Display device, method of manufacturing display device, and electronic apparatus

Abstract

A display device, a method of manufacturing the display device, and an electronic apparatus are provided. The display device includes a display panel and a heat dissipation member provided on one surface of the display panel, wherein the heat dissipation member includes: a substrate; a cover provided to face a surface opposite to a surface facing the display panel among the surfaces of the substrate; and a groove formed in the substrate such that at least the fluid moves. The groove has a region in which a width of a portion farthest from the display panel is narrower than a width of a portion closest to the display panel in a thickness direction of the substrate.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0102299, filed on August 1, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] One or more aspects of embodiments of this disclosure relate to display devices, methods of manufacturing display devices, and electronic devices. Background Technology

[0004] Electronic devices such as smartphones, tablet computers, digital cameras, laptops, navigators, and smart TVs provide images to users and include display devices for displaying those images. One display device includes a display panel that generates and displays images, and one or more suitable input devices.

[0005] For example, a display device may include a display panel that generates an image using a plurality of light-emitting elements and a heat dissipation member attached to the bottom of the display panel. The plurality of light-emitting elements of the display panel can display an image using electricity supplied from an external source. The plurality of light-emitting elements can display an image using applied electricity (e.g., by converting electricity into light energy), but some of the applied electricity (e.g., not converted into light energy) may be lost to the surrounding environment as heat (e.g., emitted to the exterior of the display panel). Summary of the Invention

[0006] One or more aspects of embodiments of this disclosure relate to display devices, methods of manufacturing display devices, and electronic devices that have improved ease of manufacture and heat dissipation characteristics. However, the aspects of this disclosure are not limited to those set forth in the text.

[0007] Additional aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0008] According to one or more embodiments, a display device includes a display panel; and a heat dissipation member provided on a surface (e.g., one) of the display panel. The heat dissipation member includes a substrate having a first surface and a second surface opposite to the surface of the display panel; and a cover having a surface opposite to the first surface of the substrate (e.g., which is provided as a surface facing opposite to the surface facing the display panel among the surfaces of the substrate). A groove is provided (or formed) in the substrate, and is a fluid passage such that at least a fluid moves, and has a first width region and a second width region. The first width region is away from the display panel in a thickness direction of the substrate, and is narrower than the second width region which is close to the display panel in the thickness direction of the substrate. In other words, the groove has a region in which, in the thickness direction of the substrate, a width of a portion farthest from the display panel is narrower than a width of a portion closest to the display panel.

[0009] In one or more embodiments, the groove can have a shape in which a width gradually decreases along a depth direction thereof.

[0010] In one or more embodiments, the groove can have an inclined surface in at least one region of the substrate.

[0011] In one or more embodiments, the groove can include symmetrical inclined surfaces.

[0012] In one or more embodiments, an angle formed between an extension line of the second surface (e.g., a surface facing the display panel among the surfaces of the substrate) and an inner surface of the groove can be equal to or less than 90 degrees (°).

[0013] In one or more embodiments, an angle formed between an extension line of the second surface (e.g., a surface facing the display panel among the surfaces of the substrate) and an inner surface of the groove can be in a range of 50° to 80°.

[0014] In one or more embodiments, a first adhesive layer can be provided in at least one region between the substrate and the cover.

[0015] In one or more embodiments, the first adhesive layer can include a thermal adhesive and a first spaced region in a region corresponding to the groove, and the first spaced region can not include the thermal adhesive.

[0016] In one or more embodiments, a plate can be coupled (or provided to be connected) to a second surface (e.g., a surface facing opposite to the cover among the surfaces of the substrate) of the substrate.

[0017] In one or more embodiments, a second adhesive layer can be provided in at least one region between the substrate and the plate.

[0018] In one or more embodiments, the second adhesive layer can include a thermal adhesive and a second spaced region in a region corresponding to the groove, and the second spaced region can not include the thermal adhesive.

[0019] In one or more embodiments, a third adhesive layer can be provided between the plate and the display panel.

[0020] In one or more embodiments, the substrate can include a flexible material.

[0021] In one or more embodiments, the substrate can include a polymer-based material.

[0022] In one or more embodiments, the display panel can include an organic light emitting element.

[0023] According to one or more embodiments, a method of manufacturing a display apparatus includes providing a display panel; providing a heat dissipation member; and coupling or attaching the display panel to the heat dissipation member. The heat dissipation member can include a substrate having a first surface and a second surface opposite to a surface of the display panel, and a cover having a surface opposite to the first surface (e.g., which is provided as a surface facing opposite to a surface facing the display panel of the substrate). A groove is provided (or formed) in the substrate, the groove being a fluid passage such that at least fluid moves, and having a first width region and a second width region, the first width region being away from the display panel in a thickness direction of the substrate and being narrower than the second width region which is close to the display panel in the thickness direction of the substrate. In other words, the groove has a region in which, in the thickness direction of the substrate, a width of a portion farthest from the display panel is narrower than a width of a portion closest to the display panel.

[0024] In one or more embodiments, providing the heat dissipation member can include forming the groove in the surface (the first surface and / or the second surface) of the substrate by using a mold (e.g., by a process using a mold).

[0025] In one or more embodiments, the mold can include a cutting die for stamping.

[0026] In one or more embodiments, providing the heat dissipation member can further include forming an adhesive layer on the first (e.g., one) surface and the second (e.g., opposite) surface of the substrate before forming the groove by using the mold.

[0027] In one or more embodiments, providing the heat dissipation member can further include attaching a plate after forming the groove.

[0028] According to one or more embodiments, an electronic device includes a display apparatus according to one or more embodiments of the disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings are included to provide a further understanding of the foregoing and other aspects, features, and advantages of certain embodiments of this disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments, which will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0030] Figure 1 A cross-sectional view of a display device according to one or more embodiments of the present disclosure is shown for illustrative purposes.

[0031] Figure 2 For illustrative purposes only Figure 1 An enlarged view of an example of part A in the diagram;

[0032] Figure 3 For example Figure 2 A diagram showing an example of the modification;

[0033] Figure 4 For illustrative purposes only Figure 1 A cross-sectional view of an example display device;

[0034] Figure 5 To illustrate the example along Figure 1 An example cross-sectional view of the section intercepted by line I-I';

[0035] Figures 6 to 12 The views are cross-sectional views, each illustrating an example of a method of manufacturing a display device according to one or more embodiments of the present disclosure;

[0036] Figure 13 Example manufacturing Figure 12 A cross-sectional view of an example cutting die used in a display device;

[0037] Figure 14 A cross-sectional view illustrating an example of a cutting die used in manufacturing a display device according to one or more embodiments of the present disclosure;

[0038] Figure 15 For example, by using Figure 14 A cross-sectional view of an example display device manufactured using a cutting die;

[0039] Figure 16 A cross-sectional view illustrating an example of a cutting die used in manufacturing a display device according to one or more embodiments of the present disclosure;

[0040] Figure 17 For example, by using Figure 16 A cross-sectional view of an example display device manufactured using a cutting die;

[0041] Figure 18 This is a block diagram of an electronic device according to one or more embodiments of the present disclosure; and

[0042] Figure 19 An illustration of a single electronic device according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION

[0043] Reference will now be made in detail embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments can have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described, by referring to the figures, to explain aspects.

[0044] As used in the text, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," "one," "selected from," and "chosen from" when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. For example, in the disclosure, the expressions "at least any one of X, Y, and Z" and "at least any one of a group of X, Y, and Z" can be interpreted as one X, one Y, one Z, and / or a combination (e.g., any suitable combination) of two or more of X, Y, and Z (e.g., XYZ, XY, YZ, XZ).

[0045] Because the present disclosure can be modified in various suitable ways and can have one or more suitable embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. The effects and features of the present disclosure and methods of achieving the same will be clearly understood by referring to the embodiments described in detail in the text and the drawings. However, the present disclosure is not limited to the embodiments disclosed in the text and can be implemented in one or more suitable forms.

[0046] In the following embodiments, terms such as "first" and "second" can be used to describe one or more suitable components, and the terms are not used in a limiting sense but for the purpose of distinguishing one component from another. Accordingly, the first component can be referred to as the second component without departing from the present disclosure.

[0047] In the embodiments disclosed in the text, a singular form such as "a" and "the" can include a plural form unless it means a completely different meaning from the context.

