 400 in any of the preceding embodiments, and the light emitting device 400 can include the first type of device 401, the second type of device 402, the third type of device 403, and the fourth type of device 404 in any of the embodiments. In the direction away from the substrate 100, the light emitting device 400 includes the first electrode 410, the light emitting layer 420, and the second electrode 430 stacked in sequence.

[0295] For example, the isolation structure 300 can be the isolation structure 300 in any of the foregoing embodiments, the isolation structure 300 can enclose the isolation opening 301 in any of the foregoing embodiments, and specifically, the isolation opening 301 can include the first opening 301a, the second opening 301b, the third opening 301c, and the fourth opening 301d in any of the foregoing embodiments. The isolation structure 300 can include the conductive part 330, the first isolation part 310, and the second isolation part 320 in any of the foregoing embodiments, and the relative positional relationship and dimensional relationship between the conductive part 330, the first isolation part 310, and the second isolation part 320 can be set according to any of the foregoing embodiments. At least part of the conductive part 330 away from the substrate 100 can have a pit structure 10a.

[0296] Optionally, the embodiment of the first aspect of the application also provides a display panel 10, which can further include the pixel definition layer 200 in any of the foregoing embodiments, and the pixel definition layer 200 can include the pixel limiting part 210 and the pixel opening 220 in any of the foregoing embodiments. At least part of the pixel limiting part 210 away from the substrate 100 can have a pit structure 10a.

[0297] Figure 9 is a flowchart of a method for manufacturing a display panel 10 according to an embodiment of the application, Figures 10 to 36 is a schematic diagram of a manufacturing process of a method for manufacturing a display panel 10 according to an embodiment of the application.

[0298] The embodiment of the third aspect of the application provides a method for manufacturing a display panel, and the display panel manufactured by the manufacturing method can be the display panel 10 provided by any of the embodiments of the first aspect described above. Please refer to Figure 9 in combination with Figures 1 to 8 and Figures 10 to 36 , the manufacturing method comprises the following steps.

[0299] Step S01: as shown in Figure 12 , forming an isolation material layer on a substrate.

[0300] Step S02: as shown in Figure 13 , forming a first opening and a second opening penetrating the isolation material layer.

[0301] Step S03: as shown in Figure 14 and Figure 15 , disposing a first type of device in the first opening.

[0302] Step S04: as shown in Figures 16 to 18 , manufacturing a second type of device in the second opening, and the first type of device and the second type of device have different light emitting colors.

[0303] Step S05: As shown in Figure 19 a third opening penetrating the isolation material layer is formed.

[0304] Step S06: As shown in Figure 20 and Figure 21 a third device is arranged in the third opening.

[0305] In the embodiments of the present application, by performing the preparation of the third opening 301c after the preparation of the first device 401 and the second device 402 is completed, the preparation of the third device can be reduced. For example, the etching material will not affect the isolation structure 300 and the conductive part 330 on the side of the third opening 301c prepared subsequently, so that the conductive part 330 on the side of the third opening 301c prepared is not easy to be damaged by etching of the etching material and cause fracture, thereby better improving the connection reliability of the second electrode 430 of the third device 403 and the conductive part 330 on the side of the third opening 301c. Since the etching material will not affect the conductive part 330 on the side of the third opening 301c subsequently, the conductive part 330 on the side of the third opening 301c can not have a pit structure 10a.

[0306] In some optional embodiments, step S03 can include:

[0307] Step S031: As shown in Figure 14 a first device material layer is prepared on the whole surface.

[0308] The first device material layer 15 can be used to form the first device 401 in any of the preceding embodiments.

[0309] Optionally, the first device material layer 15 can include a first light emitting material layer 15a and a first electrode material layer 15b located on the side of the first light emitting material layer 15a away from the substrate 100.

[0310] The first light emitting material layer 15a can be used to form the light emitting layer 420 of the first device 401 in any of the preceding embodiments, and the first electrode material layer 15b can be used to form the second electrode 430 of the first device 401 in any of the preceding embodiments.

[0311] Optionally, step S031 can further include: preparing a packaging material layer 18 on the first device material layer 15 on the whole surface. Part of the packaging material layer 18 can be used to form a packaging unit 511 arranged corresponding to the first opening 301a.

[0312] Step S032: As shown in Figure 15 the first device material layer in the second opening 301b is removed to form a first device arranged corresponding to the first opening.

[0313] Optionally, the first type of device 401 is connected to the conductive material layer 12 around the first opening 301a.

[0314] Optionally, the second electrode 430 of the first type of device 401 is connected to the conductive material layer 12 on the periphery of the first opening 301a.

[0315] Optionally, step S032 may further include: removing the encapsulation material layer 18 outside the first opening 301a to form an encapsulation unit 511 corresponding to the first opening 301a.

[0316] In some optional embodiments, the isolation material layer includes a first isolation material layer 13, a second isolation material layer 14 located on the side of the first isolation material layer 13 facing away from the substrate 100, and a conductive material layer 12 located on the side of the first isolation material layer 13 facing the substrate 100. The conductive material layer 12 can be used to form the conductive portion 330 of the isolation structure 300 in any of the foregoing embodiments. The first isolation material layer 13 can be used to form the first isolation portion 310 of the isolation structure 300 in any of the foregoing embodiments. The second isolation material layer 14 can be used to form the second isolation portion 320 of the isolation structure 300 in any of the foregoing embodiments.

[0317] Optional, such as Figure 22 As shown, the conductive material layer 12 surrounding the second opening 301b has a pit structure 10a. In step S03, the etching material can etch the conductive material layer 12 surrounding the second opening 301b to a certain extent to form the pit structure 10a.

[0318] Optionally, in step S03, as follows Figure 23 As shown, a pit structure 10a is formed on the pixel-defined material layer 11 exposed from the second opening.

[0319] Optionally, the following may be included before step S04:

[0320] like Figure 16 As shown, the second opening 301b is cleaned using an etching material, and at least a portion of the first insulating material layer 13 is etched so that the conductive material layer 12 protrudes toward the second opening 301b relative to the first insulating material layer 13.

