Stage and tool for heterogeneous integration of variable size dies

Abstract

A support structure for a die, comprising: an array of attachment connections configured to hold die actuators, each of the die actuators being held by at least one attachment connection; and an array of controller connections configured to interface with the die actuators to control movement of the die actuators, where the array of controller connections is interspersed in the array of attachment connections. A system for die positioning includes a first stage supporting an array of die actuators; a second stage supporting a plurality of receptor target dies; and a measurement system functionally coupled to at least one of the first stage and the second stage and configured to position the at least one of the first stage and the second stage such that a position of the first donor die corresponds to a position of the first acceptor target die.

Description

Cross-reference to related applications

[0001] This application claims priority to EP application 23184264.2, filed on 7 July 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure generally relates to platforms and tools for heterogeneous integration. Background Technology

[0003] In the manufacturing process of integrated circuits (ICs), multiple completed or incomplete ICs (e.g., entire wafers, diced wafers, partially diced wafers, chips, dies, etc.) can be contacted, stacked, bonded, or otherwise joined (e.g., joined to heterogeneous or homogeneous devices) at different points in the manufacturing process. Heterogeneous integration (e.g., the integration of different circuits or other patterned devices) can rely on the joining of specific portions of multiple dies (e.g., conductive contact elements), where these specific portions can be aligned in three-dimensional space to ensure functional connectivity. The mutual alignment of these dies, which may have multiple manufacturing layers, different critical dimensions, different nodes, packages, etc., may require different techniques than those used in photolithography during manufacturing. As the physical size of IC components continues to shrink and their structures continue to become more complex, accuracy and yield in integration become increasingly important. For applications such as heterogeneous integration, accurate and rapid placement of dies relative to each other may be desirable.

[0004] In the context of semiconductor manufacturing, improvements in die placement and alignment (e.g., improvements in heterogeneous integration) lead to improvements in IC manufacturing and integration capabilities. Summary of the Invention

[0005] According to one embodiment, a support structure for a die is provided, comprising: an array of attachment connectors configured to hold die actuators, each die actuator being held by at least one attachment connector; and a controller connection array configured to interface with the die actuators to control movement of the die actuators, wherein the controller connection array is distributed among the attachment connector arrays, and wherein the attachment connector array and the controller connection array are configured to remain in a static position during the movement of the die actuators.

[0006] In one embodiment, the support structure further includes a plurality of die actuators, individual die actuators being attached to the support structure via at least one of the attachment connectors, and individual die actuators being connected to at least one of the controller connectors.

[0007] According to another embodiment, a system for die positioning is provided, the system comprising at least two support structures as described in any other embodiment.

[0008] According to another embodiment, a system for die positioning is provided, the system comprising: a first stage supporting an array of die actuators, wherein the die actuators are configured to actuate at least one of a plurality of donor dies; a second stage supporting a plurality of target dies; and a measurement system functionally coupled to at least one of the first and second stages and configured to: obtain a relative position between a first donor die among the plurality of donor dies and a first recipient target die among the plurality of target dies; position at least one of the first and second stages such that the position of the first donor die corresponds to the position of the first target die; and activate a die actuator supporting the first donor die to place the first donor die on the first target die.

[0009] According to one embodiment, a die positioning tool is provided that is configured to perform the methods of any other embodiment.

[0010] According to another embodiment, one or more non-transitory machine-readable media having instructions thereon, which, when executed by a processor, are configured to perform the methods of any other embodiment. Attached Figure Description

[0011] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one or more embodiments and explain these embodiments together with the specification. Embodiments of the invention will now be described by way of example only, with reference to the accompanying drawings, wherein corresponding reference numerals indicate corresponding parts, and wherein:

[0012] Figures 1A-1D This is a schematic diagram illustrating an exemplary die bonding method according to an embodiment.

[0013] Figures 2A-2B This is a schematic diagram illustrating an example apparatus for die bonding according to an embodiment.

[0014] Figures 3A-3H This is a schematic diagram illustrating a die placement method according to an embodiment.

[0015] Figures 4A-4C This is a schematic diagram illustrating a support structure for dies of various sizes according to an embodiment.

[0016] Figures 5A-5B This is a schematic diagram illustrating a die placement method using an example support structure with two inputs according to an embodiment.

[0017] Figures 6A-6BThis is a schematic diagram illustrating a die placement method using an example support structure with four inputs according to an embodiment.

[0018] Figure 7 This is a flowchart illustrating a die placement method according to an embodiment.

[0019] Figure 8 This is a block diagram of an example computer system according to embodiments of the present disclosure. Detailed Implementation

[0020] Embodiments of this disclosure are described in detail with reference to the accompanying drawings, which are provided as illustrative examples to enable those skilled in the art to practice this disclosure. It is important to note that the following drawings and examples are not intended to limit the scope of this disclosure to a single embodiment, but rather other embodiments are possible by interchangeing some or all of the elements described or illustrated. Furthermore, where certain elements of this disclosure may be implemented partially or entirely using known components, only those portions of such known components necessary for understanding this disclosure will be described, and detailed descriptions of other portions of such known components will be omitted to avoid obscuring this disclosure. Embodiments described as being implemented in software are not intended to be limited thereto, but may include embodiments implemented in hardware or a combination of software and hardware, and vice versa, as will be apparent to those skilled in the art, unless otherwise specified herein. Embodiments illustrating a single component in this specification should not be considered limiting; rather, this disclosure is intended to cover other embodiments including a plurality of identical components, and vice versa, unless expressly stated herein. Furthermore, the applicant does not intend any terminology in the specification or claims to have an unusual or particular meaning unless so expressly stated. Furthermore, this disclosure covers current and future known equivalents of the known components mentioned herein as illustrative purposes.

[0021] While specific references to IC manufacturing may be made in this text, it should be clearly understood that the description herein has many other possible applications. For example, it can be used to manufacture integrated optical systems, guide and detection patterns for magnetic domain memory, liquid crystal displays, thin-film magnetic heads, etc. Those skilled in the art will understand that, in the context of such alternative applications, any use of the terms "wafer" or "die" in this text should be considered interchangeable with the more general terms "substrate" and "target portion," respectively. The term "wafer" can generally be used to refer to a large manufacturing unit, which may be the largest manufacturing unit, while the term "die" can be used to refer to a smaller manufacturing unit, which may correspond to a lithographic pattern, a portion of a lithographic pattern, multiple lithographic patterns, etc. "Die" can correspond to a portion of a "wafer"—that is, a "die" can be produced by dicing or otherwise dividing a "wafer." The term "die" should be considered interchangeable with the terms chip, chiplet, or other terms used for IC dicing. Patterning equipment (e.g., lithography equipment) may include or can form one or more patterns, which may correspond to one or more dies. Patterns can be generated using CAD (Computer-Aided Design) programs based on patterns or design layouts; this process is often referred to as EDA (Electronic Design Automation). Unless otherwise stated, the word "or" as used throughout this application takes a non-exclusive meaning, encompassing both "and" and "or". "Each," "every," "all," "corresponding," "individual," and other relational terms essentially encompass "each," "every," "all," etc., including cases where each, every, all, corresponding, individual, etc., can include situations where a relationship is not one-to-one or excludes every possible item. For example, "each" can exclude items such as those determined to be defective during testing. "Each" can exclude items such as unused marginal items. "All" can exclude items such as excess items. "Corresponding" does not require items to correspond in an exact one-to-one manner. For example, the first item can correspond to two items in the second item, or vice versa. In some cases, "individual" can refer to multiple items, such as each item A having an individual item B, where item A can have two items B.

[0022] Now to Figures 1A-1D For reference, Figures 1A-1DThis is a schematic diagram illustrating an exemplary die bonding method according to an embodiment of the present disclosure. The exemplary die bonding method is described relative to a set of reference axes, which are consistent in the schematic diagram. The reference axes are provided merely for ease of description and not as a limitation. The included methods and apparatus may alternatively be described with reference to different sets of axes (e.g., cylindrical coordinates, polar coordinates, etc.), different origins (e.g., the origin in the donor die, the origin in the target, the origin between the donor die and the target, etc.), or different orientations. A set of standard axes is selected such that the manufacturing plane of the die (i.e., the wafer surface) lies in the xy plane, and wherein, for the donor die and the target location, the manufacturing direction is parallel or antiparallel to the z-axis.

[0023] like Figures 1A-1D As shown, an exemplary die bonding method may involve a donor die 102 and a target die 104. In this document, the terms "donor" and "target" are used for ease of description. It should be understood that the terms "donor" and "target" are provided for reference and are relative, and an element described as corresponding to "donor" may alternatively correspond to "target," and vice versa. The target die may also be referred to, or alternatively, as a recipient die. The donor die 102 may have an electrically active region 106, such as on the alignment surface of the donor die 102. The electrically active region 106 may correspond to a via (e.g., a through-silicon via (TSV)), an electrical contact line, a contact pad, a package pad, or other conductive region. The donor die 102 may have one or more electrically inert regions (e.g., electrically insulating regions) outside the electrically active region 106, such as on the alignment surface of the donor die 102. The electrically active region 106 may be recessed relative to other surfaces of the donor die 102 (as shown). The electrically active region 106 may correspond to the contacts (e.g., source, drain, gate, etc.) of the electronic devices within the donor die 102 (not shown). The target die 104 may also have an electrically active region 108, which may have similar properties to the electrically active region 106.

[0024] like Figure 1A As shown, an exemplary die bonding method may involve aligning at least some electrically active regions 106 of a donor die 102 with at least some electrically active regions 108 of a target die 104. An exemplary die bonding method may involve contacting the donor die 102 with the target die 104 while maintaining alignment between the electrically active regions 108 and 106. An exemplary die bonding method may involve applying or maintaining pressure between the donor die 102 and the target die 104, such as when bonding (e.g., chemical bonding) occurs between the donor die 102 and the target die 104. Multiple layers of the donor die 102 or multiple layers of the target die 104 (which may be optically opaque) can complicate alignment. Figures 1A-1CCross-sectional views of various parts of an exemplary die bonding method are depicted.

