Display device

Abstract

A display device according to an exemplary embodiment of the present disclosure includes a planarization layer disposed over a substrate and including a protrusion. The anode is disposed on an upper surface and a side surface of the protrusion. A bank is disposed to cover the anode except for an upper surface of the protrusion, and an organic layer is disposed on an exposed portion of the anode. The cathode is disposed on the organic layer. The bank has a height equal to or less than a height of an upper surface of the protrusion.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0103006, filed on August 2, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to a display device. Background Technology

[0004] Currently, with the advent of the comprehensive information age, the field of display devices that visually express electronic information signals has developed rapidly, and research continues to improve the performance of various display devices, such as thinness, light weight, and low power consumption.

[0005] Among various display devices, electroluminescent displays are self-emissive, thus requiring no separate light source, unlike liquid crystal displays. Therefore, electroluminescent displays can be manufactured to be lightweight and thin. Furthermore, because electroluminescent displays are driven by low voltage, they offer advantages not only in power consumption but also in color reproduction, response speed, viewing angle, and contrast ratio (CR). Therefore, they are expected to be used in a wide range of fields.

[0006] In this electroluminescent display device, when current is supplied to the light-emitting diode in the forward direction, electrons and holes move through the pn junction between the positive electrode (anode) supplying holes and the negative electrode (cathode) supplying electrons and recombine with each other. In this case, the electrons and holes have less energy than when they are separated, and emit light corresponding to the energy difference generated at this time.

[0007] Conversely, when the anode and cathode are in direct contact with each other without a light-emitting layer between them, resulting in a short circuit, the LED will not function without a potential difference applied to the light-emitting layer. To suppress this problem, a retaining wall is inserted between the anode and cathode in the non-light-emitting area to ensure sufficient space between them. Summary of the Invention

[0008] The disclosed display device features a structure in which the protrusions of the planarization layer correspond to the light-emitting area, and the embankment has a height equal to or less than that of the protrusions. This configuration eliminates the tapered portion typically formed at the boundary of the light-emitting area, resulting in a flatter deposition surface for the organic layer and the cathode. This improves the uniformity of the deposited layer thickness, reduces resistance in the cathode, and minimizes the possibility of electrical discontinuities. Furthermore, the planarization structure improves the light-emitting path, which contributes to a wider viewing angle and more consistent brightness performance.

[0009] This configuration is particularly well-suited for color-on-encapsulation structures. By minimizing the step height between the emitting and non-emitting areas, the thickness of the organic encapsulation layer can be reduced without requiring additional photomasks or manufacturing steps. This leads to improved optical properties, reduced material usage, and simplified processing, all of which are beneficial for both rigid and flexible display applications.

[0010] This structure also helps reduce power consumption by ensuring a more efficient light-emitting path and minimizing electrical losses in the cathode. By reducing energy requirements and material waste during production, it supports increased manufacturing throughput and reliability while aligning with environmental and sustainability goals.

[0011] Various embodiments of this disclosure provide a display device in which the decrease in viewing angle brightness caused by the tapered portion of the embankment is suppressed.

[0012] Various embodiments of this disclosure provide a display device in which the increased resistance of the cathode and the open circuit caused by the tapered portion of the embankment are improved.

[0013] The technical effects of this disclosure are not limited to those described above, and those skilled in the art will clearly understand other effects not mentioned above based on the following description.

[0014] To achieve the above-mentioned effects, according to one aspect of this disclosure, a display device includes: a planarization layer disposed on a substrate and including a protrusion having an upper surface and a side surface extending from the upper surface; an anode disposed on the upper surface and the side surface of the protrusion; a dam portion configured to cover the anode except for the upper surface of the protrusion; an organic layer disposed on the anode exposed by the dam portion; and a cathode disposed on the organic layer. The dam portion has a height equal to or lower than the height of the upper surface of the protrusion.

[0015] According to another aspect of this disclosure, a display device includes: a planarization layer disposed above a substrate; a protrusion disposed on the planarization layer and protruding to correspond to a light-emitting area; an anode disposed on a portion of an upper surface of the planarization layer and on an upper surface and a side surface of the protrusion; a dam configured to cover the anode except for the upper surface of the protrusion; an organic layer disposed on the anode exposed by the dam; and a cathode disposed on the organic layer. The dam has a height equal to or lower than the height of the upper surface of the protrusion.

[0016] Further details of the exemplary embodiments are included in the detailed description and accompanying drawings.

[0017] According to this disclosure, the height of the light-emitting unit is formed to be the same as the height of the embankment, and the light path is ensured by removing the tapered portion of the embankment to achieve a wide viewing angle.

[0018] According to this disclosure, as the height of the embankment decreases, the thickness of the product decreases.

[0019] According to this disclosure, the increased resistance and open circuit of the cathode caused by the tapered portion of the embankment are improved, thereby achieving low power and increasing output. At low power, greenhouse gas emissions can be reduced by decreasing the use of fossil fuels for power generation, thus achieving ESG (Environment / Social / Governance).

[0020] When this disclosure is applied to color-on-encapsulation (COE) technology, the thickness of the organic encapsulation layer is reduced by decreasing the height of the embankment and thus mitigating the step size of the light-emitting unit. This reduces the amount of organic material required to form the organic encapsulation layer, thereby saving costs. Furthermore, due to the reduced thickness of the organic encapsulation layer, viewing angle brightness is improved even when using a COE structure with the same margin.

[0021] According to this disclosure, the above-mentioned effects can be achieved without adding masks and processes.

[0022] Further details of the exemplary embodiments are included in the detailed description and accompanying drawings. Attached Figure Description

[0023] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0024] Figure 1 This is a diagram schematically illustrating the configuration of a display device according to exemplary embodiments of the present disclosure;

[0025] Figure 2 It is shown schematically. Figure 1 A floor plan of the display panel;

[0026] Figure 3 This is a perspective view showing the structure of the touch panel embedded in the display panel;

[0027] Figure 4 This is a diagram illustrating the pixel structure in a display panel according to a first exemplary embodiment of the present disclosure;

[0028] Figure 5 It is along Figure 4 A sectional view taken by line A-A';

[0029] Figure 6This is a diagram showing the pixel structure in the display panel of the comparative example;

[0030] Figure 7 This is a diagram illustrating the pixel structure in a display panel according to a second exemplary embodiment of the present disclosure;

[0031] Figure 8 It is along Figure 7 A sectional view taken by line B-B';

[0032] Figure 9 This is a diagram showing a cross-sectional structure in a display panel according to a third exemplary embodiment of the present disclosure;

[0033] Figure 10 It is magnification Figure 9 The diagram of part C;

[0034] Figure 11 This is a view showing a portion of a cross-section of the display panel of the comparative example;

[0035] Figures 12A to 12F It is shown in sequence. Figure 9 A cross-sectional view of a part of the manufacturing process of the display panel;

[0036] Figure 13 This is a diagram illustrating a cross-sectional structure in a display panel according to a fourth exemplary embodiment of the present disclosure; and

[0037] Figure 14 This is a diagram showing a cross-sectional structure in a display panel according to a fifth exemplary embodiment of the present disclosure. Detailed Implementation

[0038] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the exemplary embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0039] The shapes, sizes, dimensions (e.g., length, width, height, thickness, radius, diameter, area, etc.), ratios, angles, quantities, etc. of the elements shown in the accompanying drawings used to describe embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto.

[0040] For ease of description, dimensions including the size and thickness of the various components shown in the accompanying drawings are shown, and this disclosure is not limited to the size and thickness of the components shown, but it should be noted that the relative dimensions of the relative size, position and thickness of the components shown in the various accompanying drawings submitted herein are part of this disclosure.

[0041] Throughout this specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0042] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0043] When using terms such as “above,” “over,” “below,” and “beside” to describe the positional relationship between two parts, one or more parts may be located between the two parts, unless these terms are used with the terms “immediately adjacent” or “directly.”

[0044] When an element or layer is placed "on" another element or layer, the other layer or element can be directly inserted on or between the other element.

[0045] As used herein, the term "connection" is intended to have the broadest possible meaning. Specifically, the phrase "A connected to B" includes both direct connection (where no intermediate parts or elements exist) and indirect connection (where one or more intermediate parts or elements exist between A and B). In other words, "A connected to B" includes both direct physical or electrical bonding and indirect bonding via one or more intermediate parts. Unless otherwise explicitly stated, these terms do not require direct physical or electrical contact. The terms "bonding" and "contact" should be interpreted in the same manner.

[0046] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from others. Therefore, the first component referred to below may be the second component in the technical concept of this disclosure.

[0047] The features of the various embodiments of this disclosure may be combined or integrated with each other in part or in whole, and may interact and operate in a variety of technical ways, and the embodiments may be performed independently or in association with each other.

[0048] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0049] Figure 1 This is a diagram schematically illustrating the configuration of a display device according to an exemplary embodiment of the present disclosure.

[0050] For example, Figure 1A schematic configuration of a display device in which a touch panel (TSP) is embedded, according to an exemplary embodiment of the present disclosure, is shown. However, the present disclosure is not limited thereto, and the display device according to an exemplary embodiment of the present disclosure may not include a touch panel.

[0051] Reference Figure 1 The display device according to an exemplary embodiment of the present disclosure can provide both a function for displaying images and a function for sensing touch.

[0052] To provide image display functionality, a display device according to exemplary embodiments of the present disclosure may include a display panel (DISP), a gate drive circuit (GDC), a data drive circuit (DDC), and a timing controller (TC).

[0053] For example, in a display panel DISP, multiple data lines and multiple gate lines are provided, and multiple sub-pixels defined by the multiple data lines and multiple gate lines can be provided.

[0054] The data drive circuit DDC drives multiple data lines, the gate drive circuit GDC drives multiple gate lines, and the timing controller TC can control the operation of the data drive circuit DDC and the gate drive circuit GDC.

[0055] Each of the data driver circuit (DDC), gate driver circuit (GDC), and timing controller (TC) can be implemented by one or more separate components. In some cases, two or more of the data driver circuit (DDC), gate driver circuit (GDC), and timing controller (TC) can be integrated into a single component. For example, the data driver circuit (DDC) and timing controller (TC) can be implemented as a single integrated chip (IC chip).

[0056] To provide touch sensing functionality, a display device according to exemplary embodiments of the present disclosure may include a touch panel (TSP) and a touch sensing circuit (TSC). The touch panel (TSP) includes a plurality of touch electrodes. The touch sensing circuit (TSC) supplies touch drive signals to the touch panel (TSP) and detects touch sensing signals from the touch panel (TSP) to sense the presence or absence of a user's touch or the touch position (touch coordinates) in the touch panel (TSP) based on the detected touch sensing signals.

