Dual-frequency composite packaging antenna for microwave wireless energy transmission

Abstract

The invention provides a dual-frequency composite packaging antenna for microwave wireless energy transmission. The dual-frequency composite packaging antenna sequentially comprises a high-frequency radiation array plane, a low-frequency radiation array plane, a feed network and a packaging cavity from top to bottom. The high-frequency radiation array plane comprises four first patches which are arranged in a 2 * 2 matrix form; the low-frequency radiation array plane comprises a second patch, and four corners of the second patch are provided with grooves. The four parasitic patches are respectively positioned at the grooves at the four vertex angles of the second patch, are respectively positioned below the four first patches, and are used for feeding the first patches and feeding the second patch in a proximity coupling manner; the packaging cavity is located at the bottom of the dual-frequency composite packaging antenna and is connected with the feed network, and a closed space is formed between the packaging cavity and the feed network. The dual-band antenna has the advantages of small caliber, high integration and simple feed while the dual-band requirement of a microwave wireless energy transfer system is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of antennas, in particular to a dual-frequency composite packaged antenna for microwave wireless energy transmission. BACKGROUND

[0002] An antenna is a device for transmitting and receiving electromagnetic waves, and is one of the key parts of a microwave wireless energy transmission system, which can realize the requirement of effectively radiating electromagnetic energy under the condition of a specific frequency, polarization mode, etc. In order to reduce transmission loss, the microwave wireless energy transmission system works in the atmospheric window. Most of the traditional microwave wireless energy transmission systems work at a single frequency point, which has weak anti-interference ability and limited bandwidth, and cannot meet the modern high-density and multi-scene requirements. Therefore, it is particularly important to develop a dual-frequency composite antenna for microwave wireless energy transmission.

[0003] The dual-frequency composite phased array antenna in the prior art has problems such as large size and complex feed network in low-frequency applications. For example, high-frequency radiation patches and low-frequency radiation patches are arranged on the same layer of dielectric substrate, and four high-frequency radiation patches are arranged around the low-frequency radiation patch. In this structure, the high-frequency radiation patch can be used as a parasitic patch of the low-frequency radiation patch to expand the low-frequency bandwidth. However, this structure is only suitable for high-frequency applications. When both frequency points of the antenna are low-frequency, the size of the high-frequency radiation patch and the low-frequency radiation patch is large, which causes problems such as the inability to etch the patches on the same layer or the large aperture of the unit, thereby affecting the scanning performance of the array.

[0004] Therefore, it is particularly important to develop a dual-frequency composite antenna for microwave wireless energy transmission.

[0005] The statements herein only provide background technology related to the present application, and do not necessarily constitute the prior art. SUMMARY

[0006] The purpose of the present application is to provide a dual-frequency composite packaged antenna for microwave wireless energy transmission, which overcomes the problems of large size and complex feed network of the existing dual-frequency composite antenna in low-frequency applications, and realizes the miniaturization and integration design of the antenna while meeting the dual-frequency requirements of the microwave wireless energy transmission system.

[0007] In order to achieve the above purpose, the present application provides a dual-frequency composite packaged antenna for microwave wireless energy transmission, which comprises, from top to bottom, a high-frequency radiation array, a low-frequency radiation array, a feed network and a packaging cavity. The high-frequency radiation array comprises four first patches for receiving a feed signal, and the four first patches are arranged in a 2x2 matrix form. The low-frequency radiation array includes: a second patch for receiving a feed signal, and four top corners of the second patch are provided with grooves; and four parasitic patches are respectively located at the grooves of the four top corners of the second patch and are not in contact with the second patch, and interact with the second patch through electromagnetic coupling. The four parasitic patches are respectively located below the four first patches, feed the first patches, and feed the second patch through adjacent coupling, so that the high-frequency radiation array and the low-frequency radiation array share a set of feed networks. The packaging cavity is located at the bottom of the dual-frequency composite packaging antenna and is connected with the feed network, and a sealed space is formed between the packaging cavity and the feed network.

[0008] Optionally, the four first patches are rectangular patches of the same size, arranged in a 2x2 matrix, and the distance between adjacent first patches in the row direction and the column direction is equal; the second patch is a rectangular patch, and the grooves at the four top corners of the second patch are rectangular grooves of the same size; and the four parasitic patches are rectangular patches of the same size.