[0025] like Figure 1A As further shown, the donor die 102 and the target die 104 can be brought together along the z-axis, and the position of the donor die 102 or the target die 104 can be adjusted in the xy plane (e.g., perpendicular to the nearest z-axis) to improve the alignment between the donor die 102 and the target die 104. Figure 1B As shown, the donor die 102 and the target die 104 can be annealed after contact. Annealing can be, or includes, thermal annealing, electrical annealing, electrostatic treatment, van der Waals treatment, etc. Figure 1C As shown, annealing can cause physical or chemical changes in the electrically active region 106 of the donor die 102 or in the electrically active region 108 of the target die 104, which can cause physical or electrical contact between the electrically active regions 108 and 106. Therefore, annealing can create an electrical connection (e.g., integration) between the components of the donor die 102 and the target die 104. This electrical connection can occur even if the electrically active regions 106 and 108 are different—for example, having different recess depths, being made of different materials, having different dimensions, etc.

[0026] Figure 1D A plan view depicting an example die bonding method according to this disclosure is shown. Figure 1D As shown, donor die 102 and target die 104 may have alignment marks along the xy-plane to facilitate alignment of the dies as a whole. Alignment marks in the xy-plane of the dies (e.g., alignment mark 116 on donor die 102 or alignment mark 118 on target die 104) can reduce the area available for use in the circuit system. Alignment marks can be manufactured additively or subtractively, such as by etching or depositing in the z-direction. Alignment marks used during wafer fabrication (such as alignment marks used during photolithography to align one or more fabrication layers) can be placed in scrap areas, such as areas between chips, which can then be destroyed (e.g., removed) during dicing. Dicing, as used herein, refers to the mechanical separation of a region of the wafer (e.g., a fabrication cell) into a smaller region (e.g., a die or chip) that may contain one or more operational units (e.g., logic devices, memory cells, etc.). Cutting can be performed using any suitable method—e.g., dicing and breaking, mechanical sawing, laser dicing, etc.—and when separating the die, cutting can destroy (e.g., grind into powder or otherwise render unusable for circuit system placement) the non-zero linewidth portion of the wafer volume. Alternatively, the electrically active region 106 of the donor die 102 or the electrically active region 108 of the target die 104 ( Figure 1D(Not shown) or other surface features (e.g., metal contact pads) can be used as reference marks (e.g., alignment marks) for aligning the donor die 102 and the target die 104. The donor die 102 and the target die 104 can be aligned in three dimensions before or during contact between the donor die 102 and the target die 104. For example, when the donor die 102 is contacted in the target die 104, the donor die 102 or the target die 104 can be positioned or adjusted in the xy plane. The donor die 102 or the target die 104 can be positioned or adjusted by the operation of a die actuator or other die-level element (such as via a piezoelectric stepper element) or by the operation of a wafer chuck or other wafer-level element (such as via a stepper element).

[0027] The position of the donor die 102 or the target die 104 can be adjusted relative to up to six degrees of freedom. For example, given the origin at the center of the donor die 102, the donor die 102 can be adjusted by movement along the X-axis (e.g., in the positive or negative X direction), along the y-axis (e.g., in the positive or negative Y direction), and along the z-axis (e.g., in the positive or negative Z direction). The donor die 102 can also be adjusted rotationally relative to each of these axes, for example, rotation relative to the x-axis, rotation relative to the y-axis, and rotation relative to the z-axis. That is, the donor die 102 can be adjusted by free rotation within the space occupied by six different types of movement (where the movements listed above are provided as examples, but where the movements can be described by other axes).

[0028] Figures 2A-2B This is a schematic diagram illustrating an example apparatus for die bonding. Reference is made to "donor die" (and "donor wafer" comprising multiple "donor dies") and "target die" (and "target wafer" comprising multiple "target dies") for description. Figures 2A-2B These are relative descriptors, and the donor die can be the target die, and vice versa. Figure 2A This is a planar view showing the donor die placed on the target die. The donor wafer 220 (and the target wafer 250) are depicted as circular, but may alternatively be any suitable shape. The donor wafer 220 may be partially or entirely diced into donor dies. The donor wafer may be a “reconstructed wafer” in which donor dies (or other different portions of the wafer) are arranged or supported approximating their positions within the diced wafer. The donor wafer 220 may be supported, for example, by a vacuum chuck, an electrostatic chuck, or the like, from a front (e.g., a fabrication surface) or a back (e.g., a body wafer surface). The donor wafer 220 may have fabricated devices, such as through-silicon vias (TSVs), contact pads, etc., on multiple surfaces, such that both the top and back surfaces are fabrication surfaces.

[0029] Donor wafer 220 can be placed on donor wafer chuck 210. Donor wafer chuck 210 can be located in a first position (e.g., a measurement position) on frame 202. Donor wafer chuck 210 can include (e.g., support) a die actuator 216 (or “pusher”). Die actuator 216 can have a pitch (e.g., regular pitch) corresponding to the pitch (or size) of the donor die of donor wafer 220. Die actuator 216 can have one or more adhesive surfaces such that the donor die is held by die actuator 216. Die actuator 216 can have one or more controllable extensions such that die actuator 216 can move the donor die in one or more directions, including movement along one degree of freedom (e.g., along the Z-axis), up to three degrees of freedom (e.g., along the X, Y, and Z axes), and up to six degrees of freedom (e.g., rotation along orthogonal axes and along the X, Y, and Z axes). The die actuator 216 can be controlled by one or more inputs (e.g., signals), including via electrical actuation, vacuum actuation, compressed air actuation, etc. The die actuator 216 can be any suitable die actuator. The die actuator 216 can be supported by "feet" or other die actuator supports, which can interact with the donor wafer chuck 210 via a connector array 214 (e.g., a connector between the donor wafer chuck 210 and the die actuator 216).

[0030] Array 214 may include connectors providing an adhesive method (such as vacuum bonding) for die actuator 216. Array 214 may include connectors providing an actuation method (such as a signal that can control movement of die actuator 216 in one or more directions) for die actuator 216. Array 214 may contain as many connectors as die actuator 216, or more connectors than die actuator 216 (including two, three, four, etc. more connectors than die actuator 216). Array 214 may include connectors not attached to die actuator 216 or otherwise not corresponding to die actuator 216. For example, each die actuator in die actuator 216 may occupy four connectors, which may be of different types, with only 10% of the connectors occupied by die actuator 216. The vacancy rate of the connectors in array 214 can be as high as 100% (e.g., in an example where die actuator 216 is not used) and as low as 0% (e.g., in an example where every connector is occupied by die actuator 216). Die actuator 216 can be placed on connector array 214 in various configurations (e.g., via a pick-and-place tool) and can engage and disengage with the connectors of array 214 and move around array 214. Array 214 can be operated by one or more control systems, which may include processors, computer-readable instructions, etc., and may include vacuum control systems, actuator control systems, electrical control systems, mechanical control systems, etc.

[0031] The donor wafer chuck 210 may have a zero measurement point (or alignment point), such as identified by a cross-shaped zero measurement mark 212A and a circular zero measurement mark 212B, which are provided as examples, and any suitable zero measurement mark may be used therein. The zero measurement point can be used to place the donor wafer 220 onto the donor wafer chuck 210, such as during wafer movement onto the chuck (e.g., insertion of the donor wafer along direction 222 via a wafer transport device). Once the donor die is placed on the donor wafer chuck 210 (e.g., supported by the die actuator 216), the zero measurement point can be used to measure the relative position of the donor die 220. The placement of the die actuator 216 can be measured relative to the zero measurement point, for example, with nanometer-level accuracy. The placement of the donor die on the die actuator 216 can be measured relative to the zero measurement point, for example, with nanometer-level accuracy. The placement of the donor die on the die actuator 216 (or the die actuator 216 on the array 214) can be controlled with precision up to the micrometer level. The position of the donor die after placement can be measured from any suitable measurement system, such as an optical microscope, reflectometer, diffractometer, etc. If the die actuator 216 operates with two or more degrees of freedom, the position of the donor die can be adjusted after placement on the die actuator 216.

[0032] Once the donor die position is measured, the donor wafer chuck 210 can be moved, for example, along direction 230 around the central Z-axis. The donor wafer chuck 210 can then occupy a second position (e.g., a bonding position) on frame 202. A donor wafer chuck 240 is depicted at this second position on frame 202, but may alternatively be the moved donor wafer chuck 210. Frame 202 may contain multiple positions—for example, frame 202 may be substantially rotationally symmetric, including a first position for placing the donor wafer 220 on the donor wafer chuck, a second position for measuring the donor die position, a third position for placing the donor die on the target die, and a fourth position for removing the bonded die pair from the donor wafer chuck. The donor wafer chuck 240 may be substantially identical to the donor wafer chuck 210, including a cross-shaped zero measurement mark 242A and a circular zero measurement mark 242B, an array and die actuators (not depicted in the plan view), and the donor wafer 244.

[0033] In the second position, the target wafer 250 can be positioned parallel to the donor wafer 244, such as by means of a wafer transport device or other suitable equipment that moves in direction 252. The target wafer 250 can be rotated about the x-axis in direction 254 such that the fabricated surface of the target wafer 250 faces the donor wafer 244. The target wafer 250 can be any suitable target wafer, including a reconstructed wafer of a target die. The target die of the target wafer 250 can be substantially the same size as the donor die of the donor wafer 244. The target die of the target wafer 250 can be substantially different in size from the donor die of the donor wafer 244 in one or more dimensions. The target wafer 250 can be lowered onto the donor wafer 244. The donor die of the donor wafer 244 can be positioned to contact the target die of the target wafer 250, such as through the operation of one or more die actuators supporting the donor die and optionally one or more die actuators supporting the target die. The contact between the donor die and the target die can be maintained during the bonding period (such as during the movement of the chemical bonding front) or during annealing.