[0057] For example, a touch sensing circuit (TSC) may include a touch driving circuit (TDC) and a touch controller (TCTR). The touch driving circuit (TDC) supplies touch driving signals to the touch panel (TSP) and detects touch sensing signals from the touch panel (TSP). The touch controller (TCTR) senses the presence or absence of a user's touch and / or the touch location on the touch panel (TSP) based on the touch sensing signals detected by the touch driving circuit (TDC). The touch driving circuit (TDC) may include a first circuit section that supplies touch driving signals to the touch panel (TSP) and a second circuit section that detects touch sensing signals from the touch panel (TSP).

[0058] For example, the touch driver circuit TDC and the touch controller TCTR can be implemented by separate components, or in some cases, they can be integrated into a single component.

[0059] For example, each of the data drive circuit (DDC), gate drive circuit (GDC), and touch drive circuit (TDC) can be implemented by one or more integrated circuits. From the viewpoint of electrical connection with the display panel (DISP), the circuit can be implemented as a chip-on-glass (COG), chip-on-film (COF), or tape-carrier package (TCP) type. Furthermore, the gate drive circuit (GDC) can also be implemented as a gate-in-panel (GIP) type.

[0060] For example, each of the circuit configurations DDC, GDC, and TC for display driving and the circuit configurations TDC and TCTR for touch sensing can be implemented by one or more separate components. In some cases, one or more of the circuit configurations DDC, GDC, and TC for display driving and one or more of the circuit configurations TDC and TCTR for touch sensing are functionally integrated as implementations of one or more components.

[0061] For example, the data driver circuit (DDC) and the touch driver circuit (TDC) can be implemented as integrated into one or more integrated circuit chips. When the data driver circuit (DDC) and the touch driver circuit (TDC) are implemented as integrated into two or more integrated circuit chips, each of the two or more integrated circuit chips can have both data driving and touch driving functions.

[0062] On the other hand, the display device according to the exemplary embodiments of this disclosure can be of various types, such as a light-emitting display device or a liquid crystal display device. Hereinafter, for ease of description, a light-emitting display device will be described as an example of a display device. That is, even though the display panel DISP can be of various types such as a light-emitting display panel or a liquid crystal display panel, in the following description, for ease of description, a light-emitting display panel will be described as an example of a display panel DISP.

[0063] In addition, as will be described below, the touch panel TSP may include: a plurality of touch electrodes to which touch driving signals are applied or touch sensing signals are detected; and a plurality of touch wirings connecting the plurality of touch electrodes to the touch driving circuit TDC.

[0064] The touch panel TSP can be located outside the display panel DISP. For example, the touch panel TSP and the display panel DISP can be manufactured separately and then combined. This type of touch panel TSP is called an external type or an attached type.

[0065] Conversely, the touch panel TSP can be embedded in the display panel DISP. For example, when manufacturing the display panel DISP, the touch sensor structure (e.g., multiple touch electrodes and multiple touch wirings) constituting the touch panel TSP can be formed together with multiple electrodes and signal lines used for display driving.

[0066] Furthermore, the touch panel TSP can be formed directly above the encapsulation unit of the display panel DISP. For example, the touch insulating film and touch electrodes are patterned above the encapsulation unit and connected to signal lines formed as electrodes for driving the display. In the following description, for ease of explanation, an example of the touch panel TSP being formed directly above the encapsulation unit will be described.

[0067] Figure 2 It is shown schematically. Figure 1 A floor plan of the display panel.

[0068] Reference Figure 2 The display panel DISP may include an active region AA in which an image is displayed and a non-active region NA that is the outer region of the active region AA as the outer boundary line BL.

[0069] In the active area AA of the display panel DISP, multiple sub-pixels SP are provided for displaying images, and various electrodes or signal lines for display driving are provided.

[0070] Furthermore, the active area AA of the display panel DISP can be equipped with multiple touch electrodes for touch sensing and multiple touch wires electrically connected to the multiple touch electrodes. Therefore, the active area AA can also be referred to as a touch sensing area capable of sensing touch.

[0071] In the non-active area NA of the display panel DISP, there may be link lines extending from or electrically connected to various signal lines in the active area AA, as well as pads electrically connected to the link lines. The pads in the non-active area NA may be coupled to or electrically connected to the display driver circuit.

[0072] Furthermore, in the non-active area NA of the display panel DISP, there may be connecting lines extending from or electrically connected to multiple touch wirings provided in the active area AA, as well as pads electrically connected to the connecting lines. The pads provided in the non-active area NA may be coupled to or electrically connected to the touch driving circuitry.

[0073] In the non-active region NA, a portion of the outermost touch electrode among the multiple touch electrodes disposed in the active region AA extends, or may be further provided with one or more electrodes (touch electrodes) formed of the same material as the multiple touch electrodes disposed in the active region AA.

[0074] For example, all of the multiple touch electrodes disposed in the display panel DISP can exist in the active area AA, or a portion of the multiple touch electrodes disposed in the display panel DISP (e.g., the outermost touch electrode) can exist in the non-active area NA. A portion of the multiple touch electrodes disposed in the display panel DISP (e.g., the outermost touch electrode) can exist in both the active area AA and the non-active area NA.

[0075] Reference Figure 2 The display panel DISP according to an exemplary embodiment of the present disclosure may include a dam region DA having a dam for suppressing any layer (e.g., a packaging unit in the display panel) in the active region AA from extending beyond the display panel DISP.

[0076] The dam region DA can be located at the boundary between the active region AA and the non-active region NA, or at any location in the non-active region NA, which is an outer region of the active region AA.

[0077] A dam set in the dam region DA can be set to surround all directions of the active region AA, or it can be set only outside one or more parts of the active region AA.

[0078] A dam set in the dam area DA can have one connected pattern or two or more separate patterns. In addition, a dam area DA can have only one primary dam, or two dams (a primary dam and a secondary dam), or even three or more dams.

[0079] For example, in the dam area DA, only a primary dam is set up in one direction, while in the other direction, both a primary dam and a secondary dam can be set up.

[0080] Figure 3 This is a perspective view showing the structure of the touch panel embedded in the display panel.

[0081] Figure 3 This is a perspective view showing a structure in which a touch panel is embedded in a display panel according to an exemplary embodiment of the present disclosure.

[0082] Reference Figure 3 For example, in the display panel ( Figure 2 In the active region AA of the DISP, multiple sub-pixels SP can be disposed above the substrate 110.

[0083] Each sub-pixel SP may include: a light-emitting diode 120; a first transistor T1 for driving the light-emitting diode 120; a second transistor T2 for transmitting a data voltage VDATA to a first node N1 of the first transistor T1; and a storage capacitor Cst for maintaining a constant voltage within a frame.

[0084] For example, the first transistor T1 may include a first node N1 to which a data voltage VDATA is applied, a second node N2 electrically connected to the light-emitting diode 120, and a third node N3 to which a drive voltage VDD is applied from the drive voltage line DVL. The first node N1 may be a gate node, the second node N2 may be a source node or a drain node, and the third node N3 may be a drain node or a source node. The first transistor T1 may also be referred to as the driving transistor for driving the light-emitting diode 120.

[0085] The light-emitting diode 120 may include a first electrode (e.g., an anode), a light-emitting layer, and a second electrode (e.g., a cathode). The first electrode is electrically connected to a second node N2 of the first transistor T1, and the second electrode may be subjected to a base voltage VSS.

[0086] The light-emitting layer in the light-emitting diode 120 can be made of organic or inorganic materials.

[0087] For example, the second transistor T2 is controlled to be turned on or off by a scan signal SCAN applied through the gate line GL, and can be electrically connected between the first node N1 of the first transistor T1 and the data line DL. Furthermore, the second transistor T2 can be referred to as a switching transistor.

[0088] For example, when the second transistor T2 is turned on by the scan signal SCAN, the second transistor T2 can transmit the data voltage VDATA supplied from the data line DL to the first node N1 of the first transistor T1.

[0089] In addition, the storage capacitor Cst can be electrically connected between the first node N1 and the second node N2 of the first transistor T1.

[0090] like Figure 3 As shown, each sub-pixel SP can have a 2T1C structure including two transistors T1 and T2 and a capacitor Cst, and in some cases, it can further include one or more transistors or one or more capacitors.

[0091] The first transistor T1 and the second transistor T2 can be composed of n-type transistors or p-type transistors. As described above, the display panel DISP can include circuit elements such as a light-emitting diode 120, two or more transistors T1 and T2, and one or more capacitors Cst. Since the circuit elements (specifically, the light-emitting diode 120) are susceptible to external moisture or oxygen, a packaging unit 140 can be provided on the display panel DISP to prevent external moisture or oxygen from penetrating into the circuit elements.

[0092] The packaging unit 140 can be formed by one layer or by multiple layers.

[0093] On the other hand, in the display device according to an exemplary embodiment of the present disclosure, the touch panel TSP may be disposed above the packaging unit 140. For example, in the display device according to an exemplary embodiment of the present disclosure, a touch sensor structure (e.g., a plurality of touch electrodes TE configuring the touch panel TSP) may be disposed above the packaging unit 140.

[0094] Furthermore, the display device according to an exemplary embodiment of the present disclosure can sense touch based on the capacitance formed in the touch electrode TE.

[0095] The display device according to an exemplary embodiment of the present disclosure employs a capacitance-based touch sensing method, thereby sensing touch through a mutual capacitance-based touch sensing method or a self-capacitance-based touch sensing method.

[0096] For example, based on the mutual capacitance-based touch sensing method, multiple touch electrodes TE can be classified into driving touch electrodes (transmitting touch electrodes) that are subjected to touch driving signals and sensing touch electrodes (receiving touch electrodes) that detect touch sensing signals and form capacitance with the driving touch electrodes.

[0097] In the case of touch sensing based on mutual capacitance, the touch sensing circuit senses the presence or absence of a touch and / or the touch coordinates based on the change in capacitance (mutual capacitance) between the driving touch electrode and the sensing touch electrode, which depends on the presence or absence of a pointer such as a finger or pen.

[0098] In a self-capacitance-based touch sensing method, each touch electrode TE can function as both a driving touch electrode and a sensing touch electrode. For example, a touch sensing circuit applies a touch driving signal to one or more touch electrodes TE and detects the touch sensing signal through the touch electrode TE to which the touch driving signal is applied. Based on the detected touch sensing signal, the touch sensing circuit identifies changes in capacitance between a pointer such as a finger or pen and the touch electrode TE to sense the presence or absence of a touch and / or touch coordinates. In a self-capacitance-based touch sensing method, there is no distinction between driving and sensing touch electrodes.

[0099] As described above, the display device according to exemplary embodiments of the present disclosure can sense touch using a touch sensing method based on mutual capacitance or a touch sensing method based on self-capacitance. However, in the following description, for ease of description, a display device performing touch sensing based on mutual capacitance and including a touch sensor structure for it will be described as an example.

[0100] The configuration of subpixels will be described in detail below with reference to the accompanying drawings.

[0101] Figure 4 This is a diagram illustrating the pixel structure in a display panel according to a first exemplary embodiment of the present disclosure.

[0102] Figure 5 It is along Figure 4 A sectional view taken by line A-A'.