[0321] In the optional embodiment, the second opening 301b is cleaned by using the etching material, so that the etching material can etch the first isolation material layer 13 around the second opening 301b while removing the impurity residues in the second opening 301b, so that the protruding length of the conductive material layer 12 relative to the first isolation material layer 13 towards the first opening 301a is less than the protruding length of the conductive material layer 12 relative to the first isolation material layer 13 towards the second opening 301b, so as to facilitate the subsequent formation of the conductive part 330 relative to the first isolation part 310 towards the first opening 301a is less than the protruding length of the conductive part 330 relative to the first isolation part 310 towards the second opening 301b.

[0322] Optionally, the step S04 can include:

[0323] The step S041: as shown in the figure, the second device material layer is prepared on the whole surface. Figure 17

[0324] Optionally, the second device material layer 16 can include a second light emitting material layer 16a and a second electrode material layer 16b located on the side of the second light emitting material layer 16a away from the substrate 100.

[0325] Optionally, the second light emitting material layer 16a can be used to form the light emitting layer 420 of the second device 402 in any of the foregoing embodiments, and the second electrode material layer 16b can be used to form the second electrode 430 of the second device 402 in any of the foregoing embodiments.

[0326] Optionally, the step S04 can further include: preparing a packaging material layer 18 on the whole surface of the second device material layer 16. Part of the packaging material layer 18 can be used to form a packaging unit 511 arranged corresponding to the second opening 301b.

[0327] The step S042: as shown in the figure, the second device material layer outside the second opening is removed to form a second device arranged corresponding to the second opening. Figure 18

[0328] Optionally, the second device 402 is connected with the conductive material layer 12 around the second opening 301b, and the protruding length of the conductive material layer 12 relative to the first isolation material layer 13 towards the first opening 301a is less than the protruding length of the conductive material layer 12 relative to the first isolation material layer 13 towards the second opening 301b.

[0329] Optionally, the second electrode 430 of the second device 402 is connected with the conductive material layer 12 around the second opening 301b.

[0330] ​​Optionally, step S042 may further include: removing the encapsulation material layer 18 outside the second opening 301b to form an encapsulation unit 511 corresponding to the second opening 301b.

[0331] Step S06 includes: Step S061: such as Figure 20 As shown, the third device material layer is fabricated on the entire surface.

[0332] The third device material layer 17 can be used to form the third type of device 403 in any of the foregoing embodiments.

[0333] Optionally, the third device material layer 17 may include a third light-emitting material layer 17a and a third type of electrode material layer 17b located on the side of the third light-emitting material layer 17a facing away from the substrate 100.

[0334] The third light-emitting material layer 17a can be used to form the light-emitting layer 420 of the third type of device 403 in any of the foregoing embodiments, and the third type of electrode material layer 17b can be used to form the second electrode 430 of the third type of device 403 in any of the foregoing embodiments.

[0335] Optionally, step S061 may further include: preparing an encapsulation material layer 18 on the entire surface of the third device material layer 17. This portion of the encapsulation material layer 18 can be used to participate in forming the encapsulation unit 511 corresponding to the third opening 301c. In some optional embodiments, before step S061, the following may be included: cleaning the third opening 301c with an etching material and etching at least a portion of the first isolation portion 310, such that the protrusion length of the conductive portion 330 relative to the first isolation portion 310 toward the third opening 301c is greater than or equal to the protrusion length of the conductive portion 330 relative to the first isolation portion 310 toward the first opening 301a, or, such that the protrusion length of the conductive portion 330 relative to the first isolation portion 310 toward the third opening 301c is greater than or equal to the protrusion length of the conductive portion 330 relative to the first isolation portion 310 toward the second opening 301b.

[0336] In the optional embodiment, the third opening 301c is cleaned by using the etching material, so that the etching material can etch the first isolation material layer 13 while cleaning and removing the impurity residues in the third opening 301c, so as to make the conductive part 330 of the isolation structure 300 protrude from the first isolation part 310 towards the third opening 301c. The etching degree of the etching material to the first isolation material layer 13 around the third opening 301c can be adjusted to make the protruding length of the conductive part 330 from the first isolation part 310 towards the third opening 301c greater than or equal to the protruding length of the conductive part 330 from the first isolation part 310 towards the first opening 301a, or make the protruding length of the conductive part 330 from the first isolation part 310 towards the third opening 301c greater than or equal to the protruding length of the conductive part 330 from the first isolation part 310 towards the second opening 301b.

[0337] Step S062: As shown in Figure 21 , the third device material layer outside the third opening is removed to form the third type of device arranged corresponding to the third opening.

[0338] Optionally, the third type of device 403 is connected with the conductive part 330 around the third opening 301c, and the protruding length of the conductive part 330 from the first isolation part 310 towards the third opening 301c is greater than or equal to the protruding length of the conductive part 330 from the first isolation part 310 towards the first opening 301a.

[0339] Optionally, the protruding length of the conductive part 330 from the first isolation part 310 towards the third opening 301c is greater than or equal to the protruding length of the conductive part 330 from the first isolation part 310 towards the second opening 301b.

[0340] Optionally, the second electrode 430 of the third type of device 403 is connected with the conductive material layer 12 around the third opening 301c.

[0341] Optionally, in step S062, the method further includes: removing the packaging material layer 18 outside the third opening 301c to form the packaging unit 511 arranged corresponding to the third opening 301c.

[0342] In some optional embodiments, before step S01, the preparation method further includes: as shown in Figure 10 and Figure 11 , forming a pixel definition material layer on the substrate.

[0343] In step S01, it includes: as shown in Figure 12 , forming an isolation material layer on the pixel definition material layer.

[0344] In step S02, it includes: as shown in Figure 13 ,

[0345] The pixel definition material layer exposed from the first opening and the second opening is patterned to form pixel openings corresponding to the first opening and the second opening.

[0346] In step 05, as shown in Figure 19 ,

[0347] The pixel definition material layer exposed from the third opening is patterned to form a pixel opening corresponding to the third opening.

[0348] In the embodiments of the present application, the third opening is not formed before step S05, so that the first electrode corresponding to the third opening is not exposed, and the damage of the etching process to the first electrode can be improved.

[0349] In some optional embodiments, step S03 includes:

[0350] The first opening and the second opening are cleaned by using an etching material, and at least part of the first isolation material layer is etched, so that the conductive material layer is arranged to protrude from the first isolation material layer towards the first opening and the second opening.