[0034] Figure 2B This is a cross-sectional view of a donor die placed on a target die. The donor die 220 may include a fabrication surface 226 and a body die surface 224, wherein the fabrication surface 226 may include one or more features that can be used for alignment between the donor die and the target die. The donor die may be placed on a donor die chuck 210, which may include a connector array 214 supporting a die actuator and the donor die 220. The array 214 may be recessed into the donor die chuck 210, partially or fully protrude from the surface of the donor die chuck, etc. The array 214 may be considered together with any applied die actuator, or separately from any applied die actuator. The donor die chuck 210 may be operable to move along two degrees of freedom (e.g., along direction 204 in the XY plane), along three degrees of freedom (e.g., along the XY plane and rotating in the XY plane), or in other directions. The location of one or more features on manufacturing surface 226 can be measured, such as optically, by one or more measuring systems 260. The measuring system 260 can measure the location of one or more features relative to a zero measurement mark (such as a reference). Figure 2A (As discussed). After measuring the location of the donor die, the donor die chuck 210 can be rotated, for example, along direction 230 to the position of donor die chuck 240. In the second position, the donor wafer 244 (which may be a translated donor wafer) can be aligned with the target wafer 250.

[0035] In the second position, donor wafer 244 is depicted supported by donor die chuck 240, which is movable in various directions 206 to align the donor die of donor wafer 244 with the target die of target wafer 250. Donor wafer 244 may include a fabrication facet 248 and a body wafer facet 246 (but may alternatively have multiple fabrication faces). The donor wafer may be supported by a connector array 249 and die actuators, which may be substantially the same as or different from array 214. For example, the arrangement of die actuators on array 214 may differ from the arrangement of die actuators on array 249, such as when dies of different sizes comprise donor wafer 220 and donor wafer 244.

[0036] The target wafer 250 may also have a manufacturing facet 258 and a body wafer facet 256 (or multiple manufacturing faces). The manufacturing facet 258 of the target wafer 250 can be rotated so that it faces the manufacturing facet 248 of the donor wafer 244. The target wafer 250 may be supported by a target wafer chuck 270, which may be supported by a support arm 272 or another wafer processing device. The target wafer chuck 270 may include an array 259 and one or more die actuators. Alternatively, the target wafer chuck 270 may not include a die actuator or die actuator that is significantly different from the die actuator of the donor wafer chuck 210 or donor wafer chuck 240. The position of the target die (or a feature of the target die) of the target wafer 250 can be measured, such as optically by one or more measurement systems 264. The measurement system 264 can measure the location of the target die relative to a zero measurement mark (such as a reference). Figure 2A (As discussed), the zero measurement mark may be located on the target wafer chuck 270 or the donor wafer chuck 240. In some embodiments, the measurement system 264 can measure the position of the target die from within the donor wafer chuck 240 or otherwise through the donor wafer 244.

[0037] The support arm 272 or another suitable method can move the target wafer 250 such that the target wafer 250 (e.g., about a plane of symmetry) corresponds to the donor wafer 244, such as along direction 276. The movement of the donor wafer 244 (e.g., along direction 206) and the target wafer 250 (e.g., along direction 276) can occur based on differences between the measurement locations of the donor die and the corresponding target die. The donor wafer 244 and the target wafer 250 can be realigned for each successive pair of donor and target dies. The target wafer 250 and the donor wafer 244 can contact each other by movement along the individual die of either wafer or along the Z-axis of either wafer.

[0038] Figures 3A-3HThis is a schematic diagram illustrating the die placement method. Refer to "donor die" (and "donor wafer" comprising multiple "donor dies") and "target die" (and "target wafer" comprising multiple "target dies") for description. Figures 3A-3H These are relative descriptors, and the donor die can be the target die, and vice versa. Figures 3A-3H This is a cross-sectional view of the various steps involved in placing the donor die onto the target die. In some embodiments, Figures 3A-3H The steps can be made by Figures 2A-2B The example device is executed. In some embodiments, in Figures 3A-3H Multiple steps, described as occurring substantially simultaneously, can be executed sequentially. In some embodiments, in Figures 3A-3H The multiple steps described as occurring sequentially can be performed substantially simultaneously. In some embodiments, the steps may be performed in a different order.

[0039] Figure 3A This is a cross-sectional view of donor dies 310 and 320 to be placed on target die 300. Although a target die (target die 300) is depicted, donor dies 310 and 320 may alternatively be placed on separate target dies. In some embodiments, donor dies 320 and 320 may be placed relative to target die 300 and relative to each other, such as adjacent, stacked on top of each other, etc. Although target die 300 is depicted as not supported by a die actuator, in some embodiments, the target die may also be supported by a die actuator.

[0040] Donor die 310 has a manufacturing facet 314 and a body wafer facet 312, while donor die 320 has a manufacturing facet 324 and a body wafer facet 322. Donor die 310 is supported by die actuator 316, while donor die 320 is supported by die actuator 326. Die actuators 316 and 326 are depicted as rectangular for ease of depiction, and this depiction should not be considered as a limitation on the type or method of operation of the die actuators. For example, die actuators 316 and 326 may be leaf spring die actuators, piezoelectric die actuators, steppers, etc. Die actuators 316 and 326 are supported by support structure 340. Support structure 340 may include an array of connectors (not depicted). Each die actuator 316 and 326 may have die actuator feet (not depicted) that interact with the array of connectors or other support structure 340. The die actuators 316 and 326 can be vertically actuated—that is, operable to adjust the position of donor die 310 or donor die 320 along the Z-direction. The die actuators 316 and 326 can also be controlled in other directions, such as along the X and Y planes. Die actuator 316 can be controlled in the XY plane by guide 318. Die actuator 326 can be controlled in the XY plane by guide 328. Guides 318 and 328 are depicted as triangles, where their support structures are not depicted. Guides 318 and 328 can be any suitable guide, such as guide rails, structs, clamps, etc.

[0041] Donor dies 310 and 320 can be moved in the XY plane, such as in direction 342, by movement of support structure 340. In some embodiments, target die 300 is also (or alternatively) moved in the XY plane by movement of support structure (not depicted), such as in direction 306. To align donor die 310 with target die 300, support structure 340 can be moved, for example, based on a measured position of donor die 310, to align donor die 310 with target die 300, which can also be based on a measured position of donor die 310. Movement of support structure 340 (or support structure of target die) can be controlled, for example, with micrometer-level precision via a microstepper. Die actuators can also be used to align a given donor die with a given target die if they operate with additional degrees of freedom, such as in a direction other than along the Z-axis.

[0042] Once the donor die 310 is aligned with the target die 300, the donor die 310 can be moved (e.g., along direction 350) to contact the target die 300. The target die 300 can be moved by a die actuator 316. The die actuator 316 can be actuated by receiving a control signal (such as via an array or support structure 340), which can be an electrical signal, a compressed air signal, a vacuum signal, etc. In some embodiments, multiple donor dies can be brought into immediate contact. For example, if both donor dies 310 and 320 are aligned with their corresponding positions on the target die 300 at the same location on the support structure 340, then donor dies 310 and 320 can be placed substantially simultaneously. The term "alignment" and its syntactic variations herein include alignment within permissible threshold ranges and do not require atomic alignment. Alignment thresholds can depend on die size, feature size, die type, etc.

[0043] Figure 3B This is a cross-sectional view showing the donor die 310 placed on the target die 300. The die actuator 316 can remain in contact with the support structure 340, while the donor die 310 is held in contact with the target die 300. The die actuator 316 can disengage from the support structure 340, while the donor die 310 remains in contact with the target die 300. For example, the die actuator 316 can be held in place by a guide 318, which can be connected to the support structure 340, the foot of the die actuator, etc. Examples of die actuator geometry are provided in the following figures. After the donor die 310 has contacted the target die 300, the die actuator 316 can continue to supply pressure to the donor die 310. For example, the donor die 310 may be kept in contact with the target die 300 during a bonding time period, which may be a calculated period of time that allows the bonding front (e.g., for chemical bonding) to travel approximately a certain percentage of the surface of the fabricated facet 314 of the donor die 310. The donor die 310 may be kept in contact with the target die 300 at constant pressure, gradient pressure, or by being held against the target die 300 with substantially no pressure.

[0044] Figure 3CThis is a cross-sectional view showing the donor die 320 aligned with the target die 300. After the donor die 310 is placed on the target die 300, the guide 318 can be removed from the die actuator 316. The guide 318 can be removed from the die actuator 316 in an outward radial direction 352, for example, in the XY plane. The die actuator 316 can continue to hold the donor die 310 against the target die 300 with or without applying substantial pressure. Once the movement of the donor die 310 in the XY plane (e.g., via the guide 318) is no longer restricted, the support structure 340 (or alternatively or additionally, the support structure of the target die 300) can be moved, for example, along direction 356, to position the donor die 320 aligned with the target die 300. Once the donor die 320 is aligned with the target die 300, the die actuator 326 can move, for example, in direction 358, to bring the donor die 320 onto the target die 300. Alignment can be performed based on previous measurements (e.g., the position of the donor dies 310 and 320 relative to the zero measurement mark) or based on new measurements.

[0045] Figure 3D This is a cross-sectional view showing the donor die 320 placed on the target die 300. The die actuator 326 can place the donor die 320 on the target die 300, for example, by movement in direction 358. The die actuator 326 can remain in contact with the support structure 340, while the donor die 320 is held in contact with the target die 300. The die actuator 326 can be any suitable die actuator, such as those previously mentioned regarding die actuator 316 and... Figure 3B As described above. The die actuator 326 can continue to maintain or supply pressure to the donor die 320, as previously described regarding the die actuator 316. The donor die 320 can be kept in contact with the target die 300 during the bonding time period.

[0046] Once the bonding period for donor die 310 has expired, die actuator 316 can be removed from donor die 310. Donor die 310 can be held to die actuator by means such as vacuum actuation or electrostatic force. Die actuator 316 can be removed from donor die (e.g., retracted) with or without a repulsive force between donor die 310 and die actuator 316. Die actuator 316 can be moved in a direction 360 (e.g., rearward toward support structure 340).