[0103] Figure 6 This is a diagram showing the pixel structure in the display panel of a comparative example.

[0104] Figure 4 A portion of a display panel with three sub-pixels SP1, SP2, and SP3 is shown as an example, and a second planarization layer 116 and a embankment 117 defining the protruding area PA and the luminous area EA are shown as examples.

[0105] Figure 5 A portion of a cross-section of a second sub-pixel SP2 of a display panel according to a first exemplary embodiment of the present disclosure is shown.

[0106] Furthermore, despite Figure 5For ease of description, the components above the LED 120 are not shown, but this disclosure is not limited thereto, and may include the packaging unit, touch sensor layer and / or color filter layer and black matrix above the LED 120.

[0107] Figure 6 The pixel structure of the display panel of the comparative example is shown, wherein the second planarization layer 16 has no protrusions, such that the upper surface has a embankment 17 and a step.

[0108] Reference Figure 4 The display panel according to the first exemplary embodiment of the present disclosure may include a pixel area provided with a plurality of sub-pixels SP1, SP2 and SP3 and a wiring area provided with various signal lines.

[0109] A pixel region can have multiple first sub-pixels SP1, multiple second sub-pixels SP2, and multiple third sub-pixels SP3.

[0110] For example, the first sub-pixel SP1 could be a red sub-pixel.

[0111] For example, the second sub-pixel SP2 could be a green sub-pixel.

[0112] For example, the third sub-pixel SP3 could be a blue sub-pixel.

[0113] For example, the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can have polygonal shapes, such as rectangular shapes, but are not limited to them, and can have various shapes, such as circles or ellipses.

[0114] At this time, the shapes of sub-pixels SP1, SP2 and SP3 can be defined by the shape of the third region of anode 121, but are not limited thereto.

[0115] exist Figure 4 The image shows a pixel formed by a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3, but it is not limited to this. A fourth white sub-pixel can be added to a pixel.

[0116] According to the first exemplary embodiment, the second planarization layer 116 has a protrusion 116b such that there is no step between the upper surface of the protrusion 116b of the second planarization layer 116 and the upper surface of the embankment 117, and it is substantially flat. The upper surface of the protrusion 116b of the second planarization layer 116 may correspond to the third region 121c of the anode 121.

[0117] However, this disclosure is not limited thereto; considering process margins or errors, the protrusion 116b of the second planarization layer 116 may protrude further than the upper surface of the embankment 117. Conversely, according to... Figure 6 In a comparative example, it should be understood that the second planarization layer 16 does not have a protrusion, resulting in a step between the upper surface of the second planarization layer 16 (i.e., the upper surface of the anode 21) and the upper surface of the embankment 17. In this case, the optical path is partially blocked by the embankment 17, and the embankment 17 has a steep tapered portion, causing the cathode and organic layer to be formed on the side surface of the embankment 17 with a relatively thin thickness, which leads to an increase in the resistance of the cathode and an open circuit.

[0118] As described above, according to this disclosure, the height of the light-emitting unit is formed to be substantially equal to the height of the embankment 117, thereby eliminating the tapered portion of the embankment 117, thus ensuring the optical path and achieving a wide viewing angle. Furthermore, the increased resistance and improved open circuitry of the cathode 123 achieve low power consumption and increased throughput.

[0119] Reference Figure 5 The driving transistor Td, the switching transistor Ts, and the light-emitting diode 120 can be disposed above the substrates 110a, 110b, and 110c. However, this disclosure is not limited to... Figure 5 The arrangement of the driving transistor Td and the switching transistor Ts.

[0120] For example, substrates 110a, 110b, and 110c may include a first substrate 110a, a second substrate 110b, and an interlayer insulating film 110c. The interlayer insulating film 110c may be disposed between the first substrate 110a and the second substrate 110b. However, this disclosure is not limited thereto, and a single-layer substrate may be used.

[0121] As described above, substrates 110a, 110b, and 110c are composed of a first substrate 110a, a second substrate 110b, and an interlayer insulating film 110c to suppress moisture penetration. For example, the first substrate 110a and the second substrate 110b can be polyimide (PI) substrates, but are not limited thereto. Furthermore, substrates 110a, 110b, and 110c can be made of flexible materials to become flexible substrates. Thus, foldable or bendable foldable display panels can be manufactured.

[0122] Multiple transistors, such as driving transistor Td or switching transistor Ts, may be disposed above substrates 110a, 110b and 110c.

[0123] A multi-buffer layer 111a is disposed on the second substrate 110b, and an active buffer layer 111b may be disposed on the multi-buffer layer 111a.

[0124] On the other hand, the first light-shielding layer 135a may be disposed above the second substrate 110b. However, this disclosure is not limited thereto, and the first light-shielding layer 135a may be disposed on the multiple buffer layer 111a. Furthermore, in some cases, the first light-shielding layer 135a may be omitted.

[0125] The first light-shielding layer 135a can be used as a light-shielding part.

[0126] The multiple buffer layer 111a can be disposed on the first light-shielding layer 135a.

[0127] An active buffer layer 111b can be placed above a multi-buffer layer 111a.

[0128] The first active layer 134a of the driving transistor Td can be disposed above the active buffer layer 111b.

[0129] The first gate insulating film 112a can be disposed on the first active layer 134a.

[0130] In addition, the first gate 131a of the driving transistor Td can be disposed on the first gate insulating film 112a.

[0131] Furthermore, for example, the gate material layer 136a may be disposed on the first gate insulating film 112a at a location different from the formation location of the driving transistor Td. For example, the gate material layer 136a may be the first storage electrode, but is not limited thereto.

[0132] The first interlayer insulating film 113a can be disposed on the first gate 131a.

[0133] The metal layer 136b can be disposed on the first interlayer insulating film 113a. For example, the metal layer 136b can be a second storage electrode, but is not limited thereto.

[0134] In this case, the metal layer 136b can form a storage capacitor together with the gate material layer 136a, but is not limited thereto.

[0135] Furthermore, for example, the second light-shielding layer 135b may be disposed on the first interlayer insulating film 113a at a location different from the formation location of the metal layer 136b.

[0136] The buffer layer 111c can be disposed on the metal layer 136b and the second light-shielding layer 135b.

[0137] The second active layer 134b of the switching transistor Ts can be disposed on the buffer layer 111c.

[0138] The second gate insulating film 112b can be disposed on the second active layer 134b.

[0139] Furthermore, the second gate 131b of the switching transistor Ts can be disposed on the second gate insulating film 112b.

[0140] The second interlayer insulating film 113b can be disposed on the second gate 131b.

[0141] The first source 132a and the first drain 133a of the driving transistor Td can be disposed on the second interlayer insulating film 113b. Furthermore, the second source 132b and the second drain 133b of the switching transistor Ts can be disposed on the second interlayer insulating film 113b.

[0142] At this time, for example, the first source 132a and the first drain 133a can be electrically connected to one side and the other side of the first active layer 134a through contact holes provided in the second interlayer insulating film 113b, the second gate insulating film 112b, the buffer layer 111c, the first interlayer insulating film 113a and the first gate insulating film 112a.

[0143] In addition, for example, a portion of the first drain 133a can be electrically connected to one side of the first light-shielding layer 135a through contact holes provided in the second interlayer insulating film 113b, the second gate insulating film 112b, the buffer layer 111c, the first interlayer insulating film 113a, the first gate insulating film 112a, the active buffer layer 111b, and the multiple buffer layer 111a.

[0144] Furthermore, for example, the second source 132b and the second drain 133b can be electrically connected to one side and the other side of the second active layer 134b through contact holes respectively provided in the second interlayer insulating film 113b and the second gate insulating film 112b.

[0145] The portion of the first active layer 134a that overlaps with the first gate 131a is a channel region. For example, one of the first source 132a and the first drain 133a is connected to one side of the channel region in the first active layer 134a, and the other can be connected to the other side of the channel region in the first active layer 134a.

[0146] Furthermore, the portion of the second active layer 134b that overlaps with the second gate 131b is a channel region. For example, one of the second source 132b and the second drain 133b is connected to one side of the channel region in the second active layer 134b, and the other can be connected to the other side of the channel region in the second active layer 134b.

[0147] Although not shown, protective films can be provided on the first source 132a, the first drain 133a, the second source 132b, and the second drain 133b.

[0148] Planarization layers 115 and 116 may be disposed above the first source 132a and the first drain 133a, as well as the second source 132b and the second drain 133b. For example, planarization layers 115 and 116 may include a first planarization layer 115 and a second planarization layer 116.

[0149] The first planarization layer 115 can be disposed on the protective film.

[0150] The connecting electrode 125 can be disposed on the first planarization layer 115.

[0151] For example, the connecting electrode 125 can be electrically connected to one of the first source 132a and the first drain 133a through a contact hole provided in the first planarization layer 115.

[0152] The second planarization layer 116 can be disposed on the connecting electrode 125.

[0153] The second planarization layer 116 may be composed of an organic material such as an acrylic resin or an epoxy resin, and may be, for example, composed of photopolymer propylene (PAC). For ease of description, the second planarization layer 116 may be referred to as a planarization layer.

[0154] For example, the second planarization layer 116 may include a bottom layer 116a disposed on the first planarization layer 115 in the entirety of the light-emitting region EA and the non-light-emitting region NEA, and a protrusion 116b disposed on the bottom layer 116a and protruding corresponding to the light-emitting region EA of the sub-pixel.

[0155] Reference Figure 4 In a planar drawing, the luminous area EA or the prominent area PA can have a generally (or overall) polygonal shape, such as a rectangle. However, it is not limited to this and can have various shapes, such as circles or ellipses.

[0156] The protrusion 116b may have an upper surface and a side surface.

[0157] The upper surface of the protrusion 116b is the surface located at the top of the second planarization layer 116 and is substantially parallel to the second substrate 110b. The upper surface of the protrusion 116b may correspond to the protruding region PA.

[0158] The side surface of the protrusion 116b can extend from the upper surface of the protrusion 116b. For example, the side surface of the protrusion 116b may have a tapered portion at a predetermined angle. Figure 5 The illustration shows an example of a protrusion 116b with a straight shape where the upper and side surfaces intersect to form a vertex, but the present disclosure is not limited thereto, and the side surface of the protrusion 116b may have a gentle curve.

[0159] In the plan view, the upper surface of the protrusion 116b may have a generally (or entirely) polygonal shape, such as a rectangle, that is substantially the same as the protruding region PA. However, as stated above, this disclosure is not limited to this and may have various shapes, such as circles or ellipses.

[0160] For example, the anode 121 may be disposed on a portion of the upper surface of the bottom layer 116a of the second planarization layer 116, as well as on the upper and side surfaces of the protrusion 116b. For example, the anode 121 may be disposed in the protruding region PA, the side surface of the protrusion 116b, and a portion of the upper surface of the bottom layer 116a. Furthermore, for example, the anode 121 disposed in the protruding region PA may be in contact with the upper surface of the protrusion 116b of the second planarization layer 116.

