Non-soldered lead-free busbar manufacturing device

Abstract

The application discloses a non-welding lead-free busbar manufacturing device and particularly relates to the technical field of busbar manufacturing, which comprises a plating solution tank, a first rack and a second rack fixedly installed on the two sides of the plating solution tank, a pay-off roller, a pretreatment mechanism and a positioning roller fixedly installed on the first rack in sequence along the direction of the base strip, and the pretreatment mechanism comprises a pretreatment box fixedly installed on the first rack. The application realizes the integration of degreasing activation and anchoring effect, solves the technical pain points that the traditional pretreatment can only clean the surface and the adhesion of the plating layer is insufficient, significantly improves the combination stability of the plating layer and the base strip, makes the degreasing activation more sufficient, realizes the double improvement of the plating solution uniformity and the surface activation effect, avoids the plating layer thickness deviation and local shedding failure from the root, avoids the problems that the temperature is too high to cause the poor cooperativity of the busbar forming and the plating layer and the plating layer is easy to crack, and solves the defects that the welding process is easy to cause the damage of the plating layer and the combination is not firm.

Description

Technical Field

[0001] This invention relates to the field of busbar manufacturing technology, and more specifically, to a non-welded lead-free busbar manufacturing apparatus. Background Technology

[0002] As a key connecting component in photovoltaic modules, electronic devices and other fields, the adhesion, thickness uniformity and molding stability of the busbar directly affect the reliability and service life of the end products. With the increasing environmental protection requirements, lead-free busbars have become the mainstream of industry development.

[0003] In the baseband pretreatment stage of the busbar, traditional processes generally employ chemical degreasing or atmospheric pressure plasma treatment. The former is prone to leaving chemical residues, while the latter only achieves preliminary surface cleaning of impurities. Both lack a synergistic design for degreasing activation and microstructure modification, failing to form an anchoring structure on the baseband surface conducive to coating adhesion. This results in inherently weak coating adhesion, becoming a major cause of peeling and failure. In the plating solution mixing and coating deposition stages, existing devices mostly rely on single stirring or aeration structures. The flow field design lacks synergy, making it difficult to form a stable and uniform plating solution environment. This not only causes large deviations in coating thickness but also further exacerbates the problem of weak local adhesion due to insufficient material exchange on the baseband surface. In the forming stage, traditional technologies either use welding processes that easily damage the coating or lack a rapid cooling dual-roller synergistic design and targeted mechanical interlocking structure. This leads to the coating being prone to thermal stress cracking and insufficient density, seriously affecting the reliability and service life of the busbar. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a non-welded lead-free busbar manufacturing apparatus to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a non-welded lead-free busbar manufacturing apparatus, comprising a plating bath and a first frame and a second frame respectively fixedly installed on both sides thereof, wherein an unwinding roller, a pretreatment mechanism, and a positioning roller are sequentially fixedly installed on the first frame along the direction of baseband travel;

[0006] The pretreatment mechanism includes a pretreatment box fixedly installed on the first frame. Both sides of the pretreatment box are provided with baseband inlets and outlets for baseband to pass through. The pretreatment box is provided with a plasma nozzle for treating the surface of the baseband passing through it.

[0007] The plating tank is equipped with a uniform mixing mechanism and two guide rollers rotatably connected to its inner wall for guiding the baseband.

[0008] The second frame is fixedly equipped with a cooling and rolling mechanism, which is used to cool and mechanically press the two confluence belts that have been drawn from the plating bath and have completed the plating.

[0009] Preferably, the pretreatment mechanism further includes:

[0010] A vacuum pump is fixedly installed on the top of the pretreatment box, and its suction end is connected to the inside of the pretreatment box through a pipe;

[0011] Argon and oxygen cylinders are fixedly installed on the top of the pretreatment box, and their outlets are connected to the inlet of a gas mixer through connecting pipes.

[0012] The outlet of the gas mixer is connected to a gas distribution pipe located inside the pretreatment tank via a flow controller;

[0013] Multiple plasma nozzles are fixedly mounted on the gas distribution pipe and face the baseband surface;

[0014] A high-frequency, high-voltage power supply, the output of which is electrically connected to the electrodes inside the plasma nozzle.