[0047] Figure 3EThis is a cross-sectional view of the removal of guide 328 from die actuator 316 of donor die 320. Removing guide 328 from die actuator 316 allows for the alignment of an additional donor die with target die 300 (e.g., as previously described for aligning donor die 320 with target die 300 after placing donor die 310 on target die 300). Guide 328 can be removed from die actuator 326 in the XY plane along an outward radial direction 362, or by any other suitable means. With or without applying substantial pressure, die actuator 326 can continue to hold donor die 320 against target die 300. Once the movement of the donor die 320 in the XY plane (e.g., via the guide 328) is no longer restricted, the support structure 340 (or alternatively or additionally, the support structure of the target die 300) can be moved to position another donor die for alignment with the target die 300 or to perform another operation.

[0048] Figure 3F This is a cross-sectional view showing the removal of the die actuator 326 from the donor die 320. Once the bonding period for the donor die 320 has expired, the die actuator 326 can be removed from the donor die 320. The donor die 320 can be held to the die actuator by means of vacuum actuation, electrostatic force, etc. The die actuator 326 can be removed from the donor die (e.g., retracted) with or without a repulsive force applied between the donor die 320 and the die actuator 326. The die actuator 326 can be moved in direction 366 (e.g., rearward toward the support structure 340).

[0049] Once the die actuator 316 is removed from the donor die 310 and returned to its original position (e.g., as...), Figure 3A (as depicted in the diagram of the die actuator 316 position), the guide 318 can be re-engaged with the die actuator 316, for example, by moving it radially toward the die actuator 316 in a direction 364. The guide 318 can also be reattached to the die actuator 316 during the process of removing the die actuator 316 from the donor die 310.

[0050] Figure 3G This is a cross-sectional view showing the guide 328 re-engaging with the die actuator 326. Once the die actuator 326 is removed from the donor die 320 and returned to its original position (e.g., as shown in the image),... Figure 3A (as depicted in the diagram of the die actuator 326 position), the guide 328 can be re-engaged with the die actuator 326, for example, by moving it radially toward the die actuator 326 in a direction 368. The guide 328 can also be reattached to the die actuator 326 during the process of removing the die actuator 326 from the donor die 320.

[0051] Once the die actuators 316 and 326 are returned to their original (or "neutral") positions, the support structure 340 can be moved, for example, in direction 370, to apply additional donor dies to the target die, receive additional donor dies, etc.

[0052] Figure 3H This is a cross-sectional view of die actuators 316 and 326 prepared for receiving additional donor dies. Once all donor dies have been placed on the target die, the target die can be removed, for example, by means of a wafer processor along direction 372. Removal of the bonded dies (e.g., donor dies 310 and 320 bonded to target die 300) allows for the placement of additional donor dies (and target dies) on die actuators 316 and 326, and allows for the bonding of the additional donor dies and the target die. Die actuators 316 and 326 can be rearranged between the applied donor dies, for example, by using a pick-and-place tool. Die actuators 316 and 326 can be adjusted to correspond to the pitch of the donor dies (and target dies) used in a given die-to-die bonding.

[0053] Figures 4A-4C This is a schematic diagram illustrating the support structure for dies of various sizes. References are made to "donor die" (and "donor wafer" comprising multiple "donor dies") and "target die" (and "target wafer" comprising multiple "target dies"). Figures 4A-4C These are relative descriptors, and the donor die can be the target die, and vice versa. Figure 4A This is a plan view of an example heterogeneous die bonding. Figure 4A The diagram depicts the bonding between target dies 402A, 402B, and 402C and various donor dies. Target die 402A is bonded to donor dies 410A-410D, as well as 420A and 420B. Target die 402B is bonded to donor dies 412A-412D, as well as 422A and 422B. Target die 403C, depicted only partially, is bonded to at least donor dies 414B, 414D, 424A, and 424B. By using a regular arrangement of donor and target dies, die-to-die bonding can be improved (e.g., in terms of speed, accuracy, and precision). For example, Figures 2A-2BThe apparatus can bond a reconstructed donor wafer, composed of donor dies, to a reconstructed target wafer, composed of target dies. The donor and target dies can be arranged in a regular pattern, such that they have various pitches. For example, target dies 402A to 402C have a pitch 430 in the X direction and a pitch 440 in the Y direction. Donor dies 410A-D, 412A-D, 414B, and 414D have a first pitch 441 in the X direction (corresponding to donor dies on the same target wafer) and a second pitch 442 in the X direction (corresponding to separations in donor dies of different target wafers). Donor dies 420A-B, 422A-B, and 424A-D are also depicted having pitches 441 and 442 in the X direction. Donor dies 410A-D, 412A-D, 414B, 414D, 420A-B, 422A-B and 424A-D have a first pitch 431 in the Y direction (corresponding to the separation between substantially identical donor dies), a second pitch 432 in the Y direction (corresponding to the separation between different types of donor dies), and a third pitch 433 in the Y direction (corresponding to the separation in the donor dies of different target wafers).

[0054] Figure 4B This is a plan view of an example array 452 of connectors used to support donor dies, such as those used for... Figure 4A The example heterogeneous die bonding is depicted. Array 452 includes a plurality of attachment connectors 450 that can hold die actuators for donor dies. Attachment connectors 450 may include vacuum orifices. Attachment connectors 450 can be any suitable attachment connector, such as pads for electrostatic attraction. Attachment connectors 450 may include attachment feet 460 that can secure attachment components (such as vacuum source lines) to array 452. Attachment connectors 450 may include vacuum lines 462 or other supply lines for control or attachment signals. For example, vacuum lines 462 may be flexible conduits. Attachment connectors 450 may define orifices 464 through which attractive forces (e.g., vacuum forces) can be supplied.

[0055] The attachment connector 450 may have a pitch 470 in the X direction and a pitch 472 in the Y direction. The pitch of the attachment connector 450 may be less than the minimum pitch of the donor die and the target die. This allows the attachment connector 450 to support the die actuator and the die at the minimum pitch desired for a given die bond. The attachment connector 450 is depicted in a square array, but may also be provided in any suitable arrangement, including a tight-packed arrangement, a radial array, a rectangular array, etc.

[0056] Each attachment connector 450 is operable to attach a die actuator to array 452. Each die actuator placed on array 452 can be attached to the array via one or more attachment connectors 450. Some attachment connectors 450 may not be attached to any die actuator—the placement of die actuators on array 452 can be indicated by the arrangement of placing a donor die on a target die for any given die bonding. Die actuators can be attached to array 452 via the die actuator foot, where a die actuator “foot” refers to any suitable arrangement of the die actuator’s base. Dashed rectangle 480 represents an example die actuator foot placement on array 452, where the die actuator can move around array 452, including moving in directions 482 and 484 to be attached at another attachment connector in attachment connector 450. The die actuator can be placed on array 452 and held in place by gravity in addition to any applied attractive force. The attachment connector 450 can have an attractive force, such as a vacuum supply source. In some embodiments, the attachment connector 450 can be activated independently.

[0057] The die actuator foot may occupy one or more attachment connectors—dashed rectangle 486 represents a die actuator foot occupying one attachment connector. The die actuator foot may be configured to attach to attachment connector 450 in a specific area. For example, the die actuator foot may have a flat surface suitable for vacuum attachment along the outer side of the foot.

[0058] Figure 4C It is shown together with the example die actuator 316 for support Figure 4B A cross-sectional view of an example array 452 of connectors for a donor die. Array 452 includes attachment connectors comprising attachment feet 460, vacuum lines 462 or other supply lines, and orifices 464. The attachment connectors may be defined within an array support 490. The array support 490 may be substantially planar. The attachment feet 460 and orifices 464 may be substantially coplanar with the array support 490. In some embodiments, the attachment feet 460 and orifices 464 may be recessed relative to the array support 490, or vice versa. Orifices 464 may be supplied with a vacuum force 492, which 492 originates from a common vacuum supply 494. Orifices 464 may alternatively supply another force, such as electrostatic attraction, in which case the orifice may instead be a contact pad.

[0059] Array 452 is depicted supporting three die actuators 316, but may alternatively support fewer die actuators. Array 452 may have orifices 464 operable to hold the die actuators 316, such as orifices for applying a vacuum force 492 to free space (which may be atmosphere, an inert gas, etc.). The common vacuum supply 494 may be supplied with sufficient force such that applying at least some of the vacuum force 492 to free space will not prevent the vacuum force 492 from attaching to the die actuators 316. For example, the vacuum force 492 may be substantially equal to a vacuum level less than or equal to -0.3 bar, with a flow rate less than 20 standard liters per minute (Nl / min).

[0060] Array 452 may have a die actuator 316 and donor dies (e.g., donor dies 310A-B) placed thereon. The die actuator 316 may be supported by die actuator feet 480A, 480B, 480C. Die actuator feet 480A-480C may be any suitable support for the die actuator 316. The die actuator 316 may be placed on array 452 using a pick-and-place tool, including by using a pick-and-place tool that can interact with die actuator holder 496. The die actuator holder 496 may interact with the die actuator 316 (including by interacting with die actuator feet 480A) and allow the pick-and-place tool to move the die actuator 316. Once the die actuator 316 is attached to array 452 by gravity or an attachment connector, the die actuator holder 496 may be removed. The die actuator holder 496 can also be used to move the die actuator 316 around the array 452.

[0061] Once the die actuator is placed on array 452, the donor die 301A can be placed on die actuator 316. The donor die 310A can be placed on die actuator 316 by pick-and-place tool 498 or any other suitable wafer handling method. Once the donor die 310B is secured to die actuator 316, including by active (e.g., electrostatic) or passive (e.g., van der Waals) force, the donor die 301B can be aligned with the target die, such as by reference. Figures 3A-3H The described die placement method or any other suitable method.

[0062] Figures 5A-5B This is a schematic diagram illustrating a die placement method using an example support structure with two inputs. Refer to "donor die" for further description. Figures 5A-5B These are relative descriptors, and the donor die can instead be the target die. Figure 5B Such as for Figure 4AThe diagram depicts a plan view of an example array 502 of connectors for supporting donor dies in an example heterogeneous die bonding configuration. Array 502 includes a plurality of attachment connectors 450, which can be any suitable attachment connector, such as those previously referenced. Figures 4B-4C The array 502 contains multiple controller connectors 500 that can control the die actuators that hold the donor die.