[0161] For example, the anode 121 may include a first region 121a and a second region 121b. The first region 121a is disposed on a portion of the upper surface of the bottom layer 116a of the second planarization layer 116 and has a surface substantially parallel to the surface of the second substrate 110b. The second region 121b extends from the first region 121a and has a surface at a predetermined angle relative to the second substrate 110b. The second region 121b of the anode 121 may correspond to the side surface of the protrusion 116b. Therefore, the second region 121b of the anode 121 may be referred to as the side surface of the anode 121.

[0162] The anode 121 may include a third region 121c, which extends from the second region 121b and has a surface substantially parallel to the surface of the second substrate 110b. The third region 121c may correspond to the upper surface of the protrusion 116b. Furthermore, the third region 121c of the anode 121 may correspond to the protruding region PA.

[0163] As described above, in a sub-pixel, the second planarization layer 116 may include at least one contact hole spaced apart from the protruding region PA, and the driving transistor Td is electrically connected to the anode 121 through the contact hole. For example, the driving transistor Td and the first region 121a of the anode 121 may be electrically connected through the contact hole.

[0164] The embankment 117 can be set to cover both the first region 121a and the second region 121b of the anode 121 at the same time.

[0165] The embankment 117 may cover the first region 121a and the second region 121b of the anode 121. Conversely, the embankment 117 may expose the third region 121c of the anode 121. For example, the embankment 117 may have a height equal to or lower than the height of the protrusion 116b of the second planarization layer 116. In this case, height may refer to the height from the first substrate 110a to the upper surface of the embankment 117 or the protrusion 116b of the second planarization layer 116.

[0166] Therefore, in the first exemplary embodiment of this disclosure, the tapered portion of the embankment 117 can be substantially removed. The step is substantially removed between the upper surface of the embankment 117 and the upper surface of the protrusion 116b of the second planarization layer 116, thereby removing the tapered portion of the embankment 117. That is, the upper surface of the embankment 117 and the upper surface of the protrusion 116b of the second planarization layer 116 can form a substantially flat surface.

[0167] The portion of the embankment 117 corresponding to the light-emitting area EA of the sub-pixel can be open.

[0168] For example, the portion of the (open) embankment 117 corresponding to the light-emitting region EA of each sub-pixel can be removed. In this case, the width and area of ​​the light-emitting region EA are greater than the width and area of ​​the protruding region PA, that is, the width and area of ​​the upper surface of the protrusion 116b of the planarization layer 116. Furthermore, for example, in a planar view, the light-emitting region EA can have a polygonal shape, such as a rectangle, but is not limited thereto. The light-emitting region EA of this disclosure can have various shapes, such as circular or elliptical.

[0169] The luminescent image formed by the luminescent region EA can have a shape corresponding to the shape of the luminescent region EA. In this case, when the shape of any component corresponds to the shape of another component, it means that the shape of the arbitrary component has the same shape as the other component, or has the same shape but different dimensions, or the shape of the arbitrary component is formed by transferring the shape of the other component by any method. Therefore, it should be understood that the shape of the luminescent image formed by the luminescent region EA is essentially the shape of the luminescent region EA transmitted by light emitted from the organic layer 122 located in the luminescent region EA. According to this disclosure, as the tapered portion of the embankment 117 is removed, the size of the luminescent image can be larger than the shape of the luminescent region EA.

[0170] Next, the embankment 117 may include an upper surface, a side surface, and a bottom surface.

[0171] For example, the upper surface of the embankment 117 may be the surface located at the top of the embankment 117 and substantially parallel to the second substrate 110b. In addition, the upper surface of the embankment 117 may be substantially parallel to the upper surface of the protrusion 116b of the second planarization layer 116.

[0172] Furthermore, the upper surface of the embankment 117 may correspond to the non-luminescent region NEA.

[0173] The side surface of the embankment 117 may be a surface extending from the upper surface of the embankment 117 to the side surface. The side surface of the embankment 117 may have a predetermined cone angle. The side surface of the embankment 117 may correspond to the side surface of the protrusion 116b of the second planarization layer 116.

[0174] Furthermore, for example, the bottom surface of the embankment 117 may correspond to the surface adjacent to the anode 121 in the first region 121a of the anode 121.

[0175] The side and bottom surfaces of the embankment 117 can correspond to the non-luminescent region NEA.

[0176] The width and area of ​​the protruding region PA in the protrusion 116b of the second planarization layer 116 can be smaller than the width and area of ​​the light-emitting region EA defined by the embankment 117. Therefore, the protruding region PA can be located in the light-emitting region EA.

[0177] For example, the third region 121c of the anode 121 can be exposed by the luminescent region EA.

[0178] The dam 117 can be formed from a PI-based material, but is not limited to this. Furthermore, the dam 117 can be formed from a black material. For example, the dam 117 can be configured such that black pigment is dispersed in an organic material, but is not limited to this, and the dam can be composed of any black material as long as it is black. Furthermore, the organic material can be, for example, a carbon-based polymer or a polymer containing epoxy acrylate, but is not limited to this. Because the dam 117 contains a black material, the reflection of external light can be reduced, especially the irregular reflections caused when the dam 117 is formed from a transparent material.

[0179] Furthermore, the dam 117 can be composed of multiple layers. For example, the first dam layer is formed of a black material, and the second dam layer disposed above it can be formed of a transparent material. Additionally, the second dam layer may include spacers (not shown). The spacers can be used to suppress damage to structures disposed on substrates 110a, 110b, and 110c caused when the mask used during the deposition of organic layer 122 comes into contact with substrates 110a, 110b, and 110c. When the second dam layer includes spacers, the height of the spacers in the non-light-emitting region NEA is higher than the height of the protrusion 116b of the second planarization layer 116 in the light-emitting region EA, but is not limited thereto.

[0180] The inner surface of the embankment 117 may have a polygonal shape (e.g., a rectangle), substantially similar to the edge of the luminous region EA, but is not limited thereto. For example, the inner surface of the embankment 117 of this disclosure may have various shapes, such as circular or elliptical.

[0181] For example, the organic layer 122 can be disposed on the upper surface of the third region 121c of the embankment 117 and the anode 121. At this time, in Figure 5 As an example, an organic layer 122 is shown disposed on the light-emitting region EA and the non-light-emitting region NEA, but this disclosure is not limited thereto. Therefore, the organic layer 122 may be disposed only in the light-emitting region EA, or it may be disposed in a portion of the light-emitting region EA and the non-light-emitting region NEA.

[0182] The cathode 123 is disposed on the organic layer 122.

[0183] The light-emitting diode 120 can be composed of an anode 121, an organic layer 122, and a cathode 123. The portion of the light-emitting diode 120 corresponding to the third region 121c of the anode 121 that actually emits light can be referred to as a light-emitting unit.

[0184] The light-emitting area EA can be formed by a light-emitting diode 120 disposed in the light-emitting unit.

[0185] The packaging unit can be positioned above the aforementioned light-emitting diode 120.

[0186] The encapsulation layer can have a single-layer structure or a multi-layer structure. For example, an encapsulation unit may include a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer.

[0187] The touch sensor layer can be positioned above the aforementioned packaging unit.

[0188] As described above, according to the first exemplary embodiment of this disclosure, the height of the light-emitting unit is formed to be substantially equal to the height of the embankment 117, thereby eliminating the tapered portion of the embankment 117 and achieving a wide viewing angle by ensuring the light path. Furthermore, due to the reduced height of the embankment 117, the thickness of the product is reduced. Reference will be made below. Figure 10 Describe a detailed description of this point.

[0189] Furthermore, according to the first exemplary embodiment of this disclosure, the increased resistance and improved open circuit of the cathode 123 due to the tapered portion of the embankment 117 achieve low power and increased output. In the case of low power, greenhouse gas emissions can be reduced by decreasing the use of fossil fuels for power generation, thereby achieving ESG (Environmental, Social, and Governance).

[0190] On the other hand, according to this disclosure, considering process margins or errors, the protrusion 116b of the second planarization layer 116 further protrudes beyond the upper surface of the embankment 117, as referenced Figure 7 and Figure 8 This will be described in more detail.

[0191] Figure 7 This is a diagram illustrating the pixel structure of a display panel according to a second exemplary embodiment of the present disclosure.

[0192] Figure 8 It is along Figure 7 The sectional view taken by line B-B'.

[0193] Figure 7 A portion of a display panel with three sub-pixels SP1, SP2, and SP3 is shown as an example, and a second planarization layer 116 and a embankment 217 defining the protruding area PA and the luminous area EA are shown as examples.

[0194] Figure 8 A portion of a cross-section of a second sub-pixel SP2 of a display panel according to a second exemplary embodiment of the present disclosure is shown.

[0195] Furthermore, despite Figure 8 For ease of description, the components above the LED 120 are not shown, but this disclosure is not limited thereto, and may include the packaging unit, touch sensor layer and / or color filter layer and black matrix above the LED 120.

[0196] Except for the protrusion 116b of the second planarization layer 116 protruding beyond the upper surface of the embankment 217, Figure 7 and Figure 8 The second exemplary embodiment is consistent with the above. Figures 4 to 6 The first exemplary embodiment is substantially the same, therefore redundant descriptions will be omitted. Here, the description of the same reference numerals can be found by referring to... Figures 1 to 6 .

[0197] Reference Figure 7 In the display panel according to the second exemplary embodiment of the present disclosure, a plurality of first sub-pixels SP1, a plurality of second sub-pixels SP2 and a plurality of third sub-pixels SP3 are provided in the pixel region.

[0198] For example, the first sub-pixel SP1 could be a red sub-pixel.

[0199] For example, the second sub-pixel SP2 could be a green sub-pixel.

[0200] For example, the third sub-pixel SP3 could be a blue sub-pixel.

[0201] For example, the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can have polygonal shapes, such as rectangular shapes, but are not limited to this; they can have various shapes, such as circular or elliptical shapes.

[0202] According to a second exemplary embodiment, the second planarization layer 116 has a protrusion 116b, and the embankment 217 has a height less than that of the protrusion 116b of the second planarization layer 116. This is due to process margins or errors, such that the end of the embankment 217 can be positioned above the tapered portion of the protrusion 116b of the second planarization layer 116. Therefore, the step between the upper surface of the protrusion 116b of the second planarization layer 116 and the upper surface of the embankment 217 can be mitigated. The upper surface of the protrusion 116b of the second planarization layer 116 can correspond to the third region 121c of the anode 121.

[0203] As described above, according to this disclosure, the height of the light-emitting unit is formed to be substantially equal to the height of the embankment 217, thereby eliminating the tapered portion of the embankment 217, thus ensuring the optical path and achieving a wide viewing angle. Furthermore, the increased resistance and improved open circuitry of the cathode 223 achieve low power consumption and increased yield.

[0204] Reference Figure 8 The driving transistor Td, the switching transistor Ts, and the light-emitting diode 220 can be disposed above the substrates 110a, 110b, and 110c. A description of the driving transistor Td and the switching transistor Ts can be found in the first exemplary embodiment of this disclosure described above.

