Display panel and display device

Abstract

The invention discloses a display panel and a display device. The display panel comprises an array substrate which comprises a first substrate; the gate driving circuit layer is arranged in the non-display area of the first substrate; the common electrode switching layer is arranged on the first substrate, is positioned on one side, close to the display area, of the gate driving circuit layer, and comprises a first lug boss and a first transparent conductive layer; a groove is formed in the top surface of the first lug boss; in the non-display area, the first lug boss comprises a metal electrode wire and a passivation layer which are stacked; in the groove, the first transparent conductive layer and the metal electrode wire are arranged at an interval; the opposed substrate includes: a second substrate; the common electrode conduction layer is arranged on the second substrate and comprises a second lug boss and a second transparent conductive layer; the first protruding part at least partially corresponds to the second protruding part, and the second transparent conductive layer is electrically connected with the first transparent conductive layer. Through the arrangement, the problems that the narrow frame design of the display panel is difficult to realize, and the conduction between the array substrate and the transparent conductive layer of the opposite substrate is poor are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] TFT-LCD (Thin Film Transistor Liquid Crystal Display) can occupy an unshakable position in the field of large, medium and small panel display, thanks to the following characteristics of TFT-LCD: ①low voltage and low power consumption; ②flat panel structure; ③passive display (no glare, no stimulation into the eye, independent control of dedicated light source, that is, adjustable product brightness); ④large amount of display information; ⑤easy to color; ⑥no electromagnetic radiation; ⑦long service life, etc. With the continuous improvement of consumer requirements, it is necessary to continuously upgrade TFT-LCD products.

[0003] In the related art, the display panel has the problems of wide frame, difficulty in realizing narrow frame design, and poor conduction of the transparent conductive layer of the array substrate and the counter substrate. SUMMARY

[0004] The present application mainly provides a display panel and a display device to solve the problems of difficulty in realizing narrow frame design and poor conduction of the transparent conductive layer of the array substrate and the counter substrate of the display panel in the related art.

[0005] To solve the above technical problems, one technical solution adopted by the present application is to provide a display panel having a display area and a non-display area, comprising: An array substrate comprising: A first substrate; A gate drive circuit layer disposed in the non-display area of the first substrate; A common electrode transfer layer disposed on the first substrate and located on the side of the gate drive circuit layer close to the display area; the common electrode transfer layer comprises a first protruding portion and a first transparent conductive layer disposed on the top surface of the first protruding portion; the top surface of the first protruding portion is provided with a groove; in the non-display area, the first protruding portion comprises a metal electrode trace and a passivation layer stacked and disposed; in the groove, the first transparent conductive layer is spaced apart from the metal electrode trace; A counter substrate comprising: A second substrate; A common electrode conduction layer disposed on the second substrate, comprising a second protruding portion and a second transparent conductive layer; A frame glue disposed between the array substrate and the counter substrate; The first protruding part at least partially corresponds to the second protruding part, and the second transparent conductive layer is electrically connected with the first transparent conductive layer.

[0006] In some embodiments, the groove is annular; or, The top surface of the first protruding part is provided with a plurality of grooves, and the plurality of grooves are spaced apart from each other; or, The top surface of the first protruding part is provided with a plurality of grooves, and the plurality of grooves are spaced apart from each other, and the plurality of grooves are annularly arranged.

[0007] In some embodiments, the top surface of the first protruding part is provided with a plurality of concentrically spaced annular grooves, and the outermost annular groove is spaced apart from the edge of the first protruding part; The outer side wall of the outermost annular groove is provided with a notch, one end of the notch is in communication with the annular groove, and the other end extends to the edge of the first protruding part.

[0008] In some embodiments, the groove is arranged in the passivation layer, and the bottom surface of the groove is spaced apart from the top surface of the metal electrode trace; Or, the groove penetrates the passivation layer and the metal electrode trace, and at the position of the groove, the passivation layer completely covers the side surface of the metal electrode trace.

[0009] In some embodiments, the common electrode adapter layer further comprises a third protruding part located in the non-display area; the third protruding part comprises the metal electrode trace and the passivation layer arranged in layers; the top surface of the third protruding part is provided with a first via hole penetrating the passivation layer and exposing part of the metal electrode trace, and the first transparent conductive layer extends into the first via hole and is in contact with the metal electrode trace for electrical connection.

[0010] In some embodiments, the second protruding part is at least partially arranged in the display area of the second substrate; The common electrode adapter layer further comprises a fourth protruding part located in the display area and an auxiliary conductive layer arranged on the top surface of the fourth protruding part; the top surface of the fourth protruding part is provided with the groove; the fourth protruding part comprises an insulating layer and the passivation layer arranged in layers; the display area of the first substrate is further provided with the metal electrode trace, and the metal electrode trace is spaced apart from the fourth protruding part; The auxiliary conductive layer is electrically connected with the metal electrode trace of the display area, and the auxiliary conductive layer on the top surface of the fourth protruding part is electrically connected with the second transparent conductive layer.

[0011] In some embodiments, the fourth protruding part further comprises a first virtual metal layer, which is arranged between the first substrate and the insulating layer and corresponds to a position where the fourth protruding part is not provided with the groove; the auxiliary conductive layer is arranged in isolation from the first virtual metal layer; And / or, the fourth protruding part further comprises a second virtual metal layer, which is arranged between the insulating layer and the passivation layer and corresponds to a position where the fourth protruding part is not provided with the groove; the second virtual metal layer is arranged in the same layer as the metal electrode trace and is in isolation from each other; the auxiliary conductive layer is arranged in isolation from the second virtual metal layer; And / or, the first protruding part further comprises the first virtual metal layer and the insulating layer, the insulating layer is arranged between the first substrate and the metal electrode trace, the first virtual metal layer is arranged between the first substrate and the insulating layer and is in isolation from the metal electrode trace; the first virtual metal layer corresponds to a position where the first protruding part is not provided with the groove; the first transparent conductive layer is arranged in isolation from the first virtual metal layer.

[0012] In some embodiments, the top surface of the first protruding part is further provided with a second via hole, which is arranged in isolation from the groove; the second via hole penetrates the passivation layer and exposes part of the metal electrode trace, and the first transparent conductive layer extends into the second via hole and is in electrical contact with the metal electrode trace; And / or, the second protruding part comprises a red color resist layer, a green color resist layer and a blue color resist layer arranged in sequence on the surface of the second substrate; or the second protruding part comprises a black matrix layer, a red color resist layer, a green color resist layer and a blue color resist layer arranged in sequence on the surface of the second substrate; wherein the size of the red color resist layer is greater than the size of the blue color resist layer, and the size of the blue color resist layer is greater than the size of the green color resist layer; And / or, the second substrate is provided with the second protruding part at a position corresponding to the frame glue position.

[0013] In some embodiments, the second protruding part is provided with a through hole, which penetrates the second protruding part along the thickness direction of the display panel; The second transparent conductive layer comprises a first conductive part and a second conductive part; the first conductive part is arranged on the surface of the second substrate close to the second protruding part; the second conductive part is arranged on the surface of the second protruding part close to the array substrate and is in electrical contact with the first transparent conductive layer; the through hole is provided with a connecting piece, one end of the connecting piece is in electrical contact with the first conductive part, and the other end is in electrical contact with the second conductive part; Or, the second transparent conductive layer is arranged on the surface of the second substrate close to the second protruding portion; the common electrode conduction layer further comprises a conduction metal layer arranged on the surface of the second protruding portion close to the array substrate and in contact with the first transparent conductive layer; the through hole is provided with a connecting piece, one end of the connecting piece is in contact with the second transparent conductive layer, and the other end is in contact with the conduction metal layer; Or, the second protruding portion comprises a plurality of sub-protruding portions, and the plurality of sub-protruding portions are arranged in close proximity; the second transparent conductive layer is arranged on the surface of the plurality of sub-protruding portions close to the array substrate and in contact with the first transparent conductive layer; the second transparent conductive layers on the surfaces of the two adjacent sub-protruding portions are in contact with each other.

[0014] To solve the above technical problems, another technical solution adopted by the present application is to provide a display device comprising: The display panel of any one of the above; The backlight module is arranged on one side of the display panel and is used to provide backlight for the display panel.

[0015] The present application has the following beneficial effects: Different from the prior art, the present application discloses a display panel and a display device. The display panel has a display area and a non-display area, and comprises: an array substrate comprising: a first substrate; a gate drive circuit layer arranged on the non-display area of the first substrate; a common electrode adapter layer arranged on the first substrate and located on the side of the gate drive circuit layer close to the display area; the common electrode adapter layer comprises a first protruding portion and a first transparent conductive layer arranged on the top surface of the first protruding portion; the top surface of the first protruding portion is provided with a groove; in the non-display area, the first protruding portion comprises a metal electrode trace and a passivation layer arranged in layers; in the groove, the first transparent conductive layer is arranged in a spaced manner with the metal electrode trace; a counter substrate comprising: a second substrate; a common electrode conduction layer arranged on the second substrate and comprising a second protruding portion and a second transparent conductive layer; a frame glue arranged between the array substrate and the counter substrate; wherein the first protruding portion is arranged at least partially corresponding to the second protruding portion, and the second transparent conductive layer is electrically connected with the first transparent conductive layer.