[0063] Controller connector 500 may include orifices that can provide vacuum, compressed air, or other through-signals. Controller connector 500 can be any suitable controller connector, such as pads for electrostatic attraction. Controller connector 500 may include attachment feet 510 that can secure attachment components (such as vacuum source lines, voltage source lines, etc.) to array 502. Controller connector 500 may include a vacuum line 512 or other supply lines for control signals. For example, vacuum line 512 may be a flexible conduit. Controller connector 500 may define an orifice 514 through which attraction forces (e.g., vacuum force) can be supplied. Controller connector 500 can be a standalone controller, such as by applying individual signals to controller connector 500. Controller connector 500 can be batch controlled, such as by applying column and row signals to controller connector 500.

[0064] Each controller connector 500 is operable to control the actuation of a die actuator on array 502. Each die actuator placed on array 502 can be attached to the array via one or more attachment connectors 450 and controlled by one or more controller connectors 500. Some of the controller connectors 500 may not be attached to any die actuator. A die actuator can be attached to array 502 via its feet, and a controller connector 500 can supply one or more control signals to the die actuator feet. The feet of a die actuator can occupy one or more attachment connectors and controller connectors—dashed rectangle 534 represents a die actuator foot occupying one attachment connector 450 and one controller connector 500. The feet of a die actuator can be configured to be attached to attachment connector 450 in a first specific interval and to controller connector 500 in a second specific interval. For example, the foot of the die actuator may have a flat surface suitable for vacuum attachment along the outside of the foot and a recessed surface suitable for supplying compressed air inside the foot.

[0065] Dashed rectangle 530A represents an example die actuator foot placement on array 502, where the die actuator can move around array 502. Dashed rectangle 530B represents a translation (e.g., in direction 532) of the example die actuator foot placement of dashed rectangle 530A to another location on array 502. The die actuator foot may have specific sections corresponding to (e.g., connected to) controller connector 500 (and attachment connector 450). Specific sections of the die actuator foot may define the location on array 502 where the die actuator can be placed. By rotating the die actuator (or its foot), a single configuration of the die actuator foot can be used to place it on any of the four connectors (e.g., attachment connector 450 and controller connector 500).

[0066] The attachment connector 450 and controller connector 500 may have a pitch 520 in the X direction and a pitch 522 in the Y direction. The pitch of the array 502 may be less than the minimum pitch of the donor die and the target die. This allows the attachment connector 450 and controller connector 500 to support and control the die actuator and die at the minimum pitch desired for a given die bond. The attachment connector 450 and controller connector 500 are depicted as a square array, but may be provided in any suitable arrangement, including a tightly packed arrangement, a radial array, a rectangular array, etc. The attachment connector 450 and controller connector 500 may appear in a distributed (e.g., interlaced) array, which may have different pitches. For example, the attachment connector 450 may be located at the vertices of a square array, while the controller connectors 500 (including controller connectors with dimensions substantially different from those of the attachment connector 450) may be arranged in a 4-fold radially symmetrical or other suitable arrangement around the attachment connector 450.

[0067] Figure 5B It is used for support and control Figure 5A A cross-sectional view of an example array 502 of donor die connectors is shown, illustrating an example die actuator 316. Array 502 includes a controller connector comprising a controller foot 510, a vacuum line 512 or other supply line, and an orifice 514. Array 502 also includes attachment connectors, as previously referenced. Figure 4C The accessory connector and controller connector may be defined within the array support 550. The array support 550 may be substantially planar. The attachment feet 510 and the aperture 514 may be substantially coplanar with the array support 550. In some embodiments, the attachment feet 510 and the aperture 514 may be recessed relative to the array support 550, or vice versa. A variable compressed air signal may be supplied to the aperture 514. Alternatively, the aperture 514 may be supplied with another force, such as electrostatic attraction, in which case the aperture may instead be a contact pad.

[0068] Array 502 is depicted as supporting two die actuators 316, but may alternatively support more or fewer die actuators. Array 502 may have orifices 514 operable to control the die actuators 316, such as supplying compressed air to extend orifices 514 of the die actuators 316 and supplying vacuum force to retract orifices 514 of the die actuators 316. Orifices 514 may be individually controlled, such as by supplying a separate control signal to each orifice 514. Orifices 514 that do not correspond to (e.g., are not controlled) the die actuators 316 may be closed or otherwise not supplied with a control signal.

[0069] Array 502 may have a die actuator 316 and donor dies (e.g., donor dies 310C-310D) placed thereon. The die actuator 316 may be supported by die actuator feet 580A and 580B. The die actuator feet 580A-580B may be any suitable support for the die actuator 316. The die actuator is depicted as including expandable bellows 560A and 560B for actuation in the Z direction. The expansion and contraction of the expandable bellows 560A and 560B may be controlled by signals supplied via a controller connector. Expandable bellows 560A and 560B are provided as examples, but actuation of the die actuator 316 may occur via any suitable method or structure.

[0070] The "push" signal 562 can be supplied via the controller connector. The push signal 562 can be operated to cause the die actuator 316 to extend to place the donor die 310C on the target die. The push signal 562 can cause the expansion of the expandable bellows 560A.

[0071] The "retraction" signal 564 can be supplied via the controller connector. The retraction signal can be operated to cause the die actuator 316 to retract from holding the donor die 310D on the target die. The retraction signal 564 can cause compression of the expandable bellows 560B.

[0072] In some embodiments, a "hold" signal may be supplied via a controller connector. The hold signal may be operated to cause the die actuator 316 to hold the donor die on the target die with or without substantial pressure.

[0073] In some embodiments, the retraction signal may be absent, or vice versa, such as for spring-loaded die actuators. In some embodiments, the push signal may automatically include a holding signal or periodic or other gradient pressure change between the donor die and the target die, such as for dash pot-based die actuators.

[0074] Figures 6A-6BThis is a schematic diagram illustrating a die placement method using an example support structure with four inputs. Refer to "donor die" for further description. Figures 6A-6B These are relative descriptors, and the donor die can instead be the target die. Figure 6B Such as for Figure 4A The diagram depicts a plan view of an example array 602 of connectors for supporting donor dies in an example heterogeneous die bonding configuration. Array 602 includes a plurality of attachment connectors 450, which can be any suitable attachment connector, such as those previously referenced. Figures 4B-4C and Figures 5A-5B The array 602 includes multiple controller connectors 500, which can be any suitable controller connector, such as those previously referenced. Figures 5A-5B The array 502 includes multiple additional controller connectors 600 and 620. Controller connectors 600 and 620 can be any suitable controller connector and can be substantially the same as or different from controller connector 500 and from each other. Controller connectors 500, 600, and 620 can each control different aspects of the actuation (e.g., movement) of the die actuator 316.

[0075] Controller connector 600 may include orifices that can provide vacuum, compressed air, or other through-signals. Controller connector 600 can be any suitable controller connector, such as pads for electrostatic attraction. Controller connector 600 may include controller feet 610 that can secure attachment members (such as vacuum source lines, voltage source lines, etc.) to array 602. Controller connector 600 may include a vacuum line 612 or other supply lines for control signals. For example, vacuum line 612 may be a flexible conduit. Controller connector 600 may define an orifice 614 through which attraction forces (e.g., vacuum force) can be supplied. Controller connector 600 can be a single controller, such as by applying a single signal to controller connector 600. Controller connector 600 can be batch controlled, such as by applying column and row signals to controller connector 600. Controller connector 620 may include pads for electrostatic control (e.g., voltage supply pads). Controller connectors may include controller feet that may include pads as exposed surfaces. The controller connector can be connected to one or more electrical signal supply lines.

[0076] Each controller connector 600 and 620 is operable to control one or more actuations of the die actuators on array 602. Each die actuator placed on array 602 can be attached to the array via one or more attachment connectors 450 and controlled by one or more controller connectors 500, 600, and 620. Some of the controller connectors 600 and 620 may not be attached to any die actuator. A die actuator may not be attached to array 602 via its feet, and controller connectors 500, 600, and 620 may supply one or more control signals to the die actuator feet. The feet of the die actuator may occupy one or more attachment connectors and controller connectors—dashed rectangle 640A represents a die actuator foot occupying one attachment connector 450, one controller connector 500, one controller connector 600, and one controller connector 620. The feet of the die actuator can be configured to attach to attachment connector 450 in a first specific interval, to controller connector 500 in a second specific interval, to controller connector 600 in a third specific interval, and to controller connector 620 in a fourth specific interval. For example, the die actuator feet can have a flat surface suitable for vacuum connection in a first radial quadrant, a recessed surface suitable for supplying compressed air in a second radial quadrant, an electrical pad suitable for receiving electrical signals in a third radial quadrant, and an orifice suitable for receiving vacuum supply in a fourth radial quadrant.

[0077] Dashed rectangle 640A represents an example die actuator foot placement on array 602, where the die actuator can move around array 602. Dashed rectangle 640B represents a translation (e.g., rotation) of the example die actuator foot placement of dashed rectangle 640A to another location on array 602. Dashed rectangle 642A represents an example die actuator foot placement on array 602, where the die actuator foot of dashed rectangle 642A is a mirror image of the die actuator foot of dashed rectangle 640A. Dashed rectangle 642B represents a translation (e.g., rotation) of the example die actuator foot placement of dashed rectangle 642A to another location on array 602. By including a rotating die actuator (or die actuator foot), two different die actuator feet can be used, allowing the die actuator feet to be placed anywhere on array 602.

[0078] Attachment connectors 450 and controller connectors 500, 600, and 620 may have a pitch 630 in the X direction and a pitch 632 in the Y direction. The pitch of array 602 may be less than the minimum pitch of the donor die and the target die. This allows attachment connectors 450 and controller connectors 500, 600, and 620 to support and control the die actuator and die at the minimum pitch desired for a given die connection. Attachment connectors 450 and controller connectors 500, 600, and 620 are depicted in a square array, but may be provided in any suitable arrangement, including a tightly packed arrangement, a radial array, a rectangular array, etc. Attachment connectors 450 and controller connectors 500, 600, and 620 may appear in a distributed (e.g., interlaced) array, which may have different pitches. For example, the attachment connector 450 may be located at the vertices of a square array, while the controller connectors 500, 600 and 620 (including controller connectors with dimensions substantially different from those of the attachment connector 450) may be arranged in a triple radially symmetrical or other suitable arrangement around the attachment connector 450.