[0351] The first type of device is arranged in the first opening.

[0352] In these optional embodiments, the first opening 301a and the second opening 301b are cleaned by using an etching material, so that the conductive material layer 12 is arranged to protrude from the first isolation material layer 13 towards the first opening 301a and the second opening 301b. The area of the conductive material layer 12 is larger, which facilitates the lapping of the second electrode 430 and the conductive material layer 12.

[0353] In some optional embodiments, when the isolation material layer includes the first isolation material layer 13, the second isolation material layer 14 located on the side of the first isolation material layer 13 away from the substrate 100, and the conductive material layer 12 located on the side of the first isolation material layer 13 towards the substrate 100, step S04 further includes: as shown in Figure 16 the second opening is cleaned by using an etching material, and at least part of the first isolation material layer is etched, so that the conductive material layer is arranged to protrude from the first isolation material layer towards the second opening;

[0354] The second type of device is arranged in the second opening.

[0355] In the embodiments of the present application, after step S03, the second opening 301b is cleaned by using an etching material, which can improve the influence on the first type of device 401. And the lapping effect of the second electrode 430 and the conductive material in the second type of device 402 can be improved.

[0356] Step S06 further includes:

[0357] Step S063: cleaning the third opening using an etching material, and etching at least part of the first isolation material layer, so that the conductive material layer is arranged protruding from the first isolation material layer towards the third opening;

[0358] Step S064: arranging a third type of device in the third opening.

[0359] Optionally, step S064 can include step S061 and step S062 described above.

[0360] In some optional embodiments, in step S03, the recess structure 10a is formed on the conductive material layer 12 exposed by the second opening 301b.

[0361] In some optional embodiments, step S02 is before step S05, or, step S02 is after step S05. That is, the third opening 301c can be opened and the third type of device 403 can be prepared after the first opening 301a and the second opening 301b are opened and the first type of device 401 and the second type of device 402 are prepared. Or, the first opening 301a and the second opening 301b can be opened and the first type of device 401 and the second type of device 402 can be prepared after the third opening 301c is opened and the third type of device 403 is prepared.

[0362] In some optional embodiments, in step S05, further comprising: as shown in Figure 24 opening a fourth opening penetrating the isolation material layer. After step S04, for example, after step S06, further comprising: as shown in Figure 25 and Figure 26 arranging a fourth type of device in the fourth opening.

[0363] In these optional embodiments, the fourth opening 301d is also opened and the fourth type of device 404 is prepared, and the display effect of the display panel 10 can be improved by arranging the fourth type of device 404. Moreover, the preparation efficiency of the display panel 10 can be improved by arranging the third opening 301c together with the fourth opening 301d.

[0364] Optionally, in step S06, further comprising: as shown in Figure 25

[0365] cleaning the fourth opening using an etching material, and etching at least part of the first isolation material layer, so that the conductive material layer is arranged protruding from the first isolation material layer towards the fourth opening.

[0366] ​In these optional embodiments, the fourth opening 301d is also cleaned in step S06, and the conductive material layer 12 is disposed protruding from the first isolation material layer 13 towards the fourth opening 301d, facilitating the lapping of the second electrode 430 of the fourth type of device 404 with the conductive material layer 12.

[0367] Optionally, the step of cleaning the fourth opening 301d using the etching material further comprises:

[0368] The etching material etches at least part of the first isolation material layer 13, so that the protruding length of the second isolation material layer 14 towards the third opening 301c relative to the first isolation material layer 13 is less than the protruding length of the second isolation material layer 14 towards the fourth opening 301d relative to the first isolation material layer 13. This facilitates the lapping of the second electrode 430 of the fourth type of device 404 with the conductive material layer 12.

[0369] In some optional embodiments, step S06 comprises: Figure 27 as shown in

[0370] The etching material etches the conductive material layer exposed from the fourth opening, forming a pit structure on the conductive material layer exposed from the fourth opening.

[0371] In these optional embodiments, when the third type of device 403 is prepared, for example, when the material for preparing the third type of device 403 in the region where the first opening 301a and the second opening 301b are located is removed by using the etching material, the conductive material layer 12 exposed from the fourth opening 301d is also etched to form a pit structure 10a.

[0372] In some optional embodiments, in step S05, the third opening 301c and the fourth opening 301d are formed through the isolation material layer, and the pixel definition material layer 11 exposed from the third opening 301c and the fourth opening 301d is subjected to a patterning process to form pixel openings 220 corresponding to the third opening 301c and the fourth opening 301d.

[0373] Optionally, step S06 comprises: Figure 28 as shown in

[0374] The etching material etches the pixel definition material layer exposed from the fourth opening, forming a pit structure.

[0375] In these optional embodiments, in step S05, not only the third opening 301c and the fourth opening 301d are opened, but also pixel openings 220 corresponding to the third opening 301c and the fourth opening 301d are opened in the pixel definition material layer 11, which can improve the preparation efficiency. In step S06, since the fourth opening 301d has been opened, part of the pixel definition material layer 11 is exposed from the fourth opening 301d, and this part of the pixel definition material layer 11 is easy to be etched to form the pit structure 10a in step S06.

[0376] In some optional embodiments, the preparation method further comprises:

[0377] Step S07: as shown in Figure 29 , a fourth opening penetrating the isolation material layer is opened.

[0378] Step S08: as shown in Figure 30 , a fourth type of device is arranged in the fourth opening.

[0379] In some optional embodiments, step S07 is located after step 05, or step S07 is located between step S02 and step S05, or step S07 is located before step 02.

[0380] In these optional embodiments, the fourth opening 301d is also opened and the fourth type of device 404 is prepared, and the fourth opening 301d and the fourth type of device 404 can be opened before step S02, between step S02 and step S05, or after step S05, so that the inner wall of the fourth opening 301d is not easy to be damaged by etching when other steps are performed.

[0381] In some optional embodiments, step S02 further comprises:

[0382] As shown in Figure 31 , a fourth opening penetrating the isolation material layer is opened.

[0383] After step S04, it further comprises: as shown in Figure 32 , a fourth type of device is arranged in the fourth opening.