[0016] By providing a common electrode transition layer on the first substrate near the display area of ​​the gate driving circuit layer, and providing a second protrusion and a second transparent conductive layer on the second substrate of the mounting substrate, the first transparent conductive layer on the top surface of the first protrusion of the common electrode transition layer is electrically connected to the second transparent conductive layer of the mounting substrate. This effectively increases the conduction area of ​​the array substrate and the mounting substrate, resulting in better conduction and stronger electrical connection stability between the two. Simultaneously, by providing a groove on the top surface of the first protrusion, the groove can collect liquid that spreads into the non-display area during the alignment film coating process. This effectively prevents the alignment film from spreading into the non-display area and covering the first transparent conductive layer on the top surface of the first protrusion, thus affecting the conduction of the first and second transparent conductive layers. The second transparent conductive layer cannot be effectively electrically connected due to the presence of the alignment film. Furthermore, within the groove, the first transparent conductive layer and the metal electrode traces are spaced apart. At the groove location, moisture is less likely to contact the metal electrode traces and cause an electrochemical reaction, effectively preventing corrosion of the metal electrode traces. Compared to placing gold balls within the frame adhesive or using a gold ball dotting method, eliminating the use of gold balls saves material costs, simplifies the process, and improves manufacturing efficiency. Moreover, without gold balls within the frame adhesive, the coating of the frame adhesive does not affect the normal function of the gate driving circuit layer. The common electrode transition layer is located on the side of the gate driving circuit layer closer to the display area, and the electrical connection between the first and second transparent conductive layers is also located on the side of the gate driving circuit layer closer to the display area, which is more conducive to reducing the width of the display panel bezel. Through the above configuration, the problems of achieving a narrow bezel design in display panels and poor conductivity between the transparent conductive layers of the array substrate and the counter substrate in related technologies are effectively solved. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a top view of an embodiment of the display panel provided in the first embodiment of this application; Figure 2 yes Figure 1 A cross-sectional schematic diagram of an embodiment of the provided display panel (A1-A2); Figure 3 yes Figure 1 A cross-sectional schematic diagram of another embodiment of the provided display panel, A1-A2; Figure 4 yes Figure 1A top view structural schematic diagram of the first protruding part of the display panel according to the first embodiment is provided. Figure 5 is Figure 4 A cross-sectional schematic diagram of the first protruding part according to the B1-B2 embodiment is provided. Figure 6 is Figure 1 A top view structural schematic diagram of the first protruding part of the display panel according to the second embodiment is provided. Figure 7 is Figure 6 A cross-sectional schematic diagram of the first protruding part according to the B1-B2 embodiment is provided. Figure 8 is Figure 1 A top view structural schematic diagram of the first protruding part of the display panel according to the third embodiment is provided. Figure 9 is Figure 8 A cross-sectional schematic diagram of the first protruding part according to the B1-B2 embodiment is provided. Figure 10 is Figure 1 A top view structural schematic diagram of the first protruding part of the display panel according to the fourth embodiment is provided. Figure 11 is Figure 10 A cross-sectional schematic diagram of the first protruding part according to the B1-B2 embodiment is provided. Figure 12 is Figure 1 A cross-sectional schematic diagram of the third protruding part and the first transparent conductive layer according to the first embodiment of the display panel is provided. Figure 13 is Figure 1 A cross-sectional schematic diagram of the third protruding part and the first transparent conductive layer according to the second embodiment of the display panel is provided. Figure 14 is Figure 1 A top view structural schematic diagram of the fourth protruding part, the auxiliary conductive layer and the pixel unit according to the first embodiment of the display panel is provided. Figure 15 is Figure 14 A local enlarged schematic diagram of the middle region C is provided. Figure 16 is Figure 15 A cross-sectional schematic diagram of the position of the fourth protruding part according to the first embodiment of the display panel is provided. Figure 17 is Figure 15 A cross-sectional schematic diagram of the position of the fourth protruding part according to the second embodiment of the display panel is provided. Figure 18 is Figure 1 A top view structural schematic diagram of the fourth protruding part according to the first embodiment of the display panel is provided. Figure 19is Figure 1 A top view structural schematic diagram of a fourth protruding part of the display panel provided in another embodiment; Figure 20 is Figure 1 A structure schematic diagram of an electrical connection mode between the first transparent conductive layer and the second transparent conductive layer of the display panel provided; Figure 21 is Figure 1 A structure schematic diagram of another electrical connection mode between the first transparent conductive layer and the second transparent conductive layer of the display panel provided; Figure 22 is Figure 1 A structure schematic diagram of still another electrical connection mode between the first transparent conductive layer and the second transparent conductive layer of the display panel provided; Figure 23 A structure schematic diagram of an embodiment of the display device provided in the second embodiment.

[0018] Reference signs: 300, display device; 200, backlight module; 100, display panel; 1, array substrate; 11, first substrate; 12, gate drive circuit layer; 13, common electrode transfer layer; 2, first protruding part; 21, first virtual metal layer; 22, insulating layer; 23, metal electrode trace; 24, passivation layer; 25, groove; 26, second via hole; 27, notch; 3, third protruding part; 31, first via hole; 4, fourth protruding part; 41, second virtual metal layer; 42, auxiliary conductive layer; 5, first transparent conductive layer; 6, counter substrate; 61, second substrate; 62, common electrode conduction layer; 7, second protruding part; 71, black matrix layer; 72, red color resist layer; 73, green color resist layer; 74, blue color resist layer; 75, sub-protruding part; 8, second transparent conductive layer; 81, first conductive part; 82, second conductive part; 83, through hole; 84, conduction metal layer; 85, connecting piece; 9, frame glue; 10, circuit board; 101, pixel unit; 102, gate; 103, source; 104, drain; 105, pixel electrode; X, display area; F, non-display area; B, bonding area; L1, first direction; L2, second direction. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] The terms "first", "second", "third", etc. in the embodiments of the present application are used only for descriptive purposes and should not be construed as indicating or implying relative importance or a specific number of the technical features indicated. Thus, the features defined with "first", "second", "third" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed or can optionally include other steps or units inherent to the process, method, product or device.

[0021] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor is it necessarily mutually exclusive of other embodiments. It is expressly understood that the embodiments described herein can be combined with other embodiments.

[0022] Reference is made to Figures 1 to 19 , Figure 1 is a schematic top view of an embodiment of a display panel provided by the first embodiment of the present application, Figure 2 is Figure 1 a schematic cross-sectional view of an A1-A2 embodiment of a display panel provided by the first embodiment of the present application, Figure 3 is Figure 1 a schematic cross-sectional view of another A1-A2 embodiment of a display panel provided by the first embodiment of the present application, Figure 4 is Figure 1 a schematic top view of a first protruding portion of a display panel provided by the first embodiment of the present application, Figure 5 is Figure 4 a schematic cross-sectional view of a B1-B2 embodiment of a first protruding portion provided by the first embodiment of the present application, Figure 6 is Figure 1 a schematic top view of a second protruding portion of a display panel provided by the first embodiment of the present application, Figure 7 is Figure 6 a schematic cross-sectional view of a B1-B2 embodiment of a first protruding portion provided by the first embodiment of the present application, Figure 8 is Figure 1 a schematic top view of a third protruding portion of a display panel provided by the first embodiment of the present application, Figure 9 is Figure 8 a schematic cross-sectional view of a B1-B2 embodiment of a first protruding portion provided by the first embodiment of the present application, Figure 10 is Figure 1A top view of the first protrusion of the provided display panel in a fourth embodiment. Figure 11 yes Figure 10 A cross-sectional schematic diagram of one embodiment of the first protrusion B1-B2 is provided. Figure 12 yes Figure 1 A cross-sectional schematic diagram of the third protrusion and the first transparent conductive layer of the provided display panel according to one embodiment. Figure 13 yes Figure 1 A cross-sectional schematic diagram of the third protrusion of the provided display panel and the first transparent conductive layer in another embodiment. Figure 14 yes Figure 1 A top view schematic diagram of one embodiment of the provided display panel, including the fourth protrusion, auxiliary conductive layer, and pixel unit. Figure 15 yes Figure 14 A magnified view of a portion of region C in the middle. Figure 16 yes Figure 15 A cross-sectional schematic diagram of one embodiment of the location of the fourth protrusion of the provided display panel. Figure 17 yes Figure 15 A cross-sectional schematic diagram of another embodiment of the location of the fourth protrusion of the provided display panel. Figure 18 yes Figure 1 A top view of one embodiment of the fourth protrusion of the provided display panel. Figure 19 yes Figure 1 A top view of another embodiment of the fourth protrusion of the provided display panel.

[0023] In related technologies, gold balls (Au) are typically placed in the frame adhesive of the non-display area of ​​the display panel, or gold balls are used to mark the common electrode trace layer of the array substrate to conduct the VCOM voltage of the array substrate to the counter substrate.