[0205] The second planarization layer 116 can be disposed above the first planarization layer 115.

[0206] For example, the second planarization layer 116 may include a bottom layer 116a disposed on the first planarization layer 115 in the entirety of the light-emitting region EA and the non-light-emitting region NEA, and a protrusion 116b disposed on the bottom layer 116a and protruding in correspondence with the light-emitting region EA of the sub-pixel.

[0207] Reference Figure 7 In a planar drawing, the luminous area EA or the prominent area PA can have a generally (or overall) polygonal shape, such as a rectangle. However, it is not limited to this and can have various shapes, such as circles or ellipses.

[0208] The protrusion 116b may have an upper surface and a side surface.

[0209] The upper surface of the protrusion 116b is the surface located at the top of the second planarization layer 116 and is substantially parallel to the second substrate 110b. The upper surface of the protrusion 116b may correspond to the protruding region PA.

[0210] The side surface of the protrusion 116b can extend from the upper surface of the protrusion 116b.

[0211] In the plan view, the upper surface of the protrusion 116b may have a generally (or entirely) polygonal shape, such as a rectangle, that is substantially the same as the protruding region PA. However, as stated above, this disclosure is not limited to this and may have various shapes, such as circles or ellipses.

[0212] For example, the anode 121 may be disposed on a portion of the upper surface of the bottom layer 116a of the second planarization layer 116 and on the upper and side surfaces of the protrusion 116b.

[0213] For example, the anode 121 may include a first region 121a and a second region 121b. The first region 121a is disposed on a portion of the upper surface of the bottom layer 116a of the second planarization layer 116 and has a surface substantially parallel to the surface of the second substrate 110b. The second region 121b extends from the first region 121a and has a surface at a predetermined angle relative to the second substrate 110b. For example, the second region 121b of the anode 121 may correspond to the side surface of the protrusion 116b.

[0214] The anode 121 may include a third region 121c, which extends from the second region 121b and has a surface substantially parallel to the surface of the second substrate 110b. The third region 121c may correspond to the upper surface of the protrusion 116b. Furthermore, the third region 121c of the anode 121 may correspond to the protruding region PA.

[0215] The dam 217 can be provided simultaneously covering the first region 121a and the second region 121b of the anode 121. In this case, according to the second exemplary embodiment of the present disclosure, the end of the dam 217 can be positioned above the tapered portion of the protrusion 116b of the second planarization layer 116. Therefore, the dam 217 may not cover a portion of the second region 121b of the anode 121.

[0216] As described above, the embankment 217 according to the second exemplary embodiment of the present disclosure can expose a portion of the second region 121b and the third region 121c of the anode 121. For example, the height of the embankment 217 in the second exemplary embodiment of the present disclosure may be lower than the height of the protrusion 116b of the second planarization layer 116.

[0217] Therefore, in the second exemplary embodiment of this disclosure, the tapered portion of the embankment 217 can be substantially removed. Since the height of the embankment 217 is lower than the height of the protrusion 116b of the second planarization layer 116, the tapered portion of the embankment 217 can be removed.

[0218] The portion of the embankment 217 corresponding to the light-emitting region EA of the sub-pixel can be open. In this case, the width and area of ​​the light-emitting region EA can be increased compared to the first exemplary embodiment. Since the end of the embankment 217 is disposed above the tapered portion of the protrusion 116b of the second planarization layer 116, the width and area of ​​the light-emitting region EA can be increased.

[0219] The embankment 217 may include an upper surface, a side surface and a bottom surface.

[0220] For example, the upper surface of the embankment 217 is the uppermost surface of the embankment 217 and is substantially parallel to the second substrate 110b. Furthermore, the upper surface of the embankment 217 is substantially parallel to the upper surface of the protrusion 116b of the second planarization layer 116.

[0221] Furthermore, the upper surface of the embankment 217 may correspond to the non-luminescent region NEA.

[0222] The side surface of the embankment 217 may extend from the upper surface of the embankment 217.

[0223] Furthermore, for example, the bottom surface of the embankment 217 may correspond to the surface adjacent to the anode 121 in the first region 121a of the anode 121.

[0224] The side and bottom surfaces of the embankment 217 can correspond to the non-luminescent region NEA.

[0225] Furthermore, the dam 217 can be formed of a black material. For example, the dam 217 can be configured such that black pigment is dispersed in an organic material, but is not limited thereto, and the dam can be made of any black material as long as the dam is black. Furthermore, the organic material can be, for example, a carbon-based polymer or a polymer containing epoxy acrylate, but is not limited thereto. Because the dam 217 contains a black material, the reflection of external light can be reduced, especially the irregular reflections caused when the dam 217 is formed of a transparent material.

[0226] Furthermore, the dam 217 can be composed of multiple layers. For example, the first dam layer is formed of a black material, and the second dam layer disposed above it can be formed of a transparent material. Additionally, the second dam layer may include spacers (not shown). The spacers can be used to suppress damage to structures disposed on substrates 110a, 110b, and 110c caused when the mask used during the deposition of organic layer 122 comes into contact with substrates 110a, 110b, and 110c. When the second dam layer includes spacers, the height of the spacers in the non-light-emitting region NEA is higher than the height of the protrusion 116b of the second planarization layer 116 in the light-emitting region EA, but is not limited thereto.

[0227] The width and area of ​​the protruding region PA in the protrusion 116b of the second planarization layer 116 can be smaller than the width and area of ​​the light-emitting region EA defined by the embankment 217. Therefore, the protruding region PA can be located in the light-emitting region EA.

[0228] For example, a portion of the second region 121b and the third region 121c of the anode 121 can be exposed by the luminescent region EA.

[0229] For example, organic layer 222 may be disposed on the upper surface of the embankment 217, a portion of the second region 121b, and the third region 121c of the anode 121.

[0230] The cathode 223 can be disposed on the organic layer 222.

[0231] The light-emitting diode 220 can be composed of an anode 121, an organic layer 222, and a cathode 223.

[0232] The packaging unit can be positioned above the light-emitting diode 220.

[0233] The touch sensor layer can be positioned above the packaging unit.

[0234] On the other hand, this disclosure can be applied to color filter encapsulation (COE) technology, in which the color filter layer is disposed above the encapsulation unit when the upper surface of the light-emitting unit is flat with the upper surface of the embankment 217. (Refer to...) Figures 9 to 11 This will be described in detail.

[0235] Figure 9 This is a diagram showing a cross-sectional structure of a display panel according to a third exemplary embodiment of the present disclosure.

[0236] Figure 10 It is magnification Figure 9 The diagram for part C.

[0237] Figure 11 This is a diagram showing a portion of a cross-section of the display panel of the comparative example.

[0238] Figure 9 A portion of a cross-section of a subpixel of a display panel according to a third exemplary embodiment of the present disclosure is shown as an example.

[0239] Figure 10 Enlarged Figure 9 The light-emitting unit and its surrounding configuration. Furthermore, Figure 11 The configuration of the light-emitting unit and its surroundings in the comparative example was magnified. Furthermore, in Figure 10 and Figure 11 For convenience, the configuration of the second planarization layer 116 and below it has been omitted.

[0240] In addition to the COE technology that only applies the color filter layer 370 above the packaging unit 340, Figure 9 and Figure 10 The third exemplary embodiment of this disclosure is consistent with the above. Figure 7 and Figure 8 The second exemplary embodiment is substantially the same. However, other configurations are substantially the same, so redundant descriptions will be omitted. Here, the description of the same reference numerals can be found by referring to... Figures 1 to 8 .

[0241] Reference Figure 9 and Figure 10 A second planarization layer 116, including a protrusion 116b, may be disposed above the first planarization layer 115.

[0242] For example, the second planarization layer 116 may include a bottom layer 116a disposed on the first planarization layer 115 in the entirety of the light-emitting region EA and the non-light-emitting region NEA, and a protrusion 116b disposed on the bottom layer 116a and protruding corresponding to the light-emitting region EA of the sub-pixel.

[0243] exist Figure 9 The illustration shows an example where the upper and side surfaces of a protrusion 116b with a straight shape intersect to form a vertex, but this disclosure is not limited thereto, and as shown in the illustration... Figure 10 As shown, the side surface of the protrusion 116b can have a gentle curve. In this case, the portion where the upper surface and the side surface of the protrusion 116b intersect can maintain a curved shape. Furthermore, even if the embankment 217 has a lower height than the protrusion 116b of the second planarization layer 116, the organic layer 222 deposited thereon can be formed continuously without seams or breaks.

[0244] For example, the anode 121 may be disposed on a portion of the upper surface of the bottom layer 116a of the second planarization layer 116 and on the upper and side surfaces of the protrusion 116b.

[0245] For example, the anode 121 may include a first region 121a and a second region 121b. The first region 121a is disposed on a portion of the upper surface of the bottom layer 116a of the second planarization layer 116 and has a surface substantially parallel to the surface of the second substrate 110b. The second region 121b extends from the first region 121a and has a surface at a predetermined angle relative to the second substrate 110b. The anode 121 may include a third region 121c, which extends from the second region 121b and has a surface substantially parallel to the surface of the second substrate 110b.

[0246] The embankment 217 can be provided simultaneously covering the first region 121a and the second region 121b of the anode 121. In this case, according to the third exemplary embodiment of the present disclosure, the end of the embankment 217 can be positioned above the tapered portion of the protrusion 116b of the second planarization layer 116. In this case, the embankment 217 has a height lower than that of the protrusion 116b of the second planarization layer 116, but is not limited thereto, and the embankment 217 can have the same height as the protrusion 116b of the second planarization layer 116.

[0247] As described above, the embankment 217 according to the third exemplary embodiment of the present disclosure may expose a portion of the second region 121b and the third region 121c of the anode 121.

[0248] The portion of the embankment 217 corresponding to the light-emitting region EA of the sub-pixel can be open.

[0249] For example, a portion of the second region 121b and the third region 121c of the anode 121 can be exposed by the luminescent region EA.

[0250] For example, organic layer 222 may be disposed on the upper surface of the embankment 217, a portion of the second region 121b, and the third region 121c of the anode 121.

[0251] The cathode 223 can be disposed on the organic layer 222.

[0252] On the other hand, the packaging unit 340 can be positioned above the light-emitting diode 220.

[0253] The light-emitting diode 220 may experience dark spots or pixel shrinkage due to the properties of the organic material in the organic layer 222 reacting with external moisture and oxygen. To suppress this problem, the encapsulation unit 340 may be disposed above the cathode 223.

[0254] The encapsulation unit 340 may be composed of a first inorganic insulating film 340a, a foreign matter compensation layer 340b, and a second inorganic insulating film 340c, but is not limited thereto.

[0255] The first inorganic insulating film 340a can be disposed above the substrates 110a, 110b and 110c, which are positioned adjacent to the light-emitting diode 220, on which the cathode 223 is disposed.