[0048] In the embodiments disclosed in the text, the terms such as "include", "contain", "have" are understood as they are intended to indicate the presence of the features or components disclosed in the specification, and also do not exclude the presence of one or more similar features or components in advance. In addition, the terms "include", "contain", "have" or similar terms include or support the terms "consist of" and "consist essentially of", which indicate the presence of the recited features, integers, steps, operations, elements and / or components, and the absence or essential absence of other features, integers, steps, operations, elements, components and / or groups thereof. In this context, "consist essentially of" indicates that any additional components do not materially affect the chemical, physical, optical or electrical characteristics of the display panel and / or electronic device.

[0049] In the embodiments disclosed in the text, when a part such as a unit, a region, a component, etc. is referred to as being located on another part (for example, spatial relative terms such as "below" and "above"), it not only includes the case where the part is directly located on the other part, but also includes the case where other units, regions, components, etc. are interposed therebetween. In addition to the orientation depicted in the drawings, the spatial relative terms are intended to include different orientations in use, operation, and / or manufacture. For example, if the device shown in the drawings is turned over, the element depicted as being below the other elements or features is positioned above the other elements or features. Therefore, in one or more embodiments, the term "below" can include (for example, include both) above and below. In addition, the device can be oriented in other directions (for example, rotated 90 degrees or in different directions), and therefore the spatial relative terms used in the text are interpreted accordingly.

[0050] In the following embodiments, unless otherwise specified in the context, the terms such as "connection" or "coupling" do not necessarily mean "two members are directly and / or fixedly connected or coupled", and do not exclude the intervention of other members between the two members.

[0051] In the drawings, the size of the components can be exaggerated or enlarged or reduced for ease of explanation. For example, the size (for example, thickness) of each component illustrated in the drawings is illustrated for ease of description, and the present disclosure is not necessarily limited thereto.

[0052] Unless otherwise defined, all terms used in the text (including chemical terms, technical terms, and scientific terms) have the same meaning as that commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in a common dictionary should be interpreted in accordance with their meanings in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense, unless explicitly defined in the text.

[0053] The term "may" will be understood to mean "one or more embodiments of the present disclosure" wherein some embodiments include the described element, and wherein some embodiments do not include the described element and / or include an alternative element. Similarly, alternative language such as "or" means "one or more embodiments of the present disclosure" each of which is inclusive of the corresponding listed item.

[0054] In the present specification, a phrase such as "on a plane" means looking at a target portion from the top, and a phrase "on a cross-section" means looking at a cross-section formed by vertically cutting a target portion from the side.

[0055] Hereinafter, a description will be given in detail of preferred embodiments disclosed in the text with reference to the accompanying drawings. For the description with reference to the accompanying drawings, the same or equivalent components can be given the same reference numerals, and a redundant description thereof will not be provided.

[0056] Display device

[0057] Figure 1 To schematically illustrate a cross-sectional view of a display device according to one or more embodiments of the present disclosure, and Figure 2 To schematically illustrate Figure 1 an enlarged view of an example of a portion A in FIG. 1.

[0058] Referring to Figure 1 , a display device 1 according to one or more embodiments of the present disclosure can include a display area and a peripheral area. The peripheral area is defined outside the display area to surround the display area. One or more appropriate wirings and a driving circuit portion can be located in the peripheral area, and transmit an electrical signal to be applied to the display area. The display device 1 can provide a certain image by using light emitted from a plurality of pixels provided in the display area. In one or more embodiments, the display device 1 can be bent by including a bending area in a partial area of the peripheral area.

[0059] The display device 1 can be a display device such as an organic light emitting display (OLED) device, an inorganic light emitting display (or inorganic EL display) device, or a quantum dot light emitting display device. Hereinafter, an organic light emitting display device will be described as an example. Examples of the display device 1 can include one or more appropriate types (or kinds) of electronic devices such as a mobile phone, a laptop computer, a smart watch, etc.

[0060] The display device 1 can include a display panel 10 that emits (e.g., realizes) visible light, and a heat dissipation member 30 provided on a surface of the display panel 10 opposite to a surface that emits (e.g., realizes) visible light. For example, the visible light can be emitted in one direction (e.g., a direction toward the outside of the display device 1) from an upper surface (e.g., an upper surface based on the Figure 1 Figure 1 ​emitted (e.g., implemented) from, and the heat dissipation member 30 can be provided on a surface (e.g., based on the lower surface of the display panel 10) opposite to the surface from which the visible light is emitted (e.g., implemented), and can be coupled or connected in a manner in contact or bonded with the corresponding surface. Figure 1

[0061] The display panel 10 can provide an image recognizable by a user, and can include an organic light emitting element on a surface on which the visible light is emitted (e.g., implemented).

[0062] By specific configurations and steps to be described later, material costs and processing costs can be reduced, and a display device 1 in which a channel is freely processed and formed can be produced.

[0063] As exemplified in Figure 2 , the display panel 10 can include a display element 150 capable of emitting (e.g., implemented) (or configured to emit) visible light to provide the visible light to a user. The display element 150 can be implemented as one or more display elements of an appropriate type (or kind), and the present embodiment is an example to describe a case where the display element 150 is an organic light emitting element.

[0064] The display panel 10 will be described in more detail. The display panel 10 can include a substrate 100, a display element 150, an encapsulation member 170, and an optical functional layer 110.

[0065] The substrate 100 can be formed using one or more appropriate materials. For example, the substrate 100 can be made of a transparent glass material including (e.g., containing) SiO2 as a main component thereof. In some embodiments, the substrate 100 can be formed of a transparent plastic material.

[0066] The display element 150 can be formed on the substrate 100, and can include a first electrode 151, a second electrode 152, and an intermediate layer 153. For example, the first electrode 151 can be formed on the substrate 100, the second electrode 152 can be formed on the first electrode 151, and the intermediate layer 153 can be formed between the first electrode 151 and the second electrode 152.

[0067] In some embodiments, a buffer layer can be further formed on the first electrode 151 and the substrate 100. The buffer layer can provide or define a flat surface on the substrate 100, and can block moisture and / or gas from permeating through the substrate 100.

[0068] ​The first electrode 151 can function as an anode, and the second electrode 152 can function as a cathode. Of course, the order of these polarities can be reversed. When the first electrode 151 functions as an anode, the first electrode 151 can include (e.g., contain) ITO, IZO, ZnO, In2O3, etc. having a high work function. In addition, the first electrode 151 can further include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Yb, and / or Ca, according to the purpose and design conditions.

[0069] When the second electrode 152 functions as a cathode, the second electrode 152 can be formed of a metal such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, and / or Ca. In addition, the second electrode 152 can contain ITO, IZO, ZnO, and / or In2O3 to achieve light transmission.

[0070] The intermediate layer 153 has at least one organic light emitting layer. In some embodiments, the intermediate layer 153 can optionally include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, in addition to the organic light emitting layer. When a voltage is applied to the first electrode 151 and the second electrode 152, visible light is generated from the intermediate layer 153 (e.g., from the organic light emitting layer of the intermediate layer 153).

[0071] The encapsulation member 170 can be provided on the display element 150 to protect the display element 150. The encapsulation member 170 can protect the display element 150 from external impact, and reduce or inhibit penetration of external foreign substances, moisture, etc.

[0072] The encapsulation member 170 can be formed in one or more appropriate types (or kinds). In one or more embodiments, the encapsulation member 170 can be made of a transparent glass material including (e.g., containing) SiO2 as a main ingredient thereof. In one or more embodiments, the encapsulation member 170 can be formed of a plastic material that can transmit light. In one or more embodiments, the encapsulation member 170 can be formed using an inorganic film or an organic film. In some embodiments, the encapsulation member 170 can be formed by stacking at least one (e.g., one or more) organic layer and at least one (e.g., one or more) inorganic layer, and optionally, can be formed by alternately stacking the organic layer and the inorganic layer.

[0073] In one or more embodiments, the display panel 10 can provide an image in an upward direction (i.e., based on Figure 2 towards the optical functional layer 110). The optical functional layer 110 can include a base material and optical functional particles.

[0074] The display panel 10 may include thin-film transistors that transmit signals required to drive the display element 150 to the display element 150. This will refer to... Figure 3 To describe in more detail.

[0075] Figure 3 For example Figure 2 The image shows an example of the modification. (See reference.) Figure 3 The display panel 10 may include a substrate 100', a display element 150', a thin film transistor, and a packaging component 170'.

[0076] The thin-film transistor may include an active layer 133', a gate electrode 135', a source electrode 137', and a drain electrode 138'. This will be described in more detail. A buffer layer 120' may be formed on the substrate 100'. The buffer layer 120' serves to inhibit the penetration of impurity elements through the substrate 100' and provides a flat surface on top of the substrate 100', and may be formed of one or more suitable materials capable of or suited to perform this function. The buffer layer 120' may also be omitted, as it is an optional component.