[0024] However, when using gold balls within the frame adhesive to achieve conductivity between the first transparent conductive layer of the array substrate and the second transparent conductive layer of the opposing substrate, the common electrode trace layer needs to be designed with a certain width to maintain the conductivity of the gold balls. This can easily lead to difficulty in narrowing the bezel width of the non-display area outside the display area, resulting in a wider bezel for the display panel and making it difficult to achieve a narrow bezel design. When using gold ball dotting, the size of the gold ball dots will be relatively large; specifically, the gold balls are generally spherical structures with a diameter of about 750um. This will still result in a relatively wide bezel width in the non-display area outside the display area, which is not conducive to narrow bezel design.

[0025] Based on this, this application provides a new display panel 100.

[0026] See Figures 1 to 19The first embodiment of this application provides a display panel 100, which has a display area X and a non-display area F. The display panel 100 includes an array substrate 1 and a counter substrate 6 disposed opposite to each other, and a frame adhesive 9 connecting the array substrate 1 and the counter substrate 6.

[0027] Specifically, the array substrate 1 includes a first substrate 11, a gate driving circuit layer 12, and a common electrode transition layer 13. The gate driving circuit layer 12 is disposed in the non-display area F of the first substrate 11. Specifically, the gate driving circuit layer 12 can be a GDL circuit layer. The gate driving circuit layer 12 is used for electrical connection with the gate scan lines in the display area X, and the gate scan signal is transmitted to the gate scan lines in the display area X through the gate driving circuit layer 12. See [link to details]. Figure 1 In some embodiments, two gate driving circuit layers 12 are provided along the first direction L1, and the two gate driving circuit layers 12 are respectively disposed on opposite sides of the display area X along the first direction L1. In some embodiments, the frame adhesive 9 overlaps with the gate driving circuit layers 12 at least partially, which can further reduce the bezel of the display panel 100.

[0028] Specifically, in the second direction L2, the display panel 100 includes a bonding area B disposed on one side of the display area X, such as... Figure 1 As shown, in one embodiment, in the second direction L2, the size of the array substrate 1 is larger than the size of the counter substrate 6, and one side of the array substrate 1 protrudes from the counter substrate 6 to form a bonding area B, which is used to bond other components such as the circuit board 10. The first direction L1 and the second direction L2 intersect. In one specific embodiment, the display panel 100 is rectangular, and the first direction L1 and the second direction L2 are perpendicular to each other. The first direction L1 can be the width direction (left-right viewing direction) of the display panel 100, and the second direction L2 can be the height direction (up-down viewing direction) of the display panel 100.

[0029] A common electrode transition layer 13 is disposed on the first substrate 11 and located on the side of the gate drive circuit layer 12 near the display area X. In one specific embodiment, as shown... Figure 1 As shown, the first substrate 11 is rectangular, and the common electrode transition layer 13 is partially disposed on the side of the two gate driving circuit layers 12 near the display area X, and partially disposed on the side of the display area X away from the bonding area B. The common electrode transition layer 13 is spaced apart from the gate driving circuit layers 12, and the common electrode transition layer 13 is located on the side of the frame adhesive 9 near the display area X.

[0030] The common electrode transition layer 13 includes a first protrusion 2 and a first transparent conductive layer 5 disposed on the top surface of the first protrusion 2. Specifically, the material of the first transparent conductive layer 5 includes indium tin oxide (ITO).

[0031] In some embodiments, the first protrusion 2 is disposed within the non-display area F. In some embodiments, within the non-display area F, the first protrusion 2 includes stacked metal electrode traces 23 and a passivation layer 24. Specifically, a groove 25 is provided on the top surface of the first protrusion 2. Within the groove 25, the first transparent conductive layer 5 is spaced apart from the metal electrode traces 23. That is, at the location of the groove 25, the passivation layer 24 completely covers the metal electrode traces 23, and the metal electrode traces 23 are not exposed through the groove 25. The metal electrode traces 23 and the first transparent conductive layer 5 do not contact each other at the location of the groove 25 of the first protrusion 2. It should be noted that, in the embodiments of this application, the first transparent conductive layer 5 and the metal electrode traces 23 do not contact each other only at the location of the groove 25 of the first protrusion 2, but the first transparent conductive layer 5 and the metal electrode traces 23 are electrically connected themselves. The contact electrical connection location between the first transparent conductive layer 5 and the metal electrode traces 23 is not within the groove 25.

[0032] The substrate 6 includes a second substrate 61 and a common electrode conductive layer 62. The common electrode conductive layer 62 is disposed on the second substrate 61. Specifically, the common electrode conductive layer 62 includes a second protrusion 7 and a second transparent conductive layer 8. Specifically, the material of the second transparent conductive layer 8 includes indium tin oxide (ITO). In some embodiments, the first protrusion 2 is at least partially disposed corresponding to the second protrusion 7, and the second transparent conductive layer 8 is electrically connected to the first transparent conductive layer 5.

[0033] It is understood that in this embodiment, by providing a common electrode transition layer 13 on the first substrate 11 located on the side of the gate driving circuit layer 12 near the display area X, and providing a second protrusion 7 and a second transparent conductive layer 8 on the second substrate 61 of the supporting substrate 6, the first transparent conductive layer 5 on the top surface of the first protrusion 2 of the common electrode transition layer 13 is electrically connected to the second transparent conductive layer 8 of the supporting substrate 6, effectively increasing the conduction area of ​​the array substrate 1 and the supporting substrate 6, resulting in better conduction of the array substrate 1 and the supporting substrate 6, and stronger electrical connection stability between the two; at the same time, by providing a common electrode transition layer 13 on the first protrusion 2 of the common electrode transition layer 13 near the display area X, and providing a second protrusion 7 and a second transparent conductive layer 8 on the second substrate 61 of the supporting substrate 6, the conduction area of ​​the array substrate 1 and the supporting substrate 6 is increased, resulting in better conduction of the array substrate 1 and the supporting substrate 6, and stronger electrical connection stability between the two; at the same time, by providing a common electrode transition layer 13 on the first protrusion 2 of the common electrode transition layer 13 near the display area X, and providing a common electrode transition layer 13 on the first substrate 11 located on the side of the gate driving circuit layer 12 near the display area X, and providing a second protrusion 7 and a second transparent conductive layer 8 on the second substrate 61 of the supporting substrate 6, the conduction area of ​​the array substrate 1 and the supporting substrate 6 is increased, resulting in better conduction of the array substrate 1 and the supporting substrate 6, and stronger electrical connection stability between the two; at the same time, by providing a common electrode transition layer 13 on the first protrusion 2 of the common electrode transition layer 13, the conduction area of ​​the array substrate 1 and the supporting substrate 6 is increased, resulting in better conduction of the array substrate 1 and the supporting substrate 6, and stronger electrical connection stability between the two A groove 25 is provided on the top surface of the first protrusion 2. The groove 25 can be used to collect liquid that spreads into the non-display area F during the coating process of the alignment film (not shown). This effectively prevents the alignment film from spreading into the non-display area F and covering the first transparent conductive layer 5 on the top surface of the first protrusion 2, thus affecting the conductivity of the first transparent conductive layer 5 and the second transparent conductive layer 8. By providing the groove 25 for collecting the alignment film, the alignment film that spreads into the non-display area F can flow into the groove 25, avoiding the problem that the first transparent conductive layer 5 and the second transparent conductive layer 8 cannot be effectively electrically connected due to the presence of the alignment film. Moreover, the first transparent conductive layer 5 and the metal electrode trace 23 are spaced apart in the groove 25. At the location of the groove 25, water vapor is not easily in contact with the metal electrode trace 23 and undergoes an electrochemical reaction, which can effectively prevent the metal electrode trace 23 from being corroded. Meanwhile, compared to setting gold balls within the frame adhesive 9 or using a gold ball dotting method, eliminating the use of gold balls saves material costs, simplifies the process, and improves manufacturing efficiency. Furthermore, without gold balls within the frame adhesive 9, the coating of the frame adhesive 9 does not affect the normal function of the gate driving circuit layer 12. The common electrode transition layer 13 is located on the side of the gate driving circuit layer 12 closest to the display area X, and the electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8 is also located on the side of the gate driving circuit layer 12 closest to the display area X. This eliminates the need to set common electrode traces (VCOM traces) on the side of the gate driving circuit layer 12 away from the display area X, which is more conducive to reducing the width of the bezel of the display panel 100 and reduces the risk of electrochemical corrosion of the common electrode traces under high temperature and high humidity conditions caused by setting common electrode traces on the side of the gate driving circuit layer 12 away from the display area X. Through the above settings, the problems of difficulty in achieving a narrow bezel design in the display panel 100 and poor conductivity between the transparent conductive layers of the array substrate 1 and the counter substrate 6 in related technologies are effectively solved.