[0384] In these optional embodiments, the first opening 301a, the second opening 301b and the fourth opening 301d are opened in the same process step, which can simplify the preparation process and improve the preparation efficiency.

[0385] In some optional embodiments, when step S01 comprises step S011 and step S012 as described above, in step S02, a fourth opening 301d can also be formed through the isolation material layer, and the pixel definition material layer 11 exposed from the first opening 301a, the second opening 301b and the fourth opening 301d can be subjected to a patterning process to form pixel openings 220 corresponding to the first opening 301a, the second opening 301b and the fourth opening 301d.

[0386] In these optional embodiments, the first opening 301a, the second opening 301b and the fourth opening 301d are formed synchronously in step S02, which can simplify the preparation process.

[0387] Optionally, step S03 comprises:

[0388] The etching material is used to clean the first opening, the second opening and the fourth opening, and at least part of the first isolation material layer is etched so that the conductive material layer is arranged to protrude from the first isolation material layer towards the first opening, the second opening and the fourth opening.

[0389] The first type of device is arranged in the first opening.

[0390] In these optional embodiments, the etching material also cleans the fourth opening 301d, so that the conductive material layer 12 is arranged to protrude from the first isolation material layer 13 towards the fourth opening 301d, facilitating the mutual lapping of the first electrode 410 of the fourth type of device 404 and the conductive material layer 12.

[0391] Optionally, step S04 further comprises: Figure 33 As shown, the etching material is used to clean the second opening and the fourth opening, and at least part of the first isolation material layer is etched so that the conductive material layer is arranged to protrude from the first isolation material layer towards the second opening and the fourth opening.

[0392] In these optional embodiments, the etching material also cleans the second opening 301b and the fourth opening 301d, so that the conductive material layer 12 has a longer protruding length towards the second opening 301b and the fourth opening 301d than the first isolation material layer 13, facilitating the mutual lapping of the first electrode 410 of the second type of device 402 and the fourth type of device 404 and the conductive material layer 12.

[0393] Optionally, the step of using the etching material to clean the second opening 301b and the fourth opening 301d further comprises:

[0394] The etching material etches at least part of the first isolation material layer 13, so that the protruding length of the second isolation material layer 14 relative to the first isolation material layer 13 towards the first opening 301a is less than the protruding length of the second isolation material layer 14 relative to the first isolation material layer 13 towards the second opening 301b and the fourth opening 301d. Thus, the first electrode 410 of the second type device 402 and the fourth type device 404 can be conveniently overlapped with the conductive material layer 12.

[0395] In some optional embodiments, after step S04, the following step can be included: as shown in Figure 34

[0396] The etching material etches at least part of the first isolation material layer 13, so that the protruding length of the second isolation material layer 14 relative to the first isolation material layer 13 towards the first opening 301a is less than the protruding length of the second isolation material layer 14 relative to the first isolation material layer 13 towards the second opening 301b and the fourth opening 301d. Thus, the first electrode 410 of the second type device 402 and the fourth type device 404 can be conveniently overlapped with the conductive material layer 12.

[0397] In these optional embodiments, the etching material also etches the fourth opening 301d, so that the conductive material layer 12 has a longer protruding length relative to the first isolation material layer 13 towards the fourth opening 301d, further facilitating the mutual overlap of the first electrode 410 of the fourth type device 404 and the conductive material layer 12.

[0398] Optionally, the step of using the etching material to etch the fourth opening 301d further includes:

[0399] The etching material etches at least part of the first isolation material layer 13, so that the protruding length of the second isolation material layer 14 relative to the first isolation material layer 13 towards the first opening 301a and the second opening 301b is less than the protruding length of the second isolation material layer 14 relative to the first isolation material layer 13 towards the fourth opening 301d. Thus, the first electrode 410 of the fourth type device 404 can be conveniently overlapped with the conductive material layer 12.

[0400] Optionally, in step S03, the following step can be included: as shown in Figure 35

[0401] The etching material etches the pixel definition material layer exposed from the second opening and the fourth opening, and forms a pit structure on the pixel definition material layer exposed from the second opening and the fourth opening.

[0402] In these optional embodiments, since the first opening 301a, the second opening 301b and the fourth opening 301d are opened in step S02, when the material for preparing the first type device 401 is etched from the second opening 301b and the fourth opening 301d, the etching material can affect the pixel definition material layer 11 exposed from the second opening 301b and the fourth opening 301d to form a pit structure 10a.

[0403] ​​In step S04, the following is included: as shown in Figure 36

[0404] The etching material etches the pixel definition material layer exposed from the fourth opening to form a pit structure on the pixel definition material layer exposed from the fourth opening.

[0405] As described above, since the first opening 301a, the second opening 301b and the fourth opening 301d are opened in step S02, when the material for preparing the second type device 402 of the fourth opening 301d is etched in step S04, the etching material can affect the pixel definition material layer 11 exposed from the fourth opening 301d to form a pit structure 10a.

[0406] In some optional embodiments, in step S03, the following is included: as shown in Figure 35

[0407] The etching material etches the conductive material layer exposed from the second opening and the fourth opening to form a pit structure 10a on the conductive material layer exposed from the second opening and the fourth opening.

[0408] In this optional embodiment, by forming the pit structure 10a on the conductive material layer 12 exposed from the second opening 301b and the fourth opening 301d, the lap joint effect of the second electrode 430 and the conductive material in the second type device 402 and the fourth type device 404 can be improved.

[0409] In some optional embodiments, in step S04, the following is included: as shown in Figure 36

[0410] The etching material etches the conductive material layer exposed from the fourth opening to form a pit structure on the conductive material layer exposed from the fourth opening.

[0411] In this optional embodiment, by forming the pit structure 10a on the conductive material layer 12 exposed from the fourth opening 301d, the lap joint effect of the second electrode 430 and the conductive material in the fourth type device 404 can be improved.

[0412] Figure 37 is a preparation method flow diagram of a display panel 10 provided by an embodiment of the present application, Figures 38 to 44 is a preparation process diagram of a preparation method of a display panel 10 provided by an embodiment of the present application.