[0079] Figure 6B It is used for support and control Figure 6A A cross-sectional view of an example array 602 of donor die connectors shows an example die actuator 316. Array 602 includes a controller connector comprising a controller foot 610, a vacuum line 612 or other supply line, and an orifice 614 (e.g., corresponding to...). Figure 6A The array 602 also includes an attachment connector, as previously referenced. Figure 4C The accessory connector and controller connector may be defined within the array support 650. The array support 650 may be substantially planar. The controller feet 610, orifice 614, and controller connector 620 may be substantially coplanar with the array support 650. In some embodiments, the controller feet 610, orifice 614, and controller connector 620 may be recessed relative to the array support 650, or vice versa. A variable compressed air signal may be supplied to the orifice 614. Alternatively, another force, such as electrostatic attraction, may be supplied to the orifice, in which case the orifice may instead be a contact pad. An electrical signal, including signals from voltage sources 622 and 626, may be supplied to the controller connector 620. The electrical signal may be alternating current (AC), direct current (DC), voltage, capacitance, inductance, etc.

[0080] Array 602 is depicted as supporting two die actuators 316, but may alternatively support more or fewer die actuators. Array 602 may have orifices 614 operable to control the die actuators 316, such as supplying compressed air to attach guides 318 to the die actuators 316 and supplying vacuum force to remove guides 318 from the die actuators 316. Orifices 614 may be individually controlled, such as by providing a separate control signal to each orifice 614. Orifices 614 that do not correspond to (e.g., are not controlled) die actuators 316 may be closed or otherwise not supplied with a control signal. Array 602 may have voltage sources 622 and 626 that can be individually controlled. Controller connector 620 may have electrical pads connected to electrical connections in the die actuators 216. Voltage sources 622 and 626 may apply voltages (or other electrical signals) that can operate electrostatic connections, such as electrostatic die chucks 624. The controller connector 620, which does not correspond to the die actuator 316, can be shut off, connected to ground, or otherwise not supplied with control signals.

[0081] Array 602 may have a die actuator 316 and donor dies (e.g., donor dies 310E-310D) placed thereon. The die actuator 316 may be supported by die actuator feet 680A and 680B. The die actuator feet 680A-680B may be any suitable support for the die actuator 316. The die actuator is depicted as including expandable bellows 560A and 560B for actuation in the Z direction, an electrostatic die chuck 624, and a guide arm 670. The expansion and contraction of the expandable bellows 560A and 560B can be controlled by a controller connector (e.g., Figure 5BThe controller connector 500 supplies signals to control the actuator 316. Expandable bellows 560A and 560B are provided as examples, but actuation of the die actuator 316 can occur via any suitable method or structure. The die actuator is depicted as including an electrostatic die chuck 624, which can be controlled by signals supplied by the controller connector 620 to induce adhesion of the donor die 310E and repulsion of the donor die 310D. The electrostatic die chuck 624 is provided as an example of additional die actuation, but actuation of the die actuator 316 can occur otherwise via other structures. In some embodiments, the donor die may not be adhered to the die actuator 316. A guide arm 670 is depicted as supporting the guides 318. The guide arm 670 can support all the guides 318 of the die actuator 316. In some embodiments, multiple guide arms 670 may be provided, and different control signals may be used to control the guides 318 to prevent movement in different directions. The guide arm 670 is depicted as having a pivot point 672 on the die actuator feet 680A and 680B, but this configuration is provided only as an example, and the guide arm 670 can be operated in any suitable manner. The guide arm 670 is provided as an example of actuation of the guide 318, but the guide can be actuated in any suitable manner.

[0082] An "attract" signal can be supplied to the electrostatic die chuck 624 via the controller connector 620. The attract signal is operable to clamp the donor die 310E onto the die actuator 316. A "reject" signal can be supplied to the electrostatic die chuck 624 via the controller connector 620. The reject signal is operable to disengage the donor die 310D from the die actuator 316. In some embodiments, a "hold" signal can be supplied via the controller connector 620. The hold signal is operable to hold the donor die on the die actuator 316 with or without substantial pressure. In some embodiments, the attract signal may be absent, or vice versa, such as with an electrostatic die chuck 624 having hysteresis.

[0083] A "guide" signal 660 can be supplied to the guide arm 670 via a controller connector. The guide signal 660 can be operated to clamp the guide 318 onto the die actuator 316 to guide the placement of the donor die 310E on the target die, thereby preventing movement of the die actuator 316 in the XY plane, etc. The guide signal 660 can also cause the guide arm 670 to pivot toward the die actuator 316.

[0084] A "release" signal 662 can be supplied to the guide arm 670 via a controller connector. The release signal can be operated to release (e.g., withdraw) the die actuator 316 to allow the die array 602 to move relative to the donor die 310D (e.g., after bringing the donor die 310D into contact with the target die). The release signal 662 can cause the guide arm 670 to pivot away from the die actuator 316.

[0085] In some embodiments, a "hold" signal may be supplied via a controller connector. The holding signal may be operated to hold the guide arm 670 with or without substantial pressure on the die actuator 316, but may prevent the guide arm 670 from re-engaging with the die actuator if the guide arm 670 has been previously released.

[0086] In some embodiments, the release signal may be absent or conversely, such as for a spring-loaded die guide arm 670. In some embodiments, the guide signal may automatically include a holding signal or periodic or other gradient change in pressure between the guide arm 670, the guide 318, and the die actuator 316.

[0087] Figure 7 This is a flowchart illustrating the die placement method. Each of these operations is described in detail below. The operations of method 700 presented below are intended to be illustrative. In some embodiments, method 700 may be performed using one or more additional operations not described, and / or without one or more of the operations discussed. Additionally, the operations of method 700 in… Figure 7 The order illustrated in the figures and described below is not intended to be limiting. In some embodiments, one or more portions of method 700 may be implemented in one or more processing devices (e.g., one or more processors) (e.g., through simulation, modeling, etc.). The one or more processing devices may include one or more devices that perform some or all of the operations of method 700 in response to instructions stored electronically on an electronic storage medium. The one or more processing devices may include one or more devices configured by hardware, firmware, and / or software that are specifically designed to perform one or more operations, such as method 700.

[0088] At operation 710, multiple die actuators are placed on a connector array. The connector array may include attachment connectors and controller connectors, as referenced above. Figures 4A-4C , Figures 5A-5B and Figures 6A-6B As described. The connector array can be part of an alignment tool, a wafer chuck, etc., such as Figures 2A-2BThis is part of the [structure / system]. The connector array can control the actuation of the die actuator. The die actuator can be any suitable die actuator, including those mentioned above. Figures 2A-2B , Figures 3A-3H , Figures 4A-4C , Figures 5A-5B and Figures 6A-6B The described types of die actuators can be placed at any suitable location on the connector array. The die actuator can rotate relative to the connector array. The die actuator can include two or more types of die actuators. The die actuator can interact with the connector array via die actuator feet. The die actuator can be actively attracted to the connector array. In some embodiments, the die actuator can be passively attracted to the connector array, for example, by gravity. In some embodiments, the die actuator can be oriented such that gravity forces the die actuator away from the connector array (e.g., inverted), and the effective attractive force exerted by the connector array on the die actuator can be large enough to overcome gravity.

[0089] At operation 720, multiple donor dies are placed onto die actuators on a connector array. Donor dies can be placed onto die actuators using a pick-and-place tool or any other suitable method, such as a die handling method compatible with reconfigurable wafers. Donor die placement on die actuators can be monitored, for example by picking up placement elements, so that if a donor die is not placed on a die actuator, it can be repositioned (e.g., repositioned, discarded, etc.). The pitch of the die actuators can be equal to or less than the pitch of the donor dies. Each die can be placed on one or more die actuators. Recesses can have one or more recess widths, recess depths, recess lengths, etc. Donor dies can be multiple dies, such as previously coupled dies (e.g., two or more stacked dies). Multiple donor dies can include different types of donor dies (e.g., dies manufactured with different patterns) and dies of different sizes.

[0090] At operation 730, multiple donor die locations are obtained. Donor die locations can be obtained by measuring one or more locations of the donor die along one or more dimensions. The locations of the multiple donor dies can be measured relative to a zero-point measurement mark. The locations of the multiple donor dies can be measured in a plane (e.g., in the xy-plane). The locations of the multiple donor dies can also be measured in a plane via a first method and out of plane (e.g., in the Z-direction) via a second method. For example, the locations of the multiple donor dies can be measured based on one or more in-plane images. The locations of the multiple donor dies can be obtained from a two-dimensional image that shows the location of the edges or corners of the donor dies relative to the support structure or die actuator. The locations of the multiple donor dies can be obtained based on features (e.g., electroactive regions) on the exposed surface of the donor die. These features of the donor die can be used as alignment marks or reference marks. In some embodiments, alignment marks can be included as exposed features of the donor die. Alignment marks can be specifically added for die bonding, or they can be alignment marks corresponding to previous manufacturing steps. Multiple donor die locations can be measured or obtained from the storage device.

[0091] At operation 740, multiple target die locations are obtained. The locations of the multiple target dies can be obtained by any suitable method, including those described with reference to operation 730.

[0092] At operation 750, multiple donor dies and multiple target dies are brought close together. The donor dies and target dies can be brought close together such that the donor dies are parallel to the target dies (e.g., the manufacturing facet of the donor die faces the manufacturing facet of the target die). The donor dies and target dies can be brought close together by movement of the multiple donor dies (e.g., by movement of a donor wafer chuck) or movement of the target dies (e.g., by movement of a target wafer chuck). The donor dies and target dies can be placed together such that the donor dies and their corresponding target dies are separated by a distance that can be traversed by actuation of a die actuator. The donor dies and target dies can be coarsely aligned, for example, within a coarse alignment threshold range. The donor dies and target dies can be held by one or more die actuators.