[0034] In some embodiments, the electrical connection between the first transparent conductive layer 5 of the array substrate 1 and the second transparent conductive layer 8 of the opposing substrate 6 is located only at the location of the first protrusion 2, that is, the electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8 is located in the non-display area F. Specifically, in some embodiments, the metal electrode trace 23 of the first protrusion 2 is an ACOM trace disposed in the non-display area F, and the metal electrode trace 23 is located on the side of the gate drive circuit layer 12 near the display area X, and the metal electrode trace 23 is located in the second metal layer. That is, the first transparent conductive layer 5 is electrically connected to the ACOM trace on the side of the gate drive circuit layer 12 in the non-display area F near the display area X, and then the electrical signal of the ACOM trace is transmitted to the second transparent conductive layer 8 through the electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8. In other embodiments, the electrical connection between the first transparent conductive layer 5 of the array substrate 1 and the second transparent conductive layer 8 of the opposing substrate 6 can also be located in the display area X, which can be designed as needed.

[0035] In this embodiment, at the groove 25 position on the top surface of the first protrusion 2, the first transparent conductive layer 5 and the metal electrode trace 23 are spaced apart. The first transparent conductive layer 5 and the metal electrode trace 23 do not make contact or electrical connection at the groove 25 position. The groove 25 is not a transition hole for realizing electrical connection between the first transparent conductive layer 5 and the metal electrode trace 23.

[0036] Specifically, in some embodiments, the first protrusion 2 includes metal electrode traces 23 and a passivation layer 24 sequentially stacked on the surface of the first substrate 11, with the passivation layer 24 covering the metal electrode traces 23. In one specific embodiment, such as Figure 2 As shown, the first protrusion 2 also includes an insulating layer 22, which is disposed between the metal electrode trace 23 and the first substrate 11, and the metal electrode trace 23 covers the insulating layer 22. By providing the insulating layer 22, the thickness of the first protrusion 2 can be further increased, making it easier to achieve the alignment of the first protrusion 2 and the second protrusion 7, and making it easier to achieve the electrical connection between the first transparent conductive layer 5 on the top surface of the first protrusion 2 and the second transparent conductive layer 8 at the position of the second protrusion 7. This facilitates the improvement of the stability and reliability of the electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8, and increases the conduction area.

[0037] In some implementations, such as Figure 2As shown, the groove 25 can be disposed within the passivation layer 24, with the bottom surface of the groove 25 spaced apart from the top surface of the metal electrode trace 23. That is, the groove 25 does not penetrate the passivation layer 24, so that the first transparent conductive layer 5 extends into the groove 25 without contacting the metal electrode trace 23. Therefore, at the location of the groove 25, the metal electrode trace 23 is not exposed through the groove 25, and the first transparent conductive layer 5 does not contact the metal electrode trace 23 at the location of the groove 25. Even if moisture enters the display panel 100, it will not contact the metal electrode trace 23 at the location of the groove 25 and react. The metal electrode trace 23 is not easily corroded, which is beneficial to improving the display performance of the display panel 100.

[0038] In other implementations, such as Figure 3 As shown, the groove 25 penetrates both the passivation layer 24 and the metal electrode trace 23, and at the location of the groove 25, the passivation layer 24 completely covers the side of the metal electrode trace 23. That is, the groove 25 can simultaneously penetrate both the passivation layer 24 and the metal electrode trace 23. The bottom surface of the groove 25 can be the top surface of the insulating layer 22. At the location of the groove 25, the passivation layer 24 completely encloses the metal electrode trace 23, and the groove 25 does not expose the metal electrode trace 23. Because the passivation layer 24 completely encloses the metal electrode trace 23, the first transparent conductive layer 5 extending into the groove 25 will not contact the metal electrode trace 23, thus preventing the groove 25 from exposing the metal electrode trace 23 and causing it to be corroded by moisture.

[0039] In other embodiments, the groove 25 may also penetrate the passivation layer 24, the metal electrode trace 23 and the insulating layer 22 at the same time. However, at the location of the groove 25, the passivation layer 24 still completely covers the metal electrode trace 23. With this arrangement, the volume of the groove 25 can be larger, and more alignment films can be accommodated.

[0040] In some implementations, see Figures 2 to 11 The groove 25 on the top surface of the first protrusion 2 can be annular. It is understood that the annular structure helps increase the volume of the groove 25, allowing it to hold more alignment film and preventing it from overflowing. It also facilitates the flow of alignment film within the annular groove 25, preventing excessive alignment film overflow in localized areas. Simultaneously, the alignment film extending to the first protrusion 2 can be effectively collected at multiple locations along the extension direction of the annular groove 25, thus more effectively preventing the alignment film from covering the first transparent conductive layer 5 on the top surface of the first protrusion 2 and affecting the conductivity between the first transparent conductive layer 5 and the second transparent conductive layer 8.

[0041] Specifically, when the groove 25 is annular, it can be any regular or irregular ring, such as a rectangular ring, circular ring, rhomboid ring, elliptical ring, or octagonal ring. The annular structure can be a closed ring or a ring with a gap; the specific shape can be selected and designed as needed, and this application embodiment does not limit this. In other embodiments, the groove 25 may not be annular; it can be any other regular or irregular shape. For example, the cross-sectional shape of the groove 25 can be any shape, such as an inverted trapezoid, rectangle, inverted triangle, or semicircle, and the shape can be selected and designed as needed.

[0042] In some implementations, see Figures 2 to 11 The top surface of the first protrusion 2 can be provided with multiple grooves 25, which are spaced apart from each other. It can be understood that by providing multiple grooves 25 on the top surface of the first protrusion 2, each groove 25 can accommodate the alignment film, further increasing the volume of the grooves 25 on the top surface of the first protrusion 2. Furthermore, the spaced-apart arrangement of the multiple grooves 25 allows the alignment film to be accommodated at multiple different locations, improving the accommodating capacity of the grooves 25 for the alignment film. This effectively prevents the alignment film from covering the first transparent conductive layer 5 and affecting the conductivity of the first transparent conductive layer 5 and the second transparent conductive layer 8, thus avoiding the problem of poor conductivity between the first transparent conductive layer 5 and the second transparent conductive layer 8.

[0043] Specifically, the plurality of grooves 25 on the top surface of the first protrusion 2 can be spaced apart from each other along a specific direction. For example, the plurality of grooves 25 can be spaced apart from each other along the circumference of the first protrusion 2, or the plurality of grooves 25 can be spaced apart from each other along the direction from the center to the edge of the top surface of the first protrusion 2. Alternatively, the plurality of grooves 25 on the top surface of the first protrusion 2 can be randomly or irregularly distributed. When the plurality of grooves 25 are spaced apart from each other, they can be evenly spaced, or they can be unequally spaced, distributed at random intervals. The size and shape of the plurality of grooves 25 can be the same, or they can be different. Among the plurality of grooves 25, some grooves 25 can be annular, some grooves 25 can be non-annular, or all grooves 25 can be annular, or all grooves 25 can be non-annular. The size, shape, spacing and distribution of the plurality of grooves 25 can be designed as needed, and the embodiments of this application do not limit this.

[0044] In some embodiments, the top surface of the first protrusion 2 is provided with a plurality of grooves 25, which are spaced apart from each other and form a ring. That is, the plurality of grooves 25 on the top surface of the first protrusion 2 are not themselves a ring structure, but are formed by the spaced-apart grooves 25 surrounding each other to form a ring. For example, the cross-sectional shape of the grooves 25 can be any shape such as an inverted trapezoid or a triangle, and the plurality of grooves 25 can be spaced apart from each other along the circumference of the first protrusion 2, so that the plurality of grooves 25 together form a ring; or, the shape of the grooves 25 can be arc-shaped, and the plurality of grooves 25 together form a circular ring.

[0045] It is understood that multiple grooves 25 are spaced apart from each other and form a ring. The grooves 25 at multiple different positions in the extension direction of the ring can accommodate the grooves 25, avoiding the situation where some positions have concentrated grooves 25 while others do not have grooves 25. This would prevent the alignment film from being effectively collected when it spreads to the position where no grooves 25 are provided, thereby affecting the conductivity of the first transparent conductive layer 5 and the second transparent conductive layer 8.

[0046] In some implementations, see Figures 2 to 11 The top surface of the first protrusion 2 is provided with a plurality of concentric and spaced annular grooves 25, and the outermost annular grooves 25 are all spaced apart from the edge of the first protrusion 2. Specifically, the plurality of concentric and spaced annular grooves 25 extend along the circumference of the first protrusion 2, and the outer surface of the outermost annular groove 25 is at a certain distance from the edge of the first protrusion 2.

[0047] In some implementations, such as Figure 4 , Figure 5 and Figure 8 , Figure 9 As shown, the outermost annular groove 25 is a closed annular structure. The annular groove 25 does not extend directly to the edge of the first protrusion 2, and the outermost annular groove 25 is not connected to the edge of the first protrusion 2.