[0009] Optionally, the length of each of the four first patches is 0.32 , and the width is 0.31 ; in the row direction and the column direction, the distance between adjacent first patches is 0.78 ; wherein, is the high-frequency wavelength; the length of the second patch is 0.32 , and the width is 0.31 ; the length of the rectangular groove is 0.05 , and the width is 0.02 ; and the length and width of each of the four parasitic patches are 0.1 ; wherein, is the low-frequency wavelength; the edge of each parasitic patch is spaced apart from the edge of the second patch at each top corner groove by 0.2mm.

[0010] Optionally, the antenna further includes a first dielectric substrate, and the four first patches are arranged on the first dielectric substrate; the antenna further includes a second dielectric substrate, and the second patch and the parasitic patch are arranged on the second dielectric substrate; and the second dielectric substrate is located below the first dielectric substrate.

[0011] Optionally, the feeding network adopts a substrate integrated coaxial line design, sequentially comprising an upper metal layer, a first dielectric substrate, an intermediate feeding line, a second dielectric substrate, and a lower metal layer from top to bottom; a plurality of metal vias are arranged around the intermediate feeding line, and the plurality of metal vias are densely arranged around the intermediate feeding line and penetrate from the upper metal layer to the lower metal layer.

[0012] Optionally, the intermediate feeding line has four output ports, which are respectively located below the four parasitic patches; four slots are arranged in the upper metal layer, and the four slots are respectively located below the four parasitic patches.

[0013] Optionally, the four parasitic patches are respectively located directly below the four first patches; the four slots are respectively located directly below the four parasitic patches.

[0014] Optionally, an open-circuit stub is arranged at each output port, and impedance matching is performed through the open-circuit stub.

[0015] Optionally, solder balls are arranged between the two second dielectric substrates, and the upper part and the lower part of the intermediate feeding line are vertically interconnected through the solder balls to realize signal transmission.

[0016] Optionally, the dielectric constant of the first dielectric substrate and the second dielectric substrate is 2.2; the dielectric constant of the third dielectric substrate is 2.6; the second dielectric substrate and the first dielectric substrate are bonded through a prepreg, and the dielectric constant of the prepreg is 2.6.

[0017] The application provides a dual-frequency composite packaging antenna for microwave wireless energy transmission, which realizes co-aperture compounding of a high-frequency 2x2 subarray and a low-frequency subarray in a lower frequency band by stacking a high-frequency radiation array and a low-frequency radiation array, ensures that the aperture of the dual-frequency antenna subarray is not too large, and ensures the array performance of the subarray; the low-frequency band antenna is coupled and fed through parasitic patches below the high-frequency band antenna, and two frequency bands share a set of feeding networks, so that the complexity of the dual-frequency composite antenna feeding network is reduced; secondly, the dual-frequency composite packaging antenna is realized by means of a feeding network capable of suppressing back radiation and isolating active circuits from a packaging cavity. The application has the advantages of small aperture, high integration, and simple feeding. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a schematic diagram of the dual-frequency composite packaging antenna of the application; Figure 2 FIG. 2 is a three-dimensional structure schematic diagram of the dual-frequency composite packaging antenna of the application; Figure 3 FIG. 3 is a structure schematic diagram of the high-frequency radiation array of the dual-frequency composite packaging antenna of the application; Figure 4 This is a schematic diagram of the low-frequency radiating array of the dual-frequency composite packaged antenna of the present invention; Figure 5 This is a schematic diagram of the feeding network of the dual-frequency composite packaged antenna of the present invention; Figure 6 This is a simplified cross-sectional view of the dual-frequency composite packaged antenna of the present invention; Figure 7 The simulation results of the return loss of the dual-frequency composite packaged antenna of the present invention are shown in the figure. Figure 8 This is a simulation result of the low-frequency radiation pattern of the dual-frequency composite packaged antenna of the present invention; Figure 9 This is a simulation result of the high-frequency radiation pattern of the dual-frequency composite packaged antenna of the present invention. Detailed Implementation

[0019] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, further illustrates the dual-frequency composite packaged antenna for microwave wireless power transmission proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, intended only to facilitate and clearly illustrate the embodiments of this invention. Please refer to the drawings for a clearer understanding of the objectives, features, and advantages of this invention. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes and to enable those skilled in the art to understand and read the content disclosed in the specification. They are not intended to limit the implementation conditions of this invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.