[0077] The active layer 133' may be provided as a specific pattern on the buffer layer 120'. The active layer 133' may be formed of an inorganic semiconductor material such as silicon, or, as an alternative embodiment, an organic semiconductor material, or, as another alternative embodiment, an oxide semiconductor material.

[0078] A gate insulating layer 136' may be formed on the active layer 133'. The gate insulating layer 136' may be formed of one or more suitable insulating materials, and may be formed using, for example, oxides and / or nitrides.

[0079] Gate electrode 135' may be formed on gate insulating layer 136' to correspond to a specific region of active layer 133'. Gate electrode 135' may be formed of a material with high conductivity. For example, gate electrode 135' may include (e.g., contain) Au, Ag, Cu, Ni, Pt, Pd, Al and / or Mo, and may contain alloys such as Al:Nd, Mo:W, etc. However, this is only an example, and the embodiments are not limited thereto, and may be formed of one or more suitable materials.

[0080] The interlayer insulating layer 139' may be formed to cover the gate electrode 135'. The source electrode 137' and the drain electrode 138' may be formed on the interlayer insulating layer 139'. The source electrode 137' and the drain electrode 138' may be formed to contact a specific region of the active layer 133'.

[0081] The passivation layer 140' may be formed to cover the source electrode 137' and the drain electrode 138'. Although not illustrated, a separate insulating layer may be further formed on the passivation layer 140' to planarize the thin-film transistor.

[0082] In one or more embodiments, the display element 150’ can further include at least one (e.g., one or more) thin film transistor electrically connectable to the display element 150’, and can further include at least one (e.g., one or more) capacitor electrically connectable to the display element 150’ or the thin film transistor.

[0083] The first electrode 151’ can be formed on the passivation layer 140’. The first electrode 151’ can be electrically coupled or connected to one of the source electrode 137’ and the drain electrode 138’. For example, the first electrode 151’ can be coupled or connected to the drain electrode 138’.

[0084] The pixel defining layer 160’ can be formed on the first electrode 151’, and can be formed to expose a certain area of the first electrode 151’.

[0085] The intermediate layer 153’ can be formed on the first electrode 151’. The intermediate layer 153’ can have an organic light emitting layer. In one or more embodiments, in addition to the organic light emitting layer, the intermediate layer 153’ can further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0086] The second electrode 152’ can be formed on the intermediate layer 153’.

[0087] The encapsulation member 170’ can be provided on the display element 150’ to protect the display element 150’.

[0088] In one or more embodiments, the display panel 10 can further include an optical functional layer 110’. The optical functional layer 110’ can include a layer for improving, changing, and in various ways selecting or controlling the characteristics of light emitted (e.g., implemented in) by the display element 150’.

[0089] Figure 4 FIG. 1 is a cross-sectional view schematically illustrating an example of a display device according to an embodiment of the disclosure, and Figure 1 FIG. 2 is a cross-sectional view schematically illustrating an example of a cross-section taken along line I-I’ of Figure 5 FIG. 3 is a cross-sectional view schematically illustrating an example of a cross-section taken along line II-II’ of Figure 1 FIG. 4 is a cross-sectional view schematically illustrating an example of a cross-section taken along line III-III’ of

[0090] Referring to Figure 4 The heat dissipation member 30 can include a cover 340, a first adhesive layer 313, a substrate 310, a second adhesive layer 314, a groove 320, and a plate 330.

[0091] The plate 330 of the heat dissipation member 30 can be coupled or bonded to the display panel 10 by a third adhesive layer 351.

[0092] The substrate 310 can be a layer positioned between the cover 340 and the plate 330. The substrate 310 can be coupled or bonded to the cover 340 by a first adhesive layer 313, and can be coupled or bonded to the plate 330 by a second adhesive layer 314.

[0093] In one or more embodiments, the first adhesive layer 313, the second adhesive layer 314, and the third adhesive layer 351 can each include a thermal adhesive. The thermal adhesive can have a high thermal conductivity and can include a polymer, an epoxy resin, etc.

[0094] The substrate 310 can have one or more appropriate shapes, for example, can have a plate shape corresponding to a plate shape of the display panel 10, and as an example, can be in the form of a sheet having an area corresponding to an area of the display panel 10. As another example, the substrate 310 can be formed to be smaller than the display panel 10, or as another example, can be formed to be larger than the display panel 10.

[0095] As an example, the substrate 310 can have a thickness (e.g., in a Z-axis direction in Figure 4 The width and length can have values greater than at least the thickness.

[0096] In one or more embodiments, as an example, the substrate 310 can have a polygonal planar shape, and as an example, can have a rectangular planar shape.

[0097] The substrate 310 can include a groove 320, which can serve as a (e.g., fluidic) passage for the flow of a refrigerant. As an example, the groove 320 can be formed by a cutting mold design in the substrate 310.

[0098] The substrate 310 can be formed of a material having a high thermal conductivity to sufficiently (e.g., well) absorb heat of the display panel 10.

[0099] In one or more embodiments, the substrate 310 can include or be formed of a flexible material to improve coupling or bonding accuracy when the heat dissipation member 30 and the display panel 10 are coupled or bonded to each other. In one or more embodiments, when the heat dissipation member 30 and the display panel 10 are coupled or bonded by a roll lamination process, forming the substrate 310 using a flexible material can result in enhancing or improving the quality of an adhered surface between the heat dissipation member 30 and the display panel 10, and reducing or inhibiting the risk of plastic deformation due to an impact on the heat dissipation member 30 and a concentrated load on a wall between the passages during the roll lamination process.

[0100] The substrate 310 can be formed of one or more appropriate materials, and as an example, the material of the substrate 310 can include at least a polymer. This can allow the channels to be more freely processed, formed, and varied in the substrate 310 than in a substrate 310 made of a metallic material. In one or more embodiments, the substrate 310 can include a polymer-based material.

[0101] The substrate 310 should have a thickness of a certain value or more so that the refrigerant can flow into the groove 320 to have a heat dissipation effect, but the display device 1 should be as thin as possible. As an example to satisfy the foregoing condition, the thickness of the substrate 310 can be equal to or more than 0.2 micrometers (μm) and less than 0.4 μm.

[0102] The groove 320 can be provided in the substrate 310 and can be formed to have at least one path. For example, the groove 320 can be formed as a closed loop as one path. In addition, as an alternative embodiment, the groove 320 can form a plurality of closed loops. As an alternative embodiment, the groove 320 can be formed using a punching process, and the same channel or a plurality of channels can be designed by controlling an area for punching the groove 320 in the substrate 310.

[0103] The groove 320 can be a channel through which at least a fluid flows. As an example, the groove 320 can be a channel through which a refrigerant flows to dissipate heat. The refrigerant in the groove 320 can absorb heat generated from the display panel 10 and reduce the temperature of the display panel 10.

[0104] One or more appropriate types (or kinds) of refrigerants can flow in the groove 320 that is a closed loop. For example, a gaseous or liquid refrigerant can flow in the groove 320.

[0105] As an example, a refrigerant that is a mixture of two phases (e.g., liquid and gas) can flow in the groove 320. When a certain portion of the display panel 10 is heated, the refrigerant in the groove 320 overlapping the heated portion of the display panel 10 can absorb the heat of the display panel 10, and a certain amount of liquid refrigerant in the corresponding portion can phase change (e.g., evaporate or transform) into gaseous refrigerant. For example, the refrigerant in the groove 320 that is a closed loop can flow faster and absorb the heat of the display panel 10 faster.

[0106] In addition, the groove 320 can be formed in the substrate 310 to have a desired length and shape, thereby controlling the length and area of the channel through which the refrigerant flows.

[0107] As an example, the groove 320 can have a structure formed by repeating a process more than once (e.g., multiple times), in which the groove 320 is formed long in one direction (e.g., in a direction parallel to one side of the substrate 310), and the direction is switched to form the groove 320 long again in a direction parallel to one side of the substrate 310.

[0108] In one or more embodiments, the groove 320 can be formed from near (e.g., proximate to) one vertex of the substrate 310 along a side adjacent to the one vertex (e.g., in the X-axis or Y-axis of the substrate 310), and rotated 180° toward a vertex opposite to the one vertex before reaching another side adjacent to the one side, to form up to a side adjacent to the one vertex but different from the one side. In this way, the groove 320 can be defined up to a side opposite to the one side. The groove 320 can form at least one (e.g., one or more) closed loop. Figure 1

[0109] The groove 320 can be formed in one or more appropriate ways, for example, by a process using a die, and as an example, by a punching process using a cutting die (or a knife die).