[0048] In other implementations, such as Figure 6 , Figure 7 and Figure 10 , Figure 11As shown, the outermost annular groove 25 has a notch 27 on its outer side wall. One end of the notch 27 communicates with the annular groove 25, and the other end extends to the edge of the first protrusion 2. That is, in this embodiment, the outermost annular groove 25 communicates with the edge of the first protrusion 2 through the notch 27 provided in its outer side wall. This is understandable. In this embodiment, by providing a notch 27 on the outer wall of the annular groove 25, the alignment film enters the annular groove 25 and flows within it. It then flows through the notch 27 to the edge of the first protrusion 2. Since there is a height difference between the position of the first protrusion 2 and the position where the first protrusion 2 is not provided, the alignment film at the edge of the first protrusion 2 will flow to the position of the first substrate 11 where the first protrusion 2 is not provided. After the alignment film flows out of the annular groove 25, it can avoid the problem that after the annular groove 25 is full of alignment film, the alignment film still covers the first transparent conductive layer 5, resulting in poor conductivity between the first transparent conductive layer 5 and the second transparent conductive layer 8. This effectively improves the conductivity between the first transparent conductive layer 5 and the second transparent conductive layer 8.

[0049] In some embodiments, when the top surface of the first protrusion 2 is provided with a plurality of mutually spaced annular grooves 25, the plurality of annular grooves 25 may not be concentrically arranged. Specifically, the plurality of annular grooves 25 may be nested together, or they may not be nested together and may be completely staggered. In this embodiment, the plurality of annular grooves 25 are all spaced apart from the edge of the first protrusion 2. The outer wall of the annular groove 25 closest to the edge of the first protrusion 2 may still be provided with a notch 27, so that the annular groove 25 closest to the edge of the first protrusion 2 can be connected to the edge of the first protrusion 2 through the notch 27, and the alignment film entering the annular groove 25 can still flow to the edge of the first protrusion 2 through the notch 27.

[0050] In some embodiments, when the top surface of the first protrusion 2 is provided with a plurality of mutually spaced annular grooves 25, a notch 27 can be provided in the common wall between two adjacent annular grooves 25, thereby connecting the two adjacent annular grooves 25 to each other. This is more conducive to extending the flow path of the alignment film after entering the annular groove 25, facilitating the accommodation of more alignment film, and more effectively solving the problem of poor conductivity between the first transparent conductive layer 5 and the second transparent conductive layer 8 caused by the alignment film covering the first transparent conductive layer 5. Specifically, in this embodiment, the plurality of annular grooves 25 can be arranged concentrically, or they can be arranged non-concentrically; the plurality of annular grooves 25 can be nested, or they can be not nested and completely staggered.

[0051] In some embodiments, the common electrode transition layer 13 further includes a third protrusion 3 located in the non-display area F. See also Figure 12 and Figure 13The third protrusion 3 includes stacked metal electrode traces 23 and a passivation layer 24. In some embodiments, the third protrusion 3 further includes an insulating layer 22 disposed between the metal electrode traces 23 and the first substrate 11. In some embodiments, a first via 31 is provided on the top surface of the third protrusion 3. The first via 31 penetrates the passivation layer 24 and exposes a portion of the metal electrode traces 23. A first transparent conductive layer 5 extends into the first via 31 and makes contact with the metal electrode traces 23 for electrical connection. That is, in this embodiment, the first transparent conductive layer 5 and the metal electrode traces 23 are made contact with each other for electrical connection within the first via 31 of the third protrusion 3. The number, shape, and size of the first vias 31 can be designed as needed. The first vias 31 can also be used to hold an alignment film, which can more effectively prevent the alignment film from covering the first transparent conductive layer 5 on the top surface of the first protrusion 2.

[0052] In some implementations, see Figure 13 Furthermore, a groove 25 can be provided on the top surface of the third protrusion 3. The groove 25 does not expose the metal electrode trace 23. Specifically, the groove 25 is spaced apart from the first via 31, and the number, shape, and size of the groove 25 can be designed as needed. By further providing a groove 25 on the top surface of the third protrusion 3, the alignment film extending to the non-display area F can be further accommodated, more effectively avoiding the problem of poor conductivity between the first transparent conductive layer 5 and the second transparent conductive layer 8. In other embodiments, the top surface of the third protrusion 3 may not have a groove 25, but only a first via 31, which can be designed as needed.

[0053] In some implementations, see Figure 3 The top surface of the first protrusion 2 may also be provided with a second via 26, which is spaced apart from the groove 25. The second via 26 penetrates the passivation layer 24 and exposes part of the metal electrode trace 23. The first transparent conductive layer 5 extends into the second via 26 and makes contact with the metal electrode trace 23 for electrical connection. That is, in this embodiment, the top surface of the first protrusion 2 may be provided with both the groove 25 and the second via 26. The groove 25 does not expose the metal electrode trace 23 and is only used to hold the alignment film; while the second via 26 is used to expose part of the metal electrode trace 23 so that the first transparent conductive layer 5 can make contact with the metal electrode trace 23 for electrical connection at the location of the second via 26, so as to realize the electrical connection between the first transparent conductive layer 5 and the metal electrode trace 23.

[0054] Specifically, the number, size, and shape of the second vias 26 on the top surface of the first protrusion 2 can be arbitrarily set as needed. The second vias 26 can also be used to hold the alignment film, which can more effectively prevent the alignment film from covering the first transparent conductive layer 5. In this embodiment, when the first transparent conductive layer 5 and the metal electrode trace 23 are electrically connected through the second vias 26 on the top surface of the first protrusion 2, the common electrode transition layer 13 may include a third protrusion 3. The top surface of the third protrusion 3 may or may not have a first via 31; or, the common electrode transition layer 13 may not include the third protrusion 3, which can be designed according to needs.

[0055] In other embodiments, the top surface of the first protrusion 2 may only have a groove 25 and no second through hole 26, and the electrical connection position between the first transparent conductive layer 5 and the metal electrode trace 23 may only be located within the first through hole 31 of the third protrusion 3.

[0056] In some implementations, see Figures 8 to 11 The first protrusion 2 further includes a first virtual metal layer 21. An insulating layer 22 is located between the first substrate 11 and the metal electrode trace 23. The first virtual metal layer 21 is located between the first substrate 11 and the insulating layer 22, and is spaced and insulated from the metal electrode trace 23. That is, the first protrusion 2 may include a first virtual metal layer 21, an insulating layer 22, a metal electrode trace 23, and a passivation layer 24 stacked sequentially. The first virtual metal layer 21 and the metal electrode trace 23 are spaced and insulated from each other by the insulating layer 22, and the first transparent conductive layer 5 is spaced and insulated from the first virtual metal layer 21.

[0057] Specifically, the first virtual metal layer 21 belongs to the first metal layer. No electrical signal is connected to the first virtual metal layer 21. The groove 25 and the second via 26 (refer to...) Figure 3 Neither of them exposes the first virtual metal layer 21. By setting the first virtual metal layer 21, the thickness of the first protrusion 2 can be further increased, making it easier to achieve the alignment of the first protrusion 2 and the second protrusion 7, thereby improving the stability and reliability of the electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8 on the top surface of the first protrusion 2.

[0058] In some implementations, see Figure 9 and Figure 11 The first virtual metal layer 21 is disposed only at the position of the first protrusion 2 where the groove 25 is not provided; that is, the first virtual metal layer 21 is misaligned with the groove 25. This arrangement increases the thickness of the first protrusion 2 while also increasing the volume of the groove 25, facilitating the accommodation of more alignment films. In other embodiments, the first virtual metal layer 21 may also be disposed across the entire insulating layer 22 of the first protrusion 2, depending on the specific design requirements.

[0059] In some embodiments, the second protrusion 7 of the substrate 6 is at least partially disposed in the display area X of the second substrate 61, see [reference]. Figures 14 to 19 The common electrode transition layer 13 also includes a fourth protrusion 4 located in the display area X and an auxiliary conductive layer 42 disposed on the top surface of the fourth protrusion 4. The auxiliary conductive layer 42 is electrically connected to the second transparent conductive layer 8 located at the second protrusion 7. That is, in this embodiment, the electrical connection position between the first transparent conductive layer 5 and the second transparent conductive layer 8 is located within the display area X. This method can further reduce the width of the bezel of the non-display area F, which is more conducive to achieving a narrow bezel design.

[0060] For details, see Figure 14 and Figure 15 The display area X contains multiple pixel units 101. A fourth protrusion 4 is disposed in a blank area within the display area X of the first substrate 11 where no pixel units 101 are disposed. The fourth protrusion 4 is spaced apart from the pixel units 101. See also Figure 14 and Figure 15 The surface of the first substrate 11 within the display area X is further provided with gate scan lines (not shown), data lines (not shown), multiple pixel electrodes 105, and multiple thin-film transistors (not shown). The thin-film transistors include a gate 102, a source 103, and a drain 104. The pixel electrodes 105 are connected to the corresponding source 103 or drain 104 of the thin-film transistor, and the gate 102 is connected to the gate scan lines. The gate scan lines extend along the row direction, and the data lines extend along the column direction. The display area X of the first substrate 11 is also provided with metal electrode traces 23, which intersect with the data lines within the display area X. In one specific embodiment, as... Figure 14 and Figure 15 As shown, the fourth protrusion 4 is disposed at intervals in the gap between the gate scan line and the pixel unit 101.