[0020] This invention provides a dual-frequency composite packaged antenna for microwave wireless power transmission, such as... Figures 1-2 As shown, the dual-frequency composite packaged antenna includes: a high-frequency radiating array 1, a low-frequency radiating array 2, a feed network 3, and a packaged cavity 4.

[0021] The high-frequency radiating array 1 is located at the top of the antenna, the low-frequency radiating array 2 is located below the high-frequency radiating array 1, the feed network 3 is located below the low-frequency radiating array 2, and the encapsulation cavity 4 is located below the feed network 3 and at the bottom of the antenna.

[0022] like Figure 3 As shown, the high-frequency radiation array 1 adopts a 2×2 subarray structure.

[0023] Specifically, the high-frequency radiation array 1 comprises four first patches 101 for receiving a feeding signal. The four first patches 101 are rectangular patches and have the same size. The four first patches 101 are arranged in a 2x2 matrix, and the distance between two adjacent first patches 101 in the row direction and the column direction is equal. In a preferred embodiment of the present application, the length of the four first patches 101 is 0.32 , the width is 0.31 , and the distance between two adjacent first patches 101 in the same row direction and the same column direction is 0.78 , where λ is the high-frequency wavelength, which is determined by the working frequency of the high-frequency radiation array 1. In other embodiments, the length, width and distance between two adjacent first patches 101 can be other values.

[0024] Further, the antenna further comprises a first dielectric substrate 102, and the four first patches 101 are arranged on the first dielectric substrate 102 and are arranged in two rows and two columns aligned along the length direction and the width direction of the first dielectric substrate 102. The first dielectric substrate 102 adopts Rogers 5880 high-frequency board, and the dielectric constant .

[0025] As shown in FIG. 1, the low-frequency radiation array 2 adopts a unit form. Figure 4

[0026] Specifically, the low-frequency radiation array 2 comprises one second patch 201 for receiving a feeding signal and four parasitic patches 202 for interacting with the second patch 201 through electromagnetic coupling. The second patch 201 is a rectangular patch, and rectangular recesses are formed at the four corners of the second patch 201, and the four recesses have the same size. The four parasitic patches 202 are rectangular patches and have the same size, and are respectively arranged at the recesses at the four corners of the second patch 201. In the preferred embodiment, the length of the second patch 201 is 0.32 , the width is 0.31 , rectangular recesses with a length of 0.05 , and a width of 0.02 are formed at the four corners of the second patch 201, and the length and width of the four parasitic patches 202 are both 0.1 . Wherein, ​​For low frequency wavelength, the operating frequency of the low frequency radiation array 2 determines. Four of the parasitic patches 202 are respectively located at four top corner recesses of the second patch 201, and are spaced apart from the second patch 201 by 0.2mm, the spacing refers to the shortest straight line distance between the metal edge of each parasitic patch 202 and the metal edge of the second patch 201 at each top corner recess.

[0027] Further, the antenna further comprises a second dielectric substrate 203, the second patch 201 and the parasitic patch 202 are arranged on the second dielectric substrate 203, the second dielectric substrate 203 adopts Rogers 5880 high frequency board, and the dielectric constant thereof is 2.2. .

[0028] Further, the second dielectric substrate 203 is located below the first dielectric substrate 102, and the four parasitic patches 202 are respectively located below the four first patches 101. The four parasitic patches 202 feed the first patch 101, and simultaneously feed the second patch 201 through proximity coupling, thereby realizing that the high frequency radiation array 1 and the low frequency radiation array 2 share a set of feeding network 3. In the preferred embodiment, the four parasitic patches 202 are respectively located directly below the four first patches 101.

[0029] Further, the second dielectric substrate 203 and the first dielectric substrate 102 are bonded by pp prepreg with a dielectric constant of 2.6.