[0110] As described in the text, the substrate 310 can be formed of a flexible material to facilitate the punching process using a cutting die.

[0111] The groove 320 can be formed such that, in a thickness direction of the substrate 310, a width of a region (e.g., a first width region) farthest from (or away from) the display panel 10 is narrower than a width of a region (e.g., a second width region) closest to (or proximate to) the display panel 10. For example, the groove 320 can be formed such that its width decreases away from the display panel 10 in the thickness direction of the substrate 310. Thereby, when a refrigerant (e.g., a liquid or a gas) for cooling the display panel 10 is in the groove 320, the refrigerant can be stable in the groove 320, and an area toward the display panel 10 can increase, thereby improving heat dissipation efficiency.

[0112] The groove 320 can have a shape in which a width gradually decreases in a depth direction of the groove 320.

[0113] The groove 320 can have at least one inclined surface in at least one region of the substrate 310. As an example, (e.g., two) inclined surfaces can be formed to correspond to inner surfaces of each side (e.g., both sides) of the groove 320, so as to be inclined in a width direction of the groove 320 (e.g., in a direction parallel to a side of the substrate 310). Figure 4 ​are opposite to each other (e.g., face each other). In one or more embodiments, the (e.g., two) inclined surfaces corresponding to the inner surfaces of each side (e.g., both sides) of the groove 320 can have a symmetrical shape (e.g., are symmetrical to each other) with respect to the thickness direction of the substrate 310 (e.g., the Z-axis direction in FIG. 3). Figure 4

[0114] In one or more embodiments, the inclined surfaces corresponding to the inner surfaces of both sides of the groove 320 can be asymmetrical with respect to the thickness direction of the substrate 310 (e.g., the Z-axis direction in FIG. 3). Figure 4

[0115] In some embodiments, the inclined surfaces of the groove 320 can be curved at least once along the depth direction of the groove 320.

[0116] The angle formed between the groove 320 and the substrate 310 can be equal to or less than 90°. The angle g formed between the top (e.g., second) surface of the substrate 310 and the inner surface of the groove 320 can be equal to or less than 90°. For example, the angle g formed between the extension line of one surface of the substrate 310 facing the display panel 10 among the surfaces of the substrate 310 and the inner surface of the groove 320 can be equal to or less than 90°. For example, as illustrated in Figure 4

[0117] As described in the text, the groove 320 can be formed through a punching process using a mold (e.g., a cutting mold). At this time, by forming the angle between the groove 320 and one surface of the substrate 310 to be less than 90°, the manufacturing characteristics using the cutting mold can be improved. Accordingly, during the punching process using the cutting mold, the cutting mold can be easily removed from the substrate 310.

[0118] The punching angle of the groove 320 can be adjusted to be less than 90°, and thus the area of the passage can be differentially designed only by adjusting the inclination.

[0119] ​​​In the step of forming the groove 320, the groove 320 can be formed in one or more appropriate shapes by using one or more cutting dies of an appropriate type (or kind). The groove 320 can be formed using one cutting die such that an angle between the substrate 310 and one surface of the groove 320 is in a range of 50° to 80°. In an embodiment, an angle g formed between an extension line of one surface of the substrate 310 facing the display panel 10 and an inner surface of the groove 320 can be in a range of 50° to 80°. If the angle between one surface of the groove 320 and the substrate 310 is less than 50°, a small amount of fluid can be accommodated in the groove 320, and thus a heat dissipation effect can be reduced. If the angle between one surface of the groove 320 and the substrate 310 exceeds 80°, it can be difficult to manufacture using a cutting die, and it can be difficult to remove the cutting die from the substrate 310 during a stamping process using the cutting die.

[0120] The substrate 310 can have a first surface and a second surface, and the second (e.g., top) surface can be opposite to (e.g., can face) the display panel 10. The cover 340 can have a surface opposite to the first surface of the substrate 310. In other words, the plate 330 can be coupled to a surface of the substrate 310 opposite to a surface facing the cover 340 among the surfaces. For example, the plate 330 can be provided to cover the substrate 310 and the groove 320.

[0121] The plate 330 can be provided between the substrate 310 and the display panel 10. The second adhesive layer 314 can be provided in at least one region between the plate 330 and the substrate 310, and thus the plate 330 and the substrate 310 can be coupled to each other by the second adhesive layer 314.

[0122] The second adhesive layer 314 can be provided to correspond to a periphery of the groove 320. In one or more embodiments, the second adhesive layer 314 can be formed to have a side surface corresponding to an inner surface (e.g., an inclined surface) of the groove 320.

[0123] One region of the plate 330 can define a top surface of a passage through which the refrigerant flows, and the second adhesive layer 314 can not be formed in the region. In other words, the second adhesive layer 314 can not be provided in a region corresponding to an uppermost portion in a depth direction among regions of the groove 320. For example, the second adhesive layer 314 can not be provided on one surface (e.g., an upper surface in Figure 4

[0124] ​Thus, when the refrigerant as a fluid is contained in the groove 320, the purity of the refrigerant can be maintained, and the refrigerant characteristics can be enhanced or improved, for example, the refrigerant can be prevented or reduced from contacting the second adhesive layer 314, thereby reducing or inhibiting the deterioration of the refrigerant characteristics due to chemical reactions and other physical reactions with the second adhesive layer 314. In some embodiments, by reducing or inhibiting impurities remaining in the refrigerant, the flow resistance of the refrigerant can be reduced, and the refrigerant flow characteristics can be enhanced or improved.

[0125] The third adhesive layer 351 can be provided in at least one region between the plate 330 and the display panel 10, and thus the plate 330 and the display panel 10 can be coupled or bonded to each other by the third adhesive layer 351. As an example, the plate 330 and the display panel 10 can be coupled or bonded using a roll lamination process.

[0126] The plate 330 can have one or more appropriate shapes. For example, the plate 330 can have a planar shape corresponding to the planar shape of the display panel 10, and as an example, can be formed in a planar shape having an area corresponding to the area of the display panel 10. As another example, the plate 330 can be formed to be smaller than the display panel 10, or as another example, can be formed to be larger than the display panel 10.

[0127] As an example, the plate 330 can have a thickness (e.g., in the Z-axis direction in Equation 1) and a width and a length in a direction perpendicular to the thickness direction of the plate 330, and the width and the length can have values at least greater than the thickness. Figure 4

[0128] In addition, as an example, the plate 330 can have a shape of a polygonal plane, and as an example, can have a shape of a rectangular plane.

[0129] The plate 330 can be formed of a material having a high thermal conductivity to well absorb heat of the display panel 10. In some embodiments, the plate 330 can be formed of a flexible material to facilitate bonding with the display panel 10, for example, to facilitate lamination bonding, and as an example can at least include a metal or graphite. For example, if the material of the plate 330 is a metal, the production cost of the heat dissipation member 30 can be prevented or reduced.

[0130] The second adhesive layer 314 can be provided in at least one region between the substrate 310 and the plate 330. The plate 330 and the substrate 310 can be coupled or bonded to each other by the thermal adhesive of the second adhesive layer 314.

[0131] The second adhesive layer 314 can have a second spaced region 314a in a region corresponding to the groove 320. The second spaced region 314a can be in the form of a penetration region that is a region not including (free of) the thermal adhesive.

[0132] ​Unlike a brazing or a heat staking method in which the adhesive material of the second adhesive layer 314 (e.g., a heat adhesive) can remain in the groove 320, causing a chemical reaction with the refrigerant (and, for example, deteriorating the performance of the heat dissipation member when physically removed), due to the second spacing region 314a, there is no remaining heat adhesive and / or adhesive material on the region of the top surface of the plate 330 defining the passage. This can result in a reduction in the flow resistance of the refrigerant and minimize the clogging of the refrigerant flow.

[0133] The second adhesive layer 314 (e.g., a heat adhesive) can have high adhesion so that the substrate 310 and the plate 330 are well adhered to each other, and can have water resistance to inhibit the penetration of external foreign substances such as moisture into the passage. In some embodiments, the second adhesive layer 314 includes a heat adhesive that can be made of a material having a high thermal conductivity to effectively receive heat emitted from the display panel 10.

[0134] The third adhesive layer 351 can be provided in at least one region between the plate 330 and the display panel 10. The plate 330 and the display panel 10 can be coupled to each other by a heat adhesive of the third adhesive layer 351.

[0135] In some embodiments, the third adhesive layer 351 includes a heat adhesive that can be made of a material having a high thermal conductivity to effectively receive heat emitted from the display panel 10.