[0061] The metal electrode traces 23 and the fourth protrusion 4 are spaced apart. Specifically, the metal electrode traces 23 in the display area X and the metal electrode traces 23 in the first protrusion 2 in the non-display area F both belong to the second metal layer, and the metal electrode traces 23 in the display area X and the metal electrode traces 23 in the first protrusion 2 in the non-display area F are electrically connected.

[0062] The auxiliary conductive layer 42 is made of indium tin oxide (ITO). It is disposed on the same layer as the first transparent conductive layer 5. Specifically, the auxiliary conductive layer 42 in the display area X is electrically connected to the first transparent conductive layer 5 in the non-display area F. The auxiliary conductive layer 42 is a DBS com (Data Line Blameless Common electrode). Part of the traces in the auxiliary conductive layer 42 pass through the gate scan lines, part of the traces pass through the data lines, and part of it covers the top surface of the fourth protrusion 4. The auxiliary conductive layer 42 is electrically connected to the metal electrode traces 23 in the display area X via vias, thereby transmitting the electrical signals from the metal electrode traces 23 to the auxiliary conductive layer 42. The auxiliary conductive layer 42 on the top surface of the fourth protrusion 4 in the display area X is electrically connected to the second transparent conductive layer 8 at the corresponding position of the second protrusion 7. The auxiliary conductive layer 42 then transmits electrical signals to the second transparent conductive layer 8, further enabling communication between the array substrate 1 and the counter substrate 6. Within the display area X, the stability of the electrical signals transmitted from the auxiliary conductive layer 42 to the second transparent conductive layer 8 of the counter substrate 6 is improved. The auxiliary conductive layer 42, i.e., DBS com, can also shield the voltage on the counter substrate 6 from crosstalk to the gate scan lines and data lines, improving the performance of the display panel 100.

[0063] For details, see Figures 14 to 19 In some embodiments, the fourth protrusion 4 includes a stacked insulating layer 22 and a passivation layer 24, with the passivation layer 24 covering the insulating layer 22. That is, the fourth protrusion 4 may not include a metal layer. Since the auxiliary conductive layer 42 on the top surface of the fourth protrusion 4 is electrically connected to the metal electrode traces 23 in the display area X, and the electrical signal of the auxiliary conductive layer 42 directly originates from the metal electrode traces 23 in the display area X, it is not necessary to provide a metal layer in the fourth protrusion 4 for transmitting electrical signals to the auxiliary conductive layer 42.

[0064] In this embodiment, when a fourth protrusion 4 and an auxiliary conductive layer 42 located on the top surface of the fourth protrusion 4 are provided in the display area X, and the auxiliary conductive layer 42 is electrically connected to the second transparent conductive layer 8 at the position of the second protrusion 7 in the display area X, a first protrusion 2 can be provided in the non-display area F. Simultaneously, the first transparent conductive layer 5 on the top surface of the first protrusion 2 in the non-display area F is electrically connected to the second transparent conductive layer 8 at the position of the second protrusion 7 in the non-display area F. This allows the array substrate 1 and the opposing substrate 6 to have multiple electrical connection points, thereby increasing the conduction area of ​​the transparent conductive layers of the array substrate 1 and the opposing substrate 6, and enhancing the stability and reliability of the electrical connection. Alternatively, in other embodiments, the first protrusion 2 may not be provided in the non-display area F. Correspondingly, the second protrusion 7 may not be provided in the non-display area F, or the first transparent conductive layer 5 on the top surface of the first protrusion 2 in the non-display area F may not be electrically connected to the second transparent conductive layer 8 at the position of the second protrusion 7 in the non-display area F. This can be designed as needed.

[0065] In some embodiments, a groove 25 is provided on the top surface of the fourth protrusion 4. The groove 25 can penetrate the passivation layer 24, or simultaneously penetrate the passivation layer 24 and the insulating layer 22. It can be understood that by providing a groove 25 on the top surface of the fourth protrusion 4, the alignment film can be directly collected by the groove 25 on the top surface of the fourth protrusion 4 in the display area X. This avoids the alignment film covering the auxiliary conductive layer 42 on the top surface of the fourth protrusion 4, thus preventing it from affecting the electrical connection between the auxiliary conductive layer 42 and the second transparent conductive layer 8. This avoids the problem of poor conductivity between the auxiliary conductive layer 42 of the array substrate 1 and the second transparent conductive layer 8 of the substrate 6, and also prevents the alignment film from diffusing into the non-display area F.

[0066] For details, see Figure 18 and Figure 19 The number, shape, and specific arrangement of the grooves 25 on the top surface of the fourth protrusion 4 can be referred to the relevant description in the above description of the grooves 25 on the top surface of the first protrusion 2. For example, the grooves 25 are annular or multiple grooves 25 are arranged to form an annulus, or a notch 27 is provided, etc., which will not be described in detail here.

[0067] In some implementations, see Figure 16 and Figure 17The fourth protrusion 4 also includes a first virtual metal layer 21, which is located between the first substrate 11 and the insulating layer 22. In some embodiments, the first virtual metal layer 21 is disposed at the position of the fourth protrusion 4 where the groove 25 is not provided, and the auxiliary conductive layer 42 is spaced and insulated from the first virtual metal layer 21. That is, the groove 25 does not expose the first virtual metal layer 21. Specifically, the first virtual metal layer 21 is not connected to electrical signals; it is an isolated metal trace, belongs to the first metal layer, and is not electrically connected to the auxiliary conductive layer 42. It can be understood that by providing the first virtual metal layer 21, the thickness of the fourth protrusion 4 can be further increased, making it easier for the fourth protrusion 4 and the second protrusion 7 to align, thereby facilitating the reliable electrical connection between the auxiliary conductive layer 42 on the top surface of the fourth protrusion 4 and the second transparent conductive layer 8 at the position of the second protrusion 7. Furthermore, the first virtual metal layer 21 is only provided at the positions of the fourth protrusion 4 where the groove 25 is not provided, which can further increase the volume of the groove 25 and facilitate the accommodation of more alignment films. In other embodiments, the fourth protrusion 4 may not include the first virtual metal layer 21, and can be designed as needed.

[0068] In some implementations, see Figure 17 The fourth protrusion 4 also includes a second virtual metal layer 41, which is located between the insulating layer 22 and the passivation layer 24. In some embodiments, the second virtual metal layer 41 is disposed at a position on the fourth protrusion 4 where the groove 25 is not provided. The second virtual metal layer 41 is disposed on the same layer as the metal electrode trace 23 and is insulated from it. The auxiliary conductive layer 42 is also insulated from the second virtual metal layer 41. That is, the second virtual metal layer 41 belongs to the second metal layer, but is separated from and insulated from the metal electrode trace 23, and the groove 25 does not expose the second virtual metal layer 41. Specifically, the second virtual metal layer 41 is not connected to electrical signals; it is an isolated metal trace and is not electrically connected to the auxiliary conductive layer 42.

[0069] Similarly, by providing a second virtual metal layer 41, the thickness of the fourth protrusion 4 can be further increased, making it easier for the fourth protrusion 4 and the second protrusion 7 to align, thereby enhancing the electrical connection reliability between the auxiliary conductive layer 42 on the top surface of the fourth protrusion 4 and the second transparent conductive layer 8 at the position of the second protrusion 7. Furthermore, since the second virtual metal layer 41 is only provided at positions on the fourth protrusion 4 where the groove 25 is not provided, the volume of the groove 25 can be further increased, facilitating the accommodation of more alignment films. In other embodiments, the second virtual metal layer 41 may completely cover the insulating layer 22, or the fourth protrusion 4 may not include the second virtual metal layer 41, depending on the design requirements.

[0070] In some embodiments, the fourth protrusion 4 may include only one of the first virtual metal layer 21 and the second virtual metal layer 41, or it may include both the first virtual metal layer 21 and the second virtual metal layer 41, or it may not include either the first virtual metal layer 21 or the second virtual metal layer 41. The specific design can be customized as needed, and the embodiments of this application do not limit this.

[0071] In other embodiments, the fourth protrusion 4 and / or auxiliary conductive layer 42 may not be provided in the display area X. Instead, the first transparent conductive layer 5 on the top surface of the first protrusion 2 in the non-display area F may be electrically connected to the second transparent conductive layer 8 at the position of the second protrusion 7 in the non-display area F. The specific design can be customized as needed, and this application does not limit the specific design.

[0072] In some embodiments, the second protrusion 7 may be disposed only in the non-display area F of the second substrate 61, or the second protrusion 7 may be disposed only in the display area X of the second substrate 61, or the second protrusion 7 may be disposed in both the display area X and the non-display area F of the second substrate 61. The conductive position between the second transparent conductive layer 8 of the substrate 6 and the array substrate 1 may be located only in the non-display area F, or only in the display area X, or simultaneously in both the display area X and the non-display area F. The specific design can be customized as needed, and this application does not limit this aspect.

[0073] In some embodiments, a second protrusion 7 may be provided on the second substrate 61 of the substrate 6 at a position corresponding to the frame adhesive 9. By providing the second protrusion 7 at the position of the frame adhesive 9, the second protrusion 7 can be used to support the substrate 6, thereby improving the structural strength, structural stability and reliability of the display panel 100. At the same time, it can also improve the uniformity of the cell thickness of the display panel 100 and improve the display performance.