[0015] Preferably, the uniform mixing mechanism comprises:

[0016] A spiral agitator mounted on the inner wall of the plating bath via a bearing housing;

[0017] An annular aeration pipe is fixedly installed in the middle of the plating bath and located between two guide rollers, with multiple aeration micropores opened on its pipe wall;

[0018] An air pump is fixedly installed on the outside of the plating tank. Its outlet is connected to the annular aeration pipe through a pipeline, and its inlet is connected to an inert gas inlet pipe.

[0019] Preferably, the cooling rolling mechanism includes:

[0020] A support frame is fixedly installed on the top of the second frame, and a guide wheel is rotatably connected to the top of the support frame;

[0021] A fixed housing that is permanently installed on top of the second frame;

[0022] The first cooling pressure roller has its two ends rotatably connected to the top of the fixed box via rotating columns;

[0023] The first motor is fixedly installed on the outside of the fixed box, and its output shaft is connected to the rotating shaft at one end of the first cooling pressure roller via a coupling.

[0024] Preferably, the first cooling roller has a hollow interior forming a cooling cavity, and its rotation axis is a hollow shaft;

[0025] The device also includes a closed-loop cooling circuit, which is sequentially connected to: the cooling chamber of the first cooling roller, a first circulation pipe rotatably connected to its hollow shaft, a circulation pump, and a first water-cooling block.

[0026] Preferably, the cooling roller mechanism further includes a second cooling roller located directly above the first cooling roller, and a lifting assembly for driving the second cooling roller to move up and down;

[0027] The lifting assembly includes:

[0028] A top plate that is fixedly installed on the top of the fixed box;

[0029] A threaded rod, the lower end of which is rotatably connected to the top of the fixed box via a bearing, and the upper end passing through the top plate and connected to the output shaft of a second motor fixed on the top plate via a coupling;

[0030] A threaded sleeve is provided on the threaded rod and threadedly engaged with it;

[0031] At least one vertical fixing rod is fixed between the top plate and the fixed box;

[0032] A positioning sleeve is mounted on the fixed rod and can slide along it;

[0033] A fixed box, one side of which is fixedly connected to the threaded sleeve, and the other side of which is fixedly connected to the positioning sliding sleeve;

[0034] The two ends of the second cooling roller are rotatably connected to the fixed box via a rotating cylinder.

[0035] Preferably, the second cooling roller has a hollow interior forming a cooling cavity;

[0036] The device also includes another closed-loop cooling circuit, which is connected in sequence to: a cooling chamber at one end of the second cooling roller, a second circulation pipe, a water pump, a second water-cooled block, and a cooling chamber at the other end of the second cooling roller.

[0037] Preferably, the first and second cooling rollers are further fixedly inlaid with a plurality of radially protruding rolling plates in the circumferential direction of the roller body.

[0038] Preferably, the axis of the spiral agitator is arranged perpendicular to or at a certain angle to the axis of the annular aeration pipe to create turbulence in the plating bath.

[0039] The technical effects and advantages of this invention are as follows:

[0040] 1. Through a low-pressure plasma synergistic pretreatment scheme, a stable low-pressure environment is created by a vacuum pump. Combined with the precise ratio of argon tank, oxygen tank and gas mixer, and then the flow controller and gas distribution pipe to achieve uniform plasma distribution, the plasma nozzle, under the action of high frequency and high voltage power supply, not only completes the deep removal of oxide layer and oil on the substrate surface, but also forms a micro-concave-convex structure through plasma etching, realizing the integration of degreasing activation and anchoring effect. This solves the technical pain point of traditional pretreatment that can only clean the surface and has insufficient coating adhesion, and significantly improves the bonding stability between the coating and the substrate.

[0041] 2. A uniform mixing mechanism with a spiral agitator and annular aeration arranged at an angle creates a strong turbulent flow field in the plating bath by setting the spiral agitator perpendicular to or at an angle to the axis of the annular aeration pipe, combined with the microbubbles released by the aeration micropores. This not only overcomes the problem of uneven plating bath concentration and flow rate caused by traditional single agitation methods, but also accelerates the exchange of substances on the substrate surface through turbulence, making degreasing and activation more complete. This achieves a dual improvement in plating bath uniformity and surface activation effect, fundamentally avoiding coating thickness deviation and local peeling failure, and is significantly better than the performance of traditional mixing structures.