[0136] The cover 340 can be provided to face a (e.g., first) surface of the substrate 310, which is opposite to a (e.g., second) surface facing the display panel 10. In detail, the first adhesive layer 313 can be provided in at least one region between the substrate 310 and the cover 340.

[0137] The cover 340 and the substrate 310 can be coupled or bonded to each other by a heat adhesive of the first adhesive layer 313.

[0138] The cover 340 is the outermost layer of the heat dissipation member 30 and must have a minimum thickness to withstand external impact, but the thickness of the display device 1 must be as thin as possible. As an example satisfying the condition, the thickness of the cover 340 can be equal to or greater than 0.1 μm and less than 0.5 μm.

[0139] The first adhesive layer 313 can be provided in at least one region between the substrate 310 and the cover 340. The cover 340 and the substrate 310 can be coupled or bonded to each other by a heat adhesive of the first adhesive layer 313.

[0140] The first adhesive layer 313 can have a first spacing region 313a in a region corresponding to the groove 320. The first spacing region 313a can be in the form of a penetration region that is a region not including (free of) a heat adhesive.

[0141] The presence of the first interval region 313a can provide an effect of reducing chemical reactions of residual adhesive material of the first adhesive layer 313 (e.g., a thermal adhesive) with the refrigerant in the groove 320 and performance deterioration of the heat dissipation member when the residual adhesive material is physically removed.

[0142] In other words, the first adhesive layer 313 (e.g., a thermal adhesive) can not be provided in a region among regions of the groove 320 corresponding to a bottom portion in a depth direction. For example, the first adhesive layer 313 (e.g., a thermal adhesive) can not be provided on one surface (e.g., a lower surface in Figure 6 to 12

[0143] Thus, when the refrigerant as a fluid is contained in the groove 320, the purity of the refrigerant can be maintained and the refrigerant characteristics can be improved, for example, the contact of the refrigerant with the first adhesive layer 313 (e.g., a thermal adhesive) can be prevented or reduced, thereby reducing or inhibiting deterioration of the refrigerant characteristics due to chemical reactions and other physical reactions with the first adhesive layer 313 (e.g., a thermal adhesive). In some embodiments, by reducing or inhibiting impurities remaining in the refrigerant, the flow resistance of the refrigerant can be reduced, and the refrigerant flow characteristics can be enhanced or improved.

[0144] The first adhesive layer 313 (e.g., a thermal adhesive) can have high adhesion so that the substrate 310 and the cover 340 are well adhered to each other, and can have water resistance to inhibit penetration of external foreign substances such as moisture into the passage. In some embodiments, the first adhesive layer 313 includes a thermal adhesive, which can be made of a material having high thermal conductivity to effectively receive heat emitted from the display panel 10.

[0145] Figures 6 to 11 are cross-sectional views each illustrating an example of a method of manufacturing a display device according to one or more embodiments of the disclosure.

[0146] For example, Figure 1 are cross-sectional views each illustrating an example of a method of manufacturing a display device according to one or more embodiments of the disclosure. Figure 1 are cross-sectional views each illustrating an example of a method of manufacturing a display device according to one or more embodiments of the disclosure.

[0147] For the convenience of explanation, Figure 6 the heat dissipation member 30 of

[0148] First, referring to Figure 7 ​The first release paper 312 can be stacked on the support member 311, the first adhesive layer 313 can be stacked on the first release paper 312, the substrate 310 can be stacked on the first adhesive layer 313, and the second adhesive layer 314 can be stacked on the substrate 310. For example, the base core structure of the heat dissipation member 30 can be provided or prepared.

[0149] As an example, the support member 311 can be made of metal. The metal support member 311 can be recycled, thereby reducing the production cost of the display device 1.

[0150] As an example, the support member 311 and the first release paper 312 can be coupled or bonded by different adhesive layers.

[0151] Referring to Figure 7 The groove 320, in which at least one passage can be formed, can be formed in the first adhesive layer 313, the substrate 310, and the second adhesive layer 314.

[0152] The groove 320 can be formed in the surface (e.g., the first surface and / or the second surface) of the substrate 310 by a process using a mold. The groove 320 can be formed in the substrate 310 such that at least a fluid can flow, and can be formed to have a region in which a width of a region farthest from (or away from) the display panel 10 in a thickness direction of the substrate 310 is narrower than a width of a region closest to (or near to) the display panel 10. In this case, the groove 320 can be formed by a process using a mold, as an optional example, by a punching process using a cutting mold. In one or more embodiments, an adhesive layer (e.g., the first adhesive layer 313 and / or the second adhesive layer 314) can be formed on the first surface and the second surface of the substrate 310 before the groove 320 is formed by using a mold.

[0153] The punching process can be performed by applying pressure to the cutting mold at least once in a direction in which the cutting mold comes into contact with the substrate 310, thereby forming the groove 320. As an optional embodiment, a cutting mold having a shape corresponding to the groove 320 having a closed ring shape with one or more curved surfaces can be prepared, and the punching process of applying pressure to the substrate 310 using the cutting mold can be performed at once, thereby realizing the shape of the groove 320.

[0154] When the punching process is performed, the depth (e.g., the punching depth) of the punched groove 320 can be selected or controlled such that the groove 320 can be formed up to the first release paper 312. In this step, the passage can be punched and formed.

[0155] When the groove 320 is formed, the support member 311 can fix the first release paper 312, the first adhesive layer 313, the substrate 310, and the second adhesive layer 314 formed thereon, inhibit the wall of the groove 320 and each layer from being bent or moved, and allow the formation of a narrow passage.

[0156] The substrate 310 can be made of a flexible material to facilitate the stamping of the groove 320. The substrate 310 can be formed of one or more suitable materials, and examples of such materials can include at least a polymer.

[0157] The groove 320 can be stamped to a desired length and shape to control the length and area of the passage through which the refrigerant flows. As an example, the groove 320 can be formed by stamping using a cutting die design. The width and area of the passage, the number of passages, etc. can be adjusted by selecting or controlling the stamping width and the stamping angle.

[0158] In some embodiments, the groove 320 can be formed by stamping using a cutting die design such that, in the thickness direction of the substrate 310, the width of the region farthest from (or away from) the display panel 10 is narrower than the width of the region closest to (or near to) the display panel 100. For example, the groove 320 can be formed such that its width decreases away from the display panel 10 in the thickness direction of the substrate 310. Thereby, when the refrigerant (e.g., liquid and / or gas) for cooling the display panel 10 is in the groove 320, the refrigerant can be stabilized in the groove 320, and the area toward the display panel 10 can increase, thereby enhancing or improving the heat dissipation efficiency.

[0159] The groove 320 can be formed by stamping to have inclined surfaces in at least one region of the substrate 310. As an example, the inclined surfaces can be formed to correspond to the inner surfaces of both sides of the groove 320 to face each other (e.g., face) in the width direction of the groove 320 (e.g., the X-axis direction in FIG. 4). Figure 7 In some embodiments, the inclined surfaces corresponding to the inner surfaces of both sides of the groove 320 can be symmetrical to each other. For example, the inclined surfaces corresponding to the inner surfaces of both sides of the groove 320 can be symmetrical to each other with respect to the thickness direction of the substrate 310 (e.g., the Z-axis direction in FIG. 4). Figure 7 In some embodiments, the inclined surfaces corresponding to the inner surfaces of both sides of the groove 320 can be asymmetrical to each other with respect to the thickness direction of the substrate 310 (e.g., the Z-axis direction in FIG. 4).

[0160] In some embodiments, the inclined surfaces corresponding to the inner surfaces of both sides of the groove 320 can be asymmetrical to each other with respect to the thickness direction of the substrate 310 (e.g., the Z-axis direction in FIG. 4). Figure 1 In some embodiments, the inclined surfaces corresponding to the inner surfaces of both sides of the groove 320 can be asymmetrical to each other with respect to the thickness direction of the substrate 310 (e.g., the Z-axis direction in FIG. 4).

[0161] In addition, one or more curved surfaces can be formed along the depth direction of the groove 320.

[0162] An angle formed between the groove 320 and one surface of the substrate 310 can be less than 90°. An angle g formed by a top surface of the substrate 310 and an inner surface of the groove 320 can be less than 90°. For example, among surfaces of the substrate 310, an angle g formed between an extension line of one surface facing the display panel 10 and the inner surface of the groove 320 can be less than 90°. As an alternative embodiment, when the second adhesive layer 314 is formed on a top (e.g., second) surface of the substrate 310 to have a side surface corresponding to the inner surface of the groove 320, among surfaces of the second adhesive layer 314, an angle g formed between an extension line of one surface facing the display panel 10 and the inner surface of the groove 320 can be equal to or less than 90°.