[0074] In some implementations, see Figure 2 , Figure 3 and Figure 16 , Figure 17 The second protrusion 7 includes a red resist layer 72, a green resist layer 73, and a blue resist layer 74 sequentially stacked on the surface of the second substrate 61. It can be understood that in this embodiment, the second protrusion 7 is formed by stacking the aforementioned multiple resist layers. Electrical connection is achieved between the second transparent conductive layer 8 at the location of the second protrusion 7 and the first transparent conductive layer 5 on the top surface of the first protrusion 2. This eliminates the need for structures such as conductive gold balls, effectively narrowing the bezel and saving costs while simplifying the process.

[0075] In some embodiments, the size of the red resist layer 72 is larger than the size of the blue resist layer 74, and the size of the blue resist layer 74 is larger than the size of the green resist layer 73. This can effectively prevent the separation of the film layers of the second protrusion 7 and improve the structural strength and stability of the second protrusion 7.

[0076] In some embodiments, the second protrusion 7 further includes a black matrix layer 71, specifically, see [link to relevant documentation]. Figure 2 , Figure 3 and Figure 16 , Figure 17 The second protrusion 7 includes a black matrix layer 71, a red color resist layer 72, a green color resist layer 73, and a blue color resist layer 74, which are sequentially stacked on the surface of the second substrate 61. It can be understood that by providing the black matrix layer 71, the thickness of the second protrusion 7 can be further increased. The greater the thickness of the second protrusion 7, the easier it is to achieve electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8.

[0077] Specifically, the fabrication of each color resist layer and black matrix layer 71 of the second protrusion 7 can be carried out using the same process as the fabrication of the color resist layer and black matrix layer 71 at the pixel location in the display area X of the substrate 6, which helps to simplify the process and save costs.

[0078] In other embodiments, the second protrusion 7 may not include the black matrix layer 71, and / or the second protrusion 7 may include any one or two of the red color resist layer 72, the green color resist layer 73, and the blue color resist layer 74, which can be designed as needed.

[0079] See Figures 20 to 22 , Figure 20 yes Figure 1 A schematic diagram of the structure of the first transparent conductive layer and the second transparent conductive layer of the provided display panel, showing their electrical connection. Figure 21 yes Figure 1 A schematic diagram of another electrical connection method between the first transparent conductive layer and the second transparent conductive layer of the provided display panel. Figure 22 yes Figure 1 A schematic diagram of another electrical connection method between the first transparent conductive layer and the second transparent conductive layer of the provided display panel.

[0080] See Figure 1 To the diagram Figure 3 , Figure 16 and Figure 17In some embodiments, the second protrusion 7 does not have a through hole 83, and the second transparent conductive layer 8 covers the top surface of the second protrusion 7 and extends to the surface of the second substrate 61. The second transparent conductive layer 8 on the top surface of the second protrusion 7 is in direct contact with the first transparent conductive layer 5 on the top surface of the first protrusion 2 in the non-display area F; and / or, the second transparent conductive layer 8 on the top surface of the second protrusion 7 is in direct contact with the auxiliary conductive layer 42 on the top surface of the fourth protrusion 4 in the display area X, thereby realizing the contact electrical connection between the second transparent conductive layer 8 and the first transparent conductive layer 5 and / or the auxiliary conductive layer 42.

[0081] In some implementations, see Figures 20 to 22 A through hole 83 is provided in the second protrusion 7, which extends through the second protrusion 7 along the thickness direction of the display panel 100. The cross-sectional shape of the through hole 83 can be any regular or irregular shape such as rectangle, trapezoid, rhombus, or triangle, and can be designed as needed.

[0082] Specifically, in some implementation methods, see [link to implementation details]. Figure 20 The second transparent conductive layer 8 includes a first conductive portion 81 and a second conductive portion 82. The first conductive portion 81 is disposed on the surface of the second substrate 61 near the second protrusion 7, that is, the first conductive portion 81 is located between the second protrusion 7 and the second substrate 61. The second conductive portion 82 is disposed on the surface of the second protrusion 7 near the array substrate 1, that is, the second conductive portion 82 is disposed on the top surface of the second protrusion 7. In some embodiments, the second conductive portion 82 is in contact with the first transparent conductive layer 5 on the top surface of the first protrusion 2. In one specific embodiment, a connector 85 is disposed in the through hole 83. One end of the connector 85 is in contact with the first conductive portion 81 and the other end is in contact with the second conductive portion 82. In other embodiments, the second conductive portion 82 may be in contact with the auxiliary conductive layer 42 on the top surface of the fourth protrusion 4.

[0083] It is understood that in this embodiment, by setting the second transparent conductive layer 8 to include a first conductive portion 81 and a second conductive portion 82, the first conductive portion 81 is located between the second protrusion 7 and the second substrate 61 and is planar, and the second conductive portion 82 covers the top surface of the second protrusion 7, and the first conductive portion 81 and the second conductive portion 82 are electrically connected through a connector 85, since the slope of the side of the second protrusion 7 is large, it can effectively avoid the problem that when the second transparent conductive layer 8 only includes the second conductive portion 82 covering the top surface of the second protrusion 7, the second transparent conductive layer 8 may break at the top or side of the second protrusion 7, which would make it difficult to achieve an effective electrical connection between the first transparent conductive layer 5 and / or the auxiliary conductive layer 42 and the second transparent conductive layer 8. This can effectively enhance the stability and reliability of the electrical connection between the first transparent conductive layer 5 and / or the auxiliary conductive layer 42 and the second transparent conductive layer 8, and improve the performance of the display panel 100.

[0084] Specifically, the connector 85 fills the through hole 83 to electrically connect the first conductive portion 81 and the second conductive portion 82. Specifically, the connector 85 can be a metal structure or other conductive material filled within the through hole 83, or the connector 85 can be formed by the second conductive portion 82 and / or the first conductive portion 81 extending into the through hole 83.

[0085] In one specific implementation, such as Figure 20 As shown, the second conductive portion 82, disposed on the surface of the second protrusion 7 near the array substrate 1, can extend to the surface of the second substrate 61 near the array substrate 1. The second conductive portion 82 covers the first conductive portion 81, thus forming a double-layer structure. The impedance of the second transparent conductive layer 8 is lower, which is more conducive to further improving the stability of the conduction voltage between the first transparent conductive layer 5 and the second transparent conductive layer 8. In other embodiments, the second conductive portion 82 may only cover the top surface of the second protrusion 7. Specifically, the second conductive portion 82 may extend to the surface of the second substrate 61 and contact the first conductive portion 81, or it may not extend to the surface of the second substrate 61, and the second conductive portion 82 may not cover the first conductive portion 81. The second transparent conductive layer 8 covering the surface of the second substrate 61 can still be a single-layer structure, which can be designed as needed.

[0086] In some implementations, see Figure 21The second transparent conductive layer 8 is disposed on the surface of the second substrate 61 near the second protrusion 7, that is, the second transparent conductive layer 8 is located between the second protrusion 7 and the second substrate 61. The common electrode conductive layer 62 of the substrate 6 also includes a conductive metal layer 84, which is disposed on the surface of the second protrusion 7 near the array substrate 1. Specifically, the conductive metal layer 84 covers the top surface of the second protrusion 7 and is electrically connected to the first transparent conductive layer 5. A connector 85 is disposed within the through hole 83, one end of which is electrically connected to the second transparent conductive layer 8, and the other end is electrically connected to the conductive metal layer 84.

[0087] In this embodiment, the second transparent conductive layer 8 is disposed on the surface of the second substrate 61 near the second protrusion 7. The second transparent conductive layer 8 is planar, which effectively prevents breakage of the second transparent conductive layer 8. Simultaneously, a conductive metal layer 84 is disposed on the surface of the second protrusion 7 near the array substrate 1. A connector 85 within the through-hole 83 electrically connects the conductive metal layer 84 to the second transparent conductive layer 8, and the conductive metal layer 84 also makes contact with the first transparent conductive layer 5 of the array substrate 1, thereby achieving a stable electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8. Similarly, in this embodiment, the above arrangement effectively prevents breakage at the top or side of the second protrusion 7 due to the large slope of its side surface, which would otherwise cause the second transparent conductive layer 8 to cover the top surface of the second protrusion 7 and thus hinder effective electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8. This effectively enhances the stability and reliability of the electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8, improving the performance of the display panel 100.

[0088] In some embodiments, the material of the conductive metal layer 84 can be metal or other conductive material, and the connector 85 can be metal or other conductive material filled in the through hole 83. The material of the connector 85 can be the same as or different from the material of the conductive metal layer 84; alternatively, the connector 85 can also be formed by the second transparent conductive layer 8 extending and filling the through hole 83. Similarly, the conductive metal layer 84 can only cover the top surface of the second protrusion 7, without extending to the second substrate 61, and without contacting or electrically connecting with the second transparent conductive layer 8 on the surface of the second substrate 61. Alternatively, the conductive metal layer 84 can simultaneously cover the top surface of the second protrusion 7 and a portion of the second transparent conductive layer 8 on the surface of the second substrate 61, thereby forming a double-layer structure of the second transparent conductive layer 8 and the conductive metal layer 84 on the surface of the second substrate 61. This is more conducive to reducing the impedance of the second transparent conductive layer 8 and enhancing the stability and reliability of the electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8.