[0256] For example, the first inorganic insulating film 340a is composed of an inorganic insulating material (e.g., silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3)) that allows for low-temperature deposition thereon. The first inorganic insulating film 340a is deposited in a low-temperature atmosphere, thereby suppressing damage to the organic layer 222, which contains organic materials susceptible to high-temperature atmospheres, during deposition.

[0257] The foreign matter compensation layer 340b can be configured to have a smaller area than the first inorganic insulating film 340a, and can be configured to expose both ends of the first inorganic insulating film 340a. The foreign matter compensation layer 340b can be formed of an organic insulating material, such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon oxycarbide (SiOC). The foreign matter compensation layer 340b can be referred to as an organic encapsulation layer.

[0258] On the other hand, when the foreign matter compensation layer 340b is formed by inkjet printing, one or more dams can be set in the boundary region between the non-active region and the active region, or dam regions corresponding to a portion of the non-active region can be set. In such dam regions, primary dams adjacent to the active region and secondary dams adjacent to the pad cells can be set.

[0259] When the liquid foreign object compensation layer 340b is arranged in the active region, one or more dams are set in the dam region to prevent the liquid foreign object compensation layer 340b from collapsing and intruding into the pad cell in the direction of the non-active region.

[0260] Primary and / or secondary dams can be configured as single-layer or multi-layer structures.

[0261] The foreign matter compensation layer 340b containing organic materials can be located only on the inner surface of the primary dam.

[0262] The second inorganic insulating film 340c can be configured to cover the upper and side surfaces of each of the first inorganic insulating film 340a and the foreign matter compensation layer 340b. The second inorganic insulating film 340c can be used to minimize or block the penetration of external moisture or oxygen into the first inorganic insulating film 340a and the foreign matter compensation layer 340b.

[0263] The second inorganic encapsulation layer 340c can be formed of an inorganic insulating material (e.g., silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3)).

[0264] The touch buffer film 351 can be disposed on the encapsulation unit 340.

[0265] A bridging pattern 355 may be provided on the touch buffer film 351. However, this disclosure is not limited thereto, and touch electrodes (or touch lines) may be provided on the touch buffer film 351.

[0266] The touch buffer film 351 can be located between the bridging pattern 355 and the packaging unit 340.

[0267] The bridging pattern 355 can be positioned above the encapsulation unit 340 without having a touch buffer membrane 351.

[0268] The bridging pattern 355 can have a single-layer or multi-layer structure formed of a metal with strong corrosion resistance and acid resistance (e.g., aluminum (Al), titanium (Ti), copper (Cu) or molybdenum (Mo)).

[0269] The touch insulating film 352 can be set on the bridging pattern 355.

[0270] For example, the touch insulating film 352 can be an organic film or an inorganic film that can be formed by a low-temperature process. When an organic film is used for the touch insulating film 352, after the organic film is coated on the substrates 110a, 110b, and 110c, the organic film is cured at a temperature below 100°C to form the touch insulating film 352, thereby suppressing damage to the organic layer 222 which is susceptible to high temperatures. When an inorganic film is used for the touch insulating film 352, in order to suppress damage to the organic layer 222 which is susceptible to high temperatures, the low-temperature chemical vapor deposition process and the cleaning process are repeated at least twice to form a touch insulating film 352 with a multilayer structure.

[0271] Selectively remove a portion of the touch insulating film 352 to form a touch contact hole, thereby exposing a portion of the bridging pattern 355.

[0272] Touch electrodes (or touch lines) 356 may be provided on the touch insulating film 352. However, it is not limited to this, and bridging patterns may be provided on the touch insulating film 352.

[0273] For example, touch electrode 356 can be electrically connected to bridging pattern 355 via touch contact hole.

[0274] In addition, the touch planarization layer 357 can be disposed on the touch electrode 356, but is not limited thereto, and the touch planarization layer can be omitted.

[0275] A black matrix 380 can be set on the touch flattening layer 357.

[0276] The black matrix 380 can be located above the touch electrode 356.

[0277] The black matrix 380 can be arranged to correspond to the non-luminous region NEA.

[0278] The color filter layer 370 can be set in the non-emitting region NEA and the emitting region EA above the black matrix 380.

[0279] For example, the color filter layer 370 may include a red color filter layer, a green color filter layer, and a blue color filter layer, but is not limited thereto, and may also include a white color filter layer.

[0280] The black matrix 380 can be disposed on the boundary of the color filter layers 370 with different colors. Therefore, the black matrix 380 can define sub-pixel regions. The sub-pixel regions defined by the black matrix 380 can be red sub-pixel regions, green sub-pixel regions, and blue sub-pixel regions. Furthermore, the sub-pixel regions can further include white sub-pixel regions. That is, regions with red color filter layers can correspond to red sub-pixel regions, regions with green color filter layers can correspond to green sub-pixel regions, and regions with blue color filter layers can correspond to blue sub-pixel regions. Additionally, regions with white color filter layers can correspond to white sub-pixel regions.

[0281] For example, red light is emitted in an area with a red color filter layer, green light is emitted in an area with a green color filter layer, blue light is emitted in an area with a blue color filter layer, and white light can be emitted in an area with a white color filter layer.

[0282] An outer coating layer 375 may be provided above the color filter layer 370.

[0283] On the other hand, according to this disclosure, since the embankment 217 has a height equal to or lower than the height of the protrusion 116b of the second planarization layer 116, the tapered portion of the embankment 217 can be removed. Therefore, the optical path is ensured to achieve a wide viewing angle (see...). Figure 10 Conversely, according to Figure 11 In a comparative example, it should be understood that the second planarization layer 16 does not have protrusions, thus creating a step between the upper surface of the second planarization layer 16 (i.e., the upper surface of the anode 21) and the upper surface of the embankment 17. In this case, a portion of the light path is blocked by the embankment 17. That is, light traveling at a large angle is blocked by the embankment 17, resulting in reduced viewing angle brightness.

[0284] Furthermore, in this disclosure, the height H1 of the embankment 217 is reduced to mitigate the step of the light-emitting unit, thereby reducing the thickness D1 of the encapsulation unit 340 (i.e., the foreign matter compensation layer 340b of the encapsulation unit 340). Conversely, according to Figure 11 In a comparative example, a step is formed between the upper surface of the anode 21 and the upper surface of the embankment 17, thereby increasing the thickness D2 of the foreign matter compensation layer 40b of the encapsulation unit 40, taking into account the step of the light-emitting unit. For reference, reference numerals 40a and 40c refer to the first inorganic insulating film and the second inorganic insulating film.

[0285] As described above, according to this disclosure, the thickness D1 of the foreign matter compensation layer 340b is reduced, thereby improving the optical path of the comparative example even when applying a COE structure with the same margin M. Figure 10 Compared to the dashed arrow, the optical path ( Figure 10The solid arrow (the line) is also enlarged further. Therefore, the viewing angle brightness is improved to achieve a wider viewing angle.

[0286] In addition, according to Figure 11 In a comparative example, because the embankment 17 has a conical portion, the step coverage of the organic layer 22 and cathode 23 deposited on the conical portion is reduced, resulting in vertical deposition of the organic layer and cathode. In this case, the organic layer 22 and cathode 23 are deposited with a thickness less than other portions, and the thickness decreases as the conical portion of the embankment 17 increases, which may lead to increased resistance and open circuits in the cathode 23.

[0287] Conversely, according to this disclosure, even if the embankment 217 lacks a tapered portion and has a lower height than the protrusion 116b of the second planarization layer 116, there are almost no steps between the upper surface of the embankment 217 and the upper surface of the protrusion 116b of the second planarization layer 116. Therefore, the organic layer 222 and the cathode 223 are deposited with a uniform thickness throughout the region. Thus, low power is achieved by improving the resistance increase and open circuit of the cathode 123, and increased yield is achieved.

[0288] Furthermore, according to this disclosure, the thickness of the final product is reduced due to the reduced height of the embankment 217.

[0289] On the other hand, the advantage of this disclosure is that the above-mentioned effects are achieved without adding masks and processes, which will be described in detail with reference to the accompanying drawings.

[0290] Figures 12A to 12F It is shown in sequence. Figure 9 A cross-sectional view of a part of the manufacturing process of the display panel.

[0291] Reference Figure 12A The driving transistor Td and the switching transistor Ts can be disposed above the substrates 110a, 110b and 110c.

[0292] A protective film and / or a first planarization layer 115 may be formed above the driving transistor Td and the switching transistor Ts.

[0293] Subsequently, the connecting electrode 125 can be disposed on the first planarization layer 115.

[0294] For example, the connecting electrode 125 can be electrically connected to one of the first source 132a and the first drain 133a through a contact hole provided in the first planarization layer 115. However, this disclosure is not limited thereto, and the anode can be directly connected without a connecting electrode.

[0295] Subsequently, an insulating layer 116' can be formed on the connecting electrode 125.

[0296] The insulating layer 116' can be formed from organic materials such as acrylic resins or epoxy resins, and for example, it can be formed from photopropylene (PAC).

[0297] Subsequently, refer to Figure 12B A portion of the insulating layer 116' is selectively removed using a masking process to form a contact hole 145 that exposes a portion of the connecting electrode 125.

[0298] At this time, another portion of the insulating layer 116' is removed through the same masking process to form the second planarization layer 116. The second planarization layer 116 may include a bottom layer 116a disposed on the first planarization layer 115 throughout the light-emitting and non-light-emitting regions, and a protrusion 116b disposed on the bottom layer 116a and protruding corresponding to the light-emitting region of the sub-pixel.

[0299] As described above, according to this disclosure, when the contact hole 145 is formed, a second planarization layer 116 including the protrusion 116b is patterned by the same mask process.

[0300] The protrusion 116b may have an upper surface and a side surface.

[0301] The upper surface of the protrusion 116b may be the surface located at the top of the second planarization layer 116 and substantially parallel to the second substrate 110b. The upper surface of the protrusion 116b may correspond to the protruding region PA. The side surfaces of the protrusion 116b may extend from the upper surface of the protrusion 116b.

[0302] Reference Figure 12C The anode 121 can be formed on a portion of the upper surface of the bottom layer 116a of the second planarization layer 116, as well as on the upper and side surfaces of the protrusion 116b.

[0303] For example, the anode 121 may include a first region 121a and a second region 121b. The first region 121a is disposed on a portion of the upper surface of the bottom layer 116a of the second planarization layer 116 and has a surface substantially parallel to the surface of the second substrate 110b. The second region 121b extends from the first region 121a and has a surface at a predetermined angle relative to the second substrate 110b. The anode 121 may include a third region 121c, which extends from the second region 121b and has a surface substantially parallel to the surface of the second substrate 110b.

[0304] The first region 121a of the anode 121 can be electrically connected to the drive transistor Td through the contact hole 145 and the connecting electrode 125.

[0305] Next, refer to Figure 12DThe embankment 217 can be formed simultaneously covering the first region 121a and the second region 121b of the anode 121.