[0163] The groove 320 can be formed through a press process using a die (e.g., a cutting die). At this time, by forming an angle between the groove 320 and one surface of the substrate 310 to be less than 90°, cutting die manufacturing characteristics can be improved. Accordingly, during the press process using the cutting die, the cutting die can be easily removed from the substrate 310.

[0164] In the step of forming the groove 320, the groove 320 can be formed in one or more appropriate shapes using one or more cutting dies of an appropriate type (or kind). The groove 320 can be formed using one cutting die such that an angle between the substrate 310 and one surface of the groove 320 is in a range of 50° to 80°. If the angle between one surface of the groove 320 and the substrate 310 is less than 50°, a small amount of fluid can be accommodated in the groove 320, thereby reducing a heat dissipation effect. If the angle between one surface of the groove 320 and the substrate 310 exceeds 80°, it can be difficult to manufacture using a cutting die, and it can be difficult to remove the cutting die from the substrate 310 during a press process using the cutting die.

[0165] As an example, the groove 320 can be formed through a press process repeated more than once (e.g., multiple times) in which the groove 320 is formed long in one direction of the substrate 310 (e.g., in a direction parallel to one side of the substrate 310) and the direction is switched to make the groove 320 long again in the direction parallel to one side of the substrate 310. In some embodiments, as described in the text, a cutting die used to perform the press process can be prepared in advance to correspond to the overall shape of the groove 320, so that the shape of the groove 320 can be achieved through a single press process.

[0166] In some embodiments, the groove 320 can be formed from near one vertex of the substrate 310 along a side adjacent to the one vertex (e.g., a side parallel to the one vertex), and the groove 320 can be formed from near another vertex of the substrate 310 along a side adjacent to the other vertex (e.g., a side parallel to the other vertex). Figure 7The groove 320 can be punched up to the side opposite to the one side. The groove 320 can form one or more closed loops.

[0167] When the groove 320 is formed, the first adhesive layer 313 and the second adhesive layer 314 for portions corresponding to the bottom surface and the top surface of the passage can also be punched, thereby reducing the area of the refrigerant flowing along the passage in contact with the adhesive (e.g., thermal adhesive).

[0168] Accordingly, the second adhesive layer 314 can not be formed in a region of the top surface of the plate 330 that can define a passage through which a refrigerant flows. In other words, the second adhesive layer 314 (e.g., thermal adhesive) can not be provided in a region among regions of the groove 320 corresponding to the uppermost portion in the depth direction. For example, the second adhesive layer 314 (e.g., thermal adhesive) can not be provided on a surface (e.g., the upper surface in Figure 4 ) of the plate 330 facing one surface of the plate 330 among the regions of the groove 320.

[0169] The second adhesive layer 314 can have a second spaced region 314a (see, e.g., Figure 7 ) defined in a region corresponding to the groove 320. The second spaced region 314a can be in the form of a penetration region that is a region without the second adhesive layer 314.

[0170] In some embodiments, the first adhesive layer 313 can not be formed in a region of the cover 340 that can define a bottom surface of a passage through which a refrigerant flows. In other words, the first adhesive layer 313 (e.g., thermal adhesive) can not be provided in a region among regions of the groove 320 corresponding to the lowermost portion in the depth direction. For example, the first adhesive layer 313 (e.g., thermal adhesive) can not be provided on a surface (e.g., the lower surface in Figure 4 ) of the cover 340 facing one surface of the cover 340 among the regions of the groove 320.

[0171] The first adhesive layer 313 can have a first spaced region 313a (see, e.g., Figure 8 ) defined in a region corresponding to the groove 320. The first spaced region 313a can be in the form of a penetration region that is a region not including (without) the thermal adhesive of the first adhesive layer 313.

[0172] By the foregoing description, when the refrigerant as a fluid is contained in the groove 320, the purity of the refrigerant can be maintained, and the refrigerant characteristics can be enhanced or improved, for example, the contact of the refrigerant with the thermal adhesive of the first adhesive layer 313 and the second adhesive layer 314 can be prevented or reduced, thereby reducing or inhibiting the deterioration of the refrigerant characteristics due to chemical reactions and other physical reactions with the thermal adhesive of the first adhesive layer 313 and the second adhesive layer 314. In some embodiments, by reducing or inhibiting the impurities introduced or remaining in the refrigerant, the flow resistance of the refrigerant can be prevented or reduced, and the refrigerant flow characteristics can be enhanced or improved.

[0173] Referring to Figure 9 After the groove 320 defining the channel is formed, the plate 330 can be stacked on the second adhesive layer 314. For example, this step can be a step of attaching the plate 330. When the plate 330 is attached, the channel can be provided or generated.

[0174] One area of the plate 330 can define a top surface of the channel through which the refrigerant flows. The second adhesive layer 314 can be removed from the area by punching, thereby avoiding the performance deterioration of the heat dissipation member (for example, improving the problem) caused when the residual adhesive material chemically reacts with the refrigerant and is physically removed.

[0175] Referring to Figure 10 After the plate 330 is attached, the first release paper 312 and the support member 311 on the opposite side of the plate 330 can be removed.

[0176] The first release paper 312 can be a layer whose surface is treated to protect the adhered surface and is easily removed from the support member 311.

[0177] The support member 311 can be made of a metal material and can be recycled because the groove 320 is not punched therein.

[0178] Referring to Figure 11 After the first release paper 312 and the support member 311 are removed, the cover 340 and the third adhesive layer 351 can be attached, and the second release paper 350 can be attached on the third adhesive layer 351. In this step, the heat dissipation member 30 can be provided or commercialized by attaching the cover 340 and the third adhesive layer 351.

[0179] The cover 340 can be attached to a surface of the first adhesive layer 313 from which the first release paper 312 and the support member 311 have been removed.

[0180] One area of the cover 340 can define a bottom surface of the channel through which the refrigerant flows. The first adhesive layer 313 can be removed from the area by punching, thereby avoiding the performance deterioration of the heat dissipation member (for example, improving the problem) caused when the residual adhesive material chemically reacts with the refrigerant and is physically removed.

[0181] The third adhesive layer 351 can be stacked on the plate 330, and the second release paper 350 can be stacked on the third adhesive layer 351. The third adhesive layer 351 can be a layer through which the heat dissipation member 30 (e.g., the plate 330) is bonded to the display panel 10. The second release paper 350 can maintain and protect the adhesive strength of the third adhesive layer 351, and can be easily removed so that the display panel 10 and the third adhesive layer 351 can be coupled or bonded to each other.

[0182] Referring to Figure 12 , attachment of the display panel 10 and the heat dissipation member 30 is illustrated. The heat dissipation member according to another embodiment can be applied to the method of manufacturing a display apparatus according to one or more embodiments of the disclosure in substantially the same manner or by being modified within a similar range as needed.

[0183] The display panel 10 and the heat dissipation member 30 can be separately provided or prepared, and coupled or attached to each other. However, the second release paper 350 on the third adhesive layer 351 of the heat dissipation member 30 can be removed before the display panel 10 and the heat dissipation member 30 are attached.

[0184] Attachment of the display panel 10 and the heat dissipation member 30 can be provided or performed using one or more appropriate methods. As an example, the display panel 10 and the heat dissipation member 30, which are flat panels, can be coupled or bonded through a roll lamination process in which two layers are pressed by a pair of rollers 40 to be coupled or bonded to each other.

[0185] Through the coupling or bonding process of the display panel 10 and the heat dissipation member 30, the display apparatus 1 as illustrated in Figure 12 can be manufactured.

[0186] In the manufacturing method according to one or more embodiments, the display apparatus 1 can be easily manufactured by easily attaching the display panel 10 and the heat dissipation member 30, and as an example, the display apparatus 1 having a large size can be efficiently manufactured.

[0187] Referring to Figures 6 to 11 , the display apparatus 1 can be manufactured by Figure 13In one example of the display device 1 manufactured through the steps, the heat dissipation member 30 can be provided on one surface of the display panel 10, one surface of the plate 330 of the heat dissipation member 30 can be adhered to one surface of the display panel 10 through the third adhesive layer 351, and the other surface of the plate 330 can be adhered to one surface (e.g., the second surface) of the substrate 310 through the second adhesive layer 314 between the plate 330 and the substrate 310. The other surface (e.g., the first surface) of the substrate 310 can be adhered to the cover 340 through the first adhesive layer 313 between the substrate 310 and the cover 340. In addition, the groove 320 can be formed in the first adhesive layer 313, the substrate 310, and the second adhesive layer 314 to form an angle of less than 90° with the surface of each layer.