[0030] As shown in Figure 5 and Figure 6 , the feeding network 3 adopts a substrate integrated coaxial line design, and sequentially includes an upper metal layer 306, a layer of third dielectric substrate 303, a middle feeding line 305, a layer of third dielectric substrate 303, a lower metal layer 307 from top to bottom, and a plurality of metal vias 304 are further provided around the middle feeding line 305, the plurality of metal vias 304 are densely arranged around the middle feeding line 305 at a certain interval, and penetrate from the upper metal layer 306 to the lower metal layer 307. The substrate integrated coaxial line design makes the feeding network 3 have good back radiation suppression function.

[0031] Further, the third dielectric substrate 303 all adopts F4B high frequency board, and the dielectric constant thereof is 3.8. .

[0032] Further, the middle feeding line 305 has a plurality of output ports, which are respectively located below the four parasitic patches 202, and an open circuit stub 301 is respectively arranged at each output port, and impedance matching is performed through the open circuit stub 301.

[0033] Furthermore, four slots 302 are provided in the upper metal layer 306, and the four slots 302 are respectively located below the four parasitic patches 202. It can be seen that the four slots 302 are also located below the four first patches 101 of the high-frequency radiating array 1. Therefore, the high-frequency radiating array 1 is fed through the slot coupling of the feeding network 3, and the low-frequency radiating array 2 is fed through the four parasitic patches 202. The designed feeding network 3 can be applied to both high and low frequencies, thereby achieving dual-band performance of the antenna. In this preferred embodiment, the four slots 302 are respectively located directly below the four parasitic patches 202, that is, directly below the four first patches 101.

[0034] like Figure 6 As shown, the encapsulation cavity 4 is located at the bottom of the dual-frequency composite encapsulated antenna and is connected to the feed network 3. By forming a sealed space between the encapsulation cavity 4 at the bottom of the antenna and the feed network 3, good isolation between the antenna's radiating array and the active circuit is achieved.

[0035] Furthermore, solder balls 401 are disposed between the two third dielectric substrates 303, and the upper and lower portions of the intermediate feed line 305 are vertically interconnected through the solder balls 401 to realize signal transmission.

[0036] Figures 7-9 The simulation results are for the dual-frequency composite packaged antenna for microwave wireless power transmission proposed in this invention. Figure 7 The simulation results of the return loss of the dual-frequency composite packaged antenna of the present invention are shown. The horizontal axis of the figure represents frequency, and the vertical axis represents return loss. The simulation results show that at low frequencies... f 1. Antenna return loss is less than -15dB at high frequencies. f 2. Antenna return loss is less than -20dB; Figure 8 The simulation results of the low-frequency radiation pattern are shown. The horizontal axis represents the theta angle and the vertical axis represents the gain. The simulation results show that the antenna's low-frequency gain is 5 dBi. Figure 9 The simulation results of the high-frequency radiation pattern are shown. The horizontal axis represents the theta angle, and the vertical axis represents the gain. The simulation results show that the antenna's low-frequency gain is 10.7 dBi. Figures 7-9 The simulation results demonstrate that the antenna of the present invention can achieve good performance at both high and low frequencies.

[0037] In summary, the application forms a laminated structure in the vertical direction between the high-frequency radiation array surface and the low-frequency radiation array surface, the high-frequency radiation array surface is coupled to feed through a feed network slot, the low-frequency radiation array surface is coupled to feed through the parasitic patch at the edge of the low-frequency radiation array surface, a set of feed systems is used to realize the combination of high-frequency and low-frequency, and a closed cavity is formed through the feed network and the packaging cavity to realize good isolation between the radiation array surface of the antenna and the active circuit.

[0038] It should be noted that in this document, the terms "comprising", "containing", or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles or devices that include a series of elements not only include those elements, but also include other elements not explicitly listed, or include elements inherent to such processes, methods, articles or devices. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0039] In the description of the application, it should be understood that the orientation or positional relationship indicated by the terms "center", "height", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application. In the description of the application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0040] In the description of the application, unless otherwise specified and limited, the terms "mounting", "connection", "connection", "fixing" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication between two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0041] In the present application, unless specifically stated and limited otherwise, the "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "on", "above" and "on top of" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is horizontally higher than the second feature. The "under", "below" and "underneath" of a first feature to a second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the first feature is horizontally lower than the second feature.