[0413] Embodiments of the third aspect of the present application also provide a preparation method of a display panel 10. The display panel prepared by the preparation method can be the display panel 10 provided by any of the first aspect embodiments described above. Please refer to Figure 37 in combination with Figures 1 to 8 and Figures 38 to 44 ​​​The preparation method comprises the following steps:

[0414] Step S01': as shown in the figure, a pixel definition material layer is formed on the substrate. Figure 38

[0415] Step S02': as shown in the figure, an isolation material layer is formed on the pixel definition material layer. Figure 39

[0416] Step S03': as shown in the figure, a first opening, a second opening and a third opening are formed through the isolation material layer. Figure 40

[0417] Step S04': as shown in the figure, a pixel opening corresponding to the first opening and the second opening is formed on the pixel definition material layer. Figure 41

[0418] Step S05': as shown in the figure, a first type of device is arranged in the pixel opening corresponding to the first opening, and a second type of device is arranged in the pixel opening corresponding to the second opening. Figure 42

[0419] Step S06': as shown in the figure, a pixel opening corresponding to the third opening is formed on the pixel definition material layer. Figure 43

[0420] Step S07': as shown in the figure, a third type of device is arranged in the pixel opening corresponding to the third opening. Figure 44

[0421] In the embodiments of the present application, different pixel openings 220 are formed in steps S04' and S06', for example, step S04' is performed before step S06', then in step S05', the pixel definition material corresponding to the third opening 301c can provide protection for the first electrode 410 below, which can improve the influence of the etching material on the first electrode 410 corresponding to the third opening 301c prepared subsequently. Alternatively, step S04' is performed after step S06', then in step S07', the pixel definition material corresponding to the first opening 301a and the second opening 301b can provide protection for the first electrode 410 below, which can improve the influence of the etching material on the first electrode 410 corresponding to the third opening 301c prepared subsequently.

[0422] In some optional embodiments, step S04' can be performed before step S06', or step S04' can be performed after step S06'. As long as steps S04' and S06' are performed in two different process steps.

[0423] ​​​​​​​The display device provided by the third aspect of the present application comprises the display panel 10 of any one of the above-mentioned embodiments. Since the display device provided by the third aspect of the present application comprises the display panel 10 of any one of the above-mentioned embodiments of the first aspect, or the display panel 10 prepared by the preparation method of any one of the above-mentioned embodiments of the second aspect. Therefore, the display device provided by the third aspect of the present application has the beneficial effects of the display panel 10 of any one of the above-mentioned embodiments of the first aspect or the display panel 10 prepared by the preparation method of any one of the above-mentioned embodiments of the second aspect, which will not be described here.

[0424] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDA), tablet computers, e-books, televisions, access control systems, smart fixed phones, consoles and other devices with display functions.

[0425] In accordance with the above embodiments of the present application, these embodiments do not describe all the details and do not limit the application to only specific embodiments. Obviously, according to the above description, many modifications and changes can be made. The present description selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well utilize the present application and make modifications and uses on the basis of the present application. The present application is limited by the claims and their entire scope and equivalents.

Claims

1. A display panel, characterized in that, include: substrate; A pixel definition layer is disposed on one side of the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion; An isolation structure is disposed on one side of the substrate, and the isolation structure is provided with an isolation opening, which communicates with the pixel opening; The light-emitting device is at least partially located within the pixel opening. The pixel defining portion exposed from at least part of the isolation opening has a recessed structure on the side facing away from the substrate.

2. The display panel according to claim 1, characterized in that, The isolation opening includes a first opening and a second opening. The light-emitting device includes a first type of device corresponding to the first opening and a second type of device corresponding to the second opening. The first type of device and the second type of device emit different colors. The pixel limiting portion exposed from the second opening has the pit structure on the side facing away from the substrate. Preferably, the pixel defining portion exposed from the first opening has a first flat surface on the side facing away from the substrate; Preferably, the isolation opening further includes a third opening, the light-emitting device includes a third type of device corresponding to the third opening, the pixel defining portion exposed from the third opening has the pit structure on the side away from the substrate, or the pixel defining portion exposed from the third opening has a first flat surface on the side away from the substrate. Preferably, the isolation opening further includes a fourth opening, the light-emitting device includes a fourth type of device corresponding to the fourth opening, the pixel limiting portion exposed from the fourth opening has the pit structure on the side away from the substrate, or the pixel limiting portion exposed from the fourth opening has a first flat surface on the side away from the substrate. Preferably, the first type of device is a light-emitting device that emits blue light, the second type of device is a light-emitting device that emits green light, the third type of device is a light-emitting device that emits red light, and the fourth type of device is a light-emitting device that emits white light.

3. The display panel according to claim 1, characterized in that, The film layer of the light-emitting device is located within the recessed structure; Preferably, in the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially, wherein the light-emitting layer is partially located within the recessed structure, and / or the second electrode is partially located within the recessed structure.

4. The display panel according to claim 1, characterized in that, The number of the recessed structures is one or more, and the recessed structures are spaced apart from each other, and / or the recessed structures are connected together.

5. The display panel according to any one of claims 1 to 4, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion has a first protrusion that protrudes from the first isolation portion toward the isolation opening. Preferably, the orthographic projection of the recessed structure on the substrate is at least partially located within the orthographic projection of the first protrusion on the substrate.