[0188] In one example of the display device 1 manufactured through the steps, the heat dissipation member 30 can be provided on one surface of the display panel 10, one surface of the plate 330 of the heat dissipation member 30 can be adhered to one surface of the display panel 10 through the third adhesive layer 351, and the other surface of the plate 330 can be adhered to one surface (e.g., the second surface) of the substrate 310 through the second adhesive layer 314 between the plate 330 and the substrate 310. The other surface (e.g., the first surface) of the substrate 310 can be adhered to the cover 340 through the first adhesive layer 313 between the substrate 310 and the cover 340. In addition, the groove 320 can be formed in the first adhesive layer 313, the substrate 310, and the second adhesive layer 314 to form an angle of less than 90° with the surface of each layer.

[0189] For example, the heat dissipation member 30 in one or more embodiments of the present disclosure can be configured as a three-layer structure in which the plate 330 and the cover 340 are provided on one surface and the other surface of the polymer substrate 310 in which the channel is formed. In some embodiments, since the plate 330 can be made of a graphite material, the heat dissipation member 30 can have a composite structure of a pulsating heat pipe and a graphite layer, which includes the groove 320 forming the channel and the plate 330 as a graphite layer covering the groove 320.

[0190] In the display device 1 having the structure described in the text through the foregoing steps, the substrate 310 can be made of a polymer material, which can improve or facilitate the coupling or bonding of the heat dissipation member 30 and the display panel 10, and the plate 330 and the metal support member 311, which can be made of a metal material, can reduce production costs and ensure the structural stability of the display device 1.

[0191] The plate 330 and the cover 340 in one zone, which define the bottom and top surfaces of the channel through which the refrigerant flows, can be spaced apart and / or separated from each other (e.g., spaced apart or separated) without the second adhesive layer 314 and the first adhesive layer 313 being disposed therebetween. Accordingly, when the refrigerant flows in the channel, the contact area between the refrigerant and the residual adhesive material can be reduced, thereby resulting in a reduction in the flow resistance of the refrigerant and avoiding or mitigating clogging of the channel.

[0192] The method of forming the groove 320 using a cutting die (e.g., a knife die) can improve or facilitate the machining and formation of the channel shape. In some embodiments, the way in which the punch angle, depth, and width of the groove 320 can be selected or controlled to provide a display device 1 having improved heat dissipation effects by forming a channel through which the refrigerant flows.

[0193] Figure 13 A cross-sectional view illustrating an example of a cutting die used in manufacturing a display device according to one or more embodiments.

[0194] When the channel through which the refrigerant flows is formed by punching, one or more appropriate cutting dies can be used to form the groove 320. Depending on the type (or kind) of the cutting die, the angle of each channel segment formed with the substrate 310 can vary, and one or more appropriate channel shapes and widths can be achieved.

[0195] For example, when the angle between the knife of the cutting die 50 and the plate supporting the knife is close to 90°, the angle between the channel (i.e., the groove 320) formed and the substrate 310 can also be close to 90°.

[0196] Figure 12 An example of a cutting die used when forming a channel in an exemplary heat dissipation member 30 is illustrated. Figure 14 The groove 320 can be formed using the cutting die 50.

[0197] The cutting die 50 can include a flat portion 51 and a protruding portion 52, which can be a knife. The flat portion 51 can serve as a base plate to which the protruding portion (e.g., the knife) 52 is attached.

[0198] The protruding portion 52 can be directed symmetrically about the center of the protruding portion 52 to form a channel with the knife. The protruding portion 52 can extend from the flat portion 51 to form an inclined plane with respect to the flat portion 51, and the angle a formed between the inclined plane and the flat portion 51 can be in the range of 50° to 70°.

[0199] The groove 320 manufactured by the cutting mold 50 can form an angle g formed between the upper surface (e.g., the second surface) of the substrate 310 and the inclined surface of the groove 320 to correspond to the angle a formed between the protruding portion 52 and the flat portion 51 of the cutting mold 50. The angle a formed between the protruding portion 52 and the flat portion 51 of the cutting mold 50 can be in the range of 50° to 70°, and the angle g formed between the upper surface (e.g., the second surface) of the substrate 310 and the inclined surface of the groove 320 can be in the range of 50° to 70°.

[0200] Figure 15 To illustrate a cross-sectional view of an example of a display device manufactured using a cutting mold according to one or more embodiments, and Figure 14 To illustrate a cross-sectional view of an example of a display device manufactured using a cutting mold according to one or more embodiments, and Figure 14 To illustrate a cross-sectional view of an example of a display device manufactured using a cutting mold according to one or more embodiments, and

[0201] Figure 15 To illustrate another example of a cutting mold used when forming a channel in the heat dissipation member 30' according to one or more embodiments. Figure 16 The groove 320' can be formed using the cutting mold 60.

[0202] The cutting mold 60 can include a flat portion 61 and a protruding portion 62 which can be a knife. The flat portion 61 can serve as a base plate to which the protruding portion (e.g., knife) 62 is attached.

[0203] The protruding portion 62 can be symmetrically directed about the center of the protruding portion 62 to form a channel with the knife.

[0204] The inclined surface of the knife can extend from the flat portion 61 to form a first angle b with the flat portion 61, and the extended inclined surface can then be bent to form a second angle c with the flat portion 61. The first angle b can be an angle in the range of 83° to 90°, and the second angle c can be an angle in the range of 62.5° to 75°.

[0205] The groove 320' manufactured by the cutting mold 60 can form an angle b' between the upper surface (e.g., the second surface) of the substrate 310' and the inclined surface of the groove 320' to correspond to the first angle b formed between the protruding portion 62 and the flat portion 61 of the cutting mold 60, and can form an angle c' between the upper surface of the cover 340' and the surface of the groove 320' contacting the cover 340' to correspond to the second angle c formed between the bent inclined surface at the protruding portion 62 and the flat portion 61 of the cutting mold 60.

[0206] The first angle b of the cutting die 60 can be in the range of 83° to 90°, the second angle c can be in the range of 62.5° to 75°, the angle b' between the upper surface of the substrate 310' and the inclined surface of the groove 320' can be in the range of 83° to 90°, and the angle c' between the upper surface of the cover 340' and the surface of the groove 320' contacting the cover 340' can be in the range of 62.5° to 75°.

[0207] Figure 17 FIG. 6 is a cross-sectional view illustrating an example of a cutting die used to manufacture a display device according to an embodiment. Figure 16 FIG. 7 is a cross-sectional view illustrating an example of a display device manufactured using the cutting die of FIG. 6. Figure 16 FIG. 8 is a cross-sectional view illustrating an example of a cutting die used to manufacture a display device according to an embodiment.

[0208] Figure 17 FIG. 9 is a cross-sectional view illustrating another example of a cutting die used when forming a channel in the heat dissipation member 30" according to an embodiment. Figure 18 The groove 320" of FIG. 9 can be formed using the cutting die 70.

[0209] The cutting die 70 can include a flat portion 71 and a protruding portion 72 which can be a knife. The flat portion 71 can serve as a base plate to which the protruding portion (e.g., knife) 72 is attached.

[0210] The protruding portion 72 can include two sides extending at an angle of 90° from the flat portion 71 to form a channel with the knife. The two sides can have different lengths, and their ends can be connected by a straight line.

[0211] An angle d between the flat portion 71 and the line connecting the ends of the two sides extending from the flat portion 71 can be in the range of 70° to 80°.

[0212] The groove 320" manufactured by the cutting die 70 can form an angle d" between the upper surface of the cover 340" and the surface of the groove 320" contacting the cover 340", corresponding to the angle d between the flat portion 71 and the inclined surface defined by the line connecting the ends of the two sides extending from the flat portion 71 of the protruding portion 72.

[0213] An angle d between the flat portion 71 and the line connecting the ends of the two sides extending from the flat portion 71 of the cutting die 70 can be in the range of 70° to 80°, and an angle d" between the upper surface of the cover 340" and the surface of the groove 320" contacting the cover 340" can be in the range of 70° to 80°.

[0214] The display device 1 can further include a housing accommodating the display panel 10 and the heat dissipation member 30. For example, the heat dissipation member 30 can be placed between the housing and the display panel 10.

[0215] The display device 1 according to one or more embodiments can be applied to one or more appropriate electronic devices 1000. The electronic device 1000 according to one or more embodiments can include the display device 1 described herein, and in addition to the display device 1, can further include a module or a device having an additional function.