[0042] 3. By adopting a non-welding cooling roll forming scheme to replace the traditional welding process, rapid cooling is achieved through an independent closed-loop cooling circuit of dual cooling rollers. Combined with the adjustable spacing function of the circumferential rolling plate and lifting component of the roller body, stable cooling prevents the coating from cracking due to thermal stress. Mechanical interlocking compacts the coating pores, avoiding the problems of poor coordination between busbar forming and coating and easy cracking of the coating caused by excessive temperature. This solves the defects of the welding process that easily lead to coating damage and weak bonding. At the same time, cooling and shaping and densification pressing are completed simultaneously, significantly improving the forming quality and service life of the busbar. Attached Figure Description

[0043] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0044] Figure 2 This is a schematic diagram of the rear view structure of the present invention.

[0045] Figure 3 This is a three-dimensional structural diagram of the plating tank of the present invention.

[0046] Figure 4 This is a partial structural diagram of the present invention.

[0047] Figure 5 For the present invention Figure 2 Enlarged structural diagram at point A in the middle.

[0048] Figure 6 For the present invention Figure 4 A side sectional view of the structure.

[0049] Figure 7 This is a partial frontal cross-sectional view of the present invention.

[0050] The attached diagram is labeled as follows: 1. Plating bath; 2. First frame; 3. Second frame; 4. Unwinding roller; 5. Positioning roller; 6. Pretreatment box; 7. Baseband inlet / outlet; 8. Vacuum pump; 9. Argon tank; 10. Oxygen tank; 11. Connecting pipe; 12. Gas mixer; 13. High-frequency high-voltage power supply; 14. Flow controller; 15. Gas distribution pipe; 16. Plasma nozzle; 17. Spiral agitator; 18. Air pump; 19. Inert gas inlet pipe; 20. Annular aeration pipe; 21. Aeration micropores; 22. Guide tube. 23. Support frame; 24. Guide wheel; 25. Fixing box; 26. First cooling pressure roller; 27. First motor; 28. Rotating column; 29. ​​First circulation pipe; 30. Circulation pump; 31. First water-cooling block; 32. Top plate; 33. Threaded rod; 34. Threaded sleeve; 35. Fixing box; 36. Rotating cylinder; 37. Second circulation pipe; 38. Second water-cooling block; 39. Water pump; 40. Second motor; 41. Fixing rod; 42. Positioning sleeve; 43. Second cooling pressure roller; 44. Rolling plate. Detailed Implementation

[0051] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] As attached Figure 1-7 The non-welded lead-free busbar manufacturing apparatus shown includes a plating bath 1 and a first frame 2 and a second frame 3 respectively fixedly installed on both sides of it. The first frame 2 is sequentially fixedly installed with an unwinding roller 4, a pretreatment mechanism, and a positioning roller 5 along the direction of baseband travel.

[0053] The pretreatment mechanism includes a pretreatment box 6 fixedly installed on the first frame 2. Both sides of the pretreatment box 6 are provided with baseband inlet and outlet 7 for baseband to pass through. The pretreatment box 6 is provided with a plasma nozzle 16 for treating the surface of the baseband passing through it.

[0054] The plating bath 1 is equipped with a uniform mixing mechanism and two guide rollers 22 rotatably connected to its inner wall for guiding the base strip;

[0055] A cooling and rolling mechanism is fixedly installed on the second frame 3, which is used to cool and mechanically press the two confluence belts that have been coated and drawn out from the plating bath 1.

[0056] As attached Figure 1 , 2 As shown in Figures 5 and 7, the pretreatment mechanism also includes:

[0057] A vacuum pump 8 is fixedly installed on the top of the pretreatment box 6, and its suction end is connected to the inside of the pretreatment box 6 through a pipe;

[0058] Argon cylinder 9 and oxygen cylinder 10 are fixedly installed on the top of the pretreatment box 6, and their outlets are connected to the inlet of a gas mixer 12 through a connecting pipe 11.

[0059] The outlet of the gas mixer 12 is connected to a gas distribution pipe 15 located inside the pretreatment box 6 via a flow controller 14.