6. The display panel according to claim 5, characterized in that, The isolation opening includes a first opening and a second opening. The light-emitting device includes a first type of device corresponding to the first opening and a second type of device corresponding to the second opening. The protrusion length of the second isolation portion relative to the first isolation portion toward the first opening is less than the protrusion length of the second isolation portion relative to the first isolation portion toward the second opening. Preferably, the first isolation portion has a first surface on the side away from the substrate, and the second isolation portion has a second surface on the side facing the substrate. There is a first distance between the orthographic projection of the edge of the first surface corresponding to the first opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the first opening on the substrate, and there is a second distance between the orthographic projection of the edge of the first surface corresponding to the second opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the second opening on the substrate. The first distance is smaller than the second distance. Preferably, the first isolation portion has a third surface on the side near the substrate, and there is a third distance between the orthographic projection of the edge of the first opening on the third surface corresponding to the first opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the first opening on the substrate, and there is a fourth distance between the orthographic projection of the edge of the second opening on the third surface corresponding to the second opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the second opening on the substrate, wherein the third distance is smaller than the fourth distance. Preferably, the isolation opening further includes a third opening, the light-emitting device includes a third type of device corresponding to the third opening, the protrusion length of the second isolation portion relative to the first isolation portion toward the third opening is not less than the protrusion length of the second isolation portion relative to the first isolation portion toward the first opening, and / or, the protrusion length of the second isolation portion relative to the first isolation portion toward the third opening is not greater than the protrusion length of the second isolation portion relative to the first isolation portion toward the second opening. Preferably, there is a fifth distance between the orthographic projection of the edge of the first surface corresponding to the third opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the third opening on the substrate, wherein the fifth distance is not less than the first distance and / or the fifth distance is not greater than the second distance; Preferably, there is a sixth distance between the orthographic projection of the edge of the third surface corresponding to the third opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the third opening on the substrate, the sixth distance being not less than the third distance, and / or the sixth distance being not greater than the fourth distance; Preferably, the isolation opening further includes a fourth opening, the light-emitting device includes a fourth type of device corresponding to the fourth opening, and the protrusion length of the second isolation portion relative to the first isolation portion toward the fourth opening is greater than or equal to the protrusion length of the second isolation portion relative to the first isolation portion toward the third opening; Preferably, there is a seventh distance between the orthographic projection of the edge of the first surface corresponding to the fourth opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the fourth opening on the substrate, wherein the seventh distance is not less than the first distance and / or the seventh distance is not greater than the second distance; Preferably, there is a fifth distance between the orthographic projection of the edge of the first surface corresponding to the third opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the third opening on the substrate, and the seventh distance is greater than or equal to the fifth distance; Preferably, there is an eighth spacing between the orthographic projection of the edge of the third surface corresponding to the fourth opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the fourth opening on the substrate, the eighth spacing being not less than the third spacing and / or the eighth spacing being not greater than the fourth spacing; Preferably, there is a sixth distance between the orthographic projection of the edge of the third surface corresponding to the third opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the third opening on the substrate, and the eighth distance is greater than or equal to the sixth distance.

7. The display panel according to claim 5, characterized in that, The isolation structure further includes a conductive portion disposed on the side of the first isolation portion facing the substrate. The conductive portion has a second protrusion that protrudes from the first isolation portion toward the isolation opening. At least a portion of the second protrusion of the conductive portion has a pit structure on the side away from the substrate. Preferably, the isolation opening includes a first opening and a second opening, the light-emitting device includes a first type of device corresponding to the first opening and a second type of device corresponding to the second opening, and the second protrusion protruding from the first isolation portion toward the second opening has the pit structure on the side away from the substrate; Preferably, the second protrusion, which protrudes from the first isolation portion toward the first opening, has a second flat surface on the side away from the substrate; Preferably, the isolation opening further includes a third opening, and the light-emitting device includes a third type of device corresponding to the third opening. The second protrusion provided in the first isolation portion protrudes toward the third opening and has the pit structure on the side away from the substrate, or the second protrusion provided in the first isolation portion protrudes toward the third opening and has a second flat surface on the side away from the substrate. Preferably, the isolation opening further includes a fourth opening, and the light-emitting device includes a fourth type of device corresponding to the fourth opening. The second protrusion, which protrudes from the first isolation portion toward the fourth opening, has the pit structure on the side away from the substrate, or the second protrusion, which protrudes from the first isolation portion toward the fourth opening, has a second flat surface on the side away from the substrate.

8. The display panel according to claim 7, characterized in that, The light-emitting device portion is located within the recessed structure of the conductive portion; Preferably, in the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting layer and a second electrode stacked sequentially, the second electrode being connected to the conductive portion, and the second electrode portion being located within the pit structure of the conductive portion; Preferably, the second electrode is also connected to the first isolation portion.

9. The display panel according to claim 1, characterized in that, The isolation opening includes a first opening and a second opening. The light-emitting device includes a first type of device corresponding to the first opening and a second type of device corresponding to the second opening. The isolation structure includes a first isolation portion and a conductive portion located on the side of the first isolation portion facing the substrate. The protrusion length of the conductive portion relative to the first isolation portion facing the first opening is less than the protrusion length of the conductive portion relative to the first isolation portion facing the second opening. Preferably, the length of the protrusion of the conductive portion relative to the first insulating portion toward the first opening ranges from 0.05 micrometers to 0.4 micrometers; Preferably, the protrusion length of the conductive portion relative to the first isolation portion toward the second opening is greater than the protrusion length of the conductive portion relative to the first isolation portion toward the first opening, but not greater than 3 times the protrusion length of the conductive portion relative to the first isolation portion toward the first opening. Preferably, the protrusion length of the conductive portion relative to the first isolation portion toward the second opening is not less than 3 / 2 times the protrusion length of the conductive portion relative to the first isolation portion toward the first opening, and not greater than 2 times the protrusion length of the conductive portion relative to the first isolation portion toward the first opening. Preferably, the isolation structure further includes a second isolation portion located on the side of the first isolation portion away from the substrate, wherein there is a ninth distance between the orthographic projection of the edge of the second isolation portion toward the first opening side on the substrate and the orthographic projection of the edge of the conductive portion toward the first opening side on the substrate, and there is a tenth distance between the orthographic projection of the edge of the second isolation portion toward the second opening side on the substrate and the orthographic projection of the edge of the conductive portion toward the second opening side on the substrate, wherein the ninth distance is equal to the tenth distance. Preferably, the values ​​of the ninth spacing and the tenth spacing range from 0.1 micrometers to 0.6 micrometers; Preferably, the isolation opening further includes a third opening, the light-emitting device includes a third type of device corresponding to the third opening, the protrusion length of the conductive part relative to the first isolation part toward the third opening is not less than the protrusion length of the conductive part relative to the first isolation part toward the first opening, and / or, the protrusion length of the conductive part relative to the first isolation part toward the third opening is not greater than the protrusion length of the conductive part relative to the first isolation part toward the second opening. Preferably, the length of the protrusion of the conductive portion relative to the first insulating portion toward the third opening ranges from 0.05 micrometers to 0.4 micrometers; Preferably, the isolation structure further includes a second isolation portion located on the side of the first isolation portion away from the substrate. A ninth distance exists between the orthographic projection of the edge of the second isolation portion facing the first opening onto the substrate and the orthographic projection of the edge of the conductive portion facing the first opening onto the substrate. A tenth distance exists between the orthographic projection of the edge of the second isolation portion facing the second opening onto the substrate and the orthographic projection of the edge of the conductive portion facing the second opening onto the substrate. An eleventh distance exists between the orthographic projection of the edge of the second isolation portion facing the third opening onto the substrate and the orthographic projection of the edge of the conductive portion facing the third opening onto the substrate. The ninth, tenth, and eleventh distances are all equal. Preferably, the values ​​of the ninth spacing, the tenth spacing, and the eleventh spacing range from 0.1 micrometers to 0.6 micrometers; Preferably, the isolation opening further includes a fourth opening, the light-emitting device includes a fourth type of device corresponding to the fourth opening, and the protrusion length of the conductive portion relative to the first isolation portion toward the fourth opening is greater than or equal to the protrusion length of the conductive portion relative to the first isolation portion toward the third opening. Preferably, the isolation structure further includes a second isolation portion located on the side of the first isolation portion away from the substrate. A ninth distance exists between the orthographic projection of the edge of the second isolation portion facing the first opening on the substrate and the orthographic projection of the edge of the conductive portion facing the first opening on the substrate. A tenth distance exists between the orthographic projection of the edge of the second isolation portion facing the second opening on the substrate and the orthographic projection of the edge of the conductive portion facing the second opening on the substrate. An eleventh distance exists between the orthographic projection of the edge of the second isolation portion facing the third opening on the substrate and the orthographic projection of the edge of the conductive portion facing the third opening on the substrate. A twelfth distance exists between the orthographic projection of the edge of the second isolation portion facing the fourth opening on the substrate and the orthographic projection of the edge of the conductive portion facing the fourth opening on the substrate. The ninth, tenth, eleventh, and twelfth distances are all equal. Preferably, the values ​​of the ninth spacing, the tenth spacing, the eleventh spacing and the twelfth spacing are in the range of 0.1 micrometers to 0.6 micrometers.