[0042] Although the present application has been described in detail by the foregoing preferred embodiments, it should be recognized that the foregoing description is by way of example only and that various modifications and substitutions can be made by those skilled in the art without departing from the scope of the present application. Accordingly, the scope of the present application should be limited only by the appended claims.

Claims

1. A dual-frequency composite packaged antenna for microwave wireless power transmission, characterized in that, From top to bottom, it includes: high-frequency radiating array (1), low-frequency radiating array (2), power supply network (3) and encapsulation cavity (4). The high-frequency radiation array (1) includes four first patches (101) for receiving feed signals, and the four first patches (101) are arranged in a 2×2 matrix. The low-frequency radiating array (2) includes: a second patch (201) for receiving a feed signal, wherein the four corners of the second patch (201) are provided with grooves; and four parasitic patches (202) located at the grooves at the four corners of the second patch (201) respectively, and not in contact with the second patch (201), but interacting with the second patch (201) through electromagnetic coupling. The four parasitic patches (202) are located below the four first patches (101) respectively, feeding the first patches (101) and feeding the second patches (201) through proximity coupling, so that the high-frequency radiation array (1) and the low-frequency radiation array (2) share a set of feeding network (3). The encapsulation cavity (4) is located at the bottom of the dual-frequency composite encapsulation antenna and is connected to the feed network (3), forming a sealed space between the encapsulation cavity (4) and the feed network (3).

2. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 1, characterized in that, The four first patches (101) are rectangular patches of the same size, arranged in a 2×2 matrix, and the spacing between two adjacent first patches (101) in the row and column directions is equal; The second patch (201) is a rectangular patch, and the grooves opened at the four top corners of the second patch (201) are rectangular grooves of the same size; the four parasitic patches (202) are rectangular patches of the same size.

3. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 2, characterized in that, The length of each of the four first patches (101) is 0.

32. The width of each is 0.

31. In both the row and column directions, the spacing between any two adjacent first patches (101) is 0.

78. ;in, High frequency wavelength; The length of the second patch (201) is 0.

32. The width is 0.

31. The length of the rectangular groove is 0.

05. The width is 0.02 The length and width of each of the four parasitic patches (202) are 0.1 mm. ;in, Low frequency wavelength; The distance between the edge of each of the parasitic patches (202) and the edge of the second patch (201) at each of the apical recesses is 0.2 mm.

4. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 1, characterized in that, The antenna also includes a first dielectric substrate (102), and the four first patches (101) are all arranged on the first dielectric substrate (102); The antenna further includes a second dielectric substrate (203), on which the second patch (201) and the parasitic patch (202) are both disposed; The second dielectric substrate (203) is located below the first dielectric substrate (102).

5. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 4, characterized in that, The power supply network (3) adopts a substrate integrated coaxial line design, which includes, from top to bottom, an upper metal layer (306), a third dielectric substrate (303), an intermediate feed line (305), a third dielectric substrate (303), and a lower metal layer (307). A plurality of metal vias (304) are provided around the intermediate feed line (305), and the plurality of metal vias (304) are densely arranged around the intermediate feed line (305) and extend from the upper metal layer (306) to the lower metal layer (307).

6. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 5, characterized in that, The intermediate feed line (305) has four output ports, located below the four parasitic patches (202); Four slots (302) are provided in the upper metal layer (306), and the four slots (302) are respectively located below the four parasitic patches (202).

7. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 6, characterized in that, The four parasitic patches (202) are located directly below the four first patches (101); the four slots (302) are located directly below the four parasitic patches (202).

8. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 6, characterized in that, An open-circuit stub (301) is provided at each of the output ports, and impedance matching is performed through the open-circuit stub (301).

9. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 5, characterized in that, Solder balls (401) are disposed between the two third dielectric substrates (303), and the upper and lower portions of the intermediate feed line (305) are vertically interconnected through solder balls (401) to achieve signal transmission.

10. The dual-frequency composite packaged antenna for microwave wireless power transmission as described in claim 5, characterized in that, The dielectric constant of the first dielectric substrate (102) and the second dielectric substrate (203) is 2.2; the dielectric constant of the third dielectric substrate (303) is 2.

6. The second dielectric substrate (203) and the first dielectric substrate (102) are bonded together by a prepreg, the dielectric constant of which is 2.6.

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