[0060] Multiple plasma nozzles 16 are fixedly mounted on the gas distribution pipe 15 and face the baseband surface;

[0061] A high-frequency high-voltage power supply 13, the output of which is electrically connected to the electrodes inside the plasma nozzle 16;

[0062] By precisely mixing the argon tank 9, oxygen tank 10 and gas mixer 12, and combining the flow controller 14 and gas distribution pipe 15 to deliver gas evenly, the plasma released by the plasma nozzle 16 is made to have a more balanced effect, significantly improving the surface roughness of the baseband and strengthening the anchoring effect to improve the adhesion of the coating.

[0063] With the help of the low-pressure environment created by the vacuum pump 8 and the stable electric field provided by the high-frequency high-voltage power supply 13, the plasma nozzle 16 can fully remove the oxide layer and oil stains on the substrate surface, achieve deep degreasing and activation, and lay a clean and active foundation for coating deposition.

[0064] As attached Figure 1-3 As shown, the uniform mixing mechanism includes:

[0065] A spiral stirrer 17 is installed on the inner wall of the plating bath 1 via a bearing housing;

[0066] An annular aeration pipe 20, fixedly installed in the middle of the plating tank 1 and located between two guide rollers 22, has multiple aeration microholes 21 on its pipe wall;

[0067] An air pump 18 is fixedly installed on the outside of the plating tank 1. Its outlet is connected to an annular aeration pipe 20 through a pipe, and its inlet is connected to an inert gas inlet pipe 19.

[0068] The synergistic effect of the spiral stirrer 17 and the annular aeration pipe 20, together with the microbubbles released by the aeration micropores 21, forms a stable turbulence in the plating bath 1, ensuring uniform concentration and flow rate of the lead-free plating solution and effectively improving the consistency of the plating thickness.

[0069] The gas delivered by the air pump 18 through the inert gas inlet pipe 19 is uniformly aerated through the annular aeration pipe 20, which can accelerate the diffusion of reaction products in the plating solution, avoid weak coating adhesion caused by local concentration imbalance, and reduce the risk of coating peeling and failure.

[0070] As attached Figure 1 , 2 As shown in Figures 4 and 6, the cooling and rolling mechanism includes:

[0071] A support frame 23 is fixedly installed on the top of the second frame 3, and a guide wheel 24 is rotatably connected to the top of the support frame 23;

[0072] The mounting box 25 is fixedly installed on the top of the second frame 3;

[0073] The first cooling roller 26 has its two ends rotatably connected to the top of the fixed box 25 via rotating columns 28;

[0074] The first motor 27 is fixedly installed on the outside of the fixed box 25, and its output shaft is connected to the rotating shaft at one end of the first cooling pressure roller 26 via a coupling.

[0075] The guide wheel 24 on the support frame 23 can accurately guide the direction of the busbar, and together with the first motor 27, it drives the rotating column 28 to drive the first cooling pressure roller 26 to rotate stably, so as to realize the smooth delivery and precise pressing of the busbar and avoid the offset defects when forming without welding.

[0076] The stable assembly of the first cooling roller 26 with the fixed box 25 and the direct drive of the first motor 27 ensure uniform pressing force and controllable speed, adapting to the forming requirements of different specifications of busbars and improving the versatility of the device.

[0077] As attached Figure 6 As shown, the first cooling roller 26 has a hollow interior forming a cooling chamber, and its rotation axis is a hollow shaft;

[0078] The device also includes a closed-loop cooling circuit, which is connected in sequence to: the cooling chamber of the first cooling roller 26, a first circulation pipe 29 rotatably connected to its hollow shaft, a circulation pump 30, and a first water-cooling block 31.

[0079] As attached Figure 1 , 2 As shown in Figures 4 and 6, the cooling rolling mechanism also includes a second cooling roller 43 located directly above the first cooling roller 26, and a lifting assembly for driving the second cooling roller 43 to rise and fall.