10. The display panel according to claim 1, characterized in that, The depth of the pit structure ranges from 0.3 micrometers to 0.7 micrometers, and / or the width of the pit structure is less than 1.5 micrometers.

11. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate. The isolation structure has an isolation opening. The isolation structure includes a first isolation portion and a conductive portion disposed on the side of the first isolation portion facing the substrate. The conductive portion has a second protrusion that protrudes from the first isolation portion toward the isolation opening. The light-emitting device is at least partially located within the isolation opening. Wherein, at least a portion of the second protrusion of the conductive portion has a pit structure on the side opposite to the substrate.

12. The display panel according to claim 11, characterized in that, The isolation opening includes a first opening and a second opening. The light-emitting device includes a first type of device corresponding to the first opening and a second type of device corresponding to the second opening. The second protrusion, which protrudes from the first isolation portion and is disposed therein, has the pit structure on the side away from the substrate. Preferably, the second protrusion, which protrudes from the first isolation portion toward the first opening, has a second flat surface on the side away from the substrate; Preferably, the isolation opening further includes a third opening, and the light-emitting device includes a third type of device corresponding to the third opening. The second protrusion provided in the first isolation portion protrudes toward the third opening and has the pit structure on the side away from the substrate, or the second protrusion provided in the first isolation portion protrudes toward the third opening and has a second flat surface on the side away from the substrate. Preferably, the isolation opening further includes a fourth opening, and the light-emitting device includes a fourth type of device corresponding to the fourth opening. The second protrusion, which protrudes from the first isolation portion toward the fourth opening, has the pit structure on the side away from the substrate, or the second protrusion, which protrudes from the first isolation portion toward the fourth opening, has a second flat surface on the side away from the substrate.

13. The display panel according to claim 11, characterized in that, The light-emitting device portion is located within the recessed structure; Preferably, in the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting layer and a second electrode stacked sequentially, the second electrode being connected to the conductive portion, and the second electrode portion being located within the recess structure.

14. The display panel according to claim 11, characterized in that, The number of the recessed structures is one or more, and the recessed structures are spaced apart from each other, and / or the recessed structures are connected together.

15. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate. An isolation opening is provided on the isolation structure. The isolation opening includes a first opening, a second opening, and a third opening. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion protrudes from the first isolation portion toward the isolation opening. The light-emitting device includes a first type of device corresponding to the first opening, a second type of device corresponding to the second opening, and a third type of device corresponding to the third opening. The first isolation portion has a first surface on the side away from the substrate, and the second isolation portion has a second surface on the side facing the substrate. There is a first distance between the orthographic projection of the edge of the first surface corresponding to the first opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the first opening on the substrate. There is a second distance between the orthographic projection of the edge of the first surface corresponding to the second opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the second opening on the substrate. There is a fifth distance between the orthographic projection of the edge of the first surface corresponding to the third opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the third opening on the substrate. The first distance is smaller than the second distance, and the fifth distance is equal to the first distance. And / or, the first isolation portion has a third surface on the side near the substrate, the third surface corresponding to the orthographic projection of the edge of the first opening on the substrate has a third distance between the orthographic projection of the edge of the second surface corresponding to the first opening on the substrate, the third surface corresponding to the orthographic projection of the edge of the second opening on the substrate has a fourth distance between the orthographic projection of the edge of the third surface corresponding to the second opening on the substrate, and the second surface corresponding to the third opening on the substrate has a sixth distance between the orthographic projection of the edge of the third surface corresponding to the third opening on the substrate, the third distance being less than the fourth distance, and the sixth distance being equal to the third distance.

16. The display panel according to claim 15, characterized in that, The isolation opening further includes a fourth opening, and the light-emitting device includes a fourth type of device corresponding to the fourth opening. There is a seventh distance between the orthographic projection of the edge of the first surface corresponding to the fourth opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the fourth opening on the substrate. The seventh distance is greater than or equal to the fifth distance. And / or, there is an eighth spacing between the orthographic projection of the edge of the third surface corresponding to the fourth opening on the substrate and the orthographic projection of the edge of the second surface corresponding to the fourth opening on the substrate, the eighth spacing being greater than or equal to the sixth spacing.