[0216] Figure 18 is a block diagram of an electronic device according to one or more embodiments. Referring to Figure 19 The electronic device 1000 according to one or more embodiments can include a display module 1100, a processor 1200, a memory 1300, and a power module 1400.

[0217] The processor 1200 can include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0218] The memory 1300 can store data information required for the operation of the processor 1200 or the display module 1100. In the case where the processor 1200 executes an application stored in the memory 1300, an image data signal and / or an input control signal can be transmitted to the display module 1100, and the display module 1100 can output image information through a display screen by processing the received signal.

[0219] The power module 1400 can include a power supply module such as a power adapter or a battery device, and a power conversion module that converts power supplied by the power supply module to generate power required for the operation of the electronic device 1000.

[0220] At least one of the respective components of the electronic device 1000 can be included in the display device 1 according to one or more embodiments described herein. In some embodiments, some individual modules functionally included in the modules can be included in the display device, and other modules can be provided separately from the display device. For example, the display device 1 can include the display module 1100, and the processor 1200, the memory 1300, and the power module 1400 can be provided in the form of other devices than the display device 1 in the electronic device 1000.

[0221] Figure 19 An example of a schematic diagram of a single electronic device according to one or more appropriate embodiments.

[0222] Referring to ​The one or more appropriate electronic devices to which the display device 1 according to the embodiments is applied can include an electronic device for displaying an image such as a smartphone 1000.1a, a tablet personal computer 1000.1b, a laptop computer 1000.1c, a television 1000.1d, a desktop monitor 1000.1e, etc., a wearable electronic device including a display module such as smart glasses 1000.2a, a head-mounted display 1000.2b, a smart watch 1000.2c, etc., and an electronic device for a vehicle including a display module 1000.3 such as a center information display (CID) provided on an instrument panel, a center console, or a dashboard of a vehicle, an interior mirror display, etc.

[0223] Each of the embodiments described herein can be independently implemented, but of course the structure of each embodiment can be applied in combination to other embodiments.

[0224] Thus, the present disclosure has been described with reference to the embodiments illustrated in the drawings, but these are merely illustrative, and those skilled in the art will understand that one or more appropriate modifications and other embodiments equivalent thereto are possible. Therefore, the true technical scope of the present disclosure should be determined by the technical spirit of the appended patent claims.

[0225] The specific implementations described in the embodiments are examples and do not limit the scope of the embodiments in any way. In addition, if there is no specific mention such as "essentially", "importantly", etc., it can not be a necessary component for applying the present disclosure.

[0226] In the specification of the embodiments, particularly in the claims, the use of the term "above" and similar reference terms can refer to both singular and plural. In some embodiments, when a range is described in an example, the present disclosure includes the application of individual values within the range (unless there is a contrary description), and is the same as describing each individual value constituting the range in the detailed description. Finally, unless the order of the steps constituting the method according to the embodiments is clearly described or there is a contrary description, the steps can be performed in an appropriate order. The embodiments are not necessarily limited to the order of the steps described above. The use of all examples or illustrative terms in the embodiments is only for the purpose of detailing the embodiments, and unless limited by the claims, the scope of the embodiments is not limited by the examples or illustrative terms. In addition, those skilled in the art will recognize that one or more appropriate modifications, combinations, and changes can be made according to design conditions and factors within the scope of the appended claims or their equivalents.

[0227] The display device, the method of manufacturing a display device, and the electronic device according to the embodiments of the present disclosure can improve manufacturing convenience and heat dissipation characteristics.

[0228] Terms such as "substantially," "about," and "approximately" are utilized herein to account for inherent discrepancies in, for example, measurements or calculations that those of ordinary skill in the art will readily understand. They can encompass a margin of error or a range of values that those of ordinary skill in the art would consider to be a reasonable alternative to an exact value. For example, "about" can refer to one or more standard deviations, or ± 30%, 20%, 10%, or 5% of a recited value.

[0229] Numerical ranges recited within the text include and are intended to disclose all subranges encompassed therein. For example, a range from 1.0 to 10.0 includes and intends all subranges involving a minimum value of equal to or greater than 1.0 and a maximum value of equal to or less than 10.0, such as 2.4 to 7.6. Accordingly, the applicant reserves the right to amend this specification, including the claims, to expressly recite any subranges of the ranges explicitly recited within the text.

[0230] Display apparatuses, electronic devices, manufacturing equipment therefor, and / or any other related apparatuses or components according to embodiments of the disclosure described in the text can be implemented using any appropriate hardware, firmware (e.g., an application-specific integrated circuit), software, or a combination of software, firmware, and hardware. For example, one or more appropriate components of a display apparatus and / or an electronic device can be formed on one integrated circuit (IC) chip or on separate IC chips. Further, one or more appropriate components of a display apparatus and / or an electronic device can be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on one substrate. Further, one or more appropriate components of a display apparatus and / or an electronic device can be a process or thread, running on one or more processors in one or more computing devices, executing computer program instructions and interacting with other system components for the purpose of displaying and / or generating graphical information for one or more appropriate functions described in the text. The computer program instructions can be stored in a memory, which can be implemented using a standard memory device such as random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer readable media such as, for example, a CD-ROM, a flash drive, etc. Moreover, those skilled in the art will appreciate that the functions of one or more appropriate computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed across one or more other computing devices, without departing from the scope of embodiments of the disclosure.

[0231] In the context of the present application, the term "use" can be considered synonymous with the term "utilize" unless otherwise defined.

[0232] It is to be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects in each of the embodiments should typically be considered as being applicable to other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details can be made therein without departing from the spirit and scope as defined by the following claims and their equivalents.

Claims

1. A display device comprising: a display panel; and a heat dissipation member over a surface of the display panel, the heat dissipation member comprising: a substrate having a first surface and a second surface opposite to the surface of the display panel; and a cover having a surface opposite to the first surface of the substrate, wherein a groove is in the substrate, the groove is a fluid passage and has a first width region and a second width region, and wherein the first width region is away from the display panel in a thickness direction of the substrate and is narrower than the second width region which is close to the display panel in the thickness direction of the substrate.

2. The display device according to claim 1, wherein the groove has a width which gradually decreases along a depth direction of the groove.

3. The display device according to claim 1, wherein the groove has an inclined surface in at least one region of the substrate.

4. The display device according to claim 3, wherein the groove has symmetrical inclined surfaces.

5. The display device according to claim 1, wherein an angle between an extension line of the second surface of the substrate and an inner surface of the groove is equal to or smaller than 90°.

6. The display device according to claim 5, wherein the angle between the extension line of the second surface of the substrate and the inner surface of the groove is in a range of 50° to 80°.

7. The display device according to claim 1, wherein a first adhesive layer is in at least one region between the substrate and the cover.

8. The display device according to claim 7, wherein the first adhesive layer includes: a thermal adhesive; and a first spacing region which does not include the thermal adhesive in a region corresponding to the groove.

9. The display device according to claim 1, wherein a plate is coupled to the second surface of the substrate.

10. The display device according to claim 9, wherein a second adhesive layer is in at least one region between the substrate and the plate.

11. The display device according to claim 10, wherein the second adhesive layer includes: a thermal adhesive; and a second spacing region which does not include the thermal adhesive in a region corresponding to the groove.

12. The display device according to claim 9, wherein a third adhesive layer is between the plate and the display panel.

13. The display device according to any one of claims 1 to 12, wherein the substrate includes a flexible material.

14. The display device according to any one of claims 1 to 12, wherein the substrate includes a polymer-based material.

15. A method of manufacturing a display device, the method comprising: providing a display panel; providing a heat dissipation member; and coupling the display panel to the heat dissipation member, the heat dissipation member comprising: a substrate having a first surface and a second surface opposite to a surface of the display panel; and a cover having a surface opposite to the first surface, wherein a groove is in the substrate, the groove is a fluid passage and has a first width region and a second width region, and wherein the first width region is away from the display panel in a thickness direction of the substrate and is narrower than the second width region which is close to the display panel in the thickness direction of the substrate. ​ ​ ​ ​ wherein the first width region is narrower than the second width region in a thickness direction of the substrate away from the display panel. 16.The method of claim 15, wherein the providing the heat dissipation member includes forming the groove in the first surface and / or the second surface of the substrate by using a mold. 17.The method of claim 16, wherein the mold includes a cutting die for punching. 18.The method of claim 16, wherein the providing the heat dissipation member further includes: forming an adhesive layer on the first surface and the second surface of the substrate before forming the groove by using the mold. 19.The method of claim 16, wherein the providing the heat dissipation member further includes attaching a plate after forming the groove. 20.An electronic device comprising: the display apparatus of any one of claims 1 to 14.

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