[0080] The lifting assembly includes:

[0081] A top plate 32 is fixedly installed on the top of the fixed box 25;

[0082] A threaded rod 33, the lower end of which is rotatably connected to the top of the fixed box 25 via a bearing, and the upper end of which passes through the top plate 32 and is connected to the output shaft of a second motor 40 fixed on the top plate 32 via a coupling;

[0083] A threaded sleeve 34 is provided on the threaded rod 33 and is threadedly engaged with it;

[0084] At least one vertical fixing rod 41 is fixed between the top plate 32 and the fixed box 25;

[0085] A positioning sleeve 42 is mounted on the fixed rod 41 and can slide along it;

[0086] A fixed box 35, one side of which is fixedly connected to a threaded sleeve 34, and the other side of which is fixedly connected to a positioning sliding sleeve 42;

[0087] The two ends of the second cooling roller 43 are rotatably connected to the fixed box 35 through the rotating cylinder 36.

[0088] As attached Figure 1 , 2 As shown in Figures 4 and 6, the second cooling roller 43 has a hollow interior forming a cooling chamber;

[0089] The device also includes another closed-loop cooling circuit, which is connected in sequence to: the cooling chamber at one end of the second cooling roller 43, a second circulation pipe 37, a water pump 39, a second water cooling block 38, and the cooling chamber at the other end of the second cooling roller 43.

[0090] As attached Figure 1 , 2 As shown in Figure 4, multiple radially protruding rolling plates 44 are also fixedly embedded in the circumferential direction of the first cooling roller 26 and the second cooling roller 43.

[0091] The first cooling roller 26 and the rolling plate 44 on the second cooling roller 43 are arranged radially protrudingly, which can apply concentrated and uniform pressing force to the busbar, compact the internal pores of the coating, and improve the density and mechanical strength of the coating.

[0092] Multiple rolling plates 44 are evenly distributed around the roller body. Together with the relative rotation of two cooling pressure rollers, they achieve full-width mechanical interlocking of the busbar, enhance the anchoring effect, and further reduce the risk of coating peeling.

[0093] As attached Figure 1 , 3 As shown, the axis of the spiral stirrer 17 is arranged perpendicular to or at a certain angle to the axis of the annular aeration pipe 20 to create turbulence in the plating bath.

[0094] The angle design between the axes of the spiral stirrer 17 and the annular aeration pipe 20 allows the bubbles and the stirring flow field to fully intertwine to form strong turbulence, promotes the rapid diffusion of plating solution components, and ensures uniform plating thickness in all areas of the baseband surface.

[0095] The turbulence generated by this arrangement can fully act on the baseband surface guided by the guide roller 22, accelerate material exchange, ensure more thorough degreasing and activation of the baseband, and improve the bonding stability between the coating and the baseband.

[0096] The working principle of this invention is as follows: The process proceeds sequentially from baseband treatment, coating deposition, and cooling / pressing. Through key structural design, it achieves enhanced coating adhesion and improved forming stability. The baseband to be treated is released from the unwinding roller 4 fixed to the first frame 2, conveyed along the baseband's travel direction, and corrected in position by the positioning roller 5. It then enters the pretreatment mechanism through the baseband inlet / outlet 7 on both sides of the pretreatment box 6. A vacuum pump 8 is activated to extract air from the pretreatment box 6 to create a low-pressure environment. Gases from the argon tank 9 and oxygen tank 10 are connected via a connecting pipe 11 and mixed uniformly in a gas mixer 12. The gas is then uniformly mixed and the intake volume is precisely adjusted by the flow controller 14 before being delivered to the gas distribution pipe 15 in the pretreatment box 6. The high-frequency high-voltage power supply 13 supplies power to the electrodes inside the multiple plasma nozzles 16 on the gas distribution pipe 15, causing the mixed gas to be ionized into plasma and sprayed toward the baseband surface. This process not only removes impurities and enhances the activity of the baseband surface, but also improves the surface roughness of the baseband through the etching effect of plasma, forming a micro-uneven structure to generate an anchoring effect, providing a solid foundation for subsequent coating adhesion, and significantly improving the adhesion effect between the coating and the baseband.