[0089] In some implementations, see Figure 22Each second protrusion 7 of the second substrate 61 may include a plurality of sub-protrusions 75, which are disposed adjacent to each other. Specifically, a through hole 83 passes through the second protrusion 7 and forms a plurality of sub-protrusions 75. A second transparent conductive layer 8 is disposed on the surface of the plurality of sub-protrusions 75 near the array substrate 1 and is in contact with and electrically connected to the first transparent conductive layer 5. The second transparent conductive layers 8 on the surfaces of two adjacent sub-protrusions 75 are in contact with each other. It can be understood that, in this embodiment, by setting each second protrusion 7 to include a plurality of sub-protrusions 75, and by having the second transparent conductive layers 8 on the surfaces of the plurality of sub-protrusions 75 in contact with each other, it is possible that when the second transparent conductive layer 8 on the surface of some sub-protrusions 75 breaks, the second transparent conductive layer 8 on the surface of the remaining sub-protrusions 75 can still achieve a stable and effective contact electrical connection with the first transparent conductive layer 5. The above configuration can effectively prevent the second transparent conductive layer 8 from breaking at the top or side of the second protrusion 7 due to the large slope of the side of the second protrusion 7, which would make it difficult for the first transparent conductive layer 5 and the second transparent conductive layer 8 to achieve effective electrical connection. This can effectively enhance the stability and reliability of the electrical connection between the first transparent conductive layer 5 and the second transparent conductive layer 8, and improve the performance of the display panel 100.

[0090] Specifically, the number of through holes 83 can be one or more. When there is one through hole 83, each second protrusion 7 can include two adjacent sub-protrusions 75; when there are other numbers of through holes 83, each second protrusion 7 can also form other numbers of sub-protrusions 75. For example, when there are two through holes 83, each second protrusion 7 can include three sub-protrusions 75. In other embodiments, the sub-protrusions 75 may not be formed through the through holes 83 of the second protrusion 7, and the specific number and arrangement of the sub-protrusions 75 can be designed as needed.

[0091] See Figure 23 , Figure 23 This is a schematic diagram of an embodiment of the display device provided in the second embodiment of this application.

[0092] See Figure 23 The second embodiment of this application provides a display device 300, which includes a display panel 100 and a backlight module 200. The backlight module 200 is disposed on one side of the display panel 100 and is used to provide backlight for the display panel 100 so that the display panel 100 can realize the image display function.

[0093] Specifically, the display panel 100 can be any of the display panels 100 described in the above embodiments, and can be designed or selected as needed.

[0094] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel having a display area and a non-display area, characterized in that, include: Array substrate, including: First substrate; A gate driving circuit layer is disposed in the non-display area of ​​the first substrate; A common electrode transition layer is disposed on the first substrate and located on the side of the gate driving circuit layer near the display area; the common electrode transition layer includes a first protrusion and a first transparent conductive layer disposed on the top surface of the first protrusion; a groove is provided on the top surface of the first protrusion; in the non-display area, the first protrusion includes stacked metal electrode traces and a passivation layer; in the groove, the first transparent conductive layer and the metal electrode traces are spaced apart. The substrate includes: Second substrate; A common electrode conductive layer is disposed on the second substrate, including a second protrusion and a second transparent conductive layer; A frame adhesive is disposed between the array substrate and the opposing substrate; The first protrusion is at least partially corresponding to the second protrusion, and the second transparent conductive layer is electrically connected to the first transparent conductive layer.

2. The display panel according to claim 1, characterized in that, The groove is annular; or, The top surface of the first protrusion is provided with a plurality of grooves, which are spaced apart from each other; or, The top surface of the first protrusion is provided with a plurality of grooves, which are spaced apart from each other and form a ring.

3. The display panel according to claim 2, characterized in that, The top surface of the first protrusion is provided with a plurality of concentrically spaced annular grooves, and the outermost annular grooves are all spaced apart from the edge of the first protrusion. The outermost ring of the annular groove has a notch on its outer side wall. One end of the notch is connected to the annular groove, and the other end extends to the edge of the first protrusion.

4. The display panel according to claim 1, characterized in that, The groove is disposed within the passivation layer, and the bottom surface of the groove is spaced apart from the top surface of the metal electrode trace; Alternatively, the groove extends through the passivation layer and the metal electrode trace, and at the location of the groove, the passivation layer completely covers the side of the metal electrode trace.

5. The display panel according to claim 1, characterized in that, The common electrode transition layer further includes a third protrusion located in the non-display area; the third protrusion includes the stacked metal electrode traces and the passivation layer; a first via is provided on the top surface of the third protrusion, the first via penetrates the passivation layer and exposes part of the metal electrode traces, and the first transparent conductive layer extends into the first via and contacts and electrically connects with the metal electrode traces.

6. The display panel according to claim 1, characterized in that, The second protrusion is at least partially disposed in the display area of ​​the second substrate; The common electrode transition layer also includes a fourth protrusion located in the display area and an auxiliary conductive layer disposed on the top surface of the fourth protrusion; the top surface of the fourth protrusion is provided with the groove; the fourth protrusion includes an insulating layer and a passivation layer stacked together; the display area of ​​the first substrate is also provided with the metal electrode trace, and the metal electrode trace is spaced apart from the fourth protrusion; The auxiliary conductive layer is electrically connected to the metal electrode traces in the display area; the auxiliary conductive layer on the top surface of the fourth protrusion is electrically connected to the second transparent conductive layer.

7. The display panel according to claim 6, characterized in that, The fourth protrusion further includes a first virtual metal layer, which is located between the first substrate and the insulating layer and is disposed at a position where the fourth protrusion does not have the groove; the auxiliary conductive layer is provided insulated from the first virtual metal layer. And / or, the fourth protrusion further includes a second virtual metal layer, which is located between the insulating layer and the passivation layer and is disposed at a position where the fourth protrusion does not have the groove; the second virtual metal layer is disposed on the same layer as the metal electrode trace and is insulated from each other; the auxiliary conductive layer is insulated from the second virtual metal layer. And / or, the first protrusion further includes the first virtual metal layer and the insulating layer, the insulating layer being located between the first substrate and the metal electrode trace, the first virtual metal layer being located between the first substrate and the insulating layer, and being spaced and insulated from the metal electrode trace; the first virtual metal layer is disposed at a position in the first protrusion where the groove is not provided; the first transparent conductive layer is spaced and insulated from the first virtual metal layer.

8. The display panel according to claim 1, characterized in that, The top surface of the first protrusion is also provided with a second via, which is spaced apart from the groove; the second via penetrates the passivation layer and exposes part of the metal electrode trace, and the first transparent conductive layer extends into the second via and contacts and is electrically connected to the metal electrode trace; And / or, the second protrusion includes a red color resist layer, a green color resist layer, and a blue color resist layer sequentially stacked on the surface of the second substrate; or the second protrusion includes a black matrix layer, a red color resist layer, a green color resist layer, and a blue color resist layer sequentially stacked on the surface of the second substrate; wherein, the size of the red color resist layer is larger than the size of the blue color resist layer, and the size of the blue color resist layer is larger than the size of the green color resist layer; And / or, the second substrate is provided with the second protrusion at a position corresponding to the frame adhesive.

9. The display panel according to claim 1, characterized in that, The second protrusion is provided with a through hole, which extends through the second protrusion along the thickness direction of the display panel; The second transparent conductive layer includes a first conductive portion and a second conductive portion; The first conductive portion is disposed on the surface of the second substrate near the second protrusion; the second conductive portion is disposed on the surface of the second protrusion near the array substrate and is in contact with and electrically connected to the first transparent conductive layer; a connector is disposed in the through hole, one end of the connector is in contact with and electrically connected to the first conductive portion, and the other end is in contact with and electrically connected to the second conductive portion; Alternatively, the second transparent conductive layer is disposed on the surface of the second substrate near the second protrusion; the common electrode conductive layer further includes a conductive metal layer, which is disposed on the surface of the second protrusion near the array substrate and is in contact with and electrically connected to the first transparent conductive layer; a connector is disposed in the through hole, one end of which is in contact with and electrically connected to the second transparent conductive layer, and the other end of which is in contact with and electrically connected to the conductive metal layer; Alternatively, the second protrusion may include a plurality of sub-protrusions, which are disposed adjacent to each other; the second transparent conductive layer is disposed on the surface of the plurality of sub-protrusions near the array substrate and is in contact with and electrically connected to the first transparent conductive layer; the second transparent conductive layers on the surfaces of two adjacent sub-protrusions are in contact with and electrically connected to each other.

10. A display device, characterized in that, include: The display panel as described in any one of claims 1-9; A backlight module is disposed on one side of the display panel and is used to provide backlight for the display panel.

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