[0306] According to a third exemplary embodiment of the present disclosure, the embankment 217 is formed to have a height equal to or lower than that of the protrusion 116b of the second planarization layer 116.

[0307] According to the third exemplary embodiment of this disclosure, the end of the embankment 217 is disposed above the tapered portion of the protrusion 116b of the second planarization layer 116 to ensure process margin. Therefore, the embankment 217 may not cover a portion of the second region 121b of the anode 121, but this disclosure is not limited thereto, and the embankment 217 may cover the entire second region 121b of the anode 121. In this case, there is no step between the upper surface of the protrusion 116b of the second planarization layer 116 and the upper surface of the embankment 217, but it can be substantially flat.

[0308] Subsequently, refer to Figure 12E An organic layer 222 can be formed on the upper surface of the embankment 217, a part of the second region 121b, and the third region 121c of the anode 121.

[0309] Subsequently, a cathode 223 can be disposed on the organic layer 222.

[0310] Subsequently, refer to Figure 12F A package unit 340 can be formed above the light-emitting diode 220.

[0311] A touch sensor layer consisting of a touch buffer film 351, a bridging pattern 355, a touch insulating film 352, a touch electrode 356, and a touch planarization layer 357 can be formed above the packaging unit 340.

[0312] A black matrix 380 and a color filter layer 370 can be formed above the touch sensor layer.

[0313] An outer coating layer 375 can be applied above the color filter layer 370.

[0314] On the other hand, according to this disclosure, the second planarization layer and the protrusion are formed separately, referring to... Figure 13 This will be described in detail.

[0315] Figure 13 This is a diagram showing a cross-sectional structure of a display panel according to a fourth exemplary embodiment of the present disclosure.

[0316] Figure 13 The fourth exemplary embodiment of this disclosure and Figure 9Compared to the third exemplary embodiment, the configuration is substantially the same except that the second planarization layer 416 and the protrusion 416p are separately constructed. Therefore, redundant descriptions will be omitted. Here, the description of the same reference numerals can be found by referring to Figures 1 to 9 .

[0317] Reference Figure 13 The second planarization layer 416 can be disposed above the first planarization layer 115.

[0318] In the second planarization layer 416, the upper surface, except for the contact holes that expose the connecting electrode 125, can be flat.

[0319] A protrusion 416p, which protrudes corresponding to the light-emitting region EA of the sub-pixel, may be provided above the second planarization layer 416.

[0320] The protrusion 416p may have an upper surface and a side surface.

[0321] The upper surface of the protrusion 416p can be a surface substantially parallel to the second planarization layer 416. The upper surface of the protrusion 416p can correspond to the protruding region PA.

[0322] The side surface of the protrusion 416p can extend from the upper surface of the protrusion 416p.

[0323] The protrusion 416p may be made of a different material than the material of the second planarization layer 416, but is not limited thereto, and may be made of the same material.

[0324] The anode 121 may be disposed on a portion of the upper surface of the second planarization layer 416 and on the upper and side surfaces of the protrusion 416p.

[0325] The anode 121 of the fourth exemplary embodiment may include a first region 121a and a second region 121b. The first region 121a is disposed on a portion of the upper surface of the second planarization layer 416 and has a surface substantially parallel to the surface of the second planarization layer 416. The second region 121b extends from the first region 121a to be disposed on the side surface of the protrusion 416p and has a surface at a predetermined angle relative to the second planarization layer 416. The anode 121 may include a third region 121c, which extends from the second region 121b to be disposed on the protrusion 416p and has a surface substantially parallel to the surface of the second planarization layer 416.

[0326] The embankment 217 can be provided simultaneously covering the first region 121a and the second region 121b of the anode 121. For example, the embankment 217 can have a height equal to or lower than that of the protrusion 416p.

[0327] For example, organic layer 222 can be disposed on the upper surface of the third region 121c of the embankment 217 and the anode 121.

[0328] The cathode 223 can be disposed on the organic layer 222.

[0329] The encapsulation unit 340, as described above, along with the touch sensor layer and / or color filter layer 370 and black matrix 380, can be disposed above the cathode 223.

[0330] On the other hand, according to this disclosure, the light-emitting unit is formed with an uneven structure to improve luminous efficiency, which will be referred to Figure 14 This will be described in detail.

[0331] Figure 14 This is a diagram showing a cross-sectional structure of a display panel according to a fifth exemplary embodiment of the present disclosure.

[0332] Figure 14 The fifth exemplary embodiment of this disclosure is consistent with the above. Figure 9 The third exemplary embodiment differs in that the light-emitting unit is composed of a non-uniform structure, but the other configurations are basically the same, so redundant descriptions will be omitted. Here, the description of the same reference numerals can be found by referring to... Figures 1 to 14 .

[0333] Reference Figure 14 The second planarization layer 516 can be disposed above the first planarization layer 115.

[0334] For example, the second planarization layer 516 may include a bottom layer 516a disposed on the first planarization layer 115 in the entirety of the light-emitting region EA and the non-light-emitting region NEA, and a protrusion 516b disposed on the bottom layer 516a and protruding corresponding to the light-emitting region EA of the sub-pixel.

[0335] The protrusion 516b may have an upper surface and a side surface.

[0336] The upper surface of the protrusion 516b is located at the top of the second planarization layer 516 and is substantially parallel to the second substrate 110b. The upper surface of the protrusion 516b may correspond to the protruding area PA and have an uneven structure.

[0337] The side surface of the protrusion 516b can extend from the upper surface of the protrusion 516b.

[0338] For example, the anode 521 may be disposed on a portion of the upper surface of the bottom layer 516a of the second planarization layer 516 and on the upper and side surfaces of the protrusion 516b.

[0339] For example, the anode 521 may include a first region 521a and a second region 521b. The first region 521a is disposed on a portion of the upper surface of the bottom layer 516a of the second planarization layer 516 and has a surface substantially parallel to the surface of the second substrate 110b. The second region 521b extends from the first region 521a and has a surface at a predetermined angle relative to the second substrate 110b.

[0340] The anode 521 may include a third region 521c that extends from the second region 521b to have a surface substantially parallel to the surface of the protrusion 516b of the second planarization layer 516.

[0341] The third region 521c of the anode 521 may have an uneven structure corresponding to the shape of the upper surface of the protrusion 516b.

[0342] The embankment 217 can be provided simultaneously covering the first region 521a and the second region 521b of the anode 521. For example, the embankment 217 can have a height equal to or lower than that of the protrusion 516b.

[0343] For example, the organic layer 522 can be disposed on the upper surface of the embankment 217 and the third region 521c of the anode 521.

[0344] In addition, for example, the organic layer 522 may have an uneven structure corresponding to the shape of the upper surface of the protrusion 516b.

[0345] The cathode 523 can be disposed on the organic layer 522.

[0346] Furthermore, for example, the cathode 523 may have an uneven structure corresponding to the shape of the upper surface of the protrusion 516b.

[0347] For example, the uneven structure of the anode 521, the organic layer 522, and the cathode 523 can be a microlens, but is not limited to this.

[0348] As described above, according to the fifth exemplary embodiment of this disclosure, when a predetermined voltage is applied between the anode 521 and the cathode 523, holes and electrons supplied from the anode 521 and the cathode 523 are transferred to the organic layer 522 to form excitons. When the excitons transition from the excited state to the ground state, light is generated. Furthermore, the light generated in the organic layer 522 is emitted to the outside through the cathode 523 to realize arbitrary images. At this time, microlenses are formed in the protrusion 516b, the anode 521, the organic layer 522, and the cathode 523 to change the travel path of light that is not extracted to the outside by total internal reflection in the organic layer, thereby improving the light extraction efficiency.

[0349] Furthermore, microlenses for the protrusion 516b, anode 521, organic layer 522, and cathode 523 are disposed within the entire protrusion region PA corresponding to the light-emitting region EA. The entire light-emitting region EA is used for microlenses to maximize light extraction efficiency.

[0350] The encapsulation unit 340, as described above, along with the touch sensor layer and / or color filter layer 370 and black matrix 380, can be disposed above the light-emitting diode 520.

[0351] Exemplary embodiments of this disclosure can also be described as follows:

[0352] According to one aspect of this disclosure, a display device is provided. The display device includes a substrate, and a planarization layer 116 is disposed above the substrate. A protrusion 116b may be formed on the planarization layer 116, and the protrusion may have a first side surface SS1, a second side surface SS2 opposite to the first side surface SS1, and an upper surface TS1 extending between the two side surfaces (see, for example, [reference needed]). Figure 8 The first electrode 121 can be deposited such that it extends continuously along the upper surface TS1, the first side surface SS1, and the second side surface SS2 of the protrusion. A dam 217 can be formed adjacent to the protrusion, the dam including the upper surface TS2. An organic layer 222 can be disposed on the first electrode 121, and a second electrode 223 can be disposed on the organic layer 222. In some embodiments, the upper surface TS2 of the dam is substantially coplanar with the upper surface TS1 of the protrusion. This configuration provides a flat upper surface for uniform organic layer deposition and improved encapsulation planarity.

[0353] In one embodiment, the upper surface TS2 of the embankment and the upper surface TS1 of the protrusion may terminate at substantially the same vertical height, making them flush with each other. This flush alignment of the surfaces minimizes discontinuities on the upper surface of the luminescent region, which facilitates uniform deposition of subsequent layers and improves light extraction properties.

[0354] In another embodiment, the protrusion and the planarization layer can be integrally formed from the same material. For example, the planarization layer can be patterned by etching or photolithography to define the raised area used as the protrusion. Integrating the protrusion from the planarization layer simplifies the manufacturing process and ensures material compatibility and uniform surface energy characteristics during deposition.

[0355] In some configurations, the embankment can define a lateral opening corresponding to the light-emitting area located above the protrusion. The embankment can surround the protrusion on multiple sides, while leaving an aperture above the upper surface of the protrusion. This arrangement allows for selective patterning of the light-emitting material and improves the sharpness of pixel boundaries.

[0356] According to some embodiments, the embankment may cover at least a portion of the side surface of the first electrode while exposing the upper surface of the protrusion. This configuration ensures that the light-emitting area remains available for organic layer deposition, while the side surface is shielded by the embankment to prevent unwanted leakage or electrical interference between adjacent pixels.

[0357] In an alternative embodiment, the upper surface of the embankment is not coplanar with the upper surface of the protrusion. Specifically, the upper surface of the embankment is located below the upper surface of the protrusion. This height difference creates a stepped profile, which can facilitate light redirection and optical confinement in certain display configurations, such as display configurations with encapsulated color filter layers.

[0358] As described above, even in non-coplanar configurations, the protrusions can still be integrally formed with the planarization layer from the same material. The planarization layer can be selectively patterned to define raised areas that serve as protrusions while maintaining compositional continuity.

[0359] In one example, the upper surface of the protrusion includes a textured surface comprising a wavy or irregular pattern. The texture can be formed during planarization layer patterning or subsequent processing and can consist of random surface roughness or periodic undulations. In some cases, the upper surface exhibits a non-flat topology characterized by continuous ridges, valleys, or peaks with variations in height and spacing.