[0097] The pretreated baseband enters the plating bath 1, where a uniform lead-free coating is deposited under the synergistic action of a homogeneous mixing mechanism. Inside the plating bath 1, a spiral stirrer 17 mounted on a bearing seat rotates and stirs the lead-free plating solution. Simultaneously, an air pump 18 is activated, drawing inert gas through an inert gas inlet pipe 19 and delivering it to an annular aeration pipe 20 fixed in the middle of the plating bath 1, between two guide rollers 22. The gas is released as tiny bubbles through the aeration micropores 21 on the pipe wall. Due to the alignment of the spiral stirrer 17 with the annular aeration pipe 20... The axes are arranged perpendicularly or at a certain angle. The two work together to form a stable turbulent flow in the plating bath 1, which effectively ensures the uniformity of the concentration and the stability of the flow rate of the lead-free plating solution. This ensures that the substrate surface is fully degreased and activated, avoiding the problem of weak local adhesion of the coating caused by uneven distribution of the plating solution. This makes the coating less likely to fall off and fail, while improving the uniformity of the coating thickness. This lays the foundation for the subsequent forming quality. The substrate is guided by two guide rollers 22 to be completely immersed in the uniformly mixed lead-free plating solution, and the lead-free coating is deposited on the surface.

[0098] After the dual-band conduit for coating deposition is led out from the plating bath 1, it is guided by the guide wheel 24 on the top of the support frame 23 on the second frame 3 into the working area of ​​the fixed box 25. The conduit is formed by a non-welding mechanical pressing method. The first cooling roller 26 is driven by the first motor 27 on the outside of the fixed box 25. Its output shaft drives the rotating column 28 at one end of the first cooling roller 26 to rotate through a coupling. The first cooling roller 26 has a hollow interior forming a cooling chamber and the rotating shaft is also a hollow shaft, enabling closed-loop cooling. The circuit consists of the cooling chamber of the first cooling roller 26, the first circulation pipe 29 rotatably connected to its hollow shaft, the circulation pump 30, and the first water-cooling block 31 connected in sequence. The circulation pump 30 drives the coolant to circulate in the circuit to achieve precise cooling. The second cooling roller 43 adjusts the distance between itself and the first cooling roller 26 through the lifting assembly. The second motor 40 on the top plate 32 is started, and its output shaft drives the threaded rod 33 to rotate, causing the threaded sleeve 34 to rise and fall along the rod body. The positioning sleeve 42 moves synchronously along the fixed rod 41. The sliding mechanism drives the fixed box 35 and the second cooling roller 43, which is connected to the inside of the rotating cylinder 36, to rise and fall. The second cooling roller 43 also has a cooling chamber inside. Another closed-loop cooling circuit is composed of the cooling chamber at one end of the second cooling roller 43, the second circulation pipe 37, the water pump 39, the second water cooling block 38, and the cooling chamber at the other end of the second cooling roller 43 connected in sequence. The water pump 39 drives the coolant to circulate in the circuit to reduce the temperature and avoid the problem of poor synergy between the formation of the busbar and the coating and easy cracking of the coating due to excessive temperature. The stable cooling effect prevents the coating from generating internal stress due to excessive temperature difference during the formation process, effectively preventing the coating from cracking. At the same time, the multiple radially protruding rolling plates 44 fixedly embedded in the two cooling rollers mechanically press the busbar when they rotate relative to each other. Combined with the cooling effect, the coating is densified and shaped, further enhancing the adhesion effect brought by the anchoring effect. Finally, the non-welded lead-free busbar with strong coating adhesion, uniform thickness, and no crack defects is manufactured.

[0099] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0100] Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other.

[0101] In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A non-welded lead-free manifold manufacturing apparatus, comprising a plating bath (1) and a first frame (2) and a second frame (3) respectively fixedly installed on both sides thereof, characterized in that: The first frame (2) is fixedly installed with an unwinding roller (4), a pretreatment mechanism, and a positioning roller (5) in sequence along the base belt traveling direction. The pretreatment mechanism includes a pretreatment box (6) fixedly installed on the first frame (2). Both sides of the pretreatment box (6) are provided with baseband inlet and outlet (7) for baseband to pass through. The pretreatment box (6) is provided with a plasma nozzle (16) for treating the surface of the baseband passing through it. The plating tank (1) is equipped with a uniform mixing mechanism and two guide rollers (22) rotatably connected to its inner wall for guiding the base strip. A cooling rolling mechanism is fixedly installed on the second frame (3), the cooling rolling mechanism comprising: A support frame (23) is fixedly installed on the top of the second frame (3), and a guide wheel (24) is rotatably connected to the top of the support frame (23). A fixed box (25) is fixedly installed on the top of the second frame (3); The first cooling roller (26) is rotatably connected to the top of the fixed box (25) at both ends by a rotating column (28); The first motor (27) is fixedly installed on the outside of the fixed box (25), and its output shaft is connected to the rotating shaft at one end of the first cooling roller (26) via a coupling. The first cooling roller (26) has a hollow interior forming a cooling chamber, and its rotation axis is a hollow shaft; The cooling rolling mechanism also includes a second cooling roller (43) located directly above the first cooling roller (26); The device also includes a closed-loop cooling circuit, which is connected in sequence to: the cooling chamber of the first cooling roller (26), a first circulation pipe (29) rotatably connected to its hollow shaft, a circulation pump (30), and a first water-cooled block (31).