[0093] At operation 760, the location of a given donor die is adjusted to align with the corresponding target die. A given die from a plurality of dies can be selected. Adjustment includes minimal or no location adjustment after measurement, such as if the measured location corresponds to a target location within a threshold range. The location of the donor die can be adjusted by the action of a die actuator. The location of the donor die can be adjusted by the action of a wafer processing device such as a microstepper. The location of the donor die can be adjusted by the movement of a connector array. The die actuator, wafer processing device, or connector array can adjust the position of the donor die in one or more directions (such as in the XY plane). The die actuator, wafer processing device, or connector array can adjust the length, position, and angle of one or more supports (e.g., pillars) supporting the donor die or connector array. The die actuator, wafer processing device, or connector array can be controlled by one or more measurement systems (such as a measurement system incorporating location measurement elements), including electrical control. Die actuators, wafer handling devices, or connector arrays can be controlled by a system such as one or more measurement systems that also control pick-and-place elements or other elements that place die actuators on connector arrays or place donor dies on die actuators. Adjustment of the donor die location can correspond to adjustment of one or more donor die chucks. Adjustment of the donor die location can correspond to adjustment of the location of one or more donor die actuators. Adjustment of the donor die location can include iterative measurements of multiple donor die locations, including measurements taken when adjustments occur.

[0094] The location adjustment of the donor die position can occur at a given location on the stage (e.g., donor wafer chuck), such as at a measurement location. The adjustment of the donor die position can occur after the locations of multiple donor dies have been obtained, for example, through a location measuring element.

[0095] The location of the donor die can be adjusted based on a target. The target can be a target location. A target (e.g., a target location) can be obtained. The target can correspond to a location on the target die. The target can correspond to multiple locations on the target die. The target can be a position (e.g., a three-dimensional position such as along the X, Y, and Z axes, a position in six directions such as along the X, Y, and Z axes, and a position relative to rotational angles about these axes, etc.). The target can be a set of positions, such as two or more locations on the target die to which an area of ​​the donor die will be bonded, or two or more locations on the target die (e.g., like...). Figure 1A The active region of electricity 108).

[0096] The target can be obtained from a target pattern, such as from the plane of the target. The target location can be obtained from measurements, such as from measurements of the target die. The target can be obtained in any suitable coordinate system, such as one or more zero measurement marks relative to the target wafer, the die actuator, the support structure, etc.

[0097] In some embodiments, a target can be used to notify the pick-and-place element when a donor die is placed on a die actuator. In some embodiments, the donor die can be placed on the die actuator based on the obtained target location. That is, when multiple donor dies are placed, a target can be used to notify the pick-and-place element.

[0098] Adjusting the location of the donor die can include adjusting the donor die to a location corresponding to a target location, which may differ from the location of the target die. That is, the location corresponding to the target location can be a location that corresponds to but is not equal to the target location. For example, the location corresponding to the target location of the donor die can be a location at the adjustment limit of the donor die, such as a target located outside the adjustment range of the donor die (via die actuators, via connector arrays, etc.). Alternatively, if the target is outside the adjustment range of the donor die, the donor die may not be placed on the target, such as if it is impossible to determine bonding based on the target location. The location corresponding to the target location can be an approximation of the target location, such as within measurement accuracy. The location corresponding to the target location can be an intermediate location (such as during iterative adjustment of the donor die location), a placement location (such as a location between the donor die location and the target die location), etc.

[0099] For example, donor dies and target dies can be used to determine placement locations (such as placement locations for each donor die and its corresponding target die), to which the donor die and its corresponding target die can be adjusted. The donor die location and target die location can be obtained (e.g., measured), and the placement location can be determined where both the donor die and the target die can be adjusted to. For example, if the donor die is offset by 4 μm in a first direction (e.g., from a desired location), and the target die is offset by 1 μm in an antiparallel direction, both the donor die and the target die can be adjusted into place to meet at the placement location (where placement of the donor die on the target can occur).

[0100] At operation 770, a given donor die is placed on one or more target dies. The donor die can be placed on the target by moving the die actuator. When the donor die is brought into contact with the target, the donor die can undergo self-alignment. For example, the donor die can be biased relative to the target location such that electrically active regions of the donor die are attracted to certain regions of the target location, such as electrically attracted regions. The donor die can be bonded to the target die. The donor die can be bonded to the target die, for example, by annealing. The donor die can be held relative to the target die during the bonding period. The die actuator can be released in one or more directions such that the connector array can move while the donor die is held against the target die. The donor die can be released from the die actuator or from the connector array.

[0101] In some embodiments, additional donor dies can be placed on the same or different target dies. For example, if the target corresponds to a target wafer, the target obtained for one of the target wafers can be applied to an additional target wafer with the same manufacturing parameters. In another example, if multiple dies are to be stacked, a target for a second stack can be obtained when the first stacking occurs; for example, the donor die location used for the first stacking can be used as the target for the second stacking.

[0102] As described above, method 700 (and / or other methods and systems described herein) is configured for the alignment of multiple dies.

[0103] Figure 8 This is a diagram of an example computer system CS that can be used for one or more of the operations described herein. The computer system CS includes a bus BS or other communication mechanism for transmitting information, and a processor PRO (or multiple processors) coupled to the bus BS for processing information. The computer system CS also includes main memory MM, such as random access memory (RAM) or other dynamic storage devices, coupled to the bus BS for storing information and instructions to be executed by the processor PRO. The main memory MM can also be used to store temporary variables or other intermediate information during instruction execution by the processor PRO. The computer system CS also includes read-only memory (ROM) or other static storage devices coupled to the bus BS for storing static information and instructions for the processor PRO. Storage devices SD, such as disks or optical discs, are provided and coupled to the bus BS for storing information and instructions.

[0104] A computer system (CS) can be coupled to a display (DS) (such as a cathode ray tube (CRT) or flat panel or touch panel display) via a bus (BS) for displaying information to the computer user. Input devices (ID), including alphanumeric keys and other keys, are coupled to the bus (BS) for transmitting information and command selections to the processor (PRO). Another type of user input device is a cursor control (CC) (such as a mouse, trackball, or arrow keys) for transmitting directional information and command selections to the processor (PRO) and for controlling cursor movement on the display (DS). This input device typically has two degrees of freedom on two axes (a first axis, e.g., x) and a second axis, e.g., y), allowing the device to specify its position in a plane. Touch panel (screen) displays can also be used as input devices.

[0105] In some embodiments, in response to processor PRO executing one or more sequences of one or more instructions contained in main memory MM, computer system CS may execute portions of one or more methods described herein. Such instructions may be read into main memory MM from another computer-readable medium, such as storage device SD. Execution of the sequence of instructions included in main memory MM causes processor PRO to perform the processing steps (operations) described herein. One or more processors in a multiprocessor arrangement may also be employed to execute the sequence of instructions contained in main memory MM. In some embodiments, hardwired circuitry may be used in place of or in combination with software instructions. Therefore, the description herein is not limited to any particular combination of hardware circuitry and software.

[0106] As used herein, the terms "computer-readable medium" and / or "machine-readable medium" refer to any medium that participates in providing instructions to a processor (PRO) for execution. Such media can take many forms, including, but not limited to, non-volatile media, volatile media, and transmission media. Non-volatile media include, for example, optical discs or magnetic disks, such as storage devices (SD). Volatile media include dynamic memory, such as main memory (MM). Transmission media include coaxial cables, copper wires, and optical fibers, including conductors forming a bus (BS). Transmission media can also take the form of sound waves or light waves, such as those generated during radio frequency (RF) and infrared (IR) data communications. Computer-readable media can be non-transitory, such as floppy disks, flexible disks, hard disks, magnetic tape, any other magnetic media, CD-ROMs, DVDs, any other optical media, punched cards, paper tape, any other physical media with a perforated pattern, RAM, PROMs and EPROMs, FLASH-EPROMs, any other memory chips or cartridges. Non-transitory computer-readable media can have instructions recorded thereon. When executed by a computer, the instructions can perform any of the operations described herein. For example, a temporary computer-readable medium may include a carrier wave or other medium that propagates electromagnetic signals.

[0107] Various forms of computer-readable media can involve carrying one or more sequences of one or more instructions to a processor PRO for execution. For example, the instructions may initially be carried on a disk of a remote computer. The remote computer may load the instructions into its dynamic memory and transmit them over a telephone line using a modem. A modem local to the computer system CS may receive data over the telephone line and convert the data into an infrared signal using an infrared transmitter. An infrared detector coupled to a bus BS may receive the data carried in the infrared signal and place that data on the bus BS. The bus BS carries the data to main memory MM, from which the processor PRO retrieves and executes the instructions. The instructions received by the main memory MM may optionally be stored on a storage device SD before or after execution by the processor PRO.

[0108] The computer system CS may also include a communication interface CI coupled to the bus BS. The communication interface CI provides bidirectional data communication coupled to a network link NDL (which connects to a local area network LAN). For example, the communication interface CI may be an Integrated Services Digital Network (ISDN) card or a modem to provide data communication connectivity to a corresponding type of telephone line. As another example, the communication interface CI may be a local area network (LAN) card to provide data communication connectivity to a compatible LAN. Wireless links may also be implemented. In any such implementation, the communication interface CI transmits and receives electrical, electromagnetic, or optical signals carrying digital data streams representing various types of information.

[0109] A network link (NDL) typically provides data communication to other data devices over one or more networks. For example, a network link (NDL) can provide a connection from a local area network (LAN) to a host computer (HC). This can include data communication services provided via a global packet data communication network (now commonly referred to as the "Internet" INT). A LAN (Internet) can use electrical, electromagnetic, or optical signals carrying digital data streams. Signals through various networks and signals on the network data link (NDL) via the communication interface (CI), carrying digital data to and from the computer system (CS), are exemplary forms of information carriers.

[0110] A computer system CS can send and receive messages, including program code, via one or more networks, network data links (NDLs), and communication interfaces (CIs). In the Internet example, a host HC can transmit request codes for an application via the Internet (INT), network data links (NDLs), local area networks (LANs), and communication interfaces (CIs). For example, an application downloaded in this way can provide all or part of the methods described herein. The received code can be executed by the processor PRO upon receipt and / or stored in storage devices (SDs) or other non-volatile memory for later execution. In this way, the computer system CS can obtain application code in carrier form.