17. A method for manufacturing a display panel, characterized in that, include: An isolation material layer is formed on the substrate; A first opening and a second opening are made that penetrate the insulating material layer; A first type of device is disposed within the first opening; A second type of device is fabricated within the second opening, wherein the first type of device and the second type of device emit different colors of light. A third opening is made that penetrates the insulating material layer; A third type of device is disposed within the third opening.

18. The preparation method according to claim 17, characterized in that, A first type of device is disposed within the first opening, including: The first device material layer is fabricated across the entire surface. Remove the first device material layer inside the second opening to form a first type of device corresponding to the first opening; A second type of device is disposed within the second opening, including: The second device material layer is fabricated over the entire surface. Remove the second device material layer outside the second opening to form a second type of device corresponding to the second opening; A third type of device is disposed within the third opening, including: The third device material layer is fabricated across the entire surface. Remove the third device material layer outside the third opening to form a third type of device corresponding to the third opening.

19. The preparation method according to claim 17, characterized in that, Prior to the step of forming an insulating material layer on the substrate, the method further includes: A pixel definition material layer is formed on the substrate; The step of forming an insulating material layer on a substrate includes: The isolation material layer is formed on the pixel definition material layer; The step of creating the first and second openings penetrating the insulating material layer includes: The pixel-defined material layer exposed from the first opening and the second opening is patterned to create pixel openings corresponding to the first opening and the second opening; The step of creating a third opening through the insulating material layer includes: The pixel definition material layer exposed from the third opening is patterned to create a pixel opening corresponding to the third opening; Preferably, in the step of setting the first type of device within the first opening, a pit structure is formed on the pixel definition material layer exposed from the second opening.

20. The preparation method according to claim 17, characterized in that, The insulating material layer includes a first insulating material layer, a second insulating material layer located on the side of the first insulating material layer facing away from the substrate, and a conductive material layer located on the side of the first insulating material layer facing the substrate. The step of setting the first type of device within the first opening includes: The first opening and the second opening are cleaned using an etching material, and at least a portion of the first insulating material layer is etched so that the conductive material layer protrudes from the first insulating material layer toward the first opening and the second opening. The first type of device is disposed within the first opening.

21. The preparation method according to claim 17, characterized in that, The insulating material layer includes a first insulating material layer, a second insulating material layer located on the side of the first insulating material layer facing away from the substrate, and a conductive material layer located on the side of the first insulating material layer facing the substrate. The step of setting the second type of device within the second opening includes: The second opening is cleaned using an etching material, and at least a portion of the first insulating material layer is etched so that the conductive material layer protrudes from the first insulating material layer toward the second opening; The second type of device is disposed within the second opening; Preferably, the step of cleaning the second opening using an etching material further includes: The etching material etches at least a portion of the first isolation material layer such that the protrusion length of the second isolation material layer relative to the first isolation material layer toward the first opening is less than the protrusion length of the second isolation material layer relative to the first isolation material layer toward the second opening.

22. The preparation method according to claim 17, characterized in that, The insulating material layer includes a first insulating material layer, a second insulating material layer located on the side of the first insulating material layer facing away from the substrate, and a conductive material layer located on the side of the first insulating material layer facing the substrate. The step of setting the third type of device within the third opening includes: The third opening is cleaned using an etching material, and at least a portion of the first insulating material layer is etched so that the conductive material layer protrudes from the first insulating material layer toward the third opening; The third type of device is disposed within the third opening.

23. The preparation method according to claim 17, characterized in that, The insulating material layer includes a first insulating material layer and a conductive material layer located on the side of the first insulating material layer facing the substrate. In the step of setting the first type of device in the first opening, a pit structure is formed on the conductive material layer exposed in the second opening.

24. The preparation method according to claim 17, characterized in that, The steps of opening the first and second openings through the insulating material layer are performed before the step of opening the third opening through the insulating material layer; Alternatively, the steps of opening the first and second openings through the insulating material layer are performed after the step of opening the third opening through the insulating material layer.

25. The preparation method according to any one of claims 17 to 24, characterized in that, The step of creating a third opening through the insulating material layer includes: A fourth opening is made that penetrates the insulating material layer; After the step of placing the third type of device within the third opening, the method further includes: A fourth type of device is disposed within the fourth opening.

26. The preparation method according to any one of claims 17 to 24, characterized in that, The preparation method further includes: A fourth opening is made that penetrates the insulating material layer; A fourth type of device is disposed within the fourth opening; The step of opening the fourth opening through the insulating material layer is located after the step of opening the third opening through the insulating material layer, or the step of opening the fourth opening through the insulating material layer is located between the steps of opening the first and second openings through the insulating material layer and the step of opening the third opening through the insulating material layer, or the step of opening the fourth opening through the insulating material layer is located before the steps of opening the first and second openings through the insulating material layer.

27. The preparation method according to any one of claims 17 to 24, characterized in that, The step of creating the first and second openings penetrating the insulating material layer further includes: A fourth opening is made that penetrates the insulating material layer; The step of placing the second type of device within the second opening further includes: A fourth type of device is disposed within the fourth opening.

28. A method for manufacturing a display panel, characterized in that, include: A pixel definition material layer is formed on the substrate; An isolation material layer is formed on the pixel-defined material layer; A first opening, a second opening, and a third opening are made that penetrate the insulating material layer; A pixel opening corresponding to the first opening and the second opening is formed on the pixel definition material layer; A first type of device is disposed in the pixel opening corresponding to the first opening, and a second type of device is disposed in the pixel opening corresponding to the second opening; A pixel opening corresponding to the third opening is formed on the pixel definition material layer; A third type of device is disposed within the pixel opening corresponding to the third opening.

29. The preparation method according to claim 28, characterized in that, The pixel openings corresponding to the first and second openings on the pixel definition material layer are located before the pixel opening corresponding to the third opening on the pixel definition material layer, or the pixel openings corresponding to the first and second openings on the pixel definition material layer are located after the pixel opening corresponding to the third opening on the pixel definition material layer.

30. A display device, characterized in that, It includes a display panel as described in any one of claims 1 to 16, or a display panel prepared by any one of claims 16 to 29.

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