[0360] In some embodiments, the upper surface of the protrusion exhibits a surface roughness with a patterned or irregular morphology. The term "morphology" refers to the three-dimensional geometric features of a surface, including spatial variations in height, profile, and slope. Morphology can be periodic or aperiodic and can include continuous or discontinuous features such as ridges, valleys, undulations, or random roughness. Surface roughness can be introduced by patterning techniques applied to a planarization layer or through a subsequent texturing process. This patterned or irregular morphology can affect the optical and deposition properties of the overcoat layer, including light extraction, angular emission, and film uniformity.

[0361] In such an embodiment, the first electrode 121 may conform to the shape of the corrugated surface of the protrusion. The electrode may be deposited by methods such as sputtering or evaporation, enabling it to follow the surface profile of a textured or irregular shape without disrupting continuity.

[0362] The presence of surface roughness on the upper surface of the protrusion can enhance angular light distribution. In particular, wavy or irregular surface patterns can scatter emitted light in all directions, thereby increasing the effective viewing angle of the display. This effect is especially advantageous in displays that require consistent brightness over a wide viewing angle.

[0363] In another embodiment, the upper surface of the embankment is substantially flat and extends laterally beyond the light-emitting area defined by the protrusion. This extended flat area can be used to block light leakage, reduce reflection, and provide a continuous support surface for the overlying encapsulation film or touch electrode structure.

[0364] According to another aspect of this disclosure, a display device is provided. The display device includes: a planarization layer disposed on a substrate and including a protrusion having an upper surface and a side surface extending from the upper surface; an anode disposed on the upper surface and the side surface of the protrusion; a dam portion configured to cover the anode except for the upper surface of the protrusion; an organic layer disposed on the anode exposed by the dam portion; and a cathode disposed on the organic layer, wherein the dam portion may have a height equal to or lower than the height of the upper surface of the protrusion.

[0365] The planarization layer may include a bottom layer disposed in the light-emitting area and the non-light-emitting area, wherein the protrusions of the planarization layer are disposed on the bottom layer and correspond to the light-emitting area.

[0366] The upper surface of the protrusion and the upper surface of the embankment can be flat and without steps.

[0367] The height of the embankment can refer to the distance from the base layer to the upper surface of the embankment, and the height of the protrusion refers to the distance from the base layer to the upper surface of the protrusion.

[0368] The upper surface of the protrusion may correspond to the protruding area, and the side surface of the protrusion may extend from the upper surface of the protrusion.

[0369] The anode can be disposed on a portion of the upper surface of the bottom layer of the planarization layer, as well as on the upper and side surfaces of the protrusion.

[0370] The anode may include: a first region disposed in a portion of the upper surface of the substrate; a second region extending from the first region to be disposed on the side surface of the protrusion; and a third region extending from the second region to be disposed in the protrusion region.

[0371] The third region of the anode can correspond to the upper surface of the protrusion.

[0372] The embankment can cover the first and second regions of the anode and expose the third region of the anode.

[0373] The embankment may include an upper surface, side surfaces, and a bottom surface.

[0374] The upper surface of the embankment can be parallel to the upper surface of the protrusion.

[0375] The upper surface of the embankment can correspond to the non-luminescent area, and the side and bottom surfaces of the embankment can also correspond to the non-luminescent area.

[0376] The side surface of the embankment can extend from the upper surface of the embankment and can correspond to the side surface of the protrusion.

[0377] The bottom surface of the embankment can correspond to the surface that contacts the anode in the first region of the anode.

[0378] The protruding region may have a smaller width and area than the luminescent region defined by the embankment, and the third region of the anode may be exposed by the luminescent region.

[0379] The organic layer can be disposed on the upper surface of the embankment and the third region of the anode.

[0380] The display device may further include an encapsulation unit disposed above the cathode, a touch sensor layer disposed above the encapsulation unit, and a black matrix and color filter layer disposed above the encapsulation unit.

[0381] The upper surface of the protrusion may have an uneven structure, and the anode, organic layer and cathode may have an uneven structure corresponding to the shape of the upper surface of the protrusion.

[0382] According to another aspect of this disclosure, a display device is provided. The display device includes: a planarization layer disposed above a substrate; a protrusion disposed on the planarization layer and protruding corresponding to a light-emitting area; an anode disposed on a portion of the upper surface of the planarization layer and on the upper and side surfaces of the protrusion; a dam portion configured to cover the anode except for the upper surface of the protrusion; an organic layer disposed on the anode exposed by the dam portion; and a cathode disposed on the organic layer, wherein the dam portion may have a height equal to or lower than the height of the upper surface of the protrusion.

[0383] The upper surface of the protrusion and the upper surface of the embankment can be flat without steps.

[0384] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and are not limiting of the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be construed as falling within the scope of the present disclosure.

[0385] The various embodiments described above can be combined to provide further embodiments. Based on the detailed description above, these and other changes can be made to the embodiments. Generally, the terminology used in the following claims should not be construed as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to include all possible embodiments and the full scope of equivalents conferred by these claims. Therefore, the claims are not limited by this disclosure.

Claims

1. A display device, comprising: A planarization layer disposed on a substrate and including a protrusion having an upper surface and a side surface extending from the upper surface; An anode, wherein the anode is disposed on the upper surface and the side surface of the protrusion; A dam portion, the dam portion being configured to cover the anode except for the upper surface of the protrusion; An organic layer is disposed on the anode exposed by the dike; as well as Cathode, the cathode being disposed on the organic layer, The embankment has a height equal to or lower than the height of the upper surface of the protrusion.

2. The display device according to claim 1, wherein, The planarization layer includes: The bottom layer is disposed in the light-emitting area and the non-light-emitting area. The protrusions of the planarization layer are disposed on the bottom layer and correspond to the light-emitting area.

3. The display device according to claim 1, wherein, The upper surface of the protrusion and the upper surface of the embankment are flat and without steps.

4. The display device according to claim 1, wherein, The height of the embankment refers to the distance from the reference layer to the upper surface of the embankment, and the height of the protrusion refers to the distance from the reference layer to the upper surface of the protrusion.

5. The display device according to claim 2, wherein, The upper surface of the protrusion corresponds to the protruding region, and the side surface of the protrusion extends from the upper surface of the protrusion.

6. The display device according to claim 2, wherein, The anode is disposed on a portion of the upper surface of the bottom layer of the planarization layer, as well as on the upper surface and the side surface of the protrusion.

7. The display device according to claim 5, wherein, The anode includes: A first region is disposed in a portion of the upper surface of the bottom layer; A second region, extending from the first region and disposed on the side surface of the protrusion; and A third region extends from the second region and is located in the protruding region.

8. The display device according to claim 7, wherein, The third region of the anode corresponds to the upper surface of the protrusion.

9. The display device according to claim 7, wherein, The embankment covers the first and second regions of the anode and exposes the third region of the anode.

10. The display device according to claim 7, wherein, The embankment includes an upper surface, side surfaces, and a bottom surface.

11. The display device according to claim 10, wherein, The upper surface of the embankment is parallel to the upper surface of the protrusion.

12. The display device according to claim 10, wherein, The upper surface of the embankment corresponds to the non-luminescent area, and the side and bottom surfaces of the embankment also correspond to the non-luminescent area.

13. The display device according to claim 10, wherein, The side surface of the embankment extends from the upper surface of the embankment and corresponds to the side surface of the protrusion.

14. The display device according to claim 10, wherein, The bottom surface of the embankment corresponds to the surface that contacts the anode in the first region of the anode.

15. The display device according to claim 7, wherein, The width and area of ​​the protruding region are smaller than the width and area of ​​the luminescent region defined by the embankment, and the third region of the anode is exposed by the luminescent region.

16. The display device according to claim 7, wherein, The organic layer is disposed on the upper surface of the third region of the embankment and the anode.

17. The display device according to claim 1, further comprising: Encapsulation unit, the encapsulation unit being disposed on the cathode; A touch sensor layer is disposed on the packaging unit; as well as A black matrix and a color filter layer are disposed on the packaging unit.

18. The display device according to claim 1, wherein, The upper surface of the protrusion has an uneven structure, and the anode, the organic layer, and the cathode have uneven structures corresponding to the shape of the upper surface of the protrusion.

19. A display device, comprising: A planarization layer is disposed on a substrate; A protrusion is provided on the planarization layer and protrudes corresponding to the light-emitting area; An anode is disposed on a portion of the upper surface of the planarization layer and on the upper and side surfaces of the protrusion; A dam portion, the dam portion being configured to cover the anode except for the upper surface of the protrusion; An organic layer is disposed on the anode exposed by the dike; as well as Cathode, the cathode being disposed on the organic layer, The embankment has a height equal to or lower than the height of the upper surface of the protrusion.

20. The display device according to claim 19, wherein, The upper surface of the protrusion and the upper surface of the embankment are flat and without steps.

21. A display device, comprising: substrate; A planarization layer is disposed on the substrate; A protrusion disposed on the planarization layer, the protrusion having a first side surface, a second side surface opposite to the first side surface, and an upper surface between the first side surface and the second side surface; A first electrode extends continuously along the upper surface, the first side surface, and the second side surface of the protrusion; A embankment, adjacent to the protrusion, the embankment having an upper surface; An organic layer is disposed on the first electrode; as well as The second electrode is disposed on the organic layer. The upper surface of the embankment is coplanar with the upper surface of the protrusion.

22. The display device according to claim 21, wherein, The protrusion and the planarization layer are integrally formed from the same material.

23. The display device according to claim 21, wherein, The embankment defines a lateral opening corresponding to the light-emitting area above the protrusion.

24. The display device according to claim 21, wherein, The embankment covers only a portion of the side surface of the first electrode, leaving the upper surface of the protrusion exposed.

25. A display device, comprising: substrate; A planarization layer is disposed on the substrate; A protrusion disposed on the planarization layer, the protrusion having a first side surface, a second side surface opposite to the first side surface, and an upper surface between the first side surface and the second side surface; A first electrode extends continuously along the upper surface, the first side surface, and the second side surface of the protrusion; A embankment, adjacent to the protrusion, the embankment having an upper surface; An organic layer is disposed on the first electrode; as well as The second electrode is disposed on the organic layer. The upper surface of the embankment is not coplanar with the upper surface of the protrusion and is located below the upper surface of the protrusion.

26. The display device according to claim 24, wherein, The protrusion and the planarization layer are integrally formed from the same material.

27. The display device according to claim 24, wherein, The upper surface of the protrusion includes a textured surface, which includes a wavy pattern or an irregular pattern.

28. The display device according to claim 27, wherein, The first electrode corresponds to the corrugated pattern on the upper surface of the protrusion.

29. The display device according to claim 27, wherein, The surface roughness on the protrusion increases the amount of light scattered towards the tilted viewing angle.

30. The display device according to claim 25, wherein, The upper surface of the embankment is flat and extends laterally beyond the luminescent area.

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