2. The non-welded lead-free busbar manufacturing apparatus according to claim 1, characterized in that: The pretreatment mechanism also includes: A vacuum pump (8) is fixedly installed on the top of the pretreatment box (6), and its suction end is connected to the inside of the pretreatment box (6) through a pipe; Argon cylinder (9) and oxygen cylinder (10) are fixedly installed on the top of the pretreatment box (6), and their outlets are connected to the inlet of a gas mixer (12) through a connecting pipe (11). The outlet of the gas mixer (12) is connected to a gas distribution pipe (15) located inside the pretreatment box (6) via a flow controller (14); Multiple plasma nozzles (16) are fixedly mounted on the gas distribution pipe (15) and face the baseband surface; A high-frequency high-voltage power supply (13) is provided, the output of which is electrically connected to the electrodes inside the plasma nozzle (16).

3. The non-welded lead-free busbar manufacturing apparatus according to claim 1, characterized in that: The uniform mixing mechanism includes: A spiral stirrer (17) is installed on the inner wall of the plating tank (1) via a bearing housing. An annular aeration pipe (20) is fixedly installed in the middle of the plating tank (1) and located between two guide rollers (22), and multiple aeration microholes (21) are opened on its pipe wall. An air pump (18) is fixedly installed on the outside of the plating tank (1). Its outlet is connected to the annular aeration pipe (20) through a pipe, and its inlet is connected to an inert gas inlet pipe (19).

4. The non-welded lead-free busbar manufacturing apparatus according to claim 1, characterized in that: The device also includes a lifting assembly for driving the second cooling pressure roller (43) to rise and fall; The lifting assembly includes: A top plate (32) is fixedly installed on the top of the fixed box (25); A threaded rod (33) has its lower end rotatably connected to the top of a fixed box (25) via a bearing, and its upper end passes through a top plate (32) and is connected to the output shaft of a second motor (40) fixed on the top plate (32) via a coupling; A set of threaded sleeves (34) provided on the threaded rod (33) and threadedly engaged with it; At least one fixing rod (41) is vertically fixed between the top plate (32) and the fixed box (25); A positioning sleeve (42) is provided on the fixed rod (41) and can slide along it. A fixed box (35) is fixedly connected to the threaded sleeve (34) on one side and to the positioning sliding sleeve (42) on the other side; The two ends of the second cooling roller (43) are rotatably connected to the fixed box (35) through the rotating cylinder (36).

5. The non-welded lead-free busbar manufacturing apparatus according to claim 1, characterized in that: The second cooling roller (43) has a hollow interior forming a cooling chamber; The device also includes another closed-loop cooling circuit, which is connected in sequence to: the cooling chamber at one end of the second cooling roller (43), a second circulation pipe (37), a water pump (39), a second water-cooled block (38), and the cooling chamber at the other end of the second cooling roller (43).

6. The non-welded lead-free busbar manufacturing apparatus according to claim 1, characterized in that: The first cooling roller (26) and the second cooling roller (43) are also fixedly inlaid with a plurality of radially protruding rolling plates (44) in the circumferential direction of the roller body.

7. The non-welded lead-free busbar manufacturing apparatus according to claim 3, characterized in that: The axis of the spiral stirrer (17) is arranged perpendicular to or at a certain angle to the axis of the annular aeration pipe (20) to create turbulence in the plating bath.

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