[0111] The embodiments include the following numbered clauses: Clause 1: A support structure for a die, comprising: An array of attachment connectors is configured to hold die actuators, each die actuator being held by at least one attachment connector; and A controller connector array is configured to interface with the die actuator to control the movement of the die actuator. The controller connector array is distributed in the attachment connector array, and the attachment connector array and the controller connector array are configured to remain in a static position during the movement of the die actuator. Clause 2: The support structure according to Clause 1, wherein the support structure further comprises a plurality of die actuators, wherein an individual die actuator is attached to the support structure via at least one of the attachment connectors, and wherein an individual die actuator is connected to at least one of the controller connectors. Clause 3: The support structure according to Clause 2, wherein the die actuator is configured to mechanically move the die in a direction substantially perpendicular to the longitudinal plane of the support structure. Clause 4: The support structure as described in Clause 2, wherein the die actuator is individually controllable via the controller connector. Clause 5: The support structure according to Clause 2, wherein the die actuator is placed on the support structure and attached to the support structure by activation of the attachment connector. Clause 6: The support structure as described in Clause 5, wherein the die actuator is detached from the support structure by releasing the attachment connector. Clause 7: The support structure as described in Clause 1, wherein the surface of the support structure defines the attachment connector and the controller connector. Clause 8: The support structure as described in Clause 7, wherein the surface is substantially planar. Clause 9: The support structure as described in Clause 1, wherein the attachment connector is configured to retain the orifice of the individual die actuator by applying a vacuum force. Clause 10: The support structure as described in Clause 1, wherein the attachment connection is configured to hold the individual die actuator by applying an electrostatic force. Clause 11: The support structure according to Clause 1, wherein the controller connector comprises at least one of the following: The orifice is configured to control the movement of the die actuator by applying a vacuum force. The orifice is configured to control the movement of the die actuator by applying compressed air force, and An electrical connector is configured to control the movement of the die actuator by applying an electrical signal. Clause 12: The support structure according to Clause 1, wherein the controller connector array includes at least two different types of the controller connectors. Clause 13: A system for positioning a die, comprising at least two of the support structures described in any one of Clauses 1-10. Clause 14: A system for die positioning, comprising: A first stage supporting a die actuator array, wherein the die actuators are configured to actuate at least one of a plurality of donor dies; A second stage supporting multiple target dies; and The measurement system is functionally coupled to at least one of the first stage and the second stage, and is configured to: Obtain the relative position between the first donor die among multiple donor dies and the first target die among multiple target dies; Position at least one of the first stage and the second stage such that the position of the first donor die corresponds to the position of the first target die; and Activate the die actuator supporting the first donor die to place the first donor die on the first target die. Clause 15: The system according to Clause 14, wherein the measurement system is further configured to: The relative position between the second donor die among the plurality of donor dies and the second target die among the plurality of target dies is obtained; Position at least one of the first stage and the second stage such that the position of the second donor die corresponds to the position of the second target die; and Activate the die actuator supporting the second donor die to place the second donor die on the second target die. Clause 16: The system according to Clause 15, wherein the measurement system is further configured to: After the first donor die is placed on the first target die, pressure is maintained from the die actuator supporting the first donor die placed on the first target die; and Position at least one of the first stage and the second stage such that the position of the second donor die corresponds to the position of the second target die, while maintaining the pressure supporting the first donor die. Clause 17: The system according to Clause 15, wherein the measurement system is configured to substantially simultaneously obtain the relative position between the first donor die and the first target die and the relative position between the second donor die and the second target die. Clause 18: The system according to Clause 14, wherein the measurement system is further configured to retract the die actuator supporting the first donor die after the bonding time period has expired. Clause 19: The system according to Clause 14, wherein the measurement system is configured to obtain the relative position between the first donor die and the first target die based on measurements of the position of the first donor die relative to a reference point on the first stage and measurements of the position of the first target die relative to a reference point on the second stage. Clause 20: The system according to Clause 14, wherein the measurement system is configured to position at least one of the first stage and the second stage such that the position of the first donor die corresponds to the position of the first target die within a threshold range. Clause 21: The system according to Clause 14, wherein the measurement system configured to activate the die actuator includes a measurement system configured to controllably guide the first donor die into contact with the first target die. Clause 22: The system according to Clause 21, wherein the first stage further includes a plurality of guide rails, each die actuator being guided by at least one guide rail. Clause 23: The system according to Clause 22, wherein each guide rail guides the position of the corresponding die actuator in a direction substantially perpendicular to the longitudinal plane of the first stage. Clause 24: The system according to Clause 22, wherein each guide rail prevents the corresponding die actuator from moving in a direction substantially parallel to the longitudinal plane of the first stage. Clause 25: The system according to Clause 22, wherein after the first donor die is placed on the first target die, the at least one guide rail disengages from the die actuator. Clause 26: The system according to Clause 25, wherein after the die actuator retracts from placing the first donor die on the first target die, the at least one guide rail re-engages with the die actuator. Clause 27: The system according to Clause 14, wherein the first stage and the second stage are substantially parallel, and wherein the die actuator places the first donor die on the first target die in a direction substantially perpendicular to the parallel plane of the first stage and the second stage. Clause 28: The system according to Clause 27, wherein the first stage and the second stage are positioned opposite each other with respect to the parallel plane. Clause 29: The system according to Clause 27, wherein the first stage is supported by a movable wafer chuck, and wherein the measurement system configured to position at least one of the first stage and the second stage includes a measurement system for positioning the movable wafer chuck. Clause 30: The system according to Clause 29, wherein the movable wafer chuck further includes a third stage supporting the second die actuator array, and wherein the movable wafer chuck is further configured to exchange the positions of the first stage and the third stage. Clause 31: The system according to Clause 29, wherein the measurement system configured to obtain the relative position between the first donor die among a plurality of donor dies and the first target die among a plurality of target dies includes a measurement system configured to measure the position of the first donor die at a first position in the movable wafer chuck, and wherein the measurement system configured to activate the die actuator supporting the first donor die to place the first donor die on the first target die includes a measurement system configured to activate the die actuator supporting the first donor die to place the first donor die on the first target die at a second position in the movable wafer chuck.

[0112] While the concepts disclosed herein can be used in fabrication with substrates such as silicon wafers, it should be understood that the disclosed concepts can be used with any type of fabrication system (e.g., those used in fabrication on substrates other than silicon wafers).

[0113] Furthermore, combinations and sub-combinations of the disclosed elements may include individual embodiments. For example, one or more of the operations described above may be included in a separate embodiment, or they may be included together in the same embodiment.

[0114] The above description is intended to be illustrative and not restrictive. Therefore, it will be apparent to those skilled in the art that modifications as described can be made without departing from the scope of the claims set forth below.

Claims

1. A support structure for a die, comprising: An array of attachment connectors is configured to hold die actuators, each of which is held by at least one attachment connector. as well as The controller connector array is configured to interface with the die actuator to control the movement of the die actuator. The controller connector array is distributed in the attachment connector array, and the attachment connector array and the controller connector array are configured to remain in a static position during the movement of the die actuator.

2. The support structure according to claim 1, wherein the support structure further comprises a plurality of die actuators, wherein an individual die actuator is attached to the support structure via at least one of the attachment connectors, and the individual die actuator is connected to at least one of the controller connectors.

3. The support structure according to claim 2, wherein the die actuator is configured to mechanically move the die in a direction substantially perpendicular to the longitudinal plane of the support structure.

4. The support structure according to claim 2, wherein the die actuator can be individually controlled via the controller connector.

5. The support structure according to claim 2, wherein the die actuator is placed on the support structure and attached to the support structure by activation of the attachment connector.

6. The support structure according to claim 5, wherein the die actuator is detached from the support structure by releasing the attachment connector.

7. The support structure of claim 1, wherein the surface of the support structure defines the attachment connector and the controller connector.

8. The support structure of claim 1, wherein the attachment connector is configured to hold the orifice of the individual die actuator by applying a vacuum force, or wherein the attachment connector is configured to hold the electrical connection of the individual die actuator by applying an electrostatic force.

9. The support structure according to claim 1, wherein the controller connector comprises at least one of the following: The orifice is configured to control the movement of the die actuator by applying a vacuum force. The orifice is configured to control the movement of the die actuator by applying compressed air force, and An electrical connector is configured to control the movement of the die actuator by applying an electrical signal.

10. The support structure according to claim 1, wherein the controller connector array comprises at least two different types of controller connectors.

11. A system for positioning a die, comprising: A first stage supporting a die actuator array, wherein the die actuators are configured to actuate at least one of a plurality of donor dies; A second stage supporting multiple target dies; as well as The measurement system is functionally coupled to at least one of the first stage and the second stage, and is configured to: The relative position between the first donor die among the plurality of donor dies and the first target die among the plurality of target dies is obtained; Position at least one of the first stage and the second stage such that the position of the first donor die corresponds to the position of the first target die; as well as Activate the die actuator supporting the first donor die to place the first donor die on the first target die.

12. The system of claim 11, wherein the measurement system is further configured to: Obtain the relative position between the second donor die among the plurality of donor dies and the second target die among the plurality of target dies; Position at least one of the first stage and the second stage such that the position of the second donor die corresponds to the position of the second target die; as well as Activate the die actuator supporting the second donor die to place the second donor die on the second target die.

13. The system of claim 12, wherein the measurement system is further configured to: After the first donor die is placed on the first target die, pressure is maintained from the die actuator supporting the first donor die placed on the first target die; and Position at least one of the first stage and the second stage such that the position of the second donor die corresponds to the position of the second target die, while maintaining the pressure supporting the first donor die.

14. The system of claim 12, wherein the measurement system is configured to obtain substantially simultaneously the relative position between the first donor die and the first target die and the relative position between the second donor die and the second target die.

15. The system of claim 11, wherein the measurement system is further configured to retract the die actuator supporting the first donor die after the bonding time period has expired.

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